TW201024004A - Silver particle containing copper, its manufacturing method and dispersion liquid using the same - Google Patents

Silver particle containing copper, its manufacturing method and dispersion liquid using the same Download PDF

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Publication number
TW201024004A
TW201024004A TW98122526A TW98122526A TW201024004A TW 201024004 A TW201024004 A TW 201024004A TW 98122526 A TW98122526 A TW 98122526A TW 98122526 A TW98122526 A TW 98122526A TW 201024004 A TW201024004 A TW 201024004A
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Taiwan
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silver
copper
reaction
silver particles
solution
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TW98122526A
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Chinese (zh)
Inventor
Shuji Kaneda
Kimikazu Motomura
Tatsuya Kariyasu
Yutaka Hisaeda
Kosuke Iha
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Dowa Electronics Materials Co
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Publication of TW201024004A publication Critical patent/TW201024004A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • B22F1/054Nanosized particles
    • B22F1/0545Dispersions or suspensions of nanosized particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

The present invention provides a manufacturing method for simple and mass production of nanoparticles having a unified particle diameter, and a silver particle produced by the manufacturing method thereof. In the reaction for reducing the silver particles, a silver compound solution, a protective agent and a reducing-agent solution were mixed, and one or more of the substance selected from the group consisting of copper, copper compound and copper ion were added before the reaction terminated. By using such reaction procedures, even the silver particles in the solution having an average particle diameter of 1 to 100 nm, a homogeneous particle diameter regardless of the reaction scales can still be obtained.

Description

201024004 六、發明說明: 【發明所屬之技術領域】 本發明係關於可適用於電子裝置等的佈線或電極等的銀 粒子、含銀粒子分散液、及該銀粒子之製造方法。 【先前技術】 一般已知具奈米等級粒徑的粒子,相較於微米等級以上、 粒子之下’具有特異性質,而正針對活用該性質的利用方= 進行探討。例如在電氣•電子機器業界中,為了各種/ 小型化,便檢討有針對在活用奈米粒子尺寸或低溫燒^ 基板上形成細微佈線。 的 除例示以外,亦有針對利用於各種用途而進行檢討的 粒子,其製造法已知大致區分為氣相法與液相法等二、 因為利用氣相法進行的製造一般大多在真空條件下進= 作’因而有裝置等之初期投資成本提高、不適合大量生 缺點。此外,液相法的情況,雖適合大量生產,但因為在反 應初期與結束附近時的液性不同,且反應槽⑽液性變 原因,導致所獲得之粒子大小、或形狀等出現變動,因而結 果導致粒度分佈容易變寬的問題。 $知依”、、液相錢仃的合成’例如依液相反應獲得銀粒子 的隋況大多係藉由使銀鹽溶液與還原劑溶液直接接觸而開 始反應仁疋田使用此種反應的情況,因為反應急遽發生, 因而截至反應結束為止的時間在極端短的情況便有秒單位 098122526 201024004 $ It'此種反應會由添加液的部分局部性地進行反應。此 月兄-可讀難使賴得之粒子形態均勻。而為能獲得較均 勻粒仏便有嘗試執行高度之控制反應狀態、或選擇較緩慢 的還原齊1以降低反應速度,使其達均句化。 除此之外’奈米粒子尚有粒子凝聚的問題。奈米粒子係因 其特徵的粒徑細微度所引發的粒子間凝聚力,大於習知已知 的微米等級或*微料賴且粒子本彡的反應性較 •问’因而有陷於同㈣發粒子凝聚與結合之所謂凝結狀態, 若於此種H仍然無法呈現丨所期待的奈米粒子性質。 為解決此種事態,已有各種檢討。具體而言,有如變更反 應形態本身、或如前述在緩慢條件下施行還原,使反應系統 較均勻。前者的例子,例如專利文獻丨,從習知所施行的批 次式反應變更為連續式反應。根據該文獻的技術,藉由形成 連續式便可使混合狀態經常為一定。因而,習知之批次式反 • 應所出現的局部性濃度之變動變小,不論反應系統之任何部 分均可使反應呈均句’因而結果可獲得呈均勻粒徑的銀微粒 子。 此外’後者的例子,係如專利文獻2,嘗試有使銀鹽溶液 與弱還原劑在保護劑存在下進行混合後,再藉由徐緩加溫而 開始進行還原的方法。此情況,因為還原劑的還原力較緩 慢,因而僅使還原劑接觸於原料溶液仍無法使反應開始。為 能使還原開始’必須從系統外施加熱而開始進行反應。即, 098122526 5 201024004 亦可在使還原開始的溫度之前,將反應槽内的溶液調整為 均勻狀態。結果’從到達還原開始溫度的時點起,使反應 槽全域幾乎均勻地開始進行還原,可獲得粒徑變動較小的 粉末。 專利文獻1 :日本專利特開2004_068072號說明書 專利文獻2 :曰本專利特開2〇〇7_146279號說明書 【發明内容】 (發明所欲解決之問題) 前述專利文獻1〜2因為均能獲得粒度整合的奈米粒手’因 而能滿足所期待之粒徑均勻化的相關問題。但是,專利文獻 1的情況,因為其特徵在於連續式反應,因而於生產管理層 面而言會發生較差部分。具體而言,通常在檢討大量生產的 隋況,會因各種原因導致發生不良情況。此種情況下,連續 式反應的情況較難找出異常原因。此外,當粒子屬於条米等 級的隋況,頗難依現場(in_situ)確認不良情況。結果導致依 不良條件進行連續製造,會有大量製造物成為報廢等處分的 月、從此清况得知,由盡量減少發生不良情況時所造成之 〇 觀點而σ,較佳係批次式反應。此外,依照專利文獻 1的方法,即使單純地設為批次式反應’但如同從該文獻的 比較=記載中得知’因為會形成粒徑不均勻物,因而導致無 法獲得田初所期待之粒徑均勻性提升效果的結果。所以,頗 難使用該方式同時滿足生紐與粒徑均勻度。 098122526 201024004 再者’專利文獻2的情況,因為特意 眉劑,升溫至既定、“ 用還原力較弱的還 原劑升狐至既疋溫度而逐漸進行還原,因而 長達數小時,造成生產能反應時間 風生“力降低。此外,因為屬於 契機進行還原的反應,目而#反應槽餘百公相上,皿度為 量的情況時,反應槽_溫度變動變大,而有_不齊等之大谷[Technical Field] The present invention relates to silver particles, a silver-containing particle dispersion liquid, and a method for producing the silver particles, which are applicable to wirings, electrodes, and the like of an electronic device or the like. [Prior Art] It is generally known that particles having a nanometer-sized particle diameter are more specific than the micron-scale or lower particles, and are being used for the utilization of the property. For example, in the electrical and electronic equipment industry, for various types and miniaturizations, it has been reviewed to form fine wiring on a substrate for using nano particles or a low-temperature substrate. In addition to the examples, there are also particles which are reviewed for various uses, and the production method is known to be roughly classified into a gas phase method and a liquid phase method, etc., because the production by the vapor phase method is generally under vacuum conditions. In the first step, the initial investment cost of the device is increased, and it is not suitable for a large number of shortcomings. Further, in the case of the liquid phase method, although it is suitable for mass production, the liquidity at the initial stage of the reaction and the vicinity of the reaction is different, and the liquidity of the reaction vessel (10) is changed, resulting in fluctuations in the size and shape of the obtained particles. As a result, the problem that the particle size distribution is easily widened is caused. "Knowledge", the synthesis of liquid phase ruthenium, for example, the case of obtaining silver particles by liquid phase reaction, mostly by directly contacting the silver salt solution with the reducing agent solution to start the reaction using the reaction. Because the reaction occurs rapidly, the time until the end of the reaction is extremely short. There are seconds unit 098122526 201024004 $ It' This reaction will be partially reacted by the added liquid. This month, the brother-readable is difficult to make The obtained particles have a uniform morphology, and in order to obtain a relatively uniform particle, an attempt is made to perform a highly controlled reaction state, or a slower reduction is selected to lower the reaction rate to achieve a uniform sentence. The rice particles still have the problem of particle agglomeration. The interparticle cohesive force caused by the fineness of the characteristic particle size of the nanoparticle is larger than the known micron-scale or *micro-material and the reactivity of the particle is better. 'Therefore, there is a so-called condensed state in which the particles of the same (4) are condensed and combined with each other. If this kind of H is still unable to exhibit the properties of the nanoparticles that are expected, in order to solve this kind of situation, various kinds of things have existed. In particular, it is possible to change the reaction form itself or to perform a reduction under a slow condition as described above to make the reaction system more uniform. For example, the former example, for example, the patent document, changes from a conventional batch reaction to a continuous one. According to the technique of this document, the mixing state can be made constant by forming a continuous type. Therefore, the variation of the local concentration occurring in the conventional batch type reaction is small, regardless of any part of the reaction system. The reaction can be made uniform. Thus, silver fine particles having a uniform particle diameter can be obtained. Further, the latter example is as in Patent Document 2, and attempts have been made to mix a silver salt solution with a weak reducing agent in the presence of a protective agent. And the method of starting the reduction by slowly heating. In this case, since the reducing power of the reducing agent is relatively slow, it is impossible to start the reaction only by bringing the reducing agent into contact with the raw material solution. The reaction is started by applying heat externally. That is, 098122526 5 201024004 The solution in the reaction tank can also be used before the temperature at which the reduction starts. The result is adjusted to a uniform state. As a result, from the time when the reduction start temperature is reached, the entire reaction vessel is uniformly reduced in the entire region, and a powder having a small particle diameter variation can be obtained. Patent Document 1: Japanese Patent Laid-Open No. 2004-068072 2: 曰 专利 专利 〇〇 _ _ _ _ _ _ ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( 因为 因为A related problem of homogenization. However, in the case of Patent Document 1, since it is characterized by a continuous reaction, a poor portion occurs at the production management level. Specifically, it is usually reviewed in the case of mass production, depending on various conditions. The cause causes an adverse situation. In this case, it is more difficult to find the cause of the abnormality in the case of continuous reaction. In addition, when the particles belong to the level of the meter, it is difficult to confirm the inconvenience on the spot (in_situ). As a result, continuous manufacturing is carried out under unfavorable conditions, and a large number of manufactured products become a month of disposing, etc., and it is known from the above, and it is preferable to perform a batch reaction by minimizing the viewpoint of occurrence of a problem. Further, according to the method of Patent Document 1, even if it is simply a batch type reaction, it is known from the comparison of the document = that the particle size unevenness is formed because the method of the grain size is not formed. The result of the particle size uniformity improvement effect. Therefore, it is quite difficult to use this method to satisfy both the raw and the particle size uniformity. 098122526 201024004 Furthermore, in the case of Patent Document 2, because of the special eyebrow agent, the temperature is raised to a predetermined value, and "the reducing agent with a weak reducing power is used to raise the fox to the temperature of the ruthenium and gradually reduce it, so that it takes several hours to cause a production reaction. Time is prosperous. In addition, since it is a reaction to reduce the reaction, the reaction tank _ temperature fluctuation becomes large when the reaction tank has a hundred-fold common phase, and there is a large valley such as _

=’為:溶劑變更為所需物,必須執行所謂的溶劑取 代作業且因為所獲得之溶劑的銀濃度係Μ% 薄物’因此為了形成適於利用的濃度則必須進行濃^騎=' is: the solvent is changed to a desired substance, so-called solvent replacement work must be performed and because the silver concentration of the obtained solvent is Μ% thin matter', therefore, in order to form a concentration suitable for utilization, it is necessary to carry out a thickening

