201102573 六、發明說明： - 【發明所屬之技術領域】 . 本發明涉及一種照明裝置，特別涉及一種發光二極體 燈具。 【先前技術】 發光二極體(Light Emitting Diode，簡稱LED)光源作 為一種新興之第三代光源，雖然現在還不能大規模取代傳 統之白熾燈，惟其具有工作壽命長、節能、環保等優點， 而普遍被市場看好。且，目前由發光二極體組成之模組能 φ 產生大功率、高亮度之光源，是故將廣泛地取代傳統之白 熾燈等習知之光源，進而成為符合節能環保主題之主要光 源。 然，隨著發光二極體及其模組之功率、亮度之增大， 其產生之熱量也越來越大，是故通常將發光二極體模組安 裝在一平板狀散熱器上以保證發光二極體模組正常工作。 該等發光二極體模組一般水平貼置於散熱器之底部而形成 平面光源，當裝設有平面光源之發光二極體燈具單獨地被 安裝在一燈桿上時，就會造成燈具之照射方向單一，照射 面積也很有限，是故在很多情況下都難以使用戶滿意。 •【發明内容】 一種發光二極體燈具，包括一具有一基板之散熱器、 導熱安裝於該散熱器之基板底面之複數導熱支架及分別導 熱安裝於該等導熱支架上之複數發光二極體模組，該等導 熱支架使相應之發光二極體模組之出光方向相對於豎直方 向朝外側傾斜，該等支架於該散熱器基板之底面呈放射狀 設置。 與習知技術相比，本發明之發光二極體燈具通過排佈 設置在散熱器之基板底面之多個支架而形成所需之照明區 域，達到相應之照明效杲。當多個支架圍合成呈放射狀之 201102573 ’ ίΐ在支架上之發光二極體模組相應分佈在 6亥發先£域之周邊’從而產生大角度照明之發光效果。 L貫施方式】 产及圖2,本發明—實施例之發光二極體 〇、固定於散熱器10底面之複數支 ;又支，2〇上之複數發光二極體模組3〇、 ί二ii 發光二極體餘30並與散熱器10 二Ξί、5°〇&。燈罩4〇及套設於該燈罩40外周緣之一 ^ H气參閱圖3至圖5，上述散熱器1〇由導熱性 如銅、鋁、合金等一體製成，其包括 之複數散熱“t。2二延伸而出 凸伸出一崁灿玄基板之底面周緣垂直向下 容置邱1 =狀^出β|Μ20。該環狀凸出部120圍設出一 供該等支架20容置其内。該凸出部12〇 體Ξ且：置槽122内，用以密封該發光二極 以‘i線。2之中央開設出一垂直貫通孔124，用 基^ 12夕^並導電性連接該等發光二極體模組30。該 :凸肋126 mm外凸伸出複數暨直設置 孔】該4凸肋126之底面中央分別開設出一螺 該基板U之^與面螺Λ (//示）配合安裝該燈罩40。 16 接垂f向上凸伸出一圓筒狀連接部 片14由嗜艽 圍％该貝通孔124設置。該等散熱鰭 鰭片古之頂面垂直向上延伸而出’相鄰散熱 接iif之頂面:=!ΪΓ16呈放射狀設置。該連 ΐ Si::凹槽160内，用以密封該發光二極體Ϊ 碗狀中空安裝件17對應密封性蓋置於該連接部 201102573 上;裝件17與連接部16之内部相連 模组、(圖、丄-、斜：Ϊ腔（未標不），以收容驅動電路 )對該發光二極體燈具提供電源驅動。該 安裝件η之側壁上開設有一容置孔17〇 _亥 於容置孔m處形成有内螺紋。一安全 Π; =容置孔no内’以連通燈具之外部與内部並供= 亥安全連接件18設有貫穿其中心軸之軸！ —。该安全連接件18之中部開設有一凹陷槽182。咳 =連接件18靠近底部之外圓周開設有外螺紋，以g ^孔Π〇處之内螺紋相配合，從而將該安全連接件& = ^安;件17上。該安全連接件丄 ΐ懕！:产 裝設於凹陷槽182内之壓片⑻。 4壓片184之兩端開設有定位孔（未標示），供 ^而：該壓片184固定在凹陷槽182内側壁上：該 84用以定位穿置於安全連接件18内之電線，以以 力之拉拽而發生位移。一安裝片3〇0安裝於該 面上’用以將該發光二極體燈具固定安 支架2〇在由導熱性能良好之金屬材料如銅、 2方5制Ϊ 一ί製成，較佳地，該支架20通過擠麼加 成。母一支架2〇包括固定於基板12之底面上 ^極ίίΠ2、與該結合部22才目間隔設置並供該發光 相貼置之一安裝部24及連接該結合部22 i 之複數連接板26。該結合部22為一矩形板 邱丨91、'貼置於該基板12之底面上並容置於該容置 124 = 2。該等結合部22圍繞該基板12中央之貫通孔 A 一祐ί於该貫通孔I24呈放射狀設置。該安裝部24 形板體，其與該結合部22之間形成一銳角（未 二吏得貼置於該安裝部24外側面之發光二極體 吴，， 相對於該散熱器10上之基板12沿該基板12之 201102573 周緣向其中央成一定角度傾斜向下設置，以增加發光二 極體模組30之照射範圍。在其他實施例中，可以根據 發光一極體燈具不同照射角度之需要，設置該安裝部24 ^結合部22成不同之角度傾斜，只需滿足該支架20能 夠使安裝於其上之發光二極體模組3〇之出光方向相對 =丑直方向朝外側傾斜即可。該連接板26由該結合部 之底面垂直向下延伸而出並對應連接於該安裝部24 之内側面。該連接板26相互平行、間隔設置。在本實 施，中，該等支架20之安裝部24相對於基板12圍成 體’該等發光二極體模組30相應地分佈於該 =上周緣。可以理解地，根據出光需要，該等支 基板12可以圍成相應之規則 32 ϋϋ母6一5光二極體模組30包括一矩形電路板 對廍Ιί ϋΪ設於該電路板32上之發光二極體34及 極體34上之複數光學透鏡36。每- ί ϊο一3 :二〇之電路板3 2對應導熱性貼合於-支 L之外側面上。該等光學透鏡36用以 一極&产ί择〜曰t社之出光方向，進而使本發明之發光 一極體燈具獲付車父佳之照明效果。 璃、呈碗狀’由透明或半透明材料如玻 ϊ底m體製成，其對應覆蓋於該基板12 環狀卡邊42〜·^ 士 4之頂部周緣向外水平延伸形成一 %狀卡邊42。该卡邊42在形狀上 122相對應，以對應容置於 揭H12之今置槽 圈100夾置於該卡邊42與基板12; 性密封材料如矽膠製成，田，ν 低面之間其由彈 10之間之間隙，$ π Μ π用畨封該燈罩4〇與散熱器 、極該發光二極體燈具之整體密封 該壓框60整體上為一圓形環狀框 201102573 ^，其中央形成有一圓形開口 62。該壓框6〇在尺寸上 ί 燈罩40之卡邊42，使得在組裝時，該燈罩4〇 該壓框60之開σ 62,而同時壓框6〇 該燈罩40之卡邊42上。該壓框60之外周 =勻間隔向外凸伸而出複數半圓形凸塊64。該等凸塊 位置上與該基板12之凸肋126相對應，在組裝時， ，專凸塊64對應與該等凸肋126疊置。每一凸塊64之201102573 VI. Description of the invention: - [Technical field to which the invention pertains] The present invention relates to a lighting device, and more particularly to a light-emitting diode lamp. [Prior Art] Light Emitting Diode (LED) light source as an emerging third-generation light source, although it can not replace the traditional incandescent lamp on a large scale, but it has the advantages of long working life, energy saving, environmental protection, etc. And generally optimistic about the market. Moreover, the module composed of the light-emitting diode can generate a high-power, high-brightness light source, and thus it will widely replace the conventional light source such as a conventional incandescent lamp, thereby becoming a major light source that meets the theme of energy conservation and