TW201034795A - System and method for polishing glass - Google Patents

System and method for polishing glass Download PDF

Info

Publication number
TW201034795A
TW201034795A TW099106410A TW99106410A TW201034795A TW 201034795 A TW201034795 A TW 201034795A TW 099106410 A TW099106410 A TW 099106410A TW 99106410 A TW99106410 A TW 99106410A TW 201034795 A TW201034795 A TW 201034795A
Authority
TW
Taiwan
Prior art keywords
glass
turntable
grinding
fixed
unit
Prior art date
Application number
TW099106410A
Other languages
Chinese (zh)
Other versions
TWI511842B (en
Inventor
Won-Jae Moon
Sang-Oeb Na
Hyung-Young Oh
Yang-Han Kim
Young-Sik Kim
Kil-Ho Kim
Heui-Joon Park
Chang-Hee Lee
Original Assignee
Lg Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Chemical Ltd filed Critical Lg Chemical Ltd
Publication of TW201034795A publication Critical patent/TW201034795A/en
Application granted granted Critical
Publication of TWI511842B publication Critical patent/TWI511842B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • B24B7/245Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass discontinuous
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/12Lapping plates for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

A system for polishing a glass includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit capable of contacting with the glass and being passively rotated due to the rotation of the glass, and a moving unit for moving the upper unit in a horizontal and/or vertical direction. The upper unit includes a fixed platter fixed to a spindle of the upper unit, a polishing platter installed movably with respect to the fixed platter, and a pressing member interposed between the fixed platter and the polishing platter so as to keep the uniformity of pressure applied from the polishing platter to the glass.

Description

201034795 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種玻璃研磨系統及方法,尤指一種適 用於研磨液晶顯示器用玻璃表面之系統及方法。 本案係主張2009年3月6曰向韓國提申之韓國專利申靖 案號10-2009-0019292之優先權,其整體内容併於此以做= 【先前技術】 一般而言,應用於液晶顯示器之玻璃(或玻璃片)維持 有特定程度之平坦度係非常重要的,如此才能精確地顯示 影像。因此,應移除透過浮室所形成之浮法玻璃表面上之 細微波紋。 玻璃研磨製程可被分類為「奥斯卡(〇scar)」型研磨及 「同軸(inline)」型研磨,「奥斯卡(〇scar)」型研磨係對玻 璃-個接-個地各別進行研磨,而「同軸(inUne)」型研磨 係連續對-連串的玻璃進行研磨。又,玻璃研磨製程亦可 被分類為「單側研磨」及「雙側研磨」,「單側研磨」係僅 對玻璃之一表面進行研磨,而「雙側研磨」係對玻璃之兩表 面進行研磨。 於習知玻璃研磨裝置中,當裝有研磨墊之研磨板(或頂 板)於水平方向移動,且其上置有玻璃之研磨⑽底板Μ 轉時’可藉由隨意散落至研磨板上之研磨漿料而對玻璃進 行研磨。 201034795 然而,於習知研磨製程中,破璃與研磨板間會形成特 定壓力。基於此理由’研較料將無法充分地渗透研磨板 中之溝槽,故不易穩定且均勻地供應研磨漿料。此外,於 習知研磨裝置中,研磨襞料可能於供應時落於研磨板外: 因而難以均勻地研磨玻璃。 同時’習知玻璃研磨裝置會因頂板或研磨板本身的重 量而對玻璃施予-作用力’故無法對整個研磨板區域的玻 璃施予均勾的作用力。因此’最終研磨後之玻璃於矩形玻 璃之每一處會產生不平整的平坦度,因而導致許多瑕疵產 。尤其,隨著液晶顯示器尺寸增加而增加研磨板尺寸(例 如直徑約l,〇〇〇mm)時,此問題會更加嚴重。詳細地說’,於 習知研磨裝置中,與玻璃接觸的研磨板實質上是無法於玻 璃之每-區域施予i句勻的作用力,且作用力會隨著遠離轴 (研磨板係安裝在軸上)而減弱,故無法均勻地進行研磨。 此外,當研磨板尺寸較大時,維修或更換設於習知研 磨裝置研磨板之研磨墊會變得更加困難,其需要更多裝 備,且會耗費更多時間。 【發明内容】 本發明係為了解決先前技術問題而設計完成的,本發 明目的如下所述。 第一 ’本發明目的係在於提供一種玻璃研磨系統及方 法’其係將上單元分為固定轉盤及可相對於固定轉盤移動 或浮起之研磨轉盤(包括令間轉盤及分離轉盤),且設置複數 201034795 個施壓構件(如氣壓彈簧)於固定轉盤與研磨轉盤間,接著, '研磨作業中’於上單元數個位置處均勻施加壓力於破 璃且孔壓彈黃會吸收研磨過程造成的震動,俾可提高玻 璃的平坦度。 第…本發明目的係在於提供一種玻璃研磨系統及方 ”係藉由通過上單元(設有研磨墊且包括固定轉盤、中 1轉盤及刀離轉盤)之複數個研磨製料供應道,將研磨浆料 ❹直接供應至玻璃表面,俾可改善研磨聚料供應作業之效率。 第—本發明目的係在於提供一種玻璃研磨系統及方 法其ίτ、藉由吸附力,將具有待貼附之研磨墊的分離轉盤 維持於中間轉盤,以便於研磨墊之維修或更換。 為達上述目的,本發明提供-種玻璃研磨系統,其包 括下單元,其可轉動置於固定位置之玻璃;一上單元, 可與玻璃接觸且可因玻璃之旋轉而被動式地轉動;以及一 移動單元,係用於使上單元於水平及/或垂直方向移動其 中上單元包括:一固定轉盤,係固定於該上單元之一軸; 〇 Τ研磨轉盤,係設置為可相對於固定轉盤移動;以及-施 壓構件,係插置於固定轉盤與研磨轉盤之間,以維持研磨 轉盤施加於該玻璃之壓力均勻度。 較佳為,該施壓構件包括:複數個氣壓彈簧,係設於 固定轉盤與研磨轉盤之間。 k佳為,該些氣壓彈簧包括:至少一氣壓彈簧組,係 以該輛為基準而同心設置。 車又佳為,每一氣壓彈簧包括:具有一空氣入口之箱狀 7 201034795 物’以吸入供應穿過固定轉盤之空氣。 較佳為’相同氣壓彈簧組中之每一氣壓彈簧維持相同 壓力。 ° 較佳為,施加於每一氣壓彈簧之壓力係可調控的。 較佳為’本發明之玻璃研磨系統更包括:複數個導向 構件,係設於固定轉盤與中間轉盤之間,以引導中間轉盤 相對於固定轉盤之移動。 車X仏為,每一導向構件包括:一導向轴,係穿過固定 轉盤而設於中間轉盤;以及一導向制動件,係設於導向軸 之另一端。 較佳為,研磨轉盤包括:一中間轉盤,係面對固定轉 盤;以及一分離轉盤,係可分離式地設於中間轉盤,而真 空吸盤係用於將分離轉盤藉由真空而固定於中間轉盤。 較佳為,該真空吸盤包括:複數個壓制道,係穿過固 定轉盤及中間轉盤’以及―真空單S ’係於接觸分離轉盤 之中間轉盤表面上形成真空,以與壓制道連通。 較佳為,提供至少兩個以軸為基準而同心設置之真空 吸盤。 “李父佳為’真空單元包括:一體成型之階狀表面,其係 藉由削減中間轉盤之下表面而形成。 較it為,垓真空單元包括:複數個味丨n八型真空槽,係 形成於中間轉盤下表面’俾使其尺寸係由壓制道處增加。 較佳為,該玻璃研磨系統更可包括:一安全接合構件, 係將分離轉盤可卸式地設於該中間轉盤。 ,係設於 係用於鎖201034795 VI. Description of the Invention: [Technical Field] The present invention relates to a glass polishing system and method, and more particularly to a system and method suitable for polishing a glass surface for a liquid crystal display. This case claims the priority of Korean Patent Application No. 10-2009-0019292, which was submitted to Korea on March 6th, 2009. The overall content is hereby made. [Prior Art] Generally, it is applied to liquid crystal displays. It is important that the glass (or glass) maintain a certain degree of flatness so that the image can be accurately displayed. Therefore, the fine ripples on the surface of the float glass formed by the floating chamber should be removed. The glass grinding process can be classified into "Oscar" type grinding and "inline" type grinding, and "Oscar" type grinding system grinds glass-to-ground ones separately. The "inUne" type of grinding system continuously grinds a series of glass. In addition, the glass polishing process can also be classified into "one-side grinding" and "double-side grinding". "One-side grinding" is to polish only one surface of the glass, and "double-side grinding" is performed on both surfaces of the glass. Grinding. In the conventional glass grinding device, when the polishing plate (or the top plate) equipped with the polishing pad is moved in the horizontal direction, and the glass is ground (10), the bottom plate is rotated, and the grinding can be performed by randomly scattering onto the polishing plate. The glass is ground with a slurry. 201034795 However, in the conventional grinding process, a specific pressure is formed between the glass and the grinding plate. For this reason, it is difficult to stably and uniformly supply the polishing slurry because the grooves in the polishing plate are not sufficiently penetrated. Further, in the conventional grinding apparatus, the abrasive material may fall outside the polishing plate at the time of supply: thus it is difficult to uniformly polish the glass. At the same time, the conventional glass polishing apparatus exerts a force on the glass due to the weight of the top plate or the polishing plate itself, so that it is impossible to apply a uniform force to the glass in the entire polishing plate area. Therefore, the final polished glass produces uneven flatness at each of the rectangular glasses, resulting in many defects. In particular, this problem is exacerbated as the size of the liquid crystal display increases and the size of the abrasive plate is increased (e.g., about 1 mm, 〇〇〇 mm). In detail, in the conventional polishing apparatus, the polishing plate in contact with the glass is substantially incapable of imparting a uniform force to each of the regions of the glass, and the force is moved away from the shaft (grinding plate mounting) It is weakened on the shaft and cannot be uniformly polished. In addition, when the size of the grinding plate is large, it becomes more difficult to repair or replace the polishing pad provided on the polishing plate of the conventional grinding device, which requires more equipment and takes more time. SUMMARY OF THE INVENTION The present invention has been devised in order to solve the problems of the prior art, and the objects of the present invention are as follows. The first 'the object of the present invention is to provide a glass grinding system and method' which divides the upper unit into a fixed turntable and a grinding turntable (including an inter-turning turntable and a separating turntable) which can be moved or floated relative to the fixed turntable, and is set A plurality of 201034795 pressure members (such as gas springs) are placed between the fixed turntable and the grinding turntable, and then, in the 'grinding operation', a plurality of pressures are applied to the glass at a plurality of positions in the upper unit, and the hole is pressed to absorb the grinding process. Vibration, 俾 can improve the flatness of the glass. The present invention is directed to providing a glass polishing system and a system for grinding by a plurality of abrasive feed channels through an upper unit (providing a polishing pad and including a fixed turntable, a middle turntable, and a knife away from the turntable) The slurry is directly supplied to the surface of the glass, and the efficiency of the abrasive material supply operation can be improved. The first object of the present invention is to provide a glass polishing system and method, which has a polishing pad to be attached by adsorption force. The separation carousel is maintained in the intermediate carousel to facilitate repair or replacement of the polishing pad. To achieve the above object, the present invention provides a glass lapping system including a lower unit that can be rotated in a fixed position of the glass; an upper unit, Can be in contact with the glass and can be passively rotated by the rotation of the glass; and a moving unit for moving the upper unit in the horizontal and/or vertical direction, wherein the upper unit comprises: a fixed turntable fixed to the upper unit a shaft; the grinding wheel is arranged to be movable relative to the fixed turntable; and - the pressing member is inserted into the fixed turntable and the grinding turn Between the two, in order to maintain the pressure uniformity of the grinding wheel applied to the glass. Preferably, the pressing member comprises: a plurality of gas springs, which are disposed between the fixed turntable and the grinding turntable. The utility model comprises: at least one gas spring group, which is concentrically arranged on the basis of the vehicle. The car is also preferred, and each gas spring comprises: a box shape having an air inlet 7 201034795 'the air supplied through the fixed turntable by suction. Preferably, each of the gas springs in the same gas spring group maintains the same pressure. ° Preferably, the pressure applied to each gas spring is controllable. Preferably, the glass grinding system of the present invention further comprises: plural The guiding member is disposed between the fixed turntable and the intermediate turntable to guide the movement of the intermediate turntable relative to the fixed turntable. Each of the guiding members comprises: a guiding shaft disposed through the fixed turntable a turntable; and a guiding brake member disposed at the other end of the guide shaft. Preferably, the grinding turntable comprises: an intermediate turntable facing the fixed turntable; and a The separation dial is detachably disposed on the intermediate turntable, and the vacuum chuck is used to fix the separation turntable to the intermediate turntable by vacuum. Preferably, the vacuum chuck comprises: a plurality of press passes through the fixed turntable And the intermediate turntable 'and the vacuum single S' form a vacuum on the surface of the intermediate turntable contacting the separation turntable to communicate with the pressing track. Preferably, at least two vacuum chucks arranged concentrically with respect to the axis are provided. The father's vacuum unit includes an integrally formed stepped surface formed by cutting the lower surface of the intermediate turntable. More than it, the vacuum unit includes: a plurality of miso n-type vacuum tanks, which are formed on the lower surface of the intermediate turntable, so that the size thereof is increased by the press path. Preferably, the glass grinding system further comprises: a safety joint member, wherein the separation disc is detachably disposed on the intermediate dial. , is attached to the system for the lock

