201133951 六、發明說明： 【發明所屬之技術領域】 [0001]本發明係有關一種燈泡，尤指一種發光二極體燈泡的燈 蕊製作方法及其結構。 【先前技術】 [0002] 傳統的發光二極體（LED，light emitnn ,. J , tlng diode) g) 體積小、耗«低、使壽命長’以逐•代傳統燈泡， 被廣泛的使用在紅綠燈號誌、汽車方向燈、手電筒手 機、燈具及大型的戶外看板上。201133951 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a light bulb, and more particularly to a method for fabricating a bulb of a light-emitting diode bulb and a structure thereof. [Prior Art] [0002] Conventional light-emitting diodes (LED, light emitnn, J, tlng diode) g) Small size, low consumption, long life, and traditional light bulbs are widely used in Traffic lights, car lights, flashlights, lights and large outdoor billboards.
❹ [0003] 目前許多的燈具中所使用的煃泡都是發光二極體a片所 製作成的燈蕊’而這些燈蕊都是將發光二極艘焊接在玻 璃纖維或碳纖維所製成的電路基板上，而焊接 板上的發光二極體係屬於高功率特性，如、上 所以在被點亮時 ，必然產生一極高的熱源，這個極高的叙I 入 q的熱源將會影響到 高功率發光二極體的正常使用及使用秦人 .’命。因此，製造 者於該電路基板上增設有-散熱結構.，將高功率發光二 極體所產生的弟齊難去’使高功率發光二 t木 用及延長使用壽命。但是，讓燈蕊在製作上工二= 都增加，而且燈蕊的結構也變複雜。 [_由於近幾年科技不斷進步下，業者為解決上述缺失，將 玻璃纖維或碳纖維所製成的電路基板由氮㈣基板所取 代’不但簡化了結構’讓製成更加容易。但是，氣化銘 基板的價格昂貴，造成製作成本增加。 【發明内容】 [0005] 099109836 因此’本發明之主要目的，在於解決上述傳統缺失， 表單编號A0101 第3頁/共16頁 提 0992017377-0 201133951 出一種結構簡易，還可降低製作成本的發光二極體燈蕊 的製作方法及其結構。 [0006] 為達上述之目的，本發明提出的方法，包括： [0007] 備一鋁基板，將鋁基板的一侧面處理後，形成一層極薄 的氧化鋁（Al^g)的絕緣層； L 〇 [0008] 再備有一電路板，其上具有一穿孔，該穿孔邊緣的電路 板的一側面上具有傳導正、負電源的二相對稱的第一焊 接面及複數個正、負電源的第二焊接面；於該電路板的 邊緣上具有複數個對應該凹口的缺口；該電路板的另一 側面塗布有黏膠，使該電路板可黏貼於該氧化鋁的絕緣 層上，該電路板的穿孔使部份的氧化鋁的絕緣層外露； [0009] 將一發光二極體晶片固著於該絕緣層上； [0010] 將該發光二極體晶片與第一焊接面之間電性連結二導線 [0011] 再於該第一及第二焊接面之間的電路板上製作一圍住該 發光二極體晶片及二導線的圍牆；及， [0012] 再於該圍牆内點膠，以形成一透鏡。 [0013] 為達上述之目的，本發明所提出的結構，包括： [0014] 一鋁基板，其上具有一氧化鋁的絕緣層，以及邊緣具有 複數凹口； [0015] 一電路板，係設於該絕緣層上，其上具有一使部份絕緣 層外露的穿孔，該穿孔邊緣的電路板的一側面上具有傳 099109836 表單編號A0101 第4頁/共16頁 0992017377-0 201133951 導正、負電源的二相對稱的第一焊接面及複數個正、負 電源的第二焊接面；於該電路板的邊緣上具有複數個對 應該凹口的缺口； [0016] 一發光二極體晶片，係固著於該部份外露的絕緣層上； [0017] 二導線，係電性連結於該發光二極體晶片及二個第一焊 接面之間； [0018] 一圍牆，係設於該第一及第二焊接面之間的電路板上， 並圍住該發光二極體晶片及二導線；❹ [0003] At present, the sputum used in many luminaires is a lamp core made of a light-emitting diode a piece, and these lamp cores are made by welding a light-emitting diode to glass fiber or carbon fiber. On the circuit board, the light-emitting diode system on the soldering plate belongs to high-power characteristics. If it is on, it will inevitably generate a very high heat source. This extremely high heat source will affect the heat source. The normal use of high-power light-emitting diodes and the use of Qin people. 'Life. Therefore, the manufacturer adds a heat-dissipating structure to the circuit board, which makes it difficult to use the high-power light-emitting diode to make the high-power light-emitting diode and the service life. However, the lamp core is increased in production, and the structure of the lamp core is complicated. [_Because of the continuous advancement of technology in recent years, in order to solve the above-mentioned shortcomings, the manufacturer replaced the circuit substrate made of glass fiber or carbon fiber with a nitrogen (four) substrate, which not only simplifies the structure, but makes it easier to manufacture. However, the gasification of the substrate is expensive, resulting in an increase in production costs. SUMMARY