TW201105921A - Thermal conducting principle and device for prestressed clamping type multi-layered structure - Google Patents

Abstract

The present invention discloses that the relay thermal conductor being made of material having better thermal conductivity coefficient is heat transfer coupled with the heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof, wherein the interface thermal conductor having higher specific heat capacity is the heat transfer carrier between relay thermal conductor and second thermal body.

Description

201105921 VI. Description of the Invention: [Technical Field] The present invention is a relay heat conductor having a better heat transfer coefficient, and a unit heat capacity value or an emissivity (emissivity) or at least one of them is superior to relay The interface heat conductor of the heat conductor is configured to form a temperature-conducting structure or a heat-dissipating structure with at least two layers of a pre-stressed package in a specific combination type, thereby improving the heat transfer performance and avoiding the same layer material. The expansion coefficient causes looseness or deformation, resulting in poor bonding of the heat conduction surface and is not conducive to heat conduction.

[Prior Art] The traditional heat dissipating structure usually consists of a single-material thermoelectric conduction structure, which is used as a cooling source or a heat source for the first-temperature, and can be cooled or heated in a closed space to cover the entire area. In addition to hot material contact, it is often the gambling #combined to the heating conduction device - the smaller heat conduction area, for example, as the source of the first - temperature body, ^ for the central processing of the computer, H heat energy, or power semiconductor heat loss Thermal energy, or: light diode (_ heat loss heat energy, when borrowing the above-mentioned warm energy conduction structure or scattered south: structure for heat dissipation (4), if the warm energy structure structure is subtracted from the structure early: material system In addition, even if the heat conduction of the single-material itself is better, the single seven=value is usually not necessarily optimal, for example, the heat sink made of a medium scale, or the power semi-finished=light-emitting diode, the weight thereof. Heavier and more expensive, the heat transfer coefficient is good - the early heat capacity is like hot fine green (emissivity, (4) such as (8) is lower than Shao; single (four) capacity value of heat radiation (discharge, (9) match 2: material' its weight is better For those who are lighter and lower in price, for example, the slings* The light-radiation coefficient (emissivity, (10) to (4)) Although: the heat conductivity coefficient of the material itself is lower than that of the copper material, the temperature is used to make the temperature energy meter __, in addition, the amount of money to avoid complex, The material is loose or deformed due to different thermal expansion, causing the heat conduction surface junction 201105921 to be unsuitable for heat conduction. [Inventive content] The thermal conductivity principle and device of the multi-layer structure with pre-load loss are different. The temperature of the composite layer =

= "The structure is made of material" - (4) constitutes the structure of the energy structure or the bulk structure of the material. The principle and device of the thermal conductivity of the multi-layer structure with pre-clamping is to use a material with a good conductivity coefficient. Following the heat conductor, the end or face of the relay heat conductor is used for heat transfer or heat transfer, and the other end or face of the relay heat conductor is coupled with the interface heat conductor. The interface thermal conductor has (1) a higher unit heat capacity value relative to the relay heat conductor' or (2) a better thermal emissivity (emissivity) relative to the relay heat conductor to the second warm energy body. The two heat conduction characteristics, or at least one of them is better than the heat conduction characteristics of the relay heat conductor, as the heat conduction carrier between the relay heat conductor and the second temperature body; when the first temperature body and the second temperature energy A temperature difference between the bodies may be advantageous for conducting the temperature. The further feature of the present invention is that a pre-clamp-like combination structure between the structural layers is used to reduce the volume, and a pre-force gap (50 〇) is provided for generation. Pre-stress of the double or outer support to ensure a good guide Contacts, and to avoid the multi-layer structure material due to different thermal expansion coefficients cause loosening or deformation, resulting in poor heat conduction surface binding are not conducive to heat transfer. [Embodiment] The present invention is a material having a relatively good heat conduction property with a first warm energy body as a relay heat conductor for non-closed temperature energy conduction coupling with the first warm energy body, and Between the heat conductor and the second warm energy body, an interface heat conductor is provided for engaging with the second warm energy body and the relay heat conductor to conduct the temperature between the two, and the interface heat conductor has (1) relative The relay thermal conductor has a higher unit heat capacity value, or (2) has a better thermal emissivity (emissivity) with respect to the relay thermal conductor to the second warm energy body, of which two or more of 201105921 One of the green private ^, the species is better than the thermal conduction characteristics of the relay thermal conductor, as a relay heat conductor and the thermal conductor between the skirt and the first warm energy body, and avoid == the same thermal expansion coefficient caused by loose Or deformation, causing poor heat conduction 而不 s is not conducive to heat conduction. The structure of the thermal conductivity principle and the device of the multi-layer structure with pre-load loss is as shown in Fig. 1. The heat conduction peripheral of the heat-dissipating end or the heat-absorbing end of the heat pipe of the present invention is the first-temperature body. The pre-stressed package is combined with the structural schematic diagram, and its main components include:

The service conductive structure or the heat dissipation structure assembly (100) is composed of at least two layers of thermal conductive materials having different thermal characteristics, wherein the relay heat transfer body (102) having a better heat transfer number (four) is coupled to The first warm energy body (1〇1) has a higher... and a valley interface thermal conductor (103) is disposed between the relay heat conductor (1〇2) and the second warm energy body (104). Further, the temperature-conducting structure or the heat-dissipating structure assembly (1〇〇) is formed; the temperature-conducting structure or the heat-dissipating structure assembly (10 0 ) is provided for the first warm energy body (101) and the first Between the two warm energy bodies (丨04); the temperature-conducting structure or the heat-dissipating structure assembly (丨00) is composed of a relay heat conductor (102) and an interface heat conductor (1〇3), The first warm energy body (101): may be an uncooled solid, or a gaseous, or liquid, or a gelatinous body* or a powdery granule formed by an active chilling or heating thermodynamic body' or passive endothermic Or a warm energy body that releases heat; or a warm energy body composed of a heat-conducting shell from the heat-dissipating end of the heat pipe or a heat-conductive shell of the heat-absorbing end; (102): constituting a relay heat conductor by at least one layer of a solid, or gaseous, or liquid, or gel-like, or powder-like object having a relatively good heat transfer coefficient, relaying one end of the heat conductor (102) or — 201105921 The surface is for contact with the open-heating body (1〇1), and the other end or the other side of the relay heat conductor (102) is for bonding to the interface heat conductor 〇〇3) for temperature energy The conductor, including the first heat energy body (1〇1) and the interface heat conductor (1〇3) formed by the outer shell of the heat-dissipating end of the heat pipe or the heat-conductive outer shell of the heat-absorbing end, is provided with a relay heat conductor (1) 〇 2) for the heat conductor (see Figure i, Figure 2); or the first warm energy body (101) and the interface heat conductor (103) formed by the heat conducting outer casing of the conduit for circulating the warm energy fluid Between, the relay heat conductor (102) is placed as a warm energy conductor (see Figure 3); the thermal conductivity of the relay heat conductor and the first warm energy body (1〇丨) is better than the interface heat conduction Body (103), that is, its heat conduction rate is faster than the interface heat conductor (1〇3), relay heat conductor (102) and interface heat conductor (1) 3) The area of the heat conduction coupling surface is greater than or equal to the area of the heat