TW201043371A - Laser processing method, laser processing device, and manufacturing method of solar panels - Google Patents

Abstract

A laser processing method that can reduce as much as possible a processing time caused by laser light, a laser processing device and a manufacturing method of solar panels are provided. When a laser processing is performed on a glass substrate transported sequentially from a film-forming device that forms a transparent electrode layer, a semiconductor layer or a metal layer on the glass substrate, an alignment processing is performed on the glass substrate, and then the glass substrate is held and moved. The stages that perform the alignment processing and keep the glass substrate moving are installed at two positions on two sides of a laser processing stage, so that when one stage performs the laser processing, the other stage performs the alignment processing, and waiting time is reduced largely. In addition, even if any one of the stages is down due to failure etc, the other stage may be used to maintain the laser processing.

Description

[Technical Field] The present invention relates to a laser processing method, a laser processing apparatus, and a solar cell manufacturing method for processing a film or the like using a laser beam. In particular, a laser processing method, a laser addition device, and a solar cell manufacturing method capable of efficiently processing a film or the like with a Xiang Lei beam can be efficiently performed. [Prior Art] Conventionally, a solar panel is manufactured by sequentially forming a transparent electrode layer and a semiconductor layer metal layer on a light-transmissive substrate (glass substrate), and in each step after forming the layers The laser beam module is used to process the layers into strips to form a solar panel module (5) anal p·] module). When the solar panel module is manufactured in the manner described, on the film on the glass substrate, the laser beam is formed into a scribe line at a pitch of, for example, about mm (like (4). This scribe line is about the line width. It is composed of three lines of 30 μm and a line-to-line spacing of about 3 〇μιη. When a laser beam is used to form a line, the laser beam is usually irradiated on a constant-speed moving glass substrate. The degree and the line width are stable. The manufacturing method of such a solar panel (photoelectric conversion device) is known as a continuous mode Cm+nethod). A method of manufacturing a solar cell panel (photoelectric conversion device) of a continuous type is known, for example, in the method disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. Fig. 1 is a view showing an example of manufacturing of a conventional continuous solar cell panel (photoelectric conversion package). The manufacturing apparatus includes: moving into a robot. (robot station) (roller conveyor (r〇uer c〇nvey〇r)) 201043371 Ο

(4) Temporarily keeping the glass substrate 搬· 揪J processing table iG 'moved from the previous stage of the sputum device i2', forming a scribe line on the slab 1e; and = manipulator table (roller conveyor unit) 16 Temporarily ride the processed glass plate Id and carry the glass substrate 1 (} out into the film forming apparatus μ in the rear stage. Loading into the robot table (roller conveyor unit) 14 includes turning the front and back of the glass substrate lb On the back of the watch, the laser processing of the glass substrate ib is reversed and transferred to the laser processing station. The laser processing table includes the alignment portion i〇a, the gripper portion, and the gripper (grippe). _ moving part ^, processing area part view. The aligning part applies alignment processing to the glass substrate lc carried in by the loading robot stage (roller conveyor part) 14 at a predetermined position. The gripper part i〇b is kept right. The glass substrate lc after the quasi-treatment. The gripper driving unit 10C moves the glass substrate lc held by the gripper portion i〇b in synchronization with the laser beam of the processing region portion 10d. The processing region portion 1〇d will be Ray The beam is irradiated onto the glass substrate lc to perform predetermined processing. The machine is unloaded (roller conveyor unit) 16 includes a front and back inversion mechanism that reverses the front and back surfaces of the glass substrate lc, and the front and back surfaces of the glass substrate ld subjected to the laser processing are inverted, and then carried out as a glass substrate le to the film forming apparatus 18 of the next stage. In the conventional continuous solar panel manufacturing apparatus described above, the alignment process 10b on the laser processing table 10 performs the alignment process and the glass substrate transfer process. Therefore, there is a problem in the processing day. Outside the keeper, there is a lot of useless time for the special time, and the entire farm will be shut down when the mechanism of the aligning unit 1 〇b is down due to a failure or the like. [Invention] 5 201043371 The present invention is The object of the above is to provide a laser processing method, a laser processing apparatus, and a solar panel manufacturing method capable of shortening the processing time as much as possible. The first feature of the laser processing method of the present invention lies in Then, the glass substrate conveyed from the front stage device is subjected to the following steps in sequence, and the step is to face the predetermined position from the front stage. a step of performing alignment processing on the first glass substrate that has been carried out; and holding the first glass substrate after the alignment process and moving the first glass substrate relatively while irradiating the laser beam a step of performing laser processing on the second glass plate; and aligning the second glass substrate conveyed from the front device to a predetermined position while performing processing by the laser beam a step of processing; and after the processing by the laser beam is completed, the first glass substrate is carried out, and while the second glass substrate is held and the second glass substrate is relatively moved, the second glass substrate is irradiated The step of performing laser processing on the second glass substrate by the laser beam. The processing for irradiating the laser beam to the substrate is more compatible with the manufacture of solar panels, etc., when manufacturing solar panels, A metal layer, a semiconductor layer, and a transparent electrode layer are sequentially formed on the glass substrate. In each step of forming the respective layers, each layer is processed into a strip shape using a laser beam to form a solar cell panel. The front stage device is a device for forming a transparent electrode layer, a semiconductor layer or a metal layer on the glass substrate. When laser processing is performed on the glass substrate conveyed from these film formations, the glass substrate is first subjected to alignment processing. Then, the glass substrate is held and the glass substrate is moved. In the present invention, the alignment processing and the platform for holding and moving the glass substrate are performed. 201043371 is not placed on two sides of the laser processing platform, thereby performing laser processing on one platform, on another platform. The alignment process is performed thereon, so that the waiting time is greatly shortened. Moreover, even if any platform is shut down due to a malfunction or the like, another platform can be used to maintain the laser processing.

