TW201132907A - LED light source device - Google Patents

LED light source device Download PDF

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Publication number
TW201132907A
TW201132907A TW099133548A TW99133548A TW201132907A TW 201132907 A TW201132907 A TW 201132907A TW 099133548 A TW099133548 A TW 099133548A TW 99133548 A TW99133548 A TW 99133548A TW 201132907 A TW201132907 A TW 201132907A
Authority
TW
Taiwan
Prior art keywords
led
frame
heat dissipation
light source
source device
Prior art date
Application number
TW099133548A
Other languages
Chinese (zh)
Inventor
Kenji Yoneda
Original Assignee
Ccs Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ccs Inc filed Critical Ccs Inc
Publication of TW201132907A publication Critical patent/TW201132907A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

This invention thermally separates a LED and a control section for controlling the LED so as to reduce their mutual thermal effect, and to efficiently cool the LED and the control section. The LED light source device of this invention includes a first housing receiving a LED substrate, a second housing receiving a LED control section, a connection member connecting the first housing and the second housing in a thermally separated state, a first heat dissipation structure provided on one of the mutually opposing faces of the first housing and the second housing, and a second heat dissipation structure provided on the other of the afore-mentioned mutually opposing faces and spaced from the first heat dissipation structure.

Description

201132907 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種使用發光二；^體(以下稱LED)的光源裝置。 【先前技術】 用LED的光源裝置，如專利文獻1所示的，包含：第 體覆蓋部以及基盤），其收納搭載著LED的LED基板；第2 if(電路收納部）’其收納驅動電路部；以及保持柱，其連結第1 及第2框體。然後’在保持柱上設置用來將LED所產生的 ϊΐίί外部域去的健部，將咖所產钱熱從鱗柱傳導 而’在上述的光源裝置中，由於透過連結第1框體以及第2 ίΪΪ保躲對散熱部料LED所產生祕，LED所產生的熱不 到散熱部而6，還會_第2框體，導致熱分離不充分這 =問題。另外，當驅動電路部比LED更高溫時，該驅動電路部 生的熱會傳到第1框體，也會導致熱分離不充分的問題。 外，如專利文獻2所示的，習知LED光源裝置包含：第1 二狀部以及蓋部構件），其收納LED基板；第2框體(下部框 月)笛:收納控制電路；以及第3框體(框體），其橫跨第1框體以 框體的側周圍面而連結第i框體以及第2框體。然後，在 的内部設置* LED.絲熱接合的散熱構件，同時在 遛上设置開口部。 品二Ϊ而:第3框體是横跨第1框體以及第2框體的整個側周圍 H§ s、纟f第1框體以及第2框體的構件，會有熱分離不充分的問 件僅設置在以衫板側，完全沒有考慮到收納 的第2框體的散熱問題。這樣的構造，其控制電路會受201132907 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a light source device using a light-emitting device (hereinafter referred to as an LED). [Prior Art] A light source device using LEDs includes a first body covering portion and a base plate, and includes an LED substrate on which an LED is mounted, and a second if (circuit storage portion) that houses a driving circuit. And a holding column that connects the first and second frames. Then, 'the health part that is used to set the 外部ίί external area generated by the LED is placed on the holding column, and the heat generated by the coffee is transferred from the scale column. 