TW201125595A - Substrate for effusing volatile compositions and effusion method for volatile compositions - Google Patents

Abstract

This invention provides a substrate for effusing volatile compositions, which is capable of (1) making volatile compositions effused without using mechanical means such as applying pressure, and (2) preventing the volatility from being degraded or deteriorated even the pack is not sealed when not in use. The substrate (10) for effusing volatile composition is characterized in that it has a plate-shaped base material (20A), heating elements (30) (32) that selectively heats a partial area (40A) of the plate-shaped base material, and microcapsules, wherein the microcapsules are at least equipped in the heating area (40) and include core material containing volatile compositions and shell material that covers the core material will be damaged when heated.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for escaping volatile components and a method for dispersing volatile components. [Prior Art] In the prior art, various kinds of aromatic products are provided for the purpose of calming effect, sleeping effect, refreshing effect, analgesic effect, antibacterial effect, deodorizing effect and the like. Among these aromatic products, as a product using so-called essential oils, there is also a heating method in which an essential oil (or a thin solution containing a fine solution or a solution impregnated with the solution) is heated to dissipate the fragrance, and the natural oil is not heated to make it natural. Non-heating method of ground dissipation. As the non-heated aromatic product, there are known a bottle having a solution filled with a solution in which the aromatherapy agent is dissolved, and a dissipating portion which sucks out the solution in the bottle and escapes to the outside. Further, a thin plate-shaped aromatic product containing an aromatic agent (hereinafter referred to as "aroma plate" is known). As the aroma plate, for example, an aroma plate in which a microcapsule containing an aromatic component is adhered to a substrate is known (Seeking Document 1). In the aroma plate disclosed in the document 1, the microcapsules are broken by applying pressure, whereby the aroma components are dissipated to the outside of the aroma plate. Further, as a seat having a function or composition similar to that of the aroma plate, there is known a so-called mosquito repellent piece which is made to escape the volatile insecticidal component which penetrates into the sheet by heating by the electric warmer (mosquito repellent mat) ). [Patent Document 1] Japanese Laid-Open Patent Publication No. JP-A-2002-265353, No. JP-A-2002-265353, the present invention is a subject of the invention. However, in the aroma plate disclosed in Patent Document 1, the aroma plate is not pressed or rubbed by hand. When pressure is applied, the aromatic component cannot be dissipated. In addition, it is necessary to store in a state in which it is sealed by an aluminum bag or the like in order to store it in a thin plate in which a hairy insecticidal component is infiltrated, such as a mosquito-repellent sheet. In addition, once removed from the bag, the insecticidal component naturally volatilizes, so the volatility deteriorates. The present invention has been made in view of the above circumstances, and an object thereof is to provide (1) a volatile component that can be dissipated without using a mechanical method such as pressing, and (2) a volatile property of an unsealed package when not in use. The substrate for bursting of the bursting component which does not deteriorate, and the method of scattering the volatile component using the substrate. <Object of the Invention> The above problems are achieved by the following invention. That is, the volatile component of the present invention is dispersed in the peripheral substrate, and is characterized in that it has a plate-like substrate, a heating element that selectively heats a partial region of the plate-shaped base seal, and a microcapsule, wherein the microcapsule is disposed at least The heating zone is selectively heated by the heating element, and includes a nicotine containing a volatile component and an outer casing material which is covered by the anger material while being broken by heating. In one embodiment of the substrate for bursting the component of the present invention, it is preferred that at least one of the aroma component, the insecticidal component, the antibacterial component, and the deodorant component is selected as the hair component. In another embodiment of the substrate for displacing volatile components of the present invention, it is preferred that the plate-shaped base material has a hollow portion and that the microcapsules are disposed in the hollow portion. In another embodiment of the substrate for bursting the component of the present invention, it is preferred that the material constituting the plate-like substrate is at least one selected from the group consisting of resin, cellulose, and ceramic. In another embodiment of the substrate for bursting component of the present invention, the plate-shaped substrate is provided with a communication from a region in which the microcapsules are disposed in the plate-like base to the surface of the plate-like substrate. The hole is better. In another embodiment of the substrate for volatile component dispersion of the present invention, flexibility is preferred. In another embodiment of the substrate for displacing volatile components of the present invention, the heating element is provided with one wire which is axially parallel to the plane of the plate-like substrate, and is disposed in a thickness direction with respect to the plate-shaped substrate. Another wiring that is separated from one wiring and is parallel to the flat surface of the plate-like substrate and intersects one wiring, and a region where one wiring and the other wiring intersect is used as a heating region.撢作周为佳. In another embodiment of the substrate for volatile component dispersion of the present invention, it is preferable that the heating element is constituted by a heat generating chip. In another embodiment of the substrate for displacing a volatile component of the present invention, it is preferable to provide a escaping component having a burst member having a cylindrical member disposed in the tubular member. The microcapsules inside and the heat generating chips arranged to seal the opening on one side of the tubular member. In another embodiment of the substrate for volatile component dispersion of the present invention, it is preferable to have two or more heating regions in 201125595. In another embodiment of the substrate for volatile component dispersion of the present invention, the volatile component contained in the microcapsules disposed in one heating zone and the volatility contained in the microcapsules disposed in the other heating zone The type of ingredients is different. In another embodiment of the substrate for displacing volatile components of the present invention, it is preferable to have four or more heating elements: and each of the heating TG members is arranged in a matrix in the plane direction of the f-transformed substrate. The method for dispersing the burst component of the present invention preferably uses the substrate for dissipating the volatile component and heating the at least one heating region to disperse the volatile component to the outside of the substrate for dissipating the volatile component. The substrate for dispersing a volatile component has a plate-shaped base, a heating element that selectively heats a part/region of the plate-shaped base, and at least a heating that is selectively heated by the heating element. The microcapsules in the region and including the core material containing the volatile component and the outer shell material which is coated by the core material while being destroyed by heating. In one embodiment of the method for dispersing a volatile component of the present invention, it is preferable that the substrate for volatile component escape has two or more heating regions, and one or more heating treatments are repeated, wherein the heat treatment is performed. After the first heat treatment of one part of the entire heating zone and heating, a part or all of the remaining heating zone which has not been heated once is selected and heated. According to the present invention, it is possible to provide (1) capable of dissipating the burst component without causing mechanical methods such as pressing, and (2) not deteriorating even if the package is not sealed at the time of 201125595. A substrate for escaping volatile components and a method for dissipating volatile components using the substrate. [Communication method] (a substrate for dispersing a volatile component) The substrate for volatile component dispersion of the present embodiment has a plate-shaped base material (plate-shaped base material) and selectively forms a part of the plate-shaped base material. a heating element that heats the area, and a microcapsule (micr 〇capsu丨e), wherein the microcapsule is disposed at least in a heating zone that is selectively heated by the heating element, and includes a core material containing a volatile component And an outer casing that is destroyed by heating while covering the core material. In the substrate for volatile component dispersion of the present embodiment, a microcapsule including a core material containing a burst component and a shell # which is covered by the core # and destroyed by heating is used. Therefore, when the microcapsules disposed in the heating zone are heated by the heating element, the volatile component is dissipated to the outside of the substrate for escaping the volatile component due to the destruction of the outer casing. Therefore, the volatile component can be dissipated without using a mechanical method such as pressing. Further, since the volatile component is contained (inclusive) in the microcapsule, the volatile component does not naturally volatilize and disappear unless the microcapsule is heated from the outside. Therefore, the volatile energy is not deteriorated even when the peripheral substrate is not sealed by the bursting component when not in use. Hereinafter, the details of each portion constituting the volatile component dissipation substrate of the present embodiment or the structure of the volatile component dissipation substrate will be described. (Volatile component) Volatilization used in the substrate for volatile component scattering in the present embodiment 201125595

It is also preferable to use an aromatic component in particular. Further, it may be a component having two or more functions, such as an aromatic function and an antibacterial function. It is preferable to use a refreshing component, an insecticidal component, or a lesser one, and it may be transferred to the five volatile components, and the volatile salty component used is an aromatic component, and there is no particular limitation as long as it is a known aromatic component. As the suitable component, for example, an essential oil, a synthetic fragrance, an animal fragrance, an active component or a monomer compound of these, and the like, and an active component contained in an essential oil or an essential oil is preferable. As the essential oil, for example, ylang-ylang oil (Y|ang γ丨ang)

Essential Oil), Geranium Essential Oil, La vender Essential〇i丨, Jasmine Essential Oil, Chamomile Essential Oil, Lavendery Essentia丨Oil), Hyssop Essential Oil, Rose Essential Oil, Neroli Essential〇Π, Cedarwood Essential Oil, Youli Spear 1] Essential Oil (Eucalyptus Essential Oil), Cypress Essential Oil, Hinoki Essential Oil, Sandalwood Essential Oil, Juniper Essential Oil, Tea 201125595

Tea Tree Essential Oil, Pine Tree;; Pine Essential Oil, Patchou丨i Essential〇i丨, Orange Essential Oil, Grapefruit Essential Oil Lime Essentia I oil, Lemong "ass Essential oil", Lemon essence: Lemon Essential oil, Citronella Essential Oil, Bergamot Essential oil, Peppermint Peppermint Essential oil, Rosemary Essential oil, Clary Sage Essential oil, Clove Essential oil, Thyme Essential oil, Fennel Essential oil), Marjoram Essential oil, Melissa Essential oil, Rosewood Essential oil, 巳asil Essential oil, Bate Essential oil, Natural essential oils such as Cinnamon Essential oil. Among them, especially ylang-ylang oil, Hollyhock essential oil, cedar essential oil, eucalyptus essential oil, cypress essential oil, orange essential oil, grapefruit essential oil, muslim essential oil, peppermint oil, rosemary essential oil. In addition, these fine and oil combinations can also be combined. For use as an active component contained in the essential oil, for example, Linalool, Linalyl acetate, 1-Limonene, 1-menthol (1- Menthol ), a-pinene, β-pinene, Citral, Cineole, d-camphor, Thym® ), 201125595 Eugenol, cinnamaldehyde, Chamazulene, Bianyou-4 (Dinghujano Bu 4), Borneo! (Borneo!), a-terpineol (a_terpjne〇l) , β-terpineol (pre-terpineol), pine oil dilute-4 (Τθ"ρίηθηοΝ4), geraniol (Geranio丨), nerol (Ne "o|), a-santalol (a- Santalol) 'β-santa丨ol, carotol, Cedrol, green leucovorin (\/1"丨(^1:丨〇"〇丨) , Sclareol, Saf "ole", celery brain (Apiol), Myristiciπ, methylchavicol, Anethole, sclareol oxide (Sclareol oxide), Manoy丨oxide, Citronellal, and the like. Further, it is also possible to use these active components in various combinations.

