TW201116939A - Multi-step contact printing process - Google Patents

Abstract

A multi-step contact printing process including the following steps is described. A mold is provided, wherein a surface of the mold includes a pattern structure. The pattern structure is a step structure, the pattern structure includes a plurality of step surfaces, and a top one of the step surfaces is located in the surface of the mold. A plurality of imprint material layers are formed to respectively cover the step surfaces. A plurality of substrates are provided, wherein one surface of each substrate is covered with a contact adhesive layer. A plurality of imprint steps are performed to respectively transfer the imprint material layers onto the contact adhesive layers on the substrates from high to low.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a transfer process, and more particularly to a multi-step contact transfer process. [Prior Art] In the general contact pattern transfer technique, a mold is usually provided, wherein the surface of the mold is provided with a pattern structure. The pattern of the pattern structure is the pattern to be transferred. The pattern structure has a top and a bottom surface. The surface of the mold core is formed by a transfer material layer. The mold core is then in microcontact with the substrate to be transferred or the resist layer on the substrate. 'At this time, the layer of transfer material deposited on the top of the surface of the mold will adhere to the substrate to be transferred, the resist layer on the board, and then demolded. At this time, the transfer material deposited on the top of the surface of the mold is deposited. The layer is transferred to a resist layer on the substrate or substrate. Then, the resist residue layer having no transfer material layer as an etch mask is removed by etching, and the lift-off process is performed or the substrate is directly etched to complete the contact transfer process. However, in the current contact transfer technology, a mold is only transferred to the transfer pattern of the same pattern as the mold core. If a transfer pattern is to be produced, the complementary mold must be reprinted and then transferred. In general, a mold core is transferred using only a layer of transfer material deposited on the top of its surface. Therefore, the effect of multiple transfer using a single mold core cannot be achieved. Therefore, the production efficiency of the conventional contact transfer process is not good, and it is impossible to produce a variety of transfer patterns, which not only increases the complexity of the process, but also affects the process yield. In addition to the above-mentioned shortcomings in the conventional contact pattern transfer technology, the conventional nanoimprint process, such as hot stamping or ultraviolet (uv) imprinting 201116939, also has disadvantages to be overcome. The traditional nanoimprint process usually provides a mold core in which the surface of the mold has a patterned structure. The pattern of the pattern structure is the pattern to be transferred. Next, the pattern structure is pressed onto the substrate to be transferred, or the resist layer on the substrate. The mold release is carried out, and the mold core is transferred from the substrate to transfer the pattern structure of the mold to the substrate or the resist layer on the substrate. Then, the residual layer of the resist is removed by etching to complete the imprint process. However, as can be seen from the above process, the conventional nanoimprint process has a problem that the photoresist Φ residual layer may be too thick. SUMMARY OF THE INVENTION Accordingly, it is an aspect of the present invention to provide a multi-step contact transfer process that utilizes a multi-layered three-dimensional mold for transfer. Therefore, the effect of multiple transfer can be achieved by using only a single mold core. Another aspect of the present invention provides a multi-step contact transfer process which, by employing a multi-layered stereo mold, can produce a substrate having a transfer pattern of the same order as the pattern structure of the mold core. . Therefore, not only the process cost can be reduced, but also the goal of high mass production, high efficiency, and diversification of transfer patterns can be achieved. Yet another aspect of the present invention is to provide a multi-step contact transfer process in which the transferred pattern has multiple complementarities. Therefore, the application of the reticle can directly form a high-precision alignment mark, which is beneficial to the fabrication of the reticle. Still another aspect of the present invention is to provide a multi-step contact transfer process which can transfer a material layer as an etch mask during transfer, so that 201116939 can avoid the problem of excessive thickness of the photoresist residual layer. In accordance with the above object of the present invention, a multi-step contact transfer process is proposed which comprises the following steps. A mold core is provided, wherein a surface of one of the mold cores is provided with a pattern structure. The pattern structure is a stepped structure, and the pattern structure comprises a plurality of step faces, one of the highest of which is located on the surface of the mold core. A plurality of layers of the transfer material are formed to cover the aforementioned step faces, respectively. A plurality of substrates are provided, wherein one of the surfaces of each of the substrates is covered with a contact adhesion layer. A plurality of transfer steps are carried out to transfer the transfer material layer on the step surface from the high and low portions to the contact adhesion layer of the substrate. According to an embodiment of the invention, the contact adhesion layer and the substrate may be the same material. With the present disclosure, it is possible to extend a surface of one of the mold cores to provide a pattern structure. The step surface included in the pattern structure can be extended into a multi-level step surface, so that multiple transfer can be achieved by using a single mold core, the process cost can be reduced, mass production and production efficiency can be improved, and the transfer pattern can be achieved. Diversified • Goals. Moreover, the transfer material layer can be used as an etch mask during the transfer process, so that the problem of excessive thickness of the photoresist residual layer can be avoided. In addition, the present disclosure can be applied to directly form high-precision alignment marks, thereby facilitating the fabrication of the mask. [Embodiment] % Please refer to the drawings, 2A, 3, 4B, 5A, 6, 7A, 8, 9A and 10, which illustrate a multi-step ^ contact transfer process according to the first embodiment of the present invention. Flow chart. In the present embodiment, when the multi-step connection 201116939 touch transfer process is performed, the mold core 100a for transfer is first provided. The surface 102a of the mold core 100a is preliminarily provided with a pattern structure 104a. The pattern structure 104a is a stepped structure and includes a first step surface 106a, a second step surface 108a, and a third step surface 110a. Wherein, as shown in FIG. 1A, the first step surface 106a is located in the surface 102a of the mold core 100a. The second step surface l8a is lower than the first step surface 106a, and the third step surface ii〇a is lower than the first step surface 106a. Two step faces i〇8a. In other embodiments, the stepped structure of the mold core may also contain more layers, or may include only two levels. In an embodiment, as shown in Fig. 1A, the first step surface 1〇6a, the second step surface 108a and the third step surface 11 may be planar. In another embodiment, as shown in Fig. 1B, in the mold core 100b, the first step surface lG6b, the second step surface 嶋, and the third step surface of the pattern structure 1 may be curved surfaces. Of course, in other embodiments, each step of the pattern structure may not be entirely planar or curved, and some of the steps may be planar, while other Psb are curved. In order to avoid repetition, the following description of the embodiments of the present disclosure is made by taking the model 100a of the 苐ia diagram as an example. The material of the model can be (4) materials with anti-(four) characteristics: The material of the mold test can also be made of a material that does not have anti-stick properties: the material of the two-tit said that the material of the mold can be, for example, a crucible, a polymer material, a plastic material, a semiconductor material, a metal glass material, or the like. A material synthesized from any one or more of the materials. When the straight bar has its anti-adhesive property, the direct transfer material layer 112 and the two-third transfer material layer 116 are respectively covered in the figure clam: 14", the first system, the first, the