'In the light source device described above, the first frame and the first frame are connected through 2 ΪΪ ΪΪ 躲 对 对 对 对 对 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热Further, when the drive circuit portion is at a higher temperature than the LED, heat generated in the drive circuit is transmitted to the first casing, which causes a problem of insufficient heat separation. Further, as shown in Patent Document 2, a conventional LED light source device includes: a first two-shaped portion and a lid member) that houses an LED substrate, and a second frame (lower frame moon): a storage control circuit; In the third frame (frame), the i-frame and the second frame are coupled to each other across the first frame body on the side peripheral surface of the frame. Then, the inside of the *LED. wire heat-dissipating heat-dissipating member is placed inside, and the opening portion is provided on the crucible. In the second frame, the third frame body is a member that spans the entire circumference of the first frame body and the second frame body, H§s, 纟f, the first frame body, and the second frame body, and the heat separation is insufficient. The question piece is only placed on the side of the shirt panel, and the heat dissipation problem of the second housing that is accommodated is not considered at all. Such a configuration, its control circuit will be subject to

成為發生故障等不良情況的原因。該等問題主要4 為並未明確地簡顺 U 習知_文獻 201132907 專利文獻 專利文獻1 :曰本特開2008—293753號公報 專利文獻2 ·日本特開2008—204671號公報 【發明内容】 [發明所欲解決的問題] 本發明乃係為一舉解決上述問題點而提出者， 、 的問題為：將LED與控制LED的控卿錢似=欲解決 在熱傳導上難以互相造成影響，同時能夠有效率 使其 控制部。 卞e々部LED以及 [解決問題之技術手段] 亦即本發明之LED光源裝置包含：第！框體，其 基板；第2框體，其收納控制該LED的控^ i 上熱分離的狀態連結該第1框體以及該第2 ίί ^政熱構造，其設置在該第丨框體與該第2 體互相 其中-面上；以及第2散熱構造，其設置在該第丨框體盘 1 框體互相對向面的另-面上，與該第i散熱構造隔著間隔、。以 若根據該等構造，由於將LED基板收納在第丨框體内， 控制部收納在第2框體内，同時利用連結構件使該等框 質 上熱分離的狀態下連結，故能夠讓LED所產生的熱難以傳導至控 制部，同時讓控制部所產生的熱也難以傳導至LED。另外，由^ 在第、1框體以及第2框體互相對向之面上設置彼此獨立存在的散 熱構造，故隨著今後LED的耐熱對策的發展其容許溫度越來越高 的技術趨勢，在框體之間的有限空間内，可讓散熱構造的散熱^ 形狀、片數、咼度等要素配合led側以及控制部側各自的最適當 溫度’進而實現效率良好的照明。 田 ^就第1散熱構造以及第2散熱構造的具體實施態樣而言，該 等散熱構造可考慮由複數散熱片所構成。該等散熱片分別以對其 對向面立起的方式設置。 八 為了利用散熱構造提高散熱性能，宜在該第1框體與該第2 201132907 框體之間設置風扇。 當將風扇設置在第1框體與第2框體之間時，為了成+兩林 ; ffi第2框體之間的構造，該風扇宜被^連結 苒仵固疋在该第1框體與該第2框體之間。 體固定態樣而言，該風扇宜以其空氣吸人口或空 方朝向該第1框體側，而其空氣吸入口或空氣 戸出的另一方朝向該第2框體側的方式固定。特別是宜以处氣 1 ΪΤ或第2框體的低溫侧而空氣排出口朝向ί温 式 便可鱗置在低溫_域上陳熱構造 空1使其冷卻’ _對高溫側咐1體將低溫側的空氣 供、，，。到咼溫側以使其冷卻，進而適當地使兩者冷卻。 [對照先前技術之功效] Μ,ιϊίίί備^構造的本㈣，便可將led與㈣的 二H为離’使，、不易互相造成熱影響，同時有效 以及控制部。 【實施方式】 樣 以下參照®式説明本發明之LED絲裝置_的—個實施態 〈裝置構造〉 、、包刚2源裝i 1 〇〇係呈約略旋轉體形狀的電燈 泡i裝置，如圖1所不的，包含：第！框體22，其收 複數個LED2U的LED基板21 ;第2框體24，其收 刪的電壓的控制部23 ;以及連結構件25，其以在^二 體22以及第2框體24之間形成朝外 該等框體22、24互相連結。 的万式將 第1框體22係刚端側呈約略部分球體形狀的構件，在第工框 ，22的後端壁221上以互相密合的方式設置咖 苐i框體22的呈約略部分球體形狀的部分22 ^ LE咖之光線的擴散構件所構成。又，第i框體22的^ 201132907 構造並非僅限於圖1而已，可有各種形狀以及構造。例如，第i 框體22亦可收納LED以及對應LED設置的集光透鏡，並使射出 光線從該集光透鏡直接射出到外部去。 第^框體24 —端設置有可連接插座部的套圈部24ι，在其内 部收納著控制該套圈部241的供給電力供應給LED2U的控制部 23。又，在圖1中套圈部241與控制部23之間的配線被省略。 連結構件25，如圖1所示的，係連接第丨框體22以及第2 ，體24互相對向之面的構件，亦即，連接第（框體22的後端面 2a與第2框體24的前端面24a，進而連結第1框體22盥第2框 體24的構件。 ^ 本心態樣的連結構件25有4個，如圖2所示的，配置在』 ί’以約略平行的方式連結第1框體22的平面狀的後免 遠社it 框1 24的平面狀的前端面24a。藉由像這樣將複1 的產ίϊί 相物㈣方式設置，便可防止溫度例 扩it差二。5鍵、，，。構件25在第1框體22的後端面22a與第 ，體24的刖^面24a之間形成朝外部開放的空間χ。又，至少乂 ΐΐ構的，設有連接控制部23與LED2U的電源線 第2 的咖光源裝置觸，在第1框體22以石 。ίΐ ί ’亦即第“1體22的後端面2㈣ 具體而言，係在蜀立^散熱構造％、27。 並在 2框體24的前端面24a上;熱構錄 成。散熱片（以下稱所損 立起而呈約略直線=:== 散熱片26長度大約相同。 断騎所有的第1 另外，第2散熱構造27，與該第〗q 數散熱片（以下稱第2散熱片27)所^ ^；’&quot; 26相同’亦由複 2框體24的前端面24a上設置成向第H片27係f第 棒狀的猜。糾，所梅2 _ 27^=略= 6 201132907 散熱片26以及第2散熱片27彼此之間留有間p 具備上述構造的第！散熱片26以及 LED211與控制部23的溫度平衡決定 ^熱片27可因應 邊會比控制部23更高溫時，便將第i散^ LED2U這 熱片27更長，而當控制部23這邊會比&amp; :士成比第2散 第2散熱片27設定成比第 1 i片會2比6 S2。11 二高，，便將 以及，制部23的運作溫度範圍大約相同f寺長便 以及第2散熱片27的長度設定成相同。 