OF THE INVENTION [0005] 099109836 Therefore, the main purpose of the present invention is to solve the above-mentioned conventional deficiencies, form number A0101, page 3 / total 16 pages, 0992017377-0 201133951, a simple structure, can also reduce the cost of production The manufacturing method and structure of the diode lamp core. [0006] In order to achieve the above object, the method provided by the present invention comprises: [0007] preparing an aluminum substrate, treating one side of the aluminum substrate to form an ultra-thin aluminum oxide (Al^g) insulating layer; L 〇 [0008] further comprising a circuit board having a through hole thereon, the circuit board of the perforated edge has a first symmetrical first welding surface for conducting positive and negative power sources and a plurality of positive and negative power sources a second soldering surface; a plurality of notches corresponding to the notches on the edge of the circuit board; the other side of the circuit board is coated with an adhesive, so that the circuit board can be adhered to the insulating layer of the aluminum oxide, The perforation of the circuit board exposes a portion of the insulating layer of aluminum oxide; [0009] fixing a light-emitting diode wafer to the insulating layer; [0010] between the light-emitting diode wafer and the first soldering surface Electrically connecting two wires [0011] and forming a wall surrounding the LED chip and the two wires on the circuit board between the first and second soldering surfaces; and [0012] further in the fence Dispensing to form a lens. [0013] In order to achieve the above object, the structure proposed by the present invention includes: [0014] an aluminum substrate having an insulating layer of aluminum oxide thereon, and an edge having a plurality of notches; [0015] a circuit board Provided on the insulating layer, having a perforation for exposing a portion of the insulating layer, the side of the circuit board having the perforated edge having a pass number 099109836 Form No. A0101 Page 4 / 16 pages 0992017377-0 201133951 a second welding surface of the negative power source and a second welding surface of the plurality of positive and negative power sources; and a plurality of notches corresponding to the notches on the edge of the circuit board; [0016] a light emitting diode chip Attached to the exposed insulating layer; [0017] two wires electrically connected between the LED chip and the two first soldering surfaces; [0018] a wall a circuit board between the first and second soldering surfaces, and surrounding the LED chip and the two wires;
[0019] [0020] 一透鏡，係設於圍牆内，以封蓋發光二極體晶片及二導[0020] a lens is disposed in the surrounding wall to cover the LED chip and the second guide
