TW201107406A - Polyester composition for forming thermoset film - Google Patents

Polyester composition for forming thermoset film Download PDF

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TW201107406A
TW201107406A TW099109908A TW99109908A TW201107406A TW 201107406 A TW201107406 A TW 201107406A TW 099109908 A TW099109908 A TW 099109908A TW 99109908 A TW99109908 A TW 99109908A TW 201107406 A TW201107406 A TW 201107406A
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component
group
forming
polyester composition
polyester
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TWI485197B (en
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Tadashi Hatanaka
Isao Adachi
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Nissan Chemical Ind Ltd
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
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    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/56Amines together with other curing agents
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    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/54Amino amides>
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
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    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • G02F1/133711Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by organic films, e.g. polymeric films
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2477/00Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2477/06Polyamides derived from polyamines and polycarboxylic acids
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133514Colour filters
    • G02F1/133519Overcoatings

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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  • Nonlinear Science (AREA)
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  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Epoxy Resins (AREA)
  • Liquid Crystal (AREA)
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Abstract

Provided is a polyester composite for forming thermoset films, said composite having, after forming a thermoset film, high resistance to solvents and heat, good liquid crystal orientation, high transparency, and high planarizability. Said composite can also, when forming a thermoset film, be dissolved in glycol solvents and lactate ester solvents that can be applied to production lines for planarized color filter films. The composite contains: a component (A) which is a polyester obtained by reacting a tetracarboxylic dianhydride with a diol compound; a component (B) which is an epoxy compound having at least two epoxy groups; and a component (C) which is an amino-group-containing carboxylic compound obtained by reacting a diamine compound, a dicarboxylic anhydride, and a tetracarboxylic dianhydride.

Description

201107406 六、發明說明: 【發明所屬之技術領域】 本發明係有關熱硬化膜形成用聚酯組成物及由該組成 物所得之硬化膜。更詳而言,本發明係有關一種具有高的 透明性、平坦化性,且具有液晶配向能、高的耐溶劑性及 耐熱性的熱硬化膜形成用聚酯組成物及其硬化膜、及使用 該硬化膜者。此熱硬化膜形成用聚酯組成物特別適合兼備 液晶顯示器中之液晶配向功能的彩色濾光片被覆劑。 【先前技術】 —般,液晶顯示元件、有機EL ( electroluminescent )兀件、固體攝影兀件等的光裝置,爲了防止元件表面在 製造步驟中曝露於溶劑或熱當中,因此設置保護膜。此保 護膜不僅需要與保護之基板的密著性高,耐溶劑性高,也 需要透明性、耐熱性等的性能。 這種保護膜作爲彩色液晶顯示裝置或固體攝影元件所 用之彩色濾光片的保護膜使用時,一般要求具有使其底層 基板之彩色濾光片或黑色矩陣樹脂平坦化的性能,即作爲 平坦化膜的性能。特別是製造STN方式或TFT方式之彩 色液晶顯示元件時,必須非常嚴密地進行彩色濾光片基板 與對向基板之貼合精度’使基板間之胞間隙均一化爲不可 或缺的。此外,爲了維持透過彩色濾光片之光的透過率, 其保護膜之此等平坦化膜必須爲高的透明性。 另外’近年硏究藉由於液晶顯示器之胞內導入相位差[ -5- 201107406 材’以達到低成本化、輕量化,這種相位差材一般係使用 塗佈液晶單體,並經配向後,使光硬化的材料。爲了使此 相位差材配向,必須爲下層膜經擦摩處理後,具有配向性 的材料。因此,於彩色濾光片之被覆層上形成液晶配向層 膜後’形成相位差材(參照圖2(a))。可形成兼具此 液晶配向層與彩色濾光片之被覆層的膜(參照圖2(b) )時,從可得到低成本化、製程數減少等大的優點,強烈 期待這種材料。 一般此彩色濾光片的被覆層係使用透明性高的丙烯酸 樹脂。此等丙烯酸樹脂從安全性、操作性的觀點,可廣泛 使用丙二醇單甲基醚或丙二醇單甲基醚乙酸酯等之甘醇系 溶劑或乳酸乙酯、乳酸丁酯等之酯系溶劑。這種丙烯酸樹 脂係以熱硬化或光硬化,賦予耐熱性或耐溶劑性(專利文 獻1、2 )。但習知之熱硬化性或光硬化性的丙烯酸樹脂 雖顯示適度的透明性或平坦化性,但即使擦摩處理這種平 坦化膜,也無法顯示充分的配向性。 另外,液晶配向層一般可使用溶劑可溶性聚醯亞胺或 聚醯胺酸所構成的材料。此等材料係在後烘烤時,以完全 醯亞胺化賦予耐溶劑性,藉擦摩處理顯示充分的配向性已 有相關報告(專利文獻3 )。但以彩色濾光片之平坦化膜 來看時,有平坦化性與透明性大幅降低等的問題。又,聚 醯亞胺或聚醯胺酸可溶於N-甲基-2-吡咯烷酮或丁內酯 等禱劑,但對於甘醇系溶劑或酯系溶劑的溶解性低,很難 適用於製作平坦化膜的生產線。 201107406 【發明內容】 [發明之槪要] [發明欲解決之課題] 本發明係依據上述情形而完成者,其欲解決的課題係 在於提供一種硬化膜形成後,顯示高的耐溶劑性、液晶配 向性、耐熱性、高透明性及高平坦化性,而且在硬化膜形 成時’可溶解於彩色濾光片之平坦化膜之製作生產線可使 用的甘醇系溶劑或乳酸酯系溶劑的材料。 [解決課題的手段] 本發明人等爲了解決上述課題而精心硏究結果發現本 發明。 換言之’第1觀點係有關一種熱硬化膜形成用聚酯組 成物’其係含有(A)成分、(B)成分及(C)成分, (A) 成分:使四羧酸二酐與二醇化合物反應所得之聚酯 (B) 成分:具有2個以上之環氧基的環氧化合物、 (C )成分:使二胺化合物、二羧酸酐及四—羧酸二酐反應 所得之含胺基羧酸化合物。 第2觀點係有關第丨觀點之熱硬化膜形成用聚酯組成 物’其中前述(A)成分爲含有以下述式(1)所示的構 造單元的聚酯,[Technical Field] The present invention relates to a polyester composition for forming a thermosetting film and a cured film obtained from the composition. More specifically, the present invention relates to a polyester composition for forming a thermosetting film having high transparency and flatness, and having liquid crystal alignment ability, high solvent resistance and heat resistance, and a cured film thereof, and Use this hardened film. The polyester composition for forming a thermosetting film is particularly suitable for a color filter coating agent having a liquid crystal alignment function in a liquid crystal display. [Prior Art] Generally, an optical device such as a liquid crystal display element, an organic EL (electroluminescent) element, or a solid-state imaging element is provided with a protective film in order to prevent the surface of the element from being exposed to a solvent or heat during the manufacturing step. This protective film not only needs to have high adhesion to the substrate to be protected, but also has high solvent resistance, and also requires properties such as transparency and heat resistance. When the protective film is used as a protective film for a color filter for a color liquid crystal display device or a solid-state imaging device, it is generally required to have a flattening effect of a color filter or a black matrix resin of the underlying substrate, that is, as a planarization. Membrane properties. In particular, when manufacturing a color liquid crystal display element of the STN type or the TFT type, it is necessary to make the bonding precision between the color filter substrate and the counter substrate very tight, and it is indispensable to make the cell gap between the substrates uniform. Further, in order to maintain the transmittance of light transmitted through the color filter, the planarizing film of the protective film must have high transparency. In addition, in recent years, due to the introduction of phase difference [ -5- 201107406 materials in the liquid crystal display to achieve low cost and light weight, such phase difference materials are generally coated with liquid crystal monomers, and after alignment, A material that hardens light. In order to align the phase difference material, it is necessary to have an alignment material after the underlayer film is rubbed. Therefore, a liquid crystal alignment layer film is formed on the coating layer of the color filter, and a phase difference material is formed (see Fig. 2(a)). When a film having a coating layer of the liquid crystal alignment layer and the color filter (see Fig. 2(b)) can be formed, such a material is strongly expected from the viewpoints of cost reduction and a large number of processes. Generally, the coating layer of the color filter is made of an acrylic resin having high transparency. As the acrylic resin, a glycol solvent such as propylene glycol monomethyl ether or propylene glycol monomethyl ether acetate or an ester solvent such as ethyl lactate or butyl lactate can be widely used from the viewpoint of safety and handling properties. This acrylic resin is thermally or photohardened to impart heat resistance or solvent resistance (Patent Documents 1, 2). However, the conventional thermosetting or photocurable acrylic resin exhibits moderate transparency or flatness, but even if the flat film is rubbed, it does not exhibit sufficient alignment. Further, as the liquid crystal alignment layer, a material composed of a solvent-soluble polyimine or poly-proline is generally used. These materials have been reported to have sufficient solvent resistance by rubbing imitation at the time of post-baking, and have been reported by rubbing treatment (Patent Document 3). However, when viewed as a planarizing film of a color filter, there are problems such as flatness and transparency being greatly lowered. Further, polyimine or polylysine is soluble in a solvent such as N-methyl-2-pyrrolidone or butyrolactone, but has low solubility in a glycol solvent or an ester solvent, and is difficult to apply to production. A production line for planarizing films. 201107406 [Summary of the Invention] [Problems to be Solved by the Invention] The present invention has been made in view of the above circumstances, and a problem to be solved is to provide a solvent-resistant film which exhibits high solvent resistance and liquid crystal. Ordination, heat resistance, high transparency, and high flatness, and a glycolic solvent or a lactic acid ester solvent which can be used in the production line of a flattening film which can be dissolved in a color filter when the cured film is formed. material. [Means for Solving the Problems] The inventors of the present invention have found the present invention in order to solve the above problems. In other words, the first aspect relates to a polyester composition for forming a thermosetting film, which comprises (A) component, (B) component, and (C) component, and (A) component: tetracarboxylic dianhydride and diol Polyester (B) obtained by reacting a compound: an epoxy compound having two or more epoxy groups, and (C) a component: an amine group obtained by reacting a diamine compound, a dicarboxylic anhydride, and a tetracarboxylic dianhydride Carboxylic acid compound. The second aspect is the polyester composition for forming a thermosetting film according to the second aspect, wherein the component (A) is a polyester containing a structural unit represented by the following formula (1).

L SJ -7- 201107406 【化1】 {HOOC、/COOH \ 。-Π*"〇-Β+ (” ° ° / (式中,A係表示於脂環式基或脂肪族基上有4個連結鍵 結合之4價有機基,B係表示於脂環式基或脂肪族基上有 2個連結鍵結合之2價有機基)。 第3觀點係有關第1或2觀點之熱硬化膜形成用聚酯 組成物,其中前述(A)成分係使以下述式(i)表示之四 羧酸二酐與以式(Π)表示之二醇化合物反應所得之聚酯 【化2】L SJ -7- 201107406 【化1】 {HOOC, /COOH \ . -Π*"〇-Β+ (" ° ° / (wherein, A is a tetravalent organic group having four linkages bonded to an alicyclic group or an aliphatic group, and B is represented by an alicyclic group. The present invention relates to a polyester composition for forming a thermosetting film according to the first or second aspect, wherein the component (A) is as follows a polyester obtained by reacting a tetracarboxylic dianhydride represented by the formula (i) with a diol compound represented by the formula (Π) [Chemical 2]

(式中’ A係表示於脂環式基或脂肪族基上有4個連結鍵 結合之4價有機基,B係表示於脂環式基或脂肪族基上有 2個連結鍵結合之2價有機基)^ 第4觀點係有關第2或3觀點之熱硬化膜形成用聚酯 組成物,其中前述式(1)中,A係表示由下述式(A-1) 〜式(A-8)表示之基選出之至少一種的基,b係表示由下 述式(B-1)〜式(B-5)表示之基選出之至少一種的基。 201107406 【化3】 (A-1) [A-2 cf3 (A.3) (A-4) X xn: (A-5) (A-6) (A-7) (A-8) 【化4】 λ B_1 (B-2) (B-3) B-4: (B-5) 第5觀點係有關第1〜4觀點中任一觀點之熱硬化膜形 成用聚酯組成物,其中(A)成分之聚酯的重量平均分子 量爲以聚苯乙烯換算爲1 000~30000。 第6觀點係有關第1 ~5觀點中任一觀點之熱硬化膜形 成用聚酯組成物,其中(C)成分爲相對於四羧酸二酐1 莫耳,使二胺化合物2莫耳與二羧酸酐2莫耳反應所得之 含胺基羧酸化合物。 第7觀點係有關第1〜5觀點中任一觀點之熱硬化膜形 成用聚酯組成物,其中(C)成分爲使下述式(iii)、( iv)及(v)表示之化合物反應所得之含胺基羧酸化合物 -9- 201107406 【化5】(In the formula, 'A is a tetravalent organic group having four bonding bonds bonded to an alicyclic group or an aliphatic group, and B is a combination of two bonding bonds on an alicyclic group or an aliphatic group. The valence organic group) is a polyester composition for forming a thermosetting film according to the second or third aspect, wherein in the above formula (1), the system A represents a formula (A-1) to (A) -8) a group of at least one selected from the group, and b is a group selected from at least one of the groups represented by the following formulas (B-1) to (B-5). 201107406 [A3] (A-1) [A-2 cf3 (A.3) (A-4) X xn: (A-5) (A-6) (A-7) (A-8) 4: λ B_1 (B-2) (B-3) B-4: (B-5) The fifth aspect is a polyester composition for forming a thermosetting film according to any one of the first to fourth aspects, wherein The weight average molecular weight of the polyester of the component A) is from 1,000 to 30,000 in terms of polystyrene. The sixth aspect is the polyester composition for forming a thermosetting film according to any one of the first to fifth aspects, wherein the component (C) is 1 mol with respect to the tetracarboxylic dianhydride, and the diamine compound 2 is a molar The amine-containing carboxylic acid compound obtained by the 2 molar reaction of the dicarboxylic anhydride. The polyester composition for forming a thermosetting film according to any one of the first to fifth aspects, wherein the component (C) is a compound represented by the following formulas (iii), (iv) and (v) The obtained amino group-containing carboxylic acid compound-9- 201107406 [Chemical 5]

