TW201125166A - Light emitting device package and fabricating method thereof - Google Patents

Abstract

A light emitting diode (LED) package and fabricating method thereof are disclosed. The LED package includes a first conductive lead and an insulating substrate extending from the lateral side of the first conductive lead, a second conductive lead disposed on the insulating substrate extending on the top and bottom surfaces of the insulating substrate, wherein the first conductive lead and the second conductive lead are electrically isolated. An LED is disposed on the first conductive lead. A first electrode of the LED couples to the first conductive lead and a second electrode of the LED couples to the second conductive lead. The LED package further includes an encapsulation layer packaging the LED.

Description

201125166 VI. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode cracking and a manufacturing method thereof, and more particularly to a light-emitting diode in which a light-emitting diode is disposed in a groove of a substrate Body package and its manufacturing method τ [Prior Art] Light emitting diode (LED) components have gradually replaced traditional fluorescent lamps = or tungsten due to their advantages such as wide life, small size and low power consumption. Silk bulbs are widely used in lighting, backlights for liquid crystal displays, various electronic products and traffic signs. In terms of package type, the current package structure of the light-emitting diode is mainly based on the surface mount device (SMD) light-emitting diode package, and *AN, and the mouth*. However, since the substrate used in the conventional surface-adhesive LED package structure is a planar substrate, and the light-emitting diode system is disposed on the flat surface of the planar substrate, the thickness of the conventional light-emitting diode package is thick. Does not match the requirements of the month 1 for light, thin, short, and small electronic components. SUMMARY OF THE INVENTION 201125166 The object of the present invention is to provide a light emitting diode package and a method of fabricating the same to reduce the overall thickness of the light emitting diode package. The present invention provides a method for fabricating a light emitting diode package, including the following steps. A substrate is provided, the substrate comprising an insulating substrate and an upper conductive layer and a lower conductive layer disposed on the insulating substrate, the substrate including a plurality of tree regions. Patterning the upper conductive layer and the lower conductive layer in each of the component regions to form a first-wire region and a second wire region, and splitting into the upper two layers of each of the first-wire regions Where the openings partially expose the insulating substrate. The patterned upper conductive layer and the patterned lower conductive layer are formed by dividing the insulating substrate exposed in each of the first-wire regions to form a recessed wire region. The upper conductive layer of each of the second # line regions is electrically connected to pattern the lower conductive layer to form a second wire. The plurality of::: each of the recesses, and each of the light-emitting diodes - the first electrode two: the wire is electrically connected, and the second electrode and the second electrode of each of the light-emitting diodes The alkali-guide layer on the substrate of the guide plate encloses the light-emitting diode. A plurality of light emitting diode packages are formed by cutting the earth plate. In the other embodiment, wherein a portion of the line region is the lower conductive layer. The groove is exposed to each material - according to the above, in another embodiment, wherein each of the concave axes - the conductive drunk 4 is a t-lead - the step includes electrically connecting the conductive patterns of the upper guide The patterned upper conductive layer and the patterned lower conductive layer of the first wire region of the 201125166. According to the above, in another embodiment, wherein the upper conductive pattern is between the diode and the lower conductive layer. According to the above, in another embodiment, the upper conductive pattern is formed in a conformal manner with the recess. According to the above, in another embodiment, the step of forming the second wire includes removing the insulating substrate exposed in each of the 5 second wire regions to form a hole and exposing each of the second wire regions. And the lower conductive layer electrically connects the patterned upper conductive layer and the patterned lower conductive layer of each of the second lead regions. According to the above, in another embodiment, wherein the holes are formed by laser drilling. According to the above, in another embodiment, each of the holes is located in a central portion of one of the edges of each of the first lead regions. According to the above, in another embodiment, the step of patterning each of the element regions to the upper conductive layer and the lower conductive layer is performed by etching. 201125166 In accordance with the above, in another embodiment, wherein the grooves are formed using a laser drilling method. According to the above, in another embodiment, an identification mark is formed on the surface of the upper conductive layer located in each of the second lead regions. According to the above, in another embodiment, the surface of the conductive layer located on each of the second wire regions is formed by an identification mark S wherein the identification mark is located above the hole. According to the above, in another embodiment, a further solder resist insulating layer is formed in each of the element regions, partially covering a lower surface of the first wire. According to the above, in another embodiment, the following steps are further included. The lower conductive layer, the insulating substrate and the upper conductive layer are removed from the four corner regions of each of the element regions, so that a hole is formed in each of the four corner regions of the element region. An upper solder resist layer is formed on the upper conductive layer of each of the four corner regions of the component region, and each of the upper fresh insulating layers covers the corresponding hole. Forming a conductive pattern on a sidewall of each of the holes, respectively electrically connecting the upper conductive layer and the lower conductive layer adjacent to each of the holes to form a first wire in each of the first wire regions, and Forming a second wire in each of the second wire regions. According to the above, in another embodiment, each of the conductive patterns covers the sidewalls of each of the recesses 7 201125166 and the lower conductive layer exposed by the recesses. According to the above, in another embodiment, the conductive pattern of the 箄莫茨茨寺 and the grooves are formed in a conformal manner. According to the above, in another embodiment, wherein the 钻孔, 视 is mechanically drilled. According to the above 'in another embodiment', wherein the lightning-guided Tudec-guide pattern is formed by electroplating. According to the above, in another embodiment, the first electrode and the second electrode are located on the same side of the LED, and the first electrode and the first electrode are respectively recorded by the line and the first The wire and the second wire are electrically connected. According to the above-mentioned another embodiment, wherein the first electrode and the second electrode are located on different sides of the light emitting diode, the first pole is directly electrically connected to the first wire in the groove. The second electrode is electrically connected to the second wire 9 by a bonding wire. The present invention provides a light emitting diode package comprising - a first wire, an insulating layer extending laterally from one of the first wires. A second wire is disposed on the insulating layer and extends on the upper surface and the lower surface of the insulating layer, wherein the second wire is electrically separated from the first wire. A light-emitting diode is disposed on the first wire, wherein a first electrode of the 201125166 photodiode is electrically connected to the first wire, and a second electrode thereof is electrically connected to the second wire. A light-emitting diode is encapsulated in a glue layer. According to the above, in another embodiment, one of the first wires is laterally sandwiched by the insulating layer. According to the above-mentioned "other embodiment", the first wire ± is formed with a recess, and the light emitting diode system is disposed in the recess. According to the above, in another embodiment, wherein the first conductive wire comprises an upper conductive pattern: a lower conductive layer, the upper conductive pattern forms the recess and is electrically connected to the lower conductive layer in the embodiment. Including at least one identification mark, set in

