201131458 六、發明說明： 【發明所屬之技術領域】 本發明係關於為一種面板，特別是關於一種具近接感應功能之面板。 【先前技術】 隨著光電科技的發展’近接切換裝置已被大量運用在不同的機器上， 例如.智慧性手機、運輸工具之購票系統、數位照像機、遙控器與液晶螢 幕專。常見的近接切換裝置（Proximi ty Device)包括如近接感測器 (Proximity sensor)與觸摸面板（touch panel)等，主要用以切換系統狀 態。近接感測器之運作方式為：當一物體靠近感測器之感應範圍内，近接 感測器在觸及該物體或不觸及物體的狀況下，經由近接感應之方式得知該 物體所在之位置，近接感測器將感應所得之信號轉變為一電子訊號，系統 或機器會依據該電子訊號做出適當的反應，達成控制系統狀態之目的。 近接感測器又稱近接開關（proximity Switch)，應用在許多液晶電視、 電源開關、家電開關、門禁系統、手持式遙控器與手機等，近年來，更是 這些裝置與設備不可或缺的角色之一。它負責偵測物體是否靠近，以便讓 控制器了解目前物體所在之位置。以家電應用來說，近接感測器被大量用 在燈源的控制上’ ^要靠近近接制^或碰觸近贼測器，依據感測訊號 燈源就可進行開或關之動作。而近接感測器之種類及外型琳琅滿目，係為 長方型、四方型、圓柱型'圓孔型、溝型、多點型等。依其原理可分成以 下4種類型：電感式、電容式、光電式與磁氣式。 請參考第1圖，其為一般電容式近接感應系統1〇〇功能方塊圖，其包 201131458 括物件10、近接感應單元101、感測電路105與微控制器jog。當物件 1〇靠近接感應單元1〇1時，近接感應單元1〇1所感應之電容量會隨著物件 之距離而產生變動’此時，由振盈器他產生之振盛頻率/波幅之大小會依 據物件之距離而改變並產生—振盪訊號。而檢波電路1Q3轉換振蓋訊號為 固定直流電壓並傳送至輸出電路1Q4，輸出電路1〇4用以接受岐直流電 壓並增強驅動力為輸出訊號，並傳送至微控制器1〇6或受控之負載端。 現今各式各樣的顯示面板已經大幅地應用於不同之裝置，為了實現觸 控面板互動式之概念，先前技術於面板之周邊增設一具近接感應功能之面 板，包括.電路板(PCB)、近接感應單元、感測電路與微控制器。如第2圖 所示者，其為先前技術觸控面板之上視圖，其包括：觸控面板130、近接 感應單元140與電路板(PCB)150第3圖則為先前技術電容式觸控面板之結 構圖。 參考第2圖與第3圖可得知，先前技術之作法，須於觸控面板之外部 另增設至少一個電路板(PCB)，並將個別之近接感應單元放置於個別之電路 板(PCB)之上。此種作法將使得成本變高，且增加系統繞線之複雜度而使得 系統難於整合。因此，在面板的應用上，如何使得近接感應單元製作於面 板上的成本能夠降低並簡化系統繞線之複雜度，成為未來互動式面板開發 的重要議題。 【發明内容】 本發明係提出一種具近接感應功能之面板，包含基板與至少—個近接 感應單元。先前技術必需額外增設至少一個電路板(PCB)並放置至少一個互 谷式近接感應單元’本發明提出於製作面板之過程，同時，將互容式近接 201131458 感應單元形成於面板之基板，使得成本降低並減少系統繞線之複雜度。 本發明更提出一種具近接感應功能之面板，包括：基板、至少—個互 容式近接感應單元與至少一個感測電路。互容式近接感應單元形成於基板 . 周邊，互容式近接感應單元感應物件之靠近而產生所對應之—感應訊號。 - 感測電路，連接互容式近接感應單元，用以接收感應訊號而產生一控制訊 號。 為讓本發明之上述和其他目的'特徵、和優點能更明顯易懂，下文特 φ 舉數個較佳實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 本發明提出一種具近接感應功能之面板，包含基板與至少一個近接感 應單几。藉由將近接感應單元直接形成於各種不同面板之基板周邊，使得 整體製作成本降低並降低系統繞線之複雜度，使得所應用的基板具有近接 感應功能，而使得採用此面板的機器能達到更佳的人機互動效果。形成於 面板之周邊，可在不影響原面板製作的流程上，利用面板之周邊窄邊來製 鲁 作近接感應單元，並設法將近接感應單元的製作整合入面板的製作流程， . 如此’即可大幅降低近接感應單元所需的成本。 ' 請參考第4圖，其為本發明具近接感應功能之面板200之具近接感應 功能之面板130之功能方塊圖，其中，具近接感應功能之面板2〇〇包含： 面板130、至少一個近接感應單元140與至少一個感測電路160。近接感 應單元140形成於基板130周邊，其可依據物件之靠近而產生所對應 之近接感應訊號，且近接感應訊號之大小係依據物件1〇之距離遠近來改 變。感測電路160用以接收近接感應訊號而產生控制訊號。微控制器170 201131458 連接感測電路160，用以接收控制訊號並進行計算而產生座標資訊(χ γ)。 微控制器170可利用此座標資訊(χ，γ)進行手勢方向之判斷，例如：物件由 左至右、由右至左、由左斜至右斜、由右斜至左斜、由上至下、由下至上、 兩物件放大、兩物件縮小等等。如此，即可實現使用者與各種面板的互動 手勢。 其中，近接感應單元140係為以下之任意組合：電容式近接感應單元、 電感式近接感應單元、光電式近接感應單元與磁氣式近接感應單元。亦即， 在實做上，可以採取一種近接感應單元製作在面板上，或者，採取多種近 接感應單元製作在面板上。 電容式近接感應單元係利用該物件1〇之距離遠近而改變感應訊號之大 小，其中，感應訊號之大小係為電容量之變化。感測電路16〇内之振盪電 路依據電容量之變化而改變振盪頻率/振幅之大小，並依據此振盪頻率/振幅 之大小產生控制訊號而輸出至微控制器170。 其中’電容式近接感應單元包含了自容式近接感應單元與互容式近接 感應單元。自谷式近接感應單元係運用至少一電極進行驅動(D「jVjng)與债測 (Sensing卜而互電容式近接感應單元係運用至少兩電極的排列分別來進行 驅動與偵測。 電感式近接感應單元係利用物件之距離而改變感應訊號之大小，其 中’感應訊號之大小係為電感量之變化。感測電路160内之振盈電路係藉 由電感量之變化而改變振盪頻率/振幅之大小，並依據此振盪頻率/振幅之大 小產生控制訊號而輸出至微控制器17〇。 其中電容式與電感式之近接感應單元之形狀可選自：圓形、方形、橢 201131458 圓形、星形、心形、螺旋形'空心狀或任意形狀。 光電式近接感應單元包含：光發射器與光接收器，其運作之原理係利 用光發射雜射-规，該光義為紅外線。光電式近賊鮮^接收藉 • 纟物體表面反射回來之光量強度並產生近-光源訊號，且感測電路160係 ··- 依據光源訊號之光量強度來產生電子訊號並輸出至微控制器170。 ‘ 磁氣式近接感應單元係為磁性感應元件，其運作之原理係利用外部之 磁性物件靠磁氣式近接感應單元，磁氣式近接感應單元之磁性感應元件是 φ 由一片鐵性簧片所形成之接點。當磁性物件接近時，磁氣式近接感應單元 之鐵性簧片感應大量之磁性，而使得接翻此而導通^感測電路16〇依據 該接點來產生電子訊號並輸出至微控制器17〇。 其令，近接感應單元140係形成於：基板之上表面、基板之下表面、 基板之側面或基板上下表面。其中，具近接感應功能之面板之基板係選自： 投射電容式馳面板之基板、表面電容摘㈣板之基板、電阻式觸控面 板之基板、超音波觸控面板之基板、紅外線觸控面板之基板、有機發光二 • 極體面板(〇LED)之基板、液晶面板之基板、電子紙之基板、玻璃基板 '塑 . 膠基板(PET)基板與壓克力基板。 • 以下’第5圖、第6圖與第7圖之實施例，將分別列舉三個採用電容 式與電感式近接感應單元之面板實施例。 接著，請參考第5圖’其·具近接錢魏之面板之第—實施例上 視圖，近接感應單元141係採用方形之設計。 接著，請參考第6 ®，其制具近減應姐之面板之第二實施例上 視圖，近接感應單元142係採用螺旋形之設計。 