201128195 六、發明說明： 【發明所屬之技術領域】 ^發暇涉及LSI等電子設触財，用婦查形成於半導 ^ =峨辨德㈣彻+_鴨_體；特 於針對排·半導體W上的電路料（電極塊 (pad))，在晶圓狀態下接觸探針，以 氣導^ ㈣、、“敎+¥體晶片電 轧導通之探針測试(probmg test)的探 【先前技術】 口、 隨著半導财術的進步，喊升了電子設制縣度，並增 加各+導體晶片上的電路端子（電極塊）數，並隨之縮小電極塊 的面積、且依雜關距的狹,Mb，猶修_排職 化發展。 另-方面’在透過探針群（探針）以電氣連接半導體電路之 ，極塊的半導體電路檢查用探針卡中，則實施了隨增加半導體 晶片上的電極塊數、縮小電極塊面積'及電極塊間距的狹小化的 焉密度探針排列。 -般而言，探針卡如日本特開2_—G755Q3號公報所示，在 週邊具有連接檢查裝置之標準稀疏間距的料（land)、或通孔 (toaigh hole)的印刷電路板中央部位，配置了排列於狹間距的 探針組裝體，且為了將探針組裝體附近的高密度配線，變換成共 通配線電路板週邊部之標準稀疏間距的電極塊或通孔，因而透過 軟排線(Flexible Flat Cable)以進行連接。 此外，如日本特開2007-279009號公報所示，探針組裝體是 201128195 用黏著鋼合金S的樹脂勝膜，且働以咖⑹加卫該銅合金落 後’在樹脂顧上形成含有探針及輸出端子部的導電部，再層磨 數片樹脂賴騎，·且輸出端子部财層虔樹脂軸探針時，曰讓 各配置位置轉關距触财式，形❹各樹卿膜；藉此可 在探針組裝_近m難度的稀㈣輯接於印刷電路 板，以為削減印刷電路板層數、與簡化配線帶來貢獻，· 但如日本特開2003-075503號公報所示，在^接軟排線一 端的線制連接方法中，為了 _更進—步的關距化、多插銷 (_)化或不同的半導體電路的電極塊排列，會遇到因軟排線擁塞 而難以封裝、與難以較連接部馳置/射度問題。 ^卜，如曰本特開2007_㈣〇9號公報所示在僅於印則 路板表面層實施從探針組裝職出端子崎 一步因應狹間距化，因此合發生為了更请 探針的問題。^發生夕層印刷電路板、大麵脂咖 專利文獻1特開2003-075503號公報 專利文獻2特開2007-279009號公報 【發明内容】 所欲解決的問題點： 本發明為了触上關題，目吨 探針組㈣、及維持稀疏間二態的印刷 電路板、或與端子連接器的連接端子 j 施狹間距半導體晶片的電氣雖檢查 片上的電極塊賴距，·發之探針妙=狀賴+導體曰曰 ,4木針、'且裴體的探針台裝置上，藉 4 201128195 裝置。 本發明的技術手段： 置 之讓，針接觸受檢半導體晶片，並透過探針在檢查裝 之間進仃電_接物針Μ置上 端子，而酬排列包含該輪接連、^針的輸出 輸出鳊子的禝數探針群，以形成出數層 mr及在料轉難*上黏著娜成出配線 、1 S且讓形成於第n層配線電路板-端的焊墊排列群、 j針組裝體第η列的輸出端子群接觸後，將形成於該配線電路 ^另一端的配線端子’連接於共通配線電雜或端子連接器，以 構成出電氣連接較檢铸體^與檢查裝置。 ★此外，本發明則藉由形成於配置在第η層配線電路板下端之 第η+1層的。卩刀配線電路板’及包含相當於和探針組裝體第η + ι 列之輸出端子群相互接觸的料制群上方㈣η層，以將開口 部設置於自第η層起算之上端配線電路板的非導電部、或導電部 的-部份’以便讓探針組錢的輸出端子群，得以直接連接配線 電路板的中闕，並構成出可用狹間距輸出端子進行連接。 此外’本發明是以軟排線，構成出配線電路板各層的一部分 或全部。 另外，本發明是以整體多層印刷層壓電路板，構成出配線電 路板各層的一部分或全部。 此外，本發明藉由在配線電路板的配線端子、與共通配線電 路板之間’ S置變換電路基板，以形成出可因舰有共通配線電 路板的構成。 201128195 工該裝體是以黏著銅合金糾樹脂膠膜，經侧加 心r，D錢在細旨賴上形成含嫌針及輸出端子部的導 A «，支雜層驗#樹轉麟針者所構成。 f位^輸Γ子部在驗樹轉聰針時，則轉間距讓各配 置，曰位的方^，形成於各樹脂咖上所構成。 “於層£削述樹脂膠膜探針的支撐棒、與前述配線電路板， ^藉由δχ置於同—支撑台上的域體，·少受到χγ平面方向 (曰曰圓平面方向）而拘束的方式所構成。 上述支撐 的熱膨脹係數’則由至少與半導體晶圓 係數近似㈣料所職。 明…私脹 對照先前技術之功效： 山根據本發明之探針台裝置，在於提供具有直接連結探針的輸 出端子’而細㈣包含該輸出端子的複數騎群，以形成出數 層-體化的探針組裝體及配線電路板，且讓形成於第η層配線電 路板-端的焊塾排列群、與探針組裝體第η列的輸出端子群接觸 下所構成’並藉由解決以狹間距組裝而成的探針組裝體、與維持 稀疏間距的印猶職、或與端子辆阶瞻咖)連接端子之 間的連接問題，以容易實施狹間距半導體晶片的電氣特性檢查， 及價格低廉的探針台裝置。 【實施方式】 以下針對本發明實施型態，參考圖面進行詳細說明；圖ι為 本發明第1實施賴®，且屬探針台裝置概略結構斜視圖；圖2 為配置於圖1所示之探針台裝置中央部分聰顺賴剖視詳細 201128195 •囷3及圖4為探針組裝體構成圖，圖5為圖1中央部分正視 圖，圖6為探針組裝體、配線電路板與共通電路板之間的固定位 置關係剖視圖。 a圖1及圖2所示之探針台裝置，是由以下各部分所構成；i ^探^組裳體、2為排列於關等受檢電子設備的㈣輸出入用 電極塊、3為配線電路板、4為共通配線電路板、10為探針； 仏針ίο是由導電性材料所構成，中途有彎曲部13，以直接連結輸 出端子14 ’在複數探針1〇的匯集下，藉由接觸各配線鐵線，以構 =出#木針組|體，在此實施型態中，圖2的複數探針Μ則有探針 1(H、10-2、IQ-3、1G-4，對圖2紙面呈垂直的方向（深度方向） 上:則在探針1G-1的後方，以1()_2所㈣隙所設置而成，以下 =同樣如1G-3、1G-4所示’以逐—規定的間隙所設置而成；同樣 在配線電路板3上’設置了接觸上述探針1G-1〜1(M的輸出 2專用焊塾33+ 33-2、33-3、33-4 ;探針組裝體丨，則以因 極塊2配置的方式’規則排列與固定複數探針10 :配線電路 =則错由侧或黏著等方式，形成於朝水平方向延伸的非導電 >、面且具有銅4等金屬_所做成的複數配線圖32。 膠膜31及配線圖（wiring patten〇32，則以垂直方向的所定 配^配置出形成11個層；在圖2所示事例中，層數為4,將各層 2^圖32定為由上起算第1層、第2層、第3層、第4層後，第 配線圖32一2，則比第1層的配線圖324更延伸到另-端；第 配線圖32—3 ’則比第2層配線圖32-2更延伸到另-端，因此 方平視％是以路出各層配線圖32前端的方式所配置而成； 201128195 而且，各層配線圖32+32m 端子專用焊墊糾、33—2、33_3、33_4;因^ ’則連接了輸出 33-1、…、33~4，則各自相互朝不同於圖2左右』=用焊塾 直方向偏位的方式所配置；再者，在圖2 向、及垂 開所定間隔後，整列配置數個輸出端子專用’朝垂直方向隔 形成於配線電路板3 -端的焊塾排_ 33~1 ’以構成出 自 以構成出形成於配線電路板3 一端的群整列配置複數個’ 來:===:，、— 子前端部中的探針1(H的輸出端垂延伸；這些輸出端 糾對齊，以下亦同的探針向輸出端子專用焊塾 出端子專用焊墊33_2、3彳q QQ μ 10~4輸出端子，則向輸 ㈣輸出端子前端部H對齊的同時，各探樣1、…、 33+33-2、33_3、33_4 f各相應的輸出端子專用桿塾 出端子、與輸出端子專用焊塾、··.、1〇-4輸 而在探針10側，探針㈣ ~2、33H4的接觸， 更加延伸到另-端，且輸出端外的探務1 針10-2更加延伸到另一端，且 下方，探針10-3則比探 設定；藉此讓探針1(H、···、I端子則朝下延伸的方式予以 ^方向'妓直扣偏子21^目朗_不同於水 ㈣的 m醜咖 2==3-2、33-3' π保針10-1輸出端子，在圖 201128195 2紙面上’朝垂直方向隔開所定間隔後，整列配置複數個，以構成 出雜針輸出端子排列群；關於探針10-1.....10-4的輪出端子 亦同’各在第2 ®紙面上’幅直方向關所定間隔後，整列配 置複數個’崎成各探針輸出端子排列群。 再者，在各層配線圖32_卜32_2、32_3、32_4之間，則配置 了接地構件 3G-1、3G_2、3G_3、3Q_4 ;此接地構件 3(M、3〇 2、 3〇-3、30-4用於縮小各層配線圖32所流動的電流或信號間的串音 (_S talk);換言之’也就是縮小g線； 曰 再者上述各層之配線圖32、及輸出端子專用焊墊33的配置 構成’用於方便理解與說明本發明；若讓上述配置構成更加—船 化的話，那麼第2層配線圖32_2無須採取比第（層配線圖如 更加延伸到另—端的構成，其實第1層配線圖32-1，也可比第2 :=2Γ:延:到另一端;在衡，咖 , "但此日守在第1層配線圖32-1的部分（含膠膜31 貫通孔，以平視麵只要露轉2層配線圖 焊:^上_設第2層_㈣專職出端子專用 2’讀觸因應輸出端子專用焊墊33-2的探針1Q_2輸出 奸前端部；鑽開貫通孔的第i層配線圖32]雖有「斷線」之虞， 但只要讓配絲充分大於貫通孔的直徑，即^ :、第4層之間的關係亦同;因此有時可藉由二： 鑽開跨及2層以上的貫軌。 ㈣祕置構成 此外4 I、通配線電路板，週邊則在 載）上，有因應進行電氣連接之並、£牲—裝置（本圖名略兄 丁冤才又連接之共通精密探針 201128195 =通焊她41域於連脑__—端之共通 板4的通孔。 圖3及圖4為本發明所用之探針1〇的結構、和探針組裝體丄 ^ =圖3卿’探針1Q是倾(beryu_)鱗具導電性且機 械強度_材料所形成，中間部設有平行四邊形㈣部I〗，藉由 彈簧力讓探針前端部U與LSi電極塊2接觸，以獲得⑸之咖 電^㈣-方面，輸出部繼端子14具有彎曲部13，而屬 可=垂直方向（Z方向）吸收外力的結構，藉由推向配線電路板 33，以獲職導通的結構；此外，複數輸 “子Η的輸出位置則如圖3所示，朝向χγζ的3次元直交座標 =各)(向，配僅依序挪動長度ρχ的位置；這些探針則在例 =脂膠膜15上’黏貼上述導電性材料，而得以藉由侧加工製 作出具備所紐密尺柏娜顧探針1〇。 