Ο 201034795 ^較料,該安全接合構件包括··複數個托座 ^中間轉盤及分離轉盤之邊緣;以及鎖固單元, 固接托座。 較公為,邊安全接合構件包括··複數個 過中間轉盤而固定於分離轉盤。 “ 為°亥玻璃研磨系統更可包括:複數個工作孔, 5於魅中並分別對應接合栓;以及封蓋,係用於 盍封該些工作孔。 * f佳4 ’本發明之玻璃研磨系統更包&:-研磨漿料 [應早m於將研磨漿料透過該上單元而供應至玻璃。 、:丨°亥研磨漿料供應I元包括:複數個研磨漿料 -應道,其係穿過固定轉盤及研磨轉盤。 較佳為,每一研磨漿料供應道包括:一第一通道,係 f接研磨㈣供應單元之研磨㈣供應部與固定轉盤頂 部,以及一第二通道,係連接固定轉盤底部與研磨轉盤頂 部,且具有可延伸之結構。 —較佳為,第二通道包括:一第一連接導管,係設於固 定轉盤之下表面;以及一第二連接導管,係設於研磨轉盤 表面且·1在封式地連接至第一連接導管,俾可相對 於第一連接導管移動。 較佳為,該研磨漿料供應單元包括:一中央供應器, 位於移動單元軸下方;以及複數個放射狀供應器,係由中 央供應益朝放射狀方向設置。 本發明之玻璃研磨系統可提供下述功效。 201034795 苐一 ’衩數個氣壓彈簀可提供相同作用力至對應於固 定轉盤之研磨轉盤的數個部位,亦可吸收研磨作業中產生 的震動’俾可改善製得玻璃之平坦度。 第二,透過分別穿過固定轉盤、中間轉盤及分離轉盤 之研磨漿料供應道’可將研磨漿料直接供應至玻璃表面, 俾可將研磨漿料供應作業之效率提升到最大,並確保可穩 定且均勻地供應研磨漿料。 第三’設有研磨塾之分離轉盤可以吸附方式,選擇性 地自中間轉盤分離,遂而便於研磨墊的維修或更換c 【實施方式】 參考隨附圖式’下述具體實施例將更加闡明本發明之 其他目的及態樣。 下文將參考隨附圖式’詳細敘述本發明較佳具體實施 例。 在敘述之前,應了解使用於本說明書及隨附之申請專 利範圍之用语’不該被解釋為褐限在·一般及字典上的音 義,而是在發明人可適當定義用語的原則基礎上,基於對 應於本發明之技術觀點作出最佳的解釋。因此,此處描述 僅是為說明用之較佳實施例,不應限制本發明之範_,應 瞭解的是,可作其他不悖離本發明精神及範疇的相等物及 修飾。 圖1係本發明一較佳具體實施例之玻璃研磨系統示意 圖 201034795Ο 201034795 ^Comparatively, the safety joint member comprises a plurality of brackets ^ an intermediate turntable and an edge of the separation turntable; and a locking unit for fixing the bracket. More generally, the side safety joint member includes a plurality of intermediate turntables and is fixed to the separation turntable. " For the ° Hai glass grinding system can include: a plurality of working holes, 5 in the charm and corresponding to the joint bolt; and the cover is used to seal the working holes. * f good 4 'the glass grinding of the present invention The system further comprises &:-grinding slurry [should be supplied to the glass by passing the polishing slurry through the upper unit.]: 丨°hai grinding slurry supply I element includes: a plurality of polishing slurry-according, It is passed through the fixed turntable and the grinding turntable. Preferably, each of the grinding slurry supply channels comprises: a first passage, a f-grinding (four) supply unit grinding (four) supply part and a fixed turntable top, and a second passage Connecting the bottom of the fixed turntable to the top of the grinding turntable and having an extendable structure. Preferably, the second passage comprises: a first connecting conduit disposed on a lower surface of the fixed turntable; and a second connecting conduit, It is disposed on the surface of the grinding wheel and is connected to the first connecting pipe in an enclosed manner, and is movable relative to the first connecting pipe. Preferably, the grinding slurry supply unit comprises: a central supplier, located in the mobile unit Below the axis And a plurality of radial supplies are arranged in a radial direction from the central supply. The glass grinding system of the present invention can provide the following effects: 201034795 苐一's number of pneumatic magazines can provide the same force to correspond to the fixed The rotating discs of the turntable can also absorb the vibration generated during the grinding operation to improve the flatness of the glass. Second, through the grinding slurry supply passage through the fixed turntable, the intermediate turntable and the separation turntable respectively. 'The slurry can be supplied directly to the glass surface, which maximizes the efficiency of the slurry supply and ensures a stable and uniform supply of the slurry. The third 'separation turntable with abrasive 可以 can be adsorbed The method is selectively separated from the intermediate turntable to facilitate maintenance or replacement of the polishing pad. [Embodiment] Other objects and aspects of the present invention will be further clarified with reference to the following specific embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. The term "the scope of the patent application" should not be interpreted as a brown limit in the general and dictionary sense, but on the basis of the principle that the inventor can appropriately define the term, based on the technical point of view corresponding to the present invention. Therefore, the descriptions of the present invention are intended to be illustrative only and not to limit the scope of the invention. It is understood that other equivalents and modifications may be made without departing from the spirit and scope of the invention. Schematic diagram of a glass grinding system according to a preferred embodiment of the present invention 201034795

