TW201037456A - Pellicle film, pellicle used with mask for tft liquid crystal panel production, and photomask containing the pellicle - Google Patents

Pellicle film, pellicle used with mask for tft liquid crystal panel production, and photomask containing the pellicle Download PDF

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Publication number
TW201037456A
TW201037456A TW098139443A TW98139443A TW201037456A TW 201037456 A TW201037456 A TW 201037456A TW 098139443 A TW098139443 A TW 098139443A TW 98139443 A TW98139443 A TW 98139443A TW 201037456 A TW201037456 A TW 201037456A
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Taiwan
Prior art keywords
film
pattern
light
mask
less
Prior art date
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TW098139443A
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Chinese (zh)
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TWI493278B (en
Inventor
Yoshinori Yanagita
Yasushi Kaneko
Yasuyuki Abe
Hiroshi Ogawa
Makoto Murai
Hiroyuki Shinchi
Masayoshi Tsuchiya
Kuniyuki Honda
Tomokazu Tanaka
Noritaka Hashimoto
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Asahi Kasei E Materials Corp
Hoya Corp
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Publication of TW201037456A publication Critical patent/TW201037456A/en
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Publication of TWI493278B publication Critical patent/TWI493278B/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

Disclosed is a pellicle which can prevent generation of a growable foreign material on a chromium hard mask during a photolithography process. Also disclosed are a pellicle film and a photomask containing the pellicle. The pellicle film contains an optical organic polymer as a main film material, and has an oxalic acid permeation rate converted as the value of a 1 [mu]m thick film at 70 DEG C in 72 hours of 1.0 10-3 mg/cm2 or less.

Description

201037456 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種用於防止異物附著於IC(integrated201037456 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a method for preventing foreign matter from adhering to an IC (integrated

circuit ^ t^) > LSKlarge scale integrated circuit ^ A 規模積體電路)、TFT 型 LCD(Thin FUmCircuit ^ t^) > LSKlarge scale integrated circuit ^ A scale integrated circuit), TFT type LCD (Thin FUm

Crystai Display,薄膜電晶體液晶顯示器)等之微影步驟中 所使用的光罩或主光罩上之膠片及膠片中所使用之膠片 膜、以及包含該膠片之鮮。本發明尤其係關於_種可較 好地用於TFT液晶型平板顯示器之圖案形成之膠片及膠片 中所使用之膠片膜、以及包含該膠片之光罩。 【先前技術】 先刖,當於矽晶圓(以下 仆間稱為 , ——日日圓」)上形成半 導體兀件圖案、或者於液晶面板等平板顯示器基板上形成 圖案時,通常使用稱作膠片之防塵機構來防止異物附著於 光罩(以下,亦簡稱為「遮罩」)上。 、所謂「膠片」,係指將厚度為1〇 _以下之透明高分子膜 (、下稱為膠片膜」)展開並接著於具有與遮罩之形狀 相:口之形狀的厚度為幾毫米左右之框體(以下,亦簡稱 ^框木」)之上緣面側,且於該框體之下緣面側積層黏 著材層而成者。 液晶面板等之製造中所使用之膠片與半導體元件製造中 所:吏用之膠片相比,為大型膠片,其膠片膜之面積為刪 cm以上、30000 cm2以下。 於利用光微影技術之半導體元件之製造方法中,藉由經 144856.doc 201037456 匕括光阻之成膜步驟、曝光步驟、顯影步驟、姓刻步 驟^阻之剝離步驟的純影步驟,㈣成元件電路。於 光微影之各步驟中,使用用以塗佈光阻之有機溶劑'或者 、、/丨或對光阻進行顯影或剝離之藥液,並利用化學反 ::光:學反應,藉此高效地生產元件電路。因此,於製 衣,氛圍中’由於使用上述各種有機溶劑或藥液,而存 在微$之揮發、飛散之化學物質。 、衣兄氛圍中所存在之該等化學物質有時會通過遮罩 ,片膜或展開有膠片膜之框體之側面所形成的通氣孔, 而到達遮罩之圖案形成表面上,與遮罩製造步驟中所殘留 物或其他存在於遮罩表面上之化合物反應而固化, 產生異物。於長時間使用之情形時,由於係使用數年,故 對應二使用時間與曝光頻率,即使該等異物之初始產生量 為微里:亦、會逐漸地積蓄、増大而成為成長之異物(以 '、稱為 <長性異物」)。而且,若最終於遮罩表面 :之圖案之紫外線透過部產生該成長性異物,則會成為曝 n而成為產生不良裝置或缺陷之原因。 近年來’伴隨LSI圖案之微細化、高積體化,關於曝> 裝置之光源,正自高壓水銀燈之g線(436 _)、i線(36 麵)向KrF準分子雷射⑽)、…準分子雷射⑽· :仃紐波長化。由於此種短波長之曝光光源能量高且輸注 故光之此里密度較高,易於引起光化學反應。其甸 業界已^出曝光光源之波長越短,上述成長性異物之 產生越顯著。 144856.doc 201037456 乍為使用短波長之曝光光 物產生的甩m I皁上所發生之成長性異 的原因之一,報告有製造遮罩後 硫酸籬早r田+人* 戈存於遮罩表面之 離子(用於清洗遮罩)與遮罩使用氛圍中所存在 於顯影液)由於圖案轉印時之準分 安 應,從而生成硫酸銨,藉此成為史、…’而產生反 專利文獻小 ^ #此成為異物(參照非專利文獻!及Crystai Display, thin film transistor liquid crystal display, etc. The reticle used in the lithography step or the film used in the film and film on the main mask, and the film containing the film. More particularly, the present invention relates to a film film which can be preferably used for patterning of a TFT liquid crystal type flat panel display, and a film film used in the film, and a photomask including the film. [Prior Art] First, when a semiconductor element pattern is formed on a wafer (hereinafter referred to as "day-day circle"), or when a pattern is formed on a flat panel display substrate such as a liquid crystal panel, it is usually called a film. The dustproof mechanism prevents foreign matter from adhering to the photomask (hereinafter also referred to as "mask"). The term "film" refers to a transparent polymer film (hereinafter referred to as a film film) having a thickness of 1 〇 or less, and then has a thickness of a few millimeters in a shape having a shape corresponding to the shape of the mask. The frame body (hereinafter, also referred to as "frame wood") has a top edge side and is formed by laminating an adhesive layer on the lower edge side of the frame. The film used in the manufacture of a liquid crystal panel or the like is a large-sized film as compared with the film used for the manufacture of a semiconductor element, and the area of the film film is cm or more and 30,000 cm2 or less. In the manufacturing method of the semiconductor device using the photolithography technique, the film forming step, the exposing step, the developing step, and the stripping step of the last step of the photoresist are performed by 144856.doc 201037456, (4) Into the component circuit. In each step of the photolithography, an organic solvent used to coat the photoresist is used, or a chemical solution for developing or stripping the photoresist, and a chemical reaction is used: Efficient production of component circuits. Therefore, in the atmosphere of the clothes, in the atmosphere, the chemical substances which are volatilized and scattered are slightly present due to the use of the above various organic solvents or chemical solutions. The chemical substances present in the atmosphere of the brothers sometimes pass through the mask, the film or the vent hole formed by the side surface of the frame on which the film film is unfolded, and reach the pattern forming surface of the mask, and the mask. The residue in the manufacturing step or other compound present on the surface of the mask reacts and solidifies to generate foreign matter. In the case of long-term use, since it is used for several years, it corresponds to the two use time and the exposure frequency, even if the initial amount of the foreign matter is meager: it will gradually accumulate and become large and grow into foreign matter ( ', called <long foreign body'). Further, if the growth foreign matter is generated in the ultraviolet ray transmissive portion of the pattern on the surface of the mask, it may become a cause of defective devices or defects. In recent years, with the LSI pattern being finer and more integrated, the light source of the device for exposure is from the g-line (436 _) and the i-line (36-plane) of the high-pressure mercury lamp to the KrF excimer laser (10). ...excimer laser (10)· : The wavelength of the neon. Since such a short-wavelength exposure light source has high energy and the density of the light is high in the infusion, it is easy to cause a photochemical reaction. The shorter the wavelength of the exposure light source in the industry, the more significant the growth of the above-mentioned growth foreign matter is. 144856.doc 201037456 之一 One of the reasons for the growth difference in the 甩m I soap produced by the use of short-wavelength exposure light, it is reported that after the manufacture of the mask, the sulphate fence is early, and the person* is in the mask. Surface ions (used to clean the mask) and the mask used in the atmosphere in the developing solution) due to the quasi-spinning of the pattern transfer, thereby generating ammonium sulfate, thereby becoming a history, ... Small ^ #This becomes a foreign object (refer to the non-patent literature! and

陽二!:下等報告:用作膠片之框架之紹合金的表面之 ,化覆膜中混入有硫酸、確酸、有機酸等酸,該酸於 曝光壤境下自該陽極氧化覆膜中脫離,並滯留於勝片與遮 罩,間之搶閉空間内’由於曝光時之短波長紫外線照射於 »亥St而產生硫酸化合物、例如硫酸銨等(參照專利文獻2)。 因此即使於製造後之檢查中為無缺陷之品質狀態良好 的遮罩,亦存在如下問題,即藉由曝光裝置反覆進行準分 子田射照射日守’遮罩上會產生成長性異物,而無法獲得轉 印至晶圓上之良好之圖案轉印圖像。作為對策,提出有藉 由如下方法來抑制成長性異物之產生:降低製造遮罩時之 硫酸殘餘量或利用化學濾網等去除環境中之氨的方法、向 遮罩與膠片之間之密閉空間内導入氮氣的方法、及降低遮 罩使用環境之濕度的方法等。 先前技術文獻 專利文獻 專利文獻1:曰本專利特開2006-11048號公報 專利文獻2 :曰本專利特開2〇〇7_33391〇號公報 非專利文獻 144856.doc 201037456 非專利文獻 1 : Advanced Microlithography Technologies,Yang Er!: Inferior report: used as the surface of the film of the alloy, the chemical film is mixed with acid such as sulfuric acid, acid, organic acid, and the acid is separated from the anodized film in the exposed soil. In the space between the film and the mask, the sulfuric acid compound, for example, ammonium sulfate, is produced by the short-wavelength ultraviolet ray at the time of exposure (see Patent Document 2). Therefore, even in the case of a mask having a good quality in a defect-free inspection after the manufacturing, there is a problem in that the excimer is irradiated by the exposure device, and the growth of the foreign matter is generated on the mask. A good pattern transfer image transferred to the wafer is obtained. As a countermeasure, it is proposed to suppress the generation of growth foreign matter by reducing the residual amount of sulfuric acid when the mask is produced, or removing the ammonia in the environment by using a chemical filter or the like, and sealing the space between the mask and the film. A method of introducing nitrogen into the inside, and a method of reducing the humidity of the environment in which the mask is used. PRIOR ART DOCUMENT PATENT DOCUMENT Patent Document 1: Japanese Patent Laid-Open No. Hei. No. 2006-11048 Patent Document 2: Japanese Patent Laid-Open Publication No. Hei No. Hei No. Hei. ,

