TWI491945B - Method of fabricating a lens module - Google Patents

Method of fabricating a lens module Download PDF

Info

Publication number
TWI491945B
TWI491945B TW101118001A TW101118001A TWI491945B TW I491945 B TWI491945 B TW I491945B TW 101118001 A TW101118001 A TW 101118001A TW 101118001 A TW101118001 A TW 101118001A TW I491945 B TWI491945 B TW I491945B
Authority
TW
Taiwan
Prior art keywords
lens
layer
spacer layer
spacer
sub
Prior art date
Application number
TW101118001A
Other languages
Chinese (zh)
Other versions
TW201348784A (en
Inventor
Cheng Heng Chen
Original Assignee
Himax Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Himax Tech Ltd filed Critical Himax Tech Ltd
Priority to TW101118001A priority Critical patent/TWI491945B/en
Publication of TW201348784A publication Critical patent/TW201348784A/en
Application granted granted Critical
Publication of TWI491945B publication Critical patent/TWI491945B/en

Links

Landscapes

  • Lens Barrels (AREA)

Description

透鏡模組的製作方法Lens module manufacturing method

本發明是有關於一種光學模組的製作方法,且特別是有關於一種透鏡模組的製作方法。The present invention relates to a method of fabricating an optical module, and more particularly to a method of fabricating a lens module.

隨著電子產品模組微型化與低價化的之趨勢,晶圓級模組(wafer level module,WLM)技術之出現備受關注。晶圓級模組的技術主要是可將電子產品利用晶圓級的製造技術,而將電子產品的體積微型化並降低成本。舉例來說,將晶圓級模組的技術應用於製作鏡頭模組上,能使鏡頭模組的體積遠小於傳統的鏡頭模組的體積,進而便於應用在例如筆記型電腦、平板電腦、手機等電子裝置的相機模組上。With the trend of miniaturization and low price of electronic product modules, the emergence of wafer level module (WLM) technology has attracted much attention. The technology of wafer-level modules is mainly to make electronic products use wafer-level manufacturing technology, and to miniaturize and reduce the cost of electronic products. For example, applying the wafer level module technology to the lens module can make the lens module much smaller than the traditional lens module, and thus can be easily applied to, for example, a notebook computer, a tablet computer, or a mobile phone. On the camera module of the electronic device.

一般而言,常見的晶圓級鏡頭模組是由具有至少一透鏡的透鏡層、以及分別位於透鏡層上下二側的第一間隙層與第二間隙層所組成。其中,第一間隙層具有至少一第一貫孔,第二間隙層具有至少一第二貫孔,而第一貫孔與第二貫孔曝露出透鏡層之透鏡。第一間隔層是用以使透鏡與後續欲貼合之影像感測元件保持適當間距。第二間隔層是用保護透鏡頂部,使透鏡頂部在晶圓級鏡頭模組製作過程中不易受損。然而,第二間隔層卻會使晶圓級鏡頭模組的厚度增加,進而使採用此晶圓級鏡頭模組的影像擷取裝置不易被薄化。In general, a common wafer level lens module is composed of a lens layer having at least one lens and a first gap layer and a second gap layer respectively located on the upper and lower sides of the lens layer. The first gap layer has at least one first through hole, the second gap layer has at least one second through hole, and the first through hole and the second through hole expose the lens of the lens layer. The first spacer layer is used to maintain the lens at an appropriate spacing from the image sensing elements to be subsequently attached. The second spacer layer is provided with a protective lens top so that the top of the lens is not easily damaged during the fabrication of the wafer level lens module. However, the second spacer layer increases the thickness of the wafer level lens module, which makes the image capturing device using the wafer level lens module less susceptible to thinning.

本發明提供一種透鏡模組的製作方法,其可製作出整體厚度薄的透鏡模組。The invention provides a method for manufacturing a lens module, which can produce a lens module with a thin overall thickness.

本發明之一實施例提出一種透鏡模組的製作方法,其包括下列步驟。提供透鏡層,其中透鏡層包括透光基板及配置於透光基板上的多個透鏡。提供第一間隔層,其中第一間隔層具有多個第一貫孔及被第一貫孔貫穿的黏合子層。提供第二間隔層,其中第二間隔層具有多個第二貫孔。堆疊第一間隔層、透鏡層及第二間隔層,其中透鏡層位於第一間隔層與第二間隔層之間,第一貫孔及第二貫孔曝露出透鏡,且黏合子層與透鏡層接觸。利用固定件固定第一間隔層、透鏡層及第二間隔層的相對位置。壓合第一間隔層、透鏡層與第二間隔層,以使黏合子層與透鏡層緊密接合。移除固定件及第二間隔層,以形成透鏡模組。One embodiment of the present invention provides a method of fabricating a lens module that includes the following steps. A lens layer is provided, wherein the lens layer comprises a light transmissive substrate and a plurality of lenses disposed on the light transmissive substrate. A first spacer layer is provided, wherein the first spacer layer has a plurality of first through holes and an adhesive sublayer penetrated by the first through holes. A second spacer layer is provided, wherein the second spacer layer has a plurality of second through holes. Stacking a first spacer layer, a lens layer and a second spacer layer, wherein the lens layer is located between the first spacer layer and the second spacer layer, the first through hole and the second through hole exposing the lens, and the adhesive sublayer and the lens layer contact. The relative positions of the first spacer layer, the lens layer and the second spacer layer are fixed by the fixing member. The first spacer layer, the lens layer and the second spacer layer are laminated to bond the adhesive sublayer to the lens layer. The fixture and the second spacer layer are removed to form a lens module.

