201026898 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種鍵合方法’特別是有關於將異質材料於 低溫狀態下相互鍵合的方法。 【先前技術】 由於電子技術的發達，及積體電路(integrate命⑶红)製程的進 ❹ 步’使得每一個晶片（chip)内所含的電晶體數越來越多’但晶片的 體積卻越來越小’使得散熱(thermal dissipation)成為目前電子技術 所需克服的問題。 而目前的用於電子元件散熱方式，多利用一散熱模組(thermal module)所達成，藉由散熱模組之金屬材質可快速傳熱之特性將電 子元件所產生之熱能傳導至空氣内，而可避免電子元件過熱。其 中，散熱模組多利用一鋁材質鰭片（fin)接合一銅材質基板，藉由銅 基板之高熱傳導係數傳導至鋁製鰭片，再藉由鋁製鰭片的表面 φ 積，利用自然對流或配合風扇，將熱散逸至空氣中。 接合鋁鰭片與銅基板的方式，業界常用的方式有滾壓法、爆 炸成形，化學錢錄法及熱熔射塗佈。 滾壓方式疋於銘韓片與銅基板之間塗佈一層接著劑，在利用 滾輪壓合㈣#與銅基板’使鋪腫銅基板接合在-起。然而， 由於接著劑熱傳導係數極低導致散熱效率不佳，且 熱後接著劑之水分子會氣化散出，導致電路板或電容損壞]、又 壯人爆炸成形是將銅粉末利用爆炸所產生的高溫高壓，使銅粉末 結合於紹鰭片上。然而此種製程成本高昂，且粉末物質容易對人 201026898 體產生危害而不符合環保。 化學錄是於鋁鰭片或銅基板 及銅基板藉由金屬騎合在—起電片 程，仍有水氣造成電路板或電容損壞的問題。於屬式製 火焰方式是_紐轉、粉雜熔射、電魏射、 板容易受_形，導財轉齡高溫製程，使錄 【發明内容】 旦暫知技藝之㈣，本發明之目是在提供一種 =材料鍵合方法，以解決習知技藝將異f材料，如將銅與銘接 合時成本高昂，或於高溫運作時科產生錢賴壞電子元件的 問題。 根據本發明之目的’提出-種異f材料鍵合方法。首先，提 ❹供一基材並進行喷砂加工。接著使用一第一金屬導線與一第二金 屬導線分別電性連接-電源，以提供不同電性至第一金屬導線與 第二金屬導線。接著’依據第-金屬導線及第二金屬導線不同電 性產生電弧。接著，使用電弧加熱第一金屬導線與第二金屬導線， 以熔融第一金屬導線及第二金屬導線成為一熔融材。接著，使用 麼縮空氣喷射溶融材而吹散為複數個粒子，以吹送該複數個粒子 至該基材上。最後，形成一喷塗層至基材上。 其中，第一金屬導線及第二金屬導線係為銅導線。 其中，電弧係產生-高周波，其係振動加熱第一金屬導線及 201026898 第二金屬導線。 其中’壓縮空氣形成-氣旋結構，其用以降低粒子溫度。 承上所述’依本發明之異質材料鍵合方法，其可具有一或多 個下述優點： ⑴此異質㈣鍵合綠可於t溫下使金屬與基材鍵結相立 鍵合’可避免習知技術的触射方式因高熱造成材受熱變形。 (2)此異質材料鍵合方法為乾式鍵合，可避免習知技術利用滚 ❹壓^式或化學賴合等赋鍵合方法騎減水氣胃丨而導致電 路板或電容短路。 【實施方式】 本發明提供-種異質材騎合方法，其糊無錢熔射用於 ，覆溶融金屬基材於-基材上，錢過—具有複數喷射口的喷射 單元’以喷射壓縮空氣。本發明利用複數壓縮空氣吹送溶融金屬 基材’使金屬基材喷覆於基材時即迅速降至常溫，以達到常温炼 Φ 射喷覆的目的。 請參閱第1 ®，其係為本發明異質材料鍵合方法之一實施例 之流程圖。 本發明異質材料鍵合方法包含下列步驟： 步驟S11:提供-基材’此基材係進行—喷砂加工處理以去除 基材表面雜質及灰塵； 步驟S12:使用-第一金屬導線與一第二金屬導線分別電性連 接-電源’以提供不同電性至第—金屬導線及第二金屬導線，其 201026898 中’第-金屬導線與第二金屬導線係以不同基材之金屬材料所製 成； 步驟S13:依據第—金屬導線及第二金線之不同電性產生 電弧； 步驟si4:使用電弧加熱第—金屬導線及第二金屬導線，以溶 融第-金屬導線及第二金屬導線成為一溶融材； 步驟S15 .使用壓縮空氣喷射溶融材而吹散為複數個粒子，以 吹送粒子至基材上； ❹ 步驛S16 :形成一噴塗層於基材上；及 步驟S17:拋光加工喷塗層，以磨平及使喷塗層呈現光滑狀態。 在本實加例中’第-金屬導線及第二金屬導線可以銅導線來 實施’基材可為金屬絲實施，然並不以此為限，基材亦可為陶 究石墨、塑膠、玻璃、紙或其他金屬材料，如金、銀、銅、鐵、 鋅、紹等材質。上述步驟流程之電弧產生一高周波，藉由高周波 振動加熱第-及第二金屬導線，使第—及第二金屬導線溶融成電 ❹ 漿(Plasma)狀態，其攝氏溫度約位於45〇(rc至480(rc之間，使金 屬銅轉變為帶有電性而具活性的銅離子(i〇n)。壓 氣 有複數個喷射口之喷嘴(nozzle)所噴出而形成高速喷射流(喊 velocity jet flow)。每一噴射口由於所連接之流道設計並不相同， 使匯聚在一起之氣流產生渦璇(vertex)而形成一氣旋結構，使得銅 離子可藉由此氣旋結構所構成的流場快速散熱而降溫，使銅離子 由喷嘴喷射出後、約30 S 45公分間便可由超高溫狀態降溫至常溫 狀態(約25°C JL 45°〇。銅離子仙^絲域便触基材相互鍵 結而形成一共晶結構，此共晶結構可使將與噴覆層相接觸的電子 6 201026898 /〇件的熱祕速料至錄材上，Μ會產生如習知技術將銅基 板與賴片相結合時，會因接著劑之熱傳導係數過低 ，使得熱殘 留在銅基板上而無法將電子元件所產生的熱能順利排散出。 凊參閱第2圖，其係為本發明異質材料鍵合方法之喷覆裝置 結構示意圖。喷覆裝置包含—噴嘴u、—第—輸出模組12與一第 一輸出模組13 °第—輸賴組12及第二輸賴組13分別推送第 -金屬導線2及第二金屬導線3。喷嘴u具有複數個喷氣孔iu， 用以將壓縮空氣高逮射出，且倾u的―侧連接—空氣壓縮機 ❹（Air comP聰or)。其中，第-金屬導線2及第二金屬導線3分別 電性連接-第-電極4及第二電極5，且第一電極4及第二電極5 分別耦接一電源(圖未示)之正電位及負電位。 第金屬導線2及第一金屬導線3經由第一電極4與第二電 極5所耦接的電源而導電，因此，第一金屬導線2與第二金屬導 線3於噴嘴11的外側產生電弧，電弧會依據電源所提供的電流強 度而產生對應的熔融溫度。 ❹電弧於噴嘴11外侧熔融第一金屬導線2與第二金屬導線3， 並於喷嘴11外侧形成一熔融材6。喷嘴u將壓縮空氣噴射至熔融 材6，使融熔材6吹散為複數個粒子61，並吹送粒子61使沉積於 基材7上並與基材7相互鍵結而產生共晶結構的喷塗層g。在本實 施例中，第一金屬導線2及第二金屬導線3可為銅導線，基材7 可為金屬鋁所製成，粒子61的接合強度可達99.8公斤每平方公 分，且噴覆層的孔隙率為百分之一至百分之五，但並不以此為限， 可藉由改變輸入電流電壓及改變喷射氣體流速等方式，依照加工 件之材料特性及應用需求而加以調整。其中，喷氣孔所喷出 201026898 的氣體可產生交互作用而形成氣旋流場之結構，以快速降溫粒 子’如第3圖所示。因此，本發明之異質材料鍵合方法可將異質 材料共晶結合，如將銅基材共晶結合於鋁基材7上，以提升散熱 模組的散熱效率，如第4圖所示。 ' 综上所述，本發明異質材料鍵合方法之功效在於可將銅以冷 喷塗(cold spray)的方式喷覆結合於鋁基材上，可避免習知技術的熱 熔射方式因南熱造成銘基材受熱變形。 本發明異質㈣鍵合^法之另-功效在触乾式方式使異質 ❹材料，如銅紐與紹基材相結合，以避免習知技藝利用濕式方式 結合而容易因水氣蒸發造成電路板等電子元件短路。 本發明異質材料鍵合方法之再—功效可使金、銀、銅、鐵、 鋅、銘等金屬材料鍵結於金屬材料、石墨、紙、塑膠等基材上， 以結合兩種材料特性而增加應用範圍。 