201028282 六、發明說明： 【發明所屬之技術領域】 β本發月疋有關於種微結構成形裝置、方法及導光板，特別 疋有關於種可準確餘成職結翻^基材上之技術領域。 【先前技術】 近年來’由於液晶螢幕紐晶電視等需求大為提升，因此導 ❹光板之生纽S造猶需麵隨之提升。—般秘料光板之導 光效率及降低生產成本’會在導光板上彻射出方式成型使導光 板上成型一微結構。 然而’利用射出方式成型微結構時，受限於成型技術，當微 結構越小(小於0.8微米)時，射出良率會大幅下降。此外，當導光 板之尺寸越大時，由於導光板受重力產生變形彎曲㈣麵)的現 象’使得錄導絲之微結構之解度私，料導光板無法 發揮理想均光的效果。 … Ο 此夕卜，亦有業界嘗試利用微熱壓印法(H〇t Emb〇ssing)之方式 製作微結構。微麵印是微機衫統製造領域之巾，重要的微結 構複製成型技術，其湘輯鎳模板上面的微結構複製至待壓印 待壓印標的，以完成高精度與高品質之微機電成品製造。 習知的微熱壓印技術，是藉由壓板結構來加熱加壓。壓板本 身具有加熱冷卻功能，又稱為熱盤。壓板内的加熱器或加熱管路 發熱後’先加鐘塊越’再藉由熱傳導方式，將齡傳遞至壓 板上的模具與塑膠。以使塑膠達到軟化溫度，才能進行壓印。在 冷卻階段，藉由壓板内之冷卻管路通入冷流體，需先冷卻整塊壓 3 201028282 板，才能冷卻待齡物。此㈣板式缝加齡卻方式，需將整 塊熱盤升溫及降溫，每—娜約需化費數十分鐘至 耗時且浪f_、。 -取程 L ’微熱印法在執行減印時，由㈣板巾間處壓印 力大，靠賴板邊緣處賴印力小。因此’在實顧熱壓印成型 法時’通常以矽膠板(Silicone Rubber)作為模具緩衝襯純模 待壓印物能緊密貼合，贱和與平衡壓力不均的影響達到均句201028282 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a microstructural forming device, a method, and a light guide plate, and particularly relates to a technical field in which a seed can be accurately formed into a substrate. . [Prior Art] In recent years, due to the increasing demand for LCD screens, such as the New Crystal TV, the production of the slabs has been enhanced. As a result, the light guiding efficiency and the reduction of production cost of the light board will be formed on the light guide plate to form a microstructure on the light guide plate. However, when the microstructure is formed by the injection method, it is limited by the molding technique, and when the microstructure is smaller (less than 0.8 μm), the injection yield is drastically lowered. In addition, when the size of the light guide plate is larger, the phenomenon that the light guide plate is deformed and bent by the gravity (four) surface makes the microstructure of the recording guide wire unsolvable, and the material light guide plate cannot exert the effect of ideal homogenization. ... Ο In addition, there are also industries that try to make microstructures by means of H〇t Emb〇ssing. Micro-finish printing is a towel in the field of micro-shirt manufacturing, an important micro-structure replication molding technology, and the microstructure on the Xiangji nickel template is copied to the embossed label to be finished to complete the high-precision and high-quality micro-electromechanical products. Manufacturing. The conventional micro-hot stamping technique is to heat and pressurize by a platen structure. The pressure plate itself has a heating and cooling function, which is also called a hot plate. After the heater or heating pipe in the pressure plate heats up, the first time the block is added, the heat is transferred to the mold and plastic on the platen. In order to achieve a softening temperature of the plastic, the imprint can be performed. In the cooling phase, the cold fluid is passed through the cooling line in the pressure plate, and the whole block pressure 3 201028282 is required to cool the object to be cooled. This (4) plate-type joint ageing method requires heating and cooling the whole hot plate. Each time, it takes about ten minutes to take time and wave f_. -Receipt L 'The micro-hot stamping method is used when the subtraction is performed, and the printing force is large at the edge of the (4) stencil, and the printing force is small at the edge of the slab. Therefore, 'in the case of hot stamping, 'Silicone Rubber' is usually used as a buffer cushioning lining. The embossing material can be closely adhered, and the influence of unevenness and balance pressure is uniform.
