TWI412891B - Method for photo-curing contact printing micro/nano patterns - Google Patents

Abstract

A method for photo-curing contact printing micro/nano patterns is described. The method includes the following steps. A mold is provided, wherein a surface of the mold includes a pattern structure including at least one convex portion and at least one concave portion. A print material layer is formed to at least dispose on the convex portion. A substrate is provided, wherein a photosensitive solidification material layer is formed on a surface of the substrate. The print material layer on the convex portion is pressed on the photosensitive solidification material layer. An illumination step is performed on the photosensitive solidification material layer to solidify the photosensitive solidification material layer and to fix the print material layer on the convex portion into the photosensitive solidification material layer. The mold is removed. A patterning step is performed on the photosensitive solidification material layer by using the print material layer as a mask until a portion of the surface of the substrate is exposed.

Description

Contact curing method of light curing micro-nano pattern

The present invention relates to a transfer method, and more particularly to a contact transfer method for a photocurable micro-nano pattern.

In the current contact micro-nano pattern transfer technology, the transfer material on the pattern structure projection of the mold core is usually laminated on the surface of the substrate. Next, the transfer material layer is heated to cause the transfer material layer to reach the glass transition temperature to cause a melting phenomenon. Thereby, the transfer material layer can be adhered to the surface of the substrate to be pressed into contact. Then, the mold core is removed, and the transfer material layer adhered to the surface of the substrate is transferred onto the surface of the substrate to complete the contact transfer process.

However, heating the transfer material layer to its glass transition temperature consumes a large amount of thermal energy, resulting in an increase in the process heat budget. In addition, the heating process of the transfer material layer is also disadvantageous for pattern transfer on the flexible substrate, which reduces the applicability of the contact transfer process.

Therefore, one aspect of the present invention provides a contact transfer method of a photocurable micro-nano pattern, which uses a photosensitive curing material as a material to be contacted with a transfer layer, so that only a light irradiation is required in the transfer process. The transfer layer to be contacted can be effectively cured without using any heat source for curing the transfer layer to be contacted. Therefore, the thermal budget of the contact transfer process can be greatly reduced.

Another aspect of the present invention is to provide a contact transfer method of a photocurable micro-nano pattern which can be carried out at room temperature without raising the temperature to the glass transition temperature of the transfer layer to be contacted. Therefore, the contact transfer method of the photocurable micro-nano pattern can be applied to pattern transfer on a flexible substrate such as a plastic material, a polymer series material or an organic material.

According to the above aspect of the invention, a contact transfer method of a photocurable micro-nano pattern is proposed, comprising the following steps. A mold core is provided, wherein the mold core has opposite first and second surfaces, and the first surface includes a pattern structure including at least one protrusion and at least one recess. The anti-adhesion layer is selectively formed on the surface of the mold core according to the anti-adhesion property of the surface of the mold core, and then the transfer material layer is formed at least on the convex portion. A substrate is provided, wherein one surface of the substrate is provided with a photosensitive curing material layer. The transfer material on the projection is laminated on the photosensitive cured material layer. The photosensitive cured material layer is subjected to an irradiation step to cure the photosensitive cured material layer, and the transfer material layer on the convex portion is fixed in the photosensitive cured material layer. Remove the mold kernel. The photosensitive material layer is subjected to a patterning step by using a transfer material layer in the photosensitive cured material layer as a mask until a portion of the surface of the substrate is exposed.

According to an embodiment of the invention, after the patterning step, the contact transfer method of the photocurable micro-nano pattern further comprises removing the transfer material layer in the photosensitive cured material layer.

According to another embodiment of the present invention, after the patterning step, the contact transfer method of the photocurable micro-nano pattern further comprises the following steps. The exposed portion of the surface of the substrate is subjected to an etching step by using a transfer material layer in the photosensitive cured material layer as a mask. The photosensitive material layer and the transfer material layer in the photosensitive cured material layer are removed.

According to still another embodiment of the present invention, after the patterning step, the contact transfer method of the photocurable micro-nano pattern further comprises the following steps. A pattern material layer is formed on the exposed portion of the transfer material layer in the photosensitive cured material layer and the surface of the substrate. A Lift-off step is performed to remove the photosensitive cured material layer, the transfer material layer and the pattern material layer on the photosensitive cured material layer.

