TW201126654A - Micro electro-mechanical package module - Google Patents

Micro electro-mechanical package module Download PDF

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Publication number
TW201126654A
TW201126654A TW099101854A TW99101854A TW201126654A TW 201126654 A TW201126654 A TW 201126654A TW 099101854 A TW099101854 A TW 099101854A TW 99101854 A TW99101854 A TW 99101854A TW 201126654 A TW201126654 A TW 201126654A
Authority
TW
Taiwan
Prior art keywords
chamber
receiving hole
carrier
cover
disposed
Prior art date
Application number
TW099101854A
Other languages
English (en)
Inventor
Jiong-Yue Tian
Ren-Quan Ye
Original Assignee
Lingsen Precision Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lingsen Precision Ind Ltd filed Critical Lingsen Precision Ind Ltd
Priority to TW099101854A priority Critical patent/TW201126654A/zh
Priority to US12/707,940 priority patent/US20110180924A1/en
Publication of TW201126654A publication Critical patent/TW201126654A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Description

201126654 六、發明說明： 【發明所屬之技術領域】 製程ίΓ㈣微機電封裝漁㈣，特別是指—種可簡化 裝程且k⑤產品良率之微機電封裝模组。 【先前技術】 到二封裝_的性能’必須在封裝時考量 微機^ 〜兄因素(如雜訊干擾)的問題，其中，有些 =?，組的構造較為特殊，以微機電麥克風為例: 诵、首：之下方接收外界的訊號，故基板必須形成一曲折 、、翌機電麥克風之晶Μ目通，以糊接收峨的目的。 才二!、用技術而言’基板必須由多數個板體堆疊而成， 言，因/特通道’但是此種結構設計不僅製造成本 :整體體基板的厚度增加，連帶影響微機電封裝模組 用 。另外财—種設計是將導線架當作基板使 相使用前必須先將鎮空處填補絕緣膠，製程同樣 率’並且在回谭的過程中容易變形’導致產品的良 【發明内容】 可、访2明之主要目的在於提供—種微機電封裝模組，其 品良^。體厚度贿低製造成本，並可簡化製程以提升產 為了達成上述目的，本發明之微機電封褒模組包含有 201126654 -載板、-封蓋、-間隔件，以及—晶片。該封蓋蓋合於 该載板之表面’並具有—腔室與-連通外界之接收孔；該 間隔件設於該載板與該封蓋之間，並於内部具有一連通該 腔室與該接收孔之曲折通道；該晶片設於該間隔件而對應 於。亥曲折通道’同時位於該封蓋之腔室内並與該載板電性 連接，使得外界訊號能夠經由該封蓋之接收孔與該間隔件 之曲折通道而傳遞至該晶片。 藉由上述之設計，本發明之微機電封裝模組確實能夠 達到減少整體厚度，降低製造成本，簡化製造過程，以及 提升產品良率之目的。 【實施方式】 為了詳細說明本發明之結構、特徵及功效所在，茲列 舉一較佳實施例並配合下列圖式說明如後。 請參閱第一圖，為本發明第一較佳實施例所提供之微 機電封裝模組(ίο)，包含有一載板(20)、一封蓋(30)、一間 隔件(40) ’以及一晶片（5〇)。 載板(20)可為陶瓷基板或者由雙層板體堆疊而成，本 實施例是以陶瓷基板為例。 封蓋(30)之周緣蓋合於載板(2〇)之表面，並具有一腔室 (32)與一柱體(34)，柱體(34)由腔室(32)之頂壁向下延伸而 出’並具有一連通外界之接收孔(342)。 間隔件(40)設置於載板(20)與封蓋(30)之間，並於内部 具有一曲折通道(42)，曲折通道(42)區分為一水平段(422) 201126654 f二垂直段(424)，該二垂直段(424)位於水平段(422)的兩 端，並分別連通封蓋(3〇)之腔室(32)與接收孔(342)。 晶片（50)設於間隔件(40)而對應於曲折通道(42)之其中 -垂直段’），同時位於封蓋(3〇)之腔室⑽内並與載板 ⑽電性連接，使得外界訊號能夠從封蓋(30)之接收孔(342) 、經由間隔件(4〇)之曲折通道(42)傳遞至封蓋⑽之腔室㈤ 内讓晶片（50)接收。 • ，經由上述結構可知，本發明之微機電封裝模組⑽採 用單層陶甍基板或雙層板體作為結構穩固之载板⑽，並 採用厚度相當薄之間隔件(40)而在其内部形成曲折通道 (42)，並非使用由多數個堆疊而成之板體或者導線架作為 基板，可確實達到減少整體厚度、降低製造成本、簡化製 造過程，以及提高產品良率的目的。 請再參閱第二圖’為本發明第二較佳實施例所提供之 微機電封裝模組(60)，其主要結構與上述實施例大致相 # 同，惟其差異在於載板⑽之表面形成-凹陷㈤與間隔件 (80)之曲折通道(82)連通，如此便能擴大曲折通道(82)之容 : 積供外界訊號通過，藉以同樣達到本發明之目的。 本發明於前揭實施例中所揭露的構成元件，僅為舉例 說明，並非用來限制本案之範圍，其他等效元件的替代或 變化，亦應為本案之申請專利範圍所涵蓋。 201126654 【圖式簡單說明】 第一圖為本發明第一較佳實施例之剖視圖。 第二圖為本發明第二較佳實施例之剖視圖。 【主要元件符號說明】 「第一實施例」 微機電封裝模組(10) 封蓋(30) 柱體(34) 間隔件(40) 水平段(422) 晶片（50) 「第二實施例」 微機電封裝模組(60) 凹陷(72) 曲折通道(82) 載板(20) 腔室(32) 接收孔(342) 曲折通道(42) 垂直段(424) 載板(70) 間隔件(80)

Claims (1)

  1. 201126654 七、申請專利範圍： 1· 一種微機電封裝模組，包含有： 一載板； -封盍，蓋合於該載板之表面，並具有一腔室與一連 通外界之接收孔； 一間隔件，設於該載板與該封蓋之間，並於内部呈有 -曲折通道’㈣折通如其兩齡料職腔室與該接 收孔；以及 一^片’設於該間隔件喊應於該曲折通道，同時位 於該封蓋之腔室内並與該載板電性連接。 2. 如請求項丨所述之微機電封裝模組，其中該封蓋具 有一柱體，該柱體由該腔室之頂壁延伸而出，並具有該接 收孔。 3. 如請求項1所述之微機電封裝·，其中該曲折通 道具有一水平段與二垂直段，該二垂直段位於該水平段之 兩端而分別連通該接收孔與該腔室。 4. 如請求項丨所述之微機電封 # Α 屯钉裝槟組，其中該載板之 表面形成一連通該曲折通道之凹陷。 5. 如請求項1所述之微機電料模組，其中該載板為 陶瓷基板。 6·如請求項1所述之微機電封域組，其中該載板由 雙層板體堆疊而成。
TW099101854A 2010-01-22 2010-01-22 Micro electro-mechanical package module TW201126654A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW099101854A TW201126654A (en) 2010-01-22 2010-01-22 Micro electro-mechanical package module
US12/707,940 US20110180924A1 (en) 2010-01-22 2010-02-18 Mems module package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099101854A TW201126654A (en) 2010-01-22 2010-01-22 Micro electro-mechanical package module

Publications (1)

Publication Number Publication Date
TW201126654A true TW201126654A (en) 2011-08-01

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US (1) US20110180924A1 (zh)
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