如圖4所示，藉由在樹脂膠膜15所設的孔16上貫通支撐棒 ’以層翻定這簡轉卿針1Q ;簡此在χ向上形成ρχ 咖、及在Υ向上形成具Py間距的探針_體i ;透過週期性的 =在X向具連續性Px不同間距的複數探針群（本圖是以4個構 成的探針群為例示），以因應狹間距的⑶電極塊間輯，且可 形成出變賊轉電職域魏_ ρχ _顺裝體卜 圖5表示因應探針組裝體！之輸出端子14的排列，而在已配 3VI酉 1 線電路板3上，&置輸出端子專用焊塾33之間的關係圖； :，因應探針組裝體丨輸出端子前端部之γ向第丨列⑹，而 设於第1層配線電路板上的焊塾排列群；33_2為因應探針組裝體 201128195 卜子㈣部之Y向第2列14-2 ’而設於第2層配線電路板 向第日，排列群；33'3為因應探針組裝體1輸出端子前端部之γ ° 丨4 3而叹於第3層配線電路板上的焊墊排列群；33-4 第針組敦體1輸出端子前端部之Y向第4列14—4，而設於 2層配線電路板上的焊墊排解；魏置於第η層配線電路板 :山而與形成於第n + 1層配線電路板之探針組裝體1第Π+1列 =輸立出端子群接觸’而相當於電極塊群上方㈣η層配線電路板 輸出端=’，設置開口部34_η ’讓探針組裝體第n+1列的 直接接觸第n+1層配線電路一^ 上述構成要奴探針台裝置__纽功能。 之於中t ，將因應狹間輯，且具魏稀疏X向間距Ρχ 14 1 ’ _定於因聽1電極塊2 細咖路板上（本圖未揭示）；配線電路板3則以被配置 、弟η層配線電路板3—n下端，而與形雜第奸1層配線電路板 ==:的輸出端子群14-，，而相當於輸出 =專叫墊群上方_ n層配線電路板的—部分上，則藉由設 置開口部34-η，讓探針組褒體第_列的輸出端子群 接接觸第n+1層配線電路板上所形成的輸 曰 上’透過支撐纟51等’蝴辦蝴嫩4用另=置 =電路板3的另—端，職由在設於麵崎電 4 =桿墊上，使_具52進行_的方 = 導電膠膜31突靡咖2_，㈣職 201128195 43及中間層44的導體圖案45，連接於週邊的共通焊墊42;再者， 透過共通精密探針46，以讓檢查裝置收受電氣信號。 配線電路板3也可以是複數單層軟排線、或單數或複數多層 層壓軟排線；此外，設於配線電路板3的另一端、與共通配線電 路板4之通孔41之間的連接方法，也可採用端子連接器連接或焊 錫等方式。 圖6為探針組裝體、配線電路板、與共通電路板之間的固定 位置相_視圖；依據相詳細訓各固雜置的_，·圖6中 的51為支撐台、53為設於支樓台51上的支撐體A，上方則有僅 大於層壓樹轉醜針支雜17外徑_触⑽，可高精度维 持支樓棒17 ;另—方面，54為設於支撐台51上的支撐體^配 線電路板3上則有設於僅小於各層共通的基準孔％内徑的胖， 以藉由將支撐體B插入基準孔35，而得以將配線電 工 持於XY杨糾。 π»職雖 高精度維持上職轉難針龍針前端、輸_子 配線電路板之輸出端子專用焊墊之間的位置關係，且至财 撐台的熱膨脹係數，近似於半導體晶圓熱膨服係 如Fe-篇合金），而得以在高溫環境下，不受共通 的熱膨麵騎，硕《絲度維雜針越、輸“ 1 配線電路板之輸出端子專用·之間的位置關係。 - 接下來’關於本發明第2實施型態，則依以下圖 說明；圖7為本實施型態的探針台裝置斜視圖、圖8為該中二 的剖棚、圖9為中央部的正視圖；圖7及圖 12 201128195 疋由以下各分所構成；6為藉由令間絕緣 有銅洛等配線圖62的配線電路板。 戶斤層壓之具 4為共通配線電路板，檢查裝置（本 應電氣連接的共通精密探針46位置的共通谭塾42载)=則有因 接配線電_接軸U5之共通__上^設於連 圖9為設於因應探針組裝體1輸出端子14排列而w ，路板6的輸出端子專用桿塾63之間的關係圖咖為 ^裝體1輸出端子前端部γ向第〗列⑹之第〗層配線上 2列μ之第⑽體1輸出端㈣端部Y向第 乂 2 電路板上的辉塾排列群魯3為設於因應 二，體1輸出端子前端部γ向第3列14—3之第3層g ς 部：=:7/ 63~4為設於因應探針組裝體1輸出端子前端 於第==，層：^ 針组奘笛^ /成於弟n+1層配線電路板之探 列的輸出端子群接觸，而相當於電極塊群上方 4日配線電路板的一部分上’則藉由設置開口部64-n，讓探 2㈣第n+1列的輸出端子群，得以直接接觸第別層配線電 板上所开)成的輸出端子專用焊墊63。201128195 VI. Description of the invention: [Technical field to which the invention belongs] 暇 暇 暇 暇 暇 等 LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI LSI The circuit material (electrode pad) on W contacts the probe in the wafer state, and probes the probmg test with the gas guide ^ (4), "敎+¥ body wafer electric rolling conduction" Prior Art] With the advancement of semi-conducting technology, the number of electronic terminals was increased, and the number of circuit terminals (electrode blocks) on each +-conductor wafer was increased, and the area of the electrode block was reduced. The narrowness of the miscellaneous distance, Mb, and the repairing of the squad. The other aspect is implemented in the probe card for the semiconductor circuit inspection of the semiconductor circuit through the probe group (probe) to electrically connect the semiconductor circuit. A narrower probe array with a smaller number of electrode blocks on the semiconductor wafer, a smaller electrode block area', and an electrode block pitch. - Generally, the probe card is shown in Japanese Patent Laid-Open Publication No. 2_-G755Q3. Standard sparse-spaced land or through-holes connected to the inspection device at the periphery At the center of the printed circuit board of the (toaigh hole), a probe assembly arranged at a narrow pitch is disposed, and the high-density wiring in the vicinity of the probe assembly is converted into a standard sparse-pitch electrode in the peripheral portion of the common wiring board. The block or the through hole is connected through a flexible flat cable. Further, as shown in Japanese Laid-Open Patent Publication No. 2007-279009, the probe assembly is a resin film of 201128195 adhered to the steel alloy S, and働 働 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( (曰 Let each configuration position turn to the touch-off type, and shape each sapphire film; this can be connected to the printed circuit board in the probe assembly _ near m difficulty (four) difficulty, in order to reduce the number of printed circuit boards, and simplify In addition, as shown in Japanese Laid-Open Patent Publication No. 2003-075503, in the wire connection method at one end of the flexible cable, the distance is further increased and the multi-pin (_) is turned on. Or electrode blocks of different semiconductor circuits Columns, it will be difficult to package due to congested flexible cable, and difficult to connect with the connection / radiance problem. ^ Bu, such as 曰本特开2007_(四)〇9 bulletin shown in the surface layer only In the case of the probe assembly, the terminal is in a narrow position, and the problem arises in order to facilitate the probe. ^Generation printed circuit board, large-faced grease, patent document 1 JP-A-2003-075503 The present invention has a problem to be solved. The connection terminal j is electrically connected to the semiconductor wafer of the narrow pitch. Although the electrode block distance on the sheet is checked, the probe is wonderful, the shape is +, the conductor is 曰曰, the 4 wood needle, and the 探针 body of the probe station device is borrowed. 