A second feature of the laser processing method according to the present invention is that, in the laser ji method + of the first feature, when the first processing of the beam is completed, the acquisition is completed. The image of both the shape change portion of the glass substrate and the portion of the edge portion formed by the initial processing is stored in the image == identification data (ID data) of the glass substrate, At the time of processing after the second or second time, the alignment processing is performed based on the ID data. In the past, when processing with a laser beam, it was necessary to perform the correction in each step. At the time of the first processing j performed by the laser beam, an image of a portion including the shape of the shape changed by the addition of the jade and the edge portion of the glass substrate is obtained, and Thus, the alignment processing before the processing after the next-time or the next-time is used. For example, when manufacturing the solar panel, both the til line including the laser processing and the edge portion of the substrate are obtained. An image of the part and an alignment process based on the acquired image before the laser processing. Since the image is such that it includes an image of both the shape-changing portion and the edge portion of the substrate, it has the effect of being easy to handle. For example, in the case of manufacturing solar electric power = plate, since the image towel includes both the image of the ¢/朗 image and the shape of the edge portion of the wire, the image recognition process is easy. Therefore, it is not necessary to use 7 201043371 to accurately align the alignment mark on the substrate. According to a third aspect of the laser processing method of the present invention, an image of the vicinity of the four corners of the glass substrate is obtained by the f-ray processing method of the i-th or the second feature, and the image is detected based on the image. A base (four) bend (wei Qu) or a notch near the four corners of the glass substrate. Machining with a laser beam is performed by illuminating the laser beam substantially perpendicularly on the abutment surface of the substrate. Therefore, if the substrate is bent (lightly curved) or the four corners of the substrate are notched, it is difficult to perform the processing accurately, and there is a possibility that the quality of the solar panel module may cause problems. Therefore, in the present invention, when the wire is moved to the processing position, an image near the four corners of the substrate is taken, and the bending (turd of the substrate) or the notch near the four corners of the substrate is detected based on the image. The relative position of the camera unit that acquires the image near the four corners of the substrate is a predetermined value set in advance, so that the position of each vertex in the image of each vertex of the four corners is biased, and the substrate can be detected based on the offset. The bending (warping), and the notch of the substrate can also be detected based on the image near the four corners. According to a fourth aspect of the laser processing method of the present invention, in the laser processing method of the second or third feature, an image of an outer periphery of the glass substrate is acquired, and the image is detected based on the image. Bending (warping) of the glass substrate and a notch of the outer periphery of the glass substrate. According to a fourth aspect of the laser processing method of the present invention, an image of an outer peripheral edge of the substrate is obtained, and the curvature (warpage) of the substrate and the notch of the outer peripheral edge of the substrate are detected based on the image. In order to acquire an image of the outer circumference of the substrate, 201043371 may be provided with an image acquisition unit that moves along the outer circumference of the substrate. At this time, one or more image acquisition units can be moved along the outer circumference of the substrate.第 Ο The first feature of the laser processing apparatus according to the invention is that the laser beam irradiation unit stipulates a laser beam by irradiating a laser beam to a glass plate of Mm, and performs a predetermined processing process, and the alignment unit is aligned to a predetermined position. The first glass substrate conveyed from the front stage device performs alignment processing; the second alignment unit performs alignment processing on the second glass substrate conveyed from the front stage device at a predetermined position; the first holding unit 'in the i-th After the alignment process of the alignment unit is completed, the ith glass substrate is held and the third glass is relatively moved with respect to the laser beam irradiation unit; the second holding i element is in the second alignment After the alignment processing of the unit is completed, the second glass substrate is held, and the second glass substrate (10) is oppositely sensed by the laser beam; and (4) the unit is controlled by the riding control The front-end device reads the following _ 彡 动作 依 · it · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · , the edge of the i-th substrate relative to the laser beam Performing, by the unit, the laser beam to process the first glass substrate, and performing the alignment processing on the second substrate by the second alignment unit, and performing the alignment processing on the first substrate After the processing of the i-th substrate is completed, the second glass substrate is carried out, and the second substrate is stored by the second material, and the second glass substrate is opposite to the second glass substrate. The laser beam riding unit performs relative shifting 9 201043371 Μ* «/〆' to process the second glass substrate using the laser beam. This invention is an invention of a laser processing apparatus for realizing the laser processing method described in the first feature of the laser blasting method. According to a second aspect of the laser processing apparatus of the present invention, the laser-added X-device towel of the second feature includes: an image acquiring unit, when the initial cleaning process by the laser beam is completed And acquiring an image including a portion where the shape changing portion of the substrate formed by the initial X processing (4) is a portion of the edge portion of the glass substrate; storing a unit that is stored by the ® image acquiring unit a surcharged image of the image as the ID data of the glass substrate; and a control unit that controls the first alignment unit and the first aligning unit according to the ship id (four) after performing the second or second processing 2 Alignment processing of the alignment unit. This invention is an invention of a laser processing apparatus for realizing the laser processing method described in the second feature sheet of the laser plus X method. According to a third aspect of the invention, in the laser processing apparatus of the ith feature or the second aspect, the second image acquiring unit includes: acquiring a vicinity of four corners of the glass substrate And the first detecting unit detects the bending (warpage) of the substrate or the vicinity of the four corners of the substrate according to an image near the four corners of the glass substrate acquired by the image acquiring unit gap. This invention is an invention of a laser processing apparatus for realizing the laser processing method described in the third feature of the laser processing method. A fourth feature of the laser processing apparatus of the present invention is that, in the laser-assisted device of the second, second or third feature, comprising: second image acquisition 10 201043371 unit 'acquiring the glass substrate The image of the outer periphery; the second detecting unit detects the bending (warpage) of the glass substrate and the gap of the outer periphery of the glass substrate based on the image acquired by the image acquiring unit . This invention is an invention of a laser processing apparatus that realizes a laser processing method recorded in the first feature of the laser processing method.

The method for producing a solar panel according to the present invention, characterized in that the laser processing method according to any one of the first to fourth aspects, or the one of the first to fourth features The laser processing device is used to manufacture solar panels. This invention is an invention for manufacturing a solar panel using either the laser processing method or the laser processing apparatus. [Effects of the Invention] According to the present invention, there is an effect that the processing interval of the laser beam can be shortened as much as possible. The above and other objects, features and advantages of the present invention will become more <RTIgt; 'β Embodiments Hereinafter, an embodiment of the present invention will be described based on the drawings. Fig. 2 is a view showing a schematic configuration of a lightning device; Tigers and scorpions solar panels manufacturing equipment (four) laser beam processing will be the step into the device. In the f-ray processing apparatus of the present invention, at the same time, the two waiting time processing sheets disposed on both sides of the processing table are simultaneously subjected to de-processing. (4) Shortened 11 201043371 FIG. 2 is a solar battery showing the present invention. A diagram of an example of a return mode of the board manufacturing apparatus. This manufacturing apparatus includes a loading/unloading machine table 14_1 and a laser processing table 1〇1. The roller conveyor 121 sequentially transports the glass substrate lx to the glass strand lz between the film forming apparatus, (not shown) and the manufacturing apparatus that performs the laser scribing processing. The carrying/removing hand 141 includes a glass substrate 1 that is formed by a film forming apparatus (not shown) that has been transported on the roller conveyor m, and is carried as a glass substrate The front and back inversion mechanism portion 143' in which the front and back surfaces of the glass substrate are inverted is inverted by the glass substrate lm according to the contents of the laser processing, and then transferred to the laser processing table 1〇1. At this time, the loading/unloading robot table 141 is configured as follows: (4) the substrate to the back surface of the miscellaneous table is directly transferred to the laser plus I stage 1 (n, and the glass substrate lm which has been inverted by the front surface is conveyed by a roller The right end position of the laser processing table 1〇1 is transported to the laser processing table 1G1. The loading/unloading robot table 141 uses the front and back turning mechanism unit 143 to process the glass processed on the laser processing table 1〇1. The substrate is directly received, or the glass substrate 1r received at the right end position of the f-addition 4 101 is transported to the front and back inversion mechanism portion 143 by light conveyance or air floating, and the front and back inversion mechanism portion M3 is used. The front and back surfaces of the glass substrate after the laser processing are reversed, and then transferred to the roller conveyor 121. The laser processing table 101 forms a scribe line on the film on the glass substrate carried in from the loading/unloading robot table 141. The laser processing table 1〇1 includes: alignment portions 102 and 104; gripper portions 106 and 108; a gripper driving unit 110; and a processing region portion 112. The alignment unit 1〇2 will be carried in/out of the robot table 141. 