201032193 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種顯示面板及其製作方法，且特別是有 關於一種可撓性顯示面板及其製作方法。 【先前技術】 • 請參考圖1 ’其繪示習知之一種可撓性顯示面板的剖面示 意圖。習知之可撓性顯示面板100包括一可撓性顯示模組 (flexible display module) 110、多個可撓性電路板（f|exible circuit board) 120與多個驅動裝置（driver) 130。可撓性顯示 ❹ 模組110包括一可換性基板（flexible substrate ) 111、一第一 電路層（circuit layer) 112、一 電泳層（electr〇ph〇retic layer) 113、一第二電路層 114 與一絕緣附著層（insuiati〇I1 attachment layer) 115 。 可挽性基板111具有被此相對之*-第一表面111a與·一第 二表面11 lb。絕緣附著層115配置於可挽性基板111之第一 表面111a上。第一電路層112配置於絕緣附著層115上，且 第一電路層112具有一可視區（view area) 112a與一周邊電路 ❿ 區（peripheral circuit area) 112b。第一電路層112包括多個陣 列排列之畫素電極（pixel electrode) 112c與多個分別對應這 些畫素電極112c之薄膜電晶體（thin film transistor，TFT)(未 繪示）。這些畫素電極112c與薄膜電晶體位於可視區112a内。 此外，這些薄膜電晶體可藉由絕緣附著層115而附著於可撓性 基板111上。 電泳層113配置於第一電路層112上且對應於可視區 112a。電泳層113具有多個微膠囊（microcapsule) 113a與填 充於各個微膠囊113a内的電泳流體（electrophoretic fluid) 113b。各個微膠囊113a内的電泳流體113b包括一絕緣溶劑 4 201032193 (dielectric solvent) 113c 與多個電泳粒子（electrophoretic particle) 113d。各個微膠囊113a的這些電泳粒子ii3d散佈 (disperse)於對應之絕緣溶劑113c内。 第二電路層114配置於電泳層113上，第二電路層114為 一透光導電薄膜（transparent conductive thin film )，其材質為 銦錫氧化物（Indium-Tin-Oxide，ITO)。換言之，第二電路層 114 為一共用 ΙΤΟ 電極（common ΙΤΟ electrode)。這些可撓 性電路板120藉由一第一異方向性導電膜（anisotropic ©conductive film ’ ACF) A1而電性連接至周邊電路區U2b。這 些驅動裝置130為一積體電路晶片（integrated circuit chip，1C chip) ’其藉由一第二異方向性導電膜A2而電性連接至周邊 電路區112b。 然而，由於可撓性基板111的厚度tl較薄，其厚度tl通 常介於0至20微米（micrometer)之間，所以當可撓性基板 111之第二表面111b承受一壓力F1時，第一電路層112容易 產生損壞。 【發明内容】 〇 本發明提供一種可撓性顯示面板，其具有一固化保護層 (cured protection layer )以保護其内部電路。 本發明提供一種可撓性顯示面板的製作方法，其形成一固 化保護層以保護可撓性顯示面板的内部電路。 本發明提出一種可撓性顯示面板，包括一可撓性顯示模組 與一固化保護層。可撓性顯示模組包括一可撓性基板、一第一 電路層、一顯示層（display layer)與一第二電路層。可撓性 基板具有彼此相對之一第一表面與一第二表面。第一電路層配 置於第一表面上且具有一可視區。顯示層配置於該第一電路層 201032193 上且對應於該可視區。第二電路層配置於該顯示層上。固化保 護層配置於第二表面上。 在本發明之一實施例中，上述之固化保護層的材質為紫外 線固化膠（ultraviolet cured adhesive)或熱固化膠（heatcured adhesive) ° 在本發明之一實施例中’上述之固化保護層的厚度介於〇 至 0.2 毫米（millimeter)之間。 在本發明之一實施例中’上述之可撓性基板的厚度介於〇 至20微米之間。 〇 在本發明之一實施例中，上述之可撓性基板的材質為聚亞 醯胺（polyimide，PI)。 本發明提出一種可撓性顯示面板的製作方法，包括下列步 驟。首先’提供一支樓基板（supporting substrate)。接著， 形成一可挽性顧示模組於該支樓基板上。該可挽性顯示模纟且包 括一可撓性基板、一第一電路層、一顯示層與一第二電路層。 可撓性基板配置於該支撐基板上且具有彼此相對之一第—表 面與一第二表面。該第二表面面向該支撐基板。第一電路層配 © 置於該第一表面上且具有一可視區。顯示層配置於該第一電路 層上且對應於該可視區。第二電路層配置於該顯示層上。接 著，移除該支撐基板。之後，形成一保護材料層於該第二表面 上。保護材料層為一謬狀體。然後，固化該保護材料層以形成 一固化保護層。 在本發明之一實施例中，上述之固化保護材料層的方式為 照射養外線於保護材料層或加熱於保護材料層。 在本發明之一實施例中，上述之固化保護層的厚度介於〇 至0.2毫米之間。 201032193 在本發明之一實施例中，上述之可撓性基板的厚度介於〇 至20微米之間。 在本發明之一實施例中，形成保護材料層於第二表面上的 方式為塗佈（coating )、喷佈（spraying )或網印（screen printing) 〇 由於固化保護層配置於可撓性基板的第二表面上，所以固 化保護層可保護可撓性基板的第二表面。因此，當一麗力作用 於固化保護層時，可撓性顯示模組的第一電路層不易產生損 0 壞。換&之，本發明之實施例之可撓性顯示面板的内部電路受 到固化保護層的保護。 為讓本發明之實施例的上述特徵和優點能更明顯易僅，下 文特舉實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 清參考圖2，其繪示本發明一實施例之一種可撓性顯示面 板的剖面示意圖。本實施例之可撓性顯示面板2〇〇包括一可撓 性顯示模組210、多個可撓性電路板220 (圖2示意地繪示一 個）、多個驅動裝置230 (圖2示意地繪示一個）與一固化保 ❹ 護層240。可撓性顯示模組21〇包括一可撓性基板211、一第 —電路層212、一顯示層213、一第二電路層214與一絕緣附 著層215。 可撓性基板211具有彼此相對之一第一表面21ia與一第 二表面211b。可撓性基板211的材質為聚亞醯胺，其厚度t2 介於0至20微米。絕緣附著層215配置於可撓性基板211的 第一表面上211a。第一電路層212配置於絕緣附著層215上， 且第一電路層212具有一可視區212a與一周邊電路區212b。 第一電路層212包括多個陣列排列之畫素電極212c與多個分 201032193 別對應這些晝素電極212c之薄膜電晶體（未緣示）。這些晝 素電極212c與薄膜電晶體位於可視區2i2a内。此外，這些薄 膜電晶體可藉由絕緣附著層215而附著於可撓性基板211上。 顯示層213例如為一電泳層，其配置於第一電路層212上 且對應於可視區212a。