TW201125917A - Photo-sensitivity resin composition, overcoating layer of color filter and photo-sensitivity resin adhesive - Google Patents

Abstract

A photo-sensitivity resin composition is provided. The photo-sensitivity resin composition comprises (A) photoreaction alkali-soluble resin adhesive, (B) photopolymerization compound containing ethylenically unsaturated group, (C) photo-initiator, (D) organic acid anhydride, (E) compound containing at least two epoxy groups in one molecule, and (F) organic solvent. (A) photoreaction alkali-soluble resin adhesive contains a polymer as shown in formula (1), wherein x = 1 to 10 mol%; y = 29 to 59 mol%; a + b = 40 to 60 mol%; a = 5 to 40 mol%; b = 5 to 25 mol%; R is benzyl, phenyl, CN or C(O)OR2, wherein R2 is C1 to C15 straight chain or cyclic alkyl, phenyl, benzyl, allyl; R1 is H or C1 to C4 alkyl.

Description

201125917 DX071102 31286twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a photosensitive resin composition, a color filter j protective film and a photosensitive resin adhesive, and particularly relates to a A photosensitive resin, a protective film of a color filter W, and a photosensitive resin binder having characteristics such as light transmittance, heat, acidity, durability, and heat discoloration. [Prior Art] Generally, a color filter of a liquid crystal display panel is formed by forming a plurality of black matrices on a glass substrate, and then sequentially forming red between adjacent black matrices. The green and blue color layers act as pixels, so that when the light passes through the element, the color will appear. In addition, after the color filter is completed, a transparent electrode is then formed to cover the black matrix and the color layer. Generally, a protective film (〇verc〇ating layer) is formed between the color filter and the transparent drain to make the surface of the color filter flat, to facilitate the manufacture of the transparent electrode, and to protect the color. The filter is not affected by subsequent processes. In general, the above protective film must have high light transmittance, adhesion, heat resistance, acid resistance and durability. In some documents, a related art relating to a protective film for a color filter has been proposed, for example, US 6,582,862, US Pat. No. 7,097,759, WO 2006/129924, and the like. In the above documents, it is disclosed that the protective film of the color filter is a negative resist composition (negative resist comp0siti), which includes the test soluble 201125917 DX071102 31286twf.doc/n resin adhesive (alkali dissolvable resin binder) ), a photopolymerization compound, a photopolymerization initiator, and a solvent. However, the compositions proposed in these documents are inferior in characteristics such as t-testability, acid resistance, and thermochromism. Therefore, the development of the composition of the protective film for the color light-passing sheet and the improvement of its characteristics have become one of the important topics in the development of the industry. SUMMARY OF THE INVENTION One invention provides a photosensitive resin composition which has characteristics such as high light transmittance, heat resistance, acid resistance, alkali resistance, and heat discoloration resistance. The present invention further provides a protective film for a color light-receiving sheet which can effectively protect a color filter. The present invention provides a photosensitive resin adhesive which has characteristics of high penetrability, heat resistance, acid resistance, durability, and heat discoloration resistance. , a kind of sensible resin composition, which comprises (4) test = heart month glue, (8) photopolymerizable compound containing ethylenic unsaturated group, (C) photoinitiator, (D) organic traitor Compound and (F) organic solvent. (A) The soluble diglute contains the polymer represented by the structural formula (1), 201125917 DX071102 31286twf.doc/n R1 Rt Ri R,