h2n-p—νη2 ο (Ni) (上述式(iii )及(iv)中’ Ρ及Q係分別獨立表示2價 有機基,式(v)中,Z係表示4價有機基)。 第8觀點係有關第1 ~7觀點中任—觀點之熱硬化膜形 成用聚酯組成物,其中基於(A)成分之1〇〇質量份,含 有3〜50質量份之(B)成分、5〜80質量份之(c)成分。 第9觀點係有關第1〜8觀點中任一觀點之熱硬化膜形 成用聚酯組成物’其係進一步含有雙馬來醯亞胺化合物作 爲(D)成分。 第1 〇觀點係有關第9觀點之熱硬化膜形成用聚酯組 成物,其中基於(A)成分之100質量份,含有〇.5~50質 量份之(D )成分。 第11觀點係有關一種硬化膜,其特徵係使用第1〜10 觀點中任一觀點之熱硬化膜形成用聚酯組成物所得。 第12觀點係有關一種液晶配向層,其特徵係使用第 1〜1 〇觀點中任一觀點之熱硬化膜形成用聚酯組成物所得 [發明效果] 本發明之熱硬化膜形成用聚酯組成物可形成除了高平 -10- 201107406 坦化性、高透明性、高耐溶劑性、高耐熱性外,且具有液 晶配向能的硬化膜,故作爲液晶配向膜或平坦化膜之形成 材料使用。特別是可一次形成兼具以往獨立形成之液晶配 向膜與彩色濾光片之被覆層兩者特性之「液晶配向層」, 可實現製造步驟之簡略化及製程數降低所產生的低成本化 等。 此外,本發明之熱硬化膜形成用聚酯組成物可溶於甘 醇系溶劑及乳酸酯系溶劑,故可適合使用於主要使用此等 溶劑之平坦化膜的製作生產線。 [實施發明之形態] 如前述,以往所提案之丙烯酸樹脂系及聚醯亞胺系之 硬化膜中,無法充分滿足液晶配向膜或平坦化膜所要求之 平坦化性、透明性、配向性等全部的性能。 又’至目前爲止已提案使用聚酯作爲液晶顯示元件之 配向材料(參照日本特開平5-158055號公報、特開2002-22903 9號公報),但是此等均不具有熱硬化性,所形成 之膜的耐溶劑性差者。 本發明的特徵係在於使用熱硬化性之聚酯試圖提高前 述性能’換言之’本發明係含有(A )成分之聚酯、(B )成分之具有2個以上之環氧基之環氧化合物、(C)成 分之含胺基羧酸化合物的熱硬化膜形成用聚酯組成物。此 外’本發明係除了(A)成分、(B)成分及(C)成分外 ’也可含有雙馬來醯亞胺化合物作爲(D)成分的熱硬化 -11 - 201107406 膜形成用聚酯組成物。 以下,說明各成分之詳細內容。 [(A)成分] (A)成分之聚酯較佳爲含有以下述式(1)所示的 構造單元的聚酯,更佳爲以式(1)所示之構造單元所構 成的聚酯。 【化6】 / HOOC、/COOH \ 十-O-B-J- (1) \ ° ° / 上述式中,A係表示於脂環式基或脂肪族基上有4個 連結鍵結合之4價有機基,B係表示於脂環式基或脂肪族 基上有2個連結鍵結合之2價有機基。 上述A較佳爲以下述式(ιΑ1)、式(1A2)或式( 1 A3 )表示的基。 【化7】 X >1-R1-A1< (1A1> (1A2) (1A3) 式中之A1係表示環狀飽和烴基,較佳爲表示碳原子 數4〜8的環狀飽和烴基,更佳爲表示碳原子數4~6之環狀 飽和烴基。其中,A1基中所含有之任意的氫原子係分別 獨立可被脂肪族基取代,或彼等中,2個取代基可互相結 合形成4~6員環。 此處’該取代基之脂肪族基較佳爲碳原子數的脂 -12- 201107406 肪 族基 9 更佳爲碳原子數1〜3的脂 肪族基 〇 此等取代 基 結 合 形成 環 時,例如降冰片烯基或金 剛烷基 等 架橋環式 烴 基 一部 或 全部被氫化之縮合多環式 烴基。 上 述 式中,R1係表示單鍵、; 凝基、 醚 基、購酿 基 販 原子 數 1〜8的飽和烴基或被氟原 子取代 之 碳原子數 1〜8 的 飽和 烴 基。較佳爲單鍵、羰基、 醚基、 磺 酿基、碳 原 子 數 1 ~5 的 飽和烴基或被氟原子取代 之碳原 子 數1~5的 飽 和 烴 基。 R2 係表示碳原子數1〜8的飽 和烴基 > 較佳爲碳 原 子 數 1〜5 的 飽和烴基,更佳爲碳原子 數卜3 的 飽和烴基 〇 式 ( 1)中之4價有機基之A 之較佳 具 體例以下 述 式 ( A-1 : )卜 -式(A-8 )表示。下述式 (Α-1 ). ~ 式(A - 8 ) 所 示 之基 中 ,A較佳爲選自式(Α·1 ) 或(A -2 )的基。 【化8】H2n-p-νη2 ο (Ni) (In the above formulas (iii) and (iv), the Ρ and Q systems each independently represent a divalent organic group, and in the formula (v), the Z system represents a tetravalent organic group). The eighth aspect is a polyester composition for forming a thermosetting film according to any one of the first to seventh aspects, wherein the component (B) is contained in an amount of from 3 to 50 parts by mass based on 1 part by mass of the component (A). 5 to 80 parts by mass of the component (c). The ninth aspect is the polyester composition for forming a thermosetting film according to any one of the first to eighth aspects, which further comprises a bismaleimide compound as the component (D). The first aspect is the polyester composition for forming a thermosetting film according to the ninth aspect, wherein the component (D) is contained in an amount of from 5 to 50 parts by mass based on 100 parts by mass of the component (A). The eleventh aspect relates to a cured film obtained by using the polyester composition for forming a thermosetting film according to any one of the first to tenth aspects. The present invention relates to a liquid crystal alignment layer which is obtained by using the polyester composition for forming a thermosetting film according to any one of the first to the first aspects of the invention. [Effect of the invention] The polyester for forming a thermosetting film of the present invention The material can be formed into a material for forming a liquid crystal alignment film or a planarizing film, in addition to a cured film having high crystallinity, high transparency, high solvent resistance, and high heat resistance, and having liquid crystal alignment energy. In particular, the "liquid crystal alignment layer" having the characteristics of both the liquid crystal alignment film and the color filter layer which are formed independently in the past can be formed at one time, and the manufacturing process can be simplified and the number of processes can be reduced. . Further, since the polyester composition for forming a thermosetting film of the present invention is soluble in a glycol solvent and a lactic acid ester solvent, it can be suitably used in a production line for a planarizing film mainly using such a solvent. [Embodiment of the Invention] As described above, the acrylic resin and the polyimide film of the conventionally proposed cured film cannot sufficiently satisfy the flatness, transparency, alignment, and the like required for the liquid crystal alignment film or the planarizing film. All performance. In addition, it has been proposed to use polyester as an alignment material for a liquid crystal display element (see Japanese Patent Laid-Open No. Hei 5-158055, JP-A-2002-22903-9), but none of them have thermosetting properties. The film has poor solvent resistance. The present invention is characterized in that the use of a thermosetting polyester is attempted to improve the above-described performance. In other words, the present invention relates to a polyester containing (A) component, an epoxy compound having two or more epoxy groups of (B) component, A polyester composition for forming a thermosetting film of an amino group-containing carboxylic acid compound of the component (C). Further, 'the present invention is a thermosetting hardened -11 - 201107406 film forming polyester which may contain a bismaleimide compound as the component (D) in addition to the component (A), the component (B) and the component (C). Things. Hereinafter, the details of each component will be described. [Component (A)] The polyester of the component (A) is preferably a polyester containing a structural unit represented by the following formula (1), more preferably a polyester composed of a structural unit represented by the formula (1). . [6] / HOOC, /COOH \ 十-OBJ- (1) \ ° ° In the above formula, A represents a tetravalent organic group having four bonding bonds bonded to an alicyclic group or an aliphatic group. B is a divalent organic group having two bonding bonds bonded to an alicyclic group or an aliphatic group. The above A is preferably a group represented by the following formula (ιΑ1), formula (1A2) or formula (1A3). (1) A1 represents a cyclic saturated hydrocarbon group, preferably a cyclic saturated hydrocarbon group having 4 to 8 carbon atoms, and more preferably Preferably, it is a cyclic saturated hydrocarbon group having 4 to 6 carbon atoms, wherein any hydrogen atom contained in the A1 group may be independently substituted with an aliphatic group, or two of them may be bonded to each other to form a hydrogen atom. 4~6 member ring. Here, the aliphatic group of the substituent is preferably a carbon number of aliphatic-12-201107406. A fatty group 9 is more preferably an aliphatic group having 1 to 3 carbon atoms. When a ring is formed, a condensed polycyclic hydrocarbon group in which one or all of the bridged cyclic hydrocarbon groups such as a norbornene group or an adamantyl group are hydrogenated. In the above formula, R1 represents a single bond, a condensed group, an ether group, and a commercially available a saturated hydrocarbon group having 1 to 8 atomic number or a saturated hydrocarbon group having 1 to 8 carbon atoms substituted by a fluorine atom, preferably a single bond, a carbonyl group, an ether group, a sulfonyl alcohol group, and a saturated carbon number of 1 to 5. A hydrocarbon group or a saturated hydrocarbon group having 1 to 5 carbon atoms which is substituted by a fluorine atom. R2 represents a saturated hydrocarbon group having 1 to 8 carbon atoms. Preferably, it is a saturated hydrocarbon group having 1 to 5 carbon atoms, more preferably a saturated hydrocarbon group having 3 carbon atoms, and a tetravalent organic group in the formula (1). A preferred specific example of A is represented by the following formula (A-1: ) - formula (A-8). Among the groups represented by the following formula (Α-1). ~ formula (A-8), A is preferably It is a group selected from the formula (Α·1 ) or (A -2 ).

XX (A*1 ) (A-2) (A-3) (A-4)XX (A*1 ) (A-2) (A-3) (A-4)

(A-7) (A-8) (A-5) (A-6) 上述式(1)中,B係表示於脂環式基或脂肪族基上 有2個連結鍵結合之2價有機基,較佳爲以下述式(1B1 )或式(1B2)所示之基。 201107406 【化9】 —r4-b1{r3-b1)^r5— —R6-B2-R7- (1B1> (1B2) 式中之B1係表示環狀飽和烴基,較佳爲表示碳原子 數4〜8的環狀飽和烴基,更佳爲表示碳原子數爲4〜6之環 狀飽和烴基。此處,B1基中所含有之任意的氫原子係分 別獨立可被脂肪族基取代。 其中,該取代基之脂肪族基較佳爲碳原子數1〜5的脂 肪族基,更佳爲碳原子數1〜3的脂肪族基。此等取代基結 合形成環時,例如成爲降冰片烯基或金剛烷基等的交聯環 式烴基、一部或全部被氫化之縮合多環式烴基》 B2表示伸苯基β 式中,R3係表示單鍵 '羰基、醚基、磺醯基、碳原 子數1〜8的飽和烴基或被氟原子取代之碳原子數的飽 和烴基’較佳爲單鍵、羰基、醚基、磺醯基、碳原子數 1〜5的飽和烴基或被氟原子取代之碳原子數卜5的飽和烴 基。 r4、R5係分別獨立表示單鍵或碳原子數1〜5之伸烷 基’較佳爲表示單鍵、碳原子數1〜3之伸烷基。 r6、R7分別獨立表示碳原子數1~5之伸烷基,較佳 爲表示碳原子數1〜3之伸烷基。 又k表示〇或^ 式(1)中之2價有機基之B之較佳的具體例以下述 式(B-1)〜式(B-5)表示。以下述式(B-1)〜式(B-5) -14- 201107406 所示之基中,B較佳爲選自式(Β-l)〜(B-4)的基。 【化1 0】(A-7) (A-8) (A-5) (A-6) In the above formula (1), B represents a divalent organic compound having two linked bonds bonded to an alicyclic group or an aliphatic group. The group is preferably a group represented by the following formula (1B1) or formula (1B2). 201107406 - r4-b1{r3-b1)^r5 - R6-B2-R7- (1B1) (1B2) wherein B1 represents a cyclic saturated hydrocarbon group, preferably represents a carbon number of 4~ The cyclic saturated hydrocarbon group of 8 is more preferably a cyclic saturated hydrocarbon group having 4 to 6 carbon atoms. Here, any hydrogen atom contained in the B1 group may be independently substituted with an aliphatic group. The aliphatic group of the substituent is preferably an aliphatic group having 1 to 5 carbon atoms, more preferably an aliphatic group having 1 to 3 carbon atoms. When these substituents are combined to form a ring, for example, it is a norbornene group or A crosslinked cyclic hydrocarbon group such as an adamantyl group, or a partially or wholly hydrogenated condensed polycyclic hydrocarbon group, wherein B2 represents a phenylene group, and R3 represents a single bond 'carbonyl group, an ether group, a sulfonyl group, a carbon atom. The saturated hydrocarbon group of 1 to 8 or the saturated hydrocarbon group having a carbon number substituted by a fluorine atom is preferably a single bond, a carbonyl group, an ether group, a sulfonyl group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a fluorine atom. a saturated hydrocarbon group having a carbon number of 5, and r4 and R5 each independently represent a single bond or an alkylene group having 1 to 5 carbon atoms. And an alkyl group having 1 to 3 carbon atoms. r6 and R7 each independently represent an alkylene group having 1 to 5 carbon atoms, preferably an alkylene group having 1 to 3 carbon atoms. Further k represents 〇 or ^. A preferred specific example of B of the divalent organic group in the formula (1) is represented by the following formula (B-1) to formula (B-5). The following formula (B-1) to formula (B-5) are given. In the group shown by -14- 201107406, B is preferably a group selected from the group consisting of the formula (Β-1) to (B-4).

(B-1 ) (B-2) (B-3) (B-4) (B-5) (A)成分之聚酯較佳爲以式(Π所示之構造單元 中,A較佳爲含有選自由式(1A1)〜式(1A3)所示之基 所成群之至少一種構造,但也可含有以式(1A1 ) ~式( 1A3)所示之基以外的構造。其時,只要是形成聚酯之構 造時,其構造無特別限定,但較佳爲選自由以下述式( 1 A4 )〜式(1A5 )所示之基所成群之至少一種的構造。 【化1 1】 (1A4) (1A5) 上述式中,R8、R9、R1()係分別獨立表示單鍵、羰基 、醚基、磺醯基、碳原子數1~8的飽和烴基或被氟原子取 代之碳原子數的飽和烴基,較佳爲表示單鍵、羰基、 醚基、磺醯基、碳原子數1~5的飽和烴基或被氟原子取代 之碳原子數1〜5的飽和烴基。 特別是R8較佳爲表示單鍵、羰基、醚基、磺醢基、 碳原子數1~5的飽和烴基或被氟原子取代之碳原子數1〜5 的飽和烴基,R9較佳爲表示醚基、碳原子數1~5的飽和 烴基或被氟原子取代之碳原子數1〜5的飽和烴基,R1Q較 佳爲表示羰基、醚基、磺醯基 '碳原子數1〜5的飽和烴基 -15- 201107406 或被氟原子取代之碳原子數1〜5的飽和烴基。 又h表示0或1。 前述式(1A4)〜式(1A5)之較佳具體例如下述式( al )〜式(a7 )表示。 【化1 2】(B-1) (B-2) (B-3) (B-4) (B-5) The polyester of the component (A) is preferably a formula (in the structural unit shown by Π, A is preferably It has at least one structure selected from the group consisting of the groups represented by the formula (1A1) to the formula (1A3), but may have a structure other than the group represented by the formula (1A1) to the formula (1A3). In the structure in which the polyester is formed, the structure is not particularly limited, but is preferably a structure selected from at least one of the groups represented by the following formulas (1A4) to (1A5). (1A4) (1A5) In the above formula, R8, R9 and R1() each independently represent a single bond, a carbonyl group, an ether group, a sulfonyl group, a saturated hydrocarbon group having 1 to 8 carbon atoms or a carbon atom substituted by a fluorine atom. The number of saturated hydrocarbon groups preferably represents a single bond, a carbonyl group, an ether group, a sulfonyl group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms substituted by a fluorine atom. Preferably, it represents a single bond, a carbonyl group, an ether group, a sulfonyl group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms substituted by a fluorine atom, and R9 preferably represents an ether group or a carbon atom. Number of 1 to 5 saturated hydrocarbons Or a saturated hydrocarbon group having 1 to 5 carbon atoms which is substituted by a fluorine atom, and R1Q is preferably a saturated hydrocarbon group having a carbon number of 1 to 5, which is a carbonyl group, an ether group or a sulfonyl group, and a carbon atom substituted by a fluorine atom. A saturated hydrocarbon group having an atomic number of 1 to 5. Further, h represents 0 or 1. Preferred examples of the above formula (1A4) to formula (1A5) are represented by the following formula (al) to formula (a7).

XX (»1) (a2) (a3) (a4) (a6) (aS) (a7) 本發明所使用之(A)成分的聚酯中,在以上述式( 1)所示之構造單元中,A較佳爲含有至少60莫耳%以上 之選自由式(1A1)〜式(1A3)所示之基所成群之至少— 種的構造單元》 (A)成分之聚酯的重量平均分子量較佳爲 1 000〜3 0000,更佳爲ι,5〇〇〜1〇,〇〇〇。(A)成分之聚酯的 重量平均分子量小於前述範圍時,配向性及耐溶劑性有降 低的傾向,若超過前述範圍,有時平坦化性會降低。 <(A)成分之製造方法> 本發明中’ (A)成分之聚酯例如可使四羧酸二酐與 一醇化合物聚合而得到。更佳爲使含有以下述式(i)所 示之四羧酸二酐的四羧酸二酐(以下稱爲酸成分)與含有 以下述式(11)所示之二醇化合物的二醇化合物(以下也 稱爲二醇成分)反應而得到。 -16- 201107406 【化1 3】XX (»1) (a2) (a3) (a4) (a6) (aS) (a7) In the polyester of the component (A) used in the present invention, in the structural unit represented by the above formula (1) And A is preferably a weight average molecular weight of a polyester containing at least 60 mol% or more of a structural unit selected from the group consisting of the groups represented by the formula (1A1) to the formula (1A3) (A). It is preferably 1 000 to 3 0000, more preferably ι, 5 〇〇 1 〇, 〇〇〇. When the weight average molecular weight of the polyester of the component (A) is less than the above range, the alignment property and the solvent resistance tend to be lowered, and if it exceeds the above range, the planarization property may be lowered. <Production Method of Component (A)> In the present invention, the polyester of the component (A) can be obtained, for example, by polymerizing a tetracarboxylic dianhydride and a monool compound. More preferably, a tetracarboxylic dianhydride (hereinafter referred to as an acid component) containing a tetracarboxylic dianhydride represented by the following formula (i) and a diol compound containing a diol compound represented by the following formula (11) (hereinafter also referred to as a diol component) is obtained by a reaction. -16- 201107406 【化1 3】

上述式中’A及B係與上述式(1)的定義相同,較 佳之形態也與上述者相同。 本發明中,以式(i )所示之四羧酸二酐、以式(ii ) 所示之二醇化合物係分別獨立可1種單獨使用亦或使用2 種以上。 上述(A)成分之聚酯不僅只有作爲酸成分之以上述 式(i)所示之四羧酸二酐,且可倂用其以外之四羧酸二 酐(以下也稱爲其他的酸二酐)。其時,其他之酸二酐只 要在不影響本發明的效果時,並無特別限定。較佳爲以下 述式(i2)所示之四羧酸二酐。 【化1 4】 Ο 〇In the above formula, 'A and B are the same as defined in the above formula (1), and the preferred form is the same as the above. In the present invention, the tetracarboxylic dianhydride represented by the formula (i) and the diol compound represented by the formula (ii) may be used alone or in combination of two or more. The polyester of the above (A) component is not limited to the tetracarboxylic dianhydride represented by the above formula (i) as an acid component, and may be used in addition to the tetracarboxylic dianhydride (hereinafter also referred to as other acid II). anhydride). In this case, the other acid dianhydride is not particularly limited as long as it does not affect the effects of the present invention. The tetracarboxylic dianhydride represented by the following formula (i2) is preferred. 【化1 4】 Ο 〇