According to the above aspect of the invention, a contact transfer method of a photocurable micro-nano pattern is further provided, which comprises the following steps. A mold core is provided wherein the mold core has opposing first and second surfaces. A layer of transfer material is formed on a portion of the first surface of the mold core, wherein the layer of transfer material forms a pattern structure. A substrate is provided, wherein one surface of the substrate is provided with a photosensitive curing material layer. The transfer material is laminated on the photosensitive cured material layer. The photosensitive cured material layer is subjected to an irradiation step to cure the photosensitive cured material layer, and the transfer material layer is fixed in the photosensitive cured material layer. Remove the mold kernel. The photosensitive material layer is patterned by the transfer material layer as a mask until a portion of the surface of the substrate is exposed.

By adopting the photosensitive curing material, the curing of the transfer layer to be contacted can be performed without using a heating method, thereby reducing the process heat budget and facilitating transfer patterning of the flexible substrate.

In one embodiment, when the contact transfer of the micro-nano pattern is performed, the mold core 100 may be first provided as shown in FIGS. 1A, 1B, 1C, and 1D. The mold core 100 includes two surfaces 102 and 104, wherein the two surfaces 102 and 104 are respectively located on opposite sides of the mold core 100. The surface 102 of the mold core 100 is provided with a pattern structure 110. The pattern structure 110 includes at least one protrusion 106 and at least one recess 108, wherein the protrusion 106 and the recess 108 together define a pattern of the pattern structure 110.

In an embodiment, the pattern size of the pattern structure 110 can be on the order of microns. In another embodiment, the pattern size of the pattern structure 110 can be nanometer.

In the present embodiment, the material of the mold core 100 may include, for example, tantalum, a polymer series material, an organic material, a plastic material, a semiconductor material, a metal material, a quartz, a glass material, a ceramic material, an inorganic material, or the like. A material synthesized by any two or more of them.

In the embodiment shown in Fig. 1A, the mold core 100 itself is composed of an anti-adhesive material, so that no additional anti-adhesion layer may be provided on the surface 102 of the mold core 100. At this time, the material of the mold core 100 may be a fluorine-containing polymer series material, such as ethylene tetrafluoroethylene produced by DuPont, or a fluorine-free polymer. Polymer series materials, such as polyethylene terephthalate (PET), or polyurethane acrylate, which are resistant to adhesion. In this embodiment, transfer material layers 112 and 114 can then be formed directly on surface 102 of mold core 100. The transfer material layer 112 is located on the protrusion 106 of the pattern structure 110, and the transfer material layer 114 is located on the recess 108 of the pattern structure 110. In another embodiment, the transfer material layer 112 may be formed only on the protrusions 106 of the pattern structure 110, and no transfer material layer is formed in the recesses 108 of the pattern structure 110, as shown in FIG. 1D. .

In the embodiment shown in Figures 1B and 1C, the mold core 100 itself may be composed of a non-adhesive material. Therefore, the anti-adhesion film layer 116 can be formed on the pattern structure 110 of the surface 102 of the mold core 100. Then, as shown in FIG. 1B, the transfer material layer 112 may be formed only on the projections 106 of the pattern structure 110 of the mold core 100. Alternatively, as shown in FIG. 1C, the transfer material layers 112 and 114 may be formed on the projections 106 and the recesses 108 of the pattern structure 110 of the mold core 100, respectively.

In another embodiment, when the contact transfer of the micro-nano pattern is performed, the mold core 200 may be first provided as shown in FIGS. 1E and 1F. The mold core 200 includes two surfaces 202 and 204, wherein the two surfaces 202 and 204 are respectively located on opposite sides of the mold core 200. When the mold core 200 itself is composed of an anti-adhesive material, as shown in FIG. 1E, the surface 202 of the mold core 200 has been provided with a transfer material layer 206. The transfer material layer 206 constitutes a pattern structure 210. In still another embodiment, when the mold core 200 itself may be composed of a non-adhesive material, as shown in FIG. 1F, an anti-sticking layer 208 may be formed on the surface 202 of the mold core 200, and then the anti-sticking layer is formed. A pattern structure 210 composed of a transfer material layer 206 is formed on the mucous layer 208. The material used in the mold core 200 can be the same as the mold core 100. In addition, the pattern size of the pattern structure 210 may be on the order of micrometers or nanometers.