201131458 接著，請參考第7 @ ’其卿具近賊應魏之面板之第三實施例上 視圖，其中，近接感應單元143係採用圓形之設計。 接著’第8圖〜第13圖將分別列舉六個具近接感應功能形成於觸控面 板之位置之實施例。其餘形成於0LED面板之基板、液晶面板之基板或電 子紙之基板等，由於其原理皆相同，不再贅述。 接著，請參考第8圖，其說明具近接感應功能之電容式觸控面板之剖 面圖，其中’具近接感應功能之電容式觸控面板201包括：第一電極層21〇、 基板220、第二電極層230與近接感應單元14〇 〇由於第一電極層21〇與 第-電極層230分別位於基板220的上下表面，因此，近接感應單元14〇 可形成於第一電極層210與第二電極層230之上表面或者下表面，或者上 下表面均形成。 接著，請參考第9圖，其說明具近接感應功能之電阻式觸控面板之剖 面圖，其中，具近接感應功能之電阻式面板3〇1包括：第一基板31〇、隔 離點320(spacer)、第二基板330與近接感應單元140。由於第一基板31〇 與第二基板330的表面具有電極層，因此，近接感應單元14〇可形成於第 一基板220表面或第二基板230表面。 接著，睛參考第10圖，其說明具近接感應功能之全平面電容式觸控面 板之剖面圖，其中，具近接感應功能之全平面電容式觸控面板400包括： 近接感應單元140、覆蓋層402、外殼404、保護層406與液晶面板408。 其中’近接感應單元140可形成於覆蓋層402之下表面，覆蓋層402可以 是玻璃層或塑膠層（PET)或壓克力層。 接著’請參考第11圖’其說明具近接感應功能之全平面電阻式觸控面 201131458 板之結構圖，其中，具近接感應功能之全平面電阻式面板410包括：近接 感應單元140、第一基板310、隔離點320(spacer)、第二基板330、覆蓋 層402、外殼404與液晶面板408。其中，近接感應單元140可形成於覆 . 蓋層402之下表面。 ， 接著，請參考第12圖，其說明具近接感應功能之光學式面板之剖面圖 之結構圖’其中，具近接感應功能之光學式面板420包括：近接感應單元 140、覆蓋層402、外殼404、液晶面板408、光源發射器422、光源接收 Φ 器424與隔離物426。其中，近接感應單元140可形成於覆蓋層402之上 表面或下表面，第12圖的實施例係為形成於覆蓋層402的下表面。 接著，請參考第13圖，其說明具近接感應功能之音波式面板之剖面圖， 其中’具近接感應功能之音波式面板440包括：近接感應單元14〇、覆蓋 層402與外殼404、液晶面板408、音波發射器442與音波接收器444。 其中’近接感應單元140可形成於覆蓋層402之下表面。 其中，至少一個互容式近接感應單元145，形成於該基板周邊，該互容 ♦ S近接感應單it 145用以感應-物件之靠近而產生一感應訊號，且該互容 式近接感應單元之形狀係選自同心圓、半月形同心圓、同心方塊與同心迴 字形方塊。其中，第14圖中同心圓之結構為二圓形電極具有相同圓心，而 第15圖中半月形同心'圓之結構為—弧形電極圍繞-圓型電極，且第16圖 中同〜方塊之結構為—矩形電测繞—U形電極，矩形電極具有朝内延伸 的末端’此末端指向U形電極之開口，最後，第π圖中同心迴字形方塊之 201131458 結構為一電極圍繞成具有開口的外矩形以及一較小的内矩形，另一電極形 成於該外矩形與該内矩形的間隙之間。 接著，將說明第14圖至第17圖為互容式近接感應單元之應用電路’ 其中，感測電路16〇包含驅動電路161與偵測電路162。其中，互容式近 接感應單元145中至少包括兩個電極，如第14圖所示者。而運用互容式近 接感應單元145來進行物件近接偵測的動作原理為：由驅動電路161驅動 一仏號於與其相連的第一電極，而第二電極會產生相應的互電容感應。當 物件1〇靠近互容式近接感應單元145時，互容式近接感應單元145的電 令量將受到擾動而改變，此時，偵測電路162即可依據與其所連接的第二 電極偵測到電容的變化，並藉由電壓或電流的大小的改變，進而得知互容 式近接感應單元145電容量變化。如此，即可計算物件接近面板的相對距 離。其中，運用互容式近接感應單元145，可達到反應速度較快，且穩定 性較高的功效。 雖然本發明之較佳實施例揭露如上所述，然其並非用以限定本發明， 任何熟習相關技藝者，在不脫離本發明之精神和範圍内，當可作些許之更 動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利^>.圍 所界定者為準》 【圖式簡單說明】 第1圖係為電容式近接感應系統功能方塊圖(先前技術）； 第2圖係為先前技術觸控面板之上視圖(先前技術）； 第3圖係為先前技術觸控面板之結構圖(先前技術）； 第4圖係為具近接感應功能之面板之系統功能方塊圖； 201131458 第5圖係為具近接感應功能之面板之第一實施例上視圖； 第6圖係為具近接感應功能之面板之第二實施例上視圖； 第7圖係為具近接感應功能之面板之第三實施例上視圖； • 第8圖係為具近接感應功能之電容式觸控面板之剖面圖； ·- 第9 ®係為具近接感應功紅電阻式觸控面板之部面圖； 第10圖係為具近接感應功能之全平面電容式觸控面板之剖面圖 第11圖係為具近減應功能之全平面餘式觸控面板之剖面圖 • 帛12圖係為具近接感應功能之光學式面板之剖面圖； 第13圖係為具近接感應功能之音波式面板之剖面圖； 第14圖係為具近接感應功能之電容式面板之第—實施例圖； 第15圖係為具近接感應功能之電容式面板之第二實施例圖； 第16圖係為具近接感應功能之電容式面板之第三實施例圖；及 第17圖係為具近接感應功能之電容式面板之第四實施例圖。 【主要元件符號說明】 10 物件 100 電容式近接感應系統 101 近接感應單元 102 振盈電路 103 檢波電路 104 輸出電路 105 感測電路 106 微控制器 11 201131458 130 觸控面板 140 近接感應單元 141 方形近接感應單元 142 螺旋形近接感應單元 143 圓形近接感應單元 145 互容式近接感應單元 150 電路板 160 感測電路 161 驅動電路 162 偵測電路 170 微控制器 200 具近接感應功能之面板 201 電容式觸控面板201 210 第一電極層 220 基板 230 第二電極層 301 電阻式面板201 310 第一基板 320 隔離點 330 第二基板 400 全平面電容式觸控面板 402 覆蓋層 12 201131458 404 外殼 406 保護層 408 液晶面板 410 全平面電阻式面板 420 光學式面板 422 光源發射器 424 光源接收器 φ 426 隔離物 440 音波式面板 442 音波發射器 444 音波接收器 13201131458 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a panel, and more particularly to a panel having a proximity sensing function. [Prior Art] With the development of optoelectronic technology, the proximity switching device has been widely used in different machines, such as smart phones, transportation ticket purchasing systems, digital cameras, remote controls and LCD screens. Common Proximity Devices include Proximity sensors and touch panels, etc., which are mainly used to switch system states. The proximity