U X °OwO° {i2) τ τ ο ο 此處,上述式(i2)之W係在上述式(1)中所定義 之式(1A4)及式(1A5)所示之基所成群中選出之至一 種的構造,R8、R9、R1G、h亦如上述定義。 尙且,式(1A4 )及式(i A5 )之較佳的具體例亦如 以上述之式(al) ~式(a7)所示。 本發明中,以式(i)所示之四羧酸二酐較佳爲含有 酸成分中之至少60莫耳%以上。 -17- 201107406 前述(A)成分之聚酯中,四羧酸二酐之合計量(酸 成分之合計量)與二醇化合物之合計量(二醇化合物之合 計量)的調配比’亦即(二醇化合物之合計莫耳數)/ ( 四羧酸二酐化合物之合計莫耳數)較佳爲0.5〜1.5。與一 般之聚縮合反應同樣,此莫耳比愈接近1,生成之聚酯的 聚合度愈大,分子量愈會增加》 (A)成分之聚酯爲了避免保存安定性之降低,因此 其末端爲酸酐末端較佳。 上述聚酯之末端係依存於酸成分與二醇成分之調配比 而變化。例如,使酸成分過剩地反應時,末端易成爲酸酐 〇 又,過剩地使用二醇成分進行聚合時,末端易成爲羥 基。此時,使該末端羥基與羧酸酐反應,可以酸酐封閉末 端羥基。此種羧酸酐例如有酞酸酐、偏苯三甲酸酐、馬來 酸酐、萘酸酐、氫化酞酸酐、衣康酸酐、四氫酞酸酐、 1,2-環己烷二羧酸酐、4-甲基-1,2-環己烷二羧酸酐、4-苯 基-1,2-環己烷二羧酸酐、甲基-5-降冰片烯-2,3-二羧酸酐 、四氫酞酸酐、甲基四氫酞酸酐、雙環[2.2.2]辛烯-2,3-二 羧酸酐等。 在上述(A)成分之聚酯製造時,酸成分與二醇成分 之反應溫度可選擇50〜200°C、較佳爲80~170°C之任意的 溫度。例如,反應溫度爲100〜140°C、反應時間2~48小 時可得到聚酯。 又,以酸酐保護末端羥基時之反應溫度可選擇 -18- 201107406 50〜200°C,較佳爲80~l7〇°C之任意的溫度。 上述酸成分與二醇成分之反應一般在溶劑中進行。此; 時可使用之溶劑只要不含有羥基或胺基等、與酸酐反應之 官能基者即可,並無特別限定。例如有N,N -二甲基甲醯 胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯烷酮' N_乙烯基 吡咯烷嗣、N -甲基己內醯胺、二甲基亞颯 '四甲基尿素、 二甲基颯、六甲基亞颯、間甲酚、r-丁內酯、環己酮、 環戊酮、甲乙酮、甲基異丁基酮' 2-庚酮、丙二醇單甲基 醚乙酸酯、丙二醇丙醚乙酸酯' 3-甲氧基丙酸甲酯、2-甲 氧基丙酸甲酯、3-甲氧基丙酸乙酯' 2-甲氧基丙酸乙酯、 3-乙氧基丙酸乙酯、2-乙氧基丙酸乙酯等。 此等溶劑可單獨使用或混合使用,但從安全性、彩色 濾光片之被覆劑的生產線之適用性的觀點,更佳爲丙二醇 單甲醚乙酸酯。 進一步,即使不溶解聚酯之溶劑,在聚合反應所生成 之聚酯不會析出的範圍內,亦可與上述溶劑混合使用。 又,上述酸成分(式(i)及式(i2))與二醇成分 (式(Π))之反應時亦可使用觸媒。UX °OwO° {i2) τ τ ο ο Here, the W of the above formula (i2) is selected from the group represented by the formula (1A4) and the formula (1A5) defined in the above formula (1). As for one configuration, R8, R9, R1G, h are also as defined above. Further, preferred specific examples of the formula (1A4) and the formula (i A5) are as shown in the above formula (al) - formula (a7). In the present invention, the tetracarboxylic dianhydride represented by the formula (i) preferably contains at least 60 mol% or more of the acid component. -17- 201107406 In the polyester of the above component (A), the total ratio of the tetracarboxylic dianhydride (the total amount of the acid components) to the total amount of the diol compound (the total amount of the diol compound) is (The total number of moles of the diol compound) / (the total number of moles of the tetracarboxylic dianhydride compound) is preferably from 0.5 to 1.5. As with the general polycondensation reaction, the closer the molar ratio is to 1, the greater the degree of polymerization of the resulting polyester, and the higher the molecular weight. The polyester of the component (A) is designed to avoid a decrease in the stability of storage. The anhydride end is preferred. The end of the polyester varies depending on the blending ratio of the acid component to the diol component. For example, when the acid component is excessively reacted, the terminal tends to be an acid anhydride. When the diol component is excessively polymerized, the terminal tends to be a hydroxyl group. At this time, the terminal hydroxyl group is reacted with a carboxylic acid anhydride, and the terminal hydroxyl group can be blocked with an acid anhydride. Such carboxylic anhydrides are, for example, phthalic anhydride, trimellitic anhydride, maleic anhydride, naphthalic anhydride, hydrogenated phthalic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, 1,2-cyclohexanedicarboxylic anhydride, 4-methyl- 1,2-cyclohexanedicarboxylic anhydride, 4-phenyl-1,2-cyclohexanedicarboxylic anhydride, methyl-5-norbornene-2,3-dicarboxylic anhydride, tetrahydrophthalic anhydride, A Tetrahydrophthalic anhydride, bicyclo[2.2.2]octene-2,3-dicarboxylic anhydride, and the like. In the production of the polyester of the component (A), the reaction temperature of the acid component and the diol component may be any temperature of 50 to 200 ° C, preferably 80 to 170 ° C. For example, a polyester can be obtained at a reaction temperature of 100 to 140 ° C and a reaction time of 2 to 48 hours. Further, the reaction temperature at which the terminal hydroxyl group is protected by an acid anhydride may be selected from the range of -18 to 201107406 50 to 200 ° C, preferably 80 to 17 ° C. The reaction of the above acid component with the diol component is generally carried out in a solvent. In this case, the solvent which can be used is not particularly limited as long as it does not contain a functional group which reacts with an acid anhydride such as a hydroxyl group or an amine group. For example, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone 'N-vinylpyrrolidinium, N-methylcaprolactam, Dimethyl sulfonium 'tetramethyl urea, dimethyl hydrazine, hexamethyl hydrazine, m-cresol, r-butyrolactone, cyclohexanone, cyclopentanone, methyl ethyl ketone, methyl isobutyl ketone ' 2 -heptanone, propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate 'methyl 3-methoxypropionate, methyl 2-methoxypropionate, ethyl 3-methoxypropionate' Ethyl 2-methoxypropionate, ethyl 3-ethoxypropionate, ethyl 2-ethoxypropionate, and the like. These solvents may be used singly or in combination, but are more preferably propylene glycol monomethyl ether acetate from the viewpoint of safety and suitability of a coating line of a color filter. Further, even if the solvent of the polyester is not dissolved, it may be used in combination with the above solvent within a range in which the polyester formed by the polymerization reaction does not precipitate. Further, a catalyst may be used in the reaction of the above acid component (formula (i) and formula (i2)) with a diol component (formula).

聚酯聚合時所使用之觸媒的具體例有氯化苯甲基三甲 基銨、溴化苯甲基三甲基銨、氯化苯甲基三乙基銨、溴化 苯甲基三乙基銨、氯化苯甲基三丙基銨、溴化苯甲基三丙 基銨、氯化四甲基銨、溴化四乙基銨、氯化四丙基銨、溴 化四丙基銨等之四級銨鹽、氯化四苯基鱗、溴化四苯基錢 、氯化苯甲基三苯基鱗、溴化苯甲基三苯基辚、氯化乙基[SI -19- 201107406 三苯基鳞、溴化乙基三苯基銹等之4級鱗鹽。 含有上述得之(A)成分之聚酯的溶液可直 調製熱硬化膜形成用聚酯組成物。又,使所得之 、甲醇、乙醇、二乙基醚、己烷等之弱溶劑中沈 回收後,也可使用。 < (B)成分> 本發明之(B)成分之具有2個以上之環氧基 化合物,例如有三(2,3-環氧基丙基)三聚異氰 1,4-丁二醇二縮水甘油醚、1,2-環氧基-4-(環氧基 環己烷、甘油三縮水甘油醚、二乙二醇二縮水甘 2,6-二縮水甘油基苯基縮水甘油醚、1,1,3-三[對-氧基丙氧基)苯基]丙烷、I,2-環己烷二羧酸二縮外 、4,4’-亞甲基雙(Ν,Ν-二縮水甘油基苯胺)、3,4 環己基甲基·3,4-環氧基環己烷羧酸酯、三羥甲基乙 水甘油醚及雙酚-Α-二縮水甘油醚及季戊四醇聚縮 醚等。 又,從容易取得的觀點,也可使用市售品的化 以下舉其具體例(商品名),但不限定於此等: 、YH4 3 4L (東都化成(股)製)等之具有胺基的 月旨;Epolead GT-401、Epolead GT-403、Epolead 、Epolead GT-302、Celoxide 2 0 2 1、Celoxide Daicel化學工業(股)製)等之具有環己烯氧化物 環氧樹脂;Epikote 1001 ' Epikote 1002、Epikote 使用於 酯於水 單離、 ;的環氧 酸酯、 ;乙基) 油醚、 (2,3-環 :甘油酯 -環氧基 ,烷三縮 水甘油 ,合物。 YH-434 環氧樹 GT-301 3000 ( 丨構造之 1 003、 -20- 201107406Specific examples of the catalyst used in the polymerization of the polyester include benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltriethylammonium chloride, and benzyltrimethyl bromide. Ammonium, benzyltripropylammonium chloride, benzyltripropylammonium bromide, tetramethylammonium chloride, tetraethylammonium bromide, tetrapropylammonium chloride, tetrapropylammonium bromide Quaternary ammonium salt, tetraphenyl chlorinated chloride, tetraphenyl bromide, benzyltriphenyl chlorinated chloride, benzyltriphenylphosphonium bromide, ethyl chloride [SI -19- 201107406 Grade 4 scale salts such as triphenyl scale and ethyl bromide bromine. The solution containing the polyester of the component (A) obtained above can directly prepare a polyester composition for forming a thermosetting film. Further, it can be used after it has been recovered by sinking a weak solvent such as methanol, ethanol, diethyl ether or hexane. <Component (B)> The component (B) of the present invention has two or more epoxy compounds, for example, tris(2,3-epoxypropyl)trimeric isocyanide 1,4-butanediol Diglycidyl ether, 1,2-epoxy-4-(epoxycyclohexane, glycerol triglycidyl ether, diethylene glycol diglycidyl 2,6-diglycidylphenyl glycidyl ether, 1,1,3-tris[p-oxypropoxy)phenyl]propane, 1,2-cyclohexanedicarboxylic acid, di-, 4,4'-methylenebis(Ν,Ν-二Glycidyl aniline, 3,4 cyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, trimethylol glycol glyceryl ether and bisphenol-indole-diglycidyl ether and pentaerythritol condensation Ether, etc. In addition, from the viewpoint of the availability of the commercially available product, the specific example (product name) may be used, but it is not limited thereto: YH4 3 4L (manufactured by Tohto Kasei Co., Ltd.) has an amine group. Equivalent epoxy resin; Epolead GT-401, Epolead GT-403, Epolead, Epolead GT-302, Celoxide 2 0 2 1 , Celoxide Daicel Chemical Industry Co., Ltd., etc.; epoxy resin with cyclohexene oxide; Epikote 1001 ' Epikote 1002, Epikote for esters in water, epoxidized esters; ethyl ether ethers, (2,3-ring: glyceride-epoxy, alkane triglycidyl, YH -434 Epoxy Tree GT-301 3000 (丨1, 003, -20- 201107406

Epikote 1004 、 Epikote 1007 、 Epikote 1009 、 Epikote 1010、Epikote 828 (以上,油化 Shell Epoxy (股)(現 在Japan Epoxy Re sin (股)製))等之雙酣A型環氧樹 脂;Epikote 807 (油化 Shell Epoxy (股)(現在 Japan Epoxy Resin (股)製))等之雙酚 F型環氧樹脂; Epikote 152' Epikote 154(以上,油化 Shell Epoxy (股 )(現在 Japan Epoxy Resin (股)製))、EPPN 201、 EPPN 202 (以上,日本化藥(股)製)等之酚醛清漆型 環氧樹脂;EOCN-102、EOCN-103S、EOCN-104S、EOCN-1 020、EOCN-1 025、EOCN- 1 027 (以上,曰本化藥(股) 製)'Epikote 180S75(油化 Shell Epoxy (股)(現在 Japan Epoxy Resin (股)製))等之甲酣酣酸清漆型環氧 樹月旨;Denacol EX-252 ( Nagase Chemtex (股)製)、 CY175、CY177、CY179、Araldite CY-182 ' Araldite CY-192、Araldite CY-184 (以上,CIBA-GEIGY A.G 製)、 Epiclon 200、Epiclon 400 (以上,大日本油墨化學工業 (股)(現在 DIC (股))製)'Epikote 871 'Epikote 872 (以上,油化 Shell Epoxy (股)(現在 Japan Epoxy Resin (股)製))、ED - 5 66 1、ED - 5 66 2 (以上,Epikote 1004, Epikote 1007, Epikote 1009, Epikote 1010, Epikote 828 (above, oiled Shell Epoxy (now Japan Epoxy Re sin)), etc. Epikote 807 (oil) Shell Epoxy (now Japan Epoxy Resin Co., Ltd.) and other bisphenol F-type epoxy resin; Epikote 152' Epikote 154 (above, oiled Shell Epoxy (shares) (now Japan Epoxy Resin (shares) No.), EPPN 201, EPPN 202 (above, manufactured by Nippon Chemical Co., Ltd.), etc.; EOCN-102, EOCN-103S, EOCN-104S, EOCN-1 020, EOCN-1 025 , EOCN- 1 027 (above, 曰本化药(股))'Epikote 180S75 (oiled Shell Epoxy (now Japan Epoxy Resin)), etc. Deancol EX-252 (made by Nagase Chemtex), CY175, CY177, CY179, Araldite CY-182 'Araldite CY-192, Araldite CY-184 (above, CIBA-GEIGY AG), Epiclon 200, Epiclon 400 (above, Dainippon Ink Chemical Industry (shares) (now DIC (shares) ) Ltd.) 'Epikote 871' Epikote 872 (above, Yuka Shell Epoxy (shares) (now Japan Epoxy Resin (shares), Ltd.)), ED - 5 66 1, ED - 5 66 2 (or more,

Cel an ese Coating (股)製)等之脂環式環氧樹脂; Denacol EX-611、Denacol EX-612、Denacol EX-614、 Denacol EX-622、Denacol EX-411、Denacol EX-512、 Denacol EX-522、Denacol EX-421、Denacol EX-313、 Denacol EX-314、Denacol EX-321 ( Nagase Chemtex (股$ -21 - 201107406 )製)等之脂肪族聚縮水甘油基醚等。 又’具有至少2個環氧基之化合物可使用具有環氧基 之聚合物。此種聚合物只要爲具有環氧基者即可使用,無 特別限制。 上述具有環氧基之聚合物例如可藉由使用具有環氧基 之加成聚合性單體之加成聚合來製造。例如聚縮水甘油基 丙烯酸酯、縮水甘油基甲基丙烯酸酯與乙基甲基丙烯酸酯 之共聚物、縮水甘油基甲基丙烯酸酯與苯乙烯與2-羥基 乙基甲基丙烯酸酯之共聚物等之加成聚合聚合物、或環氧 基酚醛清漆等之縮聚合聚合物。 或上述具有環氧基之聚合物可藉由具有羥基之高分子 化合物與表氯醇、縮水甘油基甲苯磺酸酯等之具有環氧基 的化合物之反應來製造。 此種聚合物的重量平均分子量爲例如300-200,000。 具有2個以上之此等環氧基之環氧化合物可單獨或組 合2種以上使用。 本發明之熱硬化膜形成用聚酯組成物中之(B)成分 之具有2個以上之環氧基之環氧化合物的含量係依據(A )成分之聚酯1〇〇質量份,較佳爲3〜50質量份,更佳爲 5~40質量份,特佳爲10~30質量份。此比率太小時,從 熱硬化膜形成用聚酯組成物所得之硬化膜的耐溶劑性或耐 熱性會降低,另外,過大時,有時耐溶劑性降低,或保存 安定性降低。 -22- 201107406 < (c )成分> (C)成分係使二胺化合物、二羧酸酐、四羧酸二酐 反應所得之含胺基羧酸化合物。詳細內容係相對於四羧酸 二酐1莫耳’使二胺化合物2莫耳與二羧酸酐2莫耳反應 所得之含胺基羧酸化合物。 上述二胺化合物、二羧酸酐、四羧酸二酐例如有下述 式(iii) ~(v)所示之化合物。 【化1 5】Epoxy epoxy resin such as Cel an es Coating; Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-411, Denacol EX-512, Denacol EX -522, an aliphatic polyglycidyl ether such as Denacol EX-421, Denacol EX-313, Denacol EX-314, Denacol EX-321 (manufactured by Nagase Chemtex (stock: -21-07406)). Further, a compound having at least two epoxy groups may use a polymer having an epoxy group. Such a polymer can be used as long as it has an epoxy group, and is not particularly limited. The above epoxy group-containing polymer can be produced, for example, by addition polymerization using an addition polymerizable monomer having an epoxy group. For example, polyglycidyl acrylate, copolymer of glycidyl methacrylate and ethyl methacrylate, glycidyl methacrylate and copolymer of styrene and 2-hydroxyethyl methacrylate, etc. A polycondensation polymer such as an addition polymerization polymer or an epoxy novolac. Or the above epoxy group-containing polymer can be produced by a reaction of a polymer compound having a hydroxyl group with a compound having an epoxy group such as epichlorohydrin or glycidyl tosylate. The weight average molecular weight of such a polymer is, for example, 300 to 200,000. The epoxy compound having two or more of these epoxy groups may be used singly or in combination of two or more. The content of the epoxy compound having two or more epoxy groups in the component (B) in the polyester composition for forming a thermosetting film of the present invention is preferably 1 part by mass based on the polyester of the component (A). It is 3 to 50 parts by mass, more preferably 5 to 40 parts by mass, and particularly preferably 10 to 30 parts by mass. When the ratio is too small, the solvent resistance or heat resistance of the cured film obtained from the polyester composition for forming a thermosetting film is lowered, and when it is too large, the solvent resistance may be lowered or the storage stability may be lowered. -22-201107406 <(c) component> The component (C) is an amino group-containing carboxylic acid compound obtained by reacting a diamine compound, a dicarboxylic acid anhydride, or a tetracarboxylic dianhydride. The details are the amino group-containing carboxylic acid compound obtained by reacting the diamine compound 2 mole with the dicarboxylic anhydride 2 mol with respect to the tetracarboxylic dianhydride 1 mol. The diamine compound, the dicarboxylic anhydride, and the tetracarboxylic dianhydride are, for example, compounds represented by the following formulas (iii) to (v). [化1 5]

h2n-p-nh2 0 (iii) 上述式(iii )及式(iv )中,P及Q係分別獨立表示 2價有機基,式(v)中,Z係表示4價有機基。 因此,使上述式(iii )表示之二胺化合物、式(iv ) 表示之二羧酸酐及式(v)表示之四羧酸二酐反應可得到 下述式(2)表示之化合物。 【化1 6】 Ο HOOC、人H2n-p-nh2 0 (iii) In the above formulas (iii) and (iv), the P and Q systems each independently represent a divalent organic group, and in the formula (v), the Z system represents a tetravalent organic group. Therefore, the diamine compound represented by the above formula (iii), the dicarboxylic anhydride represented by the formula (iv) and the tetracarboxylic dianhydride represented by the formula (v) can be reacted to obtain a compound represented by the following formula (2). 【化1 6】 Ο HOOC, person

