TW201025476A - Control unit for adjusting a wafer angle in a probe apparatus - Google Patents

Abstract

In a wafer angle controller, a wafer is positioned on a wafer chuck rotatable on a central axis thereof. A chuck connector is located at a side of the wafer chuck and has a spherical hollow portion. A fixation shaft extends in a tangential direction of the wafer chuck and has a spherical connecting body coupled into the hollow portion at a first end and a screw hole at a second end thereof. A screw shaft is screwed into the screw hole, thus a joint distance between the screw and fixation shafts may be varied as the screw shaft is screwed. A driving unit drives the screw shaft to be screwed relative to the fixation shaft, to rotate the wafer chuck due to the variation of the joint distance. Accordingly, the wafer chuck is rotated by variation of the joint distance caused by the rotation of the screw shaft.

Description

201025476 VI. Description of the invention: [Technical field to which the invention pertains]: The embodiment is related to the adjustment - the angle of the object is made more early, and it is more efficient to efficiently push the angle of the wafer. + One of the measuring devices in the round angle is adjusted - the control unit is executed on the probe - check program. 1 is in the round [previous technique] - generally, in a grain sorting process on a wafer * 疋 疋 疋 using a detection device to check the absence of the yen, the grain Ί * 牧》® sequence program is the last step in the process of making an integrated circuit device for & The repose device checks the buildup on the wafer and checks it by electrical and functional features. In particular, the missing defect on the circle is measured. In one step, the probe card and the wafer are in contact with the probe card and one of the sundays is in contact with the pad. And each wafer on the Japanese yen is subject to the blunt statement between the probes that use the probe card and the wafers on the wafer. The alignment of the general detection device is precisely determined by the accuracy of the early cancer degree of the butyl sheet between the probe and the contact pad, and the accuracy of the detection device in the self-level. 'The alignment between the probes and the contact pads is accurate. Between the probes and the probes, you can adjust the contact angle of one of the wafer contacts. Therefore, the alignment accuracy of the probe and the alignment is determined by the contact angle adjustment, and the high accuracy of the precise contact angle adjustment of the wafer angle is usually achieved under control. Wafer angle control. Therefore, there is one improved wafer. However, the detector having a complicated structure of the detecting device is difficult to perform precision control of the wafer angle and has a simpler structural angle controller. It is necessary.

SUMMARY OF THE INVENTION Accurate and Precision Control of a Wafer of a Detection Device The illustrated embodiment provides an angle controller that can be combined with a simpler structure. According to some embodiments of the inventive concept, in the case of the 丨 I I I , , , , 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 弛 弛 弛 弛 弛 弛 弛 弛 弛 弛 弛 弛 弛The angle control thief includes a wafer chuck, a ridge (four), a drive single _ head connection, a fixed shaft member, and a snail day, which is used to rotate the yoke in the wafer chuck. The collet is connected to a peripheral component and has a ball-shaped intermediate α ® shaft member extending in a tangential direction perpendicular to the radius of the wafer chuck - the wire member includes a ball-shaped connecting body and one end member a second end member and a ball, a cymbal, and a hole, wherein the ball joint body H of the first member corresponds to the ball type hollow member of the clip connector The threaded bore is located at the end piece relative to the first end piece. The threaded shaft is made of one? The sturdy and sturdy, coupled, and coupled to the threaded hole of the fixed shaft member, according to the loosening and fixing system of the threaded shaft relative to the fixed shaft member

5180-10471-PF 201025476 can be changed for the joint distance between the threaded shaft and the fixed shaft. The drive unit is positioned around the wafer chuck and is used to drive the threaded shaft

