201129274 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及印刷電路板製作技術，特別涉及一種承載治 具。 【先前技術·】 [0002] 軟性印刷電路板（Flexible Printed Circuit Board ，簡寫為FPC)具有體積小，重量輕，可做立體組裝及動 態可撓曲等優點，被愈來愈廣泛應用於各種可攜式電子 產品中，尤其係手機、數位相機、掌上電腦等輕薄且可 攜式電子產品。參見文獻以^^〇 7丑1113231^，¥〇31^111卜 chi Sogawa, Rieka Yoshino, Keiichiro Kata,201129274 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a printed circuit board manufacturing technique, and more particularly to a load bearing tool. [Previous Technology·] [0002] Flexible Printed Circuit Board (FPC) has the advantages of small size, light weight, three-dimensional assembly and dynamic flexibility, and is widely used in various applications. Among the portable electronic products, especially light and portable electronic products such as mobile phones, digital cameras, and palmtop computers. See the document to ^^〇 7 ugly 1113231^, ¥〇31^111b chi Sogawa, Rieka Yoshino, Keiichiro Kata,
Ichiro Hazeyama, and Sakae Kitajo, Real Chip Size Three-Dimensional Stacked Package, IEEE Transactions 〇n Advanced Packaging, 2005, 28(3)， 397-403 〇 _3]目刖’於FPC之製作過程中包括複數次貼合過程，以滿足 最終產品之性能要求。如，於FPC上貼合補強板，以增強 y FPC上承載電子元件之能力。通常補強板之貼合係先於 及待貼s之補強板上相應位置分別鑽複數定位孔；然 後依人將FPC與待貼合之補強板套設於預先設計之治具之 後數定位柱’該複數定位柱與複數定位孔一一對應，從 而將待貼。之補強板定位於Fpc之預定位置；最後藉由熱 壓之方式使補強板上之熱固化膠與Fpc表面發生化學鍵接 ’從而將補強板貼合固定於FPC之預定位置。然，由於 FPC之脹縮’ FPc上複數定位孔之位置會發生變化，而複 099103033 表單編號A0101 第4頁/共28頁 0992005738-0 201129274 [0004] Ο [0005] Ο 數定位柱固定於治具，從而預先設計之治具之複數定位 柱不能全部穿過該複數定位孔導致治具無法使用。一種 解決之辦法係將治具之定位柱之直徑設計得小於定位孔 之孔徑’如此，複數定位柱可能可全部穿過面積較小或 者脹縮比例較小之FPC，惟，由於補強板與FPC於治具上 還可相對於定位柱移動，補強板與FPC之間對位精度亦因 此而降低。 【發明内容】 有鑑於此，提供一種承載治具，以承載待貼合之基板並 提高貼合對位精度實屬必要。 一種承載治具，用於承載待貼合之第 基板與第二基板 。所述第一基板具有複數第1孔，所述第二基板具有與 所述複數第一孔一—對應之複數第二孔β所述承載治具 包括一第一板體、一第二板體以及複數定位杈。所述第 一板體具有與所述複數第π孔之位置一一攀應之複數容 置孔。所述第二板體具有與所述複數容置孔一—對應之 複數定位孔。所述複數定位枉與所述複數容置孔 —對 應。每一定位柱均自與之對應之容置孔向與之對應之a 位孔延伸，並突出於所述與之對應之定位孔以與所述第 一基板之一第一孔與所述第二基板之一第二孔相配人。 所述複數定位柱中，一定位柱定位於所述第一板體與之 對應之容置孔或者所述第二板體與之對應之定位孔中 其餘之定位柱可移動地設置於所述第一板體與之對應 容置孔與所述第二板體與之對應之定位孔中。 之 [0006] 與先前技術相比， 本技術方案提供之承載治具之定位& 099103033 表單編號A0101 第5頁/共28頁 0992005738-0 201129274 可移動之設置於第一板體之容置孔内，所述容置孔之孔 徑大小可根據待貼合之第一基板之脹縮情況而設計，從 而當待貼合之第一基板發生脹縮時，僅需移動定位柱調 整該定位柱於第一板體之容置孔内之位置即可適應第一 基板上每一第一孔發生之偏位之情況，尤其適用於包括 複數塊未裁切之電路板單元之大面積FPC，不僅可提高貼 合對位精度，還可提高貼合效率。 【實施方式】 [0007] 以下將結合附圖及複數實施例對本技術方案提供之承載 治具作進一步詳細說明。 [0008] 請一併參閱圖1與圖2，本技術方案第一實施例提供一種 承載治具10，用於定位待貼合之第一基板與第二基板。 所述第一基板具有複數第一孔。所述第二基板具有與所 述複數第一孔一一對應之複數第二孔。所述承載治具10 包括一第一板體11、一第二板體12、複數定位柱13以及 複數固定件14。 [0009] 所述第一板體11可為長方形板體，其具有相對之第一表 面110與第二表面111。所述第一表面110與第二表面111 均近似為長方形面。所述第一板體11可採用導熱效率較 高之鋼或鋁製成。所述第一板體11具有複數容置孔、複 數第一固定孔112與複數第一導向孔113。所述複數容置 孔與所述複數第一孔之位置——對應。所述複數容置孔 包括一第一基準孔與至少一第一調節孔，所述第一基準 孔之孔徑小於所述第一調節孔之孔徑。每一容置孔均為 自所述第二表面111向第一表面110開設之盲孔。每一容 099103033 表單編號A0101 第6頁/共28頁 0992005738-0 201129274 Ο 置孔均具有用於承載定位柱13之底壁114，所述底壁114 為平行於第二表面111之光滑平面。所述容置孔之橫截面 可為圓形。本實施例中，容置孔之數量為四個，且於所 述第一表面111中心處成陣列式排布，該四個容置孔分別 為第一容置孔115、第二容置孔116、第三容置孔117與 第四容置孔118。第一容置孔115與第二容置孔116靠近 第二表面111之一長邊，第三容置孔U7與第四容置孔 118罪近第一表面in之另—長邊。所述第一容置孔ns 為第一基準孔，第二容置孔116、第三容置孔u 7與第四 容置孔118均為第一調節孔。所述第二容置孔116、第三 谷置孔117與第四容置孔Π8之孔徑相等，且均大於所述 第一容置孔115之孔徑。所述複數第一固定孔112均貫穿 第一表面11〇與第二表面m，且每一第一固定孔112均 具有内螺紋。本實施例中，第一固定孔112之數量為四個 ，每一第一固定孔112均靠近所述第一板體u之一頂角。 所述複數第一導向孔113亦均貫穿第一表面11〇與第二表 ο 面1U。本實施例中，第一導向孔113之數量為兩個，一 第一導向孔113靠近第二表面U1之一短邊，且基本位於 兩個第一固定孔112之間，另一第一導向孔113靠近第二 表面ill之另一短邊，且基本位於另兩個第一固定孔112 之間。 [0010] 所述第二板體12與所述第一板體丨丨相對設置。所述第二 板體12具有相對之第三表面12〇與第四表面121。所述第 三表面120靠近所述第一板體11並與第二表面ill相對。 所述第四表面121遠離所述第一板體u。所述第二板體12 099103033 表單編號Α0Μ 第7頁/共28頁 〇992〇〇5738-0 201129274 亦可採用導熱效率較高之鋼或鋁製成。所述第二板體12 具有複數定位孔122、複數第二固定孔123與複數第二導 向孔124。所述複數定位孔122與所述複數容置孔一一對 應。具體地，所述複數定位孔122與複數容置孔之位置一 一對應，從而亦與所述複數第一孔之位置——對應。每 一定位孔122均為貫穿所述第三表面120與第四表面121 之通孔。本實施例中，與所述複數容置孔相對應之，定 位孔122之數量亦為四個，且孔徑均相同，所述四個定位 孔122於所述第四表面121中心處成陣列式排布。所述複 數第二固定孔123均貫穿第三表面120與第四表面121， 且每一第二固定孔123亦均具有内螺紋。本實施例中，與 所述複數第一固定孔112相對應地，所述第二固定孔123 亦為四個，每一第二固定孔123均靠近所述第二板體12之 一頂角。所述複數第二導向孔124亦均貫穿第三表面120 與第四表面121。本實施例中，與所述複數第一導向孔 113相對應地，所述第二導向孔124亦為兩個，一第二導 向孔124靠近所述第四表面121之一短邊，且基本位於兩 個第二固定孔123之間，另一第二導向孔124靠近所述第 四表面121之另一短邊，且基本位於另兩個第二固定孔 123之間。 [0011] 所述複數定位柱13與所述複數容置孔——對應，每一定 位柱13均包括相連接之容置部130與定位部131，所述容 置部130容置於所述容置孔，所述定位部131穿過所述定 位孔122。所述定位部131之直徑小於所述容置部130之 直徑。所述容置部130與定位部131均大致為圓柱體形， 099103033 表單編號A0101 第8頁/共28頁 0992005738-0 201129274 Ο 所述容置部130遠離定位部131處具有倒角。所述定位部 131之直徑小於定位孔122之孔徑、等於所述第一孔及所 述第二孔之孔徑，從而可移動地穿過與之對應之定位孔 122，並與所述第一基板之第一孔與所述第二基板之第二 孔相配合，從而將所述第一基板與第二基板定位於第二 板體12上。本實施例中，與所述複數容置孔相對應之， 所述定位枉13亦為四個。定位柱13之容置部130之直徑恰 等於作為所述第一基準孔之第一容置孔115之孔徑，且小 於所述第二容置孔116、第三容置孔117與第四容置孔 118之孔徑。從而實現所述四個定位柱中，與所述第一容 置孔115相對應之定位柱13定位於所述第一板體11第一容 置孔115，其餘之定位柱13可移動地設置於所述第一板體 11與之對應之容置孔與所述第二板體12與之對應之定位 孔 122。 [0012] Ο 所述複數固定件14與所述複數第一固定孔112--對應， 用於與所述第一固定孔112與複數第二固定孔123相配合 以將所述第一板體11與第二板體12固定於一起。所述複 數固定件14之直徑與所述第一固定孔112及第二固定孔 123相匹配，即，恰可穿過第一固定孔112及第二固定孔 123。所述固定件14還具有與所述第一固定孔112及第二 固定孔123之内螺紋相匹配之外螺紋。本實施例中，與所 述複數第一固定孔112相對應地，所述複數固定件14亦為 四個。 [0013] 099103033 當然，作為第一調節孔之所述第二容置孔116、第三容置 孔11 7與第四容置孔11 8之孔徑亦不一定要求相等，每一 表單編號Α0101 第9頁/共28頁 0992005738-0 201129274 第一調節孔之孔徑均可根據所述第一基板之脹縮比例以 及該第一調節孔所於之第一板體11之位置而定，如所述 第一調節孔之孔徑與定位柱13之定位部131之直徑之間之 差值等於所述第一基板之脹縮比例與該第一調節孔與第 一基準孔之間距之乘積。如此，可提高對位調節之精度 〇 [0014] 可理解，所述容置孔、定位孔122及定位柱13之數量並不 限於為四個，且所述容置孔及定位孔122分佈方式亦不限 於成陣列式排布，可根據待貼合之第一基板與第二基板 之實際需要而作相應設計。 [0015] 請一併參閱圖3至圖6，使用本技術方案第一實施例提供 之承載治具10對第一基板與第二基板進行壓合時，可採 用以下步驟： [0016] 第一步，提供第一基板100、第二基板200、熱壓裝置 300與如上所述之承載治具10。 [0017] 所述第一基板100可包括複數電路板單元101，且第一基 板100上開設有複數第一孔。所述第一孔之孔徑等於定位 柱13之定位部131之直徑，以使得定位柱13之定位部131 恰穿過所述第一孔10 2。本實施例中’所述第一基板1 0 0 為包括兩個電路板單元101之軟性電路板，每一電路板單 元101均開設有兩個第一孔102，從而所述第一基板100 上一共開設有四個第一孔1 0 2。 [0018] 所述第二基板200與所述複數電路板單元101——對應， 所述第二基板200上開設有複數第二孔201。所述第二孔 099103033 表單編號A0101 第10頁/共28頁 0992005738-0 201129274 [0019] Ο Ο [0020] 2〇1之孔徑等於定位柱13之定位部131之直徑，以使得定 位柱13之定位部131恰穿過所述第二孔2〇1。本實施例中 ，所述第二基板200為兩個，每一第二基板2〇〇均開設有 兩個第二孔201。其可為具有熱固化膠之補強板。優選之 ，所述第二基板200之脹縮比例與所述第一基板1〇〇之脹 縮比例相當。 所述熱壓裝置300包括相對設置之加熱台3〇1與壓塊3〇2 。所述加熱台301可為橫戴面積大於第一板體方形平 板，且其上延伸出複數導向柱3〇3，所述複數導向柱 與所述第一板體11今複數第一導向孔113及第二板體12之 複數第二導向孔124 — 一對應，用於與所述複數第一導向 孔11 3及複數第二導向孔丨24部配合以將所述承載治具i 〇 定位於所述熱壓裝置300。與所述複數第一導向孔113相 對應之，所述導向柱303為兩個。所述靨塊3〇2用於對所 述第基板100、第一基板200施.塵。所述.壓塊3〇2靠近 所述加熱台301之表面杲有與所述承栽治具1〇之複數定位 枉13相對應之孔或槽，以使得·所述壓塊3〇2可接觸到第二 基板200並對第-基板1〇〇與第二基板2〇〇施壓，而不會 被突出於第二基板200之定位杈13抵住》 第二步，將所述第—基板⑽、第二基板200藉由所述承 載治具10定位。 [0021] 可先使所述承絲㈣之複數定位枉13之一穿過將第 一基板副之複數第—孔，將第-基板10G置於第二板體 099103033 12上此時疋位柱丄3擺放於容置孔之位置與所述第 -基板100之第-孔之位置不對應，可移動定位㈣以使 表單編號A0101 第11頁/共28頁 0992005738-0 201129274 得定位柱13可穿過與之對應之第一孔。具體地，可先定 住複數定位柱13中之一，使該定位柱13對準第一基板1〇〇 上與之對應之第一孔，再調整其餘定位柱13之位置，使 該剩餘之複數定位柱13— 一對準第一基板1〇〇上其餘之複 數第一孔。 [0022] [0023] [0024] [0025] 再使所述承栽治具10之複數定位柱13之--穿過將第二 基板200之複數第二孔，將第二基板20〇置於第一基板 100上方。 第三步’利用熱壓裝置300將定位於所述承載治具10之第 一基板100與第二基板200壓合於一起。 具體地，可使熱壓裝置300之導向柱303依次穿過第一板 體11之第一導向孔113以及第一板體12之.第二導向孔124 ，將定位有第一基板100與第二基板200之所述承載治具 10置於熱壓裝置3〇〇之加熱台301上並對所述承載治具ίο 加熱，利用壓塊302對所述第一基板100輿第二基板200 施壓，從而將第一基板1〇〇與第二基板200壓合於一起。 請一併參閱圖γ與圖8，本技術方案第—實施例提供之承 载治具20與第一實施例之承載治具大致相同，其區別 於於，所述第一板體之複數容置孔之孔徑均相等，且其 孔徑均大於所述定位柱23之容置部230之直徑。所述第二 板體22之複數定位孔包括〆第二基準孔與至少一第二調 節孔。所述第二基準孔之孔徑之孔徑恰等於定位柱之定 位部之直徑以使得該第二基準孔恰可供定位柱2 3之定位 部231穿過。所述複數第二調節孔之孔徑依據所述第一基 099103033 表單編號Α0101 第12頁/共 28寅 0992005738- 201129274 板之脹縮比例以及該第二調節孔所於之第二板體2 2之位 置而定，所述第二調節孔之孔徑與定位柱23之定位部231 之直徑之間之差值等於所述第一基板之脹縮比例與該第 二調節孔與第二基準孔之間距之乘積，即，所述定位柱 23之定位部231於所述第二調節孔内可移動之最大值為所 述第一基板之脹縮比例與該第二調節孔與基準孔之間距 之乘積。所述第一基板之脹縮比例可利用專門之設備進 行測量得到。例如，所述第二板體22具有四個定位孔， 該四個定位孔分別為第一定位孔222、第二定位孔223、 第三定位孔2 2 4與第四定位孔22 5。第一定位孔2 2 2與第 ：. ..... . . . - ' ·. "：： ... ... .. 二定位孔223靠近第二板體22之一條長邊，第三定位孔 224與第四定位孔225靠近第二板體22之另一條長邊。若 將第一定位孔222定為第二基準孔，則第二定位孔223、 第三定位孔224與第四定位孔225均為第2調節孔。假設 所述第一基板之脹縮比例為φ，第二定位孔223與第一定 位孔222之間距為D1，第三定位孔224與第一定位孔222 之間距為D2，第四定位孔225與第一定位孔222之間距為 D3。該第一定位孔2i2之扎徑D0恰等於定位柱23之定位 部231之直徑以使得該第一定位孔222恰可供定位枉23之 定位部231穿過。第二定位孔223之孔徑為d〇+D1*P，第 二定位孔223之孔徑為D0+D2*<p，第三定位孔224之孔徑 為D0 + D3*p。從而實現所述四個定位柱23中，與所述第 一定位孔222相對應之定位柱23定位於所述第二板體22之 第一定位孔222，其餘之定位柱23可移動地設置於所述第 一板體21與之對應之容置孔與所述第二板體22與之對應 之定位孔。如此’於將第一基板定位於承載治具2〇時’ 099103033 表單編號A0101 第13頁/共28頁 0992005738-0 201129274 存在第疋位孔222及與之對應之定位柱23作為基準，僅 二找准第基板上與該第一定位孔222及定位柱23對應之 第孔再微碉其餘之定位柱23即可快速對位，省去了 將複數定位板23與複數第一孔一-對應之步驟。此外， 由於第一疋位孔223、第三定位孔224與第四定位孔225 之孔k已根據所述第—基板上與之對應之第—孔可能發 偏4乍了相應之設計，對於其餘之定位柱23之微調 亦於脹縮比例之範圍内，從而可進—步地提高對位精度 [0026] [0027] [0028] [0029] [0030] [0031] 田然’作為第二調節孔之第二定位孔223、第三定位孔 224與第四定仇孔奶之孔徑亦可相等，且均大於定位柱 23之定位部231之直徑。Ichiro Hazeyama, and Sakae Kitajo, Real Chip Size Three-Dimensional Stacked Package, IEEE Transactions Advancedn Advanced Packaging, 2005, 28(3), 397-403 〇_3]目刖'In the production process of FPC, including multiple stickers Process to meet the performance requirements of the final product. For example, a reinforcing plate is attached to the FPC to enhance the ability to carry electronic components on the y FPC. Usually, the bonding of the reinforcing plates is to drill a plurality of positioning holes respectively before the corresponding positions on the reinforcing plates to be attached; then the FPC and the reinforcing plates to be fitted are set in the pre-designed jig and the positioning column is ' The plurality of positioning posts are in one-to-one correspondence with the plurality of positioning holes, so that they are to be attached. The reinforcing plate is positioned at a predetermined position of