201033618 … , 六、發明說明： ； 【發明所屬之技術領域】 本發明縣關-觀臂式酬朗，尤指—種具有錐形柱 體之之懸臂式探測針頭’使接觸待測元件之焊墊時，達到更佳 接觸與引導指示之效果，_於高鮮積體電路或其他電子元 件之量測使用。 【先前技術】 鲁 目前已知有多麵測探針展置總成，以供量測積體電路或 其他形式的微電子元件’其中代表性總成是使用電路卡，上側 形成長形導線痕跡，作為訊號和地線，卡上形成中央開孔，探 針尖附於開孔附近的各訊號痕跡末端，故呈現針尖朝下的徑向 延伸排列，以供與受職微電子元件之焊墊（Pad)選擇^連 接。 近來’電子·大量IG化，隨著產品魏戦、增多與 體積的縮小，1C腳數因而增多且增密，使得製程後之測試更 癱為困難’因此現今探針在結構設計上仍有以下不足的地方： 1、 現今探針A與焊墊之接觸面係設計為一矩形面或一端漸 細的圓柱形（如第卜la圖所示），若焊墊氧化形成氧化 層後，探針需大力刺穿氧化層而常會不慎破壞焊塾； 2、 矩形或圓柱形接觸面B之設計與焊墊之形狀幾近類似， 使得在量_’探針_面B與焊娜成平行之相對面， 導致使用者不容易準確域認探針A與焊塾是否對位成接 觸； / 3、 該矩形或圓柱形接觸面B在使用一段時間磨損後，細 3 201033618 面會產生變形，甚至探針A的接觸面B面積之變大，而 無法刺穿焊墊之氧化層以形成可靠的電性連結，而必須 汰換整個探針A。 、 【發’本發明人致力研發與改善，遂有本發明之產生。 、本發明之主要目的储供—麵觸剌元件之雜時，可 達到更佳接顺料指示之絲之Μ式探測針頭。 本發明之另—目的储供-觀針綱 維持接觸面之形狀與接觸面積之懸臂式探測針頭。 為達上述之目的，本㈣—麵臂式探_頭，包括至少 一探測針體，其具有—供祕接觸剌元件焊墊（Pad)之介 面部，該介面部係為-錐形柱體，其末端端面包括有一尖形區 域與峨域同树 端面==：====測針體 行接觸_。 予係呈角度之接觸，且由尖形區域先 後：為便於對本發明能有更深人的瞭解，歸—實施例詳述於 【實施方式】 實施=參圖，圖式内容為本發明懸臂式探測針頭之一 實施例，其包括一探測針體卜 辦頌之 該探測針體1具有— 之介面部U，偏於接觸制元件焊塾2⑽） 以” 411係為-錐形柱體，其末端端面11〇 4 201033618 ’ 包括有—尖形輯111及其延伸之—矩形區域112，且該尖形 : 區域111與矩形區域112同為設在介面部末端端面11〇之共平 面上’且介面部Η係呈一 (9角度之彎折。 …因此，如第3〜5圖所示，t本發曰月之探測針體工安裝在一 ^測裝置域探針構件上’使可活駐適當錄，供探測針體 之介面部11末端接觸待測元件(如晶圓）上個別組件之烊墊。 “而當接觸焊塾2時，探測針體1之介面部11末端端面110 • ，、料2嶋崎呈現—夾且由尖形區域先行接觸焊墊 如第3A圖所不）’當探測針體1輕微過壓（overdrive)焊 墊2日夺二探測針體i介面部u末端端面別之尖形區域⑴ 二、可先^人焊墊2之氧化層2卜*於尖形之料，使得可 —易破壞氧化層21 (如第3B圖所示），此時在增加過壓，本 =懸臂式探騎頭會產生形變使介面部u末端端面ιι〇與 表面趨近平行（如第3C圖所示），進而使矩形區域112 田^與乾淨的焊塾2大面積之接觸，提高量測之精度，同時使 *透過顯微鏡觀看作業時’透過探測針體（介面部U末端 ^之大腿域111之設計，可清楚判聰測針體1是否 ^ Γ焊墊2對位。此外’當探測針體1介面部11末端端面 複進行量測焊墊2而造成磨損時，其錐形柱體之設計， =端面11G依舊可鱗尖形區域m及其延伸之—矩形區域 丄1Z 〇 因此，本發明具有以下之優點： 1.本發明剌制之介神係為雜形柱體 ，且其末端端面 已有一尖形區域及其延伸之一矩形區域之設計概念，使得 5 201033618201033618 ... , VI. Description of the invention: [Technical field of the invention] The county-off-arm type of the invention, in particular, a cantilever type probe needle having a tapered cylinder makes the welding of the component to be tested When the pad is used, the effect of better contact and guiding instructions is achieved, and the measurement is performed on a high-precision integrated circuit or other electronic components. [Prior Art] Lu is currently known to have a multi-faceted probe spread assembly for measuring integrated circuits or other forms of microelectronic components. The representative assembly is a circuit card, and the upper side forms a long wire trace. As the signal and the ground line, the central opening is formed on the card, and the probe tip is attached to the end of each signal trace near the opening, so that the radial extension of the needle tip is downwardly arranged for the pad of the microelectronic component. (Pad) Select ^Connect. Recently, 'electronics and a large number of IGs, with the increase in product size, increase and volume, the number of 1C feet has increased and densified, making the test after the process more difficult. Therefore, the current probes still have the following structural design. Insufficient places: 1. The contact surface between probe A and the pad is designed as a rectangular surface or a tapered one end (as shown in Fig. 1a). If the pad is oxidized to form an oxide layer, the probe Need to puncture the oxide layer and often inadvertently destroy the soldering iron; 2. The design of the rectangular or cylindrical contact surface B is similar to the shape of the solder pad, so that the amount _'probe_face B is parallel with the solder On the opposite side, it is not easy for the user to accurately identify whether the probe A and the welding splicing are in contact with each other; / 3. After the rectangular or cylindrical contact surface B is worn for a period of time, the surface of the thin 3 201033618 