201038905 六、發明說明： • 【發明所屬之技術領域】 本發明係有麟_種散熱結構及其製造方法，《-種具有極佳之散 熱效能的散熱結構及其製造方法。 【先前技術】 按’現行電子賴麟運算及歧麟之魏稿及速麟快其内部 所設置之電子元件相對的將會產生更高之熱量，如無法即時將熱能排出， ❹輕者將影響運作效率重者則將會造成電子元件燒毀，故該習知技術於電子 元件上方設置有散熱單元並透過該散熱單元對所述電子元件進行散熱，習 知散熱元件通常以散熱縛片組或散熱器之態樣為最為常見之使用態樣並於 散熱元件之本體與熱源間搭配穿設熱管以增加導熱及散熱之效能。 目前，由於熱管具有較快的傳熱速度，而廣泛應用於電子元件散熱領 域。常用之熱管包括-具有一定真空度之密封管型殼體，且在殼體内設有 燒結而成之毛細結構並於殼體内充有適量之工作流體，該熱管一端為蒸發 Q端而另一端為冷凝端。當熱管蒸發端受熱時，工作液體蒸發汽化，蒸氣在 微小壓差下流向冷凝端放出熱量後凝結成液體，所述液體藉由毛細結構產 生之毛細壓力差回流至熱管蒸發端，而從使熱量由熱管蒸發端迅速傳至冷 凝端。然，熱管之工作性能受毛細壓力差和迴流阻力二者因素之影響，誃 二因素隨著毛細結構之毛細孔隙之大小而變化，當毛細孔隙較小時，其具 有較大毛細壓力差，可驅動凝結液體進入毛細結構内並向蒸發端回流，但 另一方面毛細孔隙之減小使工作流體回流之摩擦力和粘滯力增大，即工作 液體回流阻力增大，導致工作液體回流速度慢，易使熱管在蒸發端發生乾 201038905 燒現象’而當毛細孔隙較Λ時，工作液體受到較小回流阻力，然，使凝結 液體吸入毛細結構之毛細壓力差隨之減小，減少工作液體回流量，亦會使 熱管在蒸發端發生紐現象’且目鮮内部毛細結構係將銅粉末透過粉末 冶金之方式燒結於熱管内壁以形摘述毛域構，補毛域構具有孔 隙’彼此間結合度不佳，銅粉末常因熱管受外力彎折而脫落散布於熱管内 部令熱管導熱效能降低，故傳統熱管之毛域構已無法貞荷高功率之中央 處理器所產生之熱能。 根據上述習知之缺點’熟悉該項技藝之人士係採用具有高導熱係數之 人工鑽石材料來作為增加散熱及導熱效能之結構材料，工麵^之熱傳導 性高達2300 (W/m · Κ)，她於銅之熱傳導性4〇1⑽.κ)，高出甚多， 故透過所述人工鑽石材料所製成之散熱結構係可有效提升散熱效率，因受 人工鑽石材料沉積及製造方法難條件因素受關下故成本較為昂貴， 例如使用化學氣她積法對欲沉積之工件進行人工鑽石鑛層批覆，欲沉積 之工件大小及材料熔點皆為受限制之條件之一，故針對較大型及低熔點之 材料則無法彼覆人JL鑽石鍍層’故需製細粒狀或粉末狀並搭配其他異質 材料-起混合燒結制’但所述人工心㈣與其他異諸料結合度不 佳’例如透過粉末冶金之方式令所述人确^材料與金屬粉末燒結結合， 最後人工鑽；5材料亦會因為結合度不佳喊落；故習知技術具有下列缺點： 1. 結合度不佳； 2. 成本較高； 3·導熱效能不佳； 4.加工材料受限條件較多。 201038905 -因此，如繼-嶋嫩编枝，術繼效果、結 -構早純、胁f作从有断低縣之設計，⑽魏辦知麟之缺失， 實為本產業亟需待解決之問題。 【發明内容】 纽，為有效解決上述之問題，本發明之主要目的在提供一種具有極 佳散熱效能的散熱結構。 本發明之另—目的在提供—種具有極佳錄效麟餘結構的製造方 法。 本發明之再-目的在提供-種寶善碳細咖於散熱結構中附著 度不佳的散熱結構。 .為達上述主要目的，本發明係提供—種散熱結構，所述散熱結構係包 含.至少-碳質複合層具有複數碳質顆粒及至少—金屬網層，所述金屬網 層具有複數網格’且各該等碳質顆粒選擇地卡固於所述金屬網層之網格内 或受所述金屬_覆蓋@定’並所述韻難射選自於鑽石及石墨所組 成之群組’所述碳質複合層可與至少—金屬製基體搭配，附著於所述金屬 製基體-《φ ;另者，崎韻複合収可與-具有腔室之金屬製基體 搭配，所述碳質複合層係附著於前述金屬製基體之腔室表面。 為達成上述主要目的，本發明係提供—種散熱結構，所述散熱結構係 包含：至少-碳質複合層具有複數碳質顆粒及至少—金屬_，各該等碳 質顆粒外部披覆有至少-層金屬顯，輯金屬網層具有複數哺，且前 述該等碳質顆粒it擇地卡gj於所述金屬崎之網格内或受所述金屬網層覆 蓋固定，並該碳質職係可選自於鑽石及石墨雖狀群組，及所述金屬 5 201038905 鑛層材料係可選自於銅及鋁及銀所組成之群組，另者，所述碳質複合層可 與至少-金屬製基體搭配，附著於所述金屬製基體_側表面；再者，所述 礙質複合層更可與-具有腔室之金屬製基體搭配，所述碳質複合層係附著 於前述金屬製基體之腔室表面。 為達成上述主要目的’本發鴨提供—錄熱結構，所述散熱結構， 係包含.至少一碳質複合層具有複數碳質顆粒及至少一金屬網層及複數高 導熱金屬雜，所述金屬_具有複油格，且前職等碳_粒與前述 高導熱金屬雛㈣混合，並⑽述金屬_覆蓋蚊，該碳_粒係可 選自於鑽石及石墨所組成之群組，及所述高導熱金屬顆粒係可選自於銅及 鋁及銀及鎳所組成之群組，另者，所述碳質複合層可與至少一金屬製基體 搭配’附著於所述金屬製基體—側表面；再者，所述碳質複合層更可與一 具有腔室之金屬製基祕配’所述碳質複合層伽著於祕金屬製基體之 腔室表面。 為達成上述主要目的，本發明係提供一種散熱結構，所述散熱結構， 係包含：至少一碳質複合層具有複數碳質顆粒及至少一金屬網層及複數高 導熱金屬顆粒，各該等碳質顆粒外部彼覆有至少一層金屬鍍層，所述金屬 網層具有複數網格，且前述該等碳質顆粒與前述高導熱金屬顆粒均勻混 合，並由所述金屬網層覆蓋固定，該碳質顆粒係可選自於鑽石及石墨所組 成之群組，所述金屬鍍層材料係可選自於銅(Cu)及鋁(A1)及銀(Ag)所組成 之群組，所述咼導熱金屬顆粒係可選自於銅及鋁及銀及鎳所組成之群組， 另者，所述碳質複合層可與至少一金屬製基體搭配，附著於所述金屬製基 體一側表面；再者，所述碳質複合層更可與一具有腔室之金屬製基體搭配， 201038905 -所述碳質複合層係附著於前述金屬製基體之腔室表面。 . 為達上述另一目的，本發明係提供一種散熱結構之製造方法，所述散 熱結構之製造方法，係包含下列步驟：提供至少一金屬製基體及至少一金 屬網層及複數碳質驗；並將騎碳質雜狀前述金屬網層之網格中構 形成-碳質複合層；再將前述碳質複合層披覆於前述金屬製基體一側表 面，並以燒結之方式令所述碳質複合層與金屬製基體緊固貼合；在將該等 碳質顆粒壓入前述金屬網層之網格之步驟前，更可於所述碳質顆粒外部被 〇 覆至少一金屬鍍層，另者，於所述碳質顆粒外部披覆至少一金屬鍍層之步 驟則，更包括先於所述碳質顆粒表面彼覆碳化層之步驟，所述碳化層材料 係選自於鉻(Cr)、鈦(Τι)、鎢(W)、鉬(M〇)、矽(si)、釩(v)等材料所組成 之群組，及前述金屬鍵層材料係選自於銅(Cu)及銘⑹及銀(Ag)及所組成 之群組，並且該碳質顆粒係選自於鑽石及石墨所組成之群組，再者，於前 述將所述碳質顆粒壓人前述金屬網層之峨巾之步驟前，更包括將所述碳 質顆粒與高導熱金屬顆粒均勻混合之步驟。 〇 為達上述另一目的，本發明係提供一種散熱結構之製造方法，所述散 熱結構之製造方法，係包含下列步驟：提供至少一金屬製基體及至少一金 屬網層及複數碳質顆粒；將所述碳質顆粒均布前述金屬製基體欲沈積之部 位；再由所述金屬網層覆蓋固定形成一碳質複合層；及以燒結之方式令所 述碳質複合層與金屬製基體緊_合；其中將所述碳f顆粒均布前述金屬 製基體欲沈積之部位之步驟前，更可於所述碳質顆粒外部彼覆至少一金屬 鍍層；另者，於所述碳質顆粒外部披覆至少一金屬鍍層之步驟前，更包括 先於所述碳質顆粒表面披覆碳化層之步驟，所述碳化層材料係選自於鉻 201038905 (Cr)、鈦(Ti)、鎢(W)、鉬(M〇)、矽(Si)、釩(V)等材料所組成之群組，及 前述金屬鍍層材料係選自於銅(CU)及鋁(A1)及銀(Ag)所組成之群組，並且 該碳質顆粒係選自於鑽石及石墨所組成之群組，再者，於將所述碳質顆粒 均布别述金屬製基體欲沈積之部位之步驟前，更包括將所述碳質顆粒與高 導熱金屬顆粒均勻混合之步驟。 為達上述再一目的，本發明係提供一種散熱結構及其製造方法，透過 所述散熱結構及其製造方法，以金屬_具有複數娜之賴雛將所述 碳質顆粒卡i]於該網格f錢由所述金屬網層覆蓋蚊該等碳f顆粒，令所 述碳質顆_固設於金屬崎，解決了習知碳__著度雜之問題， 同時藉由碳粒及金屬_所構狀碳倾合層可任覆或附著 於任一材料表面，故本發明具有下列優點二 1·附著度佳； 2. 具有極佳散熱效能； 3. 節省製造成本； 4.製造程序簡單。 【實施方式】 以下係藉由特定的具體實施例說明本發明之實施方式，熟習該項技藝 之人士可參照本說明書所揭示之魄及關W地瞭解本發.其他優點 與功效並可藉由其他不_具·施例具財施或，並本發明之上述 的及…。構與功症上的特性，將依據所附圖式之較佳實施例予以說明。 凊參閱第1、2、<^、<^/|/|)4[：11 3八，、4、4义、5八，、50圖，如圖所示，係為本 發明之—實施例之散熱結構，所述散熱結構1係包含： 至少一碳質複合層 201038905 11具有複數碳質顆粒111及至少一金屬網層U2，所述金屬網層ii2具有 -複數網格1121 ’所述金屬網層112係選自於由銅（Cu)及銘(A1)及銀⑽ 及鎳(Ni)所組成之群組，且各該等碳f顆粒m卡固於所述金屬網層112 之網格1121内（如第3B圖所示），或由所述金屬網層112覆蓋固定所述碳 質顆粒111 (如第3A圖所示），並所述碳質顆粒m係可選自於鑽石及石墨 所組成的群組’所述散熱結構1之碳質複合層11係可與至少一金屬製基體 12搭配，所述金屬製基體12係為散熱器之態樣（如第4、4A圖所示），所 〇述韻複合層11碰覆或_於麟金>1製紐12 -齡面；另者，所 述碳質複合層11更可與-具有腔室121之金屬製基體12搭配，所述金屬 製基體12係為熱管之態樣（如第5、5B圖所示），所述碳質複合層η係附 著於則述金屬製基體12之腔室121表面，由前述複數碳質顆粒⑴及金屬 網層112所構成之碳質複合層u係可為單層或複數層彼此堆疊構形成一碳 質複σ層11再彼覆於欲搭配之金屬製基體12表面或具有腔室121之金屬 製基體12之腔t 121表面，所述金屬製基體12係為平板式熱管之態樣（如 〇第5B、5C圖所示），所述碳質複合層^係附著於前述金屬製基趙12之腔 室121表面，由前述複數碳質顆粒ιη及金屬網層112所構成之碳質複合 層11係可為單層或複數層。 請參閱第卜2、6、7、7A、8、8A、8B、8C圖，如圖所示，係為本發 明之另-實施例之散熱結構，所述散熱結構i係包含：至少一碳質複合層 11具有複數碳質顆粒111及至少一金屬網層112，各該等碳質顆粒m外 部披覆有至少-層金屬鍍層11U，所述金屬網層112具有複數網格ιΐ2ΐ， 所述金屬網層U2係可選自於細⑽祕⑼及銀㈤及錄㈤所組 201038905 、、㈤述該等碳質顆粒⑴選擇地卡固於所述金屬網層112之網 格1121内（如第6圖所示）或受所述金屬網層112覆蓋固定（如第3A圖 所不）’並該碳質麵⑴係可選自於鑽石及石墨離成之群組，及所述金 屬鑛層1111係可選自於銅（Cu)及細)及銀(Ag)等材料所組成之群組， 另者，所述散熱結構丨可與至少一金屬製基體12搭配，所述金屬製基體12 係為散熱器（如第7、7A圖所示所述破質複合層U附著於所述金屬 製基體12侧表面；再者，所述散熱結構【更可與一具有腔室⑵之金屬 製基體12搭配’所述金屬製基體12係為一熱管或一平板式熱管之態樣（如 第8 8A 8B、8C圖所示），所述碳質複合層u係附著於前述金屬製基體 12之腔室121表面，另者，前述由複數表面披覆有金屬鑛層Ull之碳質顆 粒111及至少-金屬網層112所構成之碳質複合層1H系可為單層或複數層 彼此堆叠’再將所述碳質複合層U披覆於欲搭配之金屬製基體12表面或 具有腔室121之金屬製基體12之腔室121表面。 請參閱第卜2、9、9A、10、l〇A、10B、10C圖，如圖所示，係為本發 明之另一實施例之散熱結構’所述散熱結構1係包含：至少一碳質複合層 11具有複數碳質顆粒111及至少一金屬網層n2及複數高導熱金屬顆粒 113’所述高導熱金屬顆粒113係可選自於銅(Cu)及鋁(A1)及銀(Ag)及鎳(N〇 所組成之群組，係以銅(Cu)為較佳，所述金屬網層ία具有複數網格1121， 所述金屬網層112係可選自於銅（Cu)及鋁(A1)及銀(Ag)及鎳(Ni)所組成 之群組’且前述該等碳質顆粒與前述高導熱金屬顆粒1丨3均勻混合， 並由所述金屬網層112覆蓋固定’該碳質顆粒in係可選自於鑽石及石墨 所組成之群組’另者，所述碳質複合層U可與至少一金屬製基體12搭配， 201038905 一散熱器（如第9、9A圖所示），所述碳質複合層201038905 VI. Description of the invention: • Technical field to which the invention pertains The present invention relates to a heat dissipation structure and a method of manufacturing the same, and a heat dissipation structure having excellent heat dissipation performance and a method of manufacturing the same. [Prior Art] According to the current electronic Rylin calculation and Qi Lin's Wei draft and the speed of the internal components set by the speed of Lin Lin will produce higher heat, such as the inability to immediately discharge heat, the lighter will affect If the operation efficiency is severe, the electronic