201123870 六、發明說明： 【發明所屬之技術領域】 【先前技術】 傳統由影像感測晶片原件以及光學鏡麵組顺成的取像模組 往往由於感測晶片原件與光學鏡頭之間的接合面面積太小且鏡賴 組與整合電路模組間的高度比例差異太大，導致力矩太大而造成傳 統取像模_抗紐不佳，容易在震射分離而無法通過震盈與摔 落測試。 請參照第1圆’其為習知取像模、组1〇〇的結構示意圖。如圖所示， 鏡頭模組110的接合面A2與整合電路模组120的接合面具有相 同的面積（亦即A1 --A2) ’亦即鏡頭模組110與整合電路模組12〇 之間以一等面積之接合面連結在一起(如線段P1-P1，所示意的接 ^) ’此外’由圖可知鏡頭模組Π〇相對於整合電路模組120有著較 间的同度（亦即H2>H1)，使得取像模組1〇〇在遭受震盪時於接合 面A2所糾的力料平均而導賴賴組i0與整合祕模組⑽ 分離。第2圖則為另一習知取像模組2 〇〇的結構示意圖。如圖所示， 201123870 鏡頭模組no之接合面A2，的面積小於整合電路模請 則面積（亦即Α2’<αγ)，因此，鏡軸且 術 鞭間以-不細之接合峨在ι(如線段ρ2ρ2，== 面），同樣地’鏡賴組训相對於整合電略她22〇也有著 面度(亦即Η2，>Η1，），在遭受震盘時，鏡頭模组2職整人電 組22〇也同樣地容易因力矩分配不均而分離。此外，傳統整合電路 模組的封«會有漏光的情__致最終㈣像品質不佳。 是故，如何細簡易祕義方式麵力吨倾_抗震性並避 免整合電路模組的漏光問題仍是此領域的一大課題。 【發明内容】 鎌本發敗-實_ ’提供了 ―種取像模組’其包含有一整合 電路模組以及-鏡頭模組。該整合電路模組則具有一第一接合面。 φ該鏡頭模組包含有-鏡頭元件以及一支擇結構。該鏡頭元件具有一 第广接合面，其面積大於該第一接合面之面積，其中該第一接合面 與該第二接合面係彼此接合而使該整合電路模組固定於該鏡頭元件 之上’此外，該支樓結構則設置於該第二接合面上，並位於該整合 電路模組之侧壁的外圍。 依據本發明之另一實施例，提供了一種鏡頭模組，其包含有一鏡 頭元件以及_捕結構。纖頭元件具有_接合面，㈣與一整合 201123870 電路模組相接合，而該支撑結構則設置於該接合面上。 、依據本發明之另—實施例’提供了 ―種晶圓級綱模組的製造方 其匕括开乂成一基底，其_該基底的一第一表面具有複數個凹 槽’在基底上的-第二表面形成一鏡頭層；切割該基底形成複數個 兄頭模、、且4中該些鏡頭模組係分別對應至該些凹槽，使得各凹槽 周圍形成一支樓結構。 【實施方式】 。月參照第3圖’其為依據本發明之一實施例所實現的取像模組 300的結構示意圓。取像模组3〇〇包含有（但不限於）一鏡頭模組 310以及-整合電路模组32〇。鏡頭模組31〇則包含有一綱元件 3101以及-支禮結構遍。整合電路模组32〇具有一第一接合面 A_1用以與鏡麵組31()接合。綱元件細可為-晶圓級鏡頭 (wafer·1—，其具有-第二接合面A_2，其面積大於第一接合 面A_1之面積（亦即A_2>AJ )，其中第一接合面a」與第二接合 面A_2係彼此接合而使整合電路模組32〇固定於鏡頭元件丨之 上。此外，支撐結構3102設置於第二接合面A_2上，並位於整合 電路模組320之側壁的外圍，如第3圖所示。經由支標結構通 所額外提供的接細，鏡賴組31〇可更加緊密地經合電路模組 320接合(支樓結構遍與整合電路模组32〇可應用一填充物或黏 合物來增加兩者的接合程度)以強化取像模組3〇〇的整體結構強度。 201123870 請參照第4圖與第5圖，第4圖為依據本發明之一實施例於第3 圖中取像模組300的剖面俯視圖，而第5圖為第請所示之取像模 組300的立體結構圖。由第4圖可知，支樓結構避會環繞整合電 路模組3如並提供額外的接合面與其側壁連結(支撐結構迦愈整 合電路模組320可應用一填充物或黏合物來增加兩者的接合程 度），使其在遭受震動以及摔落時較不易與鏡頭模組分離，其中 鲁支樓結構遞之外側具有對應於鏡頭元件_之一長度u以及 一寬度W1 ’而其_具有對應於整合電路模組32G之-長度L2以 及-寬度W2 (L1>L2 ’ W1>W2)。如第5圖所示，支樓結構遞一 邊與鏡頭元件3HH貼合，而另一方面將整合電路模組32〇環繞起 來。然而’此侧僅為本發明之—實酬，並制來限定本發明之 。月參…、第6圖與第7圖，第6圖為依據本發明之另一實施例於第 _ 3圖中取像模組的剖面俯視圖，而第⑽為依據本發明之另一 實施例之取像模組300的立體結構圖。在第6圖中支樓結構遞 為=道分離的環形結構，其與整合電路模組32〇部分的側壁相連結 並提供額外的接合面，其中支樓結構31〇2之外側具有對應於鏡頭元 件jlOl之長度L1以及一寬度W1，而其内側具有對應於整合電 路模，、且320之一長度L2以及一寬度W2 (L1>L2，W1>W2)，如第7 圖所示’支撐結構3102-邊與鏡頭元件31〇1貼合，而另一方面將 整合電路模組32〇部分環繞起來。然而，在其他實施例中，支揮結 201123870 構3102之外侧亦可不與鏡頭元件遲相對應，舉例來說請參照 第8圖’其為依據本發明之另一實施例之取像模組3〇〇的立體結構 圖，其中支#結構纖内侧分财兩組分麟制鏡頭元件_ 與整合電路模、组320的長度u、寬度W1與長度u、寬度— (LI L2 W1>W2)’而支樓結構31〇2之外側之長度與寬度僅須分別 大於L1與W1。然而，在其他實施例中，整合電路模組32〇之長度 L2與寬度W2亦可分別大於鏡頭元件31〇1的長度u與寬度 W1(L2>L1 W2>W1)。上述之結構均可達到提高取像模组3⑽之抗 震性的目的’故這-設計上的變化亦符合本發明之精神而落在本發# 明的範_之内。 為了避免外來的光線穿透整合電路模組32G之側壁而影響取像 模組3〇〇之運作’本實施例可以採用不透光的材質來構成支樓結構 纖以增進整體的效能，或是在支撑結構遞鑛上不透光材料(支 撐構3102與整合道路模組320間所使用的填充物亦可為不透光材 質）此外’在本實施例中，鏡頭元件贿係以一晶圓級鏡頭來實_ 見是故其可與支撐結構31〇2也可以晶圓級製程來實現一個一體成 形的鏡頭模組3K)。舉例來說，請參照第9圖，其為依據本發明之 -實施例以同-晶圓級製程來實現—個—體成形的鏡頭模組的簡 圖。第9圖中點描的部分即為用以構成支撐結構的不透光材質，而 該晶圓製程會依據各個鏡頭元件的位置，在該不透光材質中分別蝕 刻出用以容納-整合電路模組的空間。請配合第9圖來參照第川 圖’其為在第9圖中的晶圓上沿著一線段Α_·一部分剖面圖。由 201123870 圖可知，該晶®製程會依據—鏡頭元件的位置_$肋容納一整 合電路模組的空間’再依據該鏡頭元件的位置蝴出— 3·，如此-來，便可以低成本來大量生產抗震性強且不易漏光的 取像模組。 此外，本發明所提供之鏡頭模組31〇除了應用於取像模組3〇〇 之外’亦可使用於其他光學應用之中，亦即，任何應用本發明所教 導之鏡頭元件31〇1以及支樓結構31〇2所構成的鏡賴組均隸屬於 本發明的範疇。舉例來說，只要是鏡頭元件31〇1具有一接合面（例 如第3圖所示之A一2)以與一整合電路模組相接合，且支撐結構31〇2 設置於該接合面上的鏡頭模組，均符合本發明的精神，支撐結構 3102係為環狀並由不透光的材質所構成，鏡頭元件31〇1為一晶圓 級鏡頭，及/或支撐結構3102與鏡頭元件3101係一體成型。 請再參照第9圖，在前述的實施例當中，在同一晶圓製程中，於 鲁一晶圓原始基板上一第二表面形成一鏡頭層，並在一第一表面(該第 一表面以不透光材質構成)餘刻出對應至該些鏡頭模組的複數個凹 槽使該原始基板形成一基底，之後再依據該些複數個凹槽的位置切 割該基底而形成複數個晶圓級鏡頭模組，例如鏡頭模組31〇。