4 201128195 Installation. The technical means of the invention: the needle is contacted with the semiconductor wafer to be inspected, and the terminal is connected to the terminal via the probe through the probe, and the output of the wheel is connected to the terminal. Outputting the number of probes of the dice to form a plurality of layers of mr and bonding the wires to the wire, and 1 s and letting the pad arrays formed at the end of the nth layer of the wiring board, the j pin After the output terminal group of the nth column of the assembly is in contact with each other, the wiring terminal ' formed at the other end of the wiring circuit is connected to the common wiring or the terminal connector to constitute an electrical connection test body and an inspection device. Further, the present invention is formed by the n+1th layer disposed at the lower end of the n-th layer wiring board. a squeegee wiring board' and an upper (four) η layer including a material group corresponding to the output terminal group of the η + ι column of the probe assembly, and the opening portion is provided on the upper end wiring board from the η layer The non-conducting portion, or the portion of the conductive portion, allows the probe output group of the probe group to be directly connected to the middle of the wiring board, and constitutes a narrow-pitch output terminal for connection. Further, the present invention constitutes a part or all of each layer of the wiring circuit board by a flexible wiring. Further, the present invention is an integral multilayer printed laminated circuit board which constitutes a part or all of each layer of the wiring circuit board. Further, according to the present invention, a conversion circuit board is placed between the wiring terminals of the wiring board and the common wiring board to form a common wiring circuit board. 201128195 The body is made of adhesive copper alloy resin film, through the side of the heart r, D money on the basis of the formation of the needle and the output terminal part of the guide A «, the branch layer inspection #树转麟针Composed of. When the f-bit ^ Γ 部 在 在 在 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验"The support rod of the resin film probe is described in the layer, and the wiring board of the above-mentioned wiring board, which is placed on the same support table by δ ,, is less subject to the χ γ plane direction (the circular plane direction) The method of restraint consists of the above-mentioned support thermal expansion coefficient 'is at least similar to the semiconductor wafer coefficient (four) material. Ming ... private inflation against the efficacy of the prior art: Mountain according to the present invention, the probe station device is provided with direct The output terminal of the probe is connected to the fourth and the plurality of quads of the output terminal are arranged to form a plurality of layers of the probe assembly and the wiring board, and the soldering is formed on the end of the n-th wiring board.