TW201131823A - Light-emitting device, luminaire using the same, and image display device - Google Patents

Light-emitting device, luminaire using the same, and image display device Download PDF

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TW201131823A
TW201131823A TW099143012A TW99143012A TW201131823A TW 201131823 A TW201131823 A TW 201131823A TW 099143012 A TW099143012 A TW 099143012A TW 99143012 A TW99143012 A TW 99143012A TW 201131823 A TW201131823 A TW 201131823A
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light
emitting device
phosphor
crystal orientation
emitting
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TW099143012A
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TWI438939B (en
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Hisayuki Hashimoto
Michiharu Nakashima
Suzuya Yamada
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Denki Kagaku Kogyo Kk
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    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48475Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48478Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
    • H01L2224/4848Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
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    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)

Abstract

The present invention provides a high luminance light-emitting device, a lighting device using the light-emitting device and an image display device. A light-emitting device 1 comprises a light-emitting source 2 and a wavelength transferring member 5, the wavelength transferring member 5 contains cylindrical fluorescent particles 8 which absorbs near-ultraviolet to blue light emitted from light-emitting source 2 and emits at least one kind of fluorescence, a bias of at least one crystalline orientation distribution of the cylindrical fluorescent particles is 5% to 15% which is the orientation index analyzed by following formula (1) through using a cross-section of the light-emitting device by electron backscatter diffraction pattern method. Orientation Index= ((a cross-section area of the particle having a crystal orientation of a crystal surface corresponding to the bottom surface of the cylindrical fluorescent particles ± 30 DEG )/(a cross-section of the cylindrical fluorescent particles ))x100(%) (1)

Description

201131823 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種發光裝置及使用其之照明裝置以及 影像顯示裝置。更詳言之,本發明係關於一種用於發光裝 置之波長轉換構件中之螢光體結晶方位分布之偏移被控制 的發光裝置。 【先前技術】 最近,於照明領域中,已逐漸採用將白色發光二極體 作爲光源的照明。如此之照明也被稱爲LED照明或LED燈 泡。白色發光二極體係由例如藍色發光二極體晶片與螢光 體所構成。具體而言,將螢光體分散於樹脂等中之複合構 件被覆於藍色發光二極體晶片上。螢光體之一例係於從藍 色發光二極體照射藍色光時,發生黃色螢光之材料。因此, 複合構件也被稱爲將藍色光轉換成黃色之波長轉換構件。 藉由從藍色發光二極體所發生的藍色光與經由此藍色發光 所激發而發出黃色光將進行混色而可以獲得白色光。 第6圖係顯示習知之發光二極體構造的截面圖。如第 6圖所示,習知之發光二極體60係由發光二極體晶片66、 裝載此發光二極體晶片66之第一引線框架62、第二引線 框架68、以及被覆發光二極體晶片66、第一引線框架62 與第二引線框架68之透光性樹脂材78所構成。在第一引 線框架62之上部62a形成有發光二極體晶片裝載用之凹 部。此凹部係具有孔徑從凹部之底面朝向上方慢慢地擴大 201131823 極 之 係 參 64 光 72 光 舉 铈 架 發 藉 由 見 脂 酸 過 脂 1 ) 的約略漏斗形狀,同時凹部內面成爲反射面64。發光二 體晶片66之下面側一邊電極將晶粒結著於此反射面64 底面。在發光二極體晶片66之上面所形成的另外之電極 透過結著線7 0而連接於第二引線框架6 8之表面6 8 a ( 閱專利文獻1 )。 該發光二極體晶片66之上面及側面係利用反射面 內所塡充的波長轉換構件所被覆。波長轉換構件係由透 性環氧樹脂等之樹脂72與螢光體74所構成,於樹脂 中’將發光二極體晶片66之發光轉換成黃色可見光之螢 體7 4係以分散狀態予以大量混入。如此之螢光體7 4可 例:母材爲由鋁酸釔(Y3A15012 )所構成,發光中心爲 (Ce)之YAG螢光體等。若將電壓施加於第一引線框 62與第二引線框架68之間的話,發光二極體晶片66將 光。如上所述,放射發光二極體晶片66之藍色發光、與 由此藍色發光而從YAG螢光體74放射黃色可見光。藉 此等之藍色可見光與從YAG蛋光體74所放射的黃色可 光將混色而可以獲得白色光。此白色光係藉由透光性樹 材78之凸透鏡部76予以聚光而放射至外部。 習知白色發光二極體用之螢光體74係將矽酸鹽、碟 鹽、鋁酸鹽、硫化物利用於母體材料,活化材係添加有 渡金屬或稀土類金屬者。活化材也被稱爲發光中心。 72係除了在第4圖所說明的環氧樹脂(參閱專利文獻 之外,也使用丙烯酸樹脂、矽樹脂等。 201131823 近年來,由於白色發光二極體之高亮度化,使大電流 流入發光二極體晶片的方式來進行。因此,發光二極體晶 片之溫度將上升。藉此,在發光二極體晶片上所配置的螢 光體之溫度也將上升。於習知之螢光體中,溫度上升同時 螢光之亮度也將降低。因此,作成隨著溫度上升之亮度降 低小且具有優異的耐久性之螢光體,逐漸使用結晶構造爲 安定之氮化物或氧氮化物的螢光體。代表性之螢光體可舉 例:爲氮化矽(Si3N4)之固溶體的賽隆(Sialon)。賽隆 係利用A1與氧置換氮化砂一部分之原子的Si-Al-Ο-Ν系之 化合物。 由於賽隆中存在α型、A型之二種結晶系,使特定之稀 土類元素活化的α型賽隆(參閱專利文獻2至4)係具有有 用的螢光特性,對白色發光二極體等之適用進行探討。 於專利文獻2及3中,已介紹稀土類元素經Eu (銪) 或Er (餌)活化之Ca-α型賽隆。 於專利文獻4中,已介紹使用稀土類元素經Eu活化的 Ca-a型賽隆等之螢光體與發光二極體之照明裝置。 於專利文獻5中,已介紹使用稀土類元素經Eu活化的 P型賽隆螢光體。因爲此β型賽隆螢光體之發光光譜係綠 色光且非常的清晰,所以是光三原色之中,適合於綠色發 光成分的螢光體。因此,專利文獻5之β型賽隆螢光體係 一種適合於藍、綠、紅的光三原色之純度高且半幅値狹窄 的狹帶域發光所要求的液晶顯示器面板之背光板用所使用 201131823 的白色發光二極體之螢光體。 專利文獻 專利文獻1 :日本專利特開2004- 1 52 993號公報 專利文獻2 :日本專利特許第3 66 8 770號公報 專利文獻3 :曰本專利特許第3 72 6 1 3 1號公報 專利文獻4 :日本專利特開2003 - 1 24 527號公報 專利文獻5 :日本專利特開2 0 0 5 - 2 5 5 8 9 5號公報 專利文獻6 :日本專利特許第3 8 3 7 5 8 8號公報 非專利文獻 非專利文獻 1 : Electron Backscatter Diffraction in201131823 VI. Description of the Invention: [Technical Field] The present invention relates to a light-emitting device, an illumination device using the same, and an image display device. More specifically, the present invention relates to a light-emitting device in which the shift of the crystal orientation distribution of the phosphor in the wavelength converting member for the light-emitting device is controlled. [Prior Art] Recently, in the field of illumination, illumination using a white light-emitting diode as a light source has been gradually adopted. Such lighting is also known as LED lighting or LED lighting. The white light-emitting diode system is composed of, for example, a blue light-emitting diode wafer and a phosphor. Specifically, a composite member in which a phosphor is dispersed in a resin or the like is coated on a blue light-emitting diode wafer. One example of the phosphor is a material in which yellow fluorescence occurs when blue light is irradiated from the blue light-emitting diode. Therefore, the composite member is also referred to as a wavelength conversion member that converts blue light into yellow. White light can be obtained by mixing blue light generated from the blue light-emitting diode and emitting yellow light by excitation through the blue light. Figure 6 is a cross-sectional view showing a conventional light-emitting diode structure. As shown in FIG. 6, the conventional light-emitting diode 60 is composed of a light-emitting diode chip 66, a first lead frame 62 on which the light-emitting diode chip 66 is mounted, a second lead frame 68, and a coated light-emitting diode. The wafer 66, the first lead frame 62, and the light transmissive resin material 78 of the second lead frame 68 are formed. A concave portion for mounting the light-emitting diode wafer is formed on the upper portion 62a of the first lead frame 62. The concave portion has a diameter that gradually expands from the bottom surface of the concave portion toward the top of the 201131823 polar ginseng 64 light 72 light truss is caused by the approximate funnel shape of the fat peracid 1), and the inner surface of the concave portion becomes the reflecting surface 64 . The lower side electrode of the light-emitting diode wafer 66 is bonded to the bottom surface of the reflecting surface 64. The other electrode formed on the upper surface of the light-emitting diode wafer 66 is connected to the surface 6 8 a of the second lead frame 68 through the bonding wire 70 (see Patent Document 1). The upper surface and the side surface of the light-emitting diode wafer 66 are covered by a wavelength converting member that is filled in the reflecting surface. The wavelength conversion member is composed of a resin 72 such as a transparent epoxy resin and a phosphor 74, and the phosphor in which the light emission of the light-emitting diode chip 66 is converted into yellow visible light is dispersed in a large amount in a dispersed state. Mix in. Such a phosphor 7 4 can be exemplified by a base material composed of yttrium aluminate (Y3A15012) and a YAG phosphor having an illuminating center of (Ce). If a voltage is applied between the first lead frame 62 and the second lead frame 68, the light emitting diode chip 66 will be light. As described above, the blue light emission of the radiation LED wafer 66 and the blue light emission cause the yellow visible light to be emitted from the YAG phosphor 74. White light can be obtained by mixing the blue visible light with the yellow visible light emitted from the YAG egg light 74. This white light is condensed by the convex lens portion 76 of the light-transmitting tree 78 and radiated to the outside. The fluorescent body 74 for a conventional white light-emitting diode uses a phthalate, a dish salt, an aluminate or a sulfide for a parent material, and a source of a transition metal or a rare earth metal. The active material is also referred to as the luminescent center. In addition to the epoxy resin described in Fig. 4 (see also the patent document, acrylic resin, enamel resin, etc. are also used. 201131823 In recent years, due to the high brightness of the white light-emitting diode, a large current flows into the light-emitting diode 2 The polar body wafer is formed. Therefore, the temperature of the light-emitting diode wafer is increased. Thereby, the temperature of the phosphor disposed on the light-emitting diode wafer is also increased. In the conventional phosphor, When the temperature rises and the brightness of the fluorescent light is also lowered, a phosphor having a crystal structure of a stable nitride or oxynitride is gradually used as a phosphor having a small decrease in luminance with an increase in temperature and excellent durability. A representative phosphor can be exemplified by Sialon which is a solid solution of tantalum nitride (Si3N4). The Saron is a Si-Al-Ο-Ν which replaces a part of the atomized sand by A1 and oxygen. A compound of the type α and type A, in which a specific rare earth element is activated (see Patent Documents 2 to 4) has useful fluorescent characteristics, white Light-emitting diode, etc. In the patent documents 2 and 3, the Ca-α-type sialon in which the rare earth element is activated by Eu (铕) or Er (bait) has been described. In Patent Document 4, the use of rare earth elements via Eu has been described. An illuminating device for a phosphor and a light-emitting diode of activated Ca-a type Sialon. In Patent Document 5, a P-type Sialon phosphor activated by Eu using a rare earth element has been described. The luminescence spectrum of the sialon phosphor is green light and is very clear, so it is a phosphor suitable for the green luminescent component among the three primary colors. Therefore, the β-Sialon fluorescent system of Patent Document 5 is suitable for blue. The phosphor of the white light-emitting diode of 201131823 used for the backlight panel of the liquid crystal display panel which is required for the light source of the green and red light, and the narrow-band stencil of the half-width of the light. Patent Document 1: Japanese Patent Patent Document No. 2004- 1 52 993 Patent Document 2: Japanese Patent No. 3 66 8 770 Patent Document 3: Japanese Patent Application No. 3 72 6 1 3 1 Patent Document 4: Japanese Patent Special Publication 2003 - 1 24 527 Gazette Patent Japanese Patent Laid-Open No. Hei 2 0 0 5 - 2 5 5 8 9 5 Patent Document 6: Japanese Patent No. 3 8 3 7 5 8 8 Non-Patent Literature Non-Patent Document 1 : Electron Backscatter Diffraction in

