201030279 . 六、發明說明： 【發明所屬之技術領域】 本發明有關於一種LED燈具結構，尤指一種可將LED所產 生之高溫導出，以消除因過熱造成LED之發光功率下降之燈具 結構。 【先前技術】 按，光源在曰常生活中是相當重要之環節，不論是在建築物 ©内外必需藉由光源才能進行照明，然而，一般常見之光源則是以 曰光燈管為主，為了使光線得到良好的散射效果，通常會將該燈 具安裝在較高位置（如天花板），由於，日光燈管的發光原理是利 用氣體放電，藉由日光燈管内的電子加速運動，經由密閉在管内 的氣體產生紫外線，再透過玻璃上塗佈的螢光粉而發光，因此， 曰光燈往往在使用約6000個小時後，日光燈管内的水銀已被管 壁吸收殆盡，因而導致日光燈管喪失順利放電的能力，而令燈管 _ 有燒毁的現象產生，因此，需使用樓梯將毀壞之燈管拆卸更換， 相當不便利。 為了改善現今照明燈具因壽命短、耗電量大等缺點，而發展 出一種具有壽命長、耗電量低、無產生紫外線及免於經常更換的 發光二極體(Light Emitting Diode，LED)來取代現有曰光燈管， 但是，LED在持續發光一段時間後，會有高溫的現象產生，因 而導致LED的發光效率下降，進而使亮度衰退的問題產生，因 此，LED所製成的燈具需針對散熱問題加以改善。 201030279 如圖一 A所示，為習知散熱型LED燈具結構10,具有一燈 具本體11及多數LED 12電性連結於線路板13上。燈具本體11 的後緣形成有多數散熱鰭片14,可將LED 12發光時所產生的高 溫導出，以達到散熱降溫之目的。如圖一 B所示，LED 12包含 一導電架15及多數LED晶片16以打線方式電性連結於導電架 15上，最後充填螢光劑以完成封裝。由於，此種LED燈具結構 10具有多數LED 12，而每顆LED 12之封裝結構需使用一導電 ❿ 架15，致使成本增加，須加考慮。 【發明内容】 本發明之主要目的在提供一種具有延長使用壽命、降低耗電 量及降低製造成本之LED燈具結構。 本發明之次要目的在提供一種LED燈具結構，能使LED晶 片所產生的熱能藉由各散熱鰭片導出，而發散至周圍空氣中，以 解決因過熱造成LED晶片之發光功率下降，進而影響照明亮度 ❿之問題。 為達上述之目的及功效，本發明LED燈具結構包括一燈具 本體具有一前端設有一凹槽，其上設有正、負極導電線路及金屬 箔片，及一後端設有多數散熱鰭片；多數LED晶片裝載於金屬 箔片上，以打線方式電性連結於正、負極導電線路，且與接線連 結點作電性連接，最後充填封裝材料以完成封裝；及一燈罩設置 在該燈具本體的前端。 本發明LED燈具結構更包含一擴充結構而具有橫向及/或縱 201030279 . 向延伸或雙面連結之目的。 本發明確信新穎之特徵詳述於後附之申請專利範圍中。然 而新型之結構、操作方式以及目的與優點，藉由參考下列之敘 述及附圖，當可更加容易了解。 【實施方式】 如圖二至圖四所示，本發明LED燈具結構2〇包括一燈具本 體21，多數LED晶片30、一燈罩4〇及一擴充結構5〇。燈具本 φ 體21以散熱性較佳之材料製成。燈具本體21的前端設有一凹槽 23 ’其上設有一正、負極導電線路22及一金屬箔片27位於正、 負極導電線路22間。多數LED晶片30裝載在金屬箱片27上， 以串聯及並聯形態連結’並以打線方式電性連接於正、負極導電 線路22，使LED晶片30與接線連結點24成為電性連接，最後 在凹槽23上充填封裝材料25以完成封裝，LED晶片30發出之 光源可經由封裝材料25射出。由於，LED晶片30以特定顏色 φ 光源射出，若封裝材料25含有螢光劑可改變光源發出的顏色如 單色、白光及相關具RGB(RED-GREEN-BLUE三原色）組合變化 之發光光源者。一燈罩40安裝在燈具本體21的前端，可避免異 物或灰塵沈積於封裝材料25上，進而影響到照明光線的散射。 燈具本體21的後端設有多數散熱鰭片26，當LED晶片30 持續發光時所產生的高溫，可經由散熱鰭片26將熱能導出，並 發散於周圍的空氣中，而達到散熱降溫之目的，可避免過熱而造 成LED晶片30的光功率下降，進而產生亮度不足的問題，甚至 201030279 導致LED晶片30燒毀。 燈具本體21更包括一擴充結構50可使LED燈具結構20具 有延伸之功能。該擴充結構50具有一軌道51形成在燈具本體 21的兩側，及至少一聯結器52可套入軌道51中而成為結合， 該聯結器52具有一基板53及一滑入部54形成在基板53的兩 側，滑入部54的形狀與軌道51相對應，讓滑入部54可有效的 嵌入於軌道51中而成為連結。 〇 多具LED燈具結構20間藉由擴充結構50使其成為連接可 作為招牌或看板用。如圖五所示，多具LED燈具結構20間可藉 由聯結器52之滑入部54插入於相鄰執道51而成為機械上的連 接，以達到橫向及/或縱向無限延伸的目的。 如圖二所示，擴充結構50更進一步包含至少一凸出部55 形成在任一散熱鰭片26末端，及至少一受納部56形成在任一散 熱鰭片26末端。如圖六所示，兩具LED燈具結構20間藉由凸 ® 出部55與對應受納部56的插入組裝而成為機械上的連接，使 LED燈具結構20可雙面連結而具有雙面照明之目的。上述圖六 顯示兩具LED燈具結構20為雙面連結之實例說明，事實上，也 可以同時將多具LED燈具結構20藉由聯結器52插入於相鄰軌 道51，以達到橫向及/或縱向延伸而增加雙面照明之範圍，如圖 七戶斤示。 如圖八所示，本發明LED燈具結構20在應用上可安裝在燈 座上，LED燈具結構20的兩端安裝一套頭60，套頭60的外側 201030279 設有一對相互平行的導電銷61與燈座之插孔成為機械與電氣上 的連接。 總而言之，本發明LED燈具結構20能使LED晶片30所產 生的熱能藉由各散熱鰭片26導出，而發散至周圍空氣中，以解 決因過熱造成LED晶片30之發光功率下降，進而影響照明亮度 之問題，及LED燈具結構20具有擴充之目的可作為招牌或看板 等用途。再者’ LED晶片30的使用哥命約有10萬小時’而具 φ 有延長使用壽命之目的。 雖然本發明之實施例已經說明於前，但是對於熟知此技藝 之人士而言，其他各種可輕易達成之變化或修改，皆不脫離本 發明之精神。在申請專利範圍内也試著涵蓋本發明精神範圍内 之所有變化或修改。 【圖式簡單說明】 圖一 A為習知散熱型LED燈具結構之斷面圖。 φ 圖一 B為習知LED之立體圖。 圖二為本發明LED燈具結構之立體圖。 圖三為圖二中沿3 -3線所作之斷面圖。 圖四為本發明LED燈具結構之立體分解圖。 圖五為本發明多具LED燈具結構以橫向及縱向擴充連接之 立體圖。 圖六及圖七為本發明多具LED燈具結構以雙面擴充連接之 立體圖。 201030279 圖八為本發明LED燈具結構的兩端與套頭結合之示意圖。 【主要元件符號說明】 LED燈具結構20 燈具本體21 正、負極導電線路22 凹槽23 接線連結點24 封裝材料25 散熱鰭片26 金屬箔片27 LED晶片30 燈罩40 擴充結構50 軌道51 聯結器52 基板53 滑入部54 凸出部55 受納部56 套頭60 導電銷61 參 8201030279. VI. Description of the Invention: [Technical Field] The present invention relates to an LED lamp structure, and more particularly to a lamp structure capable of deriving a high temperature generated by an LED to eliminate a decrease in luminous power of the LED due to overheating. [Prior Art] According to the light source, the light source is a very important part in the normal life. It