sensor operates in the following manner: when an object is in proximity to the sensing range of the sensor, the proximity sensor detects the location of the object by proximity sensing when the object is touched or not touched. The proximity sensor converts the induced signal into an electronic signal, and the system or machine responds appropriately according to the electronic signal to achieve the purpose of controlling the state of the system. Proximity sensors, also known as proximity switches, are used in many LCD TVs, power switches, appliance switches, access control systems, handheld remote controls and mobile phones. In recent years, they have been indispensable for these devices and devices. one. It is responsible for detecting the proximity of an object so that the controller knows where the current object is. In the case of home appliance applications, the proximity sensor is used in a large number of control of the light source. ^ To be close to the proximity system or touch the proximity detector, the light source can be turned on or off according to the sensing signal source. The types of proximity sensors and their appearance are numerous, such as rectangular, square, cylindrical, round, groove, and multi-point. According to its principle, it can be divided into the following four types: inductive, capacitive, photoelectric and magnetic. Please refer to FIG. 1 , which is a functional block diagram of a general capacitive proximity sensing system, which includes an object 10 , a proximity sensing unit 101 , a sensing circuit 105 , and a microcontroller jog . When the object 1 is close to the sensing unit 1〇1, the capacitance induced by the proximity sensing unit 1〇1 varies with the distance of the object. At this time, the frequency/amplitude of the vibration generated by the vibrator The size will vary depending on the distance of the object and produce an oscillating signal. The detection circuit 1Q3 converts the oscillating signal into a fixed DC voltage and transmits it to the output circuit 1Q4, and the output circuit 1〇4 receives the 岐DC voltage and enhances the driving force as an output signal, and transmits it to the microcontroller 1〇6 or controlled The load side. Nowadays, various display panels have been widely applied to different devices. In order to realize the interactive concept of the touch panel, the prior art has added a proximity sensing function panel around the panel, including a circuit board (PCB). Proximity to the sensing unit, sensing circuit and microcontroller. As shown in FIG. 2 , it is a top view of a prior art touch panel, including: touch panel 130 , proximity sensing unit 140 and circuit board (PCB) 150. FIG. 3 is a prior art capacitive touch panel. Structure diagram. Referring to FIG. 2 and FIG. 3, it can be seen that in the prior art, at least one circuit board (PCB) needs to be added outside the touch panel, and individual proximity sensing units are placed on individual circuit boards (PCBs). Above. This approach will make the cost higher and increase the complexity of the system winding, making the system difficult to integrate. Therefore, in the application of the panel, how to make the cost of the proximity sensing unit on the panel can reduce the complexity of the system winding, and become an important issue in the development of interactive