201118383 ASEK2266-NEW-FINAL-TW-20091120 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種垂直式探針卡，且特別是有關於 一種適用於微間距接點之電性測試的頂針式垂直探針卡。 【先前技術】 積體電路晶片（integrated circuit chip，IC chip )的電 性測试在半導體製程（semiconductor process )的各階段中 都是相當重要的。每一個1C晶片在晶圓（wafer)與封裝 (package )型態都必須接受測試以確保其電性功能 (electrical function )。 在晶圓型態測試個別晶片，其過程稱為晶圓探測 (wafertest)。晶圓探測的方式乃是使測試機台與探針卡 (Probe Card )構成測試迴路，將探針卡上的探針頭（pr〇be Pin)直接與晶片上的銲签（pad)或凸塊（如㈣接觸， 、、:,2 :奴針.木測曰曰圓上的各個晶片’從而引出晶片訊號， =將此晶片訊號資料送往測試機台作分析與判斷。如此一 以避：步驟之前’事先濾除電性與功能不良的晶片， 义免不良品的增加而提高封裝製造成本。 片塾=於==卡或者是無法測試陣列式的晶 、了/則。式的日日片種類有限、 =換且頂針的電性測試端之平以致於产 卡維護不易且電性測試的準確性不 損壞且製作成本高、或者 佳又或疋彳木針頭夺易 飞者疋頂針之間的間距無法降低以致 201118383 ASEK2266-NEW-FINAL-TW-20091120 電性測試並使得可測試的晶片種 於無法進行微間距接點之 類有限。 【發明内容】 之電提供—髓直式探針卡，其可進行額距接點201118383 ASEK2266-NEW-FINAL-TW-20091120 VI. Description of the Invention: [Technical Field] The present invention relates to a vertical probe card, and in particular to an electrical test suitable for micro-pitch contacts Thimble vertical probe card. [Prior Art] The electrical test of an integrated circuit chip (IC chip) is quite important in each stage of the semiconductor process. Each 1C wafer must be tested in both wafer and package types to ensure its electrical function. The individual wafers are tested in wafer type and the process is called wafer test. Wafer detection is done by making the test machine and the probe card form a test loop. The probe head (pr〇be Pin) on the probe card is directly attached to the pad or bump on the wafer. Block (such as (4) contact, ,,:, 2: slave needle. Wood chip on each wafer on the circle" to lead to the wafer signal, = send the wafer signal data to the test machine for analysis and judgment. : Before the step of 'filtering out the defective and defective dyads beforehand, the increase in the number of defective products will increase the manufacturing cost of the package. The film 塾 = = = = card or the array type crystal can not be tested. The type of film is limited, and the electrical test end of the thimble is flat so that the maintenance of the card is not easy and the accuracy of the electrical test is not damaged and the manufacturing cost is high, or the good or the eucalyptus needle wins the thimble. The spacing between the two cannot be reduced so that the 201118383 ASEK2266-NEW-FINAL-TW-20091120 electrical test and the testable wafers are limited to the inability to make micro-pitch contacts. [Invention] The electric supply-myelin probe Card, which can be used for the distance contact
板以^發:ί出一種垂直式探針卡包括-電路板、-轉接 n木頭’其中轉接板具有相對的一第一表面以及 多轉接板在第—表面以及第二表面上分別具有 ^點以及多個第二接點’第—接闕間距大於第 = 轉接板的第—表面朝向電路板，且轉接板 j弟-接點電連制電路板。探針頭包括—第一板件、 料及多個頂針(pGgGpin)。第一板件鄰近轉接板 二-⑶亚且具有對應於第二接點的多個第__開孔。第 與，—板件相對設置’第二板件具㈣應於第-開 外白、夕個Μ二開孔，且第-開孔在第二板件的垂直投影與 弟一開孔重合。每—頂針為直桿狀’並沿垂直投影方向插 置於相應的第一開孔與第二開孔内，每一頂針具有一第— 1縮頂端(retractable tip)以及一第二伸縮頂端，其中第一伸 縮頂端穿過第一開孔而抵靠轉接板上的第二接點，而第二 伸縮頂端穿過第二開孔。 — 在本發明之一實施例中，每一頂針更具有一長直管體 以，-彈性件’第-伸縮頂端與第二伸縮頂端分別位於長 直管體的兩端，而彈性件位於長直管體内並且抵靠第—伸 201118383 ASEK2266-NEW-FINAL-TW-20091120 ^端與第二伸縮頂端，以對第端與第二伸縮頂 知·^供一彈性恢復力。 、、 在本發明之-實施例中，第一板件與第二板件之間且 有一空間，而長直管體穿過空間。 、 在，之-實施例中，第—板件與第二板件密合， 使母-苐一開孔與相應的第二開孔形成 一頂針插置於相應的貫孔内。 、貝孔母 第實施例中’每—頂針更具有—彈性件’ =，頂端分別位於相應之貫孔的兩 ?而彈性件位於貫孔内並且抵靠第—伸缩 =端’以對第一伸縮頂端與第二伸縮頂端提供二雜: 成-= 月之:實珊，每—貫孔的兩端分別内縮形 -止擋部，M „端位於貫孔⑽部分具有-第 棒田々弟—伸縮頂端位於貫孔内的部分具有一第二 I㈣止擔部與第二止擒部的外徑分別大於相i的 ii:明之一實施例中’彈性件為-螺旋彈簀。 ,.I明之—實施例中，螺旋彈簧俜由 相應之貫孔的中心轴捲繞而成。 纟條轉片沿 芊，明之—實施例中，垂直式探針卡更包括-r 在本發明之一，頭猎由框架固定於電路板上。 接板的一側具有—圓滑&面。¥伸縮頂^在朝向轉 201118383The board is made up of: a vertical probe card comprising - a circuit board, - a switch n wood - wherein the adapter plate has a first surface opposite thereto and the plurality of adapter plates are respectively on the first surface and the second surface The first surface of the first and second plurality of contacts is greater than the first surface of the first adapter plate facing the circuit board, and the adapter plate is electrically connected to the circuit board. The probe head includes a first plate, a material, and a plurality of thimbles (pGgGpin). The first plate is adjacent to the adapter plate two-(3) sub- and has a plurality of __ openings corresponding to the second contacts. The first and the plate members are oppositely disposed. The second plate member (4) should be opened at the first-opening white and the outer plate, and the vertical projection of the first-opening hole in the second plate coincides with the opening of the first hole. Each of the thimbles is in the shape of a straight rod and is inserted into the corresponding first opening and the second opening in a vertical projection direction, each thimble having a first retractable tip and a second telescopic tip. The first telescopic top end passes through the first opening and abuts the second contact on the transfer plate, and the second telescopic top end passes through the second opening. In an embodiment of the invention, each of the thimbles further has a long straight body, and the elastic member 'the first telescopic top end and the second telescopic top end are respectively located at two ends of the long straight tube body, and the elastic member is located at the long end. Straight inside the body and against the