must be illuminated by the light source inside and outside the building. However, the common light source is mainly the fluorescent tube. To make the light have a good scattering effect, the luminaire is usually installed at a higher position (such as the ceiling), because the principle of illuminating the fluorescent tube is to use gas discharge, through the acceleration of the electrons in the fluorescent tube, through the gas enclosed in the tube The ultraviolet rays are generated and then illuminate through the phosphor powder coated on the glass. Therefore, after about 6000 hours, the mercury in the fluorescent tube has been absorbed by the tube wall, which causes the fluorescent tube to lose its smooth discharge. The ability to make the lamp _ burned out, so it is quite inconvenient to use the stairs to disassemble and replace the damaged lamp. In order to improve the shortcomings of today's lighting fixtures, such as short life and high power consumption, a light-emitting diode (LED) with long life, low power consumption, no ultraviolet light generation and no frequent replacement has been developed. It replaces the existing neon tube. However, after the LED is continuously illuminated for a period of time, there is a phenomenon of high temperature, which leads to a decrease in the luminous efficiency of the LED, which in turn causes a problem of brightness degradation. Therefore, the lamp made by the LED needs to be targeted. The heat dissipation problem is improved. As shown in FIG. 1A, the conventional heat dissipation type LED lamp structure 10 has a lamp body 11 and a plurality of LEDs 12 electrically connected to the circuit board 13. The rear edge of the lamp body 11 is formed with a plurality of heat dissipating fins 14, which can be used to derive the high temperature generated when the LED 12 is illuminated, so as to achieve the purpose of cooling and cooling. As shown in FIG. 1B, the LED 12 includes a conductive frame 15 and a plurality of LED chips 16 electrically connected to the conductive frame 15 by wire bonding, and finally filled with a fluorescent agent to complete the package. Since such an LED lamp structure 10 has a plurality of LEDs 12, and a package structure of each of the LEDs 12 requires the use of a conductive truss 15, the cost is increased and must be considered. SUMMARY OF THE INVENTION The main object of the present invention is to provide an LED lamp structure having an extended life, a reduced power consumption, and a reduced manufacturing cost. A secondary object of the present invention is to provide an LED lamp structure that enables the heat generated by the LED chip to be derived by the heat dissipation fins and diffused into the surrounding air to solve the decrease in the luminous power of the LED chip caused by overheating, thereby affecting The problem of brightness is ambiguous. In order to achieve the above object and effect, the LED lamp structure of the present invention comprises a lamp body having a front end provided with a groove, the positive and negative conductive lines and the metal foil are disposed thereon, and a plurality of heat dissipation fins are disposed at a rear end; Most of the LED chips are mounted on the metal foil, electrically connected to the positive and negative conductive lines by wire bonding, and electrically connected to the connection points of the