線。 【實施方式】 茲有關本發明之詳細說明及技術内容，現配合圖式說明 如下： [0021] 請參閱第一圖，係本發明之燈蕊製作步驟流程示意圖； 及同時，一併參閱第二圖a~g及第三圖。如圖所示：本發 Ο 明之發光二極體燈泡的燈蕊製作方法，首先，如步驟1〇〇 ，備一銘基板1。 [0022] 步驟102，製作絕緣層2，將鋁基板1經加工處理後，在該 鋁基板1的一侧面上形成一層極薄的氧化鋁（ai2〇3)的絕 緣層2(如第二圖a)及緣邊上的凹口11。在本圖式中，該 氧化鋁的絕緣層2的厚度為10um。 [0023] 步驟104，黏貼電路板3，該電路板3為薄片形，其上中央 具有一穿孔31，該穿孔31邊緣的電路板3的一侧面上具有 099109836 表單編號A0101 第5頁/共16頁 0992017377-0 201133951 傳導正、負電源的二相對稱的第一焊接面犯、32，及複 個正負％源的第二烊接面33、33，。於該電路板的 邊緣上具有複触對應該凹^ u的缺心。該電路板㈣ 另一側面塗布有黏膠，使該電路板3可黏貼於該氧化鋁的 絕緣層2上’該電路板3的穿孔31使部份的氧化紹的絕緣 層2外露（如第二圖b、c)。本圖式中，該電路板3為印刷 電路板（Printed Clr⑶it bGard，p⑻或軟性印刷 電路板（Flex Printed Circuit board，FPCB)之任 一種。 [0024] [0025] [0026] 步驟106，固晶，將發光二極體晶片4一侧面塗布一黏膠 或者由穿孔31外露的氧化鋁的絕緣層2的表面上塗布有一 黏膠’以供發光二極體晶片4黏著於該氧化㈣絕緣層2 的表面上（如第二圖d)。 步驟108 ’打線’將該發光二極體晶片5的另—側面與二 導線5的-端電性連結，該；導線5的另7端與該電路板3 上的第一焊接面32、32’霍性連結。在本圖式中可為金 線（如第二圖e)。 步驟110，製作圍牆，可透過印刷技術印刷具有_特定厚 度的圍牆（或中空的座體）6，該圍牆6設於該第—焊接面> 32、32’與該第二焊接面33、33，之間的電路板3的一 側面上（如第二圖f)。 步驟112，進行點膠，係於該圍牆6内點入矽膠或環氧樹 脂，以形成-透鏡7(如第二圖以。該透鏡7可以保護發光 二極體晶片（晶粒）不受外物影響，使投射於外部的光學 099109836 表單編號A0101 第6頁/共16頁 0992017377-0 [0027] 201133951 [0028] [0029] ❹line. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The detailed description and technical contents of the present invention will now be described with reference to the following drawings: [0021] Referring to the first drawing, it is a schematic flow chart of the steps of manufacturing the lamp core of the present invention; and at the same time, referring to the second Figures a~g and third. As shown in the figure: In the method for manufacturing the lamp core of the light-emitting diode bulb of the present invention, first, as in step 1 , a substrate 1 is prepared. [0022] Step 102, the insulating layer 2 is formed, and after the aluminum substrate 1 is processed, an extremely thin aluminum oxide (ai2〇3) insulating layer 2 is formed on one side of the aluminum substrate 1 (as shown in the second figure). a) and the notch 11 on the rim. In the present figure, the insulating layer 2 of the alumina has a thickness of 10 μm. [0023] Step 104, pasting the circuit board 3, the circuit board 3 is in the shape of a sheet having a through hole 31 at the center thereof, and the side of the circuit board 3 at the edge of the through hole 31 has 099109836 Form No. A0101 Page 5 of 16 Page 0992017377-0 201133951 Conducting the first and second welding faces of the positive and negative power sources, 32, and the second splicing faces 33, 33 of the positive and negative source. On the edge of the board, there is a missing contact that should be concave. The other side of the circuit board (4) is coated with a glue, so that the circuit board 3 can be adhered to the insulating layer 2 of the alumina. The perforation 31 of the circuit board 3 exposes part of the insulating layer 2 of the oxide layer (eg, Figure b, c). In the figure, the circuit board 3 is any one of a printed circuit board (Printed Clr (3) it bGard, p (8) or a flexible printed circuit board (FPCB). [0024] [0026] Step 106, solid crystal Applying an adhesive to one surface of the light-emitting diode wafer 4 or coating the surface of the insulating layer 2 of the aluminum oxide exposed by the through-hole 31 for the light-emitting diode wafer 4 to adhere to the oxide (four) insulating layer 2 On the surface (as in the second figure d). Step 108 'wire' electrically connects the other side of the LED wafer 5 to the end of the two wires 5; the other end of the wire 5 and the circuit The first welding surface 32, 32' on the plate 3 is humiliated. In this