N _ Η Η / \ Η HOOC COOH Ο (2)N _ Η Η / \ Η HOOC COOH Ο (2)

P、人〆COOH N H 在式(2)中,P、Q、Z係與上述式(iii)、式(iv) 、式(v )之定義相同。 本發明中,二胺化合物、二羧酸酐、四羧酸二酐可分 別僅使用一種類,亦可使用複數種。因此,本發明之(C[S] -23- 201107406 )成分之含胺基羧酸化合物係不僅可只使用一種以式(2 )所示的化合物,亦可使用複數種。 前述P及Q中,較佳爲分別獨立具有環構造之2價 有機基。此處,環構造例如有苯環、脂環、縮合多環式烴 〇 式(iii)中’ P所具有之環構造較佳爲苯環、碳原子 數4~8之脂環、碳原子數7〜16之縮合多環式烴。 因此,具有如此環構造的二胺化合物的具體例有以下 者:對苯二胺、間苯二胺、2,4-二胺基甲苯、2,5-二胺基 甲苯、2,6 -二胺基甲苯、2,4 -二甲基-1,3 -二胺基苯、2,5-二甲基-1,4 -二胺基苯、2,3,5,6 -四甲基-1,4 -二胺基苯、 2.4- 二胺基酚、2,5-二胺基酚、4,6-二胺基間二甲酚、2,5-二胺基安息香酸、3,5-二胺基安息香酸、N,N-二烯丙基- 2.4- 二胺基苯胺、N,N-二烯丙基-2,5-二胺基苯胺、4-胺基 苯甲基胺、3-胺基苯甲基胺、2- ( 4-胺基苯基)乙基胺、 2- (3-胺基苯基)乙基胺、1,5-萘二胺、2,7·萘二胺、 4,4’-二胺基聯苯、3,4’-二胺基聯苯、3,3’-二胺基聯苯、 2,2’-二甲基-4,4’-二胺基聯苯、3,3’-二甲基-4,4’-二胺基 聯苯、3,3’-二甲氧基,4,4’-二胺基聯苯、3,3’-二羥基-4,4’-二胺基聯苯、3,3’-二羧基-4,4’-二胺基聯苯、3,3,-二 氟-4,4’-二胺基聯苯、2,2’-三氟甲基-4,4’-二胺基聯苯、 3,3’-三氟甲基-4,4’-二胺基聯苯、4,4’-二胺基二苯基甲烷 、3,3’-二胺基二苯基甲烷、3,4’-二胺基二苯基甲烷、 4,4’-二胺基二苯基醚、3,3’-二胺基二苯基醚、3,4’-二胺 -24- 201107406 基二苯基醚、4,4’-二胺基二苯基颯、3,3’-二胺基二苯基 颯、4,4’-二胺基二苯基胺、3,3’-二胺基二苯基胺、3,4’-二胺基二苯基胺、N-甲基(4,4’-二胺基二苯基)胺、N-甲基(3,3’-二胺基二苯基)胺、N-甲基(3,4’-二胺基二 苯基)胺、4,4’-二胺基二苯甲酮、3,3’-二胺基二苯甲酮 、3,4’-二胺基二苯甲酮、4,4’-二胺基苯甲醯苯胺、1,2-雙 (4-胺基苯基)乙烷、1,2-雙(3-胺基苯基)乙烷、4,4’-二胺基二苯乙炔(diaminotolane) 、1,3 -雙(4-胺基苯基 )丙烷、1,3-雙(3-胺基苯基)丙烷、2,2-雙(4-胺基苯 基)丙烷、2,2-雙(3-胺基苯基)丙烷、2,2-雙(3-胺基-4 -甲基苯基)丙烷、2,2-雙(4-胺基苯基)六氟丙烷、 2,2-雙(3-胺基苯基)六氟丙烷、2,2-雙(3-胺基-4-甲基 苯基)六氟丙烷、1,3-雙(4-胺基苯氧基)丙烷、1,4-雙 (4-胺基苯氧基)丁烷、1,5-雙(4-胺基苯氧基)戊烷、 1,6-雙(4-胺基苯氧基)己烷、1,7-雙(4-胺基苯氧基) 庚烷、1,8-雙(4-胺基苯氧基)辛烷、1,9-雙(4-胺基苯 氧基)壬烷、1,10-雙(4-胺基苯氧基)癸烷、1,11-雙( 4-胺基苯氧基)十一碳烷、1,12-雙(4-胺基苯氧基)十二 碳烷、雙(4-胺基苯基)丙烷二酸酯、雙(4-胺基苯基) 丁烷二酸酯、雙(4-胺基苯基)戊烷二酸酯、雙(4-胺基 苯基)己烷二酸酯、雙(4-胺基苯基)庚烷二酸酯、雙( 4-胺基苯基)辛烷二酸酯、雙(4-胺基苯基)壬烷二酸酯 、雙(4-胺基苯基)癸烷二酸酯、1,4-雙(4-胺基苯基) 苯、1,3-雙(4-胺基苯基)苯、1,4-雙(4-胺基苯氧基)[s] -25- 201107406 苯' 1,3-雙(4-胺基苯氧基)苯、1,4-雙(4-胺基苯甲基 )苯、1,3-雙(4-胺基苯甲基)苯、雙(4-胺基苯基)對 酞酸酯、雙(3-胺基苯基)對酞酸酯、雙(4-胺基苯基) 間酞酸酯、雙(3-胺基苯基)間酞酸酯、1,4-伸苯基雙[( 4-胺基苯基)甲酮]、1,4-伸苯基雙[(3-胺基苯基)甲酮] 、:1,3-伸苯基雙[(4-胺基苯基)甲酮]、1,3-伸苯基雙[( 3-胺基苯基)甲酮]、1,4-伸苯基雙(4-胺基苯甲酸酯)、 1,4-伸苯基雙(3-胺基苯甲酸酯)、1,3-伸苯基雙(4-胺 基苯甲酸酯)、1,3-伸苯基雙(3-胺基苯甲酸酯)、N,N’-(1,4-伸苯基)雙(4-胺基苯並醯胺)、N,N’- ( 1,3-伸苯 基)雙(4-胺基苯並醯胺)、N,N’-(1,4-伸苯基)雙(3-胺基苯並醯胺)、N,N’- ( 1,3-伸苯基)雙(3-胺基苯並醯 胺)、雙(4-胺基苯基)對酞醯胺、雙(3-胺基苯基)對 酞醯胺、雙(4-胺基苯基)間酞醯胺、雙(3-胺基苯基) 間酞醯胺、2,2-雙[4- ( 4-胺基苯氧基)·苯基]丙烷、2,2-雙 [4-(4-胺基苯氧基)苯基]六氟丙烷、4,4’-雙(4-胺基苯 氧基)二苯基颯、2,6·二胺基吡啶、2,4-二胺基吡啶、 2,4-二胺基-1,3,5-三嗪、2,6-二胺基二苯並呋喃、2,7-二胺 基二苯並呋喃、3,6 -二胺基二苯並呋喃、2,6 -二胺基咔唑 、2,7-二胺基昨唑、3,6-二胺基咔唑、2,4-二胺基-6-異丙 基-1,3,5-三嗪、2,5-雙(4-胺基苯基)-1,3,4-噁二唑、 1,4-二胺基環己烷、1,3-二胺基環己烷、雙(4-胺基環己 基)甲烷、雙(4-胺基-3-甲基環己基)甲烷等。 又,前述式(iv)中,Q所具有之環構造較佳爲苯環 -26- 201107406 、碳原子數4〜8的脂環、碳原子數7〜16之縮合多環式烴 。更佳爲脂環。 具有這種環構造之二羧酸酐的具體例,例如有酞酸酐 、偏苯三甲酸酐、馬來酸酐、萘酸酐、氫化酞酸酐、甲 基-5-降冰片燦_2,3 -二翔酸野、衣康酸酐、四氫酞酸酐等 〇 上述式(ν)中,Ζ較佳爲具有環構造之4價有機基 。此處’環構造例如有苯環、脂環、縮合多環式烴。更佳 爲於脂環式基或脂肪族基上有4個連結鍵結合之4價有機 基’更佳爲以下述式(Ζ-1)、式(Ζ-2)或式(Ζ-3)表 示之基。 【化1 7】P, human 〆COOH N H In the formula (2), the P, Q, and Z systems are the same as defined in the above formula (iii), formula (iv), and formula (v). In the present invention, the diamine compound, the dicarboxylic anhydride, and the tetracarboxylic dianhydride may be used singly or in combination of plural kinds. Therefore, the amino group-containing carboxylic acid compound of the component (C[S] -23- 201107406) of the present invention may be used alone or in combination of a plurality of compounds represented by the formula (2). Among the above P and Q, preferred are divalent organic groups each having a ring structure. Here, the ring structure is, for example, a benzene ring, an alicyclic ring or a condensed polycyclic hydrocarbon. In the formula (iii), the ring structure of 'P is preferably a benzene ring, an alicyclic ring having 4 to 8 carbon atoms, and a carbon number. Condensed polycyclic hydrocarbons of 7 to 16. Therefore, specific examples of the diamine compound having such a ring structure include p-phenylenediamine, m-phenylenediamine, 2,4-diaminotoluene, 2,5-diaminotoluene, 2,6-di Aminotoluene, 2,4-dimethyl-1,3-diaminobenzene, 2,5-dimethyl-1,4-diaminobenzene, 2,3,5,6-tetramethyl- 1,4 -diaminobenzene, 2.4-diaminophenol, 2,5-diaminophenol, 4,6-diaminoxyxylenol, 2,5-diaminobenzoic acid, 3,5 -diamine benzoic acid, N,N-diallyl-2.4-diaminoaniline, N,N-diallyl-2,5-diaminoaniline, 4-aminobenzylamine, 3-aminobenzylamine, 2-(4-aminophenyl)ethylamine, 2-(3-aminophenyl)ethylamine, 1,5-naphthalenediamine, 2,7-naphthalene Diamine, 4,4'-diaminobiphenyl, 3,4'-diaminobiphenyl, 3,3'-diaminobiphenyl, 2,2'-dimethyl-4,4'- Diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dimethoxy, 4,4'-diaminobiphenyl, 3,3 '-Dihydroxy-4,4'-diaminobiphenyl, 3,3'-dicarboxy-4,4'-diaminobiphenyl, 3,3,-difluoro-4,4'-diamine Biphenyl, 2,2'-trifluoromethyl-4,4 '-Diaminobiphenyl, 3,3'-trifluoromethyl-4,4'-diaminobiphenyl, 4,4'-diaminodiphenylmethane, 3,3'-diamino Diphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 3,4'-di Amine-24- 201107406 bisdiphenyl ether, 4,4'-diaminodiphenyl hydrazine, 3,3'-diaminodiphenyl hydrazine, 4,4'-diaminodiphenylamine, 3,3'-Diaminodiphenylamine, 3,4'-diaminodiphenylamine, N-methyl(4,4'-diaminodiphenyl)amine, N-methyl ( 3,3'-Diaminodiphenyl)amine, N-methyl(3,4'-diaminodiphenyl)amine, 4,4'-diaminobenzophenone, 3,3' -diaminobenzophenone, 3,4'-diaminobenzophenone, 4,4'-diaminobenzamide, 1,2-bis(4-aminophenyl)ethane 1,2-bis(3-aminophenyl)ethane, 4,4'-diaminotolane (diaminotolane), 1,3-bis(4-aminophenyl)propane, 1,3 - bis(3-aminophenyl)propane, 2,2-bis(4-aminophenyl)propane, 2,2-bis(3-aminophenyl)propane, 2,2-bis(3- Amine -4 -methylphenyl)propane, 2,2-bis(4-aminophenyl)hexafluoropropane, 2,2-bis(3-aminophenyl)hexafluoropropane, 2,2-dual ( 3-amino-4-methylphenyl)hexafluoropropane, 1,3-bis(4-aminophenoxy)propane, 1,4-bis(4-aminophenoxy)butane, 1 , 5-bis(4-aminophenoxy)pentane, 1,6-bis(4-aminophenoxy)hexane, 1,7-bis(4-aminophenoxy)heptane, 1,8-bis(4-aminophenoxy)octane, 1,9-bis(4-aminophenoxy)decane, 1,10-bis(4-aminophenoxy)decane 1,11-bis(4-aminophenoxy)undecane, 1,12-bis(4-aminophenoxy)dodecane, bis(4-aminophenyl)propane II Acid ester, bis(4-aminophenyl)butane dicarboxylate, bis(4-aminophenyl)pentane dicarboxylate, bis(4-aminophenyl)hexanedicarboxylate, bis( 4-aminophenyl)heptane diester, bis(4-aminophenyl)octane dicarboxylate, bis(4-aminophenyl)decanedioate, bis(4-aminobenzene) Base decane diester, 1,4-bis(4-aminophenyl)benzene, 1,3-bis(4-aminophenyl)benzene, 1,4-bis(4-amine Phenyloxy)[s] -25- 201107406 Benzene '1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminobenzyl)benzene, 1,3- Bis(4-aminobenzyl)benzene, bis(4-aminophenyl)p-phthalate, bis(3-aminophenyl)p-phthalate, bis(4-aminophenyl) Phthalate, bis(3-aminophenyl) metacaprate, 1,4-phenylene bis[(4-aminophenyl)methanone], 1,4-phenylene bis[(3) -aminophenyl)methanone], 1,3-phenylene bis[(4-aminophenyl)methanone], 1,3-phenylene bis[(3-aminophenyl)methyl Ketone], 1,4-phenylene bis(4-aminobenzoate), 1,4-phenylphenylbis(3-aminobenzoate), 1,3-phenylene bis ( 4-amino benzoate), 1,3-phenylene bis(3-aminobenzoate), N,N'-(1,4-phenylene) bis(4-aminobenzene) And decylamine, N,N'-(1,3-phenylene)bis(4-aminobenzophthalamide), N,N'-(1,4-phenylene)bis(3-amine Benzobenzamine), N,N'-(1,3-phenylene)bis(3-aminobenzoguanamine), bis(4-aminophenyl)-p-amine, double (3 -aminophenyl) pair Indoleamine, bis(4-aminophenyl)m-decylamine, bis(3-aminophenyl)m-decylamine, 2,2-bis[4-(4-aminophenoxy)· Phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, 4,4'-bis(4-aminophenoxy)diphenylanthracene, 2 ,6.diaminopyridine, 2,4-diaminopyridine, 2,4-diamino-1,3,5-triazine, 2,6-diaminodibenzofuran, 2,7- Diaminodibenzofuran, 3,6-diaminodibenzofuran, 2,6-diaminocarbazole, 2,7-diaminocarbazol, 3,6-diaminocarbazole, 2,4-Diamino-6-isopropyl-1,3,5-triazine, 2,5-bis(4-aminophenyl)-1,3,4-oxadiazole, 1,4 -diaminocyclohexane, 1,3-diaminocyclohexane, bis(4-aminocyclohexyl)methane, bis(4-amino-3-methylcyclohexyl)methane, and the like. Further, in the above formula (iv), the ring structure of Q is preferably a benzene ring -26-201107406, an alicyclic ring having 4 to 8 carbon atoms, or a condensed polycyclic hydrocarbon having 7 to 16 carbon atoms. More preferably an alicyclic ring. Specific examples of the dicarboxylic acid anhydride having such a ring structure include, for example, phthalic anhydride, trimellitic anhydride, maleic anhydride, naphthalic anhydride, hydrogenated phthalic anhydride, methyl-5-norbornate _2,3-dipic acid In the above formula (ν), ruthenium, itaconic anhydride, tetrahydrofurfuric anhydride, etc., Ζ is preferably a tetravalent organic group having a ring structure. Here, the ring structure is, for example, a benzene ring, an alicyclic ring or a condensed polycyclic hydrocarbon. More preferably, the tetravalent organic group having four bonding bonds bonded to the alicyclic group or the aliphatic group is more preferably a formula (Ζ-1), a formula (Ζ-2) or a formula (Ζ-3) The base of expression. [化1 7]