有因該超過滤而導致濃縮步驟耗#時間的問題。所以,從量 產性的觀點而言有更待進一步改善的必要。 Μ I 有鑑於習知技術所存在關題點,本㈣目的在於提供經 整合粒徑的奈綠子之簡便且躲大量生㈣製造方法及 利用該製造方法所製得之銀粒子及其集合體的粉末。 (解決問題之手段) 本發明者等為達成上述目的經深入鑽研,結果發現,若在 反應液中存在有微量銅成分之狀態下進行還原反應,便可達 成上述目的,遂完成本發明。 即,本發明銀粒子之製造方法,係在反應槽中將銀化合物 溶液、保護劑及還原劑溶液進行混合而還原的銀粒子之製造 方法,其特徵在於:於還原反應結束前,添加從銅、銅化合 物及銅離子所構成群組中選擇之丨種以上的物質(銅成分)。 再者’本發明銀粒子之製造方法之較佳形態,係將上述銅 098122526 7 201024004 2添加於魏化合物溶液、保護劑、還原劑溶液、 護劑的混合溶液、及還原劑溶液與保護劑的混: 令液所構成群組中至少選擇之一者中。 再者’上述銀粒子之製造方法之較佳形態,係上述 銅化合物及_子所構成群財_之丨種以上的 加量’依銅換算,相對於上述反應液中的 :、、 的狀態實施。 ^ 2〇〇〇ppm 形態,係上述還原反 形態,係上述保護劑 形態,係上述保護劑 再者,上述銀粒子之製造方法之較佳 應依40〜8(Tc實施。 再者,上述銀粒子之製造方法之較佳 含有碳、氮、氧之任一種以上。 再者,上述銀粒子之製造方法之較佳 的沸點在250。(:以下。 再者,上述銀粒子之製造方法之較佳形態,係上述保護劑 所具有的官能基為從及胺基所構成群組中選擇之 以卜。 m 「再者,本發明巾由銀粒子所構叙粉末(本朗書中所謂 「粉末」-用語,乃使用在測定物理特性時所提供的數值^ 依複數錄子的平均倾供之㈣),係含有w麵獅的 銅’含有從TEM像所測得之粒徑的算術平均值係 1〜100麵’且依祖法賴得之粉末比表面義5〜4〇 的銅。 098122526 8 201024004 再者’上述銀粒子之較佳形態係粒徑計測值的變動係數未 滿 30%。 再者,上述銀粒子之較佳形態係上述保護劑的沸點在25〇 °c以下。 再者,上述銀粒子之較佳形態係存在含有碳、氮、氧中任 一種以上的保護劑。 再者,上述保護劑係由有機羧酸或其衍生物所構成, Φ 係3〜8。 再者本發明分散液係含有上述本發明的銀粒子。 (發明效果) 藉由採用本說明書所揭示方法,即使在獲得溶液中的平均 粒敉為1〜l〇〇nm之銀粒子的反應操作中,不論反應規袼均 能獲得粒徑均整物。 【實施方式】 參 以下’針對本發明較佳實施形態進行說明。 本發月銀粒子製造方法係在反應槽中將銀化合物溶液、保 護劑及還㈣錢進行混合而還原的錄子之製造方法,其 特徵在於·於該反應系統巾存在有銅。另外,本說明書中所 «胃銅成分」係指存在有銅、銅化合物及銅離子巾任一者或 複數者。 本發明中’將截至溶液中的銀利用與還原劑的反應而被還 原成銀為止的期間中,使銅成分存在於混合液中的步驟,稱 098122526 201024004 :「銅添加步驟」。銅添加步驟亦可包括有在例如使銅存在 升之操 ;反應系财之後’紐_存在之反應㈣液溫上 作。 本發明之製造方法巾’目為若在反缝巾存抽成分的狀 :下進打還原反應的話,將發揮效果,因而添加的時期只要 疋在還原反應結束前便可,但為能確保反應均勻性,較佳係 在還原反應為止前的期間中均有存在。添加形態並無特別的 限制,較佳係在溶液中產生作用的銅呈離子狀態。 銅成分的添加亦可在諸如:銀化合物溶液、保護劑、還原 劑溶液、銀化合物溶液與賴_混合㈣、以及還原劑溶 液與保護_混合溶料般之還原反應實施前的原料溶液 階段便添加該原料溶液中之1種以上,亦可在從將該原料溶 液混合並開始還原反應起至結束為止期間中添加。但,因為 還原反應依情況而有在數分鐘的短時間内便完成的情況,因 而在還原反應中添加的情況時’建議選擇還原力較弱者實 施。另外,本發射,簡「反應結束」縣在從反應溶液 中所取樣的溶液中添加還原劑時,已不會引發未還原銀反應 的時點。 最終的生絲t,就從幾乎未相咖存在μ,銅被吸 入至粒子中之事並非必要構成要件。即,雖然反應機制不明 處尚多,但本發明中,銅只要在反應時存在於反應液中即足 夠。所以’所添加的銅形態並未受任何限制。例如若依塊狀 098122526 201024004 進行添加,則在銅依離子形式溶出的條件下,可為粉、箔、 塊等任何形態。但,此情況中,先考慮到粉、箔、塊等在反 應結束後能予以分離的手法,就從抑制雜質混入的觀點將屬 較佳。 本發明中,銅成分的添加量係依反應規格而異,若達一定 量以上則效果達飽和。所以,銅成分添加量的上限並無特別 決定。因而,並不需要所需以上的銅存在,最高亦是相對於 • /合液整體為未滿2000ppm、較佳未滿1〇〇〇ppm。 因為銅係屬於較卑於銀的金屬,因而在銅與銀共存的溶液 中^之離子形態較為安定。所以,在最終生成物的銀粒子 中’幾乎未含有溶液中所添加的銅。另外,本發明的銀粒子 、主由乾燥步驟亦可依粉末狀提供。所以,本㈣書巾所謂「銀 粒子」亦涵蓋形成乾燥形態時的粉末。 ❿ 在依照本案方法所形成之銀粉末巾含有的銅係在 lOOOppmfe圍内。若未滿丨獅時可謂並未依照本發明 方务進仃衣& ’右依濕式法進行製料會形絲徑不均句 :。另:方面’當超過1000ρρηι日寺,會呈現溶液中的銅與 g卩便形絲料整物,仍會有對導電性造成 =影響的可能性,因而最好避免。為了形成純銀,必須: = 代’因而殘存鋼含有量係較佳 1 〜500ppm、更佳 1〜3〇〇ppm。 。上述銀化合物溶液 以下’針對本發明原料溶液進行說明 098122526 201024004 係指使銀化合物溶解於溶劑中者。上述銀化合物的種類係配 合溶劑而適當選擇溶解物便可,例如若溶劑為水,則最好可 使用硝酸銀。 構成依照本發明之粒子的官能基’最好利用對銀粒子表面 可容易融入,具有所謂高親和性之性質者。具體可例示如綾 基、胺基等。 本發明銀粒子的使用形態係混入於諸如溶劑等之中而依 導電性分散液或糊膏形式使用。此時,為形成高導電性物, 最好形成雜質盡量少的高純度物。 為形成高純度金屬膜,必須儘可能減少雜質的混入。所 以,保護劑在燒成後的導電膜組成物中,最好幾乎消失至無 法球認到的讀。所以,構成表面的界面吨_點最好較 低。具體係在250°C以下、較佳200X:以下、承技, 尺住15〇。〇以 本發明的保護劑若具備上述特性則其餘並無特別限制可 舉例如:丁酸、戊酸、己酸、庚酸、辛酸、 ° 1X1呆酸、乳酸、 琥珀酸、己胺、辛胺、己二胺等。此外,保護 對於銀的莫耳比(保護劑分子莫耳數/銀莫耳數1,量係相 0.1〜4.0。若未滿G1時,因為相對於銀的保護劑量過=佳為 而有發生多數粒子間凝結的可能性。 V因 再者,在超過4.0的情況,被覆銀周圍的保護劑變多。此 現象表示最終生成的銀組成物中,殘存較 夕此 雜質的虞慮較 098122526 201024004 南’有不易獲得高純度銀膜之虞,因而最好避免。所以,保 護劑添加量/銀的比,較佳為0.5〜3.0、更佳1.0〜2.0範圍。 再者’上述還原劑係在能將銀離子還原至銀的前提下,其 餘並無特別的限制,可使用自習知起便已廣泛使用之氫化爛 鈉、肼、L-抗壞血酸、氫醌、没食子酸、福馬林、膦、葡糖 酸、或該孝的衍生物等。 還原劑添加量係相對於銀的當量,最好在1.0〜9.0範圍 φ 内。若未滿1 _〇時,會有發生未還原的可能性,反之,若超 過9.0時,因為還原劑量過多,因而反應過快,導致凝結粒 子增加’最終有粒徑變動變大的可能性,因而最好避免。 再者’上述還原劑溶液中’尚可更進一步含有保護劑的溶 解劑。此係當本發明製造方法可使用的保護劑缺乏對溶劑溶 解性時,用於使上述保護劑溶解。當保護劑在還原劑溶液中 並未〉谷解而呈不均勻存在時’因為有反應呈不均勻的可能 _ 性,因而較佳係添加保護劑溶解劑以使保護劑溶解。上述保 護劑溶解劑的種類係依照保護劑種類而改變,當保護劑係酸 的情況則使用氨等。此外,添加量只要保護劑溶解用的所需 之最低量便足夠。 再者’上述銀粒子之製造方法較佳係依40〜卯^範圍内實 施。若未滿40。(:時,因為銀的過飽和度提高,因而發生過 剩的核產生,而進行丨次粒子的過剩微粒子化。一般而古, 當一次粒徑較小的情況,因為凝聚力變強,因而會進行粒子 098122526 13 201024004 間的凝結,而造成粒徑變動。此外,依照其他反應條件,就 生成還原而言尚屬不足,因而發生未還原情形。此外,若超 過80C時’因為反應過快’因而在利用保護劑進行充分保 4剛’粒子間會溶接導致凝結粒子增加,隨此現象會造成粒 徑變動。 所謂還原反應依40〜80。(:實施」,亦可將投入反應槽中 的溶液分別加減4〇〜8(Π:,亦可採取最初在反應射將溶 液加熱至40〜8(TC,再於其中添加4〇〜贼其他溶液的方法 實施。 發 其次,針對依本發明製造法可製作的銀粒子進行詳細說 明。 根據本發明製造法,不論反應規格均可獲得粒徑整合的奈 米等級銀粒子。此處所謂「銀粒子粒徑」係指從TEM像中 依照後述測定法所測得丨次粒徑。本發明的銀粒子較佳係上 述1次粒徑的平均值在iMOOnm範圍内。若該i次粒徑的 ❿ 平均值未滿lnm時,因為粒子凝聚力過強,因而較難防止 粒子凝結現象的發生。此外,若超過1〇〇nm時,因為低溫 燒結性惡化,因而可認為其並不適合用於本發明之銀粒子所 預期之金屬佈線用途等。 再者’本發明銀粒子粉末依bet法所測得之比表面積係 5〜4〇m2/g、較佳15〜40m2/g、更佳20〜30m2/g。依本發明製 4方法所製付之銀粒子係藉由在製造時添加銅成分而明顯 098122526 _ 201024004 增加比表面積。關於其原因雖尚不明,但得知若將添加有鋼 與無添加時的反應情況相比較,前者的反應速度明顯變快。 此現象可認為係發揮觸媒性作用的可能性。 再者’銀粒子粉末的比表面積係可利用製造時所添加的銅 成分量進行調整。在將銀粒子施行分散液化等情況時,係調 整成適合於用途與印刷法的黏度。分散液黏度會受粒子粉末 比表面積大幅影響。例如粒子粉末比表面積較大時,因為接 •觸到粒子表面的溶劑量增加,因而未接觸到該粒子表面的溶 劑量減少,導致黏度增加。反之,粒子粉末表面積較小時, 因為接觸到粒子表面的溶劑量減少,導致無溶劑量變多,因 而黏度會降低。 一般除調整粉末表面積之外,利用黏度調整劑的添加、溶 劑添加量的調整等方法均可因應分散液的黏度調整,但黏度 調整劑的添加係如同前述理由,因為殘存雜質會增變多,因 籲而成為抑制導電性之要因,導致在形成金屬膜時的體積電阻 值提高。為了排除此種可能性,最好可利用粒子粉末比表面 積的變化進行調整。就此點觀之,如本發明般簡便地獲得各 種比表面積銀粒子粉末的製造方法,係具有可輕易對應適合 於各種用途之分散液黏度調整的優點。 再者,關於粒子粉末的比表面積調整,可考慮未採用本發 明製造方法’進行還原劑量或反應溫度調整等習知所採行的 方法,亦可調整粒子粉末的比表面積,但若根據本發明者等 098122526 15 201024004 的檢討, ’仍無法獲得具有達 即使依照此種反應條件的變更 5m2/g以上之比表面積的乾燥銀粒子粉末。此外,亦有成為 每次液性變化時職形狀亦變化等不佳銀粒子的情況、或因There is a problem that the concentration step consumes time due to the ultrafiltration. Therefore, from the viewpoint of mass production, there is a need for further improvement. Μ I In view of the problems in the prior art, the purpose of this (4) is to provide a simple and escaping method for the integration of the size of the nano-greens, and the silver particles and aggregates thereof obtained by the method. Powder. (Means for Solving the Problem) The present inventors have intensively studied in order to achieve the above object, and as a result, have found that the above object can be attained by carrying out a reduction reaction in the presence of a trace amount of a copper component in the reaction liquid, and the present invention has been completed. That is, the method for producing silver particles of the present invention is a method for producing silver particles which are obtained by mixing a silver compound solution, a protective agent and a reducing agent solution in a reaction vessel, and is characterized in that copper is added before the completion of the reduction reaction. A substance (copper component) selected from the group consisting of a copper compound and a copper ion. Further, in a preferred embodiment of the method for producing silver particles of the present invention, the copper 098122526 7 201024004 2 is added to a mixed solution of a Wei compound solution, a protective agent, a reducing agent solution, a protective agent, and a reducing agent solution and a protective agent. Mix: At least one of the selected groups of fluids. In a preferred embodiment of the method for producing the above-mentioned silver particles, the amount of the above-mentioned copper compound and the constitutive group of the above-mentioned copper compound and the genus Implementation. ^ 2 〇〇〇 ppm form, which is the above-mentioned reducing form, which is the protective agent form, and is the above protective agent. Further, the method for producing the silver particles is preferably carried out according to 40 to 8 (Tc. Further, the above silver The method for producing the particles preferably contains at least one of carbon, nitrogen and oxygen. Further, the method for producing the silver particles preferably has a boiling point of 250. (The following is the same. Further, the method for producing the silver particles described above In a preferred embodiment, the functional group of the protective agent is selected from the group consisting of an amine group and m. "In addition, the towel of the present invention is composed of silver particles (the so-called "powder" in this book - The term used is the value provided in the measurement of physical properties ^ According to the average declination of the plural (4), the copper containing the w-face lion contains the arithmetic mean of the particle size measured from the TEM image. It is a copper having a surface of 1 to 100 Å and a powder having a surface ratio of 5 to 4 Å. 098122526 8 201024004 Further, the coefficient of variation of the particle diameter measurement value of the preferred silver particles is less than 30%. Furthermore, the preferred form of the silver particles is the above The boiling point of the agent is not more than 25 ° C. Further, a preferred form of the silver particles is a protective agent containing at least one of carbon, nitrogen and oxygen. Further, the protective agent is derived from an organic carboxylic acid or a derivative thereof. The composition of the present invention is Φ 3 to 8. Further, the dispersion of the present invention contains the above-described silver particles of the present invention. (Effect of the Invention) By using the method disclosed in the present specification, even if the average particle size in the solution is 1~ In the reaction operation of silver particles of 〇〇nm, the particle size uniformity can be obtained regardless of the reaction standard. [Embodiment] The following description of the preferred embodiments of the present invention will be described. A method for producing a recording medium in which a silver compound solution, a protective agent, and a (4) money are mixed and reduced in a reaction tank, characterized in that copper is present in the reaction system towel, and the "stomach copper component" in the present specification is In the present invention, in the case where the copper, the copper compound, and the copper ion towel are present in a plurality of cases, in the period in which the silver in the solution is reduced to silver by the reaction with the reducing agent, the copper is formed. The step of being present in the mixed solution is called 098122526 201024004: "copper addition step". The copper addition step may also include the operation of raising the copper in, for example, the reaction, and the reaction of the reaction (4) after the reaction. The manufacturing method of the present invention is intended to provide a reaction in the form of a reverse-sewed towel: a reduction reaction is carried out, and the effect is obtained. Therefore, the period of addition may be before the completion of the reduction reaction, but the reaction can be ensured. The uniformity is preferably present in the period before the reduction reaction. The addition form is not particularly limited, and it is preferred that the copper which acts in the solution is in an ionic state. The addition of the copper component may also be in, for example, silver. One or more of the raw material solutions are added to the compound solution, the protective agent, the reducing agent solution, the silver compound solution, the lysate (mixed), and the reducing agent solution and the protective solution-mixing solution. It may be added during the period from the start of the mixing of the raw material solution to the start of the reduction reaction. However, since the reduction reaction is completed in a short time in a few minutes depending on the situation, it is recommended to select a case where the reduction reaction is weak. In addition, in the present emission, when the reducing agent is added to the solution sampled from the reaction solution in the "end of reaction" county, the time at which the unreduced silver reaction is not caused is not caused. The final raw silk t, from the fact that there is almost no photo in the presence of copper, is not necessary for the copper to be absorbed into the particles. Namely, although the reaction mechanism is not known, in the present invention, it is sufficient that copper is present in the reaction liquid at the time of the reaction. Therefore, the form of copper added is not subject to any restrictions. For example, if it is added in the form of a block of 098122526 201024004, it may be in the form of powder, foil, or block in the case where copper is eluted in the form of ions. However, in this case, it is preferable to consider the method of separating the powder, the foil, the block, and the like after the reaction is completed, from the viewpoint of suppressing the incorporation of impurities. In the present invention, the amount of the copper component added varies depending on the reaction standard, and if it is a certain amount or more, the effect is saturated. Therefore, the upper limit of the amount of copper component added is not particularly determined. Therefore, the presence of more than the required copper is not required, and the maximum is less than 2000 ppm, preferably less than 1 ppm, relative to the total of the / liquid mixture. Since the copper system is a metal that is more inferior to silver, the ion form in the solution in which copper and silver coexist is relatively stable. Therefore, in the silver particles of the final product, the copper added in the solution is hardly contained. Further, the silver particles of the present invention and the main drying step may be provided in the form of a powder. Therefore, the so-called "silver particles" of this (4) book towel also covers the powder in the form of a dry form.银 The silver powder towel formed in accordance with the method of the present invention contains copper in the range of 1000 ppm. If it is not full of lions, it can be said that according to the invention, the filth is in accordance with the invention. Another: Aspects' When more than 1000ρρηι Temple, it will show the copper and g-shaped silk material in the solution, there is still the possibility of affecting the conductivity, so it is best to avoid. In order to form pure silver, it is necessary to have: = generation and thus the residual steel content is preferably from 1 to 500 ppm, more preferably from 1 to 3 ppm. . The above silver compound solution is described below with respect to the raw material solution of the present invention. 098122526 201024004 means a compound in which a silver compound is dissolved in a solvent. The type of the above-mentioned silver compound may be appropriately selected by using a solvent, and for example, if the solvent is water, silver nitrate is preferably used. The functional group constituting the particles according to the present invention is preferably one which can be easily incorporated into the surface of the silver particles and has a property of so-called high affinity. Specific examples thereof include a mercapto group, an amine group and the like. The use form of the silver particles of the present invention is used in the form of a conductive dispersion or a paste, for example, in a solvent or the like. At this time, in order to form a highly conductive material, it is preferable to form a high-purity substance having as few impurities as possible. In order to form a high-purity metal film, it is necessary to minimize the incorporation of impurities. Therefore, it is preferable that the protective agent in the conductive film composition after firing disappears almost to the reading which is not recognized by the ball. Therefore, the interface _ point of the surface constituting the surface is preferably lower. Specifically, it is below 250 ° C, preferably 200X: below, and the skill is 15 feet. The protective agent of the present invention is not particularly limited as long as it has the above characteristics, and examples thereof include butyric acid, valeric acid, caproic acid, heptanoic acid, octanoic acid, ° 1X1 acid, lactic acid, succinic acid, hexylamine, and octylamine. , hexamethylene diamine, etc. In addition, the molar ratio of silver is protected (the molar number of the protective agent molecule/the number of silver moles is 1, and the amount is 0.1 to 4.0. If it is less than G1, it occurs because the protective dose relative to silver is too good. The possibility of condensation between most particles. V. In addition, in the case of more than 4.0, there is a large amount of protective agent around the coated silver. This phenomenon indicates that the silver composition in the final formation has the concern of the residual impurity compared with 098122526 201024004. South 'has not easy to obtain a high-purity silver film, so it is best to avoid it. Therefore, the ratio of the amount of the protective agent added / silver is preferably in the range of 0.5 to 3.0, more preferably 1.0 to 2.0. Under the premise of reducing silver ions to silver, the rest is not particularly limited. Hydrogenated sodium, strontium, L-ascorbic acid, hydroquinone, gallic acid, formalin, phosphine, and glucosamine, which have been widely used since the beginning of the study, can be used. a sugar acid, or a derivative of the filial acid, etc. The amount of the reducing agent added is preferably in the range of 1.0 to 9.0 in terms of the equivalent of silver. If less than 1 〇, the possibility of non-reduction may occur, and vice versa. If it exceeds 9.0, because there is too much reducing dose Therefore, the reaction is too fast, resulting in an increase in the number of condensed particles. "There is a possibility that the particle size variation becomes large, and thus it is preferable to avoid it. Further, in the above-mentioned reducing agent solution, a solvent containing a protective agent can be further contained. The protective agent which can be used in the production method of the present invention is used for dissolving the above protective agent when it lacks solubility in a solvent. When the protective agent is not uniformly present in the reducing agent solution, it is unevenly present because the reaction is uneven. It is preferable to add a protective agent solubilizing agent to dissolve the protective agent. The type of the protective agent solubilizing agent is changed depending on the kind of the protective agent, and when the protective agent is an acid, ammonia or the like is used. The amount of the protective agent required to dissolve is sufficient. Further, the method for producing the above silver particles is preferably carried out in the range of 40 to 。. If it is less than 40 (:: because of the supersaturation of silver) Increase, and thus excessive nuclear generation occurs, and excess particulates of the primary particles are carried out. Generally, when the primary particle diameter is small, since the cohesive force becomes strong, the particles are formed. Condensation between 098122526 13 and 201024004 causes particle size variation. In addition, according to other reaction conditions, it is insufficient in terms of reduction, and thus unreduced. In addition, if it exceeds 80C, 'because the reaction is too fast', it is utilized. The protective agent is fully protected, and the particles are dissolved to cause an increase in the number of coagulated particles. This phenomenon causes a change in the particle size. The so-called reduction reaction is 40 to 80. (: Implementation), the solution introduced into the reaction tank may be separately added or subtracted. 4 〇 ~ 8 (Π:, can also be taken in the initial reaction in the reaction to heat the solution to 40 ~ 8 (TC, and then add 4 〇 ~ thief other solution method. The second, for the manufacturing method according to the invention can be made The silver particles are described in detail. According to the production method of the present invention, nano-sized silver particles having an integrated particle size can be obtained regardless of the reaction specifications. Here, the "silver particle diameter" means a particle diameter measured by a measurement method described later from a TEM image. The silver particles of the present invention are preferably such that the average value of the primary particle diameter is in the range of iMOOnm. If the average value of i of the i-th particle diameter is less than 1 nm, since the cohesive force of the particles is too strong, it is difficult to prevent the occurrence of particle coagulation. Further, when it exceeds 1 〇〇 nm, since the low-temperature sinterability is deteriorated, it is considered to be unsuitable for use in metal wiring applications and the like intended for the silver particles of the present invention. Further, the specific surface area measured by the bet method of the silver particle powder of the present invention is 5 to 4 m 2 /g, preferably 15 to 40 m 2 /g, more preferably 20 to 30 m 2 /g. The silver particles produced by the method of the present invention 4 are apparently increased by adding a copper component at the time of manufacture 098122526 _ 201024004. Although the reason for this is not known, it is found that the reaction rate of the former is remarkably faster when the steel is added and compared with the case of no addition. This phenomenon is considered to be a possibility of exerting a catalytic effect. Further, the specific surface area of the silver particle powder can be adjusted by the amount of the copper component added at the time of production. When the silver particles are dispersed and liquefied, the viscosity is adjusted to suit the application and the printing method. The viscosity of the dispersion is greatly affected by the specific surface area of the particle powder. For example, when the specific surface area of the particle powder is large, since the amount of solvent which contacts the surface of the particle increases, the amount of the solvent which is not in contact with the surface of the particle decreases, resulting in an increase in viscosity. On the other hand, when the surface area of the particle powder is small, since the amount of solvent contacting the surface of the particle is reduced, the amount of solvent-free is increased, and the viscosity is lowered. In general, in addition to adjusting the surface area of the powder, the addition of the viscosity modifier and the adjustment of the amount of the solvent may be adjusted according to the viscosity of the dispersion, but the addition of the viscosity modifier is as described above, because the residual impurities may increase. As a result of suppressing the conductivity, the volume resistance value at the time of forming the metal film is increased. In order to eliminate this possibility, it is preferable to adjust the particle powder by the change in the surface area. From this point of view, the method for producing various specific surface area silver particle powders is easily obtained as in the present invention, and has an advantage that the viscosity of the dispersion liquid suitable for various uses can be easily adjusted. Further, regarding the specific surface area adjustment of the particle powder, a method which is not conventionally employed in the production method of the present invention, such as a reduction amount or a reaction temperature adjustment, may be considered, and the specific surface area of the particle powder may be adjusted, but according to the present invention Review of 098122526 15 201024004, 'It is still not possible to obtain dry silver particle powder having a specific surface area of 5 m 2 /g or more even if it is changed according to such reaction conditions. In addition, there are cases of poor silver particles such as changes in the shape of the job when each liquidity changes, or