first A step surface 201116939 test, a second step face and a third step face 11 () & on the center, the mold = material is a metal, inorganic material, polymer series (polymer) with resistance characteristics Materials such as materials, running Xuan ^ ceramic materials, semiconductor materials, organic materials ^ 4 or more of them. When r 1〇〇a itself does not have anti-stick properties, it can be applied first. The pattern structure purchase material, the ancient eight early, θ material can be, for example, an organic material, no = two materials, a metal material, Teflon material, === (CXFy) deposited material after electropolymerization dissociation And a synthetic material of the above. Next, a first transfer surface is formed on the first step surface 108a of the material layer 114 and the third transfer material layer 116, and the first I1 self-latitude surface 1 l〇 On the top of the anti-adhesive layer 118 on the upper side of the μ, as in the first, there are r,: point: and 'to avoid repetition The following is a description of the material of the present disclosure by taking the adhesive property of the mold core 100a as an example. The material of the material layer 112, the second transfer material layer 114 and the third transfer material layer 116 may be For example, it includes materials such as Shi Xi, high-distillation materials, organic materials, plastic materials, semiconductor materials, and stone materials: materials, ceramic coffee, inorganic materials, and materials of two or more of the above materials. Or on the substrate (3). Langs-contact adhesive layer adhesion layer 124 on the material tt20 eight f / j22. Among them, the first contact curing material. Material = heat (four) (four) or photosensitive embodiment, the first contact point attached Material of layer 124 201116939 :: such as molecular polymer series material, light P and material, organic: ceramic; = material, quartz, glass material synthesized on the glass or both of them have the same layer on the first substrate = In the embodiment shown as the first-contact, the surface of the first substrate m is the surface of the first substrate m. In another embodiment, the surface of the first substrate may be The curved first substrate can be, for example, a columnar structure having a curved surface ^Manufacture of roller lining. The material of the first substrate 12G may include, for example, Shi Xi, : knive polymer series materials, organic materials, plastic materials, semiconductor materials, metal materials, quartz, glass materials, ceramic materials, inorganic materials, the above materials. a material synthesized by any two or more of them. Next, a transfer step is performed, and the surface 102a of the mold core 100a is first pressed against the surface 122 of the first substrate 12G, thereby making the first A transfer material layer 112 is bonded to the first contact adhesion layer 124. A pre-pressure is applied to bring the first transfer material layer 112 into close contact with the first contact adhesion layer 124. As shown in Figure 4A, this pre-pressure can be a uniform pressure 126. In another embodiment, as shown in Fig. 4B, the pre-pressure may also be a concentrated pressure of 13 〇, wherein the concentrated pressure 13 〇 may be provided by the drum 128. In addition to the above, the position of the concentrated pressure generated by the drum 128 described above or later = 30 can be applied to reduce the pressure at the end, the substrate end or both ends. The material of Li 128 may, for example, comprise ruthenium, polymer series materials, materials, plastic materials, semiconductor materials, metal materials, quartz, glass materials, (4) materials, inorganic materials, any of the above materials or any of the above 201116939 The material of the material is synthesized, or it may be

Light transmissive material. In order to avoid heavy = two over rollers 128 to apply 隼 懕 1 1 1 货 货 货 货 货 货 货 货 货 货 货 货 货 货 货 以下 以下 以下 以下By way of example, the embodiment of the present disclosure is carried out, and then the heat transfer is performed so that the first transfer material layer 112 is adhered to the first society.

Contact the adhesive layer U4. For example, as in the 5A:, in the photosetting curing process, the light source 132a can be provided, and the light source 132a can be illuminated by the concentrated illumination by the concentrating light from the gantry 8 through the roller 12.

Production: Contact adhesion I 124, and thereby the first transfer material layer 112 ^ is contacted in the adhesion layer 124. The wavelength range of the light source 132a can be, for example, between 1 nm and 1 〇 7 μηη. In another embodiment, a plurality of light sources l; 32a may be provided as shown in FIG. 5B, and the light sources 132a may illuminate and cure the first-contact adhesion in a dispersed manner without transmitting the light of the drum 128. Layer 124. In the embodiment of the photocuring described above or after, the incident position of the light source 132a may be at the end of the mold, at the end of the substrate, or at both ends. In other embodiments, when the heat curing process is performed, the first contact adhesion layer 124 may be heated by using a heating source such as the light source 132a shown in FIG. 5A or FIG. 5B as a heating source, or as in the 5C. The non-source heat source shown in the drawing, for example, the heat source 132b, heats the first contact adhesion layer 124 to a molten state of the glass transition temperature (Tg). Next, the pattern structure 104a of the mold 1a is pressed into the first contact adhesion layer 124. The first contact adhesion layer 124 is cooled and cured to thereby fix the first transfer material layer 112 in the first contact adhesion layer 124, or the liquid first contact adhesion layer 124 is added to the 201116939 heat to be thermally cured. Thereby, the first transfer material layer 112 is thereby fixed in the first contact adhesion layer 124, and the heating temperature at this time may be smaller than the glass transition temperature (Tg). The heating source may be, for example, a laser light heating source, a lamp source heating source, a thermistor heating source, an eddy current heating source, a microwave heating source or an ultrasonic heating source. The wavelength range of the laser light source or the light source illumination source may be, for example, between 1 nm and ΙΟ7 μηη. In the thermally cured embodiment described above or later, the heating source may be heated to the end of the mold, the substrate end or both ends. • Next, a demolding step is performed to remove the mold core 10a from the first contact adhesion layer 124 on the first substrate 120. Since, in the transfer step, the first transfer material layer has been fixed on the first contact adhesion layer 124. Therefore, after the mold core 100a is removed, the first transfer material layer 112 can be detached from the mold core i〇〇a and transferred to the first contact adhesion layer 124 as shown in FIG. Then, the next-order pattern transfer is continued. First, a second substrate 134 is provided. A second contact adhesion layer 138 is formed overlying the surface 136 of the second substrate 134. The material of the second contact adhesion layer 138 may comprise a thermoplastic material, a thermosetting material or a photocurable material. In an embodiment, the material of the second contact adhesion layer 138 may include, for example, germanium, polymer series materials, photoresist materials, organic materials, plastic materials, semiconductor materials, metal materials, quartz, glass materials, ceramic materials, A material synthesized by any one or both of an inorganic material and the above materials. In an embodiment, the second contact adhesion layer may also have the same material as the second substrate, that is, the second substrate directly serves as the second contact adhesion layer. The surface 136 of the second substrate 134 can be planar, or curved. For example, the second substrate 134 may be a columnar structure having a curved surface for making a roll mold 201116939. The material of the second substrate 134 may include, for example, tantalum, a polymer series material, an organic material, a plastic material, a semiconductor material, a metal material, a quartz, a glass material, a ceramic material, an inorganic material, or any two of the above materials. The materials synthesized above. Next, another transfer step of the same layer is performed using the same mold core 100a. First, the pattern structure 104a of the mold 1a is placed on the second contact adhesion layer 138 above the second substrate 134. At this time, the second contact adhesion layer 138 should have flowability or heat the second contact first. Adhesion layer 138 is melted into a φ shape. The pattern structure 104a of the mold core 100a is then pressed into the second contact adhesion layer 138 over the second substrate 134, thereby bonding the second transfer material layer 