JP2010131366A - Volatile component vaporizing board and volatile component vaporizing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a volatile component vaporizing board which can vaporize a volatile component without using a mechanical method such as thrust force (1), and does not deteriorate volatile performance even it is not tightly packaged when unused (2). <P>SOLUTION: The volatile component vaporizing board 10 comprises a sheet substrate 20A, heating elements 30, 32 selectively heat a partial area 40a of the sheet substrate 20A, and microcapsules which are at least placed in the heating area 40 and includes a core material containing a volatile component and a crust material covering the core material and destructible by heating. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

    The present invention relates to a volatile component volatilization substrate and a volatile component volatilization method.

  Conventionally, various fragrance products have been provided for the purpose of sedation, sleep falling, awakening, analgesic, antibacterial, deodorant and the like. Among these fragrance products, those using so-called essential oils include a heating system that heats essential oil (or a solution containing it or a sheet soaked with the solution) to volatilize the fragrance, and does not heat the essential oil. There is a non-heating method that volatilizes naturally.

  As an unheated fragrance product, one having a bottle filled with a solution in which a fragrance is dissolved and a volatilization part that sucks up the solution in the bottle and volatilizes it to the outside is known. In addition, a sheet-like fragrance product containing a fragrance (hereinafter sometimes referred to as “fragrance sheet”) is also known. As an aromatic sheet, for example, a sheet in which a microcapsule containing an aromatic component is attached to a substrate is known (Patent Document 1). In the fragrance sheet disclosed in Patent Document 1, the microcapsule is broken by applying pressure, whereby the fragrance component is volatilized to the outside of the fragrance sheet. Further, as a product having a function and configuration similar to an aromatic sheet, a so-called mosquito-removing mat that volatilizes a volatile insecticidal component soaked into the sheet by heating with an electric warmer is known.

JP 2002-265353 A

  However, in the fragrance sheet disclosed in Patent Document 1, the fragrance component cannot be volatilized unless pressure is applied by pressing or rubbing the fragrance sheet by hand. In addition, a sheet soaked with a volatile insecticidal component such as a mosquito-repelling mat must be stored in a state of being sealed and packed with an aluminum bag or the like for storage until just before use. In addition, once removed from the packaging bag, the pesticidal component naturally volatilizes, so the volatility performance deteriorates.

  The present invention has been made in view of the above-described circumstances. (1) Volatile components can be volatilized without using a mechanical method such as pressing force, and (2) without being sealed in a non-use state. However, it is an object of the present invention to provide a volatile component volatilization substrate that does not deteriorate the volatilization performance and a volatile component volatilization method using the same.

The above-mentioned subject is achieved by the following present invention. That is,
The substrate for volatile component volatilization of the present invention is disposed in a sheet-like base material, a heating element that selectively heats a partial area of the sheet-like base material, and a heating area that is selectively heated by at least the heating element. And a core material containing a volatile component and a microcapsule that covers the core material and includes an outer shell material that is destroyed by heating.

  In one embodiment of the substrate for volatile component volatilization of the present invention, the volatile component is preferably at least one selected from a fragrance component, an insecticidal component and an antibacterial component.

  In another embodiment of the volatile component volatilization substrate of the present invention, the sheet-like base material preferably has a hollow portion, and the microcapsules are disposed in the hollow portion.

  In another embodiment of the substrate for volatilization of volatile components of the present invention, the material constituting the sheet-like substrate is preferably at least one selected from resins, fibrous substances, and ceramics.

  In another embodiment of the substrate for volatilization of volatile components of the present invention, the sheet-like base material has a communication hole communicating from the region where the microcapsules in the sheet-like base material are arranged to the surface of the sheet-like base material. It is preferable to be provided.

  It is preferable that the other embodiment of the board | substrate for volatile component volatilization of this invention has flexibility.

  In another embodiment of the substrate for volatile component volatilization of the present invention, the heating element has one wiring whose axial direction is substantially parallel to the plane of the sheet-like substrate and one thickness direction of the sheet-like substrate. An area that is separated from the wiring, is substantially parallel to the plane of the sheet-like base material, and is arranged so as to intersect with the one wiring. It preferably functions as a heating region.

  In another embodiment of the volatile component volatilization substrate of the present invention, the heating element is preferably composed of a heat generating chip.

  Other embodiments of the volatile component volatilization substrate of the present invention are arranged so as to seal a cylindrical member, a microcapsule arranged inside the cylindrical member, and an opening on one side of the cylindrical member. It is preferable to include a volatile component volatilization unit having a generated heat generating chip.

  It is preferable that the other embodiment of the board | substrate for volatile component volatilization of this invention has two or more heating area | regions.

  Another embodiment of the substrate for volatilization of volatile components of the present invention includes a type of volatile component contained in a microcapsule disposed in one heating region and a microcapsule disposed in another heating region. It is preferable that the type of the volatile component contained is different.

  In another embodiment of the volatile component volatilization substrate of the present invention, it is preferable that four or more heating elements are provided, and each heating element is arranged in a matrix in the plane direction of the sheet-like substrate.

  The volatile component volatilization method of the present invention includes a sheet-like substrate, a heating element that selectively heats a partial area of the sheet-like substrate, and at least a heating area that is selectively heated by the heating element. At least one heating region is heated using a volatile component volatilization substrate having a core material containing a volatile component and a microcapsule that covers the core material and includes an outer shell material that is destroyed by heating. Thus, the volatile component is volatilized to the outside of the volatile component volatilization substrate.

  One embodiment of the volatile component volatilization method of the present invention is the first time that the volatile component volatilization substrate has two or more heating regions, and heating is performed by selecting a part of all the heating regions. After performing the heat treatment, it is preferable to repeat the heat treatment in which heating is performed by selecting a part or all of the remaining heating region that has not been heated once or more.

  According to the present invention, (1) Volatile components can be volatilized without using a mechanical method such as pressing force, and (2) Volatility that does not deteriorate volatilization performance even if not sealed when not in use. A substrate for component volatilization and a method for volatilizing a volatile component using the substrate can be provided.

It is a schematic cross section which shows an example of the board | substrate for volatile component volatilization of this embodiment. FIG. 2 is a schematic perspective schematic view showing the arrangement of heating lines, heating lines, and hollow portions when the substrate for volatile component volatilization shown in FIG. 1 is viewed from one side. It is a schematic diagram which shows arrangement | positioning of the heating wire, heating wire, and hollow part which show when the board | substrate for volatile component volatilization shown in FIG. 1 is seen from one surface side. It is a schematic cross section which shows the modification of the board | substrate for volatile component volatilization of this embodiment shown in FIGS. It is a schematic cross section which shows the other example of the board | substrate for volatile component volatilization of this embodiment. It is a schematic cross section which shows the other example of the board | substrate for volatile component volatilization of this embodiment. It is a schematic cross section which shows the other example of the board | substrate for volatile component volatilization of this embodiment. It is a schematic diagram which shows an example of the volatile component volatilization unit used for the volatile component volatilization board | substrate of this embodiment. It is a top view which shows an example of the board | substrate for volatile component volatilization using the volatile component volatilization unit shown in FIG. It is a schematic cross section which shows an example of the board | substrate for volatile component volatilization which does not use a microcapsule. It is a circuit diagram containing the heat-emitting chip which comprises the board | substrate for volatile component volatilization of this embodiment used in Example 2. FIG.

-Substrate for volatilization of volatile components-
The substrate for volatile component volatilization of the present embodiment includes a sheet-like base material, a heating element that selectively heats a partial area of the sheet-like base material, and at least a heating area that is selectively heated by the heating element. And a microcapsule including a core material containing a volatile component and an outer shell material that covers the core material and is destroyed by heating.

  In the substrate for volatile component volatilization of this embodiment, a microcapsule including a core material containing a volatile component and an outer shell material that covers the core material and is destroyed by heating is used. For this reason, when the microcapsule arranged in the heating region is heated by the heating element, the outer shell material is destroyed, whereby the volatile component is volatilized outside the volatile component volatilization substrate. Therefore, the volatile component can be volatilized without using a mechanical method such as a pressing force. Furthermore, since the volatile component is encapsulated in the microcapsule, the volatile component is not spontaneously volatilized and lost unless the microcapsule is heated from the outside. For this reason, even if the substrate for volatile component volatilization is not hermetically packed when not in use, the volatile performance does not deteriorate. Hereinafter, the detail of each part which comprises the board | substrate for volatile component volatilization of this embodiment, and the structure of the board | substrate for volatile component volatilization are demonstrated.

-Volatile component-
The volatile component used in the volatile component volatilization substrate of the present embodiment is volatile in a general temperature environment (about −10 ° C. to 50 ° C.) where the use of the volatile component volatilization substrate is assumed. If it is a component which has, the component will not be specifically limited, A well-known substance can be utilized. However, the volatile component is preferably at least one selected from an aroma component, an arousal component, an insecticidal component, and an antibacterial component, and two or more of these may be used in combination. Of these three types of volatile components, it is particularly preferable to use an aromatic component. Furthermore, the volatile component used may have two or more types of functions, such as having both an aroma function and an antibacterial function.

  As the fragrance component, any known fragrance component can be used without any particular limitation. For example, essential oils, synthetic fragrances, animal fragrances, active ingredients and simple compounds thereof can be mentioned as suitable ones. The active ingredient contained is preferred.

  Examples of essential oils include ylang ylang essential oil, geranium essential oil, lavender essential oil, jasmine essential oil, chamomile essential oil, lavantine essential oil, hyssop essential oil, rose essential oil, neroli essential oil, cedarwood essential oil, eucalyptus essential oil, cypress essential oil, cypress essential oil, sandalwood essential oil, Juniper Essential Oil, Tea Tree Essential Oil, Pine Essential Oil, Patchouli Essential Oil, Orange Essential Oil, Grapefruit Essential Oil, Lime Essential Oil, Lemongrass Essential Oil, Lemon Essential Oil, Citronella Essential Oil, Bergamot Essential Oil, Peppermint Essential Oil, Rosemary Essential Oil, Clary Sage Essential Oil, Clove Essential Oil, Thyme Essential Oil, Examples include natural essential oils such as fennel essential oil, marjoram essential oil, Melissa essential oil, rosewood essential oil, basil essential oil, bate essential oil, and cinnamon essential oil. Of these, ylang ylang essential oil, geranium essential oil, cedarwood essential oil, eucalyptus essential oil, cypress essential oil, orange essential oil, grapefruit essential oil, lime essential oil, peppermint essential oil and rosemary essential oil are preferred. A combination of these essential oils may be used.