在本發明之一實施例中,上述的透鏡模組的製作方法更包括下列步驟。提供承載帶,其中承載帶具有黏性材料層。令被固定件固定的第一間隔層、透鏡層以及第二間隔層配置於承載帶上,其中第一間隔層與承載帶的黏性材料層接觸。壓合承載帶、第一間隔層、透鏡層與第二間隔層,以使承載帶的黏性材料層與第一間隔層接合。In an embodiment of the invention, the method for fabricating the lens module further includes the following steps. A carrier tape is provided, wherein the carrier tape has a layer of viscous material. The first spacer layer, the lens layer and the second spacer layer fixed by the fixing member are disposed on the carrier tape, wherein the first spacer layer is in contact with the adhesive material layer of the carrier tape. The carrier tape, the first spacer layer, the lens layer and the second spacer layer are laminated to bond the adhesive material layer of the carrier tape to the first spacer layer.

在本發明之一實施例中,上述的透鏡模組的製作方法更包括下列步驟。在壓合承載帶、第一間隔層、透鏡層與第二間隔層之前,提供治具,治具撐開承載帶。In an embodiment of the invention, the method for fabricating the lens module further includes the following steps. Before the carrier tape, the first spacer layer, the lens layer and the second spacer layer are pressed, a jig is provided, and the jig is opened to extend the carrier tape.

在本發明之一實施例中,上述的透鏡模組的製作方法,更包括下列步驟。切割透鏡模組,以形成彼此分離的 多個透鏡結構,其中每一透鏡結構包括至少一透鏡。In an embodiment of the invention, the method for fabricating the lens module further includes the following steps. Cutting the lens modules to form separate from each other A plurality of lens structures, wherein each lens structure comprises at least one lens.

在本發明之一實施例中,上述的透光基板具有相對的第一表面以及第二表面。每一透鏡包括相對應的第一子透鏡與第二子透鏡。第一子透鏡配置於第一表面上,而第二子透鏡配置於第二表面上。In an embodiment of the invention, the light transmissive substrate has opposing first and second surfaces. Each lens includes a corresponding first sub-lens and a second sub-lens. The first sub-lens is disposed on the first surface, and the second sub-lens is disposed on the second surface.

在本發明之一實施例中,在堆疊上述的第一間隔層、透鏡層、第二間隔層後,第一子透鏡位於第一貫孔中,而第二子透鏡位於第二貫孔中。In an embodiment of the invention, after stacking the first spacer layer, the lens layer and the second spacer layer, the first sub-lens is located in the first through hole, and the second sub-lens is located in the second through hole.

在本發明之一實施例中,在堆疊上述的第一間隔層、透鏡層、第二間隔層後,第二間隔層與透鏡層接觸。In an embodiment of the invention, after stacking the first spacer layer, the lens layer, and the second spacer layer, the second spacer layer is in contact with the lens layer.

本發明之一實施例中,上述的固定件為膠帶。In an embodiment of the invention, the fixing member is an adhesive tape.

基於上述,在本發明一實施例之透鏡模組的製作方法中,可利用固定件暫時固定第一間隔層、透鏡層以及第二間隔層的相對位置,而使第一間隔層、第二間隔層在壓合製程中不易對透鏡層造成損傷。此外,第二間隔層在壓合製程可發揮保護透鏡層的作用,使透鏡層在壓合製程中不易受損。In the manufacturing method of the lens module according to the embodiment of the present invention, the relative position of the first spacer layer, the lens layer and the second spacer layer may be temporarily fixed by using the fixing member, and the first spacer layer and the second spacer may be used. The layer is less susceptible to damage to the lens layer during the pressing process. In addition, the second spacer layer functions as a protective lens layer during the pressing process, so that the lens layer is not easily damaged during the pressing process.

更重要的是,在本發明一實施例之透鏡模組的製作方法中,是利用固定件暫時地固定第二間隔層的位置,因此當透鏡模組製作完成後,製造者可輕易地將第二間隔層自透鏡層上移除,而使透鏡模組的整體厚度明顯減薄。如此一來,採用部分透鏡模組所製作的影像擷取裝置便可具有易於薄型化的優點。More importantly, in the manufacturing method of the lens module according to the embodiment of the present invention, the position of the second spacer layer is temporarily fixed by the fixing member, so that when the lens module is completed, the manufacturer can easily The two spacer layers are removed from the lens layer, and the overall thickness of the lens module is significantly reduced. In this way, the image capturing device fabricated by using the partial lens module can have the advantage of being easy to be thinned.

為讓本發明之上述特徵和優點能更明顯易懂,下文特 舉實施例,並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more obvious, the following The embodiments are described in detail with reference to the accompanying drawings.