Materials Science, Edited by A. J. Schwartz, M. Kumar and B. L. Adams, Kluwer Academic/ Plenum Publishers, New York, 2000 【發明內容】 〔發明所欲解決之技術問題〕 於藉由從發光二極體晶片所發光的從近紫外至藍色之 光、與利用此光所激發的螢光體予以波長轉換的例如與黃 色之光的混色而放射白色光之發光二極體中,爲了減低所 放射的光之強度、色調之偏異,使螢光體分散或是沉降於 波長轉換構件之樹脂中而使用。 再者,爲了波長轉換而使用二種以上螢光體之情形 下,使此等二種以上之螢光體均勻混合於波長轉換構件之 樹脂中,或是謀求進行不均化等之控制。 然而,螢光體之粒子形狀爲具有柱狀、或近似柱狀的 201131823 形狀之情形,由於螢光粒子係於密封樹脂中顯示柱狀粒子 如偏單向倒下之分散,考量結晶方位之情形下,無從判斷 無偏向,針對提供更高亮度之發光裝置,控制螢光體粒子 之結晶方位分布係不足。 本發明係有鑑於該課題,其目的在於提供一種發光裝 置及使用此發光裝置之照明裝置以及影像顯示裝置,爲了 實現將從近紫外至藍色之光作爲光源之高亮度化,藉由控 制波長轉換構件中之螢光體的結晶方位分布,使其更高亮 度化。 〔解決問題之技術手段〕 本發明人等係於含有波長轉換構件中具有柱狀形狀之 螢光體的發光裝置中,針對具有柱狀形狀之螢光體結晶方 位分布偏移,利用電子反散射繞射圖案法(參閱非專利文 獻η而進行探討。藉由使其具有柱狀形狀之螢光體的結 晶方位分布於既定範圍內之偏向,獲得來自發光裝置之發 光強度將提高之見解而完成本發明。 爲了達成該目的,本發明之發光裝置,其特徵係含有 發光光源與波長轉換構件;波長轉換構件係含有吸收來自 經由該發光光源所發生的從近紫外至藍色光而發生螢光的 一種以上之柱狀螢光體粒子;至少一種柱狀螢光體粒子結 晶方位分布之偏移係將利用電子反散射繞射圖案法而解析 發光裝置之截面的下列(1)式所代表的配向指數設爲5% 以上且1 5 %以下。 配向指數(%) = ((相當於具有柱狀形狀之螢光體粒 201131823 子底面的結晶面±30°之結晶方位的粒子之截面積)/ (具有 柱狀形狀之螢光體粒子之截面積))X 1 0 0 ( % ) ( 1 )。 於該構造中,該發光光源較佳爲發出從近紫外至藍色 之光’即發生300 nm至500 nm波長之光的發光二極體。 螢光體較佳含有β型賽隆(Sialon) 、α型賽隆、經Eu活 化的CaAlSiN3中任一種。 本發明之發光裝置能夠適用於照明裝置或影像顯示裝 置。 發明之效果 與不控制螢光體之結晶方位分布之發光裝置作一比 較’本發明之發光裝置係將藍色或紫外光作爲光源的白色 發光裝置可以獲得更高亮度之發光。 本發明之發光裝置能夠適合使用於作爲照明裝置或影 像顯示裝置之高亮度光源。 【實施方式】 實施發明之形態 以下’一邊參照圖中顯示本發明之實施形態,一邊詳 細說明。 第1圖係顯示本發明發光裝置之構造的截面圖。如第 1圖所示,本發明之發光裝置1係包含發光光源2、裝載發 光光源2之第一引線框架3、第二引線框架4、與被覆發光 光源2與第一引線框架3之波長轉換構件5所構成。 在第一引線框架3之上部3a形成有作爲發光光源2之 201131823 發光二極體晶片裝載用之凹部3b。此凹部3b係具有孔徑 從凹部之底面朝向上方慢慢地擴大的約略漏斗形狀,同時 凹部3b內面成爲反射面。發光二極體晶片2之下面側一邊 之電極係晶粒結著於此反射面之底面。在發光二極體晶片 2之上面所形成的另外的電極係透過結著線6而連接於第 二引線框架4之表面。 再者,發光裝置1係如第1圖所示,發光光源2與第 —及第二引線框架3、4與波長轉換構件5與接著線6之整 體係被由樹脂或玻璃所構成的間隙9予以被覆所構成。 發光光源2能夠使用發生從近紫外至藍色光3之300 nm至500 nm波長之光的發光二極體晶片。 波長轉換構件5係例如由如矽樹脂之樹脂材7與至少 一種以上之螢光體8所構成,螢光體8係分散於樹脂材中。 螢光體8之種類最好藉由根據發光光源2之光、與從吸收 此發光光源2之光所激發的螢光體8而發生的光之混色所 獲得之色調而選定,爲了獲得所期望的混色光,能夠組合 一組或複數組之螢光體8的種類而使用。 螢光體8係具有粒狀之形狀。如此之螢光體粒子8可 舉例·· β型賽隆' α型賽隆、經EU活化的CaAlSiN3等。此 等之螢光體8係具有六角形等之柱狀的結晶形狀。 以通式:Si6- ZA1Z0ZN8-Z : Eu2+所代表的β型賽隆8係 具有柱狀之形狀,發光特性係呈現以520 nm至550 nm作 爲波峰波長之綠色發光。Materials Science, Edited by AJ Schwartz, M. Kumar and BL Adams, Kluwer Academic/Plenum Publishers, New York, 2000 [Summary of the Invention] [Technical Problem to be Solved by the Invention] By illuminating from a light-emitting diode wafer In order to reduce the intensity of the emitted light, from the near-ultraviolet to the blue light, and the light-emitting diode that emits white light by color mixing with a phosphor that is excited by the light, for example, mixed with yellow light, The color tone is different, and the phosphor is dispersed or used to settle in the resin of the wavelength converting member. In the case where two or more types of phosphors are used for wavelength conversion, the two or more kinds of phosphors are uniformly mixed in the resin of the wavelength converting member, or control such as unevenness is performed. However, in the case where the particle shape of the phosphor is a column shape or a columnar shape of 201131823, since the phosphor particles are displayed in the sealing resin, the columnar particles are dispersed in a one-way direction, and the crystal orientation is considered. Under the circumstance, it is impossible to judge that there is no bias, and for the light-emitting device that provides higher brightness, the crystal orientation distribution of the control phosphor particles is insufficient. The present invention has been made in view of the above problems, and an object thereof is to provide a light-emitting device, an illumination device using the same, and an image display device, in order to achieve high luminance from a near-ultraviolet to blue light source, by controlling wavelength The crystal orientation distribution of the phosphor in the conversion member is made higher in brightness. [Means for Solving the Problem] The inventors of the present invention are in a light-emitting device including a phosphor having a columnar shape in a wavelength conversion member, and use electron backscattering for a crystal body orientation distribution shift having a columnar shape. The diffraction pattern method (see Non-Patent Document η). The viewpoint that the crystal orientation of the phosphor having a columnar shape is distributed within a predetermined range is obtained, and the luminous intensity from the light-emitting device is improved. In order to achieve the object, a light-emitting device of the present invention is characterized in that it comprises an illuminating light source and a wavelength converting member; and the wavelength converting member contains absorbing fluorescence from near ultraviolet to blue light generated by the illuminating light source. More than one type of columnar phosphor particles; at least one columnar phosphor particle crystal orientation distribution is shifted by using an electron backscatter diffraction pattern method to analyze the alignment represented by the following formula (1) of the cross section of the light-emitting device The index is set to 5% or more and 15% or less. The alignment index (%) = ((equivalent to a phosphor with a columnar shape 201131823) The cross-sectional area of the crystal grain of the bottom surface of the crystal surface of ±30°) / (the cross-sectional area of the phosphor particles having a columnar shape)) X 1 0 0 ( % ) ( 1 ). In this configuration, the luminescence The light source is preferably a light-emitting diode that emits light from near-ultraviolet to blue light, that is, light having a wavelength of 300 nm to 500 nm. The phosphor preferably contains a beta-type Sialon, an alpha-type Sialon, and a Any of Eu-activated CaAlSiN3. The light-emitting device of the present invention can be applied to an illumination device or an image display device. The effect of the invention is compared with a light-emitting device that does not control the crystal orientation distribution of the phosphor. A white light-emitting device using blue or ultraviolet light as a light source can obtain higher-luminance light. The light-emitting device of the present invention can be suitably used as a high-intensity light source as an illumination device or a video display device. [Embodiment] The embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a cross-sectional view showing the structure of a light-emitting device of the present invention. As shown in Fig. 1, the light-emitting device of the present invention is shown in Fig. 1. The first lead frame 3 includes a light source 2, a first lead frame 3 on which the light source 2 is mounted, a second lead frame 4, and a wavelength conversion member 5 that covers the light source 2 and the first lead frame 3. The upper portion 3a is formed with a recessed portion 3b for mounting the 201131823 light-emitting diode wafer as the light-emitting source 2. The recessed portion 3b has an approximate funnel shape in which the aperture gradually expands upward from the bottom surface of the recessed portion, and the inner surface of the recessed portion 3b becomes a reflection. The surface of the lower side of the light-emitting diode wafer 2 is bonded to the bottom surface of the reflecting surface. The other electrode formed on the upper surface of the light-emitting diode wafer 2 is connected to the connecting line 6 through the bonding line 6. The surface of the second lead frame 4. Further, as shown in Fig. 1, the light-emitting device 1 and the first and second lead frames 3, 4 and the wavelength conversion member 5 and the line 6 are integrally formed by A gap 9 made of resin or glass is covered. The illuminating light source 2 can use a light-emitting diode wafer in which light of a wavelength of from 300 nm to 500 nm from near ultraviolet to blue light 3 occurs. The wavelength converting member 5 is composed of, for example, a resin material 7 such as enamel resin and at least one or more kinds of phosphors 8, and the phosphor 8 is dispersed in a resin material. The type of the phosphor 8 is preferably selected by the color tone obtained by the color mixture of the light of the illuminating light source 2 and the light emitted from the illuminating light source 2, in order to obtain the desired color. The mixed color light can be used by combining the types of the phosphors 8 of one or a plurality of arrays. The phosphor 8 has a granular shape. Such phosphor particles 8 can be exemplified by β-Sialon 'α-sialon, EU-activated CaAlSiN 3 and the like. These phosphors 8 have a columnar crystal shape such as a hexagon. The β-Sialon 8 system represented by the general formula: Si6-ZA1Z0ZN8-Z: Eu2+ has a columnar shape, and the luminescent property exhibits green luminescence with a peak wavelength of 520 nm to 550 nm.