12 201043371 Surface back surface of the flip mechanism portion 143 The sheet lm is transferred, and the received glass substrate ln is aligned at a predetermined position, and the glass substrate subjected to the scribe processing in the processing region U2 is carried out to the loading/unloading robot table 141. On the other hand, the alignment unit 104 carries the glass substrate on which the front and back surfaces of the loading/unloading robot #141 are reversed by the front and back reversing mechanism unit 143, and is transported to the laser processing by light conveyance or air floatation. The glass substrate k up to the right end of the 101 is attached to and 'aligned' the received glass plate to a predetermined position, and the glass substrate lq subjected to the scribing process in the processing region 112 is carried out to carry in/ The gripper portion 106 is held at the right end position of the robot table 141. The gripper portion 106 holds the glass substrate 1A that has been aligned by the alignment portion 1〇2. The gripper portion 1〇8 is paired with the alignment portion 1〇4. At the same time, the rear glass substrate lq is held. When the laser processing is performed, the gripper drive 110 causes the laser of the glass substrate processing region portion 112 held by the gripper portion 1〇6 and the gripper portion 1〇8. Bunch synchronously, in glass The substrate i moves between the glass substrate lp and the glass substrate lp which is not shown by the broken line. The processing region portion 112 irradiates the glass substrate 1G and the glass substrate lq held by the grip portion um gripper portion (10) with a laser beam and performs predetermined scribing. In the processing of Fig. 2, a state in which the glass substrate 1 held by the gripper 1〇6 is moved to the position indicated by the broken line=the position of the glass substrate lq is performed, and the predetermined _ line processing is performed. The operation of the solar panel manufacturing apparatus of the reciprocating system of the second embodiment is carried out. First, the glass that has been transported by the parent conveyor m from the previous film formation is carried out by moving and unloading the robot hand 141. When the substrate & 13 201043371 ^ is the glass substrate &amp; (4), the surface f of the glass plate lm is inverted on the front and back rotation mechanism portion 143. The glass substrate lm after the table #_ has been transferred to the laser processing table 1〇1 (four) reference portion 1〇2, and alignment processing is performed on the portion 102. The glass substrate ln after the alignment process is held by the gripper = 106, and is moved as a glass substrate lQ, lp to the processing region ° to perform a predetermined scribing process. On the other hand, at the time of the alignment processing of the alignment unit 102 and the processing @_112 &gt;, the loading/removing robot (4) is passed, and the next glass substrate ly conveyed via the roller conveyor (2) is used as a glass substrate. 101, the surface protection flipping mechanism portion 143 is temporarily placed, and the front and back surfaces of the glass substrate lm are turned over. The glass substrate lm having the front and back turns is used as a glass substrate to be lightly moved to reach the laser processing table 1 (1). Immediately after the alignment portion is located at the right end position, the glass substrate 1r is transported to the alignment portion of the laser processing table 1〇1, and alignment processing is performed on the alignment portion 104. The glass substrate lq after the alignment process is held by the gripper portion 108, and waits until the processing of the glass substrate held by the gripper portion 1A6 is completed. When the laser processing of the glass substrate held by the gripper portion 106 is completed, the glass substrate 1 held by the grip portion 106 passes through the alignment portion 1〇2 and the position from the glass substrate In serves as the front and back inversion mechanism portion. The glass substrate lm on the 143 is temporarily held, and the front and back inversion mechanism portions 143 are reversed on the front and back sides, and then transported to the roller conveyor 121 to be conveyed to the film forming apparatus of the next stage. On the other hand, when the glass substrate 1 held by the gripper portion 1〇6 is moved on the alignment portion 1〇2 as the glass substrate ln, the glass substrate lq held by the gripper portion 108 is used as a glass substrate. 1〇, 14 201043371 ΐρ moves to the processing area unit 112 to perform predetermined scribing processing. In the reciprocating solar panel manufacturing apparatus of FIG. 2, by repeating the above processing alternately, the specific time of the alignment processing and the like are greatly shortened, and even if any of the alignment portions fails, another pair can be used. The department will continue to process. Fig. 3 is a view showing the details of the processing region portion of Fig. 2 in which the scribing process is performed. The processing area portion includes a base 1 〇, a χγ stage Ο table 20, a gripper portion 106, a laser generating skirt 4, an optical system member 50, a linear encoder (linear encoder), and a control device 8 〇 and detection of optical system components and the like. The base 1G is provided with a χγ stage 20 that is driven and controlled along the X-axis direction and the Y-axis direction (XY plane) of the base 10. The cymbal stage 20 is controlled to move in the X direction and the γ direction. Further, as the driving unit of the cymbal stage 2, a ball screw (a) screw or a linear motor (linear 〇 t〇r) or the like is used, and the driving unit of Fig. 3 is shown. On the upper side of the XY stage 2G, the glass substrate i which is the target of the laser processing is held by the gripper portion. Further, on the one side, the optical system member 50 is held while the x-axis is held. Slide-driven slide frame 30. Χγplant A White The Z axis is the rotation axis and is rotatable in the θ direction. Further, when the yoke stage 30 is sufficiently passed through the carriage 30 and the γ-axis stage 20 can be fluxed in the γ-axis field, the XY stage 20 may have a configuration in which only the y-axis is moved. At this time, the cymbal stage 20 may be an illuminating movement of the X car from the gantry, and the aligning portions 1 and 2, 104 are omitted in Fig. 3 . 〇, 成. Another 15 201043371 The carriage 30 is mounted on the four-corner moving table set on the base 10; A vibration damping member (not shown) is also placed. In the carriage 30 = =1 upper, a device 80 made of a sewing machine 4G and an optical system member 50 is provided. The optical system member 50 is composed of a combination of mirror surfaces (mirr〇〇, ^^ 〇enS). Each beam produced by the laser line 40 is divided into four series and guided to the χγ stage 2〇. On the glass soil 1 above. Further, the number of divisions of the laser beam is not limited to the four series, and it is only required to be two or more series. The linear encoder 70 includes a x-axis moving load provided on the χγ stage 2〇. a side ruler (seale) member; and a detecting portion mounted on the gripper portion ι6. The detection signal of the linear encoder 7〇 is input to the fourth control device 8, and the control device 80 detects the moving speed (moving frequency) of the gripper portion 106 in the X-axis direction based on the detection signal from the linear encoder, 7〇, and The output (laser frequency) of the laser generating device 4〇 is controlled. As shown in Fig. 3, the optical system member 5G is provided on the side surface side ' of the bottom plate 31 and is configured to move in the Y-axis direction along the side surface of the bottom plate 31. The front end portion of the optical system member 50 is rotatable about the Z axis. The bottom plate 31 is further provided with a galvanometer mirror (%) for guiding the laser beam emitted from the lightning generating device 4G to the vocational system component 5'. The galvanometer mirror 33 scans the laser beam in a two-dimensional region of XZ using two motors (rotary encoders). The galvanometer mirror % is constructed in a two-axis type (X, Z) and includes two motors and a mirror mounted on the motor. The galvanometer control unit 331 includes a driver and a power source for driving the electric motor 16 201043371, and a microcomputer for controlling the driver and the power source. The mirror surface 34 and the mirror surface 35 are disposed on the optical system member 50 in conjunction with the sliding movement of the optical system member 50. The laser beam emitted from the laser generating device 4 is reflected by the galvanometer mirror 33 toward the mirror surface 34, and the laser beam directed toward the mirror surface 34 is reflected by the mirror surface 34 toward the mirror surface 35. The mirror surface 35 guides the reflected laser beam from the mirror surface 34 into the optical ❹ system member 50 via the through holes