例如為電泳層之顯示層213具有多個 微膠囊213a與填充於各個微膠囊213a内的一電泳流體2nb。 各個微膠囊213a内的電泳流體213b包括一絕緣溶劑213c與 多個電泳粒子213d。各個微膠囊213a的這些電泳粒子213d ❹散佈於對應之絕緣溶劑213c内。在本實施例中，各個微膠囊 213a的這些電泳粒子213d可為黑色電泳粒子與白色電泳粒子 的組合。此外，本實施例之這些微膠囊213a的結構可以多個 微杯（miCr0Cup)的結構而加以替代，本發明於此不做任何限 定。 第二電路層214配置於顯示層213上，第二電路層214為 透光導電薄膜，其材質為鋼錫氧化物。換言之，第二電路^ 214為一共用ITO電極。在另一實施例中，第一電路層212在 可視區212a内可包括多個平行排列之][T〇電極，第二電路層 ❹ 214可包括多個平行排列之IT〇電極，且第一電路層212之這 些ιτο電極的排列方向垂直於第二電路層214之這些ΙΤ〇電 極的排列方向，但是並未以圖面繪示。 這些可撓性電路板220藉由一第一異方向性導電膜而 電性連接至周邊電路區212b。這些驅動裝置230為積體電路 晶片’其藉由一第二異方向性導電膜A4而電性連接至周邊電 路區212b。在此必須說明的是，在另一實施例中，這些驅動 裝置230可依設計者的需求而分別配置於這些可撓性電路板 220 上。 8 201032193 固化保240配置於可撓性基板2U的第二表面2Ub 上。固的材質為紫外_轉或熱固化膠，_ 化保護層介於ua2毫米之間。由於 ‘ 240配置於可撓性基板211的第二表面㈣上 = 護層可保護可撓性基板211的第二表面2m。因此，= 一壓力F2作用於固化保護層24〇日夺，第一電 ^ 生損壞。 勿度 當，實施例之可撓性顯示面板2〇〇運作時，第一電路 ❹212與第二電路層214於各個微膠囊2m產生不同的電場。 此時’各個微膠囊213a内的部分這些電泳粒子迎會移動至 第二電路層2)4，進而顯示某種資訊。因此，使用者可由圖2 所示之觀視方向m觀看可撓性顯示面板厕之可撓性顯 組210以判讀所顯示的資訊。 供 以下對於本實施例之可撓性顯示面板細的製作方 說明。請參考圖3A至圖3F，其纷示製作圖2之可挽性顯示面 板的不意圖。首先，請參考圖3A，提供一支撲基板s卜其材 質例如為玻璃。接著，請參考圖3B，形成-可撓性顯示模組 210於支樓基板si上’且可撓性顯示模组之可挽性基板 211配置於支撐基板S1上。可撓性基板211的第二表面21比 面向支撐基板S1。 接著，請參考3C，藉由第一異方向性導電膜A3，將這些 可撓性電路板220熱壓合至周邊電路區212b，以電性連接各 個可撓性電路板220與周邊電路區212b。接著，藉由第二異 方向性導電膜A4，將這些驅動裝置23〇熱壓合至周邊電路區 \12b，以電性連接各個驅動裝置230與周邊電路區212b。接 著，請參考圖3C與圖3D，移除支撐基板S卜 201032193 之後’請參考圖3E，形成一保護材料層240’於可撓性基 板211的第二表面211b上。此時，保護材料層240’為一膠狀 體。在本實施例中，形成保護材料層240,於可撓性基板211 的第二表面211b上的方式可為塗佈、喷佈或網印。 然後’請參考圖3E與圖3F，固化保護材料層240’以形成 固化保護層240。至此’本實施例之可撓性顯示面板200得以 製作完成。在此必須說明的是，若保護材料層240,的材質為紫 外線固化膠，則上述固化保護材料層240，的方式是以紫外線照 0 射保護材料層240’。若保護材料層240’的材質為熱固化膠， 則上述固化保護材料層240’的方式是對於保護材料層240,加 熱。 由於保護材料層240’是膠狀體，所以在形成保護材料層 240於可挽性基板211的第二表面2llb上時，可挽性基板211 的第二表面211b所承受的壓力得以控制於可撓性基板211可 承受的範圍内。此外，本實施例之形成保護材料層24〇’於可撓 性基板211的第二表面211b上的方式可為塗佈、喷佈或網印， 所以在形成保護材料層240,於可撓性基板211的第二表面 ❹ 21 lb上時，可撓性基板211的第二表面21 lb所承受的壓力亦 可控制於可撓性基板211可承受的範圍内。 綜上所述’本發明之實施例的可撓性顯示面板及其製作方 法至少具有以下其中之一或其他優點： ' 一、由於固化保護層配置於可撓性基板的第二表面上， 以固化保護層可保護可撓性基板的第二表面。因此，當一壓力 作用於固化保護層時，可撓性顯示模組的第一電路層二易產生 損壞。換言之，本發明之實施例之可撓性顯示面板的内 受到固化保護層的保護。 201032193 ㈣二”材料層是膠狀體，所以在形成保護材料層於 ^撓，基板的弟二表面上時，可撓性基板的第二表面所承受的 壓力得以控制於可撓性基板可承受的範圍内。 三、由於保護材料層可藉由塗佈、噴佈或網印的方式而形 成，所以可撓性基板的第二表面所承受的壓力亦可控制於可撓 性基板可承受的範圍内。201032193 VI. Description of the Invention: [Technical Field] The present invention relates to a display panel and a method of fabricating the same, and more particularly to a flexible display panel and a method of fabricating the same. [Prior Art] • Please refer to Fig. 1' for a schematic cross-sectional view of a conventional flexible display panel. The conventional flexible display panel 100 includes a flexible display module 110, a plurality of flexible circuit boards 120 and a plurality of drivers 130. The flexible display module 110 includes a flexible substrate 111, a first circuit layer 112, an electrophoretic layer 113, and a second circuit layer 114. With an insulating layer (insuiati〇I1 attachment layer) 115. The slidable substrate 111 has a *-first surface 111a and a second surface 11 lb opposite thereto. The insulating adhesion layer 115 is disposed on the first surface 111a of the slidable substrate 111. The first circuit layer 112 is disposed on the insulating adhesion layer 115, and the first circuit layer 112 has a view area 