  The active ingredients contained in essential oils include, for example, linalool, linalyl acetate, 1-limonene, 1-menthol, α-pinene, β-pinene, citral, cineol, d-camphor, thymol, eugenol, keihyaldehyde, camazulene, tyranol -4, borneol, α-terpineol, β-terpineol, terpineol-4, geraniol, nerol, α-santalol β-santalol, carotol, cedrol, biridiflorol, sclareol, safrole, apiol, myristicin, methylcarbicol, anethole, Examples include sclareol oxide, manoyl oxide, and citronellal. Moreover, you may use combining these active ingredients in multiple numbers.

  As the insecticidal component, a known volatile insecticide can be appropriately selected depending on its use. Specific examples include pyrethroid insecticides such as fernothrin and phenpropatriline, organic phosphorus compounds such as fenitrothion, diphenylcarninol compounds such as kelsen, phenyl salicylate, etc., pentrin, 2,3,5,6-tetrafluoro- 4-methoxymethylbenzyl 3- (1-propenyl) -2,2-dimethylcyclopropanecarboxylate, 2,3,5,6-tetrafluoro-4-methylbenzyl 3- (1-propenyl) -2,2- Examples thereof include dimethylcyclopropanecarboxylate and 2,3,5,6-tetrafluorobenzyl 3- (2,2-dichlorovinyl) -2,2-dimethylcyclopropanecarboxylate, pyrethroids and the like.

  As the antibacterial component, a known volatile antibacterial agent can be appropriately selected depending on its use. Specific examples include hinokitiol, xanthone, phyton and the like.

-Microcapsules-
The microcapsule used for the volatile component volatilization substrate of the present embodiment can be produced using a known microcapsule production method. The microcapsule production method can be roughly classified into a chemical method, a physicochemical method, and a mechanical method. And (1) chemical methods include, for example, suspension polymerization method, miniemulsion polymerization method, emulsion (emulsion) polymerization method, precipitation polymerization method, dispersion polymerization method, interfacial polymerization method, submerged curing method, (2) Examples of the physicochemical method include a submerged drying method, a phase inversion emulsification method, and a coacervation method. (3) Examples of the mechanical method include a spray drying method and a heteroaggregation method. (For example, see “Key Points for Nano / Microcapsule Adjustment”, Tanaka Hayato, Techno System Co., Ltd.).

  Among these microencapsulation methods, the interfacial polymerization method and the coacervation method are usually preferred. When the interfacial polymerization method is used, the microcapsules can be manufactured, for example, as follows. First, an oil phase prepared by dissolving or dispersing a volatile component in a hydrophobic organic solvent as a raw material constituting the core material of the microcapsule is prepared. Next, this oil phase is put into an aqueous phase in which a water-soluble polymer is dissolved, and emulsified and dispersed by a stirring means such as a homogenizer. The obtained emulsion is heated to cause a polymer formation reaction at the oil droplet interface. Thereby, a microcapsule in which a core material containing a volatile component is coated with an outer shell material can be obtained.

  Note that as the outer shell material constituting the microcapsule, a material that is dissolved by heating or broken by thermal decomposition is used. As such a material, an organic material having a melting point of about 85 ° C. to about 135 ° C. is preferably used. In addition, melting | fusing point has the more preferable range of 85 to 105 degreeC. When the melting point is less than 85 ° C., when the volatile component volatilization substrate is left in a high temperature environment, the outer shell material of the microcapsule spontaneously dissolves, and the volatile component may volatilize outside. is there. Further, when the melting point exceeds 135 ° C., even when heated by a heating element, the outer shell material of the microcapsule may not be dissolved, and the volatile component may not be volatilized to the outside.

  Specific examples of the outer shell material include gelatin, rosin, gum arabic, shellac, sodium alginate, polyvinyl alcohol, epoxy, polyurethane, polystyrene, polyacrylamide, polyester, polyamide, urea and the like. Moreover, as a hydrophobic organic solvent that can be used together with a volatile component as a core material, an organic solvent having a boiling point of 300 ° C. or lower is preferable. For example, in addition to esters, dimethylnaphthalene, diethylnaphthalene, diisopropylnaphthalene, dimethylbiphenyl, Diisopropylbiphenyl, diisobutylbiphenyl, 1-methyl-1-dimethylphenyl-2-phenylmethane, 1-ethyl-1-dimethylphenyl-1-phenylmethane, 1-propyl-1-dimethylphenyl-1-phenylmethane, triallyl Methane (eg tritoluyl methane, toluyl diphenyl methane), terphenyl compounds (eg terphenyl), alkyl compounds, alkylated diphenyl ethers (eg propyl diphenyl ether), hydrogenated terphenyls (eg , Hexa hydro terphenyl), diphenyl ether and the like.

  The average particle size of the microcapsules is not particularly limited, but is preferably in the range of 10 μm to 500 μm, more preferably in the range of 150 μm to 350 μm, and still more preferably in the range of 10 μm to 50 μm. When the average particle size is less than 10 μm, the content ratio of the volatile component in the total mass of the microcapsules becomes too small, and it may be difficult to volatilize the volatile component at a sufficient concentration. Further, when the average particle size exceeds 500 μm, the mechanical strength of the microcapsules may be lowered. For this reason, when pressure is applied to the microcapsule by bending or pressing down the volatile component volatilization substrate, the microcapsule is easily destroyed, and the volatile component is easily volatilized outside at an unintended timing. .

  In addition, the microcapsules can be arranged at any position on the surface or inside of the sheet-like substrate as long as they are arranged at least in the heating region. However, the surface of the sheet-like substrate is exposed to mechanical stimuli such as friction, and the microcapsules are easily broken. For this reason, it is preferable that a microcapsule is arrange | positioned inside a sheet-like base material. In this case, it is preferable that the sheet-like substrate has a hollow portion, and the microcapsules are disposed in the hollow portion. Moreover, you may arrange | position a microcapsule in the area | region away from the heating area | region as needed. For example, when the sheet-like substrate is composed of a fibrous material or a porous body, the microcapsules can be evenly dispersed and arranged in the sheet-like substrate. When the sheet-like substrate is composed of a fibrous substance, the microcapsules can be confined in a network structure formed by the fibrous substance. Note that the number of microcapsules arranged in the heating region is not particularly limited, and one or more microcapsules may be arranged in one heating region. For example, if the diameter of the microcapsule and the size of the heating region are approximately the same, only one microcapsule may be disposed in one heating region. In addition, when the diameter of the microcapsules is sufficiently small with respect to the size of the heating region, it is preferable to arrange a plurality (for example, ten to several hundreds) of microcapsules in one heating region. In the description of specific examples using the drawings, which will be described later, a description is given on the assumption that a plurality of microcapsules are arranged in one heating region, but one microcapsule is present in one heating region. It does not exclude the arrangement.

-Sheet base material-
The sheet-like base material constituting the volatile component volatilization substrate of the present embodiment may have air permeability or may not have air permeability. The “air permeability” means a case where gas can permeate from the front surface to the back surface while diffusing at a molecular level, like a paper sheet mainly composed of pulp fibers. When the sheet-like substrate has air permeability, the molecules constituting the volatile component can pass through the sheet-like substrate by diffusing at the molecular level. As a material constituting the sheet-like substrate, a fine and air-permeable material having continuous voids such as a fibrous material or a porous material can be used.

  In addition, when the sheet-like base material does not have air permeability (when it is non-air-permeable), such as a sheet-like base material composed of a resin film or a plastic substrate, the molecules constituting the volatile component are The sheet-like base material cannot be diffused and passed through at the molecular level. For this reason, for example, the microcapsule is disposed between a pair of non-permeable sheet-like base materials in which the inside of the non-permeable sheet-like base material and the entire periphery of the end surface are completely sealed. In the volatile component volatilization substrate having such a configuration, the microcapsule is dissipated out of the microcapsule due to heat destruction of the microcapsule, and the volatile component cannot be volatilized outside the volatile component volatilization substrate. In such a case, from the area | region where the microcapsule in a sheet-like base material is arrange | positioned, it connects to the communicating hole from the surface of a sheet-like base material, and one surface to the other surface. A communication hole is provided. In addition, you may provide a communicating hole in the sheet-like base material which has air permeability if necessary. Also, when using a non-permeable sheet-like base material, instead of providing a communication hole in the non-permeable sheet-like base material, from the position where the microcapsules inside the volatile component volatilization substrate are arranged, the volatile component A gas diffusion path communicating with the end face of the volatilization substrate can also be provided. For example, in a volatile component volatilization substrate having a structure in which a columnar spacer is disposed between a pair of non-permeable sheet-like base materials, the volatile component is easily generated from the inside of the volatile component volatilization substrate to the end face side. Can diffuse to.

  When communication holes are provided in a sheet-like substrate, the size of the communication holes is usually sufficiently larger than the void size of fibrous materials, porous materials, etc., so volatile components in the thickness direction of the sheet-like substrate The diffusion rate can be increased. For this reason, regardless of whether or not the sheet-like base material is made of a non-air-permeable material, the microcapsule is heated by the heating element, and then within a short time, to the outside of the volatile component evaporation substrate. Similarly, when it is desired to control the concentration of the volatile component to be volatilized to a high concentration, it is preferable to provide a communication hole in the sheet-like substrate. Moreover, when a sheet-like base material is comprised by bonding two sheet-like materials, you may provide a clearance gap so that a communicating hole may be formed in a part of bonding interface.