first extension 201118383 ASEK2266-NEW-FINAL-TW-20091120 ^ end and the second telescopic top, to provide a resilient restoring force to the first end and the second telescopic top. In the embodiment of the invention, there is a space between the first plate member and the second plate member, and the long straight pipe body passes through the space. In the embodiment, the first plate member is in close contact with the second plate member, so that the female-inch opening and the corresponding second opening form a thimble inserted into the corresponding through hole. In the first embodiment of the method, in the first embodiment, the 'each thimble has an elastic member' = the top end is located at two of the corresponding through holes, and the elastic member is located in the through hole and abuts against the first - telescopic = end 'for the first The telescopic top end and the second telescopic top end provide two miscellaneous: Cheng-= month: Shishan, each end of the perforation hole is respectively indented-stop, M „ end is located in the through hole (10) part has - the first barn - the portion of the telescopic tip located in the through hole having a second I (four) stop portion and the second stop portion having an outer diameter greater than that of the phase i, respectively: in the embodiment "elastic member is - auger." In the embodiment, the coil spring 卷绕 is wound by the central axis of the corresponding through hole. The 转 strip is along the 芊, in the embodiment, the vertical probe card further includes -r in one of the inventions, The head hunting is fixed on the circuit board by the frame. One side of the board has - smooth & face. ¥ telescopic top ^ in the direction of turn 201118383
Ai>tK2266-NEW-FINAL-TW-20091120 在本發明之一實施例中，每一第一伸縮頂端在朝向轉 接板的一側具有一凹洞。 在本發明之一實施例中，每一第一伸縮頂端在朝向轉 接板的一側具有一平面。 在本發明之一實施例中，每一第一伸縮頂端在朝向轉 接板的一側具有一冠狀(crown)結構。 在本發明之-實施例中’每—第二伸縮頂端在遠離轉 接板的一側具有一平面。 # 纟本發明之一實施例中，每一第二伸縮頂端在遠離轉 接板的一側具有多個尖狀凸起。 在本發明之-實施例中’每一第二伸縮頂端在遠離轉 接板的一侧具有一冠狀(crown)結構。 基於上述，本發明利用轉接板來連接探針頭的頂針， 以使頂針的排列密度得以縮小，而有利於測試高晶片塾密 度的晶片或者是其他高接點密度的電子元件。此外，本& 明之頂針的第-伸縮頂端係抵靠轉接板的第二接點，故^ 參冑與轉接板㈣二接點之間的連接相當制，使得頂針與 轉接板的電性連接品質佳，並使探针頭的使用壽命長且可 靠度佳。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 本發明所提出_直式探針卡是在用以連接測試機 201118383 ASEK2266-NEW-FINAL-TW-20091120 台的電路板無以職細元件的探針頭之間 板’以使線路間距較大的電路板可透過轉接板而電㈣= 至排列間距較小的頂針，從而使頂針之間的間矩得2 低’以利於對具有制距接點(如㈣或凸塊) 2 (如晶片）進行電性測試。 疋牛 此外’本發明的探針頭是採用直桿狀的料 pm)，因此，本發明的探針頭中的頂針容易拆卸 而f助於探針頭的維護。再者，本發_各頂針的、 抵罪轉接板的接點’故頂針與轉接板的接點之間相 當穩固’使得頂針與難板的電性連接品，並 頭的可靠度佳且使用壽命長。 木’ 圖1A繪不本發明一實施例之垂直式探針卡的剖面 圖。請參照圖1A’本實施例之垂直式探針卡1〇〇包括一電 路板110、-轉接板120以及一探針頭13〇。轉接板^ 位於電路板11G與探針頭13G之間，轉接板12()且有相 對的一第一表面122以及一第二表面124，其中第一表面 122朝向電路板110，而第二表面124朝向探針頭。 圖1B繪不圖1A之轉接板的局部放大圖。請同時參照 圖1A與圖1B，轉接板120在第一表面122以及第二表面' 124上为別具有多個苐一接點122a以及多個第二接點 124a，其中第一接點122a電性連接至第二接點124a，且 第一接點122a的間距D1大於第二接點124a的間距D2。 轉接板120可經由第一接點122a電性連接到電路板11〇。 探針頭130包括一第一板件132、一第二板件134以 201118383 Ai>Jtj<^266-NEW-FINAL-TW-20091120 及，個頂針136(pGgG pin)。第—板件132鄰近轉接板ι2〇 的第二表面124並且具有對應於第二接點12如的多個第一 開孔132a。第二板件134與第一板件132相對設置，第二 板件134具有對應於第一開子L咖的多個第二開孔 134a，且第-開孔132a在第二板件i別的垂直投影與第二 開孔134a重合。詳細而言，在本實施例中，第一板件 與第二板件m可為相互密合的結構，以使每一第一開孔 132a與相應的第二開孔134a形成連續的一貫孔丁。 每一斯136為直桿狀，並沿垂直投影方向插置於相 應的第-開孔132a與第二開孔134a内。換言之，在本實 f例中，每一頂針136皆插置於相應的貫孔T内。、 母二頂針136具有一第一伸縮頂端13如(論_此t⑻以 j-第二伸縮頂端⑽，其中第一伸縮頂端服穿過第 一開1 132a而抵罪轉接板12〇上的第二接點12知，而第 頂端136b穿過第二開孔134a，第二伸縮頂端⑽ σ “接驗測晶#之晶片墊（或是其他電子元件的接 "、、占）以進行電性測試，換言之，第二伸縮頂端 136b為雷 试端。在本實施例中’在未進行晶片（或其他電子元 4的電性測試時，第二伸縮頂端B6b係突出於第二板件 ϋ的-底面134b。第一伸縮頂端13仏與第二伸縮頂端 例如是由鈹銅（BeCu)構成且外部鑛金、由高碳鋼 〔Κ·4)構成且外部鍍金、由鈀合金（pb 構成、 =金鋼（ΡΒΤ)構成且外部鑛金，或者是由黃銅（Β 構成且外部鑛金。 ^ 9 201118383 ASEK2266-NEW-FINAL-TW-20091120 詳細而言，第一伸縮頂端136a電性連接至第二伸縮 頂端136b ’因此’在進行晶片的電性測試時，測試機台（未 繪示）可將電訊號傳導至電路板110與轉接板12〇，並透 過弟一接點124a將電訊號依序傳至第一伸縮頂端、 第二伸縮頂端136b以及待測晶片之晶片墊。 值仔注思的疋，相較於習知技術在進行晶片的電性測 試時是使探針頭中的頂針直接接觸電路板以與電路板電性 連接，以致於頂針的排列密度需與電路板的線路密度相 當，本實施例是利用轉接板120的第一接點122a連接線路 間距較大的電路板110’並利用第二接點124a連接探針頭 130的頂針136’因此，頂針136的排列密度可縮小，以利 ，測試高晶片墊密度的晶片（例如具有陣列式的晶片墊的 s曰片）或者是其他高接點密度的電子元件（如晶片封裝 體）。在本實施例中，二相鄰頂針136之間的間距D3可 小於400微米，例如為〖go微米。 圖1C繪示圖ία之探針頭的局部放大圖。請同時參照 圖1A與圖1C，在本實施例中，每一頂針136可選擇性地 具有一彈性件138 ’且第—伸縮頂端136a與第二伸縮頂端 脳分別位於相應之貫孔丁的兩端，而彈性件138位於貫 ϋ内並且抵②第—伸縮頂$ 136a與第二伸缩頂端 一η以對第一伸縮頂端136&與第二伸縮頂端136b提供 这往ΐ恢復力。雜件丨38例如為—螺旋彈簧，且螺旋彈 條狀彈片沿相應之貫孔了的中心軸Μ捲繞而成。 在”他貫施例中，亦可以其他的彈性體取代彈簧，或者是 201118383 ASEK2266-NEW-FINAL-TW-20091120 透過特殊的設計使第-伸縮頂端】施與第二伸縮頂端 136b本身具有適當的彈性。 在本實施例中，每-貫孔τ的兩端分別内縮形成一限 位開口 L’第一伸縮頂端136&位於貫孔τ内的部分具有一 第止擋部S1，第一伸縮頂端i36b位於貫孔τ内的部分 具有-第二止擔部S2，且第—止播部S1與第二止稽部S2 的外徑υι分別大於相應的限位開口 L的開口直徑。 ^如此一來，當第一伸縮頂端136a與第二伸縮頂端136b 因又到彈性件138的彈性恢復力而分別向貫孔τ的兩端移 動日守，第一止擋部S1與第二止擋部S2會分別受到限位開 口 L的阻擋而停止繼續向貫孔τ的兩端移動，故可避免第 一伸縮頂端136a與第二伸縮頂端136b完全脫離貫孔τ， 且可使各第二伸縮頂端136b之突出於限位開口 L的部分 的長度一致，進而使全部的第二伸縮頂端136b可實質上共 平面，以利於在之後的晶片（或其他電子元件）的電性^ 試中可量測到所有的晶片墊（或接點）。 在本實施例中，可在電路板110上設置一框架14〇， 框架140可藉由鎖固、黏著等適合的方式固定在電路板u〇 上，且探針頭130可藉由框架14〇固定於電路板n〇上。 詳細而言，框架140具有一開口 142,而探針頭13〇與轉 ，板120配置於開口 142中，且本實施例可藉由多個貫穿 第板件132與第二板件134並插入框架140中的螺絲（或 卡榫）150而將探針頭13〇固定於框架14〇上。 