圖1為本發明一實施例之透鏡模組的製作方法的流程圖。請參照圖1,本實施例之透鏡模組的製作方法包括下列步驟。提供透鏡層,其中透鏡層包括透光基板以及配置於透光基板上的多個透鏡(步驟100)。提供第一間隔層,其中第一間隔層具有多個第一貫孔以及被這些第一貫孔貫穿的黏合子層(步驟200)。提供第二間隔層,其中第二間隔層具有多個第二貫孔(步驟300)。堆疊第一間隔層、透鏡層以及第二間隔層,其中透鏡層位於第一間隔層與第二間隔層之間,第一貫孔以及第二貫孔曝露出透鏡,且第一間隔層的黏合子層與透鏡層接觸(步驟400)。利用至少一固定件固定第一間隔層、透鏡層以及第二間隔層之間的相對位置(步驟500)。壓合第一間隔層、透鏡層與第二間隔層,以使第一間隔層的黏合子層與透鏡層緊密接合(步驟600)。移除固定件以及第二間隔層,以形成透鏡模組(步驟700)。值得注意的是,前述之步驟S100、S200、S300的順序可以做任意的更動。舉例而言,可先進行步驟S200,再進行步驟S100與步驟S300。當然,亦可先進行進行步驟S300,再進行步驟S100與步驟S200。1 is a flow chart of a method of fabricating a lens module according to an embodiment of the invention. Referring to FIG. 1, the manufacturing method of the lens module of this embodiment includes the following steps. A lens layer is provided, wherein the lens layer includes a light transmissive substrate and a plurality of lenses disposed on the light transmissive substrate (step 100). A first spacer layer is provided, wherein the first spacer layer has a plurality of first vias and an adhesive sublayer that is penetrated by the first vias (step 200). A second spacer layer is provided, wherein the second spacer layer has a plurality of second vias (step 300). Stacking a first spacer layer, a lens layer, and a second spacer layer, wherein the lens layer is located between the first spacer layer and the second spacer layer, the first through hole and the second through hole exposing the lens, and the first spacer layer is bonded The sublayer is in contact with the lens layer (step 400). The relative position between the first spacer layer, the lens layer, and the second spacer layer is fixed by at least one fixing member (step 500). The first spacer layer, the lens layer and the second spacer layer are laminated to bond the adhesive sub-layer of the first spacer layer to the lens layer (step 600). The fixture and the second spacer layer are removed to form a lens module (step 700). It should be noted that the order of the foregoing steps S100, S200, and S300 can be arbitrarily changed. For example, step S200 may be performed first, and then step S100 and step S300 are performed. Of course, step S300 may be performed first, and then step S100 and step S200 are performed.

以下將搭配圖2A至圖2H以及圖3A至圖3H,對本發明一實施例之透鏡模組的製作方法詳細地進行描述。Hereinafter, a method of fabricating a lens module according to an embodiment of the present invention will be described in detail with reference to FIGS. 2A to 2H and FIGS. 3A to 3H.

圖2A至圖2H為本發明一實施例之透鏡模組製作方法的上視示意圖。圖3A至圖3H為本發明一實施例之透鏡 模組製作方法的剖面示意圖。特別是,圖3A至圖3H是對應2A至圖2H中的線段AA’所繪之剖面圖。請先參照圖2A及圖3A,首先,提供透鏡層100。透鏡層100包括透光基板110以及配置於透光基板110上的多個透鏡120。詳細而言,如圖3A所示,在本實施例中,透光基板110具有相對的第一表面110a以及第二表面110b。每一透鏡120包括相對應的第一子透鏡122與第二子透鏡124。第一子透鏡122的光軸與第二子透鏡124的光軸可對齊。第一子透鏡122配置於第一表面110a上,而第二子透鏡124配置於第二表面110b上。在本實施例中,透光基板110例如是玻璃基板,而透鏡120例如為由第一子透鏡122與第二子透鏡124組合而成的凸透鏡。然而,本發明不限於此,在其他實施例中,透鏡120亦可為凹透鏡。透鏡120的形式端視使用者的需求與設計而定。另外,本實施例之透鏡模組是利用晶圓級(wafer level)的製造技術所製作,且透光基板110與透鏡120的形成方式可為一體成型或各自成型。2A to 2H are schematic top views of a method of fabricating a lens module according to an embodiment of the invention. 3A to 3H are lenses of an embodiment of the present invention A schematic cross-sectional view of the module fabrication method. In particular, Figures 3A through 3H are cross-sectional views corresponding to line segments AA' in Figures 2A through 2H. Referring first to FIGS. 2A and 3A, first, a lens layer 100 is provided. The lens layer 100 includes a light transmissive substrate 110 and a plurality of lenses 120 disposed on the light transmissive substrate 110. In detail, as shown in FIG. 3A, in the present embodiment, the light transmissive substrate 110 has opposing first and second surfaces 110a, 110b. Each lens 120 includes a corresponding first sub-lens 122 and second sub-lens 124. The optical axis of the first sub-lens 122 is alignable with the optical axis of the second sub-lens 124. The first sub-lens 122 is disposed on the first surface 110a, and the second sub-lens 124 is disposed on the second surface 110b. In the present embodiment, the light-transmitting substrate 110 is, for example, a glass substrate, and the lens 120 is, for example, a convex lens in which the first sub-lens 122 and the second sub-lens 124 are combined. However, the invention is not limited thereto, and in other embodiments, the lens 120 may also be a concave lens. The form of the lens 120 depends on the needs and design of the user. In addition, the lens module of the present embodiment is fabricated by a wafer level manufacturing technique, and the transparent substrate 110 and the lens 120 can be formed integrally or separately.