conduction light junction surface of the relay heat conductor (1〇2) and the first temperature energy body (1〇1); the interface heat conductor (103): It consists of at least one layer of solid, or gaseous, or liquid, or gelatinous or powdery particles, of which the thermal properties of the material (1) unit heat capacity value or (2) and the second warm energy body (1)热4) The thermal emissivity (emissivity, emiSsivity), the thermal conductivity of the above two or one of them is better than that of the relay thermal conductor 〇2), and the interface thermal conductor (1〇3) is provided for relay heat conduction. The first warm energy body formed between the body (1〇2) and the second warm energy body (1〇4) as a heat conducting conductor comprising a heat conducting outer shell or a heat conducting outer shell of the heat releasing end of the heat pipe (丨〇丨) Set the relay heat conductor (102) in the pre-clamping package ' and set the interface heat conductor (1〇3) to the relay heat conductor (102) and the second warm body (1〇4) Between the heat conductors (see Figure 1, Figure 2); or the first warm energy body (1〇1) for the heat-conducting casing of the conduit for the circulation of warm energy fluid Following the heat conductor (1〇2), and the interface heat conductor (103) is disposed between the relay heat conductor (1〇2) and the second warm energy body (1〇4) 201105921 as a warm energy conductor ( Referring to FIG. 3); the area of the heat conduction coupling surface of the interface heat conductor (103) and the second temperature body (104) is greater than or equal to the heat conduction coupling between the relay heat conductor (102) and the interface heat conductor (1〇3). The area of the surface; between the above structural layers is a pre-clamp-like joint structure to reduce the volume and the pre-force gap with the pre-force gap (500) for generating a brace or outer bracing Ensure good thermal contact, and avoid loose or deformed composite materials due to different thermal expansion coefficients, resulting in poor heat transfer surface bonding and φ is not conducive to heat transfer; second warm energy body (104): containing solid state, or gaseous state, or An active cooling or heating thermodynamic body composed of a liquid, or a gel-like object, or a powder-like object or a passive heat-absorbing or heat-releasing body; the multi-layer structure with pre-clamping Thermal conduction principle and device, wherein the first warm energy body (101) and the relay heat conductor (102) a conductive coupling surface, and a heat conduction coupling surface of the interface heat conductor (103) and the second temperature energy body (1〇4), which may be selected as needed; • the first temperature body is lowered by the above specific structure (101) The thermal resistance between the second warm energy body (104). w The thermal conductivity principle and device of the multi-layer structure with pre-clamping, the first warm energy body (101), the relay heat conductor (1〇2), the interface thermal body (1〇3), the first temperature The energy bodies (104) have the following relative relationship: a temperature-conducting structure or a heat-dissipating structure assembly is disposed between the first warm energy body (101) and the second warm energy body (104) (1〇〇) The 'conductor structure or the heat dissipating structure assembly (100) is composed of a heat conductor composed of at least two layers of different thermal characteristics materials, wherein the relay heat conductor (102) is opposite to the interface heat conductor (103) The first warm energy body (101) has a better heat transfer coefficient of 201105921, the relay heat conductor (102) is lightly coupled to the first warm energy body (101), and the interface heat conductor (1) 3) is adapted to engage the relay heat conductor ( 1〇2) Between the second warm energy body (104), the interface heat conductor (103) is (1) has a higher unit heat capacity value relative to the relay heat conductor (102) or (7) is opposite to the relay heat conductor (1Q2) The second thermal energy body π(4) has a relatively good m-emission coefficient (emissivity), that is, the above-mentioned two kinds of interface thermal conductors (103) or the heat conduction characteristics thereof It is better than the relay heat conductor (1〇2); the heat transfer coefficient of the material forming the relay heat conductor (102) is better than the interface φ heat conductor (103); the material constituting the interface heat conductor (103) The heat capacity value or the heat transfer coefficient of the second warm energy body (1 (34), the emissivity of the emissivity, the heat transfer characteristics of the above two or some of them are superior to those of the relay heat conductor (1〇2) The area of the heat conduction coupling surface of the relay heat conductor (102) to the interface heat conductor (103) is greater than or equal to the area of the heat conduction coupling surface between the relay heat conductor (102) and the first temperature energy body (101) To reduce the thermal resistance; - the thermal conduction coupling of the interface thermal conductor (103) to the second warm energy body (104) • the area of the surface is greater than or equal to the relay thermal conductor (102) and the interface thermal conductor • (103) The area of the heat conduction coupling surface, thereby reducing the thermal resistance; in the above structure, when the temperature of the first warm energy body (101) is higher than the second temperature energy body (104), the first temperature energy body (1) 〇1) thermal energy, a small heat transfer surface between the first warm energy body (101) and the relay heat conductor (1〇2) Diffusion heat conduction to the relay heat conduction with good heat transfer coefficient: ((10)' and assist in transmitting temperature energy by at least one of the following functions: (1) relayed heat conductor 〇() 2) and interface heat conduction The larger area of the body ((10)) < heat conduction light junction, the thermal energy is diffused to the interface heat conductor (1G3) with a larger heat capacity value; or (2) by the interface heat conductor (103) with the phase 201105921 A larger area of heat conduction light combined area to the second warm energy body (1) 4) release heat energy ' or (7) with better thermal emissivity (emissivity emissivUy) characteristics of the second warm energy body (1〇4) release heat In the structure, the thermal energy of the second warm energy body q〇4 is lower than the temperature of the first warm energy body (1 〇1). The thermal conductivity of the second temperature energy '胄(1〇4) and the interface thermal conductor (10)) is larger, and the diffusion conducts thermal energy to the interface thermal conductor (103) with a larger heat capacity value. The interface heat conductor (1 () 3) and the relay heat conductor (1) 2) are lightly coupled with each other (6), the area of the heat conduction surface to 'transmit heat energy to the relay 'Reheat (⑽) via a relatively small area of the good thermal conductivity of the thermal relay thermal conductor (102) facing the first conductive light alloys thermal energy body ⑽) released by thermal energy. In the principle and device for the thermal conductivity of the multi-layer structure with pre-clamping, the structure can be further formed into the following structures as needed, including: one if the first warm energy body (101) or the second warm energy hot body (102) Or the interface heat conductor (103) or the second warm energy body (1〇4), at least one of which is in a gaseous state, or a liquid state, or a gelatinous body, or a powdery granular body, the container structure may be provided to provide The structure of the container may be a good conductor or a non-thermal conductor, or a container made of a material having a good heat transfer coefficient and forming a relay heat conductor (102) ' or made of a material having a large heat capacity value. Formed into a container and constitutes the function of the interface heat conductor (103). The principle and device for the thermal conductivity of the multi-layer structure with pre-clamping, wherein the thermal conduction surface and the bonding surface of the relay thermal conductor (102) and the interface thermal conductor (103) can be selected by the following Or more than one type of structure 'including concavo-convex shape for pre-clamping combination, or with 35 tail slots: pre-clamping combination, or Τ-shaped groove type for pre-clamping combination, or column-shaped pre-packing The clip is combined, or is combined with a concave-convex multi-wing for pre-clamping, or combined with its 201105921 heat-conducting surface of the heat-conducting surface to increase the conduction area. The heat-conducting outer casing of the heat-releasing end or the heat-absorbing end of the heat f of the present invention is a schematic diagram of the pre-force-clamping structure of the first warm energy body. FIG. 2 is a top plan view of FIG. 1 . As shown in FIG. 3, the thermal conduction light-conducting surface of the relay heat conductor (1〇2) and the interface thermal conductor (103) and the joint surface of the interface are in a concave-convex shape.