此外’本實施例可藉由將第一板件132與第二板件134Ai>tK2266-NEW-FINAL-TW-20091120 In one embodiment of the invention, each of the first telescoping tips has a recess on a side facing the transfer plate. In one embodiment of the invention, each of the first telescoping tips has a flat surface on a side facing the transfer plate. In one embodiment of the invention, each of the first telescoping tips has a crown configuration on a side facing the transfer plate. In the embodiment of the invention - the per-second telescopic tip has a flat surface on the side remote from the transfer plate. In one embodiment of the invention, each of the second telescoping tips has a plurality of pointed projections on a side remote from the transfer plate. In the embodiment of the invention, each of the second telescoping tips has a crown structure on a side remote from the transfer plate. Based on the above, the present invention utilizes an adapter plate to connect the ejector pins of the probe head to reduce the arrangement density of the thimbles, and is advantageous for testing wafers with high wafer densities or other high junction density electronic components. In addition, the first telescopic top of the thimble of the present & pedestal is abutted against the second contact of the adapter plate, so that the connection between the 胄 胄 and the adapter plate (four) two contacts is equivalent, so that the thimble and the adapter plate The electrical connection quality is good, and the probe head has a long service life and good reliability. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] The present invention proposes that a straight probe card is used between the probe heads of the circuit board for connecting the test machine 201118383 ASEK2266-NEW-FINAL-TW-20091120. A circuit board with a large line spacing can be electrically connected through the interposer board (4) = to a thimble with a small pitch, so that the moment between the thimbles is 2 low' to facilitate the connection of the contact points (such as (4) or bumps). 2 (such as a wafer) for electrical testing. The yak In addition, the probe head of the present invention is a straight rod-shaped material pm. Therefore, the thimble in the probe head of the present invention is easily disassembled to assist in the maintenance of the probe head. Furthermore, the contact of the ejector pin and the arbitrage adapter plate is such that the contact between the thimble and the adapter plate is relatively stable, so that the electrical connection between the thimble and the hard plate is good, and the reliability of the head is good. long lasting. Fig. 1A is a cross-sectional view showing a vertical probe card in accordance with an embodiment of the present invention. Referring to FIG. 1A', the vertical probe card 1 of the present embodiment includes a circuit board 110, an adapter board 120, and a probe head 13A. The adapter board is located between the circuit board 11G and the probe head 13G, and has an opposite first surface 122 and a second surface 124, wherein the first surface 122 faces the circuit board 110, and the first surface 122 The two surfaces 124 face the probe head. FIG. 1B is a partial enlarged view of the adapter plate of FIG. 1A. Referring to FIG. 1A and FIG. 1B simultaneously, the adapter plate 120 has a plurality of first contacts 122a and a plurality of second contacts 124a on the first surface 122 and the second surface '124, wherein the first contacts 122a Electrically connected to the second contact 124a, and the pitch D1 of the first contact 122a is greater than the pitch D2 of the second contact 124a. The adapter plate 120 can be electrically connected to the circuit board 11A via the first contact 122a. The probe head 130 includes a first plate member 132, a second plate member 134 to 201118383 Ai>Jtj<^266-NEW-FINAL-TW-20091120 and a thimble 136 (pGgG pin). The first plate member 132 is adjacent to the second surface 124 of the adapter plate ι2 并且 and has a plurality of first openings 132a corresponding to the second contacts 12, for example. The second plate member 134 is disposed opposite to the first plate member 132. The second plate member 134 has a plurality of second openings 134a corresponding to the first opening L, and the first opening 132a is in the second plate. The vertical projection coincides with the second opening 134a. In detail, in the embodiment, the first plate member and the second plate member m may be closely adhered to each other such that each of the first openings 132a and the corresponding second opening 134a form a continuous continuous hole. Ding. Each of the strings 136 is a straight rod shape and is inserted into the corresponding first opening 132a and second opening 134a in the vertical projection direction. In other words, in the present embodiment f, each of the thimbles 136 is inserted into the corresponding through hole T. The female ejector pin 136 has a first telescopic top end 13 such as (the t-8) and the j-second telescopic top end (10), wherein the first telescopic top end wears the first opening 1 132a to defeat the first on the adapter plate 12 The second contact 12 is known, and the first top end 136b passes through the second opening 134a, and the second telescopic top end (10) σ "connects the wafer pad of the test crystal (or the connection of other electronic components), for electricity) The second test, in other words, the second telescopic top end 136b is a