201117918 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種用於修整或者調節一化學機械拋光 (CMP)塾的器具’尤其是有關修整器的製法。 【先前技術】 化學機械拋光(Chemical Mechanical Polishing，CMP) 疋製作晶圓時的精密拋光製程，目的在於使晶圓表面全面平坦 化，以便設計之精微電路圖案經由曝光及顯影製程能完整的佈 於晶圓上。化學機械拋光時，是使研磨液不斷地被添加至旋轉 的拋光墊，借助磨粒的機械磨削及化學氧化劑的腐蝕作用來完 成對晶圓表面的拋光，使晶圓表面全面平坦化。 拋光墊表面在研磨過程中會產生拋光碎屑堆積。此堆積會 導致該拋光墊頂部釉化或硬化、使該等纖維纏結，而使得該抛 光墊表面不易抓持研磨液的磨粒，而降低拋光的效果。因此需 利用修整器對該拋光塾表面進行修整(Dressing)或者調整 (Conditioning) ’使拋光墊得以恢復拋光的效果。 傳統的修整H是以金屬基板、陶綠板等硬質基板為主 體，利用電鑛、燒結或硬銲之金屬結合劑層來固定鑽石磨粒。 例如台灣糊13_24揭補具轉基座之陶£研磨塾修整 器及其製造方法，係包含有：一塑膠基座；一陶究基板，裝設 於該塑膠基座上；及複數個研磨顆粒，湘由—喊粉末層加 熱後所形狀玻璃侧著層响該概個研細粒固著於該 陶兗基板上；其中該陶究粉末層係加熱至__1〇〇叱又如 201117918 台灣專利I22G657揭示的長條形修整器，其修整表面係為混合 有研磨顆粒的鑛層或硬銲層。 另有以樹脂廣固定結合鑽石磨粒者，例如台灣專利126拠揭 示的化學機械研磨修整器，是在每一超級磨粒的至少一部分與 該樹脂層之間設置-金屬縣，以便每―超級餘包括至少部 分地從該旨毅出的外露部分，該外露部分實質上在該金屬 鍍層之外。 以燒結、硬銲結合劑層來固定鑽石磨粒的結構，在受到高 溫的作用下或受到高溫結合_錢作用下，鑽石磨粒容易變 質、產生裂痕；因此當鑽石磨粒對拋光墊進行修整時，容易發 生脫落或_的絲。崎脂層固定鑽石練的方式，雖不會 有上述情況’但齡相料產生氣泡，#氣泡接觸鑽石磨粒 時’即會降側定鑽石練_持力4;因此當鑽石磨粒雌 光墊進行修整時，容易發生脫落或斷裂的現象。 又在燒結、硬銲或樹脂固定鑽石磨粒的作業中，鑽石磨粒 容易移動位置，難以使複數鑽石磨粒具有相等的突出高度，因 而修整器的研磨端面的平坦度較差。 【發明内容】 為了改善修整器的磨粒的固定作業，而提出本發明 本發明的主要目的，在提供一種修整器的製法，使修整器 的複數磨粒在被樹脂層固定前，先使複數磨粒的研磨端被黏著 劑固定於下模具，織再粒液S狀的樹脂，使複數磨粒在灌 201117918 注液態狀咖旨作業時，不會產生位移，而具有相同的突出高 度’而使健ϋ的研磨端雜為平坦。。 本矣月的另一目的’在提供一種修整器的製法，使結合複 數磨粒的液‘4狀的樹脂在固化前，經由加壓、抽真空的處理， 以降低樹軸喊泡含量，增加細旨對複數絲咖持力，使 複數磨粒在對研磨墊進行修整時較不會脫落。 本發明的其他目的、功效，請參晒式及實施例，詳細說 明如下。 【實施方式】 如圖卜2~1、2-2、3~1、3-2、4所示。本發明第一實施 例的修整裔的製法，包括如下步驟： (al)使複數磨粒11的研磨端111分別被黏著劑12黏結 於一下模具30形成複數凹槽31的底壁311;或使複數磨粒n 的研磨鳊111直接被黏著劑12黏結於一平坦下模具3〇上方； (a2)使一基板4置於一上模具32内，且置於複數磨粒 11的上方； (a3 )在一您閉空間3内，使被加壓的液態狀的樹脂5流 佈於下模具30、與基板4之間的流佈空間33内，並對該密閉 空間3進行抽真空作業； (a4)使液態狀的樹脂5固化而分別與基板4及複數磨粒 11結合成一第一實施例的結構體61; (a5)取出結構體61，如圖3_卜3_2所示，並去除黏結 201117918 於複數磨粒11的研磨端U1的黏著南 形成-第-實施例的修整器1G H所路出研磨端111即 磨粒11的研磨端ill對一拋光塾2進行作業修整。說 本實施例基板4的上義41及下· 42 ^具有至少— 對應於複數磨粒H的上凹槽411、下凹槽421 ;基板4並201117918 VI. Description of the Invention: [Technical Field] The present invention relates to an apparatus for trimming or adjusting a chemical mechanical polishing (CMP) crucible, particularly for a dresser. [Prior Art] Chemical Mechanical Polishing (CMP) The precision polishing process used in wafer fabrication to completely flatten the surface of the wafer so that the fine circuit pattern can be completely printed through the exposure and development process. On the wafer. In chemical mechanical polishing, the polishing liquid is continuously added to the rotating polishing pad, and the surface of the wafer is polished by the mechanical grinding of the abrasive grains and the corrosion of the chemical oxidant to completely flatten the surface of the wafer. The surface of the polishing pad produces a buildup of polishing debris during the grinding process. This accumulation causes the top of the polishing pad to be glazed or hardened to entangle the fibers, so that the surface of the polishing pad is less likely to grip the abrasive grains of the polishing liquid, and the polishing effect is lowered. Therefore, it is necessary to use a dresser to perform dressing or conditioning on the surface of the polishing pad to restore the polishing pad. The conventional trimming H is a hard substrate such as a metal substrate or a ceramic green plate, and the diamond abrasive grains are fixed by a metal bond layer of electric ore, sintering or brazing. For example, the