201117682 六、發明說明： 【發明所屬之技術領域】 [_本發明涉及-種印刷電路板，特別涉及—種具有防散熱 凹槽的印刷電路板及其製作方法。 【先前技術】 〇 [0002] 印刷電路板的電源層及接地層為了有較低的阻抗，一般 都會鋪設大面積的銅箔。如此，當連接到電源層和接地 層的插件經過錫爐加熱後，若插件的接腳沒有做適當的 熱隔離，熱就會迅速的被電源層及接地層上大面積的銅 箔帶走，從而使得電源層及接地層的插件孔吃錫率低而 造成冷焊，即不容易將插件焊接上。 【發明内容】 [0003] 鑒於以上内容’有必要提供一種具有防散熱凹槽的印刷 電路板及其製作方法，該印刷電路板可降低前述冷焊現 象的發生。 [0004] —種印刷電路板，其一層上設置有f銅箔、一插件孔及 〇 複數防散熱凹槽，該銅箱鋪設於該層的表面，該插件孔 貫穿整個印刷電路板，該防散熱凹槽為設置於該層表面 的凹槽且不被銅箔所覆蓋，該等防散熱凹槽環繞設置于 插件孔的周圍且兩相鄰的防散熱凹槽不相連接。 [0005] —種印刷電路板的製作方法，該印刷電路板具有一貫通 的插件孔’該製作方法包括以下步驟： [0006] 鋪設一鋼箔在該印刷電路板的一層上；以及 [0007] 於該銅鴒上在該插件孔的四周開設複數防散熱凹槽’該 098138587 表單編號A0101 第3頁/共12頁 0982066209-0 201117682 等防散熱凹槽環繞於該插件孔的周圍且兩相鄰的防散熱 凹槽不相連接，其中該防散熱凹槽的深度大於或等於該 銅箔的厚度。 [0008] 前述印刷電路板透過設置複數防散熱凹槽減小了插件孔 周圍銅箔的散熱面積，減慢了該印刷電路板經過回流焊 後的散熱速度，避免了因散熱過快而導致的插件元件出 現冷焊的情況。 【實施方式】 [0009] 請一併參閱圖1及圖2，本發明印刷電路板的較佳實施方 式以一接地層10為例進行說明，其他實施方式中，該接 地層10亦可為一電源層。該接地層10上設置有一層銅箱 12、一插件孔15及四個防散熱凹槽（Thermal Relief )16° [0010] 該銅箔12鋪設於該接地層10的表面。該插件孔15貫穿整 個印刷電路板，用於使得插入的元件與印刷電路板的接 地層10或者電源層（圖未示）以及訊號層上的傳輸線相 連通。 [0011] 每一防散熱凹槽16為一設置於接地層10表面的弧形凹槽 且不被銅箔12所覆蓋，其深度大於或等於銅箔12的厚度 即其穿透該銅箔12。該四個防散熱凹槽16呈環形設置於 該插件孔15的周圍，且四個防散熱凹槽16之間互不相連 ，然，每相鄰的兩個防散熱凹槽16之間彼此疊合。 [0012] 如此，當元件插接於印刷電路板的插件孔15中時，由於 四個防散熱凹槽16將插件孔15包圍起來，從而減小了插 0982066209-0 098138587 表單編號A0101 第4頁/共12頁 201117682 [0013] Ο [0014] ❹ [0015] [0016] [0017] [0018] 098138587 表單編號A0101 件孔1 5周圍銅箔1 2的散熱面積，減慢了該印刷電路板經 過回流焊後的散熱速度，避免了因散熱過快而導致的插 件元件出現冷焊的情況。又，四個防散熱凹槽丨6之間互 不相連從而使得接地層10上的銅羯12仍為一個整體，使 得接地層10仍然具有較低的阻抗。 請一併參閱圖3，其中曲線Α為習知印刷電路板上插件孔 内壁的溫度隨著接地層的厚度變化的示意圖，曲線B為本 發明印刷電路板上插件孔15内壁的溫度隨著接地層1〇的 厚度變化的示意圖。從圖3中可明顧看出，本發明印刷電 路板上插件孔内壁的溫度高於習知印刷電路板上插件孔 内壁的溫度。當接地層的厚度為62mils時，兩者溫差甚 至高達10攝氏度左右。 本實施方式以接地層1〇為例進行說明，其他實施方式中 ，該防散熱凹槽16亦可設置於其他層上。另，該防散熱 凹槽16的數量及形狀亦可根據設許煮的需要選擇，只需 . .... . ： ..... 滿足該防散熱凹槽16環繞在插件孔15的周圍且至少兩個 相鄰的防散熱凹槽16不相連即可。 请參閲圖4，本發明還提供了一種製作前述印刷電路板的 方法，包括以下步驟： 步驟S1 :鋪設銅荡12在該印刷電路板的接地層1〇上。 步驟S2 .於該銅落12上在該插件孔15的四周開設四個防 散熱凹槽16 ’該四個防散熱凹槽16環繞於該插件孔15的 周圍且兩相鄰的防散熱凹槽16不相連接。 綜上所述’本發明符合發明專利要件爰依法提出專利 第5頁/共丨2頁 0982066209-0 201117682 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0019] 圖1是本發明印刷電路板的較佳實施方式的示意圖。 [0020] 圖2是圖1中印刷電路板沿Π ~ Π方向的剖視圖。 [0021] 圖3是圖1中印刷電路板及習知印刷電路板上的插件孔的 溫度變化的仿真類比圖。 [0022] 圖4是本發明印刷電路板的製作方法的流程圖。 【主要元件符號:說明】 [0023] 接地層：10 [0024] 銅箔：12 [0025] 插件孔：15 [0026] 防散熱凹槽：16 098138587 表單蝙衆Α0101 第6頁/共12頁 0982066209-0201117682 VI. Description of the invention: [Technical field to which the invention pertains] [The present invention relates to a printed circuit board, and more particularly to a printed circuit board having a heat-dissipating recess and a method of fabricating the same. [Prior Art] 〇 [0002] The power supply layer and the ground plane of a printed circuit board are generally provided with a large area of copper foil in order to have a low impedance. Thus, when the plug connected to the power layer and the ground plane is heated by the tin furnace, if the pins of the plug are not properly thermally isolated, the heat is quickly carried away by the large area of copper foil on the power layer and the ground layer. Therefore, the plug hole of the power layer and the ground layer has a low tin consumption rate and causes cold soldering, that is, it is not easy to solder the plug. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a printed circuit board having a heat-dissipating recess and a method of fabricating the same, which can reduce the occurrence of the aforementioned cold soldering phenomenon. [0004] A printed circuit board having a layer of copper foil, a plug hole, and a plurality of anti-heat dissipation grooves disposed on a layer, the copper box being laid on a surface of the layer, the plug hole extending through the entire printed circuit board, the The heat dissipating recess is a groove disposed on the surface of the layer and is not covered by the copper foil. The heat dissipating recess is disposed around the insert hole and the two adjacent heat dissipation grooves are not connected. [0005] A method of fabricating a printed circuit board having a through-hole of a plug-in method comprising the steps of: [0006] laying a steel foil on a layer of the printed circuit board; and [0007] A plurality of anti-heat dissipation grooves are formed on the copper cymbal around the plug hole. The 098138587 form number A0101 3/12 pages 0982066209-0 201117682 and the like are provided around the plug hole and adjacent to each other. The heat dissipation grooves are not connected, wherein the depth of the heat dissipation grooves is greater than or equal to the thickness of the copper foil. [0008] The foregoing printed circuit board reduces the heat dissipation area of the copper foil around the plug hole by providing a plurality of anti-heat dissipation grooves, thereby slowing the heat dissipation speed of the printed circuit board after reflow soldering, and avoiding the heat dissipation due to excessive heat dissipation. The plug component is cold welded. [0009] Referring to FIG. 1 and FIG. 2 together, a preferred embodiment of the printed circuit board of the present invention is described by taking a ground layer 10 as an example. In other embodiments, the ground layer 10 can also be a Power layer. The ground layer 10 is provided with a copper box 12, a plug hole 15 and four heat dissipation recesses (Thermal Relief) 16[0010] The copper foil 12 is laid on the surface of the ground layer 10. The card opening 15 extends through the entire printed circuit board for interconnecting the inserted components with the ground plane 10 or power plane (not shown) of the printed circuit board and the transmission lines on the signal layer. [0011] Each of the heat dissipation recesses 16 is an arcuate groove disposed on the surface of the ground layer 10 and is not covered by the copper foil 12, and has a depth greater than or equal to the thickness of the copper foil 12, that is, it penetrates the copper foil 12. . The four anti-heat dissipation grooves 16 are annularly disposed around the insertion hole 15 , and the four anti-heat dissipation grooves 16 are not connected to each other. However, each adjacent two anti-heat dissipation grooves 16 are stacked one on another. Hehe. [0012] Thus, when the component is inserted into the card hole 15 of the printed circuit board, since the four heat-dissipating recesses 16 enclose the card hole 15, the insertion of the 0982066209-0 098138587 form number A0101 is