請參照圖2B及圖3B,接著,提供第一間隔層200。第一間隔層200具有多個第一貫孔H1以及被這些第一貫孔H1貫穿的黏合子層210。在本實施例中,第一貫孔H1的尺寸可大於透鏡120的尺寸,且第一貫孔H1的數量可對應透鏡120的數量。如此一來,當第一間隔層200利用黏合子層210與透鏡層100接合時,第一間隔層200的第一貫孔H1便可環繞在透鏡120(例如第一子透鏡122)外圍,而不易壓傷透鏡120。在本實施例中,第一間隔層200 的材質可採用透光或不易透光的材質。此外,第一間隔層200具有厚度G1,以使後續與之貼合的影像感測元件(未繪示)和透鏡120之間維持適當的距離,進而使得採用本實施例之透鏡模組形成的影像擷取模組具有優良的光學表現。Referring to FIG. 2B and FIG. 3B, next, a first spacer layer 200 is provided. The first spacer layer 200 has a plurality of first through holes H1 and an adhesive sub-layer 210 penetrated by the first through holes H1. In this embodiment, the size of the first through hole H1 may be larger than the size of the lens 120, and the number of the first through holes H1 may correspond to the number of the lenses 120. In this way, when the first spacer layer 200 is bonded to the lens layer 100 by the adhesive sub-layer 210, the first through hole H1 of the first spacer layer 200 can surround the periphery of the lens 120 (for example, the first sub-lens 122). It is not easy to crush the lens 120. In this embodiment, the first spacer layer 200 The material can be made of light or not easy to transmit light. In addition, the first spacer layer 200 has a thickness G1 to maintain an appropriate distance between the image sensing component (not shown) and the lens 120, which is formed by the lens module of the embodiment. The image capture module has excellent optical performance.

請參照圖2C及圖3C,接著,提供第二間隔層300。第二間隔層300具有多個第二貫孔H2。類似地,第二貫孔H2的尺寸可大於透鏡120的尺寸,且第二貫孔H2的數量可對應透鏡120的數量。如此一來,當第二間隔層300堆疊在透鏡層100上時,第二間隔層300之第二貫孔H2便可環繞在透鏡120(例如第二子透鏡124)外圍,而不易壓傷透鏡120。在本實施例中,第二間隔層300的材質亦可採用透光或不易透光的材質。此外,第二間隔層300具有厚度G2,其中厚度G2可大於第二子透鏡124的最大高度H(繪於圖3A)。如此一來,當第一間隔層200、透鏡層100與第二間隔層300一起被壓合時,第二間隔層300可保護透鏡120(例如第二子透鏡124),使透鏡120於壓合的製程中不易受損。Referring to FIG. 2C and FIG. 3C, next, a second spacer layer 300 is provided. The second spacer layer 300 has a plurality of second through holes H2. Similarly, the size of the second through hole H2 may be larger than the size of the lens 120, and the number of the second through holes H2 may correspond to the number of the lenses 120. In this way, when the second spacer layer 300 is stacked on the lens layer 100, the second through hole H2 of the second spacer layer 300 can surround the periphery of the lens 120 (for example, the second sub-lens 124), and is not easy to crush the lens. 120. In this embodiment, the material of the second spacer layer 300 may also be a material that is transparent or not easily transparent. Further, the second spacer layer 300 has a thickness G2, wherein the thickness G2 may be greater than the maximum height H of the second sub-lens 124 (shown in FIG. 3A). In this way, when the first spacer layer 200, the lens layer 100 and the second spacer layer 300 are pressed together, the second spacer layer 300 can protect the lens 120 (for example, the second sub-lens 124), and the lens 120 is pressed. The process is not easily damaged.

請參照圖2D及圖3D,接著,堆疊第一間隔層200、透鏡層100以及第二間隔層300。在堆疊透鏡層100與第一間隔層200、第二間隔層300後,透鏡層100位於第一間隔層200與第二間隔層300之間。第一間隔層200的黏合子層210與透鏡層100接觸。第一貫孔H1以及第二貫孔H2曝露出透鏡120。更進一步地說,第一子透鏡122位於第一貫孔H1中,而第二子透鏡124位於第二貫孔H2 中。值得注意的是,在本實施例中,第二間隔層300是與透鏡層100接觸。換言之,第二間隔層300與透鏡層100之間不存在黏著層。本實施例之第二間隔層300是承靠於透鏡層100上,而未黏貼在透鏡層100上。Referring to FIG. 2D and FIG. 3D, next, the first spacer layer 200, the lens layer 100, and the second spacer layer 300 are stacked. After the lens layer 100 and the first spacer layer 200 and the second spacer layer 300 are stacked, the lens layer 100 is located between the first spacer layer 200 and the second spacer layer 300. The adhesive sub-layer 210 of the first spacer layer 200 is in contact with the lens layer 100. The first constant hole H1 and the second through hole H2 expose the lens 120. Further, the first sub-lens 122 is located in the first through hole H1, and the second sub-lens 124 is located in the second through hole H2. in. It should be noted that in the present embodiment, the second spacer layer 300 is in contact with the lens layer 100. In other words, there is no adhesive layer between the second spacer layer 300 and the lens layer 100. The second spacer layer 300 of the present embodiment is supported on the lens layer 100 without being adhered to the lens layer 100.