一般係將從TEM像所測得之一 的粒徑變動。關於粒徑的變動, -一次平均粒彳坐的標準偏差值’ 除以平均值後所獲;^之變動係數㈣為指標。在本發明銀粒 子的ft況’上述變動係數未滿35%。若此值達以上, 便粒徑變動較大,最好避免。較佳係未滿3〇%。 本發明的銀粒子係藉由採用上述構造,而呈低溫燒結性優 異之I1生質。銀的總體阻抗值(buik resistance value)係1.6μΩ • cm,藉由採用本發明的粒子,即使將燒成溫度設為250 C左右’仍可獲得近似該值的電阻值。此外,為了賦予此種 性質’當然必須考慮到形成後述分散液時的構造、特別係分 散媒、添加劑分解點、及沸點等。 再者,因為根據本發明銀粒子製造方法,可簡便地製造各 種比表面積的銀粒子粉末,因而可製作能因應各種用途、印 刷法的分散液。本發明所謂「分散液」係指本發明銀粒子分 散於溶劑中的液體。 再者’根據本發明較佳實施形態,因為在反應後會凝聚沉 殿’因而利用過濾便可簡便地施行固液分離,更可使該粉末 098122526 16 201024004 再分散於各種溶劑中。此時可使用的分散液溶劑係可例示 如:水、醇、多元醇、二醇醚、卜甲基吡咯烷二酮、吡啶不 松油醇、丁基卡必醇、丁基卡必醇醋酸酯、2,2,4_三甲基3_ 戊二醇單丁酸酯(Texanol)、苯氧基丙醇等。 再者,為能更加提升分散液的分散性或搖變性等與分散 液溶劑一起添加黏結劑或分散劑之任一者、或二者,亦可構 成較佳形態。黏結劑係對粒子賦予分散獨立性的必要要素, •因而必須至少具有與溶劑及粒子間的親和性。此外,不管分 散性如何提高,若在燒結時未被排出於系統外,亦不符H 案發明目的。即,分解或揮散溫度在25(rc以者 擇。若至少具有上述性質,則不管市售的有機、無 適當地使用。此外,不僅可使用單獨種類,亦可合併使用。 具體的黏結劑,作為有機黏結劑係可添加使用例如:丙烯 酸樹脂、聚酯樹脂、環氧樹脂、酚樹脂、苯氧樹脂、DAp 鲁樹脂、胺基曱酸乙酯樹脂、氟樹脂、聚醯亞胺樹脂、聚醯胺 樹脂、聚矽氧樹脂、聚烯烴樹脂、乙基纖維素及聚乙烯醇等, 作為無機黏結劑係可使用例如:二氧化€夕溶膠、氧化銘溶 膠、二氧化锆溶膠、二氧化鈦溶膠等。Generally, the particle diameter changes from one of the TEM images. Regarding the variation of the particle size, - the standard deviation value of the average granule squatting' is obtained by dividing the average value; the coefficient of variation (4) of the ^ is an index. In the ft condition of the silver particles of the present invention, the above coefficient of variation is less than 35%. If the value is above, the particle size will vary greatly and it is best to avoid it. Preferably, it is less than 3%. The silver particles of the present invention have an I1 biomass which is excellent in low-temperature sinterability by adopting the above structure. The bulk resistance value of silver is 1.6 μΩ • cm, and by using the particles of the present invention, a resistance value similar to this value can be obtained even if the firing temperature is set to about 250 C. Further, in order to impart such a property, it is of course necessary to take into consideration the structure at the time of forming a dispersion described later, in particular, a dispersing medium, an additive decomposition point, and a boiling point. Further, according to the method for producing silver particles of the present invention, it is possible to easily produce silver particle powders having various specific surface areas, and thus it is possible to produce a dispersion liquid which can be used in various applications and printing methods. The "dispersion liquid" in the present invention means a liquid in which the silver particles of the present invention are dispersed in a solvent. Further, according to a preferred embodiment of the present invention, since the solidified liquid separation can be easily carried out by filtration after the reaction, the powder 098122526 16 201024004 can be further dispersed in various solvents. The dispersion solvent which can be used at this time may, for example, be water, an alcohol, a polyhydric alcohol, a glycol ether, a methylpyrrolidinedione, pyridyl oleyl alcohol, butyl carbitol, butyl carbitol acetate, 2,2,4_trimethyl 3_pentanediol monobutyrate (Texanol), phenoxypropanol, and the like. Further, in order to further improve the dispersibility of the dispersion liquid or the addition of a binder or a dispersant together with the dispersion solvent, it is also possible to form a preferred embodiment. The binder is an essential element for imparting dispersion independence to the particles, and therefore must have at least affinity with the solvent and the particles. In addition, regardless of the increase in the dispersibility, if it is not discharged outside the system during sintering, it does not meet the purpose of the invention of H. That is, the decomposition or vaporization temperature is selected at 25 (rc). If at least the above properties are present, the commercially available organic materials are not suitably used. Further, not only a single type but also a combination of specific types may be used. As the organic binder, for example, an acrylic resin, a polyester resin, an epoxy resin, a phenol resin, a phenoxy resin, a DAp resin, an amino phthalate resin, a fluororesin, a polyimide resin, a poly For example, a ruthenium resin, a polysiloxane resin, a polyolefin resin, an ethyl cellulose, a polyvinyl alcohol, or the like, as the inorganic binder, for example, a oxidized sol, an oxidized sol, a zirconia sol, a titania sol or the like can be used. .

