201126763 六、發明說明： 【發明所屬之技術領域】 本發明與一種LED晶片封裝方法有關。具體而言，本發 明係關於一種利用靜電粉體塗裝技術來封裝LED晶片之方 法。 【先前技術】 發光二極體(Light-Emitting Diode，LED)是半導體元 件的一種，其以佈植或摻雜技術產生半導體p-n接面。 當施加正向偏壓時，發光二極體會因其内部電子與電洞 之複合而以光子形式釋出能量，此屬電致發光效應 (electroluminescent)的一種。對所採用的半導體材料化學 組成進行調配’ LED晶片可發出位於近紫外線、可見光 或紅外線等光波段的單色、不連續的光。現今業界已開 發出各種顏色的LED晶片，其多被用來作為指示燈、顯 示板’具有效率高、壽命長、不易損壞等傳統光源無法 與之相較的優點。然’供以照明大宗用途的純白光led 現今仍未被開發出來，大幅限制了 LED的用途。為此， 目前業界開發出以藍光LED晶片搭配黃色螢光粉之方 式來營造白光LED之效果。其原理在於黃色螢光粉會受 藍光LED晶片所發出之藍光激發而發出黃光，該黃光與 藍光兩互補光混光後即可形成為肉眼所觀測到的白光。 就上述此種LED晶片搭配螢光粉之作法而言，目前 業界已開發有多種相關的製作方式。請參照第一圖，其 為先前技術中一 LED裝置之示意圖。在第一圖的裝置 100中，LED晶片102會被設置在一具有杯體結構的導 線架104上，該導線架104透過導線1〇6來與LED晶片 102的P極、N極導通。在此作法中，定量的螢光粉會 201126763 先與透明矽膠混合攪拌形成含有螢光粉之膠液1〇8。之 後再利用注射器將該螢光粉膠液108點膠在已銲上導線 的LED晶片102上並完全覆蓋之。之後整個lED 裳置100會被送入烘烤箱中烘烤使該螢光粉膠液1〇8固 化，以在LED晶片102周遭形成一層硬化後的螢光層。 目前的先前技術多採用上述將螢光粉混合在矽膠中 的作法來將螢光粉均勻散佈在LED晶片周遭。如上述作 法係以具有杯體結構的導線架讓螢光粉膠液在LED周 遭固化成形。而美國公開發明第2009/0278156號中亦揭 露了一種LED裝置的模塑方法，其利用模具來將螢光粉 膠液模塑成其所想要的各式形狀。 這類使用螢光粉與透明矽膠混合之作法有不少缺 點。其一，螢光粉與矽膠混合後，隨著放置時間越長， 螢光粉與矽膠分離的情形亦就越明顯，使得每次的點膠 製程中螢光粉在矽膠中的含量都有所不同。再者，石夕膠 中的螢光粉於後續的烘烤步驟中會有沈澱現象，使得曰^ 片周圍形成的螢光粉膠膜厚薄不均，最終導致同批生產 的led裝置所發出的白光色溫不一致。 而在美國公開發明第2009/0321769號中亦揭露了 — 種以電泳沉積技術(electrophoresis)在LED晶片表面形 成螢光層之技術。該發明中係將螢光粉懸浮於電解質溶 液中，欲進行上膜的LED晶片會被設置在一導電基板: 並將之幾乎完全浸沒在該含有螢光粉的電解質溶液 中。一電源的兩電極會分別耦接在該導電基板及該電解 質溶液中。此時在該電極上施以偏壓將可使電解質溶液 中的榮光粉泳動至LED晶片表面達到成膜效果。上述作 法雖然可在LED晶片的表面形成均勻的螢光層，但其步 驟中須將led晶片浸沒在電解質溶液中，此舉容易^宝 4 201126763 到脆弱的LED晶片本體。 是以，現今業界仍欠缺有效將led晶片與螢光粉结 合之方法，如何減少製作成本，同時能產出具有預定色 溫、兼具品質一致性之LED裝置，誠為相關業者亟待突 破之難題。 【發明内容】201126763 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an LED chip packaging method. In particular, the present invention relates to a method of packaging LED wafers using electrostatic powder coating techniques. [Prior Art] A Light-Emitting Diode (LED) is a type of semiconductor element that produces a semiconductor p-n junction by implantation or doping techniques. When a forward bias is applied, the light-emitting diode releases energy in the form of photons due to the recombination of its internal electrons and holes, which is a kind of electroluminescent effect. The chemical composition of the semiconductor material used is formulated. The LED wafer emits monochromatic, discontinuous light in the vicinity of the ultraviolet, visible or infrared light. Nowadays, LED chips of various colors have been developed in the industry, which are often used as indicator lights and display boards, which have the advantages of high efficiency, long life, and low damage, which are not comparable to conventional light sources. However, pure white LEDs for large-scale lighting applications have not yet been developed, which greatly limits the use of LEDs. To this end, the industry has developed the effect of creating a white LED with a blue LED chip and a yellow phosphor. The principle is that the yellow phosphor is excited by the blue light emitted by the blue LED chip to emit yellow light, and the yellow light and the blue light are mixed to form a white light observed by the naked eye. In view of the above-mentioned LED chip with phosphor powder, various related production methods have been developed in the industry. Please refer to the first figure, which is a schematic diagram of an LED device in the prior art. In the apparatus 100 of the first figure, the LED chip 102 is disposed on a lead frame 104 having a cup structure, and the lead frame 104 is electrically connected to the P and N poles of the LED wafer 102 through the