請參照圖2E及圖3E,接著,利用至少一固定件400固定第一間隔層200、透鏡層100以及第二間隔層300之間的相對位置。換言之,可利用固定件400暫時地固定第一間隔層200、透鏡層100以及第二間隔層300的相對位置,以使透鏡層100在後續之壓合製程中不易因第一間隔層200、第二間隔層300的位置偏移而造成透鏡120的損傷。在本實施例中,當第一間隔層200、透鏡層100以及第二間隔層300被固定件400暫時固定時,第一間隔層200、透鏡層100以及第二間隔層300的外緣可彼此切齊。第一貫孔H1與第二貫孔H2可彼此切齊。本實施例之固定件400例如為膠帶,但本發明不以此為限,固定件400可以是任何可使第一間隔層200、透鏡層100及第二間隔層300的相對位置暫時固定的元件。此外,本發明亦不限定,此步驟中所使用之固定件400的數量。所使用之固定件400的數量及種類皆可視實際製程上的需求而定。Referring to FIG. 2E and FIG. 3E, the relative position between the first spacer layer 200, the lens layer 100, and the second spacer layer 300 is fixed by at least one fixing member 400. In other words, the relative positions of the first spacer layer 200, the lens layer 100, and the second spacer layer 300 may be temporarily fixed by the fixing member 400, so that the lens layer 100 is not easily damaged by the first spacer layer 200 in the subsequent pressing process. The position of the two spacer layers 300 is offset to cause damage to the lens 120. In the present embodiment, when the first spacer layer 200, the lens layer 100, and the second spacer layer 300 are temporarily fixed by the fixing member 400, the outer edges of the first spacer layer 200, the lens layer 100, and the second spacer layer 300 may be mutually Cut together. The first through hole H1 and the second through hole H2 may be aligned with each other. The fixing member 400 of the embodiment is, for example, an adhesive tape, but the invention is not limited thereto. The fixing member 400 may be any component that temporarily fixes the relative positions of the first spacer layer 200, the lens layer 100 and the second spacer layer 300. . Further, the present invention is not limited to the number of the fixing members 400 used in this step. The number and type of fasteners 400 used can be determined by the actual process requirements.

請繼續參照圖2E及圖3E,接著,在固定件400暫時地固定第一間隔層200、透鏡層100以及第二間隔層300的相對位置下,壓合第一間隔層200、透鏡層100與第二間隔層300,以使第一間隔層200的黏合子層210與透鏡層100緊密接合。在本實施例中,黏合子層210例如為熱固化膠層。在對第一間隔層200、透鏡層100、第二間隔層 300加壓的同時,可對黏合子層210進行加溫加壓,以使第一間隔層200可透過黏合子層210良好地貼附於透鏡層100上。但,本發明不限於此,在其他實施例中,黏合子層210亦可為光固化膠層或其他適當種類的黏合層。2E and FIG. 3E, next, at a relative position where the fixing member 400 temporarily fixes the first spacer layer 200, the lens layer 100, and the second spacer layer 300, the first spacer layer 200 and the lens layer 100 are pressed together. The second spacer layer 300 is such that the adhesive sub-layer 210 of the first spacer layer 200 is in close contact with the lens layer 100. In this embodiment, the adhesive sub-layer 210 is, for example, a thermosetting adhesive layer. In the first spacer layer 200, the lens layer 100, and the second spacer layer While the pressure is 300, the adhesive layer 210 may be heated and pressurized so that the first spacer layer 200 can be adhered to the lens layer 100 through the adhesive sub-layer 210. However, the present invention is not limited thereto. In other embodiments, the adhesive sub-layer 210 may also be a photo-curable adhesive layer or other suitable type of adhesive layer.

值得一提的是,在進行上段所述之壓合製程時,第二間隔層300可保護透鏡層100(即第二子透鏡124),第一間隔層200可保護透鏡層100(及第一子透鏡122),而使透鏡層100不易受損。此外,在本實施例中,由於第二間隔層300是承靠於透鏡層100上,而未黏貼在透鏡層100上,因此當所有壓合製程完成後,第二間隔層300可輕易地自透鏡層100移除,進而使透鏡模組的整體厚度明顯減薄。It is worth mentioning that the second spacer layer 300 can protect the lens layer 100 (ie, the second sub-lens 124) during the pressing process described in the above paragraph, and the first spacer layer 200 can protect the lens layer 100 (and the first The sub-lens 122) makes the lens layer 100 less susceptible to damage. In addition, in the embodiment, since the second spacer layer 300 is supported on the lens layer 100 without being adhered to the lens layer 100, the second spacer layer 300 can be easily self-contained after all the pressing processes are completed. The lens layer 100 is removed, thereby significantly reducing the overall thickness of the lens module.

請參照圖2F及圖3F,接著,提供承載帶(tape)500。承載帶500可具有黏性材料層510。然後,令被固定件400固定的第一間隔層200、透鏡層100以及第二間隔層300配置於承載帶500上,其中第一間隔層200與承載帶500的黏性材料層510接觸。接著,壓合承載帶500、第一間隔層200、透鏡層100與第二間隔層300,以使承載帶500的黏性材料層510與第一間隔層200接合。類似地,在本實施例中,黏性材料層510可為熱固化膠層。在壓合承載帶500、第一間隔層200、透鏡層100與第二間隔層300、的同時,可對黏性材料層510加溫加壓,以使承載帶500可透過黏性材料層510良好地附著於第一間隔層200上。但,本發明不限於此,在其他實施例中,黏性材料層510亦可為光固化膠層或其他適當種類的黏合層。Referring to FIG. 2F and FIG. 3F, next, a tape 500 is provided. Carrier tape 500 can have a layer of viscous material 510. Then, the first spacer layer 200, the lens layer 100, and the second spacer layer 300 fixed by the fixing member 400 are disposed on the carrier tape 500, wherein the first spacer layer 200 is in contact with the adhesive material layer 510 of the carrier tape 500. Next, the carrier tape 500, the first spacer layer 200, the lens layer 100 and the second spacer layer 300 are laminated to bond the adhesive material layer 510 of the carrier tape 500 with the first spacer layer 200. Similarly, in the present embodiment, the adhesive material layer 510 may be a thermosetting adhesive layer. While the carrier tape 500, the first spacer layer 200, the lens layer 100 and the second spacer layer 300 are laminated, the adhesive layer 510 may be warmed and pressurized to make the carrier tape 500 permeable to the adhesive material layer 510. Good adhesion to the first spacer layer 200. However, the present invention is not limited thereto. In other embodiments, the adhesive material layer 510 may also be a photocurable adhesive layer or other suitable type of adhesive layer.

