TW201134376A - Heat-dissipating module for liquid - Google Patents

Heat-dissipating module for liquid Download PDF

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Publication number
TW201134376A
TW201134376A TW99109467A TW99109467A TW201134376A TW 201134376 A TW201134376 A TW 201134376A TW 99109467 A TW99109467 A TW 99109467A TW 99109467 A TW99109467 A TW 99109467A TW 201134376 A TW201134376 A TW 201134376A
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Taiwan
Prior art keywords
heat
valve body
fluid
absorbing unit
valve
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TW99109467A
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Chinese (zh)
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TWI430742B (en
Inventor
Hao-Jan Mou
Ta-Wei Hsueh
Ying-Lun Chang
Rong-Ho Yu
Shih-Chang Chen
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Microjet Technology Co Ltd
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Priority to TW99109467A priority Critical patent/TWI430742B/en
Publication of TW201134376A publication Critical patent/TW201134376A/en
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Publication of TWI430742B publication Critical patent/TWI430742B/en

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Abstract

A heat-dissipating module for liquid is disclosed and employed for dissipating heat generated from a heat-generating element. The heat-dissipating module includes a heat-absorption unit being in contact with the heat-generating element for absorbing the thermal energy generated from the heat-generating element; a fluid transportation unit stacked on the heat-dissipating module for transporting a fluid and having a heat-dissipating structure; and a connection tube coupling with the heat-absorption unit and the fluid transportation unit for transporting a fluid toward the heat-absorption unit to absorb the thermal energy of the heat-absorption unit and transporting the heated fluid to the fluid transportation unit to dissipate the heat by the heat-dissipating structure.

Description

201134376 六、發明說明: 【發明所屬之技術領域】 [_] 本案係關於一種液體散熱模組,尤指一種具有吸熱單元 之液體散熱模組。 【先前技術】 [0002] [0003] 隨著電腦產業的迅速發展,CPU追求高速度化、高功能化 及小型化所衍生的散熱問題越來越嚴重,這在筆記型電 腦等内部空間狹小的電子裝置中更為突出。如果無法將 筆記型電腦内CPU等電子元件所產生的熱量即時有效的散 發出去’將會影響電子元件的工作性能,同時還會減少 電子元件的使用壽命,因此業者通常採用一冷卻裝置來 對電子元件散熱。 在眾多的冷卻技術中,液體冷卻是一種極為有效的冷卻 —jh- X °傳統的液體冷卻系統由吸熱體、散熱體、泵浦及 傳輸營所構成,且藉由傳輸管作為吸熱體、散熱體及泵 浦徙μ_ 匕之間的連接媒介以構成一後環回路,並於該回路 中填充冷卻液,主要藉由吸%體吸收電子元件所產生的 ” ” 後利用泵浦及傳輸管將冷卻液傳送至吸熱體中 以。及收吸熱體的熱量,而已吸收熱量之冷卻液則在泵 浦的吸力作用下經傳輸管傳至散熱體後放出熱量。在該 果满的驅動作用下’該冷卻液在回路中不斷循環,進而 源源不斷地帶走該電子元件所產生的熱量。 [0004] 099109467 雖‘、、:S知的液體冷卻系統確實可達到將發熱電子元件所 產生的熱量移除的功效,但是泵浦僅為熱傳流體循環迴 路^中之— 個元件’且習知液體冷卻系統所包含之吸熱體 表單犏號Α0101 第4頁/共31頁 0992016826-0 201134376 、散熱體以及泵浦均為一獨立的元件,彼此之間需藉由 傳輸管的連接才能構成一循環迴路,因此習知液體冷卻 系統的組成元件數量過多,將使得組裝後的液體冷卻系 統體積過大,隨著電子產品朝小型化發展的趨勢之下, 習知液體冷卻系統很難應用於筆記型電腦等内部空間狹 小的電子裝置中對電子元件進行冷卻散熱。 [0005] 因此,如何發展一種可改善上述習知技術缺失之液體散 熱模組,實為目前迫切需要解決之問題。 ^ 【發明内容】 〇 [0006] 本案之主要目的在於提供一種液體散熱模組,俾解決習 知液體冷卻系統所包含之吸熱體、散熱體以及泵浦均為 一獨立的元件,彼此之間需藉由傳輸管的連接才能構成 一循環迴路,造成組裝後的液體冷卻系統體積過大,使 得習知液體冷卻系統很難應用於筆記型電腦等内部空間 狹小的電子裝置中對電子元件進行冷卻散熱等缺點。 [0007] 為達上述目的,本案之一較廣義實施態樣為提供一種液 〇 體散熱模組,用以對一發熱元件進行散熱,至少包含: 一吸熱單元,其係與該發熱元件接觸,用以吸收該發熱 元件所產生之熱能;一流體輸送裝置,用以傳送一流體 且與該吸熱單元堆疊設置,並具有一散熱結構;以及一 連接管,其係連接該吸熱單元及該流體輸送裝置,用以 將該流體傳送至該吸熱單元内,以吸收該吸熱單元之熱 能,並將已吸收熱能之該流體傳回該流體輸送裝置,以 利用該散熱結構對該流體進行散熱。 【實施方式】 099109467 表單編號 A0101 第 5 頁/共 31 頁 0992016826-0 201134376 [0008] 體現本案特徵與優點的一些典型實施例將在後段的說明 中詳細敘述。應理解的是本案能夠在不同的態樣上具有 各種的變化,其皆不脫離本案的範圍,且其中的說明及 圖示在本質上係當作說明之用,而非用以限制本案。 [0009] 本案之流體散熱模組可適用於一電子裝置,例如:筆記 型電腦,之主機殼體内部,主要對主機殼體之發熱元件 ,例如:CPU,進行散熱,請參閱第一圖A,其係為本案 較佳實施例之流體散熱模組之分解結構示意圖,如圖所 示,本案之流體散熱模組1可包含流體輸送裝置2、吸熱 單元3以及連接管4,其中流體輸送裝置2與吸熱單元3之 間係上下堆疊設置,並藉由連接管4相互連接,以使流體 輸送裝置2與吸熱單元3間形成一封閉迴路,使一流體於 該封閉迴路中循環流動,並將流體所吸收之熱量透過流 體輸送裝置2排至外界。 [0010] 請再參閱第一圖A,本案之流體輸送裝置2主要係由閥體 座21、閥體蓋體22、閥體薄膜23、複數個暫存室、致動 裝置24、蓋體25以及散熱結構28所組成,其中,閥體蓋 體22及致動裝置24之間形成一壓力腔室226,且散熱結構 28可為複數個散熱鰭片,且其係設置於閥體座21、閥體 蓋體22以及蓋體25的側邊,可透過自然對流或風扇強制 對流的方式將流體傳導至閥體座21、閥體蓋體22以及蓋 體25的熱量排至外界環境中。 [0011] 本案流體散熱模組1的組裝方式係將流體輸送裝置2的閥 體薄膜23設置於閥體座21及閥體蓋體22之間,且吸熱單 元3設置於閥體座21的下方,並使閥體薄膜23與閥體座21 099109467 表單編號A0101 第6頁/共31頁 0992016826-0 201134376 Ο [0012] 及閥體蓋體22相互堆疊結合,且在閥體薄膜23與閥體蓋 體22之間形成一第一暫存室,而在閥體薄膜23與閥體座 21之間形成一第二暫存室,並且於閥體蓋體22上之相對 應位置更設置有致動裝置24,致動裝置24係由一振動薄 膜241以及一致動器242組裝而成,用以驅動流體輸送裝 置2之作動,最後,再將蓋體25設置於致動裝置24之上方 ,故其係依序將吸熱單元3、閥體座21、閥體薄膜23、閥 體蓋體22、致動裝置24及蓋體25相對應堆疊設置,最後 利用連接管4使閥體座21與吸熱單元3相連通,即可完成 流體散熱模組1之組裝(如第二圖所示)。201134376 VI. Description of the invention: [Technical field to which the invention belongs] [_] This case relates to a liquid heat dissipation module, and more particularly to a liquid heat dissipation module having a heat absorption unit. [Prior Art] [0002] [0003] With the rapid development of the computer industry, the heat dissipation problem caused by the pursuit of high speed, high functionality, and miniaturization of the CPU is becoming more and more serious, which is a small internal space such as a notebook computer. More prominent in electronic devices. If the heat generated by the electronic components such as the CPU in the notebook cannot be immediately and effectively dissipated, it will affect the performance of the electronic components and reduce the service life of the electronic components. Therefore, the manufacturer usually uses a cooling device to the electronic device. Component heat dissipation. Among the many cooling technologies, liquid cooling is an extremely effective cooling—jh-X °. The traditional liquid cooling system consists of a heat sink, a heat sink, a pumping and transmission camp, and uses a transfer tube as a heat sink to dissipate heat. The connecting medium between the body and the pumping μ_ 以 constitutes a rear loop circuit, and the circuit is filled with a cooling liquid, which is mainly generated by absorbing the "component" generated by the absorbing body, and then using the pump and the transfer tube The coolant is transferred to the heat absorber. And the heat of the heat absorbing body, and the coolant that has absorbed the heat is transferred to the heat sink through the transmission pipe under the suction of the pump to release heat. Under the