201118939 六、發明說明： c 明所屬冬奸領j 發明領域 本發明係有關於一種適合於切削封裝基板的切削裝置 及使用該切削裝置之切削方法。 C ittr ΦΗτ 發明背景 舉例言之，於半導體封裝件之製造程序中’業已形成 LSI等電路之複數半導體晶片係於裝上引線框架而接合 後，藉由利用玻璃環氧樹脂等樹脂來封裝，形成CSP(晶片 尺寸封裝，Chip Size Package)基板等封裝基板。 封裝基板係具有形成為格子狀之分割預定線，且藉由 矛J用切削裝置沿著分割預定線切削封跋基板，分割成與半 導體晶片大致相同尺寸之CSP等半導體封裝件。 切削封農基板之切削裝置包含有：保持台，係吸引保 持封裝基板者；及切削機構，係具有切削刀片，且該切削 刀片係切削保持於保持台之封裝基板者（例如參照日本專 利公開公報特開2001-24003號公報）。 切削裝置之保持台係由夾具基座及保持夾具所構成， 且前述失具基座係裝人切肢置，並與㈣源連接，前述 保持夹具係以可卸下方式配置於夾具基座上。保持夾具係 於對應於所載置封裝基板的分割預定線之領域具有切削刀 片用退刀槽，且於藉由退刀槽劃分之各領域具有吸引孔。 在如工不同的半導體封裝件尺寸之封裝基板時，藉由 201118939 父換成應加工封裝基板專用之保持夾具，而可藉由一二士 削裝置加工複數種類之封裝基板。 D刀 +另-方面，於各個半導體封裝件會形成複數電極，若 沿者分割預定線㈣封裝基板，則於半導體封 : (切斷面）會露出複數電極。 先行技術文獻 專利文獻 〔專利文獻1〕特開2〇01_24003號公報 t 明内】 發明概要 發明欲解決之課題 右鞛由切削刀片切削封裝基板 ，-、4.八…叩屯W則時產生 加工熱，電極會朝切削方向延伸而到達鄰 發生短路之問題。X，藉由加工熱’於半導體封裝件之 畏兩面側會大幅地產生被稱作剝離之切口或裂痕。 本發日縣有鑑於此點而完成，其目的在提供—種可 極之延伸或剝離、裂痕之產生等不良 置及切削方法。 的切削 用以欲解決課題之手段 削裝Ϊ藉由如申請專利範圍第1項之發明，則可提供一種 :，糊裝置包含有：保持台’係保 置=裝基板係於藉由分割預定線劃分之複數領域;別 疋件’同時由樹脂封裝者；及切削機構1 ，且該切削刀片係切削由該保持台保持之封裝美板者 4 201118939 該保持台係由保持夾具及夾具基座所構成，且前述保持夾 具包含有：保持面，係保持該封裝基板者；複數切削刀片 用退刀槽，係形成於與保持在該保持面的封裝基板之分割 預定線相對應之位置者；及複數吸引孔，係形成於藉由該 切削刀片用退刀槽劃分之各領域者；前述夾具基座包含 有：負壓傳達部，係將負壓傳達至該吸引孔者；及載置面， 係載置該保持夾具者；又，該保持夾具係具有於該切削刀 片用退刀槽開口之流體喷出孔，且該夾具基座係具有與該 流體噴出孔連通並與流體供給源連接之流體供給路。 若藉由如申請專利範圍第2項之發明，則可提供一種切 削方法，該切削方法係使用如申請專利範圍第1項之切削裝 置來切削封裝基板者，又，具備以下步驟，即：於前述保 持台上載置封裝基板者；使前述吸引源作動而藉由該保持 台吸引保持該封裝基板者；及藉由前述切削刀片切削由該 保持台吸引保持的該封裝基板之前述分割預定線，同時使 前述流體供給源作動，並自前述流體喷出孔將流體供給至 前述切削刀片用退刀槽而冷卻該切削刀片者。 發明效果 依據本發明，由於在封裝基板之切削中流體會供給至 切削刀片用退刀槽中，因此，切削刀片可藉由流體冷卻而 防止加工熱之上升，並防止不良之產生。 圖式簡單說明 第1圖係封裝基板之平面圖。 第2圖係放大顯示封裝基板之局部側視圖。 201118939 第3圖係切削裝置之局部切斷立體圖。 第4(A)圖係第⑸施形態之保持爽具之平面圖，第*⑻ 圖係搭載於保持基座上的第1實施形態之保持失具之縱截 面圖。 八 第5⑷圖係第2實施形態之保持央具之平面圖，第· 圖係搭載於保持基座上的第2實施形態之保持失具之縱截 面圖°201118939 VI. Description of the invention: c. The present invention relates to a cutting device suitable for cutting a package substrate and a cutting method using the same. Cittr ΦΗτ BACKGROUND OF THE INVENTION In the manufacturing process of a semiconductor package, a plurality of semiconductor wafers in which a circuit such as an LSI has been formed are bonded to a lead frame and then packaged by using a resin such as glass epoxy resin. A package substrate such as a CSP (Chip Size Package) substrate. The package substrate has a predetermined dividing line formed in a lattice shape, and the sealing substrate is cut along the dividing line by the cutting device by the spear J, and is divided into semiconductor packages such as CSP having substantially the same size as the semiconductor wafer. The cutting device for cutting a sealing substrate includes: a holding table that attracts and holds the package substrate; and a cutting mechanism that has a cutting insert that is cut and held by the holding substrate of the holding table (for example, refer to Japanese Patent Laid-Open Publication) JP-A-2001-24003). The holding platform of the cutting device is composed of a clamp base and a holding clamp, and the dislocation base is mounted on a cutting body and connected to the source, and the holding clamp is detachably arranged on the clamp base. . The holding jig has an undercut for the cutting blade in the field corresponding to the planned dividing line of the mounted package substrate, and has suction holes