參考圖1,本發明之玻璃研磨系統刚係用來研磨大型 玻璃G (長度為丨,000 mm以上且厚度約為〇 3爪⑺至】」出⑷ 之一表面,使該表面具有液晶顯示器(為一舉例)所需之平坦 度。又,該玻璃研磨系統100包括:下單元n〇,其可以預 定速度旋轉吸固其上之玻璃G;〗單元12〇,設於下單元ιι〇 上方且設有研磨墊丨22,俾使研磨墊122可與置於下單元ιι〇 之玻璃G上表面(或待研磨表面)接觸;移動單元ι3〇,係用 於使上單元120朝水平或垂直方向移動;以及研磨漿料供應 f元140,係用於將研磨焚料由研磨聚料供應部μ]透過上 單元1 20供應至待研磨之玻璃〇表面。 於本具體實施例之玻璃研磨系統1〇〇中,上單元12〇及/ 或其所設有的研磨塾122尺寸(盤型時為直徑)小於待研磨之 矩形玻璃G尺寸(水平及垂直長度間較小之一者)。又下單 凡110之旋轉軸112較佳係不與上單元12〇之轴124位於一直 線,而是可自上單元丨20之軸124偏移(〇ffset)及對應於上單 元120之軸124相對移動。 於本具體實施例之玻璃研磨系統1〇〇中,若下單元no 旋轉’㈣動單S130同時沿著預定執道朝水平方向移動, 而研磨墊丨22與待研磨之破璃G表面接觸時,旋轉之下單元 會使上單TC12G被動式地轉動,而藉由研磨㈣供廣單 元1侧供應之研磨漿料,可均勾地研磨玻璃g整個表面“。 於本具體實施例之破璃研磨系統1〇〇中,移動單元13〇 已括.第一層台(圖未示),其係設於支撐下單元"Ο的座架 102 ’且可藉由第一驅動源(圖纟示),透過朝χ方向設於座 201034795 架102上之X導向(圖未示)自由移動;第二層台(圖未示),其 可藉由第二驅動源(圖未示),透過朝γ方向設於第—層二上 之Y導向(圖未示)自由移動;以及第三層台137,其可藉由 第三驅動源(圖未示),於第二層台上朝垂直方向移動,且上 單元120係設於第三層台。 下單元110包括:旋轉軸1丨2,其係延伸自裝於座架 之平台106 :以及第四驅動源1〇3,係以預定速度轉動旋轉 上單元120係裝於自第三層台137垂直延伸下來之軸 1 24下端。該軸124可相對於第三層台丨37自由旋轉。 上單7L120包括:固定轉盤丨21及研磨轉盤123,其整體 各自為盤型。又,研磨轉盤123可分為中間轉盤125及分離 轉盤127。固定轉盤丨21係固定於軸124下端,且研磨轉盤is] 係與固定轉盤121間隔設置,其可相對於固定轉盤121^起 或移動。分離轉盤127可經由吸附而以選擇性可卸式的方式 設於中間轉盤125。 "" 研磨漿料供應單元丨4〇包括:複數個研磨漿料供應道 144,其係分別穿過固定轉盤121 '令間轉盤125及分離轉盤 127而形成,以供應含有矽土粒子(為一舉例)之漿狀研磨漿 料。又’研磨聚料供應單元刚包括:中央供應器,係與中 央供應官146連通,且中央供應管ι46係穿過軸124且通過位 於軸124下之上單元12〇 ;以及複數個放射狀供應器係由 中央供應朝放射狀方向設置。藉此,由研磨漿料供應部 142供應之研磨漿料可供應至上單元120中央處(或軸正下 201034795 方位置)及距離輛丨24預定半徑之複數位置。Referring to Fig. 1, the glass polishing system of the present invention is used to grind one surface of a large glass G (having a length of 丨, 000 mm or more and a thickness of about 爪3 claws (7) to ???" (4), so that the surface has a liquid crystal display ( For example, the required flatness. In addition, the glass grinding system 100 includes: a lower unit n〇, which can rotate the glass G on the fixed speed at a predetermined speed; the unit 12〇 is disposed above the lower unit ιι A polishing pad 22 is provided so that the polishing pad 122 can be in contact with the upper surface (or the surface to be polished) of the glass G placed on the lower unit; the moving unit ι3 is used to make the upper unit 120 face horizontally or vertically And a grinding slurry supply f-unit 140 for supplying the grinding incineration from the abrasive aggregate supply portion μ through the upper unit 120 to the surface of the glass crucible to be ground. The glass grinding system 1 of the present embodiment In the crucible, the upper unit 12〇 and/or the size of the grinding crucible 122 (the diameter of the disc type) is smaller than the size of the rectangular glass G to be polished (the smaller of the horizontal and vertical lengths). The single shaft 110 of the rotating shaft 112 is preferably not with the order The axis 124 of the element 12 is located in a straight line, but is offset from the axis 124 of the upper unit 20 (〇 ffset) and the relative movement of the axis 124 corresponding to the upper unit 120. The glass grinding system of the present embodiment 1〇〇 If the lower unit rotates '(4), the moving sheet S130 moves horizontally along the predetermined way, and when the polishing pad 22 contacts the surface of the broken glass G to be ground, the unit under rotation causes the order TC12G to passively Rotating, and grinding (4) the polishing slurry supplied from the side of the wide unit 1 can uniformly grind the entire surface of the glass g. In the glass grinding system 1 of the present embodiment, the moving unit 13 is included a first floor (not shown), which is disposed on the frame 102' supporting the lower unit "Ο and can be disposed on the frame 201034795 through the first drive source (not shown) The upper X guide (not shown) is free to move; the second stack (not shown) can be guided by the second drive source (not shown) through the Y guide disposed on the first layer 2 in the gamma direction. (not shown) free to move; and a third layer 137, which can be driven by a third source (Fig. The upper unit 120 is disposed on the third floor. The lower unit 110 includes a rotating shaft 1丨2 extending from the platform 106 mounted on the mount: The fourth drive source 1〇3 is rotated at a predetermined speed. The upper unit 120 is attached to the lower end of the shaft 1 24 extending vertically from the third stage 137. The shaft 124 is free to rotate relative to the third layer 37. The order sheet 7L120 includes: a fixed turntable 丨 21 and a grinding turntable 123, each of which is of a disc type. Further, the grinding turntable 123 can be divided into an intermediate turntable 125 and a separation turntable 127. The fixed turntable 丨 21 is fixed to the lower end of the shaft 124, and is ground. The turntable is disposed at a distance from the fixed turntable 121, which can be moved or moved relative to the fixed turntable 121. The separation turntable 127 can be selectively detachably provided to the intermediate turntable 125 via suction. "" The slurry supply unit 丨4〇 includes a plurality of abrasive slurry supply passages 144 which are respectively formed through the fixed turntable 121' between the turntable 125 and the separation turntable 127 to supply the alumina particles ( For example, a slurry slurry is exemplified. Further, the 'grinding aggregate supply unit has just included a central supply that is in communication with the central supply officer 146, and the central supply tube 146 is passed through the shaft 124 and through the unit 12 below the shaft 124; and a plurality of radial supplies The device is arranged in a radial direction by the central supply. Thereby, the polishing slurry supplied from the polishing slurry supply portion 142 can be supplied to the center of the upper unit 120 (or the position immediately below the axis of 201034795) and at a plurality of positions from the predetermined radius of the vehicle cymbal 24.