effect of the full drive, the coolant circulates continuously in the circuit, and the source continuously removes the heat generated by the electronic component. [0004] 099109467 Although ',,: S knows that the liquid cooling system can achieve the effect of removing heat generated by the heat-generating electronic components, but the pump is only a component of the heat transfer fluid circuit ^ and Know the liquid cooling system included in the form of the heat sink 犏 Α 0101 Page 4 / a total of 31 pages 0992016826-0 201134376, the heat sink and the pump are a separate component, each need to be connected by a transfer tube to form a Loop circuit, so the number of components of the conventional liquid cooling system is too large, which will make the liquid cooling system after assembly too large. With the trend of miniaturization of electronic products, the conventional liquid cooling system is difficult to apply to the notebook type. The electronic components are cooled and dissipated in an electronic device such as a computer having a small internal space. [0005] Therefore, how to develop a liquid heat dissipation module that can improve the above-mentioned conventional technology is an urgent problem to be solved. ^ [Summary of the Invention] 0006 [0006] The main purpose of the present invention is to provide a liquid heat dissipation module, which solves the problem that the heat absorbing body, the heat sink and the pump included in the conventional liquid cooling system are independent components. The connection of the transfer tube can constitute a circulation loop, resulting in an excessive volume of the liquid cooling system after assembly, making the conventional liquid cooling system difficult to apply to cooling and dissipating electronic components in electronic devices such as notebook computers and the like. Disadvantages. [0007] In order to achieve the above object, a generalized embodiment of the present invention provides a liquid heat dissipation module for dissipating heat from a heat generating component, comprising at least: a heat absorbing unit that is in contact with the heat generating component. a heat transfer device for absorbing the heat generated by the heat generating component; a fluid transporting device for transporting a fluid and stacked with the heat absorbing unit, and having a heat dissipating structure; and a connecting tube connecting the heat absorbing unit and the fluid transporting device And transferring the fluid to the heat absorbing unit to absorb the heat energy of the heat absorbing unit, and returning the fluid that has absorbed heat energy to the fluid conveying device to dissipate the fluid by using the heat dissipating structure. [Embodiment] 099109467 Form No. A0101 Page 5 of 31 0992016826-0 201134376 [0008] Some exemplary embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and the description and illustration are in the nature of [0009] The fluid heat dissipation module of the present invention can be applied to an electronic device, such as a notebook computer, inside the main body casing, mainly for heat-generating components of the main body casing, such as a CPU, for heat dissipation, please refer to the first Figure A is a schematic exploded view of the fluid heat dissipation module of the preferred embodiment of the present invention. As shown, the fluid heat dissipation module 1 of the present invention may include a fluid delivery device 2, a heat absorption unit 3, and a connecting tube 4, wherein the fluid The conveying device 2 and the heat absorbing unit 3 are stacked one on another, and are connected to each other by the connecting pipe 4, so that a closed circuit is formed between the fluid conveying device 2 and the heat absorbing unit 3, so that a fluid circulates in the closed circuit. The heat absorbed by the fluid is discharged to the outside through the fluid delivery device 2. [0010] Please refer to FIG. A again. The fluid transport device 2 of the present invention mainly comprises a valve body seat 21, a valve body cover 22, a valve body film 23, a plurality of temporary storage chambers, an actuating device 24, and a cover body 25. And a heat dissipation structure 28, wherein a pressure chamber 226 is formed between the valve body cover 22 and the actuating device 24, and the heat dissipation structure 28 can be a plurality of heat dissipation fins, and is disposed on the valve body seat 21, The valve body cover 22 and the side of the cover body 25 can discharge the heat of the fluid to the valve body seat 21, the valve body cover 22 and the cover body 25 to the external environment by natural convection or forced convection of the fan. [0011] The fluid heat dissipation module 1 of the present invention is assembled by placing the valve body film 23 of the fluid delivery device 2 between the valve body seat 21 and the valve body cover 22, and the heat absorption unit 3 is disposed below the valve body seat 21. And the valve body film 23 and the valve body seat 21 099109467 Form No. A0101 Page 6 / 31 page 0992016826-0 201134376 Ο [0012] and the valve body cover 22 are stacked on each other, and the valve body film 23 and the valve body A first temporary storage chamber is formed between the cover bodies 22, and a second temporary storage chamber is formed between the valve body film 23 and the valve body seat 21, and the corresponding position on the valve body cover 22 is further provided with actuation. The device 24 is assembled by a vibrating membrane 241 and an actuator 242 for driving the fluid transport device 2, and finally, the cover 25 is disposed above the actuating device 24, so that The heat absorbing unit 3, the valve body seat 21, the valve body film 23, the valve body cover 22, the actuating device 24 and the cover body 25 are sequentially stacked, and finally the valve body seat 21 and the heat absorbing unit are made by the connecting pipe 4. The three phases are connected to complete the assembly of the fluid cooling module 1 (as shown in the second figure).

