TW201022004A

TW201022004A - Hot embossing device and viscous body cassette

Info

Publication number: TW201022004A
Application number: TW098140265A
Authority: TW
Inventors: Koji Miyoshi
Original assignee: Komatsu Ind Corp
Priority date: 2008-12-15
Filing date: 2009-11-26
Publication date: 2010-06-16
Also published as: JP2010137497A; KR20100069571A; JP5457664B2

Abstract

As a substrate (m) is pressurized, a frame (34) slides to a base plate (33) side. Next, along with a movement of the frame (34), a viscous body is compressed by imprint means (35) in order to develop uniform pressure inside the viscous body. As a result, the viscous body can be used to uniformly and tightly press all parts of imprint means (35) on the substrate (m). Thus, a uniform distribution of contact planar pressure from imprint means (35) is received by the substrate (m) without the need of applying excessive pressure or planar pressure on the substrate (m).

Description

201022004 六、發明說明：【發明所屬之技術領域】本發明係關於熱壓成形裝置及黏性體匣。【先前技術】以往，已有一種將數以m〜數十高度之微細形狀圖案（凹凸凸案）熱轉印至液晶顯示器用之導光板等之基材的熱壓成形裝置（以下記載為成形裝置）（參照例如文獻丨：日本特開2004-74769號公報）。文獻i之成形裝置，具備具有上側金屬模具部與下侧金屬模具部之金屬模具裝置。各金屬模具部，具備調溫板、設於各調溫板之對向面側且於表面具有微細形狀圖案的轉印手段。於下側金屬模具部之轉印手段上設置有基材。此種文獻丨之成形裝置，係藉由調溫板將轉印手段加熱至基材之軟化溫度以上後，將轉印手段緊壓於基材，以將轉印手段之形狀圖案熱轉印於基材。接者，藉由調溫板’透過轉印手段使基材冷卻至軟化溫度以下’藉此將形狀圖案固定於基材。然而，此種成形裝置中，不但於基材之平面度具有左右之不均，且於金屬模具裝置之尺寸或轉印手段平面度亦有0.01〜0.05mm左右的不均。又，調溫板因加熱冷卻時之熱應變，而產生翹曲。因此，此種成形裝置承受之接觸面壓的分布產轉印至接觸面壓低的部分，在緊魔成形時基材從轉印手段生不均，而有無法將形狀圖案熱之問題。又，當基材為lmm以下 201022004 而非常薄時，若於接觸面壓之分布產生不均，即會在基材之厚度方向的壓縮變形量及面方向之延伸變形量產生部分之差，而亦有於基材產生翹曲或起伏的問題。針對此等問題’例如可考量將熱轉印所需之加壓力以上的加磨力附加於基材、提升對轉印手段之加熱溫度以下降熱轉印所需的面麼、增長轉印手段對基材之緊壓時間、藉由增大基材之軟化層以τ降熱轉印所需之面虔等的對 ❿ 策。然而，此等對策，不僅在設備成本、運轉成本、生產時^方面不甚理想，且由於對基材附加必要以上之溫度或面壓’因此緊壓時基材侧面之膨起會變大’而須對該膨起之側面進行後加工。又，當基材較薄時，亦會使輕曲或起伏增加。【發明内容】 Ο 、本發明之目的，在於提供能使基材所承受之接觸面壓的分布均一之熱壓成形裝置及黏性體匣。本發明之熱壓成形裝置，其具備：模壓裝置，具有承板及設於該承板上方、可對該承板接近或離開的滑件；以及金屬模具裝置，具有設在該承板且裝載基材的下側金屬模具部、以及設於該滑件之上側金屬模具部；該下侧金屬模具部及該上側金屬模具部之至少一方，具備：底板，係固定於該承板或該滑件；框體，係形成為框狀，於開口部内設置該底板，且設置成能滑動於上下方向；轉印手段， 5 201022004 固定於該框體並封閉該開口部，於表面具有既定形狀圖案，用以將該形狀圖案熱轉印至該基材；以及黏性體，係設於被該底板、該框體、以及該轉印手段包圍之收容空間内。本發明之熱壓成形裝置之較佳態樣為，具備收容於該收容空間内之黏性體匣；該黏性體匣，具備：兩片薄板；設於該薄板間之彈性框材；以及該黏性體，係設在被該薄板及該彈性框材包圍之空間内。本發明之熱壓成形裝置之較佳態樣為，設於該收容空間内之該黏性體的外緣係較該基材之外緣小。根據本發明，隨著基材之緊壓而使框體往底板侧滑動。接著’由於隨著此框體之移動，黏性體被轉印手段壓縮’而於黏性體内部產生均等壓力，因此能藉由黏性體將轉印手段之各部分以均等之力按壓於基材。因此，可不須對基材附加必要以上之溫度或面壓，即能使基材從轉印手段所承受之接觸面壓的分布均一。此處’當於框體内所形成之收容空間内直接設置黏性體之情形下’在更換黏性體時，由於需進行擦除附著在框體内壁或轉印手段之背面等之黏性體的作業，因此有更換需花費人力的問題。然而’藉由本發明，由於黏性體收容於黏性體匣内，因此藉由更換黏性體匣即能更換黏性體，而能容易地進行黏性體之更換。又’當黏性體之外緣在俯視下較基材之外緣大時，於 201022004 轉p手·^又中^•不藉由間隔件按壓與黏性體自基材外緣彈出之部分對應的部分，該部分即會被黏性體上壓，而有塑性變形之虞。因此，由於需要間隔件，因此有零件件數增加的問題。然而，根據本發明，由於黏性體之外緣較基材之外緣小’因此黏性體不會自基材外緣彈出。因此，能不需要間隔件，而能減低零件件數。〇本發明之熱壓成形裝置較佳態樣為，設於該收容空間内之該黏性體的外緣，係較該基材之外緣大，於該基材外側配置有與該基材之厚度相等之厚度的間隔件；該間隔件之内緣，與該基材之外緣透過些微間隙配置，該間隔件之外緣配置於該黏性體外緣之外側。根據本發明，由於黏性體之外緣在俯視下較基材之外緣大，因此黏性體能將轉印手段之各部以均等之力緊壓於基材之全面。因此，能將轉印手段之形狀圖案良好地轉印 ❾於基材之全面。又，雖黏性體之外緣較基材之外緣大，但由於能藉由間隔件按壓轉印手段自基材外緣彈出之部分，因此能防止該部分因被轉印手段上壓而塑性變形。本發明之熱壓成形裝置之較佳態樣為，該轉印手段，由固定於該框體並封閉該開口部、於表面具有該形狀2案的壓模構成。 Μ 根據本發明，由於轉印手段由壓模構成，因此與轉印手段係由壓模與頂板構成之情形相較，能減低零件件數。 7 201022004 本發明之熱壓成形裝置之較佳態樣為，該轉印手段，係由固定於該框體並封閉該開口部之頂板與設於該頂板上且於表面具有該形狀圖案的壓模構成。根據本發明，由於在壓模與黏性體之間配置有頂板，因此能藉由頂板抑制施加於壓模之未被基材或間隔件按壓之部分之來自黏性體的壓力。因此，能確實地防止該部分產生塑性變形。本發明之熱壓成形裝置，其具備：模壓裝置，具有承板及設於該承板上方、可對該承板接近或離開的滑件；以及金屬模具裝置，具有設在該承板且裝載基材的下側金屬模具部、以及設於該滑件之上側金屬模具部；該下側金屬模具部及該上側金屬模具部之至少一方，具備：底板，係固定於該承板或該滑件；框體，係形成為框狀，於開口部内設置該底板，且設置成能滑動於上下方向；壓模，固定於該框體並封閉該開口部，於表面具有既定形狀圖案，用以將該形狀圖案熱轉印至該基材；以及彈性體，係設於被該底板、該框體、以及該壓模包圍之收容空間内。根據本發明，隨著基材之緊壓而使框體往底板侧滑動。接著，由於隨著此框體之移動，彈性體被轉印手段壓縮，而於彈性體内部產生均等壓力，因此能藉由彈性體將壓模之各分以均等之力按壓於基材。因此，可不須對基材附加必要以上之溫度或面壓，即能使基材從壓模所承受之接觸面壓的分布均一。又，彈性體因例如係由橡膠或樹脂構件形成，且為固 201022004 體，故能容易更換。並且，由於在壓模之背面側未設有頂板，因此能減低零件件數。本發明之黏性體匣，係設於用以將既定之形狀圖案熱轉印於基材之熱壓成形裝置之轉印手段的背面側，其具備：兩片薄板；設於該薄板間之彈性框材；以及黏性體，係設在被該薄板及該彈性框材包圍之空間内。 ❾ 根據本發明，黏性體匣係設於轉印手段之背面側，而於内部收容黏性體。因此，在以熱壓成形裝置緊壓基材時，此黏性體係被壓縮，而於黏性體内部產生均等壓力。因此，黏性體匣可藉由此黏性體將轉印手段之各部分以均等之力按壓於基材，可不須對基材附加必要以上之溫度或面壓，即能使基材從轉印手段所承受之接觸面壓的分布均一。又，黏性體匣由於係於内部收容黏性體，因此僅更換該黏性體匣，即能容易地更換黏性體。 e 本發明之黏性體匣之較佳態樣為，該彈性框材，具備：第1彈性框材，係密封該黏性體，具有較該黏性體厚之厚度；以及第2彈性框材，設於該第丨彈性框材外側，具有較該第1彈性框材大之硬度、且與該黏性體相同之厚度。 ;根據本發明，由於在密封黏性體之第1彈性框材外侧 α有較第1彈性框體薄、且與黏性體相同厚度的第2男性框材’因此在遷縮點性體g時，能藉由塵潰帛丨彈性框材使第2彈性框材與兩片薄板緊貼，而能充分地密封黏性體。又，第2彈性框材由於具有較第1彈性框材大之硬度 201022004 且具有與黏性體相同之厚度，因此第2彈性框材幾乎沒有不被壓潰之情事。因此，在黏性體匣被壓縮時，能藉由第2 彈性框材限制第1彈性框材往外側擴張。因之，能防止第丄彈性框材被壓溃而往薄板外側擴張，使擴張至該薄板外側之卩刀被該黏性體匣之背面所設的底板與框體之開口部内閉之間挾持，進而破損之情事。本發明之黏性體匣之較佳態樣為，該黏性體，係由凝膠狀或脂狀之聚矽氧形成。根據本發明’由於該黏性體係由凝膠狀或脂狀之聚石夕氧形成’因此在壓縮黏性體匣時’能使黏性體内產生均等壓力。本發明之黏性體g之較佳態樣為，該黏性體，係由熔點較該基材之軟化溫度低溫之低熔點金屬形成。根據本發明’由於黏性體係由熔點較該基材之軟化溫度低溫之低熔點金屬形成，因此在轉印時被底板等暖化時會變得柔軟。因此，在轉印時黏性體匣被壓縮時，能使黏性體内部確實地產生均等壓力。【實施方式】 [第1實施形態] [1_熱壓裝置之整體構成] 以下，根據圖式說明本發明之第1實施形態。圖1係顯示本實施形態之熱壓成形裝置1的截面圖。此外，圖1為後述圖6之I一 I線截面圖。 201022004 熱壓成形裝置丨’如圖1所示具備模壓裝置2、金屬模具裝置3。 [2·模壓裝置之構成] 模壓裝置2具備：固定於地面之承板21、配置於此承板21上方之滑件22、具有伺服馬達且使滑件22對承板21 接近離開之驅動手段23、以及具有Cpu(Central Processing Unit)且用以控制模壓裝置2整體的控制手段24。 [3-1.金屬模具裝置之整體構成] 金屬模具裝置3具備設於承板21且裝載基材m的下側金屬模具部3 A與設於滑件22之上侧金屬模具部3B。作為基材m，係使用用於液晶顯示器之導光板的基材即丙烯酸板。由於各金屬模具部3A，3B之基本構成係大致相等，因此以下係以下側金屬模具部3A為例說明各金屬模具部3A， 3B。 [3-2.金屬模具部之整體構成] 圖2係放大顯示下側金屬模具部3 A —部分的截面圖。 W __ 各金屬模具部3A，3B(下侧金屬模具部3A)，如圖2所示’具備底板31、冷卻板32、調溫板33、框體34、壓模 35、間隔件36、以及黏性體匣4。 [3-3·底板之構成] 底板31形成為矩形板狀，固定於承板21及滑件22上。於此底板31内形成有真空吸附用孔311(參照圖4)與熱電偶插入孔312(參照圖4)。其中，熱電偶插入孔312延伸設置至後述冷卻板32，而在調溫板33之上面開口。於此熱電偶 11 201022004 插入孔312插入連接在控制手段24之未圖示熱電偶。熱電偶前端設置於壓模35與黏性體匣4之間，用以測定壓模35 之溫度而輸出至控制手段24。 [3-4.冷卻板之構成] 冷卻板32形成為矩形板狀，固定於底板31與調溫板 33之間。於該冷卻板32内形成有複數個水孔321。藉由使冷卻水流通於此等水孔321，冷卻板32之溫度即保持於一定’而可防止後述調溫板33之熱傳導至承板21及滑件22。此外’水孔3 21連接於未圖示之外部機器，在與此外部機器之間使冷卻水循環。後述之調溫板33之水孔33 1及框體 34之水孔342亦為相同構成。 [3-5.調溫板之構成] 調溫板33形成為矩形板狀，設於冷卻板32上。於上述調溫板33設有段差部330’調溫板33係形成為前端部較基端部略小的截面視呈凸狀。圖3 ’係用以說明水孔3 3 1之相關構成之下侧金屬模具部3A的放大截面圖。具體而言，圖3係後述圖6之m 一瓜線截面圖的一部分。於調溫板33内如圖2及圖3所是形成有複數個水孔 331。水孔331兩端之開口部分係以擋栓333密封。於調溫板33之兩端附近分別形成有從底板31側之面矩形掘入之歧管部334。藉由此歧管部334使前述複數個水孔331彼此連結。於調溫板33之底板31側的面，以封閉歧管部334之 201022004 形態固接有長方體形之歧管塊382。此外，於歧管塊382與調溫板33之間介裝防止漏水用之〇形環A4。歧管塊382具有與冷卻板32相同之厚度，與冷卻板32 一起介在於底板31與調溫板33之間。於上述歧管塊382，形成有矩形（圖3)掘入而與歧管部384連結的歧管連結部 383、以及連結於此歧管連結部383並將該歧管塊382於上下方向貫通的貫通孔384。配合此貫通孔384之位置’於底板3丨之歧管塊382側之面形成有矩形掘入之掘入部313〇又，於底板31形成有從此掘入部313在水平方向貫通至該底板31之側面的貫通孔 314(圖 3)。於掘入部313以透過斷熱片315埋入配設有配管塊 316。於配管塊316掘入有彼此正交且連通之兩個孔317, 318。於歧管塊382之貫通孔384與配管塊316之孔317分 ❹別嵌入有管385之兩端。管385與歧管塊382及配管塊316 之間，分別介裝有防止漏水之〇形環A5, A6。