以上所述僅為舉例性，而非為限制性者。任何未脫離本發明 之精神與範4，㈣其進狀等效修改錢更，均應包含於後 之申請專利範圍中。 、 〇 【圖式簡單說明】 第1圖係為本發明之異質材料鍵合方法之步驟流程囷； 第2圖係為本發明之異質材料鍵合方法之噴附裝置之結構示意 園， 第3圖係為本發明之異質材料鍵合方法之氣旋流場示意圖；及 第4圖係為本發明之異質材料鍵合方法適用於散熱模組傳導介 201026898 質塗佈之示意圖。 【主要元件符號說明】 11 :喷嘴； 111 :喷氣孔； 12 :第一輸出模組； 13 :第二輸出模組； 〇 2:第一金屬導線； 3 :第二金屬導線； 4:第一電極； 5:第二電極； 6 :熔融材； 61 :粒子； 7 :基材； ❿ 8 :喷塗層；及 S11〜S17 :步驟流程。201026898 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a bonding method, particularly to a method of bonding heterogeneous materials to each other at a low temperature. [Prior Art] Due to the development of electronic technology and the advancement of the integrated circuit (integrate (3) red) process, the number of transistors contained in each chip is increasing, but the volume of the wafer is Getting smaller and smaller 'making thermal dissipation' is a problem that current electronic technology needs to overcome. However, the current heat dissipation method for electronic components is achieved by using a thermal module, and the heat energy generated by the electronic component is transmitted to the air by the rapid heat transfer property of the metal material of the heat dissipation module. It can avoid overheating of electronic components. Among them, the heat dissipation module uses a fin of aluminum material to join a copper substrate, and the aluminum substrate is transferred to the aluminum fin by the high thermal conductivity of the copper substrate, and the surface of the aluminum fin is φ, and the natural material is utilized. Convection or mating with the fan, dissipating heat into the air. The methods commonly used in the industry for joining aluminum fins and copper substrates are rolling, explosion forming, chemical recording, and thermal spray coating. In the rolling method, a layer of an adhesive is applied between the Ming Han film and the copper substrate, and the copper substrate is bonded to the copper substrate by a roller (4) #. However, due to the extremely low heat transfer coefficient of the adhesive, the heat dissipation efficiency is not good, and the water molecules of the thermal adhesive will be vaporized and dissipated, resulting in damage to the circuit board or the capacitor], and the explosive formation is caused by the explosion of the copper powder. The high temperature and high pressure make the copper powder bond to the fins. However, such a process is costly, and the powder material is liable to the human body 201026898 and is not environmentally friendly. The chemistry record is a problem in which the aluminum plate or the copper substrate and the copper substrate are coupled by the metal to the electrical circuit, and the water circuit causes the circuit board or the capacitor to be damaged. The flame system of the genus is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ It is a method of providing a material bonding method to solve the problem that the conventional art will cost a different material, such as when the copper is bonded to the metal, or when the high temperature operation occurs, the money is generated by the electronic component. According to the object of the present invention, a hetero-f material bonding method is proposed. First, the substrate is supplied and sandblasted. Then, a