201042786 六、發明說明： - 【發明所屬之技術領域】 本發明是有關於一種電子元件，且特別是有關於一種 發光二極體（Light Emitting Diode，LED)。 【先前技術】 傳統的照明燈具一般都採用金屬A化物燈、白熾燈、 水銀燈與高壓納燈等燈泡，但是這類燈泡的耗電量相當 〇 大，需要付出相當多的金錢來支付電費，而且也不符合現 今節能減碳的環保訴求。 為了解決傳統的照明燈具耗電量太大的問題，現今科 技已發展出一種耗電量很低的發光體：發光二極體。發光 二極體不僅具有低耗電量及省電的優點，同時還具有體積 小、驅動電壓低與不含汞等優點。因此，發光二極體已廣 泛地使用在現在社會中。 〇 【發明内容】 本發明的主要目的是提供一種發光二極體，其至少二 個導電接腳的材質互不相同，且在這些導電接腳之間填充 電解質材料。 本發明提出一種發光二極體，包括一對電極、一晶片、 一封膠體、一對第一導電接腳、至少一導電接腳組以及多 個電解質材料。晶片電性連接這些電極，而封膠體包覆這 3 201042786 些電極與晶片。這些第一 極，而導電接馳配置於這些電性連接這些電 -對彼此電性連接的第二導電接腳。其中導並包括 的材質不同於其，一第一導電接腳的材接: 電解質材料填充於這些第=2_1填充«。這些 本發明藉由這些第一墓带 Ο 鈾哲从電接腳、第二導電接聊以及電 =質材料’能讓發光二極體發光。因此 =卜部電源沒有供給電能’本發明的發光二極紙= 發光，而不受外部電源的限制。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖1A是本發明第一實施例之發光二極體的侧視示意 Ο 圖。請參閱圖1A’本實施例的發光二極體1〇〇包括一晶片 110、一對電極120a、120b以及一封膠體130，其中晶片 電性連接這些電極12〇a、120b，而封膠體130則包覆 這些電極120a、120b與晶片110。 晶片110例如是由半導體材料所製成，其中此半導體 材料的成分可含有III-V族元素，例如砷、鎵或鍺。晶片110 在接收電能時會發出光線，如此發光二極體100得以發 光。可見，晶片110為發光二極體100的核心元件。此外， 201042786 電極120a可為—各思十 ' 金屬座，而晶片U0配置於金屬座（即雷 極120a)上，廿a $ , 、丨电 並且電性連接電極120a。 '日日片110可以透過打線連接（wke b〇nding) 的方式電性連接另—個電極議。詳細而言，發光二極體 可更L括鍵合導線140，而鍵合導線14〇電性連接於 電極12〇&與電極l20b之間。因此，透過鍵合導線140, 晶片110得以電性連接這些電極12〇a、12〇b。 #光二極體100更包括一對第一導電接腳i5〇a、 ，而這些第—導電接腳15Ga、15%分別電性連接這些 電極120a、120b。詳言之，第一導電接腳15〇a電性連接電 極120a，而第一導電接腳15〇b電性連接電極12%。此外， 第一導電接腳150a、150b二者的材質可以彼此相同，且第 -導電接腳150a、l5〇b的材f可以是銅或碳，或是由氫氧 化鎳合金或其他合金材料所製成。 發光二極體100還包括一導電接腳組16〇與多個電解 ❹質材料170。導電接腳組160配置這些第一導電接腳15〇a、 150b之間，並包括一對彼此電性連接的第二導電接腳 162a、162b以及一電性連接於這些第二導電接腳162a、i62b 之間的導電條164，其中第二導電接腳162a鄰近第一導電 接腳150a’而第二導電接腳162b鄰近第一導電接腳15仙。 此外’這些第二導電接腳162a、162b的材質可以彼此相同。 第二導電接腳162a、162b的材質不同於第一導電接腳 150a、15〇b的材質，例如第二導電接腳162a、16几的材質 201042786 為鋅、鐵或鑪蟲么各，而筮一墓带201042786 VI. Description of the Invention: - Technical Field of the Invention The present invention relates to an electronic component, and more particularly to a Light Emitting Diode (LED). [Prior Art] Conventional lighting fixtures generally use metal A-lights, incandescent lamps, mercury lamps, and high-pressure lamps, but such lamps consume a considerable amount of electricity and require considerable money to pay for electricity. It is also inconsistent with the current environmental protection requirements of energy saving and carbon reduction. In order to solve the problem that the traditional lighting fixtures consume too much power, today's technology has developed a low-power illuminant: a light-emitting diode. The light-emitting diode not only has the advantages of low power consumption and power saving, but also has the advantages of small size, low driving voltage and no mercury. Therefore, light-emitting diodes have been widely used in the present society. SUMMARY OF THE INVENTION A main object of the present invention is to provide a light-emitting diode in which at least two conductive pins are made of different materials and an electrolyte material is filled between the conductive pins. The invention provides a light emitting diode comprising a pair of electrodes, a wafer, a gel, a pair of first conductive pins, at least one conductive pin set and a plurality of electrolyte materials. The wafer is electrically connected to the electrodes, and the encapsulant encapsulates the electrodes and wafers. The first poles, and the conductive pinch are disposed on the second conductive pins electrically connected to each other. The material included in the guide is different from the material of the first conductive pin: the electrolyte material is filled in these =2_1 filled «. These inventions enable the