具體名稱已知有下述物,但在具有上述性質的前提下,並 不排除本欄所記載物以外的物質。作為丙烯酸樹脂係可舉例 如:BR-102、BR-105、BR-117、BR-118、BR-1122、MB_3058(S 菱嫘縈股份有限公司製)、ARFLON UC-3000、ARFLON 098122526 17 201024004 UG-4010、ARFLON UG-4070、ARFLON UH-2041、ARFLON UP-1020、ARFLON UP-l(m、ARFLON UP-1061(東亞合成 股份有限公司製);作為聚酯樹脂係可舉例如:Vylon 220、The following names are known from the specific names, but those having the above properties do not exclude substances other than those described in the column. Examples of the acrylic resin system include BR-102, BR-105, BR-117, BR-118, BR-1122, MB_3058 (manufactured by S. Ryokan Co., Ltd.), ARFLON UC-3000, and ARFLON 098122526 17 201024004 UG. -4010, ARFLON UG-4070, ARFLON UH-2041, ARFLON UP-1020, ARFLON UP-l (m, ARFLON UP-1061 (manufactured by Toagosei Co., Ltd.); as a polyester resin, for example, Vylon 220,

Vylon 500、Vylon UR1350(東洋紡績股份有限公司製)、 MALKYD® No 1(荒川化學工業股份有限公司製);作為環氧 樹脂係可舉例如:ADEKA RESIN EP-4088S、ADEKA RESIN EP-49-23(ADEKA 股份有限公司製)、871(Japan Epoxy Resins 股份有限公司製);作為酚樹脂係可舉例如:RESITOP ❿ PL-4348、RESITOP PL-6317(群榮化學工業股份有限公司 製);作為苯氧樹脂係可舉例如:1256、4275(Japan Epoxy Resins股份有限公司製)、TAMANOL 340(荒川化學工業股 份有限公司製);作為DAP樹脂係可舉例如:DAP A、DAP K(DAISO股份有限公司製);作為胺基曱酸乙酯樹脂係可舉 例如:MILLIONATE® MS-50(日本聚氨酯工業股份有限公司 製);作為乙基纖維素係可舉例如:ETHOCEL © STAND ARD4、ETHOCEL STAND ARD7、ETHOCEL STANDARD20、ETHOCEL STANDARD100(日進化成股份有 限公司製);作為聚乙烯醇係可舉例如:RS-1713、RS-1717、 RS-2117(KURARAY股份有限公司製)。 再者,分散劑亦是在具有粒子表面與親和性,且對分散媒 具有親和性的前提下’即便市售通用物仍可滿足。此外,不 僅可使用單獨種類,亦可合併使用。 098122526 18 201024004 分散劑代表者係有如:脂肪酸鹽(皂)、α_續脂肪酸醋鹽 (MES)、烧基苯確酸鹽(ABS)、直鏈烧基苯續酸鹽(las)、燒 基硫酸鹽(AS)、烷基醚硫酸酯鹽(AES)、烷基硫酸三乙醇等 的低分子陰離子性(陰離子性)化合物;脂肪酸乙醇醯胺、聚 氧乙烯烧基鱗(AE)、聚氧乙稀烧基苯謎(ape)、山梨糖醇、 山梨糖醇酐等之類的低分子非離子系化合物;炫基三曱基銨 鹽、二炫基二曱基氣化銨、烧基氣化比唆鏘等之類的低分子 _ 陽離子性(陽離子性)化合物;烷基羧基甜菜檢、磺酸基甜菜 檢、卵鱗脂等的低分子兩性系化合物;或蔡績酸鹽的福馬林 縮合物、聚苯乙烯績酸鹽、聚丙稀酸鹽、乙稀化合物與幾酸 系單體的共聚合體鹽、羧甲基纖維素、聚乙烯醇等所代表的 高分子水系分散劑;聚丙烯酸部分烷基酯、聚伸烷基多元胺 等之高分子非水系分散劑;聚伸乙基亞胺、曱基丙烯酸胺烷 基酯共聚合體等之高分子陽離子系分散劑,惟若屬於適用於 • 本發明粒子的較佳物,則並不排除具有此處所例示形態物以 外的構造物。 作為分散劑,若舉具體名稱已知有如下述物。可例示如: Flouren DOPA-15B、Flouren DOPA-17(共榮公司化學股份有 限公司製);SOLPLUS® AX5、SOLPLUS® TX5、Solsperse 9000、Solsperse 12000、Solsperse 17000、Solsperse 20000、Vylon 500, Vylon UR1350 (manufactured by Toyobo Co., Ltd.), MALKYD® No. 1 (manufactured by Arakawa Chemical Industry Co., Ltd.); as epoxy resin, for example, ADEKA RESIN EP-4088S, ADEKA RESIN EP-49-23 (made by ADEKA Co., Ltd.), 871 (made by Japan Epoxy Resins Co., Ltd.); phenolic resin type: RESITOP ❿ PL-4348, RESITOP PL-6317 (made by Qunrong Chemical Industry Co., Ltd.); Examples of the oxy-resin may be, for example, 1256, 4275 (manufactured by Japan Epoxy Resins Co., Ltd.) or TAMANOL 340 (manufactured by Arakawa Chemical Industries Co., Ltd.); and as DAP resin, for example, DAP A, DAP K (DAISO Co., Ltd.) (A), for example, ETHOCEL © STAND ARD4, ETHOCEL STAND ARD7, ETHOCEL STANDARD20, ETHOCEL STANDARD100 (made by Nippon Evolution Co., Ltd.); as a polyvinyl alcohol, for example, RS-1713, RS-1717, and RS-2117 (KURARAY shares are available) Co., Ltd.). Further, the dispersant is also provided on the premise that it has a particle surface and affinity and has affinity for a dispersing medium. In addition, not only individual types but also combinations can be used. 098122526 18 201024004 Representatives of dispersing agents are: fatty acid salts (soap), α_continuous fatty acid vinegar (MES), benzoic acid (ABS), linear alkyl benzoate (las), alkyl Low molecular anionic (anionic) compounds such as sulfate (AS), alkyl ether sulfate (AES), alkyl triacetate, etc.; fatty acid ethanol decylamine, polyoxyethylene squaring (AE), polyoxygen Low-molecular nonionic compounds such as ace, sorbitol, sorbitol, etc.; succinyltrimethylammonium salt, dinonyldithiocarbamate, and base gas a low molecular cation (cationic) compound such as hydrazine or the like; a low molecular amphoteric compound such as an alkylcarboxy beet test, a sulfonic acid beet test, or an egg squama; or a formalin a polymer aqueous dispersant represented by a condensate, a polystyrene acid salt, a polyacrylic acid salt, a copolymer salt of an ethylene compound and a few acid monomers, a carboxymethyl cellulose, a polyvinyl alcohol, or the like; a polyacrylic acid Polymer non-aqueous dispersing agent such as partial alkyl ester, polyalkylene polyamine, etc.; Cationic amine polymer-based dispersing agent, Yue-based acrylic acid alkyl ester amine of copolymer, etc., but if part of the present invention suitable for • preferred compound particles, it does not exclude exemplified here was the outer shape of the structure. As the dispersing agent, the following names are known as the following. Examples are: Flouren DOPA-15B, Flouren DOPA-17 (Co-Profit Chemical Co., Ltd.); SOLPLUS® AX5, SOLPLUS® TX5, Solsperse 9000, Solsperse 12000, Solsperse 17000, Solsperse 20000,

Solsperse 21000、Solsperse 24000、Solsperse 26000、Solsperse 27000、Solsperse 28000、Solsperse 32000、Solsperse 35100、 098122526 19 201024004Solsperse 21000, Solsperse 24000, Solsperse 26000, Solsperse 27000, Solsperse 28000, Solsperse 32000, Solsperse 35100, 098122526 19 201024004

Solsperse 54000、SOLTHIX 250(日本 Lubrizol 股份有限公司 製);EFKA4008、EFKA4009、EFKA4010、EFKA4015、 EFKA4046、 EFKA7462、 EFKA4400 、 EFKA4300 、 EFKA6225 、 EFKA4047 EFKA4020 EFKA4401 EFKA4330 EFKA6700 、EFKA4060 、 、EFKA4050 、 、EFKA4402 、 、EFKA4340 、 、EFKA6780 、 EFKA4080、 EFKA4055、 EFKA4403 、 EFKA6220、 EFKA6782 、Solsperse 54000, SOLTHIX 250 (made by Lubrizol Co., Ltd.); EFKA4008, EFKA4009, EFKA4010, EFKA4015, EFKA4046, EFKA7462, EFKA4400, EFKA4300, EFKA6225, EFKA4047 EFKA4020 EFKA4401 EFKA4330 EFKA6700, EFKA4060, EFKA4050, EFKA4402, EFKA4340, EFKA6780, EFKA4080, EFKA4055, EFKA4403, EFKA6220, EFKA6782,

EFKA8503(Efka Additives 公司製);AJISPER PA111、 AJISPER PB71 卜 AJISPER PB821、AJISPER PB822、AJISPER PN411、FAMEX® L_12(Ajinomoto Fine-Techno 股份有限公 司製);TEXAPHOR-UV2 卜 TEXAPHOR-UV61(Cognis Japan 股份有限公司3 DisperBYK106 、 DisperBYK116 、 DisperBYK142 、 DisperBYK162 、 DisperBYK166 、 DisperBYK170 、 DisperBYK180 ' DisperBYK193 、 DisperBYK2020、 DisperBYK2070 、 );DisperBYKIOl DisperBYK108 、 DisperBYK130 、 DisperBYK145 、 DisperBYK163 、 DisperBYK167 、 DisperBYK171 、 DisperBYK182 、 DisperBYK2000、 DiSperBYK2025、 DisperBYK2155 、 、DisperBYK102、 DisperBYKlll 、 DisperBYK140 、 DisperBYK161 、 DisperBYK164 、 DisperBYK168 、 DiSperBYK174 、 DisperBYK192 、 DisperBYK2001 、 DisperBYK2050、 DisperBYK2164 、 098122526 20 201024004 BYK220S、BYK300、BYK306、BYK320、BYK322、BYK325、 B YK3 3 0、B YK3 40、B YK3 5 0、B YK3 7 7、B YK3 7 8、B YK3 8 ON、 BYK410、BYK425、BYK430(BYK-Chemie · Japan 股份有限 公司製);DISPARON 1751N、DISPARON 1831、DISPARON 1850、DISPARON 1860、DISPARON 1934、DISPARON DA-400N、DISPARON DA-703-50、DISPARON DA-725、 DISPARON DA_705、DISPARON DA-7301、DISPARON φ DN-900、DISPARON NS-5210、DISPARON NVI-8514L、 HIPLAD ED-152、HIPLAD ED-216、HIPLAD ED-251、 HIPLAD ED-360(橋本化成股份有限公司);FTX-207S、 FTX-212P、FTX-220P、FTX-220S、FTX-228P、FTX-710LL、 FTX-750LL、FTERGENT® 212P、FTERGENT® 220P、 FTERGENT⑧ 222F、FTERGENT® 228P、FTERGENT® 245F、FTERGENT® 245P、FTERGENT® 250、FTERGENT® • 251、FTERGENT® 710FM、FTERGENT® 730FM、EFKA8503 (manufactured by Efka Additives); AJISPER PA111, AJISPER PB71, AJISPER PB821, AJISPER PB822, AJISPER PN411, FAMEX® L_12 (made by Ajinomoto Fine-Techno Co., Ltd.); TEXAPHOR-UV2 TEXAPHOR-UV61 (Cognis Japan Co., Ltd.) 3 DisperBYK106, DisperBYK116, DisperBYK142, DisperBYK162, DisperBYK166, DisperBYK170, DisperBYK180 'DisperBYK193, DisperBYK2020, DisperBYK2070,); DisperBYKIOl DisperBYK108, DisperBYK130, DisperBYK145, DisperBYK163, DisperBYK167, DisperBYK171, DisperBYK182, DisperBYK2000, DiSperBYK2025, DisperBYK2155,, DisperBYK102, DisperBYKlll, DisperBYK140 , DisperBYK161, DisperBYK164, DisperBYK168, DiSperBYK174, DisperBYK192, DisperBYK2001, DisperBYK2050, DisperBYK2164, 098122526 20 201024004 BYK220S, BYK300, BYK306, BYK320, BYK322, BYK325, B YK3 3 0, B YK3 40, B YK3 5 0, B YK3 7 7 , B YK3 7 8, B YK3 8 ON, BYK410, BYK425, BYK430 (BYK-Chemie · Japan shares Limited company system); DISPARON 1751N, DISPARON 1831, DISPARON 1850, DISPARON 1860, DISPARON 1934, DISPARON DA-400N, DISPARON DA-703-50, DISPARON DA-725, DISPARON DA_705, DISPARON DA-7301, DISPARON φ DN-900 DISPARON NS-5210, DISPARON NVI-8514L, HIPLAD ED-152, HIPLAD ED-216, HIPLAD ED-251, HIPLAD ED-360 (Hashimoto Kasei Co., Ltd.); FTX-207S, FTX-212P, FTX-220P, FTX-220S, FTX-228P, FTX-710LL, FTX-750LL, FTERGENT® 212P, FTERGENT® 220P, FTERGENT8 222F, FTERGENT® 228P, FTERGENT® 245F, FTERGENT® 245P, FTERGENT® 250, FTERGENT® • 251, FTERGENT® 710FM, FTERGENT® 730FM,