the Fpc; finally, the thermosetting adhesive on the reinforcing plate is chemically bonded to the surface of the Fpc by means of hot pressing to fix the reinforcing plate to a predetermined position of the FPC. However, due to the expansion and contraction of the FPC, the position of the plurality of locating holes on the FPc will change, and the complex 099103033 Form No. A0101 Page 4 / Total 28 Pages 0992005738-0 201129274 [0004] Ο [0005] Ο The number of positioning posts is fixed in the treatment Therefore, the plurality of positioning posts of the pre-designed jig cannot pass through the plurality of positioning holes, thereby causing the jig to be unusable. One solution is to design the diameter of the positioning column of the jig to be smaller than the aperture of the positioning hole. Thus, the plurality of positioning columns may all pass through the FPC with a small area or a small expansion ratio, but because of the reinforcing plate and the FPC. The fixture can also move relative to the positioning column, and the alignment accuracy between the reinforcing plate and the FPC is also reduced. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a carrying fixture for carrying a substrate to be bonded and improving the alignment alignment accuracy. A carrying fixture for carrying a first substrate and a second substrate to be bonded. The first substrate has a plurality of first holes, and the second substrate has a plurality of second holes corresponding to the plurality of first holes. The bearing fixture comprises a first plate body and a second plate body. And multiple positioning 杈. The first plate has a plurality of accommodating holes that are aligned with the positions of the plurality of π holes. The second plate body has a plurality of positioning holes corresponding to the plurality of receiving holes. The complex positioning 枉 corresponds to the plurality of accommodating holes. Each of the positioning posts extends from the corresponding receiving hole toward the corresponding a-position hole, and protrudes from the corresponding positioning hole to form a first hole and the first one of the first substrate The second hole of one of the two substrates is matched with a person. In the plurality of positioning posts, a positioning post is positioned on the corresponding receiving hole of the first plate body or the remaining positioning post of the second plate body corresponding thereto is movably disposed on the positioning post The first plate body corresponding to the receiving hole and the positioning hole corresponding to the second plate body. [0006] Compared with the prior art, the positioning of the bearing fixture provided by the technical solution & 099103033 Form No. A0101 Page 5 / Total 28 Page 0992005738-0 201129274 Removable to the receiving hole of the first plate The size of the aperture of the receiving hole can be designed according to the expansion and contraction condition of the first substrate to be attached, so that when the first substrate to be bonded is expanded and contracted, only the positioning column needs to be moved to adjust the positioning column. The position of the first plate body in the receiving hole can be adapted to the deviation of each first hole on the first substrate, and is particularly suitable for a large area FPC including a plurality of uncut circuit board units. Improve the fit alignment accuracy and improve the fit efficiency. [Embodiment] [0007] The bearing fixture provided by the present technical solution will be further described in detail below with reference to the accompanying drawings and the embodiments. [0008] Referring to FIG. 1 and FIG. 2 together, the first embodiment of the present invention provides a bearing fixture 10 for positioning a first substrate and a second substrate to be bonded. The first substrate has a plurality of first holes. The second substrate has a plurality of second holes that are in one-to-one correspondence with the plurality of first holes. The bearing fixture 10 includes a first plate body 11, a second plate body 12, a plurality of positioning posts 13 and a plurality of fixing members 14. [0009] The first plate body 11 may be a rectangular plate body having a first surface 110 and a second surface 111 opposite to each other. The first surface 110 and the second surface 111 are each approximately a rectangular surface. The first plate body 11 may be made of steel or aluminum having high heat conduction