、越片26 然後，第1散熱片26以及第2散埶 ”更高的熱傳導性。具體而言 』u比連結構件 係使_域或_具有高熱傳 f，、、片26、 例如陶究或樹脂等的隔熱構件所形成。根低=材料， I2:第2框體24利用連結構件咖 傳導ί不=用:與散熱片26、27的熱 復多，藉此讓第1框體22以乃笛？ ^「碰〜—的熟傅違里小 另外，第1散J 26=22==熱分離。 連結構件25的外側。在太麻γ能接片27其至〉、一部分位於 ^ 2 ^Z\t^24 ί πΐ!#^ LED 100 的風扇28。 體之間的空間X内設置強制空氣流產生 之門該皮連結構件25固定在第1框體22以及第2框體24 心乂該二喊入π 28a或空氣排出口挪的其中一方朝向第」 201132907 框體侧(後端面22a)而空氣吸入口施或空氣排出口 28b 朝向第2框體側(前端面24a)的方式固定。例如當LEm = 溫度為120C，而控制部23的運作溫度為耽時，便以” 口 28a朝向低溫側的第2框體侧(前端面24&amp;)而空氣 ^ 向高溫:則的第1框體側(後端面叫的方式配置(參照圖。。朝 接著，説明本實施態樣的LED光源裝置⑽ 聰η所產生的熱透過LED基板 的第、的 μ21的背面設置成與第1框體22的 傳導至笛然後’料至第1框體22的後端壁22!的孰，合 ϊί片體22的後端面22a上的第1散熱構造(第θι 放,，，、片26)而被外部大氣冷卻。又，此 的熱傳導率比連結構件25的熱傳導率更大導弟^= 26 的後端壁221的熱幾乎全部都合傳導 =第1框體22 扇28f風將傳導至第1散&amp;=&amp;=去26去。這時風 構件樹㈣的固定 導至第2框體24的前端壁f412= i4 =蘭24卜然後’傳 的前端面24a上的第置在第2框體24 的熱傳導率，㈣、、放熱片的熱傳導率比連結構件25 部都會傳導到第2 至第2框體24的前端壁241的熱幾乎全 ^ fZZZV： * °ib ^28 2 〈本實施態樣的效果&gt; 於將㈡之7光源裝置100，由 結該等質上熱分離的狀態連 另外，由财H所產生的熱也不易傳導至LED211。 ' 匡體22以及第2框體24互相對向的面22a、 201132907 24a上設置彼此獨立存在的散熱構造26、27，故當LED211的運 作溫度以及控制部23的運作溫度不同時，可分別配合該等運作溫 度設計散熱構造26、27，進而有效率地冷卻LED2U以及控制部 &lt;其他變化實施態樣&gt; 又，本發明並非僅限於上述實施態樣而已。 一例如’第1、第2散熱片除了直線細棒狀之外，如圖3、圖4 所不的，亦可ϋ置成她。此時，可使風扇28所產生的 良好，並使冷卻效率提高，如圖3所示的，可將第）以及 $ 熱片26、27 *置成以風扇28為中心呈放射狀配置的平板狀構件月， 亦可如圖4所示的，將第i以及第2散熱片％ ' 設置成以 罐,，柯料板狀的散 —ί ϋ上述實施態樣中，㈣_裝置具備風扇，惟亦可 扇而僅設置第1、，第2散熱片26、27。 ，，扇的配置態樣並不限於上述 例如空氣吸入口以及空氣排出口配置成朝向沿著第 面以及第2框體的前端面的方向。 _的後而 除此之外，上述實施態樣的第丨框體2 對向面(後端面瓜以及前端面㈣為 的 的，將至少其中一面(在圖6中為 '町叮如圖6所不 面。 、園”為職面2切設置成凹狀面或凸狀 另外，在上述實施態樣中，大約 形成的第1假想平面與大約全部的第弟政熱片的前端所 假想平面彼此之間隔賴隔，惟亦的=所形成的第2 片以及第2散熱片設置成互相穿插^圖7所不的’將第1散熱 另外’在上述實施態樣中，連沾盖 惟並非以此為限，亦可為躲狀連、、树赚狀的構件， 再者，當LED與控制部的容^ 麼需要散熱時，可將_散_散‘設方： 201132907 除了電燈泡型之外，亦可置換成雙色㈣的聚光燈式的構件。 此外，本發賴限於上述實補樣，在祕出發明精神 的範圍内可以有各種變化，自不待言。 [產業利用性] 根據本發明’便可將led肖控制LED的控制部熱分離，使 /、不會互相造成熱影響’ *能夠有效率齡卻LED以及控制部。 【圖式簡單說明】 圖1係以7F意方式表示本發明—實施態樣之LED光源裳置的 圖2係沿著A—A線段的剖面圖。 圖3係表不散熱片的變化實施例的剖面圖，其中内部構造被 圖4係表不散熱片的變化實施例的剖面圖，其中内部構造被 圖5係以示意方式表示變化實施態樣之娜光源裝置的側視 圖6係以示意方式表賴化實施祕之咖光職置的側視 圖7係以示意方式表示變化實施態樣之LED光源裝置的側視 【主要元件符號說明】 21〜LED基板 22〜第1框體 22a〜後端面 23〜控制部 24〜第2框體 24a〜前端面 25〜連結構件 201132907 26〜第1散熱構造 27〜第2散熱構造 28〜風扇 28a〜空氣吸入口 28b〜空氣排出口 211〜LED 221〜後端壁 222〜呈約略部分球體形狀的部分 241〜套圈部 A-A〜剖面線 X〜空間 11It is the cause of a malfunction such as a malfunction. The problem is mainly that the problem is not explicitly succinct. U _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The problem to be solved by the invention is that the problem is solved by solving the above problems in one place, and the problem is that the LED is controlled by the control of the LED = it is difficult to solve the influence on the heat conduction, and at the same time, Efficiency makes it the control department.卞e々LED and [Technical means for solving the problem] That is, the LED light source device of the present invention includes: a frame, a substrate, and a second frame that is coupled to the first frame and the second illuminating structure in a state in which the control for controlling the LED is thermally separated, and the second frame is disposed in the second frame The second body is disposed on the other surface of the second body, and the second heat dissipating structure is disposed on the other surface of the second frame body 1 facing the opposing faces of the frame body, and is spaced apart from the ith heat dissipation structure. According