components will be burned. Therefore, the prior art has a heat dissipating unit disposed above the electronic component and dissipates heat to the electronic component through the heat dissipating unit. The aspect of the device is the most common use mode, and a heat pipe is disposed between the body of the heat dissipating component and the heat source to increase the heat conduction and heat dissipation performance. At present, heat pipes have been widely used in the field of heat dissipation of electronic components because of their relatively fast heat transfer rates. The commonly used heat pipe comprises a sealed tubular casing having a certain degree of vacuum, and a sintered capillary structure is arranged in the casing and an appropriate amount of working fluid is filled in the casing, and one end of the heat pipe is an evaporation Q end and the other One end is the condensation end. When the evaporation end of the heat pipe is heated, the working liquid evaporates and vaporizes, and the vapor flows to the condensation end to release heat under a slight pressure difference, and then condenses into a liquid, and the liquid is returned to the evaporation end of the heat pipe by the capillary pressure difference generated by the capillary structure, thereby making heat It is quickly transferred from the evaporation end of the heat pipe to the condensation end. However, the working performance of the heat pipe is affected by both the capillary pressure difference and the backflow resistance. The second factor varies with the size of the capillary pores of the capillary structure. When the capillary pores are small, it has a large capillary pressure difference. Driving the condensed liquid into the capillary structure and refluxing to the evaporation end, but on the other hand, the reduction of the capillary pores increases the frictional force and the viscous force of the working fluid returning, that is, the working fluid reflux resistance increases, resulting in slow working fluid return flow rate. It is easy for the heat pipe to dry at the evaporation end of 201038905. When the capillary pores are relatively sturdy, the working fluid is subjected to less reflux resistance. However, the capillary pressure difference between the condensed liquid and the capillary structure is reduced, and the working fluid is reduced. The flow rate will also cause the heat pipe to collide at the evaporation end. The fresh internal capillary structure sinters the copper powder through the powder metallurgy to the inner wall of the heat pipe to shape the hair domain structure, and the pore-filling structure has pores that are combined with each other. Poor degree, copper powder is often caused by the heat pipe bent by the external force and scattered inside the heat pipe to reduce the heat conduction performance of the heat pipe, so the traditional heat pipe The hair domain structure has been unable to charge the heat generated by the high-power central processor. According to the above-mentioned shortcomings, the person familiar with the art uses an artificial diamond material with high thermal conductivity as a structural material for increasing heat dissipation and thermal conductivity. The thermal conductivity of the work surface is as high as 2300 (W/m · Κ), she The thermal conductivity of copper is much higher than that of 4〇1(10).κ). Therefore, the heat dissipation structure made of the artificial diamond material can effectively improve the heat dissipation efficiency, which is affected by the difficult conditions of artificial diamond material deposition and manufacturing methods. It is expensive to close, for example, using chemical gas accumulation method to carry out artificial diamond ore layer coating on the workpiece to be deposited. The size of the workpiece to be deposited and the melting point of the material are all limited conditions, so for larger and lower melting points. The material can not be covered by JL diamond coating 'so it needs to be made into fine grain or powder and combined with other heterogeneous materials - mixed sintering" but the artificial heart (4) and other different materials have poor bonding 'for example, through the powder The metallurgical method allows the person to sinter the material and the metal powder, and finally artificially drill; 5 materials will also be shouted due to poor bonding; therefore, the prior art has the following shortcomings. : 1. The degree of binding is poor; 2. high cost; poor heat conducting 3. Effectiveness; workpiece 4 more restricted conditions. 201038905 - Therefore, as the following - the tenderness of the branches, the succession effect, the knot-structure early pure, the threat f from the design of the county, (10) the lack of Wei Zhi Zhi Lin, the industry needs to be resolved problem. SUMMARY OF THE INVENTION In order to effectively solve the above problems, the main object of the present invention is to provide a heat dissipation structure having excellent heat dissipation performance. Another object of the present invention is to provide a manufacturing method having an excellent recording efficiency. A further object of the present invention is to provide a heat dissipating structure in which the adhesion of a kind of Baoshan carbon fine coffee to a heat dissipating structure is poor. In order to achieve the above main object, the present invention provides a heat dissipating structure comprising: at least a carbonaceous composite layer having a plurality of carbonaceous particles and at least a metal mesh layer having a plurality of meshes And each of the carbonaceous particles is selectively anchored in the grid of the metal mesh layer or by the metal _ covering @定' and the rhyme is difficult to be selected from the group consisting of diamonds and graphite' The carbon composite layer may be combined with at least a metal substrate and attached to the metal substrate - "φ; in addition, the combination of