FIG. 4 is a schematic view showing the heat conduction engagement surface and the joint surface of the relay heat conductor (1〇2) and the interface heat conductor (103) according to the present invention. ^ As shown in Fig. 5, in the present invention, the heat conduction coupling surface of the heat conductor (1〇2) and the interface heat conductor (103) and the joint surface are schematic structures of the dovetail shape preloading package. As shown in FIG. 6, the heat conduction coupling surface of the relay heat conductor (1〇2) and the I heat conductor (103) and the joint surface of the present invention are combined with a τ-shaped groove φ丨55丄h dome force. Interface Thermal Conductor Loss Bonding As shown in Fig. 7, the thermal conduction coupling surface and the bonding surface of the relay thermal conductors (ι2) and (103) of the present invention are in the form of a columnar pre-force. As shown in FIG. 8 , the heat conduction coupling surface and the joint surface of the relay heat conductor (1〇2) of the thermal conductor (1〇2) of the present invention are concave and convex, and the L′′, the soldier preload is lost. Schematic. '° The thermal conductivity principle of the multi-layer structure with the pre-loaded double-layer structure is used in the various embodiments. The relay thermal conductor (102) and the interface thermal conductor (1〇ο) '^ can be placed at least one layer of heat conduction. The interlayer (110), which has a multi-layer structure, sighs, and adds the 201105921 thermal loss loss layer (110) to the relay thermal conductor (102) and the interface thermal conductor (1〇3) as follows: - Thermal interlayer ( 110) The unit heat capacity value is greater than the unit heat capacity value of the relay heat conductor (102), and smaller than the unit heat capacity value of the interface heat conductor (1〇3), and the multilayer heat conduction interlayer (110) is used. In the structure, the closer to the thermal conductive interlayer (110) of the relay thermal conductor (102), the smaller the unit heat capacity value, but still greater than the thermal conductor (1〇2); the thermal conductivity of the thermal loss layer O10) The heat transfer coefficient of the intermediate heat conductor (102) is superior to that of the thermal conductive interlayer (11〇), and the closer to the relay heat conduction when the structure is provided with a multilayer thermal interlayer (11〇) The thermal conduction interlayer (11〇) of the body (102) has a better thermal conductivity, but is still slightly inferior to the relay thermal conductor (1). 〇2); the thermal conduction coupling area of the relay thermal conductor (102) and the thermal conduction interlayer (11〇) is larger than the thermal conduction coupling area of the thermal conduction interlayer (110) and the interface thermal conductor (103), and the multilayer thermal conduction interlayer is selectively disposed. (11〇), the thermal conduction coupling area between the interlayers of the interface thermal conductor (103) is the same or larger; if the thermal conductivity central layer (110) is two or more, its thermal characteristics The choice of the medium heat transfer coefficient and the unit heat capacity value, and the coupling area of the heat conduction interlayer (丨丨0) and the heat conduction on both sides are selected from the first warm energy body (101) to the relay heat conductor (102), to The thermal conduction interlayer (110), the thermal conductivity of each layer formed by the combination of the interface thermal conductor (103) and the second thermal energy body (1〇4) are structurally the same or increasing layer by layer; Between the structural layers is a pre-clamp-like joint structure to reduce the volume 'and a pre-stress gap (5 〇〇) for generating a pre-stress of the lap or the outer building to ensure good thermal contact and avoid stratification Structural material due to 201105921 same thermal expansion system Causing loosening or deformation, resulting in thermally conductive junction person who is not conducive to heat transfer. The thermal conduction principle and device of the multi-layer structure with pre-clamping, the thermal conduction and the surface of the thermal conductor (102) and the thermal interlayer (1) 0) can be selected as follows. Or more than one combination = structure, including the concavo-convex shape as the pre-clamp combination, or the combination of the dovetail groove and the T-slot type for pre-clamping, or the hole as the pre-force The clips are combined, or combined with a concave-convex multi-wing for pre-clamping, or combined with other conventional heat-conducting surfaces to increase the conductive surface. The thermal conduction principle and device of the multi-layer structure with pre-clamping, wherein the thermal conductive interlayer (110) and the thermal conduction coupling surface 2 of the interface thermal conductor (103) are combined, and may be selected by the following one or A combination of more than one: the construction method, including the concavo-convex shape, the pre-clamping combination, or the combination of the dovetail-shaped force-type clamping, or the Τ-shaped groove type for the pre-force clamping, or the column-shaped pre-force clamping. Combine, or combine the concave and convex wings for pre-clamping, or combine with other conventional heat-conducting surfaces to increase the conduction area. As shown in FIG. 9, the heat conducting interlayer (11〇) and the relay heat conductor (102) and the interface heat conductor (1〇3) are disposed in the present invention, and the heat conducting shell of the heat pipe or the heat absorbing end of the heat pipe is first. Schematic diagram of the structure of the pre-stressed package of the warm energy body. Figure 10 is a plan view of Figure 9. FIG. 11 is a schematic view showing a heat-conducting coupling surface (11〇) of the present invention, a heat-conducting coupling surface of the relay heat-conducting body (102) and the interface heat-conducting body (103), and a joint structure of a concave-convex shape pre-clamping. As shown in FIG. 12, the thermal conduction interlayer (11〇) of the present invention and the thermal conduction coupling surface and the bonding surface of the relay thermal conductor 12201105921 (102) and the interface thermal conductor (103) are in a pre-packaged joint structure. FIG. 13 is a schematic view showing the structure of the heat-conducting interlayer (11〇) of the present invention, the heat-conducting light-conducting surface of the relay heat-conducting body (102) and the interface heat-conducting body (103), and the joint surface of the joint groove. • As shown in Figure 14, the thermal conduction sandwich layer (11〇) of the present invention and the relay heat conductor body (1〇2) and the interface heat conductor (103) have a heat conduction light junction surface and a joint surface of the τ-type groove type pre-force package. Combined with the structure diagram. _ Figure 15 is a schematic diagram showing the thermal conductive coupling surface of the thermal conductive interlayer (11〇) and the relay thermal conductor (102) and the interface thermal conductor (1〇3) and the joint surface of the thermal column (14〇3) . As shown by the circle 16, the heat conduction coupling surface of the thermal conductive interlayer (ιι) and the relay thermal conductor (102) and the interface thermal conductor (1〇3) and the joint surface are combined with a concave-convex multi-wing pre-clamping structure. . The thermal conduction principle and device of the multi-layer structure with pre-clamping, when two or more layers of thermal conduction interlayers (11〇) are selected, at least two layers of the thermal interlayer (110) and the thermal interlayer (热0) The heat conduction coupling surface and the 纟° mouth surface can be selected as shown in the previous figures 1 to 16 by one or more of the following combined structures, including the concavo-convex shape as the pre-clamp combination. Or, the tail groove shape is used as a pre-clamping combination, or the τ-type groove type is used as a pre-clamping combination, or the hole-column is used as a pre-clamping combination or a concave-convex multi-wing for pre-carrying, or Those who use other conventional heat conduction surfaces as a pre-clamp combination to increase the conduction area. α The thermal conduction principle and device of the multi-layer structure with pre-clamping is the second energy relaying thermal conductor (102), interface thermal conductor (1〇'3), and first-temperature energy body (104) Or, when step-by-step selection is made to set the thermal conductive interlayer (1) 〇), 13 201105921 can be composed of a thermal conductive material or a heat dissipating structural body (1〇〇) which can be combined with the thermal conductive material of the (IV) structure. If it is used to constitute all or part of the thermoelectric conduction structure or the heat dissipation structure assembly (ι). The heat-conducting bodies adjacent to the p-knife are all solid-state bodies, and the adjacent two heat-conducting bodies = the bonding mode 'is a combination of pre-stressed bonds between the structural layers, 1 body 胄' and pre-force gap (500) for generating a clamping