to the above configuration, the LED substrate is housed in the second frame, and the control unit is housed in the second casing, and the frame member is thermally separated by the connecting member. Therefore, the LED can be connected. The generated heat is difficult to conduct to the control portion, and the heat generated by the control portion is also difficult to conduct to the LED. In addition, since the heat dissipation structure in which the first, the first frame, and the second frame are opposed to each other is provided, the technology tends to have a higher allowable temperature as the countermeasure against heat rays of the LED develops. In the limited space between the frames, the heat dissipation structure, the number of sheets, the number of turns, and the like can be matched with the optimum temperature of each of the LED side and the control unit side to achieve efficient illumination. In the specific embodiment of the first heat dissipation structure and the second heat dissipation structure, the heat dissipation structure can be considered to be composed of a plurality of heat sinks. The fins are respectively disposed in such a manner as to stand up against the opposite faces. VIII In order to improve the heat dissipation performance by the heat dissipation structure, it is preferable to provide a fan between the first housing and the second 201132907 housing. When the fan is disposed between the first frame and the second frame, the fan is preferably shackled to the first frame in order to form a structure between the two frames and the ffi second frame. Between the second frame and the second frame. In the body-fixed state, the fan is preferably oriented such that the air suction or the air is directed toward the first frame side, and the air intake port or the other air is drawn toward the second frame side. In particular, it is advisable to use the gas 1 ΪΤ or the low temperature side of the second frame and the air discharge port to face the ί warm type, and the scale can be placed at a low temperature _ domain on the hot structure 1 to cool it _ the high temperature side 咐 1 body will Air supply on the low temperature side,,,. The temperature is cooled to the side of the wetting side, and the two are appropriately cooled. [Compared with the effect of the prior art] Μ, ιϊ ίίί 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造[Embodiment] Hereinafter, a description will be given of a light bulb i device having a shape of an approximately rotator in accordance with an embodiment of the present invention. 1 no, including: the first! The housing 22 occupies the LED substrate 21 of the plurality of LEDs 2U, the control unit 23 for removing the voltage of the second housing 24, and the connecting member 25 between the second body 22 and the second housing 24. The frames 22 and 24 are formed to be connected to each other. In the first frame 22, the first frame body 22 is a member having a substantially partial spherical shape on the rigid end side, and the approximated portion of the curry i frame 22 is provided in close contact with each other on the rear end wall 221 of the second frame 22 The portion of the sphere is formed by a diffusing member