light-emitting diodes to emit light from these first tombs, the uranium, from the electrical pins, the second conductive contacts, and the electrical material. Therefore, the power supply of the power supply is not supplied. The light-emitting diode paper of the present invention = light-emitting, and is not limited by the external power source. The above described features and advantages of the present invention will become more apparent from the following description. [Embodiment] Fig. 1A is a side elevational view showing a light-emitting diode according to a first embodiment of the present invention. Referring to FIG. 1A, the LED 2 of the present embodiment includes a wafer 110, a pair of electrodes 120a and 120b, and a gel 130. The wafer is electrically connected to the electrodes 12A and 120b, and the encapsulant 130. These electrodes 120a, 120b and the wafer 110 are then coated. Wafer 110 is, for example, made of a semiconductor material, wherein the composition of the semiconductor material may contain a group III-V element such as arsenic, gallium or germanium. The wafer 110 emits light when receiving electric energy, so that the light-emitting diode 100 is illuminated. As can be seen, the wafer 110 is the core component of the light emitting diode 100. In addition, the electrode 42a of the 201042786 may be a metal seat, and the wafer U0 is disposed on the metal seat (ie, the lightning pole 120a), 廿a $ , , and electrically connected to the electrode 120a. 'Day-day film 110 can be electrically connected to another electrode by way of wire connection (wke b〇nding). In detail, the light-emitting diode may further include a bonding wire 140, and the bonding wire 14 is electrically connected between the electrode 12A and the electrode 110b. Therefore, the wafer 110 is electrically connected to the electrodes 12A, 12B through the bonding wires 140. The photodiode 100 further includes a pair of first conductive pins i5〇a, and the first conductive pins 15Ga and 15% are electrically connected to the electrodes 120a and 120b, respectively. In detail, the first conductive pin 15〇a is electrically connected to the electrode 120a, and the first conductive pin 15〇b is electrically connected to the electrode 12%. In addition, the materials of the first conductive pins 150a, 150b may be identical to each other, and the material f of the first conductive pins 150a, 15bb may be copper or carbon, or may be made of nickel hydroxide alloy or other alloy material. production. The LED 100 further includes a conductive pin set 16A and a plurality of electrolytic materials 170. The conductive pin group 160 is disposed between the first conductive pins 15a, 150b, and includes a pair of second conductive pins 162a, 162b electrically connected to each other and electrically connected to the second conductive pins 162a. The conductive strip 164 between the i62b, wherein the second conductive pin 162a is adjacent to the first conductive pin 150a' and the second conductive pin 162b is adjacent to the first conductive pin 15s. Further, the materials of the second conductive pins 162a, 162b may be identical to each other. The material of the second conductive pins 162a and 162b is different from the material of the first conductive pins 150a and 15b. For example, the material of the second conductive pins 162a and 16b is 201042786, which is zinc, iron or furnace, and 筮Tomb belt