wires 1?. In this method, the quantitative phosphor powder will be mixed with the transparent silicone gel to form a glue containing the phosphor powder 1〇8. The phosphor powder 108 is then dispensed onto the LED wafer 102 that has been soldered onto the wire by a syringe and completely covered. Thereafter, the entire lED skirt 100 is sent to a baking oven for curing to cure the phosphor powder 1〇8 to form a hardened phosphor layer around the LED wafer 102. The prior prior art mostly uses the above method of mixing the phosphor powder in the silicone to uniformly spread the phosphor powder around the LED wafer. As described above, the phosphor paste is solidified around the LED by a lead frame having a cup structure. A molding method of an LED device which uses a mold to mold a phosphor powder into various desired shapes is also disclosed in U.S. Patent Publication No. 2009/0278156. This type of mixing of phosphor powder and clear silicone has many drawbacks. First, after the phosphor powder is mixed with the silicone rubber, the longer the separation time is, the more obvious the separation of the phosphor powder and the silicone rubber is, so that the content of the phosphor powder in the silicone rubber in each dispensing process is different. Furthermore, the phosphor powder in the Shixi gum will precipitate in the subsequent baking step, so that the thickness of the phosphor powder film formed around the sheet is uneven, which eventually leads to the same batch production of the LED device. White light color temperature is inconsistent. A technique for forming a phosphor layer on the surface of an LED wafer by electrophoresis is also disclosed in U.S. Patent Publication No. 2009/0321769. In the invention, the phosphor powder is suspended in an electrolyte solution, and the LED wafer to be subjected to the upper film is placed on a conductive substrate: and it is almost completely immersed in the phosphor-containing electrolyte solution. Two electrodes of a power source are respectively coupled to the conductive substrate and the electrolyte solution. Applying a bias voltage to the electrode at this time will allow the glory powder in the electrolyte solution to migrate to the surface of the LED wafer to achieve a film forming effect. Although the above method can form a uniform phosphor layer on the surface of the LED wafer, the LED wafer must be immersed in the electrolyte solution in the step, which is easy to get to the fragile LED chip body. Therefore, there is still a lack of effective methods for combining LED chips and phosphor powders in the industry. How to reduce the production cost and produce LED devices with predetermined color temperature and quality consistency is a difficult problem for related companies. [Summary of the Invention]
鑑於上述先前技術之缺失，本發明揭露了一種新藉 的LED晶片封裝方法。本發明之LED晶片封裝方法係 採用靜電粉體塗裝技術。方法中螢光粉粒會經由靜電^ 搶帶電並均勻吸附在LED晶片表面上，形成一層緻密: 厚度一致的螢光層。解決了習知技術中因螢光粉在膠體 中沈澱及點膠厚度不均而導致LED所發出之可見光色 溫不一的問題。同時，由於本發明採用靜電吸附原理來 形成營光層，故製作中LED晶片不會接觸任何製程 體，較不易損傷脆弱的LED晶片本體。 本發明之目的為提供一種新穎的LED晶片封襄方 去’該方法中利用靜電粉體塗裝技術在LED晶片表 ，度均勻的純螢光層* LED裝置得以發出色溫二 的可見光； 双 本發明之另-目的為提供_種新穎的LED晶 法方法中所使用的螢光粉料可以透過一回收事署 以回收再利用，節省LED裝置的製作成本。置加 在參閱下述詳細的實施方式及相關的圖示與 後，閱者將更能了解本發明其他的目的、特;:專 【實施方式】 本發明摒除了傳統LED #裝中的螢光粉點膠 201126763 (dispensing)之方式，改採靜電粉體塗裝（electr〇static power coating)技術將螢光粉粉體直接以靜電力吸附在 欲進行封裝的LED晶片表面上，形成均質、厚度一致的 螢光粉層’克服傳統螢光粉點膠技術中螢光粉在膠體内 沈澱及所形成之螢光層厚薄不一的問題，讓同道製程下 的多個LED成品能發出色溫更為一致的可見光。 以下要進行本發明具體實施例之說明。須注意，所 揭示的實施例僅在於舉例說明。