of the light of the light. Further, the structure of the 201132907 of the i-frame 22 is not limited to FIG. 1, and may have various shapes and configurations. For example, the i-frame 22 can also house an LED and a collecting lens provided corresponding to the LED, and directly emit the emitted light from the collecting lens to the outside. The rim portion 24 of the socket portion 24 is provided with a ferrule portion 24i to which the socket portion can be connected, and a control portion 23 for supplying the supply power for controlling the ferrule portion 241 to the LED 2U is housed inside. Moreover, the wiring between the ferrule portion 241 and the control portion 23 in FIG. 1 is omitted. As shown in FIG. 1, the connecting member 25 is a member that connects the second frame body 22 and the second body 24 to face each other, that is, the connection portion (the rear end surface 2a and the second frame body of the frame body 22) The front end surface 24a of the 24 is further connected to the first frame 22 and the second frame 24. The number of the connecting members 25 of the present state is four, as shown in Fig. 2, and is arranged in a state of approximately 平行. In a manner, the planar front end surface 24a of the planar rear frame 1 24 of the first frame body 22 is connected. By setting the product 1 (4) of the first one, it is possible to prevent the temperature from being expanded. The member 5 has a space χ open to the outside between the rear end surface 22a of the first frame 22 and the second surface 24a of the first body 22. Further, at least the structure is provided The connection control unit 23 is in contact with the second light source device of the power supply line of the LED 2U, and the first housing 22 is made of stone. The second rear end surface 2 (four) of the first body 22 is specifically the heat dissipation. % and 27. The structure is on the front end surface 24a of the 2 frame body 24; the heat is recorded. The heat sink (hereinafter referred to as the damage standing up and the approximate straight line =:== the length of the heat sink 26 is large The same is true. The first heat dissipation structure 27 is the same as the second heat dissipation plate 27 (hereinafter referred to as the second heat sink 27). The front end surface 24a is provided in the shape of the rod shape of the H-th sheet 27. The correction is made, and the plume 2 _ 27^ = slightly = 6 201132907 The heat sink 26 and the second heat sink 27 are provided with a space p therebetween. When the temperature balance of the heat sink 26 and the LED 211 and the control unit 23 of the above configuration is determined, the heat sheet 27 can be made longer than the control unit 23, and the heat sheet 27 of the second LED 2U is made longer. The control unit 23 is set to be smaller than the second and second heat sinks 27 by 2 to 6 S2 than the first i-chip, and the operating temperature range of the manufacturing unit 23 is set to be higher than that of the first and second pieces. The length of the same fin temple and the second heat sink 27 are set to be the same. The sheet 26 and the first fins 26 and the second diffuser have higher thermal conductivity. Specifically, the u ratio is