TW201121760A - Method for manufacturing electronic/electric components for surface mounting. - Google Patents

Abstract

The object of the present invention is to provide a method for manufacturing surface-mounting electronic/electric components without the need of applying special mold(s) or surface treatment of metal components, with a simple process, and forming good adhesion between metal component(s) and thermoplastic resins formed of liquid crystal polymer and/or Poly(phenylene sulfide) (PPS) resin and inhibiting the formation of floating solder. The solution of the present invention is that in manufacturing surface-mounting electronic/electric components through application of injection molding to produce composites of thermoplastic resin formed of liquid crystal polymers and/or PPS resin and metal components, a mold is used in which at least a portion of the whole face of an inner surface of the mold where a metal component is in contact with the inner surface of the mold forms a thermal-insulating layer.

Description

201121760 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the component symbols of this representative figure: I. V. In the case of a chemical formula in the case, the chemical formula of the age of the most can be turned over. 6. Description of the invention: [Technical field of the invention] The invention relates to an electrical method for surface mounting. [Prior Art] In the past, a molding method such as insert molding, overmolding, or ring box molding was used to mold a thermoplastic resin to form a composite of a thermoplastic resin and an electronic component. The electronic component is widely used in home appliances. Products, information communication machines, automotive components, etc. / In recent years, as a method of assembling an electric or electronic component to form a product, in order to achieve labor saving by automation or a reduction in manufacturing cost, it is often carried out by a surface mounting method. Then, when the surface f is mounted, the electrical and electronic components are exposed to high temperatures. Therefore, it is suitable to use a liquid crystalline polymer or a polyphenylene sulfide resin which is excellent in heat resistance as a material for the surface and the electric rolled electronic component to be mounted. . However, the linear expansion ratio of the liquid crystalline polymer or the polyphenylene sulfide resin is 201121760, which is smaller than the other genus and is very:::, is greater than the metal, or is the processing temperature of the gold at a low temperature. The resin has a large shrinkage ratio after molding, and therefore, the metal member and the resin are well formed in the mold, and the formed molded product is also formed to reduce the adhesion between the metal member and the resin. In addition, especially in the liquid crystalline polymer, the processing temperature is very high, and the latent heat of melting becomes small. Therefore, the thermoplastic resin in a molten state and the low-temperature metal 7L member are in contact with the mold, and the thermoplastic surface of the metal member is rapidly solidified.丨生树月曰' In the production method of a conventional metal composite molded article, there is a problem that electrical and electronic components which are not easily adhered to the metal kneading member and the thermoplastic resin are excellent.纟Using 9-crystal polymerization, it is not necessary to use a hole electronic device for surface mounting such as polyphenylene sulfide resin, and it is easy to cause the metal component to fall off. 2 Gases and liquids (four) leaking from the interface occur. In addition, the adhesion between the genus-and the thermoplastic resin interface is insufficient, and therefore, the solder contained in the tin is impregnated by the capillary phenomenon to some micro-gap between the resin, and the metal component is contaminated, which is prone to problems. . The phenomenon called "flux floatation", such as poor soldering and poor operation, is such a situation. Therefore, it is strongly desired to improve the use of liquid crystalline polys or polyphenylene sulfide tree cages as a thermoplastic resin. The surface properties of the manufactured surface, the metal element of the main electronic component, and the thermoplastic resin are developed to prevent the occurrence of "fluxing floatation". : is a method for adhering a thermoplastic resin and a metal composed of a thermoplastic resin and a metal member, and it is proposed to use, for example, a stupid ethylene polymer, an ABS resin or a copolymer thereof, polyethylene, polypropylene, or the like in 201121760. Blow molding of olefin polymers, denatured polyphenylene ether resins, vinyl chloride polymers or copolymers thereof, polycarbonates, polyamides, polyesters, polyacetals, etc. by specific thermal conductivity A method of coating a part of a contact portion between a mold and a metal member with a heat resistant polymer (Patent Document 1). However, the blow molding method of the resin described in the example of Patent Document 1 eliminates a part of the contact portion of the mold and the metal member (bolt or nut) of the mold by the specific heat conductivity heat-resistant polymer. A method in which the ABS resin is poorly filled, and it is not easy to separate the metal element from the ABS resin; and the method of injection molding using a resin having good moldability such as a polyphenylene sulfide resin or a liquid crystal polymer is used. The problem of poor filling occurs, and therefore, the effect of improving the adhesion due to the elimination of the filling failure is not desired. Further, as a method for improving the liquid crystal polymer or the polyphenylene sulfide resin and the metal element, it is proposed to perform surface treatment of the metal element and polyphenylene sulfide by etching or the like, for example, by injection molding or the like. A method in which a thermoplastic resin such as a resin is composited to obtain a specific surface roughness (Patent Document | 2); or a holding device that holds a metal member and has a heating device and a cold device, while maintaining the temperature of the crucible After heating the metal element at a temperature lower than the temperature of the crystallization temperature (TC) of the thermoplastic resin, the injection molding is performed, and the cooling is rapidly cooled to 15 (the rc or less is taken out by the mold to extract the gold U and the thermoplastic resin. The method of forming 570 (patent document 3), etc. 201121760 However, in the method described in the special order, the method must be preceded by the surface + the metal element, and the surface is in the king. There is a problem in the application of the two-face treatment. In addition, it is contained in Patent Document 9. In its own law, even if it is about the metal of the molded product: = There is room for improvement in the adhesion of the plastic resin, such as: suppression of the occurrence of "fluxing floatation" occurs, because "flux floatation" is a disk mounted θ ± m -, , ·•疋 caused by metal and The problem of close contact with the thermoplastic resin is that the θ i and D 疋 are caused by the problem between the metal and the thermoplastic resin: the method described in the patent document improves the forming. (10) The metal element and the thermoplastic resin are tightly bonded, but it is easy, and there is a slight gap between the element and the thermoplastic resin. Therefore, the ',' method is used to suppress the flux from being easily caused by the capillary phenomenon. In the case of the method described in Patent Document 3, it is necessary to use a special metal component with a device, a device, and a cooling device, and to maintain the metal component. Costs 丨 need to maintain the complex temperature control of ' 'The manufacturing process of composite metal components and thermoplastic resin molded articles is cumbersome, and the mold and the 驹The problem of the temperature change of the rush is shortened, and the life of the mold is shortened. [Prior Art Document] [Patent Document 1] [Patent Document 1] 曰本特开平〇7 - 丨7 8 7 6 5 [Patent Document 2] International Publication [Patent Document 3] JP-A-2008-132756 (Patent Document 3) [Problem to be Solved by the Invention] The present invention has been made to solve the above problems; The surface treatment of a special mold or a metal component is not necessarily required, and the work process is simple, and the adhesion between the metal component and the thermoplastic resin composed of the liquid crystalline polymer and the polyphenylene sulfide resin is good, and the "fluxing float" is suppressed. A method of manufacturing electrical and electronic components for surface mounting. [Means for Solving the Problem] The inventors of the present invention have studied the problem in an exhaustive manner in order to solve the aforementioned problems. As a result, it has been found that a thermoplastic resin and a metal member composed of a liquid daily polymer and/or a polyphenylene sulfide resin can be composited by injection molding to produce an electric electronic component for surface mounting. The problem is solved by the use of a mold which forms a heat-dissipating layer on the inner surface of the mold, so that the present invention has been completed. The present invention specifically provides the following. (1): An electrical component for surface mounting. The method of manufacturing an electronic component is to use a mold in which at least the metal inner surface of the mold and the inner surface of the wedge member are in contact with each other to form a heat insulating layer, by injection molding. The thermoplastic metal component composed of the liquid::polymer and/or polyphenylene resin is composited. The surface mounting condition described in the method (1). The method for producing an electronic component is a thermoplastic resin which is composed of a liquid crystalline polymer. (2) The K method for surface mounting of the surface mounting device described in (1) or (7) is (4) (4) K or less. 6201121760 (4) The electric device for surface mounting according to any one of (1) to (3). The method for producing an electronic component, wherein the heat-insulating layer comprises a polyimide resin. (5) The electric device for surface mounting according to any one of (1) to (4). The electronic component manufacturing method is an electronic connector, a switch, a relay, a capacitor, a converter, and a coil. Axis' resistor, integrated circuit or light-emitting diode (UD). [Effect of the Invention] The liquid crystal polymer and/or the polyphenylene sulfide resin is used as the surface of the thermoplastic resin for the surface mounting of the electronic component. The interface between the metal component and the thermoplastic resin is obtained by the production method of the present invention. Good adhesion: the ruler can't provide a type of metal component that is not easily detached or a gas leaking from the interface, such as a leak of a liquid or an automobile component. In the case of the manufacturing method of the present invention, a mold having a holding device 4 having a heating device and a cold device to be placed is used. Therefore, the electrical and electronic components for surface mounting can be manufactured at low cost by a process that does not require the modification of the mold or the complicated temperature control of the ride. The electrical and electronic components for the surface mounting obtained by the manufacturing method of the present invention can be made to float under the condition of being dry and dry. Therefore, it is possible to use (4) the electrical and electronic components used in the mounting of the present invention, including the surface mounting = and the production of defective products in the manufacture of home appliances, information machines, automobile components, and the like. . [Embodiment] The following describes the embodiment of the present invention in detail. However, the present invention is not limited to the following embodiments, and may be appropriately added within the scope of the object of the present invention. Implemented as a change. The present invention is characterized in that the thermoplastic resin and the metal component composed of the liquid crystalline polymer and/or the polyphenylene sulfide resin are composited by injection molding, and the electronic component is manufactured. A mold that forms a thermal insulation layer on the inner surface of the mold is used. Hereinafter, the present