其中,閥體座21及閥體蓋體22係為本案流體輸送裝置2中 導引流體進出之主要結構,請再參閱第一圖A,閥體座21 係具有一第一入口通道211以及一第二出口通道212,流 體經由第一入口通道211傳送至閥體座21上表面210之一 開口 213,並且閥體薄膜23及閥體座21之間所形成的第二 暫存室即為圖中所示之出口暫存腔215,但不以此為限, 其係由閥體座21之上表面210於與第一出口通道212相對 應之位置產生部分凹陷而形成,並與第一出口通道212相 連通,該出口暫存腔215係用以暫時儲存流體,並使該流 體由出口暫存腔215經由一開口 214而輸送至出口通道 212,再流出閥體座21之外(如第三圖A所示)。以及,在 閥體座21上更具有複數個凹槽結構,用以供一密封環26( 如第三圖A所示)設置於其上,閥體座21係具有環繞開口 213週邊之凹槽218,及環繞於出口暫存腔215週邊之凹 槽217,主要藉由設置於凹槽217及218内之密封環26使 099109467 表單編號A0101 第7頁/共31頁 0992016826-0 201134376 閥體座21與閥體薄膜2 3之間緊密的貼合,以防止流體外 曳。 [0013] 請參閱第一圖B並配合第一圖A,其中第一圖B係為第一圖 A所示之閥體蓋體之背面結構示意圖,如圖所示,閥體蓋 座22係具有一上表面220及一下表面228,以及在閥體蓋 座22上亦具有貫穿上表面220至下表面228之入口閥門通 道221及出口閥門通道222,且該入口閥門通道221係設 置於與閥體座21之開口 213相對應之位置,而出口閥門通 道222則設置於與閥體座21之出口暫存腔21 5相對應之位 置,並且閥體薄膜23及闕體蓋體22之間所形成之第一暫 存室即為圖中所示之入口暫存腔223,且不以此為限,其 係由閥體蓋體22之下表面228於與入口閥門通道221相對 應之位置產生部份凹陷而形成,且其係連通於入口閥門 通道221。 [0014] 請再參閱第一圖A,閥體蓋體22之上表面220係部份凹陷 ,以形成一壓力腔室226,其係與致動裝置24之致動器 242相對應設置,壓力腔室226係經由入口閥門通道221 連通於入口暫存腔223,並同時與出口閥門通道222相連 通,因此,當致動器242受電壓致動 [0015] 另外如第一圖A及第一圖B所示,閥體蓋體22上同樣具有 複數個凹槽結構,以本實施例為例,在閥體蓋體22之上 表面220係具有環繞壓力腔室226而設置之凹槽227,而 在下表面228上則具有環繞設置於入口暫存腔223之凹槽 224、環繞設置於出口閥門通道222之凹槽229,同樣地 ,上述凹槽結構係用以供一密封環27設置於其中,主要 099109467 表單編號A0101 第8頁/共31頁 0992016826-0 201134376 藉由設置於凹槽224及229内之密封環27使閥體蓋體22與 閥體薄膜2 3之間緊密的貼合,以防止流體外洩,而設置 於凹槽227内之密封環27則用來使致動裝置24之致動薄膜 241與閥體蓋體22之間緊密的貼合,以防止流體外洩(如 第三圖A所示)。 [0016] ❹ ❹ 請再參閱第一圖A及第一圖C,其中第一圖C係為第一圖A 所示之閥體薄膜之結構示意圖,閥體薄膜23主要係以傳 統加工、或黃光餘刻、或雷射加工、或電鱗加工、或放 電加工等方式製出,且為一厚度實質上相同之薄片結構 ,其上係具有複數個鏤空閥開關,包含第一閥開關以及 第二閥開關,於本實施例中,第一閥開關係為入口閥門 結構231,而第二閥開關係為出口閥門結構232,其中, 入口閥門結構231係具有入口閥片2313以及複數個環繞入 口閥片2313週邊而設置之鏤空孔洞2312,另外,在孔洞 2312之間更具有與入口閥片2313相連接之延伸部2311, 當閥體薄膜23承受一自壓力腔室226傳遞而來之應力時, 如第三圖A所示,入口閥門結構231係整個平貼於閥體座 21之上,此時入口閥片2313會緊貼於微凸結構216,而 密封住閥體座21上之開口 213,故因此入口閥門結構231 之關閉作用,使流體無法流出。 [0017] 請再參閱第一圖A並配合第三圖A,於閥體座21之上表面 210之開口 213的邊緣係環繞設置一微凸結構216,其係 與入口閥門結構231之入口閥片2313相抵頂,用以施一預 力於該入口閥門結構231,且微凸結構216與入口閥門結 構231接觸之表面為一水平接觸面型態。 099109467 表單編號A0101 第9頁/共31頁 0992016826-0 201134376 [0018] 請再參閱第一圖B並配合第三圖A,於閥體蓋體22之下表 面228之出口閥門通道222的邊緣係環繞設置一微凸結構 225 ’其係與出口閥門結構232之出口閥片2323相抵頂, 用以施一預力於該出口閥門結構232,且微凸結構225與 出口閥門結構232接觸之表面為一水平接觸面型態。 [0019] 上述之微凸結構216及225可使閥體薄膜23與閥體座21以 及閥體薄膜23與閥體蓋體22之間分別產生一間隙,而對 入口閥門結構2 31及出口閥門結構232頂推以產生一預力 作用,有助於開啟。 [0020] 而當閥體薄膜23受到壓力腔室226體積增加而產生之吸力 作用下,由於設置於閥體座21之微凸結構216已提供入口 閥門結構231—預力,因而众口閥片2313可藉由延伸部 2311的支撐而產生更大之預蓋緊效果,以防止逆流,當 因壓力腔室226之負壓而使入口閥門結構231產生位移(如 第三圖B及C所示),此時,流體則可綠由鐘空之孔洞2312 由閥體座21流至閥體蓋體22之入p暫存腔223,並經由入 口暫存腔223及入口閥門通道221傳送至壓力腔室226内 ,如此一來,入口閥門結構231即可因應壓力腔室226產 生之正負壓力差而迅速的開啟或關閉,以控制流體之進 出,並使流體不會回流至閥體座21上。 [0021] 同樣地,位於同一閥體薄膜23上的另一閥門結構則為出 口閥門結構232,其中之出口閥片2323、延伸部2321以 及孔洞2322之作動方式均與入口閥門結構231相同,因而 不再贅述,惟與出口閥門結構232相抵頂之微凸結構225 設置方向係與與入口閥門結構231相抵頂之微凸結構216 099109467 表單編號 A0101 第 10 頁/共 31 頁 0992016826-0 201134376 ❹ [0022] 反向設置,如第三圖D所示,因而當壓力腔室226壓縮而 產生一推力時,設置於閥體蓋體22下表面228之微凸結構 225將提供出口閥門結構232—預力,使得出口閥片2323 可藉由延伸部2321之支撐而產生更大之預蓋緊效果,以 防止逆流,當因壓力腔室226之正壓而使出口閥門結構 232產生位移,此時,流體則可經由鏤空之孔洞2322由壓 力腔室226經閥體蓋體22而流至閥體座21之出口暫存腔 215内,並可經由開口 214及第一出口通道212排出,如 此一來,則可經由出口閥門結構232開啟之機制,將流體 自壓力腔室226内洩出,以達到流體輸送之功能。 Ο 請參閱第一圖D並配合第一圖A,其中第一圖D係為第一圖 A所示之閥體座之反面結構示意圖,如圖所示,本案之閥 體座21的下表面219係具有一第一容置槽2191,且於第 一容置槽291的内部係具有複數個以交錯陣列方式排列的 第一凸起結構2192,複數個第一凸起結構2192主要係用 來吸收該吸熱單元之熱能。另外,在閥體座21的下表面 219上更具有環繞第一容置槽2191週邊之凹槽2193,用 以供一方形之密封環5(如第一圖A所示)設置於其上,以 使吸熱單元3與閥體座21之間可緊密結合,以防止流體外 泡。 [0023] 請再參閱第一圖A,本案之吸熱單元3的底部係與發熱元 件(未圖示)直接接觸或以散熱膠貼合,用以吸收該發 熱元件所產生的熱能,且具有一第二容置槽31、一第二 入口通道32以及一第二出口通道33,第二容置槽31係與 閥體座21之第一容置槽2191相對應,且其内部係具有複 099109467 表單編號A0101 第11頁/共31頁 0992016826-0 201134376 數個以交錯陣列方式排列的第二凸起結構311,第一容置 槽21 91之複數個第一凸起結構21 92係與吸熱單元3之該 複數個第二凸起結構311相互錯開(如第三圖A所示), 可提高熱傳導效率,該複數個第二凸起結構311主要係用 來將吸熱單元3自發熱元件上所吸收之熱能傳遞給該流體 〇The valve body seat 21 and the valve body cover 22 are the main structures for guiding fluid in and out of the fluid transport device 2 of the present invention. Referring to FIG. A, the valve body seat 21 has a first inlet passage 211 and a The second outlet passage 212 transmits fluid to the opening 213 of the upper surface 210 of the valve body seat 21 via the first inlet passage 211, and the second temporary storage chamber formed between the valve body film 23 and the valve body seat 21 is a diagram. The outlet temporary chamber 215 is shown, but not limited thereto, and is formed by the upper surface 210 of the valve body seat 21 at a position corresponding to the first outlet passage 212 to form a partial depression, and the first outlet The passage 212 is in communication. The outlet temporary storage chamber 215 is configured to temporarily store the fluid, and the fluid is delivered from the outlet temporary storage chamber 215 to the outlet passage 212 via an opening 214, and then flows out of the valve body seat 21 (eg, Figure 3 shows A). Moreover, the valve body seat 21 further has a plurality of groove structures for a sealing ring 26 (shown in FIG. 3A) to be disposed thereon, and the valve body seat 21 has a groove surrounding the periphery of the opening 213. 218, and a groove 217 surrounding the periphery of the outlet temporary storage chamber 215, mainly by a sealing ring 26 disposed in the grooves 217 and 218. 099109467 Form No. A0101 Page 7 / Total 31 Page 0992016826-0 201134376 Valve body seat 21 is tightly fitted to the valve body film 23 to prevent the fluid from dragging out. [0013] Please refer to the first figure B and cooperate with the first figure A, wherein the first figure B is a schematic view of the back structure of the valve body cover body shown in the first figure A, as shown in the figure, the valve body cover seat 22 An upper surface 220 and a lower surface 228, and an inlet valve passage 221 and an outlet valve passage 222 extending through the upper surface 220 to the lower surface 228 on the valve body cover 22, and the inlet valve passage 221 is disposed on the valve The opening 213 of the body seat 21 corresponds to the position, and the outlet valve passage 222 is disposed at a position corresponding to the outlet temporary cavity 21 5 of the valve body seat 21, and between the valve body film 23 and the body cover 22 The first temporary storage chamber is formed as the inlet temporary storage chamber 223 shown in the drawing, and is not limited thereto, and is generated by the lower surface 228 of the valve body cover 22 at a position corresponding to the inlet valve passage 