S -10- 201131823 以通式:Cam/2Sii2-(m+n)Al(m+n)Ni6.n〇n: Eu2 + 所 代表的α型賽隆8也具有柱狀形狀,發光特性係呈現以550 nm至610 nm作爲波峰波長之從黃色至橙色的發光。S -10- 201131823 The α-type Sialon 8 represented by the general formula: Cam/2Sii2-(m+n)Al(m+n)Ni6.n〇n: Eu2 + also has a columnar shape, and the luminescent properties are exhibited. From 550 nm to 610 nm, the yellow to orange luminescence of the peak wavelength.

CaAlSiN3 : Eu也具有柱狀之形狀,發光特性係呈現以 63 0 nm至6 50 nm作爲波峰波長之紅色發光。 本發明之發光裝置1之特徵係在藉由將波長轉換構件 5中之具有柱狀形狀的螢光體8之結晶方位分布之偏移控 制於既定範圍內而使從發光裝置1之發光強度提高的觀 點。波長轉換構件5中之具有柱狀形狀的螢光體8之結晶 方位分布之偏移係如後所詳述,能夠藉由電子反散射繞射 圖案法(參照非專利文獻1 )而評估發光裝置1之波長轉 換構件5之截面。 本發明人等係製作許多個的發光裝置1,藉由電子反 散射繞射圖案法而解析波長轉換構件5中之螢光體8粒子 之結晶方位分布之偏移的結果,下列(1 )式所代表的配向 指數係5 %以上且1 5 %以下之情形,發現從發光裝置1之 發光強度將提高。 配向指數(%) =((相當於具有柱狀形狀之螢光體 粒子底面的結晶面±30°之結晶方位的粒子之截面積)/(具 有柱狀形狀之螢光體粒子之截面積))χ1〇〇(%) ( 1 ) 顯示於該(1 )式之配向指數係具有利用電子反散射繞 射圖案法(Electron backscatter diffraction、也稱爲 EBSD。) 而解析從所獲得之柱狀形狀的螢光體粒子8之底面的結晶CaAlSiN3: Eu also has a columnar shape, and the luminescent property exhibits red luminescence with a peak wavelength of 63 0 nm to 65 50 nm. The light-emitting device 1 of the present invention is characterized in that the light-emitting intensity of the light-emitting device 1 is improved by controlling the shift of the crystal orientation distribution of the phosphor 8 having a columnar shape in the wavelength conversion member 5 within a predetermined range. the opinion of. The shift of the crystal orientation distribution of the phosphor 8 having the columnar shape in the wavelength conversion member 5 is as described later, and the light-emitting device can be evaluated by the electron backscatter diffraction pattern method (see Non-Patent Document 1). A section of the wavelength converting member 5 of 1. The inventors of the present invention produced a plurality of light-emitting devices 1 and analyzed the result of shifting the crystal orientation distribution of the phosphor 8 particles in the wavelength conversion member 5 by the electron backscatter diffraction pattern method, and the following formula (1) When the orientation index represented is 5% or more and 15% or less, it is found that the luminous intensity from the light-emitting device 1 is improved. Orientation index (%) = ((corresponding to the cross-sectional area of particles having a crystal orientation of ±30° on the crystal face of the bottom surface of the phosphor particles having a columnar shape)/(the cross-sectional area of the phosphor particles having a columnar shape) Χ1〇〇(%) (1) The alignment index shown in the equation (1) has an analytical column shape obtained by an electron backscatter diffraction method (also referred to as EBSD). Crystallization of the bottom surface of the phosphor particles 8

S -11 - 201131823 面、與對應於相對其法線方向傾斜_30。至30。之結晶面的螢 光體粒子8之截面積和除以全部螢光體粒子8之截面積和 後以百分率求得之値。亦即,配向指數係表示波長轉換構 件5中之具有柱狀形狀的螢光體粒子8之結晶方位分布之 偏移。 首先,針對利用電子反散射繞射圖案法(參照非專利 文獻1 )而評估在波長轉換構件5之螢光體8的結晶方位 分布之偏移而評估之方法加以說明。 第2圖係顯示解析由本發明之波長轉換構件5中之螢 光體8所構成的結晶性粒子的結晶方位分布偏移之順序。 如第2圖所示,於影像化步驟ST1中,使波長轉換構 件5中之結晶性粒子之截面影像化。 於判定步驟ST2中,判定經由步驟ST 1之影像化步驟 所作成的影像之各個結晶粒子的方位。 於步驟ST3中,分析且特定經由步驟ST2之判定步驟 所判定之各個方位的分布。 最後,於解析步驟ST4中,解析在步驟ST3之分析階 段所獲得之方位分布而解析結晶方位分布之偏移。 於影像化步驟ST1中,機械硏磨及離子硏磨而調製波 長轉換構件5之截面,接著影像化此截面。於此影像化中’ 能夠使用可觀察使其露出於該截面的結晶性粒子之裝置胃 進行。例如,藉由將波長轉換構件5之截面導入掃瞄型β 子顯微鏡之試料室內,觀察截面之二次電子像而能夠影像 -12- 201131823 化。 接著,於判定步驟ST2中,利用分析裝置而取得在波 長轉換構件5之截面而判定所觀察到的結晶性粒子之結晶 方位。如此之結晶方位的分析裝置,可舉例:利用電子反 散射繞射圖案法之裝置。此裝置之一例係將可能取得電子 反散射繞射圖案之檢測器附加於掃瞄型電子顯微鏡者。利 用掃瞄型電子顯微鏡而實施電子反散射繞射圖案法之情 形,空間解析能力係〇. 1 //m左右,觀察試料之方位決定的 解析能力爲1 °左右。 還有,於電子反散射繞射圖案法中,可以獲得對應於 結晶粒子之結晶構造與結晶方位之被稱爲菊池圖案的二次 元幾何學模樣。於電子反散射繞射圖案法中,觀察到對應 於結晶面之菊池圖案,能夠從其菊池圖案之形狀而決定觀 察粒子之結晶方向。 於分析步驟ST3中,能夠根據在判定步驟ST2所取得 的菊池圖案而利用能夠解析結晶方位之解析程式來分析。 亦即,取得結晶粒子之菊池圖案而使用解析程式來特定結 晶方位,能夠藉由利用複數個結晶粒子而重複進行此步驟 來獲得結晶方位分布。 於此,特定結晶方位之結晶性粒子數目越多的話,統 計上之解析精確度將越爲提高,若結晶性粒子數目爲50個 以上的話,對於解析可以獲得充分之資料》 接著,針對解析結晶方位分布偏移之解析步驟ST4加 -13- 201131823 以說明。解析步驟ST4也能夠利用電子反散射繞射圖案法 而實行。根據在分析步驟ST3所獲得之結晶方位分布而解 析結晶方位分布偏移之情形,能夠使用以該(1 )式所定義 的配向指數。 若根據發明人等之探討發現:爲了使發光裝置1之發 光光度提高,較佳爲使得在波長轉換構件5之截面所觀測 的β型賽隆螢光體粒子8之該配向指數成爲5%以上且15 %以下。配向指數較5 %爲小之情形下,β型賽隆螢光體粒 子8之結晶方位偏移將消除,來自發光裝置1之發光光度 將降低。相反地,配向指數較1 5 %爲大之情形下,β型賽 隆螢光體粒子8之結晶方位偏移將變得過大,此情形下, 也因爲發光裝置1之發光光度將降低而不佳。得知爲了使 發光裝置1之發光光度進一步提高,較佳爲使配向指數成 爲7 %以上且1 3 %以下。 另外,將分散於波長轉換構件5中之螢光體8作爲α 型賽隆及經Eu活化的CaAlSiN3(也標示CaAlSiN3:Eu。), 也與上述同樣地,進行螢光體8之結晶方位分布偏移之解 析。此情形下,也獲得與β型賽隆之情形同樣的結果。 若根據本發明人等之實驗,可得以下發現:即使配向 指數低於5%,或是變得較15%爲大,亦即,若在具有柱 狀形狀之螢光體8的結晶方位分布超過該範圍之偏移時, 發光裝置1之發光強度將降低。認爲此係由於若具有柱狀 形狀之螢光體粒子8具有一定方向性而存在於波長轉換構S -11 - 201131823 The face is inclined to _30 with respect to its normal direction. To 30. The cross-sectional area of the phosphor particles 8 on the crystal plane is divided by the cross-sectional area of all the phosphor particles 8 and then obtained as a percentage. That is, the alignment index indicates the shift of the crystal orientation distribution of the phosphor particles 8 having the columnar shape in the wavelength conversion member 5. First, a method of evaluating the deviation of the crystal orientation distribution of the phosphor 8 of the wavelength conversion member 5 by the electron backscatter diffraction pattern method (see Non-Patent Document 1) will be described. Fig. 2 is a view showing the order of analysis of the crystal orientation distribution shift of the crystal particles composed of the phosphors 8 in the wavelength conversion member 5 of the present invention. As