While the mold core 100 is provided, the substrate 118 to be contacted for transfer can be provided. In the embodiments shown in FIGS. 1A, 1B, 1C, 1D, 1E, and 1F, the substrate 118 may have a planar structure and thus may include two surfaces 120 and 122, wherein The two surfaces 120 and 122 are respectively located on opposite sides of the substrate 118. In other embodiments, a drum or other non-planar structure may be employed as the substrate. Therefore, the substrate can also have a curved surface. In one embodiment, the substrate can be cylindrical, so that the roller mold can be fabricated.

In the present embodiment, the material of the substrate 118 may include, for example, tantalum, a polymer series material, an organic material, a plastic material, a semiconductor material, a metal material, a quartz, a glass material, a ceramic material, an inorganic material, or any of the above materials. A material synthesized by two or more of them.

Next, as shown in FIGS. 1A, 1B, 1C, 1D, 1E, and 1F, the photosensitive cured material layer 124 is formed on the surface 120 of the substrate 118. The material of the photosensitive cured material layer 124 may be, for example, a polymer material, a photoresist material, an organic material, or a material synthesized by any two or more of the above materials. In an embodiment, the material of the photosensitive cured material layer 124 may be, for example, an ultraviolet curable resin. Then, the surface 102 of the mold core 100 having the pattern structure 110 faces the photosensitive cured material layer 124 on the surface 120 of the substrate 118.

Hereinafter, several embodiments of the present disclosure will be described by taking the structure of the mold 100 shown in Fig. 1A as an example. Of course, in other embodiments of the present invention, the mold structure shown in Figs. 1B, 1C, 1D, 1E, and 1F can be employed.

The transfer material layer 112 on the projections 106 of the pattern structure 110 of the mold core 100 is pressed against the photosensitive cured material layer 124 on the surface 120 of the substrate 118. Referring to FIG. 2A, when the mold core 100 and the substrate 118 are pressed, a concentrated pressure 128 can be applied to the mold core 100 from the surface 104 of the mold core 100, and/or a concentrated type can be applied to the substrate 118 from the surface 122 of the substrate 118. The pressure is 128B. For example, a roller 126 is used to perform a rolling step on the surface 104 of the mold core 100 or the surface 122 of the substrate 118, and a concentrated pressure 128 is applied to the mold core 100.

In another embodiment, referring to FIG. 2B, when the mold core 100 and the substrate 118 are pressed, a uniform pressure 130 can be applied from the surface 104 of the mold core 100 and/or the surface 122 of the substrate 118.

When a concentrated pressure 128 or a uniform pressure 130 is applied, a pressurization method such as mechanical, electromagnetic, hydraulic or pneumatic can be used.

Next, the photosensitive cured material layer 124 is irradiated with incident light 132 to cure the photosensitive cured material layer 124. When the photosensitive cured material layer 124 is cured, since the transfer material layer 112 on the protruding portion 106 of the pattern structure 110 of the mold core 100 is pressed into the photosensitive cured material layer 124, the curing of the photosensitive cured material layer 124 can be performed. The transfer material layer 112 is fixed in the photosensitive cured material layer 124. In one embodiment, the wavelength of incident light 132 used to illuminate the photosensitive cured material layer 124 may range, for example, between 1 nm and 10 ⁷ μm. The choice of incident light 132 may depend on the photosensitive cured material layer 124 employed. In some embodiments, the incident light 132 can be a laser or a light source.

