201040519 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種晶片缺陷偵測設備，尤其關於一 種利用振動所產生的噪音來判斷晶片是否有缺陷的偵測 設備。 【先前技術】 傳統的太陽能電池在製作前或製作中’都有產生裂 Ο 紋的可能。有裂紋的晶片會影響太陽能電池的效能，甚 至使整個太陽能電池報廢。因此，若能在製造前或製造 中剔除不良的晶片，將可有效減少成本及材料的浪費。 剔除不良的晶片的傳統方法，是使用人手來搖晃晶 片’並用人耳來聽晶片是否有異常。這樣的方式非常耗 費人工’且檢測員的聽力必須非常靈敏，且工作空間必 須非吊女靜’且不能互相干擾。此外，利用檢測員的聽 力來判斷晶片的好壞會具有較大的誤差。 〇 因此’提供—種自動化的晶片缺陷偵測設備，實為 本發明所欲實現的解決方案。 ’ 【發明内容】 因此’本發明之-個目的係提供-種能自動判定晶 片缺陷之晶片缺陷偵測設備’藉以降低人工成本，提升 判定的穩定性。 ％ # 為達上述目的，本發明提供—種晶片缺陷谓測設備， 其包含一晶片輪送機構、一 11又3裝置以及一異音判斷裝 4 201040519 置。晶片輸送機構用以輪 a 收音裝置設於晶片輸送機播/並使晶片產生振動。 所產生之聲音而產生=旁’用以接收晶片於振動時 收音裝置，用以接收聲號。：音判斷裝置連接至 聲音訊號η異常，tr，並處理聲音㈣以判斷 出-判斷訊號判斷出晶片是否具有缺陷而輸 Ο 以連續判斷晶片的品質並直接在生產線上 作。利用輸送機構的簡單設計，可以降低 ' ，減少人工成本，並能獲得較為均一的判定結 果。 更明顯易懂，下文特舉一 ’作洋細說明如下。 為讓本發明之上述内容能 較佳實施例，並配合所附圖式 【實施方式】 圖1顯示依據本發明較佳實施例之晶片缺陷摘測設 備之俯視示意圖。圖2顯示依據本發明較佳實施例之晶 P 片缺陷偵測設備之側視示意圖。如圖1與2所示，本實 . 施例之晶片缺陷偵測設備1包含一晶片輸送機構10、一 收音裝置2 0以及一異音判斷裝置3 〇。 晶片輸送機構10係用以輸送一晶片2，並使晶片2 產生振動。於本實施例中，晶片輸送機構1〇包含一履帶 12及複數個凸塊14。凸塊14係設於履帶12上，用以與 晶片2接觸以使晶片2產生振動。履帶12係由滚輪18 與19驅動。 收曰褒置20係设於晶片輪送機構旁，用以接收 5 201040519 晶片2於振動時所產哇夕遵 卞岍屋生之聲曰而產生一聲音訊號幻。 音裝置20通常可以用麥克風來實施。 異音判斷裝置30係連接至收音裝置2〇,用以接收聲 音訊號S1，並處理聲音訊號S1以判斷聲音訊號Μ是否 異常，藉以判斷出晶片2是否具有缺陷而輸出一判斷吨 號S2。異音判斷裝置3〇可以是電腦系統及軟體之組合， 亦可以疋處理器及勒體的組合。異音判斷裝置Μ可以 據頻譜的分析來作出判斷。舉例而言，如冑3所示，於 時間點τι的聲音位準L1超出預設位準lg —段預定值，' 可以將此晶片判定為不良的晶片。 此外’晶片缺陷偵測設肖丨可以更包含一晶片剔除 機構40 ’其連接至異音判斷裝置3〇 ’用以接收判斷訊號 S2,並於判斷訊號82代表晶片2具有缺陷時，將晶片2 移離晶片輸送機構10。晶片剔除機構40可以是機械手 臂或其他可以移開晶片的機構。機械手臂可以利用真空 吸盤的原理來移開晶片。若所判定的晶片是良好的，則 晶片可以繼續接受後處理。以太陽能電池而言’可以對 良好的晶片進行清洗及表面粗化等動作。 圖顯示依據本發明另一實施例之晶片缺陷偵測設 備^俯視示意圖。如圖4所示，本實施例係類似於前述 實施例，不同之處在於晶片輸送機構丨〇，包含複數個滾筒 16以及複數個凸塊14。凸塊14係設於各滾筒16上用 以與晶片2接觸以使晶片2產生振動。值得注意的是， 並非所有滾筒都必須設有凸塊，且相鄰兩滾筒的凸塊之 排列方式並不一定要使所有凸塊同步碰到晶片，只要能 201040519 使晶片產生振動即可。 藉由本發明之上述實施例 質並直接在生產線上執行判定 ^續判斷晶片的品 簡單設計，可以降低生產成本，=°利用輸送機構的 得較為均一的判定結果。 ^人王成本’並能獲 在較佳實施例之詳細說明中所提出之具體實施例僅 用以方便說明本發明之技術内容’而非將本發明狹義地 Ο 限制於上述實施例，在不超出本發明之精神及以下申妗 專利範圍之情況，所做之種種變化實施，皆 ^ 之範圍。 ⑨於本發明 201040519 Ο Ο 【圖式簡單說明】 圖1顯示依據本發 備之俯視示意圖。 圖2顯示依據本發 備之側視示意圖。 圖3顯示依據本發 備之聲音波形示意圖。 圖4顯示依據本發 備之俯視示意圖。 【主要元件符號說明】 S 1 :聲音訊號 :時間點 :聲音位準 晶片 履帶 滾筒 滾輪 異音判斷裝置 明較佳實施例之晶片缺陷偵測設 明較佳實施例之晶片缺陷偵測設 明較佳實施例之晶片缺陷偵測設 明另一實施例之晶片缺陷偵測設 Τ1 L1 2 ： 12 16 19 30 S2 :判斷訊號 L0 :預設位準 1 :晶片缺陷貞測設備 10 14 18 20 40 晶片輸送機構 凸塊 滾輪 收音裝置 晶片剔除機構 8201040519 VI. Description of the Invention: [Technical Field] The present invention relates to a wafer defect detecting apparatus, and more particularly to a detecting apparatus which uses noise generated by vibration to judge whether a wafer is defective. [Prior Art] Conventional solar cells have the possibility of cracking before or during production. Cracked wafers can affect the performance of solar cells and even scrap the entire solar cell. Therefore, if the defective wafer can be removed before or during manufacturing, the cost and material waste can be effectively reduced. The traditional method of rejecting bad wafers is to use a human hand to shake the wafer' and use the human ear to hear if the wafer is abnormal. This approach is very labor intensive and the inspector's hearing must be very sensitive and the workspace must be non-hanging and not interfere with each other. In addition, using the hearing power of the inspector to judge whether the wafer is good or bad will have a large error. 