又配g 319係從該底板31之端面插入底板^之貫通孔3 14内。此配管3 ! q夕一 a y，山之知側嵌入配管塊3 16之孔3 1 8。此外，於配管3 19盘配昝换2r ，、配b塊3 16之間插入有防止漏水之〇形環A7。配管319之另—端側連接於以控制手段Μ控制示調溫裝置，構成為在此調溫裝置與調溫板33之水孔331 之間使水蒸减冷卻水循環。藉此，調溫板33藉由從此調 13 201022004 溫裝置供應水蒸氣及冷卻水，而被加熱或冷卻至所欲之溫度，透過黏性體匣4加熱或冷卻壓模35。此外，流通於水孔33 1之熱媒亦可代替水蒸氣而使用例如高溫油。又，調溫板33設置成可藉由複數個刮屑板螺栓332(圖 1)相對冷卻板32往上下方向些許移動。藉此，本實施形態中，藉由調溫板33之熱膨脹及熱收縮而產生之上下方向的尺寸變化’而能抑制用以將該調溫板3 3固定於冷卻板3 2 之螺栓變形或緩鬆。本實施形態中，此調溫板33為設於後 _ 述黏性體43之背面側的底板。 [3-6-1.框體之開口部之構成] 框體34形成為矩形框狀，於開口 34〇内配置有前述各板體32, 33及黏性體匣4。此開口部340之内緣較透過壓模 35設於框體34上之基材瓜的外緣大。藉此，本實施形態中，設於開口部340内之黏性體匣4 (黏性體43)之俯視内側設有基材m，而能對基材m全面施加均一之成形壓力，惟詳細留待後述。〇 [3-6-2.框體與各板體之間隙的構成] 又’於開口部340設有與調溫板33之段差部33〇對應之形狀的段差部341，開口部34〇具備配置於表面侧之表面側開口部340Α與開口面積較表面側開口部34〇Α大之深側的深側開口部340Β。於上述開口部34〇之内緣與調溫板33 之外緣之間設有間隙S1。具體而言，此間隙S1，雖係由設於表面侧開口部34〇Α 之内緣與調溫板3 3之外緣之間的間隙s丨丨、以及設於深側 14 201022004 開口部34〇B之内緣與調溫板33之外緣之間的間隙S12構成，但此等間隙Sll，S 12分別設定為不同之尺寸。表面側開口部340A之内緣與調溫板33之外緣之間的間隙S11例如設定為〇.5mm，係設定成調溫板33之外緣不會因調溫板33之熱膨脹及熱收縮而導致之尺寸變化而按壓於表面侧開口部340A之内緣的尺寸，且係設定成足以密封黏性體匣4的充分小之尺寸。 ❹ 又’深側開口部340B之内緣與調溫板33之外緣之間的間隙S 12，係設定成較該間隙S 1 1大的尺寸、例如係設定為1 2mm亦即，該間隙S12，係設定為該間隙s丨2相關之金屬模具的加工公差非為嚴謹、而係金屬模具之加工為容易的尺寸。此等之間隙S1，亦可利用於未圖示真空泵從真空吸附用孔311(參照圖4)吸引此間隙S1之空氣以將壓模35對框體34固定。〇於框體34内形成有複數個水孔342。藉由使冷卻水流通此等水孔342，而能將框體34之溫度保持於4〇度左右。 [3-6-3·框體與底板之連結構成] 又，框體34係藉由到屑板螺栓343(圖丨）及彈簧344連結於底板31’設置成能上下滑動且藉由彈簧被往上方彈壓。此種上下之框體34 ’分別在滑件22下降使基材m被各金屬模具部3A，3B模壓時，係克服彈簧344之彈壓力而滑動至底板3 1側。接著，框體34在從此狀態使滑件22上升時，即隨著此上升藉由彈簧344之彈壓力往自底板31分離 15 201022004 之側滑動。於框體34與底板31之間、以及框體34與壓模^之間介裝有框狀之襯墊A 1，A2，以密封間隙s j。 [3-6-4·用以形成密閉空間的構成] 圖4係顯示熱塵成形裝置！之與圖i及圖3不同之截面的截面®。具體而言’圖4係後㈣線截面圖。如圖4所示，真空框架345係藉由刮屬板螺栓345〇及彈簧3451而能上下滑動至該上側金屬模具部3B之框體34 6 的方式連結於上側金屬模具部3B之框體34。於真空框架 345之下面設有襯墊Α3β於上側金屬模具部3B之框體34，以在俯視下隔著調溫板33對向之方式設有一對定位銷 346(圖1中僅圖示1個）。另一方面’於下側金屬模具部3 A之框體34形成有真空吸引孔347與大氣開放孔348(參照圖6)。真空吸引孔347 透過未圖示之閥連接於真空泵。大氣開放孔348透過未圖❹ 示之閥連通至熱壓成形裝置1外。各閥由控制手段24控制。藉此’控制手段24在使滑件22下降而於真空框架345 内側形成有密閉空間時，即關閉大氣開放孔348侧之閥且開啟真空吸引孔347側之閥，藉此透過真空吸引孔347藉由真空泵吸引出密閉空間内之空氣，而能使密閉空間成為真空。又’控制手段24藉由關閉真空吸引孔347側之閥且開啟大氣開放孔348侧之閥，即能開放大氣開放孔348而解除密閉空間的真空狀態。 16 201022004 又’於下側金屬模具部3A之框體34中與各定位銷346 對應之位置分別形成有定位孔349。本實施形態中，藉由將各定位銷346插入此等各定位孔349，而能定位金屬模具部 3A，3B之相對位置’進而以良好精度定位安裝於各金屬模具部3A，3B之壓模35的相對位置。於下側金屬模具部3A之框體34進一步形成有壓力感測器安裝孔370。於壓力感測器安裝孔370安裝有連接於控 0 制手段24之未圖示壓力感測器。壓力感測器在真空框架345 之内側形成有密閉空間時，係測定密閉空間内之壓力並輸出至控制手段24。 [3-6-5.用以按壓壓模之構成] 圖5係顯示固定滑件372的截面圖，圖6係下侧金屬模具部3A之俯視圖。如圖5及圖6所示，於上述各金屬模具部3八，3B之框體34設有複數個收納槽371、收納於各收納槽371之固定 Q 滑件372、以及複數個釋放槽373(圖6) » 固定滑件372係由對向之兩個固定滑件372A，372B構成。上述固定滑件372(3 72A，3 72B)具備固定塊3 74與滑件本體375。固定塊374係藉由螺栓376固定於滑件本體375。此固定塊3 7 4係透過間隔件3 6按壓壓模3 5之端緣部，將麼模 35定位固定於框體34之既定位置。如此，本實施形態中，由於以設在溫度保持於一定之框體34的固定塊374來定位 17 201022004 固疋壓模35’因此能以更高精度定位安裝於各金屬模具部 3A，3B之壓模35的相對位置。於滑件本體375形成有往相對壓模35所對應之邊成正交之方向延伸的軌孔377。滑件本艎375係插通於該軌孔 377 ’藉由螺合於框體34之刮屑板螺栓378，設置成能往壓模3 5所對應之邊滑動。於上述滑件本體375與框體34之間介裝有彈簧379，藉由此彈簧379 ’固定滑件372即被朝向壓模35所對應之邊彈壓。固定滑件372A之彈簧379係使用彈性較固定滑件 372B之彈簧379強者。藉此，在藉由固定塊374固定了壓模35時’由於具有彈性力較弱之彈簧379之固定滑件372B 係被往外側彈壓，因此能將具有彈性力較強之彈簧379之固疋滑件372A的固定塊374作為壓模35之安裝位置基準。又’於藉由冷卻水使溫度保持於一定之框體34，由於設有能朝向壓模35所對應之邊滑動的固定滑件372，因此能藉由固定滑件372吸收在熱轉印時於水平方向進行熱膨脹及熱收縮之壓模35的尺寸變化。又，於滑件本體375前端設有鍵槽380，藉由將所欲厚度之鍵381插入此鍵槽380，而能微調整朝向壓模35所對應之邊之滑件本體375的位置、進而微調整固定塊374之位置。釋放槽373在承板21及滑件22接近時，係收納設在對向之金屬模具部3A,3B之固定滑件372的固定塊374。 [3-7.壓模之構成] 18 201022004 係藉由利用了間隙s:之真二周::透::…壓模3 5 壓而對框體i附與相^料372之按而形成藉由壓模3Γ、1板3模35開口部340被封閉，容” 1V1 h ^皿板33、以及框體34所包圍之收間〜於此收容空間η收容後述之點性體… 於壓模35表面形成有由微細凹凸圖案構成之既定形狀 ❿ 、又Μ模35在藉由調溫板33被加熱至基材之軟化溫度以上後，按塵於基材m’藉此將既定之形狀圖案熱轉印至基材m。上述壓模35，具有在模麗基材m時，後述之盥間隔件36之間隙32部分在被黏性體匿4上壓時不致變形的充分強度（厚度卜對框體34固定而封閉開口部34〇且將形狀圖案熱轉印至基材m的轉印手段，在本實施形態中，係由此壓模3 5構成。 [3-8.間隔件之構成] Ο 間隔件36形成為外緣與壓模35之外緣相等的矩形框狀。此間隔件36載置於壓模35上，藉由被固定滑件372 按壓，而對框體34固定。於上述間隔件36之内側透過些微間隙S2設置基材m。亦即，間隔件36之内緣係透過與基材m外緣之些許間隙S2而配置，外緣配置於框體34之開口部340外側。上述間隔件36之板厚係與基材m之板厚大致相同的厚度。又’基材m為丙稀酸板且為熱可塑性板，因此雖通常有1 〇%左右之板壓不均，但間隔件36之板厚最好係此基材 19 201022004 m之板厚不均之最大厚度+ 〇 lmm以内。作為間隔件刊之材質’能採用不鏽鋼（SUS)或與壓模35相同之材質。此處’滑件22下降，藉由各金屬模具部3Α，3Β對基材 m加壓後，框體34即滑動至底板3丨側，後述黏性體匣4 透過基材m及間隔件36被壓模35壓縮。此時，藉由此反作用力，使黏性體匣4内之黏性體43產生内壓，藉由此内壓將基材m外側部分之壓模上壓。然而，本實施形態中，由於忐藉由間隔件3 6按壓基材m外側部分之壓模3 5，因此能抑制壓模35被黏性體43上壓而塑性變形，提高壓模35 之耐久性。又，基材m及間隔件36之間隙S2部分的壓模35，雖會因黏性體匣4之黏性體43内所產生之内壓被往外側上壓而彈性變形，但本實施形態之壓模35如前所述具有不致塑 ^生變形的充分強度。因此，當壓模35之強度較低時，雖須於壓模35背面設置頂板以減低壓模35之間隙S2部分從黏性體43承受的壓力，但本實施形態中，由於壓模35具有充分之強度，因此不須於壓模35之下面設置頂板，而能減低零件件數。此處，若將間隙S2設定得較小時，能抑制此基材瓜之彈性變形。然而，在將間隙S2設定得較小時，會因基材m 與間隔件3 6之板厚差，使被壓模3 5施加之面壓的不均在基材m之外緣附近與基材m之中央部之間變大。另一方面，若將間隙S2設定得較大時，藉由間隙S2部分之壓模35被上壓而彈性變形，而能吸收基材m與間隔件36之板厚差， 20 201022004 抑制基材m之外緣附近與基材m之中央部之面壓的不均。然而，由於壓模35之彈性變形量會增大，因此間隙以部分之壓模35的对久性會降低。因此，係在考量上述優點及缺點之情況下調整間隙U 之尺寸。接著，除了上述間隙32之尺寸調整外，藉由調整間隔件36及基材m之板厚，而能控制施加於基材爪之面壓不均。本實施形態中，除了上述控制外，亦藉由後述黏性 ❿體匣4減低施加於基材m之面壓不均。 [3-9.基材之構成] 基材m如前所述係用於液晶顯示器之導光板基材即丙烯酸板（PMMA(P〇lymethylmethacrylate，壓克力）），形成為矩形板狀，而配置於間隔件3 6内側。 [3-10.黏性體匣之構成] 黏性體匣4如圖5所示收鈉於被壓模35、調溫板33、以及框體34包圍之收容空間VI内。 φ 圖7係顯示黏性體匣4之截面圖，圖8係顯示黏性體匣4之俯視圖。黏性體匣4如圖7及圖8所示形成為俯視矩形狀。此黏性體匣4具備一對薄板（薄塾片）41、彈性框材42、黏性體43。薄板41由板厚〇.3mm之SUS(不鏽鋼）形成。如上述，本實施形態中，由於薄板41為金屬製，因此能將來自調溫板33之熱良好地傳導至壓模35。此外，薄板41除了 SUS 以外，最好係由黃銅、SPCC(冷間壓延鋼板）等的金屬形成。 21 201022004 又’薄板41之板厚最好係在〇丨〜〇 5mni之間。彈性框材42具備第1彈性框材421與第2彈性框材 422 ° 第1彈性框材421設於薄板41間，與薄板41形成收容空間V2。於此收容空間V2内收容（充填）後述黏性體43。此種第1彈性框材421，形成為寬度4mm、厚度3mm，設計成在壓潰30%左右時會與黏性體43之厚度相等。第1彈性框材421係由即使在高溫下反覆承受負荷亦不易產生永久變形之硬度蕭氏（Shore)A80之PMF(氟橡膠）形成。此外，上側之薄板41與黏性體43之間的空氣，係在為了吸附壓模35而從真空吸附用孔3 11吸引空氣時與間隙 S1中之空氣一起被吸引。201022004 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a hot press forming apparatus and a viscous body. [Prior Art] Conventionally, there has been a hot press forming apparatus (hereinafter referred to as forming) in which a fine-shaped pattern (concave convex shape) having a height of m to several tens of degrees is thermally transferred to a substrate such as a light guide plate for a liquid crystal display. The device is referred to (for example, Japanese Patent Laid-Open Publication No. 2004-74769). The molding apparatus of Document i includes a metal mold device having an upper metal mold portion and a lower metal mold portion. Each of the metal mold portions includes a temperature regulating plate, and a transfer means provided on the opposite surface side of each of the temperature regulating plates and having a fine-shaped pattern on the surface. A substrate is provided on the transfer means of the lower metal mold portion. In the molding apparatus of