panel in the future. SUMMARY OF THE INVENTION The present invention provides a panel having a proximity sensing function, including a substrate and at least one proximity sensing unit. In the prior art, it is necessary to additionally add at least one circuit board (PCB) and place at least one mutual valley proximity sensing unit. The present invention is proposed in the process of fabricating a panel, and at the same time, the mutual capacitive proximity 201131458 sensing unit is formed on the substrate of the panel, so that the cost Reduce and reduce the complexity of system winding. The invention further provides a panel with a proximity sensing function, comprising: a substrate, at least one capacitive proximity sensing unit and at least one sensing circuit. The mutual capacitive proximity sensing unit is formed on the substrate. In the periphery, the mutual capacitive proximity sensing unit senses the proximity of the object to generate the corresponding sensing signal. - a sensing circuit connected to the mutual capacitive proximity sensing unit for receiving the sensing signal to generate a control signal. The above and other objects, features and advantages of the present invention will become more apparent from the aspects of the invention. A panel with a proximity sensing function, comprising a substrate and at least one proximity sensing unit. By directly forming the proximity sensing unit on the periphery of the substrate of various different panels, the overall manufacturing cost is reduced and the complexity of the system winding is reduced, so that the applied substrate has a proximity sensing function, so that the machine using the panel can achieve more Good human-computer interaction. Formed on the periphery of the panel, the narrow-side peripheral edge of the panel can be used to make the proximity sensor unit without affecting the original panel fabrication process, and the production process of the proximity sensor unit can be integrated into the panel production process. The cost of the proximity sensing unit can be greatly reduced. Please refer to FIG. 4, which is a functional block diagram of a panel 130 with a proximity sensing function of the panel 200 with a proximity sensing function, wherein the panel 2 with a proximity sensing function includes: a panel 130, at least one proximity The sensing unit 140 is coupled to at least one sensing circuit 160. The proximity sensing unit 140 is formed on the periphery of the substrate 130, and the corresponding proximity sensing signal is generated according to the proximity of the object, and the size of the proximity sensing signal is changed according to the distance of the object 1〇. The sensing circuit 160 is configured to receive the proximity sensing signal to generate a control signal. The microcontroller 170 201131458 is connected to the sensing circuit 160 for receiving the control signal and performing calculation to generate coordinate information (χ γ). The controller 170 can use the coordinate information (χ, γ) to judge the gesture direction, for example, the object is left to right, right to left, left oblique to right oblique, right oblique to left oblique, and up to Down, from bottom to top, two objects are enlarged, two objects are reduced, and so on. In this way, the user can interact with various panels. The proximity