The threaded hole of the fixed shaft member is loosened and fixed, so that the wafer chuck can be rotated according to the change of the sigma distance between the threaded shaft member and the fixed station Du #μ 4 A-3. In the embodiment of the present invention, the drive unit is rotated relative to the vertical shaft member, and the vertical member is placed on the central axis of the crystal (four). In the embodiment of the present invention, the clip connector further includes a ball-shaped connection system to the guide groove 'sj of the shaft member, and the system can be guided by at least one guide groove and w#, The rotation is performed in the hollow member connected to the chuck with respect to the vertical shaft member, and the vertical shaft member is the central axis of the parallel chuck. According to some embodiments of the inventive concept, $this is used for the detection device, and the embodiment provides a device including a wafer chuck:: the wafer angle control axis The member and a drive single a screw μ day yen are used to position the wafer chuck to rotate the second chuck mechanism relative to a central axis thereof. The end piece is connected to one of the peripheral members of the wafer chuck and has a cylindrical portion extending perpendicularly to the radius of the wafer chuck, and the fixed shaft member includes a connecting hole. - the first line - the second end member and a screw member, the connection hole in the f member = the jaw member insertion member, the threaded hole is located at the second end member ': the end member is coupled with respect to the first end joint The threaded shaft member is coupled to the fixed shaft member's threaded hole by a threaded angle, according to the fixed sleeve

5I80-10471-PF 201025476 The loosening and fixing of the threaded shaft can be changed for ^ A between the threaded shaft and the fixed shaft. Drive Xi Tian I® « ^ The early version is located around the wafer chuck and is used to drive the threaded shaft and the self-fixing shaft is loose and fixed, so that the wafer clamp can be changed according to the change of the screw ', ' The head rotates. The interface of the door is exemplified in the present invention - the implementation of the + M y Ύ Su Dong early system is rotated relative to a vertical shaft member, and the vertical shaft member is set to the center axis of the π day g chuck. In the present invention, the fixed shaft member is rotated relative to the collet which is inserted into the connecting hole of the fixed shaft member, and the cylindrical member is connected. Thus, the change of the threaded shaft member and the fixed shaft member is converted into the rotation of the wafer chuck. Linearity of θ δ Distance: In some embodiments of the inventive concept, the 'wafer angle controller can include a threaded shaft member and a fixed single threaded shaft member driven by a drive unit. The fixing unit has a _ ..., and the threaded shaft member is locked in the threaded hole of the earlier. According to the loosening and fixing of the threaded shaft member relative to one of the fixed shaft members, the threaded shaft member can be loosened and fixed by changing the joint distance between the threaded shaft member and the fixed shaft member. According to the change of the joint distance between the threaded shaft and the fixed shaft member = the wafer chuck is rotated, so that the angle of the wafer on the wafer head can be accurately and precisely controlled. [Embodiment] The following is a detailed description of the embodiments of the present invention, which have been disclosed in the preferred embodiments.

5180-10471-PF 201025476 Limits the present invention to any extent that is within the scope of the patent and the scope of the patent application, and is presented in the hierarchical and regional manners in the drawings. The skilled artisan, without departing from the invention, is defined by the scope of the invention. In order to achieve a clear domain size and relative size, it will be appreciated that the relationship between one element or layer and another element or layer is indicated as "on" (the element or layer is located in another element or layer)上),,, '' c〇nnected t0 (- element or layer is connected to another element or layer), or "coupled to", when it is coupled to another element or layer, An element or layer can be directly located on another element or another layer or layer, one element or layer can be directly connected to another element or layer, or the element or layer can be directly coupled to another element or layer. Or an intermediate component or layer can be stored. Conversely, when an element or layer is referred to as another element or layer, "directly on" or "directly connected to" or "directly connected to" In the case of another element or layer, or "directly coupled to", it is meant that the intermediate element or layer is absent. The same elements are denoted by the same symbols throughout the text. The term ''and/or(and/or)'' as used herein includes any and all combinations of one or more of the associated listed items. It is understood that although the first, second, third, etc. It can be used to describe various elements, parts, regions, layers and/or segments, but these elements, parts, regions, layers and/or parts are not limited to these names, and this name is only for One element, one part, one area, layer or — 5180-10471-PF 8 201025476 Segment and another element, another Ai Du, s, stem # part, another area, another layer or another section The first region, the first layer or the first segment discussed below may be referred to as one without departing from the teachings of the first component of the present invention, the first component, such as a. The second component, ^ 1 亍 second part, a second area, a second layer or a second section. For the sake of convenience, the spatial phase n, the correlation name is not (for example: "benetM is located "below", "below", Λ "r ^ lower", 'above' v, “7, upper (above) and the like) is used for the relationship between the element or the external relationship of the figure or the other 7L piece or another appearance. _ 4 Appropriate description. It is understandable that these spatially related names are used in addition to the directions described for 闽 τ, and these spatial correlation names are used to include different directions of the device in use or operation.暴-^ ¥ For example, S, if the setting in the mode is overturned, then the description of the appearance or appearance of "the number of components in the other components of the number 7L is below the other components" or appearance Change to "the plural component is located in the other can be m U · "dry or above the appearance of the heart. Therefore, 561 〇 speak (below), eve_0 〈 not dry name can be included at the same time 3 above ( Above the ...) and bel〇w (located underneath the system can be steered in other ways (in the direction of 9 〇 °. The symbol is used to explain. The proprietary name used here is only used to The description of the specific embodiments is not intended to limit the invention. The singular type "& (1), "the", "the" can also include plural forms unless the text There is a clear indication. It is even more understandable that it is in the specification.