,母一研磨漿料供應道144包括:第—通道丨41及第二通 道143。第-通道丨41由研磨漿料供應部⑷連接至固定轉盤 121頂部且包括形成於旋轉接頭(圖未示)中之通道。又,第 一通道⑷係用於將設於軸124側邊之第一出口埠126連接 至設於固定轉盤121頂面之第一入口埠128,而第一通道⑷ 較佳係包括可撓式軟管一e)、管(tube)、導管(pipe)或其類 似物。第三通道143由第—通道⑷之—端連接至分離轉盤 127下表面。尤其,固定轉盤下表面與中間轉盤上表面 較佳係由可伸縮結構或材料製成。為此’第二通道丨43包 括:第一連接導管145 ’係設於固定轉盤121下表面;及第 二連接導管147 ’係設於中間轉盤125上表面。第一連接導 官145及第二連接導管147可彼此相對移動並密封其連接 部。中間轉盤丨25與固定轉盤丨21間之間隔為可調式。據此, 隨著研磨轉盤123相對於固定轉盤121的移動,第一及第二 連接導管145,147之長度可延展或縮短。 於另一具體實施例中,玻璃研磨系統1〇〇包括:施壓構 件150,以均勻地維持與旋轉玻璃G接觸之上單元12〇每處的 壓力。施壓構件150係用於使設有研磨墊122之研磨轉盤123 對玻璃的數個位置進行相當均勻地施壓。該施壓構件15〇包 括.複數個氣壓彈簧1 5 1,係設於固定轉盤121與研磨轉盤 123之中間轉盤125間’且陳設為預定圖樣。 氣壓彈黃151設置為包括:第一氣壓彈簧組丨53、第二 彈簧組1 55及第三彈簧組1 57 ’其係以軸124為基準,由内惻 201034795 朝外側以預定間距同心設置。每一氣壓彈簧組1 53,1 55 1 57 中之氣壓彈簧151分別連接至第—供氣管163、第二供氣管 165及第三供氣管167,其以轴124為基準,由内側朝外側同 心設置於固定轉盤丨21上表面上。供氣管丨63 165 167分別透 過上述旋轉接頭(圖未示)與供氣軟管161連接供氣軟管 係與設於軸124側邊之對應供氣埠129連接。又,供氣管 163,165,167透過次通道169分別連接至對應的氣壓彈^ 151。較佳為,每一供氣管163, 165, 167維持相同壓力。然 而,於另一具體實施例中,當施加至氣壓彈簧1 5 1之壓力必 須朝放射方向遠離軸124而逐漸增加時,供氣管163, 165 1 67亦可分別設定控制於不同壓力。 第一氣壓彈簧組153係最靠近軸124,或設於最内圈(以 軸124為中心),而第二氣壓彈簧組155及第三彈簧組157則 分別設於中間圈及最外圈(以軸124為中心)。本領域中具有 通常知識者可明顯知悉,該些氣壓彈簧151之同心圏數及其 設置可隨著待研磨之玻璃G尺寸或下單元n〇及上單元12〇 尺寸而改變。如圖丨所示,研磨漿料供應單元14〇之第二通 道143可设於第一氣壓彈簧153所形成的環圈與第二氣壓彈 簧1 55所形成的環圈之間。 圖2係本發明一較佳具體實施例之氣壓彈簧剖視圖而 圖3係圖2之平面圖。 參考圖1至圖3,每一氣壓彈簧丨51包括:盤狀箱,其具 有導入通過固定轉盤丨21之空氣的空氣入口 152及可收縮壁 1 :>4。每一氣壓彈簧1 5丨包括:至少一對設於其頂部之上接 201034795 合孔1 56,以與穿過固定轉盤1 21之栓接合;至少—設於其 底部之下接合孔1 5 8 ’以與穿過中間轉盤丨2 5之检接合。氣 壓彈簧151之空氣入口 152與分別通過固定轉盤丨21之次通 道169連通。因此,若將空氣導入並通過空氣入口 152,氣 壓彈簧151之箱壁154會膨脹,以增加裝有氣壓彈簧ι51之研 磨轉盤123每一區域的壓力。藉此,可均勻維持施加於上述 區域之玻璃G的壓力(而非其他區域)。同時,氣壓彈箬 並不侷限於上述箱型結構,而本領域中具有通常知識者可 明顯知悉,氣壓彈簧1 5 1可為任何已知或可知具有相同或類 似功能之結構。 圖4係本發明一較佳具體實施例之研磨系統上單元剖 視圖。 參考圖1及4 ’本發明一較佳具體實施例之玻璃研磨系 統1 〇〇包括:複數個導向構件丨7〇,係設於固定轉盤12丨與研 磨轉盤123間’以引導研磨轉盤丨23相對於固定轉盤丨2〗之移 動。當研磨轉盤123因氣壓彈簧151膨脹或收縮而相對於固 定轉盤121移動時,導向構件17〇可使研磨轉盤123僅沿垂直 方向相對於固定轉盤121移動,並避免研磨轉盤123於水平 方向偏移。導向構件170包括:導向軸175,係穿過導向孔 17丨而固定於設於研磨轉盤丨23之導向支撐件173;以及導向 制動件177,係設於導向軸175之一端。在此,導向軸175之 端形成有螺紋’俾以改變制動件1 77相對於導向軸1 75之 4立著 ’且制動件1 77較佳係可移動式地接合於導向軸1 75的 螺紋。 201034795 麥考圖1,本發明一較佳具體實施例之玻璃研磨系統 100包括:真空吸盤180,以選擇性地將分離轉盤127緊壓至 中間轉盤125或將分離轉盤丨27由中間轉盤丨25分離。 真空吸盤1 80係為了方便維修或更換研磨墊1。換言 之,為了維修或更換研磨墊122,真空吸盤】8〇可使分離轉 盤127容易與中間轉盤125分離,可免於將整個上單元120由 第三層台137之軸124分開來之麻煩。也就是說,於進行研 磨作業時,真空吸盤丨80可壓緊分離轉盤127,以將分離轉 盤127固定於中間轉盤125。又,若需要的話,真空吸盤刚 可釋放真空,以將分離轉盤127由中間轉盤丨25分離。 真空吸盤180包括:複數個壓制道(例如壓制管或導 管)丨8丨,係穿過固定轉盤121及中間轉盤125;以及真空單 元183,其可於令間轉盤125(與分離轉盤127接觸)下表面形 成真空,以與壓制道181連通。真空吸盤18〇包括:兩個真 空形成壓制管185,係、設於固定轉盤121上表面而同心設於 軸丨24周圍,且分別與對應的壓制道1 8 1連通。每一壓制道 181及每-壓制管185分別設置於第一供氣管163與第二供 氣管165之間’及第二供氣管165與第三供氣管167之間。考 慮到研磨轉盤123相對於固定轉盤121之移動,每一壓制道 181較佳係充分地延伸或由可撓性材料製成。 此外真工單元183包括:複數個喇叭型真空槽,係形 ?於中間轉盤125下表面,俾使其尺寸係由每一壓制道181 知增加。換言之,若操作真空驅動源(圖未示)而經由壓制管 185抽除空氣’則每一制0八型真空槽内部之空氣會經由壓制 201034795 道m驅離,遂而於喇叭型真空槽中形成真空,故可將分離 轉盤1 27緊密地吸固於中間轉盤125。 圖5係本發明較佳具體實施例真空吸盤之真空單元變 化態樣剖視圖。The mother-grinding slurry supply passage 144 includes a first passage 41 and a second passage 143. The first passage 41 is connected to the top of the fixed turntable 121 by the abrasive slurry supply portion (4) and includes a passage formed in a rotary joint (not shown). Moreover, the first passage (4) is for connecting the first outlet 埠 126 provided on the side of the shaft 124 to the first inlet 埠 128 provided on the top surface of the fixed turntable 121, and the first passage (4) preferably includes a flexible type Hose-e), tube, pipe or the like. The third passage 143 is connected to the lower surface of the separation dial 127 by the end of the first passage (4). In particular, the lower surface of the fixed turntable and the upper surface of the intermediate turntable are preferably made of a retractable structure or material. To this end, the second passage port 43 includes a first connecting duct 145' attached to the lower surface of the fixed turntable 121, and a second connecting duct 147' attached to the upper surface of the intermediate turntable 125. The first connection guide 145 and the second connection guide 147 are movable relative to each other and seal their connection portions. The interval between the intermediate turntable 丨 25 and the fixed turntable 丨 21 is adjustable. Accordingly, as the grinding turntable 123 moves relative to the fixed turntable 121, the lengths of the first and second connecting conduits 145, 147 can be extended or shortened. In another embodiment, the glass lapping system 1 includes a pressing member 150 to uniformly maintain the pressure of each of the cells 12 above the rotating glass G. The pressing member 150 is for causing the grinding turntable 123 provided with the polishing pad 122 to apply a relatively uniform pressure to a plurality of positions of the glass. The pressing member 15 includes a plurality of gas springs 153, which are disposed between the fixed turntable 121 and the intermediate turntable 125 of the grinding turntable 123 and are set to a predetermined pattern. The pneumatic spring 151 is arranged to include a first gas spring group 丨53, a second spring group 155, and a third spring group 1 57' which are concentrically arranged outwardly at a predetermined pitch from the inner lining 201034795 with reference to the shaft 124. The gas springs 151 of each of the gas spring groups 1 53, 1 55 1 57 are respectively connected to the first gas supply pipe 163, the second gas supply pipe 165 and the third gas supply pipe 167, which are concentric with the inner side and the outer side with reference to the shaft 124 It is disposed on the upper surface of the fixed turntable 丨21. The air supply pipe 丨 63 165 167 is connected to the air supply hose 161 through the above-mentioned rotary joint (not shown), and the air supply hose is connected to the corresponding air supply port 129 provided on the side of the shaft 124. Further, the air supply pipes 163, 165, 167 are respectively connected to the corresponding pneumatic bombs 151 through the secondary passages 169. Preferably, each of the air supply pipes 163, 165, 167 maintains the same pressure. However, in another embodiment, when the pressure applied to the gas spring 115 must be gradually increased away from the shaft 124 in the radial direction, the gas supply pipes 163, 165 1 67 may be separately controlled to be controlled at different pressures. The first gas spring group 153 is closest to the shaft 124, or is disposed on the innermost ring (centered on the shaft 124), and the second gas spring group 155 and the third spring group 157 are respectively disposed in the middle ring and the outermost ring ( Centered on the axis 124). It will be apparent to those of ordinary skill in the art that the concentric turns of the gas springs 151 and their settings may vary with the size of the glass G to be ground or the size of the lower unit n and the upper unit 12'. As shown in Fig. 2, the second passage 143 of the polishing slurry supply unit 14 can be disposed between the loop formed by the first gas spring 153 and the loop formed by the second pneumatic spring 1 55. Figure 2 is a cross-sectional view of a gas spring according to a preferred embodiment of the present invention and Figure 3 is a plan view of Figure 2. Referring to Figs. 1 through 3, each of the gas springs 51 includes a disk-shaped case having an air inlet 152 and a contractible wall 1 : > 4 introduced through the air of the fixed turntable 丨 21 . Each of the gas springs 15 5 includes: at least one pair is disposed on the top thereof and connected to the 201034795 hole 156 to engage with the bolt passing through the fixed turntable 1 21; at least - is disposed below the bottom thereof to engage the hole 1 5 8 'In conjunction with the inspection through the intermediate turntable 丨25. The air inlet 152 of the gas spring 151 communicates with the secondary passage 169 through the fixed turntable 丨 21, respectively. Therefore, if air is introduced into and through the air inlet 152, the tank wall 154 of the gas spring 151 is expanded to increase the pressure of each region of the grinding wheel 123 equipped with the gas spring ι51. Thereby, the pressure (not other areas) of the glass G applied to the above region can be uniformly maintained. At the same time, the pneumatic magazine is not limited to the above-described box structure, and it is obvious to those of ordinary skill in the art that the gas spring 157 can be any structure known or known to have the same or similar function. Figure 4 is a cross-sectional view of the unit of the polishing system in accordance with a preferred embodiment of the present invention. Referring to Figures 1 and 4, a glass polishing system 1 of a preferred embodiment of the present invention includes a plurality of guide members 丨7〇 disposed between the fixed turntable 12丨 and the grinding turntable 123 to guide the grinding turntable 丨23 Move relative to the fixed turntable 丨2. When the grinding wheel 123 moves relative to the fixed turntable 121 due to expansion or contraction of the gas spring 151, the guiding member 17 turns the grinding wheel 123 to move only in the vertical direction relative to the fixed turntable 121, and prevents the grinding turntable 123 from being displaced in the horizontal direction. . The guide member 170 includes a guide shaft 175 which is fixed to the guide support member 173 provided on the grinding wheel 丨 23 through the guide hole 17 ;, and a guide stopper 177 which is provided at one end of the guide shaft 175. Here, the end of the guide shaft 175 is formed with a thread '俾 to change the brake member 1 77 standing 4 with respect to the guide shaft 1 75' and the brake member 1 77 is preferably movably coupled to the thread of the guide shaft 1 75 . 201034795 McCaw FIG. 1, a glass lapping system 100 in accordance with a preferred embodiment of the present invention includes a vacuum chuck 180 for selectively pressing the separation carousel 127 to the intermediate carousel 125 or the separation carousel 27 from the intermediate carousel 25 Separation. The vacuum chuck 180 is designed to facilitate maintenance or replacement of the polishing pad 1. In other words, in order to repair or replace the polishing pad 122, the vacuum chuck can easily separate the separation dial 127 from the intermediate turntable 125, which is free from the trouble of separating the entire upper unit 120 from the shaft 124 of the third layer 137. That is, the vacuum chuck 丨80 can press the separation dial 127 to fix the separation dial 127 to the intermediate turntable 125 during the grinding operation. Further, if necessary, the vacuum chuck can just release the vacuum to separate the separation turntable 127 from the intermediate turntable 丨 25. The vacuum chuck 180 includes: a plurality of pressing lanes (for example, pressing tubes or conduits) 丨8丨 passing through the fixed turntable 121 and the intermediate turntable 125; and a vacuum unit 183 for contacting the turntable 125 (contacting the separation turntable 127) The lower surface forms a vacuum to communicate with the press passage 181. The vacuum chuck 18 includes two vacuum forming pressing tubes 185 which are disposed on the upper surface of the fixed turntable 121 and are concentrically disposed around the shaft 24 and communicate with the corresponding pressing passages 81 1 respectively. Each of the pressing passages 181 and the pressing tubes 185 are disposed between the first air supply pipe 163 and the second air supply pipe 165 and between the second air supply pipe 165 and the third air supply pipe 167, respectively. Each of the press passes 181 preferably extends sufficiently or is made of a flexible material in consideration of the movement of the grinding turntable 123 relative to the fixed turntable 121. In addition, the real work unit 183 includes a plurality of horn type vacuum grooves which are formed on the lower surface of the intermediate turntable 125 so that the size thereof is increased by each of the press channels 181. In other words, if the vacuum drive source (not shown) is operated and the air is removed via the press tube 185, the air inside each of the 0-type vacuum tanks is driven away by pressing the 201034795 track m, and is placed in the horn type vacuum chamber. The vacuum is formed so that the separation turntable 1 27 can be closely sucked to the intermediate turntable 125. Fig. 5 is a cross-sectional view showing a variation of a vacuum unit of a vacuum chuck according to a preferred embodiment of the present invention.