shown in Fig. 2, in the imaging step ST1, the cross section of the crystalline particles in the wavelength conversion member 5 is visualized. In the determination step ST2, the orientation of each crystal particle of the image formed by the imaging step of step ST1 is determined. In step ST3, the distribution of the respective directions determined via the determination step of step ST2 is analyzed and specified. Finally, in the analyzing step ST4, the azimuth distribution obtained in the analysis stage of step ST3 is analyzed to analyze the shift of the crystal orientation distribution. In the image forming step ST1, mechanical honing and ion honing are performed to modulate the cross section of the wavelength converting member 5, and then the cross section is visualized. In this imaging, it can be carried out using a device stomach which can observe crystal particles which are exposed to the cross section. For example, by introducing the cross section of the wavelength conversion member 5 into the sample chamber of the scanning type β sub-microscope and observing the secondary electron image of the cross section, it is possible to image -12-201131823. Then, in the determination step ST2, the cross section of the wavelength conversion member 5 is obtained by the analyzing device, and the crystal orientation of the observed crystal particles is determined. As the analyzing device for such a crystal orientation, a device using an electron backscatter diffraction pattern method can be exemplified. One example of this device is to attach a detector that may take an electronic backscatter diffraction pattern to a scanning electron microscope. The electronic backscatter diffraction pattern method is implemented by a scanning electron microscope, and the spatial resolution capability is 〇. 1 / m or so, and the resolution of the sample is determined to be about 1 °. Further, in the electron backscatter diffraction pattern method, a quadratic geometrical pattern called a Kikuchi pattern corresponding to the crystal structure and crystal orientation of the crystal particles can be obtained. In the electron backscatter diffraction pattern method, a Kikuchi pattern corresponding to a crystal face is observed, and the crystal orientation of the particles can be determined from the shape of the Kikuchi pattern. In the analysis step ST3, it is possible to analyze by using an analysis program capable of analyzing the crystal orientation based on the Kikuchi pattern acquired in the determination step ST2. That is, the crystal pool pattern of the crystal particles is obtained, and the crystal orientation is specified by an analytical program, and the crystal orientation distribution can be obtained by repeating this step by using a plurality of crystal particles. Here, the larger the number of crystalline particles in a specific crystal orientation, the more statistically accurate the analytical accuracy is. If the number of crystalline particles is 50 or more, sufficient information can be obtained for analysis. The analysis step ST4 of the azimuth distribution offset is added to -13,318,318 to illustrate. The analysis step ST4 can also be carried out by the electronic backscatter diffraction pattern method. The alignment index defined by the formula (1) can be used in the case where the crystal orientation distribution shift is resolved based on the crystal orientation distribution obtained in the analysis step ST3. According to the investigation by the inventors, it has been found that in order to increase the luminosity of the light-emitting device 1, it is preferable that the alignment index of the β-Sialon phosphor particles 8 observed in the cross section of the wavelength conversion member 5 is 5% or more. And less than 15%. When the alignment index is smaller than 5%, the crystal orientation shift of the β-Sialon phosphor particles 8 is eliminated, and the luminosity from the light-emitting device 1 is lowered. On the contrary, in the case where the alignment index is larger than 15%, the crystal orientation shift of the β-Sialon phosphor particles 8 becomes too large, and in this case, also because the luminosity of the light-emitting device 1 is lowered. good. It is found that in order to further improve the luminosity of the light-emitting device 1, the alignment index is preferably 7% or more and 13% or less. Further, the phosphor 8 dispersed in the wavelength conversion member 5 is used as α-type Sialon and Eu-activated CaAlSiN 3 (also labeled as CaAlSiN 3 :Eu), and the crystal orientation distribution of the phosphor 8 is also performed in the same manner as described above. The resolution of the offset. In this case as well, the same result as in the case of the β-Sialon was obtained. According to experiments by the inventors of the present invention, it can be found that even if the alignment index is less than 5% or becomes larger than 15%, that is, if the crystal orientation distribution of the phosphor 8 having a columnar shape is obtained When the shift of the range is exceeded, the luminous intensity of the light-emitting device 1 will decrease. It is considered that this is because the phosphor particles 8 having a columnar shape have a certain directivity and exist in the wavelength conversion structure.

