201112316 六、發明說明-: 【發明所屬之技術領域】 本發明係有關有機電激發光裝置製造裝置及有機電激 發光裝置製造方法及成膜裝置及成膜方法，並有關係洗·淨 光罩而蒸鍍於基板之有機電激發光裝置製造裝置及有機電 激發光裝置製造方法及成膜裝置及成膜方法。 φί 【先前技術】 作爲顯示裝置，有機電激發光裝置乃備受注目，作爲 其製造之有力的方法，有著真空蒸鍍法。真空蒸鍍法係使 用光罩而形成元件圖案的方法。元件圖案係在真空處理室 內加熱蒸發（昇華）蒸鍍材料，如圖4所示，由通過設置 於欲蒸鍍處之光罩的開口部，將蒸鍍材料蒸鍍於顯示基板 者而加以形成。對於光罩的開口部以外的處所，因堆積有 蒸鍍材料之故，在一定枚數成膜後，進行光罩的洗淨。 φ 光罩的洗淨方式係採用濕洗淨方式，但由於需要處理 時間，使用有機材料之故而增加環境負荷，對於細微圖案 產生損傷，蒸鍍材料的回收再利用困難的理由，開發採用 雷射光源之乾洗淨方式。對於專利文獻1係揭示有在進行 蒸鍍之成膜室（真空處理室）內進行乾洗淨，貼附雷射光 透過於光罩之有黏接的薄膜，透過薄膜照射雷射光，將從 光罩剝離的蒸鍍材料之堆積物，回收至薄膜者。 [先前技術文獻] -5- 201112316 [專利文獻] [專利文獻1]日本特開2006-0169573號公報 【發明內容】 [發明欲解決之課題] 在有機電激發光裝置製造裝置中，根據少量氣體的產 生之真空度的變動乃招致顯示裝置之大的膜厚變動，對於 顯示性能有大的影響。另外，當灰塵等粉塵附著於顯示基 板或光罩時，經由其附著部而產生顯示缺陷。另外，有光 罩開口部之光罩部係因非常的薄而容易經由外力產生變形 ，其變形乃對於顯示性能有大的影響。 隨之，必須極力抑制氣體或粉塵，對於光罩而言，必 須做到不受到過度的外力。此等影響係成爲顯示基板的微 細化越進展越大者。 但如專利文獻1所記載，當在成膜室，將雷射光照射 至光罩或堆積物而進行乾洗淨時，氣體則產生而引起真空 度的變動，其結果，膜厚產生變化，有著精彩度下降之虞 。另外，所剝離的堆積物乃殘存於成膜室而附著在顯示基 板或光罩，以及爲了將黏接薄膜，從光罩剝離而光罩部產 生變形，或者黏接物乃殘存於光罩而產生顯示缺陷，有著 生產性下降之虞。更且，有著黏接材料等之不純物混入於 回收之蒸鍍材料之虞。更且又並未揭示例如在成膜室內， 是如何移動光罩，在蒸鍍的位置是如何進行乾洗淨之具體 的敘述。 -6 - 201112316 隨之，本發明的第一之目的係爲提供可局精彩地成膜 之有機電激發光裝置製造裝置或有機電激發光裝置製造方 法或者成膜裝置或成膜方法者》 另外，本發明的第二之目的係爲提供生產性高之有機 電激發光裝置製造裝置或有機電激發光裝置製造方法或者 成膜裝置或成膜方法者。 更且，本發明的第三之目的係爲提供稼働率高之有機 φ 電激發光裝置製造裝置或有機電激發光裝置製造方法或者 成膜裝置或成膜方法者。 [爲解決課題之手段] 爲了達成上述目的之任一，其第1之特徵乃從設置於 真空蒸鍍室的壁之真空隔離手段，運出前述光罩，在共有 前述真空隔離手段的光罩洗淨處理室，照射雷射光至附著 於前述基板之前述蒸鍍材料的堆積物而乾洗淨前述光罩， • 將洗淨後前述光罩，藉由真空隔離手段而返回至前述真空 蒸鍍室，進行前述蒸鍍者。 另外，爲了達成上述目的之任一，其第2之特徵乃加 上於第1之特徵，前述乾洗淨係在真空環境進行者。 更且，爲了達成上述目的之任一，其第3之特徵乃加 上於第2之特徵，前述乾洗淨中係降低前述真空環境之真 空度而進行者。 另外，爲了達成上述目的之任一，其第4之特徵乃加 上於第1之特徵，前述乾洗淨係在氣體環境中進行者》 201112316 更且，爲了達成上述目的之任一，其第5之特徵乃加 上於第4之特徵，前述氣體乃氮者β 另外’爲了達成上述目的之任一，其第6之特徵乃加 上於第1之特徵，前述光罩洗淨處理室乃從前述真空蒸鍍 室以外之鄰接部，運出入前述光罩者。 [發明效果] 如根據本發明，可提供可高精彩地成膜之有機電激發 光裝置製造裝置或有機電激發光裝置製造方法或者成膜裝 置或成膜方法者。 另外，如根據本發明，可提供生產性高之有機電激發 光裝置製造裝置或有機電激發光裝置製造方法或者成膜裝 置或成膜方法者。 另外，如根據本發明，可提供稼働率高之有機電激發 光裝置製造裝置或有機電激發光裝置製造方法或者成膜裝 置或成膜方法者。 【實施方式】 使.用圖1至圖8說明在本發明之有機電激發光裝置製 造裝置的第1之實施形態。有機電激發光裝置製造裝置係 不只單形成發光材料層（電激發光層），以電極夾持之構 造，而於陽極之上方，將電洞植入層或輸送層，於陰極之 上方，將電子植入層或輸送層等，形成各種材料作爲薄膜 所成之多層構造，以及洗淨基板。圖1乃顯示其製造裝置 -8 - 201112316 之一例的圖。 在本實施形態之有機電激發光裝置製造裝置100係大 致由運入處理對象之基板6之負載群組13、處理基板6 之4個的群組（A~D )、各群組間或群組與負載群組1 3， 或者與接下來之工程（封閉工程）之間之所設置之5個收 授室14所構成。在本實施形態中，將塞板的蒸鍍面做成. 上面而運送，進行蒸鍍時，將基板立起進行蒸鍍。 φ 負載群組13係由爲了於前後維持真空而具有閘閥10 之加載互鎖真空處理室13R，和從加載互鎖真空處理室 13R接受基板，進行旋轉將基板6運入至收授室14a之運 送機械手臂15R所成。各加載互鎖真空處理室13R及各 收授室1 4係於前後具有閘閥1 0，控制該閘閥1 0之開關 而維持真空的同時，於負載群組13或者接下來的群組等 ，收授基板。 各群組（A〜D )係擁有：具有一台之運送機械手臂15 # 之運送室2，和從運送機械手臂15接受基板，在進行特 定處理之圖面上，配置於上下之2個處理室1(第1添加 字a~d係顯示群組’第2添加字u，d係（顯示圖中之上 側下側）。對於運送室2與處理室1之間係設置有閘閥i 〇 〇 處理室1之構成係根據處理內容而有所差異，但舉例 說明將蒸鍍材料之發光材料，在真空中進行蒸鍍，形成電 激發光層之真空蒸鍍室lbu。圖2乃此時運送室2b與真 空蒸鍍室lbu之構成的模式圖與動作說明圖。在圖2之運 [ -9- 201112316 送機械手臂15係具有可將全體上下移動（參照箭頭159 )，左右旋轉之連桿構造的柄部157，對於其前端係具有 基板運送用之梳狀手部158。 本實施形態之處理的基本思考方法係如圖2所示，於 1台的真空蒸鍍室，設置2個處理線，於在一方的線（例 如R線）進行蒸鍍之間，在另一方的L線係運出入基板 ，進行基板6與光罩81之校準而完成蒸鍍的準備。經由 交互進行此處理之時，可未蒸鍍於基板而減少多餘蒸發（ 昇華）之時間。 爲了實現上述，真空蒸鍍室lbu係具有進行基板6與 光罩之位置調整，蒸鍍至基板6必要之部分的校準部8, 和將運送機械手臂15與進行基板的收授，移動基板6至 蒸鍍部7之處理收授部9，於右側R線與左側L線設置2 系統，移動在其2系統之線間，蒸發（昇華）發光材料而 蒸鍍於基板6之蒸鍍部7。 因此，首先說明處理收授部9。處理收授部9係具有 不會與運送機械手臂15之梳狀手部158干擾而可收授基 板6，具有固定基板6之手段（未圖示）的梳狀手部91， 和使前述梳狀手部91旋轉而使基板6直立，移動至校準 部8之手部旋轉驅動手段93。作爲固定基板6之手段（ 未圖示），考慮爲真空中而採用靜電吸附或機械夾鉗等之 手段。 蒸鍍部7係具有使蒸鍍源71，沿著軌道76上移動於 上下方向之上下驅動手段（未圖示）、將蒸鍍源7 1沿著 -10- 201112316 軌道75上進行左右的校準部間移動之左右驅動基座74。 蒸鍍源71係於內部具有蒸鍍材料之發光材料，經由加熱 控制前述蒸鍍材料（未圖示）之時而得到安定之蒸發速度 ，如圖2之導出圖所示，成爲從排列於蒸鍍源71之複數 的孔73噴射之構造。根據需要，爲了提昇蒸鍍膜之特性 而亦有同時加熱添加劑進行蒸鍍。此情況，蒸鍍源與一對 或複數之蒸鍍源，平行排列於上下進行蒸鍍。 φ 校準部之一實施形態示於圖3。省略真空處理室的壁 或閘閥。校準部8係由光罩81，固定光罩81之校準基座 82，爲了進行校準而移動校準基座之校準驅動部83與校 準隨動部84，檢測校準標記之校準光學系統85，將光罩 移動至後述之光罩洗淨室之光罩運送部86，及控制此等 而進行資料處理之圖1所示的控制裝置20所成。 接著，於簡單說明在本實施形態之校準方法之前，說 明在圖4所示之本實施形態所使用之光罩81的一例。光 φ 罩81係大致由光罩部81M與支持光罩部之框體81F所成 。如導出圖所示，對於光罩部81M係於對應於蒸鍍於基 板6之部分處，具有開口部81h。在本例中’顯示蒸鍍紅 (R)、綠（G)、藍（B)之發光材料的光罩中，對應於 紅之開口部。光罩的尺寸係伴隨基板的大型化而亦成爲 2000mmx2000mm，其重量亦達到超過300kg。此窗的尺寸 係根據顏色有所差異，但平均爲寬度爲30^m、局度爲 150μηι程度。光罩81M之厚度乃50μηι程度、往後有成爲 更薄之傾向。另外’對於光罩部與基板’係於各對應之位 " ί -11 - 201112316 置，複數設置有校準標記81m，6m。兩者的校準標記乃 呈成爲特定之位置關係地，移動基板或光罩進行校準。在 以下說明之實施形態中乃移動光罩進行校準的例。 以下，簡單說明在本實施形態之校準方法。校準基座 82係在其四角附近，經由於上部2處81a、81b，設置於 其2處各下方之81c、81d之計4處的旋轉支持部，可旋 轉地加以支持。 經由設置於圖3所示之4處的校準光學系統85，檢 測在基板中心之基板6與光罩81的位置偏移（ΔΧ、ΔΖ、 Θ)。依據其結果，將設置於校準基座82上部之旋轉支持 部81b移動於顯示之X方向、Z方向，而將同樣設置於上 部之旋轉支持部81a移動於顯示之Z方向，消解前述位置 偏移，進行校準。此時，伴隨著校準基座82之上述移動 ，旋轉支持部81a係於X方向，設置於校準基座82下部 之旋轉支持部81c，81d係從動性地移動於X及Z方向。 旋轉支持部81b之驅動係由具有設置於真空蒸鍍室lbu之 上部壁1T上的驅動馬達之校準驅動部83R，旋轉支持部 81a之驅動及被動係由校準驅動部83 L，及旋轉支持部 81c’ 81d之從動係由具有設置於真空蒸鍍室lbu之下部 壁1Y下的校準從動部84R，84L而進行。 爲了進行校準之機構部83係藉由密封部而設置於大 氣側’作成未對於真空蒸鍍帶來不良影響導入粉塵等至真 空內’另外，經由此而保守性亦可提昇。更且，對於校準 光學系統85,將攝影機及光源等，收納於突出於真空側 -12- 201112316 之內部乃大氣中之收納筒，亦得到同樣的效果。 接著，說明本實施形態之大特徵之光罩洗淨室的第1 實施形態之構成與其動作流程。 如圖1之導出圖所示，光罩洗淨室4係由真空處理室 之光罩洗淨處理室5與大氣中的雷射室3加以構成。光罩 洗淨處理室5係鄰接於藉由真空隔離手段之閘閥10B而進 行蒸鍍處理之真空蒸鍍室1，作爲具有與真空蒸鑛室1不 φ 同之真空環境的真空處理室而加以設置。在以下的說明中 ，舉例說明擔當圖1導出圖所示之真空蒸鍍室lad之L線 (圖2所示之真空蒸鍍室lbu的線之稱法係成爲上下相反 之故，在圖上係成爲相反）與真空蒸鍍室lbd之R線（與 前述括弧內相同）之光罩81的洗淨之光罩洗淨室4bd。 然而，導出圖所示之56，86係顯示後述之光罩的運送部 »另外，在圖1之光罩洗淨處理室等之添加字係第1之添 加字乃從左依序爲abc，第2之添加字u，d係顯示各圖中 φ 之上側，下側》 經由此構成，對於洗淨光罩時，從真空蒸鍍室1 ad或 Ibu運送光罩至光罩洗淨處理室5bd，在光罩洗淨處理室 5 bd雷射洗淨光罩，之後將光罩返回至真空蒸鍍室，再次 開始蒸鍍。在以下說明中，爲了避免混淆，添加字bd等 係在未必要時省略。 首先，說明將光罩移動在真空蒸鍍室與光罩洗淨處理 室之間的光罩運送手段。圖5乃顯示在本實施形態之運送 手段的圖，爲了避免混淆而省略運送手段以外的部份。圖201112316 VI. EMBODIMENT OF THE INVENTION - Technical Field of the Invention The present invention relates to an apparatus for manufacturing an organic electroluminescence device, a method for manufacturing an organic electroluminescence device, a film formation device, and a film formation method, and relates to a wash and a net cover. An organic electroluminescence device manufacturing device and a method for producing an organic electroluminescence device, a film forming device, and a film forming method for vapor deposition on a substrate. Φί [Prior Art] As a display device, an organic electroluminescence device is attracting attention, and as a powerful method for manufacturing it, there is a vacuum evaporation method. The vacuum evaporation method is a method of forming a component pattern using a photomask. The element pattern is heated and evaporated (sublimed) in the vacuum processing chamber, and as shown in FIG. 4, the vapor deposition material is vapor-deposited on the display substrate through the opening of the mask provided at the portion to be vapor-deposited. . In the place other than the opening of the reticle, since the vapor deposition material is deposited, the reticle is washed after a certain number of films are formed. The φ mask is cleaned by a wet cleaning method. However, due to the need for processing time, the use of organic materials increases the environmental load, which causes damage to fine patterns and the difficulty in recycling and reusing the vapor deposition material. The dry cleaning method of the light source. Patent Document 1 discloses that a dry film is cleaned in a film forming chamber (vacuum processing chamber) where vapor deposition is performed, and a bonded film in which laser light is transmitted through the photomask is attached, and the laser beam is irradiated through the film, and the light is emitted from the light. The deposit of the vapor-deposited material from which the cover is peeled off is recovered to the film. [Prior Art Document] -5-201112316 [Patent Document 1] [Patent Document 1] JP-A-2006-0169573 SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] In a device for manufacturing an organic electroluminescence device, a small amount of gas is used. The change in the degree of vacuum generated causes a large film thickness variation of the display device and has a large influence on display performance. Further, when dust such as dust adheres to the display substrate or the reticle, display defects are generated via the adhesion portion. Further, since the mask portion having the opening portion of the mask is extremely thin, it is easily deformed by an external force, and the deformation thereof has a large influence on display performance. Accordingly, it is necessary to suppress the gas or dust as much as possible, and it is necessary for the reticle to be free from excessive external force. These effects are those in which the progress of the display substrate is progressed more and more. However, as described in Patent Document 1, when laser light is irradiated to a mask or a deposit in a film forming chamber to perform dry cleaning, gas is generated to cause a change in the degree of vacuum, and as a result, the film thickness changes. After the decline in popularity. Further, the deposited deposit remains in the film forming chamber