According to the above, in another embodiment, the lower surface of the insulating layer and the covering portion further comprise a solder resist insulating layer disposed on a lower surface of the one of the wires. In the embodiment of the invention, wherein the first electrode and the second electrode bit line and the first electrode and the first electrode are respectively electrically connected by the bonding wire and the first wire and the second wire connection. According to the above, in another embodiment, wherein the first electrode and the second electrode are located on different sides of the light emitting diode, the first electrode is directly electrically connected to the wire in the groove. The second electrode is electrically connected to the second wire by a bonding wire. According to the above, in another embodiment, wherein the groove is a closed groove. Embodiments of the present invention provide a light emitting diode package. The light emitting diode package comprises an insulating substrate, a first wire, a second wire, a plurality of upper fresh insulating layers, a light emitting diode and a sealing layer. The insulating substrate has a recess and a plurality of aperture cutters are located in the secret area of the insulating substrate. The first wire portion covers one of the upper surface and the lower surface of the insulating substrate, and the fourth wire portion covering the hole portion covers the upper surface and the lower surface of the insulating soil material and the side wall of the covering portion hole, and the first wire and the first wire The second wire electrically separated 4 the solder resist insulating layer partially covers the upper surface of the first wire and the corresponding portion, and covers the upper surface of the second wire and corresponds to a part of the hole. The light-emitting diode is disposed in the recess, the first electrode of the light-emitting diode is electrically connected to the first conductive line, and the second electrode of the light-returning diode is electrically connected to the second conductive line. The sealing layer encapsulates the light emitting diode. According to the above, in another embodiment, wherein the H-line covers the groove, the portion of the first wire is partially covered by the under-welding insulating layer according to the above-mentioned other embodiment. According to the above, in another embodiment, wherein the first electrode is on the same side of the light emitting diode, the first electrode and the second wire are electrically connected to the first wire and the second wire. Knife not to borrow

According to the above, in another embodiment, the first electrode and the different m electrode system of the light emitting diode are directly electrically connected to the wire in the groove, and the second electrode is by The bonding wire is electrically connected to the second wire. One embodiment of the present invention provides a method of fabricating a light emitting diode package, including the following steps. A substrate is provided, the substrate comprising an insulating substrate and an upper conductive layer and a lower conductive layer disposed on the edge substrate, and the substrate includes a plurality of carrier regions. Patterning the upper conductive layer and the lower conductive layer to form electrically separated-first-wire regions, a second wire region and a third wire region in each of the component regions, and each of the first wires An opening is formed in the upper conductive layer of the region, wherein the openings partially expose the insulating substrate. The insulating substrate exposed by the openings of the upper conductive layer is removed to form a recess in the insulating substrate in each of the first conductive regions. The lower conductive layer and the insulating substrate are removed from the four corner regions of each of the element regions, so that a hole is formed in each of the four corner regions of each of the element regions, wherein each of the holes partially exposes the upper conductive layer. An upper solder resist insulating layer is formed on each of the upper conductive layers on the periphery of each of the element regions. Forming a conductive pattern on a sidewall of each of the holes, electrically connecting the upper conductive layer corresponding to each of the holes and the lower conductive layer adjacent to each of the holes, to form a first conductive region The first wire forms an 11th 201125166 second wire in each of the second wire regions, and forms a third wire in each of the third wire regions. A first light emitting diode and a second light emitting element are disposed in each of the recesses, and a first electrode of each of the first light emitting diodes is electrically connected to the first conductive line, so that each of the first One of the second light-emitting diodes is electrically connected to the second wire, such that the first electrode of each of the second light-emitting diodes is electrically connected to the first wire, and each of the second light-emitting diodes is electrically connected One of the second electrodes is electrically connected to the second wire. A layer of glue is formed on the substrate to seal the light-emitting diodes. The substrate is diced between adjacent ones of the element regions to form a plurality of light emitting diode packages. According to the above, in another embodiment, each of the grooves of the towel exposes a portion of the lower conductive layer in each of the first line regions. The café covers each of the recesses in accordance with the above, in another embodiment, formed. According to the above, in another embodiment, the steps of the electrical layer are achieved by etching. Wherein the conductive patterns pattern the upper conductive in a conformal manner

The middle layer and the lower guide are formed by laser drilling in accordance with the above-described embodiments. Wherein the grooves of the insulating substrate are in accordance with the above-mentioned, in another embodiment, wherein the holes are formed using a laser. Forming according to the above, in another embodiment, the guiding method is formed by using an electric ore method according to the above, and further forming a lower welding insulation on the lower conductive layer in the line region. Floor. According to the above, in another embodiment, one of the electrodes is the same as the second electrode of the second electrode, the second light-emitting diode, and the first-pole The first electrode of the body is electrically connected to the second electric wire and the second wire. (4) The domain and the first guide are based on the above-mentioned, and the other side of the first μ-electrode of the first electrode and the second electrode of the two electrodes are recorded, and each of the first _ = The first electrode and the second electrode are electrically connected by green and the third wire, respectively. According to the above, in another embodiment, the first electrode of the second electrode located in the first light-emitting diode is directly connected to the first wire in the groove. A 13201125166 is connected, the second electrode is electrically connected to the second wire by a bonding wire. According to the above, in another embodiment, the first electrode of the second light emitting diode and the second electrode are located on different sides of the second light emitting diode, and the first of the light emitting diodes The electrode is directly electrically connected to the first wire in the recess, and the second electrode is electrically connected to the third wire by a bonding wire. According to the above, in another embodiment, each of the upper solder resist layers is wound around each of the element regions. Separate ring