S -14- 201131823 件5中時,從發光光源所放射的藍色光或紫外光、及於此 等與波長轉換構件5中,進行干涉所形成的發光朝一定方 向所散射的機率將變高,因此,由於發光元件內所產生的 光之光路將發生偏移,起因於使來自發光元件之發光變得 無法向外部有效地取出。如此方式,配向指數低於5%, 或變得較15 %爲大之情形下,發光裝置1之發光強度將降 低。 如上所述,若根據本發明,藉由使波長轉換構件5中 之螢光體粒子8之結晶方位分布之偏移成爲既定之範圍 內,能夠提供更高亮度且無顏色不均之發光裝置1。 控制具有本發明之波長轉換構件5中所含之柱狀形狀 的螢光體8之結晶方位分布的發光裝置1能夠用於照明裝 置。 控制具有本發明之波長轉換構件5中所含之柱狀形狀 的螢光體8之結晶方位分布的發光裝置1能夠用於影像顯 示裝置,例如液晶電視用之背光板。亦即,本發明之發光 裝置1尤其能夠提供一種將白色發光裝置1作爲背光板用 之照明裝置的影像顯示裝置。與使用習知之螢光燈的背光 板作一比較,因爲由本發明之所構成的背光板能夠提高三 原色之光譜純度,現色性將提高。再者,因爲由本發明之 發光裝置1所構成的背光板係將發光二極體作爲光源而使 消耗電力變小。 實施例In the case of S -14-201131823, the probability of the blue light or the ultraviolet light emitted from the light-emitting source and the light emitted by the wavelength conversion member 5 being scattered in a certain direction is increased in a certain direction. Therefore, the light path of the light generated in the light-emitting element is shifted, which causes the light emission from the light-emitting element to be effectively taken out to the outside. In this manner, in the case where the alignment index is less than 5%, or becomes larger than 15%, the luminous intensity of the light-emitting device 1 is lowered. As described above, according to the present invention, by shifting the crystal orientation distribution of the phosphor particles 8 in the wavelength conversion member 5 into a predetermined range, it is possible to provide the light-emitting device 1 having higher brightness and no color unevenness. . The light-emitting device 1 for controlling the crystal orientation distribution of the phosphor 8 having the columnar shape included in the wavelength conversion member 5 of the present invention can be used for an illumination device. The light-emitting device 1 for controlling the crystal orientation distribution of the phosphor 8 having the columnar shape included in the wavelength conversion member 5 of the present invention can be used for an image display device such as a backlight for a liquid crystal television. That is, the light-emitting device 1 of the present invention can provide, in particular, an image display device using the white light-emitting device 1 as an illumination device for a backlight. In comparison with a backlight using a conventional fluorescent lamp, since the backlight of the present invention can improve the spectral purity of the three primary colors, the color rendering property will be improved. Further, since the backlight panel comprising the light-emitting device 1 of the present invention uses the light-emitting diode as a light source, the power consumption is reduced. Example

S -15- 201131823 接著,根據實施例而更詳細說明本發明。 進行如下的方式來製作白色之發光裝置1。亦即,準 備市售的 LED 構裝(I-CHIUN PRECISION INDUSTRY CO. LTD 製、型號 SMD5050 )與藍色 LED 晶片(Genesis PhotonicsS -15- 201131823 Next, the present invention will be described in more detail based on examples. The white light-emitting device 1 was produced in the following manner. That is, a commercially available LED package (I-CHIUN PRECISION INDUSTRY CO. LTD, model SMD5050) and a blue LED chip (Genesis Photonics) are available.