221. Partially recessed and formed in communication with the inlet valve passage 221. [0014] Referring again to FIG. A, the upper surface 220 of the valve body cover 22 is partially recessed to form a pressure chamber 226 which is disposed corresponding to the actuator 242 of the actuator 24, pressure The chamber 226 communicates with the inlet temporary chamber 223 via the inlet valve passage 221 and simultaneously communicates with the outlet valve passage 222, thus, when the actuator 242 is actuated by voltage [0015] additionally as shown in the first figure A and the first As shown in FIG. B, the valve body cover 22 also has a plurality of groove structures. In the embodiment, the upper surface 220 of the valve body cover 22 has a recess 227 disposed around the pressure chamber 226. On the lower surface 228, there is a groove 224 disposed around the inlet temporary storage cavity 223 and a groove 229 disposed around the outlet valve passage 222. Similarly, the groove structure is used for a sealing ring 27 to be disposed therein. , Main 099109467 Form No. A0101 Page 8 / Total 31 Pages 0992016826-0 201134376 The sealing body 22 disposed in the grooves 224 and 229 tightly fits the valve body cover 22 and the valve body film 23, In order to prevent fluid leakage, the sealing ring 27 disposed in the groove 227 is used. The actuating means 24 of the actuator film 241 and the valve cap 22 tight fit, to prevent fluid leakage (as shown in FIG third A). [0016] ❹ ❹ Please refer to the first figure A and the first figure C, wherein the first figure C is a schematic structural view of the valve body film shown in the first figure A, and the valve body film 23 is mainly processed by conventional processing, or Yellow light engraving, or laser processing, or scale processing, or electrical discharge machining, and is a sheet structure having substantially the same thickness, having a plurality of hollow valve switches thereon, including a first valve switch and a second The valve switch, in the present embodiment, the first valve opening relationship is the inlet valve structure 231, and the second valve opening relationship is the outlet valve structure 232, wherein the inlet valve structure 231 has an inlet valve piece 2313 and a plurality of surrounding inlet valves The hollow hole 2312 is provided around the sheet 2313. Further, between the holes 2312, there is further an extension 2311 connected to the inlet valve piece 2313. When the valve body film 23 is subjected to a stress transmitted from the pressure chamber 226, As shown in FIG. 3A, the inlet valve structure 231 is entirely flushed over the valve body seat 21, and the inlet valve piece 2313 is in close contact with the micro-convex structure 216 to seal the opening 213 of the valve body seat 21. Therefore, the inlet valve junction The closing action of the structure 231 prevents the fluid from flowing out. [0017] Referring again to FIG. 1A and in conjunction with FIG. 3A, a micro-convex structure 216 is disposed around the edge of the opening 213 of the upper surface 210 of the valve body seat 21, which is connected to the inlet valve of the inlet valve structure 231. The sheet 2313 is abutted against the top for applying a pre-stress to the inlet valve structure 231, and the surface of the micro-convex structure 216 in contact with the inlet valve structure 231 is a horizontal contact surface type. 099109467 Form No. A0101 Page 9 of 31 0992016826-0 201134376 [0018] Referring again to FIG. B and in conjunction with FIG. 3A, the edge of the valve passage 222 at the outlet surface 228 of the valve body cover 22 A micro-convex structure 225' is disposed around the outlet valve piece 2323 of the outlet valve structure 232 for applying a pre-force to the outlet valve structure 232, and the surface of the micro-convex structure 225 contacting the outlet valve structure 232 is A horizontal contact surface type. [0019] The above-mentioned micro-convex structures 216 and 225 can respectively generate a gap between the valve body film 23 and the valve body seat 21 and the valve body film 23 and the valve body cover 22, and the inlet valve structure 2 31 and the outlet valve. The structure 232 is pushed up to create a pre-loading effect that facilitates opening. [0020] When the valve body film 23 is subjected to the suction generated by the increase of the volume of the pressure chamber 226, since the micro-convex structure 216 disposed on the valve body seat 21 has provided the inlet valve structure 231-pre-force, the valve plate is provided. 2313 can produce a greater pre-covering effect by the support of the extension 2311 to prevent backflow, and the inlet valve structure 231 is displaced due to the negative pressure of the pressure chamber 226 (as shown in the third figure B and C). At this time, the fluid can be green and flowed from the valve body seat 21 to the p-storage chamber 223 of the valve body cover 22 through the hole 2312 of the clock hole, and transmitted to the pressure through the inlet temporary storage chamber 223 and the inlet valve passage 221 In the chamber 226, the inlet valve structure 231 can be quickly opened or closed in response to the positive and negative pressure differences generated by the pressure chamber 226 to control the ingress and egress of fluid and prevent fluid from flowing back to the valve body seat 21. . [0021] Similarly, another valve structure located on the same valve body film 23 is an outlet valve structure 232, wherein the outlet valve piece 2323, the extension portion 2321, and the hole 2322 are operated in the same manner as the inlet valve structure 231, and thus No further details are provided, but the micro-convex structure 225 which is abutting against the outlet valve structure 232 is disposed in a direction slightly opposite to the inlet valve structure 231. The micro-convex structure 216 099109467 Form No. A0101 Page 10 of 31 0992016826-0 201134376 ❹ [ 0022] Reverse setting, as shown in the third diagram D, so that when the pressure chamber 226 is compressed to generate a thrust, the micro-convex structure 225 disposed on the lower surface 228 of the valve body cover 22 will provide an outlet valve