that are again disposed on the bottom plate 31. Further, any configuration may be adopted as long as the laser beam emitted from the laser beam generating device 40 is introduced into the optical system member 5 from the upper side through the through hole provided in the bottom plate 31. For example, the laser generating device 40 may be disposed on the upper side of the through hole, and the laser beam may be directly guided into the optical system member 50 via the through hole. A beam samper 332 ^beam sampling is placed on the optical system member 5 之间 between the galvanometer mirror 33 and the mirror surface 34 in such a manner as to move together with the sliding movement of the optical system member 5 旎The 332 reads a portion of the laser beam (e.g., 'about 10% of the laser beam or less than 10% of the pupil) to sample and branch the output to an external component. The four-quadrant photodiode photodiode 333 is arranged to receive a portion (sampling beam) of the laser beam branched by the beam sampler 332 near the substantially center of the light receiving surface. The four output signals corresponding to the intensity of the field beam outputted by the four-quadrant photodiode 333 are output to the galvanometer control device 33M - the galvanometer control device 331 is based on the photodiode from the four quadrant The four output signals of 333, while driving (four) time, control the two motors 33xy of the galvanometer mirror 33, for example. The motor 3坳201043371 is controlled such that the reflected laser beam of the galvanometer mirror 33 is rotationally moved in a plane parallel to the upper surface (XY plane) of the bottom plate 31, and the motor 33yz performs immediate control to reflect the galvanometer mirror 33. The laser beam is rotationally moved in a plane parallel to a plane (YZ plane) orthogonal to the upper surface of the bottom plate 31. FIG. 4 is a view showing a detailed configuration of the optical system member 50. Actually, the configuration of the optical system member 50 is complicated. Here, in order to simplify the description, the illustration is simplified. Fig. 4 is a view of the inside of the optical system member 50 as seen from the -X-axis direction of Fig. 3 . As shown in Fig. 4, the bottom plate 31 has a through hole 37' for introducing the laser beam reflected by the mirror surface 35 into the optical system member 50. A phase diffractive optical element (DOE) 500 is disposed directly under the through hole 37 to convert a Gaussian intensity distribution laser beam into a top hat type (t〇p hat) intensity distribution. Laser beam. The laser beam 'converted to the top hat type intensity distribution laser beam (top hat type beam) by the DOE 500 is branched by the half mirror 5U into a reflected beam and a half mirror 512 of the transmitted beam 'reflecting beam to the right direction, The mirror 524 is advanced through the downward direction of the beam. The light beam reflected on the half mirror surface 5 is further branched into a reflected beam and a transmitted beam by the half mirror surface 512, and the reflected beam is advanced toward the mirror surface 522 in the downward direction, and the transmitted beam is advanced toward the mirror surface 521 in the right direction. The light beam that has passed through the half mirror M2 is reflected by the mirror surface 521, and is irradiated onto the glass substrate 1 via the condenser lens 541 in the lower direction. The filament reflected on the half mirror surface 512 is reflected by the mirror surface 522 and the mirror surface 523, and is irradiated onto the glass substrate i via the condenser lens 542 in the lower direction. The light beam transmitted through the half mirror 511 is reflected by the mirror surface 18 201043371 524 and proceeds to the left. The light beam reflected on the mirror surface 524 is branched by the half mirror surface 513 into a reflected light beam and a transmitted light beam, and the reflected light beam is advanced toward the mirror surface 526 in the downward direction, and the transmitted light beam is advanced toward the mirror surface 528 in the left direction. The light beam reflected on the half mirror surface 513 is reflected by the mirror surface 526 and the reflecting mirror surface 527, and is irradiated onto the glass substrate 1 via the condenser lens 543 in the lower direction. The light beam that has passed through the half mirror surface 513 is reflected by the mirror surface 528 and is irradiated onto the glass substrate by the condenser lens 544 in the lower direction. The top hat type light beam converted by the DOE 500 is transmitted through the half mirror surface 511 to the half mirror surface 513 and the mirror surface 521 to the mirror surface 528, and is guided to the collecting lens 541 to the collecting lens 544. At this time, the optical path lengths from the DOE 500 to the respective condensing lenses 541 to 544 are set to be equal. That is to say, the following optical path lengths are respectively equal distances: the optical path reflected on the half mirror surface 511 is transmitted through the mirror surface 512 and reflected by the mirror surface 521 to reach the collecting lens 541; the optical path length is reflected on the half mirror surface 511. The optical path length of the light beam reflected by the half mirror surface 512, the mirror surface 522, and the mirror surface 523 to reach the collecting lens 542 is long; the light beam transmitted through the half mirror surface 511 is reflected by the mirror surface 524, the half mirror surface 513, the mirror surface 526, and the mirror surface 527. The optical path length after reaching the condensing lens 543 after being reflected separately is long; the light beam transmitted through the half mirror 511 is reflected on the mirror surface 523 and then transmitted through the half mirror 513, and then reflected on the mirror surface 528 and then reaches the condensing lens 544. . Thereby, even if the DOE 500' is disposed before the beam branching, the laser beam of the top hat type intensity distribution can be guided to the condensing lens 541 to the condensing lens 544 in the same manner. Further, in the example of Fig. 4, the case where the optical path lengths are completely identical has been described, but it is also possible to make the filament length slightly different within the range in which the top hat type intensity distribution of the laser beam 19 201043371 can be maintained. The shutter mechanism 531 to the shutter mechanism 534 shields the emission of the laser beam when the laser beam emitted from each of the collecting lens 541 to the collecting lens of the optical system member 50 is deviated from the glass substrate 1. The autofocus distance measuring system 52 and the autofocus distance measuring system 54 include a detection light irradiation thunder (four) and an autofocus photodiode, a self-joking distance measuring system 52, and a self-riding distance measuring range (not shown). The system 54 receives the self-cleaning of the light towel irradiated from the laser for detecting the light irradiation! The surface is opposite (four) reflected light, and the condensing light 54i to the condensing lens 544 in the optical system member 5 is driven up and down according to the amount of the reflected light to adjust the height of the condensing lens 541 to the condensing lens relative to the glass plate 丨. (The focal length of the condensing lens 541 to the condensing lens 5). Further, the focal length adjusting drive mechanism is not shown in Fig. 4 . Fig. 5 is a schematic view showing the configuration of the first detecting optical system member and the second detecting optical system member. The first detecting optical system member includes a condensing lens height measuring system 26 and a charge coupled device (CCD) camera 28 for focal length and optical axis adjustment. In Fig. 5, since the condenser lens distance measuring system 26 and the focal length and optical axis adjusting CCD camera 28 are repeatedly shown, they are distinguished by symbols. When the height from the glass substrate 1 to the lower surface of both sides of the optical system member 5 is adjusted by the autofocus ranging system 5 2 and the autofocus ranging system 54 described in FIG. 4, even if optical can be made The height of the lower surface of the system member 5A is the same, and the height from the glass substrate 1 to each of the condensing lens 541 to the condensing lens 544 is not necessarily the same. Therefore, in the present embodiment, the condensing lens height ranging system 26 is attached to either side surface of the XY stage 20 in the X-axis direction (the side surface in the -X-axis direction of the χγ stage 20 201043371 20 in the drawing). The height from the glass substrate 1 to each of the collecting lenses 541 to 544 is measured. Signals corresponding to the heights of the respective condenser lenses 541 to 544 detected by the condenser lens height ranging system 26 are output to the control device 80. The control device 80 determines whether or not the horsepower from the glass substrate 丨 to each of the condensing lenses 541 1 to the optical lens 544 is appropriate. The arrangement (height) of each of the condensing lens 〇 541 ～ concentrating lens 544 is adjusted in accordance with the distance measurement result of the condensing lens height ranging system 26. At this time, the arrangement (height) of the condensing lens 541 to the condensing lens 544 can be manually or automatically adjusted. Further, if the height of the lower surface of the optical system member 50 is measured using the condensing lens height ranging system 26, the autofocus ranging system 52 and the autofocus ranging system 54 can be omitted. The focal length and optical axis adjustment CCD camera 28 is provided on either side of the X-axis direction of the XY stage 20 (the side in the _ χ direction of the χ γ stage 2 图 in the drawing) and is adjacent to the concentrating lens height ranging. The location of system 26 (nearby). The focal length and optical axis adjustment CCD camera 28 associates the XY stage 20 with the position of each of the condensing lens 541 to the condensing lens 544 of the optical system member 50, and is provided so that the upper side of the XY stage 20 can be seen. The image captured by the CCD camera 28 by the focal length and optical