塾 Alignment group, which is formed in contact with the output terminal group of the n-th column of the probe assembly, and solves the problem of assembling the probe assembly assembled at a narrow pitch, maintaining the sparse spacing, or the terminal The problem of connection between the connection terminals is to facilitate the electrical characteristic inspection of the semiconductor chip with a narrow pitch and the inexpensive probe station device. [Embodiment] The following is an embodiment of the present invention. The first embodiment of the present invention is a perspective view of a probe station device; FIG. 2 is a cross-sectional view of the central portion of the probe station device shown in FIG. Detailed Description 201128195 • Fig. 3 and Fig. 4 are diagrams showing the configuration of the probe assembly, Fig. 5 is a front view of the central portion of Fig. 1, and Fig. 6 is a cross-sectional view showing the fixed positional relationship between the probe assembly, the wiring board, and the common circuit board. The probe station apparatus shown in Fig. 1 and Fig. 2 is composed of the following parts: i ^ probe group body, 2 (4) input/output electrode block, and 3 wiring for the electronic equipment to be inspected, such as off. The circuit board 4 is a common wiring circuit board, and 10 is a probe; the ί needle ίο is made of a conductive material, and has a curved portion 13 in the middle, and directly connects the output terminal 14' to the collection of the plurality of probes 1 , By contacting each of the wiring wires, the structure is a #木针组|body. In this embodiment, the complex probes of Fig. 2 have probes 1 (H, 10-2, IQ-3, 1G- 4, in the direction perpendicular to the paper surface of Figure 2 (depth direction): on the back of the probe 1G-1, set by 1 () 2 (four) gap, The lower = is also set as shown in 1G-3, 1G-4's by the prescribed gap; the same is also provided on the wiring board 3 to contact the probe 1G-1~1 (M output 2 dedicated) Soldering 塾 33+ 33-2, 33-3, 33-4; probe assembly ', regularly arranged and fixed multiple probes 10 in the way of pole block 2 configuration: wiring circuit = wrong side or adhesive In a manner, a plurality of wiring patterns 32 formed by a non-conductive material extending in a horizontal direction and a surface having a metal such as copper 4 are formed. The film 31 and the wiring pattern (wiring patten〇32 are defined in the vertical direction). 11 layers are formed in the configuration; in the example shown in FIG. 2, the number of layers is 4, and each layer 2 is shown as the first layer, the second layer, the third layer, and the fourth layer. The second wiring diagram 32-2 extends to the other end than the wiring pattern 324 of the first layer; the second wiring diagram 32-3' extends to the other end than the second wiring diagram 32-2, so the square视% is configured by way of the front end of each layer wiring diagram 32; 201128195 Moreover, each layer wiring diagram 32+32m terminal special pad correction, 33-2, 33_3, 33_4; because ^ ' then the output 33- 1 ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The terminal-specific 'welding row _ 33~1' formed at the end of the wiring board 3 in the vertical direction is configured such that a plurality of groups are formed from the entire group formed at one end of the wiring board 3: ===: , the probe 1 in the front end of the sub-portion (the output end of H is extended vertically; these output terminals are aligned correctly, and the following probes are also dedicated to the output terminal for soldering out terminal-specific pads 33_2, 3彳q QQ μ 10~ 4 output terminals, when the front end H of the output (four) output terminal is aligned, the respective output terminals of the probes 1, ..., 33+33-2, 33_3, 33_4 f are dedicated to the output terminal and the output terminal is specially soldered.塾,··.,1〇-4 loses on the probe 10 side, the probe (4) ~2, 33H4 contact extends to the other end, and the probe 1 pin 10-2 outside the output end extends to At the other end, and below, the probe 10-3 is set to be probed; thereby the probe 1 (H, . . . , I terminal is extended downward) ^ Direction '妓直扣偏子 21^目朗_ Different from water (four) m ugly coffee 2==3-2, 33-3' π needle 10-1 output terminal, in the picture 201128195 2 on the paper 'vertical vertical After the direction is separated by a predetermined interval, a plurality of columns are arranged to form a cluster of output terminals of the needles; the wheel terminals of the probes 10-1.....10-4 are also the same as on the 2nd paper surface. After the interval of the straight direction is closed, a plurality of 'successful probe output terminal array groups are arranged in the entire column. Furthermore, between the respective layer wiring patterns 32_b 32_2, 32_3, and 32_4, the grounding members 3G-1, 3G_2, 3G_3, and 3Q_4 are disposed; this grounding member 3 (M, 3〇2, 3〇-3, 30) -4 is used