The present invention provides a material diode package. The LED package includes an insulating substrate, a first wire, a second wire, a third wire, a plurality of upper solder resist layers, a first light emitting diode and a second light emitting diode. And a layer of glue. The insulating button has a groove and a plurality of holes are mixed in the corner regions of the insulating substrate. The first wire portion covers one of the upper surface and the lower surface of the insulating substrate and the cover portion is thin. The upper surface and the lower surface of the portion of the surface of the surface of the surface of the surface of the surface of the surface of the surface of the surface of the surface of the surface of the substrate. The third wire portion covers the upper surface of the insulating substrate and the lower surface and the side wall of the portion of the hole, wherein the first wire, the second wire and the third wire are electrically separated. The upper solder resist insulating layers are respectively located on the upper conductive layer around the respective element regions. The first light emitting diode and the first light emitting diode are disposed in the recess, wherein the first electrode of the first light emitting diode is electrically connected to the first conductive wire, and the first light emitting diode is a second electrode is electrically connected to the second wire, the first electrode of the second LED and the first 14 201125166 sidewall are according to the above, in another embodiment, wherein the first wire further covers the According to the above, in another embodiment, the lower surface of the first wire is covered. 1 solder resist layer, partially covered according to the above, in another shot, wherein each of the electrodes and the first: the second electrode of the second working electrode and the second electrode = the first line and the second wire Miscellaneous connections. In the above-mentioned, the first electrode and the second electrode of the two-diode body are located on the same side of the second light-emitting diode. And the first electrode of the first diode is connected to the second electrode and the third wire is electrically connected. In the other embodiment, the material is the first electrode of the light-emitting diode. The second electrode is located on a different side of the first light-emitting diode, and the first electrode of each of the first light-emitting diodes is directly electrically connected to the first wire in the groove, the second electrode The second wire is electrically connected by a bonding wire. 15 201125166 According to the above, in another embodiment, the first electrode and the second electrode of each of the second LEDs are located on different sides of the second LED, each of the second LEDs The first electrode of the pole body is directly electrically connected to the first wire in the recess, and the second electrode is electrically connected to the third wire by a bonding wire. According to the above, in another shot, each of the upper anti-ship layers respectively surrounds each of the element regions. According to the above, in another embodiment, a further anti-friction insulating layer is disposed on the lower conductive layer in the first lead region of each of the element regions. In the light-emitting diode package of the present invention, the light-emitting diode system is disposed in the recess of the substrate, so that the overall thickness of the light-emitting diode package can be greatly reduced. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to make the present invention well understood by those skilled in the art to which the present invention pertains, the preferred embodiment of the present invention will be described in detail below. The effect to be achieved. ,.凊 Refer to Figures 1 to 9. 1 to 9 are schematic views showing a method of fabricating a light emitting diode package according to a first preferred embodiment of the present invention, wherein Zhang Gaobeibenfa 201125166

Features of the Jit production method, 1B, 3, and 5th laps %2mpfr- __ Appearance type reading. As shown in Figure 1

Hr wire ω. In the present embodiment, the wire 1 (four) is a printed circuit board 'but not limited thereto, and may be other types of substrates. The substrate 10 includes an insulating interlayer layer 12, the upper conductive layer 14 is disposed on the upper surface of the insulating substrate 12, and the conductive layer 16 is disposed on the lower surface of the insulating substrate 12. The insulating substrate 12 can be various types. An insulating material such as glass fiber (fine flber) or resin, and an upper conductive layer 14 . The lower conductive layer 16 can be, for example, a plurality of conductive materials, but is not limited thereto. In addition, the substrate 10 has a plurality of butterfly tracks 18 and a plurality of component regions, wherein each of the component regions 20 includes a -first wire region 2ω, a second wire region 2〇2 and an isolation region tear. Then, the conductive layer 14 on the first conductive region 14 and the isolation region 203 of the first conductive region 201 of each of the component regions 20 is removed, and the portion of the second conductive region 202 located in each of the component regions 2 is removed. a lower conductive layer 16 and a lower conductive layer 16 in the isolation region 2〇3 to form a portion of the first wire 22 in the first wire region 2()1 and a second wire in the second wire region 202 A portion of the portion 24, and an opening in the conductive layer of each of the first conductor regions 201, wherein the opening portion exposes the insulating substrate 12. In the embodiment, the step of patterning the upper conductive layer Μ and the patterning the lower conductive layer 16 is performed by etching, but is not limited thereto. As shown in FIGS. 3 and 4, the insulating substrate 12 exposed in the upper surface of the first wiring region 201 of each of the element regions 2 is removed to form a recess %, and is removed in each of the element regions 20 as well. The insulating substrate 12 of the second wire region 202 exposing the lower surface is formed within 2° 2 of the 201125166 region, 28, wherein the groove, the space of the space of “2〇2 28, by which the recess 3 is a light emitting diode Fine coffee W conflict = edge 2: wide second wire area - the central area of the edge, such as the t == " not the 12 groove 26 thin 28 series formed by laser town hole, do not This is limited. It should be noted that, in this embodiment, the grooves 26 located in the same column: the wire region 2〇1 are connected to each other: the groove 26 of the = degree 1-2 degree can also be a mutual Connected closed recesses - as shown in Figures 5 and 6, then an upper conductive pattern 30 is formed in each of the recesses 26 of the insulating substrate 12, and 16 == each of the field rides 14 (10) The conductive layer ζ is connected under the recess 26«, whereby the upper conductive layer _G, the upper conductive layer 14 and the lower conductive layer μ form a lightning guide θ to make the upper conductive layer 14 and the lower line applied to one side of the first conductive line 22 2^ Part of the insulating substrate 12. In other words, the insulating substrate 12 extends from the first guide. In addition, a lower conductive pattern 32 is formed in each of the holes 28, wherein each of the lower conductive patterns 32 and the lower conductive layer 201125166 located in each of the second conductive regions 2〇2 and the holes 28 are exposed to conduct electricity. Layer 14 is electrically connected. Since the recess Z penetrates through the insulating substrate U, the upper conductive layer 14 on the upper surface of the insulating substrate 12 can be electrically connected to the insulating layer 3 by the upper conductive pattern 3 () at each of the first wires. The lower conductive layer 16 on the lower surface of the substrate 12 facilitates subsequent electrical connection. Further, the upper conductive pattern 3 covering the side wall of the recess 26 has a reflecting effect to increase the illuminance. The hole 28 also penetrates through the insulating substrate 12, so that the upper conductive layer μ on the surface of the insulating substrate u can be made in each of the second conductive regions 2〇2: the lower conductive pattern 32 is electrically connected to the insulating substrate. The lower conductive layer 16 of the surface under the material u is to facilitate subsequent electrical connection. In this embodiment, the material of the upper conductive pattern and the lower conductive pattern 32 may be various conductive materials, and it may be a single conductive layer or a composite conductive layer. For example, in the present embodiment, the material of the ± conductive pattern 3 〇 and the lower conductive pattern 2 may be a composite conductive layer composed of two layers of nickel and silver, and may be formed by an electric recording method, but not limited thereto. In addition, after the upper conductive pattern 3 〇 and the lower conductive pattern 32 are formed, an identification mark 34 may be formed on the surface of the conductive layer μ located above each of the second conductive regions 2 〇 2 and above the hole 28 . The difference between the second wire _ 22 and the second wire 24, and the % of the under-welding insulating layer are covered by a portion of the surface of the conductive layer 16 under each of the first wire regions 201 and the insulating substrate of the isolation region 2〇3 The lower surface of 12, that is, partially covering the lower surface of the first wire 22, is at risk of short-circuiting in the reflow process when assembled in an electronic device after the package is completed. It is worthwhile to reduce the thickness of the lower conductive layer 16 corresponding to the lower fresh-keeping insulating layer 36 before the insulating layer 36, so that the under-weld insulating layer 36 can be formed with the adjacent lower conductive layer. Layer 16 generally forms a flat surface that facilitates subsequent soldering of the LED body to another electronic device board (not shown). 201125166 As shown in FIGS. 7 and 8, a plurality of light emitting diodes 38 are provided, wherein each of the light emitting diodes 38 includes a first electrode 381 and a second electrode 382. Subsequently, each of the light-emitting diodes 38 IU is disposed on the first wire 22 in each of the grooves 26, and the first electrode 381 of each of the light-emitting diodes 38 is electrically connected to the corresponding first wire 22, and The second electrodes 382 of the LEDs 38 are electrically connected to the corresponding second wires 24 . In the present embodiment, the first electrode 381 and the second electrode 382 of the LED body 38 are respectively located on opposite surfaces of different sides of the LED body 38, and the first electrode 381 is disposed on the surface of the first wire 22 The first electrode 22 is directly electrically connected to the first wire 22, and the second electrode #382 is electrically connected to the second wire by a fresh wire 4〇, but is not limited thereto. The connector 'includes on the entire base (4) to form a conductive layer 42 on the second surface, and encapsulates and encapsulates the first-pole body 38, and performs _ on the substrate (1) along the dicing street 18 to form a plurality of light-emitting diodes The polar package 44 is as shown in FIG. . Method (10) biliary (four) money is not in the above embodiment