In the present embodiment, it is not necessary to heat and cure the photosensitive cured material layer 124 by the heat source. Therefore, the photosensitive cured material layer 124 can be irradiated at room temperature. Therefore, not only can the thermal budget of the process be reduced, but also the transfer process of the flexible substrate can be facilitated. If the photosensitive cured material layer 124 is required to be pre-baked for photocuring, the transfer material layer 112 on the projection 106 of the pattern structure 110 of the mold core 100 is pressed before the transfer. Before the layer of the material 124 is cured, it can be baked first. At this time, the material of the photosensitive cured material layer 124 is, for example, a photosensitive cured material containing a volatile solvent. The prebaking temperature may be determined in accordance with the material properties of the photosensitive cured material layer 124.

In an embodiment, referring to FIG. 3A, the incident light 132 can illuminate the photosensitive cured material layer 124 via the roller 126. The incident light 132 is transmitted through the focus of the roller 126, and the light intensity of the focus point is increased, so that the curing of the photosensitive cured material layer 124 can be accelerated.

In another embodiment, referring to FIG. 3B, the incident light 132 may also illuminate the photosensitive cured material layer 124 without passing through the roller 126, but may be from the other end of the photosensitive cured material layer 124 that is not directly contacted by the roller 126. Irradiation is performed.

In still another embodiment, referring to FIG. 3C, when the mold core 100 and the substrate 118 are pressed by the uniform pressure, the photosensitive cured material layer 124 can be irradiated from the surface 104 of the mold core 100.

In still another embodiment, referring to the 3D drawing, when the mold core 100 and the substrate 118 are pressed by the uniform pressure, the photosensitive solidified material layer 124 may be irradiated from the surface 122 of the substrate 118.

After the curing process of the photosensitive cured material layer 124 is completed, the mold core 100 is removed from the surface 120 of the substrate 118. At this time, the transfer material layer 112 is fixed in the photosensitive cured material layer 124 due to the curing of the photosensitive cured material layer 124, and the mold core 100 itself has anti-stick properties (such as FIG. 1A and FIG. 1D). The patterned structure 110 of the mold or the mold 100 is covered with an anti-sticking layer 116 (as shown in Figures 1B and 1C). Therefore, after the mold core 100 is removed, the transfer material layer 112 is attached or embedded in the photosensitive cured material layer 124 as shown in FIG.

Next, the inductive curing material layer 124 is patterned by using the transfer material layer 112 as a mask, and a portion of the photosensitive curing material layer 124 is removed until a portion of the surface 120 of the substrate 118 is exposed, whereby the transfer is performed. The pattern of the material layer 112 is transferred into the photosensitive cured material layer 124. At this time, as shown in FIG. 5, the stacked structure of the transfer material layer 112 and the patterned photosensitive cured material layer 124 constitutes a pattern structure 134. The pattern of the pattern structure 134 is transferred from the pattern of the mold core 100. In an embodiment, an etching method can be utilized, for example, when patterning the photosensitive cured material layer 124.

In another embodiment, the transfer material layer 112 may also be removed after the patterning of the photosensitive cured material layer 124 is completed.

In another embodiment, after the pattern structure 134 of FIG. 5 is formed, the substrate 118 is patterned again with the transfer material layer 112 as a mask to transfer the pattern of the pattern structure 134 to the surface 120 of the substrate 118. In, as shown in Figure 6A. When the surface 120 of the substrate 118 is patterned, the exposed portions of the surface 120 of the substrate 118 can be etched using, for example, an etch.

As shown in FIG. 7A, after the patterning of the substrate 118 is completed, the transfer material layer 112 and the remaining photosensitive cured material layer 124 are removed, and the pattern structure 136 is formed in the surface 120 of the substrate 118.

In still another embodiment, after the pattern structure 134 of FIG. 5 is formed, the pattern material layers 138 and 140 are first formed on the exposed portions of the surface 120 of the transfer material layer 112 and the substrate 118, as shown in FIG. 6B. Shown. Next, the photosensitive cured material layer 124 and the transfer material layer 112 and the pattern material layer 138 thereon are removed by, for example, lift-off, and a pattern structure composed of the pattern material layer 140 is formed on the surface 120 of the substrate 118. 142, as shown in Figure 7B. The pattern of the pattern structure 142 is complementary to the pattern of the pattern structure 110 of the mold core 100.