will be deformed, even The area of the contact surface B of the probe A becomes large, and the oxide layer of the pad cannot be pierced to form a reliable electrical connection, and the entire probe A must be replaced. The present inventors are committed to research and development and improvement, and have produced the present invention. In the case of the main purpose of the present invention, the storage of the surface-touching component can achieve a better detection of the needle of the wire. Another object of the present invention is a cantilever probe that maintains the shape and contact area of the contact surface. In order to achieve the above purpose, the present invention includes at least one detecting needle body having a face portion for a contact element assembly pad (Pad), the face portion being a cone-shaped cylinder The end face end includes a pointed area and the same end face of the = field ==:==== stylus body contact _. The angle is in contact with the angled area, and the pointed area is successively: in order to facilitate a deeper understanding of the present invention, the embodiment is described in detail in the [implementation] implementation = reference picture, the content of the figure is the cantilever type detection of the present invention An embodiment of the needle includes a probe body 1 having a face portion U, which is biased to the contact member pad 2 (10). The 411 system is a tapered cylinder having an end. The end face 11〇4 201033618 'includes a pointed array 111 and its extended rectangular region 112, and the pointed shape: the region 111 and the rectangular region 112 are disposed on the coplanar plane of the end face end face 11〇' and the interface The shackles are one (9-point bend. ... Therefore, as shown in Figures 3 to 5, the probe body of the hairpin is mounted on a probe member of the measuring device field to make it viable Appropriately recorded, the end of the face portion 11 of the probe body contacts the pad of the individual components on the component to be tested (such as a wafer). "When the pad 2 is contacted, the end face 110 of the face portion 11 of the probe body 1 is detected. , material 2 Sakizaki presents - clip and the contact area is contacted by the pointed area first as shown in Figure 3A ) 'When the probe body 1 is slightly over-pressed (overdrive), the soldering pad is 2 days. The probe body is exposed to the tip end of the u-end face of the needle. (1) 2. The oxide layer of the solder pad 2 can be used first. The pointed material makes it easy to damage the oxide layer 21 (as shown in Fig. 3B). At this time, the overpressure is increased, and the cantilever type of the probe head is deformed to make the end face of the face u 末端 〇 〇 Nearly parallel (as shown in Fig. 3C), the rectangular area 112 is contacted with a large area of the clean soldering iron 2 to improve the accuracy of the measurement, and at the same time enable the transmission of the needle through the microscope. The design of the thigh field 111 of the U-end ^ can clearly determine whether the stylus body 1 is aligning with the pad 2. In addition, when the end face of the probe body 1 is measured, the pad 2 is measured to cause wear. At the same time, the design of the tapered cylinder, the end face 11G is still the scale-like region m and its extension - the rectangular region 丄 1Z 〇 Therefore, the present invention has the following advantages: 1. The invention is made by the invention. a stud cylinder with a pointed end surface and a rectangular area extending Concept, such 5201033618