  Although the diameter of a communicating hole is not specifically limited, The range of 5 micrometers-30 micrometers is preferable, and the range of 5 micrometers-9 micrometers is more preferable. If the diameter is less than 5 μm, it may be difficult to form a communication hole in the sheet-like substrate, or clogging may easily occur due to dust or dust. In addition, when the diameter exceeds 30 μm, the opening of the communication hole on the surface of the sheet-like substrate is likely to be noticeable, and the aesthetics may be deteriorated. The “diameter of the communication hole” means the maximum diameter of a circle having the same cross-sectional area as the cross-sectional shape when the cross-sectional shape of the communication hole is not circular.

  As a material constituting the sheet-like substrate, a known solid material can be used, and two or more kinds can be used in combination. Of these, it is particularly preferable to use at least one selected from resins, fibrous substances, and ceramics. Examples of the resin include polyimide and Teflon (registered trademark). Examples of the fibrous material include pulp fiber, carbon fiber (carbon fiber), glass fiber, and the like. Examples of ceramics include alumina and zirconia. Note that the materials themselves of the resin and ceramics are non-permeable. However, a porous resin or ceramic can be used as necessary.

  Moreover, when an easily deformable material such as a resin or a fibrous substance is used as the sheet-like base material, flexibility can be imparted to the volatile component volatilization substrate. In addition, even when ceramics that are susceptible to brittle fracture are used as the sheet-like base material, the thickness of the sheet-like base material is reduced, or by using ceramics with high bending strength, the substrate for volatile component volatilization is flexible. Can be granted. When the volatile component volatilization substrate has flexibility as described above, the volatile component volatilization substrate can be used even in applications that require bending or stretching. Thereby, for example, the substrate for volatilizing volatile components can be used by being attached to the surface of a member having an uneven surface.

  Although the thickness of a sheet-like base material is not specifically limited, It is preferable to exist in the range of 30 micrometers-300 micrometers, and it is more preferable that it exists in the range of 50 micrometers-100 micrometers. If the thickness is less than 30 μm, the tensile strength may be insufficient and the volatile component evaporation substrate may be easily damaged. In addition, when the thickness exceeds 300 μm, even if a volatile component volatilization substrate is produced using a sheet-like base material made of a flexible material, flexibility can be imparted to the volatile component volatilization substrate. It can be difficult. The sheet-like base material may be composed of one sheet-like material, but may be composed of two or more sheet-like materials bonded together. In addition, when using 2 or more sheet-like material, the material and cross-sectional structure which comprise each sheet-like material may differ.

-Heating element-
The heating element provided on the volatile component volatilization substrate of the present embodiment has a function of selectively heating a partial region of the sheet-like base material. The heating element is electrically turned on / off as will be described later. For this reason, as disclosed in Patent Document 1, even if no pressing force is applied to the volatile component volatilization substrate, the heating element is electrically controlled at a desired timing, whereby the microcapsules are destroyed by heating and volatilized. Sexual components can be volatilized.

In addition, as a heating method of a microcapsule, the following two heating methods are mentioned, for example.
(1) 1st heating system The heating system which heats a microcapsule (outer shell material) by supplying heat energy directly from the outside to the area | region where a microcapsule exists.
(2) Second heating method A heating method that heats the microcapsule (outer shell material) by vigorously vibrating the molecules constituting the outer shell material by generating a high frequency in the region where the microcapsule exists.

  In the first heating method, the heating element is configured using a heat generating member that generates heat when an electric current is passed. The shape of the heat generating member is not particularly limited, but may be a linear heat generating member (heat generating wire) or a chip-shaped heat generating member (heat generating chip).

  When a heating wire is used as the heating element, when the heat energy supplied from one heating wire is an amount of energy sufficient for heating and destroying the microcapsule, the heating device is constituted by one heating wire. In this case, the microcapsule is disposed at least in the vicinity (heating region) of the heating wire. In the case where the heating element is composed of one heating wire, the heating wire may be linear, but may be coiled. In this case, the microcapsules are arranged in the coil or in the vicinity thereof (heating region).

  In addition, even if the heat energy supplied from one heating wire is insufficient for heating and destroying the microcapsule, the two heating elements arranged so as to cross each other or be parallel to each other. If the total amount of heat energy supplied from the wires is sufficient for heating and destroying the microcapsules, the heating element is composed of these two heating wires. In addition, when two heating lines intersect with each other in the plane or inside of the sheet-like base material and are separated in the thickness direction of the sheet-like base material, the two heating lines intersect. The vicinity of the area to be used is the heating area.

  In addition, as a heat generating wire, a well-known heat generating wire can be used as long as it generates heat by passing an electric current, but a tungsten wire, a nichrome wire, a stainless steel wire, a piano wire, or the like can be used. The heating wire may be disposed on the surface of the sheet-like substrate, but from the viewpoint of ensuring aesthetics, it is preferably arranged so as to be embedded in the sheet-like substrate. The diameter of the heating wire is not particularly limited, but when the heating wire is embedded in the sheet-like substrate, it is preferably in the range of 12 μm to 200 μm, and more preferably in the range of 20 μm to 100 μm. If the diameter is less than 12 μm, a sufficient amount of heat generation may not be obtained or disconnection may occur easily. If the diameter exceeds 200 μm, it may be difficult to embed the heating lines inside the sheet-like substrate, Heat generation control may be difficult. Note that the heat generation amount of the heating wire can be adjusted by appropriately selecting the distance between the heating wires when using the electrical resistance of the heating wire, the current amount, the diameter of the heating wire, and two heating wires.

  When a heat generating chip is used as the heating element, one heating region can be formed by one heat generating chip, and a microcapsule can be disposed in the vicinity of the heat generating chip. However, in a case where one heat generating chip cannot obtain sufficient thermal energy to heat break the microcapsule, or when it is desired to control the degree of heat destruction of the microcapsule by the number of heat generating chips that generate heat, One heating region may be formed by densely arranging two or more heat generating chips in one place. When two or more heat generating chips are used to form one heating region, the arrangement form of the heat generating chips in one heating region is not particularly limited, for example, arranged side by side in the plane direction of the sheet-like substrate, Or it can oppose and arrange | position so that a microcapsule may be pinched | interposed with respect to the thickness direction of a sheet-like base material.

  Further, the heat generating chip may be arranged on the surface of the sheet-like base material or may be arranged so as to be embedded inside. When the concave portion is provided on the surface of the sheet-like base material, for example, the heat generating chip can be arranged on the bottom surface or the side surface of the concave portion. In this case, after arranging the heat generating chip, the microcapsule can be arranged so as to fill the recess. Alternatively, the heat generating chip may be disposed so as to cover the opening of the concave portion after the microcapsule is first disposed so as to fill the concave portion. In this case, since the microcapsules are also densely arranged in the recesses where the heat generating chips are arranged, it is easy to further increase the heat destruction efficiency of the microcapsules by the heat generating chips. That is, the utilization efficiency of the microcapsules becomes higher.

Moreover, the volatile component volatilization unit which has a cylindrical member, the microcapsule arrange | positioned inside this cylindrical member, and the heat-emitting chip arrange | positioned so that the opening part of the one side of a cylindrical member may be sealed May be used. Such a volatile component volatilization unit functions as one heating region, and since the microcapsules are densely arranged in the cylindrical member, the heat destruction efficiency of the microcapsules by the heat generating chip can be further increased. Easy.

  In the volatile component volatilization unit corresponding to each heating region, for example, the side where the heat generating chip of the cylindrical member is arranged so that the thickness direction of the sheet-like base material and the central axis of the cylindrical member substantially coincide with each other. It can be densely arranged in a staggered arrangement or a square arrangement on the surface of the sheet-like substrate so as to be on the sheet-like substrate side. In this case, it is particularly preferable to dispose the volatile component volatilization unit so that a gap is formed between the outer peripheral surfaces of the cylindrical members constituting the volatile component volatilization units disposed adjacent to each other. Thereby, between adjacent volatile component volatilization units, a gas material (air layer) having a lower thermal conductivity than a solid material such as a cylindrical member or a liquid material such as a liquid or aroma component liquefied by heating. Will exist. For this reason, the heat insulation property between adjacent volatile component volatilization units becomes very high. In this case, when heating is performed in one volatile component volatilization unit among adjacent volatile component volatilization units, the thermal energy generated in one volatile component volatilization unit is converted to the other volatile component volatilization unit. It becomes difficult to be transmitted to the unit. Therefore, the volatilization controllability of the volatile component in each heating area unit becomes very high.

  In addition, in order to form a gap between the outer peripheral surfaces of the cylindrical members constituting the volatile component volatilization units arranged adjacent to each other, a method of simply adjusting the arrangement interval between the volatile component volatilization units is Can be mentioned. Moreover, even if it arrange | positions so that the arrangement | positioning density may become the maximum as a shape of a cylindrical member, the outer periphery of the cylindrical member which comprises the volatile component volatilization unit arrange | positioned adjacent to each other It is also possible to adopt a shape that creates a gap between the surfaces. Examples of the cylindrical member having such a shape include a cylindrical member and a cylindrical member having a polygonal shape in which a cross-sectional shape of a surface orthogonal to the central axis is a pentagon or more.

  As the heat generating chip, a chip using a material that generates heat when energized, such as a low-purity semiconductor material, can be used. The electrical characteristics of such a heat generating chip are not particularly limited as long as it can be used for resistance heating, but the heating target (microcapsule) used for the substrate for volatile component volatilization of the present embodiment. ) And heat breakdown characteristics, the resistance is preferably 15Ω to 33Ω at a voltage of 3.3V to 5.0V. The shape of the heat generating chip is not particularly limited, but usually a flat plate shape such as a disk shape or a square plate shape is preferable, and from the viewpoint of the availability of a commercially available product in addition to the surface mountability, it is a square plate shape. It is preferable that The size of the heat generating chip is selected according to the size of the heating region. For example, in the case of a square plate-shaped heat generating chip, the height is 0.4 mm × width 0.2 mm to length 3.2 mm × width. It is preferable to use the one of about 1.6 mm. A newly produced chip can be used as the heat generating chip, but a commercially available chip resistor may be used.