the document, after the transfer means is heated to a softening temperature of the substrate by the temperature regulating plate, the transfer means is pressed against the substrate to thermally transfer the shape pattern of the transfer means to the substrate. Substrate. Then, the shape pattern is fixed to the substrate by the temperature regulating plate 'cooling the substrate to a softening temperature below by a transfer means'. However, in such a molding apparatus, not only the flatness of the base material but also the unevenness of the left and right sides, and the dimensionality of the metal mold device or the flatness of the transfer means are also about 0.01 to 0.05 mm. Further, the temperature regulating plate is warped due to thermal strain during heating and cooling. Therefore, the distribution of the contact surface pressure which the molding apparatus receives is transferred to the portion where the contact surface is depressed, and the substrate is unevenly formed from the transfer means during the molding of the tightness, and there is a problem that the shape pattern cannot be heated. In addition, when the base material is extremely thinner than 1 mm and 201022004, if the distribution of the contact surface pressure is uneven, the amount of compressive deformation in the thickness direction of the base material and the amount of elongation in the surface direction are partially different. There are also problems with warpage or undulation of the substrate. For such problems, for example, it is possible to add a grinding force equal to or higher than the pressing force required for thermal transfer to the substrate, to raise the heating temperature of the transfer means to lower the surface required for thermal transfer, and to increase the transfer means. The pressing time of the substrate, the surface of the softening layer of the substrate by the τ, and the like, are required. However, these countermeasures are not only ideal in terms of equipment cost, running cost, and production time, and since the temperature or surface pressure necessary for the substrate is added, the swelling of the side surface of the substrate becomes large when pressed. The side of the bulge must be post-processed. Also, when the substrate is thin, it also causes an increase in lightness or undulation. SUMMARY OF THE INVENTION An object of the present invention is to provide a hot press forming apparatus and a viscous body which can uniformly distribute the contact surface pressure of a substrate. The hot press forming apparatus of the present invention comprises: a molding device having a carrier plate and a slider disposed above the carrier plate to approach or leave the carrier plate; and a metal mold device having the carrier plate mounted thereon a lower metal mold portion of the substrate and a metal mold portion provided on the upper side of the slider; and at least one of the lower metal mold portion and the upper metal mold portion includes a bottom plate that is fixed to the carrier or the slide The frame is formed in a frame shape, and the bottom plate is disposed in the opening portion and is slidable in the vertical direction; the transfer means, 5 201022004 is fixed to the frame body and closes the opening portion, and has a predetermined shape pattern on the surface. And thermally transferring the shape pattern to the substrate; and the adhesive body is disposed in the receiving space surrounded by the bottom plate, the frame body, and the transfer means. A preferred embodiment of the hot press forming apparatus of the present invention includes: a viscous body enthalpy contained in the accommodating space; the viscous body 具备 comprising: two sheets; an elastic frame member disposed between the sheets; The viscous body is disposed in a space surrounded by the thin plate and the elastic frame member. In a preferred embodiment of the hot press forming apparatus of the present invention, the outer edge of the viscous body disposed in the accommodating space is smaller than the outer edge of the substrate. According to the present invention, the frame body slides toward the bottom plate side as the substrate is pressed. Then, 'the viscosity is compressed by the transfer means as the frame moves, and the pressure is generated inside the adhesive body. Therefore, the respective portions of the transfer means can be pressed by the adhesive body with equal force. Substrate. Therefore, it is not necessary to add the necessary temperature or surface pressure to the substrate, that is, the distribution of the contact surface pressure which the substrate receives from the transfer means is uniform. Here, in the case where a viscous body is directly provided in the accommodating space formed in the casing, when the viscous body is replaced, the viscous property of the inner wall of the casing or the back of the transfer means is required to be erased. The work of the body, so there is a problem that it takes a lot of manpower to replace it. However, according to the present invention, since the viscous body is accommodated in the viscous body, the viscous body can be replaced by replacing the viscous body, and the viscous body can be easily replaced. In addition, when the outer edge of the viscous body is larger than the outer edge of the substrate in a plan view, in 201022004, the hand is not pressed by the spacer and the portion of the viscous body ejected from the outer edge of the substrate. In the corresponding part, the part will be pressed by the viscous body, and there will be plastic deformation. Therefore, since the spacer is required, there is a problem that the number of parts increases. However, according to the present invention, since the outer edge of the viscous body is smaller than the outer edge of the substrate, the viscous body does not eject from the outer edge of the substrate. Therefore, the number of parts can be reduced without the need for a spacer. In a preferred embodiment of the hot press forming apparatus of the present invention, the outer edge of the adhesive body disposed in the