The method is limited, (4) other implementations _. Please refer to the first embodiment of the second preferred embodiment of the present invention. In order to facilitate comparison of the differences of the embodiments, the same elements are denoted by the same reference numerals, and ^ = 'This embodiment is free of steps for description. As for the same method steps: the difference of the foregoing embodiments lies in the type of the light-emitting diode. As shown in FIG. 10, in the present embodiment, the second electrode 382 is located on the surface of the first electrode of the light-emitting diode 3^38 along the side of the Qiu, and the light is emitted. 20 201125166 Body 38 Light-' Μ is electrically connected to the first wire 22, and the second electrode 382 of the ninth electrode 38 is connected by a foot. Another fresh wire 40 is electrically connected to the second wire 24. Please refer to Figures 11 to 17. The third preferred embodiment is a schematic view of the fabrication of the light emitting diode package of the invention of the present invention. In order to highlight the schematic description of the present view, the 12A_12B, (4) '11th and 13th drawings are shown above, and the 17th figure is the cross-sectional line drawn by the cross-sectional line of the outline drawing. Show 12B _ 11th product "(4) Ding Lai, 14th _ along the 13th figure b_b, ^-New 50. In this implementation _ and other implementations described below, the substrate system is listed as - The printed circuit board, but f is limited, and may be other substrates. The substrate includes an insulating substrate 52, the upper conductive layer 54 is disposed on the upper surface of the insulating substrate %, and the lower conductive layer 56 is disposed on the insulating substrate. The lower surface of the material 52, wherein the insulating layer 52 can be various types of insulation (4) such as lang fiber or resin, and the upper conductive layer % and the lower conductive layer 56 can be electrically conductive (four), for example, copper, but not In addition, a plurality of dicing streets % and a plurality of component regions 6 定义 are defined on the j-plate 50. Then, the upper conductive layer 54 and the lower conductive layer 56 are patterned to form electrical separations in the respective elements (9). a first conductor region 601 and a second conductor region _. The upper conductive layer 54 is respectively disposed in each of the first conductor regions 6 after the patterning process The σ 54A is formed in the G1, and the insulating substrate 52 is partially exposed. In the embodiment, the step of patterning the upper conductive layer % and the lower conductive layer 56 is achieved by a side method, but not limited thereto. The insulating substrate 52 exposed by the opening 54A of the upper conductive layer 201125166 is removed to form a recess 52A in the insulating substrate 52 in each of the first lead regions 601. In the present embodiment, the insulating substrate 52 is provided. The groove 52A is formed by laser drilling, and the groove 52A can penetrate part of the lower conductive layer through the insulating substrate 52, but is not limited thereto. For example, the groove of the insulating substrate 52 52A may also be formed in other ways and the groove 52a may not penetrate the insulating substrate 52. Further, the groove 52 may be a closed groove 'but not limited thereto. The shape of the 52A may be a rectangle, but may not be limited to other various shapes; further, the side wall of the recess 52A may be a vertical side wall, an inwardly inclined or outwardly inclined side wall, or a side wall having a curvature. As shown in Figure 13 and Figure ,, then remove each of the four component areas The conductive layer 56, the insulating substrate 52 and the upper conductive layer % under the landing area are formed in the four corners of each element region = a hole 6 penetrating the substrate 5A. In the present embodiment, the system of the hole is mechanically utilized. The drilling method is formed, but the manufacturing method 66 is not limited to being formed by mechanical drilling. Then, the conductive layer 5% is formed on the four corner regions of each of the element regions 60, and each of the solder resist layers 62 is formed. The upper solder resist insulating layer 62 covers the corresponding holes, and a lower solder resist layer 64 is formed on the lower conductive layer % in the first lead region 6〇1 of each element region 60. In this embodiment, the upper guard The ship's edge layer (5) is ___, but not limited thereto. For example, the upper anti-recording insulating layer 62 may also be a pattern of other shapes, such as a rectangular pattern, a diamond pattern or other geometric patterns. In addition, the upper insulating layer has the function of avoiding short circuit, and can avoid the occurrence of burrs on the cutting surface of the upper conductive layer after the cutting process, and can increase the reliability of the light emitting diode package.曰 22 201125166 As shown in Fig. 15, a conductive pattern 68 is formed on the sidewall of each of the holes 66, and electrically connected to each of the holes and the side of the hole 66 to form a first wire 7. And forming a second wire 72 in the second region 602, wherein the first wire 7 is formed by the conductive layer 54, the lower conductive layer 56 and the conductive pattern in the first wire region 6〇, and the second wire 72 is formed by the conductive layer % and the lower conductive layer in the second wire region and the conductive pattern 68, and the first wire 7Q and the second wire 72 are electrically separated. In addition, in the present embodiment, the conductive layer 〇 above the first conductive line Μ and the lower conductive layer allow the disk conductive pattern 68 to be on the recess 52A and the three-pronged electrical connection ^=two wires 72 The conductive layer 54 and the lower conductive layer 56 are electrically connected to the conductive pattern 68 at the two locations where the material ΓΓ, 66 is located. Further, the conductive pattern is, for example, a conductive material, and it may be a single conductive layer or a composite conductive layer. (4), - person it: In the example, the material of the conductive with 68 may be formed by two layers of nickel and silver. The conductive material 68 can be formed side by side, and 52a! L is formed outside the side wall of the hole 66. It is also - and formed on each of the grooves, the guides are exposed to _ 56, and any exposed hills. The surface of the electrical layer 56. In addition, the conductive pattern 68 is preferably substantially uniform in thickness with the concave pattern 52, that is, the conductive pattern, thereby allowing the κι ' to maintain a flatness, which facilitates the setting of the subsequent light-emitting diodes, for example. Second, the bottom of the ΓΓ52Α is not flat and affects the light-emitting direction of the light-emitting diode. The conductive member 68 has a better conformality in the case where the material of the conductive crucible 68 is not added with, for example, a freshener. 23 201125166, as shown in FIG. 16 , at least one light-emitting diode is disposed in each of the recesses 52A, and one of the first electrodes 741 of each of the light-emitting diodes 74 is electrically connected to the corresponding first wire 7 , and The second electrode 742 of each of the light-emitting diodes 74 is electrically connected to the corresponding second wire 72. In this embodiment, the first electrode 741 and the second electrode 742 of the light-emitting diode % are located on the same side of the light-emitting two-slot 74, and the first electrode 741 and the second electrode 742 are respectively connected by the bonding wire 76 It is connected to the first wire % and the second wire, the second wire, and the second wire 72. However, the electrical connection between the first light conductor % and the first wire % and the second wire 72 is not limited thereto. Next, an adhesive layer 78 is formed on the substrate 5G to encapsulate the light-emitting diode 74. Next, a -cutting process is performed to cut the substrate 5A along the dicing streets 58 (shown in Figure 11) between adjacent component regions 60 to form a light emitting diode package 80, as shown in the first drawing. Please refer to Figure 18 again. 18 is a schematic view of a light emitting diode package of a preferred embodiment of the present invention, wherein the same reference numerals are used to simplify the description and to facilitate the comparison of the different embodiments. The same element 'is only for the different parts of the pure class, the science touches the S-process method to make a detailed description. The light-emitting diode of the present t example is different from the first wire and the second conductive wire in the first embodiment. As shown in FIG. 18, the first electrode 741 and the second electrode 742 of the present invention are located in the light emitting diode.