5I80-1047I-PF 9 201025476 used "comprises (including), and " , , , , · / or " compr isi ng (sentence) specific name to indicate the characteristics, the whole, steps, operations, The presence of components and/or components, but does not exclude them—or a plurality of other features, integers, steps, operations, components, and additions. The presence of components and/or their ethnic groups or the accompanying embodiments In the case of a cross-sectional view, these cross-sectional views are diagrams of the actual: examples (and intermediate structures), and thus variations in the manufacturing techniques and the shape of the pattern are expected to be expected. The embodiment should not be construed as being limited to the shape of the particular region depicted in the drawings and the error in the shape produced during manufacture. ^ =: One of the implanted regions enclosed by a rectangle may generally have a circle The curved appearance and/or the implantation on the edge of the rectangle is not produced in the implanted to non-implanted area: gradient 'and king-carry change'. Similarly, one formed by implantation Embedded under the influence of the buried area The region between the surfaces through which the implants are implanted will result in partial implantation. Therefore, the complex regions enclosed in the drawings are simply illustrated, and the shapes of the regions are not intended to describe a device. The true shape of the region is not intended to be limiting the scope of the invention. Unless otherwise defined, all names (including technical and scientific names) used herein are understood by those skilled in the art to which the invention pertains. The meaning is the same. It is more understandable that the meaning of (4) technical text = name can be used in conjunction with the general name in the dictionary, and unless specifically defined in the specification, Otherwise, this name should not be determined by means of ideal or excessive formality.

5180-10471-PF 201025476

, the village is not a π figure pair. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Figure 1 shows a diagram according to the present invention.

^ Β _ „ 1 Example for ~趁:Η, 〖Zhuang SS one day yen angle controller 2 η η zhicheng 装置 device UU - structure diagram. Please refer to Figure 1, root 摅 ★ government device - wafer angle controller i. II - for the use of - detection - under the probe card, wafer angle 2: know 'in contact angle with respect to the detection device, ° in the detection device. 1〇 0. For one of the wafers, one of the probes is opposite to the one of the probe cards, and the wafer angle controller 丨00 can be used for the contact angle of the Japanese yen. ^, thereby accurately aligning the probe card with the wafer in the detecting device. The enumerated one of the 曰&s day-day angle controller loo can include a wafer chuck 110, a chuck Sister U is a bag, a connector 120, a fixed shaft member 13〇, a threaded shaft member 14〇 and a driving unit 15〇. _ The wafer chuck 110 is relatively contiguous (the following is a detection device) In the middle - vertical shaft = called 2 axis) and rotate, and the wafer chuck U. For example, the wafer head U can be formed into a circular shape according to a circular wafer. The wafer system I is worn on the wafer head 11Q, especially at the wafer chuck. No on one of the upper classes. The collet connector 120 can be positioned on the side of the wafer: on the side: above. In the embodiment, the lost connector 12 Can be placed on top of the edge of the wafer chuck 110, and the lost connector 12〇