a connecting member. The _ field or _ has a high heat transfer f, a sheet 26, a heat insulating member such as a ceramic or a resin, etc. The root is low = material, I2: the second frame 24 is made of a joint member Conduction ί not = use: heat recovery with the heat sink 26, 27, so that the first frame 22 is a flute? ^ "Touch ~ - the cooked Fu violation small, the first scattered J 26 = 22 = = Thermal separation. The outside of the joint member 25. In the space X between the bodies, the dam can be connected to the yoke yoke 27, and a part of it is located at ^ 2 ^Z\t^24 ί πΐ!#^ LED 100 A door for generating a forced air flow is provided. The skin connecting member 25 is fixed to the first frame body 22 and the second frame body 24, and the two sides of the second frame body 22 and the second frame body 24 are moved toward the front side of the frame 32102. The end surface 22a) is fixed such that the air suction port or the air discharge port 28b faces the second frame side (front end surface 24a). For example, when LEm = temperature is 120C and the operating temperature of the control unit 23 is 耽, the second frame side (front end surface 24 &amp;) of the low temperature side is turned toward the high temperature: the first frame The body side (the rear end face is arranged in a manner as shown in the figure.) The LED light source device (10) according to the present embodiment is described as being disposed on the back surface of the first μ21 of the LED substrate. The second heat dissipation structure (the θ ι , , , , , , , , , , , , , , , , , , , , , , , 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 It is cooled by the outside atmosphere. Moreover, the thermal conductivity of this is greater than the thermal conductivity of the connecting member 25, and the heat of the rear end wall 221 of the conductor is almost all conduction = the first frame 22, the fan 28f, the wind is transmitted to the first The scatter &amp;=&amp;= goes to 26. At this time, the wind member tree (4) is fixed to the front end wall of the second frame body 24, f412=i4=lan 24, and then the first end of the front end face 24a is placed in the second frame. The thermal conductivity of the body 24, (4), and the heat transfer rate of the heat radiating sheet are more than the heat transmitted to the front end wall 241 of the second to second frames 24 from the connecting member 25 portion. ^ fZZZV: * ° ib ^28 2 <Effects of the present embodiment> In the state in which the light source device 100 of (2) is thermally separated by the junction, the heat generated by the money H is not easily conducted. To the LEDs 211. The heat dissipation structures 26 and 27 that are independent of each other are provided on the surfaces 22a and 201132907 24a where the body 22 and the second frame 24 face each other. Therefore, when the operating temperature of the LED 211 and the operating temperature of the control unit 23 are different, The heat dissipation structures 26 and 27 can be designed to match the operating temperatures, and the LEDs 2U and the control unit can be efficiently cooled. Other variations and embodiments are not limited to the above-described embodiments. For example, '1st. The second heat