On one side, 苴Φ筮 and J^1J, the first electrode 741 is directly electrically connected to the first wire 7 in the recess 52A, and the first electrode 742 is connected by the fresh wire 762 and the second wire 72. Electrical connection. 24 201125166 Please refer to pictures 19 to 26. Fig. 19 to Fig. 10 show the invention of the invention = good practice: very fine fine coffee. In order to highlight the characteristics of the manufacturing method of the seven-light=polar body package, the 19th, 21st, and 24th views of the visual reading type, the second ga_2(10), the 22nd, and the 23rd are the 25th. The schematic type shows that the '%th off is shown in a schematic form, wherein the figure is /σ19, c_c, the cross-sectional view of the cross-section, the u-th is the DD cross-section of the B-picture The cross-sectional view and the μth view are schematic cross-sectional views taken along the line E-E' of the %th figure. As shown in Fig. 19 and the first tender figure, the substrate (10) is first provided. The substrate (10) includes an insulating substrate 102, an upper conductive layer 104 is disposed on the upper surface of the insulating substrate 1〇2, and a lower conductive layer is disposed on the lower surface of the insulating substrate. In addition, a plurality of dicing streets (10)" are defined on the substrate 1"". The upper conductive layer 1 (10) and the lower conductive layer are patterned to be electrically separated from the respective element regions 11G (4). - Leading, a first-wire area 11G2 and - third wire area. Upper conductive layer · After the patterning process, a secret portion is formed in each of the first wire regions to expose the insulating substrate ι 2 In this embodiment, the steps of patterning the upper conductive layer 1〇4 and the lower conductive layer 〇6 are achieved in a secret manner, but are not limited thereto. Then, the opening of the upper conductive layer (10) is removed. The insulating substrate is removed to form a recess in the insulating substrate H) 2 in each of the first lead regions. In the embodiment, the recess of the insulating substrate 102 utilizes a laser drill. The hole pattern is formed, and the groove touches through the insulating substrate! 〇2 and exposes part of the lower conductive layer 1〇6, but is not limited thereto. For example, the 'insulation button (10) of the groove village _ other way plus (10), and 25 201125166 The groove 102A may not penetrate the insulating substrate 1〇2. The shape of the groove 102A is rectangular, but not limited thereto, and may be other various shapes; further, the side wall of the groove 102A may be a vertical side wall, an inwardly inclined or outwardly inclined side wall, or have a curvature. As shown in FIG. 21 and FIG. 22, the four corner regions of each element region 110 are further removed = the lower conductive layer 106 and the insulating substrate 102' are formed in four corners of each of the element regions 11A - holes 116, wherein the pure holes 116 partially expose the upper conductive layer 1〇4. In the embodiment, the holes 110 are formed by laser drilling, but are not limited thereto. Then, in each component region 110 An upper solder resist insulating layer 112 is formed on the conductive layer 1〇4 on the periphery, and a solder resist insulating layer 114 is formed on the lower conductive layer 106 in the first lead region of each of the element regions 11〇. In the example, each of the upper anti-friction insulating layers 112 is adjacent to each of the elements, but the position and shape of the upper solder resist insulating layer ι 2 are not limited thereto. As shown in FIG. 23, one of the holes 116 is subsequently A conductive pattern m is formed on the sidewall, and each of the electrical connections corresponds to each of the holes 11 6 exposing the upper conductive layer and the conductive layer 1〇6' under the holes 116, so that each first lead region forms a first wire 120, and each second wire region forms a second wire m and Forming a third wire m (not shown in FIG. 23) in each of the third wire regions 1103 (not shown in FIG. 23), wherein the first wire 120 is formed by the first wire region _ inner conductive layer 104 and the lower conductive layer 106. The conductive pattern 118 is formed, and the second wire 122 is formed by the second conductive region 104, the lower conductive layer 1 and the conductive pattern 118. The 26th 201125166 three wires 124 are formed. The conductive layer ι 4 and the lower conductive layer ι 〇 6 ′ are formed by the conductive layer ’ 4 and the conductive layer 118 , and the first wire 120 , the second wire 122 and the third wire 124 are formed by the third wire region 11 〇 3 . Electrical separation. The material of the conductive pattern 118 may be various conductive materials, and it may be a single conductive layer or a composite conductive layer. For example, in this embodiment, the material of the conductive pattern 118 may be a composite conductive layer composed of two layers of nickel and silver. In addition, the conductive pattern 118 can be formed by, for example, electroplating. Therefore, the conductive pattern 118 can be formed on the sidewall of each of the recesses 1 〇 2A and conductively exposed by the recesses 102A. Layer 1〇6, and any surface that exposes the upper conductive layer 1〇4 and the lower conductive layer 106. In addition, the conductive pattern 118 is preferably formed in a conformal manner with the recess 102A, that is, the conductive pattern 118 has a substantially uniform thickness, whereby the bottom of the recess 102A can be maintained flat, which is advantageous for subsequent illumination. The arrangement of the polar body does not affect the