receiving space is larger than the outer edge of the substrate, and the substrate is disposed outside the substrate. a spacer having a thickness equal to the thickness; an inner edge of the spacer is disposed through the micro-gap of the outer edge of the substrate, and the outer edge of the spacer is disposed on an outer side of the outer edge of the adhesive body. According to the present invention, since the outer edge of the adhesive body is larger than the outer edge of the substrate in plan view, the adhesive body can press the respective portions of the transfer means to the entire surface of the substrate with equal force. Therefore, the shape pattern of the transfer means can be well transferred to the entire surface of the substrate. Further, although the outer edge of the adhesive body is larger than the outer edge of the substrate, since the portion which is ejected from the outer edge of the substrate by the transfer means by the spacer is pressed, the portion can be prevented from being pressed by the transfer means. Plastic deformation. In a preferred embodiment of the hot press forming apparatus of the present invention, the transfer means is constituted by a stamper which is fixed to the frame and closes the opening and has the shape 2 on the surface. According to the present invention, since the transfer means is constituted by a stamper, the number of parts can be reduced as compared with the case where the transfer means is constituted by the stamper and the top plate. 7 201022004 In a preferred embodiment of the hot press forming apparatus of the present invention, the transfer means is a top plate fixed to the frame and closing the opening, and a pressure provided on the top plate and having a pattern on the surface Modular composition. According to the invention, since the top plate is disposed between the stamper and the viscous body, the pressure applied from the viscous body to the portion of the stamp which is not pressed by the substrate or the spacer can be suppressed by the top sheet. Therefore, it is possible to surely prevent plastic deformation of the portion. The hot press forming apparatus of the present invention comprises: a molding device having a carrier plate and a slider disposed above the carrier plate to approach or leave the carrier plate; and a metal mold device having the carrier plate mounted thereon a lower metal mold portion of the substrate and a metal mold portion provided on the upper side of the slider; and at least one of the lower metal mold portion and the upper metal mold portion includes a bottom plate that is fixed to the carrier or the slide The frame is formed in a frame shape, the bottom plate is disposed in the opening portion, and is disposed to be slidable in the vertical direction; the stamper is fixed to the frame body and closes the opening portion, and has a predetermined shape pattern on the surface for The shape pattern is thermally transferred to the substrate; and the elastic body is disposed in the receiving space surrounded by the bottom plate, the frame, and the stamper. According to the present invention, the frame body slides toward the bottom plate side as the substrate is pressed. Then, the elastic body is compressed by the transfer means as the frame moves, and an equal pressure is generated inside the elastic body. Therefore, the elastic body can press the respective portions of the stamper to the base material with equal force. Therefore, it is possible to uniformly distribute the contact surface pressure of the substrate from the stamper without attaching the necessary temperature or surface pressure to the substrate. Further, since the elastic body is formed of, for example, a rubber or a resin member and is made of a solid body 201022004, it can be easily replaced. Further, since the top plate is not provided on the back side of the stamper, the number of parts can be reduced. The viscous body raft of the present invention is provided on the back side of a transfer means for thermally transferring a predetermined shape pattern to a substrate, and comprises: two sheets; and is disposed between the sheets The elastic frame material; and the adhesive body are disposed in a space surrounded by the thin plate and the elastic frame material. According to the present invention, the viscous body is provided on the back side of the transfer means, and the viscous body is accommodated inside. Therefore, when the substrate is pressed by the hot press forming apparatus, the viscous system is compressed, and an equal pressure is generated inside the viscous body. Therefore, the viscous body can press the respective portions of the transfer means to the substrate with equal force by the viscous body, and the substrate can be rotated without adding the necessary temperature or surface pressure to the substrate. The distribution of the contact surface pressure experienced by the printing means is uniform. Further, since the viscous body is contained inside the viscous body, the viscous body can be easily replaced only by replacing the viscous body. In a preferred embodiment of the adhesive body of the present invention, the elastic frame material comprises: a first elastic frame material that seals the adhesive body and has a thickness thicker than the adhesive body; and a second elastic frame The material is disposed outside the second elastic frame material and has a hardness greater than that of the first elastic frame material and the same thickness as the adhesive body. According to the present invention, since the second male frame member which is thinner than the first elastic frame and has the same thickness as the adhesive body on the outer side α of the first elastic frame member of the sealing adhesive body, the retracting point body g is In this case, the second elastic frame member can be brought into close contact with the two thin plates by the dust-breaking elastic frame member, and the adhesive body can be sufficiently sealed. Further, since the second elastic frame member has a hardness larger than that of the first elastic frame member 