FTERGENT⑨ 730LL、FTERGENT® 730LS、FTERGENT® 750DM、FTERGENT® 750FM(Neos 股份有限公司製); AS-1100、AS-1800、AS-2000(東亞合成股份有限公司製); KAOCER® 2000、KAOCER® 2100、KDH_ 154、MX-2045L、 HOMOGENOL L-18、HOMOGENOL L-95、RHEODOL SP-010V、RHEODOL SP-030V、RHEODOL SP-L10、RHEODOL SP-P10(花王股份有限公司製);EVAN U103、SEANOL 098122526 21 201024004FTERGENT9 730LL, FTERGENT® 730LS, FTERGENT® 750DM, FTERGENT® 750FM (manufactured by Neos Co., Ltd.); AS-1100, AS-1800, AS-2000 (manufactured by Toagosei Co., Ltd.); KAOCER® 2000, KAOCER® 2100, KDH_ 154, MX-2045L, HOMOGENOL L-18, HOMOGENOL L-95, RHEODOL SP-010V, RHEODOL SP-030V, RHEODOL SP-L10, RHEODOL SP-P10 (made by Kao Co., Ltd.); EVAN U103, SEANOL 098122526 21 201024004

DC902B、NOIGEN EA-167、PLYSURF A219B、PLYSURF AL(第一工業製藥股份有限公司製);MEGAFAC® F-477、 MEGAFAC® 480SF、MEGAFAC® F-482(DIC 股份有限公司 製);SEALFAITH SAG503A、Dynol 604(日信化學工業股份 有限公司製);SN Spurs 2180、SN Spurs 2190、SN Leveller S-906(San Nopco 股份有限公司製);S-386、S420(AGC SEIMI CHEMICAL股份有限公司製)等。 ❹ 再者,分散液調整時亦可使用適當的機械式分散處理。施 行機械式分散處理時,在不致衍生粒子明顯改質的條件下, 可採用公知任何方法。具體可例示如:超音波分散、分散機、 三輥磨碎機、球磨機、珠磨機、雙轴捏合機、自公轉式撲拌 機等’該等係可單獨使用、或併用複數種。 以下’針對本發明所使用之測定方法進行說明。 (從TEM像的一次粒徑平均值測定)DC902B, NOIGEN EA-167, PLYSURF A219B, PLYSURF AL (manufactured by Daiichi Kogyo Co., Ltd.); MEGAFAC® F-477, MEGAFAC® 480SF, MEGAFAC® F-482 (manufactured by DIC Corporation); SEALFAITH SAG503A, Dynol 604 (manufactured by Nissin Chemical Industry Co., Ltd.); SN Spurs 2180, SN Spurs 2190, SN Leveller S-906 (manufactured by San Nopco Co., Ltd.); S-386, S420 (manufactured by AGC SEIMI CHEMICAL Co., Ltd.), and the like. ❹ Furthermore, appropriate mechanical dispersion treatment can also be used for dispersion adjustment. When the mechanical dispersion treatment is carried out, any method known in the art can be employed without significantly modifying the derivatized particles. Specifically, for example, ultrasonic dispersion, disperser, three-roll mill, ball mill, bead mill, twin-shaft kneader, self-propelled blender, etc. can be used alone or in combination. Hereinafter, the measurement method used in the present invention will be described. (Measured from the average value of the primary particle size of the TEM image)