connection, and finally filled with the packaging material to complete the packaging; and a lamp cover is disposed at the front end of the lamp body . The LED lamp structure of the present invention further comprises an expanded structure and has the purpose of lateral and/or vertical 201030279. The present invention is believed to be novel in the scope of the appended claims. However, the novel structure, mode of operation, and purpose and advantages can be more readily understood by reference to the following description and drawings. [Embodiment] As shown in FIG. 2 to FIG. 4, the LED lamp structure 2 of the present invention comprises a lamp body 21, a plurality of LED chips 30, a lamp cover 4A and an expansion structure 5A. The φ body 21 of the luminaire is made of a material having better heat dissipation. The front end of the lamp body 21 is provided with a recess 23' on which a positive and negative conductive line 22 and a metal foil 27 are disposed between the positive and negative conductive lines 22. A plurality of LED chips 30 are mounted on the metal case 27, connected in series and in parallel, and electrically connected to the positive and negative conductive lines 22 by wire bonding, so that the LED chip 30 and the connection point 24 are electrically connected, and finally The recess 23 is filled with the encapsulating material 25 to complete the encapsulation, and the light source emitted by the LED wafer 30 can be ejected via the encapsulating material 25. Since the LED chip 30 is emitted with a specific color φ light source, if the encapsulating material 25 contains a fluorescent agent, the color emitted by the light source such as monochromatic, white light, and related illuminating light sources having a combination of RGB (RED-GREEN-BLUE) changes can be changed. A lamp cover 40 is mounted on the front end of the lamp body 21 to prevent foreign matter or dust from being deposited on the package material 25, thereby affecting the scattering of the illumination light. The rear end of the lamp body 21 is provided with a plurality of heat-dissipating fins 26, and the high temperature generated when the LED chip 30 continues to emit light can be radiated through the heat-dissipating fins 26 and dispersed in the surrounding air to achieve the purpose of cooling and cooling. In order to avoid the overheating, the optical power of the LED chip 30 is lowered, thereby causing a problem of insufficient brightness, and even the 201030279 causes the LED chip 30 to burn out. The luminaire body 21 further includes an expansion structure 50 that allows the LED luminaire structure 20 to have an extended function. The expansion structure 50 has a track 51 formed on both sides of the lamp body 21, and at least one coupler 52 can be fitted into the track 51 to be combined. The coupler 52 has a substrate 53 and a sliding portion 54 formed on the substrate 53. On both sides, the shape of the sliding portion 54 corresponds to the rail 51, so that the sliding portion 54 can be effectively inserted into the rail 51 to be joined. 