invention will be described in the order of a thermoplastic resin, a metal element, a heat insulating layer, a molding method, and an electric/electronic component for surface mounting. [Thermoplastic Resin] In the specification and the patent application of the present application, the "thermoplastic resin" system and μ are materials of a thermoplastic resin alone, and i also means that various fillers and/or various additives are blended in the thermoplastic resin. A thermoplastic resin composition. The thermoplastic resin used in the present invention requires a high degree of resistance as an electrical and electronic component for surface mounting, and the load f degree is preferably 25. . . The above is more ideally 28 (Γ (: above. The load bending temperature can be the above range), and it is not easy to occur due to the metal element and the plasticity of the surface when the electrical and electronic components are mounted on the surface, the surface: the gap occurs. It is composed of a thermoplastic resin-based crystalline polymer and/or polyphenylene sulfide (10) resin used in the present invention because of deformation due to heat and the like. Therefore, it can be used by 8 201121760. A liquid crystalline polymer and/or a polyphenylene sulfide resin, and an electrical and electronic component which is excellent in moldability, electrical properties, and dimensional accuracy. x In liquid crystal polymer and polyphenylene In the thioether resin, the precision moldability is more excellent, 'fabrication is less likely to occur during molding, and it is more preferable to use a liquid crystalline polymer. In the present invention, the liquid crystalline polymer and/or polyphenylene sulfide is used. The resin may be used in combination with one or more other thermoplastic resins within a range that does not impair the object of the present invention. It may be combined with a liquid crystalline polymer and/or a polyphenylene. Specific examples of the thermoplastic resin of the ether resin include polyethylene polypropylene, polyamine, polycondensation, denatured polyphenylene, polyethylene terephthalate, polybutylene terephthalate,丨Vinyl phthalate, polyphenylene sulfide resin, polyimine, polyamidimide, polyether phthalimide polyether, polyether stone, polyether ketone, polyether ether ketone, fluorine A resin, a thermoplastic elastomer, etc. These thermoplastic resins can be used in combination of two or more kinds. [Liquid Crystal Polymer] The liquid crystalline polymer which is a thermoplastic resin in the present invention has a property of forming an optical anisotropic molten phase. The melt-processable polymer. The nature of the anisotropic molten phase can be confirmed by the conventional method of using orthogonal photons. More specifically, the confirmation of the anisotropic melt phase can be achieved by using Leitz. The polarizing microscope was carried out by observing the glazing sample placed on the Leitz hot stage at a magnification of 40 times in a nitrogen atmosphere T. The liquid crystalline polymer which can be applied to the present invention is examined between the crossed polarizers. For example, even melting The quiescent state is also optically showing an anisotropy in 201121760. The liquid crystal polymer is not particularly limited, and the most pregnant β-opening scented aromatic polyester or aromatic polyester decylamine is the same. The polyester system in the molecular chain which is partially scooped with aristocratic polyester or aromatic polyester decylamine is also located in the six's circumference. These systems are dissolved in pentafluorophenol at a concentration of 0.1% by weight at 60t. In the meantime, it is preferred to use a logarithmic viscosity (I.V.) having a viscosity of at least about 2.0 dl/g, more preferably 2 Å to [/g.] As an aromatic which can be applied to the liquid crystalline polymer of the present invention. The polyfluorene or aromatic polyacetamide is particularly preferably a repeating unit having two or more compounds selected from the group consisting of aromatic = hydroxy = carboxylic acid, aromatic hydroxylamine, and aromatic diamine. Aromatic eve and Fang 杳 聚 ® 日 或 方 方 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加 更加Or a polyester composed of two or more repeating units; (7) above, (8) from (4) aromatic thiol acid i or two kinds of derivatives thereof: Fangxiang dicarboxylic acid, alicyclic or more than two kinds, and (c) aromatic ... Wei and its biological ones and pots, your aroma - alcohol, alicyclic a polyester of a group diol, an aliphatic diol, and a living organism, or a polyester composed of (3) φ ® ώ 重复 repeating early; from (a) two or more aromatic hydroxy phthalic acids, (8) One kind of aroma or a scorpion, or two kinds of scorpion, a sulphate diamine and its derivatives, a sulphuric acid, a sulphuric acid, an alicyclic dicarboxylic acid, or a derivative thereof or two The above repeated list, mainly consisting of (a) Guanxiangbu _ 早 早 而 组成 复 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; (8) Cyclosylamine, aromatic diamine and its derivatives, or 10 201121760 2 or more, (_ 1 or 2 kinds of scented monocarboxylic acid, alicyclic quinone dicarboxylic acid and their derivatives And diol and its derivative and (<1) at least one or two or more repeating units of a scented diol, an alicyclic diol, and an aliphatic polyester guanamine J, and are used in combination Minutes; I. Further, the amount of the adjusting agent is required to be blended with the above-mentioned constituents. As a series of examples of a repeating succinic acid and a 6-integrated compound which can be used in the present invention, which can be applied to the liquid crystal polymer of BW, which is applicable to the present invention, is a ruthenium-based benzoic acid benzodiazepine "2_ An aromatic hydroxycarboxylic acid such as naphthoic acid; hydroquinone, —:, 4,4′-dihydroxybiphenyl, 2,6-dihydroxynaphthalene, 丄4-dihydroxynaphthalene, by the following formula (A) and the following general formula: one: an aromatic diol of a compound or the like; terephthalic acid, isophthalic acid, 2 bis-naphthalene dicarboxylic acid, a compound represented by the following formula (C) An aromatic dicarboxylic acid such as an amine dicarboxylic acid; an amine benzene test; or a p-phenylene diamine.