Wherein ~10 mole percentage; y = 29~59 mole percentage; a + b = 40~60 mole percentage; a = 5~40 mole percentage; b = 5~25 mole percentage; R is benzoquinone And phenyl, CN or c(〇)〇R2, wherein R2 is a linear or cyclic alkyl group of C1 to C15, a phenyl group, a benzyl group or an allyl group; and Ri is a ruthenium group or a C1 to C4 group. According to the photosensitive resin composition of the embodiment of the present invention, the weight average molecular weight of the above-mentioned soluble resin binder is, for example, between 3 Torr and 300,000. According to the photosensitive resin composition of the embodiment of the present invention, the solid content of the above-mentioned vat/gluten resin binder is, for example, between 1 〇 and 5 〇%. According to the photosensitive resin composition of the embodiment of the invention, the acid value of the above-mentioned soluble resin binder is, for example, between 10 and 400 mgKOH/g. The photosensitive resin composition according to the embodiment of the present invention is based on (A) a soluble resin binder of 100 parts by weight, (B) a photopolymerizable type of ethylenic acid-containing compound 201125917 201125917 31286 twf.doc/n unsaturated group of compounds The content is, for example, between 丨~(10) parts by weight. The inductive resin composition as described in the present invention is based on the test that the soluble resin binder is in the form of a part by weight, and (c) is, for example, between 0.1 and 1 part by weight. In the case of the core 3, the photosensitive resin composition yarn according to the embodiment of the present invention is based on the weight of the soluble tree-transfer agent, and the content of the (D) organic acid anhydride is, for example, between 0.1 and 1 part by weight. According to the present invention, the sensation of the sensation of the sensation of the tree is based on the alkali-soluble resin binder as the leakage weight portion, and the content of the compound (E) of the epoxide/epoxy group is, for example, between 丨~丨(8) parts by weight. :between. According to the present invention, the sensation of the touch-sensitive group yarn is based on the detection of the soluble resin binder as the touch-weight portion, and the content of the (F) organic solvent is, for example, between 10 and 2,500 parts by weight. According to the photosensitive resin composition of the embodiment of the invention, the viscosity of the photosensitive resin composition is, for example, between 〜2 〇 〇卬s. Further, the present invention proposes a protective film of a color filter which is obtained by polymerizing the above-mentioned photosensitive resin composition. Further, a photosensitive resin binder is proposed, which comprises an alkali-soluble resin binder. As a result of the above, the photosensitive resin composition of the present invention is polymerized by the photosensitive resin composition of the present invention because of the characteristics of high light transmittance, resistance, adhesion, durability, and heat discoloration resistance of the present invention. The color film of the colored calender can effectively protect the color shirt to further improve the performance of the component. In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following embodiments are described in detail below with reference to the accompanying drawings. [Embodiment] The present invention provides a photosensitive resin composition which has high light transmittance, heat resistance, acid resistance, alkali resistance and heat discoloration resistance.

Therefore, the protective film of the color filter obtained by polymerizing the photosensitive resin composition can effectively protect the color filter. The present invention further provides a photosensitive resin binder comprising the following (A) soluble resin binder. The photosensitive phase composition of the present invention comprises (A) an alkali-soluble resin binder, (B) a photopolymerizable ethylenically unsaturated group-containing compound, (c) a photoinitiator, (D) an organic acid anhydride, ( E) a compound having at least two epoxy groups in the molecule and (F) an organic solvent. In addition, propylene glycol methyl ether acetate (PGMEA) and 3-methoxy butyl acetate are preferably used in the adhesive or in the case of high-safety propylene glycol methyl ether acetate (PGMEA). , MBA), 3_ ethoxyethyl propionate (EEPA) and other solvents. (A) Alkali-soluble resin binder: (A) The soluble resin binder is a solution composed of a character represented by the formula (!) and a solvent such as PGMEA, MBA, EEPA, etc., 2011 25217 DX071102 31286twf.doc/ n

〇 ( 0 〇= l· R1 F !1 1 R

Ul Ri R, R,

Where H) Moer, structural formula (1) = 40~6G molar percentage knife ratio; ^ = 29~59 mole percentage; a + b