The 5180-10471-PF 201025476 can be extended in a direction perpendicular to the radial direction of one of the wafer chucks 11〇. Therefore, the chuck connector 120 above the wafer chuck U0 has a predetermined width w. The chuck is connected to g 12. The system can be fixed to the wafer chuck no, and the fixed shaft member 13 can be connected to the wafer chuck 11G by the chuck connector 120. The hollow member 122 can be positioned in the lost connector 12〇 and fixed. The shaft member 13 can be disposed above the IM cow 122 in the chuck connector 1, so that the fixed shaft member and the collet connector are connected to each other. As is known to those skilled in the art, the outer shape of the collet connector 120 is not limited thereby, and the collet connector 1 can have any other modifications. In one of the illustrated embodiments, a connecting body 132 can be positioned at the -th end member of the fixed shaft member 13G, and the connecting body 132 can be shaped according to one of the hollow members (2) of the collet connector 12 The inner wheel gallery is made into a shape. Therefore, the fixed shaft member 13 can be coupled to the collet connection state 120 under the action of the configuration in which the base 132 (4) is coupled to the spherical hollow member 122. When the shape of the connecting body 132 and the hollow portion 122 are both formed in a spherical shape, although the fixing Μ 13 () is in contact with the collet connector 120, the fixed shaft member 13 in the detecting device can be relatively Rotate on the z axis. The fixed axis #13G can extend along a direction perpendicular to the radial direction of the circular wafer holder 110, thereby having a length parallel to the tangential direction of the wafer chuck 110. A threaded hole (not shown) is again placed on the second end member of the shaft member i 3G, and a plurality of threads are formed on the inner surface of the threaded hole. The second end piece of the stationary shaft member is relative to its first end piece. Threaded shaft member 14G is the same as solid

5I80-I047NPF 12 201025476 The fixed shaft member 1 3 0 士士太 is extended in the fixed shaft member: and the threaded shafts have the same axis perpendicular to the 曰^ center axis. Therefore 'threaded shaft member 14. The system also extends along one of the radial directions of the plural: 1 〇, and the number of snails and minors are formed on the outer surface of the thread Ί A. Therefore, the ridge member 140 can be screwed into the threaded shaft member 140 of the fixed shaft member 13 与 and the fixed shaft member 13 〇 钍 钍 钍 糈 糈 糈 糈 糈 糈 糈 顼 顼 顼 顼 顼 顼 顼 敎 敎 敎 敎 敎 敎 敎 敎 敎(4) According to the view*, it can be relaxed or fixed. ^ Drive unit! The 50 series can be advanced to the wafer holder ιι〇 and a rotational force is applied to the screw * 140 by driving the military 150 system. For example, the drive unit 150 can include an electrical: (for example, a feeding motor). When the drive unit 15 is used to attach a f to the (four) shaft member 14G, the threaded shaft member (10) can be self-retained by the threaded hole of the shaft member 130 to relax or fulfill the screw of the shaft member 130. Among them. According to the threaded shaft member relative to the fixed shaft member 13〇, the fixing system can be changed for the joint distance d between the threaded shaft member 14Q and the fixed material MO, and the wafer is fixed due to the loss of the wafer. 7 Fix the shaft member 13. The wafer chuck HO above the probe device is rotatable relative to the z-axis. For example, when the boring shaft member 14G can be inserted into the threaded hole of the shaft member 13 ', the fixed shaft member 13 can be screwed downward toward the driving unit (10), and the threaded shaft member 14 〇 and fixed The shaft 彳 13 〇 joint distance 廿 is shortened. Therefore, since the lost connector m is fixed to the wafer, the head u is lost. 'The wafer head 110 can be rotated relative to the z-axis. 顺 〇 〇 〇 i i i i i i 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 , , , , , , , , , , , , , , , , , , 〇 Conversely, when the threaded hole of the threaded shaft member 130 is self-fixed, the fixed shaft member i30 can be self-driven and rotated, such as moving and the threaded shaft member 140 and the fixed shaft member nf) + The joint distance d is increased. The field is fixed in the wafer chuck ii〇, then the s round ten thief 120 system solids, the Japanese yen clip master U0 can be relative to the 2 axis), #行逆The clock direction is rotated by the Z phase j, and the fixed shaft member 130 is fixed to the chuck when the chuck is connected to the crying 12 茌 茌 120. That is, the wafer ❿ according to the threaded shaft 丨 4f夕βώ π 颂il 0 can be used for the relaxation and fixation of the Π0 and the slewing relative to the test card to control the wafer angle of the lower 铋needle.士Μ Head il...Shishi's example in the case of the precision of the wafer chuck U 0 in the detection device can be compared with the 俜 容 W (4) Under the action of the rotation, the movable unit 150 may be based on detecting means women 'in. By