112a and a peripheral circuit area 112b. The first circuit layer 112 includes a plurality of arrayed pixel electrodes 112c and a plurality of thin film transistors (TFTs) corresponding to the pixel electrodes 112c (not shown). These pixel electrodes 112c and the thin film transistor are located in the visible region 112a. Further, these thin film transistors can be attached to the flexible substrate 111 by the insulating adhesion layer 115. The electrophoretic layer 113 is disposed on the first circuit layer 112 and corresponds to the visible region 112a. The electrophoretic layer 113 has a plurality of microcapsules 113a and an electrophoretic fluid 113b filled in the respective microcapsules 113a. The electrophoretic fluid 113b in each of the microcapsules 113a includes an insulating solvent 4 201032193 (dielectric solvent) 113c and a plurality of electrophoretic particles 113d. These electrophoretic particles ii3d of the respective microcapsules 113a are dispersed in the corresponding insulating solvent 113c. The second circuit layer 114 is disposed on the electrophoretic layer 113. The second circuit layer 114 is a transparent conductive thin film made of Indium-Tin-Oxide (ITO). In other words, the second circuit layer 114 is a common ΙΤΟ electrode. The flexible circuit board 120 is electrically connected to the peripheral circuit area U2b by a first anisotropic conductive film (ACF) A1. The driving device 130 is an integrated circuit chip (1C chip) which is electrically connected to the peripheral circuit region 112b by a second anisotropic conductive film A2. However, since the thickness tl of the flexible substrate 111 is thin, the thickness t1 is usually between 0 and 20 micrometers, so when the second surface 111b of the flexible substrate 111 is subjected to a pressure F1, the first The circuit layer 112 is susceptible to damage. SUMMARY OF THE INVENTION The present invention provides a flexible display panel having a cured protection layer to protect its internal circuitry. The present invention provides a method of fabricating a flexible display panel that forms a cured protective layer to protect internal circuitry of the flexible display panel. The present invention provides a flexible display panel comprising a flexible display module and a cured protective layer. The flexible display module includes a flexible substrate, a first circuit layer, a display layer and a second circuit layer. The flexible substrate has a first surface and a second surface opposite to each other. The first circuit layer is disposed on the first surface and has a viewing area. The display layer is disposed on the first circuit layer 201032193 and corresponds to the visible area. The second circuit layer is disposed on the display layer. The cured protective layer is disposed on the second surface. In one embodiment of the present invention, the cured protective layer is made of an ultraviolet cured adhesive or a heat cured adhesive. In one embodiment of the present invention, the thickness of the cured protective layer is Between 〇 to 0.2 mm (millimeter). In one embodiment of the invention, the thickness of the