此外,在本實施例中,如圖2F及圖3F所示,在壓合 承載帶500、第一間隔層200、透鏡層100與第二間隔層300之前,可提供治具600。治具600是用以撐開承載帶500。在治具600撐開承載帶500後,可將被固定件400暫時固定的第一間隔層200、透鏡層100、第二間隔層300配置於承載帶500再進行壓合動作,進而使承載帶500在壓合製程中可良好地貼附在第一間隔層200上。在本實施例中,治具600例如為具有貫孔之剛性元件,其材質例如為不透鏽鋼。但,本發明不限於此,治具600的形式及材料種類皆可視實際的製程需求而定。In addition, in this embodiment, as shown in FIG. 2F and FIG. 3F, in press-fit The jig 600 may be provided before the carrier tape 500, the first spacer layer 200, the lens layer 100, and the second spacer layer 300. The jig 600 is used to extend the carrier tape 500. After the jig 600 is opened, the first spacer layer 200, the lens layer 100, and the second spacer layer 300, which are temporarily fixed by the fixing member 400, are disposed on the carrier tape 500 and then pressed to perform the bonding operation. The 500 is well attached to the first spacer layer 200 in the press-bonding process. In the present embodiment, the jig 600 is, for example, a rigid member having a through hole, and the material thereof is, for example, a stainless steel. However, the present invention is not limited thereto, and the form and material type of the jig 600 may be determined according to actual process requirements.

請參照圖2G及圖3G,接著,移除固定件400以及第二間隔層300,以形成透鏡模組1000。在本實施例中,由於第二間隔層300是承靠於透鏡層100上,而未黏貼在透鏡層100上,因此第二間隔層300可輕易地自透鏡層100上移除。不包括第二間隔層300之透鏡模組1000的整體厚度較薄,而使得採用部份之透鏡模組1000所形成的影像擷取裝置具有易於薄型化的優勢。本實施例之透鏡模組1000包括承載帶500、第一間隙層200以及透鏡層100。承載帶500具有黏性材料層510。第一間隙層200具有黏合子層210。第一間隙層200的主體220位於黏合子層210與黏性材料層510之間。第一間隙層200貼附於透光基板110之第一表面110a。第一子透鏡122位於第一間隙層200的第一貫孔H1中。第二子透鏡124配置於透光基板110之第二表面110b。Referring to FIG. 2G and FIG. 3G , the fixing member 400 and the second spacer layer 300 are removed to form the lens module 1000 . In the present embodiment, since the second spacer layer 300 is supported on the lens layer 100 without being adhered to the lens layer 100, the second spacer layer 300 can be easily removed from the lens layer 100. The overall thickness of the lens module 1000 not including the second spacer layer 300 is thin, so that the image capturing device formed by using the partial lens module 1000 has the advantage of being easy to be thinned. The lens module 1000 of the present embodiment includes a carrier tape 500, a first gap layer 200, and a lens layer 100. The carrier tape 500 has a layer 510 of viscous material. The first gap layer 200 has an adhesive sub-layer 210. The body 220 of the first gap layer 200 is located between the adhesive sub-layer 210 and the viscous material layer 510. The first gap layer 200 is attached to the first surface 110a of the transparent substrate 110. The first sub-lens 122 is located in the first through hole H1 of the first gap layer 200. The second sub-lens 124 is disposed on the second surface 110b of the transparent substrate 110.

請參照圖2H及圖3H,在完成透鏡模組1000後可對透鏡模組1000進行切割動作,以使透鏡模組1000形成彼 此分離的多個透鏡結構。圖4示出由圖3H之透鏡模組所切割出的數個透鏡結構。每一透鏡結構1000A包括至少一透鏡120。本發明並不限定每一透鏡結構1000A所包括之透鏡120的數量。每一透鏡結構1000A所包括之透鏡120的數量可視後端使用者的需求而定。Referring to FIG. 2H and FIG. 3H, after the lens module 1000 is completed, the lens module 1000 can be cut to form the lens module 1000. This separate multiple lens structure. Figure 4 shows a number of lens structures cut from the lens module of Figure 3H. Each lens structure 1000A includes at least one lens 120. The invention does not limit the number of lenses 120 included in each lens structure 1000A. The number of lenses 120 included in each lens structure 1000A may depend on the needs of the back end user.

綜上所述,在本發明一實施例之透鏡模組的製作方法中,可利用固定件暫時固定第一間隔層、透鏡層以及第二間隔層的相對位置,而使第一間隔層、第二間隔層在壓合製程中不易對透鏡層造成損傷。此外,第二間隔層在壓合製程可發揮保護透鏡層的作用,使透鏡層在壓合製程中不易受損。In the manufacturing method of the lens module according to the embodiment of the present invention, the relative position of the first spacer layer, the lens layer and the second spacer layer can be temporarily fixed by using the fixing member, so that the first spacer layer and the first spacer layer The two spacer layers are less likely to cause damage to the lens layer during the pressing process. In addition, the second spacer layer functions as a protective lens layer during the pressing process, so that the lens layer is not easily damaged during the pressing process.