Proc. of SPIE, Vol. 5645 (2005), pl〇9-113 【發明内容】 發明所欲解決之問題 然而,於平板顯示器用液晶面板之製造步驟中,與半導 體元件之製造步驟相比’轉印圖案之線寬或間距比較大, 因此無需使用如上所述之能量密度較高之短波長的曝光光 束,就曝光面積較寬廣、且需要曝光光量之方面而言,通 常於溫度為15°C以上之氛圍中,使用具有丨線〜g線之波段 之寬頻帶曝光光束來轉印遮罩圖案。因此,於平板顯示器 用液晶面板之製造步驟中,幾乎不存在如用於製造半導體 凡件%般由照射能量較高之曝光光束所引起的化學物質之 生成而導致遮罩上產生異物的情形,而不會未成為嚴重之 問題。 士上所述,於平板顯示器用液晶面板之製造步驟中,幾 乎不存在如用於製造半導體元件時般由照射能量較高之曝 光光束所引起的化學物質之生成導致遮罩上產生異物的情 形,而不會成為嚴重之問題’但本發明者等人發現如下問 題:近年來,於使用丨線1線(例如365〜436 nm)之曝光光束 的TFT液晶面板製造用大型遮罩之使用現場,亦會由於半 年至數+這-期間之遮罩保存或使用而於遮罩之膠片内 圖案形成面上產生成長性異物。本發明者等人進行研 究之結果發現’該成長性異物之產生與保管環境有關,另 方面未找出與曝光次數之明確關係。 144856.doc 201037456 若如於半導體元件製造用遮罩上所產生般,成長性異物 之:因為硫酸銨’則可藉由採取如使膠片與遮罩之間之密 • 閉空間内不殘留硫酸離子的對策來抑制成長性異物之產 · 纟°然而,本發明者等人進行研究之結果判明,即使採取 • 魏離子對策,依然、存在於硬鉻遮罩(通常為於合成石英 等之基板上形成有包含鉻之遮光性膜圖案的遮罩)上產生 成長性異物之情形。 〇 即,本發明者等人發現:於使用TFT液晶面板製造用大 型遮罩時,圖案形成面上所產生之成長性異物係與先前使 用半‘體7L件製造用小型遮罩時已知之成長性異物性質不 同者,必需採取不同之對策,從而完成本案發明。因此, •本案發明所欲解決之課題係提供一種於Ic(集成電路)、 LSI(大規模積體電路)、TFT型LCD(薄膜電晶體液晶顯示 ’器)料導體裝置之製造步驟、尤其是TFT液晶面板之製造 步驟中,可抑制於硬鉻遮罩上產生上述成長性異物之膠片 膠片中所使用之膠片膜、以及包含該膠片之光罩。 解決問題之技術手段 本發明者等人進行努力研究之結果發現,使用光微影技 術之TFT液晶面板產品之製造步驟中的產生於硬路遮罩表 面之成長性異物之主要產生原因在於草酸鉻錯合物’古亥草 •祕錯合物係製造環境中所含有之草酸與㈣該硬路遮罩 ,巾之遮光材料的鉻或其化合物之反應生成物。 又發現’料長性㈣W轉㈣ 刻而圖案化之鉻系遮光性膜之邊綾P藉由# 巧任膘之邊緣作為起點而成長。因 144856.doc 201037456 此,判明於設置有遮罩之環境中由於某種原因而存在之草 酸或其化合物之離子與遮光性膜中所使用之鉻產生某種反 應。 於多數情形時,該成長性異物具有卜兄μηι左右之尺 寸。因此,可明確於作為遮光圖案而具有3〇 μπι以上5〇〇 μιη以下之線寬的上述用途之光罩中,該成長性異物亦會 成為進行圖案轉印時之障礙,從而成為嚴重之問題。 因遮罩之保管環境而幾乎未發現該成長性異物之產生, 進而,過去於液晶面板用豸罩之膠片巾並未產生此種成長 性異物’因此推測成長性異物根據液晶面板製造廠商所擁 有之遮罩之保管環境或使用環境之變化而成長。 於TFT液晶面板之製造中,於TFT基板之加㈣⑽仏 〜 氧化銦錫)電極或Zn0(氧化鋅)電極之圖案形成與 衫色慮光片之圖案形成時使用光微影技術。其中,於ITO 電極之圖案形成時之㈣步驟中,先前係使用鹽酸作為姓 刻液’但近年來,由於ΙΤ〇電極之主流變成非紐〇,故使 用草酸作為姓刻潘。+ , 因此’本發明者等人認為於TFT液晶 ^板之製造步驟中產生於硬鉻遮罩上之成長性異物的產生 、 A午疋伴隨上述製造步驟之變化而新用作触刻液 =酸。再者認為’即使於先前具有存在草酸離子之氛圍 之月屯時’亦存在其濃度上升之類的製造步驟之變化。 j發明者等人進行努力研究,結果查明由於以下之機制 而導致草酸生成成長性異物。 先削於製造TFT液晶面板之氛圍(製造環境氛圍)中不 144856.doc 201037456 存在濃度較高之草酸。然而,存在由於上述面板製造之步 ’驟之變更’而導致製造環境氛圍發生變化,製造環境氛圍 中之草酸含有濃度變高之情形。 ,般4為草酸係以氣體狀、微粒粉體狀或霧狀而存在於 製造環境氛圍中,並通過膠片膜或膠片框體之通氣孔、其 他構件而到達硬鉻遮罩表面。 -般認為於大型之平板顯示器用丁 FT液晶面板產品之製 Ο Ο 造步驟中,上述作為ITO姓刻液之草酸係製造環境氛圍中 之草酸之供給源。 上述存在於製造環鏡氛圍中之草酸附著於硬路遮罩表 面,並與用作硬絡遮罩表面之遮光材料之鉻或其化合物反 應’從而形成錯合物。該反應係藉由草酸含水、吸濕或吸 水’並成為草酸離子而使其與鉻或其化合物之反應性變 南’從而易於生成成長性異物。尤其是草酸之反應性根據 卓酸之吸濕狀態而變化,若製造環境氛圍之濕度上升(例 如濕度為70%以上,進而為嶋以上之情形等)、草酸成為 包含過多水分之狀態’則易於生成成長性異物。因此,作 為抑制成長性異物之方法,將製造環境氛圍之濕度降低至 不產生遮罩圖案之靜電破壞之程度亦有效,但於TFT液晶 面板用途遮罩之情形時難以採用該方法。 成長性異物不易產生於遮罩之背面或周緣附近,而容易 產生於形成於路系遮光性膜上之圖案上。尤其易於以圖案 之邊緣作為起點而成長。該邊緣係利用餘刻將藉由賤鐘法 而成膜之鉻系遮光性膜圖案化所獲得之邊緣。大型遮罩之 144856.doc 201037456 主成分之藥液來進行濕 鉻蚀刻主要係藉由以硝酸鈽錢作為 式触刻。 ❹ 但是,通常於常溫之保管狀態下,不易引起金屬… 他兀素或離子之反應。因此,—般認為有時於藉由賤料 而於透明基板上成膜之鉻系遮光性膜(或者㈣遮光性膜 =抗反射膜)上’活性比較高之離子化狀態之鉻版+、〇3+ 寻)以某種概率存在,此種化學物種成為開端促進與環 境物質之反應,從而產生異物或使異物成長。或者,’可認 為藉由包含鉻之遮綠膜即上述絡系遮光性膜中所含有: 金屬Cr與環境物質相接觸,而產生活性更高之離子化之 絡。 進而,如上所述,異物產生以圖案之邊緣作為起點之情 形較多,因此推測於蝕刻而成之圖案剖面上易於存在上述 /舌性較咼之鉻,且氨促進成長性異物之成長。 又,根據本發明者等人之研究,於高濕度下(例如7〇%以 上)可較多地觀測到成長性異物之產生,因此可理解:藉 由與高濕度之環境物質之接觸,而產生離子化之鉻,從而 易於生成成長性異物。又,亦可認為:由於當遮光性膜為 將組成各異之複數層積層而成者時易於產生異物,故高濕 度化之異種金屬之接觸所引起的離子化會發揮作用。 本案說明書中’所謂「草酸鉻錯合物」係指草酸與鉻或 絡之化合物反應而生成之錯合物,以及該錯合物與氛圍中 所存在之氨、胺等有機鹼性物質或包含Li、Na、K、Ca等 之無機鹼性物質反應而形成的鹽。 144856.doc • ]0- 201037456 以下,揭示可生成之成長性異物之鹽。Μ表示1價陽離 子或2價陽離子,並且η表示整數。作為該成長性異物之 鹽,可列舉三(草酸根)鉻(III)酸鹽M3[Cr(C2〇4)3]及其水合 物,例如:(NH4)3[Cr(C204)3].2H20、(ΝΗ4)3[(:γ((:2〇4)3]·3Η20、 K3[Cr(C204)3] 3H20、Li3[Cr(C2〇4)3].5.5H20、Na3[Cr(C204)3].4.5H20、 Na3(NH4)3[Cr(C204)3]2.7H20、K3(NH4)3[Cr(C204)3]2.5H20、 Rb3[Cr(C2〇4)3]-3H2〇 ' Na3Rb3[Cr(C2〇4)3]2-7H2〇 ' Ag3[Cr(C2〇4)3]-nH20 ' K(C21H23N202)2[Cr(C2〇4)3].4H20、(C21H23N202)3[Cr(C2〇4)3].llH2〇、Proc. of SPIE, Vol. 5645 (2005), pl 〇 9-113 SUMMARY OF THE INVENTION Problems to be Solved by the Invention However, in the manufacturing steps of a liquid crystal panel for a flat panel display, compared with the manufacturing steps of the semiconductor element The line width or pitch of the printed pattern is relatively large, so that it is not necessary to use the short-wavelength exposure beam having a higher energy density as described above, and the exposure area is wide, and the amount of exposure light is required, usually at a temperature of 15 ° C. In the above atmosphere, the mask pattern is transferred using a broadband exposure beam having a wavelength band of the 丨 line to the g line. Therefore, in the manufacturing steps of the liquid crystal panel for a flat panel display, there is almost no occurrence of a chemical substance generated by an exposure beam having a high irradiation energy as in the case of manufacturing a semiconductor article, and a foreign matter is generated on the mask. It will not become a serious problem. As described above, in the manufacturing process of the liquid crystal panel for a flat panel display, there is almost no occurrence of a chemical substance generated by an exposure beam having a high irradiation energy as in the case of manufacturing a semiconductor element, and a foreign matter is generated on the mask. However, the present inventors have found the following problem: in recent years, the use of a large mask for manufacturing a TFT liquid crystal panel using an exposure beam of a ray line 1 (for example, 365 to 436 nm) It also produces growth foreign matter on the pattern forming surface of the mask film due to the preservation or use of the mask for half a year to several times. As a result of research by the inventors of the present invention, it was found that the occurrence of the growth foreign matter is related to the storage environment, and the clear relationship with the number of exposures is not found. 144856.doc 201037456 If it is produced on a mask for the manufacture of semiconductor components, it is a growth foreign matter: because ammonium sulfate can be used to prevent the separation of sulfate ions in the closed space between the film and the mask. In addition, the inventors of the present invention have found that it is still in the hard chrome mask (usually on a substrate such as synthetic quartz). A growth foreign matter is generated on the mask in which the light-shielding film pattern containing chromium is formed. In other words, the inventors of the present invention have found that when a large-sized mask for TFT liquid crystal panel manufacturing is used, the growth foreign matter generated on the pattern forming surface is known to grow when a small mask for manufacturing a semi-body 7L member is used. If the nature of the foreign body is different, it is necessary to take different countermeasures to complete the invention. Therefore, the problem to be solved by the invention of the present invention is to provide a manufacturing step of a conductor device for an Ic (Integrated Circuit), an LSI (Large Scale Integrated Circuit), a TFT LCD (Thin Film Transistor Liquid Crystal Display), especially In the manufacturing process of the TFT liquid crystal panel, it is possible to suppress the film film used in the film film in which the above-mentioned growth foreign matter is generated on the hard chrome mask, and the photomask including the film. The inventors of the present invention have conducted intensive studies and found that the main cause of growth of foreign matter generated on the hard-surface mask surface in the manufacturing steps of the TFT liquid crystal panel product using photolithography is chromium oxalate. The complex compound 'Guhai Cao• Secret Complex is the reaction product of chromium or its compound contained in the environment for the production of oxalic acid and (4) the hard road mask and the light-shielding material of the towel. Further, it was found that the edge of the chrome-based light-shielding film which was patterned by the material length (four) W-turned (four) was grown by the edge of #巧任膘 as a starting point. According to 144856.doc 201037456, it has been found that ions of oxalic acid or a compound thereof which are present for some reason in a masked environment have some reaction with chromium used in the light-shielding film. In most cases, the growth foreign body has a size of about 兄μηι. Therefore, in the photomask of the above-mentioned use having a line width of 3 〇μπ or more and 5 〇〇μη or less as a light-shielding pattern, the growth foreign matter may become an obstacle in pattern transfer, which is a serious problem. . In the storage environment of the mask, the growth of the foreign matter is hardly observed. In the past, the film towel of the liquid crystal panel has not produced such a growth foreign matter. Therefore, it is estimated that the growth foreign material is owned by the liquid crystal panel manufacturer. The mask is grown in a storage environment or a change in the environment in which it is used. In the manufacture of a TFT liquid crystal panel, photolithography is used in the pattern formation of a (4) (10) 〜 to indium tin oxide electrode or a Zn0 (zinc oxide) electrode on a TFT substrate. Among them, in the step (4) at the time of pattern formation of the ITO electrode, hydrochloric acid was previously used as the surname liquid. However, in recent years, since the mainstream of the ruthenium electrode has become non-nucleus, oxalic acid has been used as the surname. +, Therefore, the inventors of the present invention considered that the generation of growth foreign matter generated on the hard chrome mask in the manufacturing process of the TFT liquid crystal panel, and the use of the above-mentioned manufacturing steps in the manufacturing step of the TFT liquid crystal panel are newly used as the etchant = acid. Furthermore, it is considered that there is a change in the manufacturing steps such as an increase in concentration even in the case of a moon which has an atmosphere in which oxalic acid ions are present. The inventors and the like conducted an effort to study, and as a result, it was found that oxalic acid produced a growth foreign matter due to the following mechanism. It is first cut in the atmosphere (manufacturing environment atmosphere) for manufacturing TFT liquid crystal panels. 144856.doc 201037456 There is a higher concentration of oxalic acid. However, there is a case where the atmosphere of the manufacturing environment changes due to the change of the step of manufacturing the panel described above, and the concentration of oxalic acid in the atmosphere of the manufacturing environment becomes high. The oxalic acid is present in the atmosphere of the manufacturing environment in the form of a gas, a fine particle powder or a mist, and reaches the surface of the hard chrome mask through the vent holes of the film film or the film frame, and other members. In the 步骤 Ο Ο 造 。 FT FT FT FT 液晶 液晶 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 ITO ITO ITO ITO ITO ITO ITO ITO ITO ITO ITO The above-mentioned oxalic acid which is present in the atmosphere of the ring mirror is attached to the surface of the hard-circuit mask and reacts with chromium or a compound thereof which is used as a light-shielding material for the surface of the hard mask to form a complex. This reaction is easy to form a growth foreign matter by hydrating, absorbing or absorbing water oxalic acid to become an oxalic acid ion and reacting it with chromium or a compound thereof. In particular, the reactivity of oxalic acid varies depending on the hygroscopic state of the acid, and it is easy to increase the humidity in the production environment (for example, when the humidity is 70% or more, and further, it is 嶋 or more), and oxalic acid becomes a state containing excessive moisture. Generate growth foreign bodies. Therefore, as a method of suppressing growth foreign matter, it is also effective to reduce the humidity of the manufacturing environment atmosphere to such an extent that electrostatic damage does not occur in the mask pattern, but it is difficult to adopt this method in the case where the TFT liquid crystal panel is used as a mask. The growth foreign matter is less likely to occur on the back surface or the periphery of the mask, and is likely to occur on the pattern formed on the roadway light-blocking film. In particular, it is easy to grow with the edge of the pattern as a starting point. This edge is obtained by patterning the edge obtained by patterning the chromium-based light-shielding film formed by the 贱 clock method. Large masks 144856.doc 201037456 The main component of the liquid to carry out the wet chrome etching is mainly by the use of nitric acid as a touch. ❹ However, it is usually not easy to cause metal...in the reaction of normal temperature. Therefore, it is generally considered that a chromium-based light-shielding film (or (four) light-shielding film = anti-reflection film) which is formed on a transparent substrate by a coating material has a relatively high activity ionized state of chrome plate+, 〇3+ 寻) exists with a certain probability that this chemical species is beginning to promote the reaction with environmental substances, thereby generating foreign matter or growing foreign bodies. Alternatively, it is considered that the green light-shielding film containing chromium, which is contained in the above-mentioned complex light-shielding film, is in contact with an environmental substance to produce a more active ionization network. Further, as described above, since the foreign matter is generated with the edge of the pattern as a starting point, it is presumed that the above-described tongue with a relatively high tongue is likely to be present on the cross section of the pattern to be etched, and ammonia promotes the growth of the growth foreign matter. Further, according to the study by the inventors of the present invention, it is possible to observe a large amount of growth foreign matter under high humidity (for example, 7% or more), and therefore it is understood that by contact with a high-humidity environmental substance, The ionized chromium is generated, so that it is easy to generate a growth foreign matter. In addition, it is considered that when the light-shielding film is formed by laminating a plurality of layers having different compositions, foreign matter is likely to be generated, so that ionization due to contact of a high-humidity dissimilar metal acts. In the present specification, 'the so-called "chromium oxalate complex" refers to a complex formed by the reaction of oxalic acid with a compound of chromium or complex, and an organic basic substance such as ammonia or an amine present in the complex and the atmosphere or contains A salt formed by reacting an inorganic basic substance such as Li, Na, K or Ca. 144856.doc • ]0- 201037456 The following discloses a salt that can be grown into a growing foreign body. Μ represents a monovalent cation or a divalent cation, and η represents an integer. Examples of the salt of the growth foreign material include tris(oxalate) chromium (III) acid salt M3 [Cr(C2〇4) 3] and a hydrate thereof, for example, (NH4)3 [Cr(C204)3]. 2H20, (ΝΗ4)3[(:γ((:2〇4)3]·3Η20, K3[Cr(C204)3] 3H20, Li3[Cr(C2〇4)3].5.5H20, Na3[Cr( C204)3].4.5H20, Na3(NH4)3[Cr(C204)3]2.7H20, K3(NH4)3[Cr(C204)3]2.5H20, Rb3[Cr(C2〇4)3]-3H2 〇' Na3Rb3[Cr(C2〇4)3]2-7H2〇' Ag3[Cr(C2〇4)3]-nH20 'K(C21H23N202)2[Cr(C2〇4)3].4H20, (C21H23N202) 3[Cr(C2〇4)3].llH2〇,

Ca3[Cr(C204)3]2.18H20、Ca3[Cr(C2〇4)3]2-36H20、CaK[Cr(C2〇4)3].3H20、Ca3[Cr(C204)3]2.18H20, Ca3[Cr(C2〇4)3]2-36H20, CaK[Cr(C2〇4)3].3H20,

CaK[CrCC2〇4)3]-4H20 ' Sr3[Cr(C2〇4)3]2 l2H2〇 ' Sr(NH4)[Cr(C2〇4)3]-4H20 'CaK[CrCC2〇4)3]-4H20 'Sr3[Cr(C2〇4)3]2 l2H2〇 'Sr(NH4)[Cr(C2〇4)3]-4H20 '

Sr(NH4)[Cr(C204)3].5H20、KSr[Cr(C2〇4)3].6H20、Ba3[Cr(C2〇4)3]2-6H20、 Ba3[Cr(C204)3]2.7H20、Ba3[Cr(C2〇4)3]2.12H20、BaK[Cr(C2〇4)3k2H20、Sr(NH4)[Cr(C204)3].5H20, KSr[Cr(C2〇4)3].6H20, Ba3[Cr(C2〇4)3]2-6H20, Ba3[Cr(C204)3]2.7 H20, Ba3[Cr(C2〇4)3]2.12H20, BaK[Cr(C2〇4)3k2H20,

BaK[Cr(C204)3]2.3H20 等。 又,作為該成長性異物之鹽,可列舉乙二胺二(草酸根) 鉻(III)酸M[Cr(C2〇4)2(C2H8N2)]及其水合物’例如: (NH4)[Cr(C204)2(C2H8N2)HNH4)HC204 H20等。又,作為 該成長性異物之鹽,可列舉二水二(草酸根)合鉻(ΙΠ)酸鹽 M[Cr(C204)2(H20)2]及其水合物,例如:K[Cr(C204)2(H20)2].2H20、 K[Cr(C204)2(H20)2].3H20、Na[Cr(C204)2(H20)2].5H20、 (NH4)[Cr(C204)2(H20)2].3H20、Li[Cr(C204)2(H20)2]、 Rb[Cr(C204)2(H20)2] ' Cs[Cr(C204)2(H20)2]、Mg[Cr(C204)2(H20)2]2、BaK[Cr(C204)3]2.3H20 and the like. Further, examples of the salt of the growth foreign matter include ethylenediamine bis(oxalate) chromium (III) acid M [Cr(C 2 〇 4) 2 (C 2 H 8 N 2 )] and a hydrate thereof, for example: (NH 4 ) [Cr (C204) 2 (C2H8N2) HNH4) HC204 H20 or the like. Further, examples of the salt of the growth foreign material include dihydrated (oxalate) chromic acid (M) (Cr(C204)2(H20)2] and a hydrate thereof, for example, K[Cr(C204) 2(H20)2].2H20, K[Cr(C204)2(H20)2].3H20, Na[Cr(C204)2(H20)2].5H20, (NH4)[Cr(C204)2( H20)2].3H20, Li[Cr(C204)2(H20)2], Rb[Cr(C204)2(H20)2] 'Cs[Cr(C204)2(H20)2], Mg[Cr( C204) 2 (H20) 2] 2

Ca[Cr(C204)2(H20)2]2、Sr[Cr(C2〇4)2(H2〇)2]2、Ba[Cr(C204)2(H20)2] 等。又,作為該成長性異物之鹽,可列舉二氫氧根二(草 酸根)鉻(III)酸鹽M3[Cr(C2〇4)2(〇H)2]及其水合物’例如: 144856.doc • 11 - 201037456Ca[Cr(C204)2(H20)2]2, Sr[Cr(C2〇4)2(H2〇)2]2, Ba[Cr(C204)2(H20)2] and the like. Further, examples of the salt of the growth foreign matter include dihydrogen oxalate (oxalate) chromium (III) acid salt M3 [Cr(C2〇4) 2 (〇H) 2] and a hydrate thereof, for example: 144856 .doc • 11 - 201037456

Ag3[Cr(C204)2(〇H)2].3H2〇、Ca3[Cr(C204)2(〇H)2]2.4H20、 K3[Cr(C204)2(〇H)2].6H20、Ag3[Cr(C204)2(〇H)2]、Pb3[Cr(C204)2(0H)2] 等。又’亦可列舉水合(氫氧根)二(草酸根)合鉻(III)酸鹽 ivyCrCQC^OHXH^O)]及其水合物,例如:、 (NH4)2[Cr(C204)2(〇H)(H2〇)].H2〇 等。 作為成長性異物而特別易於產生者為銨鹽,其中,尤其 是三(草酸根)鉻(111)酸鹽M3[Cr(C2〇4)3]及其水合物,例如 (NH4)3[Cr(C204)3]_nH20。 上述草酸鉻錯合物之大部分具有吸濕性、吸水性及/或 潮解性,形狀根據濕度而不同,但呈結晶狀或液狀◊又, 該等草酸鉻錯合物於使用光罩之環境下,幾乎不產生昇 華洛發等,因此作為成長性異物而積蓄於硬鉻遮罩上。 又,包含該等草酸鉻錯合物之成長性異物亦產生於轉印圖 案開口部,其結果,由於未正常地進行曝光’故成為曝光 缺,所製成之TFT液晶面板成為不良或缺陷產品。至該 曝光缺陷產生為止之時間因遮罩圖案之形狀或種類、: t、圖案之種類、步料而不同,且產生曝光缺陷係具有 時間跨度,於較快之情形時,有時於ι年〜2年中產生 =氛圍中之草酸濃度較低之情形時,i因該異物之產 生而產生曝光缺陷為止之時間變長。 見解’並根據以下構思進—步進行研究,結果 =明,上述構思係若使用具有如下膠片臈之膠片, 可抑制上逑成長性異物之產生,該膠片膜 巩圍中所存在之草酸或銨鹽因 二 』土要原因之氨進入該密 I44856.doc 201037456 ❸阻氣性。於日本專利特開2隊184822號公報 不有’由膠片框架所引起之酸離子(硫酸離子、琐酸 广有機酸等)會成為異物生成之原因。另一方面,於 製造液晶顯示裝置之環境中,於ITQ電極之圖㈣成時使 用姓刻液,但該㈣液主要係鹽酸,於製造環境氛圍中僅 ^在不成為成長性異物產生之原因之程度的極其微量之草 酉文口此,並未認識到於上述環境氛圍中草酸離子以特定Ag3[Cr(C204)2(〇H)2].3H2〇, Ca3[Cr(C204)2(〇H)2]2.4H20, K3[Cr(C204)2(〇H)2].6H20, Ag3 [Cr(C204)2(〇H)2], Pb3[Cr(C204)2(0H)2] and the like. Further, hydration (hydrogen) bis(oxalate) chromite (III) acid salt ivyCrCQC^OHXH^O)] and hydrates thereof may be mentioned, for example, (NH4)2[Cr(C204)2(〇 H) (H2〇)].H2〇, etc. Particularly preferred as a growth foreign material is an ammonium salt, among which, in particular, a tris(oxalate) chromium (111) acid salt M3 [Cr(C2〇4) 3] and a hydrate thereof, for example, (NH 4 ) 3 [Cr (C204) 3] _nH20. Most of the above-mentioned chromium oxalate complexes are hygroscopic, water-absorbing and/or deliquescent, and the shapes vary depending on the humidity, but they are crystalline or liquid, and the chromium oxalate complexes are used in the mask. In the environment, there is almost no sublimation, and it is accumulated as a growth foreign matter on a hard chrome mask. Further, the growth foreign matter including the chromium oxalate complex is also generated in the opening of the transfer pattern, and as a result, the exposure is not performed normally, so that the TFT liquid crystal panel is defective or defective. . The time until the exposure defect occurs is different depending on the shape or type of the mask pattern, t: the type of the pattern, and the step material, and the exposure defect has a time span, and in the case of a faster case, sometimes When the concentration of oxalic acid in the atmosphere is low in ~2 years, the time until the exposure defect occurs due to the occurrence of the foreign matter becomes long. Insights' and proceeding according to the following concept, the result = Ming, the above concept is to use the film with the following film ,, can inhibit the growth of the growth of foreign matter in the film, the oxalic acid or ammonium present in the film film The salt due to the second soil requires the ammonia to enter the dense I44856.doc 201037456 ❸ gas barrier. In Japanese Patent Laid-Open No. 2, No. 184822, there is no cause that acid ions (sulfuric acid ions, organic acid acids, etc.) caused by a film frame may cause foreign matter formation. On the other hand, in the environment in which the liquid crystal display device is manufactured, the surname engraving is used in the diagram (4) of the ITQ electrode, but the (iv) liquid is mainly hydrochloric acid, and is only caused by the growth of foreign matter in the manufacturing environment atmosphere. The extent of the extremely small amount of grasshoppers, this does not recognize the oxalic acid ions in the above ambient atmosphere to be specific

以上之濃度存在。而且,製造環境氛圍中所存在之草酸不 僅,被視作問題,而且根據先前技術無法產生使用具有高 :氣性之膠片膜來減少上述成長性異物之產生的技術思 ’、、本案&明係根據與先前技術完全不同之技術思想而完 成之發明。 ~ 即,本發明如下。 [1] 一種膠片膜,其於70X:放置72小時後之膜厚】μπι換算之 草酸透過量為1Gxl().3 mg/em2以下,且主要之膜材料為光 學用有機高分子。 [2] 一種膠片膜,其25。(:下之氨透過係數為8.〇xl〇-9 cm3Tm/cm2_s_Pa以下,且主要之膜材料為光學用有機高分 子。 [3] 如[2]之膠片膜,其中於70°C放置72小時後之膜厚1 μΓη 換算之草酸透過量為丨〇χ 1〇_3 mg/cm2以下。 144856.doc -13- 201037456 [4] 一種膝片膜’其主要膜材料為光學用有機高分子,且於 該膜材料中包含相對於該光學用有機高分子之總重量為 〇_1重量%以上1 5重量%以下之光穩定劑。 [5] 如[4]之膠片膜’其中上述光學用有機高分子為環烯烴 系樹脂或纖維素衍生物。 [6] 如[4]或[5]之膠片膜,其中上述光穩定劑為受阻胺系光 穩定劑。 [7] 一種膠片’其包括:框體 Π]至[6]中任—項之膠片膜、 黏著材層。 、於該框體之上緣面侧之如 以及於該框體之下緣面側之 [8] 如[7]之膠片 [9] 其與TFT液晶面板製造用光罩併用 與光穩定劑溶二=法1包括:使光學用有機高 以及自該聚合=:劑中而S作聚合物溶液之步 j-1〇^ 去除有機溶劑之步驟。 如[9]之膠片膜之製造 式烴、氣化烴、其中上述有機溶劑為, [n] 5曰糸化合物或酮系化合物。 144856.doc 201037456 其中上述光穩定劑為 如[9]或[10]之膠片膜之製造方法, 受阻胺系光穩定劑。 [12] 如[11]之膠片膜之製造方法 劑於25°c為液狀。 其中上述受阻胺系光穩定 [13] 如[9]至U2]中任一項之膠片膜之製造方法,其中上述光The above concentrations are present. Moreover, the oxalic acid present in the atmosphere of the manufacturing environment is not only regarded as a problem, but also the technical idea of using the film film having high gasity to reduce the occurrence of the above-mentioned growth foreign matter cannot be produced according to the prior art, and the present case & The invention is based on a completely different technical idea from the prior art. ~ That is, the present invention is as follows. [1] A film film which has a film thickness of 70X after being left for 72 hours, has a oxalic acid permeation amount of 1 Gxl ().3 mg/cm2 or less, and the main film material is an optical organic polymer. [2] A film film, 25 of which. (The ammonia permeability coefficient is 8. 〇xl 〇-9 cm3Tm/cm2_s_Pa or less, and the main film material is an optical organic polymer. [3] The film film of [2], which is placed at 70 ° C 72 The film thickness of 1 μΓη after the hour is 丨〇χ1〇_3 mg/cm2 or less. 144856.doc -13- 201037456 [4] A knee film film whose main film material is optical organic polymer And the film material contains a light stabilizer of 〇_1% by weight or more and 15% by weight or less based on the total weight of the optical organic polymer. [5] The film film of [4] wherein the above optical The organic polymer is a cycloolefin resin or a cellulose derivative. [6] The film film according to [4] or [5] wherein the light stabilizer is a hindered amine light stabilizer. [7] A film Including: the film film of the frame Π] to [6], the adhesive layer, the side of the upper edge of the frame and the side of the lower edge of the frame [8] as [ [7] The film [9] and the TFT liquid crystal panel manufacturing photomask together with the light stabilizer dissolved two = method 1 includes: making the optical organic high and from the polymerization =: agent The step of removing the organic solvent in the step of the polymer solution. The method of producing a film of the film of [9], a hydrocarbon, a gasified hydrocarbon, wherein the above organic solvent is a [n] 5 曰糸 compound or a ketone compound. 144856.doc 201037456 wherein the light stabilizer is a method for producing a film film according to [9] or [10], a hindered amine light stabilizer. [12] A method for producing a film film according to [11] at 25 ° C The method for producing a film film according to any one of [9] to U2, wherein the light is a liquid film.