Inc.製、MODEL RIS45A19)、與波長轉換構件5,製作白 色發光裝置1(以下,也稱爲白色發光裝置。)。具體而 言,波長轉換構件 5係藉由將作爲紅色螢光體 8之A white light-emitting device 1 (hereinafter also referred to as a white light-emitting device) was produced from the wavelength conversion member 5 manufactured by Inc., and the RIS RIS 45A19). Specifically, the wavelength converting member 5 is to be used as the red phosphor 8

CaAlSiN3: Eu螢光體、與作爲綠色螢光體8之本公司製之 β型賽隆螢光體摻合於矽樹脂7(東麗道康寧股份有限公司 製、型號EG6301)中,被覆於藍色之發光二極體晶片2上。The CaAlSiN3: Eu phosphor and the β-Sialon phosphor produced by the company as the green phosphor 8 are blended in a resin 7 (manufactured by Toray Dow Corning Co., Ltd., model EG6301), and are coated in blue. On the light-emitting diode chip 2.

CaAlSiN3 : Eu螢光體8係利用專利文獻6所介紹之製造方 法而合成。如下述表1所示,在實施例1至4中,使波長 轉換構件5中之螢光體8之結晶方位分布之偏移成爲既定 « 之範圍內(亦即,成爲5 %以上且1 5 %以下)的方式來使已 去除顯著的針狀及柱狀粒子之β型賽隆螢光體8分散於波 長轉換構件5中而製得白色發光裝置1。 (比較例) 接著,在比較例1至4中,如表1中所示,在各自的 波長轉換構件5中之螢光體8之結晶方位分布,使既定範 圍外之偏移(亦即成爲較5%爲小,或是較15%爲大)的方 式,與實施例相反地來使以明顯針狀及柱狀粒子作爲主成 分之β型賽隆螢光體8分散。除此之外,進行與實施例同 樣的方式而製作白色發光裝置1。 201131823 探討白色發光裝置1之發光光度與本發明之波長轉換 構件5中之螢光體粒子8之結晶方位分布的關係。針對結 晶方位分布之測定,如在該影像化步驟ST 1所說明的方 式,必須觀察波長轉換構件5之截面。但是,藉由製作波 長轉換構件5之截面而使白色發光裝置1受到破壞。因此, 最初測定在實施例及比較例所製作的白色發光裝置1之發 光光度。接著,測定波長轉換構件5中之螢光體粒子8的 結晶方位分布,進行配向指數之算出。 將順向電壓施加於所製作的白色發光裝置1,流通既 定之電流而使白色發光裝置1發光。白色光係根據來自藍 色發光二極體晶片之藍光、與此藍光照射於該螢光體8所 發出的紅及綠之光的混色所發生。發光光度之測定係使用 超高感度瞬間多重測光系統(大塚電子股份有限公司製、 MCPD-7000 )而進行。 還有,發光光度係將所後述的比較例1中之白色發光 裝置1的發光光度設爲100%之相對數値所算出。 接著,利用第2圖所示之方法以實施白色發光裝置1 之波長轉換構件5中之螢光體8之結晶方位分布之偏移的 解析。將波長轉換構件5中之結晶性粒子的截面予以影像 化的步驟係藉由機械硏磨與 Ar+離子硏磨而使白色發光 裝置1之截面露出。 接著’利用電場放射型掃瞄電子顯微鏡(FE-SEM、曰 本電子股份有限公司製、JSM-7 0 0 IF型)觀察白色發光二 -17- 201131823 極體1之截面,獲得波長轉換構件5,亦即密封樹脂7中 經摻合的螢光體8之結晶性粒子的截面影像。 於判定根據影像化步驟所作成的影像之中的結晶粒子 之各自方位之判定步驟中,使用將電子反散射繞射圖案法 測定裝置(EDAX-TSL公司製、形式OIM )附加於該電場 放射型掃瞄電子顯微鏡之裝置。藉由此結晶方位解析系統 而進行結晶方位之測定。於電子反散射繞射圖案法中,觀 測到按照結晶面之菊池圖案。根據此菊池圖案之形狀而決 定所觀察的粒子的結晶方向。具體而言,使用能夠從利用 電子反散射繞射圖案法所獲得之菊池圖案而解析結晶方位 之軟體(EDAX-TSL公司製、OIM Ver5.2)而進行結晶方 位之分析。 以下,顯示結晶方位之測定條件: 加速電壓:15 kV 動作距離:1 5 mm 試料傾斜角度:7〇° 測定區域:8 0 // m X 2 0 0 a m 步驟寬度:〇_2 測定時間:50 msec/步驟 資料點數:約400,〇〇〇 ( 40萬)點。 還有,測定條件並不受此條件所限定,能夠按照試料 形態、裝置性能而適當決定。 解析在分析步驟所獲得之結晶方位分布,求得該(1 ) -18 - 201131823 式所定義的配向指數。 接著,針對所測定的發光光度及配向指數加以說明。 (實施例1之測定結果) 實施例1之發光裝置的發光光度係106.5%,由該(1) 式所算出的β型賽隆螢光體8之配向指數爲13.3%。 (實施例2之測定結果) 實施例2之發光裝置的發光光度係103.8%,由該(1) 式所算出的β型賽隆螢光體8之配向指數爲I4」%。 (實施例3之測定結果) 實施例3之發光裝置的發光光度係108.9%。 第3圖係顯示實施例3之β型賽隆螢光體8的結晶方 位分布之偏移的圖形。以斜線所表示的區域爲Ρ型賽隆 〔000 1〕結晶面與相對於其法線方向呈現±30度結晶面之 截面;無斜線之區域爲其他結晶面所露出的β型賽隆螢光 體8。由該(1)式所算出的β型賽隆螢光體8之配向指數 爲 1 1.3 %。 (實施例4之測定結果) 實施例4之發光裝置1的發光光度係104.1%,由該(1 ) 式所算出的β型賽隆螢光體8之配向指數爲7.3%。 (比較例1之測定結果) 比較例1之發光裝置的發光光度係1 〇〇%。 第4圖係顯示比較例1之β型賽隆螢光體8的結晶方 位分布之偏移的圖形。以斜線所表示的區域爲Ρ型賽隆 -19- 201131823 〔0 00 1〕結晶面與相對於其法線方向呈現±30度結晶面之 截面:無斜線之區域爲其他結晶面所露出的β型賽隆螢光 體8。由該(!)式所算出的β型賽隆螢光體8之配向指數 成爲22% ^ (比較例2之測定結果) 比較例2之發光裝置的發光光度係9 8.2%,β型賽隆 螢光體8的結晶方位分布偏移之配向指數爲1 9.1 %。 (比較例3之測定結果) 比較例3之發光裝置的發光光度係102.8%,β型賽隆 螢光體8的結晶方位分布偏移之配向指數爲16.3%。 (比較例4之測定結果) 比較例4之發光裝置的發光光度係100.9%,β型賽隆 螢光體8的結晶方位分布偏移之配向指數爲3·3%。 將在實施例1至4及比較例1至4所測出的白色發光 裝置1之發光光度與配向指數之結果彙整而顯示於表1。 〔表1〕 LED發光光度(% ) 配向指數 (% ) 實 施 例 1 106.5 13 3 實 施 例 2 103.8 14. 1 實 施 例 3 108.9 11 3 實 施 例 4 104.1 7.3 比 較 例 1 100.0 22. 0 比 .較 例 2 98.2 19.1 比 較 例 3 102.8 16.3 比 較 例 4 100.9 3.3 第5圖係顯示在實施例丨至4及比較例1至4之發光 裝置1所獲得之發光光度與β型賽隆螢光體8的配向指數 -20- 201131823 之關係的圖形。第5圖之縱軸係顯示發光裝置1之相對發 光光度(%),橫軸爲β型賽隆螢光體8之配向指數(%)。 由第5圖可明確得知,於將波長轉換構件5中之β型 賽隆螢光體8之結晶方位分布之偏移調製成5%以上且I5 %以下之實施例1至4之白色發光裝置1中,相對於作爲 基準之比較例1的發光二極體,發光光度爲104%至109 %左右,平均提高5%左右。 另一方面,於從波長轉換構件5中之β型賽隆螢光體 8之結晶方位分布所算出的配向指數與實施例不同的範 圍,亦即,調製成5 %以下且1 5 %以上之比較例1至4的 白色發光裝置1中,得知相對於作爲發光光度之基準的比 較例1之發光裝置爲98%至103%左右,相對於實施例1 至4爲低。 藉此,可知發光裝置1之波長轉換構件5中之β型賽 隆螢光體8之結晶方位分布之偏移爲既定之範圍內,亦即 配向指數成爲5%以上且15%以下,更佳成爲7%以上且 13%以下之發光裝置1中,能夠實現較習知之發光裝置之 發光強度更提高之發光裝置1。 在本發明之波長轉換構件5中之螢光體8之結晶方位 分布中,由於與此等配向指數範圍外之發光裝置作一比 較,具有既定範圍內之配向指數之發光裝置1係顯示更高 亮度之發光,適合作爲以藍色或紫外光作爲光源之白色發 光裝置1,能夠適合使用於照明器具、影像顯示裝置等。The CaAlSiN3 : Eu phosphor 8 is synthesized by the production method described in Patent Document 6. As shown in the following Table 1, in the first to fourth embodiments, the shift in the crystal orientation distribution of the phosphor 8 in the wavelength conversion member 5 is within the range of the predetermined « (that is, it is 5% or more and 15). The white light-emitting device 1 is obtained by dispersing the β-sialon phosphor 8 from which the remarkable needle-like and columnar particles have been removed in the wavelength conversion member 5 in a manner of % or less. (Comparative Example) Next, in Comparative Examples 1 to 4, as shown in Table 1, the crystal orientation distribution of the phosphors 8 in the respective wavelength conversion members 5 was shifted outside the predetermined range (i.e., became In a manner to be smaller than 5% or larger than 15%, the β-SiAlON phosphor 8 having a substantially needle-like and columnar particle as a main component is dispersed in the opposite manner to the embodiment. Except for this, a white light-emitting device 1 was produced in the same manner as in the embodiment. 201131823 The relationship between the luminosity of the white light-emitting device 1 and the crystal orientation distribution of the phosphor particles 8 in the wavelength conversion member 5 of the present invention is examined. For the measurement of the crystal orientation distribution, as in the manner described in the imaging step ST1, the cross section of the wavelength conversion member 5 must be observed. However, the white light-emitting device 1 is broken by making the cross section of the wavelength conversion member 5. Therefore, the luminosity of the white light-emitting device 1 produced in the examples and the comparative examples was measured first. Next, the crystal orientation distribution of the phosphor particles 8 in the wavelength conversion member 5 is measured, and the alignment index is calculated. A forward voltage is applied to the produced white light-emitting device 1, and a predetermined current is passed to cause the white light-emitting device 1 to emit light. The white light is generated by the color mixture of the blue light from the blue light-emitting diode chip and the red and green light emitted from the blue light. The measurement of the luminosity was carried out using an ultra-high sensitivity instantaneous multi-time measuring system (manufactured by Otsuka Electronics Co., Ltd., MCPD-7000). In addition, the luminosity is calculated by the relative radiance of the illuminance of the white light-emitting device 1 in Comparative Example 1 to be 100%. Next, the analysis of the shift in the crystal orientation distribution of the phosphor 8 in the wavelength conversion member 5 of the white light-emitting device 1 is carried out by the method shown in Fig. 2 . The step of imaging the cross section of the crystalline particles in the wavelength converting member 5 exposes the cross section of the white light-emitting device 1 by mechanical honing and Ar+ ion honing. Then, the cross section of the white light-emitting diode -17-201131823 was observed by an electric field radiation type scanning electron microscope (FE-SEM, manufactured by Sakamoto Electronics Co., Ltd., JSM-7 0 0 