reduced. [0013] [0018] [0018] 00138 [0018] 098138587 Form No. A0101 The heat dissipation area of the copper foil 12 around the hole 1 5 slows down the printed circuit board. The heat dissipation speed after reflowing avoids the cold soldering of the plug components due to excessive heat dissipation. Further, the four heat-dissipating recesses 6 are not connected to each other such that the copper bead 12 on the ground layer 10 is still integral, so that the ground layer 10 still has a lower impedance. Please refer to FIG. 3 together, wherein the curve 示意图 is a schematic diagram of the temperature of the inner wall of the plug hole on the printed circuit board according to the thickness of the ground layer, and the curve B is the temperature of the inner wall of the plug hole 15 on the printed circuit board of the present invention. Schematic diagram of the thickness variation of the formation. As is apparent from Fig. 3, the temperature of the inner wall of the card insertion hole on the printed circuit board of the present invention is higher than the temperature of the inner wall of the card insertion hole on the conventional printed circuit board. When the thickness of the ground plane is 62 mils, the temperature difference between the two is as high as about 10 degrees Celsius. In this embodiment, the ground layer 1 is used as an example. In other embodiments, the heat dissipation recess 16 may be disposed on other layers. In addition, the number and shape of the heat-dissipating recesses 16 can also be selected according to the needs of the cooking, and only the ... .... : ..... meets the heat-dissipating recess 16 around the insert hole 15 And at least two adjacent heat dissipation grooves 16 are not connected. Referring to FIG. 4, the present invention also provides a method of fabricating the foregoing printed circuit board, comprising the following steps: Step S1: Laying a copper pad 12 on a ground layer 1 of the printed circuit board. Step S2. Four anti-heat dissipation grooves 16 are formed around the insertion hole 15 on the copper drop 12. The four anti-heat dissipation grooves 16 surround the insertion hole 15 and two adjacent heat dissipation grooves. 16 is not connected. In summary, the invention conforms to the invention patent requirements, patents are filed according to law, and the application is filed on page 5 of the total number of pages 0982066209-0 201117682. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0019] FIG. 1 is a schematic view of a preferred embodiment of a printed circuit board of the present invention. 2 is a cross-sectional view of the printed circuit board of FIG. 1 taken along the Π to Π direction. [0021] FIG. 3 is a simulated analog diagram of temperature variations of the printed circuit board of FIG. 1 and the plug holes of the conventional printed circuit board. 4 is a flow chart of a method of fabricating a printed circuit board of the present invention. [Main component symbol: Description] [0023] Grounding layer: 10 [0024] Copper foil: 12 [0025] Plug-in hole: 15 [0026] Heat-proof groove: 16 098138587 Form bats Α 0101 Page 6 / Total 12 pages 0982066209 -0