〇 學用有機高分子為環烯烴樹脂或纖維素衍生物。 [14] -種光罩’其係於透明基板之表面具有將包含鉻之遮光 性膜圖案化而成之轉印圖案,且於該透明基板之具有轉印 圖案的一側之面上安裝有膠片之液晶顯示裝置製造用者, 該透明基板具有1000 cm2以上之面積, a亥膠片之膠片膜之膜厚為0 5 μιη以上8 以下且於溫 度為70C之氛圍中放置72小時後之該膠片膜之膜厚i μιη換 算的草酸透過量為l.OxiO-Smg/cm2以下。 [15] 如Π4]之光罩,其中上述遮光性膜之轉印圖案係藉由濺 鍍法而於上述透明基板上成膜,並具有利用蝕刻進行圖案 化而成之圖案剖面。 [16] 一種圖案轉印方法,其係於溫度為15艺以上之氛圍中, 對如[14]或[1 5]之光罩照射包含丨線〜g線之波長範圍之曝光 光束’藉此將上述轉印圖案轉印至被轉印體上。 144856.doc •15. 201037456 [17] 一種TFT液晶面板之製造方法,其包括:準備如[14]或 [15]之光罩之步驟;通過該光罩對具有ιτ〇電極並塗佈感 光性光阻而成之TFT液晶面板基板進行Μ之步驟;對该 感光性光阻進行顯影之步驟;以及利用包含草酸之崎 蝕刻該ΙΤΟ電極之步驟。 [18] 種膠片其係與TFT液晶面板製造用遮罩併用者,3The organic polymer used in the study is a cycloolefin resin or a cellulose derivative. [14] A type of photomask having a transfer pattern formed by patterning a light-shielding film containing chromium on a surface of a transparent substrate, and having a surface on a side of the transparent substrate having a transfer pattern For the manufacture of a liquid crystal display device of a film, the transparent substrate has an area of 1000 cm 2 or more, and the film thickness of the film film of a film is 0 5 μm or more and 8 or less and is placed in an atmosphere of 70 C for 72 hours. The oxalic acid permeation amount in terms of the film thickness i μηη of the film was 1.0 OxiO-Smg/cm 2 or less. [15] The photomask according to [4], wherein the transfer pattern of the light-shielding film is formed on the transparent substrate by a sputtering method, and has a pattern cross-section formed by etching. [16] A pattern transfer method in which an exposure beam having a wavelength range of a 丨 line to a g line is irradiated to an illuminant such as [14] or [1 5] in an atmosphere having a temperature of 15 or more. The above transfer pattern is transferred onto the transfer target. 144856.doc •15.201037456 [17] A method of manufacturing a TFT liquid crystal panel, comprising: a step of preparing a photomask such as [14] or [15]; passing the photomask with an ιτ〇 electrode and applying photosensitivity a step of performing photolithography on the TFT liquid crystal panel substrate; a step of developing the photosensitive photoresist; and a step of etching the germanium electrode by using oxalic acid. [18] A combination of film and TFT LCD panel manufacturing, 3

膠片包含框體、積層於該框體之下緣面側之黏著材層、^ 及於該框體之上緣面側展開之膠片膜,該膠片膜之膜厚』 W㈣以上8 _以下,且該勝片膜之於听放置η小時名 之草酸透過量為lxl〇-4mg/cm2以下。 [19] 如[18]之膠片,盆中 ,、中上述膠片膜之面積為1〇〇〇 cm2以 上、30000 cm2以下。 〇 如[18]或[19]之膠片,其中 丹Y上迤膠片膜係由包含環烯烴 系樹脂之膜材料所形成。 [21] 如[18]至[20]中任―工苜令峨μ ^ 一/ 員之膠片,其中上述膠片膜係由包含 環稀煙糸樹脂及相對於1 iSi咕μ一么& 對於该%烯烴糸樹脂之總重量為〇1 量%以上15重量1 ^ 里/。以下之光穩定劑的膜材料,或者包含環 烯煙系樹脂、相對於 、”亥%烯烴系知i月曰之總重量為〇丨重量% 以上1 5重量。/〇以下之伞 卜之先穩定劑及0.1重量%以上1〇重量%以 144856.doc 16· 201037456 下之抗氧化劑的膜材料所形成。 [22] 如Ρ1]之膠片,其中上述光穩定劑於常溫下為液狀。 [23] ° 如[18]至[2训任—項之膠片,其+於上述^膜之一 面或兩面積層有包含環式或直鏈狀氟取代氟燒基聚輕之抗 反射層。 Ο ❹ [24] 一種TFT液晶面板之製造方法,其包括:將如以8]至 中任-項之膠片經由積層於上述框體之下緣面側之黏著材 層貼附於硬鉻遮罩上之步驟;通過該硬鉻遮罩對具有汀〇 電極並塗佈感光性光阻而成之TFT液晶面板基板進行曝光 之步驟;對該感光性光阻進行顯影之步驟;以及利用包含 草酸之蝕刻液蝕刻該ITO電極之步驟。 [25] 種光罩,其係於透明基板之表面具有將包含鉻之遮光 性膜圖案化而成之轉印圖案 '且於該透明基板之具有轉印 圖案的一側之面上安裝有膠片之液晶顯示裝置製造用者, 該透明基板具有1 〇〇〇 cm2以上之面積, δ亥膠片之膠片膜之膜厚為05 μιη以上8 μιη以下,並 且, 於溫度為70 C之氛圍中放置72小時後之該膠片膜之草酸 透過量為lxl〇4mg/cm2以下。 [26] 144856.doc 17 201037456 性膜之轉印圖案係藉由濺 並具有利用蝕刻進行圖案 如[25]之光罩,其中上述遮光 鍍法而於上述透明基板上成膜, 化而成之圖案剖面。 [27] 如间或[26]之光罩,其中上述轉印圖案具有線寬為% · μιη以上500 μιη以下之遮光圖案。 _ [28] 一種光罩之製造方法’其係包括如下步驟者:於透明基 板上藉由濺鍍法而形成包含鉻之遮光性獏,並於該遮光性❹ 膜上塗佈光阻膜,對該光阻膜描繪所需之轉印圖案後,進 打顯影而獲得光阻圖案’將該光阻圖案作為遮罩而钱刻該 遮光性膜,藉此於該遮光性膜上將該轉印圖案圖案化,將 該光阻圖案剝離後,於該透明基板之該經圖案化之遮光性-膜側安裝膠片;上述膠片之膠片膜之膜厚為〇 5叫以上8 μηι以下,且於溫度為7(Γ(:之氛圍中放置72小時後之該膠 片膜之草酸透過量為lx1(r4mg/cm2以下。 [29] Ο 一種圖案轉印方法,其係於溫度為15t以上之氛圍中, 對如[25]至[27]中任一項之光罩、或者由如[28]之光罩之製 造方法所製造的光罩照射包含丨線〜g線之波長範圍之曝光 光束’藉此將上述轉印圖案轉印至被轉印體上。 [30] 一種TFT液晶面板之製造方法,其包括:準備經由積層 於上述框體之下緣面側之黏著材層而貼附有如[18]至[23] 144856.doc •18- 201037456 中任-項之膠片的硬鉻遮罩之步驟;通過該硬鉻遮罩對具 有ITO電極並塗佈感光性光阻而成之TFT液晶面板基板進 行曝光之步驟;對該感光性光阻進行顯影之步驟;以及利 • 用包含草酸之蝕刻液蝕刻該ITO電極之步驟。 發明之效果 藉由將本發明之膠片應用於硬鉻遮罩,可抑制於IC(積 體電路)、LSI(大規模積體電路)、TFT型LCD(薄膜電晶體 〇 型液晶顯示器)等半導體裝置之製造步驟、尤其是TFT液晶 面板之製造步驟中,力硬鉻遮罩上產生上$成長性異物。 【實施方式】 首先,對光罩、以及膠片於光罩上之貼附進行說明。 .. 平板顯示器用液晶面板之製造中所使用之光罩係使用於 包含合成石英玻璃或鹼石灰玻璃之透明基板上形成有微細 . 圖案者。此處所使用之透明基板多數具有1000 em2以上之 面積又,可根據圖案之精度而區分使用乳膠遮罩與硬鉻 〇 遮罩。本發明之膠片較好的是應用於形成於合成石英 或鹼石灰破璃之表面之硬鉻遮罩、尤其是形成於合成石英 玻璃上之硬鉻遮罩。於硬鉻遮罩中,除鉻系薄膜以外,亦 可使用形成有其他組成之膜之積層構成的光罩部,進而, 亦可於蝕刻鉻系薄膜後積層其他膜,進一步進行蝕刻而圖 • 案化。 ^ ^硬鉻遮罩係於透明基板之主表面上藉由反應性濺 鍍而形成以Cr(Chromium)作為主成分之遮光性之金屬膜。 於此時形成抗反射膜之情形時,首先僅濺鍍Cr,然後向賤 144856.doc •19- 201037456 鍍氣體中導入氧氣,藉此可於表面形成包含鉻氧化物之抗 反射膜。同樣地,可藉由導入各種氣體而改變〜金屬膜二 組成,藉此,可製造積層有包含合物之複數層之空白 硬鉻遮罩。作為該遮光性金屬膜’可列舉包含於鉻單體或 鉻中含有氛、氧或碳等之材料之單層膜或該膜之積層膜。 尤其是本發明之膠片可應用於具有組成各異之複數層之 膜。 曰 於該空白硬鉻遮罩之基板上之&金 〇 项联田上塗佈光阻, 並利用雷射光束描繪微細圖案,進行顯影,而形成光阻圖 案。繼而,將光阻圖案作為遮罩,利用蚀刻去除未受到光 阻保遵之Cr金屬膜’藉此形成所需之轉印圖案(圖案化)。 其後’利用光阻剝離㈣離去除&金屬膜上所殘留之 阻進而進行清洗,並進行檢查,製成硬絡遮罩。 :防!!要再次清洗上述硬絡遮罩,使用膠片貼片機 止,、物附著於具有轉印圖案的一 之膠片。复饴衣曲為目的 異物。…利用缺陷檢查機確認膠片内側是否混入有 以下’對上述成長性異物之抑制方法 作為抑制該成長性異物之方法, 兄月° 片膜之草酸读、A w 了考慮如下方法:使膠 草酸J! 降之方法、使液晶面板之製作環境之 法、將:罩:度下降之方法、保護硬絡遮罩之絡表面之方 、遮草圖案或遮光材料改變為 方法、利帛對錢不發生反應者之 空間進行置換匕〆酸之氣體對光罩基板與膠片膜之間之 置換之方法、以及使遮罩接觸乾操空氣之方法 144856.doc -20- 201037456 等。 於3亥等方法之中’對藉由使膠片膜之草酸透過性下降來 • #制成長性異物產生之方法加以說明。 . 般'^為於抑制成長性異物之方法中,必需不使硬鉻遮 . 罩上之鉻與草酸或氨接觸,因此,若使用難以透過草酸或 虱之膠片膜,則可減少到達硬鉻遮罩之鉻上之草酸量或氨 量,因此可抑制成長性異物之產生,並可大幅度地延長至 0 纟生曝光缺為止之時間。至產生成長性異物、並產生曝 光缺陷為止之時間與膠片膜之透過性有關,若使用於70。(: 放置72小時後之膜厚i μιη換算之草酸透過量為丨〇χΐ〇 3 mg/Cm2以下之膠片膜,則可維持充分之透光性能,並且可 大幅度地抑制成長性異物之產生,從而可大幅度地延長至 產生曝光缺陷為止之時間。於7〇它放置72小時後之膜厚i ' 換算之草酸透過量更好的是8.〇Xl〇-4 mg/cm2以下,更好 的是1·6χ10·4 mg/cm2以下,特別好的是5 〇χΐ〇_5 mg/cm2以 ❹ 下。 又,若使用於70°C放置72小時後之草酸透過量為1><1〇·4 mg/cm2以下之膠片膜,則可大幅度地延長至產生成長性異 .物、並產生曝光缺陷為止之時間,又,該遮罩於使用上亦 不存在問題。更好的是於70。(:放置μ小時後之草酸透過量 - 為5x10 5 mg/cm以下,較好的是即使添加光穩定劑、或者 . 光穩定劑及抗氧化劑,草酸透過量亦為5χ1(Γ5 mg/cm2以 下。於70。(:放置72小時後之草酸透過量更好的是爻“ίο·5 mg/cm2以下,特別好的是6.0x10-6 mg/cm2以下。又,藉由 144856.doc 21 201037456 添加光穩定劑(較好的是光穩定劑及抗氧化劑),可進一步 有效地抑制草酸透過量。 又,關於氨,若使用25°C下之氨透過係數為8·〇χ1〇-9 以下之膠片膜,則亦可維持充分之透光性 能,亚且可大幅度地抑制成長性異物之產生,從而可大幅 度地延長至產生曝光缺陷為止之時間。25。〇下之氨透過係 數更好的是6.0X10-9 cm、m/cm2.s.pam,進而更好的是 UxiO-9 CmVn/cm、.Pa 以下,特別好的是 ι〇χΐ〇_9 cm3’gm/cm2.s.Pa以下。 包括具有下述抗反射層之情形,膠片膜之膜厚較好的是 〇_5,以上8㈣以下,更好的是2 _以上6 _以下。膠片 膜之膜厚越厚,越可抑制草酸透過性,進而越可提昇膜強 度,因此較好的是0.5 _以上,但若過厚,則透光性下 降,因此就透光性而言較好的是8μιη以下。 作為膠片膜,重要的是減少草酸透過量,但同時, :是使膠片膜之臈厚具有合適之厚度。就穿刺強度等膜強 度之觀點或成長性異物之抑制 、、 較好的是05 , ㈣的觀點而言’膠片膜之膜厚 較好的疋0.5 _以上,且越厚越好 率之觀點而言較好的是8 ,就透光 ^ θ /+ h且越缚越好。即,鲂妬 的疋使所需之膠片膜之草酸透 車乂好 ΛΑ B ^ ^ u /、膜各達到平衡。較好 的疋作為膠片膜之草酸透過量、於 酸透過量為lxio·4 / 2 、 C放置72小時後之草 朴叫⑽以下之谬片膜,就該觀點而丄 右為母早位膜厚之草酸透過量較 ;, 抑制草酸透過量,並且可提高透光率片::可充分地 玟季乂好。具體而 144856.doc 201037456 言,較好的是作為膠片膜之草酸透過量、於7 時後之膜厚…換算之草酸透過量為ι〇χΐ〇.3 ; 之膠片膜。 卜 降低草酸透過性之膠片膜可藉由選擇膜材料而實現。作 為可用於膠片膜之膜材料’無機系材料、有機系材料均可 制,但就操作性、生產性等之觀點而言,較好的是有機 兩分子〇The film comprises a frame body, an adhesive layer laminated on the lower edge side of the frame body, and a film film which is unfolded on the upper edge side of the frame body, and the film thickness of the film film is W (four) or more and 8 _ or less, and The turmeric acid permeation amount of the slab film is 1×10 /-4 mg/cm 2 or less. [19] For the film of [18], the area of the above film film in the pot, in the middle, is above 1 cm 2 , and below 30000 cm 2 .胶片 For film of [18] or [19], the film film of Dan Y is made of a film material containing a cycloolefin resin. [21] For example, in [18] to [20], the film of the above-mentioned film is composed of ring-like soot resin and relative to 1 iSi咕μ & The total weight of the % olefin oxime resin is 〇1% by weight or more and 15% by weight. The film material of the light stabilizer described below, or a cycloolefin-based resin, is preferably a weight of 5% by weight or more based on the total weight of the oxime-based olefin. The stabilizer and 0.1% by weight or more and 1% by weight are formed of a film material of an antioxidant of 144856.doc 16·201037456. [22] The film of Ρ1], wherein the light stabilizer is liquid at normal temperature. 23] ° For the film of [18] to [2], the + or one of the two layers of the above film has a ring-shaped or linear fluorine-substituted fluoroalkyl group light-weight anti-reflection layer. [24] A method of manufacturing a TFT liquid crystal panel, comprising: attaching a film as in the above-mentioned item to a hard chrome mask via a film layer laminated on a lower edge side of the frame body; a step of exposing a TFT liquid crystal panel substrate having a tin-plated electrode and applying a photosensitive photoresist by the hard chrome mask; a step of developing the photosensitive photoresist; and using an etching solution containing oxalic acid a step of etching the ITO electrode. [25] A photomask attached to a transparent substrate A liquid crystal display device having a transfer pattern formed by patterning a light-shielding film containing chromium and having a film on a side of the transparent substrate having a transfer pattern, the transparent substrate having 1 〇〇〇cm2 or more, the film thickness of the film of δ hai film is below 05 μηη and 8 μηη, and the oxalic acid permeation amount of the film film after being placed in an atmosphere of 70 C for 72 hours is lxl〇 4mg/cm2 or less. [26] 144856.doc 17 201037456 The transfer pattern of the film is formed by sputtering and having a mask patterned by etching, such as [25], wherein the above-mentioned light-shielding method is used to form a film on the transparent substrate. [27] A mask according to [26], wherein the transfer pattern has a light-shielding pattern having a line width of less than 100 μm and a width of less than 500 μm. _ [28] A method of manufacturing a mask The method includes the steps of: forming a light-shielding ruthenium containing chromium on a transparent substrate by sputtering, and applying a photoresist film on the light-shielding ruthenium film to trace the desired rotation of the photoresist film. After printing the pattern, it is developed The photoresist pattern is used as a mask to engrave the light-shielding film, whereby the transfer pattern is patterned on the light-shielding film, and the photoresist pattern is peeled off, and then the transparent substrate is used. The patterned light-shielding-film-side mounting film; the film thickness of the film film of the film is 〇5 or more and 8 μηι or less, and the film film is placed at a temperature of 7 (after 72 hours in an atmosphere) The oxalic acid permeation amount is lx1 (r4 mg/cm2 or less. [29] Ο A pattern transfer method in an atmosphere having a temperature of 15 t or more, for a photomask according to any one of [25] to [27], Alternatively, the photoreceptor manufactured by the method for manufacturing a photomask according to [28] irradiates an exposure beam having a wavelength range of a twist line to a g line, thereby transferring the transfer pattern onto the object to be transferred. [30] A method of manufacturing a TFT liquid crystal panel, comprising: preparing to adhere to an adhesive layer laminated on a lower surface side of the frame body as in [18] to [23] 144856.doc • 18- 201037456 a step of hard chrome masking of the film of the item; a step of exposing the TFT liquid crystal panel substrate having the ITO electrode and applying the photosensitive photoresist by the hard chrome mask; developing the photosensitive photoresist a step; and a step of etching the ITO electrode with an etchant containing oxalic acid. Advantageous Effects of Invention The film of the present invention can be applied to a semiconductor such as an IC (integrated circuit), an LSI (large-scale integrated circuit), or a TFT-type LCD (thin-film liquid crystal display) by applying the film of the present invention to a hard chrome mask. In the manufacturing steps of the device, particularly in the manufacturing steps of the TFT liquid crystal panel, a top-grown foreign matter is generated on the hard chrome mask. [Embodiment] First, the reticle and the attachment of the film to the reticle will be described. The reticle used in the manufacture of a liquid crystal panel for flat panel display is used for forming a fine pattern on a transparent substrate including synthetic quartz glass or soda lime glass. Most of the transparent substrates used here have an area of 1000 em2 or more, and the latex mask and the hard chrome 遮 mask can be distinguished according to the precision of the pattern. The film of the present invention is preferably applied to a hard chrome mask formed on the surface of synthetic quartz or soda lime, especially a hard chrome mask formed on synthetic quartz glass. In the hard chrome mask, in addition to the chromium-based film, a mask portion formed by laminating a film having another composition may be used, and further, another film may be laminated after etching the chromium-based film, and further etching may be performed. Case. ^^ A hard chrome mask is formed by a reactive sputtering on a main surface of a transparent substrate to form a light-shielding metal film containing Cr (Chromium) as a main component. In the case where an antireflection film is formed at this time, first, only Cr is sputtered, and then oxygen is introduced into the plating gas of 贱144856.doc •19-201037456, whereby an antireflection film containing chromium oxide can be formed on the surface. Similarly, the composition of the metal film can be changed by introducing various gases, whereby a blank hard chrome mask in which a plurality of layers including the composition are laminated can be produced. The light-shielding metal film 'is a single-layer film containing a material such as an atmosphere, oxygen or carbon in a chromium monomer or chromium, or a laminated film of the film. In particular, the film of the present invention can be applied to a film having a plurality of layers of various compositions.涂 Applying a photoresist to the & gold alloy field on the blank hard chrome mask substrate, and drawing a fine pattern using a laser beam to develop, thereby forming a photoresist pattern. Then, the photoresist pattern is used as a mask, and the Cr metal film which is not subjected to the photoresist is removed by etching to form a desired transfer pattern (patterning). Thereafter, the photoresist is peeled off by the photoresist (4), and the residue remaining on the metal film is removed and cleaned, and inspected to form a hard mask. : Defense! To clean the hard cover again, use a film mount machine to attach the film to a film with a transfer pattern. For the purpose of reclamation, it is a foreign body. ...the method of suppressing the above-mentioned growth foreign matter is suppressed by the defect inspection machine as the method of suppressing the growth foreign matter, and the oxalic acid reading of the film of the brother and the moon, A w is considered as follows: making the oxalic acid J The method of lowering the method of making the liquid crystal panel, the method of reducing the degree of the cover, the method of protecting the surface of the hard mask, the pattern of the grass or the shading material, and the method of profiting does not occur. The space of the reactor is a method of replacing the gas between the reticle substrate and the film film, and a method of bringing the mask into contact with the dry air, 144856.doc -20-201037456, and the like. In the method of 3H, etc., a method of producing a long foreign matter by reducing the oxalic acid permeability of the film film is described. In the method of suppressing growth foreign matter, it is necessary to prevent the hard chrome from covering the chrome on the cover with oxalic acid or ammonia. Therefore, if a film film which is difficult to permeate oxalic acid or strontium is used, the hard chrome can be reduced. The amount of oxalic acid or ammonia on the chrome of the mask can suppress the growth of foreign matter, and can be extended to a time until the exposure is low. The time until the growth of the foreign matter and the occurrence of the exposure defect is related to the permeability of the film film, and is used in 70. (: A film film with a oxalic acid permeation of 丨〇χΐ〇3 mg/cm2 or less in a film thickness of i μηη after 72 hours of storage can maintain sufficient light transmission performance and can greatly suppress the growth of foreign matter. Therefore, the time until the exposure defect is generated can be greatly extended. The film thickness i' after 7 hours of placing it for 7 hours is better than 8. 〇Xl〇-4 mg/cm2 or less. Preferably, it is 1·6χ10·4 mg/cm2 or less, particularly preferably 5 〇χΐ〇_5 mg/cm2 to ❹. Further, if it is used at 70 ° C for 72 hours, the oxalic acid permeation amount is 1>< A film film of 1 〇·4 mg/cm2 or less can be greatly extended to a time when a growth property is generated and an exposure defect is generated, and the mask is not problematic in use. It is at 70. (: the amount of oxalic acid permeation after being placed for 5 hours is 5x10 5 mg/cm or less, preferably even if a light stabilizer, or a light stabilizer and an antioxidant are added, the oxalic acid permeation amount is 5χ1 ( Γ5 mg/cm2 or less. At 70. (: The oxalic acid permeation after 72 hours of placement is better 爻"ίο·5 mg/cm2 Further, it is particularly preferably 6.0x10-6 mg/cm2 or less. Further, by adding a light stabilizer (preferably a light stabilizer and an antioxidant) by 144856.doc 21 201037456, the oxalic acid permeation amount can be further effectively suppressed. In addition, when a film film having an ammonia permeability coefficient of 8 〇χ1 〇 -9 or less at 25 ° C is used for ammonia, sufficient light transmission performance can be maintained, and the growth of foreign matter can be greatly suppressed. Therefore, it can be greatly extended until the time when the exposure defect is generated. 25. The ammonia permeability coefficient of the underarm is 6.0X10-9 cm, m/cm2.s.pam, and more preferably UxiO-9 CmVn. /cm, .Pa or less, particularly preferably ι〇χΐ〇_9 cm3'gm/cm2.s.Pa or less. Including the case of the antireflection layer described below, the film thickness of the film film is better 〇_5 The above 8 (four) or less, more preferably 2 _ or more and 6 _ or less. The thicker the film thickness of the film film, the more the oxalic acid permeability can be suppressed, and the film strength can be increased, so it is preferably 0.5 _ or more. When it is thick, the light transmittance is lowered, so that it is preferably 8 μm or less in terms of light transmittance. As a film film, it is important The amount of oxalic acid permeate is small, but at the same time, it is such that the thickness of the film film has a suitable thickness. The viewpoint of film strength such as puncture strength or the suppression of growth foreign matter, preferably 05, (4) The film thickness of the film is preferably 疋0.5 _ or more, and the thicker the better, the better is 8 , the light transmission ^ θ / + h and the better the binding. The oxalic acid required for the film film is good for ΛΑB ^ ^ u /, and the films are balanced. The preferred ruthenium is used as the oxalic acid permeation amount of the film film, and the sputum film of the grass is called (10) or less after the acid permeation amount is lxio·4 / 2 and C is placed for 72 hours, and the right side is the mother early film. The amount of oxalic acid permeate is relatively high; the amount of oxalic acid permeation is inhibited, and the transmittance of the sheet can be improved: it can be sufficiently seasoned. Specifically, 144856.doc 201037456 is preferred as a film film having a oxalic acid permeation amount of a film film, a film thickness after 7 hours, and a oxalic acid permeation amount of ι〇χΐ〇.3; A film film that reduces oxalic acid permeability can be achieved by selecting a film material. As a film material which can be used for a film film, an inorganic material or an organic material can be produced, but in terms of workability, productivity, etc., it is preferred that the organic two molecules are