  In the second heating method, the heating element is composed of two conducting wires arranged so as to intersect each other in the plane or inside of the sheet-like base material and to be separated from each other in the thickness direction of the sheet-like base material. A region (heating region) where a high frequency occurs is in the vicinity of the region where the lead wires intersect. For this reason, the microcapsule can be destroyed by heating if a current is simultaneously supplied to the two conductive wires in a state where the microcapsule is disposed in this region. Although conducting wire may be arranged on the surface of a sheet-like base material, it is preferred to arrange so that it may be embedded inside a sheet-like base material from a viewpoint of securing aesthetics. The diameter of the conducting wire is not particularly limited, but when the conducting wire is embedded in the sheet-like base material, it is preferably in the range of 30 μm to 200 μm, and more preferably in the range of 50 μm to 100 μm. If the diameter is less than 30 μm, disconnection may easily occur, and if the diameter exceeds 200 μm, it may be difficult to embed the heating wire inside the sheet-like substrate.

  In addition, it is preferable to arrange | position so that the axial direction may be substantially parallel to the plane of a sheet-like base material. In other words, in the first heating method and the second heating method, the heating element includes a single wiring (heating wire or conductive wire, hereinafter the same) whose axial direction is substantially parallel to the plane of the sheet-like substrate, and a sheet. And another wiring arranged so as to be separated from one wiring with respect to the thickness direction of the sheet-shaped substrate, substantially parallel to the plane of the sheet-shaped substrate, and intersecting with the one wiring. Preferably there is. In this case, a region where one wiring intersects with another wiring functions as a heating region. When a heating element is configured by combining two wirings, one wiring is arranged on one side of the sheet-like base material in the thickness direction, and the other wiring is on the other side of the thickness direction center. It is preferable to arrange on the side.

  Although the number of the heating area | regions provided in the board | substrate for volatile component volatilization should just be at least one, it is preferable that it is two or more. Further, as will be described later, the number of heating regions is more preferably 2 or more, and even more preferably 4 or more, from the viewpoint that volatile components can be volatilized in various modes. The upper limit of the number of heating regions is not particularly limited, but is practically 5 or less. When the number of heating regions is at least two, the volatile components can be volatilized in two or more over time by controlling the heating / non-heating control of each heating region independently. it can. In addition, when the number of heating regions is two or more, the type of volatile components included in the microcapsules disposed in one heating region and the microcapsules disposed in the other heating regions are included. Different types of volatile components may be used. In this case, two or more types of volatile components comprising a desired combination can be volatilized simultaneously, or different types of volatile components can be volatilized sequentially at different timings. In addition, the number of heating regions can be appropriately selected according to the use application of the volatile component volatilization substrate.

  Moreover, when the number of heating areas is four or more, it is preferable that each heating area | region is arrange | positioned at the planar direction of a sheet-like base material at the matrix form. In this case, two or more heating wires (or conducting wires) are arranged in the row direction, and two or more heating wires (or conducting wires) are arranged so as to intersect the heating wires (or conducting wires) arranged in the row direction. By arrange | positioning in a row direction, a heating area | region can be provided in matrix at the plane direction of a sheet-like base material. When such a configuration is adopted, a specific row direction and column direction heating wire (or conducting wire) is selected from the heating wires (or conducting wires) in the row direction and the column direction, and the current is passed through. Only the heating region can be heated. On the other hand, when a heating chip is used as the heating element, the heating area can be provided in a matrix in the plane direction of the sheet-like substrate by disposing the heating chip on the intersection of the row direction and the column direction. . In this case, for example, the heat generating chip controls ON / OFF of the current in a state where it is connected to the wiring (row wiring) for controlling the current in the row direction and the wiring (column wiring) for controlling the current in the column direction. Thereby, only a specific heating area | region can be made into a heating state / non-heating state.

  A power source (external power source) outside the volatile component volatilization substrate can be used to supply current to the heat generating wire (or conducting wire) constituting the heating element and the heat generating chip. The external power source may be an outlet or a battery. Further, heating / non-heating control of the heating region may be performed manually, but it is preferable to use a control means such as an IC chip. In particular, when the heating region is provided in a matrix with respect to the planar direction of the volatile component volatilization substrate, it is preferable to perform heating / non-heating control of the heating region using the control means. The power source and the control means are usually preferably provided outside the volatile component volatilization substrate, but may be provided on the volatile component volatilization substrate side if necessary.

-Volatile component volatilization method-
In order to volatilize the volatile component to the outside of the volatile component volatilization substrate using the volatile component volatilization substrate of the present embodiment, the volatile component volatilization substrate is provided (one or more heating regions). The heating may be performed in at least one heating region (selected from the above). Thereby, the microcapsule which exists in the heating area | region which heated was destroyed by heating, and a volatile component can be volatilized outside the board | substrate for volatile component volatilization.

  In addition, when the board | substrate for volatile component volatilization has two or more heating area | regions, after performing the first heat processing which heats by selecting a part of all the heating area | regions, heating is carried out once. It is particularly preferable to repeat the heat treatment in which a part or all of the remaining heating region that is not performed is selected and heated one or more times. In this case, it is possible to volatilize the volatile component to the outside of the volatile component volatilization substrate in two or more times over time. For this reason, the volatile component can be volatilized any number of times at a desired timing by selecting the heating region and controlling the heating timing. Further, if necessary, the heated region once heat-treated may be heated again. In this case, the volatile components are volatilized to the outside again by destroying the remaining microcapsules without being thermally destroyed, or volatilizing the remaining volatile components soaking in the vicinity of the heating area. Can do. For this reason, the utilization efficiency of the volatile component included in the microcapsule can be further increased.

-Specific examples of substrates for volatilization of volatile components-
Next, a specific example of the volatile component volatilization substrate of the present embodiment will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view illustrating an example of a volatile component volatilization substrate according to the present embodiment. The volatile component volatilization substrate 10 shown in FIG. 1 includes a sheet-like base material 20A, a hollow portion 22 provided in the vicinity of the central portion in the thickness direction of the sheet-like base material 20A, and a plurality filled in the hollow portion 22. In the region between the microcapsule and the surface on one side of the sheet-like substrate 20A and the hollow portion 22, the heating wire (heating) is arranged so that the axial direction is parallel to the plane of the sheet-like substrate 20A. Part of the element) 30 and the region between the surface of the other side of the sheet-like base material 20A and the hollow portion 22, the axial direction is parallel to the plane of the sheet-like base material 20A, and And a heating wire (constituting a part of the heating element) 32 arranged so as to be orthogonal to the axial direction of the heating wire 30.

  FIG. 2 is a schematic perspective view showing the arrangement of the heating wire 30, the heating wire 32, and the hollow portion 22 when the volatile component volatilization substrate 10 shown in FIG. 1 is viewed from one side. As shown in FIG. 2, the heating lines 30A, 30B, 30C, and 30D are arranged so as to be parallel to the column direction and at equal intervals, and the heating lines 32A, 32B, 32C, and 32D are parallel to the row direction. The heating lines 30A, 30B, 30C, and 30D and the heating lines 32A, 32B, 32C, and 32D are orthogonal to each other. And the hollow part 22 is arrange | positioned in the area | region where heating wire 30A, 30B, 30C, 30D and heating wire 32A, 32B, 32C, 32D cross | intersect. The heating lines 30 and 32 are connected to a power source and a control circuit (not shown), and the ON / OFF state is controlled for each heating line.

  20 A of sheet-like base materials have air permeability, since it is comprised by using the material (porous material or fibrous substance) which has air permeability as a main material. For this reason, when the microcapsules arranged in the hollow portion 22 are destroyed by heating, the volatile components contained in the microcapsules diffuse and move from the hollow portion 22 to the surface of the sheet-like substrate 20A. Can be volatilized. In addition, when the material which comprises a sheet-like base material does not have air permeability, the communicating hole connected from the hollow part 22 to the surface of the sheet-like base material 20A is provided. Further, in the substrate 10 for volatile component volatilization, the portions where the heating lines 30A, 30B, 30C, and 30D intersect the heating lines 32 (areas 40A, 40B, 40C, and 40D indicated by dotted lines in FIG. 1) are heated. Act as a region. For this reason, a heating area | region is each provided so that each hollow part 22A, 22B, 22C, 22D may be included. However, in the embodiment shown in FIG. 1 and FIG. 2, when a current is passed through only the heating wire 30 or only the heating wire 32 in order to destroy the microcapsules arranged in the hollow portion 22 by heating, The heat generation amount of the heating wires 30 and 32 is controlled so that the capsule cannot be broken by heating.

  Next, an example of a procedure for volatilizing volatile components using the volatile component volatilization substrate 10 shown in FIGS. 1 and 2 will be described. First, from the heating lines 30 arranged in the column direction and the heating lines 32 arranged in the row direction, the heating lines through which current flows are respectively selected, and current is simultaneously supplied. For example, a current can be simultaneously supplied to the heating wire 30A and the heating wire 32A. As a result, the microcapsule filled in the hollow portion 22A1 (the upper left hollow portion 22 in FIG. 2) present in the region where the heating wire 30A and the heating wire 32A intersect is heated and destroyed. At this time, the volatile component contained in the microcapsule passes through the sheet-like substrate 20A and is volatilized to the outside. In this case, only the microcapsules existing in one hollow part 22A1 are heated, but the microcapsules existing in two or more hollow parts 22 may be heated at the same time. For example, a current can be simultaneously supplied to the heating wire 30A, the heating wire 32A, and the heating wire 32B. In this case, the microcapsules filled in the hollow portion 22A1 and the hollow portion 22A2 are destroyed by heating.