Taiwan paste 13_24 uncovers the pedestal of the pedestal, the 塾 塾 塾 及其 and its manufacturing method, includes: a plastic pedestal; a ceramic substrate mounted on the plastic pedestal; and a plurality of abrasive particles , Xiang Yu - shouting the powder layer after the shape of the glass side layer of the layer of the fine grinding particles fixed on the ceramic substrate; wherein the ceramic powder layer is heated to __1 〇〇叱 and as 201117918 Taiwan patent The elongated trimmer disclosed in I22G657 has a trimmed surface which is a mineral or braze layer mixed with abrasive particles. In addition, a chemical mechanical polishing dresser disclosed in Taiwan Patent No. 126, which is widely fixed by a resin, is disposed between at least a portion of each superabrasive grain and the resin layer, so that each super The remainder includes an exposed portion that is at least partially derived from the purpose, the exposed portion being substantially outside the metal plating. The structure of the diamond abrasive grains is fixed by the sintering and brazing bond layer, and the diamond abrasive grains are easily deteriorated and cracked under the action of high temperature or high temperature combination; therefore, when the diamond abrasive grains are used to trim the polishing pad When it is easy to fall off or _ the wire. The method of fixing the diamond in the sashimi layer does not have the above-mentioned situation, but the age-phase material produces bubbles, and when the bubble is in contact with the diamond-grain, it will lower the side of the diamond _ holding force 4; therefore, when the diamond wears the grain When the mat is trimmed, it tends to fall off or break. Further, in the operation of sintering, brazing or resin-fixing diamond abrasive grains, the diamond abrasive grains are easily moved in position, and it is difficult to make the plurality of diamond abrasive grains have the same protruding height, and thus the flatness of the polished end surface of the dresser is poor. SUMMARY OF THE INVENTION In order to improve the fixing operation of the abrasive grains of the dresser, the main object of the present invention is to provide a method for manufacturing the dresser such that the plurality of abrasive grains of the dresser are first made before being fixed by the resin layer. The grinding end of the abrasive grain is fixed to the lower mold by the adhesive, and the resin of the re-granular s-like shape is woven, so that the plurality of abrasive grains do not have displacement when they are filled with the liquid-like operation, and have the same protruding height. Make the grinding end of the healthy joints flat. . Another purpose of this month is to provide a method for the preparation of a dresser, which is to reduce the amount of foaming of the tree shaft by increasing the pressure of the liquid in the form of a liquid containing a plurality of abrasive grains before curing. The purpose is to hold the plurality of silk coffee, so that the plurality of abrasive grains will not fall off when the polishing pad is trimmed. Other objects and effects of the present invention will be described in detail below. [Embodiment] As shown in Fig. 2~1, 2-2, 3~1, 3-2, 4. The method for preparing a trimmer