(Ζ-1) (Ζ-2) (Ζ-3) 式中之Ζ1係表示環狀飽和烴基,較佳爲表示碳原子 數4〜8之環狀飽和烴基,更佳爲碳原子數4〜6之環狀飽和 烴基。其中’ Ζ1基中所含有之任意的氫原子係分別獨立 可被脂肪族基取代,或彼等中,2個取代基可互相結合形 成4〜6員環。 此處,該取代基之脂肪族基較佳爲碳原子數1〜5的脂 肪族基,更佳爲碳原子數1〜3的脂肪族基。此等取代基結 合形成環時,例如成爲降冰片烯基或金剛烷基等架橋環式 烴基'一部或全部被氫化之縮合多環式烴基。 上述式中,Υ1係表示單鍵、羰基、醚基、磺醯基、碳 -27- 201107406 原子數1〜8的飽和烴基或被氟原子取代之碳原子數1 飽和烴基。較佳爲單鍵、羰基、醚基、磺醯基、碳H 1~5的飽和烴基或被氟原子取代之碳原子數1~5的食 基。 Y2係表示碳原子數1〜8的飽和烴基,較佳爲碳 數1~5的飽和烴基,更佳爲碳原子數1〜3的飽和烴基 Z之較佳具體例有上述式(A-1)〜式(A-8)。 ,特佳爲選自式(A-1)或(A-2)之基。 以式(v)表示之四竣酸二酐例如有均苯四甲酸 ' 2,3,6,7-萘四殘酸二酐、1,2,5,6-萘四竣酸二酐、ι,4 萘四羧酸二酐、2,3,6,7-蒽四羧酸二酐、惠四 二酐、3,3’,4,4’-聯苯四羧酸二酐、2,2,,3,3,_聯苯四 二酐' 2,3,3’,4’-聯苯四羧酸二酐、3,3,,4,4,_二苯甲 羧酸二酐、2,3,3’,4’-二苯甲酮四羧酸二酐、雙(3,4_ 基苯基)甲烷二酐、雙(3,4-二羧基苯基)酸二酐、 3,4 -二羧基苯基)楓二酐、2,2 -雙(3,4 -二殘基苯基 院二酐' 2,2 -雙(3,4 -二竣基苯基)六氟丙院二酐、 二羧基甲基對酞酸二酐、4,6 -二羧基甲基異酞酸酸二 4-(2,5-二氧四氫-3-咲喃基)酞酸酐、1,4_雙(2,5_ 四氫-3-呋喃基)苯、1,4-雙(2,6-二氧四氫_4-吡喃基 ' 1,4-雙(2,5-二氧四氫-3-甲基-3-呋喃基)苯、14_ 2,6 -—氧四氨-4 -甲基- 4-Π比喃基)苯、i,2,3,4 -丁院四 二肝、1,2,3,4 -環丁院四羧酸二肝、1,2 _二甲基_丨,2,3 丁烷四羧酸二酐、1,3-二甲基- l,2,3,4-環丁烷四羧酸 〜8的 ί子數 与和烴 原子 〇 其中 二酐 ,5,8- 羧酸 羧酸 酮四 二羧 雙( )丙 2,5- 酐、 二氧 )苯 雙( 羧酸 ,4-環 二酐 -28- 201107406 、1,2,3,4-四甲基-1,2,3,4-環丁烷四羧酸二酐、1,2,3,4-環 戊烷四羧酸二酐、2,3,4,5-四氫呋喃四羧酸二酐、2,3,5-三 羧基環戊基乙酸二酐、1,2,4,5-環己烷四羧酸二酐、4-( 2.5- 二氧四氫-3·呋喃基)-環己烷-1,2-二羧酸酐、5-( 2.5- 二氧四氫-3-呋喃基)-3-甲基-3-環己烯-丨,2-二羧酸酐 、雙環[2.2.2]辛-7-烯-2,3,5,6-四羧酸二酐、3,4-二羧基· 1,2,3,4-四氫-1-萘琥珀酸二酐、3,4-二羧基-12,3,4-四氫-6-甲基-1-萘琥珀酸二酐、雙環[3.3.0]辛烷-2,4,6,8-四羧酸 二酐、3,3’,4,4’-雙環己基四羧酸二酐'2,3,5,6-降冰片烷 四羧酸二酐、3,5,6-三羧基降冰片烷-2-酢酸二酐、三環 [4.2.1.02,5]壬烷-3,4,7,8-四羧酸二酐、四環 [4.4.1.02,5.07,1()]十一烷-3,4,8,9-四羧酸二酐、六環 [6.6.0.12’7.03,6.19’丨4.〇1(),13]十六烷-4,5,11,12-四羧酸二酐 、1,4-雙(2,5-二氧四氫-3-呋喃基)己烷、4-雙(2,6-二 氧四氫-4-吡喃基)己烷等。 上述(C)成分之化合物的製造時,四羧酸二酐與二 胺化合物與二羧酸酐之反應溫度可選擇5 ~50°C、較佳爲 10〜3 5 °C之任意溫度。反應時,爲了避免聚合物化,首先 將二胺化合物溶解於任意溶劑後,爲了避免因反應時之發 熱產生聚合,更佳爲在水冷至2 3 °C的狀態下,添加四羧酸 二酐與二羧酸酐》 上述反應一般係在溶劑中進行。此時可使用之溶劑只 要不含有羥基或胺基等、與酸酐反應之官能基者即可,並 無特別限定。例如有N,N-二甲基甲醯胺、N,N-二甲基乙[s ] -29- 201107406 醯胺、N-甲基-2-吡咯烷酮、N-乙烯基吡咯烷酮、N-甲基 己內醯胺、二甲基咪唑 '二甲基亞碾、四甲基尿素、二甲 基碾、六甲基亞楓、間甲酚、丁內酯、環己酮、環戊 酮、甲乙酮、甲基異丁基酮、2-庚酮、丙二醇單甲醚乙酸 酯、丙二醇丙醚乙酸酯、3_甲氧基丙酸甲酯、2 -甲氧基丙 酸甲酯、3-甲氧基丙酸乙酯、2-甲氧基丙酸乙酯、3-乙氧 基丙酸乙酯、2-乙氧基丙酸乙酯、甲基溶纖劑乙酸酯、乙 基溶纖劑乙酸酯、甲基溶纖劑、乙基溶纖劑、丁基溶纖劑 、丙二醇單甲醚、丙二醇丙醚、乳酸乙酯、乳酸丁酯、環 己醇、醋酸乙酯、醋酸丁酯、乳酸乙酯、乳酸丁酯等。 此等溶劑可單獨使用亦可混合使用,但從溶解性的觀 點,較佳爲丙二醇單甲醚、丙二醇單甲醚乙酸酯、Ν,Ν·二 甲基乙醯胺、Ν-甲基-2-吡咯烷酮、二甲基咪唑。 此外,即使爲不溶解含胺基羧酸化合物的溶劑,在藉 聚合反應所生成之含胺基羧酸化合物不會析出的範圍內, 亦可與上述溶劑混合使用。 本發明之熱硬化膜形成用聚酯組成物中之(C)成分 的含量係依據(Α)成分之聚酯聚合物100質量份,較佳 爲5〜80質量份,更佳爲5~60質量份。此比率太小時,由 熱硬化膜形成用聚酯組成物所得之硬化膜的配向性會降低 ,另外,過大時,有時透過率降低,或平坦性降低。 < (D)成分> 本發明中,可含有以下述式(3)所示的雙馬來醯亞 -30- 201107406 胺化合物作爲(D )成分。 (D)成分的雙馬來醯亞胺化合物可進一步提昇平坦 化性。 【化1 8】(Ζ-1) (Ζ-2) (Ζ-3) wherein Ζ1 represents a cyclic saturated hydrocarbon group, preferably a cyclic saturated hydrocarbon group having 4 to 8 carbon atoms, more preferably 4 to 4 carbon atoms. a cyclic saturated hydrocarbon group of 6. Any of the hydrogen atom groups contained in the 'Ζ1 group may be independently substituted with an aliphatic group, or two of them may be bonded to each other to form a 4 to 6 member ring. Here, the aliphatic group of the substituent is preferably an aliphatic group having 1 to 5 carbon atoms, more preferably an aliphatic group having 1 to 3 carbon atoms. When these substituents are combined to form a ring, for example, a bridged cyclic hydrocarbon group such as a norbornene group or an adamantyl group is a hydrogenated condensed polycyclic hydrocarbon group. In the above formula, Υ1 represents a single bond, a carbonyl group, an ether group, a sulfonyl group, a saturated hydrocarbon group having 1 to 8 carbon atoms of carbon-27-201107406 or a saturated hydrocarbon group having 1 carbon atom substituted by a fluorine atom. Preferred are a single bond, a carbonyl group, an ether group, a sulfonyl group, a saturated hydrocarbon group of carbon H 1 to 5 or a group having 1 to 5 carbon atoms which are substituted by a fluorine atom. Y2 is a saturated hydrocarbon group having 1 to 8 carbon atoms, preferably a saturated hydrocarbon group having 1 to 5 carbon atoms, more preferably a saturated hydrocarbon group having 1 to 3 carbon atoms. ) ~ formula (A-8). Particularly preferred is a group selected from the group consisting of formula (A-1) or (A-2). The tetracarboxylic dianhydride represented by the formula (v) is, for example, pyromellitic acid '2,3,6,7-naphthalene tetraresidic acid dianhydride, 1,2,5,6-naphthalene tetraphthalic acid dianhydride, ι , 4 naphthalene tetracarboxylic dianhydride, 2,3,6,7-nonanetetracarboxylic dianhydride, thiotetrahydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2 ,,3,3,_Biphenyltetracarboxylic anhydride ' 2,3,3',4'-biphenyltetracarboxylic dianhydride, 3,3,4,4,_dibenzoic acid dianhydride, 2 , 3,3',4'-benzophenone tetracarboxylic dianhydride, bis(3,4-phenylene)methane dianhydride, bis(3,4-dicarboxyphenyl) acid dianhydride, 3,4 -Dicarboxyphenyl) Maple dianhydride, 2,2-bis(3,4-di-resin phenyl phthalic anhydride' 2,2-bis(3,4-dimercaptophenyl) hexafluoropropyl Anhydride, dicarboxymethyl-p-phthalic acid dianhydride, 4,6-dicarboxymethylisophthalic acid di 4-(2,5-dioxotetrahydro-3-indolyl) phthalic anhydride, 1,4_ Bis(2,5-tetrahydro-3-furanyl)benzene, 1,4-bis(2,6-dioxotetrahydro-4-pyranyl' 1,4-bis(2,5-dioxotetrahydro) -3-methyl-3-furanyl)benzene, 14_ 2,6--oxytetramine-4-methyl-4-pyrenepyranyl)benzene, i,2,3,4-dinary four liver 1,2,3,4 - Circulating Hospital, tetracarboxylic acid, liver, 1, 2 _ dimethyl hydrazine, 2,3 butane tetracarboxylic dianhydride, 1,3-dimethyl-l, 2,3,4-cyclobutane tetracarboxylic acid ~ 8 子 number and hydrocarbon Atomic hydrazine, dianhydride, 5,8-carboxylic acid ketone ketone tetracarboxylic bis( )propane 2,5-anhydride, dioxy)benzene bis (carboxylic acid, 4-cyclo dianhydride-28- 201107406, 1,2 , 3,4-tetramethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 2,3,4,5 - tetrahydrofuran tetracarboxylic dianhydride, 2,3,5-tricarboxycyclopentyl acetic acid dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride, 4-(2.5-dioxotetrahydro- 3·furanyl)-cyclohexane-1,2-dicarboxylic anhydride, 5-(2.5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-indole, 2-di Carboxylic anhydride, bicyclo [2.2.2] oct-7-ene-2,3,5,6-tetracarboxylic dianhydride, 3,4-dicarboxy· 1,2,3,4-tetrahydro-1-naphthalene Succinic dianhydride, 3,4-dicarboxy-12,3,4-tetrahydro-6-methyl-1-naphthalene succinic dianhydride, bicyclo[3.3.0]octane-2,4,6,8 -tetracarboxylic dianhydride, 3,3',4,4'-dicyclohexyltetracarboxylic dianhydride '2,3,5,6-norbornanetetracarboxylic dianhydride, 3,5,6-tricarboxyl Norbornane-2-furic acid dianhydride, tricyclo[4.2.1.02,5]decane-3,4,7,8-four Acid dianhydride, tetracyclo[4.4.1.02,5.07,1()]undecane-3,4,8,9-tetracarboxylic dianhydride, hexacyclo[6.6.0.12'7.03, 6.19'丨4.〇 1(), 13] hexadecane-4,5,11,12-tetracarboxylic dianhydride, 1,4-bis(2,5-dioxotetrahydro-3-furanyl)hexane, 4-double (2,6-Dioxytetrahydro-4-pyranyl)hexane or the like. In the production of the compound of the above component (C), the reaction temperature of the tetracarboxylic dianhydride and the diamine compound and the dicarboxylic anhydride may be any temperature of 5 to 50 ° C, preferably 10 to 35 ° C. In the reaction, in order to avoid polymerization, first, after dissolving the diamine compound in any solvent, in order to avoid polymerization due to heat generation during the reaction, it is more preferable to add tetracarboxylic dianhydride and water to a temperature of 23 ° C. Dicarboxylic anhydride The above reaction is generally carried out in a solvent. The solvent which can be used at this time is not particularly limited as long as it does not contain a functional group which reacts with an acid anhydride such as a hydroxyl group or an amine group. For example, there are N,N-dimethylformamide, N,N-dimethylethyl [s ] -29- 201107406 decylamine, N-methyl-2-pyrrolidone, N-vinylpyrrolidone, N-methyl Caprolactam, dimethylimidazole 'dimethylimine mill, tetramethyl urea, dimethyl mill, hexamethyl sulfoxide, m-cresol, butyrolactone, cyclohexanone, cyclopentanone, methyl ethyl ketone, Methyl isobutyl ketone, 2-heptanone, propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, methyl 3-methoxypropionate, methyl 2-methoxypropionate, 3-methyl Ethyl oxypropionate, ethyl 2-methoxypropionate, ethyl 3-ethoxypropionate, ethyl 2-ethoxypropionate, methyl cellosolve acetate, ethyl solubilized fiber Acetate, methyl cellosolve, ethyl cellosolve, butyl cellosolve, propylene glycol monomethyl ether, propylene glycol propyl ether, ethyl lactate, butyl lactate, cyclohexanol, ethyl acetate, butyl acetate, Ethyl lactate, butyl lactate, and the like. These solvents may be used singly or in combination, but from the viewpoint of solubility, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, hydrazine, hydrazine dimethyl acetamide, hydrazine-methyl group are preferred. 2-pyrrolidone, dimethylimidazole. Further, even a solvent which does not dissolve the amino group-containing carboxylic acid compound may be used in combination with the above solvent within a range in which the amino group-containing carboxylic acid compound formed by the polymerization reaction does not precipitate. The content of the component (C) in the polyester composition for forming a thermosetting film of the present invention is preferably from 5 to 80 parts by mass, more preferably from 5 to 60 parts by mass based on 100 parts by mass of the polyester polymer of the (Α) component. Parts by mass. When the ratio is too small, the alignment property of the cured film obtained from the polyester composition for forming a thermosetting film is lowered, and when it is too large, the transmittance may be lowered or the flatness may be lowered. <Component (D)> In the present invention, a compound of the double-Malaysia -30-201107406 amine represented by the following formula (3) may be contained as the component (D). The bismaleimide compound of the component (D) can further improve the planarization property. [化1 8]