  In addition, once the hollow part 22 heat-processed, the function to volatilize a volatile component lose | disappears or falls significantly. For this reason, when selecting the heating line which flows an electric current next from the heating line 30 arranged in the column direction and the heating line 32 arranged in the row direction, the hollow part 22 which is not heat-treated can be heated. It is particularly preferable to select the heating line. By repeating the process as described above, the volatile component can be volatilized any number of times at a desired timing as long as the hollow portion 22 that is not heat-treated exists in the volatile component volatilization substrate 10. . Note that the volatilization amount and volatilization rate of the volatile components are the number of the hollow portions 22 to be heat-treated at the same time, the amount of current flowing through the heating wire 30A and the heating wire 32A, the energization time, the thickness of the sheet-like substrate 20A, When the substrate 20A is made of a gas-permeable material such as a porous material or a fibrous material, the porosity of these materials, and when the sheet-like substrate 20A is made of a non-air-permeable material, the communication holes It can be controlled by adjusting the diameter.

  The volatile component volatilization substrate 10 shown in FIGS. 1 and 2 includes heating lines 30 and 32, but instead of these heating lines 30 and 32, conductive wires may be used. In this case, by generating a high frequency in a region where the conducting wire 30 and the conducting wire 32 intersect, the microcapsules filled in the hollow portion 22 existing in the region can be destroyed by heating. In the volatile component volatilization substrate 10 shown in FIGS. 1 and 2, the microcapsules are disposed in the hollow portion 22. However, the microcapsules can be arranged in other ways. For example, when the sheet-like base material 20A is composed of a fibrous material or a porous material and does not have the hollow portion 22, for example, the microcapsules are dispersed and arranged in the entire sheet-like base material 20A. May be. However, when it is desired to increase the utilization efficiency of the microcapsules, it is preferable to disperse and arrange the microcapsules in a part or all of the heating area 40 indicated by a dotted line in FIG. In addition, as a method of dispersing the microcapsules in the sheet-like base material 20A, for example, using a solution in which microcapsules are dispersed, the sheet-like base material 20A is immersed in the solution, or the sheet-like base material is used. The method of dripping a solution to the specific area | region of the surface of 20 A of base materials is mentioned.

  Next, a specific example of a volatile component volatilization substrate in which a communication hole is provided in a sheet-like base material will be described with reference to the drawings. FIG. 3 is a schematic diagram showing another example of the volatile component volatilization substrate of the present embodiment. In FIG. 3, the description of the heating wire (or conducting wire) constituting the heating element is omitted. The volatile component volatilization substrate 12 shown in FIG. 3 includes a sheet-like base material 20B, a hollow portion 22 provided in the center of the thickness direction in the sheet-like base material 20B, and a sheet from the hollow portion 22 to the sheet. A communication hole 24 provided so as to communicate with the surface on one side of the substrate 20B, a microcapsule (not shown) disposed in the hollow portion 22, and a heating wire (or conducting wire) (not shown). And a heating element. Note that the heating element can be provided in a manner similar to that shown in FIGS.

  In the volatile component volatilization substrate 12 shown in FIG. 3, when the microcapsule in the hollow portion 22 is destroyed by heating by the heating element, the volatile component contained in the microcapsule passes through the communication hole 24. Volatile component volatilization substrate 12 can be rapidly volatilized to the outside. In the volatile component volatilization substrate 12 shown in FIG. 3, the communication hole 24 is provided so that the opening is located only on one side surface of the sheet-like base material 20 </ b> B. By adopting such a configuration, when using the substrate for volatile component volatilization 12 attached to some member surface, by providing an opening on the surface opposite to the surface to be attached, The utilization efficiency of microcapsules can be increased. However, the communication holes 24 may be provided so that the openings are located on both surfaces of the sheet-like substrate 20B.

  Next, as a modified example of the volatile component volatilization substrates 10 and 12 shown in FIGS. 1 to 3, the volatile component volatilization having a structure in which a base material supporting member such as a spacer is disposed between a pair of sheet-like base materials. A specific example of the substrate will be described with reference to the drawings. FIG. 4 is a schematic cross-sectional view showing a modification of the volatile component volatilization substrate of the present embodiment shown in FIGS. The volatile component volatilization substrate 14 shown in FIG. 4 includes a first sheet-like base material 20 </ b> C containing a plurality of heating wires 34 (constituting a part of the heating element), and the first sheet-like base material 20 </ b> C. And a second sheet-like base material 20D that is arranged to face each other so as to maintain a certain distance and incorporates a plurality of heating wires (constituting a part of the heating element) 36, and a first sheet-like base material 20C A plurality of microcapsule-containing members 28 disposed between the second sheet-like substrate 20D, the first sheet-like substrate 20C and the second sheet-like substrate 20D, and And a substrate supporting member 26 disposed on the end face side of these sheet-like substrates 20C and 20D. Note that the volatile component volatilization substrate 14 shown in FIG. 4 includes the heating wires 34 and 36, but conductive wires may be used instead of the heating wires 34 and 36.

  Here, the heating wire 34 is a linear heating wire arranged in parallel with the surface of the first sheet-like substrate 20C, and each heating wire 34A, 34B in the first sheet-like substrate 20C. , 34C are arranged at equal intervals. The same applies to the heating wire 36 incorporated in the second sheet base material 20D. The sheet-like base material 20C (20D) can be produced, for example, by disposing a heating wire 34 (36) on one surface of a plastic substrate and then bonding a resin film so as to cover the heating wire 34 (36). .

  Further, the first sheet-like base material 20C and the second sheet-like base material 20D are arranged so that the heating wires 34 and the heating wires 36 incorporated therein are orthogonal to each other. The microcapsule-containing member 28 is disposed at a position where the heating wire 34 and the heating wire 36 intersect. For example, as shown in FIG. 4, the heating line 36 and the heating line 34 </ b> A intersect each other on the surface on the side where the first sheet-like substrate 20 </ b> C of the second sheet-like substrate 20 </ b> D is disposed. The microcapsule-containing member 28A is disposed at a position where the heat generating line 36 and the heat generating line 34B intersect with each other, on the side where the first sheet-shaped substrate 20C of the second sheet-shaped substrate 20D is disposed. The microcapsule-containing member 28B is disposed on the surface, and the first sheet-like substrate 20C of the second sheet-like substrate 20D is disposed at a position where the heating wire 36 and the heating wire 34C intersect. The microcapsule-containing member 28C is disposed on the side surface. In this case, each of the microcapsule-containing members 28A, 28B, 28C and the heating wires 34 disposed on both sides of each of the microcapsule-containing members 28A, 28B, 28C with respect to the thickness direction of the volatile component evaporation substrate 14 and Regions including the heating lines 36 (regions surrounded by dotted lines in the figure) constitute heating regions 42A, 42B, and 42C.

  The microcapsule-containing member 28 is a member that includes a plurality of microcapsules, and may include only microcapsules. In addition, if the volatilization of the volatile component when the microcapsule is destroyed by heating is not inhibited, the microcapsule is dispersed in a solid material such as a resin or a gel or a semi-solid material, or a porous member made of pulp fiber or the like. It may be like.

  For example, as illustrated in FIG. 4, the substrate support member 26 is configured so that a certain gap is maintained between the first sheet-like substrate 20 </ b> C and the second sheet-like substrate 20 </ b> D. Although it can arrange | position to the outer peripheral end surface side of material 20C, 20D, you may arrange | position between the adjacent two heating area | regions 42. FIG. The substrate support member 26 may be columnar or wall-shaped. In addition, when the base material support member 26 has a columnar shape and is arranged at an interval, a space (base) formed between the first sheet-like base material 20C and the second sheet-like base material 20D. Air can travel relatively freely between the space between the materials and the outside of the space between the base materials. For this reason, the first sheet-like base material 20C and the second sheet-like base material 20D may not have air permeability, or may have no communication hole that communicates the front and back surfaces. .

  On the other hand, in the case where the base material support member 26 is wall-shaped, and when the gas cannot substantially pass between the inside and outside of the space between the base materials, for example, the base material support member 26 is a sheet-like base material 20C, In the case of being continuously arranged on the entire circumference of the end face side of 20D, the volatile component volatilized in the space between the base materials passes through the end faces of the sheet-like base materials 20C and 20D and diffuses to the outside. I can't. In this case, it is necessary that at least one of the sheet-like base materials 20C and 20D has air permeability, or that at least one of the sheet-like base materials 20C and 20D is provided with a communication hole. When the base material support member 26 has a wall shape, the wall-shaped base material support member 26 may be disposed so as to be completely separated and blocked in units of individual heating regions 42.

  Next, a specific example of a volatile component volatilization substrate using a heating chip as a heating element will be described. FIG. 5 is a schematic cross-sectional view showing another example of the volatile component volatilization substrate of the present embodiment. Specifically, FIG. 5 shows an example of the arrangement of the heat generating chips and the heat generation control of each heat generating chip when a heat generating chip is used as the heating element. About members other than the heat generating chip and the wiring Is omitted. In the volatile component volatilization substrate 50 shown in FIG. 5, a plurality of heat generating chips 60 are arranged in a square on the surface of a sheet-like base material (not shown). In FIG. 5, the heat generating chips 60 are arranged in three rows and three columns in a square shape. The arrangement is shown. Further, the volatile component volatilization substrate 50 has wiring 62 (62A, 62B, 62C) connected to the heat generating chips 60 arranged in the row direction in order to control the heat generation of the individual heat generating chips 60. Wiring 64 (64A, 64B, 64C) connected to the heat generating chips 60 arranged along the column direction is provided. The wirings 62A, 62B, and 62C and the wirings 64A, 64B, and 64C are connected to a power source (not shown), and ON / OFF of energization is controlled by a control circuit (not shown). Further, microcapsules (not shown in FIG. 5) are arranged in the vicinity of the individual heat generating chips 60.

  In the volatile component volatilization substrate 50, for example, by allowing only the wiring 62 </ b> A and the wiring 64 </ b> B to be energized, only the heat generating chips 60 arranged in the first row to the second column can generate heat. In this way, since the heat generation state of each heat generating chip 60 corresponding to each heating region can be controlled, the microcapsules arranged in the vicinity of the heat generating chip 60 that has generated heat by energization are destroyed by heating and volatilized in units of heating regions. Sexual components can be volatilized.