in each of the fields divided by the undercut. In the case of a package substrate having a different semiconductor package size, a plurality of package substrates can be processed by a one-two-saw device by replacing the holder for the package substrate with a handle for the 201118939. In the D-blade + other aspect, a plurality of electrodes are formed in each of the semiconductor packages, and if the substrate is divided by a predetermined line (4), the plurality of electrodes are exposed on the semiconductor package (cut surface). For the purpose of solving the problem of the invention, the package substrate is cut by a cutting insert, and -, 4. 8 ... 叩屯W is processed. Heat, the electrode will extend in the cutting direction to reach the problem of short circuit in the neighborhood. X, by processing the heat on the both sides of the semiconductor package, a slit or crack called a peeling is largely produced. This is done in view of this point, and its purpose is to provide a method of cutting and cutting, such as extreme extension, peeling, and cracking. The cutting is used for the purpose of solving the problem. By the invention of claim 1, the paste device comprises: the holding device: the holding device is mounted on the substrate by dividing the predetermined The plural field of line division; the other part is 'packaged by the resin at the same time; and the cutting mechanism 1 , and the cutting insert is cut by the holding plate. 4 201118939 The holding stage is held by the holding fixture and the clamp base The holding jig includes: a holding surface for holding the package substrate; and a plurality of undercut grooves for the cutting insert formed at a position corresponding to a predetermined dividing line of the package substrate held by the holding surface; And the plurality of suction holes are formed in each of the fields divided by the undercut by the cutting insert; the clamp base includes: a negative pressure transmitting portion that transmits a negative pressure to the suction hole; and a mounting surface And holding the holding jig; further, the holding jig has a fluid ejection hole in the opening of the cutting blade, and the jig base has a fluid communication hole and a fluid A fluid supply path to which the supply source is connected. According to the invention of claim 2, there is provided a cutting method which uses a cutting device according to claim 1 to cut a package substrate, and has the following steps: a holder for placing the package substrate on the holding stage; the suction source is activated to suck and hold the package substrate by the holding stage; and the cutting line is used to cut the predetermined dividing line of the package substrate sucked and held by the holding stage, At the same time, the fluid supply source is actuated, and the fluid is supplied from the fluid discharge hole to the undercut groove for the cutting insert to cool the cutting insert. EFFECTS OF THE INVENTION According to the present invention, since the fluid is supplied to the undercut groove for the cutting insert during the cutting of the package substrate, the cutting insert can be prevented from rising in processing heat by fluid cooling, and the occurrence of defects can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of a package substrate. Figure 2 is a partial side elevational view showing the package substrate in an enlarged manner. 