environmental protection. However, as the power and brightness of the LED and its modules increase, the heat generated is also increased. Therefore, the LED module is usually mounted on a flat heat sink to ensure The LED module works normally. The light-emitting diode modules are generally horizontally placed on the bottom of the heat sink to form a planar light source. When the light-emitting diode lamps equipped with the planar light source are separately mounted on a light pole, the light-emitting diodes are caused. The irradiation direction is single and the irradiation area is also limited, so it is difficult to satisfy the user in many cases. [Invention] A light-emitting diode lamp includes a heat sink having a substrate, a plurality of heat-conducting brackets thermally conductively mounted on a bottom surface of the substrate of the heat sink, and a plurality of light-emitting diodes respectively thermally conductively mounted on the heat-conducting brackets The module, the heat conducting brackets incline the light emitting direction of the corresponding LED module toward the outside with respect to the vertical direction, and the brackets are radially disposed on the bottom surface of the heat sink substrate. Compared with the prior art, the LED lamp of the present invention forms a desired illumination area by arranging a plurality of brackets disposed on the bottom surface of the substrate of the heat sink to achieve corresponding illumination effects. When a plurality of brackets are formed into a radial shape, the illuminating diode module on the bracket is correspondingly distributed around the periphery of the hexagram, thereby generating a luminous effect of large-angle illumination. L through the method of production and Figure 2, the present invention - the embodiment of the light-emitting diode 〇, fixed to the bottom of the heat sink 10; a branch, 2 复 on the complex LED module 3 〇, ί The second ii LED is 30 and is connected to the heat sink 10 Ξ, 5 ° 〇 & The lamp cover 4 is disposed on one of the outer circumferences of the lamp cover 40. Referring to FIG. 3 to FIG. 5, the heat sink 1 is integrally formed of thermal conductivity such as copper, aluminum, alloy, etc., and includes a plurality of heat dissipations. 2, extending and protruding out of the bottom of the bottom surface of the sinuous substrate, vertically accommodating the lower side of the frame 1 = shape β | Μ 20. The annular projection 120 encloses a support for the bracket 20 The protruding portion 12 has a body and is disposed in the groove 122 for sealing the light emitting diode to form a vertical through hole 124 at the center of the 'i line. The light-emitting diode modules 30 are connected to the ribs 126 mm, and the ribs of the ribs 126 are respectively protruded from the bottom surface of the ribs 126. / / Show) fit the lampshade 40. 16 The vertical connection f protrudes upwardly from a cylindrical connecting portion 14 is provided by the beak hole 124. The top surface of the heat-dissip fins extends vertically upwards And the top surface of the adjacent heat-dissipating iif: =! ΪΓ 16 is radially arranged. The ΐ Si:: groove 160 is used to seal the light-emitting diode Ϊ bowl-shaped hollow mounting member 17 The corresponding sealing cover is placed on the connecting portion 201102573; the mounting member 17 is connected to the inside of the connecting portion 16 (Fig., 丄-, oblique: Ϊ cavity (not marked) to accommodate the driving circuit) The pole luminaire is provided with a power drive. The side