efficiency. The first plate body 11 has a plurality of receiving holes, a plurality of first fixing holes 112 and a plurality of first guiding holes 113. The plurality of accommodating holes correspond to the position of the plurality of first holes. The plurality of receiving holes includes a first reference hole and at least one first adjusting hole, and the first reference hole has a smaller aperture than the first adjusting hole. Each of the accommodating holes is a blind hole opened from the second surface 111 toward the first surface 110. Each of the contents 099103033 Form No. A0101 Page 6 of 28 0992005738-0 201129274 The Ο holes each have a bottom wall 114 for carrying the positioning post 13, which is a smooth plane parallel to the second surface 111. The accommodating hole may have a circular cross section. In this embodiment, the number of the accommodating holes is four, and is arranged in an array at the center of the first surface 111. The four accommodating holes are respectively the first accommodating hole 115 and the second accommodating hole. 116. The third receiving hole 117 and the fourth receiving hole 118. The first receiving hole 115 and the second receiving hole 116 are close to one of the long sides of the second surface 111, and the third receiving hole U7 and the fourth receiving hole 118 are close to the other long side of the first surface in. The first receiving hole ns is a first reference hole, and the second receiving hole 116, the third receiving hole u7 and the fourth receiving hole 118 are both first adjusting holes. The apertures of the second accommodating hole 116 and the third accommodating hole 117 are equal to each other and are larger than the aperture of the first accommodating hole 115. The plurality of first fixing holes 112 penetrate through the first surface 11 〇 and the second surface m, and each of the first fixing holes 112 has an internal thread. In this embodiment, the number of the first fixing holes 112 is four, and each of the first fixing holes 112 is close to an apex angle of the first plate body u. The plurality of first guiding holes 113 also penetrate the first surface 11A and the second surface 1U. In this embodiment, the number of the first guiding holes 113 is two, and one first guiding hole 113 is adjacent to one short side of the second surface U1 and substantially between the two first fixing holes 112, and the other first guiding The hole 113 is adjacent to the other short side of the second surface ill and is located substantially between the other two first fixing holes 112. [0010] The second plate body 12 is disposed opposite to the first plate body 。. The second plate body 12 has opposite third and second surfaces 12 and 121. The third surface 120 is adjacent to the first plate 11 and opposite the second surface ill. The fourth surface 121 is away from the first plate body u. The second plate body 12 099103033 Form number Α0Μ Page 7 of 28 〇992〇〇5738-0 201129274 It can also be made of steel or aluminum with high thermal conductivity. The second plate body 12 has a plurality of positioning holes 122, a plurality of second fixing holes 123 and a plurality of second guiding holes 124. The plurality of positioning holes 122 are paired with the plurality of receiving holes. Specifically, the plurality of positioning holes 122 correspond to the positions of the plurality of receiving holes, and thus also correspond to the positions of the plurality of first holes. Each of the positioning holes 122 is a through hole penetrating the third surface 120 and the fourth surface 121. In this embodiment, the number of the positioning holes 122 is four, and the apertures are the same, and the four positioning holes 122 are arrayed at the center of the fourth surface 121. Arrange. The plurality of second fixing holes 123 penetrate through the third surface 120 and the fourth surface 121, and each of the second fixing holes 123 also has an internal thread. In this embodiment, corresponding to the plurality of first fixing holes 112, the second fixing holes 123 are also four, and each of the second fixing holes 123 is adjacent to a top corner of the second plate body 12. . The plurality of second guiding holes 124 also penetrate the third surface 120 and the fourth surface 121. In this embodiment, corresponding to the plurality of first guiding holes 113, the second guiding holes 124 are also two, and a second guiding hole 124 is adjacent to one of the short sides of the