TW201122403A - Micro liquid cooling device - Google Patents

Micro liquid cooling device Download PDF

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Publication number
TW201122403A
TW201122403A TW098145684A TW98145684A TW201122403A TW 201122403 A TW201122403 A TW 201122403A TW 098145684 A TW098145684 A TW 098145684A TW 98145684 A TW98145684 A TW 98145684A TW 201122403 A TW201122403 A TW 201122403A
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TW
Taiwan
Prior art keywords
electrode
cooling device
micro
liquid cooling
loop
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TW098145684A
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Chinese (zh)
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TWI506238B (en
Inventor
Chien-Yu Chao
Yen-Chih Chen
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Foxconn Tech Co Ltd
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Priority to TW098145684A priority Critical patent/TWI506238B/en
Priority to US12/755,437 priority patent/US20110154833A1/en
Publication of TW201122403A publication Critical patent/TW201122403A/en
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Publication of TWI506238B publication Critical patent/TWI506238B/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/16—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/04—Coatings; Surface treatments hydrophobic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A micro liquid cooling device includes a base, a loop pipe and a plurality of electrode units. The loop pipe is disposed on the base and defines a closed loop passage therein. A working fluid is accommodated in the loop passage of the loop pipe. The plurality of electrode units are disposed on the base and spaced from each other along an extending direction of the loop pipe. Each electrode unit includes a first electrode and a second electrode. The first electrode and the second electrode of each electrode unit are located at two sides of a pipe body of the loop pipe and sandwich the pipe body of the loop pipe therebetween. An inner wall of the loop pipe forms a hydrophobic layer thereon. A first dielectric layer is formed between the first electrode and an outer wall of the loop pipe, while a second dielectric layer is formed between the second electrode and the outer wall of the loop pipe.

Description

201122403 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種冷卻裝置，尤係關於一種用於冷卻電子 元件的微型液體冷卻裝置。 【先前技術】 [0002] 目前，對發熱電子元件進行冷卻的液體冷卻裝置一般包 括一吸熱體、一散熱體、一泵及複數傳輸管。由該吸熱 體、散熱體、泵及傳輸管構成一迴路，該迴路中填充有 冷卻液體，冷卻液體在該吸熱體處吸收電子元件所產生 的熱量，經傳輸管傳至散熱體後放出熱量。在該泵的驅 動作用下，該冷卻液體在迴路中不斷循環，從而源源不 斷地帶走該電子元件所產生的熱量。 [0003] 然而，習知液體冷卻裝置中泵所佔用的空間較大，很難 符合電子裝置朝向輕薄化方向發展的要求。另外，泵在 運行時還會產生較大的嗓音，影響使用者的聽覺感受。 [0004] 介質材料上的電潤濕效應（E1 ec trowet t i ng On Dielectric，EWOD)係一種藉由施加電勢來改變液體表 面張力的可逆現象。圖1A與圖1B為介質上的電潤濕效應 的原理圖。如圖1A所示，下極板10包括一基底11，基底 11上設有下電極層12，該下電極層12被一層絕緣層13覆 蓋，液滴14位於絕緣層13的表面，上電極15插入液滴14 的内部。該上電極1 5與下電極層1 2之間藉由電源線連接 有一開關16及一可調電源17，該開關16用於控制電路的 斷開與閉合，該可調電源17用來給下極板10與上電極15 之間提供施加電壓。當上電極15與下極板10之間不加電 098145684 表單編號A0101 第4頁/共18頁 0982077972-0 201122403 Ο [0005] 壓’即開關16處於斷開狀態時，該下極板ι〇的絕緣層13 的表面為疏水的’此時液滴14的靜態接觸角為0(〇)>9〇 。。如圖1Β所示，當開關16閉合時，可調電源17提供一電 壓V ’在液滴14與下極板10之間產生電勢作用，此時，液 滴14的靜態接觸角由原來的0(〇)變化為，0(ν)< θ (0)。當V的大小達到一定值時，0 (ν)<9〇。，此時絕 緣層13的表面變成親水的。當開關16重新斷開時，即液 滴14與下極板1〇之間沒有電勢作用時，液滴14的靜態接 觸角重新回復到0(0)。上述的這種現象稱為介質材料上 的電潤濕效應。 