to reduce the current flowing between the layers of the wiring pattern 32 or the crosstalk between the signals (_S talk); in other words, 'that is, the g line is reduced; 配线 the wiring pattern 32 of the above layers, and the pad 13 for the output terminal. The configuration "is for facilitating understanding and explanation of the present invention; if the above configuration is more ship-like, then the second layer wiring diagram 32_2 does not need to adopt a ratio (the layer wiring diagram extends to the other end, in fact, the first Layer wiring diagram 32-1, can also be compared to the 2nd:=2Γ: extension: to the other end; in the balance, coffee, "but this part of the first layer wiring diagram 32-1 (including the film 31 through hole As long as the flat view surface is exposed to the 2 layer wiring diagram welding: ^上_Set the second layer _ (four) full-time output terminal dedicated 2 'read contact output terminal special welding pad 33-2 probe 1Q_2 output front end; drill Fig. 32] of the ith layer wiring of the through hole is broken, but the wire is sufficiently larger than the diameter of the through hole, that is, the fourth layer The relationship between the two is the same; therefore, it is sometimes possible to use two: to drill the cross-over and the cross-track of more than two layers. (4) The secret structure is 4 I, the wiring board, and the periphery is on the load). And, the animal - the device (this figure is named after the brother Ding Yucai is connected to the common precision probe 201128195 = through welding her 41 domain in the brain __- end of the common plate 4 through hole. Figure 3 and Figure 4 The structure of the probe 1〇 used in the present invention, and the probe assembly 丄^=Fig. 3's probe 1Q is a tilt (beryu_) scale conductive and mechanical strength_material formed, and the middle portion is provided with a parallelogram (4) Part I, by the spring force, the probe front end portion U is in contact with the LSi electrode block 2 to obtain the (5) coffee circuit (4)--the output portion of the terminal 14 has the curved portion 13, and the genus can be = vertical direction ( Z-direction) structure for absorbing external force, by pushing to the wiring circuit board 33, to obtain the structure of the conduction; in addition, the output position of the complex input "sub-turn" is as shown in Fig. 3, the 3-dimensional orthogonal coordinates toward χγζ = each (toward, match only the position of the length ρχ; these probes are affixed to the above-mentioned guide on the example = grease film 15 The material is formed by the side processing to produce the probe with the button. As shown in Fig. 4, the support rod is passed through the hole 16 provided in the resin film 15 to This is a simple change to the needle 1Q; simply form a ρ 咖 χ χ 及 、 、 、 、 、 、 、 、 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成Group (this figure is exemplified by four probe groups), in order to respond to the narrow spacing of (3) inter-electrode blocks, and can form a thief-turning power domain Wei _ ρ χ _ compliant body Figure 5 shows the response Needle assembly! The arrangement of the output terminals 14 is shown on the 3VI酉1 line circuit board 3, and the relationship between the output terminal dedicated pads 33 is provided; :, in response to the γ direction of the front end portion of the probe assembly body output terminal The second row (6), and the group of solder fillets arranged on the first layer wiring board; 33_2 is provided in the second layer wiring in accordance with the Y to the second column 14-2' of the probe assembly 201128195 The circuit board is arranged on the first day; 33'3 is a group of pad arrays on the third layer wiring board in response to γ ° 丨 4 3 at the front end of the output terminal of the probe assembly 1; 33-4 The Y-direction of the front end of the output body of the assembly body 1 is directed to the fourth column 14-4, and the pads disposed on the two-layer wiring circuit board are disposed; the Wei is placed on the n-th layer wiring circuit board: the mountain is formed in the nth + The probe assembly 1 of the one-layer wiring board 1 +1 column = the terminal group contact 'and the upper of the electrode block group (4) the η layer wiring board output terminal = ', the opening portion 