114 to the second contact adhesion layer 138. A pre-pressure is applied to bring the second layer of transfer material 114 into intimate contact with the second contact adhesion layer 138. This pre-pressure can be as uniform pressure 302 as shown in Figure 7A, or as concentrated pressure 130 as shown in Figure 4B. Next, thermal curing or photocuring treatment is carried out, and the applied pre-pressure at this time is described by the uniform pressure 302 to the embodiment of the present disclosure. As shown in Fig. φ 7A, the second transfer material layer 114 is attached to the second contact adhesion layer 138. When the photocuring treatment is performed, the light source 300a is provided, and the second contact adhesion layer 138 is irradiated and cured in a dispersed manner as shown in Fig. 7A. The wavelength range of the light source 300a may be, for example, between 1 nm and 107 μm. In other embodiments, when the applied pre-pressure is the concentrated pressure 130, thermal curing or photo-curing is performed, and the incident light source used can be incident as the light source 132a shown in Fig. 5 or Fig. 5 . In the photocuring embodiment described above or later, the incident position of the light source 132a and the light source 300a may be incident on the terminal end, the substrate end, or both ends. In other embodiments, when the thermal curing process is performed, the second contact adhesion layer may be heated by using a heating source such as the light source 300a shown in FIG. 7A or the light source 132a shown in FIG. 5A or 5B. 138, or a non-source heating source as shown in FIG. 7B, such as heat source 300b, to heat the second contact adhesion layer 138 to thermal cure, and then to cool the second contact adhesion layer 138, thereby The second transfer material layer 114 is fixed in the second contact adhesion layer 138. The heating temperature at this time may be less than the glass transition temperature (Tg). φ If the second contact adhesion layer 138 has been heated to melt before the thermal curing treatment, the second contact adhesion layer 138 is directly cooled and solidified during the thermal curing treatment, thereby thereby transferring the second transfer material. Layer 114 is secured in second contact adhesion layer 138. The heating source may be, for example, a laser light heating source, a light source illumination heating source, a thermal resistance heating source, an eddy current heating source, a microwave heating source or an ultrasonic heating source. The wavelength range of the laser light source or the light source illumination source may be, for example, between 1 nm and 107 μm. In the foregoing embodiment of the thermal curing described herein or later, the heating source may be heated to the end of the mold, the substrate end or both ends. Next, a demolding step is performed to remove the mold core 10a from the second contact adhesion layer 138 on the second substrate 134. Since, in the transfer step, the second transfer material layer 114 has been fixed on the second contact adhesion layer 138. Therefore, after the mold core l〇〇a is removed, the second transfer material layer 114 can be detached from the mold core 100a and transferred to the second contact adhesion layer 138 as shown in FIG. Referring to Fig. 8, the pattern transfer step of the second stage forms a stepped structure 164 in the second contact adhesion layer 138 of the second substrate 134. This step 13 201116939 ladder structure 164 includes a first step portion 146 and a second step portion 140. The first step portion 146 includes a first portion 142 and a second portion 144. The first transfer material layer 114 is attached to the first portion 142 of the first step portion 146 and exposes the second portion 144 of the second transfer material layer 114. Then, the pattern transfer of the next step is continued. First, a second substrate 148 is provided. A third contact adhesion layer 152 is formed overlying the surface 150 of the third substrate 148. The material of the third contact adhesion layer 152 may comprise a thermoplastic material, a thermosetting material or a photosensitive curable material. In an embodiment, the material of the first contact adhesion layer 152 may include, for example, Shi Xi, polymer series materials, photoresist materials, organic materials, plastic materials, semiconductor materials, metal materials, quartz, glass materials, ceramics. A material synthesized from any one or more of a material, an inorganic material, and the above materials. In one embodiment, the three-contact adhesive layer may also have the same material as the third substrate, that is, the second substrate directly serves as the third contact adhesion layer. The surface 150 of a second substrate 148 can be planar, or curved. For example, the second substrate 148 may be a columnar structure having a curved surface for making a roller mold. The material of the third substrate 148 may include, for example, a crushed polymer material, an organic material, a plastic material, a semiconductor material, a metal material, an English material, a glass material, a ceramic material, an inorganic material, or any of the above materials. Or a material synthesized by either or both. Next, the transfer process of the next layer can be performed by using the same mold 1〇〇a. First, the pattern structure l〇4a of the mold 1a is placed on the third contact adhesion layer 152 of the third substrate 148. At this time, the third contact adhesion layer 152-% has flowability or silk. The third contact adhesion layer 152 is heated to a dazzle. Next, the image of the mold (4) is pressed into the third contact adhesion layer 152 above the third substrate 148 201116939, whereby the third transfer material layer 116 is bonded to the third contact adhesion layer 152. A pre-pressure is applied to bring the third layer of transfer material 116 into intimate contact with the third contact adhesion layer 152. This pre-pressure can be as uniform pressure 154 as shown in Figure 9A, or as concentrated pressure 130 as shown in Figure 4B. Then, heat curing or photocuring treatment is performed to bond the third transfer material layer 116 on the third contact adhesion layer 152. The pre-pressure applied at this time is described in the embodiment of the present disclosure at a uniform pressure 154. As shown in Fig. 9A, when the photocuring treatment is performed, the light source 156a is provided, and the third contact adhesive layer 152 is irradiated and cured in a manner of dispersion irradiation as shown in Fig. 9A. The wavelength range of the light source can be, for example, between 1 nm and 107 μm. In other embodiments, when the applied pre-pressure is concentrated pressure 130, thermal curing or photo-curing is performed, and the incident light source used can be incident as the light source 132a shown in Fig. 5A or Fig. 5B. In the light-curing embodiment described above or later, the incident position of the light source 132a and the light source 156a may be incident on the terminal end, the substrate end, or both ends. In other embodiments, when the heat curing process is performed, the third contact adhesion layer 152 may be heated by using a heating source such as the light source 156a shown in FIG. 9A or the light source 132a shown in FIG. 5A or FIG. 5B. Or a non-source heating source as shown in FIG. 9B, such as heating source 156b, to heat the third contact adhesion layer 152 to thermally cure, and then to cool the third contact adhesion layer 152, thereby The transfer material layer 116 is fixed in the third contact adhesion layer 152. The heating temperature at this time may be less than the glass transition temperature (Tg). If the third contact adhesion layer 152 is heated before the heat curing treatment, the third contact adhesion layer 152 is directly cooled and cured by heating the third contact adhesion layer 152 to the fuse 15 201116939 - thereby performing the third transfer material layer. U6 is fixed in the third-contact, layer 152. The heating source may be, for example, a laser light source, a lamp thermal resistance source, an eddy current source, a micro-heat source or an ultrasonic heat source. Among them, the wavelength range of the laser light source or the light source heat source can be, for example,! Between nm and 1〇7 is called. In the heat curing embodiment described above or later, the heating source of the twisting source may be heated by the mold, the substrate end or both ends;; then, the demolding step is performed to remove the mold 100a is removed from the third contact adhesive layer 152 on the third slab 148. Because the third transfer material layer U6 has been expected to be in the third contact adhesion layer;; = therefore, after the mold core 100a is removed, the third transfer material layer 116 can be detached and transferred to the third contact adhesion layer 152, , and α are shown in Figure 10. As shown in Fig. 10, in the third contact adhesion layer 152 of the pattern transfer step 148 of the third stage, a step is formed. Any of the second step ladder structures 166 includes a first step portion 162 and a second second portion 166. This step • Three steps I58. Among them, the third transfer material layer portion 16 is formed on the first step portion 162. 