本發明之範疇並未限制 在其所揭露包含特定特徵、結構、或性質的具體實施例 中，而係由文後所附的申請專利範圍所界定。此外，說 明書中所參照之圖示並未具體描繪出所有本發明不必 要之特徵，且所描繪出之元件可能以簡化、示意之方式 來表達’圖示中各類元件的尺寸可能為說明之便而加以 誇大或不符合實際比例。不論上述之簡略為何，或是相 關特徵是否有被詳盡描述’其皆意表所描述者係位於相 關領域中熟習該項技藝之人士可據以連同其他與該等 特徵、結構或性質相關的其他具體實施例來實施之知識 範疇内。 [s] 請參照第二圖，其說明了本發明實施例中利用靜電 粉體塗裝技術來將螢光粉吸附在LED晶片表面之示意 圖。如圖所示，本發明係使用一靜電粉體塗裝設備2〇〇 來將螢光粉塗附在LED晶片202上。粉體塗裝設備2〇〇 的主體為一靜電喷槍204，欲進行塗附之螢光粉206會 藉由該靜電噴搶204喷佈在LED晶片202的表面上。在 第一圖所示的實施例中，靜電喷槍202是為一電暈放電 式靜電喷搶(corona gun)，其末端設置有一用以將粉粒喷 出的高壓電喷嘴208。喷嘴208中的電極會受一高電壓 產生器（HV generator，未圖示）施以高電壓而使週遭的空 6 201126763 氣分子產生離子雲210，進行電暈放電現象（corona discharging)。如此’行經喷嘴204的粉粒可從離子雲210 中拾取電荷而帶負電。 在發明中’螢光粉206係從一塗料供給槽或粉筒（未 圖示）供至靜電喷搶204。該螢光粉可為任何特定種類的 螢光粉’如YAG(Y3A150丨2:Ce，釔鋁石榴石）螢光粉、 TAGi^TbsAlsOniCe，試!呂石權石）螢光粉、或任何其他種 類的螢光粉，端視使用者的需求而定。舉例言之，在本 發明一實施例中，YAG黃色螢光粉可被選來塗佈在藍光 LED晶片（InGaN)上。藍光LED晶片所發出的藍光可激 發其表面所附之YAG黃色螢光粉而發出黃光，LED晶 片所發出之藍光與其表面螢光粉所發出之黃光會混光 形成吾人所欲之白色照明光源。 發明中整個塗裝製程是在一密閉的塗裝室或噴房 212中進行。舉例言之，欲進行塗裝的多個LED晶片可 能先與導線架完成導通，之後連同架座排列設置在一抗 靜電的萃盤214上一起送入噴房212中。發明中可額外 使用一定位裝置（未圖示）來移動萃盤214使萃盤上某特 定的LED晶片之喷塗面對準噴房中的喷嘴2〇8。 在塗裝期間，傳輸到靜電嘴搶綱中的螢光粉2〇6 會欠搶官内的壓縮空氣驅使而噴出，受噴出的粉體會行 經高壓電喷嘴208而從其周遭產生之離子雲21〇中拾取 電荷而帶負電。發明中欲進行粉體塗裝的LED晶片2〇2 會被接地(ground)使其保持電中性。搶管端帶電的離子 雲與晶片端的電中性會使噴嘴與晶片間形成—電場。該 些被喷出、帶負電的螢光粉粒2丨6會在電場中因靜電力 吸附在呈電中性的晶片202表面上。由於螢光粉體 與LED晶片間的靜電吸引力會隨粉體粒子的吸附而下 [S ] 7 201126763 降’故可在LED晶片表面上形成一層緻密、厚度均句一 致的螢光粉層。又發明巾營紐係以靜電力吸附而非傳 統直接方向性喷塗方式附著在LED晶片的表面上，故晶 片的角落或非喷塗面等—般不易塗佈到的位置亦可有 效、均勻地附著螢光粉。 除了上述透過電暈放電讓粉體粒子帶電之方式，在 j明其他實施例中，靜電噴槍綱亦可能為摩擦生電 gun)4㈣施财，喷搶中的螢光粉於喷 ，時會同速=經特殊材質(如聚四氟乙稀，pTFE)的嘴嘴 二路並與其官壁雜，此摩擦動作會使螢光粉和管壁作 而讓螢光粉帶電，如帶上正電。之後帶電的粉In view of the above-described deficiencies of the prior art, the present invention discloses a new borrowed LED chip packaging method. The LED chip packaging method of the present invention employs an electrostatic powder coating technique. In the method, the phosphor particles are charged and uniformly adsorbed on the surface of the LED wafer by electrostatic charging to form a dense: uniform thickness phosphor layer. The problem of the color temperature of visible light emitted by the LED due to the precipitation of the phosphor powder in the colloid and the uneven thickness of the dispensing powder is solved in the prior art. At the same time, since the present invention adopts the principle of electrostatic adsorption to form a camping layer, the LED wafer in production does not contact any process body, and is less likely to damage the fragile LED chip body. The object of the present invention is to provide a novel LED chip sealing method. In the method, the electrostatic powder coating technology is used in the LED wafer table, and the uniform fluorescent layer* LED device can emit visible light of color temperature two; Another object of the invention is to provide a fluorescent powder used in the novel LED crystal method, which can be recycled and reused by a recycling office, thereby saving the manufacturing cost of the LED device. In addition to the detailed description of the embodiments and related drawings below, the reader will be better able to understand the other objects and features of the present invention.: [Embodiment] The present invention eliminates the fluorescent light in the conventional LED # In the way of powder dispensing 201126763 (dispensing), the electrostatic powder coating technology is used to adsorb the phosphor powder directly on the surface of the LED chip to be packaged by electrostatic force to form a homogeneous and thick layer. The consistent phosphor layer 