When the Si 11 η is in the field of the wafer chuck Π U U in the clockwise direction cw哎, the rotation in the screw n direction (10) is performed on the threaded shaft member 14〇 and the fixed shaft member nf) The change is the "break" of the gap distance d between the Gusi 4 and the cow 130, which becomes the rotation of the drive unit 15〇. For example, a shaft member 15 2 can be customized to be worn along the 2 axes and is movably coupled to the vertical shaft member 152 at the detecting device 70150. According to the controller 10 shown in one of the illustrated embodiments, the loosening or fixing operation of the threaded shaft member 140 with respect to the fixed shaft member W by the driving unit 150 and the shaft #150 causes threading and threading. The change of the joint distance between the fixed shaft members 13〇, and the change can cause the wafer to lose head 11" relative h 5180-l〇 47l-pp 14 201025476 Figure 2 shows the wafer in Figure 1 Angle controller 10. The schema of the operation. Referring to Figures 1 and 2, the alumina 55 η n straw can be rotated from the wafer chuck 110 to the wafer (not shown) that has been positioned on the wafer chuck 110. In particular, based on the engagement distance of the threaded shaft member 140 and the fixed shaft member 13 of the 1jln μ wind caused by the loosening or fixing of the threaded shaft member relative to the fixed shaft member 130, Thus, the F can cause the wafer to lose its head, so that the linearity of one of the threaded shafts 14 can be used to accurately and precisely control the angle of the wafer on the wafer chuck 110. When the wafer chuck 110 is rotated, the gap distance between the screw shaft 140 and the fixed shaft member 130 is "under the inner surface of the opposing spherical hollow member 122". The system can be converted into a rotation of the connecting body 132 of the fixed shaft member 130. The unit 12 can include a guiding groove 124, which is connected to the spherical hollow portion h by a series of 4 (a) cattle 122 'and The bottom part of the hollow member 122 is m (2), which can be aligned with respect to the z-axis, and the center of the guiding groove guide m ^ is connected to the body 132 for the rotation of the body 132. The guiding groove 1.24 is the Shanghai-based axis system orthogonal to the engineering system + Extending from the x'y plane, where the z glaze is the father of the Xy plane, and early, ,., ', The bottom portion is parallel to the Xy thousand face. In addition, when the wafer holder X Υ shaft member 152 $ I, the feed is swivel, the distance d between the threaded shaft member 14 is changed below the vertical glaze member 152. The system can be converted into a wide shaft member between 13°, the drive 垔-(1) is converted into the rotation of the drive unit 150, and (4) the early heart. The system is mounted on the vertical shaft member (5). Therefore, relative to the fixed shaft member 13 The thread 4' between the threaded shaft member 140 0 and the fixed shaft member 1 3 0 is caused by the loosening or fixing.

