201034541 六、發明說明： 【發明所屬之技術領域】 本發明涉及—種賴自動地將卩方烊底#貼附於電路板上的裝 置。 【先前技術】 目前的印織路板製程大致上包含有1造内層基板— 鲁内層影像轉移（壓膜及曝光内層影像顯影（内層則及内 層去膜）—内層沖孔—内層檢測—内層墨（棕）化—壓合— 外層影像轉移（壓膜及曝光）—外層影像㈣—電鐘厚銅— 電鍍純錫—外層去膜—外層钕刻―卜層剥錫—防焊印刷— 防焊曝光—防焊顯影烘烤—錄金手指—成型—測試—完成 等製程。 其中，在防焊印刷—防焊曝光—防焊顯影烘烤的製程， ©主要是基於外層線路完成後需再披覆絕緣的樹脂層來保護 線路’避免氧化及焊接短路。披覆塗裝前通常需先用刷磨、 微鱗方法將線路板銅面做適當的粗化清潔處理。而後以網 版印刷、簾塗、靜電喷塗...等方式將液態感光綠漆塗覆於板 面上，再預烘乾燥（乾膜感光綠漆則是以真空壓臈機將其壓 °披覆於板面上）。待其冷卻後，則以人工方式在該感光綠 漆上黏貼佈設線路的透明底片，再送入紫外線曝光機中曝 光’綠漆在底片透光區域受紫外線照射後會產生聚合反應 3 201034541 (該區域的綠漆在稍後的顯影步驟中將被保留下來），而受到 線路遮住的部位則在稍後的顯影步驟中以化學溶液將乾膜 感光綠漆上未受光照的區域顯影去除。最後再加以高溫烘烤 使綠漆中的樹酯完全硬化。 習知上由於在電路板外層感光綠漆上黏貼底片均以人 工作業，在黏貼之前還必須將底片與感光綠漆做精準的對 位’因此，十分耗費眼力與作業時間，工作效率一直無法進 ❹一步提昇。 【發明内容】 本發明的主要目的，在於解決習知製造印刷電路板時， 在將防焊底片貼附於外層感光綠漆時，完全以人力作業，以 致於工作效率無法進一步提昇的問題。201034541 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a device for automatically attaching a square to a circuit board. [Prior Art] The current printing and slab process consists essentially of 1 inner layer substrate - Lu Nei layer image transfer (film and exposed inner layer image development (inner layer and inner layer film removal) - inner layer punching - inner layer inspection - inner layer ink (Brown) - Pressing - Outer image transfer (film and exposure) - Outer image (4) - Electric bell thick copper - Electroplated pure tin - Outer film removal - Outer engraving - Bu layer stripping - Anti-weld printing - Anti-welding Exposure—anti-weld development baking—recording gold finger—forming—testing—completes the process. Among them, the process of solder-proof printing—anti-weld exposure—anti-weld development baking, © mainly based on the completion of the outer layer Insulating resin layer to protect the circuit 'avoid oxidation and welding short circuit. Before coating and coating, it is usually necessary to use the brush grinding and micro-scale method to make the copper surface of the circuit board be properly roughened and cleaned. Then screen printing, curtain Coating, electrostatic spraying, etc., the liquid photosensitive green paint is applied to the surface of the board, and then pre-baked and dried (the dry film photosensitive green paint is coated on the surface by a vacuum press) After it is cooled, it is artificial The method is to stick the transparent film of the laying line on the photosensitive green paint, and then send it to the ultraviolet exposure machine for exposure. The green paint will generate a polymerization reaction after being irradiated with ultraviolet rays in the transparent area of the film. 3 201034541 (The green paint of the area is developed later) The step will be retained, and the area covered by the line will be developed by removing the unexposed area of the dry film photosensitive green paint with a chemical solution in a later development step. Finally, the high temperature baking is performed to make the green paint. The resin in the tree is completely hardened. It is known that since the film is adhered to the photosensitive green paint on the outer layer of the circuit board, the film must be accurately aligned with the photosensitive green paint before the paste. Therefore, it is very labor-intensive and work-intensive. Time and work efficiency have not been further improved. SUMMARY OF THE INVENTION The main object of the present invention is to solve the conventional problem of manufacturing a printed circuit board, and when the solder resist film is attached to the outer layer photosensitive green paint, it is completely manpowered. As a result, work efficiency cannot be further improved.