而在 另一個實施例中，晶圓級鏡頭模組310亦可應用其他方式來形成， 舉例來說’應用具有該些複數個鏡頭模組的一第一基板，以及具有 複數個穿孔的一第二基板(該第二基版以不透光材質構成)互相貼合 而形成該基底，該些複數個穿孔與該第一基板便形成了該基底之該 201123870 些複數個co槽m依據馳減個凹槽齡置切難基底便可 同樣彳于到該些複數個晶圓級鏡頭模組。這些製作方法上的變化均屬 於本發明之範嘴之内。 請參照第關料12圖來進—步了解—體成形之鏡賴組的一 種實施例之製作流程。第11圖為依據本發明之—實施例來製作一體 成形之鏡賴組的製作階段S1〜S4，㈣12 M為依據本發明之一實 施例之取像模組300A的立體結構圖。在第一個階段S1期間，形 成了具有透光性質之-基板SB ’其中基板犯上可用不同的技術來 標示出預定去除以用來作為容納整合電路模組之部分基板(即圖中 斜線部分）。而在下鑛段S2巾，基板SB上的部絲板順利 去除後’生成了複數個凹槽。在階段S3中，，在對應該些凹槽的位置 上生成了複數個鏡頭模組。最後，在S4的階段中形成間隔柱，並斑 其他鏡頭層貼合’便可制複數㈣未_而鏡酿續結構一體 成形的晶圓級鏡頭模組。如第12圖所示，晶圓級鏡賴組應一 邊具有用以容納整合電路模組32〇A之一凹槽，其具有對應到整合 電路模組3纖的長度與紐u、-,錢作上可在跟級鏡頭模 組310A之該凹槽側壁塗上不透狀質以減少漏光。 綜上所述’本發明提供了 —齡像馳及鏡麵組，其可經由一 _易而經濟的方法來大量生產，並且具有極_抗震性 漏光的牯W。 ％ 201123870 以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍 所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 第1圖為習知取像模組的結構示意圖。 第2圖為另一習知取像模組的結構示意圖。 第3圖為本發明取像模組之一實施例的結構示意圖。 •第4圖為依據本發明之一實施例於第3圖之該取像模組的剖面俯視 圖。 第5圖為第3圖所示之該取像模組的立體結構圖。 笫6圖為依據本發明之另一實施例於第3目之該取像模組的剖面俯 祝圖。 笫7圖為依據本發明之另_實細之該取像模組的立體結構圖。 第8圖為鱗本發明之另-實關之該取像模_域結構圖。 籲第9圖為依據本發明之一實施例以一晶圓製程來在一晶圓上實現一 個一體成形的鏡頭模組的簡圖。 第1 〇圖為在第6圖所示之晶圓上沿著一線段A A，的一部分剖面圖。 第11圖為依據本發明之—實施例來製作—體成形之_模組的製 作階段。 第I2圖為依據本發明之—實施彳狀—取像模組的立體結構圖。 【主要元件符號說明】 201123870 100、200、300、300Λ 110、210、310、310A 120、220、320 3101 3102 取像模組 鏡頭模組 整合電路模組 鏡頭元件 支撐結構201123870 VI. Description of the Invention: [Technical Fields of the Invention] [Prior Art] Conventionally, an image capturing module that is formed by an image sensing wafer original and an optical mirror group is often used to sense a joint between a wafer original and an optical lens. The area is too small and the height ratio between the mirror group and the integrated circuit module is too large, resulting in too much torque and causing the traditional image capturing mode to be weak. It is easy to separate in the earthquake and cannot pass the shock and drop test. . Please refer to the first circle', which is a schematic diagram of a conventional image pickup module and a group 1〇〇. As shown in the figure, the joint surface A2 of the lens module 110 and the joint surface of the integrated circuit module 120 have the same area (ie, A1 - A2) 'that is, between the lens module 110 and the integrated circuit module 12? The joints of the equal areas are joined together (such as the line segments P1-P1, the illustrated connections). In addition, it can be seen that the lens module has a relatively equal degree with respect to the integrated circuit module 120 (ie, H2>H1) causes the image capturing module 1 to be separated from the integrated module (10) by the average force corrected by the engaging surface A2 when subjected to the oscillation. FIG. 2 is a schematic structural view of another conventional image capturing module 2 〇〇. As shown in the figure, the area of the joint surface A2 of the 201123870 lens module no is smaller than the area of the integrated circuit module (that is, Α2'<αγ). Therefore, the mirror shaft and the whip are joined by a non-fine joint. ι (such as the line segment ρ2ρ2, == face), the same 'mirror group training relative to the integration of electricity, she also has a face (that is, Η 2, > Η 1,), in the shock disk, the lens module The 22-inch whole person's power group is also easily separated due to uneven torque distribution. In addition, the seal of the traditional integrated circuit module will have a light leak __ resulting in a final (four) image