'overcomes the problem of the phosphor powder in the traditional phosphor powder dispensing technology, which precipitates in the gel body and the thickness of the phosphor layer formed is different, so that the LED products in the same process can emit more color temperature. Consistent visible light. The following is a description of specific embodiments of the invention. It should be noted that the disclosed embodiments are merely illustrative. The scope of the invention is not limited to the specific embodiments disclosed, which are intended to include specific features, structures, or properties, and are defined by the scope of the appended claims. In addition, the illustrations referred to in the specification do not specifically describe all the features of the present invention, and the elements depicted may be expressed in a simplified and schematic manner. It is exaggerated or does not conform to the actual ratio. Whatever the abbreviations described above, or whether the relevant features are described in detail, the persons described in the context of the subject matter may be based on other specificities related to the features, structures or properties. The examples are implemented within the scope of knowledge. [s] Please refer to the second figure, which illustrates a schematic diagram of the use of electrostatic powder coating technology to adsorb phosphor powder on the surface of an LED wafer in an embodiment of the present invention. As shown, the present invention uses an electrostatic powder coating apparatus 2 to apply phosphor powder to the LED wafer 202. The main body of the powder coating apparatus 2 is an electrostatic spray gun 204, and the phosphor powder 206 to be coated is sprayed on the surface of the LED wafer 202 by the electrostatic spray 204. In the embodiment shown in the first embodiment, the electrostatic spray gun 202 is a corona discharge type corona gun having a high voltage electric nozzle 208 for discharging the particles at the end. The electrodes in the nozzle 208 are subjected to a high voltage by a high voltage generator (HV generator, not shown) to generate an ion cloud 210 for the surrounding air molecules to perform corona discharging. The particles passing through the nozzle 204 can be negatively charged by picking up the charge from the ion cloud 210. In the invention, the phosphor powder 206 is supplied from a paint supply tank or a powder cartridge (not shown) to the electrostatic spray 204. The phosphor powder can be any specific type of phosphor powder such as YAG (Y3A150丨2:Ce, yttrium aluminum garnet) phosphor powder, TAGi^TbsAlsOniCe, try! Lu Shiquanshi) phosphor powder, or any other kind Fluorescent powder depends on the needs of the user. For example, in one embodiment of the invention, YAG yellow phosphor can be selected for coating on a blue LED wafer (InGaN). The blue light emitted by the blue LED chip can excite the YAG yellow phosphor attached to the surface to emit yellow light, and the blue light emitted by the LED wafer and the yellow light emitted by the surface phosphor powder can be mixed to form a white illumination source that is desired. In the invention, the entire painting process is carried out in a closed painting booth or spray booth 212. For example, a plurality of LED chips to be painted may be first turned on with the lead frame, and then fed into the spray booth 212 together with the mount arrangement on an