Ο 〇 式中,X係選自由脂肪族基、含有環式構造之脂肪族 基及芳香族基所成群的有機基或選自彼等之群的複數有機 基的組合所構成的有機基。而且,X亦可含有酯鍵、醚鍵 、醯胺鍵、胺基甲酸酯等的鍵。 這種雙馬來醯亞胺化合物例如有1^,&gt;1’-3,3-二苯基甲 烷雙馬來醯亞胺、&gt;1,:^’-(3,3-二乙基-5,5-二甲基)-4,4-二苯基-甲烷雙馬來醯亞胺、N,N’-4,4-二苯基甲烷雙馬來 醯亞胺、3,3-二苯基楓雙馬來醯亞胺、4,4-二苯基颯雙馬 來醯亞胺、Ν,Ν’-對-二苯甲酮雙馬來醯亞胺、N,N,-二苯 乙烷雙馬來醯亞胺、N,N,-二苯醚雙馬來醯亞胺、Ν,Ν,-( 亞甲基二-雙四氫苯基)雙馬來醯亞胺、N,N,-(3-乙基)-4,4-二苯基甲烷雙馬來醯亞胺、Ν,Ν’_ ( 3,3_二甲基)-4,4_ 二苯基甲烷雙馬來醯亞胺、Ν,Ν,-(3,3-二乙基)-4,4-二 苯基甲烷雙馬來醯亞胺、Ν,Ν,-(3,3-二氯)-4,4-二苯基 甲烷雙馬來醯亞胺、Ν,Ν’-異佛爾酮雙馬來醯亞胺、Ν,Ν,-甲苯胺雙馬來醯亞胺、Ν,Ν,-二苯基丙烷雙馬來醯亞胺、 Ν,Ν-萘雙馬來醯亞胺、Ν,Ν’-間伸苯基雙馬來醯亞胺、 [ Ν,Ν’-5-甲氧基-13-伸苯基雙馬來醯亞胺、2,2-雙(4-(4- -31 - 201107406 馬來醯亞胺苯氧基)苯基)丙烷、2,2_雙(3-氯-4-(4-馬 來醯亞胺苯氧基)苯基)丙烷、2,2-雙(3-溴-4 _(4-馬來 醯亞胺苯氧基)苯基)丙烷、2,2-雙(3-乙基-4-(4-馬來 醯亞胺苯氧基)苯基)丙烷、2,2-雙(3-丙基-4- (4-馬來 醯亞胺苯氧基)苯基)丙烷、2,2·雙(3-異丙基-4-(4-馬 來醯亞胺苯氧基)苯基)丙烷' 2,2·雙(3-丁基-4-(4-馬 來醯亞胺苯氧基)苯基)丙烷、2,2·雙(3-甲氧基-4-(4-馬來醯亞胺苯氧基)苯基)丙烷、I,1-雙(4- (4-馬來醯 亞胺苯氧基)苯基)乙烷、1,1_雙(3_甲基-4-(4-馬來醯 亞胺苯氧基)苯基)乙烷、1,1_雙(3-氯- 4-(4-馬來醯亞 胺苯氧基)苯基)乙烷、1,1-雙(3-溴-4-(4-馬來醯亞胺 苯氧基)苯基)乙烷、3,3-雙(4- (4-馬來醯亞胺苯氧基 )戊烷、1,1,1,3,3,3-六氟-2,2-雙(4-(4-馬來醢亞胺苯氧 基)苯基)丙烷、1,1,1,3,3,3-六氟-2,2-雙(3,5-二甲基-4-(4-馬來醯亞胺苯氧基)苯基)丙烷、1,1,1,3,3,3-六氟-2,2_雙(3,5-二溴-4- ( 4-馬來醯亞胺苯氧基)苯基)丙烷 、N,N,-亞乙基二馬來醯亞胺、Ν,Ν’-六亞甲基雙馬來醯亞 胺、Ν,Ν’-十二亞甲基雙馬來醯亞胺、Ν,Ν’-間苯二甲基雙 馬來醯亞胺、Ν,Ν’-對苯二甲基雙馬來醯亞胺、Ν,Ν’-1,3-雙亞甲基環己烷雙馬來醯亞胺、Ν,Ν’-2,4·伸甲苯基雙馬來 醯亞胺、N,N’-2,6-伸甲苯基雙馬來醯亞胺等。此等雙馬來 醯亞胺化合物並無特別限定於上述者。此等可單獨使用或 倂用2種以上之成分。 此等雙馬來醯亞胺中,較佳爲2,2-雙(4- ( 4-馬來醯 -32- 201107406 亞胺苯氧基)苯基)丙烷、N,N’-4,4-二苯基甲烷雙馬來醯 亞胺、1^1^,-(3,3-二乙基-5,5-二甲基)-4,4-二苯基-甲烷 雙馬來醯亞胺等之芳香族雙馬來醯亞胺。 又,此等芳香族雙馬來醯亞胺中,爲了得到更高的平 坦化性,較佳爲分子量1000以下者。 本發明中,(D)成分之雙馬來醯亞胺化合物的使用 比率係相對於(A)成分之聚酯100質量份,較佳爲 〇.5~50質量份,更佳爲卜30質量份,特佳爲2〜20質量 份。此比率太小時,由熱硬化膜形成用聚酯組成物所得之 硬化膜的平坦化性會降低,過大時,有時硬化膜之透過率 會降低,或塗膜粗糙。 &lt;溶劑&gt; 本發明之熱硬化膜形成用聚酯組成物係在溶解於溶劑 之溶液狀態使用較多。其時所使用之溶劑係溶解(A )成 分〜(C)成分、及必要時溶解(D)成分及/或後述之其 他添加劑者,只要是具有如此溶解能的溶劑時,其種類及 構造等並特別限定。 這種溶劑例如(A)成分之聚合用的溶劑或下述溶劑 。例如有甲基溶纖劑.乙酸酯、乙基溶纖劑乙酸酯、甲基溶 纖劑、乙基溶纖劑、丁基溶纖劑、丙二醇單甲醚、丙二醇 丙醚、乳酸乙酯、乳酸丁酯、環己醇、醋酸乙酯' 醋酸丁 酯等。 此等溶劑可一種單獨使用或以二種以上之組合使用。 -33- 201107406 &lt;其他的添加劑&gt; 本發明之熱硬化膜形成用聚酯組成物,只要不影響本 發明的效果時,可依需要含有界面活性劑、流變調整劑、 矽烷偶合劑等之接著補助劑、顏料、染料、保存安定劑、 消泡劑、多元酚或多元羧酸等之溶解促進劑、抗氧化劑等 〇 抗氧化劑例如特佳爲酚類,其具體例有2,6-二-第三 丁基-4-甲酚、2,6-二-第三丁基酚、2,4,6·三(3’,5,-二第 三丁基-4’-羥基苯甲基)三甲基苯、季戊四醇四[3-( 3’,5’-二第三丁基-4’-羥基苯基)丙酸酯]、丙酮雙(3,5-二第三丁基-4’-羥基苯基)硫醇、4,4’-亞甲基雙(2,6-二 第三丁基酚)、3- (3,5-二第三丁基-4-羥基苯基)丙酸甲 酯、4,4’-硫二(2,6-二第三丁基酚)、三(3,5-二第三丁 基-4-羥基苯甲基)三聚異氰酸、雙(3,5-二第三丁基- 4-羥基苯甲基)硫醚等。 &lt;熱硬化膜形成用聚酯組成物&gt; 本發明之熱硬化膜形成用聚酯組成物係含有(A)成 分之聚酯、(B)成分之具有2個以上之環氧基的環氧化 合物、(C)成分之含胺基羧酸化合物,依需要可含有( D)成分之雙馬來醯亞胺化合物、及其他添加劑中之—種 以上的組成物》通常此等成分係以溶解於溶劑的溶液狀態 使用較多。 其中’本發明之熱硬化膜形成用聚酯組成物的較佳例 -34 - 201107406 ,如下述。 [1] :依據(A)成分100質量份’含有3~50質量份之(B )成分、5~80質量份之(C)成分的熱硬化膜形成用聚酯 組成物。 [2] :依據(A)成分100質量份’含有3〜50質量份之(B )成分、5~80質量份之(C)成分及溶劑的熱硬化膜形成 用聚酯組成物。 [3] :依據(A)成分100質量份’含有3〜50質量份之(B )成分、5~80質量份之(C)成分、〇.5~50質量份之(D )成分的熱硬化膜形成用聚酯組成物。 [4] :依據(A)成分100質量份’含有3~50質量份之(B )成分、5~80質量份之(C)成分、〇.5~50質量份之(D )成分及溶劑的熱硬化膜形成用聚酯組成物5 本發明之熱硬化膜形成用聚酯組成物爲溶液形態時之 調配比率、諷製方法等詳述如下。 本發明之熱硬化膜形成用聚酯組成物中之固形分的比 率係各成分均一地溶解於溶劑時,即無特別限定,通常爲 1〜80質量%,較佳爲5〜60質量%,更佳爲1 〇〜50質量%。 其中固形分係指從熱硬化膜形成用聚酯組成物之全成分中 除去溶劑者。 本發明之熱硬化膜形成用聚酯組成物的調製方法無特 別限定,其調製法例如有使(A)成分溶解於溶劑,於此 溶液中以特定的比率混合(B)成分、(C)成分及(D) -35- 201107406 成分,形成均一溶液的方法,或在此調製法之適當階段, 依需要再添加其他添加劑進行混合的方法。 .調製本發明之熱硬化膜形成用聚酯組成物時,可直接 使用在溶劑中之聚合反應所得的聚酯溶液。此時,於此( A)成分之溶液中與前述同樣地添加(B)成分、(C)成 分、(D)成分等,形成均一的溶液時,以濃度調整爲目 的可再追加投入溶劑。此時,聚酯之生成過程所使用的溶 劑與熱硬化膜形成用聚酯組成物之調製時,濃度調整所使 用之溶劑可相同或相異。 調製後之熱硬化膜形成用聚酯組成物的溶液較佳爲使 用孔徑爲〇·2μιη左右的過濾器等過濾後使用。 &lt;塗膜、硬化膜及液晶配向層&gt; 將本發明之熱硬化膜形成用聚酯組成物藉由旋轉塗佈 、流塗佈、輥塗佈、模縫塗佈、附細縫之旋轉塗佈、噴墨 塗佈、印刷等塗佈於基板(例如矽/二氧化矽被覆基板、 氮化矽基板、以金屬例如鋁、鉬、鉻等被覆的基板、玻璃 基板、石英基板、ΙΤΟ基板等)或薄膜(例如三乙醯基纖 維素薄膜、聚酯薄膜、丙烯酸薄膜等之樹脂薄膜)等上然 後,以加熱板或烘箱等進行預備乾燥(預烘烤),可形成 塗膜。其後,此塗膜藉由加熱處理,可形成被膜。 此加熱處理之條件可採用例如從溫度70°c〜160°C、時 間0.3〜60分鐘之範圍中適當選擇的加熱溫度及加熱時間 。加熱溫度及加熱時間較佳爲80°C〜140°C、〇.5~10分鐘。 -36- 201107406 又’由熱硬化膜形成用聚酯組成物所形成之被膜的膜 厚例如0.1 ~30μιη,可考慮使用之基板的段差或光學性、 電氣性質來適當選擇。 後烘烤一般係可採用以選自溫度140°C~250°C之範圍 中的加熱溫度,於加熱板上時處理5〜3 0分鐘,烘箱中時 處理30~90分鐘的方法。 在上述條件下,藉由使本發明之熱硬化膜形成用聚酯 組成物硬化,可使基板之段差充分地平坦化,可形成具有 高透明性的硬化膜。 如此形成之硬化膜藉由擦摩處理,可發揮作爲液晶材 配向層,換言之,使具有液晶性之化合物配向之層的功能 〇 擦摩處理之條件一般可使用旋轉速度3 00~1 000rpm, 輸送速度3~200mm/秒,押入量0.1~lmm的條件。 其後,使用純水等藉超音波洗淨,可除去擦摩所產生 的殘渣。 如此形成之液晶配向層上塗佈相位差材料後,使相位 差材料以液晶狀態進行光硬化,可形成具有光學各向異性 的層。 相位差材料可使用例如具有聚合性基之液晶單體或含 有該單體的組成物等。 形成液晶配向層之基材爲薄膜時,可作爲光學各向異 性薄膜使用。 又,將具有如上述形成之液晶配向層的2片基板,介E S ] -37- 201107406 由間隔物,以液晶配向層相對向的方式貼合後,彼等基板 間注入液晶,可形成液晶配向的液晶顯示元件。 因此.,本發明之熱硬化膜形成用聚酯組成物可適用於 各種光學各向異性薄膜、液晶顯示元件。 又,本發明之熱硬化膜形成用聚酯組成物係因具有至 少必要水準的平坦化性,故亦可作爲形成薄膜電晶體( TFT )型液晶顯示元件、有機EL元件等之各種顯示器中 的保護膜、平坦化膜、絕緣膜等之硬化膜的材料使用,特 別是適合作爲形成彩色濾光片之被覆層材、TFT型液晶元 件之層間絕緣膜、有機EL元件的絕緣膜等的材料使用。 【實施方式】 [實施例] 以下,舉實施例更詳細說明本發明,但本發明不限定 於此等實施例。 [實施例所使用的簡稱] 以下實施例所使用之簡稱的意義如下述。 &lt;聚酯聚合物原料&gt; HBPDA: 3,3’-4,4’-雙環己基四羧酸二酐 THPA : l,2,5,6-四氫酞酸酐 BPDA :聯苯基四羧酸二酐 HBPA:氫化雙酚a -38- 201107406 BTEAC :氯化苯甲基三乙銨 &lt;含胺基羧酸化合物原料&gt; HBPDA: 3,3’-4,4’-雙環己基四竣酸二酐 CBDA :環己烷四羧酸二酐 THPA : 1,2,5,6-四氫酞酸酐 DA-4P : 1,3-雙(4-胺基苯基)苯 DDS : 4,4’-二胺基二苯基碾 &lt;聚醯亞胺前驅體原料&gt; CBDA: 1,2,4,5-環己烷四羧酸二酐 pDA :對苯二胺 &lt;丙烯酸共聚合物原料&gt; MAA :甲基丙烯酸 MMA :甲基丙烯酸甲酯 HEM A : 2-羥基乙基甲基丙烯酸酯 CHMI : N-環己基馬來醯亞胺 AIBN :偶氮雙異丁腈 &lt;環氧化合物&gt; CEL : Daicel 化學工業(股)製 Celoxide P-2021 ( 製品名)(化合物名:3,4-環氧基環己烯基甲基-3’,4’-環 氧基環己烯羧酸酯) -39- 201107406 &lt;雙馬來醯亞胺化合物〉 6?411::^_&gt;1’-(3,3-二乙基-5,5-二甲基)-4,4 甲烷雙馬來醯亞胺 1 &lt;溶劑&gt; PGMEA:丙二醇單甲醚乙酸酯 PGME :丙二醇單甲醚 DMAc : N,N-二甲基乙醯胺 NMP : N-甲基-2-毗咯烷酮 依據以下合成例所得之聚酯聚合物、聚醯亞胺 及丙烯酸共聚物之數目平均分子量及重量平均分子 用曰本分光(股)製GPC裝置(Shodex (註冊商 柱 KF8 03 L及 KF804L),使溶出溶劑四氫呋喃 lml/分鐘於管柱中(管柱溫度40°C)流通溶離的條 測定。又,下述數目平均分子量(以下稱爲Μη ) 平均分子量(以下稱爲Mw)係以聚苯乙烯換算値〗 &lt;合成例1&gt; 藉由使 HBPDA 12.0g、HBPA 10.2g、THPA BTEAC 0.22g 在 PGMEA 54.48g 中以 120。。反應 19 得到聚酯聚合物溶液(固形分濃度:3 0.0質量% ) 。所得之聚酯聚合物的Mn爲2280 ’ Mw爲4200。 二苯基 前驅體 量係使 標)管 以流量 件進行 及重量 袠示。 0.95g ' 小時, (P1 ) -40- 201107406 &lt;合成例2&gt; 將DA-4P 14.6g溶解於DMAc 40.68g後,經水冷後保 持 23°C。此溶液與 CBDA 4.90g、THPA 7.60g 在 23¾ 下反 應24小時,得到含胺基羧酸化合物溶液(固形分濃度 4 0 · 0 質量 % ) ( A 1 )。 &lt;合成例3&gt; 將DDS 4.97g溶解於DMAc 14.95g後,經水冷後保 持 23°C。此溶液與 CBDA 1.96g、THPA 3.04g 在 23°C 下反 應24小時得到含胺基羧酸化合物溶液(固形分濃度40.0 質量 % ) ( A2 )。 &lt;合成例4&gt;In the formula, X is an organic group selected from the group consisting of an aliphatic group, an organic group having a cyclic structure and an aromatic group, or a combination of a plurality of organic groups selected from the group. Further, X may also contain a bond such as an ester bond, an ether bond, a guanamine bond or a urethane. Such a bismaleimide compound is, for example, 1^,&gt;1'-3,3-diphenylmethane bismaleimide, &gt;1,:^'-(3,3-diethyl -5,5-dimethyl)-4,4-diphenyl-methane bismaleimide, N,N'-4,4-diphenylmethane bismaleimide, 3,3- Diphenyl maple bismaleimide, 4,4-diphenylfluorene bismaleimide, anthracene, Ν'-p-benzophenone bismaleimide, N, N, - II Ethyl benzene bismaleimide, N,N,-diphenyl ether bismaleimide, anthracene, fluorene, -(methylenebis-bistetrahydrophenyl) bismaleimide, N ,N,-(3-ethyl)-4,4-diphenylmethane bismaleimide, anthracene, Ν'_ (3,3-dimethyl)-4,4_diphenylmethane醯imine, hydrazine, hydrazine, -(3,3-diethyl)-4,4-diphenylmethane bismaleimide, hydrazine, hydrazine, -(3,3-dichloro)-4 , 4-diphenylmethane, bismaleimide, hydrazine, Ν'-isophorone, bismaleimide, hydrazine, hydrazine, -toluidine, bismaleimide, hydrazine, hydrazine, - two Phenylpropane, bismaleimide, anthracene, anthracene-naphthalene, bismaleimide, anthracene, anthracene-phenyl-p-maleimide, [Ν,Ν'-5- Oxyl-13-phenylene bismaleimide, 2,2-bis(4-(4--31 - 201107406 maleimide phenoxy)phenyl)propane, 2,2_bis ( 3-chloro-4-(4-maleimide phenoxy)phenyl)propane, 2,2-bis(3-bromo-4 _(4-maleimidophenoxy)phenyl) Propane, 2,2-bis(3-ethyl-4-(4-maleimidophenoxy)phenyl)propane, 2,2-bis(3-propyl-4-(4-male)醯iminophenoxy)phenyl)propane, 2,2·bis(3-isopropyl-4-(4-maleimidophenoxy)phenyl)propane '2,2·double (3 -butyl-4-(4-maleimidophenoxy)phenyl)propane, 2,2.bis(3-methoxy-4-(4-maleimidophenoxy)benzene Propane, I, 1-bis(4-(4-maleimidophenoxy)phenyl)ethane, 1,1-bis (3-methyl-4-(4-mala) Amine phenoxy)phenyl)ethane, 1,1-bis(3-chloro-4-(4-maleimidophenoxy)phenyl)ethane, 1,1-bis(3-bromo) -4-(4-maleimide phenoxy)phenyl)ethane, 3,3-bis(4-(4-maleimidophenoxy)pentane, 1,1,1, 3,3,3-hexafluoro-2,2-bis(4-(4-malay) Amine phenoxy)phenyl)propane, 1,1,1,3,3,3-hexafluoro-2,2-bis(3,5-dimethyl-4-(4-maleimide benzene) Oxy)phenyl)propane, 1,1,1,3,3,3-hexafluoro-2,2-bis(3,5-dibromo-4-(4-maleimidophenoxy) Phenyl)propane, N,N,-ethylene dimaleimide, anthracene, Ν'-hexamethylene bismaleimide, anthracene, Ν'-docamethylene double mala Imine, hydrazine, Ν'-m-xylylene bismaleimide, hydrazine, Ν'-p-xylylene bismaleimide, hydrazine, Ν'-1,3-bismethylene Cyclohexane bis-maleimide, hydrazine, Ν'-2,4·-tolyl-bis-maleimide, N,N'-2,6-tolyl-based bismaleimide, and the like. These bismaleimide compounds are not particularly limited to the above. These may be used alone or in combination of two or more. Among these bismaleimides, 2,2-bis(4-(4-male-32-201107406 imidophenoxy)phenyl)propane, N,N'-4,4 is preferred. -diphenylmethane bismaleimide, 1^1^,-(3,3-diethyl-5,5-dimethyl)-4,4-diphenyl-methane bismalea An aromatic bismaleimide such as an amine. Further, in such aromatic bismaleimine, in order to obtain higher flatness, a molecular weight of 1,000 or less is preferred. In the present invention, the use ratio of the bismaleimide compound of the component (D) is preferably from 0.5 to 50 parts by mass, more preferably from 30 parts by mass, based on 100 parts by mass of the polyester of the component (A). The portion is particularly preferably 2 to 20 parts by mass. When the ratio is too small, the flattening property of the cured film obtained from the polyester composition for forming a thermosetting film is lowered. When the ratio is too large, the transmittance of the cured film may be lowered or the coating film may be rough. &lt;Solvent&gt; The polyester composition for forming a thermosetting film of the present invention is used in a state of being dissolved in a solvent. The solvent to be used in the case of dissolving the components (A) to (C) and, if necessary, the component (D) and/or other additives described later, as long as it is a solvent having such a solubility, the type and structure thereof And is particularly limited. Such a solvent is, for example, a solvent for polymerization of the component (A) or a solvent described below. For example, there are methyl cellosolve, acetate, ethyl cellosolve acetate, methyl cellosolve, ethyl cellosolve, butyl cellosolve, propylene glycol monomethyl ether, propylene glycol propyl ether, ethyl lactate, Butyl lactate, cyclohexanol, ethyl acetate 'butyl acetate, and the like. These solvents may be used singly or in combination of two or more. -33-201107406 &lt;Other Additives&gt; The polyester composition for forming a thermosetting film of the present invention may contain a surfactant, a rheology modifier, a decane coupling agent, etc. as needed, as long as the effects of the present invention are not impaired. Next, a stimulating agent such as a subsiding agent, a pigment, a dye, a storage stabilizer, an antifoaming agent, a polyphenol or a polyvalent carboxylic acid, or a hydrazine antioxidant such as an antioxidant is particularly preferably a phenol, and specific examples thereof are 2, 6- Di-t-butyl-4-methylphenol, 2,6-di-t-butylphenol, 2,4,6·tris(3',5,-di-t-butyl-4'-hydroxybenzoic acid Trimethylbenzene, pentaerythritol tetra[3-(3',5'-di-t-butyl-4-'-hydroxyphenyl)propionate], acetone bis(3,5-di-t-butyl- 4'-hydroxyphenyl)thiol, 4,4'-methylenebis(2,6-di-t-butylphenol), 3-(3,5-di-t-butyl-4-hydroxyphenyl) Methyl propionate, 4,4'-thiobis(2,6-di-t-butylphenol), tris(3,5-di-t-butyl-4-hydroxybenzyl)-trimeric isocyanate , bis(3,5-di-t-butyl-4-hydroxybenzyl) sulfide, and the like. &lt;Polyester composition for forming a thermosetting film&gt; The polyester composition for forming a thermosetting film of the present invention contains a polyester of the component (A) and a ring of two or more epoxy groups of the component (B). The oxygen-containing compound or the amino group-containing carboxylic acid compound of the component (C) may optionally contain a double-maleimide compound of the component (D) and a composition of at least one of the other additives. The solution in which the solvent is dissolved is used in a large amount. The preferred embodiment of the polyester composition for forming a thermosetting film of the present invention is -34 - 201107406, as described below. [1] A polyester composition for forming a thermosetting film containing 3 to 50 parts by mass of the component (B) and 5 to 80 parts by mass of the component (C), based on 100 parts by mass of the component (A). [2] A polyester composition for forming a thermosetting film containing 3 to 50 parts by mass of the component (B) and 5 to 80 parts by mass of the component (C) and a solvent, based on 100 parts by mass of the component (A). [3] : According to the (A) component, 100 parts by mass of the component (B) containing 3 to 50 parts by mass of the component (B), 5 to 80 parts by mass of the component (C), and the heat of the component (D) of 5 to 50 parts by mass. A polyester composition for forming a cured film. [4] : According to (A) component 100 parts by mass, '3 to 50 parts by mass of component (B), 5 to 80 parts by mass of component (C), 5.5 to 50 parts by mass of component (D) and solvent The polyester composition for forming a thermosetting film 5 The blending ratio, the sardonic method, and the like in the case where the polyester composition for forming a thermosetting film of the present invention is in a solution form are described in detail below. The ratio of the solid content in the polyester composition for forming a thermosetting film of the present invention is not particularly limited as long as the respective components are uniformly dissolved in the solvent, and is usually 1 to 80% by mass, preferably 5 to 60% by mass. More preferably 1 〇 to 50% by mass. The solid fraction refers to a solvent which is removed from the entire composition of the polyester composition for forming a thermosetting film. The preparation method of the polyester composition for forming a thermosetting film of the present invention is not particularly limited, and the preparation method may be, for example, dissolving the component (A) in a solvent, and mixing the component (B) at a specific ratio in the solution, and (C) Ingredients and (D) -35- 201107406 ingredients, a method of forming a homogeneous solution, or a method of mixing other additives as needed at an appropriate stage of the preparation method. When the polyester composition for forming a thermosetting film of the present invention is prepared, a polyester solution obtained by a polymerization reaction in a solvent can be used as it is. In this case, in the solution of the component (A), the component (B), the component (C), the component (D) and the like are added in the same manner as described above to form a uniform solution, and a solvent can be additionally added for the purpose of concentration adjustment. In this case, when the solvent used in the formation of the polyester and the polyester composition for forming a thermosetting film are prepared, the solvents used for the concentration adjustment may be the same or different. The solution of the polyester composition for forming a thermosetting film after the preparation is preferably filtered using a filter having a pore diameter of about 2 μm or the like. &lt;Coating film, cured film, and liquid crystal alignment layer&gt; The polyester composition for forming a thermosetting film of the present invention is subjected to spin coating, flow coating, roll coating, die coating, and slit spinning Coating, inkjet coating, printing, etc., applied to a substrate (for example, a ruthenium/yttria-coated substrate, a tantalum nitride substrate, a substrate coated with a metal such as aluminum, molybdenum, chromium, or the like, a glass substrate, a quartz substrate, or a germanium substrate) Or a film (for example, a resin film such as a triethylenesulfonated cellulose film, a polyester film, or an acrylic film) or the like, and then preliminarily dried (prebaked) in a hot plate or an oven to form a coating film. Thereafter, the coating film is formed by heat treatment to form a film. The heat treatment conditions may be, for example, a heating temperature and a heating time which are appropriately selected from the range of a temperature of 70 ° C to 160 ° C and a time of 0.3 to 60 minutes. The heating temperature and the heating time are preferably from 80 ° C to 140 ° C and from 5 to 10 minutes. -36-201107406 Further, the film thickness of the film formed of the polyester composition for forming a thermosetting film is, for example, 0.1 to 30 μm, and can be appropriately selected in consideration of the step difference, optical properties, and electrical properties of the substrate to be used. The post-baking is generally carried out by a heating temperature selected from the range of 140 ° C to 250 ° C in the range of 5 to 30 minutes on a hot plate and 30 to 90 minutes in an oven. Under the above conditions, by curing the polyester composition for forming a thermosetting film of the present invention, the step of the substrate can be sufficiently flattened, and a cured film having high transparency can be formed. The cured film thus formed can be used as a liquid crystal material alignment layer by the rubbing treatment, in other words, the function of the layer having the liquid crystal compound alignment can be generally carried out using a rotation speed of 300 to 1,000 rpm. The speed is 3~200mm/sec, and the amount of pushing is 0.1~lmm. Thereafter, it is washed with ultrasonic waves using pure water or the like to remove the residue generated by rubbing. After the phase difference material is applied onto the liquid crystal alignment layer thus formed, the phase difference material is photocured in a liquid crystal state to form a layer having optical anisotropy. As the phase difference material, for example, a liquid crystal monomer having a polymerizable group or a composition containing the monomer or the like can be used. When the substrate forming the liquid crystal alignment layer is a film, it can be used as an optically anisotropic film. Further, the two substrates having the liquid crystal alignment layer formed as described above are bonded to each other by a spacer, and the liquid crystal alignment layers are opposed to each other, and liquid crystal is injected between the substrates to form a liquid crystal alignment. Liquid crystal display element. Therefore, the polyester composition for forming a thermosetting film of the present invention can be applied to various optical anisotropic films and liquid crystal display elements. Further, since the polyester composition for forming a thermosetting film of the present invention has at least a required level of flatness, it can be used as a display for forming a thin film transistor (TFT) type liquid crystal display element or an organic EL element. The use of a material for a cured film such as a protective film, a flattening film, or an insulating film is particularly suitable as a material for forming a color filter, a layered insulating film for a TFT liquid crystal element, and an insulating film for an organic EL element. . [Embodiment] [Examples] Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited to the examples. [Abbreviation used in the examples] The meanings of the abbreviations used in the following examples are as follows. &lt;Polyester polymer raw material&gt; HBPDA: 3,3'-4,4'-dicyclohexyltetracarboxylic dianhydride THPA: 1,2,5,6-tetrahydrophthalic anhydride BPDA: biphenyltetracarboxylic acid Dihydride HBPA: hydrogenated bisphenol a -38- 201107406 BTEAC : benzyltriethylammonium chloride &lt;amino acid-containing carboxylic acid compound raw material&gt; HBPDA: 3,3'-4,4'-dicyclohexyltetradecanoic acid Dihydride CBDA: cyclohexane tetracarboxylic dianhydride THPA : 1,2,5,6-tetrahydrophthalic anhydride DA-4P : 1,3-bis(4-aminophenyl)benzene DDS : 4,4' -diaminodiphenyl milling &lt;polyimine precursor raw material&gt; CBDA: 1,2,4,5-cyclohexanetetracarboxylic dianhydride pDA: p-phenylenediamine &lt;acrylic acid copolymer raw material &gt; MAA : Methacrylic acid MMA : Methyl methacrylate HEM A : 2-hydroxyethyl methacrylate CHMI : N-cyclohexyl maleimide AIBN : azobisisobutyronitrile &lt;epoxy compound &gt; CEL : Daicel Chemical Industry Co., Ltd. Celoxide P-2021 (product name) (Compound name: 3,4-epoxycyclohexenylmethyl-3', 4'-epoxycyclohexene carboxylate Acid ester) -39- 201107406 &lt;Bismaleimide compound> 6?411::^_&gt;1'-(3,3-diethyl-5,5-dimethyl -4,4 methane bismaleimide 1 &lt;solvent&gt; PGMEA: propylene glycol monomethyl ether acetate PGME: propylene glycol monomethyl ether DMAc : N,N-dimethylacetamide NMP : N-A Based on the following examples, the number average molecular weight and weight average molecular weight of the polyester polymer, polyimine, and acrylic copolymer obtained by the following synthesis examples are determined by the GPC device (Shodex (Registry) Columns KF8 03 L and KF804L) were measured by stripping the elution solvent tetrahydrofuran 1 ml/min in a column (column temperature 40 ° C). Further, the following number average molecular weight (hereinafter referred to as Μη) average molecular weight (below) Mw) is expressed in terms of polystyrene. <Synthesis Example 1> By making HBPDA 12.0 g, HBPA 10.2 g, and THPA BTEAC 0.22 g in PGMEA 54.48 g, 120. Reaction 19 gives a polyester polymer solution. (solid content concentration: 3 0.0% by mass) The obtained polyester polymer had an Mn of 2,280 'Mw of 4,200. The amount of the diphenyl precursor was measured by flow rate and weight. 0.95 g 'hour, (P1) -40 - 201107406 &lt;Synthesis Example 2&gt; 14.6 g of DA-4P was dissolved in 40.68 g of DMAc, and after cooling with water, it was maintained at 23 °C. This solution was reacted with CBDA 4.90 g and THPA 7.60 g at 233⁄4 for 24 hours to obtain an amino group-containing carboxylic acid compound solution (solid content concentration: 40% by mass) (A1). &lt;Synthesis Example 3&gt; 4.97 g of DDS was dissolved in 14.95 g of DMAc, and after cooling with water, it was kept at 23 °C. This solution was reacted with CBDA 1.96 g and THPA 3.04 g at 23 ° C for 24 hours to obtain an amino group-containing carboxylic acid compound solution (solid content concentration: 40.0% by mass) (A2). &lt;Synthesis Example 4&gt;