quality is not good. Therefore, how to use the simple and secret way to overcome the shock resistance and avoid the light leakage problem of the integrated circuit module is still a major issue in this field. SUMMARY OF THE INVENTION The present invention provides a "image capture module" that includes an integrated circuit module and a lens module. The integrated circuit module has a first joint surface. φ The lens module includes a lens element and a selection structure. The lens element has a wide joint surface having an area larger than an area of the first joint surface, wherein the first joint surface and the second joint surface are joined to each other to fix the integrated circuit module to the lens element In addition, the branch structure is disposed on the second joint surface and located at the periphery of the side wall of the integrated circuit module. In accordance with another embodiment of the present invention, a lens module is provided that includes a lens element and a trapping structure. The fiber element has a _ joint surface, (4) is coupled to an integrated 201123870 circuit module, and the support structure is disposed on the joint surface. According to another embodiment of the present invention, a manufacturer of a wafer level module is further provided as a substrate, wherein a first surface of the substrate has a plurality of grooves 'on the substrate The second surface forms a lens layer; the substrate is cut to form a plurality of brother head molds, and the lens modules of the plurality of lenses are respectively corresponding to the grooves, so that a structure is formed around each groove. [Embodiment] Referring to Figure 3, there is shown a schematic circle of the image capturing module 300 implemented in accordance with an embodiment of the present invention. The image capturing module 3 includes, but is not limited to, a lens module 310 and an integrated circuit module 32A. The lens module 31A includes a component 3101 and a tribute structure. The integrated circuit module 32A has a first joint surface A_1 for engaging the mirror group 31(). The element can be a wafer-level lens (wafer·1—which has a second bonding surface A_2 whose area is larger than the area of the first bonding surface A_1 (ie, A_2>AJ), wherein the first bonding surface a” The second bonding surface A_2 is bonded to each other to fix the integrated circuit module 32 丨 on the lens element 。. Further, the supporting structure 3102 is disposed on the second bonding surface A_2 and located at the periphery of the sidewall of the integrated circuit module 320. As shown in Fig. 3, through the additional structure provided by the support structure, the mirror group 31 can be more closely joined to the integrated circuit module 320 (the branch structure can be applied to the integrated circuit module 32) Filler or adhesive to increase the degree of bonding between the two) to enhance the overall structural strength of the image taking module 3〇〇. 201123870 Please refer to Figures 4 and 5, and Figure 4 is an embodiment of the present invention. Fig. 3 is a cross-sectional plan view of the image capturing module 300, and Fig. 5 is a perspective structural view of the image capturing module 300 shown in Fig. 4. As can be seen from Fig. 4, the branch