As the insecticidal component, a known volatile insecticide can be appropriately selected depending on the use thereof. Specific examples thereof include pyrethroid-based insecticides such as phenothrin and fenpropathin, and organic fillers such as pyrithion. Biphenylcarninol, such as Kelt hane, Phenyl salicylate, etc., Empenthrin, 2,3,5,6-tetrafluoro- 4-methoxymethylindolyl 3-(1-propanyl)-2,2-dimercaptocyclopropanone acid (2, 3, 5, 6-tetrafluo "o-4-methoxymethyibenzyl 3" - (1-propenyl)-2,2-dimethylcyclop "opanecarboxy丨ate", 2' 3' 5,6'-tetraki-4-mercaptobenzyl 3-(1-propanyl)-2,2- Dimercaptocyclopropanecarboxylate and 2,3,5,6-tetrafluorobenzyl 3-(2,2-dichloroacetamidine 201125595 alkenyl)-2,2-dimethylcyclopropanecarboxylate (2,3,5,6-tetraf 丨uorobenzy 丨3-(2 = 2-dichlorovinyl ) -2 , 2-dimethylcyclopropanecarboxylate), pyrethroids, etc. As an antibacterial ingredient = can be appropriately selected according to its use Known volatile antibacterial agent Molding agent. Specific examples thereof include erythritol (Hinokitiol), Xanthone, phyton, etc. As a deodorizing component, as long as it has burstiness and deodorization As the substance of the effect, it is possible to use a known substance, for example, a volatile substance having a biological deodorizing function, a sensory deodorizing function, or a chemical deodorizing function, and having a water-containing garbage generated in the kitchen. In the substance of the biological deodorizing function which is used for the elimination of the odor of the bacteria, the antibacterial component can be used as a deodorizing component. The above-mentioned aromatic component is used as a chemical deodorizing function which chemically reacts with a component which is a source of malodor and becomes an odorless component, for example, from leaves, petioles, nucleus, stems, roots and bark of plants. Plant deodorant ingredients extracted from various parts, or lactic acid, gluconic acid, succinic acid, glutaric acid, adipic acid, malic acid Acid, maleic acid, fumaric acid, itaconic acid: organic acids such as citric acid, benzoic acid, salicylic acid, various amino acids and their salts, glyoxal, oxidizing agents, flavonoids, children Catechin, multi-i classification, etc. In addition, the kind of the plant for obtaining the odor-removing component is not particularly limited, but is, for example, Oxalis corniculata, Houttuynia 11 201125595 cordata, Tsusa sieboldii, Ginkgo bi丨oba, Pinus thunbergii, Larix leptolepis, Pinus densiflora, Paulownia tomentosa, Fortune's osmanthus, Syringa vulgaris, Dan It is preferred to have smanthus fragrans var. aura ntiacus, Petasites japonicus, Farfugium japonicu m, tea tree or forsythiasuspensa. Further, in addition to these, as a plant for obtaining a plant deodorant component, an oryxae (eaceae), a Pinaceae plant, a Theaceae plant, or a culture derived from these plants can also be used. Plant cell culture lines, etc. (Microcapsule) The microcapsule used in the substrate for volatile component dispersion of the present embodiment can be produced by a known microcapsule production method. As a general classification of the method for producing microcapsules, chemical methods, physical and chemical methods, and mechanical methods can be cited. Further, examples of the (1) chemical method include a Suspension Polymerization method, a miniemulsion polymerization method (mjniemuisj0n p〇|ymerizati〇n meth〇d), a ritual liquid (emulsification) polymerization method, and a precipitation polymerization method. , dispersion polymerization method, interfacial polymerization method (丨nterfacial Polymerization method), liquid hardening method (liquid subsurface hardening method), as (2) physical and chemical methods, can be mentioned in the case of dry liquid, phase inversion emulsification method Phase 丨 nversi〇n ulsification method ), coacervation method (c〇acervatj〇n meth〇cj), (3) mechanical method, for example, spray drying method (201125595), hetero-polycondensation method (Hetero-flocculaiion method) (For example, refer to Shiyan. Y彳 夕口力7. Seven small adjustments 0 and a half for 彳y 卜), Zhong Yiren, Co., Ltd. 亍 シ ^シ only 厶 ("The key to nano-microcapsule adjustment", Tanaka Real, TECHNO-SYSTEM Co., LTD)). w

In the case of 5 k microencapsulation, the interfacial polymerization Ί coacervation method is also used as #. The production of the microcapsules can be carried out, for example, by the following interfacial polymerization method. First, as the original material of the core material constituting U 4 f, oil # prepared by dissolving or dispersing a volatile component in a hydrophobic: organic solvent is prepared. Then, the oil phase is poured into an aqueous phase in which the water-soluble polymer is dissolved, and emulsified and dispersed by a stirrer such as a homogenizer (HomGgenizer). Then, a polymer formation reaction is caused at the oil droplet interface by adding the obtained emulsion to the dish. By this, the microcapsules which are covered with the core material containing the volatile component are covered. Further, as the outer casing constituting the microcapsule, a material which is melted by heating or destroyed by thermal decomposition is used. As such a material, an organic material having a melting point of about 85t to 135t is preferably used. Further, the melting point is more preferably in the range of 85 t to 1 〇 5 °C. When the melting point is less than 85t, when the substrate for displacing volatile components is placed in a high-temperature environment, the outer shell of the microcapsules is naturally melted to escape the volatile components to the outside. Further, when the melting point exceeds 1 3 5 C, the outer shell of the microcapsule does not melt even when heated by the heating element, so that the volatile component does not escape to the outside. Specific examples of the outer casing material may be mentioned, for example, a gel (G e丨a t i η ), 13 201125595

Rosin, Gum arabic, Shellac, Sodium alginate, Polyvinyl alcohol, Ep0Xy, Polyacetate (p0|yUrethane), Polystyrene, Polyacrylamide, Polyester, Polyamide, Urea, and the like. Further, the hydrophobic organic solvent which can be used together with the volatile component as the core material is preferably an organic solvent having a boiling point of 300 ° C or less, and examples of the ester include, for example, dimethylnaphthalene, Diethyl naphtha lene, Diisopropyl naphthalene, Dimethyl biphenyl, Diisopropylbiphenyl, Diisobutylbiphenyl , 1-methyM-dimethylpheny-2-phenylmethane, 1-ethyl-1-dimethylphenyl-1-phenyldecane (1-ethyM-djmethylphenyl-1-phenylmethane), 1-propyl-1-dimethylphenyl-l-phenylmethane, 'triarylmethyst ( Triarylmethane) (for example, Tritoluyl methane, Toluyldiphenyl methane, Terphenyl compounds (for example, terphenyl), alkylate (Alkyl compounds), dazzling "basic diphenyl bond (Alkylate d diphenyl ethers) (for example, pr〇py|diphenylether), hydrogenated terphenyl (for example, hexahydrotriphenyl 14 201125595 % P ^ (Hexahydroterphenyl)), diphenyl ether ) Wait. The average particle diameter of the microcapsules is not particularly limited, but is preferably in the range of 10 μΓη to 500 μηη, and is preferably 15 μm to 35 μm [more preferably in the range of jm, and further 1 μm to 5 μm. The range is better. When the average particle diameter is less than 10 μm, the content ratio of the volatile component to the total mass of the microcapsules becomes too small. Therefore, there is a case where the volatility is dissipated at a sufficient concentration. In addition, if the average particle size exceeds 5 pm,