fourth surface 121, and is basically Located between the two second fixing holes 123, the other second guiding hole 124 is adjacent to the other short side of the fourth surface 121 and substantially located between the other two second fixing holes 123. [0011] The plurality of positioning posts 13 correspond to the plurality of receiving holes, each of the positioning posts 13 includes a receiving portion 130 and a positioning portion 131, and the receiving portion 130 is received in the The positioning hole 131 passes through the positioning hole 122. The diameter of the positioning portion 131 is smaller than the diameter of the receiving portion 130. The accommodating portion 130 and the positioning portion 131 are substantially cylindrical, 099103033 Form No. A0101 Page 8 / Total 28 Pages 0992005738-0 201129274 Ο The accommodating portion 130 has a chamfer away from the positioning portion 131. The positioning portion 131 has a diameter smaller than an aperture of the positioning hole 122, equal to an aperture of the first hole and the second hole, so as to movably pass through the positioning hole 122 corresponding thereto, and the first substrate The first hole cooperates with the second hole of the second substrate to position the first substrate and the second substrate on the second plate body 12. In this embodiment, corresponding to the plurality of receiving holes, the positioning ports 13 are also four. The diameter of the receiving portion 130 of the positioning post 13 is exactly equal to the diameter of the first receiving hole 115 as the first reference hole, and is smaller than the second receiving hole 116, the third receiving hole 117 and the fourth receiving hole. The aperture of the aperture 118 is placed. Therefore, the positioning post 13 corresponding to the first receiving hole 115 is positioned in the first receiving hole 115 of the first plate body 11 , and the remaining positioning posts 13 are movably disposed. The accommodating hole corresponding to the first plate body 11 and the positioning hole 122 corresponding to the second plate body 12 are corresponding. [0012] Ο the plurality of fixing members 14 corresponding to the plurality of first fixing holes 112-, for cooperating with the first fixing holes 112 and the plurality of second fixing holes 123 to the first plate body 11 is fixed to the second plate body 12. The plurality of fixing members 14 have a diameter matching the first fixing hole 112 and the second fixing hole 123, that is, just passing through the first fixing hole 112 and the second fixing hole 123. The fixing member 14 further has a thread adapted to match the internal threads of the first fixing hole 112 and the second fixing hole 123. In this embodiment, corresponding to the plurality of first fixing holes 112, the plurality of fixing members 14 are also four. [0013] 099103033 Of course, the apertures of the second receiving hole 116, the third receiving hole 11 7 and the fourth receiving hole 11 8 as the first adjusting hole are not necessarily required to be equal, and each form number is Α0101 9 pages / total 28 pages 0992005738-0 201129274 The aperture of the first adjustment hole may be determined according to the expansion ratio of the first substrate and the position of the first plate body 11 of the first adjustment hole, as described The difference between the aperture of the first adjustment hole and the diameter of the positioning portion 131 of the positioning post 13 is equal to the product of the expansion ratio of the first substrate and the distance between the first adjustment hole and the first reference hole. Therefore, the accuracy of the alignment adjustment can be improved. [0014] It can be understood that the number of the accommodating holes, the locating holes 122 and the positioning posts 13 is not limited to four, and the accommodating holes and the locating holes 122 are distributed. It is not limited to the array arrangement, and can be correspondingly designed according to the actual needs of the first substrate and the second substrate to be bonded. [0015] Referring to FIG. 3 to FIG. 6 , when the first substrate and the second substrate are pressed by the carrier jig 10 provided in the first embodiment of the present technical solution, the following steps may be adopted: [0016] In the step, the first substrate 100, the second substrate 200, the hot pressing device 300, and the carrying jig 10 as described above are provided. [0017] The