structure 232 - pre- The force causes the outlet valve piece 2323 to be supported by the extension portion 2321 to produce a greater pre-covering effect to prevent backflow, and when the positive pressure of the pressure chamber 226 causes the outlet valve structure 232 to be displaced, at this time, The fluid can flow from the pressure chamber 226 through the valve body cover 22 to the outlet temporary chamber 215 of the valve body seat 21 via the hollow hole 2322, and can be discharged through the opening 214 and the first outlet passage 212, such as In this way, the fluid can be drained from the pressure chamber 226 via the mechanism of the opening of the outlet valve structure 232 to achieve the function of fluid delivery. Ο Refer to the first figure D and cooperate with the first figure A. The first figure D is the reverse structure of the valve body seat shown in the first figure A. As shown in the figure, the lower surface of the valve body seat 21 of the present invention is shown. The 219 series has a first accommodating groove 2191, and has a plurality of first protruding structures 2192 arranged in a staggered array inside the first accommodating groove 291, and the plurality of first protruding structures 2192 are mainly used Absorbing the heat energy of the heat absorbing unit. In addition, a groove 2193 surrounding the periphery of the first receiving groove 2191 is further disposed on the lower surface 219 of the valve body seat 21 for a square sealing ring 5 (shown in FIG. A) to be disposed thereon. So that the heat absorbing unit 3 and the valve body seat 21 can be tightly coupled to prevent fluid from being bubbled. [0023] Referring again to FIG. A, the bottom of the heat absorbing unit 3 of the present invention is in direct contact with a heat generating component (not shown) or is bonded with a heat dissipating adhesive for absorbing the heat energy generated by the heat generating component, and has a The second accommodating groove 31, the second accommodating channel 32 and the second accommodating channel 33 correspond to the first accommodating groove 2191 of the valve body seat 21, and the internal portion thereof has a complex 099109467 Form No. A0101 Page 11 / Total 31 Pages 0992016826-0 201134376 Several second raised structures 311 arranged in a staggered array, a plurality of first raised structures 21 92 of the first receiving groove 21 91 and the heat absorbing unit The plurality of second protruding structures 311 are offset from each other (as shown in FIG. 3A), and the heat transfer efficiency is improved. The plurality of second protruding structures 311 are mainly used to heat the heat absorbing unit 3 on the self-heating element. The absorbed heat energy is transferred to the fluid

[0024] 請參閱第三圖E,其係為於壓力腔室壓縮狀態時第二圖之 C-C剖面圖,如圖所示,本案之閥體座21的第一出口通道 212係藉由第一連接管41與吸熱單元3之第二入口通道32 相連通,可將流體由流體輸送裝置2傳送至吸熱單元3内 部,以利用流體吸收吸熱單元3之熱能。請參閱第三圖C ,其係為於壓力腔室膨脹狀態時第二圖之B-B剖面圖,如 圖所示,本案之閥體座21的第一出口通道211係藉由第二 連接管42與吸熱單元3之第二出口通道33相連通,用以將 已吸收熱能之該流體傳回流體輸送裝置2,藉由流體不斷 循環並將熱量透過閥體座21、閥體蓋體22以及蓋體25傳 導至其周圍之散熱結構28,再透過自然對流或風扇強制 對流的方式將熱量排至外界環境中。 [0025] 請參閱第三圖A,其係為第二圖所示之流體散熱模組之未 作動狀態時之A-A剖面示意圖,於本實施例中,設置於閥 體座21之開口 21 3邊緣之微凸結構216,可使得貼合設置 於閥體座21上之入口閥門結構231之入口閥片2313因微 凸結構216而形成一向上隆起,而閥體薄膜23之其餘部分 係與閥體蓋體22相抵頂,如此微凸結構216對入口閥門 231頂推而產生一預力作用,有助於產生更大之預蓋緊效 099109467 表單編號A0101 第12頁/共31頁 0992016826-0 201134376 果,以防止逆流’且由於微凸結構21 6之水平接觸面係位 於閥體薄膜23之入口間門結構231處,故使入口閥門結構 231在未作動時使入口間片2313與閥體應21之間具有一 間隙,同樣地,設置於環繞出口閥門通道222邊緣之微凸 結構225,因而玎使閥體薄膜23之出口闊門結構232之出 口閥片2323向下凸出,此微凸結構225僅其方向與微凸結 構216係為反向設置’然而其功能均與前述相同,因而不 再·贅述。 [0026] Ο[0024] Please refer to FIG. 3A, which is a CC cross-sectional view of the second figure when the pressure chamber is in a compressed state. As shown, the first outlet passage 212 of the valve body seat 21 of the present invention is first. The connecting pipe 41 communicates with the second inlet passage 32 of the heat absorbing unit 3, and the fluid can be transferred from the fluid conveying device 2 to the inside of the heat absorbing unit 3 to absorb the heat energy of the heat absorbing unit 3 by the fluid. Please refer to the third figure C, which is a BB cross-sectional view of the second figure when the pressure chamber is in an expanded state. As shown, the first outlet passage 211 of the valve body seat 21 of the present invention is connected by the second connecting pipe 42. And communicating with the second outlet passage 33 of the heat absorption unit 3 for transferring the fluid that has absorbed heat energy back to the fluid delivery device 2, wherein the fluid continuously circulates and transmits heat to the valve body seat 21, the valve body cover 22 and the cover. The body 25 is conducted to the heat dissipation structure 28 around it, and the heat is discharged to the external environment by natural convection or forced convection by the fan. [0025] Please refer to FIG. 3A, which is a schematic cross-sectional view of the AA cross section of the fluid heat dissipation module shown in FIG. 2, which is disposed at the edge of the opening 21 3 of the valve body seat 21 in the embodiment. The micro-convex structure 216 can make the inlet valve piece 2313 of the inlet valve structure 231 disposed on the valve body seat 21 form an upward bulge due to the micro-convex structure 216, and the remaining part of the valve body film 23 is connected to the valve body. The cover 22 abuts against the top, so that the micro-convex structure 216 pushes the inlet valve 231 to generate a pre-stressing effect, which helps to generate a larger pre-covering effect. 099109467 Form No. A0101 Page 12 / Total 31 Page 0992016826-0 201134376 In order to prevent backflow 'and because the horizontal contact surface of the micro-convex structure 216 is located at the entrance door structure 231 of the valve body film 23, the inlet valve structure 231 is made to move the inlet spacer 2313 and the valve body when not in operation. There is a gap between 21 and, similarly, a micro-convex structure 225 disposed around the edge of the outlet valve passage 222, thereby causing the outlet valve piece 2323 of the outlet wide door structure 232 of the valve body film 23 to protrude downward. Structure 225 only has its orientation and microbump The structure 216 is set in the reverse direction' however, its functions are the same as described above, and therefore will not be described again. [0026] Ο