Ο 利用這種介質材料上的電潤濕效應原理，美國杜克大學 (Duck University)的Pol lack M G等人首先基於介 質材料上的電潤濕效應並採用微機械製作的微電極陣列 進行了微液滴的運動控制’並提出了 “數位微流體（Di_ gital Microfluidics)”的概念。美國洛杉磯加州大 學（UCLA)的Cho S K等人成功地剁用EW0D效應對直徑 為70//m的微液滴進行了微液滴私產生、傳輸、混合和分 裂四個基本操作，並在25V的交流電壓下得到了 250mm/s 的微液滴移動速度（Cho S K，Moon H，Kim C J. Creating, Transporting, Cutting, and Merging Liquid Droplets by Electrowetting-Based Ac-tuEtion for Distal Microfluidic Circuits [J]. Journal of Microelectromechanical Sys-tems，2003，12 (1 ):70-80.)。可見，基於介質材 料上的電潤濕效應係一種十分有效的微流體控制技術。 098145684 表單編號A0101 第5頁/共18頁 0982077972-0 201122403 【發明内容】 [0006] [0007] [0008] 題積小且具有較好的靜 有鑒於此，有必要提供一種佔用 音效果的微型液體冷卻裳置。 一種微型液體冷卻裝置，.包括—我 極組，該環管設於該基板上，環^~環管及複數電 内形成-封閉的迴路，該迴路中的首尾相連並於壤官 奴φ过, 、充有工作液體，該複 數電極組sx於基板上並沿環管的 —咏 、伸方向呈間隔設置， 母一電極組包括一第一電極與—凌_ Λ咕 、乐二電極，該第一電極 與第二電極呈相對設置並將環管 幻s體失設於該第一電 極與第二電極之間，環管的内壁設有—疏水層，第一電 機管的練之間分別 設有一介電層。 與習知技術相比，該微型液體冷卻裝置製程簡單，適合 進行微型化設計，可用於内部空間較小的電子裝置内對 電子元件進行散熱。該微型液體冷卻裝置，無需設置泵 這類機械傳動件’因此具有良好的靜音效果。 【實施方式】 [0009] 本發明旨在將基於介質材料上的電潤濕效應這一微流體 控制技術應用於微型液體冷卻裝置中。 [0010] 如圖2與圖3所示為本發明微型液體冷卻裝置200的—較佳 實施例。該微型液體冷卻裝置200用於冷卻一發熱電子元 件300，所述微型液體冷卻裝置200包括一基板20、—環 管21及複數電極組22。 [0011] 該基板20呈矩形，可為一玻璃板或一矽板。該基板2〇上 098145684 表單編號A0101 第6頁/共18頁 0982077972-0 201122403 設有-環槽2(Η，該環管21水平放置於該基⑽上並^ 於該環槽2動。該環管21的首尾相連並於環管2ι内开^ -封閉的迴路，該迴路中填充有工作液體3()。所迷工^ 液體30為能夠藉由電濕潤效應驅動的任何液體。本實 例中，環管21大致i矩形，具有—吸·211及_ = Ο 段211相對的-放熱段212，該環管21於一相對的兩角處 分別設有-球狀的儲液部213 ’以用來儲存工作液體如。 該兩儲液部213的其中之一上開設有一注液孔214，以供 將工作液體30注入至環管21内，該注液孔214由〜塞子、 215封閉。本實施例中，該環管21係採用濕蝕刻 etching)的方法自基板20生長瓣成。如周4所示， 21的内壁覆蓋有一層很薄的疏水材料以形成一疏水層2丄6 [0012] 〇 請一併參閱圖4，該複數電極組22設於基板2〇上並沿環管 21的延伸方向呈間隔設置。每一電極組22包括一第—電 極221與一第二電極222，該第一電極221與第二電極222 分別位於環管21的管體的内外兩側且呈相對設置，以將 環管21的管體失設於該第一電極221與第二電極222之間 。該第一電極221與第二電極222均連接至環管21的外壁 上，且在第一電極221靠近環管21的一端與環管21的外壁 之間形成有一介電層23。同樣地，在第二電極222靠近環 管21的一端與環管21的外壁之間亦形成一介電層24。本 實施例中，電極組22的第一電極221與第二電極222係採 用蚀刻的方法自基板20上生長形成。在先製作電極組22 的情沉下，該介電層23、24可以藉由分別在電極組22的 098145684 表單編號A0101 09820779Τ2-0 201122403 第-電極221與第二電極222的表面沉積—層氮化石夕（201122403 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a cooling device, and more particularly to a micro liquid cooling device for cooling an electronic component. [Prior Art] [0002] At present, a liquid cooling device for cooling a heat-generating electronic component generally includes a heat absorbing body, a heat sink, a pump, and a plurality of transfer tubes. The heat absorbing body, the heat sink, the pump and the transfer tube form a circuit, and the circuit is filled with a cooling liquid, and the cooling liquid absorbs heat generated by the electronic component at the heat absorbing body, and is transferred to the heat sink through the transfer pipe to release heat. Under the driving action of the pump, the cooling liquid circulates continuously in the circuit, so that the source continuously removes the heat generated by the electronic component. [0003] However, in the conventional liquid cooling device, the space occupied by the pump is large, and it is difficult to meet the requirements for the development of the electronic device toward the thinning direction. In addition, the pump will also produce a loud voice during operation, affecting the user's hearing experience. [0004] The electrowetting effect on a dielectric material (E1 ec trowet t ng On Dielectric, EWOD) is a reversible phenomenon of changing the surface tension of a liquid by applying an electric potential. Figures 1A and 1B are schematic diagrams of the electrowetting effect on a medium. As shown in FIG. 