  FIG. 6 is a schematic cross-sectional view showing another example of the volatile component volatilization substrate of the present embodiment, and is a schematic cross-sectional view showing an example of a cross-sectional structure of the volatile component volatilization substrate using the heat generating chip. The volatile component volatilization substrate 52 shown in FIG. 6 is disposed so as to be bonded to one side of the first sheet-like base material 70 and the first sheet-like base material 70, and from one surface to the other. A second sheet-like base material 72 having a plurality of vertical holes 74 penetrating into the surface, a heat generating chip 60 arranged on the surface of the first sheet-like base material 70 forming the bottom surface of the vertical hole 74, and the heat generating chip 60. And a microcapsule-containing member 80 containing a plurality of microcapsules arranged so as to fill the inside of the vertical hole 74. Here, each vertical hole 74A, 74B, 74C is arrange | positioned so that a square arrangement may be comprised with respect to the planar direction of the board | substrate 52 for volatile component volatilization. In this case, the heat generating chip 60 is provided with wirings 62 and 64 (not shown in FIG. 6) as illustrated in FIG. 5, for example, and heat generation is controlled for each of the heat generating chips 60A, 60B, and 60C. In the volatile component volatilization substrate 52 shown in FIG. 6, the heating chip 60A and the microcapsule-containing member 80A, the heating chip 60B and the microcapsule-containing member 80B, and the heating chip disposed in the vertical holes 74A, 74B, and 74C, respectively. 60C and the microcapsule-containing member 80C constitute the heating regions 90A, 90B, and 90C, respectively.

  The vertical hole 74 is appropriately formed by mechanical processing such as punching or chemical processing such as etching, depending on the material and thickness of the second sheet-like base material 72, the size of the vertical hole 74 in the planar direction, and the like. The In addition, at least the opening of the vertical hole 74 is exposed so that the individual microcapsules contained in the microcapsule-containing member 80 filled in the vertical hole 74 are not scattered and fall off from the surface of the volatile component volatilization substrate 52. The surface of the microcapsule-containing member 80 may be covered with a resin film (or resin layer) having the same melting point as the outer shell of the microcapsules.

  FIG. 7: is a schematic cross section which shows the other example of the volatile component volatilization board | substrate of this embodiment, and is a schematic cross section which shows the other example of the cross-section of the volatile component volatilization board | substrate using a heat generating chip. is there. The volatile component volatilization substrate 54 shown in FIG. 7 includes a sheet-like base material 76 having a plurality of vertical holes 78 opened only on one side, a heat generating chip 60 disposed on the bottom surface of the vertical holes 78, and the heat generating chip 60. And a microcapsule-containing member 80 disposed so as to fill the inside of the vertical hole 78. Except for the point that the substrate 54 for volatilization of volatile components shown in FIG. 7 is configured by using only one sheet-like base material 76 instead of the two sheet-like base materials 70 and 72, its basic structure. The structure is the same as that of the volatile component volatilization substrate 52 shown in FIG.

  In the volatile component volatilization substrates 52 and 54 shown in FIGS. 6 and 7, the heat generating chip 60 is disposed in the vertical holes 74 and 78, and a plurality of microcapsules are densely adjacent to the heat generating chip 60. Are arranged. For this reason, the heat destruction efficiency of the microcapsule by the heat generating chip 60 is high. Further, in the volatile component volatilization substrates 52 and 54 shown in FIGS. 6 and 7, the sheet-like base materials 70, 72, and 76 are not air-permeable sheet-like base materials but non-permeable materials such as plastic substrates and ceramic substrates. It is more preferable to use a tempered sheet-like substrate. In this case, since the volatile component released to the outside of the microcapsule due to the heat breakdown does not penetrate or is absorbed into the sheet-like base material 70, 72, or 76, or is difficult to penetrate or absorb, the utilization efficiency of the microcapsule Becomes higher.

  FIG. 8 is a schematic diagram illustrating an example of a volatile component volatilization unit used in the volatile component volatilization substrate of the present embodiment. The volatile component diffusion unit 100 shown in FIG. 8 seals the cylindrical member 110 and an opening (not shown in FIG. 8) on the end side on one end side of the cylindrical member 110. And a microcapsule-containing member 80 filled in the inner peripheral portion 112 of the cylindrical member 110. One volatile component diffusion unit 100 constitutes one heating region 90. In the volatile component volatilization unit 100 shown in FIG. 8, the heat generating chip 66 is arranged on one end side of the cylindrical member 110, and a plurality of microcapsules are arranged closely adjacent to the heat generating chip 66. Has been. For this reason, the heat destruction efficiency of the microcapsule by the heat generating chip 66 is high. Moreover, in the volatile component volatilization unit 10 shown in FIG. 8, it is more preferable that the cylindrical member 110 is made of a non-permeable material such as plastic or ceramics instead of the permeable material. In this case, since the volatile component released to the outside of the microcapsule due to thermal destruction is not penetrated / absorbed into the cylindrical member 110 side or is difficult to penetrate / absorb, the utilization efficiency of the microcapsule is further increased.

  Note that the vertical and horizontal lengths of the heat generating chips 66 can be the same as or smaller than the diameter of the cylindrical member 110, for example. In this case, the plane of the volatile component volatilization substrate is so aligned that the thickness direction of the volatile component volatilization substrate coincides with the direction of the central axis of the cylindrical member 110 (a line indicated by a one-dot chain line in FIG. 8). When the volatile component diffusion units 100 are arranged side by side in the direction, it is easy to maximize the arrangement density.

  FIG. 9 is a plan view illustrating an example of a volatile component volatilization substrate using the volatile component volatilization unit illustrated in FIG. 8. Specifically, the arrangement state of the volatile component volatilization unit 100 is a cylindrical member. The top view at the time of seeing from the surface on the opposite side to the side where the 110 heat_generation | fever chip | tip 66 is arrange | positioned is shown. In FIG. 9, the members other than the cylindrical member 110 and the microcapsule-containing member 80 constituting the volatile component volatilization unit 100 such as the sheet-like base material and the heat generating chip 66 are omitted. The volatile component volatilization substrate 56 shown in FIG. 9 has a heating chip 66 (not shown in FIG. 9) in contact with the surface of the sheet-like base material (not shown in FIG. 9). As shown, the volatile component volatilization units 100 are squarely arranged.

  Here, the distance D between the central axes of the two volatile component volatilization units 100 arranged adjacent to each other in the row direction or the column direction is the same as the outer diameter of the cylindrical member 110. That is, the arrangement density of the volatile component volatilization unit 100 is the maximum arrangement density that can be taken when the volatile component volatilization unit 100 is squarely arranged. For this reason, the outer peripheral surfaces of the two volatile component volatilization units 100 arranged so as to be adjacent to each other in the row direction or the column direction are substantially in line contact (substantially point contact in the drawing). However, since the shape of the volatile component volatilization unit 100 in the planar direction is circular, the gap between the two volatile component volatilization units 100 adjacent in the diagonal direction is much lower in thermal conductivity than the solid material ( Air layer) 120 is formed. In addition, the contact area between the two volatile component volatilization units 100 arranged adjacent to each other in the row direction or the column direction is very small. Therefore, as compared with the volatile component volatilization substrates 52 and 54 illustrated in FIG. 6 and FIG. 7, the volatile component volatilization substrate 56 illustrated in FIG. 9 has extremely high thermal insulation between the adjacent heating regions 90. . For this reason, in particular, when the heating regions 90 are densely arranged (for example, when the arrangement density is maximized in a square arrangement or a staggered arrangement), heating is performed in one heating area 90 In addition, the heating region 90 in the vicinity of the heating region 90 is also preheated, and the microcapsules arranged in the heating region 90 in the vicinity can be prevented from being destroyed by heating. For this reason, the utilization efficiency of a microcapsule can be improved. In addition to this, when the microcapsules are destroyed by heating in the individual heating regions 90, secondary and noisy heating destruction of the microcapsules in the neighboring heating regions 90 is suppressed. The volatility controllability is also improved.

-Method for producing substrate for volatilization of volatile components-
The substrate for volatile component volatilization can be produced by appropriately using a known method for producing a sheet-like member according to the configuration of the substrate for volatile component volatilization. The substrate for volatile component volatilization can be produced, for example, by the following procedure. However, the manufacturing method of the board | substrate for volatile component volatilization of this embodiment is not limited to this.

(1) Preparation of microcapsules Microcapsules containing a desired volatile component are prepared by the method described above.

(2) Preparation of sheet containing heating wire (or conducting wire) A plurality of heating wires (or conducting wires) are arranged in parallel and at equal intervals on one side of the sheet-like material. Next, another sheet-like material is bonded together so as to cover the surface on which the heating wire (or conducting wire) of the sheet-like material is arranged, thereby preparing a sheet containing the heating wire (or conducting wire).

(3) Arrangement of microcapsules Microcapsules are arranged at equal intervals along a line provided with heating wires (or conducting wires) on one side of a sheet containing heating wires (or conducting wires). In arranging the microcapsules, for example, a method of injecting microcapsules (or a solution or gel in which the microcapsules are dispersed) into a predetermined position on the sheet using a dispenser can be used.

(4) Laminating sheet containing heating wire (or conducting wire) Subsequently, another sheet containing heating wire (or conducting wire) is placed on the surface of the sheet containing heating wire (or conducting wire) on which microcapsules are arranged. to paste together. In this case, when the two sheets are bonded, the heating wire (or conducting wire) of one sheet and the heating wire (or conducting wire) of the other sheet are orthogonal to each other, and the orthogonal region and the microcapsule are arranged. This is performed so that the region matches. Thereby, the board | substrate for volatile component volatilization can be obtained. In addition, if the recessed part is previously provided in the position where the microcapsule of a sheet | seat containing a heating wire (or conducting wire) is arrange | positioned, the said recessed part will comprise the hollow part of the board | substrate for volatile component volatilization. In this case, a volatile component volatilization substrate having the configuration shown in FIGS. 1 and 2 can be obtained. In addition, in order to adjust the thickness of the board | substrate for volatile component volatilization, or to smooth an unevenness | corrugation, you may press-process using a roll etc. after bonding.