之成型。然_膠板容糾張變形，且受限於固態材料本身的伸 張特性’壓印力無法達到理想均勻分布狀態。在充填階段，壓印 =布的不均會導致娜收縮的不均勻，嚴重影響成品微結構複 裏後的尺寸。 【發明内容】 /有鑑於上述習知技藝之問題，本發明之目的就是在提供一種 微、、口構成^/裝置、方法及導光板，以解決習知技藝微結構成型不 均或成形時間過慢等問題。 根據本發明之目的’提出—種微結構成形裝置，包含一驅動 模組、-模板及-加熱模組。驅動模組具有—本體及—膜體且 本體與膜體界定-容置空間。模板具有—微結構，且微結構係設 置於模板之-側。加細組係加熱一基材。其中，#基材藉由加 熱模組加熱至可塑狀態時，充填—流體至容置空間以_膜體移 動’使膜體帶動模板壓印基材，以將微結構成形至基材上。 根據本發明之另-目的，提出—種微結構成形方法，包含下 列步驟。首先’提供-加熱裝置及—模板，模板具有—微結構。 201028282 接著，加熱一基材，以將基材加熱至可塑狀態。接著，藉由一框 體密合基材及驅動模組，驅動模組具有一容置空間及一膜體，容 置空間無體相連通。接著，填充一氣體至容置空間，以驅動膜 體帶動模板移動。最後，壓印微結構至基材。 、 根據本發明再-目的’提出—種導光板，其係由上述微結構 成形方法加工基材所製成。 承上所述，依本發明之微結構成形裝置、方法及導光板，可 ® 藉充填一流體以帶動膜體向外擴張以均勻精密驅動模板移動，使 微、、構均勻壓印成型於導光板上，而可達成快速且均勻成型之效 果。 【實施方式】 請參閱第1圖、第2圖及第3圖，其分別係為本發明之微結 構成形裝置之第-示意圖、第二示意圖及第三示意圖。圖中，： 結構成形裝置包含二驅動模組u、二模板12、二框體13及二加 〇 熱模組14。 驅動模組11具有一本體110、一膜體112及複數個恆溫裝置 113。膜體112可為矽膠等材質所製成之彈性(Elastic)體，並與本體 界疋出一谷置空間111，其為一壓力室(pressure chamber)，且 膜體112可受壓力膨脹而向外擴張’且於壓力釋放後可因彈性回 復力而回復至原位。恆溫裝置113則間隔設置於驅動模組11内， 用以保持流體15及基材之工作溫度。在此實施例中，基材可以導 光板16來實施，但並不以此為限。 模板12可以精密電鏵方式所製造，且模板12之一侧具有一 201028282 微結構121，而可將微結構121以轉印複製的方式壓印導光板16。 框體13可為一真空框架(vacuum ftame)並設置於驅動模組n之 間，並具有複數個孔道131並用以夾持導光板16。其中，孔道131 供導流一由外部吹送之氣體至導光板16及模板12。加熱模組14 分別設置於導光板16之兩侧，用以對導光板16加熱。當壓印微 . 結構121於導光板16時，先藉由加熱模組14加熱導光板16，使 • 導光板16軟化至可塑狀態。 ❹ 請參閱第4圖及第5圖，其分別係為本發明之微結構之第四 示意圖及第五示意圖。接著，將驅動模組u分別壓設於導光板16 之兩侧，使模板12與導光板16相接觸。接著，抽離框體13内之 空氣，以供導光板結構成形裝置與外界形成一壓差，使導光板％ 及驅動模組11因氣密原理而緊密接觸。接著，填充高壓流體15 至容置空間ill内，由於容置空間m與膜體112相連通，而使膜 體112受流體15擠壓壓力而外膨脹，以推動模板12朝導光板16 位移。接著，產生位移之模板12壓印微結構121至導光板16上， 使導光板16之兩侧分別成形一微結構161。由於填充於容置空間 ❹ 111之流體15可於各方向維持均等壓力而使容置空間m保持在 均壓狀態，因而使膜體112均勻受壓而可精準推動模板12位移， 使模板12之微結構121可準確精密成形複製(repUcate)於導光板 16上。此外’框體13及驅動模組u在壓印導光板16時，因兩者 保持於固定位置，而可於其中形成一有限空間，以限制膜體ιΐ2 之變形量而可避免膜體H2在充壓時破裂。接著，卸除釋放位於 容置空間111内的流體，使膜體112不受高壓外力推擠而可藉由 彈性回復力移動復位。最後，吹送一氣流至框體13之孔道，使氣 體吹送至模體112及導光板16之間以辅助膜體112及導光板^ 6 201028282 分離。 請參照第6圖，其係為本發明之微結構成形方法，其包含下 列步驟： 步驟S11 :提供一加熱裝置及一模板，模板具有一微結構； 步驟S12 :加熱一基材，以將基材加熱至可塑狀態； 步驟S13 :藉由一框體密合基材及一驅動模組，驅動模組具有 -备置空間及-膜體’且容置空間與膜體相連通； 步驟S14:抽離框體内之空氣，以密合基材及驅動模組之膜體； 步驟S15 .填充一高壓流體至容置空間，以驅動膜體帶動模板 移動； 步驟S16 :壓印微結構至基材，使基材成形此微結構； 步驟S17 ·卸除容置空間之流體，以釋放容置空間之壓力而使 膜體復位；及 八〜步驟S18 .吹送一氣體至框體之孔冑，以輔助基材及模板相互 Μ其中’上狀觀構成形方法，其流體可以水 、油、空氣或 #施，加熱模組可以遠紅外線裝置、高周波裝置、涵素燈 戍熱風奸來倾，絲可叫光絲實施，但料以此限。 在二發明微結構成形裝置、方法及其導光板之功效 構可準確精密：；形二===板移動’而使微結 射出成形方式紐。 传缝及良率可較習知之 功效在於藉 本發明微賴成職置、枝狀導光板之另一 7 201028282 由《X置置來保持流體及導光板之I作溫度，避免更換導光 板或充填，而可快速成形微結構 乂上所述僅為舉例性，*非為限制性者。任何未脫離本發明 ，*職進行之秋修改峻更，均餘含於後附 之申凊專利範圍中。 【圖式簡單說明】Forming. However, the rubber sheet is deformed and deformed, and is limited by the stretch characteristics of the solid material itself. The stamping force cannot reach an ideal uniform distribution state. In the filling stage, embossing = unevenness of the cloth will result in uneven shrinkage of the nano, which seriously affects the size of the finished microstructure after resurfacing. SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, the object of the present invention is to provide a micro, port, device, method, and light guide plate to solve the problem of uneven molding or forming time of the prior art. Slow and other issues. According to the object of the present invention, a microstructure forming apparatus includes a driving module, a template, and a heating module. The driving module has a body and a film body, and the body and the film body define and occupy a space. The template has a microstructure and the microstructure is placed on the side of the template. The fine set heats a substrate. Wherein, when the substrate is heated to a plastic state by the heating module, the filling fluid is moved to the accommodating space to move the film body to drive the stencil substrate to form the microstructure onto the substrate. According to another aspect of the present invention, a microstructure forming method is proposed, comprising the following steps. First, the 'providing-heating device and the template are provided, and the template has a microstructure. 201028282 Next, a substrate is heated to heat the substrate to a moldable state. Then, the driving module has an accommodating space and a film body, and the accommodating space is in a body-free communication. Then, a gas is filled into the accommodating space to drive the film to drive the template to move. Finally, the microstructure is embossed to the substrate. According to still another aspect of the present invention, there is provided a light guide plate which is produced by processing the substrate by the above microstructure forming method. According to the present invention, the microstructure forming