=片膜k好的疋其主要膜材料為光學用有機高分子,所 謂「主要」係表示於整個膜材料甲為50重量%以上所謂 光學用」係表示例如365〜463 nm之波長之透過率為8〇% 以上。 .纟作為可用於膠片膜之光學用有機高分子,可考慮作為纖 ’准素何生物(包含纖維素)之乙酸纖維素、乙酸丁酸纖維 素、二乙酸纖維素、乙酸丙酸纖維素、硝酸纖維素、硝化 纖維素等’除此以外’可列舉:四氟乙烯_六氟丙烯共聚 〇 物浚四氟乙稀、聚三氟氯乙稀、聚偏二氟乙浠、聚4_甲 基戊烯、聚丙烯酸丁酯、聚乙酸乙烯酯、聚丙烯酸甲酯、 I丙烯、聚甲搭、聚乙烯丁越、聚曱基丙稀酸甲酯、聚乙 稀醇、聚胺基甲酸酯、聚乙烯甲醛、聚異丁烯、聚乙烯、 聚丁埽、聚丁二烯、聚氯乙烯、聚丙烯腈、聚甲基丙烯 腈聚異戊二烯、尼龍6'尼龍66、丁二烯-苯乙烯共聚 • 物、腺-甲醛樹脂、環氧樹脂、聚氯丁二烯、聚鄰苯二甲 ^ 一烯丙酯、聚苯乙烯、聚偏二氯乙烯、聚砜、苯酚-甲 搭樹脂、氣原子之一部分或全部由氟原子取代之氟烷基聚 144856.doc -23 - 201037456 趟、環式或鏈式之氟取朴齑,ρ 1 月匕 月曰、月曰壤式稀烴樹脂等,其中,就草酸透過量較少 物性、機械物性等膜實用性,易於製造等觀點而[較: 的是選自由纖維素衍生物(尤其是乙酸丙酸纖維素、硝化 纖維素)n式丙㈣樹腊以及料式婦_脂所组成 之群中之至少一種樹脂。 、又,上述光學用有機高分子之中’就氨透過係數較小, 〇 :及光學物性、機械物性等膜實用性,易於製造等觀點而 έ ’較好的是選自由作矣蓋备姑+ > 乍為齓系树月曰之四氟乙稀-六氟丙稀 物聚四敗乙稀、聚二I氣乙稀、聚偏二氣乙缚、氫 原子之-部分或全部由氟原子取代之氟烧基聚謎、環式或 鏈式之氟取代就烧基聚趟或脂環式浠烴樹脂所組成之群中 之樹脂。 種材料之中,尤其是作為草酸透過量較少、氨透過係 ,較小之材料’可列舉環烯烴系樹脂,較好的是降宿烯之 聚合物或共聚物(包含氫化物)。例如可列舉Apel(註冊商 標K三井化學公司製造)、TQpas(註冊商標)(p_piastics股 t有限公司製造)、Ze0nex(註冊商標)或zeonor(註冊商 )(本Zeon A司製造)、Arton(註冊商標)(JSR公司製造) 等作為適於膠片膜之環烯烴系樹脂,其中,尤其是 Ze〇nor(si冊商標)(日本。⑽公司製造)作為草酸透過量較 少、氨透過係數較小之材料最好。 於膠片膜之膜材料中,較好的是使用使環烯烴系樹脂或 纖維素衍生物溶解於有機溶劑中而成之聚合物溶液。尤其 144856.doc -24- 201037456 Ο 〇 是就草酸透過量或氨透過係數之觀點而言,較好的是使用 使環稀烴系樹脂溶解於有機溶劑中而成之聚合物溶液。作 為可使用之有機溶劑,可列舉月旨肪族烴系化合物、芳香族 2化°物、虱化經等之_化烴、酯系化合物或酮系化合物 ”中對於%烯系樹脂可較好地使用脂環式煙等飽 和脂肪族烴系化合物、芳香族系化合物、齒化烴等有機溶 劑1於纖維素衍生物,其可溶於氯化煙、啊、醋、貌氧 基醇、苯、醇等單一或混合有機溶劑中。作為該等有機溶 劑之例’可列舉氯化煙或醋系化合物、酮系化合物等有機 溶劑。作為氯化烴,可較好地使用二氯甲炫、二氯乙院、 二氣丙烧等,作為酮系化合物有機溶劑,可較好地使用丙 :甲基乙基酮、甲基異丁基酮等。作為醋系化合物有機 冷劑’可較好地使用乙酸醋類(乙酸甲醋、乙酸乙醋、乙 酸丁,等)、乳酸δ旨類(乳酸f酷、乳酸丁3旨等)。除此以 、乙醇、甲醇、溶纖劑乙酸醋、卡必醇等亦可用作 早一或混合溶劑。膠片膜之膜材料之聚合物溶液係藉由成 、’驟而膜化。為了增大膠片膜之透光率、且減少勝片膜 -物,此時所使用之聚合物溶液較好的是吸光卢 0.05以下者。 又句 本:明者等人對抑制膠片膜之草酸透過量之方法進行努 九、、.α果發現使用上述膜材料並添加光穩定劑可非常 有效地抑制草酸透過量。因通常於膠片膜之膜材料中有滲 出之虞’故不添加光穩定劑’但藉由向膠片膜之膜材料中 適量添加光穩定劑可提昇耐光性,並且可大幅度地抑制膝 144856.doc -25* 201037456 片膜之草酸透過率。作為添加之光穩定劑, 由於滲出或揮發後於硬路遮罩上結晶化而產生曝=不會 類的化合物,尤其是若光穩定劑係於抑等常 ^之 之光穩定劑,則可抑制光穩定劑之滲出現象,:特::狀 是包含^,5,-四甲基_衍生物特別好的 是τΙΝυνΐΝ(註冊商摔 口勿。例如較好的 門知0(几巴精化股份有限公司 〇= The film film k is good, and the main film material is an organic polymer for optics. The term "mainly" means that the entire film material is 50% by weight or more. The term "optical" means a transmittance of, for example, a wavelength of 365 to 463 nm. It is 8〇% or more.纟 As an optical organic polymer that can be used for film films, it can be considered as cellulose acetate, cellulose acetate butyrate, cellulose diacetate, cellulose acetate propionate, Nitrocellulose, nitrocellulose, etc. 'other than this' can be exemplified: tetrafluoroethylene _ hexafluoropropylene copolymer 浚 tetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, poly 4 _ Pentene, polybutyl acrylate, polyvinyl acetate, polymethyl acrylate, I propylene, polymethyl methacrylate, polyvinyl butyl phthalate, polymethyl methacrylate, polyethylene glycol, polyamino carboxylic acid Ester, polyethylene formaldehyde, polyisobutylene, polyethylene, polybutylene, polybutadiene, polyvinyl chloride, polyacrylonitrile, polymethacrylonitrile polyisoprene, nylon 6' nylon 66, butadiene Styrene copolymer, gland-formaldehyde resin, epoxy resin, polychloroprene, polyphthalate, monoallyl, polystyrene, polyvinylidene chloride, polysulfone, phenol-make resin a fluoroalkyl group in which a part or all of a gas atom is replaced by a fluorine atom. 144856.doc -23 - 201037456趟, ring or chain type of fluorine, ρ 1 1 ρ ρ 曰 曰 曰 曰 曰 曰 曰 曰 ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ ρ And [Comparative: at least one resin selected from the group consisting of cellulose derivatives (especially cellulose acetate propionate, nitrocellulose) n-type propylene (tetra) tree wax and material type gluten-lipid. Further, in the above-mentioned organic polymer for optics, the ammonia permeability coefficient is small, and the practicality of the film such as optical properties and mechanical properties is easy to manufacture, and it is preferable that it is selected from the viewpoint of being used as a cover. + > 乍 四 树 树 树 四 - 六 六 六 六 六 六 六 六 六 六 六 六 六 六 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 An atom-substituted fluoroalkyl group, a cyclic or a chain fluoro-substituted resin in a group consisting of a pyrene-based or alicyclic hydrocarbon resin. Among the materials, in particular, a material having a small amount of oxalic acid permeation and an ammonia permeation system is exemplified by a cycloolefin resin, preferably a polymer or copolymer of a pentene (including a hydride). For example, Apel (registered trademark K Mitsui Chemicals Co., Ltd.), TQpas (registered trademark) (manufactured by p_piastics Co., Ltd.), Ze0nex (registered trademark) or zeonor (registered trademark) (manufactured by Zeon A Division), and Arton (registered) (trademark) (manufactured by JSR Co., Ltd.), etc., as a cycloolefin-based resin suitable for a film film, in particular, ZeZnor (si brand) (manufactured by Japan (10) Co., Ltd.) has a small amount of oxalic acid permeation and a small ammonia permeability coefficient. The material is best. Among the film materials of the film film, a polymer solution obtained by dissolving a cycloolefin resin or a cellulose derivative in an organic solvent is preferably used. In particular, 144856.doc -24- 201037456 Ο 〇 In terms of oxalic acid permeation amount or ammonia permeation coefficient, it is preferred to use a polymer solution obtained by dissolving a cycloaliphatic resin in an organic solvent. The usable organic solvent may, for example, be a hydrocarbon-based compound, an aromatic compound, or a sulfonated hydrocarbon, an ester compound or a ketone compound. An organic solvent such as a saturated aliphatic hydrocarbon compound such as alicyclic smoke, an aromatic compound or a toothed hydrocarbon is used in a cellulose derivative, which is soluble in chlorinated tobacco, ah, vinegar, morphol, benzene. In a single or mixed organic solvent such as an alcohol, an organic solvent such as a chlorinated tobacco or a vinegar-based compound or a ketone-based compound can be mentioned as an example of the organic solvent. As the chlorinated hydrocarbon, dichloromethane can be preferably used. As the organic solvent of the ketone compound, it can be preferably used as a ketone compound organic solvent, such as methyl ethyl ketone or methyl isobutyl ketone. The use of acetic acid vinegar (acetic acid methyl acetate, ethyl acetate, butyl acetate, etc.), lactic acid δ (lactic acid f cool, lactic acid butyl 3, etc.), in addition to ethanol, methanol, cellosolve acetate vinegar, Carbitol and the like can also be used as an early one or a mixed solvent. The polymer solution of the material is formed by "forming". In order to increase the light transmittance of the film film and reduce the film film, the polymer solution used at this time is preferably 0.05 or less. In addition, the method of suppressing the oxalic acid permeation of the film film is carried out by Ming et al., and it is found that the use of the above-mentioned film material and the addition of a light stabilizer can very effectively inhibit the amount of oxalic acid permeation. In the film material of the film film, there is oozing out of the film, so no light stabilizer is added, but light resistance can be improved by adding a light stabilizer to the film material of the film film, and the knee can be greatly suppressed 144856.doc -25 * 201037456 Oxalic acid permeability of film film. As an added light stabilizer, it will be exposed to crystals on the hard path mask after oozing or volatilization, resulting in a compound that is not exposed, especially if the light stabilizer is abnormal. ^ Light stabilizer, can inhibit the appearance of light stabilizers:: special:: is the inclusion of ^,5,-tetramethyl-derivatives is particularly good is τΙΝυνΐΝ (registrars wrestle not. For example better The door knows 0 Limited billion