1A, the lower plate 10 includes a substrate 11 on which a lower electrode layer 12 is disposed. The lower electrode layer 12 is covered by an insulating layer 13, and the droplets 14 are located on the surface of the insulating layer 13, and the upper electrode 15 is provided. Insert the inside of the droplet 14. A switch 16 and an adjustable power source 17 are connected between the upper electrode 15 and the lower electrode layer 12 by a power line. The switch 16 is used for controlling the opening and closing of the circuit, and the adjustable power source 17 is used to give An applied voltage is applied between the plate 10 and the upper electrode 15. When no power is applied between the upper electrode 15 and the lower plate 10, 098145684 Form No. A0101 Page 4 of 18 0982077972-0 201122403 Ο [0005] When the switch 16 is in the off state, the lower plate is 〇 The surface of the insulating layer 13 is hydrophobic. At this time, the static contact angle of the droplet 14 is 0 (〇) > 9 〇. . As shown in FIG. 1A, when the switch 16 is closed, the adjustable power supply 17 provides a voltage V' to generate an electric potential between the liquid droplet 14 and the lower plate 10. At this time, the static contact angle of the liquid droplet 14 is from the original zero. (〇) changes to, 0 (ν) < θ (0). When the size of V reaches a certain value, 0 (ν) < 9 〇. At this time, the surface of the insulating layer 13 becomes hydrophilic. When the switch 16 is re-opened, i.e., there is no potential between the liquid droplet 14 and the lower plate 1 , the static contact angle of the droplet 14 returns to 0 (0). This phenomenon is referred to as the electrowetting effect on the dielectric material. Ο Using the principle of electrowetting effect on this dielectric material, Pump lack MG et al. of Duck University in the United States first based on the electrowetting effect on the dielectric material and micro-electrode arrays made by micro-machinery. The motion control of droplets 'and proposed the concept of "Di_ gital Microfluidics". Cho SK et al. of the University of California, Los Angeles (UCLA) successfully used the EW0D effect to perform four basic operations of microdroplet private generation, transmission, mixing and splitting on 70//m diameter droplets, and at 25V. The droplet movement speed of 250mm/s is obtained under AC voltage (Cho SK, Moon H, Kim C J. Creating, Transporting, Cutting, and Merging Liquid Droplets by Electrowetting-Based Ac-tuEtion for Distal Microfluidic Circuits [J] Journal of Microelectromechanical Sys-tems, 2003, 12 (1): 70-80.). It can be seen that the electrowetting effect based on the dielectric material is a very effective microfluidic control technique. 098145684 Form No. A0101 Page 5 of 18 0982077972-0 201122403 [Summary of the Invention] [0006] [0007] [0008] The problem is small and has a good static. In view of this, it is necessary to provide a miniature that takes up the sound effect. The liquid is cooled and placed. A micro liquid cooling device comprises: a my pole group, the ring tube is arranged on the substrate, and the ring ^~ring tube and the plurality of electric electricity form a closed loop, and the loop is connected end to end and is in the domain , the working electrode is filled with the working liquid, and the plurality of electrode groups sx are disposed on the substrate at intervals