將乾燥狀態銀粒子粉末2質量份添加於環己烧%質量份 與油酸2質量份的混合溶液中,並利用超音波進行分散。將 分散溶液滴下於具支撐膜的Cu微電網上,經乾燥形成 TEM試料。將所製成之微電網使用穿透式電子顯微鏡(日本 電子股份有限公司製JEM-iOOCXMarkA型),依臟V加 速電壓,將於明視野下所觀察到的粒子影像使用倍率 30,000倍及174,000倍進行拍攝。 -次粒子平均㈣計算係使㈣像解析軟體(旭化成工程 098122526 22 201024004 股份有限公司製A像君(註冊商標))。該影像解析軟體係依 顏色濃淡辨識各個粒子,對Π4,_倍的TEM像,依「粒 子明度」·「暗」、「雜訊去除滤波器」:「有」、「圓形臨限值」: 「20」、「重疊度」:「50」的條件,施行圓形粒子解析並測定 一次粒子平均徑。科’當簡財有彡數個凝結粒子或 異形粒子時’便視為無法測定。 (從1次粒徑計算變動係數) • 從依上述測定方法所測得刚〇個以上的測定值,計算出 平均值、標準偏差,將標準偏差除以平均值的值視為變動係 數並計算出。 ' (銀粒子粉末中的銅含有量測定) 若有銀成分殘留便會有發生分析誤差的可能性,因而為了 將銀成分去除,施行以下的前處理。在3〇〇ml錐形燒杯中裝 入銀粒子粉末l〇g,接著添加硝酸溶液15ml而使銀粒子粉 •末溶解。將溶解的溶液在設定為250T:的加熱板上施行加 熱,濃縮至不會呈蒸發乾固之程度。將經濃縮之溶液放冷 後,添加純水。在溶液中並未發現白濁或浮游物。若溶液中 出現白濁或浮游物時,則重複施行硝酸添加、加熱濃縮、放 冷的步驟直到消失為止。在無白濁與浮游物的溶液中添加鹽 酸而生成氣化銀。然後’利用過濾施行固液分離而分離為氯 化銀與濾液,再將該濾液使用ICP-MS(Agilent Technologies 股份有限公司製AGILENT7500i)施行銅量分析6 098122526 23 201024004 (依BET法施行的比表面積測定) 將銀粒子粉末0.2g在25t:、45cc/min的N2環境下,施行 20分鐘前處理後,使用Yuasa_i〇nics製4S-U2或該製品的 同等品實施。 (TAP密度測定) 使用日本專利特開2007-263860號所記載之測定法實施。 (銀膜的體積電阻值) 將銀粒子粉末施行糊膏化,並塗膜於玻璃基板上。將經塗 膜的玻璃基板利用乾燥機(YAMATO SCIENTIFIC股份有限 公司製),分別依各實施例、比較例中所示溫度與時間施行 燒成。針對經燒成膜的厚度每Ιμιη之體積電阻值,使用電 阻率計(Mitsubishi Chemical Analytech股份有限公司製 LORESTAGP)施行測定,而膜厚度係使用表面粗度計(東京 精密股份有限公司製Surfcom 1500D)施行測定,藉此可計算 出膜的體積電阻值。 [實施例] 針對以下實施例進行詳細說明。 (實施例1) 實施例1〜7中’反應槽係使用5L反應槽。此外,為了進 行授摔,將具葉片的擾掉棒設置於反應槽中心。在反應槽設 置用於為監視溫度的溫度計,此外,依對溶液從下部可供應 氮的方式設置喷嘴。 098122526 24 201024004 首先,在反應槽中裝入水3400g,為了將殘存氧去除,义 反應槽下部依3000mL/分的流量流入氮600秒鐘。然後,從 反應槽上部依3000mL/分的流量進行供應,而使反應样中成 為氮環境。然後,依反應槽内的溶液溫度成為6〇它的方式 一邊施行攪拌,一邊施行溫度調整。然後,將作為氨的人 28質量%氨水7g投入於反應槽中後,為了使溶液呈均勻而 施行擾拌1分鐘。 • 其次,添加作為保護劑的己酸(和光純藥工業股份有限公 司製)45.5g(相對於銀依莫耳比計為㈣),並為了使保護: 溶解而施行攪拌4分鐘。然後,添加作為還原劑的5〇質量 %肼水合物(大塚化學股份有限公司製)水溶液23 9g(相對於 銀為4.82當量)’將其作成還原劑溶液。 在另一容器中準備將硝酸銀結晶(和光純藥工業股份有限 公司製)33.8g溶解於水i8〇g中的硝酸銀水溶液,將其作為 瘳銀鹽水溶液。在該銀鹽水溶液中再將硝酸銅三水合物(和光 純藥工業股份有限公司製),依銅換算相對於銀為 lppm 之 相虽量進行添加。另外,此處的硝酸銅三水合物添加係製 作預先已知錢的硝酸銅三水合物水溶液,再藉由添加其稀 釋物而施行調整。此外,銀鹽水溶液係如同反應槽内的還原 劑溶液’施行溫度調整為60°c。 然後,將銀鹽水溶液一次添加於還原劑溶液中,經混合而 開始進行顧反應。此時,漿料顏色係在添加結束後馬上產 098122526 25 201024004 生變化。攪拌係連續實施,在此狀態下熟成10分鐘。然後, 停止攪拌,利用抽吸過濾施行固液分離,並利用純水施行洗 淨直到洗淨廢液的導電率成為未滿2 〇μ8/(;ιη為止後,依4〇 C施行12小時乾燥’藉此獲得微小銀粒子粉末。另外,因 為所獲得之粉末對熱的感應性較高,因而在該溫度以上的乾 燥會有成為塊狀銀的可能性。 (實施例2) 除將銀鹽水溶液中所添加的硝酸銅三水合物水溶液,變更 ❹ 為依銅換算相對於銀為5ppm的量之外,其餘均重複實施例 1 ° (實施例3) 除將銀鹽水溶液中所添加的硝酸銅三水合物水溶液,變更 為依銅換算相對於銀為lOppm的量之外,其餘均重複實施 例1。 (含銀粒子分散液之製作) ❹ 將所製得銀粒子粉末6g與松油醇4g進行混合。然後,使 用分散機依1400rpm施行90秒鐘處理,依三輥進行10次 而製得含銀粒子分散液。 (銀塗佈膜之製作及燒成) 將所製%之含銀粒子分散液,在載玻璃上使用塗佈器施行 塗佈。然後,使用乾燥機(YAMATO SCIENTIHC股份有限 公司製)’依150°C施行30分鐘燒成。此外,亦製作依2〇〇 098122526 26 201024004 C施行30分鐘燒成的樣品,並分別測定各自的體積電阻值。 (實施例4) 除了將銀鹽水溶液中所添加的銅源變更為氧化亞銅之 外,其餘均重複實施例;3的銀粒子製作步驟。 (實施例5) 除了將銀鹽水溶液中所添加的琐酸銅三水合物水溶液,變 更為依鋼換算相對於銀為1 OOppm的量之外’其餘均重複實 修 施例1。 (實施例6) 除了將銀鹽水溶液中所添加的銅源變更為銅粉之外,其餘 均重複實施例5。 (實施例7) 除了將銀鹽水溶液中所添加的硝酸銅三水合物水溶液,變 更為依銅換算相對於銀為lOOOppm的量之外’其餘均重複 鲁實施例1。 (實施例8) 在實施例8〜13中,反應槽係使用200L反應槽。在5L反 應槽中同樣地設置撥拌棒、溫度計及氮喷嘴。首先,在反應 槽中裝入水137kg,為了將殘存的氧脫除而從下部依2〇L/ 分流入氮600秒鐘。然後,從反應槽上部依2〇L/分進行氮 :應而使反應槽内部成為氮環境。然後,依反應槽内的溶液 溫度成為6Gt:的方式’-邊施賴拌—邊進行溫度調節。 098122526 27 201024004 然後,將作為氨之含28質量%氨水282_3g投入反應槽中之 後,為了使溶液呈均勻而施行1分鐘攪拌。 接著’添加作為保護劑的己酸(和光純藥工業股份有限公 司製)1818.8g(相對於銀依莫耳比計08),且為了將保護劑 溶解而施行4分鐘攪拌。然後,添加作為還原劑的8〇質量 %肼水合物(大塚化學股份有限公司製)水溶液596 3g(相對 於銀為4.82當量)’並將其作成還原劑溶液。 在另一容器中準備將硝酸銀結晶(和光純藥工業股份有限 ❹ 公司製)1350_3g溶解於水7200g中的硝酸銀水溶液,將其作 為銀鹽水溶液。在該銀鹽水溶液中再添加硝酸銅三水合物 (和光純藥工業股份有限公司製)〇 〇325g(依銅換算相對於銀 為lOppm)。另外,銀鹽水溶液係如同反應槽内的還原劑溶 液施行成為60。(:的溫度調整。 然後,將銀鹽水溶液一次添加於還原劑溶液中,經混合而 開始進行㈣反應。游顧續實施,在此狀訂崎ig ^ 分鐘熟成。然後’停止㈣,利用壓濾機施行陳分離並 利用純水施行洗淨,直到洗淨液導電率未滿2^s/cm為 止’經4G°C 12小時以上的乾燥,獲得微小銀粒子粉末。 (分散液之製作) 將所獲得之微小銀粒子粉末添加於溶劑等之中而製成分 散液'分別种量微小銀粒子粉末i_〇g、丁基卡必醇醋酸醋(和 光純藥工業股份有限公司製)10 0g、以及分散劑的 098122526 28 2010240042 parts by mass of the dry state silver particle powder was added to a mixed solution of 5% by mass of cyclohexane and 2 parts by mass of oleic acid, and dispersed by ultrasonic waves. The dispersion solution was dropped on a Cu microgrid having a support film and dried to form a TEM sample. The microgrid made using a transmission electron microscope (JEM-iOOCXMarkA type manufactured by JEOL Ltd.), according to the viscous V accelerating voltage, the particle image used in the bright field is magnified by 30,000 times and 174,000 times. Take a picture. - The average of the sub-particles (4) is calculated by the (4) image analysis software (Asahi Kasei Engineering Co., Ltd. 098122526 22 201024004 Co., Ltd. A-Jun (registered trademark)). The image analysis soft system recognizes each particle according to the color shading. For the TEM image of Π4, _ times, according to "particle brightness", "dark", "noise removal filter": "Yes", "Circular threshold" : "20", "overlap": "50" condition, circular particle analysis is performed and the average particle diameter is measured. When the bank has a number of condensed particles or shaped particles, it is considered unmeasurable. (Changing the coefficient of variation from the primary particle diameter) • Calculate the average value and the standard deviation from the measured values measured by the above measurement method, and calculate the standard deviation divided by the average value as the coefficient of variation and calculate Out. '(Measurement of copper content in silver particle powder) If there is a silver component remaining, there is a possibility that an analysis error may occur. Therefore, in order to remove the silver component, the following pretreatment is performed. Silver particle powder l〇g was placed in a 3 〇〇ml conical beaker, and then 15 ml of a nitric acid solution was added to dissolve the silver particle powder. The dissolved solution was heated on a hot plate set to 250 T: and concentrated to such an extent that it did not evaporate and dry. After the concentrated solution was allowed to cool, pure water was added. No white turbidity or floats were found in the solution. If white turbidity or floating matter appears in the solution, repeat the steps of adding nitric acid, heating and concentrating, and allowing to cool until it disappears. Calcium chloride is formed by adding hydrochloric acid to a solution free of white turbidity and floating matter. Then, it was separated into silver chloride and a filtrate by solid-liquid separation by filtration, and the filtrate was subjected to copper amount analysis using ICP-MS (AGILENT 7500i manufactured by Agilent Technologies Co., Ltd.). 6 098122526 23 201024004 (Specific surface area by BET method) Measurement) 0.2 g of silver particle powder was subjected to a treatment for 20 minutes in an N 2 atmosphere of 25 t: and 45 cc/min, and then it was carried out using 4S-U2 manufactured by Yuasa_i〇nics or an equivalent of the product. (Measurement of TAP density) The measurement method described in JP-A-2007-263860 was used. (Volume Resistance Value of Silver Film) The silver particle powder was paste-formed and coated on a glass substrate. The coated glass substrate was fired by a dryer (manufactured by YAMATO SCIENTIFIC Co., Ltd.) at the temperature and time shown in each of the examples and the comparative examples. The volume resistivity per Ιμηη of the thickness of the fired film was measured using a resistivity meter (LORESTAGP manufactured by Mitsubishi Chemical Analytech Co., Ltd.), and the film thickness was measured by a surface roughness meter (Surfcom 1500D manufactured by Tokyo Seimitsu Co., Ltd.). The measurement is carried out, whereby the volume resistance value of the film can be calculated. [Examples] The following examples are described in detail. (Example 1) In the examples 1 to 7, the reaction tank was a 5 L reaction tank. In addition, in order to perform the drop, a bladed spoiler is placed in the center of the reaction tank. A thermometer for monitoring the temperature is provided in the reaction tank, and in addition, the nozzle is set in such a manner that the solution can supply nitrogen from the lower portion. 098122526 24 201024004 First, 3400 g of water was placed in the reaction vessel, and in order to remove residual oxygen, the lower portion of the reaction vessel was flowed into the nitrogen at a flow rate of 3000 mL/min for 600 seconds. Then, it was supplied from the upper portion of the reaction vessel at a flow rate of 3000 mL/min, and the reaction sample was allowed to form a nitrogen atmosphere. Then, the temperature was adjusted while stirring was carried out in such a manner that the temperature of the solution in the reaction tank became 6 Torr. Then, 7 g of a 28% by mass ammonia water as ammonia was put into the reaction vessel, and then the mixture was stirred for 1 minute in order to make the solution uniform. • Next, 45.5 g of hexanoic acid (manufactured by Wako Pure Chemical Industries Co., Ltd.) as a protective agent (manufactured by Wako Pure Chemical Industries Co., Ltd.) was added, and stirring was carried out for 4 minutes in order to protect: dissolve. Then, 23 g of an aqueous solution of 5 〇 mass % hydrazine (manufactured by Otsuka Chemical Co., Ltd.) as a reducing agent was added (to be 4.82 equivalents with respect to silver), and this was used as a reducing agent solution. In a separate container, 33.8 g of a silver nitrate crystal (manufactured by Wako Pure Chemical Industries, Ltd.) was dissolved in an aqueous solution of silver nitrate in water i8 〇g, and this was used as a cerium silver salt aqueous solution. In the silver salt aqueous solution, copper nitrate trihydrate (manufactured by Wako Pure Chemical Industries, Ltd.) was added in an amount of 1 ppm in terms of copper in terms of copper. Further, the copper nitrate trihydrate addition here is an aqueous solution of copper nitrate trihydrate which is known in advance, and is adjusted by adding a thinner. Further, the aqueous silver salt solution was adjusted to a temperature of 60 ° C as the reducing agent solution in the reaction vessel. Then, the silver salt aqueous solution was added to the reducing agent solution at a time, and the reaction was started by mixing. At this time, the color of the slurry was changed immediately after the end of the addition, 098122526 25 201024004. The stirring system was continuously carried out, and the mixture was aged for 10 minutes in this state. Then, the stirring was stopped, and solid-liquid separation was performed by suction filtration, and washing was performed with pure water until the conductivity of the washing waste liquid became less than 2 〇μ8/(; ηη, and dried at 4 ° C for 12 hours. 'Therefore, the fine silver particle powder is obtained. In addition, since the obtained powder has high sensitivity to heat, drying at this temperature or higher may become bulk silver. (Example 2) In addition to silver salt The aqueous solution of copper nitrate trihydrate added to the aqueous solution was changed to the amount of 5 ppm in terms of copper in terms of copper, and Example 1 was repeated (Example 3) except for the nitric acid added in the aqueous silver salt solution. The copper trihydrate aqueous solution was changed to an amount of 10 ppm in terms of copper, and the same Example 1 was repeated. (Preparation of silver-containing particle dispersion) 6 6 g of silver particle powder and terpineol were obtained. 4 g of the mixture was mixed, and the silver-containing particle dispersion liquid was prepared by performing a 90-second treatment at 1400 rpm for 10 times in three rolls. (Production and firing of a silver coating film) Particle dispersion in glass carrier The coating was carried out by using an applicator, and then it was baked at 150 ° C for 30 minutes using a dryer (manufactured by YAMATO SCIENTIHC Co., Ltd.), and was also fired for 30 minutes according to 2〇〇098122526 26 201024004 C. The sample was measured for each volume resistance value. (Example 4) The silver particle production step of Example 3 was repeated except that the copper source added to the silver salt aqueous solution was changed to cuprous oxide. Example 5) Example 1 was repeated except that the aqueous solution of copper tribromide trihydrate added to the aqueous silver salt solution was changed to an amount of 100 ppm relative to silver in terms of steel. Example 5 was repeated except that the copper source added to the silver salt aqueous solution was changed to copper powder. (Example 7) The aqueous solution of copper nitrate trihydrate added to the aqueous silver salt solution was changed to The copper conversion was repeated with respect to the amount of silver of 100 ppm. The rest of Example 1 was repeated. (Example 8) In Examples 8 to 13, the reaction tank was a 200 L reaction tank, and the same was set in the 5 L reaction tank. Mixing rod, thermometer And a nitrogen nozzle. First, 137 kg of water was placed in the reaction vessel, and in order to remove residual oxygen, nitrogen was introduced from the lower portion to 2 〇L/min for 600 seconds, and then, from the upper portion of the reaction vessel, 2 〇L/min. Nitrogen: The inside of the reaction tank should be made into a nitrogen atmosphere. Then, according to the way the temperature of the solution in the reaction tank becomes 6 Gt: - the temperature is adjusted while mixing. 098122526 27 201024004 Then, it will be 28 mass as ammonia. After 282 g of ammonia water was put into the reaction tank, the mixture was stirred for 1 minute in order to make the solution uniform. Then, 1818.8 g of hexanoic acid (manufactured by Wako Pure Chemical Industries, Ltd.) as a protective agent was added (relative to the silver-based molar ratio) 08), and stirring was carried out for 4 minutes in order to dissolve the protective agent. Then, an aqueous solution of 596 g of hydrazine hydrate (manufactured by Otsuka Chemical Co., Ltd.) as a reducing agent was added to 596 g (4.82 equivalents with respect to silver), and this was used as a reducing agent solution. In a separate container, silver nitrate crystals (manufactured by Wako Pure Chemical Industries Co., Ltd.) 1350_3 g of silver nitrate aqueous solution dissolved in 7200 g of water were prepared and used as a silver salt aqueous solution. To the silver salt aqueous solution, a copper nitrate trihydrate (manufactured by Wako Pure Chemical Industries, Ltd.) 〇 325 g (10 ppm in terms of copper with respect to silver) was further added. Further, the aqueous silver salt solution was applied as 60 as the reducing agent solution in the reaction tank. (The temperature is adjusted. Then, the silver salt aqueous solution is added to the reducing agent solution at a time, and the reaction is started to carry out the (4) reaction. The continuation is carried out, and the akiji mic is cooked in this form. Then 'stop (four), use pressure The filter was separated by a filter and washed with pure water until the conductivity of the cleaning solution was less than 2 μs/cm. After drying at 4 G ° C for 12 hours or more, fine silver particles were obtained. (Preparation of dispersion) The fine silver particle powder obtained was added to a solvent or the like to prepare a dispersion liquid, and a small amount of fine silver particle powder i_〇g and butyl carbitol acetate vinegar (manufactured by Wako Pure Chemical Industries, Ltd.) 10 0g, and 098122526 28 201024004

DisperBYK2020(BYK-Chemie · Japan 公司製)0.1g。將該等 在試驗管中進行混合,並利用超音波分散機施行10分鐘分 散。結果呈均勻分散,連試驗管底亦無發現沉澱物。此外, 即使靜置24小時後,連試驗管底亦無發現沉殿物,再分散 性良好。 (實施例9) 除了將在銀鹽水溶液中所添加的确酸銅三水合物量,變更 ❹ 成依銅換算相對於銀為20ppm的量之外,其餘均重複實施 例8。 (實施例10) 除了將在銀鹽水溶液中所添加的瑣酸銅三水合物量,變更 成依銅換算相對於銀為50ppm的量之外,其餘均重複實施 例8。 (實施例11) 參 除了將在銀鹽水溶液中所添加的琐酸銅三水合物量,變更 成依銅換算相對於銀為lOOppm的量之外,其餘均重複實施 例8。 (實施例12) 除了將在銀鹽水溶液中所添加的端酸銅三水合物量,變更 成依銅換算相對於銀為300ppm的量之外,其餘均重複實施 例8。 (實施例13) 098122526 29 201024004 除了將在銀鹽水溶液中所添加的硝酸銅三水合物量,變更 成依銅換算相對於銀為500ppm的量之外,其餘均重複實施 例8。 (比較例1) 除了在銀鹽水备液中未添加石肖酸銅三水合物之外,其餘均 重複實施例1。反應襞料顏色係從添加結束起約3〇秒即結 束變化。DisperBYK2020 (manufactured by BYK-Chemie Japan Co., Ltd.) 0.1 g. These were mixed in a test tube and dispersed for 10 minutes using an ultrasonic disperser. The results were evenly dispersed, and no precipitate was found even at the bottom of the test tube. In addition, even after standing for 24 hours, no sediments were found at the bottom of the test tube, and the dispersion was good. (Example 9) Example 8 was repeated except that the amount of the copper sulphate trihydrate added in the silver salt aqueous solution was changed to 20 ppm in terms of copper in terms of copper. (Example 10) Example 8 was repeated except that the amount of copper tribromide trihydrate added to the silver salt aqueous solution was changed to an amount of 50 ppm in terms of copper in terms of copper. (Example 11) Example 8 was repeated except that the amount of copper tribromide trihydrate added to the silver salt aqueous solution was changed to an amount of 100 ppm in terms of copper in terms of copper. (Example 12) Example 8 was repeated except that the amount of the copper acid terminal trihydrate added to the silver salt aqueous solution was changed to 300 ppm in terms of copper. (Example 13) 098122526 29 201024004 Example 8 was repeated except that the amount of the copper nitrate trihydrate added to the silver salt aqueous solution was changed to an amount of 500 ppm in terms of copper in terms of copper. (Comparative Example 1) Example 1 was repeated except that no copper lithosperate trihydrate was added to the silver salt solution. The reaction color was changed from about 3 seconds after the end of the addition.