first metal wire and a second metal wire are respectively electrically connected to the power source to provide different electrical properties to the first metal wire and the second metal wire. Then, an electric arc is generated depending on the electrical properties of the first metal wire and the second metal wire. Next, the first metal wire and the second metal wire are heated by the arc to melt the first metal wire and the second metal wire into a molten material. Next, the air jet is used to blow the molten material into a plurality of particles to blow the plurality of particles onto the substrate. Finally, a spray coating is formed onto the substrate. The first metal wire and the second metal wire are copper wires. Among them, the arc system generates a high frequency, which is vibration heating the first metal wire and the 201026898 second metal wire. Where 'compressed air forms a cyclonic structure to reduce the temperature of the particles. According to the above method of heterogeneous material bonding according to the present invention, it may have one or more of the following advantages: (1) The heterogeneous (four) bonded green can bond the metal to the substrate at t temperature. It can be avoided that the touch mode of the prior art causes the material to be thermally deformed due to high heat. (2) The heterogeneous material bonding method is a dry bonding, which can avoid the conventional technique of using a bonding method such as rolling or chemical bonding to ride the water and gas sputum and cause a short circuit of the circuit board or the capacitor. [Embodiment] The present invention provides a method for riding a heterogeneous material, which is used for spraying a molten metal substrate on a substrate, and has a jetting unit having a plurality of injection ports to eject compressed air. . The present invention utilizes a plurality of compressed air to blow a molten metal substrate to rapidly drop the metal substrate to a normal temperature when it is sprayed onto the substrate, so as to achieve the purpose of tempering and tempering at room temperature. Please refer to the 1st, which is a flow chart of one embodiment of the heterogeneous material bonding method of the present invention. The heterogeneous material bonding method of the present invention comprises the following steps: Step S11: providing - substrate 'this substrate is subjected to sandblasting treatment to remove impurities and dust on the surface of the substrate; Step S12: using - first metal wire and one The two metal wires are respectively electrically connected to the power source to provide different electrical properties to the first metal wire and the second metal wire. In 201026898, the 'first metal wire and the second metal wire are made of metal materials of different substrates. Step S13: generating an electric arc according to different electrical properties of the first metal wire and the second gold wire; Step si4: heating the first metal wire and the second metal wire with the arc to melt the first metal wire and the second metal wire into one a molten material; step S15. using compressed air to spray the molten material and blowing into a plurality of particles to blow the particles