In other words, when pressure is applied to the microcapsules by volatilization or the like, the volatile component is likely to be broken by bending or pressing the microcapsules of the substrate which is unintentionally present in the mechanical strength of the microcapsules. Thereby becoming alienated to the outside. Knife 5τ, as long as the capsule - - ~ brothers and politicians, can be any position on the surface or inside of the soil. However, the plate-shaped A = surface is mechanically irritated by friction or the like, and the micro-gel is preferably disposed inside the plate-shaped base. The situation = the plate-shaped substrate has a hollow portion and. In addition, it is appropriate to make a shock configuration from the u: the micro-bag γ can be I:: sac on the area away from the heating area as needed. For example, in the case where the plate-like substrate is composed of a cellulosic structure, π, - 乂田夕孔, the plate-like substrate m can disperse the microcapsules all over the place and the plate is made of cellulose. The micro-a waste capsule is enclosed in a network formed of cellulose: another: the number of micro-in the inside of the == is not particularly limited, and: ΓΓ a heating area in the west? m ^ /, eggs in one or more microcapsules can be. For example, if the straightness of the micro (4) 15 201125595 is the same as the size of the heating zone, only one microcapsule can be placed in the area of the force. Further, in the case where the diameter of the microcapsule is very small with respect to the size of the heating region, it is preferable to arrange a plurality of (e.g., a plurality of &quot; hundreds of) microscopic sacs in one heating region. In the following description of a specific example using the drawings, the description will be made on the premise that a plurality of microcapsules are disposed in one heating region. However, instead of arranging one microcapsule in one heat-heat region Except for the status. (Plate-shaped base material) The plate-shaped base material constituting the volatile component-releasing substrate of the present embodiment may be a material having gas permeability or a material having no gas permeability. The "gas permeability" refers to a case where a gas such as paper pulp (Pu|p Fibe "s) as a main component can be diffused at a molecular level from the surface to the back surface. The plate-like substrate has a gas permeability. In the case of a property, a molecule constituting a volatile component can diffuse at a molecular level and pass through a plate-like substrate. As a material constituting the plate-like substrate, a minute and continuous void such as a fibrous material or a porous material can be used. When the plate-shaped base material does not have gas permeability like a plate-shaped base material made of a resin film or a plastic substrate (in the case of non-gas permeability), the molecules constituting the volatile component cannot be used. It is diffused at a molecular level and passes through a plate-like base material. Therefore, for example, a pair of non-permeable plate-like substrates which are completely sealed inside the non-permeable plate-shaped base material or the entire end surface are completely sealed. In the substrate for dissipating volatile components having a configuration such as a microcapsule, the microcapsules are dissipated to the outside of the microcapsule due to the heat destruction of the microcapsules. It becomes impossible to escape to the outside of the substrate for dissipating volatile components. In such a case, it is provided to communicate the communication from the region in which the microcapsules are disposed in the plate-like substrate to the surface of the plate-like substrate. The hole 'or a communication hole that communicates from one side of the plate-like substrate to the other side. Further, if necessary, a communication hole is provided on the plate-like substrate having gas permeability. Further, a non-breathable plate is used. In the case of a substrate, it is also possible to provide communication on a non-breathable plate-like substrate, and to dissipate the volatile component from the position where the microcapsule is disposed inside the plate to the volatile component. a gas diffusion path that communicates with the base (4) end face. For example, a structure in which a _ 4c; / , ' 罝, columnar 13⁄4 plate (space " is disposed between the pair of non-permeable plate-like base phases * In the substrate for dissipating the component, the volatile component can be easily diffused and moved from the inside of the substrate for volatility dissipation to the end surface side. When the communication hole is provided on the plate-like substrate, the size of the communication hole Usually compared to fibrous or porous materials Since the material or the like has a large void size, the diffusion rate of the volatilization in the thickness direction of the plate-like substrate can be further increased. Therefore, regardless of whether or not the plate-like substrate is made of a non-permeable material, If Luo, s丄付疋古疋, the non-slave will control the concentration of the volatile component and the heating component to a high concentration in a short time after passing through the heating element to the microcapsules, T, the connection hole is provided on the substrate. In addition, in the case where the plate-shaped material is composed of two plate materials 在n in the case of a plate-shaped material, it is also possible to form a gap like a communication hole. The diameter of the communicating hole on the part is not particularly preferable, and it is difficult to form a communicating hole on the plate-like substrate at 5 Mm (the WB_~ is preferably better. The diameter less than 5 pm 201125595) Or it is easy to cause blockage due to garbage or dust. In addition, when the diameter exceeds 3 μm, the opening of the communication hole on the surface of the plate-like substrate is likely to be conspicuous and the aesthetics may be deteriorated. In addition, the "diameter of the communication hole" means a maximum diameter of a circle having a cross-sectional area having the same cross-sectional shape when the cross-sectional shape of the communication hole is not circular. ^ V ^ This product is a known solid. In addition, it is also possible to use two or more types in combination, and in particular, at least one selected from the group consisting of resin, cellulose, and ceramics is preferably used. Further, as the resin, for example, polyruthenium is exemplified.胺 〇丨 im TE TE TE TE TE TE 。 。 。 。 。 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸 纸Oxygen = In addition, the resin or (4), the material itself is non-breathable. However, it is possible to use a porous resin or ceramic as needed. The shape 2 is easy to use a resin or cellulose as a plate-like substrate. The changed ceramic is used as a plate-like substrate to cause brittle fracture or to utilize bending resistance: it is sufficient to make the thickness of the plate-shaped substrate thin and flexible. These two: watts, and the substrate for escaping volatile components In the application where the card is required to be flexible or stretched, the substrate for the scattering of the component is required to be used. The surface of the component has a surface of the concave &amp; and is utilized. 18 201125595 The thickness of the plate-shaped substrate is not particularly limited, but it is preferably in the range of _ _ _ _, 5 〇 μ_1 () _ When the thickness is less than 30 Mm, there is a case where the tensile strength is insufficient and the substrate for escaping volatile components is easily broken. Further, when the thickness exceeds 3 mm, there is a plate shape made of a material having flexibility. The substrate for volatile component scattering is produced on the substrate, and it is difficult to impart flexibility to the substrate for dissipating the volatile component. The plate-like substrate may be formed of a -sheet-shaped material or may be passed through Two or more plate-shaped materials are bonded or the like. In addition, when two or more plate-shaped materials are used, the material or the cross-sectional structure constituting each of the plate-shaped materials may be different. (Heating element) — Set in this real The heating element ▲ on the substrate for the volatile component of the form of the volatile component has a 7 L piece which selectively heats the -part portion of the plate-like substrate. Further, the heating element is electrically performed as follows. On/off (ON/OFF) 捭 丨丨 丨丨 m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m The heating element is electrically controlled, and the microcapsules are taught to break the morning, so that the volatile components are dissipated. The heating method of the microcapsules can be exemplified by the following two heating methods: (1) A heating method is a heating method in which the outer shell of the microcapsule is heated by directly supplying thermal energy from the outside to the region where the microcapsule exists. (2) Second heating method 19 201125595 By generating a high frequency in the region where the microcapsule exists, A heating method in which the outer casing is violently vibrated to heat the microcapsules. In the first heating method, the heating element is formed using a heat generating member that generates heat by passing a current. The shape of the heat generating member is not particularly limited, and may be a linear heat generating member (heating wire) or a sheet-shaped heat generating member (heat generating chip).

When a heating wire is used as the heating element, the heat energy supplied from the heat generating wire is sufficient energy for heating and destroying the microcapsule. The heating element is composed of one heating wire. At this time, the microcapsules are at least placed in the vicinity of the heating line (heating area). Further, when the heating element is constituted by one heating wire, the heating wire may be linear or spiral (spiral). In this case, the microcapsules are disposed in or near the coil (heating region). _ In addition, even if the heat energy supplied from one heating wire is insufficient energy for heating and destroying the microcapsules, the sum of the heat energy given from the two heating wires is the heating damage of the capsule. If sufficient energy is used, then the heating element is composed of the two heating wires, so that the two heating wires are arranged to be mutually intersected or parallel to each other, and the two hot wires are arranged. In the case where the surface or the inner surface of the plate-like substrate is separated from each other and is separated from each other in the thickness direction of the plate-shaped substrate, _i J丨 month, two hairpins, and the spring father In the vicinity of the area, it is a heating area. In addition, as a heating line, as long as it is a heating wire that is distributed by a current, it is possible to use a known hot wire for heating, which is sufficient to utilize a tungsten wire or a Korean chromium resistant 20 201125595 hot alloy wire. Stainless steel wire, piano wire, etc. The heating wire may be disposed on the surface of the plate-shaped base material. However, from the viewpoint of ensuring aesthetics, it is preferably arranged such as to be embedded in the interior of the plate-shaped base material. There is no special limit In the case where the heating wire is buried in the inside of the plate-like substrate, it is preferably in the range of 12 μm to 200 μηη, more preferably in the range of 20 μΓΉ to ΙΟΟμΓτι. If the diameter is less than 12 μm, it may not be obtained. In the case where the temperature is more than 2 〇〇μm, it is difficult to embed the heating wire in the inside of the plate-like substrate, or it is difficult to control the heat generation. The amount of heat generated by the heating wire can be adjusted by the resistance of the heating wire, the amount of current, the diameter of the heating wire, and the distance between the heating wires when the two heating wires are used, and the heating chip can be used as a heating element. In the case of a heat generating chip, a heating region can be formed and the microcapsules can be disposed in the vicinity of the heat generating chip. However, sufficient heat energy for heating and destroying the microcapsules cannot be obtained by one heat generating chip. Or when it is desired to control the degree of heat damage of the microcapsules by the number of fever rags that are heated, etc. A heating region is formed by densely arranging two or more heat generating chips at a place. In the case where two or more heat generating chips are used to form one heating region, the configuration state of the heat generating chips in one heating region is not particularly For example, the arrangement may be arranged in the planar direction of the plate-like substrate or may be arranged to face the micro-disintegration capsule in the middle of the thickness direction of the plate-shaped substrate. The surface of the plate-like substrate may be disposed so as to be buried inside. In the case where a concave portion is provided on the surface of the plate-like substrate, the case of the heat-generating chip can be disposed, for example, on the bottom surface or the side surface of the u-shaped portion.

In this case, after the configuration of the smuggling H ^ poor ..., '^ piece, the w capsule can be configured as if the recess is filled, or the microcapsule can be matched with f as in the case of filling the recess, such as the recess The heat generating chip is disposed so as to cover the opening. In the case of the month of the month, the microcapsules in the recesses with the + and the well-known tablets are also arranged in a centralized manner. Therefore, the heat-destructive efficiency of the microcapsules using the heat-generating chip is promoted in the same way. It is easy. That is, the utilization efficiency of the p microcapsules is further improved.

In addition, it is also possible to use the right inner bell and the @ ° /, and have the same member and disposed inside the cylindrical member. The microcapsules of the crucible and the volatile component of the heat generating chip disposed on the one side of the member are sealed as shown in the figure. In this way, when the microcapsules are disposed in the same manner as the microcapsules and are in the cylindrical member, the V&amp; The heat destruction efficiency is easy. Corresponding to the respective heating zones, the corresponding volatile component escape components, such as the mooncake, are as thick as the thickness of the plate-like substrate. i M , J柙 The central axis of the same component The arrangement of the members is the same as that of the same member, and the staggered arrangement is 1", "'. One is the dense side of the plate-like substrate side which is misaligned *1 or square. Throttle and 7, the extremely violent table &quot; /, in the outer moon that constitutes the volatility of the adjacent components to the occlusion of the components of the gossip ~ #rf into a knife into sporadic into eight P... with a gap In this way, the configuration is known to be the escape member 4, and the evaluation of the eighth and fA is performed by the sample, and between the adjacent components of the blade, there is a solid material of X 拴 V compared to the same member.铒2, soil liquid or liquid by heating...~materials, ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ Therefore, the adjacent volatility becomes a 辙 埶 amp amp 情况 情况 情况 情况 情况 情况 情况 情况 情况 情况 情况 情况 情况 情况 邻接 邻接 邻接 邻接 邻接 邻接 邻接 邻接 邻接 邻接 邻接 邻接 邻接 邻接 邻接 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 It is difficult to transfer the heat energy generated by the dissipating component to the other component. Therefore, the escape of the volatilization at each of the twisted regions can be made very high. Pieces of ί two! 7 The volatile component dissipating portion adjacent to S is formed as a gap between the circumferential surfaces of the material, and a method of simply adjusting the arrangement interval between the dissipating members of the two components is mentioned. Further, as the cylindrical member &amp; @ μ , __ , it is also possible to arrange the outer peripheral surface of the tubular member constituting the mutually dissipating member 2 of the volatile component even if the volatile component escape density is maximized. The shape of the gap. The cylindrical member having such a shape may be, for example, a cylindrical member or a cylindrical member having a polygonal shape in which a cross section ν of a surface perpendicular to the central axis is a pentagon or more. As the heat generating chip, a chip which can be used to generate heat by using a low-purity semiconductor material can be used. The heat-generating chip is not particularly limited as long as it can be used for resistance heating, and it is considered that the volatile component is dissipated in the form of the material, the size of the image (microcapsule), or the heat-destructive property. It is preferable that the resistance is 15 Ω to 33 Ω when ": Γ ν 〜 5 _ ν ν 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 In the case of a plate-shaped hexagram, etc., it is preferable to use a square plate shape as a viewpoint of obtaining a product of the sale of Wang and 帀%. In addition, the hair of the heat-generating chip is selected according to the size of the heating zone, for example, if it is a square In the case of a sheet, it is preferable to use a vertical 〇.4mmx horizontal 0·2 coffee to a vertical 3.2mmx horizontal 23 201125595 1 _6mm. In addition, as a heat generating chip, it is possible to use a newly manufactured chip or Using a chip resistor sold in the market. In the second heating mode, the heating element is formed on the surface of the plate substrate.