Percentage of molars; R is the percentage of the upper 5~4G molar; b = 5~25 R2 is the C1~C15 of $, phenyl, TM or C_R2, of which the base; the heart is Η or Cl~^ or a ring-based base, Phenyl, benzyl or dilute C. (A) Alkali-soluble resin binder, such as between 3G (8) and surface G. The acid value is, for example, between 10 and 400 mg KOH/g. (9) The compound containing the citrus and the base is cut, and the A) is 100 parts by weight of the soluble resin binder. (B) Photopolymerization The amount of the compound I is, for example, between 1 and 25 Torr: preferably between 20 and 60 parts by weight. A type 5 ethylenically unsaturated group-containing compound is an ethylenic acid-free compound and a compound having at least a biphenyl group. (8) Photopolymerizable type 10 201125917 DX071102 31286twf.doc/n The compound containing an ethylenically unsaturated group is, for example, ethylene glycol di(meth)acrylate having 2 to 14 ethylene oxide groups. (ethylene oxide group) of polyethylene glycol di(meth)acrylate, trimethylol propane di(meth)acrylate, triterpene propylene Trimethylol propane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(pentaerythritol tetra) (meth)acrylate), propyleneglycol di(meth)acrylate with 2-14 propylene oxide groups, dipentaerythritol penta (dipentaerythritol penta (dipentaerythritol penta) Meth)acrylate), dipentaerythritol hexa(meth)acrylate, DPHA, trimethyl sulphide triglycidyl acrylate acrylic acid (trimethylolpropanetriglycidylether acryli) c acid adjuvant) 'bisphenol A diglycidylether acrylic acid additive', phthalate diesters of phthalate diacetate -hydroxyethyl(meth)acrylate), toluene diisocyanate additive toβ-hydroxyethyl(meth)acrylate or to ethylenically unsaturated bond (toluene diisocyanate) A polymerizable compound having an ethylenically unsaturated bond, wherein the polymerizable compound having an ethylenically unsaturated bond is selected from the group consisting of ditrimethylol 201125917 DX071102 31286twf.doc/n propanetetraacrylate, Tris(2-acryloxyethyl)isocyanurate, ethoxylated pentaerylthritoltetraacrylate (EO 4 mol), pentaerythritol Pentaery Aritoltetraacrylate (EO 35 mol), ethoxylated trimethylolpropanetriacry Late) (EO 9 mol), ethoxylated trimethylpropane triacrylate (EO 3 mol), propoxylated pentaerythritoltetraacrylate (PO 4 mol), ninth Nonaethylene glycol diacrylate, dipentaerythritol hexaacrylate-modified caprolactone and trimethylolpropanejpropoxylate triacrylate The group of which is preferably dipentaerythritol hexamethylene acrylate. (C) Photoinitiator: The content of the (C) photoinitiator based on (A) the alkali-soluble resin binder is, for example, between 0.1 and 100 parts by weight, preferably between 〇 · 5 to 10 parts by weight. (C) The photoinitiator is, for example, a phosphine oxide compound carbonyl compound, an aminocarbonyl compound triazine compound or a hydrazine compound. Used in conjunction with a co-photoinitiator. The co-photoinitiator is, for example, an amine compound or an alkoxyantharcene compound 201125917 DX071102 31286twf.doc/n or a thioxanthone compound. The phosphine oxide-based compound is, for example, an arylphosphine oxide, an acylphosphine oxide, a bisacylphosphine oxide, or a 2,4,6-trimercaptobenzoyl-diphenylphosphine oxide. 2,4,6-trimethylbenzoyldiphenylphosphine oxide, TPO), 2,6-diethylbenzoyldiphenylphosphine oxide, 2,6-dimercaptobenzoyl- 2,6-dimethoxybenzoyldiphenylphosphine oxide, 2,6-dichlorobenzoyldiphenylphosphine oxide, 2,3,5,6-tetradecyl Benzoyldi(2,6-dimethylphenyl)phosphonate, 2,3,5,6-tetramethylbenzoyldiphenylphosphine oxide 2,4,6-trimethylbenzoylethoxyphenylphosphine oxide, bis(2,4,6-trimethylbenzylidene)phenylphosphine oxide (bis(2,4,6-trimethylbenzoyl)phenylphosphine (I-819)) or bis(2,6-nonanophenylphenyl)-2,4,4-tridecylphenylphosphine oxide (bis ( 2,6-dimethoxybenzoyl)-2,4,4- Trimethylpentylphosphine oxide)) ° A series of compounds such as thiophene, benzophenone, and diphenyl ketone are compounds such as thiophene compounds, amine compounds, triazine compounds, and lanthanoid compounds. 13 201125917 uAu/ιιυζ 31286twf.doc/n (biphenylketone), 1-hydroxy-1-cyclohexyl phenyl fluorenone (l, hydroxy-l-benzoylcyclohexane (1-184)), benzyl propyl -2- 2, 2- Benzyldimethylketal 2,2-dimethoxy-l,2-diphenylethane-l-one (1-651), 1-benzyl-1-diindole 1-benzyl-1 -dimethylamino-1 -(4-morpholino-benzoyl)propane (1-369)), 2-Merlin-2 -(4-indoleyl-2-(4-methylmercapto)benzoylpropane (1-907), ethylanthraquinone, 4-phenylhydrazin-4- 4-benzoyl-4-methyldiphenylsulfide, benzoinbutylether, 2-hydroxy-2-benzoylpropane, 2 -Phenyl-2-(4-isopropyl)benzil-acrylic (2-hydroxy-2-(4-is) Opropyl)benzoylpropane), 4-butylbenzoyltrichloromethane, 4-phenoxybenzoyldichloromethane, benzoylmethylformate 1,7-bis(9- °丫σ定基)heptane, 9-η-butyl-3,6-bis(2-morphin-isobutyl) )) _卡^(9_n_butyl-3,6-bis(2-morpholino-isobutyloyl)carbazole), 10-butyl-2-chloroacrydone (10-butyl-2-chloroacrydone), 2-[2-(4-曱Oxy-phenyl)-vinyl]-4,6-bis-trichloroindolyl-[1,3,5]triazine (2-[2-(4-methoxy-phenyl)-vinyl]-4, 6-bis-trichloromethyl-[l,3,5]tr iazine), 2-(4-decyloxy-cai-1-yl)-4,6-bis-trichloroindenyl (2-(4-methoxy) -naphthalen-1 -yl)-4,6-bis-trichloromethy 1- [ 1,3,5 ]tri azine), 2-toluene [1,3]dioxol-5-yl-4,6 -Bis-trichloromethyl-[1,3,5] 14 201125917 υ υ /1102 31286twf.doc/n Triazine (2-benzo[l,3]dioxol-5-yl-4,6-bis- Trichloromethyl-[l,3,5]triazine), 2-mercapto-4,6-bis(triseodecyl)-s-triazine (2-11161;]1}4-4,6-1^( Out <:111〇1:〇1 1^1:11^1)-5-1:1^211^), 2-phenyl-4,6-bis(trichloroindenyl)-s-trioxin (2-phenyl_4,6-bis( Trichloromethyl)-s-triazine) or 2-naphthyl-4,6-bis(trichloromethyl)-s-triazine.