and adheres to the display substrate or the photomask, and the adhesive film is peeled off from the mask to deform the mask portion, or the adhesive remains in the mask. Display defects, with a decline in productivity. Further, impurities having a bonding material or the like are mixed in the recovered vapor deposition material. Further, it has not been disclosed, for example, how the reticle is moved in the film forming chamber, and how the dry cleaning is performed at the position of vapor deposition. -6 - 201112316 Accordingly, the first object of the present invention is to provide an organic electroluminescent device manufacturing apparatus or a method of manufacturing an organic electroluminescent device or a film forming apparatus or a film forming method which can form a wonderfully film-forming film. A second object of the present invention is to provide a highly productive organic electroluminescent device manufacturing apparatus or an organic electroluminescent device manufacturing method or a film forming apparatus or a film forming method. Furthermore, a third object of the present invention is to provide an organic φ electroluminescent device manufacturing apparatus or an organic electroluminescent device manufacturing method or a film forming apparatus or a film forming method having a high yield. [Means for Solving the Problem] In order to achieve the above object, the first feature is that the photomask is carried out from a vacuum isolation means provided in a wall of a vacuum deposition chamber, and the mask of the vacuum isolation means is shared. The cleaning processing chamber irradiates the laser light to the deposit of the vapor deposition material adhering to the substrate to dry the mask, and the mask is returned to the vacuum evaporation by vacuum isolation means. In the room, the above vapor deposition is performed. Further, in order to achieve the above object, the second feature is the feature of the first aspect, and the dry cleaning is performed in a vacuum environment. Further, in order to achieve the above object, the third feature is added to the second feature, wherein the dry cleaning is performed by lowering the vacuum of the vacuum environment. In addition, in order to achieve the above object, the fourth feature is added to the first feature, and the above-mentioned dry cleaning system is carried out in a gas atmosphere. 201112316 Further, in order to achieve the above object, The feature of 5 is the feature of the fourth aspect, wherein the gas is nitrogen or the other one of the above-mentioned objects, and the sixth feature is added to the first feature, and the photomask cleaning chamber is The photomask is carried out from an adjacent portion other than the vacuum evaporation chamber. [Effect of the Invention] According to the present invention, it is possible to provide an apparatus for producing an organic electroluminescence device, a method for producing an organic electroluminescence device, a film formation device or a film formation method which can form a film with high brilliance. Further, according to the present invention, it is possible to provide a highly productive organic electroluminescent device manufacturing apparatus or an organic electroluminescent device manufacturing method or a film forming apparatus or a film forming method. Further, according to the present invention, it is possible to provide an organic electroluminescent device manufacturing apparatus or a method of manufacturing an organic electroluminescent device, or a film forming apparatus or a film forming method having a high yield. [Embodiment] A first embodiment of the organic electroluminescent device manufacturing apparatus of the present invention will be described with reference to Figs. 1 to 8 . The organic electroluminescent device manufacturing device not only forms a layer of luminescent material (electro-excitation layer), but also has a structure of electrode clamping, and above the anode, a hole is implanted in the layer or transport layer, above the cathode, An electron-implanting layer or a transport layer or the like forms a multilayer structure in which various materials are formed as a film, and a substrate is cleaned. Fig. 1 is a view showing an example of a manufacturing apparatus -8 - 201112316. In the organic electroluminescent device manufacturing apparatus 100 of the present embodiment, four groups (A to D), groups, or groups of the load group 13 and the processing substrate 6 that are carried into the substrate 6 to be processed are substantially The group consists of a load group 13 or a set of five receiving rooms 14 between the next project (closed project). In the present embodiment, the vapor deposition surface of the plug plate is placed on the upper surface and transported, and when vapor deposition is performed, the substrate is raised and vapor-deposited. The φ load group 13 is driven by the load-locking vacuum processing chamber 13R having the gate valve 10 for maintaining the vacuum before and after, and receiving the substrate from the load-locking vacuum processing chamber 13R, and rotating the substrate 6 into the receiving chamber 14a. The robot arm 15R is formed. Each of the load-locking vacuum processing chambers 13R and the receiving chambers 14 has a gate valve 10 in front and rear, and controls the gate valve 10 to maintain a vacuum, and is in the load group 13 or the next group. The substrate is taught. Each group (A to D) has two transport chambers 2 having a transport robot arm 15 # and a substrate that is received from the transport robot 15 and placed on the upper surface of the screen for performing specific processing. Room 1 (the first added words a to d show the group 'the second added word u, d is the upper side of the upper side of the figure.) The gate valve i is provided between the transport chamber 2 and the processing chamber 1. The configuration of the processing chamber 1 differs depending on the processing content. However, the luminescent material of the vapor deposition material is vapor-deposited in a vacuum to form a vacuum vapor deposition chamber lbu of an electroluminescent layer. A schematic diagram and an operation explanatory diagram of the configuration of the chamber 2b and the vacuum vapor deposition chamber lbu. In Fig. 2, the [9-201112316 robot arm 15 system has a link that can move the whole up and down (refer to arrow 159) and rotate left and right. The handle portion 157 of the structure has a comb-shaped hand portion 158 for transporting the substrate to the front end. The basic method of the process of the present embodiment is as shown in Fig. 2, and two processes are provided in one vacuum deposition chamber. The line is between the vapor deposition on one of the lines (for example, the R line). The other L-line is transported out of the substrate, and the substrate 6 is calibrated to the mask 81 to complete the vapor deposition. When this treatment is performed alternately, the time for excess evaporation (sublimation) can be reduced without being deposited on the substrate. In order to achieve the above, the vacuum vapor deposition chamber lbu has a aligning portion 8 that adjusts the position of the substrate 6 and the reticle, and is vapor-deposited to the necessary portion of the substrate 6, and transports the transfer robot 15 and the substrate, and moves the substrate 6 The processing and receiving unit 9 to the vapor deposition unit 7 is provided with two systems on the right R line and the left L line, and moves between the lines of the two systems, evaporating (sublimating) the luminescent material, and vapor-depositing the vapor deposition unit 7 on the substrate 6. Therefore, first, the process receiving unit 9 will be described. The process receiving unit 9 has a means for not receiving the substrate 6 without interfering with the comb-shaped hand 158 of the transport robot 15 and having the fixed substrate 6 (not shown). The comb-shaped hand portion 91 and the hand rotation driving means 93 for rotating the comb-shaped hand portion 91 to move the substrate 6 upright and moving to the aligning portion 8. As a means for fixing the substrate 6 (not shown), a vacuum is considered. Using electrostatic adsorption or mechanical clamps, etc. The vapor deposition unit 7 has a vapor deposition source 71 that moves up and down along the rail 