figure, it may be a gold wire (as shown in the second figure e). Step 110, making a wall, printing a wall having a specific thickness by printing technology (or hollow seat body) 6, the wall 6 is provided on one side of the circuit board 3 between the first welding surface > 32, 32' and the second welding surface 33, 33 (as shown in the second figure) f) Step 112, dispensing, by inserting a silicone or epoxy resin into the fence 6 to form a transparent 7 (as shown in the second figure. The lens 7 can protect the LED chip (grain) from foreign objects, so that the optical projection 099109836 is shown on the outside of the form number A0101 page 6 / 16 pages 0992017377-0 [0027 ] 201133951 [0028] [0029] ❹
[0030] 路徑佳，在矽膠或環氧樹脂之任一種參雜螢光粉後，讓 發出的光能被調變。 步驟11 4，連結電源線，將正、負電源的二電源線8電性 連結在任一組的第二焊接面33、33’上，該二電源線8的 一端具有一連接器81(如第三圖）。 請參閱第二圖g。如圖所示：本發明之燈蕊結構，包括： 一鋁基板1，該鋁基板1的邊緣具有複數凹口 11，該鋁基 板1的一侧面上具有一氧化鋁的絕緣層2，該絕緣層2的一 側面上具有一電路板3，該電路板3上具有一供絕緣層2外 露的穿孔31，以及該電路板3的一侧面上具有傳導鄭、負 電源的二相對稱之第一焊接面32、32’及複數個正、負 電源的第二焊接面33、33’ 。於該電路板3的邊緣上具有 複數個對應該凹口 11的缺口 34。於該穿孔31中外露的絕 緣層2上黏著有一發光二極體晶片4。該發光二極體晶片4 電性連結二導線5，該二導線5的另一端與該第一焊接面 32、 32’電性連結。再於該第一焊接面32、32’與該第 二焊接面33、33’之間的電路板3上具有一圍住該發光二 極體晶片4、二導線5的圍牆6，該圍牆6上具有一透鏡7。 當電源由正、負電源的二電源線8輸入後，經第二焊接面 33、 33’傳至第一焊接面32、32’ ，此發光二極體晶片 4被點亮。在發光二極體晶片4被點亮時，該發光二極體 晶片4所產生的光線經透鏡7投射於外部，而發光二極體 晶片4所生的熱源經絕緣層2傳導至該鋁基板1上，由該鋁 基板1進行散熱。 099109836 表單編號A0101 第7頁/共16頁 0992017377-0 201133951 [0031] [0032] [0033] [0034] [0035] [0036] [0037] [0038] [0039] [0040] [0041] [0042] [0043] 099109836 由於本發明在鋁基板1上製作了 一層氧化鋁的絕緣層2， 在熱傳導率150w/mk的測試下，該鋁基板}的特性與價格 昂責的氮化鋁基板相同，因此可以降低製作成本。 請參閱第三圖，係本發明之燈蕊結構的使用狀態示意圖 。如圖所示：在本發明的發光二極體燈蕊結構製作士 後，該燈蕊結構可安裝於該具有散熱殼體91的燈泡9上 以形成發光二極體燈泡，可供運用在燈具上。 上述僅為本發明之較佳實施例而已，並非用來限定本 明實施之範圍。即凡依本發明申請專利範圍所做的幺發 變化與修飾，皆為本發明專利範圍所涵蓋。 =等 【圖式簡單說明】 第一圖係本發明之燈蕊製作步驟流程示意圖。 第二圖a~g係本發明的燈蕊結構製作流程示意圖。 第二圖係本發明之燈蕊結構的使用狀態示意圖。 【主要元件符號說明】 !：' 步驟 100~114 - 鋁基板1 凹口 11 絕緣層2 電路板3 穿孔31 第一焊接面32、32’ 表單編號A0101 °"2〇17377-ft 201133951 [0044] 第二焊接面33、33’ ' [0045] 缺口 34 [0046] 發光二極體晶片4 [0047] 導線5 [0048] 圍牆6 [0049] 透鏡7 [0050] 電源線8 Ο [0051] 連接器81 [0052] 燈泡9 [0053] 散熱殼體91 ❹ 099109836 表單編號Α0101 第9頁/共16頁 0992017377-0[0030] The path is good, and after any of the silicone or epoxy resin is mixed with the fluorescent powder, the emitted light energy is modulated. Step 11 4, the power cable is connected, and the two power cables 8 of the positive and negative power sources are electrically connected to the second soldering surfaces 33, 33' of any group, and one end of the two power cables 8 has a connector 81 (such as Three pictures). Please refer to the second figure g. As shown in the figure, the lamp core structure of the present invention comprises: an aluminum substrate 1 having an edge of a plurality of notches 11 on one side thereof, and an insulating layer 2 of aluminum oxide on one side of the aluminum substrate 1 On one side of the layer 2, there is a circuit board 3 having a through hole 31 for exposing the insulating layer 2, and a first surface of the circuit board 3 having a positive and negative power supply on one side of the circuit board 3 Welding faces 32, 32' and a plurality of second welding faces 33, 33' of positive and