34_η ' is provided for the probe assembly The n+1th column of the body is in direct contact with the n+1th layer wiring circuit. In the middle t, it will respond to the narrow series, and the Wei sparse X-direction spacing Ρχ 14 1 ' _ is fixed on the electrode block 2 of the electrode block 2 (not shown in this figure); the wiring circuit board 3 is configured , the lower layer of the η layer wiring circuit board 3 - n, and the output terminal group 14- of the type 1 wiring board ==:, which is equivalent to the output = the top layer of the pad group _ n layer wiring board In the portion, the output terminal group of the first column of the probe set body is brought into contact with the output port formed on the n+1th layer wiring board by the opening portion 34-n. Wait for 'the butterfly to do the butterfly tender 4 with the other = set = the other end of the circuit board 3, the position is set on the surface of the surface of the 4 = pole pad, so that the _ with 52 _ the side = conductive film 31 sudden coffee 2_ The conductor pattern 45 of the (4) position 201128195 43 and the intermediate layer 44 is connected to the common common pad 42; further, the precision probe 46 is transmitted through the common precision probe 46 to allow the inspection device to receive an electrical signal. The wiring board 3 may be a plurality of single-layer flexible wiring lines or a singular or plural multilayer laminated flexible wiring; in addition, between the other end of the wiring circuit board 3 and the through hole 41 of the common wiring circuit board 4. The connection method can also be connected by means of a terminal connector or solder. 6 is a view of a fixed position of the probe assembly, the wiring board, and the common circuit board; according to the detailed training of each of the _, the 51 in FIG. 6 is a support table, 53 is provided in The support body A on the support tower 51 has a larger outer diameter than the laminated tree, and the outer diameter of the ugly needle is 17 (10), which can maintain the support rod 17 with high precision; on the other hand, 54 is provided on the support table 51. The support body/wiring circuit board 3 is provided with a fat which is set to be smaller than the inner diameter of the reference hole % common to the respective layers, so that the wiring is electrically held by the XY Yang by the support body B inserted into the reference hole 35. Although the high-precision position of the π» job maintains the positional relationship between the front end of the needle-turning needle and the output pad of the output terminal of the input-sub-wiring circuit board, and the thermal expansion coefficient to the support platform is similar to the thermal expansion of the semiconductor wafer. The service is like a Fe-piece alloy, and it is possible to ride in a high-temperature environment without being shared by a common thermal expansion surface. The positional relationship between the output terminals of the 1 "wiring circuit board and the output terminal" - Next, the second embodiment of the present invention will be described with reference to the following drawings; Fig. 7 is a perspective view of the probe station device of the present embodiment, Fig. 8 is a sectional view of the second, and Fig. 9 is a central portion. Fig. 7 and Fig. 12 201128195 疋 is composed of the following sub-fractions; 6 is a wiring circuit board in which the wiring pattern 62 such as paulownia is insulated by the interlude. The ferrule 4 is a common wiring circuit board. Inspection device (common Tan 塾 42 carrying the position of the common precision probe 46 that should be electrically connected) = There is a wiring connection _ The common axis of the connecting shaft U5 is set in the connection diagram 9 is set in the corresponding probe assembly The body 1 output terminals 14 are arranged and w, the relationship between the output terminal dedicated rods 63 of the road board 6 The output end of the output terminal of the mounting body 1 is γ to the second layer of the sixth column (6). The output of the (10) body 1 output end (four) end Y is on the second 电路 2 circuit board. In the second aspect, the front end portion γ of the body 1 output terminal is directed to the third layer g ς of the third column 14-3: =: 7/ 63~4 is set at the front end of the output terminal of the probe assembly 1 at the == , layer: ^ needle group 奘 flute ^ / into the sister n+1 layer wiring board probe output terminal group contact, and equivalent to the electrode block group above the 4th wiring circuit board part of the 'by setting the opening The portion 64-n allows the output terminal group of the (n)th (nth)th (th)th column to be directly contacted with the output terminal dedicated pad 63 which is opened on the first layer wiring board.