OH

X

OH (A) S〇2 (X: the base selected from the sub-base (C1~C4), the burning fork, a 0-, a s〇-~S-, a ¢0-).

• (B)

H〇〇C

Y-

COOH (C) is selected (Y: by -(CH2)n—(n=i ～4), —0(CH2)n〇~(n==i 11 201121760.) [Juben sulphur resin] The polyphenylene sulfide resin (polyphenylene sulfide resin) which can be used as the thermoplastic resin in the present invention contains a polyphenylene sulfide skeleton - (Ar-S-) - [in the chemical formula, the Λ γ system is stupid Homopolymers and copolymers. As the phenylene group (an Ar-), for example, ρ-phenylene group, m_stupyl group, anthracene-stupyl group, substituted stupid group (for example, C1) may be exemplified. — an alkylphenyl group having a substituent such as a 5-alkyl group or an aryl group having a substituent such as a phenyl group, P, P-diphenylene acid group, P, P′-biphenyl group a base, p,p, a monophenylene ether group, p,p-diphenylenecarbonyl, etc. The polyphenylene sulfide resin is in a phenylene sulfide group composed of such a phenylene group. It is possible to use a homopolymer of the same repeating unit, and in the aspect of the processability of the composition, it may be a copolymer containing a heterocyclic repeating unit. As a homopolymer, it is preferable to use ρ-stupid sulfur Ether group It is preferable to use a P-phenylene sulfide group as a main repeating early position and a combination of a fluorene-bonding group as a main repeating unit. In the copolymer containing the m-phenylene sulfide group in the repeating unit, it is more preferable to contain ρ _ benzene of 60 mol% or more in terms of physical properties such as heat resistance, moldability, and mechanical properties. The copolymer of the thioether group on the floor is particularly preferably a copolymer comprising a line of 70 mol% or more of ruthenium thiol group. The polysulfide resin can be a relatively low molecular weight linear line. The polymer 'is improved in melt viscosity by oxidative crosslinking or thermal crosslinking, and the polymer 12 is improved in the processability. It may also be a bifunctional property by polycondensation. High molecular weight of the linear structure: The material is preferably a linear linear structural polymer obtained by polycondensation from the viewpoint of the physical properties of the obtained molded product. Can be used: combination has 3 A branched or crosslinked polyphenylene sulfide resin polymerized on a functional group or a resin composition of the above linear polymer is blended with the resin: σ^子 as a polyphenylene sulfonate resin In addition to polyphenylene sulfonium or polypyrene (PBPS), polyphenylene sulfide ketone (ppsK), poly phenylene sulfide (PPSS), etc. can also be used. Polyphenylene sulfide resin It can be used singly or in combination of two or more. [Filling material] As an ideal example of a filler for thermoplastic resin, glass fiber, asbestos fiber, dioxoid fiber, dioxo, oxidized fiber, emulsified Fiber-filled material such as fiber, oxidized fiber, nitriding, nitrogen-cut fiber, fiber-cut =, titanic fiber, metal fiber, etc., '',,, graphite, cerium oxide, quartz powder, glass Granules, rolled glass, cut-off dimension, glass sphere, glass powder, 7 acid _, 11 acid, kaolin, talc, sticky, diatomite, ash, iron oxide, titanium oxide, oxidation, oxidation, two Cerium oxide, aluminum oxide, calcium carbonate, magnesium carbonate, calcium sulfate, sulfuric acid , Jin stone of anti divided particulate filler and mica, glass flake filler of silicon, silicon nitride, boron nitride, various metal powders and the like. These filler materials can be used in combination of two or more kinds of plates in various metal cases. The amount of the filler to be added to the thermoplastic resin is not particularly limited as long as it does not hinder the scope of the present invention. The thermoplastic resin is m parts by mass and the cultivating material is based on the 1 〇〇 旦 injury and the training is 20 〇 mass parts or less.