201118939 Fig. 3 is a partially cutaway perspective view of the cutting device. Fig. 4(A) is a plan view showing the holding device of the fifth embodiment, and Fig. 4(8) is a longitudinal cross-sectional view showing the holding failure of the first embodiment mounted on the holding base. VIII. Fig. 5(4) is a plan view of the holding mechanism of the second embodiment, and Fig. 5 is a longitudinal sectional view of the holding device of the second embodiment mounted on the holding base.
【實施方式J 用以實施發明之形態 以下，參照圖式，詳細地說明本發明之實施形態。參 照第1圖，顯示構成本發明切削方法之對象的封裝基板之一 例之平面圖。封裝基板2係具有例如矩形狀之金屬框架4, 且於藉由金屬框架4之外周剩餘領域5及非元件領域化所圍 繞之領域，存在有圖示例中為3個之元件領域6a、6b、6c。 於各元件領域6a、6b、6c中，劃分出複數元件形成部 10，且該等元件形成部10係藉由縱橫地設置成相互呈正交 之第1及第2分割預定線8a、8b來劃分，並於各個元件形成 部10形成複數電極12。 各電極12彼此係藉由業已成型於金屬框架4之樹脂來 絕緣。藉由切削第1分割預定線8a及第2分割預定線8b，於 其兩側顯現各元件之電極12。 如第2圖所示，於元件領域6a、6b、6c之各元件形成部 10之裏面形成元件14，並連接業已加入各元件14之電極與 電極12。又，元件領域6a、6b、6c之各元件係藉由樹脂來 6 201118939 封農’並於各元件領域6a、6b、6C之裏面形成樹脂龍部. 參照第3圖，顯示適合於切削封裝基板2的切削裝置 之局部切斷立體圖。切削裝置20包含有爽具美座^ ^ 失具基座22係具有吸引路24及流體供給路％，又， 人 具28係吸引保持於财具基座22，並構成保持㈣(參^ 4(B)圖）。 於切削裝置20配置有切削機構(切削單元)34,且哕切削 機構34係構成為於心軸31之前端部裝設切削刀片。再 者，配置有定線機構36,且該定線機構36係檢測封裝基板2 之應切削分割預定線，並可與切削單元3 4 —體地朝γ軸方向 及z軸方向移動。定線機構36包含有由顯微鏡及ccd攝影機 等所構成的拍攝機構38。 參照第4(A)圖，顯示第1實施形態之保持夾具28之平面 圖。第4(B)圖係構成為將保持夾具28搭載於夾具基座22上 的第1實施形態之保持台30之縱戴面圖。 保持夾具28包含有：保持面28a，係保持封裝基板2者； 複數切削刀片用退刀槽40,係形成於與保持在保持面28a的 封裝基板2之分割預定線8a、8b相對應之位置者；及複數吸 弓丨孔42，係形成於藉由切削刀片用退刀槽4〇劃分之各領域 者。再者，於至少一個切削刀片用退刀槽40之底部形成流 體噴出孔44，且該流體喷出孔44係喷出切削液、冷卻空氣 等流體。 如第4(B)圖所示，將保持夾具28搭載於失具基座22 上，並透過電磁切換閥48，將形成於夾具基座22之夾具用 201118939 :=46與吸引源5。連接，且使吸师。作動而使負 =_負壓傳達部46，藉此，保持夫具28係吸引 保持於夾具基座22。 各吸引孔42係透㈣已形缺夹减座2&負 Γ2、°及引路24及電磁切換_而與吸引源料接，因此 ^封裝基板2定位、搭胁保料㈣上，麵電磁切招 技刀換至連通位置’且將負壓傳達部η與吸引源测 則封裂基板2係吸引保持於保持爽具28。 、、形成於切削刀片用退刀槽4〇之底部的流體喷出孔州系 透過業已形成於爽具基座22之流體供給路26、電磁切換闊 56而與流體供給源58連接’依此，若將電仙換閥56切換 至連通位置’並使來自流體供給源58之流體自流體噴出孔 44噴出，職體會供給至各切肖,!刀片祕刀槽4〇内。 2、以下，說明於依此所構成的保持台3〇上搭載封裝基板 2並將封裝基板2分成各個半導體封裝件之情形。透過 保持夾具28由保持台30保持的封裝基板2係藉由將保持台 3〇朝+Χ轴方向移動而定位在拍攝機構38之正下方，且藉由 拍攝機構38拍攝應切削領域’並藉由定線機構％檢測分割 預疋線8a或8b。在結束定線後，將切肖，丨刀片32朝丫軸方向移 動並進行分割預定線8a*8b與切削刀片32之Y軸方向之定位。 ”自流體喷出孔44喷出流體，且一面將流體供給至各切 削刀片用退刀槽4〇内，一面藉由切削刀片32切削業已定位 之刀割預疋線8a或8b。於該切削時，切削刀片32係嵌入切 削刀片用退刀槽4〇内’由於退刀槽蝴充滿流體，因此， 8 201118939 切削刀片32係藉由流體冷卻而防止加工熱之上升，且可防 止電極朝切削方向延伸而與鄰近之電極接觸所發生的短路 等不良之產生。供給自流體供給源58之流體可考慮業已冷 卻之純水等切削液或冷卻空氣等。 參照第5(A)圖，顯示本發明第2實施形態之保持夾具 28A之平面圖。第5(B)圖係構成為將保持夾具28a搭載於夾 具基座22上的第2實施形態之保持台3〇A之縱截面圖。 本貫施形態之保持夾具28A係流體噴出孔44於所有朝 縱橫延伸之切削刀片用退刀槽4〇之交叉點開口，依此，於 本實施形態中，可普遍地將冷卻用流體供給至所有切削刀 片用退刀槽40内。本實施形態之保持台惠之其他構造係與 第4圖所示之第丄實施形態相同。 於第5圖所示之實施形態中，將流體喷出孔44設置於所 ，然而，亦可作成未使流 體喷出孔鄉㈣交錢越喷纽做置於複 數處之交叉點。又，亦可作成 X&切削刀片用退刀槽40之側 面形成流體嘴出孔44。 , 田於冷卻用流體係透過流體喷 出孔44而供給至切削刀片用 疋刀槽4〇中，因此，於封裝基 板2之切削中嵌入保持夾具28、 之切削刀片用退刀槽40 中的切削刀片32係一面藉由八欠 γ卹用流體冷卻一面執行切 削。依此，可防止加工熱之產 生生’且可防止因切削時產生 之加工熱，使電極朝切削方 伸而與鄰近之電極接觸所 發生的短路等不良之產生。 201118939 【圖式簡單說明】 第1圖係封裝基板之平面圖。 第2圖係放大顯示封裝基板之局部側視圖。 第3圖係切削裝置之局部切斷立體圖。 第4(A)圖係第1實施形態之保持夾具之平面圖，第4(B) 圖係搭載於保持基座上的第1實施形態之保持夾具之縱截 面圖。 第5(A)圖係第2實施形態之保持夾具之平面圖，第5(B) 圖係搭載於保持基座上的第2實施形態之保持夾具之縱截 面圖。 【主要元件符號說明】 2...封裝基板 4.. .金屬框架 5.. .外周剩餘領域 5a...非元件領域 6a，6b，6c...