the rhyme and the metal substrate with a chamber, the carbon composite The layer is attached to the surface of the chamber of the aforementioned metal substrate. In order to achieve the above main object, the present invention provides a heat dissipating structure, the heat dissipating structure comprising: at least a carbonaceous composite layer having a plurality of carbonaceous particles and at least a metal, each of the carbonaceous particles being externally coated with at least - a layer of metal display, the metal mesh layer has a plurality of feeds, and the carbonaceous particles are in the grid of the metal mesh or are fixed by the metal mesh layer, and the carbon grade The carbonaceous composite layer may be selected from the group consisting of copper and aluminum and silver, and the carbonaceous composite layer may be at least - The metal substrate is attached to the metal substrate _ side surface; further, the permeable composite layer can be further matched with a metal substrate having a chamber, and the carbon composite layer is attached to the metal The surface of the chamber of the substrate. Providing a heat recording structure for the above-mentioned main purpose of the present invention, the heat dissipation structure comprising: at least one carbonaceous composite layer having a plurality of carbonaceous particles and at least one metal mesh layer and a plurality of high thermal conductivity metal impurities, said metal _ having a refilled oil grid, and the carbon granules of the predecessor and the like are mixed with the high heat conductive metal chicks (4), and (10) the metal _ covering the mosquitoes, the carbon granules may be selected from the group consisting of diamonds and graphite, and The high thermal conductivity metal particles may be selected from the group consisting of copper and aluminum, and silver and nickel. Alternatively, the carbon composite layer may be attached to at least one metal substrate to be attached to the metal substrate. Further, the carbon composite layer may be further fused with a metal matrix having a chamber to the surface of the chamber of the metal substrate. In order to achieve the above main object, the present invention provides a heat dissipating structure, the heat dissipating structure comprising: at least one carbonaceous composite layer having a plurality of carbonaceous particles and at least one metal mesh layer and a plurality of high thermal conductive metal particles, each of the carbons The outer surface of the magnetic particle is covered with at least one metal plating layer, the metal mesh layer has a plurality of meshes, and the carbonaceous particles are uniformly mixed with the high thermal conductive metal particles, and are fixed by the metal mesh layer, and the carbonaceous material is fixed. The particle system may be selected from the group consisting of diamond and graphite, and the metal plating material may be selected from the group consisting of copper (Cu) and aluminum (A1) and silver (Ag). The particle system may be selected from the group consisting of copper and aluminum, and silver and nickel. Alternatively, the carbon composite layer may be combined with at least one metal substrate and attached to one side surface of the metal substrate; The carbon composite layer may be further combined with a metal substrate having a chamber, 201038905 - the carbon composite layer is attached to the surface of the chamber of the metal substrate. In order to achieve the above another object, the present invention provides a method for manufacturing a heat dissipation structure, the method for manufacturing the heat dissipation structure, comprising the steps of: providing at least one metal substrate and at least one metal mesh layer and a plurality of carbon layers; And forming a carbonaceous composite layer in a grid of the carbonaceous heterogeneous metal mesh layer; and coating the carbonaceous composite layer on one side surface of the metal substrate, and sintering the carbon The composite layer is tightly bonded to the metal substrate; before the step of pressing the carbonaceous particles into the mesh of the metal mesh layer, at least one metal plating layer may be coated on the outside of the carbonaceous particles, and And the step of coating at least one metal plating layer on the outside of the carbonaceous particles, further comprising the step of coating a carbonized layer on the surface of the carbonaceous particles, wherein the carbonized layer material is selected from chromium (Cr), a group consisting of titanium (Τι), tungsten (W), molybdenum (M〇), bismuth (si), vanadium (v), and the like, and the aforementioned metal bond layer material is selected from copper (Cu) and Ming (6) And silver (Ag) and the group formed thereof, and the carbonaceous particles are selected from diamonds and graphite The group consisting of, Moreover, in the carbon particles prior to said pressing step before the hostages Bauer napkins or metal mesh layers, further comprising the step of carbonaceous particles with high thermal conductivity of the metal particles uniformly mixed. The present invention provides a method for manufacturing a heat dissipation structure, the method for manufacturing the heat dissipation structure, comprising the steps of: providing at least one metal substrate and at least one metal mesh layer and a plurality of carbonaceous particles; And distributing the carbonaceous particles to a portion of the metal substrate to be deposited; and then covering and fixing the metal mesh layer to form a carbon composite layer; and sintering the carbon composite layer and the metal substrate by sintering Before the step of uniformly distributing the carbon f particles to the portion of the metal substrate to be deposited, the carbonaceous particles may be coated with at least one metal plating layer; and the carbon particles may be external to the carbonaceous particles. Before the step