5180-10471-PF 15 201025476 The gap distance d can be changed without the need for the wafer: the wafer chuck 110 is rotated, and the shape and position of the .0! are changed to detect the probe card. The needle, ,,,, can continuously control the contact angle of the wafer. In addition, the simple operation of the cover and the angle control by the simple operation of the relaxation and fixing of the crepe shaft member 140 can replace the conventional complicated operation of the composite mechanism. The Fig. 3 is a schematic view showing the structure for the -detecting device in accordance with another embodiment of the present invention. The fourth chart is not in Fig. 3, and one of the joint members of the head connector 220 and the wafer angle controller 2 are 红6 red. _ ^ Sectional view of the port shaft member 230 and the fifth chart are not shown in Fig. 3 of the wafer angle controller 20. The schema of the operation. / See Figures 3 and 5, except for the configuration of the joint between the collet connector 22〇 and the fixed shaft door, the structure of the circular angle control state listed in Fig. 3 is It has substantially the same structure as the wafer angle of FIG. 1 and the Yuelu state 100. Therefore, the same reference numerals are used for the same reference numerals in the drawings, and the description of the same elements will not be repeated here. In another embodiment of the present invention, a wafer angle (four) device 200 for a detecting device includes a wafer chuck 11 〇, a center head connector 22 〇, a solid 疋 shaft member 230, and a threaded shaft 彳 14 〇 and - drive unit (10). The collet connector 220 can be positioned over one of the wafer chucks 11 , and the collet connector 22 includes a cylindrical component milk, and the stationary shaft 230 can be coupled to the collet connector 22 . The cylindrical member milk, and the cylindrical member 222 of the collet connector 220 can be parallel to the detection

5180-10471-PF 16 201025476 Extends the Z axis of the device. The solid shaft member 230 can include a coupling hole 232 into which the cylindrical member 222 of the collet connector 22 can be inserted. The cylindrical member 222 that utilizes the collet connector 220 is inserted into the connecting hole 232 of the fixed shaft member 23G, and the fixed shaft member is configured to be rotated relative to the cylindrical member 222 of the collet connector 220. The connection between the fixed shaft member 230 and the collet connector 22 () can be achieved. Therefore, the fixed shaft member 230 is rotatable relative to the Z axis of the detecting device while the joint between the fixed shaft member 23G and the collet connector 220 is maintained. The operation mode of the wafer angle controller 2 shown in Fig. 3 is substantially the same as the wafer angle control stomach (10) of Fig. 1. That is, in relation to the fixed shaft member 23. Threaded shaft member 14. The relaxation and the fixed position of the ia in the threaded shaft member 1 4 0 virtual Jfl k λι, _ U and the solid shaft member 230 between the joint distance 变 ... can cause the wafer to lose head m The rotation can be performed in such a manner that the wafer is not required to be placed on the wafer chuck H0 for the shape and position of the wafer, and the contact angle of the port and the circle is precisely controlled. = is a schematic representation of a detection device 1 具 having a round angle controller (10) according to the embodiment of the invention. As shown in the figure of FIG. 6, the detection device according to one of the illustrated embodiments can perform various processes for a wafer w, a day, a day, a day, and a process, and utilize the detecting device 10 Also for the summer who 耔柏'目丨丨^ ^ From the Japanese yen W, the various procedures are missing in this example, 'detecting the loading complex class 2/3/4, —曰n ^ f J ι栝Cartridge angle control 1 100, - base 5,