IF type), and the wavelength conversion member 5 was obtained. That is, a cross-sectional image of the crystalline particles of the phosphor 8 blended in the sealing resin 7. In the determination step of determining the respective orientations of the crystal particles among the images formed by the imaging step, an electron backscatter diffraction pattern measuring device (manufactured by EDAX-TSL, Form OIM) is added to the electric field radiation type. Scan the device of the electron microscope. The crystal orientation was measured by the crystal orientation analysis system. In the electron backscatter diffraction pattern method, a Kikuchi pattern according to the crystal face was observed. The crystal orientation of the observed particles is determined based on the shape of the Kikuchi pattern. Specifically, the crystal orientation can be analyzed by using a soft body (OIM Ver., Ltd., OIM Ver5.2) which can analyze the crystal orientation from the Kikuchi pattern obtained by the electron backscatter diffraction pattern method. The measurement conditions of the crystal orientation are shown below: Acceleration voltage: 15 kV Operating distance: 1 5 mm Sample tilt angle: 7 〇 ° Measurement area: 8 0 // m X 2 0 0 am Step width: 〇 2 Measurement time: 50 Msec / step data points: about 400, 〇〇〇 (400,000) points. Further, the measurement conditions are not limited to these conditions, and can be appropriately determined in accordance with the sample form and device performance. The orientation distribution of the crystal obtained in the analysis step is analyzed, and the alignment index defined by the formula (1) -18 - 201131823 is obtained. Next, the measured luminosity and alignment index will be described. (Measurement Results of Example 1) The luminescence luminosity of the luminescence device of Example 1 was 106.5%, and the alignment index of the β-Sialon phosphor 8 calculated by the formula (1) was 13.3%. (Measurement Results of Example 2) The luminescence luminosity of the luminescence device of Example 2 was 103.8%, and the alignment index of the β-Sialon phosphor 8 calculated by the above formula (1) was I4"%. (Measurement Results of Example 3) The luminosity of the light-emitting device of Example 3 was 108.9%. Fig. 3 is a graph showing the shift in the crystal orientation distribution of the β-SiAlON phosphor 8 of Example 3. The area indicated by the oblique line is the crystal plane of the ΡSialon (000 1) and the section of the crystal plane of ±30 degrees with respect to the normal direction thereof; the area without the slanting line is the β-type Sialon luminescence exposed by other crystal planes. Body 8. The orientation index of the β-Sialon phosphor 8 calculated by the formula (1) was 11.3%. (Measurement Results of Example 4) The luminescence luminosity of the illuminating device 1 of Example 4 was 104.1%, and the alignment index of the β-Sialon phosphor 8 calculated by the formula (1) was 7.3%. (Measurement Results of Comparative Example 1) The luminosity of the light-emitting device of Comparative Example 1 was 1% by weight. Fig. 4 is a graph showing the shift in the crystal orientation distribution of the β-SiAlON phosphor 8 of Comparative Example 1. The area indicated by the slanted line is the Ρ-type Sialon-19-201131823 [0 00 1] crystal plane and the section of the crystal plane of ±30 degrees with respect to the normal direction: the area without the slash is the beta of the other crystal plane Type Cylon phosphor 8. The alignment index of the β-Sialon phosphor 8 calculated by the formula (!) was 22% ^ (measurement result of Comparative Example 2) The luminosity of the light-emitting device of Comparative Example 2 was 8.2%, and β-sialon was obtained. The orientation index of the crystal orientation distribution shift of the phosphor 8 was 19.1%. (Measurement result of Comparative Example 3) The luminosity of the light-emitting device of Comparative Example 3 was 102.8%, and the orientation index of the crystal orientation distribution shift of the β-Sialon phosphor 8 was 16.3%. (Measurement result of Comparative Example 4) The luminescence luminosity of the luminescence device of Comparative Example 4 was 100.9%, and the alignment index of the crystal orientation distribution shift of the β-Sialon phosphor 8 was 3.3%. The results of the luminosity and the alignment index of the white light-emitting device 1 measured in Examples 1 to 4 and Comparative Examples 1 to 4 are shown in Table 1. [Table 1] LED luminosity (%) alignment index (%) Example 1 106.5 13 3 Example 2 103.8 14. 1 Example 3 108.9 11 3 Example 4 104.1 7.3 Comparative Example 1 100.0 22. 0 ratio. 2 98.2 19.1 Comparative Example 3 102.8 16.3 Comparative Example 4 100.9 3.3 Fig. 5 shows the luminosity obtained by the light-emitting devices 1 of Examples 丨 to 4 and Comparative Examples 1 to 4 and the alignment of the β-Sialon phosphor 8 A graph of the relationship of the index -20- 201131823. The vertical axis of Fig. 5 shows the relative luminosity (%) of the light-emitting device 1, and the horizontal axis shows the alignment index (%) of the β-Sialon phosphor 8. As is clear from Fig. 5, the white light emission of Examples 1 to 4 in which the shift in the crystal orientation distribution of the β-sialon phosphor 8 in the wavelength conversion member 5 is adjusted to 5% or more and I5 % or less In the device 1, the luminosity was about 104% to 109% with respect to the light-emitting diode of Comparative Example 1 as a reference, and the average luminosity was increased by about 5%. On the other hand, the alignment index calculated from the crystal orientation distribution of the β-sialon phosphor 8 in the wavelength conversion member 5 is different from the range of the embodiment, that is, 5% or less and 15% or more. In the white light-emitting device 1 of Comparative Examples 1 to 4, it was found that the light-emitting device of Comparative Example 1 which is the reference of the luminosity was about 98% to 103%, which was low with respect to Examples 1 to 4. Therefore, it is understood that the shift of the crystal orientation distribution of the β-sialon phosphor 8 in the wavelength conversion member 5 of the light-emitting device 1 is within a predetermined range, that is, the alignment index is 5% or more and 15% or less, more preferably In the light-emitting device 1 which is 7% or more and 13% or less, the light-emitting device 1 having higher luminous intensity than the conventional light-emitting device can be realized. In the crystal orientation distribution of the phosphor 8 in the wavelength conversion member 5 of the present invention, the light-emitting device 1 having an alignment index within a predetermined range is displayed higher than that of the light-emitting device outside the range of the alignment index. The light-emitting luminance is suitable as a white light-emitting device 1 using blue or ultraviolet light as a light source, and can be suitably used for a lighting fixture, a video display device, or the like.