first substrate 100 may include a plurality of circuit board units 101, and the first substrate 100 is provided with a plurality of first holes. The aperture of the first hole is equal to the diameter of the positioning portion 131 of the positioning post 13 such that the positioning portion 131 of the positioning post 13 passes through the first hole 102. In the embodiment, the first substrate 100 is a flexible circuit board including two circuit board units 101, and each circuit board unit 101 is provided with two first holes 102 so as to be on the first substrate 100. A total of four first holes 1 0 2 are opened. [0018] The second substrate 200 corresponds to the plurality of circuit board units 101, and the second substrate 200 is provided with a plurality of second holes 201. The second hole 099103033 Form No. A0101 Page 10 / Total 28 page 0992005738-0 201129274 [0019] The aperture of 2〇1 is equal to the diameter of the positioning portion 131 of the positioning post 13 so that the positioning post 13 The positioning portion 131 just passes through the second hole 2〇1. In this embodiment, the second substrate 200 is two, and each of the second substrates 2 is provided with two second holes 201. It can be a reinforcing plate with a heat curing glue. Preferably, the expansion ratio of the second substrate 200 is equivalent to the expansion ratio of the first substrate 1 . The hot pressing device 300 includes a heating table 3〇1 and a pressing block 3〇2 disposed opposite to each other. The heating table 301 may have a horizontal wearing area larger than the first plate square plate, and a plurality of guiding columns 3〇3 extending therefrom, the plurality of guiding columns and the first plate body 11 being plural first guiding holes 113 And a plurality of second guiding holes 124 of the second plate body 12 are correspondingly configured to cooperate with the plurality of first guiding holes 11 3 and the plurality of second guiding holes 24 to position the bearing fixture i 于The hot pressing device 300. Corresponding to the plurality of first guiding holes 113, the guiding posts 303 are two. The block 3〇2 is used to apply dust to the first substrate 100 and the first substrate 200. The pressing block 3〇2 is adjacent to the surface of the heating table 301 and has a hole or a groove corresponding to the plurality of positioning holes 13 of the bearing fixture 1〇, so that the pressing piece 3〇2 can be Contacting the second substrate 200 and pressing the first substrate 1 〇〇 and the second substrate 2 , without being protruded from the positioning 杈 13 of the second substrate 200 to resist the second step, the first The substrate (10) and the second substrate 200 are positioned by the carrier fixture 10. [0021] First, one of the plurality of positioning pins 13 of the wire (4) is passed through a plurality of first holes of the first substrate pair, and the first substrate 10G is placed on the second plate 099103033 12 at this time. The position of the 丄3 placed on the accommodating hole does not correspond to the position of the first hole of the first substrate 100, and the positioning (4) can be moved so that the form number A0101 page 11/28 page 0992005738-0 201129274 has the positioning column 13 It can pass through the first hole corresponding to it. Specifically, one of the plurality of positioning posts 13 can be fixed, and the positioning post 13 is aligned with the first hole corresponding to the first substrate 1 ,, and then the positions of the remaining positioning posts 13 are adjusted to make the remaining plural The positioning post 13 - is aligned with the remaining plurality of first holes on the first substrate 1 . [0025] [0024] [0025] The plurality of positioning posts 13 of the bearing fixture 10 are passed through a plurality of second holes of the second substrate 200, and the second substrate 20 is placed Above the first substrate 100. In the third step, the first substrate 100 positioned on the carrier jig 10 and the second substrate 200 are pressed together by the heat pressing device 300. Specifically, the guiding column 303 of the hot pressing device 300 can be sequentially passed through the first guiding hole 113 of the first plate body 11 and the second guiding hole 124 of the first plate body 12, and the first substrate 100 and the first substrate are positioned. The bearing fixture 10 of the second substrate 200 is placed on the heating table 301 of the hot pressing device 3, and