Adekastab LA系列(ΑΜκα股份有限公司製' CHIMASS0RB(註冊商標)(汽巴精化股份有限公^ — -製造)等。就草酸透過量抑制效果而J, 穩定劑組合之光學=果::而特別好。又,關於與光 合環_樹二广;無特別限定,… 或者纖維素衍生物(尤其疋核胺系光穩定劑)、 〇 受阻胺李光纖維素)與光穩定劑(尤其是 女系先穩疋劑)時’草酸透過量抑制效果較大。又, ==草酸透過量抑制效果而抑制光穩定劑之耐光性效 二:狀之光穩定劑,係指利用孔徑為10 _下之過 失過渡^功能,則可適當選擇。 要不丧 添加作!2穩疋劑之耐光性效果’亦可與光穩定劑一併 :好的:’氧化劑之酚系、亞磷酸酯系。作為抗氧化劑, 疋不會由於參出或揮發後於遮罩上結晶化而產生曝 144856.doc -26· 201037456 光缺陷之類的化合物。此種化合物之中,作為酚系抗氧化 劑,例如較好的是Adekastab AO系列(ADEKA股份有限公 • 司製造)、IRGAN0X(註冊商標)(汽巴精化股份有限公司製 造)。作為亞磷酸酯系,例如較好的是IRGAF〇s(註冊商 • ’ 標)(汽巴精化股份有限公司製造)、Adekastab PEP系列 (ADEKA股份有限公司製造)。 光穩定劑可獲得提昇耐光性之效果,若以相對於光學用 0 有機高分子之總重量達到0.1重量%以上15重量%以下之方 式添加,則可抑制滲出,且可提昇耐光性,故較好,更好 的疋以相對於光學用有機高分子之總重量達到i重量%以 上10重Ϊ %以下之方式添加。為了獲得耐光性提昇效果, 且不發生苓出,進而更好的是以相對於光學用有機高分子 之總重量達到2重量%以上8重量%以下之方式添加。又, 光疋齊I之g里為上述範圍,則不會發生渗出,且可獲 得草透過i抑制效果,進而可使溶液之吸光度為〇 以 Q 下’故較好。 抗氧化劑藉由與光穩定劑之相乘效果而較單獨使用光穩 疋劑更能獲得耐光性提昇效果,因此較好的是以相對於光 ' 學用有機高分子之總重量達到0.1重量%以上10重量。/。以下 之方式添加,更好的是以相對於光學用有機高分子之總重 • 量達到叫重量%以上5重量%以下之方式添加。為了加強 ' 相乘效果,使溶液之吸光度為0.05以下及不發生滲出,進 而更好的是以相對於光學用有機高分子之總重量達到0.1 重罝%以上3重量%以下之方式添加。 144856.doc •27- 201037456 於片膜之製作中’使用將光學用有機高分子溶解 膜=而成之聚合物溶液…為了進-步提昇膠片 成〜’而使用於上述聚合物溶液中添加光穩定劑而 =:、或者使用添加有光穩定劑及抗氧化劑之溶液。 系有機溶劑,可列舉脂環式烴等飽和脂肪族烴 ’、δ 、芳香族系化合物、鹵化烴等。 〇 於膜之製造方法’可藉由製作聚合物溶液、繼而 膠:膜物溶液後去除聚合物溶液中之有機溶劑而形成 又,於膠片膜之膜材料之聚合物溶 穩定劑微細且均勻地分散於已成膜之J = 情形時,ί透!之障礙因此於使用該溶液製作勝片膜之 二複诱、先則之直接混入聚合物中之方法相比’可不使 線透過率下降而提高添加量。進而,於膠片膜之膜材料 之聚合物溶液中添加光穩定劑 , 穩定劑之滲出或1物之析ά η 亦可抑制光 ❹ 辑定…出’因此於膠片膜用溶液中添加 係有效之方法。尤其是使用於常溫下為液狀 2片氧化劑易於製作均句之溶液,且於成膜之 出。又帛:易於均句化’因此可抑制滲出或異物之析 出 又’萬一渗出時,亦由於炎y 少,難以產生成為曝光障礙之異物。,而結晶化之情形較 比均之光穩定劑與不均勻地分散之光穩定劑相 響。减小對膠片膜之穿刺強度等力學物性所造成之影 144856.doc -28- 201037456 進而,包含該等均勻地分散之光穩定劑之膠片膜可提昇 耐光性,可抑制作為該耐光性之指標之聚合物劣化。由於 膠片膜於曝光時直接自曝光光源(超高壓水銀燈)接收光, 故膠片膜之膜材料聚合物會由於該曝光光源之紫外線而劣 化。由於該劣化,膠片膜之膜材料聚合物變得具有吸水 性。以耐濕性試驗觀㈣等現象,包含均句地分散之光穩 Ο Ο 定劑之膝片膜相對於不包含均句地分散之光穩定劑之膠^ 膜’可提昇耐濕性。 该等之中’製成膠片膜時之穿刺強度達到015 Ν/_以 上之材料因製膜性及機械物性優異,故就製造"膜之容 易性之觀點而言較好。於利用該強度較低之材料成膜之情 形時,不得不使膠片膜之膜厚變厚,其結果,曝光時之平 均透光率下降。 妙月膜之穿刺強度 ’、不膜之強度之指標,值. :二膠片膜之穿刺強度為0_075 Ν/μη1以上之強度,則藉 謹慎地進行操作’可用作膠片,但膠片膜較好的 〜上之強度。穿刺強Γ 更是具有°·2。 … 之強度冑刺強度之測定可藉由如下方式進 仃.將膠片膜固定於開孔有直 杬為6 mm之孔之保持器具 上並測疋利用前端為1 之丰B ^ ^ 穿刺棒以o.5mm/min之速球狀且粗細度為2麵之 速度進行穿刺時之力之最大值 (N)。所測定之膠片較好的是 取大值Adekastab LA series ("CHIMASS0RB (registered trademark) manufactured by ΑΜκα Co., Ltd. (Ciba Specialty Chemicals Co., Ltd.). In terms of oxalic acid permeation suppression effect, J, stabilizer combination optical = fruit: special Good. Also, about the photosynthetic ring _ tree two wide; no special restrictions, ... or cellulose derivatives (especially 疋 nucleoside light stabilizer), 〇 hindered amine Liguang cellulose) and light stabilizers (especially female When the stabilizer is first stabilized, the effect of oxalic acid permeation is greater. Further, the == oxalic acid permeation suppressing effect suppresses the light fastness of the light stabilizer. 2: The light stabilizer of the shape refers to the function of the transition of the aperture of 10 _, which can be appropriately selected. It is not to be added! 2 The light fastening effect of the stabilizer can also be combined with the light stabilizer: Good: 'The phenolic and phosphite esters of the oxidant. As an antioxidant, ruthenium does not cause 144856.doc -26· 201037456 photodefects due to crystallization on the mask after being introduced or volatilized. Among such compounds, as the phenolic antioxidant, for example, Adekastab AO series (manufactured by ADEKA Co., Ltd.) and IRGAN0X (registered trademark) (manufactured by Ciba Specialty Chemicals Co., Ltd.) are preferable. As the phosphite system, for example, IRGAF〇s (registered trademark) (manufactured by Ciba Specialty Chemicals Co., Ltd.) and Adekastab PEP series (manufactured by ADEKA Co., Ltd.) are preferred. When the light stabilizer is added to improve the light resistance, and it is added in an amount of 0.1% by weight or more and 15% by weight or less based on the total weight of the 0 organic polymer for optical use, bleeding can be suppressed and light resistance can be improved. Preferably, the ruthenium is added so as to be i% by weight or more and 10% by weight or less based on the total weight of the optical organic polymer. In order to obtain the light-improving effect, it is not added, and it is more preferably added in an amount of 2% by weight or more and 8% by weight or less based on the total weight of the optical organic polymer. Further, in the case where the girth of the optical enthalpy I is in the above range, bleeding does not occur, and the effect of suppressing the permeation of the grass can be obtained, and the absorbance of the solution can be made 〇 to be lower than Q. The antioxidant is more effective in light resistance improvement by the synergistic effect with the light stabilizer than the light stabilizer alone, so it is preferably 0.1% by weight relative to the total weight of the organic polymer. Above 10 weight. /. The addition is preferably carried out in such a manner that the total weight of the organic polymer for optical use is 5% by weight or more and 5% by weight or less. In order to enhance the 'multiplication effect, the absorbance of the solution is 0.05 or less and the bleeding does not occur, and it is more preferable to add it to 0.1% by weight or more and 3% by weight or less based on the total weight of the optical organic polymer. 144856.doc •27- 201037456 In the production of film, 'use a polymer solution made of optical organic polymer dissolving film=...to add light to the above polymer solution for further step-up of film formation~' Stabilizer =:, or use a solution with a light stabilizer and an antioxidant added. Examples of the organic solvent include saturated aliphatic hydrocarbons such as alicyclic hydrocarbons, δ, aromatic compounds, and halogenated hydrocarbons. The method for producing a film can be formed by preparing a polymer solution, followed by a gel: removing the organic solvent in the polymer solution after the film solution, and the polymer solvent stabilizer of the film material of the film film is finely and uniformly When dispersing in the J = case of film formation, the obstacle of ί ! 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用Increase the amount added. Further, a light stabilizer is added to the polymer solution of the film material of the film film, and the bleed out of the stabilizer or the ά η of the first substance can also suppress the 辑 辑 ... 出 出 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此method. In particular, it is used in a liquid form at room temperature. Two oxidizing agents are easy to prepare a solution of a uniform sentence, and are formed into a film. Further, it is easy to be uniformized. Therefore, it is possible to suppress the occurrence of oozing or foreign matter. In the event of oozing, it is also difficult to produce foreign matter that is an obstacle to exposure due to less inflammation. However, the crystallization is more effective than the uniform light stabilizer and the unevenly dispersed light stabilizer. Reducing the mechanical properties such as the puncture strength of the film film 144856.doc -28- 201037456 Further, the film film containing the uniformly dispersed light stabilizer can improve the light resistance and suppress the light resistance as an index The polymer is degraded. Since the film film directly receives light from the exposure light source (ultra-high pressure mercury lamp) at the time of exposure, the film material polymer of the film film is deteriorated by the ultraviolet light of the exposure light source. Due to this deterioration, the film material polymer of the film film becomes water absorbing. In the case of the moisture resistance test (4) and the like, the knee film comprising the uniformly dispersed light stabilizer can improve the moisture resistance with respect to the film which does not contain the light stabilizer which is uniformly dispersed. Among these, the material having a puncture strength of 015 Å/Å or more is excellent in film formability and mechanical properties, and therefore it is preferable from the viewpoint of manufacturing the film. When the film having a low strength is used for film formation, the film thickness of the film film has to be made thick, and as a result, the average light transmittance at the time of exposure is lowered. The puncture strength of Miaoyue film, the index of the strength of the film. The value of the puncture strength of the film is 0_075 Ν/μη1 or more, and it can be used as a film carefully, but the film film is better. The strength of the ~. The puncture force is more than °·2. The strength of the spur strength can be measured by fixing the film film to a holder having a hole of 6 mm in diameter and measuring it with a B ^ ^ puncture rod with a front end of 1 o. The maximum value (N) of the force at the time of puncture at a speed of 5 mm/min and a thickness of 2 faces. The film measured is preferably a large value.

^ _ ; c、相對濕度為45%RH 下之㈣中放置24hm上後進行測定。 又,平均透光率係將無膜 、之狀態作為空白(透光率 144856.doc •29- 201037456 100%) ’並作為波長為350〜7〇〇 之平均透光率(%)來表 不,該值越低透光率越低,值越高透光率越高。平均透光 率於先前之膠片膜用途中必需為93%左右,較好的是必需 為94%以上。透光率可利用紫外.可見分光器(例如島津製 作所製造之UV-2450)來測定。 又,為了防止光學反射並提高平均透光率,可將包含折 料低於膜材#之材料之抗反射材料作為抗反射層而積層 於膠片膜之-面或兩面。作為抗反射材料,可較好地使用 環式或直鏈狀之氟取代氟烷基聚醚。抗反射層可於主膜上 藉由旋塗法而製成。該抗反射層之膜厚為1〇 nm以上5〇〇 以下’就提高抗反射效果之觀點而丨,特別好的是汕 nm以上180 nm以下。 作為框體之材質,可列舉鋁或其合金,例如杜拉鋁、或 者鐵或鐵系合金、例如不鏽鋼這―用於膠片之公知之材 料。該等之中,若考慮由大型化所引起之框體自重之增 加’則較好的是使用輕量且具有剛性者,例如較好的是‘ 或其合金。 作為用以將膠片膜接著於框體上之接著劑,可使用紫外 線硬化型接著劑、氟樹脂系接著劑等先前通常使用者。 又,作為用以將膠片安裝於遮罩上之黏著材,可使用公 知者。通+常’作為黏著材,可使用苯乙烯·乙烯.了稀_苯乙 稀系、笨^稀-乙稀·丙稀苯-乙婦系、烯煙系等熱炼黏著 材聚夕氧系黏著材,丙稀酸系黏著材,包含發泡膜等基 材之雙面黏著”。關於熱㈣著材,可藉由使用通常之 J44856.doc -30- 201037456 注射器等之擠出塗佈而配置於框體上。進而,亦可於擠出 塗佈後面施加熱、壓力_面利用如平面板之成型盤進 行壓製等。 加速試驗法係簡單地確認包含草酸鉻錯合物之成長性異 物之產生的方法’由於能夠以實際上有無產生成長性異物 來簡便地確認本發明之膠片與先前所使用之膠片之成長性 Ο^ _ ; c, relative humidity of 45% under the R (4) placed in 24 hm and then measured. Further, the average light transmittance is as a blank (light transmittance 144856.doc • 29 - 201037456 100%) as a blank film, and is expressed as an average light transmittance (%) having a wavelength of 350 to 7 Å. The lower the value, the lower the light transmittance, and the higher the value, the higher the light transmittance. The average light transmittance must be about 93% in the previous film film use, preferably 94% or more. The light transmittance can be measured by an ultraviolet visible spectroscope (for example, UV-2450 manufactured by Shimadzu Corporation). Further, in order to prevent optical reflection and to increase the average light transmittance, an antireflection material containing a material having a refractive material lower than that of the film # may be laminated as an antireflection layer on the surface or both sides of the film film. As the antireflection material, a cyclic or linear fluorine-substituted fluoroalkyl polyether can be preferably used. The antireflection layer can be formed by spin coating on the main film. The film thickness of the antireflection layer is 1 〇 nm or more and 5 Å or less. □ From the viewpoint of improving the antireflection effect, particularly preferably 汕 nm or more and 180 nm or less. The material of the frame may, for example, be aluminum or an alloy thereof, such as durium aluminum, or iron or an iron-based alloy, such as stainless steel, which is a well-known material for film. Among these, it is preferable to use lightweight and rigid if it is considered to increase the self-weight of the frame caused by the enlargement, and for example, it is preferably "or its alloy." As the adhesive for adhering the film film to the frame, a conventional user such as an ultraviolet curable adhesive or a fluororesin-based adhesive can be used. Further, as the adhesive for attaching the film to the mask, a known one can be used. Tong + Chang ' as a bonding material, can use styrene · ethylene. Dilute _ styrene, stupid - dilute - propylene benzene - gynecological, olefinic and other hot-adhesive bonding materials Adhesive, acrylic-based adhesive, including double-sided adhesion of a substrate such as a foamed film. For heat (4), it can be extruded by using a conventional J44856.doc -30-201037456 syringe or the like. It is disposed on the frame. Further, it is also possible to apply heat after the extrusion coating, press the surface with a forming plate such as a flat plate, etc. The accelerated test method simply confirms the growth foreign matter including the chromium oxalate complex. The method of generating 'supplied by the fact that the growth of the film of the present invention and the film used previously can be easily confirmed by the presence or absence of growth of foreign matter.