Or two wires which are disposed to be separated from each other and which are disposed apart in the thickness direction of the plate-like substrate, and the vicinity of the region where the two wires intersect is a region where the high frequency is generated (heating region). Therefore, when current is simultaneously supplied to the two wires in a state where the microcapsules are disposed in this region, the microcapsules can be thermally destroyed. The wire may be disposed on the surface of the plate-like substrate, but it is preferably disposed so as to be embedded in the interior of the plate-like substrate from the viewpoint of ensuring aesthetics. The diameter of the wire is not particularly limited. However, in the case where the wire is buried in the inside of the plate-like substrate, it is preferably in the range of 3 pm to 2 pm, and more preferably in the range. When the diameter is less than % 卟 (7), there is a case where the valley is liable to be broken. When the diameter exceeds 2 〇〇p (1), it may be difficult to embed the heating wire in the inside of the plate-like substrate.

Further, it is preferable that the heating wire or the wire is disposed such that its axial direction is slightly parallel to the plane of the plate-like substrate. In other words, in the first heating mode or the second heating mode, the heating element is provided with a wiring (the heating wire or the wire, the same below) which is axially parallel to the plane of the plate-like substrate, and as opposed to the plate-like base. It is preferable that the thickness direction of the material is separated from the root wiring and is slightly parallel to the plane of the plate-like substrate, and the other wiring is disposed so as to be connected to one wiring. In this case, a region where one wiring intersects with the other wiring functions as a heating region. In addition, in the case of a heat element, the center of the wiring is disposed on the side of the square in the thickness direction of the plate-shaped substrate, and the other wiring is disposed in the center in the thickness direction: [Si 24 201125595 The other side is better. The number of the heating regions provided on the substrate for dissipating the volatile components is as follows: one is: one, but two or more is preferable. Further, as described below, the number of the regions is preferably two or more, and more preferably four or more, from the viewpoint of dissipating the volatile components in various forms. The upper limit of the number of the heating zones is not particularly limited, but it is preferably five or less in the shell. In making the number of heating zones at least

In the case of two or more, by independently controlling the addition and heating (4) of each heating zone, it is possible to divide the two by time: the volatility of the volatile component is lapsed. Further, when the number of the heating zones is two or more, the type of the volatile knives contained in the microcapsules disposed in one heating zone and the microcapsules disposed in the other heating zones may be used. Inclusion: The type of hair ingredients is different. In this case, it is sufficient to simultaneously dissipate two or more kinds of volatile components composed of a desired group or to disperse different types of volatile components at different times. Further, the number of heating regions can be appropriately selected in accordance with the use of the substrate for volatility separation. Further, when the number of the heating regions is four or more, it is preferable that the respective heating regions are arranged in a matrix shape in the planar direction of the plate-like substrate. In this case, 'two or more heating wires (or wires) are arranged in the row direction, and two or more heating wires (or wires) are intersected with the heating wires (or wires) arranged in the row direction. In the column direction, the heating regions can be arranged in a matrix in the planar direction of the plate-like substrate. With such a configuration, by selecting a specific line from the heating line (or wire) in the row direction and the column direction 25 201125595 - such as the heating line (or wire) in the direction of the earth direction and the column direction, and flowing the current 'can only make 牿 ^ The heated area of ^ is heated. On the other hand, in the case where the heating element is used as a # ^ ^ ^ ^ & ... ... 〇 〇 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ : The heating area is set in a matrix. In this case, for example, in the state in which the wiring (row wiring) of the current in the two-direction direction and the wiring (the column wiring) in the control row are connected, the snow is controlled to be turned on/off (ON). /〇ff a) This is enough to only heat up a specific heating zone in a sad/unheated state. To the heating wire (or the current supply) constituting the heating element, it is possible to use the power supply (external power supply) of the outside of the substrate for the dissipation of the wafer, the cymbal, and the volatile component. The external power supply is dead a 4 ', There is no need for a socket or a battery. In addition, the heat/non-heating control of the heating zone can be performed manually. However, the control circuit of the 1C chip or the like is used to sing the wave in the heating zone. The component is disposed in a matrix of two times in the direction of the flat surface of the substrate for dissipation, and the heating/non-heating control of the heating region is performed by the control circuit. In addition, the power source or the control circuit is generally disposed in the volatile component. The external weight of the disposable substrate may be provided on the side of the substrate for volatility component scattering if necessary. (Dispersion method of volatile component) The volatile component is dispersed in the substrate of the present embodiment. When dissipating to the outside of the volatile component scattering substrate, heating is performed on a small-heating region provided on the substrate for scattering constituents (selected from one or more heating regions) Therefore, it is possible to heat-destroy the microcapsules present in the heating zone where the heating is performed in 2011, 2011, 595, and to dissipate the hair component to the outside of the substrate for the volatile component dissipation. In the case where the loose-walled plate has a heating range of (four) or more, it is particularly preferable to repeat the heat treatment for more than one time, and the heat treatment is performed by selecting the _ portion of the entire heating region and heating for the first time. After the treatment, some or all of the remaining heating regions that have not been heated are selected and heated.

In other words, the volatile component is allowed to escape to the outside of the substrate for volatility dissipation by two or more times. Therefore, by controlling the time 〇iming for selecting and heating the addition region, the volatile component can be dissipated any number of times at a desired time. Further, if necessary, the heating zone which has been subjected to the heat treatment of the x-port may be heated again. In this case, the remaining microcapsules are destroyed by the destruction of the heat of the yang, or the volatile components remaining in the state of being infiltrated into the vicinity of the heating region are dissipated, whereby the volatile components can be again released to the outside. Therefore, the utilization efficiency of the volatile components contained in the microcapsules can be further improved. x (Specific Example of Substrate for Volatile Component Dissipation) Next, a specific example of the plate for dissipating volatile components of the present embodiment will be described with reference to the drawings. The first drawing is a schematic cross-sectional view showing an example of a substrate for volatile component scattering in the present embodiment. The substrate (1〇) for dispersing the volatile component shown in the first embodiment is provided in a hollow portion (22) in the vicinity of the center portion in the thickness direction of the plate-shaped coffin (20A) by a plate-like substrate (2A). a plurality of microcapsules filled in the medium 4 (22), a heating wire (part of the heating element) (30), and a heating wire (constituting a part of the heating element) (32)

27 201125595 The 'heating wire (30) is placed on the surface and the hollow portion of one side of the plate-shaped base material (20 A) in parallel with the flat south of the plate-shaped base material (2 〇a). 2 2) The area between the 'heating wire (32) is parallel to the plane of the plate-like substrate (2〇a) and perpendicularly intersects the axial direction of the heating wire (30), and is disposed on the plate. A region between the surface on the other side of the substrate (20A) and the hollow portion (22). The second diagram is a schematic perspective mode showing the arrangement of the heating wire (30), the heating wire (32), and the hollow portion (22) when the volatile component dissipation substrate (10) shown in the first figure is viewed from one side. Figure. As shown in the second figure, the heating wires (3〇A), (30B), (30C), and (30D) are arranged in parallel in the column direction and at equal intervals with each other, and the heating wires (32A) and (32B) are arranged. (32C) and (32D) are arranged in parallel in the row direction and at equal intervals with each other, and the heating wires (3〇A), (30B), (30C), (30D) and the heating wires (32A), (32B) ), (32C), (32D) intersect perpendicularly to each other. Further, a hollow portion is disposed in a region where the heating wires (3〇a), (3〇B), (30C), and (30D) intersect with the heating wires (32A), (32B), (32C), and (32D). (twenty two). Further, the heating wires (3〇) and (32) are connected to a power supply and a control circuit (not shown), and are controlled to be turned on/off (〇 N /〇F F ) in units of respective heating lines. The plate-like substrate (20A) is composed of a gas permeable material (porous material or cellulose) as a main material, and therefore has gas permeability. Therefore, when the microcapsules disposed in the hollow portion (22) are thermally destroyed, the volatile components contained in the microcapsules can diffusely move from the hollow portion (22) to the surface of the plate-like substrate (2A). , thus escaping to the outside. Further, in the case where the material constituting the plate-like substrate does not have gas permeability, a communication hole that communicates from the hollow portion (22) to the surface of the plate-like substrate (20 A) is provided. In addition, in the volatile substrate, the heating wires (3GA), (_), (3Qc), (then) and the heating wire (32) are crossed in the substrate (ίο) of the volatile component rr · η I ^ i 28 201125595 Part (the area ceramics, (willow), _), _)) indicated by the broken line in the first figure functions as each heating region. Therefore, each of the heating regions is provided as to include the respective hollow portions (22A), (22B), (22C), and (22D). However, in the state of the first and second figures T, in order to heat-destroy the microcapsules disposed in the hollow portion (four), in the case where only the heating wire (3G) or the heating wire (32) flows current. The heat generation of the heating wires (3〇) and (32) is controlled so that the "bag plus (4) is not broken. Next, an example of a procedure for dissipating volatile components from the volatile component dissipating substrate (10) shown in Fig. 2 and Fig. 2 will be described. First, a heating wire through which a current flows is selected from a heating wire (3 turns) arranged in the column direction and a heating wire (32) arranged in the row direction, and a current flows. For example, it is possible to simultaneously apply a heating line (a line and a heating line (32 to a current flowing through) such a hollow portion (22A1) existing on the intersection of the heating line (30A) and the heating line (32A) [upper left in the second figure] The microcapsules filled in the hollow portion (22) of the square are thermally destroyed by heating. At this time, the volatile components contained in the microcapsules pass through the plate-like substrate (20A) and escape to the outside. Further, in this case, only the microcapsules present in one hollow portion (22A1) are subjected to heat j. However, it is also possible to heat-treat the (four) capsules in the two or more hollow portions (22). The current can flow simultaneously in the heating line (3〇A), the heating line (32), and the heating line (32B). At this time, the microcapsules filled in the hollow portion (22A1) and the hollow portion (22A2) are heated. In addition, the heat-treated hollow portion (22) causes the volatile component to escape 29 201125595 大幅 2 to be greatly reduced. Therefore, the hair is arranged in the column direction 1 =) and the heating wire arranged in the row direction (4) When selecting the heating wire of the circulation electric &amp; It is particularly preferable to select a heating line for heating the hollow portion (22) which is not subjected to heat treatment. By repeating the above-described work, there is an unheated portion in the substrate (10) for volatile component dissipation ( 22), the volatile components can be dissipated at the desired time for any f times: in addition, the 'volatile amount of volatilization or volatilization rate can pass