flexible substrate described above is between 〇 and 20 microns. In one embodiment of the invention, the material of the flexible substrate is polyimide (PI). The present invention provides a method of fabricating a flexible display panel comprising the following steps. First, provide a supporting substrate. Next, a redistributable module is formed on the support substrate. The pullable display module includes a flexible substrate, a first circuit layer, a display layer and a second circuit layer. The flexible substrate is disposed on the support substrate and has a first surface and a second surface opposite to each other. The second surface faces the support substrate. The first circuit layer is disposed on the first surface and has a visible area. A display layer is disposed on the first circuit layer and corresponds to the visible area. The second circuit layer is disposed on the display layer. Next, the support substrate is removed. Thereafter, a layer of protective material is formed on the second surface. The layer of protective material is a braid. Then, the protective material layer is cured to form a cured protective layer. In an embodiment of the invention, the layer of the protective material layer is cured by irradiating the external line to the protective material layer or heating to the protective material layer. In one embodiment of the invention, the cured protective layer has a thickness of between 〇 and 0.2 mm. 201032193 In one embodiment of the invention, the flexible substrate described above has a thickness between 〇 and 20 microns. In an embodiment of the invention, the protective material layer is formed on the second surface by coating, spraying or screen printing, and the cured protective layer is disposed on the flexible substrate. On the second surface, the cured protective layer protects the second surface of the flexible substrate. Therefore, when a Lili acts on the cured protective layer, the first circuit layer of the flexible display module is less likely to cause damage. In other words, the internal circuit of the flexible display panel of the embodiment of the present invention is protected by a cured protective layer. The above features and advantages of the embodiments of the present invention will become more apparent and obvious. [Embodiment] Referring to Figure 2, there is shown a cross-sectional view of a flexible display panel in accordance with one embodiment of the present invention. The flexible display panel 2 of the present embodiment includes a flexible display module 210, a plurality of flexible circuit boards 220 (shown schematically in FIG. 2), and a plurality of driving devices 230 (FIG. 2 schematically One is shown) and a cured protective layer 240. The flexible display module 21 includes a flexible substrate 211, a first circuit layer 212, a display layer 213, a second circuit layer 214, and an insulating attachment layer 215. The flexible substrate 211 has a first surface 21ia and a second surface 211b opposite to each other. The flexible substrate 211 is made of polyamidene and has a thickness t2 of 0 to 20 μm. The insulating adhesion layer 215 is