本發明的舰是制機财料行自動化作業，使得從 提取防焊底片至與電路板進行對位放置的過程均避免使用 人力’從而達_業速度增快’精準度提高的效果。 本發明的技術手段，是在一機械手臂設置-基座，該基座下 相設置複數·元件與光賴組，得⑽由控繼機械手臂依 預疋的_移動，以利用該吸附元件吸取—防焊底片並移位至一 電路板上，織_該光學模組將所述防焊糾與電路板對位 後’再解除吸附元件對防蟬底片的吸力，使防辉底片放置於該電 路板上’最後再以人力利用膠帶將該防焊底片與電路板固定。 4 201034541 本發明對騎錢狀件的雛實闕，是提供-種真空吸 盤’該真空讀連接至_抽氣裝置，藉由抽吸空氣而使該吸盤產 生足以將防焊底片牢固吸住的吸力。 本發明對於所述絲模組的較佳實關，是湖—種電荷輕 〇 7G件(CCD，Charge-coupled Device)，其配備有鏡頭，得以攝 取電路板上之線路的影像，躺由設於麵手臂上的微電路對該 影像進行比對，在比對線路完全符合時為對位完成，即可將防焊 ❹底片放下’再採用人力作業方式利用膠帶將防焊底片黏固於電路 板。 本發明藉由自動化設備的機械手臂來取代人力健，將防焊 底片㈣於電路板，不僅可以減少人力成本，且能提昇工作效率， 更能減少人工疏失產生的錯誤。 【實施方式】 ❿ 以下配合圖式及元件魏對本發_實施方式做更詳細的說 明’俾使熟習該項技藝者在研讀本_#後能據以實施。 參第-圖，本發明提供的防焊底片自動貼附裝置，其較佳實 施例，係提供-機械手臂1，該機械手们具有—可以被控制垂直 往復移動、水平往復移動，甚至斜向往復移動的基座u，該基座 11可以是-種平板’也可岐任何—種形狀的座體，該機械手臂 的作動是由電腦控制，能依預定的程式設計其移動路徑；所述基 座11的下方設置有複數吸盤13與CCD(電輕合元件）12，該吸盤 5 201034541 與CCD 12在基座11下方的分佈，可以依防焊底片2上之線路 的佈局狀況而做最佳的佈設，並將每一吸盤13以管路連接至真空 抽氣設備（圖中未顯示），藉由真空抽氣設備抽取空氣時，在每一 吸盤13的下方形成負壓而產生吸力。 本發明的貼附裝置在貼附防谭底片時，是使機械手们依預 設的電腦程式被控制移動至放置防焊底片的區域吸取一防谭底片 2 ’然後將P方焊底片2輸送至電路板3的區域，讓防輝底片2對應 ©於電路板3上的感光綠漆31(參第二圖），再使防焊底片2下降接 近電路板3同時由CCD 12攝取電路板3上的影像，再將該影像傳 7至微電腦進行比對，比對的結果若與電腦内之資料庫所儲存的 f像不符合’職械手料自行浦基座u的賴，直到比對的 心像符合後即為對位完成，此時即可解除該吸盤13的吸力，使防 焊底片2放置於電路板3上，再由作業人員將膠帶4黏貼於防焊 =片2的各個角端或其他適當位置（參第三圖），讓防焊底片2固 ❿定於電路板3上，最後便可將機械手臂i移開（參第四圖），以待 下一階段之曝光的製程。 以上所述者僅為肋解釋本發明之較佳實施例，並非企圖具 、子本發月做任何形式上之限制，是以’凡有在相同之發明精神 下所作有關本發明之任何修飾或變更，皆仍應包括在本發明 保護之範疇。 _ 201034541 【圖式簡單說明】 第一圖為顯不本創作之機_絲 啊顿1乎臂尚未將防烊底片吸附之實施例立 吸附後，並移位至電 第二圖為顯示本創作之機械手臂將防焊底片 路板上方之實施例立體圖。 防焊底片放置於電路板 第三圖為顯示本創作之機械手臂將吸附的 上’並黏貼膠帶之實施例立體圖。The ship of the invention is an automated operation of the machine material, so that the process of extracting the solder mask to the alignment with the circuit board avoids the use of manpower to achieve an increase in accuracy. The technical means of the present invention is to provide a base on a mechanical arm, and a plurality of components and a light-receiving group are disposed under the base, and (10) is moved by the control robot according to the pre-twisting to absorb the adsorption component. - the solder mask is transferred to a circuit board, the optical module aligns the solder resist with the circuit board, and then desorbs the suction force of the adsorption element against the anti-tanning film, so that the anti-foil film is placed thereon. On the board, the solder mask is finally fixed to the board by tape. 4 201034541 The invention of the invention is to provide a vacuum chuck which is connected to the air extracting device and which is capable of sucking the air to make the suction cup firmly sucked by the suction air. suction. The preferred method for the wire module of the present invention is a lake-type charge-coupled device (CCD), which is equipped with a lens to capture images of the circuit on the circuit board. The microcircuit on the face arm compares the image, and when the alignment line is completely matched, the alignment is completed, and the solder mask can be put down. Then the tape is used to adhere the solder mask to the circuit by manual operation. board. The invention replaces the human health by the mechanical arm of the automatic device, and the solder mask (4) on the circuit board can not only reduce the labor cost, but also improve the work efficiency and reduce the error caused by the manual loss. [Embodiment] ❿ The following description of the present invention will be described in more detail with reference to the drawings and components, and the skilled person can implement it after studying the _#. Referring to the drawings, the solder mask automatic attaching device