201022004 and has the same thickness as that of the viscous body, the second elastic frame member is hardly crushed. Therefore, when the viscous body is compressed, the first elastic frame material can be restricted from expanding outward by the second elastic frame member. Therefore, the third elastic frame material can be prevented from being crushed and expanded to the outside of the thin plate, so that the file that is expanded to the outside of the thin plate is held between the bottom plate provided on the back surface of the adhesive body and the opening portion of the frame body. And then break the situation. In a preferred embodiment of the viscous body of the present invention, the viscous body is formed of gelatinous or fatty polyoxyl. According to the present invention, since the viscous system is formed of gelatinous or fat-like aggregates, it is capable of generating an equal pressure in the viscous body when the viscous body is compressed. In a preferred embodiment of the viscous body g of the present invention, the viscous body is formed of a low melting point metal having a melting point lower than a softening temperature of the substrate. According to the present invention, since the viscous system is formed of a low melting point metal having a melting point lower than the softening temperature of the substrate, it becomes soft when it is warmed by the bottom plate or the like at the time of transfer. Therefore, when the viscous body 匣 is compressed at the time of transfer, an equal pressure can be surely generated inside the viscous body. [Embodiment] [First Embodiment] [1_ Overall Configuration of Hot Pressing Apparatus] Hereinafter, a first embodiment of the present invention will be described based on the drawings. Fig. 1 is a cross-sectional view showing the hot press forming apparatus 1 of the present embodiment. In addition, Fig. 1 is a cross-sectional view taken along line I-I of Fig. 6 which will be described later. 201022004 The hot press forming apparatus 丨' includes a molding device 2 and a metal mold device 3 as shown in Fig. 1 . [2. Configuration of Molding Device] The molding device 2 includes a carrier plate 21 fixed to the floor, a slider 22 disposed above the carrier plate 21, and a driving means having a servo motor and closing the slider 22 to the carrier plate 21 23. A control means 24 having a CPU (Central Processing Unit) and controlling the entire molding apparatus 2. [3-1. Overall configuration of the metal mold device] The metal mold device 3 includes a lower metal mold portion 3A provided on the carrier plate 21 and loaded with the substrate m, and a metal mold portion 3B provided on the upper side of the slider 22. As the substrate m, an acrylic plate which is a substrate for a light guide plate of a liquid crystal display is used. Since the basic configurations of the respective metal mold portions 3A and 3B are substantially equal, the respective metal mold portions 3A and 3B will be described below by taking the lower side metal mold portion 3A as an example. [3-2. Overall Configuration of Metal Mold Portion] Fig. 2 is a cross-sectional view showing a portion of the lower metal mold portion 3A in an enlarged manner. W __ each of the metal mold portions 3A, 3B (lower metal mold portion 3A) includes a bottom plate 31, a cooling plate 32, a temperature regulating plate 33, a frame body 34, a stamper 35, a spacer 36, and Viscous 匣4. [3-3. Configuration of Base Plate] The bottom plate 31 is formed in a rectangular plate shape and is fixed to the carrier plate 21 and the slider 22. A vacuum suction hole 311 (see Fig. 4) and a thermocouple insertion hole 312 (see Fig. 4) are formed in the bottom plate 31. Among them, the thermocouple insertion hole 312 is extended to the cooling plate 32 to be described later, and is opened on the upper surface of the temperature regulating plate 33. Here, the thermocouple 11 201022004 insertion hole 312 is inserted into a thermocouple (not shown) connected to the control means 24. The front end of the thermocouple is disposed between the stamper 35 and the adhesive body 4, and is used to measure the temperature of the stamper 35 to be output to the control means 24. [3-4. Configuration of Cooling Plate] The cooling plate 32 is formed in a rectangular plate shape and is fixed between the bottom plate 31 and the temperature regulating plate 33. A plurality of water holes 321 are formed in the cooling plate 32. By circulating the cooling water through the water holes 321, the temperature of the cooling plate 32 is maintained at a predetermined value, and the heat of the temperature regulating plate 33 to be described later can be prevented from being transmitted to the carrier plate 21 and the slider 22. Further, the water hole 3 21 is connected to an external device (not shown), and the cooling water is circulated between the external machine and the external machine. The water hole 33 1 of the temperature regulating plate 33 to be described later and the water hole 342 of the frame body 34 have the same configuration. [3-5. Configuration of Temperature Control Plate] The temperature adjustment plate 33 is formed in a rectangular plate shape and is provided on the cooling plate 32. The temperature regulating plate 33 is provided with a step portion 330'. The temperature regulating plate 33 is formed such that the front end portion is slightly smaller in cross section than the base end portion. Fig. 3' is an enlarged cross-sectional view showing the lower side metal mold portion 3A constituting the water hole 3 3 1 . Specifically, Fig. 3 is a part of a cross-sectional view taken along line m of Fig. 6 which will be described later. A plurality of water holes 331 are formed in the temperature regulating plate 33 as shown in Figs. 2 and 3 . The opening portions at both ends of the water hole 331 are sealed by the stopper 333. A manifold portion 334 which is formed in a rectangular shape from the surface of the bottom plate 31 is formed in the vicinity of both ends of the temperature regulating plate 33. The plurality of water holes 331 are