disposed on the first surface 211a of the flexible substrate 211. The first circuit layer 212 is disposed on the insulating adhesion layer 215, and the first circuit layer 212 has a visible region 212a and a peripheral circuit region 212b. The first circuit layer 212 includes a plurality of array-arranged pixel electrodes 212c and a plurality of thin film transistors (not shown) corresponding to the plurality of sub-electrodes 212c. These pixel electrodes 212c and the thin film transistor are located in the visible region 2i2a. Further, these thin film transistors can be attached to the flexible substrate 211 by the insulating adhesion layer 215. The display layer 213 is, for example, an electrophoretic layer disposed on the first circuit layer 212 and corresponding to the visible region 212a. The display layer 213, which is, for example, an electrophoretic layer, has a plurality of microcapsules 213a and an electrophoresis fluid 2nb filled in each of the microcapsules 213a. The electrophoresis fluid 213b in each of the microcapsules 213a includes an insulating solvent 213c and a plurality of electrophoretic particles 213d. These electrophoretic particles 213d of the respective microcapsules 213a are dispersed in the corresponding insulating solvent 213c. In the present embodiment, the electrophoretic particles 213d of the respective microcapsules 213a may be a combination of black electrophoretic particles and white electrophoretic particles. Further, the structure of the microcapsules 213a of the present embodiment may be replaced by a plurality of microcups (miCr0Cup), and the present invention is not limited thereto. The second circuit layer 214 is disposed on the display layer 213, and the second circuit layer 214 is a light-transmitting conductive film made of steel tin oxide. In other words, the second circuit 214 is a common ITO electrode. In another embodiment, the first circuit layer 212 may include a plurality of [T〇 electrodes arranged in parallel in the visible region 212a, and the second circuit layer 214 may include a plurality of IT electrodes arranged in parallel, and the first The arrangement direction of the electrodes of the circuit layer 212 is perpendicular to the arrangement direction of the germanium electrodes of the second circuit layer 214, but is not shown in the drawing. The flexible circuit boards 220 are electrically connected to the peripheral circuit region 212b by a first anisotropic conductive film. These driving devices 230 are integrated circuit wafers which are electrically connected to the peripheral circuit region 212b by a second anisotropic conductive film A4. It should be noted that in another embodiment, the driving devices 230 can be respectively disposed on the flexible circuit boards 220 according to the needs of the designer. 