It can be seen from the above embodiments that one of the advantages of the present invention is that the contact transfer method of the photocurable micro-nano pattern of the present invention uses a photosensitive curing material as the material of the transfer layer to be contacted, so that only the transfer process is required. The transfer layer to be contacted can be effectively cured by irradiation with light without using any heat source for curing the transfer layer to be contacted. Therefore, the thermal budget of the contact transfer process can be greatly reduced.

It can be seen from the above embodiments that another advantage of the present invention is that the contact transfer method of the photocurable micro-nano pattern of the present invention can be carried out at room temperature without increasing the temperature to the glass transition of the transfer layer to be contacted. temperature. Therefore, the contact transfer method of the photocurable micro-nano pattern can be applied to pattern transfer on a flexible substrate such as a plastic material, a polymer series material or an organic material.

The present invention has been disclosed in the above embodiments, and is not intended to limit the present invention. Any one of ordinary skill in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100. . . Mold

102. . . surface

104. . . surface

106. . . Protrusion

108. . . Depression

110. . . Pattern structure

112. . . Transfer material layer

114. . . Transfer material layer

116. . . Anti-adhesive layer

118. . . Substrate

120. . . surface

122. . . surface

124. . . Photosensitive curing material layer

126. . . roller

128. . . pressure

130. . . pressure

132. . . Incident light

134. . . Pattern structure

136. . . Pattern structure

138. . . Pattern material layer

140. . . Pattern material layer

142. . . Pattern structure

200. . . Mold

202. . . surface

204. . . surface

206. . . Transfer material layer

208. . . Anti-adhesive layer

210. . . Pattern structure

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

FIG. 1A is a schematic view showing the arrangement of a mold core and a substrate according to an embodiment of the present invention.

FIG. 1B is a schematic view showing the arrangement of a mold core and a substrate according to another embodiment of the present invention.

FIG. 1C is a schematic view showing the arrangement of a mold core and a substrate according to still another embodiment of the present invention.

FIG. 1D is a schematic view showing the arrangement of a mold core and a substrate according to still another embodiment of the present invention.

FIG. 1E is a schematic view showing the arrangement of a mold core and a substrate according to still another embodiment of the present invention.

FIG. 1F is a schematic view showing the arrangement of a mold core and a substrate according to still another embodiment of the present invention.

2A is a schematic view showing the pressing of a mold core and a substrate according to an embodiment of the present invention.

FIG. 2B is a schematic view showing the pressing of a mold core and a substrate according to another embodiment of the present invention.

FIG. 3A is a schematic diagram showing illumination of a mold core and a substrate according to an embodiment of the present invention.

FIG. 3B is a schematic diagram showing illumination of a mold core and a substrate according to another embodiment of the present invention.

FIG. 3C is a schematic view showing illumination of a mold core and a substrate according to still another embodiment of the present invention.

FIG. 3D is a schematic diagram showing illumination of a mold core and a substrate according to still another embodiment of the present invention.

4 is a schematic view showing a mold core separated from a substrate according to an embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view showing a transfer pattern formed on a substrate according to an embodiment of the present invention.

6A and 7A are cross-sectional views showing a process of forming a pattern on a substrate in accordance with another embodiment of the present invention.

6B and 7B are cross-sectional views showing a process of forming a pattern on a substrate according to still another embodiment of the present invention.

100. . . Mold

102. . . surface

104. . . surface

106. . . Protrusion

108. . . Depression

110. . . Pattern structure

112. . . Transfer material layer

114. . . Transfer material layer

118. . . Substrate

120. . . surface

122. . . surface

124. . . Photosensitive curing material layer

126. . . roller

132. . . Incident light

Claims (52)