sensing unit 140 is any combination of the following: a capacitive proximity sensing unit, an inductive proximity sensing unit, a photoelectric proximity sensing unit, and a magnetic gas proximity sensing unit. That is to say, in practice, a proximity sensing unit can be used to make the panel, or a plurality of proximity sensing units can be used to make the panel. The capacitive proximity sensing unit changes the size of the sensing signal by using the distance of the object 1 ,, wherein the magnitude of the sensing signal is a change in capacitance. The oscillating circuit in the sensing circuit 16 changes the oscillating frequency/amplitude according to the change in the capacitance, and generates a control signal according to the oscillating frequency/amplitude to output to the microcontroller 170. Among them, the capacitive proximity sensor unit includes a self-capacitance proximity sensor unit and a mutual capacitance proximity sensor unit. The self-valley proximity sensing unit uses at least one electrode for driving (D "jVjng" and debt measurement (Sensing) and the mutual capacitance type proximity sensing unit uses at least two electrodes to drive and detect respectively. Inductive proximity sensing The unit changes the size of the sensing signal by using the distance of the object, wherein the size of the sensing signal is the change of the inductance. The vibration circuit in the sensing circuit 160 changes the oscillation frequency/amplitude by the change of the inductance. And generating a control signal according to the magnitude of the oscillation frequency/amplitude and outputting to the microcontroller 17〇. The shape of the capacitive and inductive proximity sensing unit can be selected from: circular, square, elliptical 201131458 circular, star , heart-shaped, spiral 'hollow shape or arbitrary shape. Photoelectric proximity sensor unit includes: light emitter and light receiver, the principle of operation is to use light emission miscellaneous-meter, the light meaning is infrared. Photoelectric thief Fresh ^ Received and borrowed • The intensity of the light reflected from the surface of the object and the near-light source signal, and the sensing circuit 160 is based on the light source signal The electronic signal is generated and output to the microcontroller 170. The magnetic gas proximity sensing unit is a magnetic sensing element, and its operation principle is to use an external magnetic object to rely on a magnetic gas proximity sensing unit, and a magnetic gas proximity sensing unit. The magnetic sensing element is a contact formed by a piece of iron reed. When the magnetic object is close, the magnetic reed of the magnetic induction type sensing unit senses a large amount of magnetic force, so that the connection is turned on and the sensing circuit is turned on. 16〇 generates an electronic signal according to the contact and outputs the signal to the microcontroller 17. The proximity sensing unit 140 is formed on the upper surface of the substrate, the lower surface of the substrate, the side of the substrate, or the upper and lower surfaces of the substrate. The substrate with the proximity sensing function is selected from the group consisting of: a substrate for projecting a capacitive touch panel, a substrate for surface capacitance picking (four) boards, a substrate