〇 Therefore, providing an automated wafer defect detecting device is a solution to be achieved by the present invention. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a wafer defect detecting apparatus capable of automatically determining wafer defects, thereby reducing labor costs and improving stability of determination. In order to achieve the above object, the present invention provides a wafer defect inspection apparatus comprising a wafer transfer mechanism, an 11 and 3 device, and an abnormal sound determination device 4 201040519. The wafer transport mechanism is used to rotate the sound receiving device on the wafer conveyor and cause the wafer to vibrate. The resulting sound produces = side to receive the sounding device when the wafer is vibrating for receiving the sound signal. The tone judging device is connected to the audio signal η abnormality, tr, and processes the sound (4) to determine whether the judging signal judges whether the wafer has a defect and outputs it to continuously judge the quality of the wafer and directly on the production line. By using the simple design of the conveying mechanism, it is possible to reduce ', reduce labor costs, and obtain a more uniform judgment result. It is more obvious and easy to understand. The following is a detailed description of the following. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view showing a wafer defect inspection apparatus in accordance with a preferred embodiment of the present invention. 2 is a side elevational view of a crystal P-slice defect detecting apparatus in accordance with a preferred embodiment of the present invention. As shown in Figs. 1 and 2, the wafer defect detecting apparatus 1 of the present embodiment comprises a wafer transport mechanism 10, a sound pickup unit 20, and an abnormal sound judging device 3''. The wafer transfer mechanism 10 is for transporting a wafer 2 and causing the wafer 2 to vibrate. In the present embodiment, the wafer transport mechanism 1A includes a crawler belt 12 and a plurality of bumps 14. A bump 14 is attached to the track 12 for contacting the wafer 2 to cause the wafer 2 to vibrate. The track 12 is driven by rollers 18 and 19. The receiving device 20 is disposed beside the wafer transfer mechanism for receiving a sound signal generated by the sound of the wafer 2 when the wafer 2 is vibrated during the vibration. The sound device 20 can typically be implemented with a microphone. The abnormal sound judging device 30 is connected to the sound collecting device 2A for receiving the sound signal S1, and processes the sound signal S1 to determine whether the sound signal is abnormal, thereby judging whether the wafer 2 has a defect and outputting a judgment tonnage S2. The abnormal sound judging device 3 can be a combination of a computer system and a software, and can also be a combination of a processor and a lecture. The abnormal sound judging device can make a judgment based on the analysis of the spectrum. For example, as shown in 胄3, the