along the direction of the ring and the extension of the ring tube, and the mother electrode group includes a first electrode and the first electrode and the second electrode. The first electrode and the second electrode are disposed opposite to each other, and the annular tube is disposed between the first electrode and the second electrode, and the inner wall of the ring tube is provided with a hydrophobic layer, and the first motor tube is respectively separated A dielectric layer is provided. Compared with the prior art, the micro liquid cooling device has a simple manufacturing process and is suitable for miniaturization design, and can be used for dissipating heat of electronic components in an electronic device having a small internal space. The micro-liquid cooling device does not require a mechanical transmission such as a pump to provide a good mute effect. [Embodiment] The present invention is directed to the application of a microfluidic control technique based on an electrowetting effect on a dielectric material to a micro liquid cooling device. [0010] As shown in Figures 2 and 3, a preferred embodiment of the micro-liquid cooling device 200 of the present invention is shown. The micro-liquid cooling device 200 is for cooling a heat-generating electronic component 300. The micro-liquid cooling device 200 includes a substrate 20, a loop 21, and a plurality of electrode sets 22. [0011] The substrate 20 has a rectangular shape and may be a glass plate or a slab. The substrate 2 is 098 098145684 Form No. A0101 Page 6 / 18 pages 0982077972-0 201122403 is provided with a ring groove 2 (Η, the ring tube 21 is horizontally placed on the base (10) and is moved in the ring groove 2. The loops 21 are connected end to end and open a closed loop in the loop 2, which is filled with a working liquid 3 (). The liquid 30 is any liquid that can be driven by the electrowetting effect. The ring pipe 21 is substantially i-rectangular and has a heat-releasing section 212 opposite to the 211 and _= Ο section 211. The ring pipe 21 is provided with a spherical liquid storage portion 213 at a pair of opposite corners. For storing the working liquid, for example, one of the two liquid storage portions 213 is provided with a liquid injection hole 214 for injecting the working liquid 30 into the annular tube 21, and the liquid injection hole 214 is closed by the plug, 215 In this embodiment, the loop 21 is grown from the substrate 20 by wet etching. As shown in FIG. 4, the inner wall of 21 is covered with a thin layer of hydrophobic material to form a hydrophobic layer 2丄6. [0012] Referring to FIG. 4 together, the plurality of electrode groups 22 are disposed on the substrate 2〇 and along the ring. The extending direction of the tubes 21 is spaced apart. Each of the electrode groups 22 includes a first electrode 221 and a second electrode 222. The first electrode 221 and the second electrode 222 are respectively disposed on the inner and outer sides of the tube body of the ring tube 21 and are oppositely disposed to connect the ring tube 21 The tube body is lost between the first electrode 221 and the second electrode 222. The first electrode 221 and the second electrode 222 are both connected to the outer wall of the collar 21, and a dielectric layer 23 is formed between the end of the first electrode 221 adjacent to the collar 21 and the