116 is attached to the first stage. _ Referring to FIG. 11 and FIG. 12', a flow chart of a multi-step contact transfer process according to the first embodiment of the present invention is shown. In the present embodiment, the first two-imprint material layer 112 of the mold core i0〇a is transferred to the first contact adhesion layer of the first substrate 120 by, for example, etching method and the first transfer material layer: • A portion of the first contact adhesion layer 124 is removed to expose a portion 168 of the surface 122 of the first substrate 12, as shown in FIG. The first transfer material layer u can be moved into the first contact adhesion layer 124 after the portion 201116939 - the contact adhesion layer 124 is removed.夂 Pattern Turning Next, the first transfer material layer 112 is removed. Thus, the substrate 120 is formed by the first contact adhesion | 124 = the first structure 170' as shown in Fig. 12. The pattern of the structure of the object is rotated: from: a pattern of the layer 112 of the transfer material. Moved from the first

Please refer to «13 and f14, which show the flow chart of the multi-step contact transfer process according to the third embodiment, which is not shown in Fig. 11. The first transfer material layer 112 can be utilized. The first portion of the surface of the first substrate 120 exposed by the surface 122 is etched, and the portion of the first substrate m is removed. Thus, the depressed region 172 is opened in the first substrate 12G as shown in Fig. 13. Warfare Next, the first transfer material layer 112 is removed. Thus, the first contact adhesion layer 124 and the first substrate 120 can be formed to form the structure 174 as shown in FIG. The pattern of the pattern structure 174 is also rotated from the pattern of the first transfer material layer 112. In another embodiment, referring to Fig. 15, after the structure shown in Fig. 14 is completed, the remaining first contact adhesion layer 124 can be further removed. Thus, the pattern structure 176 can be formed in the first substrate 120. The pattern of pattern structure 176 is also transferred from the pattern of first transfer material layer 112. Referring to Figures 16 and 17, there is shown a flow chart of a multi-step contact transfer process in accordance with a fifth embodiment of the present invention. After the structure shown in FIG. 13 is completed, the pattern material layers 178 and 18〇 may be formed to cover the portions of the first substrate 120 exposed by the first transfer material layer 112 and the recess region 172, respectively, as shown in FIG. Shown. 17 201116939 Next, a lift-off step is performed to remove the first transfer material layer 112 and the pattern material layer 178 on the first transfer material layer 112. Thus, a pattern structure 182 composed of the first contact adhesion layer 124, the pattern material layer 180, and the first substrate 120 can be formed as shown in FIG. The pattern of the pattern structure 182 is also transferred from the pattern of the first transfer material layer 12 . Referring to Fig. 18, after the structure shown in Fig. 17 is completed, the remaining first contact adhesion layer 124 can be further removed. Thus, the pattern structure 丨 84 formed by the pattern material layer 180 and the first substrate 120 can be formed as shown in Fig. 18. The pattern of pattern structure 184 is also transferred from the pattern of first layer of transfer material 112. Referring to Figures 19 and 20, there is shown a flow chart of a multi-step contact transfer process in accordance with a seventh embodiment of the present invention. After the structure shown in FIG. 11 is completed, the pattern material layers 186 and 188 may be formed to cover the first transfer material layer 112 and the exposed portion 168 of the surface 丨 22 of the first substrate 120, respectively, as shown in FIG. . The pick-up step is performed to remove the first transfer material layer 112, and the pattern material layer 186 on the first transfer material layer 112. Thus, the pattern structure 190 formed by the first contact adhesion layer 124 and the pattern material layer 188 can be formed as shown in FIG. The pattern of the pattern structure 19 is also transferred from the pattern of the first transfer material layer 112. In another embodiment, referring to FIG. 21, after the structure shown in FIG. 19 is completed, the lifting step is performed except that the first transfer material layer 112 is removed and the first transfer material layer 112 is disposed. Outside the pattern material layer 186, the remaining first contact adhesion layer 124 can be removed. Thus, the pattern structure 192 formed by the pattern material layer 188 can be formed as shown in Fig. 21, 201116939. The pattern of the pattern structure 192 is substantially complementary to the pattern of the first transfer material layer Π2. Referring to Figures 22 and 23, there is shown a flow chart of a multi-step contact transfer process in accordance with a ninth embodiment of the present invention. Please refer to Figure 8 together. In the present embodiment, after the second transfer material layer 114 of the mold core 10a is transferred to the second contact adhesion layer 138 of the second substrate 134, for example, an etching method is used, and the second transfer material layer 114 is used. For the mask, come

Removing a portion of the second step portion 140 of the second contact adhesion layer 138 and the second portion 144 of the first step portion 146 to expose a portion of the surface 136 of the second substrate 134 below the second step portion 14? Figure 22 shows. Drinking Γ 冲 不 叩 叩 叩 僧 僧 僧 i i 崎. Liu, the second substrate 134 is formed with a pattern structure 194 formed by the second contact adhesion layer 138, as shown in FIG. Referring to Figures 24 and 25, there is shown a flow chart of a multi-step contact transfer process in accordance with the tenth embodiment. After the structure shown in FIG. 22, the second transfer material layer 丨μ and 7" can be used: the second portion 144 of the first step portion 触4 of the adhesion layer 138 is etched, and the second substrate 134 is etched. The portion of the surface 136 that is exposed is covered by the second substrate 134. Thus, the second substrate 134 is removed, as shown in Fig. 24. The sacrificial depression 丨 Next, the second transfer material layer 114 is removed. Thus, the second contact adhesion layer 138 and the second substrate 134 form a structure 198 as shown in FIG. Body 丨 Referring to Figure 26, after completing the structure shown in Fig. 25, the remaining second contact adhesion layer 138 is removed by mouth and step. Thus, the pattern structure 200 can be formed in the $11616939 board 134. Referring to Figures 27 and 28, there is shown a flow chart of a multi-step contact transfer process in accordance with a '12th embodiment of the present invention. After the structure shown in FIG. 24 is completed, the pattern material layers 202, 206 and 204 may be formed to cover the portion of the second substrate 134 exposed by the recessed region 196, the second portion 144 of the first step portion 146, and The second transfer material layer 114 is as shown in Fig. 27. Next, a lift-off step is performed to remove the second transfer material layer 114, and the pattern material layer 204 on the second transfer material layer 114. Thus, a three-dimensional pattern structure 208 composed of the first step portion 146 of the second contact adhesion layer 138, the pattern material layers 202 and 206, and the second substrate 丨 34 can be formed as shown in FIG. Referring to Fig. 29, after the structure shown in Fig. 28 is completed, the remaining second contact adhesion layer 138 can be further removed. Thus, a three-dimensional pattern structure 210 composed of the pattern material layer 202 and the second substrate 134 can be formed as shown in Fig. 29. • Referring to Figures 3 and 31, there is shown a flow chart of a multi-step contact transfer process in accordance with a fourteenth embodiment of the present invention. After the structure shown in FIG. 22 is completed, the patterned material layers 212, 214, and 216 may be formed to cover the exposed portions of the surface 136 of the second substrate 134, the second transfer material layer 114, and the first step portion 146, respectively. The second portion 144 is shown in Figure 30. Next, a lift-off step is performed to remove the second transfer material layer 114, and the pattern material layer 214 on the second transfer material layer U4. Thus, a three-dimensional pattern structure 218 formed by the first-pg ladder portion 146 of the second contact-adhesion layer 138 and the 201116939 pattern