for a resistive touch panel, a substrate for an ultrasonic touch panel, and a substrate for an infrared touch panel. , organic light-emitting two-electrode panel (〇LED) substrate, liquid crystal panel substrate, electronic paper substrate, glass substrate 'plastic. plastic substrate (PET) substrate and pressure Force Substrate. • The following embodiments of Figures 5, 6, and 7 will illustrate three panel embodiments using capacitive and inductive proximity sensors. Next, please refer to Figure 5 In the upper view of the embodiment of the panel, the proximity sensing unit 141 is of a square design. Next, please refer to the sixth embodiment, which is a top view of the second embodiment of the panel of the near-reducing sister. The sensing unit 142 is designed in a spiral shape. 201131458 Next, please refer to the third embodiment of the third embodiment of the panel of the near-inductive thief Ying Wei, in which the proximity sensing unit 143 is designed in a circular shape. 'Fig. 8 to 13 will respectively illustrate six embodiments in which the proximity sensing function is formed at the position of the touch panel. The rest are formed on the substrate of the OLED panel, the substrate of the liquid crystal panel or the substrate of the electronic paper, etc., due to the principle thereof. All are the same, no longer repeat them. Next, please refer to FIG. 8 , which illustrates a cross-sectional view of a capacitive touch panel with a proximity sensing function, wherein the capacitive touch panel 201 with a proximity sensing function includes: a first electrode layer 21 , a substrate 220 , and a first The second electrode layer 230 and the proximity sensor unit 14 are located on the upper and lower surfaces of the substrate 220 respectively. Therefore, the proximity sensing unit 14 can be formed on the first electrode layer 210 and the second electrode layer 210 and the second electrode layer 210. The upper surface or the lower surface of the electrode layer 230, or both upper and lower surfaces are formed. Next, please refer to FIG. 9 , which illustrates a cross-sectional view of a resistive touch panel with a proximity sensing function, wherein the resistive panel 3 〇 1 with a proximity sensing function includes: a first substrate 31 〇, an isolation point 320 (spacer ), the second substrate 330 and the proximity sensing unit 140. Since the surfaces of the first substrate 31A and the second substrate 330 have electrode layers, the proximity sensing unit 14A can be formed on the surface of the first substrate 220 or the surface of the second substrate 230. Then, referring to FIG. 10, a cross-sectional view of a full-plane capacitive touch panel with a proximity sensing function is illustrated, wherein the full-plane capacitive touch panel 400 with a proximity sensing function includes: a proximity sensing unit 140, a cover layer 402, a housing 404, a protective layer 406 and a liquid crystal panel 408. Wherein the proximity sensing unit 140 can be formed on the lower surface of the cover layer 402, and the cover layer 402 can be a glass layer or a plastic layer (PET) or an acryl layer. Then, please refer to FIG. 11 for a structural diagram of a full-plane resistive touch surface 201131458 with a proximity sensing function, wherein the full-plane resistive panel 410 with a proximity sensing function