疋 100 parts by mass or less. L

[Additives] As a series of additives for thermoplastic resins, pigments such as inorganic calcined pigments, oxidizing agents, slip agents, mold release agents, and difficult-to-agents are widely used as a stabilizer and a plasticizer. ',』4 & Some additives can be combined with two kinds of [metal elements]. Two: The material of the metal element of the present invention is not particularly limited to metals such as copper, aluminum, iron, etc., 'month steel, stainless steel, etc. A combination of all kinds of different metals, such as an electric forged product. As a specific example of the state in which the material is stainless steel, the ferrous iron system, the Worthite iron system, and the like are not recorded. The shape of the metal element is not particularly limited as long as it can be combined with the thermoplastic resin by injection molding. The metal member can be roughened in advance for the surface of the portion contacting the thermoplastic resin to improve adhesion to the thermoplastic resin. The coarseness is also expressed by the average roughness (Rz) of 1 〇 and becomes 8#m to take 疋8~ especially 1 0 // m or more. The roughening treatment can be carried out by means of grinding, plating or etching. [Heat Breaking Layer] The method for manufacturing an electric/electronic component on the surface of the present invention uses at least a metal member on the inner surface of the mold and a part of the inner surface of the mold to form a heat insulating layer member and The stalk in the mold is formed by the entire surface of the metal enamel which is emitted into the touch, forming a heat-dissipating layer, and when the yam is formed, the metal element is improved during the drawing; And in the case of the metal element, after the 'degree of the dish', it is not easy to reduce the metal components and the surface of the grease and metal components of the thermoplastic resin of the J metal w-bovine. Curing, and, in the state of 丄, slowly slowing down, reducing the metal and tree 曰 by reducing the temperature drop of the metal component, the amount of shrinkage of the moxibustion and the resin is less than the 5 γ difference, and the metal component and the j note The tree is known to be sufficiently close to the surface, not to ... layered components. When the metal member is touched in the mold, the portion is rapidly cooled by the mold: 曰:: The effect of the present invention is obtained by the knife. Pieces, can not be filled in the present invention, the so-called "metal Qiu Ba # &&; 十 十 十 十 輭 輭 輭 輭 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十And - the king's land also contains the state of the scorpion by the current genus, and the 匕3 error is inevitably produced in the metal part... It is preferable that the area of the layer which is in contact with the inner surface of the wheel and which is in contact with the inner surface of the wheel is preferably more than or equal to the heat-insulating product of the inner surface of the mold and the metal element body. Above the surface of the part. ^Upper, especially preferably 98%. The thermal insulation layer is if the county table b % ^ i is enough to suppress the temperature drop and the thermosetting at the interface of the resin layer in the mold. In the present invention, the mold and the like are not particularly limited. The inner surface of the mold may be at least gold 15 201121760 is a 7L piece and the inner surface of the 4 mop is layered, but the entire surface of the contact portion is formed to form a fracture. In terms of aspect, it is preferable that the gold is the entire surface of the inner surface of A to form a heat break. In the present invention, the heat conductivity rate of the heat-dissipating layer which is particularly preferably 5W/the inner surface of the cookware is in the above-mentioned range two: the metal element can be sufficiently suppressed by adjusting the heat conduction of the heat-dissipating layer When the contact with the metal is reduced, the degree of adhesion between the metal component and the J-resin can be further improved. In addition, the thermal conductivity of the material of the thermal insulation layer can be obtained by laser Ρ/3 | & The first method is used to determine the thermal diffusivity, and the specific gravity is measured by the Archimedes method, and W is $4*, and the calorimeter (DSC) is used to determine the specific heat, and the thermal conductivity is calculated. In the case of injection molding, a high-temperature thermoplastic material is introduced into the mold, and the heat-insulating layer must have heat resistance at a high temperature during molding. As an electrical and electronic component for surface mounting of the present invention. The material of the heat-dissipating layer to be used in the production method is more preferably a polyimine resin. The heat conductivity of the above-mentioned polyimide resin is 5 W/m. κ or less is also sufficiently tolerated in injection molding. High temperature heat resistance As a specific example of the polyimine resin which can be suitably used in the present invention, a series of pyromellitic acid (PMDA)-based polyimine, a biphenyltetracarboxylic acid-based polyimine, and a stearic acid are used. Polyammonium imine, bismaleuric acid imide resin (bi-maleic anhydride imide/triazine, etc.), benzophenone tetracarboxylic acid polyimine, acetylene terminal poly Amine, thermoplastic polyimine, etc. 16 201121760 These polyimine resin systems can be combined with two kinds of materials, and can be combined with a material such as a heat-dissipating layer, for example, tetrafluoroethylene resinized. The method of forming a thermal insulation layer on the inner surface of the mold is not particularly limited, and for example, a precursor of a polymer which can form a polymer thermal insulation layer is used. The solution is applied to the surface of the mold, and the solvent is evaporated, and the force is applied to the sputum. The method of polymerizing, heating the layer of the yttrium imide film, etc.; or — y Λ Λ 18 2 test, treatment plating and polymerization resistance to the south of the child, such as the stupid four 4-anhydride and 4 ',,, f ... method and the like. For the mold of the planar shape, it is also possible to: use the two-substrate heat-dissipating film, and use the appropriate joint to use the split-by-part method, or the 曰:--- Molecular heat-insulating film, the method of holding 'to form a heat-dissipating layer, etc., and: the requirement can be after the formation of the broken gourd, #...the hot layer. In addition, the 'TiN film is also formed. Chromium (Cr)臈Or nitrogen [forming method] In the present invention, the electroforming method for manufacturing the surface mounting is 's β — , the resin is a composite metal shell and the thermoplastic is formed, and the outer surface is not particularly limited. (4) Various methods such as dip forming, hoop forming, etc. When the method of the present invention is formed, the metal element 彳Wr*^ is used for electrical. The electronic component of the electronic component is heated first. The temperature of the metal metal component is preferably 1. The warfare and the more 17 201121760 are preferably 14 〇 25 (TC). The adhesion between the metal component and the thermoplastic resin can be further improved by preheating the metal component. The invention is used for manufacturing surface mounting In the case of electrical and electronic components, the injection molding conditions are not affected by the object of the present invention, and the type of the thermoplastic resin to be used and the shape of the electrical and electronic component for surface mounting can be considered. * The injection molding conditions are appropriate: selection. In the present invention, the electrical and electronic element mold temperature for mounting the surface is not particularly limited insofar as it does not hinder the object of the present invention, but it is preferably 50 to 160. °c, more preferably 110 to 15 (TC, particularly preferably 疋13::15 (rc.) The adhesion of the metal member to the thermoplastic resin can be more improved by setting the mold temperature within the aforementioned range. Electrical and electronic components for armoring] The surface cream component manufactured by the method of the present invention is a composite of an electrical and electronic component for surface mounting of a metal crucible, and is made of a watch. (2) The temple is not limited. As an example of the method of the present invention, a series of connectors, switches, electrical and electronic components are