or external pre-stress to ensure good thermal contact, and to avoid loosening or deformation of the composite structural material due to the same thermal expansion coefficient, resulting in poor thermal conduction surface bonding is not conducive to heat conduction; and includes the following or One type of the above method is used for surname combination, including: '° 1' plus screw nut lock; or 3' spirally and spiral hole structure mutually screwed together; or, screw % column and spiral hole structure are mutually screwed and set There is a reserved gap (500) 'for pre-stress clamping; or 4 · riveting; or 5 · pressing; or 6. locking deadlock; or 7 · bonding; or 8 · coupling; or 9 · Frictional fusion; or 1 〇·adjacent&gt; @Qiu's thermal conductor is a caster; or 12 of the thermal conductor is made of a coating; or eight..., the conductor and another thermal conductor 'has a fixed fit or Can fit the moving heat conduction structure; or • adjacent > @ 1 &lt; heat conductor is by gravity By binding; ^ or adjacent thereto versed <heat conductor is made of means by magnetic attraction against the pull of the nip 201 105 921 15. The heat conductor adjacent to the cladding structure were combined... In the principle and device of the multi-layer structure thermal conduction with pre-clamping, between the first warm energy body (101) and the relay heat conductor (1〇2); or in the case of providing the thermal conductive interlayer (110) Between the thermal conductor (1〇2) and the thermal conductive interlayer (11〇); or when the multi-layer thermal conductive interlayer (110) is disposed, between the thermal conductive interlayer 1101〇) and the thermal conductive interlayer (110); or its thermal conductive interlayer ( 110) between the interface thermal conductor (1〇3) or between the relay thermal conductor (102) and the interface thermal conductor (103) when the thermal interlayer (110) is not provided; or the interface thermal conductor (1〇3) The heat conduction coupling surface with the second warm energy body (104) may be combined by one or more of the following methods, and the manner of bonding between the adjacent two heat conductors is a pre-package between the structural layers. A sandwich-like combination structure to reduce volume and a pre-force gap (500) for generating a pre-stress of the clamping or bracing to ensure good thermal contact and to avoid loosening or deformation of the composite material due to different coefficients of thermal expansion , causing poor heat transfer surface bonding, which is not conducive to heat conduction, and includes one or more of the following The combination of the modes includes: 1 · screwing with a screw nut; or 2. screwing the spiral column and the spiral hole structure; or 3. screwing the red column and the spiral hole structure together and having a reserve a gap (500) for pre-clamping; or 4. riveting; or 5. pressing; or 6. locking failure; or 7. bonding; or 8. welding; or 9. friction welding; 10. The adjacent heat conductor is a caster; 15 201105921 ιι_ or an adjacent heat conductor is formed by plating; or 12. The adjacent heat conductor and another heat conductor 'have a fixed fit or can be attached a heat transfer structure that is moved; or 13. the adjacent heat conductor is abutting by gravity; or 14. the adjacent heat conductor is abutting by the attraction of the magnet device; or 15_ adjacent heat conduction The body is combined in a coating structure. The heat conductor adjacent to the solid heat conductor is a heat conductor composed of a gaseous state, or a liquid state, or a gel-like object, or a powder-like object, and the heat-transfer mode of the heat-transfer shank surface includes one or the following The above method comprises: 1. transmitting the adjacent gaseous state of the solid heat conductor or the liquid state of the liquid state, or the gelatinous substance or the powdered object; or 2. the liquid fruit or the fan Chestnut moving higher temperature gas, or liquid, or gelatinous or powdery particles, randomly contact with the surface of the solid heat conductor to transmit warm energy to the adjacent solid heat conductor; In the principle and device of the thermal conductivity of the multi-layer structure, if the first warm energy body (101) or the second warm energy body (104) is a heat source of a burning state, the heat conduction mode of the solid body (101) or the adjacent solid heat-conducting structure includes: The heating surface of the solid heat conductor transmits the warm energy of the heating element adjacent to the combustion state. Fig. 17 is a schematic view showing an application example of a cooker for transmitting a heat-generating surface of a relay heat conductor (1〇2) to an adjacent combustion-like heat generating body. In the principle and device of the multi-layer structure thermal conduction with pre-clamping, if the first warm energy body (101) is in a gaseous state, or a liquid state, or a gel-like object, or a powder-like object, the heat conduction mode thereof includes : manpower, or electric power, or force to drive the dialing mechanism to move the glue or powder object to randomly transfer the temperature of the rubber 201105921 object or powder object to the adjacent ul heat conductor. .

The thermal conduction principle and device of the multi-layer structure with pre-clamping, the heat conduction between the interface thermal conductor (103) and the second warm energy body (1〇4) includes Y - in the second warm energy body (104) is a solid-state heat-receiving body, and the heat-conducting coupling surface of the interface heat-conducting body (103) in the solid state 3 can be combined by the following - i - - upper manner, and the bonding manner between the adjacent two heat conducting bodies is A pre-clamp-like joint structure between the structural layers is used to reduce the volume and the pre-force gap (500) for generating a pre-stress of the brace or the outer brace to ensure good thermal contact, to avoid The composite structural material has different thermal expansion coefficients: it is loose or deformed, resulting in poor heat conduction surface bonding and is not conducive to heat conduction, and is combined with one or more of the following methods, including: 1 · plus screw nut lock; or 2 Having a spiral column and a spiral hole structure mutually screwed together; or 3. a spiral column and a spiral hole structure are mutually screwed together, and a reserved slit (500) is provided for pre-force clamping; or 4. riveting; or 5. Press fit; or 6. Lock the clip; or 7 · Bond, or 8 · Know fit; or 9 · frictional fusion; or 10. the second warm energy body (104) is a caster; or 11. the second warm energy body (104) is formed by plating on the interface thermal conductor (1〇3); or 12. Between the second warm energy body (104) and the interface heat conductor (1〇3), having a solid-state bonded or conformable moving temperature-energy conducting structure; or 17 201105921 13· adjacent heat conducting body is by gravity Adjacent to the joint; or 14. the adjacent heat conductor is abutting by the attraction of the magnet device; or 15. the adjacent heat conductor is combined by the cladding structure; the second warm energy body (104) is In the gaseous state, the heat conduction coupling with the solid interface heat conductor (103) may be coupled by one or more of the following methods, including: 1. The heat transfer surface of the interface thermal conductor (103) in a solid state is transported in a gaseous state. The second warm energy body (104) of the warm energy; or 2. The fan blows the gaseous second warm energy body (1〇4) through the interface heat conductor (103) to transmit the warm energy; When the energy body (104) is in a liquid state, the heat conduction coupling mode with the interface heat conductor (1〇3) may be one or more of the following: Coupling, including: 1. The interface thermal conductor (103) is immersed in the liquid second warm energy body (1〇4) for free transmission as a warm energy transfer; or 2. The pump is used to pump the liquid The second warm energy body (104) passes through the surface of the interface heat conductor (103) and functions as a warm energy transmitter with the interface heat conductor (1〇3). If the second warm energy body (104) is a gel-like object or a powder-like object, the heat-conducting coupling mode with the solid-state interface heat conductor (1〇3) includes: manpower, or electricity, or The force drives the toggle mechanism to dial the glue object, or the powder object 'to randomly pass the interface heat conductor (103) to transmit the warm energy. The thermal conductivity principle and device of the multi-layer structure with pre-load loss, between the first warm energy body (101) and the relay heat conductor (i 02); or the relay thermal body 201105921 (1〇2) Between the interface heat conductors (103); or between the interface heat conductors (103) and the second warm energy body (104); or when the heat conductive interlayer (11 〇) is disposed, the relay heat conductor (102) and the thermal conductive interlayer Between (no); or between the thermal conductive interlayer (11〇) and the thermal conductive interlayer (110) when the multilayer thermal conductive layer (11〇) is