元件領域 8a...第1分割預定線 8b...第2分割預定線 10.. .元件形成部 12.. .電極 14.. .元件 16.. .樹脂封裝部 20.. .切削裝置 22.. .夾具基座 24.. .吸引路 26.. .流體供給路 28，28A...保持夾具 28a...保持面 30，30A...保持台 31·.·心軸 32…切削刀片 34…切削機構(切削單元） 36.. .定線機構 38.. .拍攝機構 40.. .切削刀片用退刀槽 42.. .吸引孔 44.. .流體喷出孔 46.. .夾具用負壓傳達部 48，54，56...電磁切換閥 50.. .吸引源 52.. .負壓傳達部 58.. .流體供給源 10[Embodiment J] Mode for Carrying Out the Invention Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to Fig. 1, there is shown a plan view showing an example of a package substrate constituting the object of the cutting method of the present invention. The package substrate 2 has, for example, a rectangular metal frame 4, and in the field surrounded by the remaining area 5 of the metal frame 4 and the non-element field, there are three element fields 6a, 6b in the illustrated example. , 6c. In each of the element regions 6a, 6b, and 6c, the plurality of element forming portions 10 are defined, and the element forming portions 10 are provided by the first and second dividing planned lines 8a and 8b which are vertically and horizontally arranged to be orthogonal to each other. The plurality of electrodes 12 are formed in the respective element forming portions 10. Each of the electrodes 12 is insulated from each other by a resin which has been molded into the metal frame 4. By cutting the first dividing line 8a and the second dividing line 8b, the electrodes 12 of the respective elements are displayed on both sides. As shown in Fig. 2, the elements 14 are formed inside the element forming portions 10 of the element regions 6a, 6b, 6c, and the electrodes and electrodes 12 which have been added to the respective elements 14 are connected. Further, each of the element fields 6a, 6b, and 6c is formed of a resin to form a resin dragon in the inside of each component field 6a, 6b, and 6C. Referring to FIG. 3, it is shown that it is suitable for cutting a package substrate. A partial cutaway perspective view of the cutting device of 2. The cutting device 20 includes a cool seat ^ ^ The pedestal base 22 has a suction path 24 and a fluid supply path %, and the person 28 is attracted and held by the pedestal base 22, and is configured to hold (4). (B) Figure). A cutting mechanism (cutting unit) 34 is disposed in the cutting device 20, and the weir cutting mechanism 34 is configured to mount a cutting insert at a front end of the mandrel 31. Further, the alignment mechanism 36 is disposed, and the alignment mechanism 36 detects the planned cutting division line of the package substrate 2, and is movable in the γ-axis direction and the z-axis direction integrally with the cutting unit 34. The alignment mechanism 36 includes an imaging mechanism 38 composed of a microscope, a ccd camera, and the like. Referring to Fig. 4(A), a plan view of the holding jig 28 of the first embodiment is shown. The fourth (B) diagram is a longitudinal plan view of the holding table 30 of the first embodiment in which the holding jig 28 is mounted on the jig base 22. The holding jig 28 includes a holding surface 28a for holding the package substrate 2, and a plurality of undercut blades 40 formed at positions corresponding to the planned dividing lines 8a, 8b of the