according to the first embodiment of the present invention comprises the steps of: (al) causing the grinding ends 111 of the plurality of abrasive grains 11 to be adhered to the lower mold 30 by the adhesive 12 to form the bottom wall 311 of the plurality of grooves 31; The abrasive crucible 111 of the plurality of abrasive grains n is directly bonded to a flat lower mold 3 by the adhesive 12; (a2) placing a substrate 4 in an upper mold 32 and placed above the plurality of abrasive grains 11; In a closed space 3, the pressurized liquid resin 5 is flowed into the flow space 33 between the lower mold 30 and the substrate 4, and the sealed space 3 is evacuated; (a4) The liquid resin 5 is solidified and combined with the substrate 4 and the plurality of abrasive grains 11 to form a structure 61 of the first embodiment; (a5) the structure 61 is taken out, as shown in FIG. 3_b 3_2, and the adhesion is removed 2011 17818. Adhesion of the grinding end U1 of the plurality of abrasive grains 11 is formed. The dressing end 1G of the first embodiment is disposed at the grinding end 111, that is, the grinding end ill of the abrasive grain 11 is subjected to work trimming of a polishing crucible 2. It is to be noted that the upper surface 41 and the lower surface 42 of the substrate 4 of the present embodiment have at least the upper groove 411 and the lower groove 421 corresponding to the plurality of abrasive grains H;
連通上凹細、下凹槽421的複數通道43，以供液態狀的樹 脂5由上凹槽4U流至下凹槽421。可利用與上凹槽4ιι相配 合的壓板34由上方扣賴上凹槽411内液態狀的樹脂5， 使液態狀_脂5經過通道43流人流佈空間33内，以排除液 態狀的樹脂5内的氣泡，並配合對整個密閉空間3的抽真空， 可大幅降働脂5内的氣泡含量。複數磨粒u的上端ιΐ2分 别置於下凹槽内可抵#或不底靠基板4。基板4亦可不設置上 凹槽41卜下凹槽421或複數通道43，使液態狀的樹脂5由上 模具32及基板4之間的縫隙流入流佈空間泊内。 如圖5、6-1、6-2、7-1、7-2、8所示。本發明第二實施 例的修整器的製法除了以結合於液態狀的樹脂5外圍的環狀 的框架7取代基板4外，其餘步驟大至與上述第-實施例的製 法相同。本發明第二實施例的修整器的製法，包括如下步驟： (bl)使複數磨粒11的研磨端ιη分別被黏著劑12黏結 於—下模具30形成複數凹槽31的底壁311;或使複數磨粒11 的研磨端111直接被黏著劑12黏結於一平坦下模具3〇上方； (b2)使一環狀的框架7置於上模具32内，且套於複數 201117918 磨粒11的外圍； (b3)在一密閉空間3内，使被加壓的液態狀的樹脂5流 佈於框架7與下模具30圍成的流佈空間35内，並對該密閉空 間3進行抽真空作業； (b4)使液態狀的樹脂5固化而分別與框架7及複數磨本立 11結合成一第一實施例的結構體62 ;The plurality of channels 43 of the concave and lower grooves 421 are connected to allow the liquid resin 5 to flow from the upper groove 4U to the lower groove 421. The liquid-like resin 5 in the groove 411 can be fastened from above by the pressing plate 34 matched with the upper groove 4 ι, so that the liquid-like grease 5 flows through the passage 43 into the flow space 33 to exclude the liquid resin 5 The air bubbles inside, together with the vacuuming of the entire closed space 3, can greatly reduce the bubble content in the resin 5. The upper end ι 2 of the plurality of abrasive grains u can be placed in the lower groove to be offset or not to the substrate 4. The substrate 4 may not be provided with the upper groove 41 or the lower groove 421 or the plurality of channels 43, so that the liquid resin 5 flows into the flow space from the gap between the upper mold 32 and the substrate 4. As shown in Figures 5, 6-1, 6-2, 7-1, 7-2, and 8. The dresser of the second embodiment of the present invention is produced in the same manner as the above-described first embodiment except that the substrate 4 is replaced by an annular frame 7 bonded to the periphery of the liquid resin 5. The manufacturing