76 in a vertical direction up/down driving means (not shown), and the vapor deposition source 71 is carried out along the -10-201112316 rail 75. The left and right drive bases 74 are moved between the aligning portions. The vapor deposition source 71 is a luminescent material having a vapor deposition material therein, and when the vapor deposition material (not shown) is controlled by heating, a stable evaporation rate is obtained, as shown in the figure. As shown in the drawing of Fig. 2, the structure is ejected from the plurality of holes 73 arranged in the vapor deposition source 71. If necessary, in order to enhance the characteristics of the vapor deposition film, the additive may be simultaneously heated and vapor-deposited. In this case, the evaporation source and A pair or a plurality of vapor deposition sources are arranged in parallel in parallel to perform vapor deposition. An embodiment of the φ calibrating unit is shown in Fig. 3. Omit the wall or gate valve of the vacuum processing chamber. The calibration unit 8 is provided with a mask 81, a calibration base 82 for fixing the mask 81, a calibration drive unit 83 for moving the calibration base and a calibration follower 84 for calibration, and a calibration optical system 85 for detecting the calibration mark. The cover is moved to a mask transport unit 86 of a photomask cleaning chamber, which will be described later, and a control device 20 shown in Fig. 1 for controlling the data processing. Next, an example of the photomask 81 used in the present embodiment shown in Fig. 4 will be described briefly before the calibration method of the present embodiment. The light φ cover 81 is substantially formed by the mask portion 81M and the frame 81F supporting the mask portion. As shown in the drawing, the mask portion 81M is provided with an opening portion 81h corresponding to a portion which is vapor-deposited on the substrate 6. In the present embodiment, the reticle that displays the luminescent materials of red (R), green (G), and blue (B) corresponds to the opening of red. The size of the mask is also 2000 mm x 2000 mm with the increase in size of the substrate, and its weight also exceeds 300 kg. The size of this window varies depending on the color, but the average width is 30^m and the degree is 150μηι. The thickness of the photomask 81M is about 50 μm, and tends to be thinner in the future. In addition, the 'photomask portion and the substrate' are placed in the corresponding positions " ί -11 - 201112316, and the plurality of calibration marks 81m, 6m are provided. The calibration marks of the two are in a specific positional relationship, and the substrate or mask is calibrated. In the embodiment described below, an example in which the reticle is moved and calibrated is used. Hereinafter, the calibration method of this embodiment will be briefly described. The calibration base 82 is rotatably supported by the rotation support portions provided at the lower portions 81c and 81d of the two places 81a and 81b in the vicinity of the four corners. The positional shift (ΔΧ, ΔΖ, Θ) of the substrate 6 and the mask 81 at the center of the substrate is detected via the calibration optical system 85 provided at four places shown in Fig. 3 . According to the result, the rotation support portion 81b provided on the upper portion of the calibration base 82 is moved in the X direction and the Z direction of the display, and the rotation support portion 81a provided in the upper portion is moved in the Z direction of the display to eliminate the positional deviation. , for calibration. At this time, with the above movement of the calibration base 82, the rotation support portion 81a is in the X direction, and the rotation support portions 81c and 81d provided at the lower portion of the calibration base 82 are driven to move in the X and Z directions. The drive of the rotation support portion 81b is a calibration drive portion 83R having a drive motor provided on the upper wall 1T of the vacuum vapor deposition chamber 1bu, a drive for the rotation support portion 81a, a passive drive portion 83L, and a rotation support portion. The slave system of 81c' 81d is performed by the calibrated follower portions 84R, 84L provided under the wall 1Y below the vacuum vapor deposition chamber lbu. In order to perform the calibration, the mechanism portion 83 is provided on the atmosphere side by the sealing portion, so that dust or the like is introduced into the vacuum without adversely affecting the vacuum deposition. Further, the conservativeness can be improved by this. Further, in the calibrating optical system 85, the same effect can be obtained by accommodating the camera, the light source, and the like in a housing tube that protrudes inside the vacuum side -12-201112316. Next, the configuration of the first embodiment of the photomask cleaning chamber of the present embodiment and the operation flow thereof will be described. As shown in the drawing of Fig. 1, the mask cleaning chamber 4 is constituted by a mask cleaning processing chamber 5 of a vacuum processing chamber and a laser chamber 3 in the atmosphere. The mask cleaning processing chamber 5 is adjacent to the vacuum vapor deposition chamber 1 which is subjected to vapor deposition treatment by the gate valve 10B of the vacuum isolation means, and is provided as a vacuum processing chamber having a vacuum environment which is not the same as that of the vacuum distillation chamber 1. Settings. In the following description, the L line of the vacuum vapor deposition chamber lad shown in the drawing of Fig. 1 is exemplified (the line of the vacuum vapor deposition chamber lbu shown in Fig. 2 is referred to as the upper and lower sides, and is shown on the figure. In contrast, the photomask cleaning chamber 4bd is cleaned from the mask 81 of the R line of the vacuum evaporation chamber lbd (same as in the aforementioned bracket). However, the 56, 86 shown in the drawing shows the transport unit of the mask described later. In addition, the added word of the first added word in the mask cleaning processing chamber of FIG. 1 is abc from the left. The second added word u, d shows the upper side of φ in each figure, and the lower side is constituted by this. When the photomask is cleaned, the photomask is transported from the vacuum evaporation chamber 1 ad or Ibu to the photomask cleaning processing chamber. 5bd, in the mask cleaning processing chamber 5 bd laser cleaning mask, after which the mask is returned to the vacuum evaporation chamber, and vapor deposition is started again. In the following description, in order to avoid confusion, the addition of the word bd or the like is omitted when it is not necessary. First, a mask transporting means for moving the mask between the vacuum vapor deposition chamber and the mask cleaning processing chamber will be described. Fig. 5 is a view showing the conveying means of the embodiment, and the portions other than the conveying means are omitted in order to avoid confusion. Figure
i S -13- 201112316 5係於左側顯示處理室1，於右側顯示光罩 ，將光罩81安裝於處理室1之狀態，以實 對於前述2個室之間，係有爲了間隔此等之 等閘閥的兩側係有爲了運送光罩81之各運 理室運送部：56、處理室運送部：86)。各 而言，具有相同構造之故，關於構造係將光 5爲主體，關於後述之光罩運送驅動手段係 關係上真空蒸鍍室1爲主體加以說明。因此 圖面及符號。 各運送部（56，86)係由基座（安裝基 基座：82)與光罩運送驅動手段（洗淨處理 :5 6B、處理室運送驅動部：86B )所成。 光罩81運入至基座時，支持光罩上部之光 (5 2u、8 2u)和運送光罩81於其下部之運: 8 2r )。兩個之光罩運送驅動手段係以較光 LS爲短的間隔LD加以設置，對於各前端係 小齒輪：56g，86g)。另外，與光罩成爲一 罩下部固定部81k係設置於運送體之光罩i 入夾持光罩於其固定部之凹狀的凹部，固戈 其光罩下部固定部81k，設置作爲前述小齒 部的齒條Sir。由於爲LS>LD，至少一方之 條8 1 r咬合之故，由協調控制前述二個之小 光罩前後前進。 爲了可平順地運送光罩8 1，對於光罩 洗淨處理室5 線加以顯示。 .閘閥10B。此 送部（洗淨處 運送部係具體 罩洗淨處理室 將參照圖3之 ，一部分省略 座：5 2、校準 室運送驅動部 基座係具有於 罩上部固定部 送軌道（56r， 罩8 1之橫長 具有小齒輪（ 體而移動之光 Η的下部，插 巨光罩 81 »於 輪咬合之擦動 小齒輪乃與齒 齒輪者，可使 上部固定部之 -14- 201112316 內部’如導出圖A所示’設置複數之左右的導引滾輪 56ui· ’ 56ul所成之運送導件56h，另一方面，光罩下部固 定部8 1 k係如導出圖B所示，於與齒條側相反側的基座， 設置與小齒輪協調夾持光罩81同時進行運送之複數的滾 輪 56dr 。 主導引滾輪86ur，86ul係在校準時，達成把持固定 光罩的作用之故，可安定保持光罩地，將夾和光罩的程度 φ ’將其導引滾輪間比較於導引滾輪56ur，56ul間，稍微 堅固地進行調節。前述運送滾輪8 2r及導引滾輪係爲了減 低對於真空蒸鍍帶來不良影響之氣體，使用低潤滑油軸承 。然而，爲了將光罩81，可拆裝於前述光罩下部固定部 81k且確實地固定，對於前述光罩下部固定部81k，係設 置複數收納設置於光罩下部之三角錐狀的突起物之三角錐 狀的凹部（未圖示）。 光罩運送驅動手段86B係如圖3所示，設置於大氣側 φ 之處理室1之下部壁1Y下之處理室運送驅動馬達86m， 咬合於光罩的齒條81r的小齒輪86g及真空密封之密封部 8 6s所成。如此，光罩運送驅動手段86B亦與爲了進行校 準之機構部83同樣地，藉由密封部而設置於大氣側’作 成未對於真空蒸鍍帶來不良影響之粉塵等引進至真空內。 光罩運送驅動手段5 6B亦具有與光罩運送驅動手段 86B同樣的構成。 是否將光罩81安裝至校準基座82之所期望的位置係 在本實施形態中，利用校準光學系統8 5。如圖4所示％ -15- 201112316 校準係設置於基板6及光罩81之校準標記6m，81m則呈 重疊地加以控制》因此，兩校準標記6m，81m乃如由校 準光學系統85之攝影機同時攝影時，則判斷被安裝。