onto the substrate; ❹ step S16: forming a sprayed layer on the substrate; and step S17: polishing and spraying The layer is smoothed and the sprayed layer is smoothed. In the present embodiment, the 'first metal wire and the second metal wire can be implemented by a copper wire. The substrate can be implemented by a wire. However, the substrate can also be made of graphite, plastic, or glass. , paper or other metal materials, such as gold, silver, copper, iron, zinc, Shao and other materials. The arc of the above step process generates a high frequency, and the first and second metal wires are heated to a state of a plasma by a high-frequency vibration, and the Celsius temperature is about 45 〇 (rc to Between 480 ( between rc, the metal copper is converted into an electrically active and active copper ion (i〇n). The nozzle has a plurality of nozzles that are ejected to form a high-speed jet (called velocity jet flow). Each jet is not designed the same according to the connected flow passages, so that the airflows that are gathered together generate a vertex structure to form a cyclonic structure, so that the copper ions can be quickly flown by the cyclone structure. After cooling and cooling, copper ions can be cooled from the ultra-high temperature state to the normal temperature state after about 30 S 45 cm (about 25 ° C JL 45 ° 〇. The copper ion xian silk domain touches the substrate mutual bond Forming a eutectic structure, the eutectic structure enables the electrons of the electrons 6 201026898 / 〇 接触 to be contacted with the spray coating onto the recording material, and the copper substrate and the slab are produced as in the prior art. When combined, it will be transmitted by the heat of the adhesive. The coefficient is too low, so that the heat remains on the copper substrate and the thermal energy generated by the electronic component cannot be smoothly discharged. Referring to Fig. 2, it is a schematic structural view of the spraying device of the heterogeneous material bonding method of the present invention. The device comprises a nozzle u, a first output module 12 and a first output module 13 ° - the input group 12 and the second source group 13 respectively push the first metal wire 2 and the second metal wire 3. u has a plurality of jet holes iu, which are used to capture the compressed air, and the side-connected air compressor ❹ (Air comP), wherein the first metal wire 2 and the second metal wire 3 respectively The first electrode 4 and the second electrode 5 are respectively coupled to a positive potential and a negative potential of a power source (not shown). The metal wire 2 and the first metal wire are electrically connected. 3 is electrically conductive via the power source to which the first electrode 4 and the second electrode 5 are coupled. Therefore, the first metal wire 2 and the second metal wire 3 generate an arc on the outside of the nozzle 11, and the arc is based on the current intensity provided by the power source. Produce a corresponding melting temperature. ❹Arc in nozzle 11 The first metal wire 2 and the second metal wire 3 are melted side by side, and a molten material 6 is formed outside the nozzle 11. The nozzle u sprays compressed air to the