of coating at least one metal plating layer, the method further comprises the step of coating a carbonized layer on the surface of the carbonaceous particle, the carbonized layer material being selected from the group consisting of chromium 201038905 (Cr), titanium (Ti), tungsten (W) a group consisting of molybdenum (M〇), bismuth (Si), vanadium (V), and the like, and the metal plating material is selected from the group consisting of copper (CU) and aluminum (A1) and silver (Ag). Group of carbonaceous particles selected from diamonds and graphite Into the group. Further, the carbonaceous particles to be uniformly distributed not the steps of the metal to be deposited before the base site, further comprising the step of carbonaceous particles with high thermal conductivity of the metal particles uniformly mixed. In order to achieve the above-mentioned further object, the present invention provides a heat dissipating structure and a manufacturing method thereof, through which the carbon granules are affixed to the net by the metal _ The carbon fiber layer covers the carbon f particles by the metal mesh layer, so that the carbonaceous particles are fixed to the metal stripe, and solve the problem of the conventional carbon __degree of miscellaneous, and at the same time, by carbon particles and metal The structured carbon tilting layer can be attached or adhered to the surface of any material, so the invention has the following advantages: 1. Good adhesion; 2. Excellent heat dissipation efficiency; 3. Saving manufacturing cost; 4. Manufacturing procedure simple. [Embodiment] The embodiments of the present invention are described by way of specific embodiments, and those skilled in the art can refer to the disclosure and other advantages and functions of the present disclosure. Others do not have a financial application or the above and the present invention. The features of the construction and function will be explained in accordance with a preferred embodiment of the drawings.凊 Refer to the first, second, <^, <^/|/|)4[:11 3 eight, 4, 4 meaning, 5 eight, 50 map, as shown in the figure, is the invention - In the heat dissipation structure of the embodiment, the heat dissipation structure 1 comprises: at least one carbonaceous composite layer 201038905 11 having a plurality of carbonaceous particles 111 and at least one metal mesh layer U2, the metal mesh layer ii2 having a complex mesh 1121 The metal mesh layer 112 is selected from the group consisting of copper (Cu) and Ming (A1) and silver (10) and nickel (Ni), and each of the carbon f particles m is stuck to the metal mesh layer 112. Within the grid 1121 (as shown in FIG. 3B), or by the metal mesh layer 112, the carbonaceous particles 111 are fixed (as shown in FIG. 3A), and the carbonaceous particles m are selected from In the group of diamonds and graphite, the carbonaceous composite layer 11 of the heat dissipation structure 1 can be combined with at least one metal substrate 12, which is a heat sink (eg, fourth). 4A), the rhyme composite layer 11 is covered or _ Yu Linjin > 1 New Zealand 12-aged surface; alternatively, the carbon composite layer 11 is more compatible with - the metal having the chamber 121 The base body 12 is matched, the gold The substrate 12 is a heat pipe (as shown in Figs. 5 and 5B), and the carbon composite layer η is attached to the surface of the chamber 121 of the metal substrate 12, and the plurality of carbonaceous particles (1) and The carbon composite layer u composed of the metal mesh layer 112 may be a single layer or a plurality of layers stacked on each other to form a carbon complex σ layer 11 and then applied to the surface of the metal substrate 12 to be matched or the metal having the chamber 121. The surface of the cavity t 121 of the base 12 is formed, and the metal base 12 is a flat heat pipe (as shown in Figs. 5B and 5C), and the carbon composite layer is attached to the metal base. The surface of the chamber 121 of 12, the carbonaceous composite layer 11 composed of the plurality of carbonaceous particles iι and the metal mesh layer 112 may be a single layer or a plurality of layers. Referring to Figures 2, 6, 7, 7A, 8, 8A, 8B, and 8C, as shown in the drawings, a heat dissipation structure according to another embodiment of the present invention, the heat dissipation structure i includes: at least one carbon The composite layer 11 has a plurality of carbonaceous particles 111 and at least one metal mesh layer 112, each of the carbonaceous particles m is externally coated with at least a metal plating layer 11U, and the metal mesh layer 112 has a plurality of meshes ΐ2ΐ, The metal mesh layer U2 may be selected from the group consisting of fine (10) secret (9) and silver (f) and recorded (5), group 201038905, and (5) the carbonaceous particles (1) are selectively clamped in the mesh 1121 of the metal mesh layer 112 (eg (not shown in FIG. 6) or covered by the metal mesh layer 112 (as shown in FIG. 3A) and the carbonaceous surface (1) may be selected from the group consisting of diamonds and graphite, and the metal ore. The layer 1111 may be selected from the group consisting of copper (Cu) and fine (A) and silver (Ag). Alternatively, the heat dissipation structure may be combined with at least one metal substrate 12, the metal substrate 12 is a heat sink (the damaged composite layer U is attached to the side surface of the metal base 12 as shown in FIGS. 7 and 7A; further, the heat dissipation knot [Compared with a metal substrate 12 having a chamber (2), the metal substrate 12 is a heat pipe or a flat heat pipe (as shown in Figs. 8 8A 8B, 8C), the carbon The composite layer u is attached to the surface of the chamber 121 of the metal substrate 12, and the carbonaceous composite layer composed of the carbonaceous particles 111 and the at least-metal layer 112 covered with the metal ore layer U11 is formed by a plurality of surfaces. The layer 1H may be a single layer or a plurality of layers