lightning test end. In the present embodiment, 'the second telescopic top end B6b protrudes from the second plate when the wafer (or other electrical test of the electronic component 4) is not performed. - the bottom surface 134b. The first telescopic top end 13 仏 and the second telescopic top end are, for example, bet copper (BeCu) and external mineral gold, made of high carbon steel [Κ·4) and externally plated with gold, composed of palladium alloy (pb) , = gold steel (ΡΒΤ) constitutes and external gold, or is composed of brass (Β and external gold. ^ 9 201118383 ASEK2266-NEW-FINAL-TW-20091120 In detail, the first telescopic top 136a is electrically connected To the second telescopic tip 136b 'so' during the electrical test of the wafer, the test machine (not shown), the electrical signal can be transmitted to the circuit board 110 and the adapter board 12, and the electrical signals are sequentially transmitted to the first telescopic top end, the second telescopic top end 136b, and the wafer to be tested through the contact point 124a. Wafer pad. The value of the thimble is compared with the prior art. In the electrical test of the wafer, the thimble in the probe head is directly in contact with the circuit board to be electrically connected to the circuit board, so that the arrangement density of the thimble is It is required to be equivalent to the circuit density of the circuit board. In this embodiment, the first contact 122a of the interposer 120 is used to connect the circuit board 110' with a large line spacing and the second pin 124a is used to connect the ejector pin 136' of the probe head 130. Therefore, the arrangement density of the ejector pins 136 can be reduced to facilitate testing of wafers having a high wafer pad density (for example, s wafers having an array of wafer pads) or other high junction density electronic components (such as chip packages). In this embodiment, the spacing D3 between the two adjacent thimbles 136 may be less than 400 micrometers, for example, [go micrometers.] Figure 1C is a partial enlarged view of the probe head of Figure ία. Please refer to FIG. 1A and FIG. 1C simultaneously. In this embodiment, each A thimble 136 can optionally have an elastic member 138' and the first telescopic top end 136a and the second telescopic top end 脳 are respectively located at opposite ends of the corresponding through hole, and the elastic member 138 is located in the through hole and resists the second expansion The top $ 136a and the second telescopic top end η provide the retractive force to the first telescopic top end 136 & and the second telescoping top end 136 b. The miscellaneous piece 38 is, for example, a helical spring, and the spiral elastic strip is along the corresponding The central axis of the through hole is wound up. In other embodiments, other springs can be used instead of the spring, or 201118383 ASEK2266-NEW-FINAL-TW-20091120 through special design to make the first - telescopic top The second telescopic tip 136b itself has appropriate elasticity. In this embodiment, the two ends of each of the through holes τ are respectively retracted to form a limit opening L'. The first telescopic top end 136& the portion located in the through hole τ has a first stop portion S1, and the first telescopic top end i36b The portion located in the through hole τ has a second stop portion S2, and the outer diameters 第1 of the first stop portion S1 and the second stop portion S2 are respectively larger than the opening diameters of the corresponding limit openings L. In this way, when the first telescopic top end 136a and the second telescopic top end 136b are respectively moved to the opposite ends of the through hole τ due to the elastic restoring force of the elastic member 138, the first stop portion S1 and the second stop portion The blocking portion S2 is blocked by the limiting opening L and stops moving to both ends of the through hole τ, so that the first telescopic top end 136a and the second telescopic top end 136b can be prevented from completely separating from the through hole τ, and each second can be prevented. The lengths of the portions of the telescopic top end 136b that protrude from the limit opening L are uniform, so that all of the second telescoping tips 136b can be substantially coplanar to facilitate subsequent electrical testing of the wafer (or other electronic component). All wafer pads (or contacts) are measured. In this embodiment, a frame 14A can be disposed on the circuit board 110. The frame 140 can be fixed on the circuit board u by a suitable manner such as locking and adhesive, and the probe head 130 can be framed by the frame 14. Fixed to the board n〇. In detail, the frame 140 has an opening 142, and the probe head 13 is rotated and the plate 120 is disposed in the opening 142, and the embodiment can be inserted through the plurality of the first plate member 132 and the second plate member 134. A screw (or cassette) 150 in the frame 140 secures the probe head 13'' to the frame 14''. Further, the present embodiment can be performed by the first plate member 132 and the second plate member 134.