package substrate 2 held by the holding surface 28a. And the plurality of suction bow boring holes 42 are formed in various fields divided by the undercut groove 4 of the cutting insert. Further, a fluid discharge hole 44 is formed in at least one of the undercuts for the cutting insert 40, and the fluid discharge hole 44 discharges a fluid such as a cutting fluid or a cooling air. As shown in Fig. 4(B), the holding jig 28 is mounted on the detachable base 22, passes through the electromagnetic switching valve 48, and the jig formed on the jig base 22 is used with the suction source 5 at 201118939:=46. Connect and make a sucker. The negative = negative pressure transmitting portion 46 is actuated, whereby the retaining device 28 is attracted and held by the jig base 22. Each of the suction holes 42 is through (4) the shape-deficient pinch reduction seat 2 & negative Γ 2, ° and the guide way 24 and electromagnetic switching _ and is connected with the attraction source, so the package substrate 2 is positioned, the protection material is protected (four), and the surface is electromagnetically cut. The technique is changed to the communication position ', and the negative pressure transmitting portion η and the suction source measurement sealing substrate 2 are sucked and held by the holding device 28. The fluid discharge port formed in the bottom of the undercut groove for the cutting insert is connected to the fluid supply source 58 through the fluid supply path 26 that has been formed in the sump base 22, and is connected to the fluid supply source 58. When the electric switch 56 is switched to the communication position 'and the fluid from the fluid supply source 58 is ejected from the fluid ejection hole 44, the body is supplied to each of the blades. 2. Hereinafter, a case will be described in which the package substrate 2 is mounted on the holding stage 3, which is configured as described above, and the package substrate 2 is divided into individual semiconductor packages. The package substrate 2 held by the holding stage 30 through the holding jig 28 is positioned directly below the photographing mechanism 38 by moving the holding table 3 〇 in the +Χ axis direction, and is photographed by the photographing mechanism 38. The split pre-twist line 8a or 8b is detected by the alignment mechanism %. After the alignment is completed, the cutting blade 32 is moved in the z-axis direction and the positioning of the dividing line 8a*8b and the cutting blade 32 in the Y-axis direction is performed. The fluid is ejected from the fluid ejecting hole 44, and the fluid is supplied to the respective undercuts for the cutting inserts, and the cutting edge 8a or 8b which has been positioned by the cutting insert 32 is cut. At the same time, the cutting insert 32 is embedded in the undercut groove 4 of the cutting insert. 