stacked on each other'. The carbon composite layer U is then coated on the surface of the metal substrate 12 to be collocated or the surface of the chamber 121 having the metal substrate 12 of the chamber 121. Referring to Figures 2, 9, 9A, 10, 10A, 10B, and 10C, as shown in the drawings, a heat dissipation structure according to another embodiment of the present invention includes: at least one carbonaceous material The composite layer 11 has a plurality of carbonaceous particles 111 and at least one metal mesh layer n2 and a plurality of high thermal conductive metal particles 113'. The high thermal conductive metal particles 113 may be selected from copper (Cu) and aluminum (A1) and silver (Ag). And a group of nickel (N〇 is preferably copper (Cu), the metal mesh layer ία has a complex grid 1121, The metal mesh layer 112 may be selected from the group consisting of copper (Cu) and aluminum (A1), and silver (Ag) and nickel (Ni), and the foregoing carbonaceous particles and the aforementioned high thermal conductive metal particles 1丨3 uniformly mixed and covered by the metal mesh layer 112. The carbonaceous particles may be selected from the group consisting of diamond and graphite. Alternatively, the carbon composite layer U may be made of at least one metal. Base 12, 201038905 A heat sink (as shown in Figures 9, 9A), the carbon composite layer
一具有腔室121之金屬製基體12搭配， -所述金屬製基體12係為一 :再者，所述碳質複合層11更可與 ’所述金屬製基體12係為一熱管或A metal base 12 having a chamber 121 is used, and the metal base 12 is one. Further, the carbon composite layer 11 can be combined with the metal base 12 as a heat pipe or
及具有腔室121之金屬製基體12的腔室121表賴披覆的碳合層u 係可為單層或複數層。The chamber 121 having the metal base 12 having the chamber 121 may be a single layer or a plurality of layers.
發月之另f施例之散熱結構，所述散熱結構1係包含：至少—碳質複合 層u ’具有複數碳質縣111及至少一金屬網層112及複數高導熱金屬顆 •粒⑽，該等碳質顆粒111外部披覆有至少一層金屬鏃層11U，且前述該 等碳質顆粒111與前述高導熱金屬難113係均勻混合，並由所述金屬網 層1111覆蓋固定；所述高導熱金屬顆粒113係可選自於銅(Cu)及鋁(A1)及 銀(Ag)及鎳(Νι)所組成之群組，係以銅(Cu)為較佳，所述金屬網層112具 〇有複數網格1121，所述金屬網層112係可選自於銅（㈤及铭⑷）及銀(Ag) 及鎳(Νι)所組成群組之其中任一，並該碳質顆粒nl係可選自於鑽石及石 墨所組成之群組，及所述金屬鍍層1U1係可選自於銅（Cu)及鋁(A1)及銀 (Ag)所組成之群組’另者，所述碳質複合層丨丨可與至少一金屬製基體12 搭配’所述金屬製基體12係為一散熱器（如第^、11Α圖所示），所述碳 質複合層11附著於所述金屬製基體12 一側表面；再者，所述碳質複合層 11更可與一具有腔室121之金屬製基體12搭配’所述金屬製基體12係為 一熱管或一平板式熱管之態樣（如第丨2、12Α、12Β、12C圖所示）所述碳 201038905 質複合層li係附著於前述金屬製鐘12之職121表面；前述金屬製基 體12表面及具有腔室121之今屬製基體12的腔室121表面所披覆的碳質 複合層11係可為單層或複數層。 上述實施例巾之碳質複合層u中的複數碳_粒出及金屬網層ιΐ2 及複數高導熱金制粒m係透驗末冶金齡之方式結合，燒結是指粉 末在-料界的條件和低於主要元素賴的燒結溫度下，所發生顆粒表面 減少、孔隙體積降低的過程，將其結合在一起，使其具有複合材料特性， 故可於燒結後之結構中得到多孔隙性質之結構，可作為熱管内部毛細結 構，另者’亦可於燒結時同時施以高溫度高動，令所述結構體中無孔隙。 由於工業鑽石之熱傳導性高達· (w/ra. κ)，銅之熱傳導性也有仙 (W/m . Κ)，故兩者之熱料性皆遠大於其他金屬，所以，使得本發明之散 熱結構1具有良好之熱傳導性，同時可改善習知技術散熱結構整體以工業 鑽石所製成之高成本的缺點。 另者，前述各實施例中的各該等碳質驗⑴大小範圍係為 2咖’而又以_m〜150卵為較佳範圍，前述各實施例的金屬網層出之 各該等網格1121面積係小於或等於丨_〜2fflm，最佳又以小於⑽卵⑽ 仰為較佳範圍，前述各實施例中之各該等碳質顆粒lu之部分粒徑稱大於 所述金屬網層112之網格1121之面積之態樣，所述該等碳質顆粒⑴係以 卡固之方式卡制於所述金屬網層112之各該等網格1121中，當然亦可採用 碳質顆粒1U整體粒徑大於所述金屬網層112之網格⑽之面積的態樣， 再由所述金屬網層112覆蓋固定所述碳質顆粒ln ^ 請參閱第 5、5A、5B、5C、8、8A、8B、8C、10、1〇A、10b、1〇c、12、 12 201038905 12A、12B、12C圖’係為本發明之實施例之散熱結構，所述散熱結構係為金 .屬製基體12與碳質複合層11之組合，所述金屬製基體12係為—熱管及一 平板式熱管之態樣’所述金屬製基體12結構中之毛細結構之應用態樣係可 為前述各實施例中之碳質複合層11之結構態樣，所述毛細結構係具有至少 一碳質複合層11，並所述碳質複合層11可選擇為單層或為複數層堆疊所構 成，所述碳質複合層11係包含複數碳質顆粒出及至少一金屬網層112， 所述金屬網層112具有複數網格1121，所述各該等碳質顆粒lu選擇地卡 0 固於所述金屬網層112之網格1121内或受所述金屬網層lu覆蓋固定，並 各該等碳質雜111係可錢數高導熱金屬齡113混合再均布於金屬製 基體12欲紐之雜，再#料金屬網層112覆蓋於舰金屬製基體 12 ’所述碳質複合層11中具有複數孔隙13，故所述碳質複合層u可取代 習知熱管金屬製基體12中之毛細結構，並可藉由碳質顆粒m高導熱係數 之特性加速熱管導熱之效能。 請參閱第4、4A、7、7A、9、 9A、11、11A圖’係為本發明之實施例之 〇散熱結構，所述散熱結構係為金屬製基餿12與碳質複合層u之組合，所 述金屬製基體12係為散熱器，所述金屬製基體12結構具有至少一受熱部 122及至少-散熱部123，所述受熱部122係與至少一發熱源（圖中未表示) 接觸以料熱源，於她謝之金屬製· 12 __ 122 樣係可為細前述各實施财之碳f複合層n之結構練，所歧熱部i22 具有至少-碳質複合層U，並所迷碳質複合層u可選擇為單層或為複數層 堆疊所構成，所述碳質複合層U係包含複數碳質顆粒m及至少一金屬網 層112，並所述金屬網層112具錢數罐1121，前述各該等破質顆粒⑴ 13 201038905 選擇地卡固於所述金屬網層112之網格肋内或受所述金屬網層山覆蓋 固定，所述受熱部122藉由該碳質複合層u之碳質雛m之高導熱係數 之特性提升金屬製基體12之散熱效能。 …、 請一併參閱第卜 2、3B、4、4A、5、5A、5B、5C、13、14、π 圖，係 為本發明讀餘狀f妙絲意圖，前錄減構讀砂法係包含 下列步驟： 步驟41 :提供至少一金屬製基體及至少-金屬網層及複數碳質顆粒； 此步驟提供至少-金屬製基體12及至少一金屬網層121及複數碳質顆粒 ⑴，所述金屬製基體12係可選擇為一散熱器（如第4圖）或一熱管（如 第5圖）或-平板式熱管（如第5BK)其中任一態樣。 前述碳質顆粒111大小範圍係為1心-，其中以100齡15〇仰 為較佳範圍。前述各實施例金屬網層112之各該等網格ιΐ2ι面積係小於或 等於1卵〜2咖’其中又以小於⑽卿⑽鄉為較佳範圍。 步驟42 .將所述碳質顆粒壓入前述金屬網層之網格中構形成—碳質複 合層；此-步驟係將前述碳質顆粒U1均布於所述金屬網層ιΐ2上並透 過對所述韻雛U1施加壓力之方式使職碳魏粒1U卡·所述金 屬網層112之網格mi中（如第17圖所示），令所述金屬網層ιΐ2之網格 1121緊束崎鱗韻顯111，並獅賴舰f複合層η。 步驟43 :將前述碳質複合層鐘於前述金屬製基體一側表面，並以燒 結之方式令㈣碳質複合賴驾體合；此步義將前述碳質 複合層11 (由碳質顆粒111及金屬網層112所構成）披覆於欲附著之部位， 並對所述韻複合層u及錢製基體12献壓力及加驗紅動作令 14 201038905 .所述碳質複合層11可與所述金錢基體12緊固貼合。 另㈣14圖所示，卿41與刚之間，進—包括步㈣：在 =顆粒外部披覆至少—金屬綱；此—步驟將增加碳_粒出與其他 金屬燒結之附著性。 、、 面披Γ在步驟Μ與步驟44之間’進—包括步驟45 :在該碳質顆粒表 Γ 此步驟係增加金屬鍍層UU披覆伽粒⑴外部之附著 度0 〇 又，在步驟私與步驟42之間，進一白人半跡Μ 高導熱金屬顆粒均勻混合。 #_··將前述伽粒與 請參閱第 .為本發明之散熱結構之另一製造方法示意圖，本發明之散熱結構之製造方 法係包含下列步驟： , 提供H屬製基體及至少—金屬嶋及複數碳質顆粒； 此步驟係提供至少—金屬餘體12及至少—金屬崎m及碳質顆粒 β⑴所述金屬製基體12係可選擇為一散熱器（如第4圖）或一熱管（如 第5圖）或-均熱板（如第5β圖）其中任一態樣。 所述各該等碳質顆粒⑴大小範圍係為1 _ 〜2咖，而又以10〇em〜150 卵為較佳範圍，則述各實施例散熱結構玉的金屬網層之各該等網格 Ϊ面積係小於或等於】_〜2細，其中又則、於⑽^⑽輝為較佳 範圍。 '2 I所述碳質顆粒均布前述金屬製基體欲沈積之部位，·前述步 布於所述金屬製基㈣欲附著碳質複合層η之 15 201038905 處0 步驟53 :再由所述金屬網層覆蓋固定構形成一碳質複合層；此步驟係 由所述金屬網層112覆蓋所述碳質顆粒m (如第18圖所示），且因所述金 屬網層112之網格1121面積小於所述碳質顆粒hi之粒徑，令所述金屬網 層112包覆覆蓋於所述金屬製基體12均布碳質顆粒ιη之處並使碳質顆粒 111不脫落。 步驟54 :以燒結之方式令所述碳質複合層與金屬製基體緊固貼合；所 述步驟54係同時對所述金屬網層112及金屬製基體12進行燒結工作，令 所述由金屬網層112及碳質顆粒111所構成之碳質複合層丨丨可附著於前述 金屬製基體12上，並且與所述金屬製基體12緊固貼合。 另外如第16圖所示’在步驟51與步驟52之間，進一包括步驟55 :在所述 碳質顆粒外部披覆至少一金屬鍍層。 再者’在前述步驟51與步驟55之間，進一包括步驟56 :在碳質顆粒表面 披覆至少一碳化層。 又’在前述步驟52與步驟55之間，進一包括步驟57 :將所述複數碳質顆 粒與複數高導熱金屬顆粒兩者混合。 前述各步驟所述之碳化層1112、金屬鍍層1111、碳質顆粒11卜高導熱 金屬顆粒113的材質如下所述： 碳化層1112係選自於由鉻(Cr)及鈦(Ti)及鎢〇〇及钥(Mo)及矽(Si)及釩 (V)所組成之群組。 金屬鍍層1111係選自於由銅（Cu)及鋁(A1)及銀(Ag)所組成之群組。 碳質顆粒111係選自於鑽石及石墨所組成之群組。 16 201038905 - 高導熱金屬顆粒113係選自於銅(Cu)及鋁(A1)及銀(Ag)及鎳(Ni)所組成 之群組，其中以銅(〇1)為較佳選擇。 需陳明者，以上所述僅為本案之較佳實施例，並非用以限制本發明， 若依本發明之構想所作之改變，在不脫離本發明精神範圍内，例如：對於 構形或佈置型態加以變換，對於各種變化，修飾與應用，所產生等效作用， 均應包含於本案之權利範圍内，合予陳明。 綜上所述，本發明之散熱結構及其製造方法於使用時，為確實能達到 Ο 其功效及目的，故本發明誠為一實用性優異之創作，為符合發明專利之申 請要件，爰依法提出申請，盼審委早日賜准本案，以保障發明人之辛苦 創作，倘若鈞局審委有任何稽疑，請不吝來函指示，創作人定當竭力配 ， 合，實感德便。 