11 201118383 ASEK2266-NEW-FINAL-TW-20091120 固定於電路板110上，而預壓（pre_load)第一伸縮頂端 136a’以使第一伸縮頂端136a因受到彈性件138的彈性恢 復力而抵靠轉接板120上的第二接點124a。 值得注意的是，由於本實施例之頂針136的第一伸縮 頂端136a抵靠轉接板120的第二接點124a，故頂針 與轉接板120的第二接點i24a之間的連接相當穩固，使得 頂針136與轉接板120的電性連接品質佳，並使探針頭 的可靠度佳且使用壽命長。 圖2A〜圖2C繪示圖1A之垂直式探針卡的其中一 製程的剖面圖。值得注意的是，在圖2A〜圖2c中，元 名稱與標號相同於圖1A之元件名稱與標號者 結構，故於此不再贅述。 匁祁U的 首先’請參照圖2A，提供一策二板件134盘多 針136，第二板件134具有多個第二開孔ma，且每—頂 針136配置於對應的第二開孔134a中。詳細而言’每、 -伸縮頂端136b藉由第二止擔部S2而承靠於 134之構成限位開σ [的部分上。接著 132,且第一板件132的多個 弟板件 應第二板件134的多個第二開孔134a。& '立置分別對 ==照圖2B ’將第一板件132配置於第二板 L上，以開孔_立於對應的第二開孔 之後，在本實施例中，可藉由多個螺絲150將第-板 12 201118383 Ai>JbJ<L2266-NEW-FINAL-TW-20091120 件132固疋於第二板件丨34上，此時，已初步完成本實施 例之探針頭130。當然，在其他實施例中，接合第一板件 132與第二板件Π4的方法還可為黏著或卡榫接合、或是 其他可穩固地接合第一板件132與第二板件134的方法。 接著，請參照圖2C，提供一轉接板12〇與一電路板 110’並將轉捿板120配置於探針頭13〇與電路板丨1〇之間。 然後，請參照圖1A，接合探針頭13〇、轉接板12〇、 電路板no,以使探針頭no的第一伸縮頂蟑136a抵靠轉 接板120上的第二接點124a，且使轉接板12〇上的第一接 點122a電性連接到電路板11〇。詳細而言，在本實施例中， 可利用多個螺絲（或卡榫）16Q將第—板件132與第二板 件134鎖固至電路板11〇上的框架14〇上。 曰由前述可知，本實施例之探針卡100的製作方法主要 ^先組農頂針136、第-板件132與第二板件134以形成 板針頭130 ’之後，接合探針頭13〇、轉接板12〇、電路板 11〇 ’因此’本實施例之探針卡1〇〇的製作方法簡易，故 作成本較低。^ 單-m值得注意的是，在本實施财，若是需要抽換 ::=Γ6 ’只需要將螺絲150、160拆卸下來，並移 ^了^件132，即可抽換單-的頂和6，且由於本實施 ==直桿狀，且·136之間幾乎是以相互平 仃的方切置在職_二開孔134a中而完 的部分，故可輕易辨別需扯施& /里 ㈣抽換的騎136。因此，可使本 貝施例之探針卡100容易維護。 + 13 201118383 ASEK2266-NEW-FINAL-TW-20091120 圖3緣示本發明-實施例之二種頂針的剖面圖。請參 照圖3 ’在本實施例中’ 了頁針300a具有第一伸縮頂端 136a、 第一伸縮頂端136b與彈性件138,其中第一伸缩頂端136 與第二伸縮頂端⑽分別配置於彈性二端 138a、138b。彈性件138例如為螺旋彈筹，第一 端版a具有一延伸入螺旋彈簧之中空11 201118383 ASEK2266-NEW-FINAL-TW-20091120 is fixed on the circuit board 110, and pre-loads the first telescopic top end 136a' so that the first telescopic top end 136a is rotated by the elastic restoring force of the elastic member 138. The second contact 124a on the board 120. It should be noted that since the first telescopic top end 136a of the ejector pin 136 of the embodiment abuts against the second contact 124a of the interposer 120, the connection between the ejector pin and the second contact i24a of the interposer 120 is quite stable. The electrical connection between the thimble 136 and the adapter plate 120 is good, and the reliability of the probe head is good and the service life is long. 2A to 2C are cross-sectional views showing one of the processes of the vertical probe card of Fig. 1A. It is to be noted that in FIG. 2A to FIG. 2c, the element names and the reference numerals are the same as those of the element name and the label of FIG. 1A, and thus will not be described again. Referring to FIG. 2A, a second plate member 134 has a plurality of pins 136. The second plate member 134 has a plurality of second openings ma, and each of the thimbles 136 is disposed in the corresponding second opening. In 134a. Specifically, each of the - telescopic top ends 136b is supported by the portion 134 of the limit opening σ by the second stop portion S2. Next, 132, and the plurality of second plates of the first plate member 132 are corresponding to the plurality of second openings 134a of the second plate member 134. & 'Standing separately == according to FIG. 2B', the first plate member 132 is disposed on the second plate L, after the opening_ standing in the corresponding second opening, in this embodiment, by The plurality of screws 150 fix the first plate 12 201118383 Ai>JbJ<L2266-NEW-FINAL-TW-20091120 piece 132 to the second plate 丨34. At this time, the probe head 130 of the present embodiment has been initially completed. . Of course, in other embodiments, the method of joining the first panel 132 and the second panel Π 4 may also be adhesive or snap-fit, or other securely engaging the first panel 132 and the second panel 134. method. Next, referring to FIG. 2C, an interposer 12 and a circuit board 110' are provided and the switch board 120 is disposed between the probe head 13A and the circuit board 110. Then, referring to FIG. 1A, the probe head 13A, the adapter plate 12A, and the circuit board no are engaged so that the first telescopic top 136a of the probe head no abuts against the second contact 124a on the adapter plate 120. And electrically connecting the first contact 122a on the adapter board 12 to the circuit board 11A. In detail, in the present embodiment, the first plate member 132 and the second plate member 134 can be locked to the frame 14A on the circuit board 11A by using a plurality of screws (or cassettes) 16Q. As can be seen from the foregoing, the probe card 100 of the present embodiment is mainly used to assemble the thimble 136, the first plate member 132 and the second plate member 134 to form the plate needle 130 ′, and then engage the probe head 13 〇, The adapter plate 12A and the circuit board 11' are thus simple in manufacturing the probe card 1 of the present embodiment, so that the cost is low. ^ Single-m is worth noting that in this implementation, if it is necessary to replace::=Γ6 'only need to remove the screws 150, 160, and move the ^ 132, you can replace the single - top and 6, and since the present embodiment == straight rod shape, and the 136 is almost completely cut between the in-service _ two openings 134a, it is easy to distinguish the need to pull & / (4) Ride the ride 136. Therefore, the probe card 100 of the present embodiment can be easily maintained. + 13 201118383 ASEK2266-NEW-FINAL-TW-20091120 Figure 3 shows a cross-sectional view of two thimbles of the present invention - an embodiment. Referring to FIG. 3, in the present embodiment, the stylus 300a has a first telescopic top end 136a, a first telescopic top end 136b and an elastic member 138. The first telescopic top end 136 and the second telescopic top end (10) are respectively disposed at the elastic end. 138a, 138b. The elastic member 138 is, for example, a spiral spring, and the first end plate a has a hollow extending into the coil spring.