structure avoids the surrounding integrated circuit module 3. If and provide additional joints to join their side walls (support structure The circuit module 320 can apply a filler or a binder to increase the degree of joint between the two, so that it is less likely to be separated from the lens module when subjected to vibration and falling, wherein the outer side of the Luzhilou structure corresponds to the lens. The element_ has a length u and a width W1' and has a length L2 corresponding to the integrated circuit module 32G and a width W2 (L1 > L2 'W1> W2). As shown in Fig. 5, the branch structure The hand side is attached to the lens element 3HH, and on the other hand, the integrated circuit module 32 is wrapped around. However, this side is only the present invention, and the invention is limited to the present invention. FIG. 7 and FIG. 6 are cross-sectional plan views of the image capturing module in FIG. 3 according to another embodiment of the present invention, and (10) is an image capturing module 300 according to another embodiment of the present invention. The three-dimensional structure diagram. In Fig. 6, the structure of the branch structure is a ring structure separated by a track, which is connected with the side wall of the flange portion of the integrated circuit module 32 and provides an additional joint surface, wherein the branch structure 31〇2 The outer side has a length L1 corresponding to the lens element j101 and a width W1, The inner side has a corresponding one of the integrated circuit modes, and 320 has a length L2 and a width W2 (L1>L2, W1>W2). As shown in FIG. 7, the support structure 3102-side is attached to the lens element 31〇1. On the other hand, the integrated circuit module 32 is partially surrounded. However, in other embodiments, the outer side of the support node 201123870 may not be corresponding to the lens element, for example, please refer to FIG. A three-dimensional structure diagram of the image capturing module 3A according to another embodiment of the present invention, wherein the length of the two-component lining lens element _ and the integrated circuit module and the group 320 are The width W1 and the length u, the width - (LI L2 W1 > W2)' and the length and width of the outer side of the branch structure 31〇2 only need to be larger than L1 and W1, respectively. However, in other embodiments, the length L2 and the width W2 of the integrated circuit module 32〇 may be greater than the length u and the width W1 (L2 > L1 W2 > W1) of the lens element 31〇1, respectively. The above structure can achieve the purpose of improving the shock resistance of the image taking module 3 (10). Therefore, the design change is also in accordance with the spirit of the present invention and falls within the scope of the present invention. In order to prevent the external light from penetrating the side wall of the integrated circuit module 32G and affecting the operation of the image capturing module 3', the embodiment may use an opaque material to form a branch structure fiber to enhance the overall performance, or The opaque material on the support structure is transferred (the filler used between the support structure 3102 and the integrated road module 320 may also be an opaque material). In addition, in the