參考圖5’該具體實施例之真空單元183,包括:階狀表 面187 ’係藉由削減中間轉盤125下表面而形成。真空單元 ⑻’係前述具體實施例中真空單元183(具有剩叭型真空槽) 之變化態樣’而真空單元183’係'藉由與每—壓制道ι8ι連通 之階狀表面187’將分離轉盤127緊壓至中間轉盤125或將分 離轉盤127由中間轉盤125分離。 本發明較佳具體實施例之玻璃研磨系統丨⑻更包括:安 全接合構件190,以輔助性地將分離轉盤127可卸式地接至 中間轉盤1‘5 ’其係應付無法預期之意外。安全接合構件刚 係一種安全裝置’當玻璃研磨系統丨崎轉過程中無法使用 真空吸盤180時,其可避免分離轉盤127由中間轉盤125脫 安全接合構件19〇包括:四個接合托座I%,係分別由 中間轉盤125及分離轉盤127之邊緣突出且互相連接;以及 鎖栓194,其可鎖固於接合托座192之鎖合槽。 剛,具體實施例中’如圖4所示,該安全接合構件 包括:複數個接合栓⑼’其可穿過中間轉盤125而固 疋於分離轉盤127。於此,工作物係形成於固定轉盤121 中對應接合栓191的位置,且每―作 v 工作孔193可错由封蓋195 而被打開或㈣。封蓋丨95可^蓋蝴未心岐於固 201034795 疋轉i 1 2 1上表面。換言之’於該具體實施例中,為了將分 _盤127自固定轉盤⑵分離’應移除蓋栓,將封蓋】95由 固定轉盤121打開’而後經過工作孔193移除接合栓丨9丨。 在此,將解釋本發明較佳具體實施例之上述結構玻璃 研磨系統的操作。 。。百先,藉由習知方式(如吸附),將待研磨之玻璃G置於 下單元11〇上表面,隨後使第四驅動源1〇3運轉,以旋轉平 台同時’運轉第三驅動源,使第三層台137向下移動, 俾使上單το 12G之研磨墊122下表面壓制於待研磨玻璃R 一表靣。又,若第一及第二驅動源運轉,第一及第二層台 會分:沿著預定軌跡於水平面上移動。接著,上單元丨別會 因:單元11〇的轉動而被動式地旋轉,同時,上單元12〇會 因第及第一層台之移動而相對於軸124旋轉。 若於此作業中運轉研磨漿料供應單元140,儲存於研磨 漿料供應部】42之研磨漿料會沿著分別穿過固定轉盤丨〕卜 中間轉盤125及分離轉盤127之研磨漿料供應道144,透過中 央供應器及中央供應器周圍朝放射狀方向設置之放射狀供 應器而供應,藉此,可將研磨漿料均勻地塗佈置待研磨破 璃G之表面。可將研磨漿料供應單元14〇設定為,於整個研 磨時間中連續供應研磨漿料,而使用後的研磨漿料可經過 過濾而後回收至研磨漿料供應部142,以循環使用。 接著,上單元120偏離下單元11 〇之旋轉軸n 2並以軸 124為基準旋轉時,啟動施壓構件150 ’均勻維持由上單元 120每一處施加於玻璃G整個區域之壓力。 201034795 〃施壓構件150運作時,供氣源(圖未示)會供應空氣通過 旋轉接頭及軸124,並使空氣透過每—供氣管163, 165, 167 而供應至對應之第第二及第三氣壓彈簣組153, 155, 157’以使每-氣壓彈簧151箱壁154膨脹。而後,研磨轉盤 123相對於固定轉盤121的位置會改變,每一氣壓彈簧1^處 之壓力會變仔均句’據此’透過上單元12G因移動單元130 而於水平面移動,可均勻維持待研磨玻璃G表面上之壓力。 Ο Ο 在此,允壓構件150可於上單元丨2〇之研磨墊122與待研 磨玻璃G表面接觸前啟動,或於研磨墊122與玻璃g接觸後 開始進行研磨作業時啟動。此外,可依據研磨作業過程中 所設定的壓力,控制施壓構件丨5〇之施壓操作。 另外,若真空吸盤18〇係於研磨作業進行前運作,研磨 轉盤123之分離轉盤127係固定於中間轉盤125。真空吸盤 180運作時,真空驅動源(圖未示)會啟動,透過壓制管185 而於具有喇叭型真空槽之真空單元1 83或具有階狀表面1 87 之真空單元183’處形成真空’藉此,可透過吸附力,將分 離轉盤127設置於中間轉盤125。分離轉盤127也可藉由安全 接合構件190而穩固地固定於中間轉盤丨25。 下文將解釋本發明一較佳具體實施例之研磨玻璃方 法0 於研磨玻璃G的過程中,該具體實施例之研磨玻璃方法 包括至少一下述步驟:藉由設於固定轉盤121及研磨轉盤 123間之複數個氣壓彈簧151,對研磨轉盤123施壓,而於上 單元1 20之複數個位置均勻維持施加於玻璃g之壓力;藉由 201034795 分別通過固定轉盤丨21、中間轉盤125及分離轉盤i27之研磨 漿料供應道144 ’供應研磨漿料至玻璃〇之—本 ^ 表面;以及固 定分離轉盤127於中間轉盤1 25上。 因此,依據本具體實施例之研磨玻璃方法可穩定供 應研磨Μ至待研磨玻璃G之—表面,可藉由氣壓彈箸 ⑸’使玻璃G維持理想程度的平坦度,且可穩固維持分離 轉盤127於中間轉盤125上。據此,可改善破璃研磨製程之 精確度及產率。將玻璃研磨製程之不良率降至最小。 〇 已詳細敘述本發明。然而,應瞭解的是,藉由此處的 詳細敘述,本領域中具有通常知識者可明顯知悉本發=精 神及範疇内之各種變化及修飾,因此,當指明為本發明之 較佳具體實施例時,其所述之詳細敘述及特定實例僅為 明用。 、 ^ 【圖式簡單說明】 圖1係本發明一較佳具體實施例之玻璃研磨系統示意圖。 圖2係圖1研磨系統中使用之氣壓彈簧剖視圖。 圖3係圖2之平面圖。 圖4係本發明-較佳具體實施例研磨系統之上單元剖視圖。 圖5係本發明一較佳具體實施例研磨系統之真空吸盤真空 部之變化態樣剖視圖。 【主要元件符號說明】 研磨糸統1 00 座架1 02 20 201034795Referring to Fig. 5', the vacuum unit 183 of this embodiment includes a stepped surface 187' formed by cutting the lower surface of the intermediate turntable 125. The vacuum unit (8)' is a variation of the vacuum unit 183 (having a residual vacuum chamber) in the foregoing specific embodiment, and the vacuum unit 183' is separated by a stepped surface 187' communicating with each of the pressing passages ι8. The turntable 127 is pressed to the intermediate turntable 125 or the separation turntable 127 is separated by the intermediate turntable 125. The glass abrading system (8) of the preferred embodiment of the present invention further includes a safety engaging member 190 to detachably couple the separation dial 127 to the intermediate turntable 1 '5 ' for unforeseen accidents. The safety joint member is just a safety device. When the vacuum chuck 180 cannot be used during the glass grinding system, it can prevent the separation dial 127 from being detached from the intermediate turntable 125 by the safety joint member 19, including: four joint brackets I% The protrusions are respectively protruded from the edges of the intermediate turntable 125 and the separation turntable 127 and are connected to each other; and the latch 194 is lockable to the locking groove of the engaging bracket 192. In the preferred embodiment, as shown in Fig. 4, the safety engaging member includes a plurality of engaging bolts (9)' which are fixed to the separating dial 127 through the intermediate turntable 125. Here, the work item is formed at a position corresponding to the engagement pin 191 in the fixed turntable 121, and each of the work holes 193 can be opened or closed by the cover 195. Cover 丨95 can cover the butterfly and not focus on the solid 201034795 疋 turn i 1 2 1 upper surface. In other words, in this embodiment, in order to separate the sub-disk 127 from the fixed turntable (2), the cover plug should be removed, the cover 95 is opened by the fixed turntable 121 and then removed by the working hole 193. . Here, the operation of the above-described structural glass polishing system of a preferred embodiment of the present invention will be explained. . . First, the glass G to be ground is placed on the upper surface of the lower unit 11 by a conventional method (such as adsorption), and then the fourth driving source 1〇3 is operated to rotate the platform while 'running the third driving source. The third layer stage 137 is moved downward, so that the lower surface of the polishing pad 122 of the upper sheet το 12G is pressed against the surface of the glass to be polished R. Further, if the first and second driving sources are operated, the first and second landings are divided into: moving along a predetermined trajectory on a horizontal plane. Then, the upper unit discrimination is passively rotated by the rotation of the unit 11 ,, and the upper unit 12 旋转 is rotated relative to the shaft 124 by the movement of the first stage. If the polishing slurry supply unit 140 is operated in this operation, the polishing slurry stored in the polishing slurry supply portion 42 will be supplied along the polishing slurry supply path that passes through the fixed turntable 丨 中间 intermediate turntable 125 and the separation turntable 127, respectively. 144, supplied through a radial supply disposed around the central supply and the central supply in a radial direction, whereby the abrasive slurry can be uniformly coated on the surface of the glass to be ground G. The polishing slurry supply unit 14A can be set to continuously supply the polishing slurry throughout the grinding time, and the used polishing slurry can be filtered and then recovered to the polishing slurry supply portion 142 for recycling. Next, when the upper unit 120 is deviated from the rotation axis n 2 of the lower unit 11 并 and rotated on the basis of the shaft 124, the activation pressing member 150' uniformly maintains the pressure applied to the entire region of the glass G by each of the upper units 120. 201034795 When the pressure applying member 150 is in operation, a gas supply source (not shown) supplies air through the rotary joint and the shaft 124, and supplies air to each of the gas supply pipes 163, 165, 167 to the corresponding second and third The three-barrel magazine group 153, 155, 157' expands the box wall 154 of each of the gas springs 151. Then, the position of the grinding wheel 123 relative to the fixed turntable 121 is changed, and the pressure of each of the gas springs 1^ will be changed according to this, and the upper unit 12G is moved in the horizontal plane by the moving unit 130, and can be uniformly maintained. The pressure on the surface of the glass G is ground.允 Ο Here, the pressure-receiving member 150 can be started before the polishing pad 122 of the upper unit 2 is in contact with the surface of the glass to be ground G, or when the polishing pad 122 is brought into contact with the glass g to start the grinding operation. Further, the pressing operation of the pressing member 丨5〇 can be controlled in accordance with the pressure set during the grinding operation. Further, if the vacuum chuck 18 is operated before the polishing operation, the separation dial 127 of the grinding wheel 123 is fixed to the intermediate turntable 125. When the vacuum chuck 180 is operated, a vacuum driving source (not shown) is activated, and a vacuum is formed through the pressing tube 185 to the vacuum unit 1 83 having the horn type vacuum chamber or the vacuum unit 183' having the stepped surface 187'. Thus, the separation dial 127 can be disposed on the intermediate turntable 125 by the adsorption force. The separation dial 127 can also be firmly fixed to the intermediate turntable 丨 25 by the safety joint member 190. Hereinafter, in the process of grinding the glass G according to a preferred embodiment of the present invention, the method of grinding the glass includes at least one of the following steps: by being disposed between the fixed turntable 121 and the grinding turntable 123. The plurality of gas springs 151 pressurize the grinding wheel 123, and uniformly maintain the pressure applied to the glass g at a plurality of positions of the upper unit 110; by means of 201034795, respectively, the fixed turntable 丨21, the intermediate turntable 125, and the separation turntable i27 The abrasive slurry supply channel 144' supplies the abrasive slurry to the surface of the glass crucible; and the fixed separation turntable 127 is disposed on the intermediate turntable 125. Therefore, the ground glass method according to the present embodiment can stably supply the polishing crucible to the surface of the glass G to be ground, and the glass G can be maintained at a desired degree of flatness by the pneumatic impeller (5)', and the separation turntable 127 can be stably maintained. On the middle turntable 125. Accordingly, the accuracy and productivity of the glass grinding process can be improved. Minimize the defect rate of the glass grinding process. The invention has been described in detail. However, it should be understood that various changes and modifications may be made by those skilled in the art in the present invention. In the following, the detailed description and specific examples are intended to be illustrative. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view of a glass polishing system in accordance with a preferred embodiment of the present invention. Figure 2 is a cross-sectional view of the gas spring used in the polishing system of Figure 1. Figure 3 is a plan view of Figure 2. Figure 4 is a cross-sectional view of the unit above the polishing system of the preferred embodiment of the invention. Figure 5 is a cross-sectional view showing a variation of the vacuum section of the vacuum chuck of the polishing system in accordance with a preferred embodiment of the present invention. [Main component symbol description] Grinding system 1 00 Rack 1 02 20 201034795