Adjust the number of hollow portions (22) that are simultaneously heat-treated, the electric current flowing in the heating wire gauge and the heating wire (32A), the 冤々IL in the claws, or the energization time, and the plate-like substrate (2〇A) The thickness of the material when the plate-like substrate (2〇A) is composed of a porous material or a gas-permeable material of a fibrous material temple, and the communication when the plate-shaped material (20A) is composed of a non-permeable material The diameter of the hole is controlled. The volatile component escape substrate (10) shown in the first and second figures is provided with heating wires (30) and (32)'. However, a wire may be used instead of the money (32). In this case, the microcapsules filled in the hollow portion (22) existing in the region can be thermally destroyed by generating a high frequency ' in a region where the wire (3q) and the wire (μ) intersect. Further, in the volatile component escape substrate (10) shown in the first and second figures, the microcapsules are disposed in the portion (22). However, the "bag can also be carried out in other states: set. For example, when the plate-form substrate (20 A) is composed of cellulose or a porous material and does not have the hollow portion (22), the microcapsules may be dispersed, for example, in the entirety of the =-form substrate (20A). . However, when it is desired to improve the utilization efficiency of the microcapsule, it is preferable to dispose the microcapsules in a part or all of the regions in the thermal region (40) of the broken line in the first figure. Further, as a method of dispersing 30 201125595 microcapsules in a plate-like substrate (20A), for example, a solution using a knife-shaped microcapsule can be used, and a plate-like substrate (2〇A) is allowed to be carried out in the solution. Production

A bubble treatment or a method of dropwise adding a specific region on the surface of a plate-like substrate (2〇A). K. Next, a specific example of the substrate for volatile component scattering in which a communication hole is provided in a plate-like substrate will be described with reference to the drawings. The third diagram is a schematic view showing another example of the substrate for volatile component dissipation in the present embodiment. Further, in the second drawing, the description of the heating wire (or wire) constituting the heating element is omitted. The substrate 〇 2) for dispersing the volatile component shown in FIG. 3 is a hollow portion (22) provided at a central portion in the thickness direction of the plate-like substrate (20B) in the plate-like substrate (thin). The communication hole (24) provided to communicate with the surface of the hollow portion (22) to the side of the plate-like base material (2〇B) is disposed in the hollow portion (22) (not shown). The microcapsules are composed of a heating element composed of a heating wire (or v, present) not shown. Further, the heating element can be provided in the same manner as the case shown in the first figure and the second figure. In the volatile component dissipating substrate (12) shown in Fig. 3, when the microcapsules in the hollow portion (22) are broken by heating by the heating element, the volatile components contained in the microcapsules can be contained. The outer portion of the volatile component escape substrate (12) is quickly dissipated via the communication hole (24). Further, in the substrate (12) for volatile component dissipation shown in Fig. 3, the communication hole (24) is provided such that its opening portion is located only on one side of the plate-like substrate (20B). By adopting such a configuration, when the volatile component scattering substrate (12) is applied to the surface of some members and used, the opening 4 is provided on the surface opposite to the bonding surface, which is sufficient for the south. The utilization efficiency of microcapsules. However, the communication hole (24) may be Γ ^ 31 201125595 to have its opening portion on both sides of the plate-like substrate (2〇b). Next, the substrate for the volatile component-dissipating substrate (10>, (12) shown in the first to third figures is disposed between the pair of plate-shaped substrates by using the drawings. A specific example of the substrate for volatile component scattering in the structure of the substrate supporting member such as a plate is described. The fourth drawing shows the substrate for volatile component scattering in the present embodiment shown in FIGS. A schematic cross-sectional view of a modified example. The substrate for volatile component dissipation (彳4) shown in FIG. 4 is provided with: a first plate having a plurality of heating wires (part of the heating element) (34); a substrate (20C), a second plate-shaped base that is disposed opposite to the first plate-shaped substrate (2〇c) and is provided with a plurality of heating wires (constituting a part of the heating element) (36) (20D), a plurality of microcapsule-containing members (28) disposed between the first plate-shaped substrate (2〇c) and the second plate-like substrate (20D), and disposed on the first plate-shaped substrate (20C) and the second plate-shaped substrate (2〇d), and the substrate supporting members on the end faces of the plate-like substrates (20C) and (20D) (2) 6) The heat-dissipating substrate (14) shown in the fourth figure is provided with heating wires (34) and (36), but these heating wires (34) and (36) may be replaced. Here, the 'heating wire (34) is a linear heating wire arranged in parallel with the surface of the first plate-shaped substrate (20C), and is formed in the first plate-shaped substrate (2〇c). The hot wires (34A) and (34B)' (34C) are arranged at equal intervals. This is also the same for the heating wires (36) incorporated in the first plate-like substrate (20D). In addition, the plate substrate (2) 0 C) [( 2 0 D)], for example, by disposing the heating wire (3 4) [(3 6)] on one side of the plastic substrate, such as covering the heating wire (34) [(36)] The resin film or the like is bonded as described above. tSl 32 201125595 In addition, the first plate-shaped base material (20C) and the second plate-shaped base material (2〇D) are respectively provided with heating wires (34) and heating wires. (36) Arranged in the form of vertical intersection. Further, the microcapsule-containing member (28) is disposed at a position where the heating wire (34) and the heating wire (36) intersect. For example, as shown in the fourth figure, the heating wire is provided. (36) A microcapsule-containing member is disposed on a surface of the second plate-shaped base material (20C) on the side of the second plate-shaped base material (20C) at a position where the heat-generating wire (34A) is placed at another position ( 28A), at a position where the heating wire (36) and the heating wire (34B) intersect, and a surface of the second plate-shaped substrate (20D) on the side of the first plate-shaped substrate (2〇c) is disposed The microcapsule-containing member (28B) 'position at the intersection of the heating wire (36) and the heating wire (34C) and the first plate-shaped substrate (20D) disposed on the side of the first plate-shaped substrate (2B) A micro-caps containing component (28C) is disposed on the surface. In this case, the respective microcapsule-containing members (28A)' (28B), (28C), and the thickness direction of the volatile component-releasing substrate (14) are disposed in the respective microcapsule-containing members (28A), The heating line (34) on both sides of (28B) and (28C) and the area of the heating line (36) (the area surrounded by a broken line in the figure) constitute heating areas (42A), (42B), and (42C). The microcapsule-containing member (28) is a member containing a plurality of microcapsules, and may also be a member containing only a microcapsule. Further, the microcapsules may be dispersed in a porous member composed of a solid material such as tannin or a semi-solid material, or pulp fibers, as long as it does not inhibit the escape of volatile components when the microcapsules are heated and broken. component. The substrate supporting member (26) can be disposed such that the first plate-shaped substrate (2) and the second plate-like substrate (20D) have a certain gap therebetween, for example, as in the fourth drawing. The outer peripheral end faces of the plate-like base materials (2〇c) and (2〇D), but 33 201125595 are 'may be disposed between the adjacent two heating zones (42). The substrate support member (26) may be either columnar or wall-shaped. Further, when the substrate support member (26) is columnar and arranged at intervals, it is formed between the first plate substrate (20C) and the second plate substrate (20D). The space (the space between the base chairs) and the space outside the space between the substrates can be freely accessed. Therefore, the first plate-shaped base material (2〇c) and the second plate-shaped base material (2〇〇) may not have gas permeability or may have a communication hole that communicates with the inside of the watch. On the other hand, in the case where the substrate supporting member (26) is in the form of a wall, and the gas is unlikely to flow in the inside and outside of the space between the substrates, for example, the substrate supporting member (26) is in the plate-like substrate ( When the end faces of 20C) and (2〇D) are continuously arranged over the entire circumference, the volatile components that escape between the substrates can not pass through the plate-like substrates (20c) and (2〇D). The end face spreads to the outside. In this case, at least one of the plate-like base materials (20C) and (2〇D) has gas permeability, or at least one of the plate-shaped base materials (20C) and (2〇D) is provided with a communication hole. necessary. The substrate supporting member (26) is a wall (four), and may be disposed such that the wall-shaped substrate supporting member (26) is completely separated and cut in units of the respective heating regions (42). Next, a specific example of the substrate for volatile component dissipation using the heat generating chip as the heating element is carried out. Fig. 5 is a view showing a substrate for volatile component dissipation in the present embodiment, and Fig. 5 is a view showing a configuration of a heat generating chip in the case where a heat generating chip is used as a member of the device. A schematic diagram of an example for a piece of $: one. The parts of the heat control of the sheet which are cut out of the line of the fifth figure are omitted. On the surface of the plate-shaped substrate shown in Fig. 5, 201125595, a plurality of heat-generating chips (6 turns) are arranged in a square shape. In the fifth diagram, the state in which the heat generating chips (6G) are arranged in a square by three rows and three columns is shown. Further, on the substrate for volatile component dissipation (5〇), the heat generation of each of the heat generating chips (60) is controlled, and wirings connected to the heat generating chips (60) arranged in the row direction are provided ( 62), [(62A), (62b), (62C)], wiring (64), [(64A), (64B), (64C) connected to the heat generating chip (6〇) arranged along the column direction. )]. Wirings (62A), (62B), # (62C) and wirings (64A), (64B), and (64C) are connected to a power supply (not shown), and 通电N/〇 is controlled by a control circuit not shown. FF. Further, microcapsules (not shown in the fifth drawing) are disposed in the vicinity of each of the heat generating chips (60). In the volatile component scattering substrate (50), for example, only the wiring (62A) and the wiring (64B) can be energized, and only the heat generating chips (60) arranged in the first row to the first row can be heated. In this way, the heat generation state of each of the heat generating chips (60) corresponding to each of the heating regions can be controlled, so that the microcapsules disposed in the vicinity of the heat generating chips (6〇) which are heated by the energization can be thermally destroyed by φ. The volatile components are allowed to escape in units of heated regions. Fig. 6 is a schematic cross-sectional view showing another example of the substrate for volatile component dissipating of the embodiment, and is a schematic cross-sectional view showing an example of a cross-sectional structure of a volatile component dissipation substrate using a heat generating chip. The volatile component dissipating substrate (52) shown in Fig. 6 is provided with a first plate-shaped substrate (7〇) bonded to one side of the first plate-shaped substrate (7〇). The second plate-shaped base material (72) provided with a plurality of vertical holes (74) penetrating from one surface facing the other surface is disposed on the first plate-shaped base material which is the bottom surface of the vertical hole (74). (7〇) the surface of the heat generating chip (60), and the microcapsule containing member (8〇), in 35 201125595, the 'microcapsule containing member (80) is configured with A# ΰ, ,; The inside of the vertical hole (74) on the chip (60) is filled with a plurality of microcapsules. Here, each of the vertical holes, (74B), and (74C) is disposed in the planar direction of the volatile component-releasing substrate (52), for example, in a square arrangement. In this case, the heat generating chip (60) is provided with wirings (62) and (64) as exemplified in the fifth diagram of the τ π π π 苐 , , , , , , , , , , , , , , , The master heating chip (60A), (60B), (60C) asm 仃 control. The substrate for volatile component dissipation shown in the sixth figure