method of the dresser according to the second embodiment of the present invention comprises the following steps: (bl) bonding the grinding ends of the plurality of abrasive grains 11 to the bottom wall 311 of the plurality of grooves 31 by the adhesive 12, respectively; The grinding end 111 of the plurality of abrasive grains 11 is directly bonded by the adhesive 12 to a flat lower mold 3〇; (b2) an annular frame 7 is placed in the upper mold 32, and is placed over the plurality of 201117918 abrasive grains 11 (b3) in a sealed space 3, the pressurized liquid resin 5 is flowed in the flow space 35 surrounded by the frame 7 and the lower mold 30, and the sealed space 3 is evacuated; B4) curing the liquid resin 5 and combining with the frame 7 and the plurality of mills 11 to form the structure 62 of the first embodiment;
(b5)取出結構體62，如圖7-1、7~2所示，並去除|占妹 於複數磨粒11的研磨端111的黏著劑12,露出研磨端lu即 形成一第二實施例的修整器10，，如圖8所示；可利用其複 數磨粒11的研磨端111對一拋光塾2進行作業修整。 本實施例可利用與框架7相配合的壓板36由上方向下擠 壓框架7内液態狀的樹脂5,以排除液態狀的樹脂5 並配合對整個賴空間3的抽真空，可大轉低液態狀的樹脂 5内的氣泡含量。本實施例雜架7結合於樹脂5的外圍，可 強化整體本實補也可不設置轉7，使被加壓的液 態狀的樹脂5流佈於上模具32與下模具3()圍成的流佈空間 内。 〇 喊一複數凹槽31，也可為一平坦表面。 本發明下模具3〇形成凹槽31 _壁312的高度卿坦下 模具30上的黏著劑12的厚度，都可用以決定磨㈣的研磨 端⑴突咖5崎；㈣的突 粒11高度的二分之—至四分之-之間；突出高心最好^ 201117918 ，可獲得樹脂5固定磨粒11的最佳 個磨粒11高度的三分之 效果。 述基板4、樞架7的材料可分別為不购等金屬材料或 陶瓷材料等硬質;^ M j χ β 為材枓。基板4、框架7的適當位置可分別設置 螺孔44、71 ’以方便彻螺絲結合其他物件。 上述黏著劑可為高分子材料，如環氧樹脂、石壤或高分子 材料加溶劑製成者。(b5) taking out the structure 62, as shown in FIGS. 7-1 and 7 to 2, and removing the adhesive 12 occupying the polishing end 111 of the plurality of abrasive grains 11 to expose the polishing end lu to form a second embodiment. The dresser 10, as shown in Fig. 8, can be used to trim a polishing crucible 2 by using the grinding end 111 of the plurality of abrasive grains 11. In this embodiment, the liquid resin 5 in the frame 7 can be pressed downward from the upper side by using the pressing plate 36 matched with the frame 7, so as to exclude the liquid resin 5 and cooperate with the vacuuming of the entire space 3, which can be greatly reduced. The content of bubbles in the liquid resin 5. In this embodiment, the miscellaneous rack 7 is bonded to the periphery of the resin 5, and the whole or the actual replenishment can be enhanced, and the pressurized liquid resin 5 can be flowed around the upper mold 32 and the lower mold 3 (). Within the space.喊 Shout a plural number of grooves 31, which can also be a flat surface. The lower mold 3 of the present invention forms the height of the groove 31 _ wall 312. The thickness of the adhesive 12 on the lower mold 30 can be used to determine the grinding end of the grinding (4) (1) the bulge 5 (4) the height of the bulge 11 Between two-to-four-point; highlighting the best heart ^ 201117918, the best effect of the height of the abrasive grain 11 of the resin 5 fixed abrasive 11 can be obtained. The material of the substrate 4 and the pivot frame 7 may be hard such as a metal material or a ceramic material which is not purchased, and ^ M j χ β is a material 枓. The screw holes 44, 71' may be respectively disposed at appropriate positions of the substrate 4 and the frame 7 to facilitate screwing of other objects. The above adhesive may be a polymer material such as an epoxy resin, a stone soil or a polymer material.