connected to each other by the manifold portion 334. A manifold block 382 having a rectangular parallelepiped shape is fixed to the surface of the temperature regulating plate 33 on the side of the bottom plate 31 in the form of a closed manifold portion 334 of 201022004. Further, a ring-shaped ring A4 for preventing water leakage is interposed between the manifold block 382 and the temperature regulating plate 33. The manifold block 382 has the same thickness as the cooling plate 32 and is interposed between the bottom plate 31 and the temperature regulating plate 33 together with the cooling plate 32. The manifold block 382 is formed with a manifold connecting portion 383 which is formed by a rectangular shape (FIG. 3) and connected to the manifold portion 384, and is connected to the manifold connecting portion 383 and penetrates the manifold block 382 in the vertical direction. Through hole 384. The position of the through hole 384 is formed in the surface of the manifold block 382 on the side of the bottom plate 3, and the tunneling portion 313 is formed in the rectangular boring portion 382. Further, the bottom plate 31 is formed in the horizontal direction from the boring portion 313 to the bottom plate 31. Through hole 314 on the side (Fig. 3). A pipe block 316 is disposed in the boring portion 313 so as to be buried in the heat insulating sheet 315. Two holes 317, 318 which are orthogonal to each other and communicate with each other are dug in the pipe block 316. The through holes 384 of the manifold block 382 and the holes 317 of the pipe block 316 are inserted into the ends of the pipe 385. Between the tube 385 and the manifold block 382 and the piping block 316, a ring-shaped ring A5, A6 for preventing water leakage is interposed. Further, g 319 is inserted into the through hole 3 14 of the bottom plate from the end surface of the bottom plate 31. This pipe 3! q 夕一 a y, the side of the mountain is embedded in the hole 3 16 of the pipe block 3 16 . Further, a yoke ring A7 for preventing water leakage is inserted between the pipe 3 19 and the 2 block, and the b block 3 16 is inserted. The other end side of the pipe 319 is connected to the control means Μ to control the temperature regulating means, and the water is circulated between the temperature regulating means and the water hole 331 of the temperature regulating plate 33 to circulate the cooling water. Thereby, the temperature regulating plate 33 is heated or cooled to a desired temperature by supplying water vapor and cooling water from the temperature adjusting device, and the pressing mold 35 is heated or cooled by the adhesive body 4. Further, the heat medium flowing through the water hole 33 1 may be used instead of water vapor, for example, a high temperature oil. Further, the temperature regulating plate 33 is provided to be slightly movable in the vertical direction with respect to the cooling plate 32 by a plurality of scraper plate bolts 332 (Fig. 1). Therefore, in the present embodiment, the dimensional change in the upper and lower directions is generated by thermal expansion and thermal contraction of the temperature regulating plate 33, and deformation of the bolt for fixing the temperature regulating plate 33 to the cooling plate 3 2 can be suppressed or Slow down. In the present embodiment, the temperature regulating plate 33 is a bottom plate provided on the back side of the adhesive body 43. [3-6-1. Configuration of the opening of the casing] The casing 34 is formed in a rectangular frame shape, and the respective plates 32 and 33 and the viscous body 4 are disposed in the opening 34A. The inner edge of the opening portion 340 is larger than the outer edge of the substrate melon which is provided on the frame body 34 through the stamper 35. Therefore, in the present embodiment, the substrate m is provided on the inner side of the viscous body 4 (adhesive body 43) provided in the opening 340, and a uniform forming pressure can be uniformly applied to the substrate m, but the details are detailed. Leave for later. 〇 [3-6-2. Configuration of the gap between the frame and each of the plates] Further, the opening portion 340 is provided with a step portion 341 having a shape corresponding to the step portion 33 of the temperature regulating plate 33, and the opening portion 34 is provided The front surface side opening portion 340'' disposed on the front surface side and the deep side opening portion 340'' have a larger opening area than the front side opening portion 34''. A gap S1 is provided between the inner edge of the opening portion 34 and the outer edge of the temperature regulating plate 33. Specifically, the gap S1 is provided by a gap s 设 between the inner edge of the front surface side opening portion 34 and the outer edge of the temperature regulating plate 33, and the opening portion 34 provided on the deep side 14 201022004. The inner edge of the crucible B is formed by a gap S12 between the outer edge of the temperature regulating plate 33, but the gaps S11 and S12 are respectively set to different sizes. The gap S11 between the inner edge of the front side opening portion 340A and the outer edge of the temperature regulating plate 33 is set to, for example, 〇5 mm, and is set such that the outer edge of the temperature regulating plate 33 is not thermally expanded and thermally contracted by the temperature regulating plate 33. The size of the inner edge of the front opening 340A is pressed against the size change, and is set to be sufficiently small to seal the viscous body 匣4. Further, the gap S 12 between the inner edge of the deep side opening 340B and the outer edge of the temperature regulating plate 33 is set to be larger than the gap S 1 1 , for example, set to 12 mm, that is, the gap In S12, it is set that the machining tolerance of the metal mold related to the gap s丨2 is not strict, and the processing of the metal mold is easy. The gap S1 can be used to suck the air of the gap S1 from the vacuum suction hole 311 (see Fig. 4) by a vacuum pump (not shown) to fix the stamper 35 to the frame 34. A plurality of water