與第二導電接腳162a、162b之間的化學電位可相差在〇 4 伏特至1.5伏特之間。 這些第一導電接腳150a、150b分別與這些第二接腳 162a、162b之間存有一第一填充間隙⑴， Ο 料170填充於這些第一填充間隙gi内。 ’而這些電解質材 内。電解質材料170 例如是尚未解離的離子化合物，而電解質材料17〇可以是 氯化鎂、氯化鈉或氯化銨等未被溶解的結晶鹽。因此，電 解質材料170本身並不具有導電性，且需要在被水或其他 溶劑（例如有機溶劑）溶解之後，電解質材料17〇才會被 解離而具有導電性。 當被水或其他溶劑滴入電解質材料17〇時，由於第一 〇 導電接腳150a、15此與第二導電接腳162a、162b二者的 化學電位並不相同，且電解質材料17〇被解離，因此第— 導電接腳150a、150b、第二導電接腳162a、162b以及被解 離的電解質材料170能形成二個串聯的伏打電池（軸也 pile)。這樣第一導電接腳150a、15〇b可以輸出電能至電極 120a、120b，而透過電極120a、12〇b，晶片11〇得以接收 電能而發出光線。 圖1B疋圖1A中線I-Ι的剖面示意圖。請參閱圖1A與 201042786 圖1B，第一導電接腳150a、150b與第二導電接腳162a、 • 162b的形狀基本上皆彼此相同，而第-導電接腳15〇a、 15〇b皆具有-第一内凹弧面S1，第二導電接腳 皆具有一第二内凹弧面S2。 第一内凹弧面S1與第二内凹弧面S2彼此面對面，而 第一填充間隙G1位於第一内凹弧面S1與第二内凹弧面 S2。由於第一内凹弧面S1與第二内凹弧面S2都是弧面， 因此第一填充間隙G1的形狀大體上與圓柱體相似，且第 ❹一填充間隙G1能容納較多的電解質材料17〇。 發光二極體100所發出的光線，其強弱會受到離子數 量的多寡而影響，而電解質材料170所提供的離子數量越 多，發光二極體100的亮度越高。由此可見，由於第一填 充間隙容納較多的電解質材料170，因此電解質材料 170所能提供的離子數量也越多，故發光二極體1〇〇能發 出較強亮度的光線。 〇 圖2是本發明第二實施例之發光二極體的侧視示意 圖。請參閱圖2，本實施例之發光二極體2〇〇也包括晶片 110、一對電極120a、120b、封膠體13〇以及—對第一導電 接腳15〇a、15〇b，而上述發光二極體2〇〇的元件，立材質、 功能、彼此之間的配置及連接關係皆於第一實施例相同， 故不再重複贅述，而以下將偏重介紹發光二極體與發 光二極體100二者的差異。 發光二極體200包括多個導電接腳組16〇，而這些導 7 201042786 ^接卿、、且16〇都配置於第一導電接腳15〇a、i鳩之間，且 。其中一個導電接腳組“Ο的第二導電接腳⑽ :另一導電接腳、组160的第二導電接腳祕之間存有一第 一填充間隙G2，而這些電解質材料17G分別填充於第一填 充間隙卬内與第二填充間隙G2内。 另外’同一個導電接腳組160的第二導電接腳162a、 162b之材質彼此不同，所以緊鄰第二填充_㈤二側的 第三導電接腳162a、l62b之材質也彼此不同，例如第二導 Ο電接腳162a的材質為碳或氫氧化鎳合金，而第二導電接腳 162b的材質為銅或鐵鎘合金。因此，第二導電接腳I·、 162b二者的化學電位並不相等。 由此可知，第一導電接腳150a、150b、第二導電接腳 162a、162b以及這些電解質材料17〇能形成三個串聯的伏 打電池，以產生更高電壓的電能。這樣第一導電接腳15如、 15〇b可以輸出更大的電能至電極12〇a、12%，讓晶片ιι〇 ❹發出更強亮度的光線，進而提高發光二極體2〇〇的亮度。 值一提的疋，雖然圖2所示的導電接腳組16〇之數 量為二個，但在其他未繪示的實施例中，導電接腳組16〇 之數量可為三個或是超過三個。因此，圖2所示的導電接 腳組160之數量僅供舉例說明，並非限定本發明。 發光二極體200可以更包括一配置於封膠體13〇内的 螢光材料220，而螢光材料22〇能改變晶片11()所發出的 光線之波長，即螢光材料220能改變光線的顏色。舉例來 201042786 說，晶片110例如能發出藍光，其中部分的藍光會穿透封 膠體130與螢光材料220，而另一部分的藍光則會被螢光 材料220吸收。螢光材料220能將所吸收的藍光轉換成黃 光，讓發光二極體200發出由藍光與黃光混合而成的白光。 另外，螢光材料220可以只分布在封膠體13〇的外表 面132處。如此，螢光材料22〇得以成為一罩蓋晶片11〇 的螢光罩。不過，在其他未繪示的實施例中，螢光材料22〇 可以是實質上均句地分布在整個封膠體13〇中。因此，圖 ° 2所示的螢光材料220僅為舉例說明，並非限定本發明。 綜上所述，藉由這些第一導電接腳、第二導 及被解離的電解質材料所形成的伏打電池，本發明能讓發 =二極體發光。即使祕或市電等外部電源沒有供給電 能，本發明的發光二極體仍然可以發光。因此，當發生停 電時，本發明的發光二極體適合作為緊急照明燈具或馨示 用的指示燈具。 0 軸本發明以較佳實_揭露如上，然其並非用以限 定本發明，任何熟習相像技藝者，在不脫離本發明之精神 和範圍内，所作更動與潤飾之等效替換，仍為本發明之專 利保護範圍内。 【圖式簡單說明】 圖1A是本發明第—實施例之發光二極體的侧視示意圖。 圖1B是圖1A中線I-Ι的剖面示意圖。 201042786 圖2是本發明第二實施例之發光二極體的侧視示意圖。The chemical potential between the second conductive pins 162a, 162b can differ between 〇 4 volts and 1.5 volts. A first filling gap (1) is stored between the first conductive pins 150a, 150b and the second pins 162a, 162b, respectively, and the material 170 is filled in the first filling gaps gi. 'And these electrolyte materials are inside. The electrolyte material 170 is, for example, an ionic compound which has not been dissociated, and the electrolyte material 17 can be an undissolved crystalline salt such as magnesium chloride, sodium chloride or ammonium chloride. Therefore, the electrolyte material 170 itself is not electrically conductive, and it is required that the electrolyte material 17 is dissociated and electrically conductive after being dissolved by water or another solvent such as an organic solvent. When water or other solvent is dropped into the electrolyte material 17〇, since the chemical potentials of the first conductive pins 150a, 15 and the second conductive pins 162a, 162b are not the same, and the electrolyte material 17 is dissociated Thus, the first conductive pins 150a, 150b, the second conductive pins 162a, 162b, and the dissociated electrolyte material 170 can form two series of voltaic cells (the shaft is also pile). Thus, the