之幹’將因應狹間距卜，且具有㈣疏X向間距PX 輸出如子群14的探針組裝體1 ’精密固定於因應LSI 電極塊2 滅^電路板上（本圖未揭示）；配線電路板6則以被配置 ;g喊電路板6_n下端，而_成於第n+丨層配線電路板 之探針組裝體1第n+1列的輸出端子群14-η接觸，而相當於輸出 13 201128195 端子專用焊塾群上方的第n層配線電路板的 置開口部64-n ’讓探針_第n+1列的輪出端:群 接接觸第η+ι層配線電路板上所形成的輸 = 配線電路板6的週邊部，則透過配線圖62，從 63連接於轉接用通孔65。 用&墊 將轉接用通孔65連接於設在共通配線電路板4的通孔耵上， ==配線電路板4之間的電氣連接;可藉由各通孔的焊塾 間接觸（圖示例）,子連接器，連接轉制通孔65*通孔π ::二，通孔广藉由設於表面層43及中間層44的導體圖 =5 ’連接㈣邊料· 42 ;料，_共補 檢查裝置收受電氣信號。 承 本發明第3實施型態上，則依以下圖面詳細說明；圖 實施型態娜咐飾謂；此外，圖u柄巾央部剖視圖； 第3貫施型態則與第2實施型態上的配線電路板6、和共通配線電 路板4的功能互為-體化的型態；圖1〇及圖^戶斤示探針台裝置 ，由以下各部分所構成；7是藉由中間絕緣層71所層壓之具有銅 猪等配線圖72的配線板；此外，檢查裝置（本圖省略域） 週邊則有餘因應魏連狀共職龍針46㈣的 42。 ’、 第8圖及第9圖則省略因應探針組裝體！輸出端子14排列而 配置之配線電路板7上的輸出端子專用焊墊73關係。 透過固定具17，將因應狹間距Py，且具有較稀疏χ向間距ρχ 之輸出端子群14的探針組裝體1，精翻定於因應⑶電極塊2 14 201128195 位置的配線電路板上（本圖未揭示 於第η層配線電路板7-n下端，而金形成於第路1 7則以被配置 之探針組賴i第沾列的輸出端子群如ς1層配線電路板 端子專用焊解上方的第η層配線電路姉—=^_出 置開口部74_η ’讓探針組緖第η+1列的輸出端I稭由设 ” _層配線電路板上所形成的輸出端子專用 上，被固定於配線電路板7;另一方面，透過 /置 端子專用焊塾連接於週邊共辦墊42 從輸出 46讓檢錄置收受錢。’者，错由共通精密探針 .如上所述’本發明在於提供具有 而規則排列包含該輸出端子的複數探針群， ==組«及配線電路板，且讓形成於第η耻 叫塾排聊'他取裝_ η _細 賴距組裝而成的探針喊體、與維的 Ρ刷電路板、或與端子連接料接端切a ^施狹間距半導體晶片的電氣特性檢查，及價格低廉二針^ 本發明雖已基於®紅最佳實施㈣進行朗，但 ^亥項技術者，皆可在不脫離本發明思細情況下輕㈣行各種 變更與改變；而本發明亦包含了該變更例。 15 201128195 【圖式簡單說明】 圖1:為本發明第1實施型態之斜視圖。 圖2 :為圖1中央部分剖視圖。 圖3用於况明第i實施型態的探針組裝體構成的正視圖。The dry 'will be narrowly spaced, and have a (4) X-direction pitch PX output such as the sub-group 14 of the probe assembly 1 'precisely fixed on the LSI electrode block 2 off circuit board (not shown in this figure); The circuit board 6 is arranged; g shouts the lower end of the circuit board 6_n, and is connected to the output terminal group 14-n of the n+1th column of the probe assembly 1 of the n+th layer wiring circuit board, and is equivalent to the output. 13 201128195 Opening the opening of the n-th wiring board above the terminal-specific soldering group 64-n 'Let the probe_n+1 column of the wheel-out: group contact the n+1 layer wiring board The formed output portion of the wiring board 6 is connected to the via hole 65 through the wiring pattern 62 from 63. The via hole 65 is connected to the via hole provided on the common wiring circuit board 4 by the & pad, == the electrical connection between the wiring boards 4; the inter-weld contact by each of the via holes ( Figure example), sub-connector, connection conversion through-hole 65* through-hole π :: 2, through-hole wide through the conductor layer provided on the surface layer 43 and the intermediate layer 44 = 5 'connection (four) edge material · 42; , _ total compensation inspection device receives electrical signals. According to the third embodiment of the present invention, it will be described in detail in the following drawings; the figure is in the form of a profile; in addition, the cross-sectional view of the central portion of the handle; the third embodiment and the second embodiment. The functions of the upper wiring board 6 and the common wiring circuit board 4 are mutually different; FIG. 1A and FIG. 2 show the probe station apparatus, which are composed of the following parts; The wiring board having the wiring pattern 72 of the copper pig or the like laminated on the insulating layer 71 is provided. Further, the periphery of the inspection device (the area omitted in the figure) is 42 in response to the Wei Lian-shaped common needle 46 (four). ‘, Figure 8 and Figure 9 omitting the probe assembly! The output terminals 14 are arranged to be arranged in a relationship of the output terminal-dedicated pads 73 on the wiring board 7. Through the fixture 17, the probe assembly 1 corresponding to the narrow pitch Py and having the output terminal group 14 having a sparse pitch pitch ρ 精 is precisely set on the wiring board corresponding to the position of the (3) electrode block 2 14 201128195 (this The figure is not disclosed at the lower end of the n-th wiring circuit board 7-n, and the gold is formed on the first circuit 17 by the dedicated probe group of the arranged probe group, such as the 焊1 layer wiring circuit board terminal dedicated soldering The upper n-th layer wiring circuit 姊-=^_out opening portion 74_n' allows the output terminal I of the probe group n+1 column to be dedicated to the output terminal formed on the "" layer wiring board, It is fixed to the wiring board 7; on the other hand, the special soldering/disconnection terminal is connected to the peripheral co-located pad 42 from the output 46 to allow the recording to be received and received. 