(比較例2) 除了在銀鹽水溶液中未添加確酸銅三水合物之外,其餘均 重複實施例8。 (比較例3) 除了將在銀鹽水溶液中所添力。的硝酸銅三水合物水溶液 量,變更成依銅換算相對於銀為6〇〇〇ppm的量之外,其餘 均重複實施例1。(Comparative Example 2) Example 8 was repeated except that copper sulphate trihydrate was not added to the aqueous silver salt solution. (Comparative Example 3) In addition to the force added in the aqueous silver salt solution. Example 1 was repeated except that the amount of the aqueous solution of copper nitrate trihydrate was changed to 6 〇〇〇 ppm in terms of copper in terms of copper.

(比較例4) 除了將在銀鹽水溶液中所添加的硝酸銅三水合物水溶液 量變更成依銅換算相對於銀為60000ppm的量之外,其餘 均重複實施例1。 (比較例5) 除了取代硝酸銅 水合物,改為添加硝酸鎳六水合物^ 和光純藥工業股份有限公司製)依鎳換算成為_解 量之外,/、餘均重複實施例】。 098122526 30 201024004 (比較例6) 除了取代硝酸銅三水合物,改為添加硝酸鐵(m)九水合物 水溶液(和光純藥工業股份有限公司製)依鐵換算成為 lOOppm的量之外,其餘均重複實施例1。 (比較例7) 在比較例1的還原反應結束後,相對於反應漿料,添加硝 酸銅三水合物水溶液依銅換算相對於銀為3000ppm的量, • 並在此狀態下持續攪拌5分鐘。然後,停止攪拌,並施行過 滤、洗淨。 (比較例8) 除了將還原劑的肼水合物量,變更為相對於銀成為9.6當 量的量之外’其餘均重複比較例1 ^在還原反應開始後反應 聚料顏色變化馬上結束,確認反應已結束。 實施例及比較例的反應規格、製造時所添加的添加物及添 •加量、反應後的銀粒子粉末中所含的Cu含有量、乾燥狀態 銀粒子粉末的BET比表面積、TAp密度、Tem徑及變動係 數、銀膜的體積電阻值,係如表丨所示。此外,圖丨〜3所示 係實施例卜3及5的TEM像,圖4所示係比較例1的TEM 像。TEM照片的倍率全部均為174,〇〇〇倍。另外,圖卜9 的照片右下箭頭全部均表示獅誰。 098122526 31 044002 1Χ20 【一<】(Comparative Example 4) Example 1 was repeated except that the amount of the aqueous solution of copper nitrate trihydrate added to the aqueous silver salt solution was changed to an amount of 60,000 ppm with respect to silver in terms of copper. (Comparative Example 5) In addition to the substitution of the copper nitrate hydrate, the addition of nickel nitrate hexahydrate (manufactured by Wako Pure Chemical Industries, Ltd.) was carried out in terms of nickel, and the remainder was repeated. 098122526 30 201024004 (Comparative Example 6) In addition to the substitution of copper nitrate trihydrate, an aqueous solution of iron nitrate (m) nonahydrate (manufactured by Wako Pure Chemical Industries, Ltd.) was added in an amount of 100 ppm in terms of iron. Example 1 was repeated. (Comparative Example 7) After the completion of the reduction reaction of Comparative Example 1, the aqueous solution of the copper nitrate trihydrate was added in an amount of 3000 ppm in terms of copper with respect to the reaction slurry, and stirring was continued for 5 minutes in this state. Then, the stirring is stopped, and filtration and washing are performed. (Comparative Example 8) Except that the amount of the hydrazine hydrate of the reducing agent was changed to 9.6 equivalents with respect to silver, the remainder of the comparative example 1 was repeated. ^ After the start of the reduction reaction, the change in the color of the reaction mixture was immediately completed, and it was confirmed that the reaction had been completed. End. The reaction specifications of the examples and the comparative examples, the additives added during the production, the amount of addition, the Cu content contained in the silver particle powder after the reaction, the BET specific surface area of the silver particle powder in the dry state, the TAp density, and the Tem The diameter and coefficient of variation, and the volume resistance of the silver film are shown in Table 。. Further, the TEM images of Examples 3 and 5 are shown in Figs. 3 and 3, and the TEM image of Comparative Example 1 is shown in Fig. 4. The magnification of the TEM photographs was all 174, 〇〇〇 times. In addition, the bottom right arrow of the photo of Figure 2 all indicate the lion. 098122526 31 044002 1Χ20 【一<】

Si! ifesap · m O〇 饀5宕 1 1 1 1 1 1 1 1 1 i 1 1 1 6.06 I 33.9 1 1 I 1 1 ιρτ 樂 |ΐ·1 Aflj) · m ^ G ^ ^ »n J^psi 'w^ 1-H 1 1 3.33 1 1 1 1 1 1 1 1 1 1 1 6.06 σ\ m 1 1 1 1 I次粒徑 TEM徑變動係數 (%) r·^ (N VO 1-H On 宕 卜 σ\ <Ρ"Η 卜 宕 \〇 (N 卜 T-H 20.6 22.2 1 1 OO 卜 1 無法測定 無法測定 無法測定 ITEM平均徑 (nm) 1-H rn 00 ΓΟ T-H (N rn m ΓΟ m CO CN CO 寸 m m CN tn CO Os CN (Μ CO r4 T—^ 1 1 cn m rn 1 無法測定 無法測定 無法測定 TAP密度 (g/can3) 1 1 CS r4 ο CN Ο CN ο <Ν ο (Ν 00 σ\ 00 r4 o CN CN CN· ο r4 r4 卜 CN o CN Ο <N Ο CN 〇 CN 〇 oi (N (N BET (m2/g) 21.8 28.3 30.4 29.8 29.6 28.8 29.2 21.7 cn (N 26.5 27.7 30.0 30.7 (N o CO 29.7 25.6 Η CN 〇 τ*Η ^ ψ a A t ^ ®w u θϊ 3 1 1 CN 1 1 1 1 cs 气 t-H CM ir! 卜 00 24.5 114.3 CM o (N d 1800 48000 1 1 1 1 Η I斑5 1¾¾ ®Η Γ ί 1 # •塞’ ι〇 Ο Ο Ο 〇 1000 o r-H Ο Ο Ο in o o 6000 60000 〇 H ο 3000 〇 反應規格 (L) ^Ti iTi in ir> o o o Ο ο Ο CN »n o (N »n iT) »〇 in 添加物 硝酸銅三水合物 氧化亞銅 硝酸銅三水合物 銅粉末 硝酸銅三水合物 1 1 硝酸銅三水合物 硝酸鎳六水合物i 硝酸鐵(III)九水合物 硝酸銅三水合物 1 編號 1實施例11 1實施例2 1 1實施例3 1 1實施例4 1 1實施例5 | |實施例6 1 1實施例71 丨實施例8 1 |實施例9 1 1實施例ιο| 1實施例ιι| 1實施例12| 1實施例13丨 比較例1 丨比較例2 | 1比較例3 |比較例4 比較例5 1 比較例ό |比較例7 丨比較例8 | e ο 9ZSZZI860 201024004 再者’圖5、6所示係實施例8及u的TEM像,圖7、8 所示係比較例6、7的ΤΕΜ像,圖9所示係比較例8的ΤΕΜ 像。此外,圖10所示係相關之實施例與比較例,表示Cu 添加置與BET的關係圖,分為5L反應的情況與2G0L反應 的情況表示。 首先參照表1所示實施例1〜7、比較例1及圖1〇。圖 10中縱輛係BET,橫軸係相對於Ag的cu添加量。空白 ❿圓點與工白三角分別係指依5L與2GGL反應槽所製得之實 施例的結果。另外,黑圓點記號與黑三角記號分別係依5L 與2〇〇L反應槽進行的比較例。具體而纟,黑圓點記號係比 較例1 ’黑三角記號係比較例2。 相對於未添加Cu的比較例,就連所添加Cu為lppm的實 施例1 ’ BET亦高達7m2/g以上。即,得知相對於實施例, 添加比較例Cu進行時,銀粒子粉末的BET增加。此外,藉 •由銅粉末(實施例6)、氧化亞銅(實施例4)的、添加,亦可獲得 同樣的效果,因而得知無關所添加之銅成分形態均可獲得本 發明效果。此外,效果係從添加Cu ippm起明顯出現j且 在lOppm附近達飽和。 藉此得知,極微量的銅添加對BET的增大會出現非常明 顯的效果。此外,若觀看圖4所示比較例1的TEM像,除 小粒子與粗大粒子混雜之外,尚多數存在凝結狀粒子。另一 方面,圖1所示實施例1的照片可明確識別一次粒子,並未 098122526 33 201024004 發現粗大粒子。就從此縣觀之,得知添域時,凝結的粒 子會減少’獲得粒度整合的效果。 此現象依照從TEM像所獲得之變動係數亦會呈現。即, 實施例W的變動係數係17〜21%的較小值,呈現粒度分佈 非常狹窄’但若觀看圖4,則粒度分佈明顯變寬廣。此外, 若觀看圖1〜3,則經添加鋼的情況,所有的銀粒子分別孤立 存在,形成分散性非常優異、且粒徑變動較小。Si! ifesap · m O〇饀5宕1 1 1 1 1 1 1 1 1 i 1 1 1 6.06 I 33.9 1 1 I 1 1 ιρτ 乐|ΐ·1 Aflj) · m ^ G ^ ^ »n J^psi 'w^ 1-H 1 1 3.33 1 1 1 1 1 1 1 1 1 1 1 6.06 σ\ m 1 1 1 1 I-order particle size TEM diameter variation coefficient (%) r·^ (N VO 1-H On 宕卜σ\ <Ρ"Η 宕 宕 〇 〇 N N 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 CO inch mm CN tn CO Os CN (Μ CO r4 T—^ 1 1 cn m rn 1 cannot be measured, cannot be measured, cannot measure TAP density (g/can3) 1 1 CS r4 ο CN Ο CN ο <Ν ο (Ν 00 σ\ 00 r4 o CN CN CN · ο r4 r4 卜 CN o CN Ο <N Ο CN 〇CN 〇oi (N (N BET (m2/g) 21.8 28.3 30.4 29.8 29.6 28.8 29.2 21.7 cn (N 26.5 27.7 30.0 30.7 (N o CO 29.7 25.6 Η CN 〇τ*Η ^ ψ a A t ^ ®wu θϊ 3 1 1 CN 1 1 1 1 cs gas tH CM ir! 00 24.5 114.3 CM o (N d 1800 48000 1 1 1 1 Η I spot 5 13⁄43⁄4 ®Η Γ ί 1 # •塞' ι〇Ο Ο Ο 〇1000 o rH Ο Ο Ο in oo 6000 60000 〇H ο 3000 〇Reaction Grid (L) ^Ti iTi in ir> ooo Ο ο Ο CN »no (N »n iT) »〇in Additives Copper nitrate trihydrate Cuprous oxide Copper nitrate trihydrate Copper powder Copper nitrate trihydrate 1 1 Copper nitrate trihydrate nickel nitrate hexahydrate iron (III) nitrate nonahydrate copper nitrate trihydrate 1 No. 1 Example 11 1 Example 2 1 1 Example 3 1 1 Example 4 1 1 Example 5 | Example 6 1 1 Example 71 丨 Example 8 1 | Example 9 1 1 Example ιο| 1 Example ιι| 1 Example 12| 1 Example 13 丨 Comparative Example 1 丨 Comparative Example 2 | 1 Comparative Example 3 |Comparative Example 4 Comparative Example 5 1 Comparative Example ό |Comparative Example 7 丨Comparative Example 8 | e ο 9ZSZZI860 201024004 Further, FIGS. 5 and 6 show TEM images of Examples 8 and u, and FIGS. 7 and 8 show The images of Comparative Examples 6 and 7 are shown in Fig. 9, which are the images of Comparative Example 8. Further, the examples and comparative examples shown in Fig. 10 show a relationship between Cu addition and BET, and are shown in the case of a 5 L reaction and a 2G0L reaction. First, referring to Examples 1 to 7, Comparative Example 1, and FIG. 1 shown in Table 1. In Fig. 10, the vertical line is BET, and the horizontal axis is the amount of cu added to the Ag. The blank ❿ dot and the industrial white triangle refer to the results of the examples made with the 5L and 2GGL reaction tanks, respectively. In addition, the black dot mark and the black triangle mark are respectively compared with the 5L and 2〇〇L reaction tanks. Specifically, the black dot symbol is Comparative Example 1 'Black Triangle Marker Comparative Example 2. With respect to the comparative example in which Cu was not added, the BET of Example 1' at which Cu was added in an amount of 1 ppm was as high as 7 m 2 /g or more. That is, it was found that the BET of the silver particle powder was increased when the comparative example Cu was added to the examples. Further, the same effect can be obtained by adding and adding copper powder (Example 6) and cuprous oxide (Example 4), and thus it is known that the effect of the present invention can be obtained irrespective of the form of the copper component added. Further, the effect was apparent from the addition of Cu ippm and reached saturation near 10 ppm. From this, it is known that a very small amount of copper addition has a very significant effect on the increase in BET. Further, when the TEM image of Comparative Example 1 shown in Fig. 4 was observed, in addition to the small particles mixed with the coarse particles, there were many coagulated particles. On the other hand, the photograph of Example 1 shown in Fig. 1 can clearly identify primary particles, and no coarse particles are found by 098122526 33 201024004. From this view of the county, when the domain is known, the condensed particles will reduce the effect of achieving particle size integration. This phenomenon is also exhibited in accordance with the coefficient of variation obtained from the TEM image. That is, the coefficient of variation of the example W is a small value of 17 to 21%, and the particle size distribution is very narrow. However, if FIG. 4 is viewed, the particle size distribution is significantly broadened. Further, when viewing Figs. 1 to 3, when silver is added, all of the silver particles are isolated in isolation, and the dispersibility is extremely excellent, and the particle diameter variation is small.