8 201032193 The curing fuse 240 is disposed on the second surface 2Ub of the flexible substrate 2U. The solid material is UV-transfer or heat-curing adhesive, and the _ protective layer is between ua2 mm. Since the '240 is disposed on the second surface (four) of the flexible substrate 211, the cover layer can protect the second surface 2m of the flexible substrate 211. Therefore, = a pressure F2 acts on the cured protective layer 24 for a long time, and the first electrical damage is caused. When the flexible display panel 2 of the embodiment is in operation, the first circuit 212 and the second circuit layer 214 generate different electric fields in the respective microcapsules 2m. At this time, a part of these electrophoretic particles in the respective microcapsules 213a are moved to the second circuit layer 2) 4 to display some information. Therefore, the user can view the flexible display panel 210 of the flexible display panel toilet in the viewing direction m shown in Fig. 2 to interpret the displayed information. The following is a description of the fabrication of the flexible display panel of the present embodiment. Referring to Figures 3A through 3F, there is no intention to make the pullable display panel of Figure 2. First, referring to Fig. 3A, a substrate is provided, such as glass. Next, referring to FIG. 3B, the flexible display module 210 is formed on the support substrate si and the flexible substrate 211 of the flexible display module is disposed on the support substrate S1. The second surface 21 of the flexible substrate 211 faces the support substrate S1. Then, referring to FIG. 3C, the flexible circuit boards 220 are thermally bonded to the peripheral circuit region 212b by the first isotropic conductive film A3 to electrically connect the flexible circuit boards 220 and the peripheral circuit regions 212b. . Then, the driving devices 23 are thermally bonded to the peripheral circuit region \12b by the second isotropic conductive film A4 to electrically connect the respective driving devices 230 and the peripheral circuit regions 212b. Next, referring to FIG. 3C and FIG. 3D, after the support substrate Sb 201032193 is removed, please refer to FIG. 3E to form a protective material layer 240' on the second surface 211b of the flexible substrate 211. At this time, the protective material layer 240' is a gel. In this embodiment, the protective material layer 240 is formed on the second surface 211b of the flexible substrate 211 by coating, spraying or screen printing. Then, referring to Figures 3E and 3F, the protective material layer 240' is cured to form a cured protective layer 240. Up to this point, the flexible display panel 200 of the present embodiment is completed. It should be noted here that if the protective material layer 240 is made of a UV curable adhesive, the protective protective material layer 240 is cured by ultraviolet radiation. If the material of the protective material layer 240' is a thermosetting adhesive, the above-described method of curing the protective material layer 240' is to heat the protective material layer 240. Since the protective material layer 240' is a gel, when the protective material layer 240 is formed on the second surface 211b of the slidable substrate 211, the pressure on the second surface 211b of the slidable substrate 211 can be controlled. The flexible substrate 211 can withstand the range. In addition, the manner of forming the protective material layer 24'' on the second