A contact transfer method for a photocurable micro-nano pattern, comprising: providing a mold core, wherein the mold core has a first surface and a second surface, and the first surface comprises a pattern structure, the pattern structure Having at least one protrusion and at least one recess; forming a transfer material layer at least on the protrusion; providing a substrate, wherein a surface of the substrate is provided with a photosensitive curing material layer; The transfer material is laminated on the photosensitive cured material layer, wherein the step of laminating the transfer material on the protruding portion on the photosensitive cured material layer comprises applying a concentrated pressure; The photosensitive cured material layer is subjected to an irradiation step to cure the photosensitive cured material layer, and the transfer material layer on the protruding portion is fixed in the photosensitive cured material layer; the mold core is removed; The transfer material layer in the photosensitive cured material layer serves as a mask, and the photosensitive cured material layer is subjected to a patterning step until a portion of the surface of the substrate is exposed. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the material of the mold comprises bismuth, polymer series material, organic material, plastic material, semiconductor material, metal material, quartz, glass material. a ceramic material, an inorganic material, or a material synthesized by any two or more of the above materials. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the pattern size of the pattern structure is on the order of micrometers. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the pattern structure has a pattern size of nanometer. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the material of the mold core is a fluorine-containing polymer series material. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the material of the mold core is polyethylene terephthalate. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the material of the mold core is polyurethane acrylate. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the material of the mold core is ethylene tetrafluoroethylene. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the step of providing the mold and the step of forming the transfer material layer And further comprising forming an anti-adhesion layer covering the first surface. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the transfer material layer is located on the protrusion and the recess. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the material of the substrate comprises bismuth, polymer series material, organic material, plastic material, semiconductor material, metal material, quartz, glass material a ceramic material, an inorganic material, or a material synthesized by any two or more of the above materials. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the substrate comprises a curved surface. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the step of providing the substrate and the step of laminating the transfer material on the protruding portion on the photosensitive cured material layer Between the two, the photosensitive curing material layer is pre-baked. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the step of laminating the transfer material on the protruding portion on the photosensitive cured material layer comprises using a roller A rolling step is performed on the second surface of the mold core. The contact transfer method of the photocurable micronano pattern according to claim 14, wherein the irradiating step irradiates the photosensitive solidified material layer after being focused by penetrating the drum. A contact transfer method of a photocurable micronano pattern according to claim 14, wherein the substrate comprises another surface with respect to the surface, and the irradiating step irradiates the photosensitive cured material layer from the other surface. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the step of laminating the transfer material on the protruding portion on the photosensitive cured material layer comprises using a roller A rolling step is performed on the other surface of the substrate relative to the surface. The contact transfer method of the photocurable micronano pattern according to claim 17, wherein the irradiating step irradiates the photosensitive solidified material layer after being focused by penetrating the drum. The contact transfer method of the photocurable micro-nano pattern according to claim 17, wherein the irradiating step irradiates the photosensitive solidified material layer from the second surface of the mold. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the irradiating step comprises using an incident light, and the incident light has a wavelength ranging from 1 nm to 10 ⁷ μm. A contact transfer method of a photocurable micronano pattern according to claim 20, wherein the incident light is a laser light. The contact transfer method of the photocurable micro-nano pattern according to claim 20, wherein the incident light is a light source type light source. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the material of the photosensitive cured material layer is a polymer material, a photoresist material, an organic material or any one or both of the above materials. The materials synthesized above. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the material of the photosensitive cured material layer is an ultraviolet curable resin. The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the step of applying the concentrated pressure is a mechanical type, an electromagnetic type, a hydraulic type or a pneumatic type. The contact transfer method of the photocurable micro-nano pattern according to claim 1, further comprising removing the transfer material layer in the photosensitive cured material layer after the patterning step. The contact of the photocurable micro-nano pattern as described in claim 1 a printing method, after the patterning step, further comprising: performing an etching step on the portion of the surface of the substrate by using the transfer material layer in the photosensitive cured material layer as a mask; and removing the photosensitive a layer of the cured material and the layer of the transfer material in the layer of photosensitive cured material. The contact transfer method of the photocurable micro-nano pattern according to claim 1, after the patterning step, further comprising: forming the transfer material layer of the pattern material layer in the photosensitive cured material layer and the a