當 然，於光罩上部固定部8 2u之端部，設置開關等之感測器 亦可。 如根據本實施形態，在光罩的洗淨時，於真空蒸鍍室 等之處理室與光罩洗淨處理室，位於之間的閘閥10B兩側 ，由設置驅動設置於保持於光罩之光罩下部固定部之齒條 的驅動部之簡單機構，可確實地移動光罩而運入之後，由 關閉閘閥10B，可將真空蒸鍍室等之處理室，從光罩洗淨 處理室完全地分離。 接著，使用圖6說明光罩洗淨處理室5之第1實施形 態的構成與動作。在圖6中，光罩上部固定部5 2u，光罩 81及光罩下部固定部81k等之左側端面係顯示剖面形狀 。當於堆積於光罩81之蒸鍍材料照射雷射光時，傳達熱 衝擊至光罩8 1與堆積物V Μ，堆積物則產生破碎。此時 ，微小的粉體之游離生成物飛出的同時，亦產生氣體。另 外，對於游離生成物亦含有氣體，其一部分乃之後放出至 洗淨處理室內》此時之雷射光的波長係由容易傳達熱衝擊 至形成光罩之金屬材料的波長而決定。在本實施形態中， 光罩81係鈷與鎳的合金，波長係作爲532 nm。 因此，光罩洗淨處理室5係除了設置於光罩洗淨處理 室壁，由雷射光的透過率高的石英玻璃，玻璃板等加以構 成之雷射光照射窗51，保持光罩而移動於鄰接之處理室 -16- 201112316 的洗淨處理室運送部56(參照圖5，在圖6中係爲了避免 繁雜而未圖示）之外，具有回收前述游離生成物之回收手 段60。 在本實施形態之回收手段60係將透過雷射光之帶電 的帶電薄膜61，設置於從光罩的前面背離之位置，將飛 出的游離生成物，由其帶電薄膜61吸附之手段》因此， 回收手段60係具有供給帶電薄膜之供給滾輪62s，回收 φ 吸附有游離生成物之帶電薄膜的回收滾輪62k及2支的輸 送滚輪62i。回收滾輪62k係由設置於其下端之滾輪驅動 馬達63加以旋轉。爲了確實地捕捉前述飛出之游離生成 物，而降低真空度加長游離生成物之平均自由行程。例如 對於真空蒸鍍室之真空度l〇_5Torr而言，下降至10_2〜 l(T3T〇rr程度而進行。然而，在本實施形態中，將滾輪驅 動馬達，設置於洗淨處理室內，但如光罩運送驅動手段 8 6B地，藉由密封部而設置於大氣側亦可。 • 如根據本實施形態之回收手段，由附著游離生成物於 . 帶電薄膜之簡單的機構，未傳達外力至光罩，另外，未殘 留黏接物而可回收游離生成物。 接著，說明雷射室3。雷射室3係在大氣環境，如圖 1之導出圖所示，作爲雷射光源，具有脈衝雷射30，和將 雷射光31掃描在光罩81之平面上的電流鏡32，雷射光 3 1係呈對焦於光罩上地加以調節。如可由1台的電流鏡 32掃描光罩81之前面，將雷射光31進行分光，以複數 之電流鏡32分擔進行掃描亦可。更且’經由進行分光而 I S1 -17- 201112316 對於游離生成物飛出時，脈衝雷射30的輸出不足之情況 ，或者在1台之脈衝雷射係花上掃描時間之情況，係設置 複數台脈衝雷射亦可。 如根據以上說明之實施形態，由將光罩洗淨處理室5 ，與真空蒸鍍室1隔離作成不同之真空環境者，可不受到 在光罩洗淨產生之氣體或游離生成物的影響而進行蒸鍍。 其結果’可提供成膜厚度一定之高精彩，或者生產性高的 有機電激發光裝置製造裝置及有機電激發光裝置製造方法 〇 另外’如根據以上說明之實施形態，可確實地運送光 罩在光罩洗淨處理室5與真空蒸鍍室1之間，可保持維持 真空而進行光罩洗淨之故，可提供稼動率高之有機電激發 光裝置製造裝置或光罩洗淨方法。 接著，使用圖7說明光罩洗淨處理室5之第2實施形 態的構成與其動作。 在圖7中，與圖3同樣地，省略處理室的壁或閘閥， 另外與圖6同樣地，光罩上部固定部5 2u，光罩81及光 罩下部固定部8 1 k等之左側端面係顯示剖面形狀。光罩洗 淨處理室5與鄰接之真空蒸鍍室1或雷射室3的關係與第 1實施形態同樣。比較大的不同係第1，將光罩洗淨處理 室內作成氮環境中的情況，第2，將氮的流動做在光罩81 的前面，使用回收從光罩飛出之游離生成物的回收手段 65的情況。 關於第1點，例如亦可在大氣中，但氮在再次提昇真 -18- 201112316 空度時爲最佳，另外，有著與大氣中不同，無需擔心光 的氧化等之優點。隨之，除氮之外，亦可使用具有如此 點的氣體。 說明第2點。本實施形態之回收手段65係具有由 置於光罩81之前面上部之氮送風部66a，和於光罩之 面下部，與氮送風部對向加以設置之氮吸引部66b所成 回收流路生成手段66，和於設置於前述光罩背面，由 φ 收流路生成手段加以形成之游離生成物回收流路68， 入游離生成物之回收補助流路形成手段67。對於光罩 淨處理室5之外部，係有藉由氮送風管66k而傳送氮至 送風部6 6a之氮傳送手段（未圖示）與回收來自氮吸引 66b的氮之回收部（未圖示）。回收流路生成手段66 直接或間接性地加以固定於光罩洗淨處理室5之地上等 壁面。回收補助流路形成手段6 7係由嵌入於圖5所示 洗淨處理室運送部56之安裝基座52的形式加以固定。 # 如前述，當於光罩81之蒸鍍材料的堆積部VM， 射雷射光時，對於光罩與堆積物，傳達熱衝擊而堆積部 生破碎，成爲微小粉體之游離生成物而從光罩飛出。此 亦產生氣體。由游離生成物回收流路66補足其游離生 物與氣體，藉由氮吸引部66b，氮回收管66η，由回收 加以回收。例如，對於回收部係有過濾組件，分離氮與 離生成物等。 此時，經由光罩81與游離生成物回收流路68之距 ’係存在有未由游離生成物回收流路所補足之游離生成 罩 優 設 前 之 回 送 洗 氮 部 係 的 之 照 產 時 成 部 游 離 物 Γ -19- 201112316 與氣體。因此，經由以回收補助流路形成手段67，從光 罩的開口部81k(參照圖4)傳送氮者，游離生成物與氣體 乃呈附著於游離生成物回收流路地進行推進。對於回收補 助流路形成手段67，係有連接於前述之氮素傳送手段（ 未圖示）的氮供給管67 k。當在光罩開口部之送風壓爲高 時，開口部亦有變形之可能性，呈可確保對於開口部未造 成變形之推進所必要之送風壓地，設置位於光罩洗淨處理 室外之氮供給管的調整閥（未圖示）。 以上，如根據說明之光罩洗淨處理室5之第2實施形 態，亦未將薄膜等之固體或液體（例如洗淨液）等接觸於 光罩，而可洗淨光罩。 另外，如根據說明之光罩洗淨處理室之第2實施形態 ，可提供在回收手段65未有旋轉等之驅動部，更高信賴 性之有機電激發光裝置製造裝置或有機電激發光裝置製造 方法。 接著，參閱圖8說明雷射室3之第2實施形態的構成 與其動作。雷射室係與第1實施形態同樣爲大氣環境室。 本實施形態係顯示與第1實施形態不同，未使用電流鏡而 掃描雷射光的雷射光掃描手段。雷射光掃描手段35係具 有左右移動照射鏡35m之雷射光左右掃描手段36與上下 方向移動之雷射光上下掃描手段37。 雷射光左右掃描手段36係具有固定照射鏡35m之照 射鏡固定部3 6d，和移動照射鏡固定部之2支左右軌道 3 6r，和照射鏡固定部之內在的左右螺帽（未圖示），和 -20- 201112316 驅動左右螺帽之左右含球氣動測頭36b，和旋轉左右含球 氣動測頭之左右馬達36m，和朝照射鏡35m反射雷射光 的中繼鏡36c及搭載此等之左右驅動台36k。另外，對於 左右驅動台係設置有爲了引導來自下方的雷射光至中繼鏡 之雷射光導引孔36h。 另一方面，雷射光上下掃描手段37係具有左右驅動 台36k移動之2支上下軌道37r，和固定於左右驅動台之 φ 上下螺帽3 7η，驅動上下螺帽之上下含球氣動測頭37b， 和旋轉上下含球氣動測頭之上下馬達37m。 經由此等構成，將來自雷射光源30的雷射光31，通 過雷射光導引孔36h而接觸於上下之中繼鏡36c，由中繼 鏡所反射的雷射光係由左右移動之照射鏡3 5 m加以反射 而透過石英玻璃51，照射至光罩的堆積物。 以上，在所說明之雷射室3之第2實施形.態，比較於 第1實施形態，多少變爲複雜，但可確實地遍佈光罩全面 • 照射雷射光。 接著，使用圖9至圖11說明在本發明之有機電激發 光裝置製造裝置之第2實施形態。本第2實施形態與第1 實施形態之不同點係光罩洗淨室乃具有鄰接於光罩洗淨處 理室5而可交換新的光罩之光罩運出入室12的點。鄰接 的位置係於左右有真空蒸鍍室1，於前面係有雷射室3之 故，成爲後方或上部或者下部。在本實施形態中，爲了發 揮圖5所示之光罩運送手段而作成設置於後方。因此，光 罩洗淨處理室5係具有將光罩做成90度方向轉換之方向 -21 - 201112316 轉換機構，例如旋轉台機構57。 以下，依序說明光罩洗淨處理室5與光罩運出入室 1 2之構成與動作。 圖9所示之光罩洗淨處理室5係具有對於作爲既已說 明之回收手段60而具有帶電薄膜61之形式，於旋轉台機 構57與光罩運出入室12之間附加閘閥10A之構成。旋 轉台機構57係呈未與回收手段60之傳送滾輪62i干擾地 加以設置。 圖1 0係顯示本發明之第3實施形態之光罩洗淨處理 室之更詳細的構成與其動作的圖，其中，顯示在其構成之 中，除了回收手段之洗淨處理室運送部56與旋轉台機構 57。洗淨處理室運送部56的基本構成係如既已在圖5所 說明者。與圖5不同處係光罩運送驅動手段56B以外之洗 淨處理室運送部56係加以固定於旋轉台56t上的點。爲 了可在與左右之真空蒸鍍室1或位於後方之光罩運出入室 1 2之間運出入光罩8 1，洗淨處理室運送驅動部56B係必 須配置於圖9之一點虛線的交叉位置。例如，洗淨處理室 運送驅動部56B之小齒輪56g的旋轉中心係呈來到旋轉台 56之旋轉中心位置地配置。由將驅動馬達配置於旋轉台 56之旋轉中心位置者，未將驅動馬達設置於旋轉台上亦 可，其結果可將驅動馬達設置於大氣側》 另外，旋轉台機構57係於其周圍具有齒輪57r之旋 轉台57t與旋轉台驅動部57B所成》旋轉台驅動部57B係 由設置於在大氣側之光罩洗淨處理室5的下部壁5Y下之 -22- 201112316 旋轉台驅動馬達5 7m，進行真空密封之密封部5 7s，與旋 轉台57t之齒輪57ι•咬合之齒輪57g及行走在光罩洗淨處 理室5之下部壁5Y上之複數的行走輪5 7k所成。 如根據本實施形態，可將運入至光罩交換室5之光罩 ，運出入至左右的處理室1或光罩運出入室12。 接著，顯示圖9所示之光罩運出入室12的構成及動 作。光罩運出入室12係設置光罩保管部121 (以下，簡單 φ 稱作保管部）。保管部121，係由具有與安裝基底52基本 上同樣的構造而加以複數配置之保管基底122、和具有與 搭載保管基底之保管台121d、和具有與將光罩移動在保 管台121d以及旋轉台5 7t之間之圖5所示的洗淨處理室 運送驅動部56B同一構造之運出入室運送驅動部126B， 所構成。運出入室運送驅動部12 6B係連結處理室運送驅 動部86B與洗淨處理室運送驅動部56B之直線，和連結 洗淨處理室運送驅動部56B與運出入室運送驅動部126B φ 之直線乃呈直角地加以配置。保管基底122之旋轉台57t 側係由從保管台1 2 1 d唯突出α =運出入室運送驅動部 1 26 Β +召幅度分之狀態加以設置。因此，經由將保管台 121d移動於箭頭Α方向之同時，移動於箭頭Β方向之時 ，所有的保管基底121h乃可作成與保管台運送驅動部 121B咬合。然而，121r係保管台121d之行走軌道。 圖11乃將圖9所示之光罩運出入室12，從箭頭C方 向而視的圖，其中，只顯示1台保管基底122，將運出入 室運送部126顯示爲主體的圖。圖11乃將閘閥l〇A作爲 -23- 201112316 交界，左側爲光罩洗淨處理室5，右側爲處理室1或運送 室2。運出入室運送部126係基本上與洗淨處理室運送部 5 6相同，但有以下不同處。 第1，運出入室運送驅動部126B之配置位置係如作 爲從運送手段的立場，必須位於與圖5之處理室運送驅動 部86B相同位置。經由此位置，運出入室運送驅動部 126B係成爲可進行與洗淨處理室運送部56之光罩的收授 〇 第2，光罩上部固定部12 2u乃成爲可開閉的點。因 從設置於光罩運出入室12的頂部之開關可能的開口部（ 未圖示），以起重器（未圖示）運入光罩81，而安裝於 運送滾輪122r時未成爲阻礙之故。安裝後，將設置於光 罩上部固定部122u之安裝爪12 2t，插入於安裝孔122h， 保持光罩81，經由導引滾輪126ur可安定運送。 光罩運出入室12係亦可爲大氣環境的室，但經由做 成真空處理室，開啓閘閥1 〇 A時，加強而言，可將光罩 洗淨處理室5的真空度，不用使處理室1之真空度降低而 交換光罩。其結果，可提供縮短爲了吸引成真空的時間， 而稼動率高之有機電激發光裝置製造裝置》 接著，使用圖1 2說明本發明之第3實施形態之有機 電激發光裝置製造裝置。本實施形態之有機電激發光裝置 製造裝置200係將圖1所示之有機電激發光裝置製造裝置 之群組（A~D)，於六角形的運送室2與六角形之中對角 之2邊，設置有收授室14f，14g於剩餘的4邊，設置有 -24- 201112316 作爲處理線而具有1線之真空蒸鍍室等之處理室1。 本有機電激發光裝置製造裝置200係將基板6之蒸鍍 面做成下面而進行水平運送，運入至真空蒸鍍室1而從下 方進行蒸鍍之裝置。於各真空蒸鍍室之橫向，設置有光罩 洗淨室5。光罩洗淨室5係具有藉由可光罩運送至真空蒸 鍍室1之閘閥10B而鄰接之光罩洗淨室5，和設置於光罩 洗淨處理室5之下側的雷射室3，和可光罩運送至光罩洗 φ 淨室5之閘閥10A而鄰接之光罩運出入室12。水平地運 送光罩，將光罩做成水平進行乾洗淨的點係爲不同，但可 使用在第1或第2實施形態所示之運送方法及乾洗淨方法 〇 隨之，在第3實施形態中，可得到在第1或第2實施 形態所示之效果。 最後，依據上述之實施形態，說明有機電激發光裝置 製造流程。圖13乃顯示未破壞光罩洗淨處理室之真空度 φ 而進行光罩洗淨情況之有機電激發光裝置製造方法流程圖 〇 首先，將光罩運出入室12及光罩蒸鍍室5做成特定 之真空度，開啓閘閥10A，10B(步驟1)。之後，將光罩 81，藉由光罩蒸鍍室5而運入至真空蒸銨室1，關閉各閘 閥（步驟2)。接著，運入基板至真空蒸鍍室1，進行校準 而進行蒸鍍（步驟3)。蒸鍍後，將基板從真空蒸鍍室1運 出（步驟4)。是否要洗淨，即判斷是否已進行特定基板片 數的蒸鍍（步驟5)。如未達到特定之基板片數，返回至步 [S1 -25- 201112316 驟3»如到達特定之基板片數，進行光罩81之洗淨處理 。爲此，開啓閘閥10B，將光罩經由運送部56，86而移 動至光罩洗淨處理室5，關閉閘閥10B(步驟6)。接著， 判斷是否特定次數洗淨該光罩（步驟7)。如爲達到特定次 數，降低光罩洗淨處理室5之真空度（步驟8)。之後，將 光罩，進行經由雷射光之乾洗淨（步驟9)。洗淨後，將光 罩洗淨處理室之真空度返回至特定的値，開啓閘閥10B( 步驟10)。接著，將該光罩，經由運送部56，86而移動 至真空蒸鍍室1，關閉閘閥10B，返回至步驟3(步驟1 1) 。如在步驟7達到特定次數，對於預定之全基板而言，判 斷處理結束（步驟1 2)。如終了，結束處理。如爲終了，將 基板移動至光罩運出入室12(步驟13)，返回至步驟丨，運 入新的光罩。 如根據上述說明之有機電激發光裝置製造流程/可提 供未曾破壞真空處理室之真空，而可保持長時間實施真空 蒸鍍處理，稼動率高之有機電激發光裝置製造方法》 圖14乃顯示以氮等之氣體淨化光罩洗淨處理室而進 行光罩洗淨情況之有機電激發光裝置製造方法流程圖«本 流程係與圖1 3所示之流程有3個大的不同點，但其他的 點係基本上相同。第1，並非進行經由如圖1 3所示之光 罩的蒸鍍，光罩洗淨，經由光罩之蒸鍍…之串聯性的處理 ，而是將新的光罩運入至真空蒸鍍室，於在新的光罩之蒸 鍍處理中’進彳了洗淨之光罩的洗淨的點。具體而言，在圖 I4之流程中，在步驟7的處理後，再次並聯地進行步驟2 -26- 201112316 至步驟5之蒸鍍流程，和步驟9至步驟12之光罩洗淨流 程。 第2，伴隨第1之變更，從光罩洗淨處理室5運出光 罩至裝置外之情況，係對於一個光罩而言，成爲只有在特 定次數之光罩洗淨後實施之步驟13之1次，其次數係大 幅降低。因此，未設置圖9所示之光罩運出入室12，而 對於將光罩運出入室12之光罩保管部121設置於光罩洗 φ 淨處理室5之裝置（未圖示）而言之處理流程的點。第3 ，在洗淨光罩時，爲了在氮環境中進行，如步驟9，步驟 12所示，將光罩洗淨處理室5做成氮環境，以及作爲返 回至具有特定真空度之真空環境的點。 在圖14所示之有機電激發光裝置製造流程中，由並 聯地進行蒸鍍處理與光罩洗淨處理，於氮環境置換中，亦 可進行蒸鍍處理’可提供稼動率高之有機電激發光裝置製 造裝置及有機電激發光裝置製造方法。 # 當然’在圖13的流程中，不限於有無設置光罩運出 入室12’與圖14同樣地’由進行並聯性之處理，對於作 爲真空度在上下的時間中，亦可進行蒸鍍處理，可提供稼 動率高之有機電激發光裝置製造裝置及有機電激發光裝置 製造方法。 在任一方法中，比較於以往，均可保持長時間實施真 空蒸鍍處理，可提供稼動率高之有機電激發光裝置製造方 法。 在以上說明中，已舉例說明過有機電激發光裝置，但 -27- 201112316 對於進行有著與有機電激發光裝置相同背景之蒸鍍處理之 成膜裝置亦可適用。 【圖式簡單說明】 圖1乃顯示本發明之第1實施形態之有機電激發光裝 置製造裝置的圖。 圖2乃本發明之實施形態之運送室與處理室之構成模 式圖和動作說明圖。 圖3乃顯示本發明之一實施形態之校準部的圖》 圖4乃顯示光罩的一例圖。 圖5乃顯示在本發明之實施形態的運送手段之基本的 槪念圖。 圖6乃顯示本發明之第1實施形態之光罩洗淨處理室 的構成與其動作的圖。 圖7乃顯示本發明之第2實施形態之光罩洗淨處理室 的構成與其動作的圖。 圖8乃顯示本發明之第2實施形態之雷射室的構成與 其動作的圖。 圖9乃顯示本發明之第2實施形態之有機電激發光裝 置製造裝置的圖。 圖1〇乃顯示本發明之第3實施形態之光罩洗淨處理 室的構成與其動作的圖。 圖11乃顯示本發明之第2實施形態之在有機電激發 光裝置製造裝置的光罩運出入室之構成及動作圖❶ -28- 201112316 圖12乃顯示本發明之第3實施形態之有機電激發光 裝置製造裝置的圖。 圖13乃顯示降低光罩洗淨處理室之真空度而進行光 罩洗淨情況之有機電激發光裝置製造方法流程圖。 圖14乃顯不以氮等之氣體淨化光罩洗淨處理室而進 行光罩洗淨情況之有機電激發光裝置製造方法流程圖。 