includes: a proximity sensing unit 140, first The substrate 310, the spacer 320, the second substrate 330, the cover layer 402, the outer casing 404, and the liquid crystal panel 408. The proximity sensing unit 140 may be formed on the lower surface of the cover layer 402. Next, please refer to FIG. 12, which illustrates a structural diagram of a cross-sectional view of an optical panel having a proximity sensing function. The optical panel 420 having a proximity sensing function includes a proximity sensing unit 140, a cover layer 402, and a housing 404. The liquid crystal panel 408, the light source emitter 422, and the light source receive the Φ 424 and the spacer 426. The proximity sensing unit 140 may be formed on the upper surface or the lower surface of the cover layer 402. The embodiment of FIG. 12 is formed on the lower surface of the cover layer 402. Next, please refer to FIG. 13 , which illustrates a cross-sectional view of a sound wave panel with a proximity sensing function, wherein the sound wave panel 440 having a proximity sensing function includes: a proximity sensing unit 14 , a cover layer 402 and a housing 404 , and a liquid crystal panel. 408, sound wave transmitter 442 and sound wave receiver 444. Wherein the proximity sensing unit 140 can be formed on the lower surface of the cover layer 402. The at least one mutual-capacity proximity sensing unit 145 is formed on the periphery of the substrate, and the mutual-capacity ♦ S proximity sensing unit 145 is used to sense the proximity of the object to generate an inductive signal, and the mutual-capacity proximity sensing unit is The shape is selected from concentric circles, half moon concentric circles, concentric squares, and concentric glyph squares. Wherein, the structure of the concentric circles in Fig. 14 is that the two circular electrodes have the same center, and the structure of the half moon-shaped concentric 'circle in Fig. 15 is - the curved electrode surrounds the round electrode, and the same figure in the sixteenth figure The structure is a rectangular electric winding-U-shaped electrode, the rectangular electrode has an end extending inwardly. The end points to the opening of the U-shaped electrode. Finally, the 201131458 structure of the concentric gyro-shaped square in the π-th diagram is surrounded by an electrode. The outer rectangle of the opening and a smaller inner rectangle are formed between the outer rectangle and the gap of the inner rectangle. Next, FIG. 14 to FIG. 17 will be an application circuit of a mutual capacitive proximity sensing unit. The sensing circuit 16A includes a driving circuit 161 and a detecting circuit 162. The mutual capacitive proximity sensing unit 145 includes at least two electrodes, as shown in FIG. The principle of using the mutual-capacity proximity sensing unit 145 for detecting the proximity of the object is that the driving circuit 161 drives an nickname to the first electrode connected thereto, and the second electrode generates a corresponding mutual capacitance sensing. When the object 1 is close to the mutual-capacity proximity sensing unit 145, the electrical quantity of the mutual-capacity proximity sensing unit 145 will be disturbed and changed. At this time, the detecting circuit 162 can detect according to the second electrode connected thereto. To the change of