used to lift electricity, relays, capacitors, converters, integrated circuits, and transformers. Change, 丄I change "circle shaft, electricity - double exchange benefit, light-emitting diode (LED), etc. Hunting from the component of the invention is a metal component #: manufacturing surface for electrical installation. Electronics are prone to metal components The adhesion of the resin is good, therefore, the gas which is not tolerated by the interfacial gap or the method of the invention from the metal element and the thermoplastic tree is used for the surface and the surface of the surface. The use of electrical and electronic components, into the 18 201121760 line surface mounting, and fully suppress the "fluid float" on the surface made by the method of the present invention.... Electronic components for surface mounting electrical. The power raft method is not particularly limited to the various methods that have been known. As a result, many parts can be made, and, because the / method is not only an unnecessary part of the mouth, it is particularly suitable to use the remelting method. ..., soldering of the inch, in the glare method, in the solder 'use of the tin powder (" tear. As a series of components contained in the solder (=: knife (8), gluten, (C) active agent, (4) thixotropy The solder may additionally contain an anti-detergent, a chelating agent, and the like. The various additives are preferably used as a specific example of the (a) resin component, which is natural rosin, polymerized rosin, hydrogenated rosin, Non-uniform rosin, succulent scented denatures, rosin, polyamide, polyester, phenoxy resin, crucible resin, etc. As a specific example of (7) solvent, ethylene glycol monohexyl _ , diethylene glycol monobutyl scale, hexyl glycol, octane diol, ethyl hexyl glycol, benzyl alcohol, U-butyl diol, U-butyl diol, 2 ( 2 -Bubutyloxyethoxy)ethanol, alcohol such as box alcohol; benzoic acid butyl vinegar, adipic acid diacetic acid, 2-(2-"oxyethoxy)ethyl acetate vinegar Vinegar; hydrocarbons such as 12x, tetradecene; N-methyl-2... ketones in various hospitals, etc. The type of solvent can match the melting temperature of the solder paste. Moderately selected.": (C) Specific examples of active agents are amines (diphenyl-n-naphthylamine, mono-amine, triethanolamine, monoethanolamine, etc.), amine salts (Eg. II 19 201121760) An organic acid salt such as a polyamine such as an amine or a cyclohexylamine or an amine such as ethylamine 'diethylamine; or an inorganic acid (inorganic acid such as hydrochloric acid or sulfuric acid); or an organic acid (amber hexanoic acid, a dicarboxylic acid such as glutaric acid, sebacic acid or maleic acid; a fatty acid such as myristic acid, palmitic acid, stearic acid or oleic acid; lactic acid, di-light methylpropionic acid, malic acid, etc. By base acid; benzoic acid, phthalic acid, trimellitic acid, etc., amino acids (glycine, alanine, aspartic acid, glutamic acid, valine, etc.) Specific examples of the solder powder of the tin paste are _Ag system, Sn-Ag-Cu system, Sn-Ag-Bi system, Sn-snake-μ 糸, Sn-Ag-Cu-In system, Sn-red, -s system, Sn_Ag_Ci - N, Ge system, Sn system, Sn-Pb system, Sn-pb_A", Sn_p丨-Bl system, In_Pb system, Pb-Ag system, sn-red system, such as -~ system, Sn- Zn system, Sn-Sb The conditions such as the temperature rise time and the wave-degree of the surface mounting of the electrical and electronic components manufactured by the method of the present invention by the method of the present invention are not particularly limited, and can be matched. The type of solder used, the type of electrical and electronic components used for surface mounting. "The method of y to manufacture gold. Electronic components, but by including surface, information communication equipment, as above, can be used When the composite molded article of the present invention is used, the occurrence of "flux floatation" in the surface mounting of an electric surface for surface mounting is reduced, and the manufacturing process is reduced to reduce the occurrence of defective products in the manufacture of automotive components and the like. . [Embodiment] 20 201121760 In the following, the present invention will be described in more detail based on the embodiments, but the present invention is not limited by these examples. <Material> Liquid crystal polymer: Hew metal insert manufactured by Polyplastics Co., Ltd.: Copper lead frame <Example 1 > (Formation of heat-dissipation layer): The mold system is used to hold the metal insert. The mold 6 was treated at 250 C after the ride was held/coated with the polyimine resin varnish uniformly on the entire surface of the work chamber. Minutes form a thermal insulation layer. The film thickness of the thermal insulation layer is determined by measuring the difference in size between the formation of the thermal insulation layer and the formation of the thermal insulation layer after the formation of the thermal insulation layer. (Formation of metal composite molded article): Table 1. The injection molding conditions were carried out, and the injection molding machine (manufactured by Sodlck Co., Ltd., TR-side) was used, and the metal composite molded article was injection-molded at a mold temperature of 12 generations. The resin adhesion area of the metal embedded member of the obtained metal composite molded article was measured by the following method. The resin adhesion area is described in Table 2. [Method for Measuring Resin Adhesion Area] Metal inserts are used to remove metal inserts, and digital cameras are used: Photographic resin attachment parts are used in photo editing software (Adobe (Registry & Photoshop)) For the metal surface and the resin adhesion portion, after the value processing, the number of pixels (Pixel) of the attachment portion of the crucible (four) is compared with the number of pixels around the area to calculate the area. 21 201121760 [Table 1] Cylinder set temperature: 350 〇C Spiral rotation number 150 rpm Ejection speed: 100 mm/sec (remelting treatment) Solder paste (Mechanical Co., Ltd., M705) is applied to the metal composite molded product. GRN360 — K2 — V), using an IR remelting device (manufactured by Nippon Pulse Research Co., Ltd., RF-33〇), with a preheating temperature of 2〇〇t and a remelting temperature of 270°C. Remelting treatment, the surface is mounted on the substrate. The flux penetration area of the lead frame I after the re-dissolution treatment was measured by the following method. The flux penetration area is shown in Table 2. [Measuring method of flux penetration area] The metal composite molded article is used to remove the metal insert, and the solder attachment portion is photographed by a digital camera, and the photo editing software (Μ*(registered trademark), Photoshop (registered trademark), E丨e_ts), after the binarization of the metal surface and the flux adhesion portion, the number of images of the m-tank adhesion portion is calculated by comparing the number of pixels around the lmm2. [Example 2 > In addition to the metal inserts installed in the mold, .^ ^ job v 1 dry person with hot air for 20 seconds, after heating the metal insert to about 2 〇〇t, and finally 4 a butyl injection forming outside The formation and re-treatment of the Resin metal composite 5 molded article. The resin deposition and the ruthenium impregnation area of the metal ruthenium composite product obtained in Example 2 are described in Table 2. [Example 3] > In addition to the mold temperature of 150, more than eight are the same as the forming and refining treatment of the molded article of Example 1 22 201121760. In the examples; the resin adhesion area and the flux impregnation area of the two-two molded article, § It is contained in Table 2. Example 4 > In addition to the mold temperature being ^ ' and 'in the metal insert mounted on the mold, blowing hurricane 9 ^.", several 20 and clock, after heating the metal insert to about 200 C, In addition to injection molding, 撕 "Tears the same as in Example 1 to form a metal composite molded article, and the air/melt-melting treatment. The metal composite molded article obtained in Example 4 is attached to the furnace." /. The area of the mouth of the tree and the flux penetration area are described in Table 2. <Comparative Examples 1 and 2> Except that the mold was not provided with a layer of the screen and the temperature of the cooker was the temperature described in Table 2, the metal composite molded article was formed in the same manner as the embodiment. Heavy cuisine. The resin adhesion area and the flux penetration area of the metal composite molded article obtained in the comparative example are described in the table.