axis adjustment is output to the control device 80. The control device 80 determines whether or not the optical axis of the laser beam emitted from each of the condensing lens 541 to the condensing lens 544 is appropriate. That is, the focal length and the optical axis are adjusted. (4) The CCD camera 28 can directly observe the optical system component 50. Each of the condensing lens 541 to the condensing lens 544 emits a laser beam. Therefore, by imaging the laser beam, the control device 80 can illuminate the focal length of each of the poly 21 201043371 and/or the 41 dimer _ mirror 544. Whether the optical axis is suitable or not is determined by the milk and light (four) components 5 of the laser generating device. Equal distance and optical axis. In addition, when the finer image is adjusted and the digitized head is adjusted, the unevenness of the ground is adjusted by acquiring each of the laser beams. The optical system member 5G^9=beam_93 is placed in the optical path of the beam, the beam sampler 92 tm beam. The present embodiment 40 and the reflective shovel-like state 93 are provided in the laser generating device to measure the amount of light under the laser beam sampling 11 92 and the beam sampler 93 by about 4% or 4 of the laser beam. The % is configured with the diode 94 as an external component. The high-speed optoelectronic sampler 92 receives the portion (sampling beam) of the beam passing through the beam of the high-speed photoelectric body near the large fiscal center. The branch 93 corresponding to the laser beam (four degrees) corresponding to the output signal _ is branched and connected to the vicinity of the center (four) of the beam sampling axis for inspection by the CCD (sampling beam). Passing light 80. In addition, the image of the light secret apricot/photograph is output to the control device and irradiated to the high-speed photodiode, and the image indicating the position of the image output to the controlled laser beam can be taken in, and 22 ❹ 〇 201043371 The detection of the auxiliary 7G detection signal and the control of the laser generating device movement frequency), and the secret electric electrode 94 and the optical axis inspection CCD camera beta detection from the laser generated decoration 4η mountain 1 m. .  The pulse of the emitted laser beam is omitted, or the root/earth, first axis offset is used to control the exit bar of the laser generating device 40. The mirror of the laser beam is introduced into the SSI optical system member 5〇_〇1). The configuration of the fifth is performed such that the feedback control is performed. The alarm 82 is generated by the alarm 82. The alarm generation unit 83 has the details of the processing of the control unit 83. The alarm generation unit 83 has a buffer unit 81 and a pulse omission determination unit 87 〇aSer. C〇ntr^r) 86 ^ it bear production - (10), lens adjustment unit 88, illumination laser ~, Huan 2nd morning 89 and illumination laser adjustment unit 8A. The branch unit 81 branches and outputs the detection signal (clock pulse, f _ ) of the linear encoder 7 到 to the laser controller 86 of the subsequent stage. The pulse laser beam input is determined by the wheel-out field (diode output) corresponding to the beam intensity from the high-speed photodiode 94 and the slave branch unit, and is determined based on these signals. 7(A) to 7(B) are diagrams showing an example of the operation of the pulse miss determination early 82 in Fig. 6. Fig. 7 (Α) to Fig. 7 show detection signals, _, _, which are rotated from the branch unit 81. For example, Fig. 7 (Β) shows an example of an output signal corresponding to the intensity of the laser beam output from the high-speed photodiode 23 201043371 94, and Fig. 7 (C) shows the missing output of the pulse omission determination unit 掏). Alert signal system i. #_出_ As shown in Fig. 7(4) to Fig. 7(C), the pulse is determined by the falling of the clock pulse from the branching unit 81 '1疋 early 70 82' to determine the diode transmission point as a trigger. The threshold value Th of the signal is smaller than the diode output value is smaller than the level determining unit 82 to the alarm generating unit 83. At the time point from the pulse omission determination sheet 1 (Mevd) becomes a high level, the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity磬箄 磬箄 every record, s 〇 § § can be realized by the operator (operator) can be aware of the pulse. The performance of the financial line is degraded or the quasi-CCD image 84a in the reference CCD image storage unit 84. This reference has a light receiving frame of the CCD camera % as shown in Fig. 6 and is not in the optical axis inspection image. The image to be inspected from the state in which the laser beam is received by the CCD m for the optical axis inspection. The fine-biased output is as shown in Fig. 6. The CCD camera 96 unit 85 takes in the image from the optical axis image 85a and the reference coffee image. = Check the image 85a, and check the amount of the image, and turn the offset out to Ray = Compare ' to measure the offset of the optical axis (10) Camera 96 wheel] Thunder = Controller 86. For example, When an image such as the image to be inspected 85a 24 201043371 shown in FIG. 6 is emitted from the optical axis 1, the optical axis The offset measuring unit 85 compares the two images with the amount of offset in the axial direction and the γ-axis direction, and outputs the offset to the laser controller 86. The laser controller 86 pairs Feedback adjustment is performed between the device related to the optical axis of the laser beam, that is, the emission condition of the laser generating device 4, or the arrangement of the mirror surface 33 to the mirror surface 35 for introducing the laser beam into the optical system member 50, and the like. The image to be inspected 85a is made to coincide with the reference CCD image 84a. 透镜 The lens displacement amount measuring unit 87 is input with the respective condensing lenses 541 to 544 that are detected by the condensing lens height ranging system 26 After the signal corresponding to the degree, it is determined whether the intensity of each of the condensing lens 541 to the condensing lens 544 is within the allowable range or a large deviation from the allowable range, and the concentrating lens indicating a large deviation is indicated. The degree of adjustment of the twist of the 541 to concentrating lens 544 is preferably a good control signal output to the lens height adjusting unit 88. The lens height adjusting unit 88 adjusts each collecting lens based on the control signal from the lens displacement measuring unit 87 541 In addition, when there is no height adjusting mechanism of the collecting lens 541 to the collecting lens 544, the lens height adjusting unit 88 can also be concentrated based on the control signal from the lens displacement amount measuring unit 87. Which of the light lens 541 to the condensing lens 544 is adjusted to the extent that the adjustment information is transmitted (visible display, sound, etc.) to the operator. The illumination laser state inspection unit 89 acquires the adjustment from the focal length and the optical axis. The image 89a of the CCD camera 28 measures the focal length and the offset of the optical axis based on the image 8%, and outputs the offset to the illumination laser adjusting unit 8A. For example, when an image 89a such as 25 201043371 FIG. 6 is outputted from the focal length and optical axis adjustment CCD camera, the laser state inspection unit 89 is irradiated with the circular rim line 89b in the image 89 &amp; The position of the focus circle (the small circle in the image 89a) is detected based on the line corresponding to the outer n of the light lens 541 to the condensing lens 544, and is based on whether or not the focus circle 89c is located at 8% of the contour line: The amount of shift in the X-axis and Y-axis directions of the optical axis is measured, and this offset is output to the illumination f-adjusting unit 8 A. Further, the irradiation laser state inspection unit 89 measures the size (area) of the focus circle 89c, and irradiates the entire material SA based on the coke age of $. The riding laser adjusting unit 8A performs the respective half mirrors 511 to half mirrors 513 and the mirror surface in the filament component % based on the signal corresponding to the shift amount and the focus position of the irradiation #ray inspection unit 89 from the optical axis. The configuration of 521~mirror surface 528 is equal to 4 feedback adjustment. Further, the lens height adjusting unit 88 and the irradiation laser unit may be omitted, and the laser control (four)% has the function of these units. In the embodiment, the optical axis shift amount measuring unit 85 is used to check the optical axis offset of the laser beam at the time of laser processing (scoring processing), and the pulse omission determination unit it 82 is used to check the missing pulse. The case has been described, but as shown in Fig. 8, the pulse state of the laser beam can be checked based on the output waveform from the high-speed photodiode 舛. For example, in Figure 8, the pulse width and pulse height of the laser beam can be measured and an alarm is issued when an abnormality occurs at this pulse height. Further, when the period from the high-speed photodiode 94 whose round-out waveform is greater than the value is within a predetermined range, it is determined as a pulse width positive film ', and when the time period is larger or smaller than the predetermined range It is judged as pulse &amp; width: and: 26 201043371 An alarm is issued. In addition, for the pulse height of the laser beam, when the maximum value of the output waveform from the high-speed photodiode body 94 exists within the allowable range, it is determined that the pulse is normal, and the maximum value is greater or smaller than the allowable range. When the range is determined, the pulse height is abnormal and an alarm is output. In this way, since the laser is frequently sampled, it is possible to instantly manage the product y of the laser beam such as the pulse width and the pulse height (power). If the above-mentioned pulse leakage rate & occurs, it can be judged that the performance of the laser generating device is deteriorated or the lifetime of the laser is exhausted. 