the carrying fixture is heated, and the first substrate 100 and the second substrate 200 are applied by the pressing block 302. Pressing, the first substrate 1A and the second substrate 200 are pressed together. Referring to FIG. γ and FIG. 8 together, the bearing fixture 20 provided in the first embodiment of the present technical solution is substantially the same as the bearing fixture of the first embodiment, and is different from the plural housing of the first board. The apertures of the holes are equal, and the apertures thereof are all larger than the diameter of the receiving portion 230 of the positioning post 23. The plurality of positioning holes of the second plate body 22 include a second reference hole and at least one second adjustment hole. The aperture of the aperture of the second reference hole is exactly equal to the diameter of the positioning portion of the positioning post such that the second reference hole is just traversable by the positioning portion 231 of the positioning post 23. The aperture of the plurality of second adjustment holes is according to the first base 099103033, the form number Α 0101, the 12th page, the total expansion ratio of the board, and the second plate body 2 2 The difference between the aperture of the second adjustment hole and the diameter of the positioning portion 231 of the positioning post 23 is equal to the expansion ratio of the first substrate and the distance between the second adjustment hole and the second reference hole. The product, that is, the maximum value of the positioning portion 231 of the positioning post 23 movable in the second adjustment hole is the product of the expansion ratio of the first substrate and the distance between the second adjustment hole and the reference hole . The expansion ratio of the first substrate can be measured by using a special device. For example, the second plate body 22 has four positioning holes, and the four positioning holes are a first positioning hole 222, a second positioning hole 223, a third positioning hole 2 24 and a fourth positioning hole 22 5 . The first positioning hole 2 2 2 and the first: ..... . . . - ' ·. ":: ..... The two positioning holes 223 are close to one long side of the second plate body 22, The third positioning hole 224 and the fourth positioning hole 225 are adjacent to the other long side of the second plate body 22. If the first positioning hole 222 is defined as the second reference hole, the second positioning hole 223, the third positioning hole 224 and the fourth positioning hole 225 are both the second adjustment holes. It is assumed that the expansion ratio of the first substrate is φ, the distance between the second positioning hole 223 and the first positioning hole 222 is D1, and the distance between the third positioning hole 224 and the first positioning hole 222 is D2, and the fourth positioning hole 225 The distance from the first positioning hole 222 is D3. The diameter D0 of the first positioning hole 2i2 is exactly equal to the diameter of the positioning portion 231 of the positioning post 23 such that the first positioning hole 222 can pass through the positioning portion 231 of the positioning port 23. The aperture of the second positioning hole 223 is d〇+D1*P, the aperture of the second positioning hole 223 is D0+D2*<p, and the aperture of the third positioning hole 224 is D0 + D3*p. Therefore, the positioning post 23 corresponding to the first positioning hole 222 is positioned in the first positioning hole 222 of the second plate body 22, and the remaining positioning posts 23 are movably disposed. The accommodating hole corresponding to the first plate body 21 and the positioning hole corresponding to the second plate body 22 are corresponding. Thus, when the first substrate is positioned on the bearing fixture 2〇 099103033 Form No. A0101 Page 13 / Total 28 Page 0992005738-0 201129274 There is a third clamping hole 222 and a corresponding positioning post 23 as a reference, only two Locating the first hole corresponding to the first positioning hole 222 and the positioning post 23 on the first substrate and then slightly repositioning the remaining positioning posts 23 can quickly align the position, eliminating the need to match the plurality of positioning plates 23 with the plurality of first holes The steps. In addition, since the holes k of the first clamping hole 223, the third positioning hole 224, and the fourth positioning hole 225 have been designed according to the corresponding hole on the first substrate, the corresponding design is The fine adjustment of the remaining positioning posts 23 is also within the range of the expansion and contraction ratio, so that the alignment accuracy can be further improved [0026] [0028] [0030] [0031] Tian Ran' as the second The apertures of the second positioning hole 223, the third positioning hole 224 and the fourth fixing hole of the adjusting hole may also be equal, and both are larger than the diameter of the positioning portion 231 of the positioning post 23.