disposed; or between the thermal conductive interlayer (110) and the interface thermal conductor (103) Depending on the need, one or more of the following methods may be selected to assist the heat transfer, including: 1. providing an insulating thermally conductive sheet; or 2_ applying a thermal grease; or 3. providing an insulating thermally conductive sheet and applying a thermal grease. The principle and device for the thermal conductivity of the multi-layer structure with pre-clamping can be applied to various heat-transfer or heat-dissipating or cooling heat-conducting applications, such as the heat absorption or heat dissipation of the heat-absorbing or heat-dissipating heat pipe structural shell of various casings, Heat absorption or heat dissipation of various structural shells 'heat absorption or heat dissipation of various semiconductor components, various ventilation devices, or information devices, or heat or heat or heat transfer of audio or imaging devices, various lamps or light-emitting diodes (LEDs) Heat absorption, heat dissipation or heat transfer of heat-dissipating devices, heat absorption or heat dissipation of heat of the motor or engine, or heat transfer of mechanical devices, heat transfer of friction heat loss, or electric heaters or other electric appliances or electric heaters Heat transfer or warm energy transfer of cookware' or endothermic or warm energy transfer of flame-heated stoves or cookware, or heat or heat or heat transfer of warm water in formations or water, plant or building construction or building materials or building structures The heat absorption or heat dissipation or the heat energy transmission of the device, the heat absorption or heat dissipation of the water tower, the heat absorption or heat dissipation or the heat energy transmission of the battery or the fuel cell; Household appliances, industrial products, electronic products, motors or mechanical devices, power generation equipment, buildings, air-conditioning units, production equipment or thermal energy transmission applications in the industrial process of 201105921

20 201105921 [Simplified description of the drawings] Fig. 1 is a schematic view showing the structure of the pre-force-clamping joint of the first heat-generating body of the heat-conducting end of the heat pipe or the heat-absorbing end of the heat pipe of the present invention. Figure 2 is a top plan view of Figure 1. Fig. 3 is a schematic view showing the heat-conducting coupling surface of the relay heat conductor (丨〇2) and the interface heat conductor (103) and the joint surface of the interface heat-conducting body (丨〇2) in a concave-convex shape. 4 is a schematic view showing a heat-transfer coupling surface and a joint surface of a relay heat conductor (1〇2) and an interface heat conductor (1〇3) according to the present invention. Fig. 5 is a schematic view showing the heat-conducting coupling surface of the relay heat conductor (102) and the interface heat conductor (1〇3) and the joint surface of the joint heat-conducting body (102) in a dovetail shape. Fig. 6 is a view showing the heat conduction coupling surface of the relay heat conductor (1〇2) and the interface heat conductor (1〇3) and the joint surface of the T-slot type pre-clamping assembly. 81 7 is a schematic view showing a heat-conducting coupling surface of the relay heat conductor (102) and the interface heat conductor (103) of the present invention and a joint structure of a hole-shaped pre-clamping joint. Fig. 8 is a view showing the heat conduction engagement surface of the relay heat conductor (1〇2) and the interface heat conductor (1〇3) of the present invention and the joint structure of the concave-convex multi-wing pre-clamping joint structure. 9 is a first thermal energy body in which the thermal conductive interlayer (11 〇) and the relay thermal conductor (1 〇 2) and the interface thermal conductor (103) are disposed with the heat-dissipating end of the heat pipe or the heat-absorbing end of the heat pipe. The pre-stressed package is combined with the structural schematic. Figure 10 is a plan view of Figure 9. Figure 11 is a schematic view showing the thermal conductive surface of the thermal conductive interlayer (110) and the relay thermal conductor (102) and the interface thermal conductor (103) of the present invention, and the joint surface of the thermal conductive interlayer (110) and the joint surface of the thermal conductive interlayer (110). 12 is a schematic view showing a heat-transfer coupling surface and a joint surface of a heat conducting interlayer (11〇) and a relay heat conductor (1〇2) and an interface heat conductor (103) according to the present invention. Fig. 13 is a schematic view showing the heat-transfer coupling surface of the heat-conducting interlayer (11〇) and the relay heat-conducting body (1〇2) and the interface heat-conducting body (103) and the joint surface of the joint of the heat-conducting interlayer (11〇). Fig. 14 is a schematic view showing the thermal conductive coupling surface of the thermal conductive interlayer (no), the relay thermal conductor (1〇2) and the interface thermal conductor (103), and the joint surface of the τ-type groove type pre-clamp. Fig. 15 is a schematic view showing the thermal conductive coupling surface of the thermal conductive interlayer (no), the relay thermal conductor (1〇2) and the interface thermal conductor (103), and the joint surface of the thermal conductive interlayer (no) of the present invention. Fig. 16 is a schematic view showing the heat-conducting interlayer (11〇) of the present invention, the heat-conducting surface of the relay heat-conducting body (1〇2) and the interface heat-conducting body (103), and the joint surface of the joint of the heat-conducting interlayer (11〇2) and the joint heat-conducting body (103). Figure Π is a schematic diagram of the relay heat conductor (1〇2) in a pre-loaded clamp combined with the cookware as an interface heat conductor. 22 201105921 [Description of main component symbols] 100: Warm energy conducting structure or heat dissipating structure assembly 101: First warm energy body 102: Relay thermal conductor 103: Interface thermal conductor - 104: Second warm energy body. 110 : Thermally conductive interlayer 500: slit

Claims (1)

201105921 VII 1. 2. The scope of application for patents: - The principle and device of the thermal conductivity of the multi-layer structure with pre-expansion encapsulation, to form the thermal conductivity conduction junction-slit thermal structure of the composite layer by different conductivity characteristics materials. Different from the single-material structure of the warm energy conduction structure or the scattering structure, this principle has a pre-stressed complex layer junction art guide principle, which is used as a relay heat conduction material with a good thermal conductivity coefficient. The end of the body's relay heat conductor, for the first heat or cold, the field energy coupling, and the other side of the relay heat conductor for the heat body 'The interface thermal conductor has 1) a relative heat capacity value with respect to the relay heat conductor, or 2) a second good temperature with respect to the relay guide finer = emissivity (emissivity) Two kinds of heat conduction characteristics, or to: - the medium is better than the heat conduction characteristics of the medium and heat bodies, as the heat conduction carrier between the second and second warm energy bodies; when the first temperature energy is one: If the temperature difference is favorable for conducting the temperature, the further feature of the present invention is that the first layer of the community is pre-packed. a combination of structures to reduce volume, and a pre-stress: (500) for creating a clamping or external pre-force to ensure good thermal contact, and to loosen or deform the composite material due to different coefficients of thermal expansion, Avoiding poor bonding is not conducive to heat conduction. &quot;,, Conducting the multi-layer structure thermal device with pre-load loss as described in the first paragraph of the patent application, the main components of which include: ”—the temperature-conducting structure or the heat-dissipating structure assembly (100) At least two layers of non-specific I. raw thermal conductive material, wherein the relay of the preferred thermal conductivity is ^^ (102), coupled to the first warm energy body (1〇1), having a higher heat capacity The interface thermal conductor (103) is coupled between the relay heat conductor (102) and the second warm energy body (104) to form a warm energy conductive structure or a heat dissipation structure assembly (100); The conductive structure or the heat dissipation structure assembly (100) is provided between the first, w body (101) and the second temperature body (1〇4); the temperature conduction structure or heat dissipation = S] 24 201105921 The composition of the body assembly (100) comprises a relay heat conductor (102) and an interface heat conductor (103), wherein - the first warm energy body (101): may be a non-closed solid, or Active cooling or pyrogenic warm energy consisting of gaseous, or liquid, or gelatinous or powdered matter, or passive