9(A) to 9(C) are views of the optical system member of Fig. 3 as viewed from the lower side (substrate side). Parts of the optical system member 50 and the bottom plate 31 are shown in Figs. 9(4) to 9(c). Fig. 9(A) is a view showing the positional relationship between the optical system member 50 and the bottom plate 31 of Fig. 3, as shown in Fig. 8), the end surface of the optical system member 50 (the upper end portion of the drawing), and the end surface of the bottom plate 31. (upper side of the figure) - Fig. 9(B) is a view showing a state in which the optical system member 50 is rotated about 30 degrees counterclockwise with respect to the center of the through hole 37 as a rotation axis. (C) of FIG. 9 is a view showing a state in which the system member 50 is rotated counterclockwise by about 45 degrees with respect to the bottom plate 31 with the center of the through hole 37 as a rotation axis. In the solar panel manufacturing apparatus of the present embodiment, the optical system member is a through hole 37 which is a guide hole of the U laser beam, and the rotation axis is sufficient to rotate freely. That is, the optical system configuration 0 as the branching unit is controlled to rotate by the d_E 500 from the mirror surface 35 of Fig. 4 and the traveling direction of the straight laser beam to the half mirror 511 (four) as the central axis. Thereby, the branching direction of the laser beam can be freely controlled in a variable manner. 27 201043371 The angle θ formed by the relative movement direction of the laser beam with respect to the substrate (the vertical direction in the drawing). In addition, the (m) rotary drive unit can be used with a ball screw or a linear display technique. Figures 9(A) to 9(c) omits these units as shown in Fig. 9(A) to Fig. 9 ( (^你·- „ The direction of the branch and the scanning direction of the laser beam I, when the angle formed is variably controlled, d〇e 500 is also ΐ = = brother I bearing the lens 544, the laser beam The illumination shape is as shown by the dotted square. Therefore, the wire member rotates (4) to rotate, and the rotation of the two phases is at the corners of the two squares of the scribe line. Rotation control two ": structure 3 so. ,,, η〇Ε 5〇〇^^ ;^);^ ::through =\(Γ9(Α)~Fig. 9(c) in the vertical direction) and 2 =: the left and right sides of the dotted square in the mirror 544 The ridges on both sides of the spine are formed to be extremely smooth, and only the optical path of the beam is set; ==== 28 201043371 It is also possible to set doe before each of the branched condensing lenses. At this time, it is also necessary to configure not to rotate each DOE even if the optical system member 50 is rotationally controlled. The DOE 500 can be made independent of the rotation of the optical system member 50 by directly attaching the DOE 500 to the bottom plate 31 in a form separate from the optical system member 50. Fig. 10 (A) to Fig. 1 (C) are diagrams showing the relationship between the amount of rotation of the optical system member and the pitch of the scribe lines. FIG. 1A is a view showing a state of a scribe line when the laser scribing process is performed in a state where the optical system member 50 is not rotated as shown in FIG. 9(A), and FIG. 10(B) is a view. The state of the scribe line at the time of performing the laser scribing processing in the state in which the optical system member 50 shown in FIG. 9(B) is rotated by about 30 degrees is shown, and FIG. 1(C) is shown in FIG. (C) A diagram showing a state of scribing at the time of performing a laser scribing process in a state where the optical system member 50 shown in (C) is rotated by about 45 degrees. When the pitch of the scribe lines in the case of FIG. 10(A) is p〇, the pitch P30 in the case of FIG. 10(B) is P〇xcos30. The pitch P# in the case of Fig. 10(C) is P〇xcos45. . As described above, the solar panel manufacturing apparatus of the present embodiment can appropriately adjust the pitch of the scribe lines to a desired value by appropriately adjusting the rotation angle ' of the optical system member 5'. FIGS. 7(A) and 5(B) are diagrams showing an example of the substrate detecting camera system provided in the aligning unit 1 and the aligning unit 104 of FIG. 2 . Fig. 11 (Α) is a side view showing the relationship between the glass substrate and the substrate detecting camera. Fig. 11 (Β) is a top view showing the relationship between the glass substrate and the substrate detecting camera. A substrate detection camera system and an alignment camera system are provided in the alignment unit 1 and the alignment unit 1 to perform glass substrate inspection 29 201043371 processing and alignment processing of the glass substrate. When the glass substrate 丨 is placed on the alignment portion 102 and the alignment portion 1〇4, the substrate detection camera 65 to the substrate detection camera 68 acquire an image near the four corners of the glass substrate 从 from the upper side of the glass substrate 1. 11(A) and 11(B) show that the glass substrate i is placed on the alignment portion 102 and the alignment portion 104, and the grip portion 1〇6 and the gripper portion 108 are held in the X-axis direction. Moved and will be put into the state before the laser processing station 1〇1. The images 65a to 68a shown in Fig. 11(B) are images near the four corners of the glass substrate 1 acquired by the substrate detecting camera 65 to the substrate detecting camera 68. Since the relative positional relationship between the substrate detecting camera 65 and the substrate detecting camera 68 is a predetermined value set in advance, the vertices of the four corners of the glass substrate 1 without warping or bending are shown as the images 65a to 68a. It is set to be located near the approximate center of the imaging range of the substrate detection camera 65 to the substrate detection camera 68. Therefore, when the positions of the vertices in the images 65a to 68a are shifted, the bending (warpage) of the glass substrate 1 can be detected based on the amount of shift. Further, a notch near the four corners of the glass substrate 可以 can be detected based on the images 65a to 68a. Further, by moving the substrate detecting camera 65 to the substrate detecting camera 68 along each side of the glass substrate 1, the notch of each side of the glass substrate 1 can be detected. Figs. 12(A) to 12(C) are views showing another example of the substrate detecting camera system provided in the aligning portion 1?2 and the aligning portion 104 of Fig. 2. In the embodiment of FIGS. 11(A) and 11(B), the substrate detecting camera 65 to the substrate detecting camera 68 are disposed at the upper portion near the four corners of the substrate 1. In the present embodiment, the two substrates are detected by the camera 65. 30 201043371 Ο 基板 The substrate detecting camera 68 is located on the upper side of the diagonal of the glass substrate 丨. In Fig. 12 (Α), in a state where the glass substrate 丨 is placed on the alignment portion 1〇2 and the alignment portion 104, the glass substrate i indicated by the broken line is moved to the right side from the dotted line position by the arrow indication. And moving to the position of the glass substrate i shown by the solid line (the substrate detecting camera 65 and the substrate detecting camera 68 are located at the upper position of the diagonal of the glass substrate 1 when the glass substrate 丨 moves, the substrate detecting camera 68 acquires the moving An image of the side la of the glass substrate 。. Then, when the movement of the substrate is completed, the substrate detecting camera 65 and the substrate detecting camera 68 acquire an image of the vertex near the diagonal of the glass substrate! (image 65a and figure of FIG. 11) Then, in a state where the glass substrate i is stopped, the substrate detecting camera 65 and the substrate detecting camera 68 move along the dotted arrow as shown in Fig. 12(B). Here, the substrate detecting camera 65 and the substrate detecting camera 68 move. At the time, the substrate detecting camera &amp; acquires an image of the side ib of the glass substrate 1, and the substrate detecting camera 68 acquires an image of if lc of the glass substrate 1. When the substrate detecting camera 65, the substrate detecting photograph When the movement of the machine 68 is completed, the substrate detecting camera 65 and the substrate detecting camera 68 acquire the image of the vertex near the other diagonal of the glass substrate, the image 66a of the image 11, and the image 67a). After that, in a state in which the substrate detecting camera 65 and the substrate detecting camera 68 are stopped, the glass substrate ι======================================================================= The glass substrate i shown in the job line is placed. When the glass substrate 1 moves, the substrate detecting camera 65 acquires the side 1d_image of the glass substrate 1 that is moving. The two substrate detection cameras 65 and the substrate detection cameras 201043371 68 can be used by the above-described series operation, and the images 65a to 6a and the substrate 丄 are acquired in the same manner as in the case of FIGS. U(A) and (u). The image of the side. Thereby, it is possible to detect the curvature of the glass substrate 1 or the notch of each side of the substrate 根据 based on the amount of shift of the position of each vertex of the image 65a to the image 68a. Further, after the - series detection operation is completed, the substrate detecting camera 65 and the substrate detecting camera 68 can be returned to the initial position of Fig. 12 (4), or the opposite operation can be performed without returning. Fig. 13 is a view showing an alignment of the aligning portion 1 〇 2 and the aligning portion 1 〇 4 of Fig. 2; An image of the vicinity of both end portions (front and rear edge portions in the X-axis direction) of the glass substrate 1 is obtained by the camera. This (4) image obtained by the alignment camera is outputted into the dragon device 8〇. The control device 80 stores the image from the alignment camera (10) and the ID data of the glass substrate 1 in a database (plus coffee) unit, and uses the alignment processing of the glass substrate 1 thereafter. Fig. 13 is a view showing an example of an alignment portion before the first scribing process, and Fig. 14 is a view showing an example of an alignment portion before the second or second post scribing process. First, as shown in the figure, the lower edge portion of the left end portion of the glass substrate 1 is brought into contact with the positioning member 2 in a state where the glass substrate 1 is placed on the alignment portion and the alignment portion iG4. The left edge portion of the lower end portion of the glass substrate 1 is brought into contact with the positioning pin 22 ′ so that the right edge portion of the lower portion of the glass substrate 1 abuts against the positioning pin 23 ′ to position the glass substrate 在 in the regulation position. In this state, the transparent electric light on the glass substrate 1 is irradiated with a laser beam to perform a shutdown process. The result of the initial scribe process is formed on the glass substrate 以 with a scribe line formed on the surface of about 1 (). 32 201043371 Check the I] line ϋ] in the scribe line system located in the middle of the substrate in the vicinity of the center of the substrate, the alignment camera system is obtained, and the part of the line 25 is obtained. The image 27a and the image 29a in the vicinity of the edge portion _ ' ° 29 of the substrate 1. As observed in the image 27a and the image 29a, since the image includes both the image of the scribe line 25 and the image of the shape of the edge portion of the glass substrate 1, it is easy to enter the image recognition processing 1 over control device. 80 (four) acquired images