wall of the mounting member η has a receiving hole 17 〇 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ And the internal safety connector 18 is provided with a shaft extending through its central axis! - The safety connector 18 is provided with a recessed groove 182 in the middle thereof. The cough connector 18 is externally threaded on the outer circumference of the bottom portion to The inner thread of the g ^ hole is matched so that the safety connector & = ^ is mounted on the member 17. The safety connector 丄ΐ懕!: produces the tablet (8) which is disposed in the recessed groove 182. 4, the two ends of the pressing piece 184 are provided with positioning holes (not shown) for fixing: the pressing piece 184 is fixed on the inner side wall of the recessed groove 182: the 84 is used for positioning the electric wire which is inserted into the safety connecting piece 18, Displacement by force pulling. A mounting piece 3〇0 is mounted on the surface for the light-emitting diode The fixture fixing bracket 2 is made of a metal material having good thermal conductivity, such as copper, 2 square 5, preferably, the bracket 20 is added by extrusion. The mother bracket 2 is fixed to the substrate 12 The bottom surface of the bottom surface is provided with a plurality of connecting plates 24 and a plurality of connecting plates 26 connected to the light emitting portion. The bonding portion 22 is a rectangular plate.丨91, 'applied to the bottom surface of the substrate 12 and accommodated in the receiving portion 124 = 2. The connecting portion 22 surrounds the through hole A in the center of the substrate 12, and the through hole I24 is radially disposed. . The mounting portion 24 is formed into a plate body, and forms an acute angle with the connecting portion 22 (the light emitting diode that is not attached to the outer side of the mounting portion 24, relative to the substrate on the heat sink 10 12 is disposed obliquely downward along the circumference of 201102573 of the substrate 12 at an angle to increase the illumination range of the LED module 30. In other embodiments, the illumination angle of the LED body may be different according to the needs of the illumination. The mounting portion 24 is configured to be inclined at different angles, and only the bracket 20 can be configured to tilt the light-emitting diode module 3 mounted thereon to the outside in a relatively straight direction. The connecting plate 26 extends vertically downward from the bottom surface of the joint portion and is correspondingly connected to the inner side surface of the mounting portion 24. The connecting plates 26 are arranged parallel to each other and spaced apart. In the present embodiment, the brackets 20 are The mounting portion 24 is surrounded by the substrate 12. The LED modules 30 are correspondingly distributed on the upper circumference. It can be understood that the substrate 12 can be enclosed according to the light requirement. Mother-in-law 6-5 light The diode module 30 includes a rectangular circuit board pair 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 复 复 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The plate 3 2 is attached to the outer side of the branch L corresponding to the thermal conductivity. The optical lens 36 is used for the light-emitting direction of the one-pole & the light-emitting body, thereby obtaining the light-emitting one-pole lamp of the present invention. The effect of the car is better than that of the car. The glass, in the shape of a bowl, is