G 請同時參閱第三圖A、B、c,如圖所示,當蓋體25、致動 裝置24、閥體蓋體22、閥體薄膜23、密封環26、27、閥 體座21、密封環5以及吸熱單元3彼此對應組裝設置,且 利用第一連接管41以及第二連接管42使閥體座21與吸熱 單元3相連通後,閥體座21上之開口 213係與閥體薄臈23 上之入口閥門結構231以及閥體蓋體22上之入口閥門通道 221相對應’且閥體座21上之出口暫存腔21 5則與閥體薄 膜23上之出口閥片232以及閥體蓋體22上之出口閥門通道 222相對應,並且,由於微凸結構216設置於閥體座21之 開口 213邊緣,使得閥體薄膜23之入口閥門結構231微凸 起於閥體座21之上’並藉由微凸結構216頂觸閥體薄骐23 而產生一預力作用,使得入口閥門結構231在未作動時則 與閥體座21形成一間隙,同樣地,出口閥門結構232亦藉 由將微凸結構225設置於閥體蓋體22上的方式,使出口閥 門結構232與閥體蓋體22形成一間隙。 當以一電壓驅動致動器242時,致動裝置24產生彎曲變形 ’如第三圖B及C所示,致動裝置24係朝箭號c所指之方向 099109467 表單編號A0101 第13頁/共31頁 0992016826-0 [0027] 201134376 向上彎曲變形,使得壓力腔室226之體積增加,因而產生 一吸力,使閥體薄膜23之入口閥門結構231、出口閥門結 構232承受一向上之拉力,並使已具有一預力之入口閥門 結構231之入口閥片2313迅速開啟,使已吸收吸熱單元3 之熱能之流體可自吸熱單元3之第二出口通道33、第二 連接管42以及閥體座21上之第一入口通道211被吸取進來 (如第三圖C所示),並流經閥體座21上之開口 213、閥 體薄膜23上之入口閥門結構231之孔洞2312、閥體蓋體 22上之入口暫存腔223、入口閥片通道221而流入壓力腔 室226之内(如第三圖B及C所示)。 [0028] 此時,請再參閱第三圖B,由於閥體薄膜23之入口閥門結 構231、出口閥門結構232承受該向上拉力,故位於另一 端之出口閥門結構232係因該向上拉力使得位於閥體薄膜 23上之出口閥片2323密封住出口閥門通道222,而使得 出口閥門結構232關閉,再加上微凸結構225與出口閥門 結構232接觸之表面為一水平接觸面型態,一旦入口閥門 結構231開啟而使流體流入閥體座21内部時,閥體薄膜23 之出口閥門結構232仍能與微凸結構225形成一段封閉面 的接觸,能產生更大更佳之預蓋緊防止逆流的效果。 [0029] 當致動裝置24因電場方向改變而如第三圖D所示之箭號d 向下彎曲變形時,則會壓縮壓力腔室226之體積,使得壓 力腔室226對内部之流體產生一推力,並使閥體薄膜23之 入口閥門結構231、出口閥門結構232承受一向下推力, 此時,設置於微凸結構225上之出口閥門結構232的出口 閥片2323其可迅速開啟(如第三圖D及E所示),並使流體 099109467 表單編號A0101 第14頁/共31頁 0992016826-0 201134376 [0030] ❹ ❹ [0031] [0032] 瞬間大量宣洩,由壓力腔室226經由閥體蓋體22上之出口 閥門通道222、閥體薄膜23上之出口閥門結構232之孔洞 2322、閥體座21上之出口暫存腔215、開口214及第一出 口通道21 2而經由第一連接管41以及吸熱單元3之第二入 口通道32流至吸熱單元3之第二容置槽31中(如第三圖E 所示),使流體可吸收吸熱單元3自發熱元件上所吸收之 熱能。 同樣地,此時由於入口閥門結構231係承受該向下之推力 ,因而使得入口閥片2313密封住開口 213,因而關閉入口 閥門結構231,再加上微凸結構216與入口閥門結構231 接觸之表面為一水平接觸面型態,一旦出口閥門結構232 開啟而使流體釋出時,閥體薄膜23之入口閥門結構231仍 能與微凸結構216形成一段封閉面的接觸,能產生更大更 佳之預蓋緊防止逆流的效果,因此,藉由入口閥門結構 231及出口閥門結構232配合設置於閥體座21及閥體蓋體 22上之微凸結構216及225之設計,可使流體於傳送過程 中不會產生回流的情形,達到高效率之傳輸。 於本實施例中,流體輸送裝置2係由良好熱導體材料所製 成,可為散熱能力好之金屬,例如銅或紹合金。 本案之流體散熱模組1係因應致動裝置24的作動而使得流 體於該封閉迴路中循環流動,於壓力腔室226之體積被壓 縮時,流體可經由閥體座21之第一出口通道212、第一連 接管41以及吸熱單元3之第二入口通道32流至吸熱單元3 之第二容置槽31中(如第三圖E所示),使流體可吸收吸 熱單元3自發熱元件上所吸收之熱能。反之,於壓力腔室 099109467 表單編號A0101 第15頁/共31頁 0992016826-0 201134376 226之體積增加時,已吸收吸熱單元3之熱能之流體可自 吸熱單元3之第二出口通道33、第二連接管42以及閥體 座21上之第一入口通道211被吸取至流體輸送裝置2的内 部進行循環(如第三圖C所示),並將流體所吸收之熱量 透過流體輸送裝置2之閥體座21、閥體蓋體22以及蓋體25 傳導至該複數個散熱結構28,並透過自然對流或風扇強 制對流的方式將熱量排至外界環境中。 [0033] 綜上所述,本案之液體散熱模組係將流體輸送裝置與吸 熱單元互相堆疊設置,並藉由連接管使流體輸送裝置與 吸熱單元相連通,以形成一封閉迴路,使流體傳送至吸 熱單元内,以吸收吸熱單元之熱能,並將已吸收熱能之 該流體傳回流體輸送裝置,以利用散熱結構對流體進行 散熱,除了可連到對一發熱元件進行散熱外,本案之液 體散熱模組的組裝體積小,可應用於筆記型電腦等内部 空間狹小的電子裝置中。 [0034] 本案得由熟知此技術之人士任施匠思而為諸般修飾,然 皆不脫如附申請專利範圍所欲保護者。 【圖式簡單說明】 [0035] 第一圖A :其係為本案較佳實施例之流體散熱模組之分解 結構示意圖。 [0036] 第一圖B :其係為第一圖A所示之閥體蓋體之背面結構示 意圖。 [0037] 第一圖C :其係為第一圖A所示之閥體薄膜之結構示意圖 099109467 表單編號A0101 第16頁/共31頁 0992016826-0 201134376 [0038] 第一圖D :其係為第一圖A所示之閥體座之反面結構示意 圖。 [0039] 第二圖:其係為第一圖A之組裝完成結構示意圖。 [0040] 第三圖A :其係為第二圖所示之流體散熱模組之未作動狀 態時之A-A剖面示意圖。 [0041] 第三圖B :其係為第三圖A之壓力腔室膨脹狀態示意圖。 [0042] 第三圖C,其係為於壓力腔室膨脹狀態時第二圖之B-B剖 面圖。G Please also refer to the third figure A, B, and c. As shown in the figure, when the cover body 25, the actuating device 24, the valve body cover 22, the valve body film 23, the sealing ring 26, 27, the valve body seat 21, The seal ring 5 and the heat absorbing unit 3 are assembled and arranged corresponding to each other, and after the valve body seat 21 and the heat absorbing unit 3 are communicated by the first connecting pipe 41 and the second connecting pipe 42, the opening 213 of the valve body seat 21 is connected to the valve body. The inlet valve structure 231 on the thin tube 23 and the inlet valve passage 221 on the valve body cover 22 correspond to each other, and the outlet temporary storage chamber 21 5 on the valve body seat 21 and the outlet valve piece 232 on the valve body film 23 and The outlet valve passage 222 on the valve body cover 22 corresponds to, and since the micro-convex structure 216 is disposed at the edge of the opening 213 of the valve body seat 21, the inlet valve structure 231 of the valve body film 23 is slightly protruded from the valve body seat 21. Above the 'and the micro-convex structure 216 touches the valve body diaphragm 23 to generate a pre-force effect, so that the inlet valve structure 231 forms a gap with the valve body seat 21 when not actuated, and likewise, the outlet valve structure 232 The outlet valve is also closed by placing the micro-convex structure 225 on the valve body cover 22. 232 and the valve cover 22 to form a gap. When the actuator 242 is driven by a voltage, the actuating device 24 produces a bending deformation as shown in Figures B and C, and the actuating device 24 is oriented in the direction indicated by the arrow c. 099109467 Form No. A0101 Page 13 / 31d0992016826-0 [0027] 201134376 The upward bending deformation causes the volume of the pressure chamber 226 to increase, thereby generating a suction force, so that the inlet valve structure 231 of the valve body film 23 and the outlet valve structure 232 are subjected to an upward pulling force, and The inlet valve piece 2313 of the inlet valve structure 231 having a pre-force is rapidly opened, so that the fluid that has absorbed the heat energy of the heat absorbing unit 3 can be self-heated from the second outlet passage 33, the second connecting tube 42 and the valve body seat of the heat absorbing unit 3. The first inlet passage 211 on the 21 is sucked in (as shown in FIG. 3C), and flows through the opening 213 in the valve body seat 21, the hole 2312 of the inlet valve structure 231 on the valve body film 23, and the valve body cover. The inlet temporary chamber 223 and the inlet valve passage 221 on the body 22 flow into the pressure chamber 226 (as shown in the third panels B and C). [0028] At this time, referring to FIG. 3B again, since the inlet valve structure 231 and the outlet valve structure 232 of the valve body film 23 are subjected to the upward pulling force, the outlet valve structure 232 at the other end is located due to the upward pulling force. The outlet valve piece 2323 on the valve body film 23 seals the outlet valve passage 222, so that the outlet valve structure 232 is closed, and the surface of the micro-convex structure 