'Yes, the common precision probe. As described above' The invention provides a plurality of probe groups having a regular arrangement including the output terminal, == group « and a wiring circuit board, and the assembly is formed by the η 耻 塾 ' ' 他 他 他 他 他 _ _ _ _ _ _ _ _ _ The probe body, the brush circuit board with the dimension, or the connection terminal with the terminal is cut a ^Inspection of electrical characteristics of narrow-pitch semiconductor wafers, and low-cost two-pin ^ This invention has been based on the best implementation of the red (4), but the technology can be light without departing from the consideration of the present invention. (4) Various modifications and changes are made in the present invention. The present invention also includes the modified example. Fig. 1 is a perspective view showing a first embodiment of the present invention. Fig. 2 is a cross-sectional view showing a central portion of Fig. 1. Fig. 3 is a front elevational view showing the configuration of a probe assembly of the i-th embodiment.
圖4:用於酬第丨實施㈣期之探針喊體構成的斜視 圖5:為表示本發明第1實施型態之圖1中央部分平面圖。 圖6 :為圖1中央部分剖視圖。 圖7:為表示本發明第2實施型態斜視圖。 圖8 .為圖7中央部分剖視圖。 圖9 :為表示第2實施型態之圖7中央部分平面圖。 圖10 .為表示第3實施型態之斜視圖。 圖11 :為圖10中央部分剖視圖。 【主要元件符號說明】 1 探針組裝體 10 探針 探針 10-1 、 10-2 、 10-3 、 10-4 Π 探針前端部 13 彎曲部 14 輸出端子 14-1 Y向第1列 14-2 Y向第2列 14-3 Y向第3列 16 201128195 14-4 Y向第4列 15 樹脂膠膜 17 支撐棒 2 LSI電極塊 3 配線電路板 3-n、3_1、3_2、3-3、3-4 配線電路板 30 接地 31 非導電膠膜 32 配線圖 32-1、32-2、32-3、32_4 配線圖 33、33-1、33-2、33-3、33-4 輸出端子專用焊墊 34-n、34-2、34-3、34-4 開口部 35 基準孔 4 配線電路板 41 通孔 42 共通焊墊 43 表面層 44 中間層 45 導體圖案 46 共通精密探針 47 通孔 51 支撐台 52 推壓具 17 201128195 53 支撐體A 53a 内徑孔 54 支撐體B 6 配線電路板 61 中間絕緣層 62 配線圖 63、 63-1 、 63-2 、 63-3 、 63-4 焊墊排列群 64-n ' 64-2 ' 64-3 ' 64-4 開口部 65 通孔 7 配線電路板 71 中間絕緣層 72 配線圖 73、 73-1 ' 73-2 ' 73-3 ' 73-4 輸出端子專用焊墊 74-n 、74-2 、 74-3 、 74-4 開口部 Px 間距 Py 間距 18Fig. 4 is a perspective view showing the configuration of the probe body for the fourth stage of the invention. Fig. 5 is a plan view showing the central portion of Fig. 1 showing the first embodiment of the present invention. Figure 6 is a cross-sectional view of the central portion of Figure 1. Fig. 7 is a perspective view showing a second embodiment of the present invention. Figure 8. is a cross-sectional view of the central portion of Figure 7. Fig. 9 is a plan view showing a central portion of Fig. 7 showing a second embodiment. Fig. 10 is a perspective view showing a third embodiment. Figure 11 is a cross-sectional view of the central portion of Figure 10. [Explanation of main component symbols] 1 Probe assembly 10 Probe probes 10-1, 10-2, 10-3, 10-4 探针 Probe tip end portion 13 Bending portion 14 Output terminal 14-1 Y to the first column 14-2 Y direction 2nd column 14-3 Y direction 3rd column 16 201128195 14-4 Y direction 4th column 15 Resin film 17 Support rod 2 LSI electrode block 3 Wiring board 3-n, 3_1, 3_2, 3 -3, 3-4 Wiring board 30 Grounding 31 Non-conductive film 32 Wiring diagram 32-1, 32-2, 32-3, 32_4 Wiring diagram 33, 33-1, 33-2, 33-3, 33- 4 Output terminal special pads 34-n, 34-2, 34-3, 34-4 Opening 35 Reference hole 4 Wiring board 41 Through hole 42 Common pad 43 Surface layer 44 Intermediate layer 45 Conductor pattern 46 Common precision Needle 47 through hole 51 support table 52 pusher 17 201128195 53 support body A 53a inner diameter hole 54 support body B 6 wiring circuit board 61 intermediate insulating layer 62 wiring diagram 63, 63-1, 63-2, 63-3, 63-4 Pad arrangement group 64-n ' 64-2 ' 64-3 ' 64-4 Opening 65 Through hole 7 Wiring board 71 Intermediate insulation layer 72 Wiring diagram 73, 73-1 ' 73-2 ' 73- 3 ' 73-4 output terminal special welding Pad 74-n, 74-2, 74-3, 74-4 Opening Px Pitch Py Pitch 18