light-emitting direction of the light-emitting diode due to the unevenness of the bottom of the groove 102A. For example, in the case where a material such as a gloss agent is not added to the material of the conductive pattern 118, the conductive pattern m can be made to have a better co-doping. Φ as shown in Figs. 24 and 25, 'the second light-emitting diodes 13G and the second light-emitting diodes 132 are disposed in the respective recesses 102A, and the first light-emitting diodes 13 are arranged. - The first lead 12 is electrically connected to the first lead 12, and the n-pole of each of the first LEDs is connected to the second electrode 122, so that the second electrode 132 of each second diode 132 Electrically connecting with the first conductive line 12 and electrically connecting the second electrode 1322 of the second light emitting diode 132 with the third conductive line 124. In this embodiment, the first electrode and the second electrode The first electrode 13〇1 and the second electrode system are respectively electrically connected to the first wire 120 and the second wire 122 by the bonding wires 1341 and 1342 respectively. An electrode 1321 and a second electrode 1322 are located on the same side of the second LED 132, and the first electrode 1321 and the second electrode 1322 are respectively connected to the first wire 120 and the third wire 124 by the bonding wires 1361 and 1362. Electrical connection. Next, a glue layer 138 (not shown in Fig. 24) is formed on the substrate 1 to encapsulate the first light-emitting diode 13'' and the second light-emitting diode 132. Next, a -dication process is performed to cut the substrate excitation along the scribe line 108 (shown in Fig. 19) between adjacent element regions UG to form a light-emitting diode package, as shown in Fig. 26. Referring to FIG. 27, FIG. 427, a schematic diagram of a light-emitting diode county according to a sixth preferred embodiment of the present invention is shown. The towel is simplified and convenient for comparing the differences of the embodiments. The five 阙 阙 肋 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The 帛 light-emitting diode of the present embodiment is electrically connected to the first conductive wire and the second conductive wire. The electrical connection between the light-emitting diode and the first wire and the third wire is the same as that of the precursor. As shown in FIG. 27, in the present addition, the first electrode of the light-emitting diode-to-light-emitting diode 130 is different from the first electrode _13G1 and the second electrode 1302 and the concave #=^ diode 130, wherein the first electrode 1301 is directly connected to the first electrode 22 of the first light-emitting diode 132; and the second light-emitting diode 1321 and the second electrode 1322 are located on the same side of the second light-emitting diode (3). An electrode 1321 is directly electrically connected to the first wire 12A in the recess 1A2A, and the second electrode 1322 is electrically connected to the third wire m by the bonding wire 1362. In summary, the light-emitting diode package of the present invention has the light-emitting diode disposed in the recess of the substrate, which can effectively reduce the overall thickness of the light-emitting diode package. In addition, the conductive pattern is formed in a conformal manner on the bottom and side walls of the recess, thereby maintaining flatness and ensuring the direction of illumination of the light-emitting diode package disposed thereon. Furthermore, by adjusting the shape of the side wall of the groove f, the angle of light and the light type can be changed, thereby increasing the application of the light-emitting diode (4). In addition, in addition to providing the connection between the upper conductive layer and the lower conductive layer, the hole of the substrate can be subsequently adhered to the surface (surfacem_ acts as a buffer space for the solder, thereby effectively improving the yield of the surface adhesion process. For the sake of the present invention, the simplification of the domain is based on the simplification of the invention. (4) belongs to the squid of the present invention. The special circumstance [simplified description] The first to the ninth of the diode package BRIEF DESCRIPTION OF THE DRAWINGS A schematic view of a method for producing a light-emitting according to a first preferred embodiment of the present invention is shown. Fig. 10 shows a schematic diagram of a method for sealing a light-emitting diode of the present invention (four) two-touch embodiment. A schematic diagram of a method for fabricating a light-emitting diode package 29 201125166. Figure 18 is a schematic view showing a light-emitting diode package according to a fourth preferred embodiment of the present invention. FIG. 26 is a schematic diagram showing a manufacturing method of a light emitting diode package according to a fifth preferred embodiment of the present invention. FIG. 27 is a diagram showing a light emitting diode package according to a sixth preferred embodiment of the present invention. Schematic diagram of [main component symbol] 10 substrate 12 Insulating substrate 14 upper conductive layer 16 lower conductive layer 18 dicing street 20 element region 201 first wire region 202 second wire region 203 isolation region 22 first wire 24 second wire 26 groove 28 hole 30 upper conductive pattern 32 under conductive Pattern 34 Identification mark 36 Lower solder resist layer 38 Light-emitting diode 381 First electrode 382 Second electrode 40 Bond wire 42 Sealant layer 44 Light-emitting diode package 50 Substrate 52 Insulation substrate 201125166