225 contacting the outlet valve structure 232 is a horizontal contact surface type once the inlet When the valve structure 231 is opened to allow fluid to flow into the interior of the valve body seat 21, the outlet valve structure 232 of the valve body film 23 can still form a closed surface contact with the micro-convex structure 225, which can produce a larger and better pre-covering against backflow. effect. [0029] When the actuating device 24 is bent downwardly as the arrow d shown in FIG. D is changed due to the change of the electric field direction, the volume of the pressure chamber 226 is compressed, so that the pressure chamber 226 generates internal fluid. a thrust force, and the inlet valve structure 231 and the outlet valve structure 232 of the valve body film 23 are subjected to a downward thrust. At this time, the outlet valve piece 2323 of the outlet valve structure 232 disposed on the micro-convex structure 225 can be quickly opened (eg, Figure 3D and E) and fluid 099109467 Form No. A0101 Page 14 / Total 31 Pages 0992016826-0 201134376 [0030] 003 ❹ [0031] [0032] Instantly vented a large amount, from the pressure chamber 226 via the valve The outlet valve passage 222 on the body cover 22, the hole 2322 of the outlet valve structure 232 on the valve body film 23, the outlet temporary cavity 215 on the valve body seat 21, the opening 214 and the first outlet passage 21 are passed through the first The connecting tube 41 and the second inlet passage 32 of the heat absorbing unit 3 flow into the second accommodating groove 31 of the heat absorbing unit 3 (as shown in FIG. 3E), so that the fluid absorbable heat absorbing unit 3 absorbs from the heating element. Thermal energy. Similarly, at this time, since the inlet valve structure 231 is subjected to the downward thrust, the inlet valve piece 2313 is sealed to the opening 213, thereby closing the inlet valve structure 231, and the micro-convex structure 216 is in contact with the inlet valve structure 231. The surface is a horizontal contact surface type. Once the outlet valve structure 232 is opened to release the fluid, the inlet valve structure 231 of the valve body film 23 can still form a closed surface contact with the micro-convex structure 216, which can produce a larger and larger Preferably, the pre-tightening prevents the backflow effect. Therefore, by designing the inlet valve structure 231 and the outlet valve structure 232 to match the micro-convex structures 216 and 225 disposed on the valve body seat 21 and the valve body cover 22, the fluid can be There is no reflow in the transfer process to achieve high efficiency transmission. In the present embodiment, the fluid delivery device 2 is made of a good thermal conductor material and can be a metal having good heat dissipation capability, such as copper or a smelting alloy. The fluid heat dissipation module 1 of the present invention causes the fluid to circulate in the closed circuit according to the actuation of the actuating device 24, and the fluid can pass through the first outlet passage 212 of the valve body seat 21 when the volume of the pressure chamber 226 is compressed. The first connecting pipe 41 and the second inlet passage 32 of the heat absorbing unit 3 flow into the second accommodating groove 31 of the heat absorbing unit 3 (as shown in FIG. 3E), so that the fluid can absorb the heat absorbing unit 3 from the heating element. The absorbed heat energy. On the other hand, when the volume of the pressure chamber 099109467 Form No. A0101 Page 15 / 31 page 0992016826-0 201134376 226 increases, the fluid that has absorbed the heat energy of the heat absorbing unit 3 can be self-heating unit 3, the second outlet channel 33, the second The connecting tube 42 and the first inlet passage 211 on the valve body seat 21 are sucked into the interior of the fluid delivery device 2 for circulation (as shown in FIG. 3C), and the heat absorbed by the fluid is transmitted through the valve of the fluid delivery device 2. The body seat 21, the valve body cover 22 and the cover body 25 are conducted to the plurality of heat dissipation structures 28, and the heat is discharged to the external environment by natural convection or forced convection of the fan. [0033] In summary, the liquid heat dissipation module of the present invention stacks the fluid delivery device and the heat absorption unit with each other, and connects the fluid delivery device and the heat absorption unit through the connecting tube to form a closed circuit for fluid transfer. Into the heat absorbing unit, to absorb the heat energy of the heat absorbing unit, and transfer the heat absorbing the fluid back to the fluid conveying device to dissipate heat from the fluid by using the heat dissipating structure, in addition to being able to dissipate heat to a heat generating component, the liquid of the present case The heat-dissipating module has a small assembly size and can be applied to an electronic device having a small internal space such as a notebook computer. [0034] The present invention has been modified by those skilled in the art, and is not intended to be protected by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0035] FIG. 1 is a schematic exploded view of a fluid heat dissipation module of the preferred embodiment of the present invention. [0036] First FIG. B is a schematic view showing the structure of the back surface of the valve body cover shown in FIG. [0037] First FIG. C is a schematic structural view of a valve body film shown in FIG. A. 099109467 Form No. A0101 Page 16 / Total 31 Pages 0992016826-0 201134376 [0038] First Figure D: The reverse structure of the valve body seat shown in the first figure A. [0039] The second figure is a schematic diagram of the assembled structure of the first drawing A. [0040] FIG. 3A is a schematic cross-sectional view of the A-A when the fluid heat dissipation module shown in FIG. 2 is in an unactuated state. [0041] FIG. 3B is a schematic view showing the state of expansion of the pressure chamber of FIG. [0042] FIG. 3C is a cross-sectional view taken along line B-B of the second diagram when the pressure chamber is in an expanded state.