material layers 212 and 216 can be formed as shown in FIG. In another embodiment, referring to FIG. 32, after the structure shown in FIG. 30 is completed, the lifting step is performed except that the second transfer material layer 114 is removed and the second transfer material layer 114 is disposed. The pattern material layer 214 may further include removing the remaining second contact adhesion layer 138 and the pattern material layer 216 thereon. Thus, the pattern structure 220 composed of the pattern material layer 212 can be formed as shown in Fig. 32. Referring to Figures 33 and 34, there is shown a flow chart of a multi-step contact transfer process in accordance with a sixteenth embodiment of the present invention. Please refer to Figure 8 together. In the present embodiment, after the second transfer material layer 114 of the mold core 100a is transferred to the second contact adhesion layer 138 of the second substrate 134, the second transfer material layer 114 is masked by, for example, etching. The second portion 144 and the second step portion 140 of the first step portion 146 of the second contact adhesion layer 138 are removed to expose the second portion 144 of the first step portion 146 and the second portion below the second step portion 140. The surface 136 portion of the second substrate 134 is as shown in Fig. 33. After the second portion 144 and the second step portion 140 of the first step 146 of the second contact adhesion layer 138 are removed, the pattern of the second transfer material layer 114 can be transferred into the second contact adhesion layer 138. Next, the second transfer material layer 114 is removed. Thus, the pattern structure 222 formed by the first portion 142 of the first step portion 146 can be formed on the second substrate 134 as shown in Fig. 34. The pattern of the pattern structure 222 is transferred from the pattern of the second transfer material layer 114. Referring to Figures 35 and 36, there is shown a flow chart of a multi-step contact transfer process in accordance with a seventeenth embodiment of the present invention. After completing the structure shown in Fig. 33 of 201116939, the second transfer material layer 114 can be used as a mask to etch the exposed portion of the surface 136 of the second substrate 134 to remove the portion of the second substrate 134. Thus, the recessed region 226 is formed in the second substrate 134 as shown in Fig. 35. Next, the second transfer material layer 114 is removed. Thus, the pattern structure 228 formed by the first portion 142 of the first step portion 146 of the second contact adhesion layer 138 and the second substrate 134 can be formed as shown in Fig. 36. The pattern of the pattern structure 228 is also transferred from the second pattern of the second transfer material layer 114. In another embodiment, referring to Fig. 37, after the structure shown in Fig. 36 is completed, the remaining second contact adhesion layer 138 can be further removed. Thus, the pattern structure 230 can be formed in the second substrate 134. The pattern of pattern structure 230 is also transferred from the pattern of second transfer material layer 114. Referring to Figures 38 and 39, there is shown a flow chart of a multi-step contact transfer process in accordance with a nineteenth embodiment of the present invention. After the structure shown in FIG. 35 is completed, the pattern material layers 232 and 234 may be formed to cover the portion of the second substrate 134 and the second transfer material layer 114 exposed by the recessed region 226, such as the 38th. The figure shows. Next, a lift-off step is performed to remove the second transfer material layer 114 and the pattern material layer 234 on the second transfer material layer 114. Thus, the pattern structure 236 formed by the first portion 142 of the first step portion 146 of the second contact adhesion layer 138, the pattern material layer 232 and the second substrate 134 can be formed as shown in FIG. The pattern of pattern structure 236 is also transferred from the pattern of second transfer material layer 114.另一 In another embodiment, referring to FIG. 40, after the structure of 22 201116939 shown in FIG. 38 is completed, the lifting step is performed except that the second transfer material layer 114 and the pattern material layer thereon are removed. In addition to 234, one of the remaining second contact adhesion layers 138 may be included. Thus, the pattern structure 238 formed by the pattern material layer 232 and the second substrate 134 can be formed as shown in FIG. Referring to Figures 41 and 42, there is shown a flow chart of a multi-step contact transfer process in accordance with a second embodiment of the present invention. After the structure shown in Fig. 33 is completed, the pattern material layers 240 and 242 may be formed to cover the exposed portion of the surface 136 of the second substrate 134 and the second φ printing material layer II4, respectively, as shown in Fig. 41. Next, the lift-off step is performed to remove the second transfer material layer 114 and the pattern material layer 242 on the second transfer material layer 114. Thus, the pattern structure 224 formed by the first portion 142 of the first step portion 146 of the second contact adhesion layer 138 and the pattern material layer 24A can be formed as shown in FIG. In another embodiment, referring to FIG. 43, after the structure shown in FIG. 41 is completed, the lifting step is performed except that the second transfer material layer 114 Φ is removed from the pattern material layer 242 thereon. Removing the remaining second contact adhesion layer 138 can be included. Thus, the pattern structure 244 composed of the pattern material layer 240 can be formed as shown in Fig. 43. The pattern of pattern structure 244 is substantially complementary to the pattern of second transfer material layer 114. Referring to Figures 44 and 45, there is shown a flow chart of a multi-step contact transfer process in accordance with a twenty-third embodiment of the present invention. Please refer to Figure 10 together. In the present embodiment, the third transfer material layer 116 of the mold core 100a is transferred to the third contact adhesion layer ι52 of the third substrate 148. After the etching, the third transfer material layer 116 is used as a mask. The cover, 23 201116939 to remove a portion of the third step 158 and the second step 160 of the third contact adhesive layer 152 to expose a portion 246 of the third base plate 148 below the third step 158, such as Figure 44 shows. Next, the second transfer material layer 116 is removed. Thus, a three-dimensional pattern structure 248 composed of the first step portion 162 and the second step portion 160 of the third contact adhesion layer 152 can be formed on the third substrate 148 as shown in Fig. 45. Referring to Figures 46 and 47, there is shown a flow chart of a multi-step contact transfer process in accordance with a twenty-fourth embodiment of the present invention. After the structure shown in FIG. 44 is completed, the first step portion 16 of the third transfer material layer 116 and the second contact adhesion layer 152 may be used as a mask, leaving the exposed portion of the surface 246 of the third substrate 148, A portion of the third substrate 148 is removed. Thus, a recessed region 25A is formed in the third substrate 148 as shown in Fig. 46. Next, the second transfer material layer 116 is removed. Thus, a three-dimensional pattern structure m2 composed of the first step portion 162 of the second contact adhesion layer 152, the second step portion 160, and the second substrate 148 can be formed as shown in Fig. 47. Referring to Fig. 48, after the structure shown in Fig. 47 is completed, the remaining third contact adhesion layer 152 can be further removed. Thus, the pattern structure 254 can be formed in the third substrate 148. & δ Months Referring to Figs. 49 and 50, there is shown a flow diagram of a multi-step contact transfer process in accordance with a twenty-sixth embodiment of the present invention. After the structure shown in FIG. 46 is completed, the pattern material layers 256, 258, and 260 may be formed to cover the 24 201116939 portion, the second step portion 160, and the third portion of the third 1 plate 148 exposed by the recess region 250, respectively. The transfer material layer 116 is as shown in Fig. 49. The lift-off step is performed to remove the third transfer material layer 116 and the pattern material layer 260 on the third transfer material layer 114. Thus, the three-dimensional pattern structure 262 formed by the first step portion 162 and the second step portion 160 of the third contact adhesion layer 152, the pattern material layers 256 and 258, and the third substrate 148 can be formed, as shown in FIG. Shown. In another embodiment, referring to FIG. 51, after performing the structure shown in FIG. 49, the lifting step is performed except that the third transfer material layer 116 and the pattern material layer 260 thereon are removed. Removing the remaining third contact adhesion layer 152 can be included. Thus, a three-dimensional pattern structure 264' formed by the pattern material layer 256 and the third substrate 148 can be formed as shown in Fig. 51. Referring to Figures 52 and 53, a flowchart of a multi-step contact transfer process in accordance with a twenty-eighth embodiment of the present invention is shown. After the structure shown in FIG. 44 is completed, the pattern material layers 266, 268, and 270 may be formed to cover the exposed portions of the surface 246 of the third substrate 148, respectively, the second step portion 16A, and the third transfer material layer. 