made of a transparent or translucent material such as a glass bottom, which corresponds to the top edge of the base plate 12 of the substrate 12 The horizontally extending to form a %-shaped card edge 42. The card edge 42 corresponds to the shape 122, so as to be placed between the card edge 42 and the substrate 12 corresponding to the receiving groove H12; a sealing material such as silicone Made, field, ν between the low faces, by the gap between the bullets 10, $ π Μ π is used to seal the lampshade 4 〇 with the heat sink, and the integral of the light-emitting diode lamp is sealed on the whole frame 60 It is a circular ring frame 201102573^, and a circular opening 62 is formed in the center thereof. The pressure frame 6 is 尺寸 in the size of the card edge 42 of the lamp cover 40, When the assembly is completed, the lamp cover 4 is opened σ 62 of the pressure frame 60, and at the same time, the frame 6 is pressed onto the card edge 42 of the lamp cover 40. The outer frame of the pressure frame 60 is evenly spaced outwardly to form a plurality of half Circular bumps 64. The bumps correspond to the ribs 126 of the substrate 12, and when assembled, the bumps 64 are correspondingly overlapped with the ribs 126. Each bump 64
::開設有一安裝孔64〇,以供螺釘（圖未示）穿過並 於该凸肋126之螺孔1260内，從而將該燈罩4〇之 ，邊42通過該壓框6〇夾置固定到該基板12之容置槽 二5玄壓框60上靠近開σ 62處間隔開設有複數固 疋孔620 ’以固定安裝該保護罩50。 上述保濩罩50呈碗狀外形，其由金屬絲彎折、編 織而成。該保護罩50在外形上與該燈罩4〇對應一致， 在尺寸上稍大於該燈罩4〇，便於該保護罩5〇套置於該 =罩40之外周緣，以保護燈罩4〇避免直接受到外力碰 才里。严f護罩50之頂部邊緣向外水平延伸出一環邊 ^ %邊52上間隔開設有複數穿孔52〇。複數螺釘穿 過邊等穿孔52並對應螺合於該壓框6〇之固定孔62〇 内’從而將保護罩50固定於該壓框6〇上。 ，再次參閱圖1至圖5,組裝本發明之發光二極體 、且具時」，該等支架20通過螺釘固定於該基板12之底 面^，s亥等發光二極體模組3〇對應貼置於該等支架2〇 之安裝部24上，該壓框6〇將燈罩4〇固定於基板12之 ，面上，該等支架20與發光二極體模組3()共同罩置於 该燈罩40内，該保護罩5〇固定於該壓框6〇上並套置 於燈罩40之外周緣。 與習知技術相比，本發明之發光二極體燈具通過排 叹置在散熱器1〇之基板12底面之多個支架2〇而形 成所需之照明區域，達到相應之照明效果。當多個支架 201102573The opening 42 开设 is provided for a screw (not shown) to pass through the screw hole 1260 of the rib 126, so that the lamp cover 4 is folded, and the edge 42 is clamped and fixed by the pressing frame 6〇. A plurality of fixing holes 620' are spaced apart from the receiving groove 2 of the substrate 12 to be spaced apart from the opening σ 62 to fix the protective cover 50. The protective cover 50 has a bowl-like shape and is bent and woven from a wire. The protective cover 50 is identical in shape to the lamp cover 4〇, and is slightly larger in size than the lamp cover 4〇, so that the protective cover 5 is disposed on the outer periphery of the cover 40 to protect the lamp cover 4 from direct contact. External force touches. The top edge of the shield 50 extends horizontally outwardly from a ring edge. The % edge 52 is spaced apart from the plurality of perforations 52〇. The plurality of screws pass through the perforations 52 such as the edges and are screwed into the fixing holes 62 of the pressing frame 6'' to fix the protective cover 50 to the pressing frame 6''. Referring again to FIG. 1 to FIG. 5, the light-emitting diode of the present invention is assembled and assembled. The brackets 20 are fixed to the bottom surface of the substrate 12 by screws, and the light-emitting diode modules 3s corresponding to the shai Attached to the mounting portion 24 of the bracket 2, the pressing frame 6〇 fixes the lamp cover 4 to the surface of the substrate 12, and the bracket 20 and the LED module 3 are placed together. In the lamp cover 40, the protective cover 5〇 is fixed on the pressing frame 6〇 and is placed on the outer periphery of the lamp cover 40. Compared with the prior art, the LED lamp of the present invention forms a desired illumination area by smashing a plurality of brackets 2 disposed on the bottom surface of the substrate 12 of the heat sink 1 to achieve a corresponding illumination effect. When multiple brackets 201102573