將DA-4P 14.61g溶解於DMAc 41.82g後,經水冷後 保持 23 °C。此溶液與 HBPDA 7.66g、THPA 7.60g 在 23 °C 下反應24小時得到含胺基羧酸化合物溶液(固形分濃度 4 0.0 質量 % ) ( A 3 )。 &lt;合成例5&gt; 藉由使 BPDA 40.0g ' HBPA 3 5.3 g、THP A 3.3 1 g、 BTEAC 0.77g 在 PGMEA 175_7g 中以 120。(:反應 19 小時, 得到聚酯聚合物溶液(固形分濃度:3 0.0質量% ) ( P2 ) 。所得之聚酯聚合物的Μη爲1,100、Mw爲2,580。 201107406 &lt;合成例6&gt; 藉由使 CBDA 17.7g、pDA 10.2g 在 NMP 66.4g 中以 23 °C反應24小時得到聚醯亞胺前驅體溶液(固形分濃度 :30.0質量% ) ( P3 )。所得之聚醯亞胺前驅體的Μη爲 5,800 ' Mw 爲 1 2,500。 &lt;合成例 使用 MAA 10.9g、CHMI 35.3g、HEMA 25.5g、MMA 28.3g作爲單體成分,使用AIBN 5g作爲自由基聚合起始 劑,將此等在溶劑PGMEA 1 50g中以溫度60°C~1 〇〇°C進行 聚合反應,得到丙烯酸共聚物溶液(固形分濃度:40.0質 量% ) ( P4 )。所得之丙烯酸共聚物溶液的Μη爲3800, M w 爲 6 7 0 0。 &lt;實施例1〜實施例6及比較例1~比較例4&gt; 以表1所示之組成調製實施例1〜實施例6及比較例 1〜比較例4之各組成物,對於各組成物進行平坦化性、耐 溶劑性、透過率及配向性之評價。 -42- 201107406 [表1] (A)成 f (B戚分 (C)成分 (D诚分 溶劑 之溶液(g) (g) (g) (g) (g) P1 CEL A1 PGME 實施例1 _ 20 1. 2 3. 0 9_ 4 實施例2 P1 CEL A1 PGME 20 1. 2 5. 0 10. 6 P1 CEL A1 PGME 實施例3 — 20 1. 2 7. 5 12. 1 實施例4 P1 CEL A1 BMI1 PGME 20 1. 2 3. 0 0· 6 11. 9 P1 CEL A2 PGME 實施例5 — 20 1. 2 5. 0 10. 6 P1 CEL A3 PGME 實施例6 一 20 1. 2 5. 0 10. 6 P2 CEL PGMEA 比較例1 — — 20 1. 2 7. 09 P1 PGMEA 比較例2 _ — 20 2. 22 P3 CEL NMP 比較例3 20 1. 2 2. 97 P4 CEL PGMEA 比較例4 20 1. 2 2. 80 ※卩^朽:聚酯聚合物溶液、P3 :聚醯亞胺前驅體溶液' P4 :丙烯酸共聚合物溶液 [平坦化性之評價] 將實施例1〜實施例6及比較例1 ~比較例4之各組成 物使用旋塗器塗佈於高度0.5 μιη、線寬ΙΟμιη、線間距 5 0 μιη之段差基板(玻璃製)上後,以溫度1 0 0 °C、1 2 0秒 在加熱板上進行預烘烤,形成膜厚2.8 μιη的塗膜。膜厚係 使用 FILMETRICS公司製 F20測定。將此塗膜以溫度 2 3 0°C加熱30分鐘進行後烘烤,形成膜厚2.5μηι的硬化膜 測定段差基板生產線上之塗膜與間隙上之塗膜的膜厚 差(參照圖1),使用平坦化率(DOP) =l〇〇x[l-{塗膜之 -43- 201107406 膜厚差(μιη) /段差基板之高度(0.5μιη) }]的式子求得平 坦化率。 [耐溶劑性之評價] 將實施例卜實施例6及比較例I〜比較例4之各組成 物使用旋塗器塗佈於矽晶圓後,以溫度l〇〇°C、120秒在 加熱板上進行預烘烤,形成膜厚2.8 μιη之塗膜。膜厚係使 用FILMETRICS公司製F20而測定。此塗膜以溫度230°C 、30分鐘於加熱板上進行後烘烤,形成膜厚2.5μιη之硬 化膜。 將此硬化膜浸漬於PGMEA或ΝΜΡ中60秒後,分別 以溫度l〇〇°C乾燥60秒鐘,測定膜厚。以PGMEA或ΝΜΡ 浸漬後無膜厚變化者評價爲〇,於浸漬後可看到膜厚的減 少者評價爲X。 [光透過率(透明性)之評價] 將實施例1~實施例6及比較例1〜比較例4之各組成 物使用旋塗器塗佈於石英基板上後,以溫度100 °C、120 秒在加熱板上進行預烘烤,形成膜厚2.8 μιη之塗膜。膜厚 係使用FILMETRICS公司製F20測定。藉由此塗膜以溫度 2 3 0°C、30分鐘於加熱板上進行後烘烤,形成硬化膜。 此硬化膜使用紫外線可見光分光光度計((股)島津 製作製SHIMADSU UV-2550型號)測定波長400nm時之 透過率。 -44 - 201107406 [配向性之評價] 將實施例1 ~實施例6及比較例1〜比較例4之各組成 物使用旋塗器塗佈於ITO基板上後,以溫度l〇〇°C、120 秒在加熱板上進行預烘烤,形成膜厚2.8μιη之塗膜。膜厚 係使用FILMETRICS公司製F20測定。此膜以溫度230°C 、30分鐘於加熱板上進行後烘烤,形成硬化膜。14.61 g of DA-4P was dissolved in 41.82 g of DMAc, and after cooling with water, it was kept at 23 °C. This solution was reacted with HBPDA 7.66 g and THPA 7.60 g at 23 ° C for 24 hours to obtain an amino group-containing carboxylic acid compound solution (solid content concentration 4 0.0 mass %) (A 3 ). &lt;Synthesis Example 5&gt; By BPDA 40.0 g 'HBPA 3 5.3 g, THP A 3.3 1 g, BTEAC 0.77 g was 120 in PGMEA 175_7g. (: The reaction was carried out for 19 hours to obtain a polyester polymer solution (solid content concentration: 30.0% by mass) (P2). The obtained polyester polymer had Μη of 1,100 and Mw of 2,580. 201107406 &lt;Synthesis Example 6&gt; A polybendimide precursor solution (solid content concentration: 30.0% by mass) (P3) was obtained by reacting CBDA 17.7 g and pDA 10.2 g in NMP 66.4 g at 23 ° C for 24 hours. The resulting polyimine precursor was obtained. The body has a Μη of 5,800 'Mw of 1,2,500. &lt;Synthesis Example: MAA 10.9g, CHMI 35.3g, HEMA 25.5g, MMA 28.3g were used as monomer components, and AIBN 5g was used as a radical polymerization initiator. The polymerization reaction was carried out at a temperature of 60 ° C to 1 ° C in a solvent PGMEA 1 50 g to obtain an acrylic copolymer solution (solid content concentration: 40.0% by mass) (P4). The obtained copolymer copolymer solution had a Tn of 3,800. M w was 6 7 0 0. &lt;Example 1 to Example 6 and Comparative Example 1 to Comparative Example 4&gt; Examples 1 to 6 and Comparative Examples 1 to 4 were prepared in the compositions shown in Table 1. For each composition, planarization, solvent resistance, transmittance, and alignment are performed for each composition. -42- 201107406 [Table 1] (A) into f (B part (C) component (D solution of solvent (g) (g) (g) (g) (g) P1 CEL A1 PGME implementation Example 1 _ 20 1. 2 3. 0 9_ 4 Example 2 P1 CEL A1 PGME 20 1. 2 5. 0 10. 6 P1 CEL A1 PGME Example 3 - 20 1. 2 7. 5 12. 1 Example 4 P1 CEL A1 BMI1 PGME 20 1. 2 3. 0 0·6 11. 9 P1 CEL A2 PGME Example 5 - 20 1. 2 5. 0 10. 6 P1 CEL A3 PGME Example 6 A 20 1. 2 5. 0 10. 6 P2 CEL PGMEA Comparative Example 1 — — 20 1. 2 7. 09 P1 PGMEA Comparative Example 2 _ — 20 2. 22 P3 CEL NMP Comparative Example 3 20 1. 2 2. 97 P4 CEL PGMEA Comparative Example 4 20 1. 2 2. 80 * 卩 朽 :: polyester polymer solution, P3: polyimine precursor solution 'P4: acrylic copolymer solution [evaluation of planarization] Examples 1 to 6 and Each of the compositions of Comparative Example 1 to Comparative Example 4 was applied onto a stepped substrate (made of glass) having a height of 0.5 μm, a line width of ΙΟμηη, and a line pitch of 50 μm using a spin coater at a temperature of 1 0 0 ° C, 1 . 20 seconds in heating The pre-baked to form a coating film of a thickness of 2.8 μιη. The film thickness was measured using F20 manufactured by FILMETRICS. The coating film was heated at a temperature of 230 ° C for 30 minutes and post-baked to form a cured film having a film thickness of 2.5 μm to measure the film thickness difference between the coating film on the step substrate production line and the coating film on the gap (see FIG. 1 ). The flattening ratio was determined by the formula of the flattening ratio (DOP) = l〇〇x [l-{coating film -43-201107406 film thickness difference (μιη) / step substrate height (0.5 μιη) }]. [Evaluation of Solvent Resistance] Each of the compositions of Example 6 and Comparative Examples 1 to 4 was applied to a ruthenium wafer using a spin coater, and then heated at a temperature of 10 ° C for 120 seconds. The plate was prebaked to form a coating film having a film thickness of 2.8 μm. The film thickness was measured using F20 manufactured by FILMETRICS. This coating film was post-baked on a hot plate at a temperature of 230 ° C for 30 minutes to form a hard film having a film thickness of 2.5 μm. The cured film was immersed in PGMEA or mash for 60 seconds, and then dried at a temperature of 10 ° C for 60 seconds, and the film thickness was measured. The change in the film thickness after impregnation with PGMEA or hydrazine was evaluated as 〇, and the decrease in film thickness after immersion was evaluated as X. [Evaluation of Light Transmittance (Transparency)] Each of the compositions of Examples 1 to 6 and Comparative Examples 1 to 4 was applied onto a quartz substrate using a spin coater at a temperature of 100 ° C and 120 ° The second was pre-baked on a hot plate to form a coating film having a film thickness of 2.8 μm. The film thickness was measured using F20 manufactured by FILMETRICS. The film was post-baked on a hot plate at a temperature of 2 30 ° C for 30 minutes to form a cured film. The cured film was measured for transmittance at a wavelength of 400 nm using an ultraviolet-visible spectrophotometer (SHIMADSU UV-2550 model manufactured by Shimadzu Corporation). -44 - 201107406 [Evaluation of the alignment property] Each of the compositions of Examples 1 to 6 and Comparative Examples 1 to 4 was applied onto an ITO substrate using a spin coater at a temperature of 10 ° C, The film was pre-baked on a hot plate for 120 seconds to form a coating film having a film thickness of 2.8 μm. The film thickness was measured using F20 manufactured by FILMETRICS. The film was post-baked on a hot plate at a temperature of 230 ° C for 30 minutes to form a cured film.