holes 342 are formed in the frame 34. By allowing the cooling water to flow through the water holes 342, the temperature of the frame 34 can be maintained at about 4 degrees. [3-6-3·Connection structure between the frame and the bottom plate] Further, the frame body 34 is connected to the bottom plate 31' by the chip bolt 343 (Fig. 314) and the spring 344 so as to be slidable up and down and by the spring Press upwards. When the sliders 22 are lowered and the substrate m is molded by the respective metal mold portions 3A, 3B, respectively, the upper and lower frames 34' are slid to the bottom plate 31 side against the elastic force of the spring 344. Then, when the slider 34 is raised from this state, that is, as the rise is caused by the spring pressure of the spring 344, it slides toward the side separated from the bottom plate 31 by 15201022004. A frame-shaped spacer A 1, A2 is interposed between the frame 34 and the bottom plate 31 and between the frame 34 and the stamper to seal the gap s j . [3-6-4·Configuration for forming a sealed space] Fig. 4 shows a hot dust forming device! Sections® of the cross section different from those of Figures i and 3. Specifically, Fig. 4 is a cross-sectional view of the rear (four) line. As shown in FIG. 4, the vacuum frame 345 is connected to the frame 34 of the upper metal mold part 3B so as to be slidable up and down to the frame body 346 of the upper metal mold part 3B by the scraping plate bolts 345 and the spring 3451. . A frame 34 of the upper side die portion 3B is provided on the lower surface of the vacuum frame 345, and a pair of positioning pins 346 are provided opposite to each other in a plan view via the temperature regulating plate 33 (only FIG. 1 is shown in FIG. 1). )). On the other hand, the frame 34 of the lower metal mold portion 3A is formed with a vacuum suction hole 347 and an atmosphere opening hole 348 (see Fig. 6). The vacuum suction hole 347 is connected to the vacuum pump through a valve (not shown). The atmosphere opening hole 348 is communicated to the outside of the hot press forming apparatus 1 through a valve not shown. Each valve is controlled by a control means 24. By the control means 24, when the slider 22 is lowered and a sealed space is formed inside the vacuum frame 345, the valve on the side of the air opening hole 348 is closed and the valve on the side of the vacuum suction hole 347 is opened, thereby passing through the vacuum suction hole 347. The air in the closed space is sucked by the vacuum pump, so that the sealed space becomes a vacuum. Further, the control means 24 closes the valve on the side of the vacuum suction hole 347 and opens the valve on the side of the atmosphere opening hole 348, that is, the atmosphere opening hole 348 can be opened to release the vacuum state of the sealed space. 16 201022004 Further, a positioning hole 349 is formed in each of the frames 34 of the lower metal mold portion 3A at positions corresponding to the respective positioning pins 346. In the present embodiment, by inserting the positioning pins 346 into the positioning holes 349, the relative positions of the metal mold portions 3A, 3B can be positioned, and the stampers attached to the respective metal mold portions 3A, 3B can be positioned with good precision. 35 relative position. A pressure sensor mounting hole 370 is further formed in the frame body 34 of the lower metal mold portion 3A. A pressure sensor (not shown) connected to the control means 24 is attached to the pressure sensor mounting hole 370. When the pressure sensor forms a closed space inside the vacuum frame 345, the pressure in the sealed space is measured and output to the control means 24. [3-6-5. Configuration for pressing the stamper] Fig. 5 is a cross-sectional view showing the fixed slider 372, and Fig. 6 is a plan view showing the lower metal mold portion 3A. As shown in FIGS. 5 and 6, the frame body 34 of each of the metal mold portions 3, 8B is provided with a plurality of storage grooves 371, a fixed Q slider 372 housed in each storage groove 371, and a plurality of release grooves 373. (Fig. 6) » The fixed slider 372 is composed of two opposite fixed sliders 372A, 372B. The fixed slider 372 (3 72A, 3 72B) has a fixed block 3 74 and a slider body 375. The fixing block 374 is fixed to the slider body 375 by bolts 376. The fixing block 374 presses the end edge portion of the stamper 35 through the spacer 36 to position and fix the mold 35 to a predetermined position of the frame body 34. As described above, in the present embodiment, since the fixing mold 374 is held at a constant temperature of the frame 34, the 17201022004 fixing mold 35' is positioned so that it can be attached to each of the metal mold portions 3A, 3B with higher precision. The relative position of the stamper 35. A rail hole 377 extending in a direction orthogonal to the side corresponding to the stamper 35 is formed in the slider body 375. The slider 375 is inserted through the rail hole 377' by a scraper bolt 378 screwed to the frame 34 so as to be slidable to the side corresponding to the stamp 35. A spring 379 is interposed between the slider body 375 and the frame 34, whereby the slider 372 is fixed by the spring 379' to be biased toward the side corresponding to the stamper 35. The spring 379 of the fixed slider 372A is stronger than the spring 379 which is more elastic than the fixed slider 372B. Thereby, when the stamper 35 is fixed by the fixing block 374, the fixed slider 372B of the spring 379 having a weak elastic force is biased outward, so that the spring 379 having a strong elastic force can be fixed. The fixing block 374 of the slider 372A serves as a reference for the mounting position of the stamper 35. Further, in the frame 34 which is kept at a constant temperature by the cooling water, since the fixed slider 372 which is slidable toward the side corresponding to the stamper 35 is provided, it can be absorbed by the fixed slider 372 during thermal transfer. The dimensional change of the stamper 35 which performs thermal expansion and heat shrinkage in the horizontal