embodiment, the lens component is a wafer. The lens is compacted. See the lens module 3K which can be integrated with the support structure 31〇2 or the wafer level process. For example, please refer to FIG. 9, which is a simplified diagram of a lens module formed by the same-wafer level process according to the embodiment of the present invention. The portion depicted in FIG. 9 is an opaque material for forming a support structure, and the wafer process is respectively etched in the opaque material to accommodate the integrated circuit according to the position of each lens element. The space of the module. Please refer to Fig. 9 for a cross-sectional view of the 川_· along the line segment on the wafer in Fig. 9. According to the figure of 201123870, the Crystal® process will be based on the position of the lens component _$ rib to accommodate the space of an integrated circuit module and then according to the position of the lens component. Mass production of imaging modules with high shock resistance and low light leakage. In addition, the lens module 31 provided by the present invention can be used in other optical applications, besides being applied to the image capturing module 3, that is, any lens element 31〇1 to which the present invention is applied. And the mirror group formed by the branch structure 31〇2 belongs to the scope of the present invention. For example, as long as the lens element 31〇1 has a joint surface (for example, A-2 shown in FIG. 3) to be engaged with an integrated circuit module, and the support structure 31〇2 is disposed on the joint surface. The lens module is in accordance with the spirit of the present invention. The support structure 3102 is annular and composed of an opaque material. The lens element 31〇1 is a wafer level lens, and/or the support structure 3102 and the lens element 3101. It is integrally formed. Referring to FIG. 9 again, in the foregoing embodiment, a lens layer is formed on a second surface of the original substrate of the Luyi wafer in the same wafer process, and is on a first surface (the first surface is The opaque material is formed by engraving a plurality of grooves corresponding to the lens modules to form a substrate, and then cutting the substrate according to the positions of the plurality of grooves to form a plurality of wafer levels A lens module, such as a lens module 31〇. In another embodiment, the wafer level lens module 310 can also be formed by other methods, for example, 'using a first substrate having the plurality of lens modules, and a first having a plurality of perforations The two substrates (the second base plate is made of an opaque material) are bonded to each other to form the substrate, and the plurality of perforations and the first substrate form the base of the 201123870 plurality of co slots m according to the reduction A plurality of wafer-level lens modules can be equally applied to a plurality of wafer-level lens modules. Variations in these manufacturing methods are within the scope of the present invention. Please refer to the Figure 12 to further understand the production process of an embodiment of the body-formed mirror group. Fig. 11 is a perspective view showing the manufacturing stages S1 to S4 of the integrally formed mirror group according to the embodiment