WO2009063546A1 - Heatsink - Google Patents

Heatsink Download PDF

Info

Publication number
WO2009063546A1
WO2009063546A1 PCT/JP2007/071948 JP2007071948W WO2009063546A1 WO 2009063546 A1 WO2009063546 A1 WO 2009063546A1 JP 2007071948 W JP2007071948 W JP 2007071948W WO 2009063546 A1 WO2009063546 A1 WO 2009063546A1
Authority
WO
WIPO (PCT)
Prior art keywords
heatsink
heat dissipating
dissipating fins
electronic device
fastening screws
Prior art date
Application number
PCT/JP2007/071948
Other languages
French (fr)
Japanese (ja)
Inventor
Akira Sawada
Hideaki Matsumoto
Minoru Fujii
Takaharu Izuno
Kenji Joko
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/071948 priority Critical patent/WO2009063546A1/en
Priority to JP2009540989A priority patent/JP5278329B2/en
Publication of WO2009063546A1 publication Critical patent/WO2009063546A1/en
Priority to US12/662,913 priority patent/US20100218929A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heatsink (1) comprises heat dissipating fins (11) for dissipating heat from an electronic device provided on a printed board. The heat dissipating fins (11) constituting the heatsink (1) have an optional diameter. The heat dissipating fins (11) are connected with each other by inserting a pair of fastening screws (17) to through holes (14) bored in the respective heat dissipating fins (11) and screwing and fastening the tips of the fastening screws (17) into the screw holes (16) in a base heatsink (15) fixed to the upper surface of the electronic device (A).
PCT/JP2007/071948 2007-11-12 2007-11-12 Heatsink WO2009063546A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2007/071948 WO2009063546A1 (en) 2007-11-12 2007-11-12 Heatsink
JP2009540989A JP5278329B2 (en) 2007-11-12 2007-11-12 heatsink
US12/662,913 US20100218929A1 (en) 2007-11-12 2010-05-11 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/071948 WO2009063546A1 (en) 2007-11-12 2007-11-12 Heatsink

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/662,913 Continuation US20100218929A1 (en) 2007-11-12 2010-05-11 Heat sink

Publications (1)

Publication Number Publication Date
WO2009063546A1 true WO2009063546A1 (en) 2009-05-22

Family

ID=40638402

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/071948 WO2009063546A1 (en) 2007-11-12 2007-11-12 Heatsink

Country Status (3)

Country Link
US (1) US20100218929A1 (en)
JP (1) JP5278329B2 (en)
WO (1) WO2009063546A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101405402B1 (en) * 2013-02-13 2014-06-11 (주)버금기술 Lead frame

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5573601B2 (en) * 2010-10-29 2014-08-20 アイシン・エィ・ダブリュ株式会社 Board condensation prevention structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04130759A (en) * 1990-09-21 1992-05-01 Nec Corp Heat sink
JPH0631151U (en) * 1992-09-18 1994-04-22 安藤電気株式会社 IC fin structure
JPH06291225A (en) * 1993-04-05 1994-10-18 Toshiba Corp Semiconductor device
JPH07183432A (en) * 1993-12-24 1995-07-21 Nec Corp Semiconductor package provided with heat sink
US5654587A (en) * 1993-07-15 1997-08-05 Lsi Logic Corporation Stackable heatsink structure for semiconductor devices
JP2005086019A (en) * 2003-09-09 2005-03-31 Shindengen Electric Mfg Co Ltd Heat radiating structure of power supply apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3372733A (en) * 1964-02-11 1968-03-12 Russell J. Callender Method of maintaining electrical characteristics of electron tubes and transistors an structure therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04130759A (en) * 1990-09-21 1992-05-01 Nec Corp Heat sink
JPH0631151U (en) * 1992-09-18 1994-04-22 安藤電気株式会社 IC fin structure
JPH06291225A (en) * 1993-04-05 1994-10-18 Toshiba Corp Semiconductor device
US5654587A (en) * 1993-07-15 1997-08-05 Lsi Logic Corporation Stackable heatsink structure for semiconductor devices
JPH07183432A (en) * 1993-12-24 1995-07-21 Nec Corp Semiconductor package provided with heat sink
JP2005086019A (en) * 2003-09-09 2005-03-31 Shindengen Electric Mfg Co Ltd Heat radiating structure of power supply apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101405402B1 (en) * 2013-02-13 2014-06-11 (주)버금기술 Lead frame

Also Published As

Publication number Publication date
JPWO2009063546A1 (en) 2011-03-31
JP5278329B2 (en) 2013-09-04
US20100218929A1 (en) 2010-09-02

Similar Documents

Publication Publication Date Title
EP1995775A3 (en) Semiconductor device with stress reducing element
US7969742B2 (en) Bracket for mounting heat sink
EP1827070A3 (en) Thermal management of electronic devices
EP1853097A3 (en) Wedgelock device for increased thermal conductivity of a printed wiring assembly
ATE532400T1 (en) HEAT-CONDUCTIVE MOUNTING ELEMENT FOR ATTACHING AN EMBLED CIRCUIT BOARD TO A HEATSINK
WO2006029265A3 (en) Liquid cooled heat sink with cold plate retention mechanism
EP1858077A3 (en) Heat sink electronic package having compliant pedestal
EP1781076A3 (en) Electronic assembly having multiple side cooling and method
TW200709766A (en) Flexible circuit board with heat sink
WO2006099936A3 (en) Device and method for determining the temperature of a heat sink
ATE433276T1 (en) INVERTER
WO2008078587A1 (en) Light emitting device, display device and solid-state light emitting element substrate
EP2498288A3 (en) Circuit board using heat radiating member, electronic module and method for manufacturing the module
JP2018190914A5 (en)
EP1753277A3 (en) Wiring circuit board
TWI256285B (en) Mounting system for high-mass heatsinks
EP1848036A3 (en) Power module
ATE547828T1 (en) BUSBAR DEVICE AND CIRCUIT BOARD MOUNTED THEREFOR
WO2008014325A3 (en) An assembly for mounting electronic components, methods of use and manfacture thereof
TW200802762A (en) Heat sink, electronic device, and tuner apparatus
DE60331272D1 (en) Electronic arrangement with improved heat sink
WO2009063546A1 (en) Heatsink
PL1987915T3 (en) Apparatus for fabricating a plurality of turbine components
EP1715732A3 (en) Printed circuit board structure having a layer at one of its surfaces for dissipating heat by convection
TW200617643A (en) Computer having thermoelectric device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07831678

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009540989

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07831678

Country of ref document: EP

Kind code of ref document: A1