The amine compound is, for example, triethanolamine, methyldiethanolamine, triisopropylamine, 4-dimethylaminomethyl benzoate, 4 -4-dimethylaminoethyl benzoate, 4-methylaminoisoamyl benzoate, 2-mercaptoaminoethyl benzoate 2-methylaminoethyl benzoate, 4-dimethylamino-2-ethylhexyl benzoate, hydrazine, fluorenyl-fluorenyl anilide (^>1-11^1%1卩& such as 〇11^(^116), 4,4'-bis(didecylamino)diphenylhydrazine_(4,4'-bis(dimethylamino) Benzophenone), 4,4'-bis(diethylamino)benzophenone or 4,4'-bis(ethyldecylamino)diphenylhydrazine The 4,4'-bis(ethylmethylamino)benzophenone decyloxy oxime compound is, for example, 9,10-dimethoxy anthracene, 9,10-diethoxy蒽(9,10-diethoxyanthracene), 2-ethyl 9,10- 2-ethyl-9,10-dimethoxyanthracene or 2-ethyl 9,10-diethoxyanthracene ° 15 201125917 DX071102 3J286twf.doc/n The thioxantane compounds are, for example, 2-isopropylthioxanthone, 4-isopropylthioxanthone (IPTX), 2,4-diethylthioxanthone (2,4). -diethylthioxanthone,DETX), 2,4-tricWorothioxanthone or 1-chloro-4-propoxythioxanthone ° (D) Organic acid anhydride: The content of the organic acid anhydride is, for example, between 0.1 and 1 part by weight, preferably between 2 and 5 parts by weight, based on 1 part by weight of the (A) alkali-soluble resin binder. (D) The organic I anhydride is, for example, maieic anhydride, itaco.nic anhydride, tetmhydrophthalic anhydride, citrac〇nic anhydride Or mesaconic anhydride, preferably maleic anhydride. The above organic acid anhydrides may be used singly or in combination of several kinds. (E) a compound having at least two epoxy groups in the molecule: based on (A) the testable resin binder is 1 part by weight, and the content of the compound having at least two epoxy groups in the molecule (E) is, for example Between 〇.丨~1(10) parts by weight, preferably between 2 and 1 part by weight. (E) A compound having at least two epoxy groups in the molecule is, for example, a bisphenol A type epoxy compound, a bisphenol s epoxy compound, 芴_9_bisphenol Diepoxyglycerol ^ 16 201125917 DX071102 31286twf.doc/n (fluorene-9-bisphenol diglycidyl Ether, FBDE), bisphenol A type epoxy resin (for example: oiled Shell Epoxy company, product Epoxy resin (eg: Epikote 828, 1001, 1002, 1004, etc.), a double-type epoxy resin alcoholic hydroxyl group and epichlorohydrin The company's 'commercial name is NER-1302, epoxy equivalent 323, softening point 76 ° C), bisphenol F type epoxy resin (for example: oiled Shell Epoxy company, products An epoxy resin obtained by reacting an alcoholic hydroxyl group with an epichlorohydrin called Epikote 8〇7, 40 (M, 4002, 4004, etc.) For example: Nippon Chemical Co., Ltd.'s product name is NER-7406 'Epoxy when 350 'softening point 66 〇 C), biphenyl glycidyl ether (for example: oiled Shell Epoxy company's trade name Epikote YX4000), benzene phenol novolac type Epoxy resin) (for example, manufactured by Nippon Kayaku Co., Ltd., trade name EPPN-201; manufactured by Oily Shell Epoxy Co., Ltd. under the trade name Epik〇te 152, 154, 157S65, IWSTO; manufactured by The Dow Chemical Company under the trade name DEN_438 ), bis( phenyl) acid type epoxy resin (cres〇i nov〇iac ep〇xy resin) (for example: manufactured by Nippon Kayaku Co., Ltd., trade name, 1 〇 4S), triglycidyl isocyanurate (triglycidyl iS0cyanUrate) (Example =: manufactured by Nissan Chemical Co., Ltd., trade name: TEPIC), and trisphenol methane type epoxy resin (for example, manufactured by Nippon Kayaku Co., Ltd.) 502, 5〇3), 苟-type epoxy resin (for example, manufactured by Shinkai Iron Chemical Co., Ltd., trade name: ESF·300), and lipid-based epoxy resin (for example, manufactured by Daicel Chemical Industry Co., Ltd., Named 17 201125917 DX071102 31286twf.doc/n