heat or heat release Thermal energy body by those, - or from heat conductive outer shell warm end of the heat from the pipes of the release, or the heat absorption end of heat conducting housing consisting of; - relay thermal conductor (102): by at least one layer of relatively having relatively good thermal conductivity The solid state, or the gaseous state, or the liquid state, or the gel-like object, or the powder-like object constitutes one end or one side of the relay heat conductor 'the relay heat conductor (102) for providing the open first warm energy body (101) Contact bonding, the other end or the other side of the relay heat conductor (102) is for bonding to the interface heat conductor (103) for warm energy conduction, and is included in the heat-emitting housing of the heat-dissipating end of the heat pipe or the heat-absorbing housing of the heat-absorbing end Between the first warm energy body (1〇1) and the interface heat conductor (103), a relay heat conductor (102) is provided as a heat conductor; or a heat conducting shell for a conduit for circulating a warm energy fluid Between the first warm energy body (1〇1) and the interface heat conductor (103), a relay heat conductor (102) that is pre-packed is provided as a heat conductor; the relay heat conductor and the first The heat transfer coefficient of a warm energy body (101) is superior to that of the interface heat conductor (103), that is, the heat conduction speed is faster than the interface heat conductor (1〇3), and the heat conduction between the relay heat conductor (102) and the interface heat conductor (103) The area of the coupling surface is greater than or equal to the heat conduction coupling surface of the relay heat conductor (102) and the first warm energy body (101) The area / / interface thermal conductor (103): is composed of at least one layer of solid, or gaseous, or liquid ' or gelatinous or powdery objects, the thermal properties of the material 1) unit heat capacity value Or 2) the thermal emissivity (emissivity) between the second warm energy body (104), the heat transfer characteristics of the above two or one of them are superior to the relay heat conductor (102), and the interface thermal conductor (103) is Provided for being disposed between the relay heat conductor (1〇2) and the first: energy body (104) for heat conduction, including heat conduction at the heat release end of the heat pipe: or a heat conductive outer casing of the heat absorption end The first warm energy body (101) is disposed as a relay heat conductor (102) of the pre-spoiler 25 201105921 and the interface heat conductor (103) is disposed on the relay heat conductor (102) and the second warm energy body (104). Between the heat conductors; or the first heat energy body (1〇1) formed by the heat conducting outer casing of the conduit for circulating the warm energy fluid, the relay heat conductor (102) is disposed, and the interface heat conductor ( 1〇3) disposed between the relay heat conductor (1〇2) and the second warm energy body (104) for heat conduction; interface thermal conductor (103 And the area of the heat conduction coupling surface of the second warm energy body (104) is greater than or equal to the area of the heat conduction coupling surface of the relay heat conductor (丨〇2) and the interface heat conductor (103); The pre-loaded sandwich-like combination structure reduces volume, and has a pre-force gap (500) for generating a pre-stress of the bundling or bracing to ensure good thermal contact and avoiding different thermal expansion of the composite material. The coefficient causes loosening or deformation, causing poor heat transfer surface bonding and is not conducive to heat conduction; - Second warm energy body (1〇4): containing solid, or gaseous, or liquid, or gelatinous, or granular An active cooling or heating thermodynamic body composed of an object, or a warm energy body that passively absorbs heat or releases heat; the principle and device of the multi-layer structure thermal conduction with pre-clamping, wherein the first warm energy The heat conduction coupling surface of the body (101) and the relay heat conductor (102), and the heat conduction coupling surface of the interface heat conductor (103) and the second temperature energy body (104) can be selected according to the needs of the geometry; Structure to lower the first warm energy body (101) and Thermal energy body's resistance (Shu 04) between the. 3. The thermal conductivity principle and device of the multi-layer structure with pre-clamping according to the first paragraph of the patent application's first thermal energy body (101), relay thermal conductor (102), interface thermal conductor (1) 〇3), the second warm energy body (104) has the following relative relationship: a first warm energy body (101) and the second warm energy body (104) are provided with a temperature-conducting structure or a heat-dissipating structure Assembly (100); a temperature-conducting structure or a heat-dissipating structure assembly (1〇〇) consisting of at least two layers of different heat-conducting materials, wherein the towel is in contact with the heat conductor (1Q2) The interface heat conductor (103) has a better heat transfer coefficient to the first temperature body (m), and the relay heat conductor (102) is coupled to the first temperature body (101), and the interface heat conductor 〇〇3) is coupled. Between the relay heat conductor (102) and the second warm energy body (10), the interface heat conductor (10) is (1) has a higher unit heat capacity value relative to the relay heat conductor (1〇2) or (2) (4) the towel heat conductor (102) The second thermal energy body (1〇4) has a relatively good thermal emissivity (emissivity, emiSS1Vlty), that is, the above two interfaces (1〇3) Or one of the heat transfer characteristics, which is superior to the relay heat conductor (1〇2); , -- constitutes the relay guide clock (10)) (four) the conductivity coefficient is better than the interface guide body (103); ..., - the heat capacity value of the material constituting the interface heat conductor (103) or the heat radiation coefficient (emissivity) of the second warm energy body (1〇4), and the heat transfer characteristics of the above two or one of them are superior to Following the heat conductor (1〇2); the area of the heat conduction coupling surface of the relay heat conductor (102) to the interface heat conductor (1〇3) is greater than or equal to the relay heat conductor (10) and the first temperature body (m) the area of the heat conduction surface of the junction 'to reduce the thermal resistance; - the area of the thermal conduction coupling surface of the interface thermal conductor (103) to the second warm energy body (104) is greater than or equal to the relay thermal conductor (1〇2) and the area of the heat conduction coupling surface of the interface heat conductor (1〇3), thereby reducing the thermal resistance; in the above structure, when the temperature of the first warm energy body (1〇1) is higher than the second The thermal energy of the 'first-temperature energy body (10) in the warm energy body (104) is between the first warm energy body (10) and the relay heat conductor (102) The smaller heat conduction coupling surface conducts diffusive heat to the relay heat conductor (1〇2) with better heat transfer coefficient, and assists in transmitting temperature energy by at least one of the following functions, including 1) relaying A large area of the heat conduction coupling surface of the heat conductor (1〇2) coupled with the interface heat conductor (103), the thermal energy is diffused to the interface heat conductor (1G3) having a larger heat capacity value; or 2) the interface heat conductor (103) releasing the thermal energy to the second warm energy body (104) with the same or 27 201105921 large area heat conduction coupling area, or 3) the second warm energy with a better thermal emissivity (emissivity) characteristic The body (104) releases heat energy; in the above structure, when the temperature of the first warm energy body (101) is lower than the second temperature energy body (104), the heat energy of the second warm energy body (1〇4), The heat conduction coupling surface of the second warm energy body (104) and the interface heat conductor (103) has a large heat conduction coupling surface, and the thermal energy is transmitted to the interface heat conductor (1〇3) having a larger heat capacity value. A small area of heat conduction coupling surface coupled to the interface heat conductor (103) and the relay heat conductor (102) The thermal energy is transmitted to the relay heat conductor (102)' and the heat transfer coupling of the smaller area of the relay heat conductor (1〇2) having a better heat transfer coefficient faces the first warm energy body (101). 