outer wall of the collar 21. Similarly, a dielectric layer 24 is also formed between the end of the second electrode 222 adjacent to the collar 21 and the outer wall of the collar 21. In this embodiment, the first electrode 221 and the second electrode 222 of the electrode group 22 are grown from the substrate 20 by etching. In the case of the first electrode group 22, the dielectric layers 23, 24 can be deposited by the surface of the first electrode 221 and the second electrode 222 of the electrode group 22, 097, 145, 684, Form No. A0101 09820779 Τ 2-0 201122403, respectively. Fossil eve

Si/4)來形成，然而再在基板2〇上製作環管Η。在先製 作環管21的情況下，該介電層23、24可以藉由在環管^ 的外壁的相對兩側分別沉積—層氮化石夕（W)來形成 ，然後再在基板20上製作電極組22。 [0013] [0014] 如圖3所示，每一電極組22的第一電極221與第二電極 222藉由複數導線41與外部的一控制電路4〇進行電連接， 該控制電路40包括一電源及—控制晶片，該控制晶片採 用電腦程式來控制施加於各電極組22上的電壓的施加時 ❹ 間及施加順序，所施加的電壓的大小由電源控制。該控 制電路40對施加電壓的控制方法採用拿規的控制方法。 使用該微型液體冷卻裝置2〇〇對電子元件3〇0進行散熱時 ，該微型液體冷卻裝置200的基板20貼設於電子元件3〇〇 上’並使環管21的吸熱段211位於發熱電子元件3〇〇的正 上方（如圖2所示），發熱電子元件300所產生的熱量被 基板20吸收’並由基板20將熱量傳給環管21的吸熱段 211中工作液體30。工作時，藉由控制電路40規律性地對 〇 該複數電極組22施加電壓，在電濕潤效應的作用下，環 管21的吸熱段211内已加熱的工作液體30被驅動至環管 21的放熱段212。工作液體30在環管21的放熱段212與基 板20進行熱交換’被冷卻後的工作液體30在電濕潤效應 的驅動下再次回到環管21的吸熱段211以進入下一次循環 ’從而源源不斷地帶走該電子元件300所產生的熱量。 該微型液體冷卻裝置200可採用微機電系統（MEMS)技術 進行製作，適合進行微型化設計，可用於内部空間較小 098145684 表單編號A0101 第8頁/共18頁 0982077972-0 [0015] 201122403 的筆記型電腦等電子裝置内對電子元件300進行散熱。該 微型液體冷卻裝置2GQ中，採用電濕潤效應來對工作液體 30進行主動傳輪，*僅可辑確地控制工作液⑽的傳 輪量，而且沒有像泵這類機械傳動件，使得該微型液體 冷卻裝置200具有良好的靜音效果。 [0016] Ο 综上所述’本發明符合發明專利要件，爰依法提出專利 申4。惟，以上所述者僅為本發明之較佳實施例，舉凡 ‘'^本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0017] 圖1A與圖1B為介質材料上的電咖效應原理的示意圖， 其中.圖1A為不加電壓時，液滴的靜態接觸角為0 ⑻&gt;9(Γ的情況；為施加—定電壓作用下，液滴的 靜態接觸角為0(V)〈9O。的情況。 [0018] 圖2為本發明微型液體冷卻裝置的立體組裝示意圖。 Λ [0019] ❹ 圖3為圖2所示微型液體冷卻裝直沿m⑴線的剖視圖 ’圖中—併示出㈣微型液體冷卻裝置的電極組提供電 壓的控制電路。 [0020] 圖4為圖3中IV處的放大圖。 [0021] 【主要元件符號說明】 〈本發明〉 [0022] 微型液體冷卻裝置：2〇〇 [0023] 環槽：201 098145684 表單編號A0101 第9頁/共18頁 0982077972-0 201122403 [0024]基板：20 [0025] 環管：21 [0026] 吸熱段：211 [0027] 放熱段：212 [0028] 儲液部：213 [0029] 注液孔：214 [0030] 塞子：215 [0031] 疏水層：216 [0032] 電極組：22 [0033] 第一電極：221 [0034] 第二電極：2 2 2 [0035] 介電層：23 [0036] 介電層：24 [0037] 電子元件：300 [0038] 工作液體：30 [0039] 控制電路：40 [0040] 導線：41 [0041] 〈習知〉 [0042] 下極板：10 098145684 表單編號A0101 第10頁/共18頁 0982077972-0 201122403 [0043] [0044] [0045] [0046] [0047] [0048] [0049] Ο [0050] 基底：11 下電極層：12 絕緣層：13 液滴：14 上電極：15 開關：16 可調電源：17 靜態接觸角：0(0)、θ(ν) 098145684 表單編號Α0101 第11頁/共18頁 0982077972-0Si/4) was formed, but a loop Η was fabricated on the substrate 2〇. In the case where the loop tube 21 is first formed, the dielectric layers 23, 24 may be formed by depositing a layer of nitride (W) on opposite sides of the outer wall of the loop tube, and then forming on the substrate 20. Electrode group 22. [0014] As shown in FIG. 3, the first electrode 221 and the second electrode 222 of each electrode group 22 are electrically connected to an external control circuit 4A by a plurality of wires 41, and the control circuit 40 includes a control circuit 40. The power supply and the control chip are controlled by a computer program to control the timing of application of the voltage applied to each electrode group 22 and the order of application, and the magnitude of the applied voltage is controlled by the power source. The control circuit 40 employs a control method for controlling the applied voltage. When the electronic component 3 〇 0 is dissipated by the micro liquid cooling device 