antistatic pickup 214. In the invention, a positioning device (not shown) can be additionally used to move the extraction tray 214 so that the spray surface of a particular LED wafer on the extraction tray is aligned with the nozzles 2〇8 in the spray booth. During the painting process, the phosphor powder 2〇6 transferred to the electrostatic nozzle will be ejected by the compressed air in the official, and the ejected powder will pass through the high-voltage electric nozzle 208 and the ion cloud generated from the periphery. The 21 〇 picks up the charge and is negatively charged. In the invention, the LED chip 2〇2 to be subjected to powder coating is grounded to maintain electrical neutrality. The electrostatic neutrality of the charged ion cloud at the end of the tube and the end of the wafer creates an electric field between the nozzle and the wafer. The ejected, negatively charged phosphor particles 2丨6 are adsorbed on the surface of the electrically neutral wafer 202 by electrostatic force in an electric field. Since the electrostatic attraction between the phosphor powder and the LED chip is lowered by the adsorption of the powder particles [S] 7 201126763, a layer of dense, uniform thickness phosphor powder can be formed on the surface of the LED wafer. In addition, the invention has been attached to the surface of the LED wafer by electrostatic force adsorption instead of the conventional direct directional spraying method, so that the corners of the wafer or the non-spraying surface, etc., which are not easily applied, can be effectively and evenly distributed. Fluorescent powder is attached to the ground. In addition to the above method of charging the powder particles by corona discharge, in other embodiments, the electrostatic spray gun may also be a frictional power gun) 4 (four), and the fluorescent powder in the spray is sprayed at the same speed. = The special material (such as Teflon, pTFE) has two nozzles and is mixed with its official wall. This friction action will make the fluorescent powder and the tube wall to make the fluorescent powder charged, such as with positive electricity. Charged powder after
Jl a透過一梳狀噴頭噴出而同前述實施例般因靜 電力吸附在LED晶片上。 絲體°騎的步驟巾，並賴有被喷出的 Γκη曰二’且亦非所有帶電的粉體都能夠吸附在 表^上(特別是當其表面已吸附形成了一定 = Ϊ ::故此’於粉體塗裝設備後端最好設 主㈣朵二置5進仃未塗附粉體之回收，以避免浪費昂 裝設-漏斗狀:回二2f8 =噴房212的底部可以 η ^ 218，回收口中可設置有排氣風 :等叹備（未圖不）來則丨切著 遽器(如袋濾式及/或旋風式集塵=f = 體來達成粉料之回收。此離工I、螢先私 成本。 收轉可有效節省LED封裝的材料 舍以步驟後’表面附有均勾螢光層的led晶片 固化，以來將LED晶片完整包覆後，送進固化爐中 片之效果、Γ層硬化的透日純緣層，提供賴LED晶 片之效果。舉例言之，吾人可採用_方式在晶片 201126763 表面包覆一層固化膠。該固化膠可為一般的矽膠 (silicon)、環氧膠(epoxy)、聚氨脂膠(pu膠）、壓克力膠 (acrylic)、及紫外線固化膠(uv膠）等，而該固化爐可能 為熱風循環爐或紅外線爐等烘烤爐，或是紫外線固化爐 等光固化爐。LED晶片表面上的固化膠會因高溫或照光 而硬化，形成一層透明保護層。 在固化步驟後，整個LED裝置上可以再選擇性裝上 透鏡或反射罩等，以將LED裝置所產生的光朝所欲之方 向角發出。 現在參照第三圖，其說明了本發明實施例中LED晶 片封裝的流程。首先在步驟301，將欲進行封裝的多個 LED晶片排列設置在一托盤上（如一訂製的抗靜電萃盤) 並接地。該些LED晶片可能已先與導線架完成導通並連 同架座一起排列設置在托盤上。LED晶片在底盤上有規 律的排設將能夠於後續的喷粉步驟中利用一自動定位 系統(auto alignment)來使托盤上某特定的LED晶片之噴 塗面對準喷嘴口。 在接下來的步驟302中，已排設好的多個LED晶片 會隨托盤送入一密閉的喷房中，喷房中配置有粉體塗裝 所需的各類裝置，如靜電喷搶、傳輸帶、集塵裝置、及 /或自動定位系統等，該些LED晶片會在喷房中依序或 同時進行喷佈製程。 LED晶片就定位後，在步驟303中，選定的螢光粉 末會透過一靜電喷搶(如電暈放電喷搶或摩擦生電嘴搶) 喷佈在該些LED晶片表面，所喷出的螢光粉體會因如矿 述高壓電暈或與管壁摩擦之方式帶電，並因靜電力作用 均勻吸附在接地後呈電中性之LED晶片表面。整個步驟 會持續直到LED晶片表面附上的螢光粉層達到吾人所 201126763 欲之厚度，其中單道喷塗步驟可以達到40〜15〇μιη之螢 光粉厚度。 粉體喷附完成後，接下來的步驟304中以點膠方式 在表面附有螢光粉層的LED晶片上完整包覆一層固化 膠。該固化膠可為一般的矽膠(silicon)、環氧膠(epoxy)、 聚氨脂膠(PU膠）、壓克力膠(acrylic)、及紫外線固化膠 (UV膠）等。