第四驅動源103 下單元1 10 上單元120 固定轉盤121 研磨轉盤123 中間轉盤125 分離轉盤127 供氣埠129 第三層台137 第一通道14 1 第二通道143 第一連接導管145 第二連接導管147 氣壓彈簧151 第一氣壓彈簧組153 第二氣壓彈簧組155 第三氣壓彈簧組157 供氣軟管161 次通道169 導向孔1 71 導向軸175 真空吸盤180 真空單元183,183, 階狀表面187 平台106 旋轉軸1 1 2 玻璃G 研磨墊122 軸124 第一出口埠126 第一入口埠128 移動單元130 研磨漿料供應單元140 研磨漿料供應部142 研磨漿料供應道144 中央供應管146 施壓構件150 空氣入口 152 壁154 上接合孔156 下接合孔158 供氣管 163,165, 167 導向構件1 7 0 導向支撐件173 導向制動件177 壓制道1 8 1 真空形成壓制管1 8 5 安全接合構件190,190, 201034795 接合托座192 鎖栓194 接合栓1 9 1 工作孔193 封蓋195Fourth drive source 103 Lower unit 1 10 Upper unit 120 Fixed turntable 121 Grinding turntable 123 Intermediate turntable 125 Separation turntable 127 Air supply port 129 Third floor stage 137 First channel 14 1 Second channel 143 First connection duct 145 Second connection Catheter 147 Gas spring 151 First gas spring group 153 Second gas spring group 155 Third gas spring group 157 Gas supply hose 161 Secondary channel 169 Guide hole 1 71 Guide shaft 175 Vacuum chuck 180 Vacuum unit 183, 183, Stepped surface 187 Platform 106 rotating shaft 1 1 2 glass G polishing pad 122 shaft 124 first outlet port 126 first inlet port 128 moving unit 130 grinding slurry supply unit 140 grinding slurry supply portion 142 grinding slurry supply channel 144 central supply pipe 146 Member 150 Air inlet 152 Wall 154 Upper engagement hole 156 Lower engagement hole 158 Air supply pipe 163, 165, 167 Guide member 1 70 Guide support 173 Guide brake 177 Pressing track 1 8 1 Vacuum forming press tube 1 8 5 Safety joint member 190,190, 201034795 Engagement bracket 192 Lock bolt 194 Engagement bolt 1 9 1 Working hole 193 Cover 195