5180-3047]-PF 17 201025476 Central controller Transfer unit Two cameras C2 and - _. First camera d, a second camera C3. Explore W. The plurality of classes 2, 3, and 1 are in contact with the wafer, and the wafers are oriented in three dimensions for the wafers W and 隹, thereby aligning the wafers W with the probes and fixing them to the base 5 The F-mountain sets the level 2, 3, 4 2, 3, 4 wafer angles... The controller 6 is used to control the wafer/carrier: (10) for the complex wall level. Passing a single... Bamboo day hi w is loaded on the wafer chuck element 7 and is unloaded from the wafer Wit line from the top of the image. The first-α camera C1 is used to sense the roundness w 曰 4 for the wafer w and the second camera C2. The alignment between the first.乂 Between the probes of the Japanese yen evaluation probe 1 can be moved along a: x-axis direction and a 2-axis direction respectively, and each class 2, 3, 4 can include A guide rail, a motor and a ball screw, #, the motor is used to generate the rotary power, and the ball screw moves the plurality of classes 2, 3, 4 by the rotary power generated by the motor. In the present embodiment, the wafer angle controller (10) may have the same structure as in Figs. In particular, the wafer angle controller ι includes a wafer chuck 110, a header connector 12A, a fixed shaft member 13A, a threaded shaft member 140, and a drive unit i50. The wafer chuck no can be rotated by changing the engagement distance d between the threaded shaft member and the fixed shaft member 130 according to the loosening and fixing of the threaded shaft member 140 with respect to the fixed shaft member 130. , which can be used for the wafer chuck ιι〇

5180-10473-PF 18 201025476 The wafer angle is precisely controlled. In the illustrated embodiment, the wafer angle controller 100 can be positioned over the support plate member 2, which is attached to one of the wafer chucks 110 in a radial direction and protrudes from the top level. 4 〇 Based on the photograph taken by the first camera Π, the second camera C2 and the third camera C3, the deviation between the probe of the probe card and the contact 塾 of the wafer w can be detected, and In the case of the probe card, φ can adjust the position and angle of the wafer k by the plurality of stages 2, 3, 4 and the wafer chuck 11G, thereby detecting between the probe and the contact 塾The measured deviation is corrected. According to the embodiment of the present invention, a loose or fixed operation of the threaded shaft member relative to the fixed shaft member causes a change in the joint distance between the threaded pull member and a fixed shaft member. The round angle apricot system can rotate the wafer chuck so that the angle of the circle on the wafer chuck can be changed according to the rotation of the wafer chuck. Because of this, the relaxation and fixing system performed by the rotation of the threaded shaft member can control the contact angle of the day 0 circle, so that it can be under the rotation of the threaded shaft member with respect to the probe card. The contact angle of the wafer is controlled accurately and precisely. The U-angle control system can be executed only by simple operation of loosening or fixing the screw shaft member with respect to the fixed shaft member, so that the conventional complicated operation of the composite mechanism can be replaced, and thereby the production of the detecting device can be reduced. cost. The description of the illustrated embodiments, but the description of these embodiments

5180-]〇47I-PF 19 201025476 does not impose its own limitations. Although the above is merely illustrative of the innovative teachings and advantages of the present invention: ° /, retouching, it is understood by anyone skilled in the art that the scope of protection of the present invention is "see The functional device statement in 申 Φ includes the structure of executable= as described herein and in addition to the structural equivalents, it is also proposed: It is to be understood that, although the various embodiments of the invention are described above, the foregoing description is not intended to be limited to the particular embodiments disclosed herein The modified examples are not included in the scope of the claimed patents. The embodiments of the present invention are included in the attached drawings [Simplified Description of the Drawings] The following description will be made with reference to the drawings. Figures 1 to 6 show non-use + The example is described in detail, and is used to form a limit embodiment. The first chart is not based on the present invention - the wafer angle controller _ I embodiment of the schematic device for detecting - ;; The first] dark Λ brother 1 map The wafer corner sound button type; the operation diagram of the monthly control benefit Fig. 3 shows the use of the wafer angle control according to the present invention - the detection device 4 ^ _ , FIG. 4 is a cross-sectional view of the joint member of the clip connector of one of the wafer angle controllers;

5180-10471-PF 20 201025476 FIG. 5 is a view showing the operation of the wafer angle controller in FIG. 3; and FIG. 6 is a view showing a crystal in FIG. 1 according to an embodiment of the present invention. Schematic diagram of one of the circular angle controller detection devices. [Description of main component symbols] 1 to probe card 10 to detecting device ^ 100 to wafer angle controller 102 to support plate 110 to wafer chip 120 to chuck connector 12.2 to hollow member 1.24 to guide groove Groove 13 0~fixed shaft member φ 132 to connecting body 14 0 to threaded shaft member 150 to driving unit 152 to vertical shaft member 2, 3, 4 to stage 220 to collet connector 222 to cylindrical member 2 3 0 to fixed shaft Piece 2 3 2~connection hole 5180-10471-PF 21 201025476 5~ base