molten material 6, and the molten material 6 is blown into a plurality of particles 61, and The blowing particles 61 are deposited on the substrate 7 and bonded to the substrate 7 to form a sprayed layer g of a eutectic structure. In the embodiment, the first metal wires 2 and the second metal wires 3 may be copper wires. The substrate 7 can be made of metal aluminum. The bonding strength of the particles 61 can reach 99.8 kg per square centimeter, and the porosity of the spray coating layer is from 1 to 5 percent, but not limited thereto. It can be adjusted according to the material characteristics and application requirements of the workpiece by changing the input current voltage and changing the injection gas flow rate. Among them, the gas emitted by the gas jet hole 201026898 can interact to form a structure of the cyclone flow field to rapidly cool the particles as shown in Fig. 3. Therefore, the heterogeneous material bonding method of the present invention can eutectic bond heterogeneous materials, such as eutectic bonding of a copper substrate to the aluminum substrate 7, to improve the heat dissipation efficiency of the heat dissipation module, as shown in FIG. In summary, the method of the heterogeneous material bonding method of the present invention is that the copper can be spray-bonded to the aluminum substrate in a cold spray manner, thereby avoiding the heat transfer method of the prior art. The heat causes the substrate to be thermally deformed. The heterogeneous (four) bonding method of the present invention has the effect of combining a heterogeneous germanium material, such as a copper neon and a rubbing substrate, in a dry-contact manner to avoid the conventional technique of utilizing a wet manner to easily cause a circuit board due to evaporation of water vapor. The electronic components are shorted. The re-efficiency of the heterogeneous material bonding method of the present invention can bond metal materials such as gold, silver, copper, iron, zinc, and Ming to metal materials, graphite, paper, plastic, etc. to combine the properties of the two materials. Increase the scope of application. The above is intended to be illustrative only and not limiting. Any departure from the spirit and scope of the present invention, and (4) its equivalent modification, shall be included in the scope of the patent application. 〇 [Simple description of the drawings] Fig. 1 is a flow chart of the method for bonding a heterogeneous material of the present invention; Fig. 2 is a schematic diagram of a structure of a spraying device for a heterogeneous material bonding method of the present invention, No. 3 The figure is a schematic diagram of the cyclonic flow field of the heterogeneous material bonding method of the present invention; and FIG. 4 is a schematic diagram of the heterogeneous material bonding method of the present invention applied to the thermal module conduction coating 201026898. [Main component symbol description] 11 : Nozzle; 111 : Jet hole; 12: First output module; 13: Second output module; 〇 2: First metal wire; 3: Second metal wire; 4: First Electrode; 5: second electrode; 6: molten material; 61: particle; 7: substrate; ❿ 8: sprayed layer; and S11~S17: step procedure.