Jl a is ejected through a comb nozzle and adsorbed on the LED wafer by static electricity as in the previous embodiment. The step of riding the silk body ° depends on the sprayed Γκη曰二' and not all of the charged powder can be adsorbed on the surface (especially when the surface has been adsorbed to form a certain = Ϊ :: 'In the back end of the powder coating equipment, it is best to set the main (four) two sets of 5 into the uncoated powder to avoid wasteful installation - funnel shape: back 2 2f8 = the bottom of the spray booth 212 can be η ^ 218, the exhaust port can be equipped with exhaust air: if the sigh (not shown), then cut the sputum (such as bag filter and / or cyclone dust = f = body to achieve the recovery of the powder. Separate work I, fire first private cost. The transfer can effectively save the material of the LED package. After the step, the LED chip with the fluorescent layer on the surface is cured. After the LED chip is completely coated, it is sent to the curing oven. The effect of the film and the hardened layer of the enamel layer provide the effect of the LED chip. For example, we can apply a layer of curing adhesive on the surface of the wafer 201126763. The curing adhesive can be a general silicone. ), epoxy, polyurethane (pu glue), acrylic, and UV-curable glue (uv) Glue), etc., and the curing oven may be a baking oven such as a hot air circulating furnace or an infrared furnace, or a curing oven such as an ultraviolet curing furnace. The curing adhesive on the surface of the LED wafer may be hardened by high temperature or illumination to form a transparent protection. After the curing step, a lens or a reflector or the like may be selectively mounted on the entire LED device to emit light generated by the LED device in a desired direction. Referring now to the third figure, the present invention is illustrated. The flow of the LED chip package in the embodiment. First, in step 301, a plurality of LED wafers to be packaged are arranged on a tray (such as a customized antistatic extraction tray) and grounded. The LED chips may have been first The lead frame is completed and arranged on the tray together with the pedestal. The regular arrangement of the LED chips on the chassis will enable an auto alignment to be used in a subsequent dusting step to make a particular on the tray The sprayed surface of the LED wafer is aligned with the nozzle opening. In the next step 302, the plurality of LED chips that have been arranged are fed into the sealed spray booth with the tray, and the spray booth is provided with powder. All kinds of devices required for painting, such as electrostatic spray, conveyor belt, dust collecting device, and/or automatic positioning system, etc., these LED chips will be sprayed sequentially or simultaneously in the spray booth. After positioning, in step 303, the selected phosphor powder is sprayed on the surface of the LED chips by an electrostatic spray (such as corona discharge or friction nozzle), and the emitted phosphor powder is sprayed. It is charged due to the high-voltage corona or friction with the tube wall, and is uniformly adsorbed on the surface of the electrically neutral LED wafer due to electrostatic force. The whole step will continue until the phosphor powder attached to the surface of the LED wafer. The layer reaches the thickness of our 201126763, and the single-pass spraying step can reach the thickness of the phosphor powder of 40~15〇μιη. After the powder coating is completed, in the next step 304, a layer of curing glue is completely coated on the LED wafer with the phosphor layer on the surface by dispensing. The curing adhesive can be a general silicone, an epoxy, a polyurethane adhesive, an acrylic, a UV adhesive, or the like.