L _ plate (60A) and micro-sac sacs disposed in each of the vertical holes (74A), (,, (74C), 3 ports, p-piece (80A), heat-generating chip (60B), and micro-capacitor-containing components (8) 〇B), &quot;; and the heat generating chip (60C) and the microcapsule containing component 〇C) respectively constitute the heating region (90A) '(90B), (90C). Further, the 'longitudinal hole (74) is appropriately formed by chemical processing such as punching or the like, or chemical processing such as etching, according to the material or thickness of the second plate-like base material (72), the dimension of the plane direction of (4), and the like. . In addition, it is also possible to use a resin film (or a resin layer) having the same glare as the outer shell of the gutta-percha, and to use the microcapsule-containing member on the opening side of the vertical hole (74). = face coverage 'so that the microcapsules containing the microcapsules contained in the vertical holes (74) are not loosened and are detached from the surface of the volatile component escape substrate (52). FIG. 7 is a schematic cross-sectional view showing an example of a substrate for volatile component dissipation in the present embodiment, and is a schematic cross-sectional view showing another example of a cross-sectional structure of a volatilization of a heat generating chip: a substrate for dissipating components. Figure. The volatile component dissipating substrate (54) shown in the drawing has a plate-shaped base material (76) provided with a plurality of vertical holes (78) opened on one side, and is disposed in the vertical holes.

[S 36 201125595 (78) The heat generating chip (6〇) on the bottom surface and the microcapsule containing the inside of the vertical hole (78) on the heat generating sheet (60) contain components (8 inches). The substrate for volatile component dissipating (figure) shown in Fig. 7 is composed of only two plate-shaped substrates (70) and (72) and only a plate-shaped substrate (76). The basic structure is the same as that of the volatile component escape substrate (52) shown in FIG. In the volatile component dissipation substrates (52) and (54) shown in the sixth and seventh figures, the heat generating chips (60) are disposed in the vertical holes (74) and (78) and further with the heat generating chip. (60) A plurality of microcapsules are closely arranged adjacent to each other. Therefore, the microcapsules using the heat-generating core sheet (60) have high heat destruction efficiency. Further, in the volatile component-dissipating substrates (52) and (54) shown in the second and seventh figures, the plate-like substrates (70), (72), and (76) are not used for ventilation. A non-breathable plate-like substrate such as a plastic substrate or a ceramic substrate is more preferably used as the plate-like substrate. In this case, the volatile component which is released to the outside of the microcapsule by the heat destruction is not penetrated, absorbed, or hardly penetrated to the side of the plate substrate (7) '(72)' (76). And absorption, so the utilization efficiency of the microcapsules is further increased. The eighth embodiment is a schematic diagram of the volatile component dissipating member (1) shown in the eighth diagram of the volatile component dissipating member used in the volatile component dissipating substrate of the embodiment. The cylindrical member (1 1 0) is sealed on one end side of the cylindrical member (not shown in the eighth drawing) on the end side of the cylindrical member (not shown). The square plate-shaped heat generating chip (66) disposed as described above and the microcapsules filled in the inner peripheral portion (11 2) of the cylindrical member (11 2) contain members (8). Moreover, a volatile component escaping 37 201125595 = piece (100) constitutes a heating zone (10) in the volatile material (_) shown in the eighth figure, at the end of the cylindrical member (1) Q) (four) The heat generating chip (66) is further adjacent to the heat generating (66) and is densely packed with ::: ΐ = microcapsules. Therefore, the volatile components of the microcapsules of the heat generating chip (66) are separated by a volatile component.

The homogenous member (110)' is preferably made of a gas permeable material or a non-permeable material such as ceramics. In this case, the volatility which is released to the outside of the microcapsule by heat destruction is eight, and the side of the cylindrical member (1) 0) is broken, absorbed, or hardly permeable: and, therefore, the microcapsule The utilization efficiency is higher. Further, the length of the longitudinal direction of the heat generating chip (66) may be formed, for example, by the diameter of the equal or h-shaped member (1). In this case, the volatile component is made to have a volatility component in a direction in which the thickness of the substrate for the volatility of the five escapes coincides with the direction of the central axis of the cylindrical member (110) (the line indicated by the dotted line in the eighth drawing). When the loose member (1 〇〇) is arranged in the plane direction of the substrate for volatile component scattering, it is easy to maximize the arrangement density. The ninth diagram is a plan view showing an example of a substrate for swaying component dissipating using the volatile component dissipating member shown in Fig. 8, and specifically, is not shown from the cylindrical member (1 1 0). The opposite side of the side of the heat generating chip (6 6) is disposed to observe the volatile component escaping member (the top view when the configuration state is called 1 in the ninth figure, for the plate substrate or the heat generating chip (66), etc. Except for the cylindrical member (110) constituting the volatile component dissipating member (1) and the member other than the micro-containing member (8〇), the description is omitted. The substrate for dissipation (56) is contacted with the surface of the soil by a heat generating chip (66) (not shown in the ninth figure) on the surface of the plate substrate (not shown in FIG. 9 201125595) In this way, the volatile component escape members (1 〇. line square arrangement. / 亍 two directions in the direction of the column or adjacent to the column = the distance d between the intermediate components of the dissipative component (1QQ), It is equal to the outer diameter of the cylindrical member 。), that is, the arrangement of the volatile component escaping member (100) is poor to dissipate the volatile component When the piece ((10)) is arranged in a square shape: two or two are matched with "degrees. Therefore" are adjacent in the row direction or the column direction, and the dissipative components of the dissipative components are in contact with each other, and the outer peripheral surface of the outer peripheral surface is in line contact ( Actually, it is a point contact on the drawing.) The extension is: a circular shape in the plane direction of the volatile component escape member ((10)), and a phase (4) two volatile component escape members (10) 〇). The gap with very low thermal conductivity of the material (air sound) (10) In addition, in the row direction or column direction, the two layers of the components of the dissipative component (100) in the row direction or column direction are mixed; The contact area between the two is very small. :: The substrate for volatile constituents dissipated as illustrated in the sixth or seventh figure (52): ^, the substrate for volatile constituents (56) shown in FIG. The thermal insulation between the adjacent interface hot regions (90) is very high. Therefore, in the case where the hot regions (90) are densely arranged, the density is greatly configured as in the arrangement of the squares and the arrays. In the case of ^, when heating a heating zone (90), the heating The near heating zone (90) of the domain (90) also generates residual heat, so that the microcapsules disposed in the four domains (90) are heated and destroyed, and the sigma hot zone brothers. Therefore, the utilization of the gutta granules can be utilized. In addition, the secondary, turbulent heating damage of the microcapsules on the adjacent heating zone (90) is suppressed due to the heating failure of the microcapsules 39 ί S1 201125595 on each of the additions, y (y〇) Therefore, the controllability of the volatilization amount of the volatile component is further increased. (Manufacturing method of the substrate for dispersing the volatile component) The substrate for dissipating the volatile component can be appropriately used according to the structure of the substrate for dissipating the volatile component. The method for producing a known plate-like member and the method for producing a Hi-generation split-distribution & plate can be produced by the following procedure. However, the substrate for volatile component scattering in the present embodiment is not limited to this. (1) Preparation of microcapsules / Preparation of a sheet of a desired volatile component J π hot line (or wire) prepared by the method described above on the surface of the -fCL 1 ^ spoon of the material A plurality of heating wires (or wires) are arranged at equal intervals. In the case of a pick-up, a thin plate of a τ heating wire (or a wire) is prepared by abutting another plate-shaped material by arranging the surface of the heat-generating wire (or the wire) on the side of the heating wire (or the wire). (3) Arrangement of microcapsules The microcapsules are arranged at equal intervals on the line of the hot plate (or wire) of the thin plate with the heating wire (or the wire). Further, in the case of the microcapsules, for example, it is possible to use a method of injecting a capsule (or a method of dispersing the microclay &gt;&gt; a method of positioning the microchip, etc. Pointing of a thin plate with a heating wire (or wire) 40 201125595 Next, the other layer with a heating wire is bonded to the surface of the raft with the heating wire (or the guide wall, the wire) on the side of the microcapsule ( , one, four wires) the seesaw. At this time, the two pieces of the thin plate 'with one lotus's like a owe, the special heating wire (or wire) and the other thin plate of the heating wire (or wire) s _ ^ ^ ' / main straight father And the region of the vertical phase is performed in the same manner as the region in which the microcapsules are disposed. The sample can be used to obtain a substrate for dissipating volatile components. In addition, if there is a concavity line in the position with the hair strand (or the configuration of the wire w thin plate)