異物之產生的i ’因此可藉由該加速試驗法來實際證明本 發明之膠片之效果。 本發明之膠片可較好地用於包含如下步驟之液晶面 板之製造方法:將膠片經由積層於框體之下緣面之黏著材 層貼附於硬鉻遮罩上之步驟;通過該硬鉻遮罩對具有ιτ〇 電極並塗佈《光性綠而成之TFT液晶面板基板進行曝光 之步驟;對該感光性光阻進行顯影之步驟;以及利用包含 草酸之蝕刻液蝕刻該ITO電極之步驟。又’ 一般認為本發 明之膠片只要係具有ITO電極層並使用草酸作為IT〇蝕刻液 者,則亦可同樣地較好地用於TFT液晶面板以外之平板顯 示器用基板、例如電漿顯示器用基板以及有機EL (electroluminescence,電致發光)顯示器用基板。 於TFT液晶面板基板中’將ιτο(氧化銦錫)或211〇(氧化 鋅)作為透明且具有導電性之材料用於電極。於包含ΙΤ〇之 電極層之圖案化中亦使用光微影技術,但如上所述,近年 來係使用草酸作為ΙΤΟ之蝕刻液《因此,若長時間地使用 鉻遮罩,則TFT液晶面板基板之製造環境會因氛圍中之微 量之草酸而為可產生成長性異物之環境,但藉由使用本發 144856.doc 31 201037456 明之與TFT液晶面板製造用遮罩併用之膠片,可防止該成 長性異物之產生,並且可使成長性異物之產生延遲至使用 期間不產生之程度為止。 實施例 (草酸透過量之測定方法) 利用50°C之純水於1 hr内將形狀、大小與膠片(框架之外 尺寸,縱149 mmx橫113 mmx高4.2 mm,框架之寬度為2 mm)之框架之内尺寸相同的濾紙(N〇 4A,東洋濾紙股份 有限公司)清洗3次並使之乾燥。以完全覆蓋膠片之框架内 ◎ 之方式將該濾紙放入其中,並以保持氣密性之方式利用2 液混合型環氧系接著劑將該膠片固定於厚度為3 之玻璃 板(縱152 „^><橫152 mm)上。於常壓下,將該固定有膠片 之玻璃板與2 g草酸酐(和光純藥工業股份有限公司製造 併放入玻璃容器(容積為3·8 L)内’並於密閉狀態下,於 7〇°C處理72小時,使透過膠片膜之草酸吸附於濾紙上。 取出上述處理後之濾紙後,利用4〇χ:、5〇 mL之純水萃 取濾紙所吸附之草酸,並藉由離子層析法測定該水中之草 〇 酸量(mg)。將該草酸量除以膠片膜之面積(cm2)來作為於 7〇 C放置72小時後之草酸透過量(mg/cm2)。再者,附記測 疋中所使用之膜厚。又’假定勝片膜之草酸透過量與膜厚 · 成反比求出膜厚1 μηι換算之草酸透過量來作為將膠片膜 , 之膜厚設定為1 μιη時之草酸透過量。 . '向岔閉之玻璃容器中加入草酸酐、且無膠片膜之狀 · 怨下僅對附有接著劑之框架進行實驗之情形時的草酸量之 144856.doc -32- 201037456 測疋結果為1 x 1 〇’6 mg/cm2以下。 (氨透過係數之測定方法) . 氨透過係數之測定係根據JIS尺_7126第2部(等壓)之氣相 層析法(2006年)來進行測定。測定條件設定為25t:、 〇%RH,試驗面積設定為2〇 mm分,試驗時之大氣壓設定為 1大氣壓,載氣流量設定為30 ce/min,載氣之種類設定為 He。官柱係使用氨用管柱,管柱填充材設定為 0 900,笞柱長设疋為1 m,並使用鐵氟龍配管。透過度係進 行單位換算,並作為透過係數(單位:cm^m/cm2 sec.pa) 來表示。 (成長性異物產生之加速試驗法) 成長性異物產生之加速試驗法係將膠片貼附於低反射型 之空白遮罩(Clean Surface技術股份有限公司製造:型號為 ' CQL6012BU ’ 於縱 152.0 mmx 橫 152.0 mmx 厚 3·〇 mm 之一 面上形成有氧化鉻膜者)上,並與2 g之草酸酐(和光純藥工 〇 業股份有限公司製造)一併裝入密閉之玻璃容器(容積為3.8 L)内’於70°C處理3天。繼而,去除該膠片後’將該空白 遮罩與50 cc之純水一併放入密閉之玻璃容器中,保管24小 • 時。進而’將該空白遮罩放入添加有10 g之10%氨水溶液 之玻璃密閉容器内,於70。(:保管2小時(參照圖1)。 • 利用水對該空白遮罩之氧化鉻面之表面之由膠片所保護 • 的部分進行清洗’回收該清洗水後,於70°C使之乾燥。 又,於獲得經乾燥之殘留物之情形時,使用Speetruml〇() (PerkinElmer Japan股份有限公司製造),並利用ATR法 144856.doc -33- 201037456 (attenuated total reflectance method,減弱全反射法)測定 該殘留物之IR光譜(infrared spectrum,紅外線光譜),以是 否於 IR 光譜之 1640〜1670 cm-1、1360〜1390 cm'1、 1240〜1260 cm·1之3個部位全部觀測到峰值來確認包含草峻 鉻錯合物之成長性異物之產生。將包含草酸鉻錯合物之成 長性異物之一例之IR光譜示於圖2。 (紫外光照射方法) 使用超高壓水銀燈(Ushio電機股份有限公司製造)作為光 源’將光照射成直徑為11 cm左右之圓狀。以不使照射面 直接接觸任何物體之方式將膠片膜置於該圓内,並對膠片 膜照射紫外光。 膝片膜之照射量係將以下之值作為照射量(J/crn2):使用 紫外線照度計(0RC製作所股份有限公司製造)之光接收器 UV-SD35(測定波長區域為31〇 nm至385 nm)進行測定,將 所獲得之照度(mW/cm2)乘以照射時間(sec),並將所獲得之 照射量(mJ/cm2)除以1〇〇〇所得之值。 (光穩定劑之滲出實驗) 將移片(框架之外尺寸,縱149 mmx橫113 mmx高4.2 mm,框架之寬度為2 mm)貼附於經充分清洗之石英玻璃板 (厗度為3 mm,縱152 mmx橫152 mm)上,並以不使膜接觸 之方式將其放入密閉之玻璃容器(容積為3.8 L)中,加以密 閉後於70。(:加熱6天。利用顯微鏡觀察該膜,並任意地實 施聚光燈下及單色光下之目視檢查等,與處理前之膜面進 行比較’藉此判定有無異物。 144856.doc •34· 201037456 (耐濕性試驗) 於膠片(框架之外尺寸,縱149 mmx橫113 mmx高4·2 mm,框架之寬度為2 mm,無框架黏著材)之中央部使用 超问壓UV(ultraviolet ’紫外線)燈(ushi0電機股份有限公司 製造)作為光源,將光照射成直徑為丨丨cm左右之圓狀。準 備已照射該光達50000 j/cm2之膠片,將該等於恆溫恆濕器 中、在溫度為22。(:、相對濕度為45%之狀態下放置}小時The resulting i' of the foreign matter can thus actually demonstrate the effect of the film of the present invention by the accelerated test method. The film of the present invention can be preferably used in a method of manufacturing a liquid crystal panel comprising the steps of: attaching a film to a hard chrome mask via an adhesive layer laminated on a lower edge of the frame; passing the hard chrome a step of exposing a TFT liquid crystal panel substrate having an ιτ〇 electrode and coating a photochromic green; a step of developing the photosensitive photoresist; and a step of etching the ITO electrode using an etching solution containing oxalic acid . In addition, it is considered that the film of the present invention is preferably used for a flat panel display substrate other than a TFT liquid crystal panel, for example, a substrate for a plasma display, as long as it has an ITO electrode layer and uses oxalic acid as the IT etchant. And a substrate for an organic EL (electroluminescence) display. In the TFT liquid crystal panel substrate, ιτο (indium tin oxide) or 211 〇 (zinc oxide) was used as a transparent and electrically conductive material for the electrode. Photolithography has also been used in the patterning of electrode layers containing germanium. However, as described above, oxalic acid has been used as an etching solution for germanium in recent years. Therefore, if a chromium mask is used for a long time, the TFT liquid crystal panel substrate is used. The manufacturing environment is an environment in which a growing foreign matter can be generated due to a trace amount of oxalic acid in the atmosphere, but the growth can be prevented by using a film for use in a mask for manufacturing a TFT liquid crystal panel as disclosed in Japanese Patent Publication No. 144856.doc 31 201037456. The foreign matter is generated, and the growth of the growth foreign matter can be delayed until the extent of use is not produced. EXAMPLES (Method for Measuring Oxalic Acid Permeability) Shape, size and film were taken in 1 hr using pure water at 50 ° C (outer frame dimensions, 149 mm in length, 113 mm in width, 4.2 mm in height, and frame width: 2 mm) Filter paper of the same size (N〇4A, Toyo Filter Co., Ltd.) within the frame was washed 3 times and dried. The filter paper is placed therein in a manner that completely covers the frame of the film, and the film is fixed to a glass plate having a thickness of 3 by a two-liquid mixed epoxy-based adhesive in a manner that maintains airtightness (longitudinal 152 „ ^><Round 152 mm). Under normal pressure, the film-fixed glass plate and 2 g of oxalic anhydride (manufactured by Wako Pure Chemical Industries, Ltd. and placed in a glass container (volume of 3·8 L) In the sealed state, it is treated at 7 ° C for 72 hours, so that the oxalic acid passing through the film film is adsorbed on the filter paper. After the above-mentioned treated filter paper is taken out, it is extracted with 4 〇χ:, 5 〇 mL of pure water. The amount of oxalic acid adsorbed on the filter paper, and the amount of oxalic acid in the water (mg) was determined by ion chromatography. The amount of oxalic acid was divided by the area of the film film (cm2) as oxalic acid after being placed at 7 ° C for 72 hours. The amount of permeation (mg/cm2). In addition, the thickness of the film used in the sputum is measured. It is assumed that the amount of oxalic acid permeation in the film thickness is 1 μηι. The amount of oxalic acid permeation when the film thickness of the film film is set to 1 μm. Adding oxalic anhydride to a closed glass container and no film film. Resent the amount of oxalic acid in the case of experiment with a frame with an adhesive. 144856.doc -32- 201037456 The result is 1 x 1 〇 '6 mg/cm2 or less. (Method for measuring ammonia permeability coefficient) The measurement of the ammonia permeability coefficient is carried out according to the gas phase chromatography (2006) of the second part (equal pressure) of JIS _7126. Set to 25t:, 〇%RH, the test area is set to 2〇mm, the atmospheric pressure during the test is set to 1 atm, the carrier gas flow rate is set to 30 ce/min, and the carrier gas type is set to He. The official column is ammonia. With the column, the column packing material is set to 0 900, the column length is set to 1 m, and the Teflon tube is used. The unit is converted by the transmittance system and used as the transmission coefficient (unit: cm^m/cm2 sec. Pa) (accelerated test method for growth of foreign matter) The accelerated test method for growing foreign matter is attached to a low-reflection type blank mask (manufactured by Clean Surface Technology Co., Ltd.: model number 'CQL6012BU' In the vertical 152.0 mmx horizontal 152.0 mmx thick 3· On the one side of the mm, a chrome oxide film was formed on the surface, and it was placed in a closed glass container (with a volume of 3.8 L) together with 2 g of oxalic anhydride (manufactured by Wako Pure Chemical Industries, Ltd.). After treatment for 3 days, the film was removed, and the blank mask was placed in a closed glass container together with 50 cc of pure water, and stored for 24 hours. Further, the blank mask was placed in the addition. In a glass closed container with 10 g of 10% aqueous ammonia solution, at 70. (: Store for 2 hours (Refer to Figure 1). • Clean the part of the surface of the oxidized chrome surface of the blank mask that is protected by the film with water. After the cleaning water is recovered, it is dried at 70 °C. Further, in the case of obtaining a dried residue, Speetruml(R) (manufactured by PerkinElmer Japan Co., Ltd.) was used, and ATR method 144856.doc -33-201037456 (attenuated total reflectance method) was used for measurement. The IR spectrum (infrared spectrum) of the residue was confirmed by observing the peaks in all three parts of the IR spectrum of 1640 to 1670 cm-1, 1360 to 1390 cm'1, and 1240 to 1260 cm·1. The growth of a foreign matter containing a chrome-chrome complex is shown in Fig. 2. The IR spectrum of an example of a growth foreign matter containing a chromium oxalate complex is shown in Fig. 2. (Ultraviolet light irradiation method) Ultrahigh pressure mercury lamp (Ushio Motor Co., Ltd. limited) The company manufactures) as a light source' to illuminate light into a circular shape with a diameter of about 11 cm. The film film is placed in the circle without direct contact of the irradiated surface with any object, and the film film is illuminated. Ultraviolet light is emitted. The amount of exposure of the knee film is the following (J/crn2): The light receiver UV-SD35 (measured in the wavelength range of 31〇) using an ultraviolet illuminometer (manufactured by 0RC Manufacturing Co., Ltd.) The measurement is performed from nm to 385 nm, and the obtained illuminance (mW/cm2) is multiplied by the irradiation time (sec), and the obtained irradiation amount (mJ/cm2) is divided by the value obtained by 1 。. Stabilizer exudation test) Attach the transfer sheet (outside the frame size, 149 mm x 133 mm x height 4.2 mm, frame width 2 mm) to a fully cleaned quartz glass plate (length 3 mm, longitudinal) 152 mm x 152 mm), and placed in a closed glass container (volume 3.8 L) without being in contact with the film, sealed and sealed at 70. (: heating for 6 days. The film was observed with a microscope, And arbitrarily performing visual inspection under a spotlight and under monochromatic light, and comparing with the film surface before the treatment, thereby determining whether or not foreign matter is present. 144856.doc •34· 201037456 (moisture resistance test) on film (outside the frame) Dimensions, vertical 149 mmx width 113 mmx height 4·2 mm, frame width 2 mm, frameless In the center of the adhesive, a UV (ultraviolet) lamp (manufactured by ushi0 Electric Co., Ltd.) is used as a light source, and the light is irradiated into a circular shape having a diameter of about 丨丨cm. The light has been irradiated for 50,000 j. /cm2 film, which will be equal to the constant temperature and humidity device at a temperature of 22. (:, when the relative humidity is 45%)

並進行觀察,然後觀察於相同溫度下花2〇分鐘將相對濕度 增加至97%為止時之膜面皺褶。 (實施例1) 將1〇 g作為環烯烴聚合物之Zeonorl060R(日本Ze〇n&司 製造之Zeon〇r(註冊商標))加入90 g擰檬烯(和光純藥工業股 份有限公司製造)中,於室溫下攪拌4小時使之溶解,然後 於70 C攪拌4小時使之溶解。將該溶液滴加至矽晶圓上, 並於旋轉塗佈機上以3〇〇 rpm旋轉塗佈後,利用14〇〇c之加 熱板乾燥30分鐘,從而獲得膠月膜。於所獲得之膜上滴加 利用全氟二丁胺(Fluorinert FC-43住友3M(股)製造,商〇 名)將包含非晶氟樹脂之溶液即Cytop CTX-8〇9SP2(旭硝子 (股)製造,商品名)稀釋成固形物成分為2。/。者,並於旋轉 塗佈機上以300 rPm旋轉塗佈後,於120。(:使之乾燥,從而 獲得厚度為4 μιη之膠片膜。 將該膠片膜展開,將其貼附於上緣面塗佈有接著劑之鋁 製框體(外形,縱149 mmx橫113 mmx高4.2 mm,框寬為2 mm)上,切斷去除自框體伸出之不需要部分之膠片膜。古亥 I44856.doc -35- 201037456 膠片之於赃放置72小時後之草酸透過量為45χΐ〇5 mg/cm2«厚為4·〇 _,膜厚i _換算之草酸透過量為 1.8^10 mg/cm2。X,測定氨透過係數之結果為3」川9The observation was carried out, and then the film wrinkles at the same temperature were increased for 2 minutes to increase the relative humidity to 97%. (Example 1) 1 〇g of Zeonor 060R (Zeon 〇r (registered trademark) manufactured by ZeZn & Division of Japan) was added to 90 g of citric acid (manufactured by Wako Pure Chemical Industries Co., Ltd.). The mixture was stirred at room temperature for 4 hours to be dissolved, and then stirred at 70 C for 4 hours to dissolve. This solution was added dropwise to a crucible wafer, and spin-coated at 3 rpm on a spin coater, and then dried by a heating plate of 14 〇〇c for 30 minutes to obtain a gel film. A solution containing amorphous fluororesin, Cytop CTX-8〇9SP2 (Asahi Glass) was added dropwise to the obtained membrane using perfluorodibutylamine (Fluorinert FC-43 Sumitomo 3M Co., Ltd., trade name). Manufactured, trade name) diluted to a solid content of 2. /. Then, after spin coating at 300 rPm on a rotary coater, at 120. (: It is dried to obtain a film film having a thickness of 4 μm. The film film is unfolded and attached to an aluminum frame coated with an adhesive on the upper edge surface (outer shape, 149 mm×110 mm×height) 4.2 mm, frame width is 2 mm), cut off the film film that removes the unnecessary part from the frame. Gu Hai I44856.doc -35- 201037456 The film has a oxalic acid permeation of 45χΐ after 72 hours of storage. 〇5 mg/cm2«thickness is 4·〇_, and the membrane acid thickness i _ converted oxalic acid permeation amount is 1.8^10 mg/cm2. X, the result of measuring the ammonia permeability coefficient is 3" Chuan 9