4_ The principle and device for the thermal conductivity of the multi-layer structure with pre-clamping according to the scope of claim 1 of the patent application can be further configured as follows: if the first warm energy body (101) or the first When the second warm energy body (102) or the interface heat conductor (1〇3) or the second warm energy body (1〇4) is at least one of a gaseous state, or a liquid state, or a gelatinous body, or a powdery object The container structure may be provided for the inserter, and the structure of the container may be a good conductor or a non-thermal conductor, or a container made of a material having a good heat transfer coefficient and constitute a relay heat conductor (102), or a unit heat The material having a larger capacitance is made into a container and constitutes a function of the interface heat conductor (103). 5_ The thermal conduction principle and the thermal conduction coupling surface and the joint surface of the relay thermal conductor (102) and the interface thermal conductor (103), as described in claim 1 of the patent application scope , if necessary, may be selected by one or more of the following combination structures: including: concave and convex shape for pre-clamping combination, or dovetail shape for pre-clamping combination, or T-slot type for pre-packing The clip is combined, or the column is used as a pre-clamp combination, or is combined with a concave-convex multi-wing for pre-clamping, or combined with other conventional heat-conducting surfaces to increase the conduction area. 6.—The principle and device of the multi-layer structure thermal conductivity with pre-clamping, between the relay thermal conductor (102) 28 201105921 and the interface thermal conductor (103), at least one thermal interlayer (1丨〇) can be arranged. In the multi-layer structure, the relationship between the added thermal interlayer (110) and the relay thermal conductor (102) and the interface thermal conductor (103) is as follows: - The thermal capacity of the thermal interlayer (110) is greater than the relay thermal conductivity. The unit heat capacity value of the body (102) is smaller than the unit heat capacity value of the interface heat conductor (103), and the closer to the relay heat conductor (1〇2) when using the structure of the multilayer heat conduction interlayer (110) The thermal conductivity interlayer (110), the smaller the unit heat capacity value is only greater than the relay thermal conductor (1〇2); the thermal conductivity of the thermal interlayer (110) is better than the interface thermal conductor (103), the middle The heat transfer coefficient of the heat conductor (102) is better than that of the heat conductive interlayer (110); and when the structure of the multilayer heat conductive interlayer (110) is adopted, the closer to the heat conductive interlayer (110) of the relay heat conductor (1〇2) The better the heat transfer coefficient, but still slightly lower than the relay heat conductor (1〇2); The heat conduction coupling area of the relay heat conductor (1〇2) and the heat conduction interlayer (11〇) is larger than the heat conduction coupling area of the heat conduction interlayer (110) and the interface heat conductor (103), and the multilayer heat conduction interlayer (110) is selectively disposed. In the case of the structure, the heat conduction coupling area between the interlayers of the interface heat conductor (1〇3) is the same or larger; if the above heat conduction interlayer (110) is two or more, the heat transfer coefficient in the thermal characteristics And the selection of the unit heat capacity value, and the size of the coupling area of the heat conduction loss layer (110) and the heat conduction on both sides, from the first temperature body (101) to the relay heat conductor (102) to the heat conduction interlayer ( 11〇), to the interface thermal conductor (1〇3), to the second warm energy body (1(10)), the heat conduction area of each layer is the structural principle of the same layer or layer by layer; Between the layers is a pre-clamp-like combination to reduce the volume, and eight pre-stress gaps (5 〇〇) for the pre-stress of the clamping or bracing to ensure good guiding contact, and to avoid complex Layer structure material is loose due to different thermal expansion coefficients or 1 k is a poorly coupled heat conduction surface and is not conducive to heat conduction. The heat conduction principle of the complex structure with the pre-load loss as described in the Shen-Yuan patent _6, and the conduction device of the relay heat conduction body (10) and the thermal conduction interlayer (10) The joint surface can be selected according to the following types or combinations of the following structures, including: concave-convex shape for pre-clamping combination, or dovetail groove for pre-clamping combination, or τ-type groove for pre-force The combination of the clips, or the columnar shape, is combined with the pre-forced clips, or combined with the concave-convex multi-wings for the pre-clamping, or combined with other pre-forces of the heat-conducting surface to increase the conduction area. 8. The principle and apparatus for the thermal conductivity of the multi-layer structure according to the sixth aspect of the patent, wherein the heat conduction surface and the bonding surface of the thermal conductive interlayer (110) and the interface thermal conductor (10) are as needed It is selected to be a combination of one or more of the following types including: a concavo-convex shape for pre-clamping, or a trunnion groove for pre-clamping, or a T-slot for pre-clamping. Or the columnar column is used as a pre-clamping combination, or is combined with a concave-convex multi-wing for pre-clamping, or combined with other conventional heat-conducting surfaces to increase the conduction area. 9. If the thermal conduction principle and device of the multi-layer structure with pre-clamping according to the scope of claim 6 is selected, when two or more layers of the thermal conductive interlayer (110) are selected, at least two of the layers are thermally conductive. The thermally conductive coupling surface and the bonding surface of the interlayer (110) and the thermal loss-reducing layer (110) may be selected by one or more of the following combined structures, including: a concavo-convex shape for pre-clamping, or The tail groove is shaped as a pre-clamp combination, or a T-slot type is used as a pre-clamp combination, or a column-like shape is used as a pre-clamp combination, or a concave-convex multi-wing is used as a pre-clamp combination, or other conventional use. The heat conduction surface is combined with a pre-clamping combination to increase the conduction area. 10. The principle and apparatus for the thermal conductivity of the multi-layer structure with the pre-clamping according to the second or sixth aspect of the patent application is the first warm energy body (101), the relay heat conductor (102), When the interface thermal conductor (103), the second warm energy body (1〇4), or the thermal interlayer (110) is further selected, the heat conductive material having a gradual structure according to the heat conduction characteristics of the multi-layer structure may be used to form the thermal energy. The conductive structure or the heat dissipating structure assembly (100) 'if it is used to form the thermal energy 30 201105921, the conductive structure or the heat dissipating structure assembly (100), or all of the adjacent thermal conductors are solid bodies, then The manner of bonding between two adjacent heat conductors is a pre-clamp-like joint structure between the structural layers to reduce the volume, and a pre-force gap (500) for generating a pre-stress of the clamping or outer support. In order to ensure good thermal contact, and to avoid loose or deformation of the composite material due to different thermal expansion coefficients, resulting in poor heat conduction surface bonding and is not conducive to heat conduction; and one or more of the following ways to do the combination, including: 1) plus screw screw Cap locking; or 2) screwing the spiral column and the spiral hole structure; or 3) screwing the spiral column and the spiral hole structure together with a reserved slit (500) for pre-clamping; or 4) Liuhe; or 5) press fit; or 6) fixed lock; or 7) adhesive; or 8) welded; or 9) frictional fusion; or ® 10) adjacent thermal conductors are casters; Or '11) the adjacent heat conductor is formed by plating; or 12) between the adjacent heat conductor and the other heat conductor, having a fixed or conformable moving structure; or 13) adjacent The heat conductor is abutting by gravity; or 14) the adjacent heat conductor is abutting by the attraction of the magnet device; or 15) the adjacent heat conductor is combined by the cladding structure. 