------ t酝 imine film thickness (//m) Example 1 20 2Π γϊϊ5Γ3 实施 Example 4 ΐComparative example 1 Metal lug 5 mouth thermal resin attachment surface borrowed 120 益# »*> Π Q UJ\J ”20 ~β~ 150 ------- Μ. L 20 150 0 120 No 0 — __25〇__ im- ^ q 々贝ui uiiiii y flux penetration area (face 2) U · J 0.6 1. 2 0 1.1 〇1.1 π 0 Λ 〇0 U U. ο 1. 2 — J u 椚 1 and 2 are compared: by forming a polyimine yt in the mold Also a) ice wood as a heat-dissipating layer, and enlarge the resin to the resin embedded area of the metal insert, the pre-precision is to greatly improve the metal insert of the metal composite molded article and the dense plastic-man-made resin Synergy. Further, 23 5 201121760, it is also known that the metal composite molded articles of Examples 1-4 to 4 which were produced using the mold forming the heat-dissipating layer were compared with the metal composite molded articles of Comparative Examples 1 and 2, after the re-dissolution treatment. The flux impregnation area is narrowed, which greatly improves the problem of "fluxing floatation" during surface mounting. In addition, it is known that by comparing the first embodiment and the third to fourth embodiments, the temperature of the metal insert and/or the mold is increased (150%) before the injection molding, and the gold is further increased. The adhesion of the composite film of the rot composites further improves the problem of "flux quenching" during surface mounting. [Simple description of the diagram] 〇 〇 [Main component symbol description] 〇 24