“上所述’本發明確已符合發明專利之要件，遂依法提 出專利_請。W 准，以上所述者僅為本發明之較佳實施方 舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ’皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案第一實施例提供之承載治具之分解示意 圖。 圖2係本技術方案第一實施例提供之承載治具之立體圖。 圖3係使用本技術方案第一實施例提供之承載治具定位第 一基板與第二基板之示意圖。 圖4係圖3沿IV-1V線之剖視圖。 099103033 表單編號A0101 第14頁/共28頁 0992005738- 201129274 [0032] 圖5係圖3沿V-V線之剖視圖。 [0033] 圖6係對定位於本技術方案第一實施例提供之承載治具之 第一基板與第二基板進行壓合之示意圖。 [0034] 圖7係本技術方案第二實施例提供之承載治具之第一定位 孔與第二定位孔與定位柱之配合剖面示意圖。 [0035] 圖8係本技術方案第二實施例提供之承載治具之第三定位 孔與第四定位孔與定位柱之配合剖面示意圖。 〇 [0036] 【主要元件符號說明】 承載治具：10、20 ' [0037] 第一板體：11、21 [0038] 第二板體：12、22 [0039] 定位柱：13、2 3 [0040] 固定件：14 [〇〇41] 〇 [0042] 第一表面：110 第二表面：111 [0043] 第一固定孔：112 [0044] 第一導向孔：113 [0045] 底壁：114 [0046] 第一容置孔：115 [0047] 第二容置孔：116 [0048] 第三容置孔：11 7 099103033 表單編號A0101 第15頁/共28頁 0992005738-0 201129274 [0049] 第四容置孔： 118 [0050] 第三表面：120 [0051] 第四表面：1 21 [0052] 定位孔：122 [0053] 第一定位孔： 222 [0054] 第二定位孔： 223 [0055] 第三定位孔： 224 [0056] 第四定位孔： 225 [0057] 第二固定孔： 123 [0058] 第二導向孔： 124 [0059] 容置部：130 、230 [0060] 定位部：131 、231 [0061] 第一基板：100 [0062] 第二基板：200 [0063] 電路板單元： 101 [0064] 第一孔：10 2 [0065] 第二孔：201 [0066] 熱壓裝置：300 [0067] 加熱台：3 01 099103033 表單編號A0101 第16頁/共28頁 0992005738-0 201129274 [0068] 壓塊： [0069] 導向柱 302 ：303"The above description" has indeed met the requirements of the invention patent, and the patent is filed according to law. The above is only the preferred embodiment of the present invention. Those who are familiar with the skill of the present invention are entitled to the spirit of the present invention. The equivalent modifications or variations are to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a carrier fixture provided by a first embodiment of the present technical solution. FIG. 2 is a schematic diagram of the technical solution. FIG. 3 is a schematic view showing the positioning of the first substrate and the second substrate by using the bearing fixture provided in the first embodiment of the present technical solution. FIG. 4 is a cross-sectional view taken along line IV-1V of FIG. Figure 5 is a cross-sectional view along line VV of Figure 3. [0033] Figure 6 is a pair of carrier fixtures provided in the first embodiment of the present technical solution. FIG. 7 is a schematic cross-sectional view of a first positioning hole and a second positioning hole and a positioning post of the bearing fixture provided by the second embodiment of the present technical solution. [0034] FIG. [0035] FIG. 8 is a schematic cross-sectional view showing a third positioning hole and a fourth positioning hole and a positioning post of the bearing fixture provided by the second embodiment of the present invention. [0036] [Main component symbol description] :10,20 ' [0037] First plate: 11, 21 [0038] Second plate: 12, 22 [0039] Positioning post: 13, 2 3 [0040] Fixing member: 14 [〇〇41] 〇 [0042] First surface: 110 Second surface: 111 [0043] First fixing hole: 112 [0044] First guiding hole: 113 [0045] Bottom wall: 114 [0046] First receiving hole: 115 [0047] ] Second accommodating hole: 116 [0048] Third accommodating hole: 11 7 099103033 Form number A0101 Page 15 / Total 28 page 0992005738-0 201129274 [0049] Fourth accommodating hole: 118 [0050] Third surface : 120 [0051] Fourth surface: 1 21 [0052] Positioning hole: 122 [0053] First positioning hole: 222 [0054] Second positioning hole: 223 [0055] Third positioning hole: 224 [0056] Fourth Positioning hole: 225 [0057] Second fixing hole: 123 [0058] Second guiding hole: 124 [0059] accommodating portion: 130, 230 [0060] Positioning portion: 131, 231 [0061] First substrate: 100 [0062] Second substrate: 200 [0063] Circuit board unit: 101 [0064] First hole: 10 2 [0065] Second hole: 201 [0066] Hot pressing device: 300 [0067] Heating Table: 3 01 099103033 Form No. A0101 Page 16 / Total 28 Page 0992005738-0 201129274 [0068] Clamp: [0069] Guide post 302 : 303
099103033 表單編號A0101 第17頁/共28頁 0992005738-0099103033 Form number A0101 Page 17 of 28 0992005738-0