110, as shown in Figure 52. Next, the lift-off step is performed to remove the third transfer material layer 1丨6 and the pattern material layer 27〇 on the third transfer material layer 116. Thus, the three-dimensional pattern structure 272 formed by the first step portion 162 and the second step portion 160 of the second contact point layer 15 and the pattern material layers 266 and 268 can be formed as shown in Fig. 53. 1. In another embodiment, after the structure shown in FIG. 52 is completed by referring to FIG. 54, the lifting step is performed except that the third transfer material layer 116 25 201116939 and the pattern material layer 270 thereon are removed. In addition, the remaining third contact adhesion layer 152 and the pattern material layer 268 thereon may be removed. Thus, the pattern structure 274 composed of the pattern material layer 266 can be formed as shown in Fig. 54. Referring to Figures 55 and 56, there is shown a flow chart of a multi-step contact transfer process in accordance with a thirtieth embodiment of the present invention. Please refer to Figure 1G together. In the present embodiment, after the third transfer material layer 116 of the mold core is transferred to the third contact adhesion layer 152 of the second substrate 148, for example, the fourth transfer material layer 116 is used as a mask. , the second step portion (10) and the third step portion 158 of the third contact adhesion layer 152 are removed to expose the second step Qiu &&& The surface 246 of the third substrate 148 below the Ρ160 and the third step portion 158 is as shown in Fig. 55. After removing the second turns of the third contact adhesion layer 152 and the third step portion 158, the pattern of the second transfer material layer β ^ 6 can be transferred to the third contact adhesion layer 152. . Next, the third transfer 耔nr 1 layer 11 移除 is removed. Thus, the pattern structure 276' formed of the first step 162 and the step 162 can be formed on the second substrate 148 as shown in Fig. 56. The pattern of the graphic structure 276 is transferred from the pattern of the third transfer material layer 116. Please refer to Fig. 57 and Fig. 58 for the second embodiment of the present invention, which is a flow chart showing the first & une stage contact transfer process in accordance with the present invention. After the structure shown in FIG. 55 is completed, the third transfer material layer 116 can be used as a mask to etch the surface of the third substrate 148, and the exposed portion of the clothing surface 246 is removed. A portion of the third substrate 14S. Thus, a recessed region 278 is formed in the second substrate 148, as shown in Fig. 57. Next, the third transfer material is removed, and the layer 116 is removed. Thus, the pattern structure 280 formed by the first step portion 162 of the second contact adhesion layer 152 and the third substrate 148 of 26 201116939 can be formed as shown in Fig. 58. In another embodiment, please refer to the 59th. After the structure shown in FIG. 58 is completed, the remaining third contact adhesion layer 152 can be further removed. Thus, the pattern structure 282 can be formed in the third substrate 148. The pattern of the pattern structure 282 is also transferred from the third. A pattern of the transfer material layer 116. Referring to Figures 60 and 61, there is shown a flow chart of a multi-step contact transfer process in accordance with a twenty-second embodiment of the present invention. After the structure shown in the figure, the pattern material layers 284 and 286 may be formed to be respectively covered. The portion of the third substrate 148 exposed on the recessed portion 278 and the third transfer material layer 116 are as shown in Fig. 60. Next, a lift-off step is performed to remove the third transfer material layer 116, and The pattern material layer 286 on the second transfer material layer 1丨6. Thus, the pattern structure formed by the first step portion 162 of the third contact adhesion layer 152, the pattern material layer 284 and the third substrate 148 can be formed. 288, as shown in Fig. 61. • In another embodiment, referring to Fig. 62, after the structure shown in Fig. 60 is completed, the lifting step is performed except that the third transfer material layer is removed. 116, in addition to the pattern material layer 286 thereon, may further include removing the remaining third contact adhesion layer 152. Thus, a pattern structure 29 共同 formed by the pattern material layer 284 and the second substrate 148 may be formed, such as the 62nd Please refer to FIG. 63 and FIG. 64, which are flowcharts showing a multi-step contact transfer process according to a twenty-fifth embodiment of the present invention. After the structure shown in FIG. 55 is completed, 'The pattern material layers 292 and 294 can be formed first on the third substrate M8 The exposed portion of the surface 246 and the third turn 27 201116939 printed material 116, as shown in Fig. 63. & performing the lift-off step while removing the third transfer material layer 116, Γ =: ΓΡ material layer 116 The pattern material layer 294. Thus, the first step portion 162 of the second contact adhesion layer 152 and the pattern material 292 together form a pattern structure 296, as shown in Fig. 64. v 65 ® ^ 63 spot: the picture on the map In addition to removing the third transfer material layer 152, the pattern is formed by the pattern material layer 292: = =:: Figure 65. The pattern. 22 = is complementary to the pattern of the second transfer material layer 116. The case of the above embodiment shows that the connection of the present invention is a combination of the =T;:j_b layer. j use the early 1 kernel, you can achieve the effect of multiple transfer. By multi-level stereo mode ί:: use this: the advantage is because of the process cost, can reach the high volume of the second case, so not only can reduce the goal. The efficiency of the return, and the transfer pattern are diverse. According to the above embodiments, another advantageous (four) day of the present invention is that the multi-step contact transfer process of the present invention is completed by the transfer mark because of the alignment mark, which is advantageous for the mask. ^作. The invention can be directly formed with high precision. The re-exposure of the present invention is that the multi-step contact transfer process of the present invention can transfer the material layer as an etch mask during the transfer process, as described in 28 201116939. Therefore, the problem that the thickness of the residual layer of the photoresist is excessively large can be avoided. The present invention has been disclosed in the above embodiments, and is not intended to limit the present invention. Any one of ordinary skill in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the description of the drawings is as follows: ΙΑ, 2A, 3, 4B, 5A, 6, 7A, 8, 9A and 10 are flow charts showing a multi-step contact transfer process in accordance with a first embodiment of the present invention. Fig. 1B is a cross-sectional view showing a mold core according to another embodiment of the present invention. • Fig. 2B is a schematic cross-sectional view showing a mold core provided with an anti-adhesion layer and a transfer material layer in accordance with another embodiment of the present invention. Figure 4A is a schematic view showing the pressing of a mold core and a substrate in accordance with another embodiment of the present invention. Fig. 5B is a schematic view showing an apparatus of an illumination mode according to another embodiment of the present invention. Figure 5C is a schematic view of a device for heating in accordance with still another embodiment of the present invention. - Figure 7B is a schematic diagram of an apparatus for adding 29 201116939 in accordance with another embodiment of the present invention. Figure 9B is a schematic view of a device for heating in accordance with another embodiment of the present invention. 