Ce loxlde 20 IP > EHPE) ^it pP rri Daicei Chemical Industry Co., Ltd., the trade name is the mother ^ 脳 (8)) ' It is preferred to be a rhyme diethylene oxide _. The above compounds having two epoxy groups in the range of 4 to 5 may be used singly or in combination of several kinds. (F) organic solvent: based on (A) the content of the soluble tree scale _ 1 () () parts by weight of the solvent is, for example, between 1 〇 25 25 θ θ θ ζ & & & & & & & & & & & & & & & It is preferably between 80 and 250 parts by weight. (F) The organic solvent is, for example, PGMEA, hydrazine or ΕΕρΑ. The above organic solvents may be used singly or in combination of several kinds. Further, as a protective film of a color filter, the fat composition of the present invention is mainly a test of a soluble resin binder, a compound containing an ethylenically unsaturated group, (c) a photoinitiator, (D) The compound having at least two epoxy groups in the (E) molecule is the main component. Of course, depending on the actual needs, the following various additives may be added as necessary. In one embodiment, the adhesion may be further added. The additive (c〇upHng agent) ' enhances the adhesion between the photosensitive resin composition and the color filter, and promotes adhesion between the photosensitive resin composition and the transparent electrode. The photosensitive resin composition is The amount of the adhesion aid may be between 0.01 and 30 parts by weight, preferably between 5 and 3 parts by weight, based on 1 part by weight. The adhesion aid is, for example, an epoxy group or an amino group. An anthracene compound, for example, a cold 18 201125917 DX071102 31286twf.doc/n -(3,4-epoxycyclohexane)ethyl trimethoxysilane,/5 -(3,4-epoxycyclohexanide)ethyltriethoxy-Xi Xing·(p-(3,4-epo) Xy-glycidoxypropyl methyldimethoxysilane γ-glycidoxypropyl methyldimethoxysilane γ-glycidoxypropyl methyldimethoxysilane γ-glycidoxypropyl methyldimethoxysilane γ-glycidoxypropyl methyldimethoxysilane γ-glycidoxypropyl methyldimethoxysilane Gamma-glycidoxypropyl methyldiethoxysilane, γ-glycidoxypropyl dimethoxy (ethoxy)silane, Y-glycid Gamma-glycidoxypropyl dimethyl (methoxy) silane, γ-glycidoxypropyl dimethyl (ethoxy) silane, 3,4-epoxy Butyl trimethoxy oxime (3,4 < mouth €^1>111^11; 1*丨11^11(^5^匕), 3,4-epoxybutyltriethoxy zeshi (3,4-epoxybutyltriethoxysilane), N-(2-aminoethyl)-3-aminopropyl-3-aminopropyldimethoxymethylsilane, (3-aminopropane) (3-aminopropyl) trimethoxysilane, (3-aminopropyl) triethoxysilane, (N,N-diethyl-3- Propyl) (N,N-diethyl-3-aminopropyl)trimethoxysilane or Ν-β(aminoethyl)γ, amine propyl dimethoxycarbazone (Np(aminoethyl)Y) -aminopropyl ishi imethoxysilane). The above-mentioned adhesion aids may be used singly or in combination of several kinds. In an embodiment, a surfactant may be further added. 19 201125917 DX071102 312 86twf. doc / n based on the photosensitive resin composition is 100 parts by weight, the amount of the surfactant can be used; 丨 between 0.01 and 0 parts by weight, preferably between 〇. 5~3 parts by weight between. The surfactant is, for example, polyoxyethylene alkyl ethers (for example, polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether) (polyoxyethylene oleyl ether)), polyoxyethylene aryl ethers (such as polyoxyethylene octyl phenyl ether & 〇iyOXyethylene octyl phenyl ether), 壬 盼 聚 聚 聚 〇 y y y y y yyy Phenyl ether)), p〇iyethylene glycol dialkyl esters (eg, polyethylene glycol dilaurate Q) 〇iyethyiene glycol dilaurate), polyethylene glycol Stearic acid (p〇iyethyiene glycol distearate), organic oxalate polymer p〇iymer) (for example, KP341 (manufactured by Shin-Etsu Chemical Industry Co., Ltd.)) or (meth)acrylic polymer ( (meth)acrylic acid polymer) (for example, p〇lyflow No. 75, 90, 95 (manufactured by Kyoei-Sha Yushi Kagaku Kogyo Co., Ltd.), Megafac F171, F172, F173, F475 (by Dainippon Chemicals ana Ink Co) ·, manufactured by Ltd.), Flor Ard FC430, FC431 (manufactured by Sumitomo 3M Co., Ltd.), Asahi Gard G710, Serflon S382, SC-101, SC-102, SC-103, Sc-104, SC-105, SC-1068 (by Asahi Glass Co., Ltd. manufacture)). The above surfactants may be used singly or in combination of several kinds. In an embodiment, other additives such as a deformer, a leveling agent, a fmal polymerization inhibitor agent, and the like may be further added. The photosensitive resin composition of the present invention is mainly produced by the above (A) test 20 201125917 DX071102 31286twf.doc/n soluble resin binder, (B) photopolymerizable ethylenically unsaturated group-containing compound, and (C) light. The initiator, (D) an organic acid anhydride, a compound having at least two epoxy groups in the (E) molecule, and (F) an organic solvent are uniformly mixed into a solution state in a stirrer, and the viscosity thereof is between 1 and 200 cps. Preferably, it is between 3 and 25 cps. The photosensitive resin composition of the present invention can be applied onto a substrate by spin coating, cast coating, cast-spin coating or the like. After coating, φ was prebaked at 80 C for 2 minutes to remove the solvent. Then, the full exposure is 200 mJ/cm2. After development, it is baked at 23 Å < t for 2 minutes to form a photosensitive resin layer of 1 to 1.5 μm, and can be used as a protective film for a color filter. The substrate described above is, for example, an alkali-free glass, a soda-lime glass, a hard glass (Pyrus glass), a quartz glass, or a photoelectric conversion device substrate (such as a germanium substrate) for a liquid crystal display device. . The structural formula (1) of the present invention will be described by taking a synthesis example of the following (Α) alkali-soluble resin binder constitutive formula (2Α) as an example, but is not limited thereto. Wherein, the g-group a control includes a functional group h, the functional group b control includes a functional group 1' functional group, which includes a functional group c, and the fluorenyl group includes a d, e, f, g ° (A) soluble resin The bonding agent is a synthetic example of the structural formula (2A). 201125917 DX0711U2 31286twf.doc/n