sound level L1 at the time point τι exceeds the preset level lg - the predetermined value of the segment, 'the wafer can be judged to be a defective wafer. In addition, the wafer defect detecting device may further include a wafer culling mechanism 40' connected to the abnormal sound determining device 3' for receiving the determining signal S2, and when the determining signal 82 indicates that the wafer 2 has a defect, the wafer 2 is The wafer transport mechanism 10 is removed. The wafer culling mechanism 40 can be a robotic arm or other mechanism that can remove the wafer. The robotic arm can use the principle of a vacuum chuck to remove the wafer. If the wafer determined is good, the wafer can continue to undergo post processing. In the case of solar cells, it is possible to perform operations such as cleaning and surface roughening of a good wafer. The figure shows a top view of a wafer defect detecting apparatus according to another embodiment of the present invention. As shown in Fig. 4, this embodiment is similar to the previous embodiment except that the wafer transport mechanism 丨〇 includes a plurality of rollers 16 and a plurality of bumps 14. Bumps 14 are provided on the respective rollers 16 for contacting the wafer 2 to cause the wafer 2 to vibrate. It is worth noting that not all the rollers must be provided with bumps, and the bumps of the adjacent two rollers are arranged in such a manner that all the bumps do not necessarily hit the wafer synchronously, as long as the wafer can vibrate in 201040519. By the above-described embodiment of the present invention and directly performing the determination on the production line, the simple design of the wafer is judged, and the production cost can be reduced, and the judgment result of the transport mechanism can be more uniform. The specific embodiments set forth in the Detailed Description of the Preferred Embodiments are merely used to facilitate the description of the technical contents of the present invention, and the present invention is not limited to the above embodiments in the narrow sense. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 9 in the present invention 201040519 Ο Ο [Simplified description of the drawings] Fig. 1 shows a schematic plan view according to the present invention. Figure 2 shows a side view of the device in accordance with the present invention. Figure 3 shows a schematic diagram of the sound waveforms in accordance with the present invention. Figure 4 shows a top plan view in accordance with the present invention. [Description of main component symbols] S 1 : Sound signal: time point: sound level wafer crawler roller wheel abnormal sound judging device. The wafer defect detecting of the preferred embodiment is shown in the preferred embodiment. The chip defect detection of the preferred embodiment is set to the chip defect detection setting of another embodiment. L1 2 : 12 16 19 30 S2 : Judgment signal L0 : Preset level 1: Chip defect inspection device 10 14 18 20 40 Wafer transport mechanism bump roller radio device wafer rejection mechanism 8