of the present invention, and (4) 12 M is a perspective structural view of the image capturing module 300A according to an embodiment of the present invention. During the first phase S1, a substrate SB' having a light transmitting property is formed in which the substrate is subjected to different techniques to indicate a predetermined removal for use as a part of the substrate accommodating the integrated circuit module (ie, a diagonal portion in the figure). . In the S2 towel of the lower miner section, after the smoothness of the filament plate on the substrate SB is smoothly removed, a plurality of grooves are formed. In stage S3, a plurality of lens modules are generated at positions corresponding to the grooves. Finally, a spacer is formed in the stage of S4, and the other lens layers are attached to each other to form a wafer-level lens module in which the plurality of mirrors are formed. As shown in Fig. 12, the wafer level mirror group should have a recess for accommodating the integrated circuit module 32A on one side, which has a length corresponding to the integrated circuit module 3 fiber and the new u, -, money The groove side wall of the step lens module 310A can be coated with an impervious shape to reduce light leakage. As described above, the present invention provides an age-like image and a mirror group which can be mass-produced by an easy and economical method and which has extremely 抗 shock-resistant light leakage. The above description is only the preferred embodiment of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention. [Simple description of the drawing] Fig. 1 is a schematic structural view of a conventional image capturing module. Figure 2 is a schematic view showing the structure of another conventional image taking module. FIG. 3 is a schematic structural view of an embodiment of the image capturing module of the present invention. Figure 4 is a cross-sectional plan view of the image taking module of Figure 3 in accordance with an embodiment of the present invention. Fig. 5 is a perspective structural view of the image taking module shown in Fig. 3. Figure 6 is a cross-sectional elevation view of the image taking module of the third object in accordance with another embodiment of the present invention. FIG. 7 is a perspective structural view of the image capturing module according to another embodiment of the present invention. Figure 8 is a diagram of the image structure of the image-mode of the other embodiment of the scale. 9 is a schematic diagram of a one-piece lens module implemented on a wafer by a wafer process in accordance with an embodiment of the present invention. The first drawing is a partial cross-sectional view along the line A A on the wafer shown in Fig. 6. Figure 11 is a diagram showing the stage of fabrication of a module for forming a body in accordance with an embodiment of the present invention. Figure I2 is a perspective structural view of the implementation of the jaw-like imaging module in accordance with the present invention. [Main component symbol description] 201123870 100, 200, 300, 300 Λ 110, 210, 310, 310A 120, 220, 320 3101 3102 Image capture module Lens module Integrated circuit module Lens component Support structure
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