In the case where the concave portion constitutes a hollow portion of the substrate for displacing a volatile component, a volatile component escape substrate having the configuration shown in the first and second figures can be obtained. Further, the thickness of the substrate for dispersing the volatile component is adjusted or (4) is smoothed, and the starring treatment may be performed later using a roller or the like. (Usage of the substrate for dispersing the volatile component) The substrate for dispersing the volatile component of the present embodiment can be used as long as the desired volatile component is dispersed to a desired space at a desired time. Used for any purpose. For example, the volatile component may be dissipated = the substrate may be disposed on the casing of the electronic device, and the volatile component may be dissipated by the action of the electronic device or the interlocking operation. For example, in the case of a foldable mobile phone, it is possible to cause the fragrance component to escape in conjunction with the action of opening the mobile phone. By doing so, the user of the piggybacking phone can enjoy a comfortable fragrance every time the mobile phone is used. In addition, it is also possible to affix the substrate for dissipating volatile components to the floor, the ceiling, and the like, and to separate the infrared sensor.兮栌v下斗 Disaster 曰成 ^ hr condition ‘This is enough to cause the fragrance component to escape when the person senses 41 201125595 through the infrared sensor. As a result, a person who enters the room in which the volatile component escape substrate is placed can enjoy a comfortable fragrance. In addition, the fragrance component is not dissipated when there is no one in the room, and therefore, the waste of the fragrance component can be prevented. In addition, there are some aromatic products for indoor fragrances, which are mainly in the low-end design of bottle-type products. However, the volatile components of this embodiment are dissipated ''' &quot; A dual-purpose substrate due to Since the space is saved, it is easy to arrange it in an inconspicuous position, and even when it is placed in a conspicuous position, the substrate for volatile component scattering can function as a wallpaper. Therefore, it is also possible to set the juice property for the substrate for the escape of volatile components. Further, the volatile component may be disposed between the floor and the carpet with a certain plate, or the substrate for dissipating the volatile component may be disposed on the floor surface side of the carpet, and periodically linked (via timing control). The insecticidal ingredients used in the mites are dispersed. In this case, since the fleas or mites that are generated in the carpet are automatically subjected to the treatment of the mosquitoes of the cockroaches, it is possible to maintain a hygienic environment at all times. (Other Embodiments of the substrate for escaping volatile components) The above-described substrate using a volatile component of the sinusoidal sinus of the microcapsules has been described as a volatile component. For the dispersion of the substrate, for example, the substrate for volatile components of the unused microcapsules which are not used in the soil m can be used, for example, as shown in the tenth figure. Fig. 10 is a schematic cross-sectional view showing an example of a substrate for a volatile substrate which is not used for microcapsules. In the tenth diagram, the volatile component escape substrate (200) basically has a structure of the volatile component escape substrate (54) (four) shown in FIG. 7, but the structure of each heating region (four) Different from this point, the volatile component escapes the base 42. The heating zone (92) of the 201125595 plate (200) is composed of a heat generating chip (60) disposed on the bottom surface of the vertical hole (78) in the vertical hole (78). The volatile component (82) in the vicinity of the opening of the vertical hole (78) is filled, and the σ portion of the vertical hole (78) is covered by sealing the volatile component (82) in the vertical hole. Here, the sealing film (84) is formed. Here, as the volatile component (82) and the sealing film (84), for example, the microcapsules contained in the microcapsule-containing member _ shown in Fig. 7 can be used as they are. The volatile component and the outer shell material. The configuration energy of the heating region (92) in the planar direction of the substrate for the volatile component escape (2QQ) is not particularly limited to be formed, for example, in a square arrangement or Interlaced (four), tortoise-like arrangement. (Embodiment) Hereinafter, an example is given to this embodiment. The substrate for volatile component dispersion in the form of the embodiment is described. [Example 1] The substrate (14) for aroma component dissipating substantially having the configuration shown in Fig. 4 was prepared by the following procedure. (Microcapsules and micro-capsules The capsule contains a solution. The outline of the microcapsules to be used is as follows. In addition, the microcapsules used in the preparation of the drink-drinking component are used as a solution, and the pure water is used as the agent, and the micro-span is used. The capsule is a solution in which the concentration is 7Q mass. The shape is spherical. The average diameter is 30 μΓη. The polyurethane resin having a thickness of 0 μm (melting point: 14 〇.〇) 43 201125595 • Core material (volatile component): Lavender essential oil (production of plate-shaped substrate with heating wire) On a grooved surface of a general-purpose substrate (72 mm in length, 48 mm in width, and 1.6 mm in thickness) In the groove provided in the longitudinal direction, four heating wires (34) (nickel-chromium heat-resistant alloy wire, wire 牷 0.35 mm, length 35_5 mm) are arranged at intervals of 2 · 54 mm. Then, by using a heat wire, the glue is used. Adhesive paste An imide thin plate (thickness: 025.025 mm) was obtained to obtain a first plate-shaped substrate (20C). In addition, 'in addition to the heat generating wire (36) disposed in a groove provided along the lateral direction of the general-purpose substrate, the first The second plate-shaped base material (2〇D) was produced in the same manner as the plate-shaped base material (20C). (Preparation of the substrate for volatile component scattering) Next, 'The second plate-shaped base material (20 D) was pasted. On the surface side of the polyimide sheet, and directly above the heating wire (36), the 〇_06cc microcapsules are added dropwise to contain the solution 'and the solvent component is naturally volatilized. Then, the first plate substrate (2〇c) is made. The second plate-shaped base material (20D) was superposed on each other with the surfaces of the polyimide sheet adhered to each other and kept at an interval of 2.4 mm. Further, when the vertical erecting is performed, a plurality of columnar spacers having a width of 24 mm are disposed between the first plate-shaped base material (2〇c) and the second plate-shaped base material (2〇D). [Substrate support member (26)], at the same time, the heating wire (34) on the first plate-shaped substrate (2〇c) side and the heating wire (36) on the second plate-shaped substrate (20D) side are perpendicularly intersected . The substrate for dissipating component of the wavy component thus obtained has four heating wires (34) and (36) (nickel-chromium alloy wire) in the vertical and horizontal directions (row direction and column direction), and nickel chrome The point at which the heat resistant alloy wires cross each other (the number of heating regions (44)) is 4χ4, and the microcapsules are contained; the valley liquid, such as in the sixteen heating regions (44)

[SI 44 201125595 (Aroma evaluation) The order is to arrange the heat-resistant alloy wires arranged in the volatilization and the row direction arranged in column 4). For example, it is possible to use each nichrome wire heat-resistant alloy wire: (◦(10)W control Connected/disconnected with DC

75 〇 mA) connection. Another production power ^ original (Electric Fort 5.0V, electric points), connected = another 'In the following description, the chrome heat resistant alloy wire according to the configuration order ^ ^ recorded chrome resistant alloy wire by day m becomes A ~ D遽 'For the column (4) ..., the mouth is in the order of the knowledge.) When the intersection of the ~4 direction and the column direction is expressed as the 2B position ^', for example, 3 does not work, and when the fragrance evaluation is performed, the change is made. The substrate for the volatile component escape is used only in the position where the microcapsule-containing member (28) is disposed at the position 2B of the total of sixteen positions, and the test is performed at the position of the addition of the component (28). After decomposing and re-sticking the sheet-like substrate (2GD) of the poly-imine sheet, the microcapsule-containing solution is re-added at the position of the 2nd, thereby reassembling the substrate for dissolving the volatile component (14) In addition, when assembling the substrate (14) for dispersing the volatile component, the microcapsule-containing solution is usually added dropwise at all positions, but in the present embodiment, in the evaluation of the fragrance, in order to make the test in the scent The effect of residual incense has become extremely small, while shortening the evaluation time' The microcapsule-containing solution is added dropwise only at one position. In addition, a temperature sensor is disposed in the vicinity of position 2B, and the maximum temperature near the position 2B of each s type is confirmed, and the temperature is transmitted. Compared with the microcapsules, the senses are located farther away from the heating line. Therefore, it is not positive 45 201125595. It does indicate the temperature near the microcapsules (ie, whether the temperature reaches the melting point of the microcapsule shell). The aroma evaluation 'for the continuous heating line The presence or absence of the fragrance after the flow of the three-minute current and its intensity were subjected to sensory evaluation based on the current before the flow of the current. Here, the sensory evaluation was performed on the substrate for the escape of the volatile component (1 4). The evaluation was carried out in the state of one meter. In addition, in order to reduce the influence of the residual fragrance, the indoor test was sufficiently ventilated at the end of one test, and the room was substantially tasteless, and the next test was performed. The results are shown in Table 1. [Table 1]

The microcapsule contains the position of the member 28 (position M). The position where the heat treatment is performed (the position of the nickname) 2 The most local temperature of the position of the nickname rc) The distance between the position of the scent position and the position of the nickname (mm) The presence or absence of the strength 2Β 74.1 0.0 Strong 3C 54.5 3.6 4D 48.8 7.2 '·», ------ &lt;J&lt;I

2B

2B 2B ^ &lt;丨 》 》 》 》 丨 丨 丨 丨 丨 丨 丨 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 乃 乃 乃 乃 乃 乃 乃In addition, in the case where the distance from the position to the 4D position in the diagonal direction is increased, the scent is not found. In addition, it can be considered that the weak scent is found when the heating is set, because the heat is transferred to the position 2B at the position of the buckle, and the microcapsule located at the position 2B is locally heated and destroyed. However, it is considered that since the intensity of the fragrance is significantly different at the positions 2B and 3c, by shortening the heating time, the fragrance can be dissipated only when the position 2B is heated. From the above, it can be seen that the desired flavor can be dissipated by heating any of the heating zones. [Example 2] (Preparation of a substrate for volatile component scattering) In addition to the volatile component used in place of Example 1, The heat generating wires (34) and (36) (nickel-chromium alloy wires) serving as heating elements in the substrate 4 are placed, and the heat generating wires (36) are disposed on the second plate substrate (2〇D) side. The volatile component dissipating substrate used in the fragrance evaluation of Example 2 was prepared in the same manner as in the following except that the microcapsules were changed to the following components. In addition, the 'heating chip (chip resistance, model: MCR03 manufactured by ROHM Co., Ltd.) is placed at a position where the heating wires (34) and (36) overlap each other (that is, each position of sixteen positions), and if It is connected to a power source like the ΟΝ/OFF control for heating each unit of the heat generating chip. Further, the circuit including each of the heat generating core sheets is configured as shown in Fig. 11, and it is advantageous to measure 忒τγ to the heat generating chip R to which the transistor D 1 is connected, and to flow a current of 3.3 V and 150 mA. (Microcapsule) The outline of the microcapsule used in Example 2 is as follows. • Shape: Spherical • Average diameter M〇〇) Jm 47 201125595 • Housing: thickness 〇 · 1μΓΤ1 of polyurethane Xie Ri t r

Ue tree 曰 (melting point: 4 〇. 〇) • Core material (volatile component) · Lavender essential oil (aromatic evaluation) The aroma evaluation was carried out in the same procedure as in Example). The results are shown in Table 2 below. [Table 2]

The microcapsules are provided with the heat treatment of the position of the nickname position member 28, and the position of the south temperature position (the apostrophe position) (the nickname position) (°C) distance (mm) 2巳2巳72.1 0 0 2Β 3C 47.8 3.6 2Β 4D 38.2 7.2 Aroma evaluation with or without strength /»»% Benefit -