The Ja? is sequentially stored in the material library unit 75 as the 1D data of the glass substrate 1. As shown in FIG. 13, when the image 27a and the image 29a_taking process are completed after the scribing process by the laser processing is completed, the film forming apparatus of the lower stage is formed on the transparent electric_ Processing of the semiconductor layer. After the semiconductor layer forming process has been completed, the glass substrate i performs the same laser beam scribing process as described above. In the shovel performing this second scribing process, the alignment process is performed by the method as shown in FIG. In the same manner as in the first alignment process, the lower edge of the left end portion of the glass substrate j is placed in a state where the glass substrate i is placed on the alignment portion 102 and the alignment portion 1〇4. The portion abuts against the positioning pin 21, and the left edge portion of the lower end portion of the glass substrate 1 abuts against the positioning pin 22, and the right edge portion of the lower end portion of the glass substrate 1 abuts against the positioning pin 23, thereby The glass substrate 1 is positioned at a predetermined position. In this state, the image 27b and the image 2 in the vicinity of the both end portions of the scribe line 25, that is, the portions 27 and 29 including both the scribe line 25 and the edge portion of the glass substrate 1 are obtained by the alignment camera system. %. On the other hand, the control device 80 reads out, from the database unit 75, the image 27a of the ID data of the glass substrate 1 of 201033371, the image 27a read by the figure (4), the image 29a, and the image: The acquired image 27b and the image 29b are compared to control the H 糸 = axis and the Θ axis so that the image is turned off, and the image 27a and the image complex 27b are used in the manner shown in FIG. When the image 29b_ is processed in alignment with the processing, the upper and lower scribe lines 25 are separated from the position of about 30 handsome, and the scribe line processing is performed. When it is difficult to end at this moment, a process of forming a metal layer on the semiconductor layer is performed in the lower film. The substrate is again ejected to the laser processing apparatus, and the same alignment processing as in Fig. 14 is performed, and the scribing process is performed on the glass substrate 1 by the laser beam. Thereby, three scribe lines are formed on the substrate 1. Fig. 15 is a view showing an example of a loop mode of the solar panel manufacturing apparatus of the present invention. In Fig. 15, the same components as those in Fig. 2 are denoted by the same reference numerals, and the description of these portions will be omitted. This manufacturing apparatus is different from the manufacturing apparatus of FIG. 2 in that the alignment portion 1〇4 existing on the laser processing table 1〇1 of the manufacturing apparatus of FIG. 2 and the loading/unloading robot stage 142 are omitted. Transfer from the right side to the left side of the figure. Therefore, in the manufacturing apparatus of Fig. 15, the glass substrate lm carried into the front and back turning mechanism portion 143 is aligned as the glass substrate ln by the alignment portion 102. Then, the glass substrate ln is subjected to predetermined processing in the processing region portion 112 as the glass substrate 〇 and the glass substrate lp. The glass substrate after processing is transferred from the laser processing table 1〇1 to the right end of the loading/unloading robot table 142 as a glass substrate lr, and is transported to the front and back turning mechanism unit as a glass substrate hn from the glass 34 201043371. In the manufacturing device where the l4 mechanism unit (4) is used to listen to the watch, (4) in the manufacturing device of the miscellaneous table=turn=, in the laser force, the alignment process is performed by the alignment ship. When the laser processing is completed, the gripper unit immediately transports the glass plate to the loading/unloading robot table 142, and then the gripper portion is just smashed.

= portion 1 〇 2 and holding the glass substrate 'for the same laser processing. That is to say, the glass plate of the glass plate moves in a circular shape on the system. Therefore, the 'tact time' is slightly larger than the case of Fig. 2, but the apparatus can be simplified since only one table f-side mechanism unit (4) is provided. Fig. 16 is a view showing another example of the reciprocating mode of the solar panel manufacturing apparatus of the present invention. In Fig. 16, the same components as those in Fig. 2 are denoted by the same reference numerals, and the description of these portions will be omitted. This manufacturing method differs from the manufacturing apparatus of FIG. 2 in that the substrate transport robot 146 of the handling arm type is used to carry in the glass substrate with respect to the parent conveyor (2) and the front and back turning mechanism unit 143. / Move out of the king. Therefore, in the 'manufacturing apparatus of the ® 16', the glass substrate lx is carried from the roller conveyor 121 to the front and back reversing mechanism portion I43, and the front and rear reversing mechanism portion 143 is subjected to the back surface turning processing, and the new sheet is transported as the glass substrate In. The alignment unit 1〇2 or the substrate transport robot 146 is used as the glass board lf, and the right end of the under-loading/(four) robot table 144 is transported to the laser processing unit (10), which is the same as in FIG. The alignment processing is performed using the alignments 4 102 and the alignment portions 1〇4 on both sides, and then the laser processing is performed. In addition, a front and back surface 35 201043371 reversing mechanism portion may be additionally provided in the portion of the glass substrate, and the front and back reversing mechanism portion 143 may be omitted, and the roller conveyor 121 and the loading/unloading robot table 144 may be disposed. Other forms of the moon surface flip mechanism. Figure π is a view showing an example of a double side mode of the solar panel manufacturing apparatus of the present invention. In this example, the substrate of the laser processing table 101 including the alignment portions 102 and 1B of Fig. 2 is smuggled/unloaded. In Fig. 17, the same components as those in Fig. 2 are denoted by the same reference numerals, and the description thereof will be omitted. This manufacturing apparatus is different from the manufacturing apparatus of FIG. 2 in that a roller conveyor 121, a roller conveyor 122, and a roller conveyor 121' roller conveyor are provided on both sides of the laser processing 纟1〇1. The front and back inversion mechanism portion 147 and the front and rear inversion mechanism portion 148 are provided in the 122. Therefore, in the manufacturing apparatus of Fig. 17, the roller type conveyors 121 and the light conveyors 122 on both sides sequentially pass the front and back inversion mechanism portions 147 and the table in accordance with the glass substrates 1χ1, 1χ2, lyl, ly2, lzl, and 1ζ2. The inversion mechanism unit 148 is carried in and out to the alignment unit 1 and the alignment unit 104. Similarly to Fig. 2, the laser processing table 1〇1 performs laser processing on the glass substrate which has just been aligned by the alignment portion 102 on both sides and the alignment portion. Further, when the front and back turning mechanism portions are not required, the front and back turning mechanism portion 147 and the front and rear turning mechanism portion 148 may be omitted. In the above-described embodiment, the case where the image of the scribe line formed on the glass substrate 1 including the result of the initial scribe process is acquired is described, but the result including the second scribe process may be acquired. An image of two scribe lines formed on the glass substrate 1 and used for alignment processing. Moreover, in the above-described embodiment, the pairing is provided with the alignment 36 201043371 2, and the moving mechanism of the camera system can be arranged in the alignment camera system. Phase, system has a substrate system _ machine 65 ~ base New (four) S &amp; 0 In the implementation, only the occurrence of pulse omission is observed, but