El，且第一伸縮頂端136b具有一延伸入螺旋彈箬之中空 軸孔B的延伸部E2。 ’、 工. 在本實施例中，頂針30〇c相似於頂針3〇〇a，兩者的 _ 差異之處在於彈性件m片狀彈簧（bGardspring)， 詳細而言，彈性件138c為一長條片狀結構，且此長條片狀 結構沿一軸向C螺旋捲繞。 在本實施例中’頂針鳩不但具有第—伸縮頂端 =6a、第二伸縮頂端136b與彈性件138，還具有一長直管 版=10 ’其中頂針3〇〇b的第一伸縮頂端136a與第二伸縮 頂端⑽分別位於長直管體310的兩端312、314，而彈 138位於長直管體310内並且抵靠第-伸縮頂端136a 癱 二苐二伸縮頂端136b，以對第-伸縮頂端136a與第二伸 縮頂端136b提供一彈性恢復力。 相較於本實施例之頂針3〇〇b具有長直管體·，在其 =Μ列+探針卡只要具有可限制彈性件⑽之伸縮方 二'、位置的結構即可取代本實施例之長直管體310，例如 = T。換言之，本實施例之頂針可不具有長直 ^ 列如頂針3O0a)，也可具有長直管體310 (例 14 2〇1118383 ASEK2266-NEW-FlNAL-TW-2009n20 ’亦即’本實施例可視實際情況而選擇是否 :頂針上女裝長直管體310。 疋否 圖4Α!會示本發明一實施例之垂直 圖，圖4Β繪示本發明另一奋祐 丁卞的口丨J面 圖。值得注意的是’由Λ實 之伸縮方向舆位置的長直管=具 广列之頂釺300b不但可應用在圖 t 〇?=卿36而插置於第一板件13二= 2二Γ^Γ (如圖4錢示），還可以插置於其他 二弟-板件的第一開孔以及第二板件的第二開孔中。 n: 2 300b可應用在圖4Β的垂直試探針卡働 中以插置於垂直試探針卡400的第—板件410的第 孔412與第二板件420的第二開孔422中。 詳細:言’，4Β的垂直試探針卡4〇〇的結構相似於 "之垂直試探針卡100的結構，兩者主要的差異之處 在於垂直試探針卡400具有多個頂針鳩且第一板件彻 與第二板件420之間具有一空間a。 第一板件410與第二板件420相對設置，且第一板件 410具有多個第一開孔412,第二板件420具有多個第-開 孔似，其令第一開孔412在第二板件42〇 ‘直== 第一開孔422重合。具體而言，第—板件41〇可呈有一平 板部4M與-支撑部416 ’支擇部416可連接平板部414 的外緣並與平板部414構成一凹槽R ,而第二板件42〇可 覆蓋凹槽R並與支撐部416相連，以構成空間A。當然， 15 201118383 ASEK2266-NEW-F1NAL-TW-20091120 在其他實施例中，第一板件與第二板件亦可以採用其他白、 設計方式以使第一板件與第二板件之間具有一空間。勺 各長直管體310係穿過相對應的第一開孔412、空間 A與相對應的第二開孔422，且各長直管體310可選擇性 地固定在相對應的第一開孔412與第二開孔422中。 請同時參照圖3與圖4B，值得注意的是，本實施例 之第二板件420的各第二開孔422可具有一限位開口 L1， 以使了頁針300b的第二伸縮頂端136b的第二止擋部s2因 文到限位開口 L1的阻擋而留在長直管體31〇内，此外， 長直管體310的一端312具有一限位開口 L2,以使第一伸 縮頂端136a的第一止擋部S1因受到限位開口 u的限擋 而留在長直管體310内。 當然，在其他貫施例中，也可是長直管體的兩端都具 有限位開口 ’或者是第-開孔與第二開孔都具有—限位開 口’又或者是以其他適合的方式來限制第__伸縮頂端與第 -伸、‘頂端’以避免第—伸縮頂端與第三伸縮頂端因脫離 長直管體而導致斷路。 圖5A〜圖5D繪示本發明—實施例之具有四種不同形 狀的第一伸縮頂端的示意圖。值得注意的是’目5A〜圖 5D所^的第—伸縮頂端的形狀皆可應用在圖1A與、圖 4A與圖4B的第一伸縮項端⑽上，故圖5a〜圖犯僅 繪不第-伸獅端的料，而省略探針卡之其他部分，因 此關則木針△卡之其他部分，請參照圖、圖4八或圖犯。 明同B样知圖1A舆圖5A，在本實施例中，第一伸縮 16 201118383El, and the first telescoping tip 136b has an extension E2 that extends into the hollow shaft hole B of the helical magazine. In the present embodiment, the ejector pin 30〇c is similar to the ejector pin 3〇〇a, and the difference between the two is the elastic member m-shaped spring (bGard spring). In detail, the elastic member 138c is long. A strip-like structure, and the elongated sheet-like structure is spirally wound along an axial direction C. In the present embodiment, the ejector pin has not only the first telescopic tip=6a, the second telescopic tip 136b and the elastic member 138, but also a long straight tube version=10', wherein the first telescopic tip 136a of the thimble 3〇〇b and The second telescopic top ends (10) are respectively located at the two ends 312, 314 of the long straight pipe body 310, and the elastic 138 is located in the long straight pipe body 310 and abuts against the first telescopic top end 136a, and the second telescopic top end 136b The top end 136a and the second telescoping top end 136b provide an elastic restoring force. Compared with the thimble 3〇〇b of the embodiment, the pedestal 3〇〇b has a long straight body. In the case of the Μ + + probe card, as long as it has a structure that can restrict the expansion and contraction of the elastic member (10), the structure can be replaced by the embodiment. The long straight body 310, for example, = T. In other words, the thimble of this embodiment may not have a long straight row such as a thimble 3O0a), or may have a long straight body 310 (Example 14 2〇1118383 ASEK2266-NEW-FlNAL-TW-2009n20 'that is, 'this embodiment can be visually actual In the case of the case, it is selected whether the ejector pin has a long straight tube body 310. 疋 No Fig. 4A shows a vertical view of an embodiment of the present invention, and Fig. 4A shows a mouth J view of another of the present invention. It is worth noting that the long straight tube from the position of the telescopic direction of the compaction = the top of the 300b is not only applicable to the figure t 〇? = Qing 36 and inserted in the first plate 13 = 2 2 ^Γ (shown in Figure 4), can also be inserted into the first opening of the other two brother-plates and the second opening of the second plate. n: 2 300b can be applied to the vertical test of Figure 4Β The probe cartridge is inserted into the first hole 412 of the first plate member 410 of the vertical test probe card 400 and the second opening 422 of the second plate member 420. Detailed: 』, 4Β vertical test probe The structure of the card 4 is similar to that of the vertical test probe card 100, and the main difference between the two is that the vertical test probe card 400 has a plurality of ejector pins and the first plate There is a space a between the second plate member 420. The first plate member 410 is disposed opposite to the second plate member 420, and the first plate member 410 has a plurality of first openings 412, and the second plate member 420 has a plurality of The first opening-shaped hole 412 is such that the first opening 412 is coincident with the second plate member 42 〇 '== the first opening 422. Specifically, the first plate member 41 can have a flat portion 4M and - The support portion 416' of the support portion 416 can connect the outer