更重要的是,在本發明一實施例之透鏡模組的製作方法中,是利用固定件暫時地固定第二間隔層的位置,因此當透鏡模組製作完成後,製造者可輕易地將第二間隔層自透鏡層上移除,而使透鏡模組的整體厚度明顯減薄。如此一來,採用部分透鏡模組所製作的影像擷取裝置便可具有易於薄型化的優點。More importantly, in the manufacturing method of the lens module according to the embodiment of the present invention, the position of the second spacer layer is temporarily fixed by the fixing member, so that when the lens module is completed, the manufacturer can easily The two spacer layers are removed from the lens layer, and the overall thickness of the lens module is significantly reduced. In this way, the image capturing device fabricated by using the partial lens module can have the advantage of being easy to be thinned.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧透鏡層100‧‧‧ lens layer

110‧‧‧透光基板110‧‧‧Transparent substrate

110a‧‧‧第一表面110a‧‧‧ first surface

110b‧‧‧第二表面110b‧‧‧ second surface

120‧‧‧透鏡120‧‧‧ lens

122‧‧‧第一子透鏡122‧‧‧First sub-lens

124‧‧‧第二子透鏡124‧‧‧Second sub-lens

200‧‧‧第一間隔層200‧‧‧ first spacer

210‧‧‧黏合子層210‧‧‧Adhesive sublayer

220‧‧‧主體220‧‧‧ Subject

300‧‧‧第二間隔層300‧‧‧Second spacer

400‧‧‧固定件400‧‧‧Fixed parts

500‧‧‧承載帶500‧‧‧ Carrying belt

510‧‧‧黏性材料層510‧‧‧Adhesive material layer

600‧‧‧治具600‧‧‧ fixture

1000‧‧‧透鏡模組1000‧‧‧ lens module

1000A‧‧‧透鏡結構1000A‧‧‧ lens structure

H‧‧‧第二子透鏡的最大高度H‧‧‧Maximum height of the second sub-lens

H1‧‧‧第一貫孔H1‧‧‧ first through hole

H2‧‧‧第二貫孔H2‧‧‧Second hole

G1、G2‧‧‧厚度G1, G2‧‧‧ thickness

S100~S700‧‧‧步驟S100~S700‧‧‧Steps

圖1為本發明一實施例之透鏡模組的製作方法的流程圖。1 is a flow chart of a method of fabricating a lens module according to an embodiment of the invention.

圖2A至圖2H為本發明一實施例之透鏡模組製作方法的上視示意圖。2A to 2H are schematic top views of a method of fabricating a lens module according to an embodiment of the invention.

圖3A至圖3H為本發明一實施例之透鏡模組製作方法的剖面示意圖。3A to 3H are schematic cross-sectional views showing a method of fabricating a lens module according to an embodiment of the present invention.

圖4示出由圖3H之透鏡模組所切割出的數個透鏡結構。Figure 4 shows a number of lens structures cut from the lens module of Figure 3H.

S100~S700‧‧‧步驟S100~S700‧‧‧Steps

Claims (6)