first conductive pins 150a, 15b can output electrical energy to the electrodes 120a, 120b, and through the electrodes 120a, 12b, the wafer 11 can receive electrical energy to emit light. Figure 1B is a cross-sectional view of the line I-Ι in Figure 1A. Referring to FIG. 1A and 201042786, FIG. 1B, the first conductive pins 150a, 150b and the second conductive pins 162a, 162b are substantially identical in shape, and the first conductive pins 15A, 15B have a first concave curved surface S1, the second conductive pins each having a second concave curved surface S2. The first concave curved surface S1 and the second concave curved surface S2 face each other, and the first filling gap G1 is located at the first concave curved surface S1 and the second concave curved surface S2. Since the first concave curved surface S1 and the second concave curved surface S2 are both curved surfaces, the shape of the first filling gap G1 is substantially similar to that of the cylinder, and the first filling gap G1 can accommodate more electrolyte material. 17〇. The intensity of the light emitted by the light-emitting diode 100 is affected by the amount of ions, and the greater the number of ions provided by the electrolyte material 170, the higher the brightness of the light-emitting diode 100. It can be seen that since the first filling gap accommodates a large amount of the electrolyte material 170, the electrolyte material 170 can provide a larger amount of ions, so that the light-emitting diode 1 can emit light of a relatively high brightness. Figure 2 is a side elevational view of a light-emitting diode according to a second embodiment of the present invention. Referring to FIG. 2, the LED 2 of the present embodiment also includes a wafer 110, a pair of electrodes 120a and 120b, a sealant 13〇, and a pair of first conductive pins 15〇a, 15〇b, and the above The elements of the light-emitting diode 2〇〇, the vertical materials, the functions, the arrangement and the connection relationship between them are the same in the first embodiment, and therefore will not be repeated, and the following will focus on the light-emitting diode and the light-emitting diode. The difference between the two bodies 100. The light-emitting diode 200 includes a plurality of conductive pin groups 16〇, and these leads are disposed between the first conductive pins 15〇a and i鸠, and are disposed between the first conductive pins 15〇a and i鸠. One of the conductive pin groups "the second conductive pin (10) of the turn: another conductive pin, the second conductive pin of the group 160 has a first filling gap G2, and the electrolyte materials 17G are filled in the first a filling gap 卬 and a second filling gap G2. In addition, the materials of the second conductive pins 162a, 162b of the same conductive pin group 160 are different from each other, so the third conductive connection adjacent to the second side of the second filling _ (five) The materials of the legs 162a and l62b are also different from each other. For example, the material of the second conductive pin 162a is carbon or nickel hydroxide alloy, and the material of the second conductive pin 162b is copper or iron cadmium alloy. Therefore, the second conductive The chemical potentials of the pins I· and 162b are not equal. It can be seen that the first conductive pins 150a, 150b, the second conductive pins 162a, 162b and the electrolyte materials 17 can form three series of volts. The battery is