2 , the substrate 20 of the micro liquid cooling device 200 is attached to the electronic component 3 ' and the heat absorbing section 211 of the collar 21 is located at the heat generating electrons. Directly above the element 3 (as shown in FIG. 2), the heat generated by the heat-generating electronic component 300 is absorbed by the substrate 20' and heat is transferred from the substrate 20 to the working liquid 30 in the heat-absorbing section 211 of the collar 21. In operation, the voltage is applied to the plurality of electrode groups 22 by the control circuit 40, and the heated working liquid 30 in the heat absorption portion 211 of the ring tube 21 is driven to the ring tube 21 under the action of the electrowetting effect. Exothermic section 212. The working liquid 30 exchanges heat with the substrate 20 in the heat releasing section 212 of the ring pipe 21. The cooled working liquid 30 is returned to the heat absorbing section 211 of the ring pipe 21 by the electrowetting effect to enter the next cycle'. The heat generated by the electronic component 300 is continuously taken away. The micro-liquid cooling device 200 can be fabricated by using micro-electromechanical system (MEMS) technology, and is suitable for miniaturization design, and can be used for small internal space 098145684 Form No. A0101 Page 8 of 18 0982077972-0 [0015] 201122403 Notes The electronic component 300 is dissipated in an electronic device such as a computer. In the micro liquid cooling device 2GQ, the electrowetting effect is used to actively carry the working liquid 30, * the amount of the working fluid (10) can be accurately controlled, and there is no mechanical transmission member like a pump, so that the micro The liquid cooling device 200 has a good mute effect. [0016] In summary, the present invention conforms to the patent requirements of the invention, and patents are filed according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0017] FIG. 1A and FIG. 1B are schematic diagrams showing the principle of electric coffee effect on a dielectric material, wherein FIG. 1A shows that the static contact angle of the droplet is 0 (8) &gt; 9 when no voltage is applied. Case; for the application of a constant voltage, the static contact angle of the droplet is 0 (V) < 9 O. [0018] Figure 2 is a schematic perspective view of the micro-liquid cooling device of the present invention. [0019] 3 is a cross-sectional view of the micro liquid cooling device shown in FIG. 2 along the line m (1) in the figure - and shows (4) a control circuit for supplying voltage to the electrode group of the micro liquid cooling device. [0020] FIG. 4 is an enlarged view of IV in FIG. [0021] [Main component symbol description] <The present invention> [0022] Micro liquid cooling device: 2〇〇[0023] Ring groove: 201 098145684 Form number A0101 Page 9/18 pages 0982077972-0 201122403 [0024] Substrate: 20 [0025] Loop: 21 [0026] Endothermic section: 211 [0027] Heat release section: 212 [0028] Liquid storage section: 213 [0029] Liquid injection hole: 214 [0030] Plug: 215 [0031] Hydrophobic layer: 216 [0032] Electrode group: 22 [0033] First electrode: 221 [0034] Second electrode: 2 2 2 [0 035] Dielectric layer: 23 [0036] Dielectric layer: 24 [0037] Electronic component: 300 [0038] Working liquid: 30 [0039] Control circuit: 40 [0040] Conductor: 41 [0041] <General knowledge> [ 0042] lower plate: 10 098145684 form number A0101 page 10 / total 18 page 0982077972-0 201122403 [0044] [0046] [0049] [0049] [0049] 基底 [0050] Base: 11 Lower electrode layer: 12 Insulation: 13 Droplets: 14 Upper electrode: 15 Switch: 16 Adjustable power supply: 17 Static contact angle: 0 (0), θ (ν) 098145684 Form number Α 0101 Page 11 / 18 pages 098207797 -0