S -21 - 201131823 本發明並不受該實施形態所限定,在申請專利範圍所 記載的發^^範圍內可有各種變形,此等變形當然也包含於 本發明之範圍內。例如,發光裝置丨之顏色係藉由改變發 出H或紅之螢光體8的摻合比而能夠變更爲白色以外之例 如電燈色。 【圖式簡單說明】 第1圖係顯示本發明發光裝置之構造的截面圖。 第2圖係顯示解析本發明之波長轉換構件中之結晶性 粒子的結晶方位分布偏移之順序的步驟圖。 第3圖係顯示實施例3之β型賽隆螢光體的結晶方位 分布之偏移的圖形。 第4圖係顯示比較例丨之β型賽隆螢光體的結晶方位 分布之偏移的圖形。 第5圖係顯示實施例丨至4及比較例1至4之發光裝 置所獲得之發光光度與β型賽隆螢光體的配向指數之關係 的圖形。 第6圖係顯示習知之發光二極體構造的截面圖。 【主要元件符號說明】 1 發 光 裝 置 2 發 光 光 源 3 第 — 引 線 框 架 3a 引 線 框 架 之 上部 3b 發 光 二 極 體 之晶片裝載用之凹部 4 第 二 引 線 框 架 -22- 201131823 5 波 長 轉 換 構 件 6 結 著 線 7 樹 脂 8 螢 光 體 9 間 隙 60 發 光 二 極 體 62 第 — 引 線 框 架 64 反 射 面 66 發 光 二 極 體 晶 68 第 二 引 線 框 架 70 結 著 線 72 樹 脂 74 螢 光 體 78 透 光 性 樹 脂 材 -23S - 21 - 201131823 The present invention is not limited to the embodiment, and various modifications are possible within the scope of the invention, and such modifications are of course included in the scope of the invention. For example, the color of the light-emitting device can be changed to a color other than white, for example, by changing the blending ratio of the phosphors 8 emitting H or red. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the structure of a light-emitting device of the present invention. Fig. 2 is a flow chart showing the procedure for analyzing the crystal orientation distribution shift of the crystalline particles in the wavelength converting member of the present invention. Fig. 3 is a graph showing the shift of the crystal orientation distribution of the ?-sialon phosphor of Example 3. Fig. 4 is a graph showing the shift of the crystal orientation distribution of the β-SiAlON phosphor of the comparative example. Fig. 5 is a graph showing the relationship between the luminosity obtained by the illuminating devices of Examples 丨 to 4 and Comparative Examples 1 to 4 and the alignment index of the β-Sialon phosphor. Figure 6 is a cross-sectional view showing a conventional light-emitting diode structure. [Description of main components] 1 illuminating device 2 illuminating light source 3 - lead frame 3a upper portion of lead frame 3b recessed portion for wafer loading of light emitting diode 2 second lead frame -22 - 201131823 5 wavelength conversion member 6 7 Resin 8 Luminous body 9 Gap 60 Light-emitting diode 62 First - Lead frame 64 Reflecting surface 66 Light-emitting diode crystal 68 Second lead frame 70 Cladding line 72 Resin 74 Phosphor 78 Translucent resin material -23

Claims (1)

201131823 七、申請專利範圍: 1. 一種發光裝置’其特徵係含有發光光源與波長_ 該波長轉換構件係含有吸收來自經由該發光 生的從近紫外至藍色光而發生螢光的一種以上 光體粒子; 至少該一種柱狀螢光體粒子結晶方位分布之 利用電子反散射繞射圖案法而解析該發光裝置 下列(1 )式所代表的配向指數設爲5 %以上且 配向指數(%) = ((相當於具有柱狀形狀 粒子底面的結晶面±30°之結晶方位的粒子之截 有柱狀形狀之螢光體粒子之截面積))xl〇〇(S 2. 如申請專利範圍第1項之發光裝置,其中該發 發生300 nm至500 nm波長之光的發光二極體 3 .如申請專利範圍第1項之發光裝置,其中該螢 有β型賽隆(Sialon )。 4.如申請專利範圍第1項之發光裝置,其中該螢 有α型賽隆。 5 .如申請專利範圍第1項之發光裝置,其中該螢 有經Eu活化的CaAlSiN3 » 6. —種照明裝置,其係含有如申請專利範圍第1 任一項之發光裝置所構成。 7 . —種影像顯示裝置,其係含有如申請專利範圍 項中任一項之發光裝置所構成。 _換構件; 光源所發 之柱狀螢 偏移係將 之截面的 I 5 %以下; 之螢光體 面積)/(具 光光源係 晶片。 光體係含 光體係含 光體係含 至5項中 第1至5 -24-201131823 VII. Patent application scope: 1. A light-emitting device 'characteristics comprising an illuminating light source and a wavelength _ the wavelength converting member contains one or more light bodies that absorb fluorescence from near ultraviolet to blue light generated through the illuminating light. Particles; at least the crystal orientation distribution of the columnar phosphor particles is analyzed by an electron backscatter diffraction pattern method. The alignment index represented by the following formula (1) is set to be 5% or more and the alignment index (%) = ((corresponding to the cross-sectional area of the phosphor particles having the columnar shape of the particles having a crystal orientation of ±30° on the crystal surface of the columnar-shaped particle surface)) xl〇〇(S 2. Patent Application No. 1 The light-emitting device of the present invention, wherein the light-emitting diode of the light of the wavelength of 300 nm to 500 nm is used. The light-emitting device of claim 1, wherein the firefly has a β-sialon (Sialon). The illuminating device of the first aspect of the invention, wherein the fluorescing device has an alpha type sialon. 5. The illuminating device of claim 1, wherein the fluorescing device has Eu-activated CaAlSiN3 » 6. The invention relates to a light-emitting device according to any one of the above claims. The image display device comprising the light-emitting device according to any one of the claims of the patent application. The columnar flicker shift is less than I 5 % of the cross section; the phosphor area is / (with a light source system wafer. The photosystem containing photosystem contains 5 to 5 - 24 of the 5 items)
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