sink may be placed in a thin rod shape as shown in Fig. 3 and Fig. 4. In this case, the fan 28 can be made good and the cooling efficiency can be improved. As shown in Fig. 3, the first and second heat sinks 26 and 27 can be arranged in a flat shape such as a fan-shaped member centered on the fan 28. As shown in Fig. 4, the first and second heat sinks can be used. The piece % ' is set to a can, the plate-like dispersion - ϋ ϋ the above embodiment In the fourth, the device is provided with a fan, but only the first and second fins 26 and 27 may be provided as a fan. The arrangement of the fan is not limited to the above-described, for example, the air intake port and the air discharge port are disposed to face the edge. The direction of the front surface and the front end surface of the second frame body. In addition to the _, the second embodiment of the second frame body 2 opposite surface (the rear end face and the front end face (four), at least One side (in Figure 6 is 'the town is not as shown in Figure 6. In the above-described embodiment, the first imaginary plane formed approximately is spaced apart from the imaginary planes of the front ends of all the first diocese hot films. The second piece and the second heat sink formed by the same type are placed so as to be interspersed with each other. The first heat dissipation is not included in the above embodiment, and the cover is not limited thereto. It can also be used as a component for escaping and escaping. In addition, when the LED and the control unit need to dissipate heat, the _ _ _ s can be set: 201132907 In addition to the bulb type, In addition, the present invention is limited to the two-color (four) spot-type member. In addition, the present invention is limited to the above-mentioned actual sample, and there are various changes within the scope of the spirit of the invention. It is self-evident. [Industrial Applicability] According to the present invention, Led Shaw controls the control part of the LED to be thermally separated so that / does not cause thermal influence on each other' * The LED and the control unit can be efficiently used. [Simplified Schematic] FIG. 1 shows the present invention in a 7F manner. Figure 2 of the LED light source is placed along the A-A line section Fig. 3 is a cross-sectional view showing a modified embodiment of a heat sink, wherein the internal structure is a cross-sectional view of a modified embodiment of the heat sink of Fig. 4, wherein the internal structure is schematically represented by Fig. 5 The side view 6 of the aspect light source device is a side view of the LED light source device in a schematic manner, and the side view of the LED light source device of the modified embodiment is schematically shown. [Main component symbol description] 21 to LED substrate 22 to first housing 22a to rear end surface 23 to control portion 24 to second housing 24a to front end surface 25 to connecting member 201132907 26 to first heat dissipation structure 27 to second heat dissipation structure 28 to fan 28a The air suction port 28b to the air discharge port 211 to the LED 221 to the rear end wall 222 to the portion 241 having a substantially partial spherical shape to the ferrule portion AA to the section line X to the space 11