'Because the undercut is filled with fluid, 8 201118939 The cutting insert 32 prevents fluid heat from rising due to fluid cooling, and prevents the electrode from cutting. A defect such as a short circuit that occurs in contact with an adjacent electrode in the direction is extended. The fluid supplied from the fluid supply source 58 may be a cutting fluid such as pure water that has been cooled, cooling air, or the like. Referring to Fig. 5(A), the present invention is shown. The plan view of the holding jig 28A of the second embodiment of the present invention is shown in Fig. 5(B) is a longitudinal cross-sectional view of the holding table 3A of the second embodiment in which the holding jig 28a is mounted on the jig base 22. The holding jig 28A is a fluid discharge hole 44 that opens at the intersection of all of the cutting inserts 4, which are extending in the longitudinal and lateral directions. Therefore, in the present embodiment, the cooling fluid can be supplied to all the cutting fluids in general. The blade is used in the undercut 40. The other structure of the embodiment of the present embodiment is the same as that of the third embodiment shown in Fig. 4. In the embodiment shown in Fig. 5, the fluid ejection hole 44 is provided. However, it can also be made that the fluid is not sprayed out of the hole (4), and the injection is placed at the intersection of the plurality of points. Alternatively, the X& cutting insert can be formed on the side of the undercut 40 to form a fluid nozzle. The hole 44. is supplied to the cutting blade boring groove 4 through the fluid discharge hole 44. Therefore, the holding jig 28 and the undercut for the cutting insert are fitted in the cutting of the package substrate 2. The cutting insert 32 of 40 performs cutting while cooling the fluid by the eight yoke shirts. Accordingly, it is possible to prevent the generation of processing heat and prevent the processing heat generated during cutting from being extended toward the cutting. A defect such as a short circuit that occurs in contact with an adjacent electrode. 201118939 [Simplified Schematic] Fig. 1 is a plan view of a package substrate. Fig. 2 is an enlarged partial side view of the package substrate. Fig. 3 is a view of the cutting device Partial cut Fig. 4(A) is a plan view of the holding jig of the first embodiment, and Fig. 4(B) is a longitudinal sectional view of the holding jig of the first embodiment mounted on the holding base. Fig. 5 is a plan view showing a holding jig of a second embodiment, and Fig. 5(B) is a longitudinal sectional view of a holding jig of a second embodiment mounted on a holding base. [Description of main component symbols] 2: Packaging Substrate 4: Metal frame 5.. Peripheral remaining area 5a... Non-element area 6a, 6b, 6c... Element area 8a... First division planned line 8b... Second division planned line 10 .. . Element forming portion 12: electrode 14 . . . element 16 .. resin encapsulation portion 20 .. cutting device 22 .. jig base 24 .. . suction path 26 .. . fluid supply path 28 , 28A... holding jig 28a... holding surface 30, 30A... holding table 31·. mandrel 32... cutting blade 34... cutting mechanism (cutting unit) 36.. Alignment mechanism 38.. Shooting mechanism 40.. cutting blade with undercut 42.. suction hole 44.. fluid ejection hole 46.. clamp negative pressure transmitting portion 48, 54, 56... electromagnetic switching valve 50.. .Attraction source 52.. Negative pressure communication part 58.. Fluid To source 10