the capacitance, and by the change of the magnitude of the voltage or current, the capacitance change of the mutual capacitive proximity sensing unit 145 is further known. In this way, the relative distance of the object to the panel can be calculated. Among them, the use of the mutual capacitive proximity sensing unit 145 can achieve a faster reaction speed and higher stability. While the preferred embodiment of the present invention has been described above, it is not intended to limit the present invention, and it is intended that those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The patent protection scope of the invention shall be subject to the definition of the patent application attached to this specification. [Comparative description of the drawing] Figure 1 is a functional block diagram of the capacitive proximity sensing system (prior art); 2 is a top view of a prior art touch panel (previous technique); 3 is a structural diagram of a prior art touch panel (previous technique); and FIG. 4 is a system function block of a panel with a proximity sensing function Figure 31; Figure 5 is a top view of a first embodiment of a panel with proximity sensing; Figure 6 is a top view of a second embodiment of a panel with proximity sensing; Figure 7 is a proximity sensing function The top view of the third embodiment of the panel; • Figure 8 is a cross-sectional view of the capacitive touch panel with proximity sensing function; ·- The 9th series is the surface of the proximity sensing red resistive touch panel Figure Figure 10 is a cross-sectional view of a full-planar capacitive touch panel with proximity sensing. Figure 11 is a cross-sectional view of a full-planar residual touch panel with near-reduction function. 帛12 is a close-up Sectional view of the optical panel with inductive function; Figure 13 is a cross-sectional view of the acoustic panel with proximity sensing function; Figure 14 is the first embodiment of the capacitive panel with proximity sensing function; Figure 15 Figure 2 is a second embodiment of a capacitive panel with a proximity sensing function; Figure 16 is a third embodiment of a capacitive panel with a proximity sensing function; and Figure 17 is a capacitive sensing with a proximity sensing function. A fourth embodiment of the panel. [Main component symbol description] 10 Object 100 Capacitive proximity sensing system 101 Proximity sensing unit 102 Vibration circuit 103 Detection circuit 104 Output circuit 105 Sensing circuit 106 Microcontroller 11 201131458 130 Touch panel 140 Proximity sensing unit 141 Square proximity sensing Unit 142 Spiral proximity sensing unit 143 Circular proximity sensing unit 145 Mutual capacitive proximity sensing unit 150 Circuit board 160 Sensing circuit 161 Driving circuit 162 Detection circuit 170 Microcontroller 200 Panel with proximity sensing function Capacitive touch Panel 201 210 First electrode layer 220 Substrate 230 Second electrode layer 301 Resistive panel 201 310 First substrate 320 Isolation point 330 Second substrate 400 Full-surface capacitive touch panel 402 Cover layer 12 201131458 404 Case 406 Protective layer 408 Liquid crystal Panel 410 Full Plane Resistive Panel 420 Optical Panel 422 Light Source Transmitter 424 Light Source Receiver φ 426 Isolation 440 Acoustic Panel 442 Acoustic Transmitter 444 Acoustic Receiver 13