Structural formula (2 A) wherein c=l mole percentage; d=19 mole percentage; e=3 mole percentage; f=2 mole percentage; g=30 mole percentage; h=15 mole percentage; = 30 mole percentage. h + i = 45% of the mole, in the range of 40 to 60 moles. The detailed synthetic procedure for this synthesis is illustrated as follows: 9 grams of 2,2-azobisisobutyronitrile (AIBN), 630 grams of PGMEA solvent and 10 grams of chain transfer were added to the reaction flask. (a-methyl styrene dimer) and dissolved by stirring. Then, 50.2 g of dicyclopentanylmethacrylate, 46.4 g of methacrylic acid, 4.5 g of allylmethacrylate, and 1.6 g of methacrylic acid were added. Methacrylonitrile, 37.5 g of styrene, 2.9 g of 2,2-dimethyl-1,3-propanediol diacrylate, And the reaction was carried out for 2.5 hours by introducing nitrogen 22 201125917 ju/Λυ /1102 31286 twf.doc/n and heating to 80 ° C with stirring. Next, 0.3 g of AIBN was dissolved in 10 g of PGMEA' and dropped into the reaction flask over 10 minutes to continue the reaction for 12 hours. Thereafter, the nitrogen gas was stopped, and 51.2 g of glycidyl methacrylate, 2.5 g of a catalyst (1-methylimidazole) and 0.15 g of an inhibitor (4-oxo-oxygen) were added. 4-methoxyphenol) and allowed to react in air for 19 hours. The obtained product resin solution had a solid content of 27.2 wt.%; a viscosity of 11 cp cpS/25 ° C; an acid value of 57.3 mgKOH/g; and a weight average molecular weight of 11,867. Example 1 Using 10 parts by weight of (A) an alkali-soluble resin binder having the following structural formula (2A),