surface 211b of the flexible substrate 211 in this embodiment may be coating, spraying or screen printing, so the protective material layer 240 is formed to be flexible. When the second surface 21 lb of the substrate 211 is applied, the pressure applied to the second surface 21 lb of the flexible substrate 211 can also be controlled within a range that the flexible substrate 211 can withstand. The flexible display panel of the embodiment of the present invention and the manufacturing method thereof have at least one of the following or other advantages: 1. Since the cured protective layer is disposed on the second surface of the flexible substrate, The cured protective layer protects the second surface of the flexible substrate. Therefore, when a pressure acts on the cured protective layer, the first circuit layer 2 of the flexible display module is liable to be damaged. In other words, the inside of the flexible display panel of the embodiment of the present invention is protected by the cured protective layer. 201032193 (4) The second material layer is a gel, so when the protective material layer is formed on the surface of the substrate, the pressure on the second surface of the flexible substrate can be controlled by the flexible substrate. 3. Since the protective material layer can be formed by coating, spraying or screen printing, the pressure on the second surface of the flexible substrate can also be controlled by the flexible substrate. Within the scope.
雖然本發明已以實施例揭露如上，然其並非用以限定本發 明，任何熟習此技藝者，在不脫離本發明之精神和範圍内，當 可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申 請專利範圍所界定者為準。 【圖式簡單說明】 圖1繪示習知之一種可撓性顯示面板的剖面示意圖。 圖2繪示本發明一實施例之一種可撓性顯示面板的剖面 示意圖。 圖3A至圖3F繪示製作圖2之可撓性顯示面板的示意圖。 【主要元件符號說明】 100、200 :可撓性顯示面板 110、 210 :可撓性顯示模組 111、 211 :可撓性基板 111a、111b、211a、211b :表面 112、 114、212、214 :電路層 112a、212a :可視區 112b、212b :周邊電路區 112c、212c :畫素電極 113 :電泳層 113a、213a :微膠囊 11 201032193 113b、213b :電泳流體 113c、213c :絕緣溶劑 113d、213d :電泳粒子 115、215 :絕緣附著層 120、220 :可撓性電路板 130、230 :驅動裝置 213 :顯示層 240 :固化保護層 240’ ：保護材料層Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a conventional flexible display panel. 2 is a cross-sectional view showing a flexible display panel according to an embodiment of the present invention. 3A to 3F are schematic views showing the fabrication of the flexible display panel of FIG. 2. [Description of Main Component Symbols] 100, 200: Flexible Display Panels 110, 210: Flexible Display Modules 111, 211: Flexible Substrates 111a, 111b, 211a, 211b: Surfaces 112, 114, 212, 214: Circuit layers 112a, 212a: visible regions 112b, 212b: peripheral circuit regions 112c, 212c: pixel electrodes 113: electrophoretic layers 113a, 213a: microcapsules 11 201032193 113b, 213b: electrophoretic fluids 113c, 213c: insulating solvents 113d, 213d: Electrophoretic particles 115, 215: insulating adhesion layers 120, 220: flexible circuit boards 130, 230: driving device 213: display layer 240: cured protective layer 240': protective material layer
Al、A2、A3、A4 :異方向性導電膜 D1 :觀視方向 FI、F2 :壓力 S1 :支撐基板 tl、t2、t3 :厚度Al, A2, A3, A4: anisotropic conductive film D1: viewing direction FI, F2: pressure S1: supporting substrate tl, t2, t3: thickness
1212