11. The principle and apparatus for the thermal conductivity of a multi-layer structure with pre-clamping according to the second or sixth aspect of the patent application, between the first warm energy body (101) and the relay heat conductor (102) Or 31 201105921 between the relay thermal conductor (102) and the thermal interlayer (110) when the thermal interlayer (110) is disposed; or when the multilayer thermal interlayer (110) is provided, the thermal interlayer (110) and the thermal interlayer (110) Between; or between the thermal conductive interlayer (110) and the interface thermal conductor (103); or when the thermal conductive interlayer (110) is not disposed, between the relay thermal conductor (102) and the interface thermal conductor (103); or The heat conduction coupling surface between the interface heat conductor (103) and the second warm energy body (104) may be combined by one or more of the following two methods, and the adjacent two heat conductors are combined; There is a pre-clamped joint structure to reduce the volume, and a pre-force gap (500) for generating a pre-stress of the brace or the outer brace to ensure _ good thermal contact, and to avoid the different layers of structural materials The coefficient of thermal expansion causes loosening or deformation, resulting in poor heat transfer surface bonding Not conducive to heat conduction, and combined with one or more of the following methods, including: 1) screwing with screw nut; or 2) screwing with spiral column and spiral hole structure; or 3) spiral column and spiral hole The structures are screwed together and provided with a reserved gap (500) for pre-clamping; or 4) riveting; or 5) pressing; or 6) locking clamps; or 7) bonding; or 8 Soldering; or 9) friction welding; or 10) adjacent heat conductors are casters; 11) or adjacent heat conductors are made of plating; or 12) adjacent heat conductors and another heat conductor Between the heat transfer structure having a fixed fit or a conformable movement; or 13) the adjacent heat conductor is abutting by gravity; or 32 201105921 14) The adjacent heat conductor is tightened by the attraction of the magnet device By the suction; or 15) the adjacent heat conductor is a combined structure; the heat conductor adjacent to the solid heat conductor is a heat conduction composed of a gaseous state, or a liquid state, or a gelatinous substance or a powdery object. Body, the thermal conduction mode of the heat conduction coupling surface includes one or the following The above-mentioned methods are composed of: 1) transmitting the adjacent gaseous state, or the liquid state, or the gelatinous substance, or the granular material of the powdery body by the heating surface of the solid heat conductor; or 2) using a liquid pump, or The fan pumps a relatively warm gaseous state, or a liquid, or gel-like object, or a powder-like object, randomly contacting the surface of the solid heat conductor to transmit warm energy to the adjacent solid heat conductor. 12. If the principle and device of the multi-layer structure thermal conductivity with pre-clamping according to the scope of claim 2 or 6 are applied, if the first warm energy body (101) or the second warm energy body (104) is The heat source of the combustion state, the heat conduction mode of the adjacent solid heat-conducting structure includes: the heat-sinking body of the heat-generating body of the solid heat-conducting body transmits the heat-generating body of the adjacent combustion state. 13. If the first thermal energy body (101) is in a gaseous state, or in a liquid state or a gelatinous state, in the principle and apparatus of the superstructure thermal conductivity of the pre-clamping package described in claim 2 or 6 The object, or the powder-like object, is thermally conductive, containing manpower, or electric power, or mechanical force to drive the dialing mechanism to move the gel-like object or the powder-like object for random colloidal or powdery particles. The warm energy of the object is transmitted to the adjacent solid heat conductor. 14. The principle and apparatus for the thermal conductivity of a multi-layer structure with pre-clamping as described in claim 2 or 6 of the patent application, between the interface thermal conductor (103) and the second warm energy body (104) The heat conduction method comprises: - when the second warm energy body (104) is a solid heat body, the heat conduction coupling surface with the solid interface heat conductor (103) may be combined by one or more of the following methods, and the adjacent two The manner of bonding between the heat conductors is a pre-clamp-like combination structure between the structural layers to reduce the volume, and a pre-force gap (500) for generating a pre-stress of the splicing or outer 33 201105921 Ensure good thermal contact, and avoid loose or deformation of the composite material due to different thermal expansion coefficients, resulting in poor heat transfer surface bonding and is not conducive to heat conduction, and combined with one or more of the following methods, including: 1) Cap lock; or 2) screwed together with the spiral hole structure; or '3) screwed together with the spiral hole structure and provided with a reserved gap (500), and pre-forced clamping Or 4) Nahe; 5) press fit; or W 6) fixed lock; or 7) adhesive; or 8) weld; or 9) frictional fusion; or 10) second warm energy (104) is caster; or 11) The second warm energy body (104) is formed by plating on the interface heat conductor (103); or 12) between the second warm energy body (104) and the interface heat conductor (103), having a fixed fit or a pasteable And the moving heat conduction structure; or: 13) the adjacent heat conductor is abutting by gravity; or '14) the adjacent heat conductor is abutting by the attraction of the magnet device; or 15) The adjacent heat conductors are combined in a cladding structure; - in the gaseous state of the second warm energy body (104), the heat conduction coupling with the solid interface heat conductor (103) may be one or more of the following Coupling, comprising: 1) transmitting a gaseous body of a second warm energy body (104) to a heated surface of a solid interface heat conductor (103); or 2) blowing a second warm energy of the gas state by a fan Body (104), through the interface heat conductor (103) to transmit the warm energy, 34 201105921 - in the second temperature New Zealand (_ green state 'the interface with the interface The thermal conduction coupling mode of the body (10) may be coupled by one or more of the following methods, including: 1) immersing the interface thermal conductor (10) in the liquid second thermal energy body (10) for free transmission; Or 2) pumping the liquid second warm energy body (1〇4) to the surface of the interface heat conductor (1〇3) and the interface heat conductor (103) as a warm energy transferer; When the second warm energy body (104) is a gel-like object or a powder plate-like object, the heat-conducting coupling mode with the solid-state interface heat conductor (1〇3) includes: manpower, or electric power, or force. The toggle mechanism is driven to move the glue object or the powder object to randomly pass the interface heat conductor (103) to transmit the warm energy. 15. The thermal conductivity principle and device of the multi-layer structure with pre-load loss as described in the second or sixth paragraph of the patent scope of claim 4, its first-temperature energy body (10) and relay heat conductor (1〇2) Between the relay heat conductor (102) and the interface heat conductor (1〇3); or between the interface heat conductor 〇〇3) and the second warm energy body (104); or set the thermal conductive interlayer (1)0 When between the relay heat conductor (102) and the thermally conductive interlayer (110); or when the multilayer thermal interlayer (1) is provided, between the thermally conductive layer (110) and the thermally conductive interlayer (110); or in thermal conduction Between the cool layer (1) 〇) and the interface thermal conductor (103), the following or a variety of ways may be selected to assist the heat transfer: including: U to provide an insulating thermal conductive sheet; or 2) applying a thermal grease; Or 3) Set the insulating thermal pad and apply thermal grease. 'If you apply for the superstructure thermal conductivity principle and device with pre-moisturizing moxibustion mentioned in item 2 or item 6 of Weiwei, it can be applied to various heat-transfer or heat-dissipating or cooling heat-conducting applications, such as various machines. The heat absorption or heat dissipation of the shell of the shell, the heat absorption or heat dissipation of the structural shell, the heat absorption or heat dissipation of various structural shells, the heat dissipation of various semiconductor components, the heat absorption or heat dissipation of various ventilation devices, or information devices, or audio or imaging devices. Temperature 35 201105921 can transmit, heat dissipation of various lamps or light-emitting diodes (LED), heat absorption or heat dissipation or temperature transmission of air conditioners, heat absorption or heat dissipation of heat of motor or engine, or heat transfer of mechanical devices Heat loss, heat dissipation or heat transfer of electric heaters or other electric appliances or electric cookers, heat or temperature transfer of stoves or cookware for flame heating, or heat absorption or heat dissipation of formation or water temperature Or heat transfer, heat or heat or heat transfer of building or building construction or building materials or building structures, heat absorption or heat dissipation of water towers, batteries or fuel cells Absorbing or dissipation or thermal energy transfer persons; and products used in home appliances, industrial products, electronic products, electrical or mechanical devices, power generation equipment, construction material, air conditioner, industrial equipment or manufacturing process of the thermal energy transfer by application. 36