β 【主要元件符號說明】 1 ·處·理室 lbu :真空蒸鍍室 2 :輸送室 3 =雷射室 4 :光罩洗淨室 5:光罩洗淨處理室 6 :基板 • 7 :蒸鍍部 8 :校準部 9 :處理收授部 I 〇 :閘閥 II :間隔板 12 :光罩運出入室 1 3 :負載群組 W :收授室 15 :運送機器手臂 [S] -29- 201112316 20 :控制裝置 30 :雷射光源（脈衝雷射） 3 1 :雷射光 3 2 :電流鏡 3 5 :雷射光掃描手段 36:雷射左右光掃描手段 37:雷射上下光掃描手段 60，65:回收手段 61 :帶電薄膜 66 :回收流路生成手段 67 :回收補助流路形成手段 71 :蒸發源 8 1 :光罩 81k:光罩下部固定部81k(固定部） 87 :光罩保持部 100，200:有機電激發光裝置之製造裝置 A〜D :群組 -30-i S -13- 201112316 5 is a display chamber 1 on the left side, a photomask is displayed on the right side, and the photomask 81 is attached to the processing chamber 1 so that there is a gap between the two chambers. Both sides of the gate valve are transported by the transport chambers for transporting the reticle 81: 56, processing chamber transport: 86). In the case of the structure having the same structure, the light 5 is mainly used for the structure, and the vacuum deposition chamber 1 will be described as a main body in relation to the mask transport driving means to be described later. Therefore, the drawings and symbols. Each of the transport units (56, 86) is formed by a susceptor (mounting base pedestal: 82) and a reticle transport driving means (cleaning process: 506B, process chamber transport drive unit: 86B). When the mask 81 is carried into the susceptor, the light (5 2u, 8 2u) supporting the upper portion of the reticle and the lower portion of the transport reticle 81 are carried out: 8 2r ). The two reticle transport driving means are provided at a shorter interval LD than the light LS, and for each front end pinion: 56g, 86g). Further, the mask is provided as a cover lower fixing portion 81k, and the mask i provided on the carrier is recessed in a concave shape sandwiching the mask at the fixing portion, and the mask lower fixing portion 81k is provided as the aforementioned small portion. The rack of teeth is Sir. Since LS>LD, at least one of the strips 8 1 r is engaged, the two small masks are coordinated to control the two forward and backward movements. In order to smoothly transport the reticle 8 1, the reticle cleaning processing chamber 5 line is displayed. Gate valve 10B. The delivery part (the cleaning part transportation part is a specific cover cleaning processing room will be referred to FIG. 3, a part of which is omitted: 5, the calibration room transportation drive unit base has a cover upper fixed part feeding rail (56r, cover 8) The horizontal length of the 1 has a pinion (the lower part of the body and the moving light, the giant reticle 81 is inserted into the wheel and the frictional pinion is the gear of the tooth, and the upper fixed part of the -14-201112316 can be The transport guide 56h formed by the guide rollers 56ui·' 56ul of the left and right of the plural is shown in Fig. A. On the other hand, the lower cover fixing portion 8 1 k is as shown in the drawing B, and the rack is attached. The pedestal on the opposite side of the side is provided with a plurality of rollers 56dr that are transported simultaneously with the pinion gear to hold the reticle 81. The main guide rollers 86ur and 86ul are calibrated to achieve the function of holding the fixed reticle, and can be stably maintained. In the reticle, the degree of the clip and the reticle φ 'the guide roller is slightly adjusted between the guide rollers 56ur and 56ul. The transport roller 8 2r and the guide roller are designed to reduce the vacuum evaporation. Bringing adverse effects For the gas, a low-lubricity bearing is used. However, in order to attach and detach the mask 81 to the mask lower fixing portion 81k and securely fix it, the mask lower fixing portion 81k is provided in a plurality of housings and disposed in the lower portion of the mask. A triangular pyramid-shaped recess (not shown) of the triangular pyramid-shaped projections. The mask transport driving means 86B is transported in a processing chamber provided under the lower wall 1Y of the processing chamber 1 on the atmospheric side φ as shown in FIG. The drive motor 86m is formed by the pinion gear 86g of the rack 81r of the mask and the sealing portion 86s of the vacuum seal. Thus, the mask transport driving means 86B is also sealed by the mechanism portion 83 for calibration. The dust is placed on the atmosphere side, and dust or the like which is not adversely affected by vacuum vapor deposition is introduced into the vacuum. The mask transport driving means 5 6B also has the same configuration as the mask transport driving means 86B. The desired position to be mounted to the calibration base 82 is in the present embodiment, using the calibration optical system 85. As shown in Fig. 4, the -15-201112316 calibration system is disposed on the substrate 6 and the mask 81 of the mask 81. 81m is controlled in an overlapping manner. Therefore, when the two calibration marks 6m, 81m are simultaneously photographed by the camera of the calibration optical system 85, it is judged to be mounted. Of course, the switch is provided at the end of the upper fixing portion 8 2u of the mask. According to the present embodiment, when the mask is cleaned, the processing chamber such as the vacuum deposition chamber and the mask cleaning processing chamber are disposed on both sides of the gate valve 10B. A simple mechanism for driving the driving portion of the rack held in the lower portion of the reticle of the reticle can be moved, and after the reticle is reliably moved, the processing chamber such as the vacuum deposition chamber can be closed by closing the gate valve 10B. Completely separated from the reticle cleaning chamber. Next, the configuration and operation of the first embodiment of the mask cleaning processing chamber 5 will be described with reference to Fig. 6 . In Fig. 6, the mask upper portion fixing portion 52u, the left end surface of the mask 81 and the mask lower fixing portion 81k, and the like have a cross-sectional shape. When the vapor deposition material deposited on the mask 81 illuminates the laser light, heat shock is transmitted to the mask 8 1 and the deposit V Μ , and the deposit is broken. At this time, a gas is generated as the free product of the fine powder flies out. Further, the free product also contains a gas, and a part of it is later released into the cleaning chamber. The wavelength of the laser light at this time is determined by the wavelength at which the thermal shock is easily transmitted to the metal material forming the mask. In the present embodiment, the photomask 81 is an alloy of cobalt and nickel, and has a wavelength of 532 nm. Therefore, the mask cleaning processing chamber 5 is a laser light irradiation window 51 which is formed by a quartz glass, a glass plate or the like which is provided with a high transmittance of laser light, and is provided in the mask cleaning processing chamber 5, and is held by the laser light irradiation window 51. The cleaning processing chamber transport unit 56 (see FIG. 5, which is not shown in FIG. 6 in order to avoid complication) in the adjacent processing chamber-16-201112316 has a recovery means 60 for recovering the above-mentioned free product. In the recovery means 60 of the present embodiment, the charged film 61 that is charged by the laser light is placed at a position away from the front surface of the reticle, and the flying free product is adsorbed by the charged film 61. The recovery means 60 includes a supply roller 62s for supplying a charged film, and a recovery roller 62k for φ adsorption of a charged film of a free product and two transfer rollers 62i for collecting the collected film. The recovery roller 62k is rotated by a roller drive motor 63 provided at a lower end thereof. In order to reliably capture the aforementioned free product of the fly-out, the degree of vacuum is lowered to lengthen the average free path of the free product. For example, in the vacuum deposition chamber, the degree of vacuum l〇_5 Torr is reduced to 10_2 to 1 (T3T〇rr). However, in the present embodiment, the roller drive motor is installed in the cleaning chamber, but The mask transport driving means 86B may be provided on the atmosphere side by the sealing portion. • According to the recovery means of the present embodiment, a simple mechanism for attaching the free product to the charged film does not transmit an external force to In the mask, the free product can be recovered without leaving the adhesive. Next, the laser chamber 3 will be described. The laser chamber 3 is in the atmosphere, as shown in the diagram of Fig. 1, and has a pulse as a laser source. The laser 30, and the current mirror 32 for scanning the laser light 31 on the plane of the reticle 81, the laser light 3 is adjusted to focus on the reticle. For example, the reticle 81 can be scanned by a current mirror 32. In the foregoing, the laser light 31 is split and scanned by a plurality of current mirrors 32. Further, 'by performing splitting, I S1 -17-201112316, when the free product is flying out, the output of the pulsed laser 30 is insufficient. Situation, or in one In the case of the scanning time of the pulsed laser, a