Claims (1)

201121760 VII. Scope of application for patents: 1. A method for manufacturing at least the entire phoenix] electronic surface of the inner surface of the mold, so that the metal element and the inner part of the mold form a thermal insulation layer. ——/, 1 The surface-contacting polymer and/or the polystyrene are formed by injection molding to form a composite of the sulfhydryl resin by the liquid crystal. 'The thermoplastic resin and gold 2', as in the manufacturing method of the component of the item i of the scope of the patent application, which is composed of ... electrical and electronic components. The thermoplastic resin just described is composed of liquid crystalline poly 3. The surface of the application of the scope of the article "the manufacturing method of the electronic component, the electrical rolling of the package. _ κ ν ', the thermal conductivity of the thermal insulation layer 5W/m . Κ 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The invention relates to a polyimine resin. 5. In the method of manufacturing an electronic component for the surface mounting of the patent 軏 軏 帛 , , , , 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气 电气Μ, relays, capacitors, inverters, coil shafts, resistors, integrated circuits or light-emitting diodes (LEDs) 25 201121760 IV. Designated representative drawings: (1) The representative representative of the case is: No. (2) Ben A simple description of the symbol of the representative figure: I. V. In the case of a chemical formula, the 'the most advanced age-turned chemical formula 〇6. The invention: (Technical field of invention) The invention of the electronic component is related to a surface [Electrical Manufacturing Method] [Previous Art] Electrical and electronic components manufactured by molding a thermoplastic resin to form a thermoplastic resin and an electronic component by a molding method such as insert molding, overmolding, or ring box molding. It is widely used in home electric appliances, information communication equipment, automotive components, etc. / In recent years, the method of assembling electrical and electronic components into products has been achieved in order to achieve labor saving by automation or reduction in manufacturing cost. This is carried out by the surface mounting method. Then, when the surface f is mounted, the electrical and electronic components are exposed to high temperatures. Therefore, it is suitable to use a liquid crystal having good heat resistance as a material for the surface and the electric rolled electronic component to be mounted. Polymer or polyphenylene sulfide resin. However, the linear expansion ratio of liquid crystalline polymer or polyphenylene sulfide resin