6 ~ Central controller 7 - Transfer unit C1 ~ First camera C2 ~ Second camera C 3 ~ Third camera CCW ~ Reverse clock direction C W ~ Clockwise direction d ~ Bonding distance w ~ Setting width W ~ Wafer

5180-10471-PF 22

Claims (1)

201025476 * VII. Patent application scope: 1. A wafer angle controller for a detecting device, the wafer angle controller comprises: a wafer chuck, a wafer is used for positioning the wafer chuck The wafer chuck is rotatable relative to a central axis thereof; the chuck is connected to the peripheral member of the wafer holder and has a spherical hollow member therein; a fixed shaft member Extending in a tangential direction perpendicular to a radius of gyration of one of the wafer heads, the fixed shaft member includes a ball joint body, a first end member, a second end member and a threaded hole, wherein The ball joint system of the first end member corresponds to the ball type hollow member of the collet connector, and the second end member is opposite to the first end member, the threaded hole is located at the second end member a threaded shaft member coupled to the threaded hole of the fixed shaft member by a threaded joint, wherein the threaded shaft member is positioned relative to the threaded shaft member relative to the fixed shaft member Between the fixed shaft a connection = change in distance; and a σ-drive unit positioned around the wafer chuck for driving the threaded shaft member to relax and fix from the threaded hole of the fixed shaft member, The wafer chuck is rotated by the change in the joint distance between the threaded shaft member and the predetermined shaft member. 2. In the scope of the patent application, the driving unit is rotated relative to a wafer angle controller of the item 1 which is parallel to the wafer, and the vertical shaft member is rotated. by. 5180-10471-PF 23 201025476 The wafer angle controller of the patent application of the present invention, wherein the lost connector further comprises at least one guiding groove, the spherical connection of the fixed shaft The system is rotatable in the spherical hollow member of the collet connector with respect to the vertical member under the guidance of the at least guiding groove. The vertical shaft member is parallel to the crystal The center of the round collet is driven by. 4. A wafer angle controller for a probe device, the wafer angle controller comprising: a —-曰曰 round collet, a wafer for positioning on the wafer chuck, the wafer The chuck is rotatable relative to a central axis thereof; the collet is connected to the peripheral member of the wafer chuck and has a cylindrical member therein; a fixed shaft member perpendicular to the wafer Extending from a line direction of a radius of gyration of the collet, the fixed shaft member includes a connecting hole, a first end 部件 member'-the second end member and a threaded hole, the cylindrical member of the collet connector is inserted The connecting hole member at the first end member is opposite to the first end member, the threaded hole is located at the second end portion - the threaded shaft member is surface-attached to the fixing by a threaded joint (4) the hole of the shaft member, according to the loosening of the threaded shaft member relative to the fixing sleeve member, and the opening and closing of the threaded shaft member can be changed for a distance between the threaded shaft member and the fixed shaft member; and "^ The drive unit 'positioned on the wafer chuck And driving the ',, ' file % from the threaded hole of the SI wire to be loosened and fixed, so that the joint distance between the threaded shaft and the fixed shaft member is 5380-1047J- PP 24 201025476 Change and rotate the wafer head. = ★ The wafer angle controller described in item 4 of the 4th patent scope, the swaying single 7C system is rotated relative to a vertical shaft member, the part is Parallel to the center axis of the wafer chuck. The straight axis is the wafer angle controller of claim 4, wherein the fixed shaft member is connected to the fixed shaft member. The chuck of the hole is connected to the column (4) for rotation, so that the linear change of the joint distance between the threaded member and the fixed shaft member is converted into the rotation of the wafer chuck. 51?0-10471- PF 25