plurality of pulsed lasers may be provided. According to the embodiment described above, the vacuum cleaning chamber 5 is separated from the vacuum evaporation chamber 1 by a vacuum. The environment can be vapor-deposited without being affected by the gas or the free product generated by the reticle cleaning. As a result, it is possible to provide a device for manufacturing an organic electroluminescence device having a high film thickness and a high productivity. According to the embodiment described above, the photomask can be reliably transported between the mask cleaning processing chamber 5 and the vacuum vapor deposition chamber 1, and the vacuum mask can be maintained while maintaining the vacuum mask. In addition, it is possible to provide an organic electroluminescence device manufacturing apparatus or a mask cleaning method having a high rate of utilization. Next, the configuration of the second embodiment of the mask cleaning processing chamber 5 and its operation will be described with reference to Fig. 7. In the same manner as in FIG. 3, the wall or the gate valve of the processing chamber is omitted, and similarly to FIG. 6, the left end surface of the mask upper fixing portion 5 2u, the mask 81 and the mask lower fixing portion 8 1 k are displayed. The relationship between the mask cleaning processing chamber 5 and the adjacent vacuum vapor deposition chamber 1 or the laser chamber 3 is the same as that of the first embodiment. The first difference is the first, and the mask cleaning chamber is made into a nitrogen atmosphere. In the case of the second, the flow of nitrogen is applied to the front surface of the reticle 81, and the recovery means 65 for recovering the free product flying out of the reticle is used. The first point may be, for example, in the atmosphere, but Nitrogen is the best when it raises the -18-201112316 vacancy again. In addition, it has the advantage of being different from the atmosphere, and there is no need to worry about the oxidation of light. In addition, in addition to nitrogen, a gas having such a point can also be used. In the second embodiment, the recovery means 65 of the present embodiment has a nitrogen blowing portion 66a which is placed on the front surface of the mask 81 and a nitrogen suction portion 66b which is disposed opposite to the nitrogen blowing portion at the lower surface of the mask. The collected flow path generating means 66 and the free product collecting flow path 68 which is formed by the φ collecting path generating means on the back surface of the mask, and the collecting auxiliary flow path forming means 67 which is a free product. A nitrogen transfer means (not shown) for transferring nitrogen to the blower portion 6 6a by the nitrogen feed pipe 66k and a recovery portion for recovering nitrogen from the nitrogen suction 66b are provided outside the mask cleaning chamber 5 (not shown). ). The recovery flow path generating means 66 is directly or indirectly fixed to the wall surface of the mask cleaning processing chamber 5 or the like. The recovery-assist flow path forming means 67 is fixed by being attached to the attachment base 52 of the cleaning process chamber transport unit 56 shown in Fig. 5 . When the laser beam is irradiated to the deposition portion VM of the vapor deposition material of the mask 81, a thermal shock is transmitted to the mask and the deposit, and the deposition portion is broken, and becomes a free product of the fine powder. The cover flew out. This also produces gas. The free product recovery flow path 66 complements the free biomass and gas, and the nitrogen recovery unit 66b and the nitrogen recovery pipe 66n are recovered and recovered. For example, a filter unit is attached to the recovery unit to separate nitrogen and the product. At this time, the distance between the mask 81 and the free product recovery flow path 68 is the same as that of the return-feeding nitrogen-removing part before the free-formed cover which is not covered by the free product recovery flow path. Partial free Γ -19- 201112316 with gas. Therefore, the nitrogen is transported from the opening 81k (see Fig. 4) of the reticle by the recovery-assist flow path forming means 67, and the free product and the gas are adhered to the free product recovery flow path to be advanced. The recovery supply passage forming means 67 is provided with a nitrogen supply pipe 67k connected to the above-described nitrogen transfer means (not shown). When the air supply pressure at the opening of the reticle is high, the opening may be deformed, and the air pressure required to advance the deformation of the opening is ensured, and nitrogen is provided outside the reticle processing chamber. Supply pipe adjustment valve (not shown). As described above, according to the second embodiment of the photomask cleaning processing chamber 5 described above, a solid or a liquid such as a film (e.g., a cleaning liquid) or the like is not brought into contact with the photomask, and the photomask can be cleaned. Further, according to the second embodiment of the photomask cleaning processing chamber according to the description, it is possible to provide a driving unit having no rotation or the like in the recovery means 65, and a more reliable organic electroluminescence device manufacturing apparatus or organic electroluminescence device. Production method. Next, the configuration of the second embodiment of the laser room 3 and its operation will be described with reference to Fig. 8 . The laser chamber is an atmospheric environment chamber as in the first embodiment. This embodiment shows a laser light scanning means that scans laser light without using a current mirror, unlike the first embodiment. The laser light scanning means 35 is a laser light up-and-down scanning means 37 for moving the left and right scanning means 36 of the laser beam left and right to move the illumination mirror 35m in the vertical direction. The laser light left and right scanning means 36 has an illumination mirror fixing portion 36d that fixes the illumination mirror 35m, and two left and right rails 3 6r that move the illumination mirror fixing portion, and left and right nuts (not shown) that are inside the illumination mirror fixing portion. , and -20- 201112316 drive the right and left ball-containing pneumatic probe 36b, and the left and right motor 36m that rotates the left and right ball-containing pneumatic probes, and the relay mirror 36c that reflects the laser light toward the illumination mirror 35m and mounts the same The left and right drive stages 36k. Further, the left and right driving stages are provided with laser light guiding holes 36h for guiding the laser light from the lower side to the relay mirror. On the other hand, the laser light up-and-down scanning means 37 has two upper and lower rails 37r which are moved by the left and right driving stages 36k, and φ upper and lower nuts 37n fixed to the left and right driving stages, and the upper and lower nuts including the ball pneumatic probe 37b are driven. , and rotate the upper and lower ball-containing pneumatic probes above and below the motor 37m. With this configuration, the laser light 31 from the laser light source 30 is brought into contact with the upper and lower relay mirrors 36c through the laser light guiding holes 36h, and the laser light reflected by the relay mirror is moved by the left and right illumination mirrors 3 5 m is reflected and transmitted through the quartz glass 51 to illuminate the deposit of the reticle. As described above, in the second embodiment of the above-described laser chamber 3, it is somewhat complicated compared to the first embodiment, but it is possible to reliably illuminate the entire surface of the reticle. Next, a second embodiment of the apparatus for manufacturing an organic electroluminescent device of the present invention will be described with reference to Figs. 9 to 11 . The second embodiment differs from the first embodiment in that the photomask cleaning chamber has a point in which the photomask that is adjacent to the mask cleaning processing chamber 5 and can exchange a new mask is carried out into the chamber 12. The adjacent position is the vacuum deposition chamber 1 on the right and left, and the laser chamber 3 is attached to the front side, and is rearward or upper or lower. In