之後於步驟305，包覆有固化膠的LED晶片會整批 送入固化爐中固化，其固化作法可能為在200°C的溫度 下烘烤15〜20分鐘，或是用紫外光(UV光）照射LED晶 片。固化後LED晶片表面會形成一層透明的保護層，本 發明整個LED晶片封裝製程於焉結束。 以上述封裝流程，LED晶片上可形成一層緻密、 厚度一致的單質螢光層來作為LED裝置的發光層，此層 有別於先刚技術中以一定量榮光粉混和透明石夕膠所製 成之發光層。而LED晶片外部會包覆有一層堅固的透^ 保護膜，避免内中的LED晶片因外力而損傷。 文中所述之實施例與圖說係供予閱者，俾其對於本 發明各不同實施例結構有通盤性的瞭解。在不悖離本發 明範嘴的情況下’發明中可以進行結構與邏輯的置換^ ^變。據此，本發明之揭露與圖式理視為描述而非限制 性質，並將由下文中的申請專利範圍來限制。 【圖式簡單說明】 參閱後續的圖式與描述將可更了解本發明的系統及 =。文中未詳列暨非限制性之實施例則請參考該後續 I式之描述。圖式中的組成元件並不—定符合比例，而 係Μ強調的方式描繪出本發明的原理^圖式中，相同 201126763 的元件係於不同圖示中標出相同對應之部分。 第一圖描繪出習知技術中一 LED晶片封裝之示意 圖， 第二圖描繪出根據本發明實施例利用靜電粉體塗裝 技術來將螢光粉吸附在led晶片表面之示意圖；及 第三圖描繪出根據本發明實施例LED晶片封裝之 流程。 【主要元件符號說明】Then in step 305, the LED chip coated with the cured glue is sent to the curing oven for curing in a batch, and the curing method may be baking at a temperature of 200 ° C for 15 to 20 minutes, or using ultraviolet light (UV light). ) illuminating the LED wafer. After curing, a transparent protective layer is formed on the surface of the LED wafer, and the entire LED chip packaging process of the present invention ends. In the above packaging process, a dense, uniform thickness single phosphor layer can be formed on the LED wafer as the light-emitting layer of the LED device, which is different from the first-generation technology in which a certain amount of glory powder is mixed with transparent stone enamel. The luminescent layer. The outer surface of the LED chip is covered with a strong protective film to prevent the inner LED chip from being damaged by external force. The embodiments and figures described herein are intended to be preferred by those of the various embodiments of the invention. The structural and logical substitutions can be made in the invention without departing from the scope of the invention. Accordingly, the disclosure of the invention is intended to be in the BRIEF DESCRIPTION OF THE DRAWINGS The system and = of the present invention will be more fully understood by reference to the following drawings and description. For a detailed and unrestricted embodiment, please refer to the description of the subsequent I. The constituent elements in the drawings are not to scale, and the manner in which the system is emphasized is to describe the principle of the present invention. In the drawings, the elements of the same 201126763 are labeled with the same corresponding parts in different drawings. The first figure depicts a schematic diagram of an LED chip package in the prior art, and the second figure depicts a schematic diagram of adsorbing phosphor powder on the surface of a LED wafer by using an electrostatic powder coating technique according to an embodiment of the present invention; and a third figure A flow of an LED chip package in accordance with an embodiment of the present invention is depicted. [Main component symbol description]
100 裝置 102 LED晶片 104 導線架 106 導線 108 膠液 200 靜電粉體塗裝設備 202 LED晶片 204 喷搶 206 螢光粉 208 喷嘴 210 離子雲 212 喷房 214 萃盤 216 螢光粉粒 218 回收口 301〜306 步驟100 device 102 LED chip 104 lead frame 106 wire 108 glue 200 electrostatic powder coating equipment 202 LED wafer 204 spray grab 206 fluorescent powder 208 nozzle 210 ion cloud 212 spray booth 214 extraction tray 216 fluorescent powder 218 recovery port 301 ~306 steps