Cm3,/C„^sec-Pa。該膠片膜之光線透過率係利用π 2450(島津製作所製造)測定波長為35〇〜·⑽下之透光率 之平均值,結果為94%。 對該膠片照射10_ J/cm2之紫外光,並測定平均透光 率’結果為94%。X,經照射紫外光之膠片之於呢放置 72小時後之草酸透過量為4_4x1〇-5 _2(膜厚為4 〇 〇 pm),膜厚1 μηι換算之草酸透過量為丨8χΐ〇_4叫/cm2。 繼而’制成長性異物產生之加速触法來確認有無產 生成長性異物,結果未獲得自空白遮罩所獲得之清洗水之 殘留物。 . (實施例2) 將ίο g作為環烯烴聚合物之Zeonorl060R(日本Ze〇n&司 製造之Zeonor(註冊商標))添加至9〇 g十氫化萘(片山製藥所 股份有限公司製造)中,於室溫下攪拌4小時使之溶解,然 後於70°C攪拌4小時使之溶解。將該溶液滴加至矽晶圓 上,於旋轉塗佈機上以3 〇〇 rpm旋轉塗佈後利用i 6〇。〇之 加熱板乾燥3 0分鐘’從而獲得膠片膜。於所獲得之膜上滴 加利用全氟三丁胺(Flu〇rinen FC43住友3M(股)製造,商 。。名)將包含非晶氟樹脂之溶液即Cytop CTX-809SP2(旭硝 子(股)製造’商品名)稀釋成固形物成分為2%者,於旋轉 塗佈機上以300 rpm旋轉塗佈後,於12(Tc使之乾燥,從而 144856.doc -36- 201037456 獲得厚度為4 μπι之膠片膜。 將該膠片膜展開,將其貼附於上緣面塗佈有接著劑之紹 製框體(外形’縱149 mmx橫in mmx高4.2 mm,框寬為2 • mm)上,且切斷去除自框體伸出之不需要部分之膠片膜。 該膠片之於70 C放置72小時後之草酸透過量為4 3χ1〇-5 mg/cm (膜厚為4.0 μηι),膜厚i μη1換算之草酸透過量為 1-7Χ10-4 mg/cm2。又,測定氨透過係數之結果為3 2χΐ〇 9 ❹ Cm3’/cm2-sec,Pa。該膠片膜之光線透過率係利用抓 2450(島津製作所製造)測定波長為35〇〜7〇〇 下之透光率 之平均值,結果為94%。 對忒膠片照射1〇〇〇〇 J/cm2之紫外光並測定平均透光 .率,結果為94%。又,經照射紫外光之膠片之於乃它放置 J寺後之草酸透過量為4·5χ1〇-5 mg/cm2(膜厚為4 〇 ㈣)’膜厚1 μπι換算之草酸透過量為丨8xl〇_4mg/cm2。 繼而,利用成長性異物產生之加速試驗法來確認有無產 〇 1成長性異物’結果未獲得自空白遮罩所獲得之清洗水之 殘留物。 (實施例3) 制:g作為J衣烯蛵聚合物之Zeonorl〇60R(日本Zeon公司 ’ Ze〇n〇r(5主冊商標))添加至90 g十氫化萘(Kishida化 子股伤有限公司製造)中,於室溫下㈣4小時使之溶解, • 、7Q C授拌4小時使之溶解。向該溶液中添加0_5 g之 :液狀之TINUV〗N292(汽巴精化),於室溫下攪 拌6小時使之、、& 之/合解。該溶液之吸光度為0.002,且該溶液為 144856.doc -37- 201037456 透明之溶液。將該溶液滴加至矽晶圓上,並使用旋轉塗佈 機以300 rpm進行旋轉塗佈後,利用16〇<t之加熱板乾燥 30分鐘,從而獲得膠片膜。於所獲得之膜上滴加利用全氟 三丁胺(Fluorinert FC-43住友3M(股)製造,商品名)將包 含非晶氟樹脂之溶液即Cyt〇p CTX_8〇9Sp2(旭硝子(股) 製造,商品名)稀釋成2%者,於旋轉塗佈機上以3〇〇 rpm旋 轉塗佈後’於12G°C使之乾燥,從而獲得厚度為6 _之膠 片膜。 將該膠片膜展開,將其貼附於上緣面塗佈有接著劑之鋁 製框體(外形,縱149 _橫113 mmx高4.2 _,框寬為2 mm)_L 切斷去除自框體伸出之不需要部分之膠片膜。 之於70C放置72小時後之草酸透過量為4 4χ1〇 該膠片 叫1) ’膜厚i μηι換算之草酸透過量為 又’測定氨透過係數之結果為30xl0-9 。該膠片膜之光線透過率係利用UV_ mg/cm2(膜厚為 6.0 2·6χ 10 5 mg/cm2。 •pm/cmLsec.Pa 245〇(島津製作所製造)測定波長為350〜700 nm下之透光率 之平均值,結果為94%。穿刺強度為n—,具有充分之強 度0 對6玄膠片照射10000 J/cm2之紫外光,並測定平均透光 率果為94%。又,經照射紫外光之膠片之於7〇t放置 72小時後之草酸透過量為4.3χ1〇-6 mg/cm2(膜厚為6.〇 μηι),膜厚!,換算之草酸透過量為25叫“2。 而牙J用成長性異物產生之加速試驗法來確認有無產 生成長性異物’結果未獲得自空白遮罩所獲得之清洗水之 144856.doc -38- 201037456 殘留物。 進行光穩定劑之滲出試驗方法,並利㈣微鏡觀察 膜面,但未發現異物。又,於聚光燈、單色光下進行目視 .觀察之結果,未發現加熱後之變化。又’平均透光率於加 • 熱珂為94·8%,加熱後為94.7%,未發現變化。 進而,目視觀察耐濕性試驗巾膜面巾央部之皺褶之產生 狀況,結果於相對濕度為45%至97%之間未發現敏摺之產 生。 〇 (實施例4 ) 將ίο g作為環埽烴聚合物之Ze〇n〇rl〇峨⑶本公司 製把之Zeonor(s主冊商標》添加至9〇 g十氫化萘(幻化丨心化 . 學股份有限公司製造)中’於室溫下授拌4小時使之溶解, 然後於7G°C擾拌4小時使之溶解。向該溶液中添加0.5 g之 .25°C下為液狀之TINUVIN292(汽巴精化)及〇·〇5 g之 irganoxlOlO(汽巴精化),於室溫下攪拌6小時使之溶解。 Ο 该浴液之吸光度為〇.002,且該溶液為透明之溶液。將該 溶液滴加至矽晶圓上,並使用旋轉塗佈機以300卬m進行 方疋轉塗佈後,利用i 60°C之加熱板乾燥3 〇分鐘,從而獲得 膠片膜。於所獲得之膜上滴加利用全氟三丁胺 FC-43住友3M(股)製造,商品名)將包含非晶氟樹脂之溶 . 液即Cyt0P CTX-809SP2(旭硝子(股)製造,商品名)稀釋成 , 2 /()者,於紅轉塗佈機上以3〇〇 rpm旋轉塗佈後,於丨2〇。〇使 之乾燥’從而獲得厚度為6 μιη之膠片膜。 將戎膠片膜展開,將其貼附於上緣面塗佈有接著劑之鋁 144856.doc 39· 201037456 製框體(外形,縱丨49 mmx橫113 mmx高4.2 mm,框寬為2 mm)上’且切斷去除自框體伸出之不需要部分之膠片膜。 6玄勝片之於70。(:放置72小時後之草酸透過量為4.5χΙΟ·5 mg/cm2(膜厚為6〇 μιη),膜厚1 μπι換算之草酸透過量為 2.7ΧΗΓ5 mg/cm2。又,測定氨透過係數之結果為3.〇χ1〇_9 cm μιη/cni ’sec’Pa。該膠片膜之光線透過率係利用υν- 245〇(島津製作所製造)測定波長為350〜700 nm下之透光率 之平均值,結果為94°/。。穿刺強度為〇 25 Ν/μιη,具有充分 之強度。 對該膠片照射10000 J/cm2之紫外光,並測定平均透光 率、、°果為94%。又,經照射紫外光之膠片之於70°c放置 72小時後之草酸透過量為4 3χ1〇·6 mg/cm2(膜厚為6 〇 μΠ1)’膜厚1㈣換算之草酸透過量為2,6xl(T5mg/em2。 繼而’利用成長性異物產生之加速試驗法來確認有無產 生成長性異物,結果未獲得自空白料所獲得之清洗水之 殘留物。 進行光穩疋劑之渗出實驗,並利用顯微鏡觀察膜 {未發現異物°於聚光燈、單色光下進行目視觀察之 結果’亦未發現加熱後之變化。平均透光率於加熱前為 94·7% ’加熱後為94 7% ’幾乎未發現變化。 進而’目㈣察耐難試驗巾膜面巾央部之皺褶之產生 、。果於相對濕度為45%至97%之間未發現皺相 生。 (實施例5) 144856.doc •40- 201037456 將5 g硝化纖維素(Bargerac…公司製造)溶解於% g乳酸 乙酯中’向該溶液中添加〇_25 g之25°C下為液狀之 TINUVIN292(汽巴精化),並於室溫下攪拌6小時使之溶 - 解。利用氮將該聚合物溶液加壓至0.01 MPa,並利用旋塗 : 法將通過口徑為0.1 μπι之膜濾器而過濾所得之溶液滴加於 石夕晶圓上,使用旋轉塗佈機以150 rpni進行旋轉塗佈後, 利用60。(:之加熱板乾燥30分鐘,從而獲得膠片膜。於所獲 ❹ 得之膜上滴加利用全氟三丁胺(Fluorinert FC-43住友 3M(股)製造,商品名)將包含非晶形氟樹脂之溶液即cyt〇p CTX-809SP2(旭硝子(股)製造,商品名)稀釋成2%者,於旋 轉塗佈機上以300 rpm旋轉塗佈後,於12〇°c使之乾燥,從 而獲得厚度為6 μιη之膠片膜。 將5亥膝片膜展開,將其貼附於上緣面塗佈有接著劑之紹 製框體(外形,縱149 mmx橫113 mmx高4.2 mm,框寬為2 mm)上’且切斷去除自框體伸出之不需要部分之膠片膜。 Q 該膠片之於70°C放置72小時後之草酸透過量為3 5xl〇-3 mg/cm2(膜厚為6.0 μηι),膜厚1 μιη換算之草酸透過量為 2.1 X 1〇'2 mg/cm2 ° (比較例1) 將包含非晶氟樹脂之溶液即Cyt〇p(旭硝子股份有限公司 • 製造,商品名)CTX_8〇9SP2滴加於矽晶圓上,於旋轉塗佈 - 機上以300 rPm旋轉塗佈後’於70。(:乾燥10分鐘,然後於 180C乾燥40分鐘,從而獲得厚度為4 μιη之膠片膜。 將該膠片膜展開,將其貼附於上緣面塗佈有接著劑之鋁 144856.doc -41 201037456 製框體(外形,縱149軸x橫113 mmx高4.2 mm,框寬為2 mm)上,且切斷去除自框體伸出之不需要部分之膠片膜。 該膠片之於70°C放置72小時後之草酸透過量為5xl〇-4 mg/cm2(膜厚為4〇 μηι),膜厚i叫換算之草酸透過量為 2_〇xlO_3 mg/em2。又,測定氨透過係數之結果為9 ΐχΐ〇9 cm3^m/cm、ec,Pa。該膠片膜之光線透過率係利用UV- 245〇(島津製作所製造)測定波長為350〜700 nm下之透光率 之平均值’結果為94%。 繼而利用成長性異物產生之加速試驗法來確認有無產 生成長性異物,結果於自空白遮罩所獲得之清洗水之殘留 物中,在IR 光譜之 164〇 〜167〇 cm·1、1360 〜1390 cm·1、 1240〜1260 cm·1之3個部位全部觀測到峰值,從而確認包含 草酸鉻錯合物之成長性異物之產生。 (參考例2) 將1〇 g作為環烯烴聚合物之Zeonex48〇R(日本Zeon公司 製造之Zeonex(註冊商標添加至9〇 g檸檬烯(和光純藥工 業股份有限公司製造)中’於室溫下攪拌4小時使之溶解, 然後於70 C攪拌4小時使之溶解。向該溶液 中添加0.5 g之 25 C下為粉末狀之Adekastab LA_62p(ADEKA股份有限公 司製造)’於室溫下攪拌6小時使之溶解。該溶液之吸光度 為0.04 ’且該溶液為透明之溶液。將該溶液滴加至矽晶圓 上’使用旋轉塗佈機以1〇〇 rprn旋轉塗佈後,利用i6〇°c之 加熱板乾燥45分鐘’從而獲得膠片臈。於所獲得之膜上滴 加利用全氟二丁胺(Flu〇rinert FC-43住友3M(股)製造,商 】44856.doc -42- 201037456 品名)將包含非晶氟樹脂之溶液即Cytop CTX-809SP2(旭;ε肖 子(股)製造,商品名)稀釋成固形物成分為2%者,於旋轉 塗佈機上以300 rpm旋轉塗佈後,於i2(TC使之乾燥,從而 • 獲得厚度為10.0 μηι之膠片膜。 • 將該膠片膜展開,將其貼附於上緣面塗佈有接著劑之鋁 製框體(外形’縱149 mmx橫113 mmx高4.2 mm,框寬為2 mm)上’且切斷去除自框體伸出之不需要部分之膠片膜。 ❹ 可確認膜略微白化,平均透光率為85%。又,進行光穩定 劑之滲出實驗,利用顯微鏡觀察膜面,結果加熱後於膜表 面產生微量之加熱前未發現之異物。 (比較例3) 將5 g硝化纖維素(取代度約為2 3)溶解於95 §乳酸乙醋 中。利用氮將該聚合物溶液加壓至〇.〇丨MPa,並利用旋塗 ' 法將通過口徑為0·1 μιη之膜濾器而過濾所得之溶液滴加於 矽晶圓上’使用旋轉塗佈機以丨50 rprn旋轉塗佈後,利用 0 6〇C之加熱板乾燥30分鐘,從而獲得膠片膜。於所獲得之 膜上滴加利用全氟三丁胺(Fluorinert FC-43住友3M(股)製 L ’商品名)將包含非晶氟樹脂之溶液即Cyt〇p CTX-809SP2(旭硝子(股)製造’商品名)稀釋成固形物成分為2〇/〇 者’於旋轉塗佈機上以3〇〇 rpm旋轉塗佈後,於12〇°c使之 • 乾燥,從而獲得厚度為6 μηι之膠片膜。 • 將該膠片膜展開,將其貼附於上緣面塗佈有接著劑之鋁 製框體(外形’縱149 mmx橫113 mmx高4.2 mm,框寬為2 mm)上’且切斷去除自框體伸出之不需要部分之膠片膜。 144856.doc • 43· 201037456 口玄膠片之於70 C放置72小時後之草酸透過量為5 5χ1〇_3 mg/cm2(膜厚為6·〇 μιη),膜厚i _換算之草酸透過量為 3.3χ 10 2 mg/cm2。 本申。s案係基於2009年ό月29曰申請之曰本專利申請案 (日本專利特願2〇〇9_154176號)及2⑼8年。月21曰申請之曰 本專利申晴案(日本專利特願2008-298 125號)者,該等申請 案之内容作為參照併入本案中。 產業上之可利用性 本發明之膠片可較好地用於TFT液晶面板之製造領域 中。 【圖式簡單說明】 圖1係成長性異物產生之加速試驗法之說明圖;及 圖2係包含草酸鉻錯合物之成長性異物之IR光譜之一 例。 【主要元件符號說明】 1 安裝有膠片之空白遮罩 2 卸下膠片之空白遮罩 3 密閉容器 4 草酸酐 5 純水 6 丨〇%氨水溶液 144856.doc • 44 -Cm3, /C„^sec-Pa. The light transmittance of the film film was measured by π 2450 (manufactured by Shimadzu Corporation), and the average value of the light transmittance at a wavelength of 35 〇 to (10) was 94%. The film was irradiated with 10_J/cm2 of ultraviolet light, and the average transmittance was determined to be 94%. X, the oxalic acid permeation after being placed for 72 hours on the film irradiated with ultraviolet light was 4_4x1〇-5 _2 (film thickness) For 4 〇〇 pm), the oxalic acid permeation amount of the film thickness of 1 μηι is 丨8χΐ〇_4 called/cm2. Then, the accelerated contact method for producing a long foreign body is used to confirm the presence or absence of growth foreign matter, and the result is not obtained from the blank cover. Residue of the washing water obtained by the hood. (Example 2) Zeonor 060R (Zeonor (registered trademark) manufactured by Zee N & Japan) of ίο g as a cycloolefin polymer was added to 9 〇g of decalin ( The product was prepared by stirring at room temperature for 4 hours, and then dissolving by stirring at 70 ° C for 4 hours. The solution was added dropwise to a crucible wafer on a spin coater. After spin coating at 3 rpm, use i 6 〇. Heated plate drying 3 0 The film was obtained in order to obtain a film film. The solution containing amorphous fluororesin, that is, Cytop CTX-, was added dropwise to the obtained film by using perfluorotributylamine (Flu〇rinen FC43, manufactured by Sumitomo 3M Co., Ltd.). 809SP2 (Asahi Glass Co., Ltd. manufacture 'product name) diluted to a solid content of 2%, spin-coated at 300 rpm on a spin coater, and then dried at 12 (Tc 144856.doc -36- 201037456 Obtain a film film with a thickness of 4 μm. The film film is unfolded and attached to the frame with the adhesive coated on the upper edge surface (the shape 'longitudinal 149 mmx horizontal in mmx height 4.2 mm, frame width is 2 • mm), and cut off the film film that removes the unnecessary part from the frame. The oxalic acid permeation of the film after 72 hours at 70 C is 4 3χ1〇-5 mg/cm (the film thickness is 4.0 μηι), the oxalic acid permeation amount in terms of film thickness i μη1 is 1-7Χ10-4 mg/cm2. Further, the result of measuring the ammonia permeability coefficient is 3 2χΐ〇9 ❹ Cm3'/cm2-sec, Pa. The light transmittance is measured by the average value of the light transmittance at a wavelength of 35 〇 to 7 利用 using a grip 2450 (manufactured by Shimadzu Corporation). The result was 94%. The 忒 film was irradiated with 1 〇〇〇〇J/cm2 of ultraviolet light and the average light transmittance was measured, and the result was 94%. Further, after the film irradiated with ultraviolet light, it was placed after the J temple. The oxalic acid permeate amount is 4·5χ1〇-5 mg/cm2 (the film thickness is 4 〇(4)). The membrane acid thickness of 1 μπι conversion is 丨8xl〇_4mg/cm2. Then, the accelerated test method for growing foreign matter was used to confirm the presence or absence of growth 〇 1 growth foreign matter. As a result, the residue of the washing water obtained from the blank mask was not obtained. (Example 3) Preparation: g as Zeonor 〇 60R of J olefin oxime polymer (Zei 〇n〇r (5 main volume trademark) of Zeon Corporation of Japan) was added to 90 g of decalin (Kishida sinensis In the company's manufacture, it was dissolved at room temperature for four hours, and it was dissolved in 7Q C for 4 hours. To the solution was added 0_5 g of liquid: TINUV〗N292 (Ciba Refinery), and stirred at room temperature for 6 hours to make /, & The solution had an absorbance of 0.002 and the solution was a 144856.doc -37-201037456 clear solution. This solution was dropped onto a ruthenium wafer, and spin-coated at 300 rpm using a spin coater, and then dried using a 16 〇<t hot plate for 30 minutes to obtain a film film. On the obtained film, a solution containing amorphous fluororesin, that is, Cyt〇p CTX_8〇9Sp2 (manufactured by Asahi Glass Co., Ltd.) was added dropwise using perfluorotributylamine (Fluorinert FC-43 Sumitomo 3M (manufactured by the company). The product name was diluted to 2%, and after being spin-coated at 3 rpm on a spin coater, it was dried at 12 G ° C to obtain a film film having a thickness of 6 Å. The film film is unfolded and attached to an aluminum frame coated with an adhesive on the upper edge surface (outer shape, longitudinal 149 _ horizontal 113 mm x height 4.2 _, frame width 2 mm) _L cutting and removing the self-frame An undesired portion of the film film is stretched out. The amount of oxalic acid permeation after 72 hours of standing at 70 C was 4 4 χ 1 〇. The film was called 1) The amount of oxalic acid permeation in terms of film thickness i μηι was again measured as 30 x 10-9. The light transmittance of the film film is measured by UV_mg/cm2 (film thickness: 6.0 2·6 χ 10 5 mg/cm 2 • pm/cm Lsec. Pa 245 制造 (manufactured by Shimadzu Corporation) at a wavelength of 350 to 700 nm. The average of the light rate was 94%. The puncture strength was n-, with sufficient intensity 0 to illuminate 10000 J/cm2 of UV light, and the average light transmittance was 94%. The ultraviolet light film was placed at 7 〇t for 72 hours, and the oxalic acid permeation amount was 4.3χ1〇-6 mg/cm2 (the film thickness was 6.〇μηι), and the film thickness was changed. The converted oxalic acid permeation amount was 25. The tooth J uses an accelerated test method for growing foreign matter to confirm the presence or absence of a growth foreign matter. The result is that the residue of the washing water obtained from the blank mask is not obtained. 144856.doc -38- 201037456 Residue of the light stabilizer is performed. The test method was used to observe the film surface by micro-mirror, but no foreign matter was found. Moreover, it was visually observed under the spotlight and monochromatic light. The result of the observation was not found after heating, and the 'average transmittance was added to the heat.珂 was 94.8%, and after heating, it was 94.7%, no change was found. Further, visual observation of moisture resistance The occurrence of wrinkles in the central portion of the test towel was observed, and as a result, no occurrence of sensitization was observed between 45% and 97% relative humidity. 〇 (Example 4) ίο g was used as a ruthenium hydrocarbon polymer Ze 〇 N〇rl〇峨(3) The company's Zeonor (s main volume trademark) was added to 9〇g decalin (manufactured by Vision Huaxin. Co., Ltd.) for 4 hours at room temperature. Dissolve, and then dissolve it at 7G ° C for 4 hours to dissolve it. Add 0.5 g of liquid solution TINUVIN 292 (Ciba refined) at 25 ° C and ir 〇 g 5 g of irganoxlOlO (Ciba Refining), stirring at room temperature for 6 hours to dissolve. Ο The absorbance of the bath is 〇.002, and the solution is a transparent solution. The solution is added dropwise to the ruthenium wafer and spin coated. After the machine was applied at 300 卬m, it was dried by a hot plate at 60 ° C for 3 〇 minutes to obtain a film film. Perfluorotributylamine FC-43 Sumitomo 3M was added dropwise to the obtained film. (manufacturing, product name) will contain the solubility of amorphous fluororesin. Liquid is Cyt0P CTX-809SP2 (made by Asahi Glass Co., Ltd., trade name) Cheng, 2 / (), after spin coating at 3 rpm on a red transfer coater, 丨 2 〇. 〇 dry it to obtain a film film with a thickness of 6 μη. Attached to the upper edge of the aluminum coated 144856.doc 39· 201037456 frame (shape, medial 49 mm x width 113 mm x height 4.2 mm, frame width 2 mm) on and cut off The film film of the unnecessary portion protruding from the frame body is removed. 6 Xuansheng film is at 70. (: The oxalic acid permeation amount after leaving for 72 hours was 4.5 χΙΟ·5 mg/cm 2 (the film thickness was 6 〇 μιη), and the oxalic acid permeation amount of the film thickness of 1 μπι was 2.7 ΧΗΓ 5 mg/cm 2 . Further, the ammonia permeability coefficient was measured. The result was 3.〇χ1〇_9 cm μιη/cni 'sec'Pa. The light transmittance of the film film was measured by υν-245〇 (manufactured by Shimadzu Corporation) to determine the average light transmittance at a wavelength of 350 to 700 nm. The value was 94° /. The puncture strength was 〇25 Ν/μιη, which had sufficient strength. The film was irradiated with 10000 J/cm 2 of ultraviolet light, and the average light transmittance was measured, and the fruit was 94%. The oxalic acid permeation amount of the film irradiated with ultraviolet light at 70 ° C for 72 hours is 4 3 χ 1 〇 · 6 mg / cm 2 (film thickness is 6 〇 μ Π 1) 'film thickness 1 (four) conversion of oxalic acid permeation is 2, 6xl (T5mg/em2. Then, using the accelerated test method for growing foreign matter to confirm the presence or absence of growth foreign matter, the residue of the washing water obtained from the blank material was not obtained. Observing the film with a microscope {no foreign matter was observed. Visual observation under spotlight and monochromatic light As a result, the change after heating was not observed. The average light transmittance was 94.7% before heating and 94 7% after heating. [There was almost no change. Further, the purpose of (4) inspection of the endurance test towel film towel Wrinkles were produced, and no wrinkles were found between the relative humidity of 45% and 97%. (Example 5) 144856.doc • 40- 201037456 5 g of nitrocellulose (manufactured by Bargerac...) was dissolved in % In g-ethyl lactate, 'Turkey _25 g was added to the solution as liquid TINUVIN 292 (Ciba refined) at 25 ° C, and stirred at room temperature for 6 hours to dissolve - decompose. The polymer solution was pressurized to 0.01 MPa, and the solution obtained by filtration through a membrane filter having a diameter of 0.1 μm was applied dropwise to a stone wafer by spin coating: spin coating at 150 rpni using a spin coater. After that, the film was dried by using a hot plate of 60 (:: 30 minutes) to obtain a film film. The film obtained by using the perfluorotributylamine (Fluorinert FC-43 Sumitomo 3M (share), trade name) was added dropwise to the obtained film. A solution containing an amorphous fluororesin, namely cyt〇p CTX-809SP2 (Asahi Glass Co., Ltd.), The product name was diluted to 2%, spin-coated at 300 rpm on a spin coater, and dried at 12 ° C to obtain a film film having a thickness of 6 μm. It is attached to the frame (appearance, longitudinal 149 mmx, width 113 mmx height 4.2 mm, frame width 2 mm) coated with the adhesive agent on the upper edge surface and is cut off and removed from the frame. Part of the film film. Q The film has a oxalic acid permeation of 3 5xl〇-3 mg/cm2 (the film thickness is 6.0 μηι) after being placed at 70 ° C for 72 hours, and the oxalic acid permeation of the film thickness of 1 μηη is 2.1 X 1〇'2 mg. /cm2 ° (Comparative Example 1) A solution containing an amorphous fluororesin, Cyt〇p (manufactured by Asahi Glass Co., Ltd., trade name) CTX_8〇9SP2, was dropped on a tantalum wafer, and was applied on a spin coating machine. 300 rPm after spin coating 'at 70'. (: drying for 10 minutes, and then drying at 180 C for 40 minutes to obtain a film film having a thickness of 4 μm. The film film was unrolled and attached to the upper edge of the surface coated with an aluminum 144856.doc -41 201037456 The frame (shape, longitudinal 149 axis x width 113 mmx height 4.2 mm, frame width 2 mm) is cut and the film film which removes the unnecessary portion from the frame is cut off. The film is placed at 70 ° C. After 72 hours, the oxalic acid permeation amount was 5xl〇-4 mg/cm2 (the film thickness was 4〇μηι), and the membrane thickness i was converted into oxalic acid permeation amount of 2_〇xlO_3 mg/em2. Further, the result of measuring the ammonia permeability coefficient It is 9 ΐχΐ〇9 cm3^m/cm, ec, Pa. The light transmittance of the film film is measured by UV-245 〇 (manufactured by Shimadzu Corporation) to determine the average value of light transmittance at a wavelength of 350 to 700 nm. It is 94%. Then, an accelerated test method for growing foreign matter is used to confirm the presence or absence of growth foreign matter, and as a result, in the residue of the washing water obtained from the blank mask, the IR spectrum is 164 〇 to 167 〇 cm·1. All the 3, 1360 to 1390 cm·1, 1240 to 1260 cm·1 three peaks were observed to confirm the inclusion Production of a foreign body of a chromium oxalate complex (Reference Example 2) Zeonex 48〇R (a Zeonex manufactured by Zeon Corporation, Japan) was added as a cycloolefin polymer (registered trademark was added to 9〇g limonene (Wako Pure Chemical Co., Ltd.) Industrial Co., Ltd.) was stirred at room temperature for 4 hours to dissolve it, and then dissolved at 70 C for 4 hours to dissolve it. 0.5 g of Adekastab LA_62p (ADEKA shares) was added to the solution at 25 C powder. Co., Ltd.) 'Dissolved at room temperature for 6 hours to dissolve. The absorbance of the solution was 0.04 ' and the solution was a clear solution. The solution was added dropwise to the crucible wafer. 'Use a spin coater to 1 〇 After 旋转rprn was spin-coated, it was dried by a hot plate of i6〇°c for 45 minutes to obtain a film crucible. Perfluorodibutylamine (Flu〇rinert FC-43 Sumitomo 3M (share) was added dropwise to the obtained film. Manufacture, business] 44856.doc -42- 201037456 Product name) Diluted into a solid content of 2% of the solution containing amorphous fluororesin, namely Cytop CTX-809SP2 (asahi, ε 肖子(股), trade name) Spin coating at 300 rpm on a spin coater , i2 (TC makes it dry, and thus • obtains a film film with a thickness of 10.0 μηι.) • Spreads the film film and attaches it to an aluminum frame coated with an adhesive on the upper edge (shape 'Version 149 The mmx is 113 mm wide and 4.2 mm high, and the frame width is 2 mm). The film is removed from the unnecessary portion of the frame. ❹ It was confirmed that the film was slightly whitened and the average light transmittance was 85%. Further, an experiment of oozing out the light stabilizer was carried out, and the film surface was observed by a microscope. As a result, a small amount of foreign matter which was not found before heating was generated on the surface of the film. (Comparative Example 3) 5 g of nitrocellulose (degree of substitution of about 2 3) was dissolved in 95 § lactic acid ethyl acetate. The polymer solution was pressurized to 〇.〇丨MPa with nitrogen, and the solution obtained by filtration through a membrane filter having a diameter of 0.1 μm was applied dropwise to the ruthenium wafer by spin coating 'using spin coating After the machine was spin-coated at 丨50 rprn, it was dried by a hot plate of 0 6 〇C for 30 minutes to obtain a film film. A solution containing amorphous fluororesin, Cyt〇p CTX-809SP2 (Asahi Glass Co., Ltd.) was added to the obtained film by using perfluorotributylamine (Fluorinert FC-43 Sumitomo 3M Co., Ltd. L' trade name). The manufactured 'commodity name' is diluted to a solid content of 2 〇/〇. After being spin-coated at 3 rpm on a spin coater, it is dried at 12 ° C to obtain a thickness of 6 μηι. Film film. • The film film is unfolded and attached to an aluminum frame coated with an adhesive on the upper edge (the shape 'longitudinal 149 mm x width 113 mm x height 4.2 mm, frame width 2 mm) and cut off An undesired film film that protrudes from the frame. 144856.doc • 43· 201037456 The oxalic acid permeation amount of 5 χ1〇_3 mg/cm2 (film thickness is 6·〇μιη) after 72 hours of storage at 70 C, film thickness i _ converted oxalic acid permeation It is 3.3 χ 10 2 mg/cm2. This application. The s case is based on the application for the patent application (Japanese Patent Priority 2〇〇9_154176) and 2 (9) 8 years. In the case of the application for the application of the patent application, the contents of the applications are incorporated herein by reference. Industrial Applicability The film of the present invention can be preferably used in the field of manufacturing TFT liquid crystal panels. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an explanatory diagram of an accelerated test method for producing a foreign body of growth; and Fig. 2 is an example of an IR spectrum of a growth foreign matter containing a chromium oxalate complex. [Main component symbol description] 1 Blank mask with film attached 2 Blank mask for removing film 3 Closed container 4 Oxalic acid 5 Pure water 6 丨〇% ammonia solution 144856.doc • 44 -