【圖式簡單說明】 第1圖係為本發明之實施例之金屬網層立體圖； 第2圖係為本發明之實施例之碳質複合層立體圖； Q第3A圖係為本發明之實施例之碳質複合層剖視圖； 第3B圖係為本發明之實施例之碳質複合層剖視圖； 第4圓係為本發明之實施例之散熱結構剖視圖； 第4A圖係為本發明之實施例之散熱結構局部剖視放大圖； 第5圖係為本發明之實施例之散熱結構剖視圖； 第5A圖係為本發明之實施例之散熱結構局部剖視放大圖； 第5B圖係為本發明之實施例之散熱結構剖視圖； 第5C圖係為本發明之實施例之散熱結構局部剖視放大圖； 17 201038905 第6圖係為本發明之另一實施例之碳質複合層剖視圖； 第7圖係為本發明之另一實施例之散熱結構剖視圖； 第7A圖係為本發明之另—實施例之散熱結構局部剖視放大圖； 第8圖係為本發明之另—實施例之散熱結構剖視圖； 第8A圖係為本發明之另一實施例之散熱結構局部剖視放大圖； 第8β圖係為本發明之另—實施例之散熱結構剖視圖； 第8C圖係為本發明之另—實施例之散熱結構局部剖視放大圖； 第9圖係為本發明之另-實施例之散熱結構剖視圖； 第9A圖係為本發明之另—實施例之散熱結構局部剖視放大圖； 第1〇圖係為本發明之另—實施例之散熱結構剖視圖； 第10A圖係為本發明之另—實施例之散熱結構局部剖視放大圖； 第⑽圖係為本發明之另—實施例之散熱結構剖視圖； 第10C圖係為本發明之另—實施例之散熱結構局部剖視放大圖； 第U圖係為本發明之另—實施例之散熱結構剖視圖； 第11A圖係為本發明之另—實施例之散熱結構局部剖視放大圖； 第12圖係為本發明之另-實施例之散熱結構剖視圖； 第_係為本發明之另-實施例之散熱結構局部剖視放大圖’· 第12嶋綱吻-軸鄉結構剖視圖； 第^圖係為本發明之另一實施例之散熱結構局部剖視放大圖； 第13圖係林發明之聽結構之製造方法實_流程示意圖； 第14圖爾恢嶋構彻蝴-細流程示意圖 第15圖係林紙編㈣物雛程示意圖 18 201038905 -第16圖係為本發明之散熱結構之製造方法另一實施例流程示意圖； .第17圖係為本發明之另一實施例之散熱結構剖視圖； 第18圖係為本發明之另一實施例之散熱結構剖視圖。 【主要元件符號說明】 散熱結構1 碳質複合層11 碳質顆粒111 金屬鍍層1111 〇 碳化層1112 金屬網層112 網格1121 金屬顆粒113 金屬製基體12 腔室121 受熱部122 ❹ 散熱部123 19The heat dissipation structure of the embodiment of the present invention comprises: at least the carbonaceous composite layer u' having a plurality of carbonaceous counties 111 and at least one metal mesh layer 112 and a plurality of high thermal conductivity metal particles (10), The carbonaceous particles 111 are externally coated with at least one metal ruthenium layer 11U, and the foregoing carbonaceous particles 111 are uniformly mixed with the high thermal conductivity metal refractory 113, and are covered and fixed by the metal mesh layer 1111; The thermally conductive metal particles 113 may be selected from the group consisting of copper (Cu) and aluminum (A1) and silver (Ag) and nickel (Νι), preferably copper (Cu), the metal mesh layer 112 The composite mesh 1121 is selected from the group consisting of copper ((5) and Ming (4)) and silver (Ag) and nickel (Νι), and the carbonaceous particles The nl system may be selected from the group consisting of diamonds and graphite, and the metal plating layer 1U1 may be selected from the group consisting of copper (Cu) and aluminum (A1) and silver (Ag). The carbon composite layer can be combined with at least one metal substrate 12. The metal substrate 12 is a heat sink (as shown in Figures 11 and 11). The metal layer 12 is attached to the surface of the metal substrate 12; further, the carbon composite layer 11 can be combined with a metal substrate 12 having a chamber 121. The metal substrate 12 is a heat pipe. Or a flat heat pipe (as shown in Figures 2, 12, 12, 12C), the carbon 201038905 composite layer li is attached to the surface of the metal 121 12; the surface of the metal substrate 12 The carbonaceous composite layer 11 coated on the surface of the chamber 121 having the chamber body 12 having the chamber 121 may be a single layer or a plurality of layers. In the carbon composite layer u of the above embodiment, the complex carbon_granules and the metal mesh layer ιΐ2 and the plurality of high thermal conductivity gold granules are combined in the manner of metallurgical age, and the sintering refers to the conditions of the powder in the material boundary. And at a sintering temperature lower than the main element, the process of reducing the surface of the particles and reducing the pore volume, combining them to have the characteristics of the composite material, so that the structure of the porous structure can be obtained in the structure after sintering. It can be used as the internal capillary structure of the heat pipe, and the other can also apply high temperature and high movement at the same time of sintering, so that there is no void in the structure. Since the thermal conductivity of industrial diamonds is as high as (w/ra. κ), the thermal conductivity of copper is also good (W/m. Κ), so the thermal properties of both are much larger than other metals, so the heat dissipation of the present invention Structure 1 has good thermal conductivity and at the same time improves the high cost of the conventional heat dissipation structure made of industrial diamonds. In addition, each of the carbon detectors (1) in the foregoing embodiments has a size range of 2 coffees and a range of _m to 150 eggs, and the metal mesh layers of the foregoing embodiments are each of the nets. The area of the cell 1121 is less than or equal to 丨_~2fflm, and preferably is less than (10) egg (10). The partial particle diameter of each of the carbonaceous particles lu in the foregoing embodiments is said to be larger than the metal mesh layer. In the aspect of the area of the mesh 1121 of the 112, the carbonaceous particles (1) are snapped into each of the meshes 1121 of the metal mesh layer 112, and of course carbonaceous particles may also be used. The 1U overall particle size is larger than the area of the mesh (10) of the metal mesh layer 112, and the carbonaceous particles ln ^ are covered by the metal mesh layer 112. See 5, 5A, 5B, 5C, and 8 8A, 8B, 8C, 10, 1〇A, 10b, 1〇c, 12, 12 201038905 12A, 12B, 12C are 'heat dissipation structures according to an embodiment of the present invention, and the heat dissipation structure is gold. a combination of a substrate 12 and a carbon composite layer 11 which is a heat pipe and a flat heat pipe. The metal substrate 12 The application of the capillary structure in the structure may be the structural aspect of the carbonaceous composite layer 11 in the foregoing embodiments, the capillary structure having at least one carbon composite layer 11, and the carbon composite layer 11 Optionally, it may be a single layer or a stack of a plurality of layers, the carbonaceous composite layer 11 comprising a plurality of carbonaceous particles and at least one metal mesh layer 112, the metal mesh layer 112 having a plurality of meshes 1121, each of which The carbonaceous particles lu are selectively fixed in the mesh 1121 of the metal mesh layer 112 or covered by the metal mesh layer lu, and each of the carbonaceous impurities 111 is capable of high thermal conductivity metal age. 113 is mixed and then uniformly distributed on