used to generate a higher voltage of electric energy. Thus, the first conductive pin 15 such as 15 〇b can output more electric energy to the electrodes 12〇a, 12%, so that the wafer emits more intense light, and then Improve the brightness of the light-emitting diode 2 As a result of the value, although the number of the conductive pin groups 16 图 shown in FIG. 2 is two, in other embodiments not shown, the number of the conductive pin groups 16 可 may be three or Therefore, the number of the conductive pin groups 160 shown in FIG. 2 is for illustrative purposes only, and is not intended to limit the invention. The light-emitting diode 200 may further include a fluorescent material 220 disposed in the sealing body 13〇. The phosphor material 22 can change the wavelength of the light emitted by the wafer 11 (i.e., the fluorescent material 220 can change the color of the light. For example, 201042786, the wafer 110 can emit blue light, for example, some of the blue light will penetrate the seal. The colloid 130 and the fluorescent material 220, and the other portion of the blue light is absorbed by the fluorescent material 220. The fluorescent material 220 can convert the absorbed blue light into yellow light, and the light emitting diode 200 emits a mixture of blue light and yellow light. In addition, the fluorescent material 220 may be distributed only on the outer surface 132 of the encapsulant 13〇. Thus, the fluorescent material 22 can be a fluorescent cover of the cover wafer 11〇. However, in other In the illustrated embodiment, the fluorescent material 2 2〇 may be substantially uniformly distributed throughout the sealant 13〇. Therefore, the phosphor material 220 shown in Fig. 2 is merely illustrative and not limiting. In summary, by these first The voltaic cell formed by the conductive pin, the second lead and the dissociated electrolyte material, the invention can make the hair=diode emit light. Even if the external power source such as the secret or the main power supply does not supply electric energy, the light emitting diode of the invention still Therefore, when a power outage occurs, the light-emitting diode of the present invention is suitable as an emergency light fixture or an indicator light for singularity. 0 Axis The present invention is preferably disclosed above, but is not intended to limit the present invention. It is to be understood by those skilled in the art that the equivalent substitutions of the modifiers and retouchings are within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a side elevational view showing a light-emitting diode of a first embodiment of the present invention. Fig. 1B is a schematic cross-sectional view taken along line I-Ι of Fig. 1A. 201042786 FIG. 2 is a side elevational view of a light emitting diode according to a second embodiment of the present invention.
【主要元件符號說明】 100 ' 200 發光二極體 110 晶片 120a ' 120b 電極 130 封膠體 132 外表面 140 鍵合導線 150a > 150b 第一導電接腳 160 導電接腳組 162a、162b 第二導電接腳 164 導電條 170 電解質材料 220 螢光材料 G1 第一填充間隙 G2 第二填充間隙 SI 第一内凹弧面 S2 第二内凹弧面 10[Main component symbol description] 100 '200 light-emitting diode 110 wafer 120a' 120b electrode 130 sealing body 132 outer surface 140 bonding wire 150a > 150b first conductive pin 160 conductive pin group 162a, 162b second conductive connection Foot 164 Conductive strip 170 Electrolyte material 220 Fluorescent material G1 First filling gap G2 Second filling gap SI First concave curved surface S2 Second concave curved surface 10