Claims (1)

201037456 七、申請專利範圍: 1. 一種膠片膜,其於7(rc放置72小時後之膜厚i μιη換算之 草酸透過置為丨〇xlo-3 mg/cm2以下,且主要之膜材料為 光學用有機高分子。 2- —種膠片膜,其於25〇c下之氨透過係數為8 〇χΐ〇·9 cm3々m/cm2.s.Pa以下,且主要之膜材料為光學用有機高 分子。 ❹ ❹ 3·如凊求項2之膠片膜,其中於7〇。〇放置72小時後之膜厚1 μΐΏ換算之草酸透過量為1.ΟΧΙΟ-3 mg/cm2以下。 4. 種勝片膜’其主要膜材料為光學用有機高分子,且於 ㈣材料中包含相對於該光學料機高分子之總重量為 〇.1重3:°/。以上15重量%以下之光穩定劑。 5. 如請求項4之膠Η睹 / ^ 、’、中上述光學用有機高分子為環 烯烴糸樹脂或纖維素衍生物。 6. 如凊求項4或5之膠只腊 光穩定劑。/、、、中上述光穩定劑為受阻胺系 7. 一種膠片,其句杠.Λ Α 求項⑴中任=·於該框體之上緣面側之如請 之黏著材f 膠片膜、以及於餘體之下緣面側 8. 如請求項7之膠片, 9· 一種膠片膜之製^與^液晶面板製造用光翠併用。 與光穩定劑溶使光于用有機尚分子 驟、以及自該聚、二劑中而製作聚合物溶液之步 10.如請求項9之”:液中去除有機溶劑之步驟。 ,之製造方法,其中上述有機溶劑為 I44856.doc 201037456 脂環式烴、氣化烴、酯系化合物或酮系化合物。 11. 如請求項9或10之膠月膜之製造方法,其中上述光穩定 劑為受阻胺系光穩定劑。 12. 如請求項11之膠片膜之製造方法,其中上述受阻胺系光 穩定劑於25°C為液狀。 13. 如晴求項9至12中任一項之膠片膜之製造方法,其中上 述光學用有機高分子為環烯烴樹脂或纖維素衍生物。 14. 一種光罩,其係於透明基板之表面具有將包含鉻之遮光 性膜圖案化而成之轉印圖案,且於該透明基板之具有轉 印圖案的一側之面上安裝有膠片之液晶顯示裝置製造用 者, 3亥透明基板具有1 〇〇〇 cm2以上之面積, 該膠片之膠片膜之膜厚為0.5 μηι以上8 μιη以下,且於 溫度為7(TC之氛圍中放置72小時後的該膠片膜之膜厚i μηι換算之草酸透過量為1〇xl〇·3 mg/cm2以下。 15. 如請求項14之光罩,其中上述遮光性膜之轉印圖案係藉 由濺鍍法而於上述透明基板上成膜,並具有利用蝕刻進 行圖案化而成之圖案剖面。 16. —種圖案轉印方法,其係於溫度為15t以上之氛圍中, 對如請求項14或15之光罩照射包含丨線〜匕線之波長範圍之 曝光光束,藉此將上述轉印圖案轉印至被轉印體上。 17. —種TFT液晶面板之製造方法,其包括:準備如請求項 14或15之光罩之步驟;通過該光罩對具有IT〇電極並塗 佈感光性光阻而成之TFT液晶面板基板進行曝光之步 144856.doc 201037456 驟,·對該感光性光阻進行顯影之步驟;以及利用包含草 酸之蝕刻液蝕刻該ITO電極之步驟。 18. —種膠片,其係與TFT液晶面板製造用遮罩併用者,該 膠片包括框體、積層於該框體之下緣面側之黏著材層、 / 以及於該框體之上緣面側展開之膠片膜,該膠片膜之膜 厚為〇,5 μιη以上8 μηι以下,且該膠片膜之於7〇£>c放置 小時後之草酸透過量為lxl0-4mg/cm2以下。 . 〇 19·如請求項18之膠片,其中上述膠片膜之面積為则一 以上、30000 cm2以下。 20. 如請求項18或19之膠片,其中上述膠片膜係由包含環烯 烴系樹脂之膜材料所形成。 21. 如請求項18至20中任一項之膠片,其中上述膠片膜係由 包含環烯烴系樹脂及相對於該環烯烴系樹脂之總重量為 • 0.1重量。/。以上15重量%以下之光穩定劑的膜材料或者 包含環烯烴系樹脂、相對於該環烯烴系樹脂之總重量為 〇 〇.1重量%以上15重量%以下之光穩定劑及〇 1重量%以上 10重量%以下之抗氧化劑的膜材料所形成。 22_如請求項21之膠片,其中上述光穩定劑於常溫下為液 -狀。 23. 如請求項18至22中任一項之膠片,其中於上述膠片膜之 . 一面或兩面上積層有包含環式或直鏈狀氟取代氟烷基聚 . 醚之抗反射層。 24. —種TFT液晶面板之製造方法,其包括:將如請求項以 至23中任一項之膠片㈣積層於上述框體之下緣面側的 144856.doc 201037456 黏著材層而貼附於硬鉻遮罩上之步驟;通過該硬絡遮罩 對具有ITO電極並塗佈感光性光阻而成之TFT液晶面板基 扳進行曝光之步驟;對該感光性光阻進行顯影之步驟; 以及利用包含草酸之蝕刻液蝕刻該IT0電極之步驟。 25. γ種光罩,其係於透明基板之表面上具有將包含鉻之遮 光性膜圖案化而成之轉㈣案、且於該透縣板之具有 轉印圖案的—側之面上安裝有膠片之液晶顯示裝置製造 用者, 。亥透明基板具有1000 cm2以上之面積, 該膠片之膠片膜之膜厚為〇5 _以上8 _以下並 且, 於溫度為70。(:之氛圍中放置72小時後之該膠片膜之草 酸透過篁為lxl〇-4 mg/cm2以下。 26. 如請求項25之光罩,其中上述遮光性膜之轉印圖案係藉 由賤鍍法而於上述透明基板上成膜,並具有利用餘刻進 行圖案化而成之圖案剖面。 27. 如請求項25或26之光罩’其中上述轉印圖案具有線寬為 3 0 μιη以上500 μιη以下之遮光圖案。 28. -種光罩之製造方法,其係包括如下步驟者:於透明基 板上藉由濺鍍法而形成包含鉻之遮光性膜’並於該遮= 性膜上塗佈光阻獏,對該光阻膜描繪所需之轉=圖案 後,進行顯影而獲得光阻圖案,將該光阻圖案作為遮罩 而蝕刻該遮光性膜,藉此於該遮光性膜上將該轉印圖率 圖案化,將該光阻圖案剝離後,於該透明基板之該經= 144856.doc 201037456 案化之遮光性膜側安裝勝 片,上述膠片之膠片膜之膜厚 為 〇·5 μηι 以上 8 π „ , 79 ,於溫度為70°C之氛圍中放置 72小時後之該膠片膜 <早®夂透過ϊ為lxl〇-4 mg/cm2以 下0 29. Ο 30. 一種圖案轉印方法,其係 升你於/JBL度為15 C以上之氛圍中, 對如請求項25至27中任一項之# | , 項之光罩、或者由如請求項28 ^光罩之製造方法所製造的光罩照射包含i線〜g線之波長 辄圍之曝光光束,藉此將上述轉印圖案轉印至被轉印體 -種TFT液晶面板之製造方法,其包括:準備經由積層 於上述框體之下緣面側之黏著材層而貼附有如請求項18 至23中任一項之膠片的硬鉻遮罩之步驟;通過該硬鉻遮 罩對具有ιτο電極並塗佈感光性光阻而成之TFT液晶面板 基板進行曝光之步驟;對該感光性光阻進行顯影之步 驟;以及利用包含草酸之蝕刻液蝕刻該IT〇電極之步 〇 144856.doc201037456 VII. Patent application scope: 1. A film film which is set to 丨〇xlo-3 mg/cm2 or less after 7 hours of rc placement for 72 hours, and the main film material is optical. Using organic polymer. 2- Film film, the ammonia permeability coefficient at 25〇c is below 8 〇χΐ〇·9 cm3々m/cm2.s.Pa, and the main film material is optical organic high. Molecular ❹ · 3· For example, the film film of the item 2, which is 7 〇. The film thickness after 1 hour of 〇 is 1-3 mg/cm 2 or less. The film film 'the main film material is an optical organic polymer, and the (4) material contains a light stabilizer of 〇.1 weight of 3:°/. or more and 15% by weight or less relative to the total weight of the optical material polymer. 5. The plastic polymer used in the above-mentioned item 4 is a cycloolefin oxime resin or a cellulose derivative. 6. If the rubber of the item 4 or 5 is only a wax stabilizer The above light stabilizer is a hindered amine system. 7. A film, the sentence bar. Λ Α In the item (1), == On the upper edge side of the frame, the adhesive film f film film, and the lower edge side of the remaining body 8. As in the film of claim 7, 9 · A film film manufacturing ^ and ^ LCD panel manufacturing light And the use of a light stabilizer to dissolve the organic solvent, and to prepare a polymer solution from the polymerization agent and the second agent. 10. The step of removing the organic solvent in the liquid. The method for producing the above-mentioned organic solvent is I44856.doc 201037456 alicyclic hydrocarbon, vaporized hydrocarbon, ester compound or ketone compound. 11. The method for producing a rubber film according to claim 9 or 10, wherein the light stable The agent is a hindered amine light stabilizer. The method for producing a film film according to claim 11, wherein the hindered amine light stabilizer is liquid at 25 ° C. 13. If any of the items 9 to 12 is clear The method for producing a film film according to the invention, wherein the optical organic polymer is a cycloolefin resin or a cellulose derivative. 14. A photomask having a light-shielding film containing chromium patterned on a surface of a transparent substrate Transfer pattern, and on the transparent substrate A manufacturer of a liquid crystal display device having a film attached to one side of a transfer pattern, the transparent substrate having a thickness of 1 〇〇〇cm 2 or more, and a film thickness of the film film of the film being 0.5 μηι or more and 8 μmη or less And the oxalic acid permeation amount of the film thickness i μηι of the film film after being left for 72 hours in an atmosphere of TC is 1〇xl〇·3 mg/cm2 or less. 15. The mask of claim 14 The transfer pattern of the light-shielding film is formed on the transparent substrate by a sputtering method, and has a pattern cross-section formed by etching. 16. A pattern transfer method in which an exposure beam having a wavelength range of a 丨 line to a 匕 line is irradiated to a reticle of claim 14 or 15 in an atmosphere having a temperature of 15 t or more, thereby transferring the above-mentioned transfer The pattern is transferred onto the transferred body. 17. A method of manufacturing a TFT liquid crystal panel, comprising: a step of preparing a photomask according to claim 14 or 15; and a TFT liquid crystal panel substrate having an IT germanium electrode and applying a photosensitive photoresist by the photomask The step of performing exposure is 144856.doc 201037456, the step of developing the photosensitive photoresist; and the step of etching the ITO electrode with an etching solution containing oxalic acid. 18. A film for use with a mask for manufacturing a TFT liquid crystal panel, the film comprising a frame, an adhesive layer laminated on a side of a lower edge of the frame, and/or a top surface of the frame The film film of the side film is 〇, 5 μm or more and 8 μηι or less, and the film has an oxalic acid permeation amount of 1×10 −4 mg/cm 2 or less after being left for 7 hours. The film of claim 18, wherein the area of the film film is one or more and 30,000 cm2 or less. 20. The film of claim 18 or 19, wherein the film film is formed of a film material comprising a cycloolefin resin. The film according to any one of claims 18 to 20, wherein the film film is made of a cyclic olefin-based resin and a total weight of the substrate is 0.1 weight. /. The film material of the light stabilizer of 15% by weight or less or the light stabilizer containing the cycloolefin resin and the total weight of the cycloolefin resin is 0.1% by weight or more and 15% by weight or less and 〇1% by weight The film material of the above 10% by weight or less of the antioxidant is formed. 22. The film of claim 21, wherein the light stabilizer is liquid-like at normal temperature. The film according to any one of claims 18 to 22, wherein an antireflection layer comprising a cyclic or linear fluorine-substituted fluoroalkyl polyether is laminated on one or both sides of the film film. A method of manufacturing a TFT liquid crystal panel, comprising: laminating a film (4) according to any one of claims 23 to 144856.doc 201037456 on the lower edge side of the frame to be attached to the hard layer a step of chrome masking; a step of exposing a TFT liquid crystal panel substrate having an ITO electrode and applying a photosensitive photoresist through the hard mask; a step of developing the photosensitive photoresist; and utilizing The step of etching the IT0 electrode by an etchant containing oxalic acid. 25. A gamma ray mask having a transfer (4) pattern formed by patterning a opaque film containing chromium on a surface of a transparent substrate, and mounting on a side surface of the permeable plate having a transfer pattern A manufacturer of liquid crystal display devices with film, . The transparent substrate has an area of 1000 cm 2 or more, and the film thickness of the film film of the film is 〇5 _ or more and 8 Å or less, and the temperature is 70. The oxalic acid of the film film after being left for 72 hours in an atmosphere is lxl 〇 -4 mg/cm 2 or less. 26. The reticle of claim 25, wherein the transfer pattern of the opaque film is by 贱A pattern is formed on the transparent substrate by a plating method, and has a pattern cross section formed by patterning. 27. The photomask of claim 25 or 26 wherein the transfer pattern has a line width of 30 μm or more a light-shielding pattern of 500 μm or less. 28. A method of manufacturing a photomask comprising the steps of: forming a light-shielding film containing chromium on a transparent substrate by sputtering; and on the mask film After coating the photoresist, the desired pattern of the pattern is formed on the photoresist film, and then developed to obtain a photoresist pattern, and the light-shielding film is etched by using the photoresist pattern as a mask. The transfer pattern is patterned, and after the photoresist pattern is peeled off, the film is mounted on the light-shielding film side of the transparent substrate, and the film thickness of the film film is 〇·5 μηι above 8 π „ , 79 , at a temperature of 70 The film film after being left for 72 hours in an atmosphere of °C is <early® 夂 through ϊ is lxl〇-4 mg/cm2 or less 0 29. Ο 30. A pattern transfer method, which is raised to /JBL degree In an atmosphere of 15 C or higher, the reticle of the reticle of the item of any of claims 25 to 27, or the reticle manufactured by the method of manufacturing the glaze of the claim 28 includes i line 〜g a method of manufacturing a transfer light beam having a wavelength of a line, thereby transferring the transfer pattern to a transfer-type TFT liquid crystal panel, comprising: preparing an adhesive material laminated on a lower surface side of the frame body And a step of attaching a hard chrome mask of the film of any one of claims 18 to 23; exposing the TFT liquid crystal panel substrate having the ιτο electrode and applying the photosensitive photoresist through the hard chrome mask a step of developing the photosensitive photoresist; and etching the IT germanium electrode with an etching solution containing oxalic acid 144856.doc
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI716697B (en) * 2017-06-23 2021-01-21 日商信越化學工業股份有限公司 Protective film for photoetching, protective film component, photomask and exposure method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011095586A (en) * 2009-10-30 2011-05-12 Shin-Etsu Chemical Co Ltd Pellicle and method of manufacturing the same
JP5586387B2 (en) * 2010-09-15 2014-09-10 旭化成イーマテリアルズ株式会社 Pellicle
JP5279862B2 (en) * 2011-03-31 2013-09-04 信越化学工業株式会社 Pellicle membrane, method for producing the same, and pellicle on which the membrane is stretched
US10437142B2 (en) 2015-05-08 2019-10-08 Nippon Light Metal Company, Ltd. Support frame for pellicle
JP6607574B2 (en) * 2016-08-24 2019-11-20 信越化学工業株式会社 Pellicle frame and pellicle

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08101497A (en) * 1994-09-30 1996-04-16 Shin Etsu Chem Co Ltd Pellicle
JPH11295879A (en) * 1998-04-14 1999-10-29 Jsr Corp Thin film for pellicle and pellicle
CA2333324A1 (en) * 1998-06-22 1999-12-29 Ciba Specialty Chemicals Holding Inc. Trisaryl-1,3,5-triazine ultraviolet light absorbers containing hindered phenols
JP2001154340A (en) * 1999-11-25 2001-06-08 Asahi Glass Co Ltd Pellicle
TW200530682A (en) * 2004-03-10 2005-09-16 Chi Lin Technology Co Ltd Diffusing device
US20090004077A1 (en) * 2006-02-13 2009-01-01 Frisa Larry E Apparatus and Method for Preventing Haze Growth on a Surface of a Substrate
JP2007225720A (en) * 2006-02-21 2007-09-06 Toppan Printing Co Ltd Pellicle
JP5221502B2 (en) * 2009-12-07 2013-06-26 麒麟麦酒株式会社 Plastic container for beverage and beverage product using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI716697B (en) * 2017-06-23 2021-01-21 日商信越化學工業股份有限公司 Protective film for photoetching, protective film component, photomask and exposure method

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