一種透鏡模組的製作方法,包括:提供一透鏡層,該透鏡層包括一透光基板以及配置於該透光基板上的多個透鏡;提供一第一間隔層,該第一間隔層具有多個第一貫孔以及被該些第一貫孔貫穿的一黏合子層;提供一第二間隔層,該第二間隔層具有多個第二貫孔;堆疊該第一間隔層、該透鏡層以及該第二間隔層,其中該透鏡層位於該第一間隔層與該第二間隔層之間,該些第一貫孔以及該些第二貫孔曝露出該些透鏡,且該第一間隔層的該黏合子層與該透鏡層接觸;利用至少一固定件固定該第一間隔層、該透鏡層以及該第二間隔層之間的相對位置;提供一承載帶,該承載帶具有一黏性材料層;令被該固定件固定的該第一間隔層、該透鏡層以及該第二間隔層配置於該承載帶上,其中該第一間隔層與該承載帶的該黏性材料層接觸;提供一治具,該治具撐開該承載帶;壓合該承載帶、該第一間隔層、該透鏡層與該第二間隔層,以使該承載帶的該黏性材料層與該第一間隔層接合,且壓合該第一間隔層、該透鏡層與該第二間隔層,以使該第一間隔層的該黏合子層與該透鏡層緊密接合;以及移除該固定件以及該第二間隔層,以形成一透鏡模組。 A lens module is provided, comprising: providing a lens layer, the lens layer comprising a transparent substrate and a plurality of lenses disposed on the transparent substrate; providing a first spacer layer, the first spacer layer having a plurality of a first through hole and an adhesive sublayer penetrated by the first through holes; providing a second spacer layer having a plurality of second through holes; stacking the first spacer layer, the lens layer And the second spacer layer, wherein the lens layer is located between the first spacer layer and the second spacer layer, and the first through holes and the second through holes expose the lenses, and the first interval The adhesive sublayer of the layer is in contact with the lens layer; the relative position between the first spacer layer, the lens layer and the second spacer layer is fixed by at least one fixing member; a carrier tape is provided, and the carrier tape has a viscosity The first spacer layer, the lens layer and the second spacer layer are fixed on the carrier tape, wherein the first spacer layer is in contact with the adhesive material layer of the carrier tape Providing a fixture that supports the Carrying the carrier tape, the first spacer layer, the lens layer and the second spacer layer, so that the adhesive material layer of the carrier tape is bonded to the first spacer layer, and the first layer is pressed a spacer layer, the lens layer and the second spacer layer such that the adhesive sub-layer of the first spacer layer is in close contact with the lens layer; and removing the fixing member and the second spacer layer to form a lens mold group. 如申請專利範圍第1項所述之透鏡模組的製作方法,更包括:切割該透鏡模組,以形成彼此分離的多個透鏡結構,每一該透鏡結構包括至少一該透鏡。 The method of fabricating the lens module of claim 1, further comprising: cutting the lens module to form a plurality of lens structures separated from each other, each lens structure comprising at least one lens. 如申請專利範圍第1項所述之透鏡模組的製作方法,其中該透光基板具有相對的一第一表面以及一第二表面,每一該透鏡包括相對應的一第一子透鏡與一第二子透鏡,該第一子透鏡配置於該第一表面上,該第二子透鏡配置於該第二表面上。 The method of manufacturing the lens module of claim 1, wherein the transparent substrate has a first surface and a second surface, each of the lenses comprising a corresponding first sub-lens and a a second sub-lens, the first sub-lens is disposed on the first surface, and the second sub-lens is disposed on the second surface. 如申請專利範圍第3項所述之透鏡模組的製作方法,其中在堆疊該第一間隔層、該透鏡層、該第二間隔層後,該些第一子透鏡位於該些第一貫孔中,而該些第二子透鏡位於該些第二貫孔中。 The method of manufacturing the lens module of claim 3, wherein after the first spacer layer, the lens layer, and the second spacer layer are stacked, the first sub-lenses are located in the first through holes And the second sub-lenses are located in the second through holes. 如申請專利範圍第1項所述之透鏡模組的製作方法,其中在堆疊該第一間隔層、該透鏡層、該第二間隔層後,該第二間隔層與該透鏡層接觸。 The method of fabricating the lens module of claim 1, wherein the second spacer layer is in contact with the lens layer after the first spacer layer, the lens layer, and the second spacer layer are stacked. 如申請專利範圍第1項所述之透鏡模組的製作方法,其中該固定件為一膠帶。 The method for manufacturing a lens module according to claim 1, wherein the fixing member is a tape.
TW101118001A 2012-05-21 2012-05-21 Method of fabricating a lens module TWI491945B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101118001A TWI491945B (en) 2012-05-21 2012-05-21 Method of fabricating a lens module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101118001A TWI491945B (en) 2012-05-21 2012-05-21 Method of fabricating a lens module

Publications (2)

Publication Number Publication Date
TW201348784A TW201348784A (en) 2013-12-01
TWI491945B true TWI491945B (en) 2015-07-11

Family

ID=50157358

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101118001A TWI491945B (en) 2012-05-21 2012-05-21 Method of fabricating a lens module

Country Status (1)

Country Link
TW (1) TWI491945B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110050979A1 (en) * 2007-12-19 2011-03-03 Heptagon Oy Optical module, wafer scale package, and method for manufacturing those
TW201135300A (en) * 2010-04-13 2011-10-16 Himax Tech Ltd Wafer level lens module, method for forming wafer level lens module and wafer level camera

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110050979A1 (en) * 2007-12-19 2011-03-03 Heptagon Oy Optical module, wafer scale package, and method for manufacturing those
TW201135300A (en) * 2010-04-13 2011-10-16 Himax Tech Ltd Wafer level lens module, method for forming wafer level lens module and wafer level camera

Also Published As

Publication number Publication date
TW201348784A (en) 2013-12-01

Similar Documents

Publication Publication Date Title
JP5218058B2 (en) Semiconductor device and manufacturing method thereof
TWI475674B (en) Camera module and fabrication thereof
JP5540120B2 (en) Stacked lens array and lens module
US7728398B2 (en) Micro camera module and method of manufacturing the same
JP2011138089A (en) Wafer-level lens array, lens module and imaging unit
JP2011128355A (en) Imaging lens, camera module using imaging lens, manufacturing method of imaging lens, and manufacturing method of camera module
JP2010118397A (en) Camera module and process of manufacturing the same
TWI486623B (en) Wafer level lens, lens sheet and manufacturing method thereof
US20230135045A1 (en) Flexible Display Module and Flexible Display Apparatus
JP4955807B1 (en) Manufacturing method of semi-finished blank for variable focus lens
KR20110025037A (en) Fabricating method and structure of a wafer level module
TWI491945B (en) Method of fabricating a lens module
KR20120066946A (en) Multilayer lens and manufacturing method thereof
US20100291256A1 (en) Mold for fabricating concave lenses
WO2019033961A1 (en) Photosensitive assembly, imaging module, intelligent terminal, and method and mould for manufacturing photosensitive assembly
TW200921234A (en) Miniature camera module and method for making same
TWI418871B (en) Lens module and fabrication method thereof
TWI549560B (en) Curved display device and manufacturing method thereof
TW201713105A (en) Camera module and method for fabricating the same
US20220124231A1 (en) Image capturing module and manufacturing method thereof
JP5237479B2 (en) Manufacturing method of semi-finished blank for variable focus lens
CN113126186B (en) Integrated aperture lens and manufacturing method thereof
JP5272300B2 (en) Manufacturing method of solid-state imaging device
US8817394B2 (en) Lens module and manufacturing method thereof
TWI487098B (en) Lens module and manufacturing method thereof