11 and 12 are flow charts showing a multi-step contact transfer process in accordance with a second embodiment of the present invention. Figures 13 and 14 are flow charts showing a multi-step contact transfer process in accordance with a third embodiment of the present invention. Figure 15 is a cross-sectional view showing a base plate after pattern transfer according to a fourth embodiment of the present invention. Fig. 16 and Fig. 17 are flow charts showing a multi-step contact transfer process in accordance with a fifth embodiment of the present invention. Figure 18 is a cross-sectional view showing a substrate after pattern transfer according to a sixth embodiment of the present invention. 19 and 20 are flow charts showing a multi-step contact transfer process in accordance with a seventh embodiment of the present invention. Figure 21 is a cross-sectional view showing the eighth embodiment of the present invention after the pattern has been transferred. BRIEF DESCRIPTION OF THE DRAWINGS Figures 22 and 23 are flow charts showing a multi-step contact transfer process in accordance with a ninth embodiment of the present invention. Fig. 24 and Fig. 25 are flow charts showing a multi-step contact transfer process in accordance with a tenth embodiment of the present invention. Figure 26 is a cross-sectional view showing a substrate after pattern transfer according to an eleventh embodiment of the present invention. Figures 27 and 28 are flow diagrams showing a multi-step contact transfer process in accordance with the twelfth embodiment of the present invention 30 201116939. Figure 29 is a cross-sectional view of the substrate after pattern transfer according to the thirteenth embodiment of the present invention. Figure 30 and Figure 31 are flow charts showing a multi-step contact transfer process in accordance with a fourteenth embodiment of the present invention. Figure 32 is a cross-sectional view showing a substrate after pattern transfer according to a fifteenth embodiment of the present invention. Figures 33 and 34 are flow charts showing a multi-step contact transfer process in accordance with a tenth embodiment of the present invention. Figures 35 and 36 show a flow chart of a multi-step contact transfer process in accordance with the seventeenth aspect of the present invention. Figure 37 is a cross-sectional view showing the eighteenth solid substrate in accordance with the present invention after pattern transfer. Fig. 38 and Fig. 39 are flow charts showing a multi-step contact transfer process according to the nineteenth aspect of the present invention. Figure 40 is a cross-sectional view showing the second substrate in accordance with the present invention after printing (Fig. 4). The present invention is a flow chart showing a multi-step contact transfer process in accordance with the first aspect of the present invention. Figure 43 is a cross-sectional view showing the second substrate in accordance with the present invention after pattern transfer. - Figure 44 - Figure 45 is a flow chart showing a state-of-the-art touch printing process in accordance with the first mode of the present invention. A drawing of a multi-step contact transfer process in accordance with a twenty-fourth embodiment of the invention of the twenty-fourth embodiment 31 201116939 is incorporated herein by reference. A cross-sectional view of a substrate according to a twenty-fifth embodiment of the present invention after pattern transfer. Fig. 50 is a flow chart showing a multi-step contact transfer process in accordance with a twenty-sixth embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 7 is a cross-sectional view showing a substrate after pattern transfer according to a twenty-seventh embodiment of the present invention.

Fig. 52 and Fig. 53 are flowcharts showing a multi-step contact transfer process in accordance with a twenty-eighth embodiment of the present invention. Figure 54 is a cross-sectional view showing a substrate after pattern transfer according to a twenty-ninth embodiment of the present invention. 55 and 56 are flow charts showing a multi-step contact transfer process in accordance with a thirtieth embodiment of the present invention. 57 and 58 are flow charts showing a multi-step contact transfer process in accordance with a thirty-first embodiment of the present invention. Figure 59 is a cross-sectional view showing a substrate after pattern transfer according to a thirty-second embodiment of the present invention. Fig. 60 and Fig. 61 are flow charts showing a multi-step contact transfer process in accordance with a thirty-third embodiment of the present invention. Figure 62 is a cross-sectional view showing a substrate after pattern transfer according to a thirty-fourth embodiment of the present invention. Figures 63 and 64 are flow diagrams showing a multi-step contact transfer process in accordance with a thirty-fifth embodiment of the present invention. Figure 65 is a cross-sectional view showing a substrate of a 32 201116939 substrate after pattern transfer according to a thirty-sixth embodiment of the present invention.

[Main element symbol description] 100a = mold core 100b 102a: surface 102b 104a: pattern structure 104b 106a: first step surface 106b 108a: second step surface 108b 110a: third step surface 110b 112 first transfer material layer 114: 116 third transfer material layer 118 : 120 first substrate 122 124 first contact adhesion layer 126 128 roller 130 : 132a : light source 132b 134 second substrate 136 138 second contact adhesion layer 140 142 first portion 144 146 first step portion 148 150 Surface 152 154 Uniform pressure 156a 156b: Heating source 158: 160 Second step 162: 164 Stepped structure 166: 168 Part 170: : Mold: Surface: Pattern structure: First step surface: Second step surface : third step surface second transfer material layer anti-adhesive layer surface uniform pressure concentration pressure: heating source surface second step portion second portion third substrate third contact adhesion layer: light source third step portion first step portion Stepped structure pattern structure 33 201116939

172 : recessed region 174 : pattern structure 176 : pattern structure 178 : pattern material layer 180 : pattern material layer 182 : pattern structure 184 : pattern structure 186 : pattern material layer 188 : pattern material layer 190 : pattern structure 192 : pattern structure 194 : Pattern structure 196 : recessed area 198 : pattern structure 200 : pattern structure 202 : pattern material layer 204 : pattern material layer 206 : pattern material layer 208 : pattern structure 210 : pattern structure 212 : pattern material layer 214 : pattern material layer 216 : pattern Material layer 218 : pattern structure 220 : pattern structure 222 : pattern structure 224 : pattern structure 226 : recessed area 228 : pattern structure 230 : pattern structure 232 : pattern material layer 234 : pattern material layer 236 : pattern structure 238 : pattern structure 240 : Pattern material layer 242 : Pattern material layer 244 : Pattern structure 246 : Surface 248 : Pattern structure 250 : Depression area 252 : Pattern structure 254 : Pattern structure 256 : Pattern material layer 258 : Pattern material layer 260 : Pattern material layer 262 Pattern structure 264 : Pattern structure 266 : Pattern material layer 268 : Pattern material layer 270 : Pattern material layer 272 : Pattern structure 274 : Pattern structure 34 201116939 276 Pattern structure 278 280 Pattern structure 282 284 Pattern material layer 286 288 Pattern structure 290 292 Pattern Material layer 294 296 pattern structure 298 300a: light source 300b 302: uniform pressure depression pattern pattern structure pattern material layer pattern structure pattern material layer pattern structure: heating source

35

Claims (1)

201116939 VII. Patent application scope: " 1. A multi-step contact transfer process comprising: 'providing a mold core, wherein one surface of the mold core is provided with a pattern structure, the pattern structure is a stepped structure, and the pattern structure The pattern structure comprises a plurality of step surfaces, wherein the highest one of the step surfaces is located on the surface of the mold core; forming a plurality of transfer material layers respectively covering the step surfaces; providing a plurality of substrates, wherein each of the substrates One surface is covered with a contact adhesion layer; and • a plurality of transfer steps are performed to cause the transfer material layers on the step surfaces to be transferred from the high and low layers to the contact adhesion layers of the substrates . 2. The multi-step contact transfer process of claim 1, further comprising etching the contact adhesion layers with the transfer material layers as masks to completely remove the contact adhesion layers from being unaffected The portions of the transfer material layer are masked to expose a portion of the surface of each of the substrates. 3. The multi-step contact transfer process of claim 2, after the step of etching the contact adhesion layers, further comprising removing the transfer material layers from the contact adhesion layers. 4. The multi-step contact transfer process of claim 2, after the step of etching the contact adhesion layers, further comprising etching the each of the substrates by using the transfer material layers as masks This part of the surface is exposed. 