Claims (1)

201034795 七、申請專利範圍: 1 · 一種玻璃研磨系統,包括·· 下早几,其可轉動置於固定位置之一玻璃; “一上單元’其可與該玻璃接觸且可因該玻璃之旋轉而被 動式地轉動;以及 移動單元,係用於使該上單元於水平及/或垂直方向 移動其中, Ο201034795 VII. Patent application scope: 1 · A glass grinding system, including: · · early, which can be rotated to one of the fixed position glass; "one upper unit" which can be in contact with the glass and can be rotated by the glass And passively rotating; and moving the unit for moving the upper unit horizontally and/or vertically, Ο 其中,該上單元包括: 一固定轉盤,係固定於該上單元之—軸; 研磨轉盤’係言免置為可相對於該固定轉盤移動;以 及 y施壓構件’係插置於該固定轉盤與該研磨轉盤之 乂 ’准持。玄研磨轉盤施加於該玻璃之壓力均勻度。 2·如申請專利範圍第丨項所述之玻璃研磨系統,其 ’該施壓構件包括:複數個氣壓彈簧’係設於該固定轉 i與該研磨轉盤之間。 T σ巧-^Γ Λί μρ ^ 札Η π &quot;· γ 心〜攻喁所僧糸統,其 基準而同心設置 ’遠些氣壓彈簧包括:至少—氣㈣簧組,係以該 基集而印,,、、WL sa 4·如申請專利範圍第3項所述之玻璃研磨系統,其 ’相同氣壓彈簧組中之每—氣壓彈簧維持相同壓力。 ^如申請專利範圍第2項所述之破璃研磨系統,其 ,施加於每一該些氣壓彈簧之壓力係可調控的。 23 201034795 6·如申請專利範圍第2項所述之玻璃研磨系統,其 中,每一邊些氣壓彈簧包括:具有一空氣入口之一箱狀物, 以吸入供應穿過該固定轉盤之一空氣。 7.如申請專利範圍第1項所述之玻璃研磨系統,更包 括: 複數個導向構件’係設於該固定轉盤與該中間轉盤之 間’以引導該中間轉盤相對於該固定轉盤之移動。 8·如申請專利範圍第7項所述之玻璃研磨系統,其 中’每一該些導向構件包括: 一導向轴’係穿過該固定轉盤而設於該中間轉盤;以 及 一導向制動件,係設於該導向軸之另一端。 9.如申叫專利範圍弟1項所述之玻璃研磨系統,更包 括: 一研磨漿料供應單元’係用於將一研磨漿料透過該上 單元而供應至該玻璃。 10·如申β可專利範圍第9項所述之玻璃研磨系統,其 中忒研磨漿料供應單元包括:複數個研磨漿料供應道, 其係穿過該固定轉盤及該研磨轉盤。 11 ·如申响專利範圍第丨〇項所述之玻璃研磨系統,其 中,每一該些研磨漿料供應道包括: 一第一通道,係連接該研磨漿料供應單元之一研磨漿 料供應部與該固定轉盤之頂部;以及 201034795 第一通運,係連接該固定轉盤之底部與該研磨轉盤 之頂部,且具有可延伸之結構。 12.如申請專利範圍第η項所述之玻璃研磨系統其 中’ *亥苐一通道包括: 第連接導官,係設於該固定轉盤之下表面;以及 —一第二連接導管,係設於該研磨轉盤之上表面,且可 岔封式地連接至該第一违接莫答,伯-Ρ 4 ^ 連接導s俾可相對於該第一連接Wherein, the upper unit comprises: a fixed turntable fixed to the shaft of the upper unit; the grinding turntable is freely movable relative to the fixed turntable; and the y pressing member is inserted into the fixed turntable It is the same as the grinding wheel. The pressure uniformity of the glass is applied to the glass. 2. The glass polishing system of claim </ RTI> wherein the pressing member comprises: a plurality of gas springs disposed between the fixed rotation i and the grinding wheel. T σ巧-^Γ Λί μρ ^ Sapporo π &quot;· γ heart ~ attack 喁 system, its reference and concentric setting 'a far pressure spring includes: at least - gas (four) spring group, is based on the base set In the glass grinding system of claim 3, the gas spring of each of the same gas spring groups maintains the same pressure. The glass grinding system of claim 2, wherein the pressure applied to each of the gas springs is controllable. The glass grinding system of claim 2, wherein each of the gas pressure springs comprises: a box having an air inlet for drawing air through one of the fixed turntables. 7. The glass lapping system of claim 1, further comprising: a plurality of guiding members disposed between the fixed turntable and the intermediate turntable to guide movement of the intermediate turntable relative to the fixed turntable. 8. The glass grinding system of claim 7, wherein each of the guiding members comprises: a guiding shaft disposed through the fixed turntable and disposed on the intermediate turntable; and a guiding brake member It is disposed at the other end of the guide shaft. 9. The glass grinding system of claim 1, further comprising: a polishing slurry supply unit for supplying a polishing slurry to the glass through the upper unit. The glass grinding system of claim 9, wherein the 忒 grinding slurry supply unit comprises: a plurality of abrasive slurry supply passages passing through the fixed turntable and the grinding turntable. The glass grinding system of claim 3, wherein each of the abrasive slurry supply channels comprises: a first passage connecting a polishing slurry supply to the one of the abrasive slurry supply units And the top of the fixed turntable; and 201034795 first transport is connected to the bottom of the fixed turntable and the top of the grinding turntable, and has an extendable structure. 12. The glass grinding system of claim n, wherein the channel comprises: a connecting guide, disposed on a lower surface of the fixed turntable; and a second connecting conduit, configured to Grinding the upper surface of the turntable, and being slidably connected to the first splicing contact, the Ρ-Ρ 4^ connection guide 俾 is relative to the first connection Ο 13. —種玻璃研磨方法’其係供應一 元與-待研磨破璃之間,並使該上單…:料至上早 _ ^ J业4上早兀於水平方向移動, 同時4上單兀因與該玻璃接觸而被動式地轉動而該玻 :係置於一下單元上之固定位置且係藉由-下單元而轉 動’其中,該方法包括: ⑷於該上單元之複數個位置處維持施加於 力實質均勻。 1 14. 如中請專利範圍第13項所述之玻璃研磨方法盆 中’於該步驟⑻中,複數個位置上之該些壓力數 個氣壓彈簧維持,該些氣壓 ’、曰 一飞坚弹更係故置為至少一氣壓彈菩 … 該移動單7^-軸為基準而呈圈狀排列。 中 申:專利靶圍第14項所述之玻璃研磨方法,其 目5乱C彈|組中之每—氣壓彈簧維持相同壓力。 中 ^專利fcSI第13項所述之玻璃研磨方法,其 施加於母—該些氣壓彈簧之壓力係可調控的。 201034795 1 7.如申請專利範圍第1 3項所述之玻璃研磨方法,其 中,該研磨漿料係由穿過該上單元同心設置之複數個研磨 漿料供應道所供應。Ο 13. A kind of glass grinding method's supply between one yuan and - to be ground, and to make the order...: material to the early _ ^ J industry 4 is moving in the horizontal direction as early as possible, while 4 is on the single 兀Passing passively by contact with the glass: the glass is placed in a fixed position on the lower unit and rotated by the lower unit, wherein the method comprises: (4) maintaining application at a plurality of locations of the upper unit Yu Li is essentially uniform. 1 14. In the glass grinding method pot according to item 13 of the patent scope, in the step (8), the pressures are maintained at a plurality of positions, and the pressures are maintained. It is more suitable for at least one air pressure. The moving single 7^-axis is arranged in a circle in the form of a circle. Zhong Shen: The glass grinding method described in Item 14 of the patent target, which is the same as the pressure spring in each of the groups. The glass grinding method described in Item 13 of the patent fcSI, which is applied to the mother, the pressure of the gas springs is controllable. The glass grinding method of claim 13, wherein the abrasive slurry is supplied by a plurality of abrasive slurry supply channels concentrically disposed through the upper unit.
TW099106410A 2009-03-06 2010-03-05 System and method for polishing glass TWI511842B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090019292 2009-03-06