- When I saw that Dan Nai heated to the position 3C where I moved away from the location, I found a little scent. In the second example, when I heated the position 2B, I found strong = aroma / in addition, When the position of the 3C position and the 4D position which are away from one and two positions in the diagonal direction from the position 2B was heated, no fragrance was observed. From the above, it can be seen that the desired fragrance can be dissipated by heating any of the heating zones. Further, compared with the first embodiment, the maximum temperature of the position No. 2B when the position of the 2nd day is heated is substantially the same, but there is no position at the position 3c farther from the position of the 2β position to the diagonal direction. Found a weak citron. In the first embodiment and the second embodiment, it is considered that the structure of the substrate for volatile component scattering is substantially the same in consideration of the difference in the type of the heating element of the two 2011, 2011, 595, and it is considered that the heating is used in comparison with the heating wire. In the case of a sheet, the controllability of the escape of volatile components is further increased. [Example 3] (Preparation of microcapsules containing aroma component) / Preparation of a turbidity containing a blend of a self-emulsifying wax, a non-self-emulsifying wax, and a flavor mixture in a polyethylene glycol solution prepared by the following steps The liquid will be 20g self-emulsifying Dur〇x〇n j_324 wax (melting point ~^ 〇C Durachem), 20g non-self-emulsifying Unj|in 7 〇〇 soil (refining point no 0|ite) Q.5Gg potassium hydroxide and 2Qg Deionized water was placed in a 5 〇〇m| reactor equipped with a mixer 'temperature regulator and a cooler. The picker 'heats the reactor' and maintains 1QQ&lt;t until it melts to form a smooth homogenous solution. I6g of stagnation deionized water was gradually added to the molten water mixture and held at (10) t until a colorless transparent solution was observed. Then, 44 g of the flavor (Musk〇_14, aroma of the scent of Sakamoto Takasago Industries Co., Ltd.) was gradually added (10). c (d) mixture produces a honey-like solution. Next, 8 〇g of jiteng deionized water was added to the reactor to form a milky/perfume mixed emulsion. Xiao i36g polyethyl alcohol solution (weight average molecular weight 2, Μ% solid) was added to the milk 2, and the emulsion was cooled in a water bath to i 4 〇 ~ (4), thereby producing a stable turbid liquid. The emulsion that will produce this result will be using Yamy. The GA31 small 3 mist dryer is dried by mist drying at TC population air temperature to make microcapsules containing 40% perfume. (Production of sheet with heating wire) 49 201125595 Commercially available in 25mmx25mm cut into vertical and horizontal directions On a ppc paper (photocopying paper, Fuji Xerox Co., Ltd., C2 paper), a nichrome wire having a diameter of mm2 mm was arranged linearly at intervals of 2 mm, and then adhered thereto. Another sheet of PPC paper is obtained. Two paper substrates with a nichrome wire are obtained in this way. (Production of a substrate for dissipating aroma components) Next, on one side of the sheet with the nichrome wire, along the side the

The 〇jcc concentration of 1〇0/ is added to the recording heat-resistant alloy wire every 2mm. The dispersion of the microcapsules in ethanol solution (microcapsule solution). Then, the substrate for fragrant component scattering is obtained by ablation of the other substrate on the surface on which the microcapsule solution is dropped by the intersection of the nickel-based heat-resistant alloy wires 4 (hereinafter, the following is a brief description of the "aromatic substrate". When the drilling is performed, the adjustment is made so that the points of the heat-resistant alloy wires of the paper substrate in the table overlap with each other and the point at which the microcapsule solution is dropped. The obtained aromatic substrate is in the material direction (row direction) There are twelve nichrome alloys in the direction of the column and the column: ': the point where the chrome-resistant alloy wires cross each other (the number of the heating regions is 1 2 X 1 2 (aromatic evaluation)), and then arranged in the Fang Fanqi &amp; μ &gt; + , each nickel-chromium-resistance alloy line in the 仃 direction of the soil board and each nickel arranged in the column direction..... 耐 全 全 全 、 、 、 、 、 、 、 、 、 、 、 、 、 It can be connected to the diaphragm power supply (voltage of 1.5 V for voltage 1 · 5 ν) by the on/off control of each nickel-chromium. On the other hand, it is added to each nichrome wire. In addition, in the following description, in the finger dry; r direction, column direction of each heat resistance / " Set deep% given number No. 1 ~ 12

LSI 50 201125595 code to distinguish. Environmental test, then, under all the nickel-chromium skin, Luo-Gan Gan..., gold, and the conduction of the FF will be placed under the high π yield 90%) Under the wet environment (temperature 50 degrees, oceanity 90/〇), the fragrance of Asia at this time... Shi Yu „, force ',,, selected the male, but 熹. 'Λ found any aroma. This can be a 疋 / fork indeed '^, in the general high, Θ 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香The scent of the scent of the musk disappears in the scent of the scent of the scent of the scent of the scent of the scent of the scent of the scent of the scent of the scent of the scent At the time of the second; the third and fourth recorded chrome heat resistant alloy wire and the square = the chrome alloy wire of No. 2, after three seconds of current flow, the same degree of strength as the first day of the test was found. Aroma. From the above, it can be confirmed that the nichrome line is vertical and horizontal, and the microcapsules near the anvil are covered, broken, and microcapsules. The aroma component is dissipated. Long-term placement test ~ Then, the aromatic sheet that ends the above aromatic test is placed for about -month at room temperature and thirst::degree, humidity (6 〇%). Then, the fifth to the 仃No. 6 and No. 6 nichrome wire and column number and the first 自 自 & amp amp 』 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 铬 三 三 三 三 三 三 三 三The degree of musk scent. From the above, even in the state where the fragrant sheet is not used for a long time, the fragrant function of the board is not deteriorated. 曰土, 51 201125595 [Simple description of the pattern] Mode section (4) ^ (4) The volatile component escapes the substrate for the use of the substrate - the example is shown in Figure 7F. From the _ φ substrate, the volatile component escape mode is not shown. The schematic view of the second configuration is the third chart. Thousands of π not only - face side observation of the first figure

When using the substrate, the volatile component of the S. "The outline of the configuration of the 杲 and the hollow portion is shown in Fig. 4, which is the deformation of the substrate for the volatilization of the first embodiment of the first to the second. The following is a schematic cross-sectional view showing an example of the dispersion of volatile components in the present embodiment. / 111 Other examples of the substrate for escape are shown in the figure of the volatile component of the present embodiment. Fig. 7 is a schematic cross-sectional view showing another example of the volatile component escaped wire of the present embodiment. The eighth figure is the wave used for the escaped silk plate of the table (the fourth) state. FIG. 9 is a plan view showing an example of a substrate for a volatile component dissipating member using the volatile component dissipating member shown in FIG. 8. FIG. A schematic cross-sectional view of an example of a substrate for dissipating a volatile component of a microcapsule. The eleventh embodiment is a circuit including a heat generating chip constituting the substrate for volatilization 52 201125595 of the present embodiment used in the second embodiment. [Description of main component symbols] (10), (12) ' (14) Substrate for volatile components (20A), (20B), (20C), (20D) plate substrate (22) ' (22A (22B), (22C), (22D) hollow portion (24) communication hole (26) substrate supporting member (28), (28A), (28B), (28C) microcapsule containing member (30), (30A), (30B), (3〇C), (30D) heating wire or wire (part of the heating element) (32), (32A), (32B), (32C), (32D) heating wire or wire (part of the heating element) (34), (34·Α), (34B), (34C), (34D) heating wire or wire (part of the heating element) (3 (3) heating wire or wire (heating element Partial) (40), (40Α), (40Β), (40C), (40D) heating zone (42), (42Α), (42Β), (42C) heating zone (50), (52), (54 (56) Substrate (60) for volatile component dissipation (60Α), (60Β), (60C) heat generating chip (heating element) (62), (62Α), (62Β), (62C) wiring ( 64), (64Α), (64Β), (64C) wiring (66) heat generating chip (heating element) (70) first plate substrate ( 72) second plate substrate

53 201125595 (74) Vertical hole (76) Plate-shaped substrate (78) Vertical hole (80), (80A), (80B), (80C) Microcapsule containing component (82) Volatile component (84) Sealing film ( 90), (90A), (90B), (90C) heating zone (92) heating zone (100) volatile component dissipating component (1 10) cylindrical member (1 12) inner peripheral portion (120) slit ( Air layer) (200) Substrate for volatile component dissipation

54

Claims (1)

201125595 Seven patent application scope: 1. A substrate for escaping volatile components, characterized by having a plate-like substrate, a heating element that selectively heats a portion of the plate-like substrate, and 'Microcapsule' The microcapsule is disposed at least in a heating zone selectively heated by the heating element, i includes a core material containing a volatile component, and an outer casing that is destroyed by heating while coating the core material material. The substrate for volatile component dispersion according to claim 1, wherein the volatile component is at least one selected from the group consisting of an aromatic component, an insecticidal component, an antibacterial component, and a deodorizing component. 3. The substrate for volatile component dispersion according to claim 2, wherein the plate-shaped substrate has a hollow portion, and the microcapsules are disposed in the hollow portion. The substrate for volatile component dispersion according to claim 1 or 2, wherein the material constituting the plate-like substrate is at least one selected from the group consisting of resin, cellulose, and ceramics. 5. The substrate for volatile component dissipating as described in claim 1 or 2, wherein the substrate is provided on the plate-like substrate from the plate-shaped soil material A communication hole in which a region of the microcapsule communicates with a surface of the plate-like substrate. 6. The substrate for volatile component escape according to claim 1 or 2, which has flexibility. 7. The substrate for volatile component dissipating r-V t ^ i 55 201125595 according to claim 1 or 2, wherein the heating element is provided with an axial direction and the plate-like base The plane of the material is slightly flattened - the root wiring 'and the thickness direction of the plate-shaped substrate 盥 the --wiring is far away, and the plane of the plate-shaped substrate is slightly parallel, μ-the wiring Another root wiring arranged in the same manner; ^ the root wiring and the heating unit (4) &amp; F 2 8 · If applying for a patented siren bucket, 0 κ / using the volatile component of the m ordinal 1 or 2, the heating element is composed of a heat generating chip. Board, two: special:? The volatile component dissipating group according to Item 8 has a diastolic material, and the volatile component dissipating member has a homogenous member, and is disposed at the 兮钤 址 site u τ and is placed in the 3 mysterious member. The heat generating chip that seals the opening of one side of the cylindrical member M. The volatility dispersing substrate according to claim 2, which has the two heating regions on the surface. II. For the patent section 圚笙i substrate, in the bean, the type of the knee-skeleton component contained in the microcapsules in the heating zone, and the volatilization component contained in the heating zone are volatilized; The types of micro-volatile components in the region are different. / 襄 包 12 12 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The regional surface direction is arranged in a matrix. 1 3 . — A method for dissipating a volatile loyal eight &amp; u knives, characterized in that 56 201125595 uses a substrate for dissipating volatile components and is crowned by at least one The region is heated to dissipate the volatile component to the exterior of the volatile component escape substrate, wherein the volatile component escape substrate has a plate-like substrate, optionally a heating element that heats a portion of the plate-shaped substrate, and at least a heating region that is selectively heated by the heating element, 'i includes a core material containing a volatile component and simultaneously covers the core material Microcapsules of the outer casing that are destroyed by heating. The method for dispersing a volatile component according to claim 13, wherein the volatile component escape substrate has two or more addition zone bases; The heat treatment is performed by heating some or all of the remaining heating regions that have not been subjected to the initial heat treatment 4 in which all of the heating regions have been heated. . 57