Claims (1)

201132907 七、申請專利範圍： 卜一種發光二極體(LED)光源裝置，包含： 第1框體，其收納搭載著LED的LED基板； 第2框體，其收納控制該LED的控制部； 連結構件’其以實質上熱分離的狀態連結該第丨框 框體； &lt;、孩弟2 第1散熱構造，其設置在該第1框體與該第2框體的 向面之其中-面上；以及 第2散熱構造，其設置在該第1框體與該第2框體的 向面之另一面上，與該第1散熱構造隔著間隔設置。 目對 2、 如申請專利範圍笫1項之發光二極體(led)光源裝置，其 該第1散熱構造與該第2散熱構造係由複數散熱片所構成。 3、 如申請專利範園第1項之發光二極體(LED)光源裝置，其°， 在該第1框體與該第2框體之間設置風扇。 '、’ 4、 如申請專利範園第3項之發光二極體(led)光源裝置，其中， 該風扇由該連結構件固定在該第1框體與該第2框體^間。 5、 如申請專利範園第3項之發光二極體(LED)光源裝置，其中， 該風扇以其空氟吸入口或空氣排出口的其中一方朝向該第工 框體侧’而空氣吸八口或空氣排出口的另一方朝向該第2° ^ 的方式固定。 6、 如申請專利範圍第1項之發光二極體(LED)光源裝置，豆中， 該LED光源装置為電燈泡型裝置。 八、圖式： 12201132907 VII. Patent application scope: A light-emitting diode (LED) light source device comprising: a first frame body accommodating an LED substrate on which an LED is mounted; and a second frame body accommodating a control unit for controlling the LED; The member 'connects the second frame body in a state of being substantially thermally separated; &lt;, child 2, the first heat dissipation structure provided on the surface of the first frame and the second frame And a second heat dissipation structure provided on the other surface of the first frame body and the facing surface of the second frame body, and provided at intervals from the first heat dissipation structure. The light-emitting diode (LED) light source device of claim 1, wherein the first heat dissipation structure and the second heat dissipation structure are composed of a plurality of heat dissipation fins. 3. A light-emitting diode (LED) light source device according to claim 1, wherein a fan is disposed between the first frame and the second frame. A light-emitting diode (LED) light source device according to the third aspect of the invention, wherein the fan is fixed between the first frame and the second frame by the connecting member. 5. The light-emitting diode (LED) light source device of claim 3, wherein the fan is air-sucking with one of an empty fluorine suction port or an air discharge port facing the first frame side The other side of the mouth or air discharge port is fixed toward the 2° ^. 6. A light-emitting diode (LED) light source device according to claim 1 of the patent scope, wherein the LED light source device is a light bulb type device. Eight, schema: 12
TW099133548A 2009-12-24 2010-10-01 LED light source device TW201132907A (en)

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BR112013017693B1 (en) * 2011-01-14 2020-05-12 Philips Lighting Holding B.V. LIGHTING DEVICE
TWI408313B (en) * 2011-05-23 2013-09-11 Sunonwealth Electr Mach Ind Co Led lamp
CN102980054B (en) * 2011-09-07 2014-10-22 王丽娜 Light-emitting diode (LED) lamp bulb
US9816698B2 (en) 2012-05-29 2017-11-14 Philips Lighting Holding B.V. Lighting device having a light source heat sink arranged separate from a driver
JP2013254576A (en) * 2012-06-05 2013-12-19 Sharp Corp Lighting device
JP2014013663A (en) * 2012-07-03 2014-01-23 Honda Motor Co Ltd Led lighting apparatus of vehicle
DE102014000582A1 (en) * 2013-09-17 2015-03-19 Dietmar Friedrich Brück Light emitting device
CN103822114B (en) * 2013-09-30 2016-05-18 亚浦耳照明股份有限公司 A kind of LED bulb lamp and preparation method thereof
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