Ο and two: the coordinate data (position data) of the missing part of the production m and the second modification of the Wei line (repairt a ^ the method of the application of the method, riding the instructions for the following situation; with a CCD camera 96 to directly receive the - portion (sampling beam) of the laser beam output by the beam sampler 93, and image-process the beam, thereby checking the impurity offset, but also using the optical axis inspection A CCD camera 96 or a quadrant type photodiode is used to acquire an image indicating a state in which the laser beam is received at the center of the high-speed photodiode 94, and the image is inspected, thereby checking the optical axis. In the above embodiment, the optical axis offset of the laser beam and the omission of the laser beam are checked, but the sister shift, the pulse omission, the pulse width, and the pulse height may be appropriately combined. The state of the laser beam is checked. In the above-described embodiment, the case where the surface of the glass substrate 1 on which the thin film is formed is irradiated with a laser beam to form a scribe line (groove) on the film has been described, but it may be from the glass. The back surface of the board i is irradiated with a laser beam to form a scribe line on the film on the surface of the substrate. In the above-described embodiment, the solar cell panel manufacturing apparatus is taken as an example 37 201043371, but the present invention is also applicable to electro-optical A device for performing laser processing such as an illumination (electiO-luminescence 'EL) panel manufacturing device, a disorder panel correction device, a flat panel display (FPD) correction device, etc. Although the present invention has been disclosed above in the preferred embodiment, </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Brief Description of the Drawings: * An example of a continuous solar panel (light-emitting device) in the electrical conversion device. The schematic view 2 of the laser processing device is a schematic configuration showing an embodiment of the present invention. Fig. 3 of the processing region portion of Fig. 2 is a view showing a detailed configuration of the scribing processing. Fig. 2 is a diagram showing the detailed configuration of the optical system member 5A. Fig. 5 is a view showing the configuration of the first detecting optical system. Fig. 6 is a schematic view showing the configuration of the control unit. Fig. 6 is a view showing the details of the processing of the control unit 80 of Fig. 2 ( A) to (c) of Fig. 7 are diagrams showing an example of the operation of Fig. 6. The pulse vacancy determination chart 8 is a diagram showing an example of the high-speed photoelectric _ of Fig. 4. The waveform of the output of the electro-polar body ~ 38 201043371 Fig. 9 (A) to Fig. 9 (C) are views of the optical system member of Fig. 3 as viewed from the lower side (substrate side). Fig. 10 (A) to Fig. 10 (c) show the rotation of the optical system member. Fig. 11 (A) and Fig. 11 (B) are diagrams showing an example of a substrate detecting camera system provided in the aligning portions 1 and 2, 104 of Fig. 2 . 12(A) to 12(c) are diagrams showing the alignment portion 1〇2 of FIG. 2;

A diagram of another example of the substrate detection camera system provided in 104. Fig. 13 is a view showing i of the alignment camera system provided in the alignment portions 102 and 1B of Fig. 2, and is a view showing a preliminary processing before the first scribing process. Fig. 14 is a view showing an example of an alignment camera system provided in the alignment portions 1A2, 1B4 of Fig. 2, showing alignment processing before the second or second etching process. Figure. Fig. 15 is a view showing an example of the circumstance of the solar cell manufacturing apparatus of the present invention. Fig. 16 is a view showing another example of the reciprocating mode of the solar panel manufacturing apparatus of the present invention. Fig. 17 is a view showing an example of a double type of the solar cell manufacturing apparatus of the present invention. [Description of main component symbols] 1 la 〜lz, lm~lr, 1x1, 1x2, lyl, ly2, lzl ^ lz2 - n slab substrate δ δ illuminating laser adjustment unit 39 201043371 ίο 101 10a, 102, 104 10b, 106 , 108 10c , 110 lOd &gt; 112 12, 18 14 machine part 16 machine part) 20 21 , 22 , 23 25 26 27 ' 29 27a, 27b, 29a, 29b 28 camera 30 31 33 33xy, 33yz 34, 35, 521 ～ 528 Laser processing table and base laser processing table Alignment part Gripper gripper drive part Processing area Part film forming device is loaded into the robot table (Successful Kunming transport and unloading robot station (Personal transport XY stage positioning) Pin-lined condenser lens height ranging system parts 65a~68a, 89a image

Focal length and optical axis adjustment CCD Slider floor galvanometer mirror motor mirror surface 40 201043371 Ο 〇 37 Through hole 40 Laser generating device 50 Optical system member 52 ' 54 Autofocus measuring system 65- '68 Substrate detecting camera 70 Linear encoder 75 Library unit 80 Control device 81 Branch unit 82 Pulse miss determination unit 83 Alarm generation unit 84 Reference CCD image storage unit 84a Reference CCD image 85a Inspection image 85 Optical axis offset measurement unit 86 Laser Controller 87 Lens displacement amount measuring unit 88 Lens height adjusting unit 89 Illuminated laser state checking unit 89b Round bar line 89c Focus circle 92, 93, 332 Beam sampler 94 High-speed photodiode 96 CCD camera for optical axis inspection 41 201043371 121 ' 122 Roller conveyors 141, 142, 144 Loading/unloading robot table 146 Substrate transport robots 143, 147, 148 Front and back turning mechanism unit 331 Galvanometer control device 333 Four-quadrant photodiode 500 Phase winding Optical element (DOE) 511 ~ 513 half mirror 531 ~ 534 fast Door mechanism 541~544 Condenser lens 42

Claims (1)

201043371 VII. Patent application scope: I. A laser processing method characterized in that laser processing is performed on a glass substrate conveyed from a front-end device while repeating the following steps in sequence, wherein the steps are: a step of performing alignment processing on the first glass substrate conveyed by the front stage device; and irradiating the laser beam while holding the first glass substrate subjected to the alignment process and relatively moving the first glass substrate a step of performing laser processing on the first glass substrate; and performing alignment processing on the second glass substrate conveyed from the front stage device at a predetermined position while the processing is performed by the laser beam And stepping out the first glass substrate after the processing by the laser beam is completed, and irradiating the laser while holding the second glass substrate and relatively moving the second glass substrate The beam is thereby subjected to laser processing on the second glass substrate. 2. The laser processing method according to claim 1, wherein: at a time point when the initial processing by the laser beam is completed, the acquisition includes the formation by the initial processing. An image of a portion of the glass substrate and a portion of the edge portion of the glass substrate, and storing the image as the number of the glass substrate after performing the first or second time At the time of processing, the alignment processing is performed based on the ID data. 3. The laser processing method according to the invention of claim 1, wherein the image of the vicinity of the four corners of the glass substrate is obtained, and the bending of the glass substrate is detected based on the image (warping) Or a notch near the four corners of the glass substrate. 4. The laser processing method according to claim 1 or 2, wherein: obtaining an image of an outer circumference of the glass substrate, and detecting a curvature of the glass plate according to the image (_) And a gap of the outer circumference of the substrate. 5. A laser processing apparatus comprising: a real glass: a relatively small glass substrate irradiated with a laser beam i, a second alignment unit transported from the front stage device, and a predetermined 2 glass substrate Performing an alignment process; the first holding unit that has been placed and placed in a paired state, and after the end of the use process, the alignment glass substrate that is held by the first alignment unit is held with respect to the laser charm plate ! After the glass treatment is finished, the aligned glass substrate aligned with the single (four) row is relatively moved relative to the laser beam substrate, and the second glass control unit is moved by 32:! Performing the series of operations described below in the following paragraphs: The first operation is performed by holding the first alignment unit in the first holding 44 201043371 unit. The substrate is subjected to relative movement of the first glass substrate with respect to the laser beam irradiation unit, whereby the first glass substrate is processed by the laser beam, and the laser beam processing is performed. During the period, the alignment processing is performed on the second glass substrate by the second alignment sheet το, and the processing is performed on the ith glass substrate by the user, and after the σ beam When the second substrate is held by the second holding unit, the second glass substrate is relatively moved with respect to the (four) material, thereby utilizing the a laser beam to feed the second glass substrate Processing. "The laser processing apparatus of claim 5, which includes: the most processing by the laser beam Storing the image by the image acquisition unit; the image acquisition unit obtains an image of both the portions of the shape of the glass substrate that are formed at the edge of the process at the end of the process; Description 7. The laser processing apparatus of claim 5, wherein the image acquisition unit of FIG. 1 acquires 45 near the four corners of the glass substrate. 201043371 • mf ^ ^ And the first detecting unit detects the substrate meandering (weiqu) or the vicinity of the four corners of the substrate according to an image near the four corners of the glass substrate of the image acquiring unit gap. 8. The laser processing according to claim 5, wherein the second image acquisition unit acquires an image of an outer circumference of the glass substrate; and the second detection unit according to the The image obtained by the acquisition unit is used to detect the curvature (warpage) of the glass substrate and the notch of the outer periphery of the glass substrate. A method of manufacturing a solar panel, characterized by using the laser processing method according to any one of claims 1 to 4, or as claimed in any one of claims 5 to 8. The laser processing apparatus described is used to manufacture solar panels. 46