Claims (1)

201122403 七、申請專利範圍： 1 . 一種微型液體冷卻裝置，包括一基板、一環管及複數電極 組，該環管設於該基板上，環管的首尾相連並於環管内形 成一封閉的迴路，該迴路中填充有工作液體，該複數電極 組設於基板上並沿環管的延伸方向呈間隔設置，每一電極 組包括一第一電極與一第二電極，該第一電極與第二電極 呈相對設置並將環管的管體夾設於該第一電極與第二電極 之間，環管的内壁設有一疏水層，第一電極與環管的外壁 之間及第二電極與環管的外壁之間分別設有一介電層。 2. 如申請專利範圍第1項所述之微型液體冷卻裝置，其中還 包括一控制電路，每一電極组的第一電極及第二電極與該 控制電路電連接，藉由控制電路規律性地對該複數電極組 施加電壓，驅動該工作流體在該環管内循環流動。 3. 如申請專利範圍第1項所述之微型液體冷卻裝置，其中該 環管上設有至少一儲液部。 4. 如申請專利範圍第3項所述之微型液體冷卻裝置，其中該 儲液部呈球形。 5 .如申請專利範圍第1項所述之微型液體冷卻裝置，其中該 基板上設有一環槽，該環管收容於該環槽内。 6.如申請專利範圍第1項所述之微型液體冷卻裝置，其中該 環管為採用濕蝕刻的方法自基板生長形成。 7 .如申請專利範圍第1項所述之微型液體冷卻裝置，其中該 環管圍成一矩形。 8 .如申請專利範圍第1項所述之微型液體冷卻裝置，其中該 環管具有一吸熱段及與該吸熱段相對的一放熱段。 098145684 表單編號A0101 第12頁/共18頁 0982077972-0 201122403 其中該 9 .如申請專利範圍第1項所述之微型液體冷卻裝置 複數電極組採用蝕刻的方法自基板生長形成。 Ο201122403 VII. Patent application scope: 1. A micro liquid cooling device comprising a substrate, a ring tube and a plurality of electrode groups, wherein the ring tube is arranged on the substrate, and the loop tubes are connected end to end and form a closed loop in the loop tube. The circuit is filled with a working liquid, and the plurality of electrodes are disposed on the substrate and spaced apart along the extending direction of the ring tube. Each electrode group includes a first electrode and a second electrode, and the first electrode and the second electrode And disposed oppositely between the first electrode and the second electrode, the inner wall of the ring tube is provided with a hydrophobic layer, the first electrode and the outer wall of the ring tube and the second electrode and the ring tube A dielectric layer is respectively disposed between the outer walls. 2. The micro-liquid cooling device according to claim 1, further comprising a control circuit, wherein the first electrode and the second electrode of each electrode group are electrically connected to the control circuit, and the control circuit is regularly A voltage is applied to the plurality of electrode groups to drive the working fluid to circulate in the loop. 3. The micro-liquid cooling device of claim 1, wherein the loop is provided with at least one liquid storage portion. 4. The micro-liquid cooling device of claim 3, wherein the liquid storage portion is spherical. 5. The micro-liquid cooling device of claim 1, wherein the substrate is provided with a ring groove, and the ring tube is received in the ring groove. 6. The micro-liquid cooling device of claim 1, wherein the collar is formed from a substrate by wet etching. 7. The micro-liquid cooling device of claim 1, wherein the ring tube encloses a rectangle. 8. The micro-liquid cooling device of claim 1, wherein the loop has a heat absorbing section and a heat releasing section opposite the heat absorbing section. 098145684 Form No. A0101 Page 12 of 18 0982077972-0 201122403 wherein the micro-liquid cooling device of claim 1 is formed by etching from a substrate by etching. Ο 098145684 表單編號A0101 第13頁/共18頁 0982077972-0098145684 Form No. A0101 Page 13 of 18 0982077972-0
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