negative power sources. On the edge of the circuit board 3 there are a plurality of notches 34 corresponding to the notches 11. A light-emitting diode chip 4 is adhered to the insulating layer 2 exposed in the through hole 31. The LED chip 4 is electrically connected to the two wires 5, and the other ends of the wires 5 are electrically connected to the first bonding faces 32, 32'. Further, on the circuit board 3 between the first soldering surface 32, 32' and the second soldering surface 33, 33', a fence 6 surrounding the LED chip 4 and the two wires 5 is formed. The fence 6 There is a lens 7 on it. When the power source is input from the two power lines 8 of the positive and negative power sources, it is transmitted to the first soldering faces 32, 32' via the second soldering faces 33, 33', and the light emitting diode chip 4 is illuminated. When the light-emitting diode wafer 4 is illuminated, the light generated by the light-emitting diode wafer 4 is projected to the outside through the lens 7, and the heat source generated by the light-emitting diode wafer 4 is conducted to the aluminum substrate via the insulating layer 2. On the first, heat is dissipated by the aluminum substrate 1. 099109836 Form No. A0101 Page 7 / Total 16 Pages 0992017377-0 201133951 [0031] [0033] [0036] [0037] [0038] [0040] [0041] [0042] [0043] 099109836 Since the present invention has formed an insulating layer 2 of aluminum oxide on the aluminum substrate 1, the characteristics of the aluminum substrate are the same as those of the expensive aluminum nitride substrate under the test of thermal conductivity of 150 w/mk. Therefore, the production cost can be reduced. Please refer to the third figure, which is a schematic diagram of the state of use of the lamp core structure of the present invention. As shown in the figure, after the light-emitting diode structure of the present invention is fabricated, the lamp core structure can be mounted on the bulb 9 having the heat-dissipating housing 91 to form a light-emitting diode bulb, which can be used in the lamp. on. The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the present invention. That is, variations and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention. =etc. [Simplified description of the drawings] The first figure is a schematic flow chart of the steps of the lamp making process of the present invention. The second figures a to g are schematic diagrams showing the manufacturing process of the lamp core structure of the present invention. The second drawing is a schematic view showing the state of use of the lamp core structure of the present invention. [Main component symbol description] !:' Step 100~114 - Aluminum substrate 1 Notch 11 Insulation 2 Circuit board 3 Perforation 31 First welding surface 32, 32' Form No. A0101 °"2〇17377-ft 201133951 [0044 Second soldering surface 33, 33'' [0045] Notch 34 [0046] LED Diode 4 [0047] Conductor 5 [0048] Fence 6 [0049] Lens 7 [0050] Power Cord 8 005 [0051] Connection 81 [0052] Light bulb 9 [0053] Heat sink housing 91 ❹ 099109836 Form number Α 0101 Page 9 / Total 16 pages 0992017377-0