將此硬化膜以旋轉速度300rpm、輸送速度10mm/秒 ,押入量0.45mm進行擦摩處理。擦摩處理後的基板以純 水超音波洗淨5分鐘。使用旋塗器將由液晶單體所構成之 相位差材料塗佈於此基板上後,以1〇〇°C40秒、55°C30秒 在加熱板上進行預烘烤,形成膜厚1.1 μπι之塗膜。將此基 板再氮氣氛下以2000m J曝光。將製作的基板以偏光板挾 著,以目視確認配向性。使基板傾斜45度時與不傾斜時 ,光之透過性有明顯變化者評價爲〇,未變化者評價爲XThis cured film was subjected to rubbing treatment at a rotation speed of 300 rpm, a conveyance speed of 10 mm/sec, and a pushing amount of 0.45 mm. The rubbed substrate was washed with pure water for 5 minutes. After the phase difference material composed of the liquid crystal monomer is coated on the substrate by using a spinner, it is prebaked on a hot plate at 40° C. for 30 seconds and 55° C. for 30 seconds to form a film having a film thickness of 1.1 μm. membrane. This substrate was exposed to 2000 m J under a nitrogen atmosphere. The produced substrate was rubbed with a polarizing plate to visually confirm the alignment. When the substrate was tilted at 45 degrees or not, the light transmittance was significantly changed as 〇, and the unchanged was evaluated as X.

[耐熱性之評價] 使實施例實施例6及比較例1〜比較例4之各組成 物使用旋塗器塗佈於石英基板上後,以溫度100°C、120 秒在加熱板上進行預烘烤後,以溫度2 3 0 °C、3 0分鐘在加 熱板上進行後烘烤,形成硬化膜,膜厚係使用 FILMETRICS公司製F20測定。其後再將硬化膜以溫度 2 3 0 °C、6 0分鐘在加熱板上燒成,再度測定膜厚,算出從 後烘烤之膜厚的變化率。 -45- 201107406 [評價結果] 將以上評價後的結果,如下表2所示。 [表2] 平坦化率(%) 溶劑耐性 配向性 耐熱性 透過率 PGMEA NMP (%) (%) 實施例1 82 〇 〇 〇 -1 93 實施例2 80 〇 〇 〇 -1 90 實施例3 75 〇 〇 〇 -2 88 實施例4 84 〇 〇 〇 -2 90 實施例5 74 〇 〇 〇 -2 89 實施例6 76 〇 〇 〇 -3 90 比較例1 80 〇 〇 〇 -15 96 比較例2 — X X — — — 比較例3 25 〇 〇 〇 -3 85 比較例4 88 〇 〇 X -0. 5 96 實施例1〜實施例6係平坦化率、耐熱性高,對於 PGMEA ' NMP之任一者均有耐溶劑性。又,任一者均顯 示良好的配向性,高溫燒成後亦達成高的透過率(透明性 )° 又,比較例1係耐溶劑性、配向性、平坦化率良好, 但耐熱性非常低。 另外,比較例2未形成硬化膜。 比較例3係耐溶劑性、耐熱性及配向性良好’但平坦 化率非常低。 比較例4係平坦化率、耐熱性、耐溶劑性及透過率良 好,但配向性差。 -46- 201107406 如上述’本發明之熱硬化膜形成用聚酯組成物係硬化 膜形成時,可使用丙二醇單甲醚乙酸酯等之甘醇系溶劑, 而且所得之硬化膜可得到優異之光透過性、耐溶劑性、平 坦化性及配向性之任一性能均良好的結果。 [專利文獻] [專利文獻1]特開2000- 1 03 93 7號公報 [專利文獻2]特開2000- 1 1 9472號公報 [專利文獻3]特開2005-03 7920號公報 【圖式簡單說明】 [圖1]圖1係表示於段差基板上塗佈本發明之熱硬化 膜形成用聚酯組成物時所形成之硬化膜的模式圖0 [圖2]圖2係表示藉由習知技術形成液晶配向膜之液 晶胞(a )與使用本發明之熱硬化膜形成用聚酯組成物形 成平坦化膜之液晶胞(b )對比的模式圖。 -47-[Evaluation of heat resistance] Each of the compositions of Example 6 and Comparative Examples 1 to 4 was applied onto a quartz substrate using a spin coater, and then preliminarily heated on a hot plate at a temperature of 100 ° C for 120 seconds. After baking, post-baking was performed on a hot plate at a temperature of 2 30 ° C for 30 minutes to form a cured film, and the film thickness was measured using F20 manufactured by FILMETRICS. Thereafter, the cured film was fired on a hot plate at a temperature of 2 30 ° C for 60 minutes, and the film thickness was measured again to calculate the rate of change in film thickness from the post-baking. -45- 201107406 [Evaluation results] The results of the above evaluations are shown in Table 2 below. [Table 2] Flattening ratio (%) Solvent resistance Alignment heat resistance transmittance PGMEA NMP (%) (%) Example 1 82 〇〇〇-1 93 Example 2 80 〇〇〇-1 90 Example 3 75 〇〇〇-2 88 Example 4 84 〇〇〇-2 90 Example 5 74 〇〇〇-2 89 Example 6 76 〇〇〇-3 90 Comparative Example 1 80 〇〇〇-15 96 Comparative Example 2 — XX — — — Comparative Example 3 25 〇〇〇-3 85 Comparative Example 4 88 〇〇X -0. 5 96 Examples 1 to 6 are high in flattening ratio and heat resistance, and are suitable for any of PGMEA 'NMP All have solvent resistance. In addition, both of them exhibited good alignment properties, and high transmittance (transparency) was also achieved after high-temperature firing. Further, in Comparative Example 1, the solvent resistance, the alignment property, and the flattening ratio were good, but the heat resistance was extremely low. . Further, in Comparative Example 2, a cured film was not formed. In Comparative Example 3, solvent resistance, heat resistance and alignment were good, but the flattening ratio was extremely low. In Comparative Example 4, the flatness ratio, heat resistance, solvent resistance, and transmittance were good, but the alignment property was poor. -46-201107406 When the polyester composition for forming a thermosetting film of the present invention is formed into a cured film, a glycol solvent such as propylene glycol monomethyl ether acetate can be used, and the obtained cured film can be excellent. Any of the properties of light transmittance, solvent resistance, planarization, and alignment property was good. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2000- 1 No. [Fig. 1] Fig. 1 is a schematic view showing a cured film formed by coating a polyester composition for forming a thermosetting film of the present invention on a step substrate. [Fig. 2] Fig. 2 shows a conventional example. A pattern in which a liquid crystal cell (a) which forms a liquid crystal alignment film is compared with a liquid crystal cell (b) which forms a planarizing film using the polyester composition for forming a thermosetting film of the present invention. -47-

Claims (1)

201107406 七、申請專利範園: 1. 一種熱硬化膜形成用聚酯組成物,其係含有(A) 成分、(B)成分及(C)成分, (A) 成分:使四羧酸二酐與二醇化合物反應所得之聚酯 、 (B) 成分:具有2個以上之環氧基的環氧化合物、 (C) 成分:使二胺化合物、二羧酸酐及四羧酸二酐反應 所得之含胺基羧酸化合物。 2. 如申請專利範圍第1項之熱硬化膜形成用聚酯組成 物,其中前述(A)成分爲含有以下述式(1)表示之構 造單元的聚酯, 【化1】201107406 VII. Application for Patent Park: 1. A polyester composition for forming a thermosetting film, which comprises (A) component, (B) component and (C) component, (A) component: tetracarboxylic dianhydride A polyester obtained by reacting with a diol compound, (B) component: an epoxy compound having two or more epoxy groups, and (C) a component obtained by reacting a diamine compound, a dicarboxylic acid anhydride, and a tetracarboxylic dianhydride. An amino group-containing carboxylic acid compound. 2. The polyester composition for forming a thermosetting film according to the first aspect of the invention, wherein the component (A) is a polyester containing a structural unit represented by the following formula (1), [Chemical Formula 1] (式中,A係表示於脂環式基或脂肪族基上有4個連結鍵 結合的4價有機基,B係表示於脂環式基或脂肪族基上有 2個連結鍵結合的2價有機基)。 3.如申請專利範圍第1或2項之熱硬化膜形成用聚酯 組成物,其中前述(A)成分係使以下述式(i)表示之四 羧酸二酐與以式(ii)表示之二醇化合物反應所得之聚酯 -48 - 201107406(In the formula, A represents a tetravalent organic group having four bonding bonds bonded to an alicyclic group or an aliphatic group, and B represents two bonding bonds bonded to an alicyclic group or an aliphatic group. Price organic basis). 3. The polyester composition for forming a thermosetting film according to the first or second aspect of the invention, wherein the component (A) is a tetracarboxylic dianhydride represented by the following formula (i) and represented by the formula (ii) Polyester obtained by the reaction of the diol compound -48 - 201107406 。⑴ ΗΟ-Β-ΟΗ (ϋ) (式中’ A係表示於脂環式基或脂肪族基上有4個連結鍵 結合之4價有機基,b係表示於脂環式基或脂肪族基上有 2個連結鍵結合之2價有機基)。 4·Μ Φ請專利範圍第2或3項之熱硬化膜形成用聚酯 組成物’其中前述式(1)中,Α係表示由下述式(Α-1) 〜式(A-8)表示之基選出之至少一種的基,b係表示由下 述式(B-1)〜式(b_5)表示之基選出之至少一種的基. (1) ΗΟ-Β-ΟΗ (ϋ) (wherein A is a tetravalent organic group having four bonding bonds bonded to an alicyclic group or an aliphatic group, and b is represented by an alicyclic group or an aliphatic group. There are two linked-bonded divalent organic groups). 4·Μ ΦPlease refer to the polyester composition for forming a thermosetting film of the second or third aspect of the patent. In the above formula (1), the lanthanoid series is represented by the following formula (Α-1) to (A-8). A group in which at least one selected from the group is selected, and b represents a group selected from at least one of the groups represented by the following formulas (B-1) to (b-5) 5.如申請專利範圍第丨〜4項中任—項之熱硬化膜形成 用聚酯組成物,其中(A)成分之聚酯的重量平均分子量 爲以聚苯乙烯換算爲1〇〇〇〜30000。 6 .如申請專利範圍第1 ~ 5項中任一項之熱硬化膜形成 用聚酯組成物,其中(C)成分爲相對於四羧酸二酐1莫 201107406 耳’使二胺化合物2莫耳與二羧酸酐2莫耳反應所得之含 胺基羧酸化合物。 7_如申請專利範圍第1〜5項中任一項之熱硬化膜形成 用聚酯組成物,其中(C)成分爲使下述式(iii) 、( iv )及(v)表示之化合物反應所得之含胺基殘酸化合物 【化5】5. The polyester composition for forming a thermosetting film according to any one of the above-mentioned claims, wherein the weight average molecular weight of the polyester of the component (A) is 1 〇〇〇 in terms of polystyrene. 30000. 6. The polyester composition for forming a thermosetting film according to any one of claims 1 to 5, wherein the component (C) is a diamine compound 2 with respect to the tetracarboxylic dianhydride 1 Mo 201107406 ear The amine-containing carboxylic acid compound obtained by reacting the ear with a dicarboxylic anhydride 2 molar. The polyester composition for forming a thermosetting film according to any one of claims 1 to 5, wherein the component (C) is a compound represented by the following formulas (iii), (iv) and (v) Reaction-containing amine-containing residual acid compound [Chemical 5] h2n-p-nh2 (上述式(iii)及(iv)中’ P及Q係分別獨立表示2價 有機基,式(v)中,Z係表示4價有機基)。 8.如申請專利範圍第1~7項中任一項之熱硬化膜形成 用聚酯組成物,其中基於(A)成分之1〇〇質量份,含有 3~50質量份之(B)成分、5〜80質量份之(C)成分。 9_如申請專利範圍第1~8項中任一項之熱硬化膜形成 用聚酯組成物,其係進一步含有雙馬來醯亞胺化合物作爲 (D)成分》 10. 如申請專利範圍第9項之熱硬化膜形成用聚酯組 成物,其中基於(A)成分之100質量份,含有0.5〜50質 量份之(D)成分。 11. 一種硬化膜,其特徵係使用如申請專利範圍第 1〜1 〇項中任一項之熱硬化膜形成用聚酯組成物所得。 1 2 .—種液晶配向層,其特徵係使用如申請專利範圍 -50- 201107406 第1〜10項中任一項之熱硬化膜形成用聚酯組成物所得 -51 -H2n-p-nh2 (In the above formulas (iii) and (iv), the 'P and Q systems independently represent a divalent organic group, and in the formula (v), the Z system represents a tetravalent organic group). The polyester composition for forming a thermosetting film according to any one of claims 1 to 7, which contains 3 to 50 parts by mass of the component (B) based on 1 part by mass of the component (A). 5 to 80 parts by mass of the component (C). The polyester composition for forming a thermosetting film according to any one of claims 1 to 8, which further comprises a bismaleimide compound as the component (D). A polyester composition for forming a thermosetting film of the ninth aspect, which contains 0.5 to 50 parts by mass of the component (D) based on 100 parts by mass of the component (A). A cured film obtained by using the polyester composition for forming a thermosetting film according to any one of claims 1 to 1. The liquid crystal alignment layer is characterized in that it is obtained by using a polyester composition for forming a thermosetting film according to any one of claims 1 to 10 to 2011-07406.
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