edge of the flat plate portion 414 and form a groove R with the flat plate portion 414, and the second plate member 42 can cover the groove R and be connected with the support portion 416 to form the space A. Of course, 15 201118383 ASEK2266-NEW-F1NAL-TW-20091120 In other embodiments, the first plate and the second plate may also be in other white, designed manners between the first plate and the second plate. There is a space. The long straight pipe 310 of the scoop passes through the corresponding first opening 412, the space A and the corresponding second opening 422, and each long straight body 310 can be selectively fixed in the corresponding The first opening 412 and the second opening 422. Referring to FIG. 3 and FIG. 4B at the same time, it is noted that the second opening of the second plate 420 of the embodiment is second. The hole 422 can have a limiting opening L1, so that the second stopping portion s2 of the second telescopic top end 136b of the stylus 300b remains in the long straight tube body 31 due to the blocking of the limit opening L1. The one end 312 of the long straight tube body 310 has a limiting opening L2 such that the first stopping portion S1 of the first telescopic top end 136a remains in the long straight tube body 310 due to the restriction of the limiting opening u. Of course, in other embodiments, the long straight tube body has a limit opening at both ends or both the first opening and the second opening have a limit opening or in another suitable manner. To limit the __ telescopic top end and the first extension, the 'top end' to avoid the first telescopic top end and the third telescopic top end being disconnected due to the separation of the long straight tube body. 5A-5D are schematic views of a first telescoping tip having four different shapes in accordance with an embodiment of the present invention. It should be noted that the shape of the first telescopic tip of the heads 5A to 5D can be applied to the first telescopic end (10) of FIGS. 1A and 4A and 4B, so that FIG. 5a to FIG. The first part of the lion end is omitted, and the other parts of the probe card are omitted. Therefore, please refer to the figure, Fig. 4 or Fig. 4 for the other parts of the wooden needle △ card. As shown in FIG. 1A and FIG. 5A, in the present embodiment, the first telescopic 16 201118383
AbtK2266-NEW-FINAL-TW-20091120 頂鈿136a在朝向轉接板12〇的一側具有一圓滑凸面51〇。 請同時參照圖1A與圖5B，在本實施例中’每一第一 =縮頂端136a在朝向轉接板12〇的一側具有一凹洞52〇。 詳細而S，在本實施例中’伸縮頂端136a具有一圓滑凸面 530 ’且凹洞520是形成在圓滑凸面53〇之鄰近轉接板12〇 的區域上’以降低伸縮頂端136&對轉接板12〇之第二接點 124a的破壞性。 φ 請同時參照圖1A與圖5C，在本實施例中，每一第一 伸縮頂端136a在朝向轉接板12〇的一側具有一平面54〇。 請同時參照圖1A與圖5D，在本實施例中，每一第一 2縮頂端136a在朝向轉接板120的一側具有一冠狀(cr〇wn) 結構550。具體而言，冠狀結構55〇是由環狀排列的多個 錐狀體552所構成。 圖6A〜圖6C繪示本發明一實施例之具有三種不同形 狀的第二伸縮頂端的示意圖。值得注意的是，圖6A〜圖 6C所繪不的第二伸縮頂端的形狀皆可應用在圖丨八、圖4A • ^圖45的第二伸縮頂端136b上，故圖6A〜圖6C僅綠示 第一伸縮頂端的部分，而省略探針卡之其他部分，因此， 關於探針卡之其他部分，請參照圖1A、圖4A或圖4B。 凊同時參照圖1A與圖6A，在本實施例中，每一第二 伸縮頂端136b在遠離轉接板12〇的一側具有一平面61〇。 請同時參照圖1A與圖6B，在本實施例中，每一第二 伸縮頂端丨3 6 b在遠離轉接板12 0的一側具有多個尖狀凸起 62〇，以利於與待測晶片（未繪示）的晶片墊接觸。 201118383 ASEK2266-NEW-FINAL-TW-2009112〇 請同時參照圖1A與圖6C，在本實施例t，每—第二 ㈣之♦心麵Μ陳品有一朝向鄉狀結構 雜心Γ軸斜詳細而言，冠狀結構630可 =的斜面632a而與待測元件(未繪示)的i 穑隹面穩固接合，並提升冠狀結構630與銲球的接觸面 積，進而提升電性測試的準確性。 丧觸面 以你It所述，本發明利用轉接板來連接探針頭的頂針， =或ί是其他高接點密度的= 針盘轉;伸Ϊ頂端係抵靠轉接板的第二接點，故頂 轉接之間的連接相當穩固’使得頂針與 可靠土連接品質佳’並使得探針頭的使用壽命長且 作成再者，本發明之探針卡的製作方法簡易，故製 之間容^八她另外’由於本發明之探針頭拆卸容易且頂針 易刀辨，故本發明之探針卡容易維護。 本發ί然f發明已以實施例揭露如上，然其並非用以限定 本發明之領域中具有通常知識者，在不脫離 發明之伴2 圍内’當可作些許之更動與潤飾，故本 '、。又耗圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1Α綠不本發明-實施例之垂直式探針卡的刻面 18 201118383 /v〇nisJ266-NEW-FINAL-TW-20091120 圖IB奢示® 1A之轉接板的局部放大圖。 圖1C會示圖1Α之探針頭的局部放大圖。 圖2Α〜圖2C繪示圖}八之垂直式探針卡的其中— 製程的剖面圖。 圖3繪示本發明—實施例之頂针的剖面圖。 圖4Α繪示本發明一實施例之垂直試探針卡的剖面AbtK2266-NEW-FINAL-TW-20091120 The top 钿 136a has a rounded convex surface 51 在 on the side facing the adapter plate 12 〇. Referring to FIG. 1A and FIG. 5B simultaneously, in the present embodiment, each of the first=retracted tips 136a has a recess 52〇 on the side facing the adapter plate 12〇. In detail, in the present embodiment, the 'retractable tip 136a has a rounded convex surface 530' and the recess 520 is formed on the area of the smooth convex surface 53A adjacent to the adapter plate 12' to reduce the telescopic tip 136& The destructiveness of the second contact 124a of the board 12〇. φ Referring to Fig. 1A and Fig. 5C simultaneously, in the present embodiment, each of the first telescopic top ends 136a has a flat surface 54 在 on the side facing the arbor plate 12 〇. Referring to FIG. 1A and FIG. 5D simultaneously, in the present embodiment, each of the first tapered ends 136a has a crown structure 550 on a side facing the adapter plate 120. Specifically, the crown structure 55 is composed of a plurality of tapered bodies 552 arranged in a ring shape. 