portion of the surface of the substrate; and performing a lift-off step to remove the photosensitive cured material layer, the transfer material layer and the pattern material layer on the photosensitive cured material layer . The contact transfer method of the photocurable micro-nano pattern according to claim 1, wherein the irradiating step further comprises curing the photosensitive cured material layer at room temperature. A contact transfer method for a photocurable micro-nano pattern, comprising: providing a mold core, wherein the mold core has a first surface and a second surface; forming a transfer material layer at the first of the mold core a portion of the surface, wherein the transfer material layer constitutes a pattern structure; providing a substrate, wherein a surface of the substrate is provided with a photosensitive curing a material layer; the transfer material is laminated on the photosensitive cured material layer, wherein the step of laminating the transfer material on the photosensitive cured material layer comprises applying a concentrated pressure; curing the photosensitive type The material layer is subjected to an irradiation step to cure the photosensitive cured material layer, and the transfer material layer is fixed in the photosensitive cured material layer; the mold core is removed; and the transfer material layer is used as a mask. A patterning step is performed on the photosensitive cured material layer until a portion of the surface of the substrate is exposed. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the material of the mold comprises bismuth, polymer series material, organic material, plastic material, semiconductor material, metal material, quartz, glass material a ceramic material, an inorganic material, or a material synthesized by any two or more of the above materials. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the material of the mold core is a fluorine-containing polymer series material. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the material of the mold is polyethylene terephthalate, polyurethane acrylate or ethylene-tetrafluoroethylene. Ethylene copolymer Tetrafluoroethylene). The contact transfer method of the photocurable micro-nano pattern according to claim 30, further comprising forming an anti-adhesion layer covering the first step between the step of providing the mold and the step of forming the transfer material layer On the surface. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the material of the substrate comprises bismuth, polymer series material, organic material, plastic material, semiconductor material, metal material, quartz, glass material a ceramic material, an inorganic material, or a material synthesized by any two or more of the above materials. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the substrate comprises a curved surface. The contact transfer method of the photocurable micro-nano pattern according to claim 30, further comprising the step of providing the substrate and laminating the transfer material on the photosensitive cured material layer The photosensitive cured material layer is pre-baked. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the step of laminating the transfer material on the photosensitive cured material layer comprises using a second roller in the mold core A rolling step is performed on the surface. The contact transfer method of a photocurable micronano pattern according to claim 38, wherein the irradiating step irradiates the photosensitive cured material layer after being focused by penetrating the roller. A contact transfer method of a photocurable micronano pattern according to claim 38, wherein the substrate comprises another surface opposite to the surface, and the irradiating step irradiates the photosensitive cured material layer from the other surface. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the step of laminating the transfer material on the photosensitive cured material layer comprises using a roller on the substrate relative to the surface A rolling step is performed on the other surface. The contact transfer method of the photocurable micro-nano pattern according to claim 41, wherein the irradiating step irradiates the photosensitive solidified material layer after being focused by penetrating the drum. The contact transfer method of the photocurable micro-nano pattern according to claim 41, wherein the irradiating step irradiates the photosensitive solidified material layer from the second surface of the mold core. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the irradiating step comprises using an incident light, and the incident light has a wavelength ranging from 1 nm to 10 ⁷ μm. The contact transfer method of the photocurable micro-nano pattern according to claim 44, wherein the incident light is a laser light or a light source light source. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the material of the photosensitive cured material layer is a polymer material, a photoresist material, an organic material or any one or both of the above materials. The materials synthesized above. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the material of the photosensitive cured material layer is an ultraviolet curable resin. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the step of applying the concentrated pressure is a mechanical type, an electromagnetic type, a hydraulic type or a pneumatic type. The contact transfer method of the photocurable micro-nano pattern according to claim 30, further comprising removing the transfer material layer in the photosensitive cured material layer after the patterning step. The contact transfer method of the photocurable micro-nano pattern according to claim 30, after the patterning step, further comprising: using the transfer material layer as a mask, and performing the portion of the surface of the substrate Etching step; The photosensitive cured material layer and the transfer material layer in the photosensitive cured material layer are removed. The contact transfer method of the photocurable micro-nano pattern according to claim 30, after the patterning step, further comprising: forming a pattern material layer on the portion of the transfer material layer and the surface of the substrate And performing a step of removing the photosensitive cured material layer, the transfer material layer and the pattern material layer on the photosensitive cured material layer. The contact transfer method of the photocurable micro-nano pattern according to claim 30, wherein the irradiating step further comprises curing the photosensitive cured material layer at room temperature.