apparatus, method and light guide plate can be filled with a fluid to drive the film body to expand outward to uniformly and precisely drive the movement of the template, so that the micro and the structure are uniformly imprinted on the guide. On the light plate, the effect of rapid and uniform molding can be achieved. [Embodiment] Please refer to Fig. 1, Fig. 2, and Fig. 3, which are respectively a first, a second, and a third schematic view of the microjunction device of the present invention. In the figure, the structure forming device comprises two driving modules u, two templates 12, two frames 13 and two heating modules 14 . The driving module 11 has a body 110, a film body 112 and a plurality of thermostats 113. The film body 112 may be an Elastic body made of a material such as silicone rubber, and a space 111 is formed in the body boundary, which is a pressure chamber, and the film body 112 can be expanded by pressure. External expansion' and return to the original position due to elastic restoring force after pressure release. The thermostats 113 are spaced apart from the drive module 11 to maintain the operating temperature of the fluid 15 and the substrate. In this embodiment, the substrate can be implemented by the light guide plate 16, but is not limited thereto. The template 12 can be fabricated in a precision electro-hydraulic manner, and one side of the template 12 has a 201028282 microstructure 121, and the microstructure 121 can be imprinted in a transfer-reproducing manner. The frame 13 can be a vacuum frame and disposed between the driving modules n and has a plurality of holes 131 for holding the light guide plate 16. The channel 131 is configured to conduct a gas blown from the outside to the light guide plate 16 and the template 12. The heating modules 14 are respectively disposed on both sides of the light guide plate 16 for heating the light guide plate 16. When the structure 121 is embossed on the light guide plate 16, the light guide plate 16 is first heated by the heating module 14, so that the light guide plate 16 is softened to a plastic state. ❹ Please refer to Fig. 4 and Fig. 5, which are respectively a fourth schematic diagram and a fifth schematic diagram of the microstructure of the present invention. Then, the driving modules u are respectively pressed on both sides of the light guide plate 16 to bring the template 12 into contact with the light guide plate 16. Then, the air in the frame 13 is pulled out to form a pressure difference between the light guide plate structure forming device and the outside, so that the light guide plate % and the driving module 11 are in close contact due to the airtight principle. Then, the high pressure fluid 15 is filled into the accommodating space ill. Since the accommodating space m communicates with the film body 112, the film body 112 is externally expanded by the pressure of the fluid 15 to push the template 12 to be displaced toward the light guide plate 16. Then, the displacement template 12 is imprinted onto the light guide plate 16 to form a microstructure 161 on both sides of the light guide plate 16 respectively. Since the fluid 15 filled in the accommodating space ❹ 111 can maintain the equal pressure in all directions and maintain the accommodating space m in the pressure equalizing state, the film body 112 is uniformly pressed to accurately push the displacement of the template 12, so that the template 12 is The microstructure 121 can be accurately and accurately formed repUcate on the light guide plate 16. In addition, when the frame 13 and the driving module u are imprinted on the light guide plate 16, since the two are held at a fixed position, a limited space can be formed therein to limit the deformation amount of the film body ι 2 and the film body H2 can be prevented from being Cracked when pressurized. Then, the fluid in the accommodating space 111 is removed and released, so that the film body 112 is pushed by the high-pressure