52A groove 54 upper conductive layer 54A opening 56 lower conductive layer 58 dicing street 60 element region 601 first wire region 602 second wire region 62 upper solder resist layer 64 lower solder resist layer 66 hole 68 conductive pattern 70 first wire 72 second wire 74 light emitting diode 741 first electrode 742 second electrode 761> 762 bonding wire 78 sealing layer 80 light emitting diode package 90 light emitting diode package 100 substrate 102 insulating substrate 102 A groove 104 Conductive layer 104 A opening. 106 lower conductive layer 108 dicing street 110 element region 1101 first wire region 1102 second wire region 1103 third wire region 112 upper solder resist insulating layer 114 lower solder resist insulating layer 116 hole 118 conductive pattern 120 One wire 122 second wire 124 third wire 130 first light emitting diode 1301 first electrode 1302 second electrode 132 second light emitting diode 1321 first electrode 31 201125166 1322 second electrode 1341 'welding wire 1342 1361 ' welding Line 138 Sealant Layer 1362 140 Light Emitting Diode Package 150 Light Emitting Diode Package

32

Claims (1)

201125166 VII. Patent application scope: 1. A method for manufacturing a light-emitting diode package, comprising: providing a substrate comprising: an insulating substrate; and an upper conductive layer and a lower conductive layer disposed on the insulating substrate; The substrate includes a plurality of component regions; the upper conductive layer and the lower conductive layer in each of the component regions are patterned to form one of the first wire region and the second wire region electrically separated, and Forming an opening in the upper conductive layer of the first lead region, wherein the openings partially expose the insulating substrate; removing the insulating substrate exposed in each of the first lead regions to form a recess; Connecting the patterned upper conductive layer and the patterned lower conductive layer of each of the first lead regions to form a first conductive line; electrically connecting the patterned upper conductive layer of the second lead regions and the patterning The lower conductive layer is formed to form a second wire; a plurality of light-emitting diodes are placed in each of the __, and the -electrode of each of the light-emitting diodes is electrically connected to each of the first wires, and ^ One of the light diodes And each of the two electrodes is electrically connected to the second conductor; forming a subbing layer encapsulating the light-emitting diodes on the substrate; and cutting the substrate to form complex prostitutes light emitting diode package. 2. The method according to claim 1, wherein each of the grooves exposes a portion of the lower conductive layer of each of the first conductor regions. The method of forming the first-conductor of the light-emitting diode package of claim 2, comprising: forming a _ in each of the grooves, and electrically connecting the upper conductive patterns to the respective ones. The first guide = the patterned lower conductive layer. The conductive layer and the light-emitting diode according to the third item, the conductive_in the basin is located between each of the light-emitting diodes and the lower guide 5. The method of forming the upper conductive layer of the light-emitting diode package according to item 3 of the patent application scope is formed by the method and the groove, and the light-emitting two according to the item The method for manufacturing a polar body package, wherein the step of forming the first conductive wire comprises: removing a portion of the upper conductive layer and the hole exposed by the insulating substrate exposed in each of the second wire regions Each of the conductive patterns is electrically connected to the conductive conductive layer and the lower conductive layer of each of the first conductive regions. 7. The method for fabricating a light-emitting diode package according to claim 6, wherein the hole is formed by laser drilling. The method of fabricating a light-emitting diode package according to claim 6, wherein each of the holes is divided into a central region of each of the second leads. 8. 201125166 9. If applying for Supplement I, please apply the method of (1), which is to make the upper conductive layer and the lower conductive layer in each of the element regions. Way to proceed. 10. The grooves of the illuminating diode package described in the scope of claim i are formed by laser drilling. The method for fabricating a light-emitting diode package according to claim 1, comprising forming a further identification mark on a surface of the upper conductive layer located in each of the second wire regions. The invention of the light-emitting diode package of the sixth aspect is included in the upper conductive layer of each of the second wire regions, wherein the identification mark is located above the hole.识别 识别 识别 以 识别 识别 识别 识别 识别 识别 识别 识别 识别 识别 识别 识别 识别 识别 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 。 。 。 。 。 。 。 , ', 14. If the scope of patent application is the first! The method for fabricating the LED package includes removing the lower conductive layer, the insulating substrate and the upper 35 201125166 conductive layer in each of the four corner regions of the component region for each of the component regions Forming a hole in each of the four corner regions; forming an upper solder resist layer on the upper conductive layer of each of the four corner regions of the component region, and covering each of the upper solder resist layers with the corresponding hole; And forming a conductive pattern on the sidewall of each of the holes, electrically connecting the upper conductive layer and the lower conductive layer corresponding to each of the holes, respectively, to form a first-conductor in each of the first lead regions, and Forming a second wire in each of the second wire regions. I5. As claimed in the fabrication of the light-emitting diode package described in item M, each of the conductive patterns covers the fibers of the grooves and the lower conductive layer. The method for producing such a conductive pattern and the grooves are formed in a conformal manner in the hair as described in claim 15 of the patent application, wherein the light-emitting diode according to item 14 is Method of Making Body Packages a These holes are formed by mechanical drilling. The method of manufacturing the light-emitting diode package according to the first aspect of the patent application is as follows: 18. The method for manufacturing the light-emitting diode package according to the first application of the patent application, 36 201125166 "The electrode and the second electrode are located on the same side of the light-emitting diode, and the first line is electrically connected. First, 20. The method for fabricating the light-emitting diode package according to claim j, The second electric pole is electrically connected to the first wire of the second electrode directly adjacent to the light emitting diode, and the second electric second is connected by the bonding wire and the second wire The electrical connection of the wires. ^ 21. The fabrication of the light-emitting diode package described in the scope of the invention is a closed recess. "2. Light-emitting diode package, including: a first wire; an insulating layer extending laterally from one of the first wires; _ a second wire disposed on the insulating layer and extending on an upper surface and a lower surface of the insulating layer, wherein The second wire is electrically connected to the first wire a diode is disposed on the first wire, and one of the first electrodes of the light emitting diode is electrically connected to the first wire, and one of the light emitting diodes is electrically connected to the second wire; An electrode layer is provided on the electrode to encapsulate the light emitting diode. The light-emitting diode package of claim 22, wherein the insulating layer is sandwiched on one side of the first lead line 2011 201126166. 25. The illuminating line of claim 24, wherein the illuminating line comprises an upper conductive pattern and a lower conductive layer and is electrically connected to the lower conductive layer. And the conductive pattern on the first conductive layer forms the recess 26. The light-emitting diode identification mark according to item n of the patent application is disposed on the second wire. And, more specifically, at least - 27. For the application of the light-emitting diode package described in the above-mentioned item, the insulating layer is disposed on the lower surface of the insulating layer and covers the lower surface of the portion. . The knives further include a light-emitting diode package as described in claim 22, wherein the second electrode and the second electrode are located on the same side of the light-emitting diode. The first electrode of the first electrode is electrically connected to the first wire and the (four) two wires by a bonding wire The light-emitting diode package of claim 22, wherein the first electrode and the second electrode are different from the light-emitting diode, and the first electrode system 38 201125166 directly faces the concave The first wire in the slot is electrically connected, and the second electrode is electrically connected to the second wire by a bonding wire. 30. A light-emitting one-pole package comprising: an insulating substrate having a recess and a plurality of holes respectively located in a corner region of the insulating substrate; the first conductive line β is an upper surface covering one of the insulating substrates And the lower surface and the sidewall of the hole covering the portion; the first wire, σΡ is the upper surface and the lower surface covering the insulating substrate, and the sidewall of the hole covering the portion, and the first wire and the second wire Electrically separating; a plurality of upper solder resist layers partially covering an upper surface of the first wire and correspondingly corresponding to the hole, and covering an upper surface of the second wire and corresponding to the hole; a light emitting diode The first electrode of the light-emitting diode is electrically connected to the first wire of the δ hai, and the second electrode of the light-emitting diode is electrically connected to the second wire; and A glue layer encapsulating the light emitting diode. The light emitting diode package of claim 30, wherein the first wire further covers a sidewall of the groove. 