TW201129472A - Gas-barrier polyimide film and metallic laminate using the same - Google Patents

Gas-barrier polyimide film and metallic laminate using the same

Info

Publication number
TW201129472A
TW201129472A TW099145417A TW99145417A TW201129472A TW 201129472 A TW201129472 A TW 201129472A TW 099145417 A TW099145417 A TW 099145417A TW 99145417 A TW99145417 A TW 99145417A TW 201129472 A TW201129472 A TW 201129472A
Authority
TW
Taiwan
Prior art keywords
polyimide film
gas
barrier
barrier polyimide
same
Prior art date
Application number
TW099145417A
Other languages
Chinese (zh)
Inventor
Naofumi Yasuda
Hiroki Ishikawa
Original Assignee
Du Pont Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont Toray Co Ltd filed Critical Du Pont Toray Co Ltd
Publication of TW201129472A publication Critical patent/TW201129472A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/123—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

The object of the present invention is to provide a gas-barrier polyimide film and a metallic laminate using the same. The gas-barrier polyimide film has high dimensional stability, and oxygen or water vapor pass through difficultly; therefore, the reduced peeling strength of the polyimide film and a metallic layer is also small even though it is at a high temperature. It is suitable that the gas-barrier polyimide film of a substrate for electrical circuit with fine pitch is demanded high dimensional accuracy. The gas-barrier polyimide film of the present invention is characterized in that one surface of the polyimide film which has modulus of elasticity more than 4GPa, linear expansion coefficient of 0 to 22 ppm/ DEG C and heating shrinkage below 0.05% at 200 DEG C for an hour forms the gas-barrier polyimide film which has a SiO2 layer has oxygen transmittance rate below 5.0x10<SP>-15</SP>mole/m2.s.Pa.
TW099145417A 2009-12-24 2010-12-23 Gas-barrier polyimide film and metallic laminate using the same TW201129472A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009291938A JP2011131456A (en) 2009-12-24 2009-12-24 Gas-barrier polyimide film and metal layered product using the same

Publications (1)

Publication Number Publication Date
TW201129472A true TW201129472A (en) 2011-09-01

Family

ID=44344714

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099145417A TW201129472A (en) 2009-12-24 2010-12-23 Gas-barrier polyimide film and metallic laminate using the same

Country Status (3)

Country Link
JP (1) JP2011131456A (en)
KR (1) KR20110074428A (en)
TW (1) TW201129472A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667133B (en) * 2014-03-31 2019-08-01 日商琳得科股份有限公司 Strip-shaped air-resistant laminated body and manufacturing method thereof, member for electronic device, and electronic device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7184858B2 (en) * 2019-09-28 2022-12-06 日鉄ケミカル＆マテリアル株式会社 Polyimide films, metal-clad laminates and circuit boards
CN111499913B (en) * 2020-05-19 2021-04-30 中山大学 Shell-like dense structure-imitated high-barrier polyimide composite film, preparation method and application

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0777778B2 (en) * 1989-03-24 1995-08-23 宇部興産株式会社 Metallized film and its manufacturing method
JPH0629634A (en) * 1992-07-10 1994-02-04 Mitsui Toatsu Chem Inc Flexible circuit board
JPH0661600A (en) * 1992-08-07 1994-03-04 Mitsui Toatsu Chem Inc Flexible circuit board
JP3447075B2 (en) * 1993-02-10 2003-09-16 三井化学株式会社 Flexible circuit board
JP2004006735A (en) * 2002-03-22 2004-01-08 Ube Ind Ltd Polyimide film for insulating inside of semiconductor package and laminated substrate
JP4406764B2 (en) * 2003-02-28 2010-02-03 東レ・デュポン株式会社 Gas barrier polyimide film and metal laminate using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667133B (en) * 2014-03-31 2019-08-01 日商琳得科股份有限公司 Strip-shaped air-resistant laminated body and manufacturing method thereof, member for electronic device, and electronic device

Also Published As

Publication number Publication date
JP2011131456A (en) 2011-07-07
KR20110074428A (en) 2011-06-30

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