20圍合成倒錐體發光區域時，設置在支架2〇之安裝部 24之外表面上之發光二極體模組3〇相應分佈在倒^體 區域之周邊，從而產生大角度照明之發光效果。另，本 發明之發光二極體燈具在工作中通過支架2〇傳遞發光 二極體模組30產生之熱量至基板12，繼而傳遞至散熱 鰭片14散發出去，整個散熱過程不僅在燈具内部進行 也在燈具外部進行，使得本發明之發光二極體燈具之散 熱效率較高，能夠保證燈具在較低之溫度下工^。同 ，，本發明之發光二極體燈具之各個結構間隙均設置有 岔封結構，適合在石油、化工、船舶、冶煉、採礦等各 種易燃易爆工作場所作為照明裝置使用。 、 综上所述，本發明確已符合發明專利之要件，遂依 ^提出專利申請。惟，以上所述者僅為本發明之較佳實 =方式’自不能以此限制本案之申請專利範圍。舉凡熟 悉本案技藝之人士援依本發明之精神所作之等效修飾 或變化’皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明一實施例之發光二極體燈具之立體组合 圖。 、 圖2係圖1中發光二極體燈具之元件分解圖。 圖3係圖1中發光二極體燈具倒置之立體組合圖。 圖4係圖1中發光二極體燈具倒置之元件分解圖。 圖5係圖3中發光二極體燈具之安裝件之元件分解 【主要元件符號說明】 散熱器 10 凸出部 120 容置槽 122 凸肋 126 散熱鰭片 14 基板 12 容置部 121 貫通孔 124 螺孔 1260 連接部 16 [S】 8 201102573 凹槽 160 安裝件 17 容置孔 170 安全連接件 18 軸孔 180 凹陷槽 182 壓片 184 支架 20 結合部 22 安裝部 24 連接板 26 發光二極體模組 30 電路板 32 發光二極體 34 光學透鏡 36 燈罩 40 卡邊 42 保護罩 50 環邊 52 穿孔 520 壓框 60 開口 62 固定子L 620 凸塊 64 安裝孔' 640 密封膠圈 100 密封墊圈 200 安裝片 300When the inverted cone-shaped light-emitting area is 20, the light-emitting diode modules 3 disposed on the outer surface of the mounting portion 24 of the bracket 2 are correspondingly distributed around the inverted body region, thereby generating a luminous effect of large-angle illumination. . In addition, the LED lamp of the present invention transmits heat generated by the LED module 30 to the substrate 12 through the bracket 2, and then is transmitted to the heat dissipation fins 14, and the entire heat dissipation process is not only performed inside the lamp. It is also carried out outside the lamp, so that the light-emitting diode lamp of the invention has high heat dissipation efficiency, and can ensure the lamp is operated at a lower temperature. In the same way, the structure gaps of the light-emitting diode lamps of the present invention are all provided with a seal structure, which is suitable for use as a lighting device in various flammable and explosive workplaces such as petroleum, chemical, shipbuilding, smelting and mining. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application. However, the above description is only the preferred embodiment of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective assembled view of a light-emitting diode lamp according to an embodiment of the present invention. 2 is an exploded view of the components of the light-emitting diode lamp of FIG. 1. 3 is a perspective assembled view of the inverted LED light fixture of FIG. 1. 4 is an exploded view of the component of the inverted LED lamp of FIG. 1. FIG. 5 is an exploded view of the mounting member of the light-emitting diode lamp of FIG. 3. [Main component symbol description] Heat sink 10 Projection portion 120 accommodating groove 122 rib 126 Heat-dissipating fin 14 Substrate 12 accommodating portion 121 through hole 124 Screw hole 1260 Connection part 16 [S] 8 201102573 Groove 160 Mounting piece 17 accommodating hole 170 Safety connecting piece 18 Shaft hole 180 Depression groove 182 Pressing piece 184 Bracket 20 Bonding part 22 Mounting part 24 Connecting plate 26 Light-emitting diode mode Group 30 Circuit board 32 Light-emitting diode 34 Optical lens 36 Lamp housing 40 Card edge 42 Protective cover 50 Ring side 52 Perforation 520 Press frame 60 Opening 62 Fixture L 620 Bump 64 Mounting hole ' 640 Sealing ring 100 Sealing washer 200 Mounting Slice 300
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