32. The light emitting diode package of claim 30, further comprising a lower insulating layer, 39 201125166 partially covering a lower surface of the first wire. The illuminating diode package of claim 30, wherein the first electrode and the second electrode are located on a same side of the illuminating diode, and the first electrode and the second electrode are respectively connected by a bonding wire The first wire and the second wire are electrically connected. The light emitting diode package of claim 30, wherein the first electrode and the second electrode are located on different sides of the δ illuminating body, the first electrode is directly in the groove The first wire is electrically connected, and the second electrode is electrically connected to the second wire by a bonding wire. 35. A method of fabricating a light emitting diode package, comprising: providing a substrate comprising: an insulating substrate; and an upper conductive layer and a lower conductive layer disposed on the insulating substrate, and the substrate includes a plurality of The upper conductive layer and the lower conductive layer are patterned to form electrically separated-first-conductor-second wire region and third wire region in each of the component regions, and Forming an opening in the upper conductive layer of the first-wire region, wherein the openings partially expose the insulating substrate; removing the insulating substrate exposed by the openings of the upper conductive layer to respectively Forming a recess in the insulating substrate in a wire region; removing the lower conductive layer and the edge substrate in the four corner regions of each of the component regions to distinguish the holes in the four corners of each of the component regions The portion of the hole 201125166 partially exposes the upper conductive layer; an upper anti-fresh layer is respectively formed on the upper conductive layer around the element region; and a guide is formed on the sidewall of each of the holes, Separate connection The upper conductive layer exposed by each of the holes and the lower conductive layer adjacent to each of the holes to form a first wire in each of the first wire regions, and a second wire in each of the second wire regions, and Forming a second wire in each of the third wire regions; and arranging the first light-emitting diodes and the second light-emitting tree, and causing the first electrode of each of the first light-emitting diodes The first-wire electrical connection is electrically connected to the second electrode of each of the first-light-emitting diodes, so that the first electrode of the second light-emitting diode and the first-wire are electrically connected And electrically connecting the second electrode of each of the second light-emitting diodes to the third wire; forming a capping layer on the substrate to encapsulate the light-emitting diodes; The substrate is diced between adjacent element regions to form a complex pole package. 36. The method of fabricating a light-emitting diode package according to the above-mentioned patent application, wherein each of the tenth recesses exposes a portion of the lower conductive layer in each of the first-wire regions. 37. The method as claimed in claim 4, wherein each of the conductive patterns covers a sidewall of each of the recesses and the lower conductive layer 38 of each of the recesses is exposed by 201125166. The method for fabricating a light emitting diode package according to the invention of claim π, wherein the specific conductive pattern is formed in a conformal manner. 39. The method for fabricating the LED package described in the patent application 帛% item, the step of patterning the upper conductive layer and the lower conductive layer in the dragon is completely achieved, 40. In the light-emitting diode package of the above-mentioned item 36, the insulating substrate is formed by the lion-like laser. /. 41. The holes in the light-emitting diode according to claim 35 of the patent application are formed by laser drilling. The method for producing a body seal, wherein the conductive pattern is formed by electroplating in the light-emitting diode according to item 5% of the patent application. The manufacturing method of the package, such as the application axis _35 Na: _ is included in the first lead region of each of the component regions, and the solder resist layer. (3) Forming 42 201125166 = photodiode_same side" and the first connection of each of the first and second diodes: the electric wire is electrically connected to the first wire and the second wire respectively The method of manufacturing the light-emitting diode package according to Item 5, wherein the first electrode and the second electrode of the light-emitting body are located on the second side, the same side, and each of the second light-emitting diodes The pole pole coffee (1) (10) is a wire conductor = the 46. The first pole of the first light-emitting diode of the light-emitting diode package described in claim 1 of the patent application and the first: The first side of each of the diodes is electrically connected to the first wire in the recess, and the third electrode is electrically connected to the second wire. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The upper solder resist insulating layer surrounds each of the element regions. 49. A light-emitting diode package, comprising: an insulating substrate having a groove, and a plurality of holes divided into corner regions of the insulating substrate; a first wire partially covering the insulating substrate An upper surface and a lower surface and a sidewall covering the holes; a first wire partially covering the upper surface and the lower surface of the insulating substrate and covering a sidewall of the holes; a third wire portion partially covering the The upper surface of the insulating substrate and the lower surface and the sidewall of the covering portion of the hole, wherein the first wire, the second wire and the third wire are electrically separated; a plurality of upper zinc-proof insulating layers are respectively located a first light emitting diode and a second light emitting diode disposed in the recess, the first electrode of the first light emitting diode and the first The second electrode of the first light emitting diode is electrically connected to the second wire, and the first electrode of the second light emitting diode is electrically connected to the first wire, the second One of the light-emitting diodes And two electrodes electrically connected to the third conductive line; and a subbing layer, a light emitting diode package of the first body and the second light-emitting diode. The light-emitting diode package of claim 49, wherein the first wire further covers a sidewall of the groove. The light-emitting diode package of claim 49, further comprising a portion covering a lower surface of the first wire. The illuminating diode package of claim 49, wherein each of the first and second electrodes are located in the first illuminating diode and each of the first illuminating diodes The first electrode 盥 the fifth side and the first electrode are respectively electrically connected to the first wire and the second wire by a twist line. The field is as described in claim 49. a light emitting diode package, wherein the first electrode and the second electrode are located in the second light emitting diode and the second light emitting diode And the second electrode system is electrically connected to the first wire and the third wire. The light emitting diode package according to claim 49, wherein each of the first light emitting ports The first electrode and the second electrode are different from the first light-emitting diode: the first electrode of each of the first-light-emitting diodes is directly connected to the first-wire of the first light-emitting diode The second electrode is electrically connected by the second wire. The light emitting diode package according to claim 49 is provided. The first electrode and the second electrode of each of the second LEDs are located on different sides of the second LED, and the first electrode of each of the first LEDs directly In the recess, the 45th 201125166 wire is electrically connected, and the second electrode is electrically connected to the third wire by a bonding wire. 56. The light emitting diode package according to claim 49, wherein each The upper solder resist insulating layer surrounds each of the component regions. 57. The light emitting diode package of claim 49, further comprising a lower solder resist insulating layer disposed in the first lead region of each of the component regions On the lower conductive layer. 46