provided by the present invention, the preferred embodiment thereof, provides a mechanical arm 1 which can be controlled to vertically reciprocate, horizontally reciprocate, or even obliquely a reciprocating base u, the base 11 can be a flat plate or a seat of any shape, the operation of the robot arm is controlled by a computer, and the moving path can be designed according to a predetermined program; A plurality of suction cups 13 and a CCD (electrical light-combining element) 12 are disposed under the susceptor 11, and the distribution of the suction cups 5 201034541 and the CCD 12 under the susceptor 11 can be made most according to the layout of the lines on the solder mask 2 Preferably, each of the suction cups 13 is connected to a vacuum pumping device (not shown) by a pipe. When the air is sucked by the vacuum pumping device, a negative pressure is generated under each of the chucks 13 to generate suction. The attaching device of the present invention attaches the anti-tamper film to the robot to control the movement of the computer program to the area where the solder resist film is placed to absorb an anti-tap film 2' and then transport the P-square soldering film 2 To the area of the circuit board 3, the anti-corrosion film 2 is corresponding to the photosensitive green paint 31 on the circuit board 3 (refer to the second figure), and then the solder resist film 2 is lowered close to the circuit board 3 while the circuit board 3 is taken by the CCD 12. The image on the image is transmitted to the microcomputer for comparison. If the result of the comparison is not in accordance with the image stored in the database in the computer, it is not the same as the one used in the computer. After the image is matched, the alignment is completed. At this time, the suction force of the suction cup 13 can be released, and the solder mask 2 can be placed on the circuit board 3, and then the operator can stick the tape 4 to the corners of the solder mask=sheet 2. At the end or other suitable position (refer to the third figure), the solder mask 2 is fixed on the circuit board 3, and finally the arm i can be removed (refer to the fourth figure) for the next stage of exposure. Process. The above description is only for the ribs to explain the preferred embodiments of the present invention, and is not intended to be a limitation of any form of the invention, and any modification or modification relating to the present invention may be made in the spirit of the same invention. Changes are still to be included in the scope of protection of the present invention. _ 201034541 [Simple description of the diagram] The first picture shows the machine that is not created. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The mechanical arm will be a perspective view of the embodiment above the solder mask substrate. The solder mask is placed on the circuit board. The third figure is a perspective view showing an embodiment in which the robot arm of the present invention will be attached and adhered to the tape.
第四圖為顯示本創作之機械手臂解除斟 實施例立體圖。 防焊底片 的吸附並離開之The fourth figure is a perspective view showing an embodiment of the robot arm release of the present invention. Adsorption of the solder mask and leaving it
【主要元件符號說明】 1……機械手臂 11……基座 12……CCD ❹ 13......吸盤 2……防焊底片 3......電路板 31......感光綠漆 4……膠帶[Description of main component symbols] 1...... Robot arm 11... Base 12... CCD ❹ 13... Suction cup 2... Solder mask 3... Circuit board 31..... Photosensitive green paint 4... tape