Structural formula (2A) wherein c = 1 mole percentage; d = 19 mole percentage, e = 3 mole percentage; f = 2 mole percentage; g = 30 mole percentage; h = 15 mole 23 201125917 /ii 31286twf.doc/n percentage; i = 30 mole percentage. 2.7 parts by weight of DPHA, 0.5 parts by weight of FBDE, 0.25 parts by weight of ruthenium, 0.2 parts by weight of 1-907, 0.5 parts by weight of ruthenium, osmium, iridium, 2 parts by weight of the adhesion promoter GTS, and 4 parts by weight The solvent PGMEA was dissolved and dissolved by stirring to prepare a photosensitive resin composition for a color filter (Table 1). The photosensitive resin composition was evaluated by the following various measurement evaluation methods, and the results are shown in Table 2.

Comparative Example 1 10 parts by weight of a (base) alkali-soluble resin binder having the following structural formula (2R) was used.

Structural formula (2R) where c 1.4 mole percentage; d = 23.5 mole percentage; e = 3.8 mole percentage 'f = 2.6 mole percentage; g = % 7 mole percentage; ^ = IS mole percentage; 1 = 15 mole percentage. 27 parts by weight of DPHA, 0.5 parts by weight of FBDE, 0.25 parts by weight of ma, 0.2 parts by weight of 24 201125917 /1102 31286twf.doc/n 1-907, 0.5 parts by weight of PTX, 0.02 parts by weight of dense The auxiliary gts and 4 parts by weight of the solvent PGMEA were stirred and mixed to prepare a photosensitive resin composition for a color calender sheet (Table 1). The photosensitive resin composition was evaluated by the following various measurement evaluation methods, and the results are shown in Table 2. Table 1 Composition Resin Adhesive (g) DPHA (g) FBDE (g) MA (g) Photoinitiator (g) GMS (g) Solvent (g) Example 1 Structural Formula (2A) 10 2.7 0.5 0.25 1 -907(0.2) IPTX(0.05) 0.02 PGMEA(4) Comparative Example 1 Structural Formula (2R) 10 2.7 0.5 0.25 1-907(0.2) ΙΡΤΧ(〇.〇5) 0.02 PGMEA(4) Evaluation Method: 1. Heat The photosensitive resin layer on the obtained glass substrate was oven-treated at 25 ° C for 60 minutes, and the film thickness change before and after the treatment was measured by profiler Tencor a - step 500. 〇: thickness change < 6% X: thickness change 26% 2. Validity The photosensitive resin layer on the obtained glass substrate was 25 ± 2 . The membrane was immersed in 10% NaOH for 3 hours, and the membrane thickness before and after treatment was measured by profller Tencor α-step 500. 〇: thickness variation <1% X: thickness variation ^3% 25 201125917 L/yw /11 31286twf.doc/n III. Acid resistance The photosensitive resin layer on the obtained glass substrate was 25 ° C ± 2 The solution was immersed in 10% HCl for 3 hours at ° C, and the film thickness changes before and after the treatment were measured by profiler Tencor a-step 500. 〇: thickness change <1% X: thickness change ^3% 4. Solvent resistance The photosensitive resin layer on the obtained glass substrate was immersed in NMP at 25 ° C ± 2 ° C for 3 hours, and The film thickness changes before and after treatment were measured by profiler Tencor ck -step 500. 〇: thickness change < 1% X: thickness change ^ 3% 4. Transmittance The photosensitive resin layer on the obtained glass substrate was measured for light transmittance at a wavelength of 380 to 800 nm. 〇: light transmittance > 97% X: light transmittance < 97% V. Heat-resistant discoloration The photosensitive resin layer on the obtained glass substrate was 250. (: The oven was treated for 60 minutes, and the light transmittance was measured by light of a wavelength of 380 to 800 nm. 26 201125917 I li 02 31286twf.doc/n 〇: The light transmittance was changed by 5% or less Δ: Light transmittance change 5 %〜10% X : The light transmittance changes by 10% or more. 6. Adhesiveness The photosensitive resin layer on the obtained glass substrate is cross-cut and the film is peeled off by adhesive tape. Layer to carry out, try 0

〇: Residual photoresist film exceeds 98% X: Residual photoresist film is less than 98%