*可採用噴砂去除、電毁侧咖sketching)或溶劑炼解 等作業方式’去除黏結於複數絲11的研磨端111的黏著劑 12。 本^明的壓板34、36可為一熱壓頭，對其下方的粉狀的 树月曰加熱械液驗的樹脂5。或使—容器⑽粉狀的樹脂炫 化成液態狀的樹脂5後射人流佈空間33、％内。 本發明可以改善修整⑽餘_定作#，使修.整器的複 數磨粒在被樹脂_前，先使複數磨粒的研磨端被黏著劑固定 於下模具’絲再灌注液態狀的樹脂，再使液態狀的樹脂固化 固定結合魏鍊及去雜著於研__著劑；使複數磨粒 在灌注液態狀的樹脂作業時，不會產生位移，而具有相同的突 出高度’峨修整器的研磨端面較為平坦，並使結合複數磨粒 的樹脂^化前，經由加壓、抽真空的處理，以降低樹脂内的 氣泡含量，增加樹脂對複數磨粒的固持力，使複數磨粒在對研 磨墊進行修整時較不會脫落。 201117918 以上所記載，僅為利用本發明技術内容之實施例，任何熟 悉本項技藝者運用本發明所為之修飾、變化，皆屬本發明主張 之專利範圍，而不限於實施例所揭示者。 201117918 【圖式簡單說明】 圖1為本發明第一實施例修整器的製法的流程圖。 圖2-1為製作本發明第一實施例修整器的示意圖。 圖2-2為製作本發明第一實施例修整器的另—示意圖 圖3-1為本發明第一實施例結構體的示意圖。 圖3-2為本發明第一實施例結構體的另一示意圖。 圖4為本發明第一實施例修整器的示意圖。·* The adhesive 12 adhered to the polishing end 111 of the plurality of wires 11 can be removed by an operation such as sand blasting, electric slashing, or solvent refining. The pressure plate 34, 36 of the present invention may be a thermal head, and the resin 5 of the powdered tree raft is heated underneath. Alternatively, the resin (10) powdery resin is condensed into a liquid resin 5 and then injected into the space 33 and %. The invention can improve the trimming (10), and make the plurality of abrasive grains of the repairing device, before the resin, firstly fix the grinding end of the plurality of abrasive grains to the lower mold by the adhesive, and refill the liquid resin. Then, the liquid resin is solidified and fixed, combined with the Wei chain, and the mixed abrasive is used for the operation of the resin in the liquid state, and the displacement is not generated, but has the same protruding height. The grinding end surface of the device is relatively flat, and the resin combined with the plurality of abrasive grains is subjected to pressure and vacuum treatment to reduce the content of bubbles in the resin, thereby increasing the holding power of the resin against the plurality of abrasive grains, so that the plurality of abrasive grains are obtained. It does not fall off when the polishing pad is trimmed. The above description of the embodiments of the present invention is intended to be a modification of the present invention, and is not intended to limit the scope of the invention. 201117918 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing a method of manufacturing a trimmer according to a first embodiment of the present invention. Figure 2-1 is a schematic view showing the dresser of the first embodiment of the present invention. Fig. 2-2 is a schematic view showing the construction of the first embodiment of the present invention. Fig. 3-1 is a schematic view showing the structure of the first embodiment of the present invention. 3-2 is another schematic view of the structure of the first embodiment of the present invention. Figure 4 is a schematic view of a trimmer of a first embodiment of the present invention. ·
圖5為本發明第二實施例修整器的製法的示意圖 圖6-1為製作本發明第二實施例修整器的示。 、示意圖 圖6-2為製作本發明第二實施例修整器的另〜' ·。 圖7-1為本發明第二實施例結構體的示意圖。 圖7-2為本發明第二實施例結構體的另〜示此 圖8為本發明第二實施例修整器的示意圖。’己圖 【主要元件符號說明】 K) > 10’修整器 11磨粒 111研磨端 112上端 12黏者劑 2抛光塾 3密閉空間 3〇下模具 31凹槽 311底壁 312側壁 32上模具 33、35流佈空間 34、36壓板 4基板 41上端面 411上凹槽 42下端面 421下凹槽 43通道 44、71螺孔 5樹脂 201117918 61、62結構體 7框架 (al)、（a2)、（a3)、（a4)、（a5)、（bl)、（b2)、（b3)、（b4)、（b5)分別 為步驟編號Figure 5 is a schematic view showing the manufacturing process of the dresser of the second embodiment of the present invention. Figure 6-1 is a view showing the dresser of the second embodiment of the present invention. Fig. 6-2 is another example of the dresser of the second embodiment of the present invention. Figure 7-1 is a schematic view showing a structure of a second embodiment of the present invention. Figure 7-2 is a structural view of a second embodiment of the present invention. Figure 8 is a schematic view of a dresser according to a second embodiment of the present invention. '图图【Main component symbol description】 K) > 10' trimmer 11 abrasive grain 111 grinding end 112 upper end 12 adhesive 2 polishing 塾 3 confined space 3 〇 lower mold 31 groove 311 bottom wall 312 side wall 32 upper mold 33, 35 flow space 34, 36 pressure plate 4 substrate 41 upper end surface 411 upper groove 42 lower end surface 421 lower groove 43 channel 44, 71 screw hole 5 resin 201117918 61, 62 structure body 7 frame (al), (a2), (a3), (a4), (a5), (bl), (b2), (b3), (b4), (b5) are step numbers respectively
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