-Use mode of substrate for volatilization of volatile components-
The substrate for volatile component volatilization of this embodiment can be used for any purpose as long as the desired volatile component is volatilized in a desired space at a desired timing. For example, a substrate for volatile component volatilization may be disposed on the surface of the casing of the electronic device, and the volatile component may be volatilized in conjunction with a predetermined operation or operation of the electronic device. For example, in the case of a foldable mobile phone, the fragrance component can be volatilized in conjunction with the opening of the mobile phone. Thereby, the user of a mobile phone can enjoy a comfortable scent every time the mobile phone is used.

  Alternatively, the volatile component volatilization substrate may be attached to a wall, floor, ceiling, or the like, and the aromatic component may be volatilized in conjunction with the infrared sensor. In this case, when a human is detected by the infrared sensor, the fragrance component can be volatilized. Thereby, the person who entered the room where the board | substrate for volatile component volatilization is arrange | positioned can enjoy a comfortable fragrance. In addition, when there is no one in the room, since the fragrance component is not volatilized, useless consumption of the fragrance component can be prevented. In addition, the conventional fragrance products for indoor fragrances are mainly bottle-type products with a cheap design that takes up space, but the substrate for volatilization of volatile components of this embodiment is inconspicuous because it saves space. It is easy to arrange in the place. Moreover, even when arrange | positioning in a conspicuous place, the function as a wallpaper can be combined with the board | substrate for volatile component volatilization. For this reason, high design property can also be provided to the board | substrate for volatile component volatilization. In addition, a substrate for volatile component volatilization is arranged between the floor and the carpet, or a substrate for volatile component volatilization is arranged on the carpet floor, and the flea is periodically flawed in conjunction with the time (by timer control). Or the insecticidal component for mites may be volatilized. In this case, the flea and tick insecticidal treatments generated on the carpet are automatically performed, so that a hygienic environment can always be maintained.

-Other embodiments of substrate for volatilization of volatile components-
Although the volatile component volatilization substrate of this embodiment using microcapsules has been described above, as the volatile component volatilization substrate, for example, for volatile component volatilization without using the microcapsule illustrated in FIG. A substrate can also be used. FIG. 10 is a schematic cross-sectional view showing an example of a volatile component volatilization substrate that does not use a microcapsule. In FIG. 10, the volatile component volatilization substrate 200 is basically for volatile component volatilization shown in FIG. Although it has the same structure as the substrate 54, it is characterized in that the structure of each heating region 92 is different. Here, the heating region 92 of the volatile component volatilization substrate 200 includes the heat generating chip 60 disposed on the bottom surface of the vertical hole 78, the volatile component 82 filled in the vertical hole 78 to the vicinity of the opening of the vertical hole 78, A sealing film 84 covering the opening of the vertical hole 78 is formed to seal the volatile component 82 in the vertical hole 78. Here, as the volatile component 82 and the sealing film 84, for example, the volatile component and the outer shell material constituting the core material of the microcapsule included in the microcapsule-containing member 80 illustrated in FIG. Can do. Moreover, although the arrangement | positioning aspect of the heating area | region 92 in the plane direction of the board | substrate 200 for volatile component volatilization is not specifically limited, For example, it can be set as a square arrangement | sequence, a zigzag arrangement | sequence, and a turtle-shaped arrangement | sequence.

  Hereinafter, the substrate for volatilization of volatile components according to this embodiment will be described with reference to examples.

<< Example 1 >>
By the following procedure, a fragrance component volatilization substrate 14 having a configuration substantially shown in FIG. 4 was prepared.

(Microcapsules and microcapsule-containing solutions)
The outline of the used microcapsule is as follows. Moreover, as the microcapsule-containing solution used when the substrate for volatile component volatilization was produced, pure water was used as a solvent, and the microcapsules were dispersed to a concentration of 70% by mass. It was.
・ Shape: Spherical shape ・ Average diameter: 30 μm
-Outer shell: 0.1 μm thick urethane resin (melting point: 140 ° C.)
・ Core material (volatile component): Lavender essential oil

(Preparation of sheet-like substrate with heating wire)
On the surface of the universal substrate (length 72 mm, width 48 mm, thickness 1.6 mm) provided on the groove, the heating wire 34 (nichrome wire, wire diameter 0.35 mm, Four pieces having a length of 35.5 mm) were arranged at intervals of 2.54 mm. Then, the 1st sheet-like base material 20C was obtained by sticking a polyimide sheet (thickness: 0025 mm) with an adhesive so that a heating wire may be covered. Moreover, the 2nd sheet-like base material 20D was produced like the 1st sheet-like base material 20C except having arrange | positioned the heating wire 36 in the groove | channel provided along the short side direction of the universal substrate.

(Preparation of substrate for volatilization of volatile components)
Next, 0.06 cc of the microcapsule-containing solution was dropped on the surface side of the second sheet-like substrate 20D to which the polyimide sheet was attached, and just above the heating wire 36, and the solvent component was naturally volatilized. . Subsequently, the first sheet-like base material 20C and the second sheet-like base material 20D are overlapped so that the surfaces to which the polyimide sheets are attached face each other so as to maintain an interval of 2.4 mm. Combined. Note that a plurality of columnar spacers (base material support member 26) having a height of 2.4 mm are disposed between the first sheet-like base material 20C and the second sheet-like base material 20D during superposition. At the same time, the heating wire 34 on the first sheet-like substrate 20C side and the heating wire 36 on the second sheet-like substrate 20D side were orthogonal to each other. The substrate 14 for volatile component volatilization obtained in this way has four heating lines 34 and 36 (nichrome lines) in the vertical and horizontal directions (row direction and column direction), and the point where the nichrome lines intersect (heating region 44). Of 4) was 4.times.4. The microcapsule-containing solution was dropped so as to be located in one heating region 44 (the heating region 44 at address 2B described later) among the 16 heating regions 44.

(Aroma evaluation)
Next, direct current is applied so that each nichrome wire arranged in the row direction and each nichrome wire arranged in the column direction of the substrate 14 for volatile component volatilization can be controlled ON / OFF in units of each nichrome wire. It was connected to a power source (voltage 5.0 V, current 750 mA). In the following description, the Nichrome lines in the row direction are numbered A to D in the order of arrangement, the nichrome lines in the column direction are numbered 1-4 in the order of arrangement, and indicate the intersection in the row direction and the column direction. For example, it is expressed as address 2B.

  In the fragrance evaluation, the test is performed by changing the address to be heated in the state where the microcapsule containing member 28 is arranged only at the address 2B out of the total 16 addresses, and each time one test is completed, the volatile property After disassembling the component volatilization substrate 14 and replacing the polyimide sheet of the second sheet-like base material 20D, the microcapsule-containing solution is dropped again at address 2B, and the volatile component volatilization substrate 14 is again attached. Assembled. When assembling the substrate 14 for volatile component volatilization, the microcapsule-containing solution is usually dropped at all addresses. In this example, the influence of residual scent in the previous test is minimized in the fragrance evaluation. For convenience of shortening the evaluation time, the microcapsule-containing solution was dropped only at one address.

  Moreover, the temperature sensor was arrange | positioned in the vicinity of the 2B address, and the maximum temperature of the 2B address vicinity was confirmed for every test. Since the temperature sensor is located farther from the heating wire than the microcapsule, it does not accurately indicate the temperature in the vicinity of the microcapsule (that is, whether the temperature has reached the melting point of the outer shell of the microcapsule). No.

  In the fragrance evaluation, sensory evaluation was performed based on the presence or absence of the fragrance immediately after the current was continuously passed through the heating wire for 3 minutes and the intensity before the current was passed. The person who performs sensory evaluation here evaluated in the state located in the place of 1 m from the board | substrate 14 for volatile component volatilization. In addition, in order to reduce the influence of the remaining scent, the next test was conducted after the room was sufficiently ventilated when the test was completed and the room became almost odorless. The results are shown in Table 1.

  As shown in Table 1, a slight scent was confirmed when heating address 3C, which is one address away from address 2B diagonally, but a strong scent was confirmed when heating address 2B. In addition, the scent was not confirmed when the address 4D, which is an address two diagonally away from the address 2B, was heated. In addition, when the 3C address was heated, the weak fragrance was confirmed because the heat generated at the 3C address was transmitted to the 2B address and the microcapsules located at the 2B address were partially destroyed by heating. . However, since there is a clear difference in the scent strength between the 2B address and the 3C address, it is considered that the scent can be evaporated only when the 2B address is heated by shortening the heating time. From the above, it was found that a desired scent can be volatilized by heating an arbitrary heating region.

<< Example 2 >>
(Preparation of substrate for volatilization of volatile components)
In the substrate 14 for volatile component volatilization used in Example 1, instead of the heating wires 34 and 36 (nichrome wires) as heating elements, at the position where the heating wires 36 on the second sheet-like substrate 20D side are arranged, A substrate for volatile component volatilization used for aroma evaluation in Example 2 was produced in the same manner except that the heating chip was arranged and the microcapsules were changed to those shown below. The heat generating chip (ROHM chip resistor model number: MCR03) is arranged at a position where the heat generating wires 34 and 36 intersect (that is, each of 16 addresses), and heating is turned on / off for each heat generating chip. Connected to a power supply for control. The circuit including each heat generating chip was configured as shown in FIG. 11. In the test, a current of 3.3 V and 150 mA was passed through the heat generating chip R1 to which the transistor TR1 was connected.

(Micro capsule)
The outline of the microcapsules used in Example 2 is as follows.
・ Shape: Spherical shape ・ Average diameter: 100 μm
-Outer shell: 0.1 μm thick urethane resin (melting point: 140 ° C.)
・ Core material (volatile component): Lavender essential oil

(Aroma evaluation)
The fragrance evaluation was performed in the same procedure as in Example 1. The results are shown in Table 2 below.