[0043] 第三圖D :其係為第三圖A之壓力腔室壓縮狀態示意圖。 [0044] 第三圖E,其係為於壓力腔室壓縮狀態時第二圖之C-C剖 面圖。 【主要元件符號說明】 [0045] 流體散熱模組:1 [0046] 流體輸送裝置-.2 [0047] 閥體座:21 [0048] 上表面:210、220 [0049] 第一入口通道:211 [0050] 第一出口通道:212 [0051] 開口 : 213、214 [0052] 出口暫存腔:21 5 [0053] 微凸結構:216、225 099109467 表單編號A0101 第17頁/共31頁 0992016826-0 201134376 [0054] 凹槽:217、218、224、227、229、2193 [0055] 下表面:219、228 [0056] 第一容置槽:2191 [0057] 第一凸起結構:2192 [0058] 閥體蓋體:22 [0059] 入口閥門通道:2 21 [0060] 出口閥門通道:222 [0061] 入口暫存腔:223 [0062] 壓力腔室:226 [0063] 閥體薄膜:23 [0064] 入口閥門結構:231 [0065] 出口閥門結構:232 [0066] 延伸部:2311、2321 [0067] 孔洞:2312、2322 [0068] 入 口閥片:2 31 3 [0069] 出 口閥片:2323 [0070] 致動裝置:24 [0071] 致動薄膜:241 [0072] 致動器:242 099109467 表單編號A0101 第18頁/共31頁 0992016826-0 201134376 [0073] 蓋體:25 [0074] 密封環:26、27、 [0075] 散熱結構:28 [0076] 吸熱單元:3 [0077] 第二容置槽:31 [0078] 第二凸起結構:311 [0079] 第二入口通道:32 [0080] 第二出口通道:33 [0081] 連接管:4 [0082] 第一連接管:41 [0083] 第二連接管:42 ❹ 099109467 表單編號A0101 第19頁/共31頁 0992016826-0[0043] FIG. D is a schematic view showing the compression state of the pressure chamber of FIG. [0044] Fig. E is a cross-sectional view taken along line C-C of the second figure in a compressed state of the pressure chamber. [Main component symbol description] [0045] Fluid heat dissipation module: 1 [0046] Fluid delivery device - 2. [0047] Valve body seat: 21 [0048] Upper surface: 210, 220 [0049] First inlet channel: 211 [0050] First outlet channel: 212 [0051] opening: 213, 214 [0052] outlet temporary cavity: 21 5 [0053] micro convex structure: 216, 225 099109467 Form number A0101 page 17 / total 31 page 0992016826- 0 201134376 [0054] Grooves: 217, 218, 224, 227, 229, 2193 [0055] Lower surface: 219, 228 [0056] First accommodating groove: 2191 [0057] First convex structure: 2192 [0058] Body body: 22 [0059] Inlet valve passage: 2 21 [0060] Outlet valve passage: 222 [0061] Inlet temporary chamber: 223 [0062] Pressure chamber: 226 [0063] Body film: 23 [ 0064] Inlet valve structure: 231 [0065] Outlet valve structure: 232 [0066] Extension: 2311, 2321 [0067] Hole: 2312, 2322 [0068] Inlet valve plate: 2 31 3 [0069] Outlet valve plate: 2323 Actuating device: 24 [0071] Actuating film: 241 [0072] Actuator: 242 099109467 Form number A0101 Page 18 of 31 0992016826-0 201134376 [0073] Cover body: 25 [0074] Sealing ring: 26, 27, [0075] Heat dissipating structure: 28 [0076] Heat absorbing unit: 3 [0077] Second accommodating groove: 31 [0078] Second convex structure: 311 [0079] Second inlet channel: 32 [0080] Second outlet channel: 33 [0081] Connecting tube: 4 [0082] First connecting tube: 41 [0083] Second connecting tube: 42 ❹ 099109467 Form number A0101 19 pages / total 31 pages 0992016826-0

Claims (1)

201134376 七、申請專利範圍: 1 . 一種液體散熱模組,用以對一發熱元件進行散熱,至少包 含:一吸熱單元,其係與該發熱元件接觸,用以吸收該 發熱元件所產生之熱能;一流體輸送裝置,用以傳送一 流體且與該吸熱單元堆疊設置,並具有一散熱結構;以及 一連接管,其係連接該吸熱單元及該流體輸送裝置,用以 將該流體傳送至該吸熱單元内,以吸收該吸熱單元之熱能 ,並將已吸收熱能之該流體傳回該流體輸送裝置,以利用 該散熱結構對該流體進行散熱。 2 .如申請專利範圍第1項所述之液體散熱模組,其中該流體 輸送裝置係由良好熱導體材料所製成,且至少包含:一 蓋體;一閥體座,其係具有一第一出口通道及一第一入 口通道;一閩體蓋體,其係設置於該閥體座上;一閥體薄 膜,其係設置於該閥體座及該閥體蓋體之間;複數個暫存 室,設置於該閥體薄膜與該閥體蓋體之間,以及於該閥體 薄膜與該閥體座之間;以及一振動裝置,其週邊係固設於 該閥體蓋體。 3 .如申請專利範圍第2項所述之流體散熱模組,其中該閥體 座更具有一第一容置槽,該第一容置槽内部係具有複數個 以交錯陣列方式排列的第一凸起結構,該複數個第一凸起 結構係用以吸收該吸熱單元之熱能。 4 .如申請專利範圍第3項所述之液體散熱模組,其中該吸熱 單元係具有一第二容置槽、一第二入口通道以及一第二出 口通道,該第二容置槽係與該第一容置槽相對應,且其内 部係具有複數個以交錯陣列方式排列的第二凸起結構,該 099109467 表單編號A0101 第20頁/共31頁 0992016826-0 201134376 複數個第一凸起結構係與該複數個第二凸起結構相互錯開 ,該複數個第二凸起結構係將該吸熱單元所吸收之熱能傳 遞給該流體。 5 .如申請專利範圍第4項所述之液體散熱模組,其中該閥體 座之該第一出口通道係經由該連接管與該吸熱單元之該第 二入口通道連通,以及該閥體座之該第一入口通道係經由 該連接管與該吸熱單元之該第二出口通道連通,以使該流 體輸送裝置與該吸熱單元間形成一封閉迴路。 6 .如申請專利範圍第2項所述之液體散熱模組,其中該散熱 〇 結構係為複數個散熱鰭片,其係設置於該流體輸送裝置之 該閥體座、該閥體蓋體以及該蓋體之侧邊。 7 .如申請專利範圍第6項所述之液體散熱模組,其中該流體 係因應該致動裝置的作動而於該封閉迴路中循環流動,以 將該吸熱單元所吸收之熱能透過該流體輸送裝置之該閥體 座、該閥體蓋體以及該蓋體傳導至該複數個散熱鰭片,並 透過對流的方式進行散熱。 0992016826-0 099109467 表單編號A0101 第21頁/共31頁201134376 VII. Patent application scope: 1. A liquid heat dissipation module for dissipating heat from a heat generating component, comprising at least: a heat absorbing unit that is in contact with the heat generating component for absorbing heat energy generated by the heat generating component; a fluid transporting device for transporting a fluid and stacked with the heat absorbing unit and having a heat dissipating structure; and a connecting tube connecting the heat absorbing unit and the fluid transporting device for transferring the fluid to the heat absorbing unit Internally, the heat energy of the heat absorbing unit is absorbed, and the fluid that has absorbed heat energy is returned to the fluid conveying device to dissipate the fluid by the heat dissipating structure. 2. The liquid heat dissipation module of claim 1, wherein the fluid delivery device is made of a good thermal conductor material and comprises at least: a cover; a valve body having a first An outlet passage and a first inlet passage; a body cover body disposed on the valve body seat; a valve body film disposed between the valve body seat and the valve body cover; The temporary storage chamber is disposed between the valve body film and the valve body cover body, and between the valve body film and the valve body seat; and a vibration device is fixed to the valve body cover body. 3. The fluid heat dissipation module of claim 2, wherein the valve body seat further has a first receiving groove, and the first receiving groove has a plurality of first arranged in a staggered array. The raised structure, the plurality of first raised structures are configured to absorb thermal energy of the heat absorbing unit. 4. The liquid heat dissipation module of claim 3, wherein the heat absorbing unit has a second accommodating groove, a second inlet channel, and a second outlet channel, and the second accommodating groove is The first accommodating groove corresponds to each other, and the inside thereof has a plurality of second convex structures arranged in a staggered array manner, the 099109467 form number A0101 page 20/total 31 page 0992016826-0 201134376 plural first bulges The structure is offset from the plurality of second raised structures, and the plurality of second raised structures transfer heat energy absorbed by the heat absorbing unit to the fluid. 5. The liquid heat dissipation module of claim 4, wherein the first outlet passage of the valve body seat communicates with the second inlet passage of the heat absorption unit via the connection tube, and the valve body seat The first inlet passage communicates with the second outlet passage of the heat absorbing unit via the connecting pipe to form a closed circuit between the fluid conveying device and the heat absorbing unit. 6. The liquid heat dissipation module of claim 2, wherein the heat dissipation structure is a plurality of heat dissipation fins disposed on the valve body of the fluid delivery device, the valve body cover, and The side of the cover. 7. The liquid heat dissipation module of claim 6, wherein the flow system circulates in the closed circuit due to actuation of the actuation device to transmit thermal energy absorbed by the heat absorption unit through the fluid The valve body seat, the valve body cover body and the cover body of the device are transmitted to the plurality of heat dissipation fins and radiated by convection. 0992016826-0 099109467 Form No. A0101 Page 21 of 31
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI775003B (en) * 2018-10-29 2022-08-21 美商海盜船記憶體股份有限公司 Modular pc cooling pump

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI775003B (en) * 2018-10-29 2022-08-21 美商海盜船記憶體股份有限公司 Modular pc cooling pump

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