〇 Multiple LED luminaire structures 20 can be connected as a sign or kanban by augmenting the structure 50. As shown in FIG. 5, a plurality of LED lamp structures 20 can be mechanically connected by the slide-in portion 54 of the coupler 52 to the adjacent track 51 to achieve lateral and/or longitudinal infinite extension. As shown in FIG. 2, the expansion structure 50 further includes at least one protrusion 55 formed at the end of any of the heat dissipation fins 26, and at least one receiving portion 56 formed at the end of any of the heat dissipation fins 26. As shown in FIG. 6, the two LED lamp structures 20 are mechanically connected by the insertion and assembly of the convex portion 105 and the corresponding receiving portion 56, so that the LED lamp structure 20 can be double-sidedly coupled with double-sided illumination. The purpose. Figure 6 above shows an example in which two LED lamp structures 20 are double-sided connectors. In fact, multiple LED lamp structures 20 can also be inserted into adjacent tracks 51 by the coupler 52 to achieve lateral and/or vertical orientation. Extend and increase the range of double-sided lighting, as shown in Figure 7. As shown in FIG. 8, the LED lamp structure 20 of the present invention can be mounted on a lamp holder in application. A set of heads 60 is mounted on both ends of the LED lamp structure 20. The outer side 201030279 of the head 60 is provided with a pair of mutually parallel conductive pins 61 and lamps. The socket of the socket becomes a mechanical and electrical connection. In summary, the LED lamp structure 20 of the present invention enables the heat generated by the LED chip 30 to be derived by the heat dissipation fins 26 and diffused into the surrounding air to solve the decrease in the luminous power of the LED chip 30 due to overheating, thereby affecting the illumination brightness. The problem, and the LED lamp structure 20 has the purpose of expansion for use as a signboard or a kanban. Furthermore, the use of the LED chip 30 has a life of about 100,000 hours, and φ has the purpose of extending the service life. While the embodiments of the present invention have been described in the foregoing, various changes and modifications may be made without departing from the spirit of the invention. All changes or modifications within the spirit of the invention are also intended to be included within the scope of the invention. [Simple diagram of the figure] Figure 1A is a cross-sectional view of a conventional heat-dissipating LED lamp structure. φ Figure 1 B is a perspective view of a conventional LED. Figure 2 is a perspective view of the structure of the LED lamp of the present invention. Figure 3 is a cross-sectional view taken along line 3 -3 in Figure 2. Figure 4 is a perspective exploded view of the structure of the LED lamp of the present invention. Fig. 5 is a perspective view showing the structure of a plurality of LED lamps in the present invention in a lateral and vertical expansion connection. Fig. 6 and Fig. 7 are perspective views of the structure of a plurality of LED lamps of the present invention which are connected by double-sided expansion. 201030279 Figure 8 is a schematic view showing the combination of the two ends of the LED lamp structure of the present invention and the ferrule. [Main component symbol description] LED lamp structure 20 Lamp body 21 Positive and negative conductive lines 22 Groove 23 Wiring connection point 24 Packaging material 25 Heat sink fins 26 Metal foil 27 LED wafer 30 Lampshade 40 Expansion structure 50 Track 51 Coupling 52 Substrate 53 slide-in portion 54 projection portion 55 receiving portion 56 sleeve 60 conductive pin 61