  In Example 1, when the address 3C, which is one address in the diagonal direction from the address 2B, was heated, a slight scent was confirmed, but in Example 2, when the address 2B was heated, a strong scent was observed. The scent was not confirmed when the 3C address and the 4D address, which were confirmed and addressed one and two in the diagonal direction from the address 2B, were heated. From the above, it was found that a desired scent can be volatilized by heating an arbitrary heating region. In addition, compared with Example 1, although the maximum temperature of the address 2B when the address 2B is heated is substantially the same, a weak fragrance is also present at the address 3C, which is one diagonally away from the address 2B. It was not confirmed. In Example 1 and Example 2, except that the types of heating elements are different, considering that the structure of the volatile component volatilization substrate is substantially the same, it is better to use a heating chip rather than a heating wire. It is considered that the volatility controllability of the volatile component becomes higher.

<< Example 3 >>
(Production of fragrance-containing microcapsules)
An emulsion containing a blend of self-emulsifying wax, non-self-emulsifying wax, and perfume mixture dispersed in a polyvinyl alcohol solution was prepared by the following steps. 20 g self-emulsifying Duroxon J-324 wax (melting point 105-115 ° C., Durachem), 20 g non-self-emulsifying Unilin 700 wax (melting point 110 ° C., Petrolite), 0.50 g potassium hydroxide, and 20 g deionized Water was placed in a 500 ml reactor equipped with a stirrer, temperature controller, and cooler.

  Subsequently, the reactor was heated and held at 100 ° C. until the wax melted to produce a smooth homogeneous solution. 16 g of boiling deionized water was slowly added to the molten water mixture and kept at 100 ° C. until a clear colorless solution was observed. After this, 44 g of fragrance (Musk C-14, manufactured by Takasago Fragrance Co., Ltd .; musk fragrance) was gradually added to the wax mixture at 100 ° C. to produce a honey-like viscous solution. Next, 80 g of boiling deionized water was added to the reactor to produce a milky wax / perfume mixture emulsion. To this emulsion, 136 g of polyvinyl alcohol solution (weight average molecular weight 2,000, 17.6% solids) is added, and the emulsion is cooled to 40-50 ° C. in a water bath to produce a stable emulsion. did. The resulting emulsion was spray dried at 120 ° C. inlet air temperature using a Yamato GA31 mini spray dryer to produce microcapsules containing 40% fragrance.

(Preparation of sheet with heating wire)
Commercially available PPC paper (manufactured by Fuji Xerox Co., Ltd., ^{C 2} paper) was cut vertically and horizontally 25 mm × 25 mm on, after placing in 2mm intervals in a straight line the nichrome wire having a diameter of 0.2 mm, another piece of PPC thereon The paper was pasted together. As a result, two paper substrates containing nichrome wire were obtained.

(Preparation of substrate for aroma component volatilization)
Subsequently, 0.2 cc of an alcohol solution (microcapsule solution) in which microcapsules having a concentration of 10% were dispersed every 2 mm along the nichrome wire was dropped on one side of the sheet containing the nichrome wire. Thereafter, another substrate was bonded to the surface on which the microcapsule solution was dropped so that the nichrome wires were orthogonal to each other to obtain a substrate for aroma component volatilization (hereinafter abbreviated as “fragrance substrate”). In addition, at the time of bonding, it adjusted so that the point which the nichrome wire of the paper base material of front and back cross | intersects, and the point which dripped the microcapsule solution may correspond. The aromatic substrate thus obtained had 12 nichrome wires in the vertical and horizontal directions (row direction and column direction), and the points (number of heating regions) where the nichrome wires intersected each other were 12 × 12.

(Aroma evaluation)
Next, a direct current power source (voltage 1...) Is controlled so that each nichrome wire arranged in the row direction of the aromatic substrate and each nichrome wire arranged in the column direction can be controlled on and off in units of each nichrome wire. A 5V dry battery and a voltage applied to each nichrome wire were connected to 1.5V). In the following description, when referring to individual nichrome wires in the row direction and the column direction, numbers 1 to 12 are assigned for distinction.

-Environmental test-
Next, with the continuity to all nichrome wires turned off, the fragrance substrate was left in a high-temperature and high-humidity environment (temperature 50 degrees, humidity 90%), and the presence or absence of fragrance at this time was confirmed. I could not confirm any fragrance. From this, it was confirmed that the microcapsules in the fragrance substrate were not thermally destroyed under a general high temperature environment.

-Aroma test-
Next, when a current was passed through the first and second nichrome wires in the row direction and the first and second nichrome wires in the column direction for 3 seconds, the scent of musk was confirmed. When the scent of musk ceased, current was passed through the third and fourth nichrome wires in the row direction and the first and second nichrome wires in the column direction for 3 seconds. The scent of musk was as strong as the fragrance test. From the above, it was confirmed that the microcapsules existing in the vicinity of the point where the nichrome wires intersect vertically and horizontally were thermally destroyed, and the aromatic component in the microcapsules was volatilized.

-Long-term neglect test-
Subsequently, the fragrance sheet after the fragrance test was left in a room temperature and humidity environment (temperature 23 ° C., humidity 60%) for about one month. After that, when a current was passed through the fifth and sixth nichrome wires in the row direction and the first and second nichrome wires in the column direction for 3 seconds, the same level of musk as in the first and second fragrance tests. The scent of was confirmed. From the above, it was confirmed that the fragrance function of the fragrance substrate does not deteriorate even when the fragrance sheet is not used for a long time.

10, 12, 14 Substrate for volatilization of volatile components 20A, 20B, 20C, 20D Sheet-like base material 22, 22A, 22B, 22C, 22D Hollow portion 24 Communication hole 26 Base material support member 28, 28A, 28B, 28C Microcapsule Containing member 30, 30A, 30B, 30C, 30D Heating wire or conducting wire (part of heating element)
32, 32A, 32B, 32C, 32D Heating wire or conducting wire (part of heating element)
34, 34A, 34B, 34C, 34D Heating wire or conducting wire (part of heating element)
36 Heating wire or conducting wire (part of heating element)
40, 40A, 40B, 40C, 40D Heating area 42, 42A, 42B, 42C Heating area 50, 52, 54, 56 Substrate 60, 60A, 60B, 60C for volatile component volatilization Heating chip (heating element)
62, 62A, 62B, 62C Wiring 64, 64A, 64B, 64C Wiring 66 Heat generation chip (heating element)
70 1st sheet-like base material 72 2nd sheet-like base material 74 Vertical hole 76 Sheet-like base material 78 Vertical hole 80, 80A, 80B, 80C Microcapsule containing member 82 Volatile component 84 Sealing film 90, 90A, 90B, 90C Heating area 92 Heating area 100 Volatile component volatilization unit 110 Cylindrical member 112 Inner peripheral part 120 Crevice (air layer)
200 Substrate for volatilization of volatile components

Claims (14)

A sheet-like substrate;
A heating element for selectively heating a partial region of the sheet-like substrate;
A microcapsule that is disposed in a heating region that is selectively heated by at least the heating element, and includes a core material containing a volatile component and an outer shell material that covers the core material and is destroyed by heating;
A substrate for volatilization of volatile components, characterized by comprising:   The volatile component volatilization substrate according to claim 1, wherein the volatile component is at least one selected from an aromatic component, an insecticidal component, and an antibacterial component.   The volatile component volatilization substrate according to claim 1, wherein the sheet-like base material has a hollow portion, and the microcapsules are disposed in the hollow portion.   The material constituting the sheet-like base material is at least one selected from a resin, a fibrous substance, and ceramics, for volatile component volatilization according to any one of claims 1 to 3. substrate.   2. The sheet-like base material is provided with a communication hole that communicates from a region where the microcapsules in the sheet-like base material are arranged to the surface of the sheet-like base material. The board | substrate for volatile component volatilization of any one of -4.   It has flexibility, The board | substrate for volatile component volatilization of any one of Claims 1-5 characterized by the above-mentioned. The heating element is spaced apart from the one wiring in which the axial direction is substantially parallel to the plane of the sheet-like substrate and the thickness direction of the sheet-like substrate, and the plane of the sheet-like substrate And other wiring arranged to be substantially parallel to and intersecting the one wiring, and
The volatile component volatilization substrate according to any one of claims 1 to 6, wherein a region where the one wiring and the other wiring intersect functions as the heating region.   The said heating element is comprised from a heat-generating chip, The volatile component volatilization board | substrate of any one of Claims 1-6 characterized by the above-mentioned.   Volatile component volatilization unit having a cylindrical member, the microcapsule disposed inside the cylindrical member, and the heat generating chip disposed so as to seal an opening on one side of the cylindrical member. The substrate for volatilization of volatile components according to claim 8, comprising:   The volatile component volatilization substrate according to any one of claims 1 to 9, wherein the substrate has two or more heating regions.   The type of volatile component contained in the microcapsule arranged in one heating region is different from the type of volatile component contained in the microcapsule arranged in the other heating region The board | substrate for volatile component volatilization of Claim 10.   The volatile component volatilization substrate according to claim 10 or 11, wherein four or more heating regions are provided, and each heating region is arranged in a matrix in the planar direction of the sheet-like base material. . A sheet-like substrate, a heating element that selectively heats a partial region of the sheet-like substrate, and a core that is disposed in a heating region that is selectively heated by at least the heating element and contains a volatile component Using a substrate for volatilization of a volatile component, and a microcapsule containing an outer shell material that covers the core material and is destroyed by heating,
A volatile component volatilization method comprising volatilizing the volatile component to the outside of the volatile component volatilization substrate by heating at least one heating region. The substrate for volatile component volatilization has two or more heating regions,
After performing the first heat treatment for selecting and heating a part of all the heating regions,
The method for volatilizing a volatile component according to claim 13, wherein a heating process in which heating is performed by selecting a part or all of the remaining heating region that has not been heated once is repeated one or more times. .

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