external force and can be moved and reset by the elastic restoring force. Finally, a gas flow is blown to the tunnel of the frame 13, and the gas is blown between the mold body 112 and the light guide plate 16 to assist the separation of the film body 112 and the light guide plate ^ 6 201028282. Please refer to FIG. 6 , which is a micro-structure forming method of the present invention, which comprises the following steps: Step S11: providing a heating device and a template, the template having a microstructure; Step S12: heating a substrate to base the substrate The material is heated to a plastic state; step S13: the substrate has a housing and a driving module, and the driving module has a preparation space and a film body, and the accommodation space is connected with the film body; Step S14: Extracting the air in the frame to close the substrate and the film body of the driving module; Step S15. Filling a high-pressure fluid to the accommodating space to drive the film body to move the template; Step S16: imprinting the microstructure to the base a material to form the microstructure into the microstructure; Step S17: removing the fluid in the accommodating space to release the pressure of the accommodating space to reset the film body; and VIII to S18. blowing a gas to the hole of the frame, The auxiliary substrate and the template are mutually squatted in a 'top shape configuration method, and the fluid can be water, oil, air or #, and the heating module can be tilted by a far infrared ray device, a high frequency device, a nuisance lamp, and a hot smother. It can be called light wire implementation, but it is expected . In the second invention, the structure of the microstructure forming apparatus, the method and the light guide plate thereof can be accurately and accurately: the shape 2 ===plate movement', and the micro-junction is injected into the forming mode. The effect of the seam and the yield can be better than the conventional one. The other 7 201028282 of the micro-relaying and branching light guide plate is used by the X to keep the temperature of the fluid and the light guide plate I to avoid replacing the light guide plate or filling. The rapid prototyping of the microstructures is described by way of example only, and is not intended to be limiting. Any change in the autumn that has not been deviated from the present invention is carried out in the scope of the appended patent. [Simple description of the map]
第1圖係為本發明之微結構成形裝置之第一示意圖； &圖係為本發明讀麟成職置之第二示意圖，係說明基材 藉由加熱裝置軟化至可塑狀態； 第3圖係為本發明之微結構成雜置之第三示意圖，係說明藉由 充填流體至容置如’崎脹舰_轉動模板壓 印微結構至基材上； 第4圖係為本發明之微結構成形裝置之第四示意圖，係說明由框 體之孔道吹送-氣體以輔助分離基材及膜體； & 微、—裝置1五示意圖，係說明基材 藉由壓印成形微結構；及 第6圖係為本㈣讀賴顏枝分财程圖。 201028282 【主要元件符號說明】 11 :驅動模組； 110 :本體； 111 :容置空間； 112 :膜體； 113 :恆溫裝置； 12 :模板； 121、161 :微結構； 13 :框體； 131 :孔道； 14 :加熱模組； 15 :流體； 16 :導光板；及 S11〜S18 :步驟流程。1 is a first schematic view of the microstructure forming apparatus of the present invention; & FIG. 1 is a second schematic view of the reading of the present invention, illustrating that the substrate is softened to a plastic state by a heating device; The third schematic diagram of the microstructure of the present invention is mixed, and the filling is performed by filling the fluid to accommodate the substrate such as the 'seal ship' rotating template to the substrate; the fourth figure is the micro of the present invention. The fourth schematic view of the structural forming device is characterized in that the gas is blown from the pores of the frame to assist in separating the substrate and the film; and the micro-device is a schematic view of the substrate by embossing the microstructure; The sixth picture is based on (4) reading Lai Yanzhi's financial plan. 201028282 [Description of main components] 11: drive module; 110: body; 111: housing space; 112: film body; 113: thermostat; 12: template; 121, 161: microstructure; 13: frame; : hole; 14: heating module; 15: fluid; 16: light guide; and S11~S18: step flow.