其次,參照實施例8〜13、比較例2及圖5、6。如同几 反應’依關H的添加,錄子粉末的臓增加。此外, 200L反應亦可製擁錄合的餘子。航,得知本發明 的製造方法係無關反應規格,均可改善粒徑變動情形。 再者’從圖10得知2親反應的情況,銅成分添加量與 BET的關係’成為較几反應時更緩和的斜率j情形就從 製造上的觀點觀之,係屬非常佳。即,如前述,當藉由銅成 分添加量之㈣’而製作具有所需BET的銀粒子粉末的情 〇 況在200L反應、中,該銅成分添加量的控制幅度會變t, 因而可簡單地獲得所需銀粒子。 其次,參照比較例3、4。比較例3、4係分別添加銅成分 6000ppm(0.6質量%)、6〇〇〇〇ppm(6質量%)者而關於如此 所得之銀粒子’其所含銅量亦變得非常多。在將比較例3、 4之銀粒子作成銀膜時,電阻值惡化係可認為起因於此。 再者,參照比較例5、6及圖7、8。比較例5、6分別係 098122526 34 201024004 取代銅成分,改為添加鎳成分、鐵成分,並無法獲得如本發 明的效果。得知在本發明的製造方法中必須添加銅成分。 再者,參照比較例7。比較例7係在還原反應結束後才添 加銅成分,但並無法獲得如本發明的效果。本發明的製造方 法中,銅成分必須在還原反應結束前添加。 再者,若觀看比較例8與圖9,得知藉由增加還原劑量, - 雖會加速還原反應,但從圖中得知會發生多數粗大粒子。藉 ⑩此,得知若單純地加速還原反應,銅成分的存在對粒度分佈 與分散性係屬必要。 再者’本實施例中’將銅成分預先與銀成分相混合,並與 還原劑液相混合。所以,從還原反應開始的時點起,銅成分 便已存在於混合液中,因而還原反應的結束點便依反應漿料 的顏色變化進行判斷。但是,亦會有即使反應漿料的顏色變 化結束’但還原反應本身卻仍尚未結束的情況。所以,僅利 ❿用銀化合物溶液、保護劑及還原劑溶液施行還原反應,即使 反應漿料的顏色變化已結束時,藉由添加銅成分便可獲得本 發明效果。 (產業上之可利用性) 本發明之製造方法係即使大規格反應仍可如同小規格般 地輕易製作銀粒子,因而量產性優異。此外,本發明的銀粒 子係粒徑變動小、且可使各種溶劑再分散,因而頗適用為金 屬佈線用途所使用的分散液。 098122526 35 201024004 【圖式簡單說明】 圖1為實施例1所製得粒子依17働〇倍拍攝的像。 圖2為實施例3所製得粒子依174〇〇〇倍拍攝的τ脳像。 圖3為實施例5所製得粒子依174〇〇〇倍拍攝的tem像。 圖4為比較例1所製得粒子依174000倍拍攝的ΤΕΜ像。 圖5為實施例8所製得粒子依丨^牝⑻倍拍攝的ΤΕΜ像。 圖6為實施例11所製得粒子依174〇〇〇倍拍攝的tem像。 圖7為比較例5所製得粒子依174〇〇〇倍拍攝的tem像。 圖8為比較例6所製得粒子依174〇〇〇倍拍攝的tem像。 圖9為比較例8所製得粒子依174000倍拍攝的TEM像。 圖10為實施例與比較例所施行相關5L反應的銅成分添 加量與Bet比表面積之關係圖。 098122526 36Next, Reference Examples 8 to 13, Comparative Example 2, and Figs. 5 and 6 will be referred to. As with the addition of several reactions, the enthalpy of the recording powder increased. In addition, the 200L reaction can also produce the remainder of the recording. It is known that the manufacturing method of the present invention is an irrelevant reaction specification, and the particle size variation can be improved. Further, the case where the two-parent reaction is observed from Fig. 10, the relationship between the amount of the copper component added and the BET is a more gentle slope than the case of several reactions, and it is excellent from the viewpoint of manufacturing. That is, as described above, when the silver particle powder having the desired BET is produced by the (four)' amount of the copper component added, the control range of the amount of the copper component added becomes t in the 200 L reaction, and thus it is simple. The desired silver particles are obtained. Next, reference is made to Comparative Examples 3 and 4. In Comparative Examples 3 and 4, the amount of copper contained in the silver particles 6,000 ppm (0.6% by mass) and 6 〇〇〇〇 ppm (6% by mass) was also increased. When the silver particles of Comparative Examples 3 and 4 were formed into a silver film, the deterioration of the electric resistance value was considered to be due to this. Further, reference is made to Comparative Examples 5 and 6 and Figs. 7 and 8. In Comparative Examples 5 and 6, respectively, 098122526 34 201024004, in place of the copper component, the nickel component and the iron component were added, and the effects of the present invention could not be obtained. It is known that a copper component must be added in the production method of the present invention. Further, reference is made to Comparative Example 7. In Comparative Example 7, the copper component was added after the completion of the reduction reaction, but the effect of the present invention could not be obtained. In the production method of the present invention, the copper component must be added before the end of the reduction reaction. Further, when Comparative Example 8 and FIG. 9 were observed, it was found that by increasing the amount of the reducing agent, the reduction reaction was accelerated, but it was found from the drawing that most of the coarse particles occurred. From this, it is found that the presence of the copper component is necessary for the particle size distribution and the dispersibility if the reduction reaction is simply accelerated. Further, in the present embodiment, the copper component is previously mixed with the silver component and mixed with the reducing agent in the liquid phase. Therefore, since the copper component is already present in the mixed solution from the time when the reduction reaction starts, the end point of the reduction reaction is judged by the color change of the reaction slurry. However, there is a case where the reduction reaction itself is not completed even if the color change of the reaction slurry is completed. Therefore, the reduction reaction is carried out only by using the silver compound solution, the protective agent and the reducing agent solution, and the effect of the present invention can be obtained by adding a copper component even when the color change of the reaction slurry is completed. (Industrial Applicability) The production method of the present invention is capable of easily producing silver particles as a small size even in a large-scale reaction, and thus is excellent in mass productivity. Further, since the silver particle size of the present invention has a small particle size variation and can redisperse various solvents, it is suitably used as a dispersion liquid for metal wiring applications. 098122526 35 201024004 [Simple Description of the Drawings] Fig. 1 is an image taken at 17 times magnification of the particles produced in Example 1. 2 is a τ 脳 image taken by a particle obtained in Example 3 at 174 〇〇〇. Fig. 3 is a TEM image of the particles produced in Example 5 taken at 174 〇〇〇. Fig. 4 is an image of the particles produced in Comparative Example 1 taken at 174,000 times. Fig. 5 is a view showing the image of the particles produced in Example 8 taken at 倍 (8) times. Fig. 6 is a TEM image of the particles produced in Example 11 taken at 174 〇〇〇. Fig. 7 is a TEM image of the particles prepared in Comparative Example 5 taken at 174 〇〇〇. Fig. 8 is a TEM image of a particle produced in Comparative Example 6 taken at 174 〇〇〇. Fig. 9 is a TEM image of a particle obtained in Comparative Example 8 taken at 174,000 times. Fig. 10 is a graph showing the relationship between the amount of copper component added and the specific surface area of Bet in the relevant 5 L reaction between the examples and the comparative examples. 098122526 36

Claims (1)

201024004 七、申請專利範圍: 1_一種銀粒子之製造方法,係在銅存在下,使銀化合物、 保護劑及還原劑相混合並進行反應。 2.-種銀粒子之製造方法,係分別包括有:將銀化合物溶 液與液狀保護劑相混合的步驟、在混合液中添加銅化合物而 使反應液巾存在銅的步驟、以及之後躲加液狀還原劑而將 溶液中的銀離子還原之步驟。 ❹ 3 一種銀粒子之製造方法,係包括有: 將液狀保·與液狀還原齡混合,而獲得保護劑與還原 劑之混合溶液的步驟; 將銀化合物溶液與銅化合物溶液相混合,而獲得銀化合物 與銅化合物之混合溶液的步驟;以及 在上述保護#j與還原劑的混合溶液中’添加上述銀化合物 與銅化合物的混合溶液而進行還原反應的步驟。 春4.如U利範圍第丨至3項中任一項之銀粒子之製造方 法’其中’上述銅成分的合計添加量係依銅換算,相對於上 述反應液中的銀為Uoooppm的量。 5. 如申明專利範圍第1至4項中任一項之銀粒子之製造方 法其中’上述還原反應係依〜8〇〇c實施。 6. 如申請專利範圍第1至5項中任一項之銀粒子之製造方 法’其中’上述保護劑係含有碳、氮、氧中任j種以上。 7. 如申明專利範圍第丨至6項中任一項之銀粒子之製造方 098122526 37 201024004 法’其中,上述保護劑的沸點係25〇〇c以下。 8·如申%專利範圍第1至7項中任-項之銀粒子之製造方 法’其中’上述保護劑所具有的官能基係羧基或胺基中任一 者、或一者均具有。 9·種銀粒子,係含有1〜10⑼ppm的銅,從TEM像所測 得之粒彳工的算術平均值係丨〜刚腿,依bET法所測得之比 表面積係5〜4〇m2/g。 10. 如巾請翻範圍第9項之絲子其巾,上述粒徑計 測值的變動係數係未滿30%。 11. 如申4專利範圍第9或1G項之銀粒子,其中,在上述 銀粒子表面存在有含碳、氮、氧中任1種以上的保護劑。 中 12.如申請專利範圍第9至11項 ’上述保護劑係由有機羧酸或其衍 中 13.如申請專利範圍第8至12項中任 ’上述保護劑的沸點係250。(:以下。 中任一項之銀粒子,其 生物構成,且碳數3〜8。 一項之銀粒子,其 14_如申請專利範圍第8至13項中任一項之銀粒子,盆 中’上述官能基係從叛基或胺基所構成群組中選擇丨種以上 的官能基。 8至14項中任一 15.—種分散液,係含有申請專利範園第 項之銀粒子。 098122526 38201024004 VII. Patent application scope: 1_ A method for producing silver particles, in which silver compound, protective agent and reducing agent are mixed and reacted in the presence of copper. 2. The method for producing silver particles, comprising the steps of: mixing a silver compound solution with a liquid protective agent, adding a copper compound to the mixed solution, and causing the reaction liquid towel to have copper, and then avoiding A step of reducing silver ions in the solution by a liquid reducing agent. ❹ 3 A method for producing silver particles, comprising: a step of mixing a liquid solution with a liquid reducing age to obtain a mixed solution of a protective agent and a reducing agent; mixing the silver compound solution with the copper compound solution, and a step of obtaining a mixed solution of a silver compound and a copper compound; and a step of performing a reduction reaction by adding a mixed solution of the above silver compound and a copper compound in the mixed solution of the above-mentioned protection #j and a reducing agent. The method of producing silver particles according to any one of the above-mentioned items, wherein the total amount of the copper component added is in an amount of Uoooppm with respect to silver in the above reaction liquid in terms of copper. 5. The method for producing silver particles according to any one of claims 1 to 4 wherein the above reduction reaction is carried out according to ~8〇〇c. 6. The method for producing silver particles according to any one of claims 1 to 5, wherein the protective agent contains at least one of carbon, nitrogen and oxygen. 7. The manufacture of silver particles according to any one of claims -6 to 214122526 37 201024004 The above-mentioned protective agent has a boiling point of 25 〇〇c or less. The method for producing silver particles according to any one of the items 1 to 7 of the invention, wherein the functional group of the protective agent is a carboxyl group or an amine group, or one of them. 9. Silver particles containing 1 to 10 (9) ppm of copper. The arithmetic mean of the particle size measured from the TEM image is 丨~ rigid leg, and the specific surface area measured by the bET method is 5 to 4 〇m2/ g. 10. If the towel is turned over, the coefficient of variation of the above-mentioned particle size measurement value is less than 30%. 11. The silver particles according to claim 9 or claim 1G, wherein one or more protective agents containing at least one of carbon, nitrogen and oxygen are present on the surface of the silver particles. 12. The above-mentioned protective agent is derived from an organic carboxylic acid or a derivative thereof. The above-mentioned protective agent has a boiling point of 250 as described in any of claims 8 to 12. (The following. The silver particles of any one of them, the biological composition, and the carbon number of 3 to 8. One of the silver particles, 14_ of the silver particles of any one of the claims 8 to 13 of the patent, the basin The above functional group is selected from the group consisting of a thiol or an amine group. The functional group of any of the above items 8 to 14 is a silver-containing particle of the patent application. 098122526 38
TW98122526A 2008-12-26 2009-07-03 Silver particle containing copper, its manufacturing method and dispersion liquid using the same TW201024004A (en)

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