the metal base 12, and the metal mesh layer 112 is covered on the ship metal base 12'. The carbon composite layer 11 has a plurality of pores 13, so the carbon composite layer u can replace the capillary structure in the conventional heat pipe metal base 12, and can accelerate the heat transfer performance of the heat pipe by the high thermal conductivity of the carbonaceous particles. Please refer to FIGS. 4, 4A, 7, 7A, 9, 9A, 11, and 11A for the heat dissipation structure of the embodiment of the present invention. The heat dissipation structure is a metal base 12 and a carbon composite layer. In combination, the metal base 12 is a heat sink, and the metal base 12 has at least one heat receiving portion 122 and at least a heat radiating portion 123. The heat receiving portion 122 is coupled to at least one heat source (not shown). Contact with the material heat source, in the metal system of her Xiezhi·12 __ 122 The sample system can be used to structure the carbon f composite layer n of the above-mentioned various implementations, and the heat portion i22 has at least a carbon composite layer U, and The carbon composite layer u may be selected as a single layer or a plurality of layers, and the carbon composite layer U includes a plurality of carbonaceous particles m and at least one metal mesh layer 112, and the metal mesh layer 112 has money. a plurality of cans 1121, each of the foregoing damaged particles (1) 13 201038905 are selectively fastened in or fixed by the mesh ribs of the metal mesh layer 112, and the heat receiving portion 122 is covered by the carbon The high thermal conductivity of the carbonaceous material of the composite layer u enhances the heat dissipation performance of the metal substrate 12. ..., please refer to the paragraphs 2, 3B, 4, 4A, 5, 5A, 5B, 5C, 13, 14 and π, which are the intentions of the invention. The method comprises the following steps: Step 41: providing at least one metal substrate and at least a metal mesh layer and a plurality of carbonaceous particles; this step provides at least a metal substrate 12 and at least one metal mesh layer 121 and a plurality of carbonaceous particles (1), The metal base 12 can be selected from either a heat sink (as in Figure 4) or a heat pipe (as in Figure 5) or a flat heat pipe (e.g., 5BK). The size of the aforementioned carbonaceous particles 111 is in the range of 1 core-, with a range of 100 angstroms and 15 angstroms being preferred. The area of each of the mesh layers 2 of the metal mesh layer 112 of the foregoing embodiments is less than or equal to 1 egg to 2 coffee', and is preferably less than (10) Qing (10). Step 42. Pressing the carbonaceous particles into a mesh of the metal mesh layer to form a carbonaceous composite layer; this step is to uniformly distribute the carbonaceous particles U1 on the metal mesh layer ι2 and The rhyme U1 applies pressure to the mesh carbon 1U card in the mesh mi of the metal mesh layer 112 (as shown in FIG. 17), so that the mesh 1121 of the metal mesh layer ι 2 is tight Saki scale rhyme shows 111, and lion lai f complex layer η. Step 43: The carbonaceous composite layer is clocked on the surface of one side of the metal substrate, and the carbonaceous composite layer is sintered in a sintered manner; the carbonaceous composite layer 11 (from the carbonaceous particles 111) And the metal mesh layer 112 is coated on the portion to be attached, and the pressure is applied to the rhyme composite layer u and the money base 12 and the red action command 14 201038905. The carbon composite layer 11 can be The money base 12 is fastened and fitted. In addition, (4) 14 shows that between Qing 41 and Gang, including - step (4): coating at least the outer part of the particle - metal; this step will increase the adhesion of carbon _ granules to other metals. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Between step 42 and stepping into the white, the high thermal conductivity metal particles are uniformly mixed. #_····························································· And a plurality of carbonaceous particles; this step provides at least - a metal residue 12 and at least - a metal matrix and a carbonaceous particle β (1). The metal substrate 12 can be selected as a heat sink (as shown in FIG. 4) or a heat pipe (as shown in FIG. 4). As shown in Figure 5) or - the soaking plate (such as the 5th figure). Each of the carbonaceous particles (1) has a size ranging from 1 _ to 2 coffee, and 10 〇em to 150 eggs are preferred ranges, and each of the mesh layers of the heat dissipation structure jade of each embodiment is described. The area of the lattice is less than or equal to _~2 fine, and in addition, the (10)^(10) glow is a preferred range. The carbonaceous particles of '2I are uniformly distributed on the portion of the metal substrate to be deposited, and the foregoing step is applied to the metal substrate (4) where the carbonaceous composite layer η is to be attached at 15 201038905. Step 53: Re-use of the metal The mesh layer is fixedly formed to form a carbonaceous composite layer; this step covers the carbonaceous particles m by the metal mesh layer 112 (as shown in FIG. 18), and the mesh 1121 of the metal mesh layer 112 The area is smaller than the particle diameter of the carbonaceous particles hi, so that the metal mesh layer 112 covers and covers the carbonaceous particles η of the metal substrate 12, and the carbonaceous particles 111 are not detached. Step 54: The carbon composite layer is tightly bonded to the metal substrate by sintering; the step 54 is to simultaneously perform sintering work on the metal mesh layer 112 and the metal substrate 12 to make the metal The carbonaceous composite layer 构成 composed of the mesh layer 112 and the carbonaceous particles 111 may be adhered to the metal base 12 and fastened to the metal base 12 . Further, as shown in Fig. 16, between step 51 and step 52, further comprising the step 55 of coating at least one