在與焊墊接觸時可透過尖形區域來破壞焊墊之氧化層，達到 糊與乾、淨的焊藝鞠之目的，除可提高接觸後量測之精度 外更可降低習用探針需大力刺穿而導致焊墊破壞之風險。 2·，發明探測針體介面部末端端面設有尖形區域，使得進行測 里時’方便使用者觀看探測針體是否正確與焊墊對位，非常 方便。 本發月探測針體介面部係設為錐形柱體’即使末端端面久用 磨損後’末端端面依舊可保持尖形區域及其延伸之一矩形區 域’使延長探測針體使用之壽命。 、所t乃疋本發明之具體實施例及所運用之技術手 縣物_餅可触料出料_更與修正， 二月金構想所作之等效改變’其所產生之作用仍未超出 =圖=斤涵蓋之實質精神時，均應視為在本發明之技術 乾臀之内，合先陳明。 依上文所揭示之内容，本發a树可達到發明 之預期目 =提供-種使接觸待測元件之焊墊時’達到更佳接觸與引 值^之^_式探_，具有絲與實用之價 t、'、疑’爰依法提出發明專利申請。 【圖式簡單說明】 第1圖係為習用探針之立體外觀示意圖。 第2A圖係為習用探針供與烊塾接觸之接觸 =圖係為本發明實施例探測針體之立體外觀示意圖圖。 圖係為本發明實施例探測針體介面部末端端面之剖視 6 201033618 帛3圖係為本發明實施例探測針體i隹卜 a ㈣知'量_之個狀態示 - 忍圖。 -帛3A _為本發明實關糊針_備量_之狀態示意 圖。 第犯圖係為本發明實施例量夠時探測針體央形區域刺綠 化層之狀態示意圖。 第3C圖係為本發明實施例探娜針體與乾淨的焊塾接觸時之 φ 狀態示意圖。 第4圖係為本發明實施例探測針體量測後之狀態示意圖。 第5圖係為本發明實施例_針體量測後之狀態放大示意 圖。 【主要元件符號說明】 1 ·探測針體 11 ··介面部 110 :末端端面 • 111 :尖形區域 112 :矩形區域 2 :焊墊 21 :氧化層 A :探針 B :接觸面 7When in contact with the pad, the oxide layer of the pad can be broken through the pointed region to achieve the purpose of paste and dry and clean soldering. In addition to improving the accuracy of measurement after contact, the probe can be reduced. The risk of piercing and causing damage to the pad. 2. Invented probe body The tip end face of the face is provided with a pointed area, which makes it convenient for the user to observe whether the probe body is correctly aligned with the pad. The present invention detects that the needle body is set to a tapered cylinder. Even if the end face is worn for a long time, the end face can still maintain the pointed region and a rectangular region extending therefrom to extend the life of the probe body. Specifically, the specific embodiment of the present invention and the technique used in the hand-made material_cake touchable discharge_more and revised, the equivalent change made by the February gold concept's effect has not exceeded Figure = the physical spirit of the cover, should be considered within the technical dry hip of the present invention, together with Chen Ming. According to the above disclosure, the tree of the present invention can achieve the intended purpose of the invention. If the contact pad of the component to be tested is contacted, it can achieve a better contact and value. The practical price t, ', doubt' 爰 filed an invention patent application according to law. [Simple description of the drawing] Fig. 1 is a schematic view of the stereoscopic appearance of a conventional probe. Figure 2A is a conventional probe for contact with the = contact. Fig. 2 is a schematic view showing the stereoscopic appearance of the probe body in the embodiment of the present invention. The figure is a cross-sectional view of the end face of the probe body of the embodiment of the present invention. 6 201033618 The figure 3 is a probe for detecting the needle body in the embodiment of the present invention. - 帛 3A _ is a state diagram of the actual 糊 糊 _ _ _ _ _ The first map is a schematic diagram showing the state of detecting the green layer of the central portion of the needle body when the amount of the embodiment is sufficient. Fig. 3C is a schematic view showing the state of φ when the needle body is in contact with a clean soldering iron in the embodiment of the present invention. Fig. 4 is a schematic view showing the state of the probe body after the measurement of the embodiment of the present invention. Fig. 5 is an enlarged schematic view showing the state after the measurement of the needle body in the embodiment of the present invention. [Explanation of main component symbols] 1 · Probe body 11 ··Intermediate face 110 : End face • 111 : Pointed area 112 : Rectangular area 2 : Pad 21 : Oxide layer A : Probe B : Contact surface 7