6A-6C are schematic views of a second telescopic top end having three different shapes according to an embodiment of the present invention. It should be noted that the shapes of the second telescopic top end depicted in FIG. 6A to FIG. 6C can be applied to the second telescopic top end 136b of FIG. 8 and FIG. 4A, FIG. 45, so that FIG. 6A to FIG. 6C are only green. The portion of the first telescopic tip is shown, and the other portions of the probe card are omitted. Therefore, please refer to FIG. 1A, FIG. 4A or FIG. 4B for other portions of the probe card. Referring to Figs. 1A and 6A, in the present embodiment, each of the second telescopic top ends 136b has a flat surface 61〇 on a side away from the adapter plate 12〇. Referring to FIG. 1A and FIG. 6B simultaneously, in this embodiment, each of the second telescopic top ends 丨 3 6 b has a plurality of pointed protrusions 62 在 on a side away from the adapter plate 120 , so as to facilitate testing and testing. The wafer pads of the wafer (not shown) are in contact. 201118383 ASEK2266-NEW-FINAL-TW-2009112 Please refer to FIG. 1A and FIG. 6C at the same time. In the present embodiment t, each of the second (four) ♦ Μ Μ Μ 品 有一 has a direction toward the home-like structure. In other words, the beveled surface 630 can be stably joined to the i-face of the component to be tested (not shown), and the contact area of the crown structure 630 with the solder ball is raised, thereby improving the accuracy of the electrical test. The contact surface is described by You It, the present invention utilizes an adapter plate to connect the thimble of the probe head, = or ί is the other high contact density = dial rotation; the extension top is against the second of the adapter plate The connection between the top and the top is quite stable, so that the quality of the thimble and the reliable soil is good, and the service life of the probe head is long and the preparation of the probe card of the present invention is simple. Between the two, the probe card of the present invention is easy to maintain because the probe head of the present invention is easy to disassemble and the thimble is easy to handle. The present invention has been disclosed in the above embodiments, but it is not intended to limit the general knowledge in the field of the invention, and may be modified and retouched without departing from the invention. ',. It is subject to the definition of the scope of the patent application attached to it. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 Α Green is not the invention - the facet of the vertical probe card of the embodiment 18 201118383 /v〇nisJ266-NEW-FINAL-TW-20091120 Figure IB Luxury® 1A part of the adapter plate Enlarged image. Figure 1C is a partial enlarged view of the probe head of Figure 1 . 2A to 2C are cross-sectional views showing the process of the vertical probe card of FIG. 3 is a cross-sectional view of a thimble of the present invention. 4A is a cross-sectional view of a vertical test probe card according to an embodiment of the invention.
圖Figure
4Β繪示本發明另一實施例之垂直試探針卡的剖面 圖5Α〜圖5D繪示本發明一實施例之具有四 _ 狀的第一伸縮頂端的示意圖。 不同形 圖6Α〜圖6C繪示本發明一實施例之具有三 _ 狀的第二伸縮頂端的示意圖。 〜不同形 【主要元件符號說明】 φ ι〇0、4〇〇 :垂直式探針卡 110 :電路板 120 =轉接板 122 :第一表面 122a :第一接點 124 :第二表面 124a :第二接點 130 :探針頭 19 201118383 ASEK2266-NEW-FINAL-TW-20091120 132、410 :第一板件 132a、412 :第一開孔 134、420 :第二板件 134a、422 :第二開孔 134b :底面 136、300a、300b、300c :頂針 136a :第一伸縮頂端 136b :第二伸縮頂端. 138、138c :彈性件 138a、138b :彈性件的一端 140 ··框架 142 :開口 150、160 :螺絲 310:長直管體 312、314 :長直管體的一端 414 :平板部 416 :支撐部 510、530 :圓滑凸面 520 :凹洞 540、610 :平面 550、630 :冠狀結搆 552、632 :錐狀體 620:尖狀凸起 A :空間 20 201118mNEW___T__ B :中空軸孔 C :轴向 D1、D2、D3 :間距 El、E2 :延伸部 L、U、L2 :限位開口 Μ :中心轴 R :凹槽 51 :第一止擋部 52 :第二止擋部 T :貫孔 U1 :外徑 U2 :開口直徑4Β shows a cross section of a vertical test probe card according to another embodiment of the present invention. FIG. 5A to FIG. 5D are schematic diagrams showing a first telescopic top end having a quadruple shape according to an embodiment of the present invention. Different shapes FIG. 6A to FIG. 6C are schematic diagrams showing a second telescopic top end having a triple shape according to an embodiment of the present invention. ~Different shape [Main component symbol description] φ ι〇0, 4〇〇: Vertical probe card 110: Circuit board 120 = Adapter plate 122: First surface 122a: First contact 124: Second surface 124a: Second contact 130: probe head 19 201118383 ASEK2266-NEW-FINAL-TW-20091120 132, 410: first plate 132a, 412: first opening 134, 420: second plate 134a, 422: second Opening 134b: bottom surface 136, 300a, 300b, 300c: thimble 136a: first telescopic top end 136b: second telescopic top end. 138, 138c: elastic member 138a, 138b: one end 140 of the elastic member · · frame 142: opening 150, 160: screw 310: long straight pipe body 312, 314: one end 414 of long straight pipe body: flat plate portion 416: support portion 510, 530: rounded convex surface 520: concave hole 540, 610: plane 550, 630: crown structure 552, 632: cone 620: pointed projection A: space 20 201118mNEW___T__ B: hollow shaft hole C: axial direction D1, D2, D3: spacing El, E2: extension L, U, L2: limit opening Μ: center Axis R: groove 51: first stop portion 52: second stop portion T: through hole U1: outer diameter U2: opening diameter
21twenty one