metal plating layer on the outside of the carbonaceous particles. Further, between the foregoing steps 51 and 55, the method further comprises the step of: coating at least one carbonized layer on the surface of the carbonaceous particles. Further, between the foregoing step 52 and step 55, further comprising the step of: mixing the plurality of carbonaceous particles with the plurality of high thermal conductivity metal particles. The material of the carbonized layer 1112, the metal plating layer 1111, the carbonaceous particles 11 and the high thermal conductive metal particles 113 described in the above steps are as follows: The carbonized layer 1112 is selected from the group consisting of chromium (Cr) and titanium (Ti) and tungsten germanium. A group consisting of 〇 and key (Mo) and 矽 (Si) and vanadium (V). The metal plating layer 1111 is selected from the group consisting of copper (Cu) and aluminum (A1) and silver (Ag). The carbonaceous particles 111 are selected from the group consisting of diamonds and graphite. 16 201038905 - High thermal conductivity metal particles 113 are selected from the group consisting of copper (Cu) and aluminum (A1), and silver (Ag) and nickel (Ni), with copper (〇1) being preferred. It is to be understood that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and variations may be made without departing from the spirit of the invention, for example, for configuration or arrangement. The type is transformed. For the various changes, modifications and applications, the equivalent effect should be included in the scope of the case and combined with Chen Ming. In summary, the heat dissipating structure and the manufacturing method thereof of the present invention can achieve the effect and purpose of the heat dissipating structure and the manufacturing method thereof. Therefore, the invention is a practical and excellent creation, and is in accordance with the application requirements of the invention patent. To file an application, I hope that the trial committee will grant the case as soon as possible to protect the inventor's hard work. If there is any doubt in the trial committee, please do not hesitate to give instructions, the creator will try his best to match, and feel really good. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a metal mesh layer according to an embodiment of the present invention; FIG. 2 is a perspective view of a carbonaceous composite layer according to an embodiment of the present invention; and FIG. 3A is an embodiment of the present invention 3B is a cross-sectional view of a carbonaceous composite layer according to an embodiment of the present invention; a fourth circle is a cross-sectional view of a heat dissipation structure of an embodiment of the present invention; and FIG. 4A is an embodiment of the present invention 5 is a cross-sectional view of a heat dissipation structure of an embodiment of the present invention; FIG. 5A is a partial cross-sectional enlarged view of a heat dissipation structure according to an embodiment of the present invention; FIG. 5B is a view of the present invention FIG. 5 is a partial cross-sectional enlarged view of a heat dissipation structure according to an embodiment of the present invention; 17 201038905 FIG. 6 is a cross-sectional view of a carbonaceous composite layer according to another embodiment of the present invention; FIG. 7A is a partial cross-sectional enlarged view of a heat dissipation structure according to another embodiment of the present invention; FIG. 8 is a heat dissipation structure according to another embodiment of the present invention. Cutaway view 8A is a partial cross-sectional enlarged view of a heat dissipation structure according to another embodiment of the present invention; FIG. 8β is a cross-sectional view of a heat dissipation structure according to another embodiment of the present invention; FIG. 8C is another embodiment of the present invention. FIG. 9 is a cross-sectional view of a heat dissipation structure according to another embodiment of the present invention; FIG. 9A is a partial cross-sectional enlarged view of a heat dissipation structure according to another embodiment of the present invention; FIG. 10A is a partial cross-sectional enlarged view of a heat dissipation structure according to another embodiment of the present invention; and FIG. 10 is a heat dissipation structure according to another embodiment of the present invention. Figure 10C is a partial cross-sectional enlarged view of a heat dissipation structure according to another embodiment of the present invention; Figure U is a cross-sectional view of a heat dissipation structure of another embodiment of the present invention; and Figure 11A is another embodiment of the present invention - FIG. 12 is a cross-sectional view showing a heat dissipating structure according to another embodiment of the present invention; FIG. 12 is a partial cross-sectional enlarged view of a heat dissipating structure according to another embodiment of the present invention. 12嶋章吻-axis Xiangjie 1 is a partial cross-sectional enlarged view of a heat dissipation structure according to another embodiment of the present invention; FIG. 13 is a schematic view showing a manufacturing method of a hearing structure of a forest invention; - Figure 15 is a schematic diagram of the process of the heat dissipation structure of the present invention. Figure 17 is another schematic diagram of the present invention. A cross-sectional view of a heat dissipating structure of an embodiment; Fig. 18 is a cross-sectional view showing a heat dissipating structure of another embodiment of the present invention. [Main component symbol description] Heat dissipation structure 1 Carbon composite layer 11 Carbonaceous particles 111 Metal plating 1111 碳 Carbonization layer 1112 Metal mesh layer 112 Grid 1121 Metal particles 113 Metal substrate 12 Chamber 121 Heated portion 122 散热 Heat dissipation portion 123 19