In summary, the alkali-soluble resin binder of the present invention successfully synthesizes a higher proportion of functional groups h and i, and can obtain better heat resistance and alkali resistance. Therefore, the photosensitive resin composition of the present invention has a higher composition. The color filter, the heat resistance, the acid resistance, the alkali resistance and the heat discoloration property, and the protective film of the color filter obtained by polymerizing the photosensitive tree composition can effectively protect the color filter Light film. Further, the photosensitive resin binder 1 having the present invention has the characteristics of high light transmittance, heat resistance, acid resistance, durability, and heat discoloration resistance. Although the present invention has been disclosed above by way of example, it is not intended to be limited to 27 201125917. W </ RTI> </ RTI> <RTIgt; The scope of protection is subject to the definition of the scope of the patent application attached. [Simple description of the map]

[Main component symbol description] None

28

Claims (1)

312S6twf.doc/n 201125917” j vvr # Λ x VII. Patent application scope: 1. A photosensitive resin composition comprising: (A) a soluble resin binder containing the polymerization represented by the structural formula (1) Object, Rr 0= 0= 〇( )HCD 0= F &lt; 〇= Ο Ri F Structural formula (1, where 1~10 mole percentage; y = 29~59 mole percentage ^=40~60 mole percentage; a=5~ 4 〇 mole percentage; ^ percentage; R is phenyl fluorenyl, phenyl, CN or c (〇) 〇 R2, its ~Cl5 direct bond or cyclic alkyl, phenyl, methyl or olefin, Ri An alkyl group of H or C1 to C4; (B) a photopolymerizable ethylenically unsaturated group-containing compound; (c) a photoinitiator; (D) an organic acid anhydride; (=) a molecule having at least two rings a compound of an oxy group; and (F) an organic solvent. 2. A photosensitive resin composition as described in the scope of claim 2 29 286 twf. doc/n 201125917 / Λ A, wherein (A) an alkali-soluble resin binder The weight average molecular weight is between 3,000 and 30,000. ' 3. The photosensitive resin composition as described in the patent application 帛i, wherein the solid content of the (A) alkali-soluble resin binder is between ι 〇 〇 〇 〇 之间° 4. As stated in the scope of application of the patent scope, (4) _ between = 〇 〇 〇 mgKOH / g of the soluble resin binder.利面! Item,: based on (4) the test of soluble resin binder; two or two parts of photopolymerization type of ethylenically unsaturated group containing two parts by weight. J 3, 丨 1~250 6. The content of the photoinitiator according to claim 4, wherein the content of the photoinitiator is from 0.1 to 100% based on (4) the alkali-soluble resin gel f composition; the content of the organic acid anhydride of the (C) compound is between 〇· 1 to 100 parts by weight. 73 () 8. According to the scope of claim 1, wherein the soluble resin binder is based on (4) the composition of the group: the content of the compound containing two epoxy groups If the product is covered by the scope of the patent application, the content of the organic solvent is based on (4) the test of the soluble resin binder, · weight = group = 30 201125917 J-^yvu / ii 02 31286twf.doc / n The photosensitive resin composition as described in claim 1, wherein the photosensitive resin composition has a viscosity of between 1 and 200 cps. The protective film of the filter is one of the items i to 10 of the patent application scope. The photosensitive resin composition obtained by polymerizing 12 - kind of a photosensitive resin adhesive, comprising: (A) an alkali-soluble resin binder containing a polymer represented by the formula (1), With X /,, mouth knife, y = π ~ π phantom percentage; a + b / 〇 ~ 6G molar percentage; au molar percentage; b = 5~25 mole percentage; R is clumsy base, benzene a group, cn or c(〇)OR2, wherein R2 is a linear or cyclic alkyl group of a CCl group, a phenyl group, a methyl group or a propyl group; and R1 is a group of a C4 group; (B) a phototype a compound containing an ethylenically unsaturated group; (C) a photoinitiator; 31 201125917 j ιυζ 31286twf.doc/n (D) an organic acid anhydride; (E) a compound having at least two epoxy groups in the molecule; ) Organic solvents. 13. The photosensitive resin adhesive according to claim 12, wherein (A) the soluble resin binder has a weight average molecular weight of from 3,000 to 300,000. 14. The photosensitive resin adhesive according to claim 12, wherein (A) the acid resin of the soluble resin binder is between 10 and 400 mgKOH/g. 32 201125917 uau / η υζ 31286twf.doc/n IV. Designated representative drawings: (1) The designated representative figure of the case: None (2) The symbolic symbol of the representative figure is simple: Yiwu. If there is a chemical formula in this case, please reveal The chemical formula that best shows the characteristics of the invention: OH Rf Ο OH OR 〇 OH R1 R1 R1 Ri Ri Structure (1)