36 201116939 5. The multi-step contact transfer process of claim 4, after the step of etching the substrates, further comprising removing the layers of the transfer material from the contact adhesion layers. 6. The multi-step contact transfer process of claim 5, after the step of removing the layers of transfer material, further comprising removing the remaining contact adhesion layers. 7. The multi-step contact transfer process of claim 4, after the step of etching the substrates, further comprising forming a plurality of pattern material layers respectively covering the transfer material layers and exposing the substrates On these surfaces. 8. The multi-step contact transfer process of claim 7, after forming the pattern material layer, further comprising performing a plurality of lift-off steps to separately remove the remaining contact adhesion layers, and Some of the transfer material layers above the adhesion layer and the pattern material layers. 9. The multi-step contact transfer process of claim 2, after the step of etching the contact adhesion layers, further comprising forming a plurality of pattern material layers respectively covering the transfer material layers and the substrates The surfaces are exposed to the portions. 10. The multi-step contact transfer process of claim 9, after forming the pattern material layer, further comprising performing a plurality of lift-off steps to remove the remaining contact adhesion layers, respectively, 37 201116939, and The transfer material layer on the contact adhesion layer and the pattern material layer. 11. The multi-step contact transfer process of claim 1, further comprising etching the contact adhesion layers with the transfer material layers as masks to remove uncovered layers of the transfer material A portion of the contact adhesion layers of the mask, wherein the step of etching the contact adhesion layers proceeds until a portion of the surface of each of the substrates is exposed. 12. The multi-step contact transfer process of claim 11, after the step of etching the contact adhesion layers, further comprising removing the transfer material layers from the contact adhesion layers. 13. The multi-step contact transfer process of claim 11, after the step of etching the contact adhesion layer, further comprising respectively using the transfer material layer and the remaining contact adhesion layers as a mask, The portion of each of the substrates that is exposed to the surface is etched. 14. The multi-step contact transfer process of claim 13, after the step of etching the substrates, further comprising removing the layers of transfer material from the contact adhesion layers. 15. The multi-step contact transfer process of claim 14, after the step of removing the layers of transfer material, further comprising removing the remaining contact bonds. 38 201116939 16. The multi-step contact transfer process of claim 13, after the step of etching the contact adhesion layers, after the step of etching the substrates, further comprising forming a plurality of pattern material layers respectively covering The transfer material layer, the exposed contact adhesion layer and the surfaces exposed by the substrates. 17. The multi-step contact transfer process of claim 16, after forming the pattern material layer, further comprising performing a plurality of lift-off steps to remove the remaining contact adhesion layers, respectively, and Some of the transfer material layers above the adhesion layer and the pattern material layers. 18. The multi-step contact transfer process of claim 11, after the step of etching the contact adhesion layers, further comprising forming a plurality of pattern material layers respectively covering the transfer material layers and exposing the layer The contact adhesion layer and the portions of the substrates on which the surfaces are exposed. 19. The multi-step contact transfer process of claim 18, after forming the pattern material layer, further comprising performing a plurality of lift-off steps to remove the remaining contact adhesion layers, respectively, and Some of the transfer material layers above the adhesion layer and the pattern material layers. 20. The multi-step contact transfer process of claim 1, wherein the material of the mold comprises bismuth, polymer series materials, organic materials, plastic materials, semiconductor materials, metal materials, quartz, glass materials, ceramics 39 201116939 Materials, inorganic materials, materials of either or both of the above materials. 21. The multi-step contact transfer process of claim 1, wherein the shape structure of the step faces comprises a plane, a curved surface, or a combination thereof. 22. The multi-step contact transfer process of claim 1, wherein the surface of the mold core is covered with an anti-stick layer. 23. The multi-step contact transfer process of claim 22, wherein the anti-adhesion layer is made of an organic material, an inorganic material, a southern molecular material, a ceramic material, a metal material, a Teflon material, a diamond-like carbon. A material, a deposited material of a fluorocarbon (CxFy) after plasma dissociation, or a synthetic material of two or more thereof. 24. The multi-step contact transfer process of claim 1, wherein the material of the substrate comprises sand, polymer series materials, organic materials, plastic materials, semiconductor materials, metal materials, quartz, glass materials. A material synthesized from any one or more of a ceramic material, an inorganic material, and the above materials. 25. The multi-step contact transfer process of claim 1, wherein the materials of the transfer material layer comprise bismuth, polymer series materials, organic materials, plastic materials, semiconductor materials, metal materials, quartz, Any of the glass materials, ceramic materials, inorganic materials, any of the above materials, or both, 40 201116939. 26. The multi-step contact transfer process of claim 1, wherein the material of the contact adhesion layer comprises a thermoplastic material, a thermosetting material, or a photosensitive curable material. 27. The multi-step contact transfer process of claim 1, wherein the material of the contact adhesion layer comprises germanium, a polymer series material, a photoresist material, an organic material, a plastic material, a semiconductor material, a metal material. , quartz, glass material, ceramic material, inorganic material, material of any two or more of the above materials. 28. The multi-step contact transfer process of claim 1, wherein the transferring step further comprises: heating a contact adhesion layer with a heat source to contact the transfer material layer The contact adhesive layers are cured. 29. The multi-step contact transfer process of claim 28, wherein the heating source is a laser light heating source, a light source illumination heating source, a thermal resistance heating source, and an eddy current heating source. , a microwave heating source or an ultrasonic heating source. 30. The multi-step contact transfer process of claim 29, wherein the laser light source and the source illumination source have a wavelength in the range of 1 nm to 7 μm. The multi-step contact transfer process of claim 1, wherein the transferring step further comprises: performing a photocuring treatment on the contact adhesion layers by using a light source, so as to be associated with the step surfaces The portions of the transfer material are cured in contact with the contact adhesive layers that are in contact with each other. 32. The multi-step contact transfer process of claim 31, wherein the source has a wavelength in the range of from 1 nm to 107 μm. 33. The multi-step contact transfer process of claim 1, wherein each of the transfer steps further comprises applying a concentrated pressure or a uniform pressure. 34. The multi-step contact transfer process of claim 33, wherein the step of applying the concentrated pressure comprises utilizing a roller on the other surface of the mold relative to the surface, and/or each of the substrates A pressing step is performed on the other surface of the surface. 35. The multi-step contact transfer process of claim 1, wherein the material of the mold is a metal, an inorganic material, a polymer material, a ceramic material, a semiconductor material, and the like. An organic material or a material synthesized by any two or more of the above materials. 36. The multi-step contact transfer process of claim 1, wherein each of the transfer steps further comprises: 42 201116939 performing a heat treatment on the contact adhesion layer with a heating source to achieve the contact adhesion layer Melting; and pressing the pattern structure into the contact adhesion layer. 37. The multi-step contact transfer process of claim 36, wherein the heat treating comprises bringing the contact adhesion layers to a glass transition temperature (Tg). 43