the present embodiment, the reticle transport means shown in Fig. 5 is provided to be disposed at the rear. Therefore, the mask cleaning processing chamber 5 has a direction-21 - 201112316 conversion mechanism for converting the mask into a 90-degree direction, for example, a rotary table mechanism 57. Hereinafter, the configuration and operation of the photomask cleaning processing chamber 5 and the photomask transporting chamber 1 will be described in order. The reticle cleaning processing chamber 5 shown in Fig. 9 has a configuration in which a charging film 61 is provided as a recovery means 60 as described above, and a gate valve 10A is added between the rotary table mechanism 57 and the reticle carry-out chamber 12. . The rotary table mechanism 57 is provided so as not to interfere with the transfer roller 62i of the recovery means 60. Fig. 10 is a view showing a more detailed configuration and operation of the photomask cleaning processing chamber according to the third embodiment of the present invention, in which the cleaning processing chamber transporting unit 56 of the recovery means is displayed. Rotary table mechanism 57. The basic configuration of the cleaning processing chamber transport unit 56 is as already explained in Fig. 5. The cleaning processing chamber transport unit 56 other than the mask transport driving means 56B, which is different from that of Fig. 5, is fixed to the rotary table 56t. In order to be able to carry out the reticle 8 between the left and right vacuum deposition chambers 1 or the rear reticle carry-in chamber 1 2, the cleaning processing chamber transport drive unit 56B must be disposed at the dotted line of one of the dotted lines in FIG. position. For example, the center of rotation of the pinion gear 56g of the washing processing chamber transport driving portion 56B is disposed at the center of rotation of the turntable 56. When the drive motor is disposed at the rotational center position of the rotary table 56, the drive motor may not be disposed on the rotary table, and as a result, the drive motor may be disposed on the atmosphere side. In addition, the rotary table mechanism 57 has gears around it. The rotating table 57t of the 57r and the rotating table driving unit 57B are formed by the lower wall 5Y of the mask cleaning processing chamber 5 on the atmospheric side. -22-201112316 Rotary table driving motor 5 7m The vacuum-sealed sealing portion 5 7s is formed by a gear 57g that meshes with the gear 57 of the rotating table 57t, and a plurality of traveling wheels 57k that travel on the lower wall 5Y of the reticle processing chamber 5. According to the present embodiment, the mask that is carried into the mask exchange chamber 5 can be carried out to the left and right processing chambers 1 or the mask can be carried out into the chamber 12. Next, the configuration and operation of the photomask shown in Fig. 9 to be carried out into the chamber 12 are shown. The mask transporting and entering chamber 12 is provided with a mask storage unit 121 (hereinafter, simply referred to as a storage unit). The storage unit 121 is provided with a storage base 122 having a structure substantially the same as that of the mounting base 52, a storage base 122 having a storage base, and a storage base 121d and a rotary table. The transport processing unit transport drive unit 56B shown in Fig. 5 between 5 and 7t is configured to be transported out of the room transport drive unit 126B having the same structure. The transport-in/out transport drive unit 12 6B is a line connecting the processing chamber transport drive unit 86B and the cleaning processing chamber transport drive unit 56B, and a line connecting the cleaning processing chamber transport drive unit 56B and the transport-in/out transport drive unit 126B φ Configure it at right angles. The side of the turntable 57t of the storage base 122 is set in a state in which it is protruded from the storage table 1 2 1 d only α = transported into the room transport drive unit 1 26 Β + call amplitude. Therefore, when the storage table 121d is moved in the direction of the arrow , and moved in the direction of the arrow ,, all the storage bases 121h can be engaged with the storage table transport drive unit 121B. However, the 121r is a traveling rail of the storage table 121d. Fig. 11 is a view in which the photomask shown in Fig. 9 is carried out of the chamber 12, as viewed from the direction of arrow C, in which only one storage base 122 is displayed, and the transport/inlet transport unit 126 is shown as a main body. Fig. 11 shows the gate valve l〇A as the junction of -23-201112316, the mask cleaning chamber 5 on the left side, and the processing chamber 1 or the transport chamber 2 on the right side. The carry-out/transporting unit 126 is basically the same as the washing-room transport unit 56, but has the following differences. First, the arrangement position of the transport-in/out transport drive unit 126B must be located at the same position as the process transport drive unit 86B of Fig. 5 as the transport means. At this position, the carry-in/outlet transport drive unit 126B is capable of receiving the photomask from the cleaning processing chamber transport unit 56. Second, the mask upper fixing portion 12 2u is openable and closable. Since the opening (not shown) of the switch provided at the top of the hood to the entrance chamber 12 is carried into the reticle 81 by a jack (not shown), it is not blocked when it is attached to the transport roller 122r. Therefore. After the attachment, the attachment claws 12 2t provided in the reticle upper fixing portion 122u are inserted into the attachment holes 122h, and the reticle 81 is held, and can be stably transported via the guide rollers 126ur. The mask can be transported into the room 12, which can also be a room in an atmospheric environment. However, when the gate valve 1 〇A is opened by forming a vacuum processing chamber, the vacuum of the processing chamber 5 can be cleaned without reinforcement. The vacuum of chamber 1 is lowered to exchange the reticle. As a result, it is possible to provide an organic electroluminescent device manufacturing apparatus according to a third embodiment of the present invention, and a device for manufacturing an organic electroluminescent device according to a third embodiment of the present invention will be described with reference to FIG. In the organic electroluminescent device manufacturing apparatus 200 of the present embodiment, the group (A to D) of the organic electroluminescent device manufacturing apparatus shown in FIG. 1 is diagonally interposed between the hexagonal transport chamber 2 and the hexagon. On the two sides, the receiving chambers 14f and 14g are provided on the remaining four sides, and the processing chamber 1 having a 1-line vacuum vapor deposition chamber or the like as the processing line is provided. In the organic electroluminescence device manufacturing apparatus 200, the vapor deposition surface of the substrate 6 is conveyed horizontally, and is transported to the vacuum deposition chamber 1 to be vapor-deposited from below. A reticle cleaning chamber 5 is provided in the lateral direction of each vacuum evaporation chamber. The photomask cleaning chamber 5 has a photomask cleaning chamber 5 that is adjacent to the gate valve 10B of the vacuum evaporation chamber 1 by a photomask, and a laser chamber that is disposed on the lower side of the photomask cleaning processing chamber 5. 