Publications (2)

Publication Number Publication Date
TW201034795A true TW201034795A (en) 2010-10-01
TWI511842B TWI511842B (en) 2015-12-11

Family

ID=42678674

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099106410A TWI511842B (en) 2009-03-06 2010-03-05 System and method for polishing glass

Country Status (4)

Country Link
US (1) US20100227535A1 (en)
JP (1) JP5408789B2 (en)
CN (1) CN101823233B (en)
TW (1) TWI511842B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012111001A (en) * 2010-11-25 2012-06-14 Nikon Corp Work carrier and polishing device having work carrier
JP5671735B2 (en) * 2011-01-18 2015-02-18 不二越機械工業株式会社 Double-side polishing equipment
JP5375895B2 (en) * 2011-08-17 2013-12-25 旭硝子株式会社 Polishing system
CN102303278A (en) * 2011-10-09 2012-01-04 湖南永创机电设备有限公司 Down-attached single-side polisher
CN103846788B (en) * 2014-03-07 2016-06-29 湖南永创机电设备有限公司 Improve the buffing machine of polished part suction type
CN107336099A (en) * 2017-07-31 2017-11-10 东莞华清光学科技有限公司 A kind of glass product clears off equipment and clears off method
CN110735112A (en) * 2019-11-25 2020-01-31 温州集袖贸易有限公司 computer goggles evaporation coating equipment

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186172A (en) * 1984-07-30 1986-05-01 Esutetsuku Giken Kk Polishing method for glass plate and its device
DE3430499C2 (en) * 1984-08-18 1986-08-14 Fa. Carl Zeiss, 7920 Heidenheim Method and device for lapping or polishing optical workpieces
DE3643914A1 (en) * 1986-12-22 1988-06-30 Zeiss Carl Fa METHOD AND DEVICE FOR LAPPING OR POLISHING OPTICAL SURFACES
JP2513426B2 (en) * 1993-09-20 1996-07-03 日本電気株式会社 Wafer polishing machine
US5795215A (en) * 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
TW344695B (en) * 1995-08-24 1998-11-11 Matsushita Electric Ind Co Ltd Method for polishing semiconductor substrate
US5658185A (en) * 1995-10-25 1997-08-19 International Business Machines Corporation Chemical-mechanical polishing apparatus with slurry removal system and method
JP3664188B2 (en) * 1995-12-08 2005-06-22 株式会社東京精密 Surface processing method and apparatus
USRE38854E1 (en) * 1996-02-27 2005-10-25 Ebara Corporation Apparatus for and method for polishing workpiece
US6045437A (en) * 1996-03-01 2000-04-04 Tan Thap, Inc. Method and apparatus for polishing a hard disk substrate
WO1997032690A1 (en) * 1996-03-04 1997-09-12 Teikoku Denso Co., Ltd. Resin disk polishing method and apparatus
JPH10551A (en) * 1996-06-07 1998-01-06 Canon Inc Chemical machine polishing device
US6162112A (en) * 1996-06-28 2000-12-19 Canon Kabushiki Kaisha Chemical-mechanical polishing apparatus and method
DE19651761A1 (en) * 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Method and device for polishing semiconductor wafers
JPH10175160A (en) * 1996-12-16 1998-06-30 Canon Inc Polishing method and polishing device
US5816895A (en) * 1997-01-17 1998-10-06 Tokyo Seimitsu Co., Ltd. Surface grinding method and apparatus
JP3027551B2 (en) * 1997-07-03 2000-04-04 キヤノン株式会社 Substrate holding device, polishing method and polishing device using the substrate holding device
JP3665188B2 (en) * 1997-09-03 2005-06-29 不二越機械工業株式会社 Polishing equipment
JPH11138426A (en) * 1997-11-11 1999-05-25 Tokyo Electron Ltd Polishing device
JPH11170166A (en) * 1997-12-08 1999-06-29 Canon Inc Chemical machine polishing method and its device
JP2968784B1 (en) * 1998-06-19 1999-11-02 日本電気株式会社 Polishing method and apparatus used therefor
US6220934B1 (en) * 1998-07-23 2001-04-24 Micron Technology, Inc. Method for controlling pH during planarization and cleaning of microelectronic substrates
JP2000158327A (en) * 1998-12-02 2000-06-13 Rohm Co Ltd Polishing cloth for chemimechanical polishing and chemimechanical polisher using same
US6227956B1 (en) * 1999-10-28 2001-05-08 Strasbaugh Pad quick release device for chemical mechanical polishing
JP3124276B1 (en) * 2000-03-28 2001-01-15 株式会社共立 Disk cleaner
JP4239129B2 (en) * 2000-04-17 2009-03-18 旭硝子株式会社 Plate-shaped body polishing apparatus and polishing pad truing method
US6607425B1 (en) * 2000-12-21 2003-08-19 Lam Research Corporation Pressurized membrane platen design for improving performance in CMP applications
WO2002070199A1 (en) * 2001-03-05 2002-09-12 Elm Inc. Device for polishing optical disk
US6863771B2 (en) * 2001-07-25 2005-03-08 Micron Technology, Inc. Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
US6705928B1 (en) * 2002-09-30 2004-03-16 Intel Corporation Through-pad slurry delivery for chemical-mechanical polish
EP1652619B1 (en) * 2004-10-29 2007-01-10 Schneider GmbH + Co. KG Polishing tool having a plurality of pressure zones
JP4531661B2 (en) * 2005-08-26 2010-08-25 東京エレクトロン株式会社 Substrate processing method and substrate processing apparatus
US20070089951A1 (en) * 2005-10-20 2007-04-26 Peter Skiba Air spring protective sleeve
JP2007152498A (en) * 2005-12-06 2007-06-21 Nikon Corp Polishing device, polishing method, semiconductor device manufacturing method using polishing method, and semiconductor device manufactured by semiconductor device manufacturing method
JP2010064196A (en) * 2008-09-11 2010-03-25 Ebara Corp Substrate polishing device and substrate polishing method
US8133097B2 (en) * 2009-05-07 2012-03-13 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing apparatus

Also Published As

Publication number Publication date
CN101823233B (en) 2015-04-29
CN101823233A (en) 2010-09-08
TWI511842B (en) 2015-12-11
US20100227535A1 (en) 2010-09-09
JP2010208015A (en) 2010-09-24
JP5408789B2 (en) 2014-02-05

Similar Documents

Publication Publication Date Title
TWI503205B (en) Glass polishing system
TW201034795A (en) System and method for polishing glass
TWI522205B (en) Glass polishing system
TW553799B (en) System and method for pneumatic diaphragm cmp head having separate retaining ring and multi-region wafer pressure control
US8740668B2 (en) Three-point spindle-supported floating abrasive platen
EP0737546B1 (en) Apparatus for holding substrate to be polished and apparatus and method for polishing substrate
JP3595266B2 (en) Chemical mechanical polishing (CMP) apparatus and method using a head having a direct pressure type wafer polishing pressure system
US8845394B2 (en) Bellows driven air floatation abrading workholder
US20110223836A1 (en) Three-point fixed-spindle floating-platen abrasive system
US20120028545A1 (en) Pivot-balanced floating platen lapping machine
TW496814B (en) Padless substrate carrier
TW201116368A (en) Method and system for polishing float glass
CN103962939A (en) Polishing apparatus and polishing method
WO2010150757A1 (en) Glass disc polishing device and glass disc polishing method
US8591289B2 (en) Multi-spindle chemical mechanical planarization tool
KR101383602B1 (en) Glass polishing system
JP2013134793A (en) Method and apparatus for manufacturing glass substrate
KR101477271B1 (en) System and method for polyshing glass
KR101383601B1 (en) Glass Polishing System
JP2002200553A (en) Polishing device
CN105590885A (en) Wafer Taping
WO2014070133A1 (en) Bellows driven air floatation abrading workholder
KR101377538B1 (en) Lower Unit for Glass Polishing System and Polishing method utilizing the same