3, and the photomask is transported to the shutter valve 10A of the reticle cleaning chamber 5, and the adjacent photomask is carried out into the chamber 12. The point that the photomask is transported horizontally and the mask is horizontally cleaned is different. However, the transport method and the dry cleaning method shown in the first or second embodiment can be used. In the embodiment, the effects shown in the first or second embodiment can be obtained. Finally, the manufacturing process of the organic electroluminescent device will be described based on the above embodiments. Fig. 13 is a flow chart showing the manufacturing method of the organic electroluminescence device which does not destroy the vacuum degree φ of the mask cleaning processing chamber and performs the mask cleaning. First, the photomask is carried out into the chamber 12 and the mask evaporation chamber 5 To achieve a specific degree of vacuum, the gate valves 10A, 10B are opened (step 1). Thereafter, the mask 81 is carried into the vacuum vaporizing chamber 1 by the mask vapor deposition chamber 5, and the gate valves are closed (step 2). Next, the substrate is transferred to the vacuum deposition chamber 1, and calibrated to perform vapor deposition (step 3). After vapor deposition, the substrate is carried out from the vacuum evaporation chamber 1 (step 4). Whether or not to be cleaned is judged whether or not vapor deposition of a specific number of substrates has been performed (step 5). If the number of specific substrates is not reached, return to step [S1 - 25 - 201112316 Step 3» If the number of specific substrates is reached, the mask 81 is cleaned. To this end, the gate valve 10B is opened, the photomask is moved to the photomask cleaning processing chamber 5 via the transport portions 56, 86, and the gate valve 10B is closed (step 6). Next, it is judged whether or not the mask is washed a certain number of times (step 7). If the specific number of times is reached, the degree of vacuum of the mask cleaning processing chamber 5 is lowered (step 8). Thereafter, the photomask is subjected to dry cleaning by laser light (step 9). After washing, the vacuum of the reticle processing chamber is returned to a specific enthalpy, and the gate valve 10B is opened (step 10). Then, the mask is moved to the vacuum deposition chamber 1 via the transport portions 56, 86, the gate valve 10B is closed, and the process returns to step 3 (step 1 1). If a certain number of times is reached in step 7, the determination process ends for the predetermined full substrate (step 12). If it is over, finish processing. If so, move the substrate to the reticle carry-out chamber 12 (step 13) and return to step 丨 to load the new reticle. According to the manufacturing process of the organic electroluminescent device according to the above description, it is possible to provide a method for manufacturing an organic electroluminescent device which can maintain a vacuum for a vacuum processing chamber without being destroyed, and which can maintain a vacuum evaporation treatment for a long period of time. Flow chart of manufacturing method of organic electroluminescence device for purifying the mask by purifying the mask cleaning chamber with nitrogen or the like. This flow system has three major differences from the flow shown in FIG. The other points are basically the same. First, instead of performing vapor deposition by a photomask as shown in FIG. 13 , cleaning of the photomask, and vapor deposition by a photomask, the new photomask is carried into vacuum evaporation. In the vapor deposition process of the new reticle, the room is cleaned by the reticle of the reticle. Specifically, in the flow of Fig. I4, after the processing of the step 7, the vapor deposition steps of steps 2-26 to 201112316 to step 5, and the mask cleaning process of steps 9 to 12 are performed in parallel again. Secondly, in the case where the photomask is carried out from the mask cleaning processing chamber 5 to the outside of the apparatus, the photomask is replaced by step 13 after only a certain number of mask cleanings. Once, the number of times is greatly reduced. Therefore, the photomask transport-in/out chamber 12 shown in FIG. 9 is not provided, and the apparatus (not shown) in which the mask storage unit 121 for transporting the mask into the chamber 12 is provided in the photomask cleaning chamber 5 (not shown) The point of the process flow. Third, in the case of cleaning the reticle, in order to carry out in a nitrogen atmosphere, as shown in step 9, step 12, the reticle cleaning treatment chamber 5 is made into a nitrogen atmosphere, and as a vacuum environment returning to a specific degree of vacuum. Point. In the manufacturing process of the organic electroluminescence device shown in FIG. 14, the vapor deposition process and the photomask cleaning process are performed in parallel, and in the nitrogen environment replacement, the vapor deposition process can be performed to provide an organic electricity having a high rate of utilization. An excitation light device manufacturing device and a method of manufacturing an organic electroluminescence device. # Of course, in the flow of Fig. 13, the presence or absence of the photomask transport-in/out chamber 12' is not limited to the same as in Fig. 14, and the parallel processing is performed, and the vapor deposition treatment may be performed for the time when the degree of vacuum is up and down. The invention provides an organic electroluminescence device manufacturing device and a method for manufacturing an organic electroluminescence device with high utilization rate. In any of the methods, the vacuum evaporation treatment can be performed for a long period of time, and a method for manufacturing an organic electroluminescence device having a high rate of utilization can be provided. In the above description, the organic electroluminescence device has been exemplified, but -27-201112316 is also applicable to a film formation apparatus which performs vapor deposition treatment with the same background as the organic electroluminescence device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an apparatus for manufacturing an organic electroluminescence device according to a first embodiment of the present invention. Fig. 2 is a block diagram and an operation explanatory view of a transport chamber and a processing chamber according to an embodiment of the present invention. Fig. 3 is a view showing a aligning portion according to an embodiment of the present invention. Fig. 4 is a view showing an example of a reticle. Fig. 5 is a view showing the basic concept of the transport means in the embodiment of the present invention. Fig. 6 is a view showing the configuration and operation of the mask cleaning processing chamber according to the first embodiment of the present invention. Fig. 7 is a view showing the configuration and operation of a mask cleaning processing chamber according to a second embodiment of the present invention. Fig. 8 is a view showing the configuration of a laser chamber according to a second embodiment of the present invention and its operation. Fig. 9 is a view showing an apparatus for manufacturing an organic electroluminescence device according to a second embodiment of the present invention. Fig. 1 is a view showing the configuration and operation of a mask cleaning processing chamber according to a third embodiment of the present invention. Fig. 11 is a view showing the configuration and operation of the mask of the organic electroluminescent device manufacturing apparatus according to the second embodiment of the present invention. Fig. 12 is a view showing the organic battery according to the third embodiment of the present invention. A diagram of an excitation device manufacturing apparatus. Fig. 13 is a flow chart showing a method of manufacturing an organic electroluminescence device which reduces the degree of vacuum of the reticle cleaning chamber and performs reticle cleaning. Fig. 14 is a flow chart showing a method of manufacturing an organic electroluminescence device which does not clean the mask cleaning chamber with a gas such as nitrogen to clean the mask. β [Description of main component symbols] 1 · Department and management room lbu : Vacuum evaporation chamber 2 : Conveying chamber 3 = Laser chamber 4 : Photomask cleaning chamber 5 : Photomask cleaning processing chamber 6 : Substrate • 7 : Steaming Plated portion 8: Calibration portion 9: Process receiving portion I 〇: Gate valve II: Spacer plate 12: Mask is carried out into the chamber 1 3: Load group W: Receiving room 15: Transporting the robot arm [S] -29- 201112316 20: Control device 30: Laser light source (pulse laser) 3 1 : Laser light 3 2 : Current mirror 3 5: Laser light scanning means 36: Laser left and right light scanning means 37: Laser up and down light scanning means 60, 65 : Recycling means 61 : Charged film 66 : Recovery flow path generating means 67 : Recovery auxiliary flow path forming means 71 : Evaporation source 8 1 : Photomask 81k : Mask lower fixing portion 81k (fixed portion) 87 : Mask holding portion 100 , 200: Manufacturing apparatus for organic electroluminescent device A~D: Group-30-