direction. Further, a key groove 380 is provided at the front end of the slider body 375, and by inserting the key 381 of the desired thickness into the key groove 380, the position of the slider body 375 facing the side corresponding to the stamper 35 can be finely adjusted, and then finely adjusted. The position of the fixed block 374. The release groove 373 accommodates the fixing block 374 of the fixed slider 372 provided in the opposing metal mold portions 3A, 3B when the carrier 21 and the slider 22 are close to each other. [3-7. Composition of the stamper] 18 201022004 is formed by using the gap s: true two weeks:: through::...the stamper 3 5 pressure and the frame i attached to the phase material 372 The opening portion 340 of the die 3 Γ, 1 plate 3 die 35 is closed, and the space surrounded by the 1V1 h ^ plate plate 33 and the frame body 34 is accommodated in the accommodating space η to accommodate the point-like body described later. The surface of the mold 35 is formed with a predetermined shape 微 formed by a fine concavo-convex pattern, and after the temperature is increased by the temperature regulating plate 33 to a softening temperature of the substrate, the dust is applied to the substrate m' to thereby form a predetermined shape. The pattern is thermally transferred to the substrate m. The stamper 35 has a sufficient strength (thickness) that does not cause deformation when the gap 32 portion of the spacer member 36 described later is pressed by the viscous body 4 when the substrate m is molded. In the present embodiment, the transfer means for fixing the frame 34 to close the opening 34 and thermally transferring the shape pattern to the substrate m is constituted by the stamper 35. [3-8. The spacer 306 is formed in a rectangular frame shape having an outer edge equal to the outer edge of the stamper 35. The spacer 36 is placed on the stamper 35 and pressed by the fixed slider 372. The frame body 34 is fixed to the inside of the spacer 36. The substrate m is provided through the micro gaps S2. That is, the inner edge of the spacer 36 is disposed through a slight gap S2 from the outer edge of the substrate m, and the outer edge is disposed. The thickness of the spacer 36 is substantially the same as the thickness of the substrate m. The substrate m is an acrylic plate and is a thermoplastic plate, so there is usually 1 〇% of the plate pressure is uneven, but the thickness of the spacer 36 is preferably the maximum thickness of the substrate 19 201022004 m uneven thickness + 〇 lmm. As a spacer material, can use stainless steel ( SUS) or the same material as the stamper 35. Here, the slider 22 is lowered, and after the metal mold portions 3, 3 are pressed against the substrate m, the frame 34 is slid to the side of the bottom plate 3, and the viscosity is described later. The body 4 is compressed by the stamper 35 through the substrate m and the spacer 36. At this time, the internal pressure of the viscous body 43 in the viscous body 4 is generated by the reaction force, whereby the substrate is pressed by the internal pressure. The stamper of the outer portion of the m is pressed up. However, in the present embodiment, the outer portion of the substrate m is pressed by the spacer 36. The mold 35 can suppress the plastic deformation of the stamper 35 by the adhesive body 43 and improve the durability of the stamper 35. Further, the stamper 35 of the gap S2 of the substrate m and the spacer 36 may be caused by The internal pressure generated in the viscous body 43 of the viscous crucible 4 is elastically deformed by being pressed outward, but the stamper 35 of the present embodiment has sufficient strength to prevent plastic deformation as described above. When the strength of the stamper 35 is low, the top plate is provided on the back surface of the stamper 35 to reduce the pressure which the portion S2 of the low-pressure mold 35 receives from the adhesive body 43. However, in the present embodiment, the stamper 35 has sufficient strength. Therefore, it is not necessary to provide a top plate under the stamper 35, and the number of parts can be reduced. Here, when the gap S2 is set to be small, the elastic deformation of the substrate can be suppressed. However, when the gap S2 is set to be small, the unevenness of the surface pressure applied by the stamper 35 is caused by the difference in sheet thickness between the substrate m and the spacer 36, and the base is near the outer edge of the substrate m. The central portion of the material m becomes larger. On the other hand, when the gap S2 is set to be large, the stamper 35 of the portion of the gap S2 is elastically deformed by being pressed, and the difference in sheet thickness between the substrate m and the spacer 36 can be absorbed, 20 201022004 The unevenness of the surface pressure of the vicinity of the outer edge of m and the central portion of the substrate m. However, since the amount of elastic deformation of the stamper 35 is increased, the durability of the gap by the partial stamper 35 is lowered. Therefore, the size of the gap U is adjusted in consideration of the above advantages and disadvantages. Next, in addition to the dimensional adjustment of the gap 32, the unevenness of the surface pressure applied to the substrate claw can be controlled by adjusting the thickness of the spacer 36 and the substrate m. In the present embodiment, in addition to the above control, the unevenness of the surface pressure applied to the substrate m is also reduced by the viscous crucible body 4 which will be described later. [3-9. Composition of Substrate] The substrate m is used as a sheet of a light guide plate of a liquid crystal display, that is, an acrylic sheet (PMMA (P〇lymethylmethacrylate)), and is formed into a rectangular plate shape. It is disposed inside the spacer 36. [3-10. Configuration of Viscous Body ]] The viscous body 匣 4 is collected in the accommodating space VI surrounded by the mold 35, the temperature regulating plate 33, and the frame 34 as shown in Fig. 5 . φ Fig. 7 is a cross-sectional view showing the viscous body 匣4, and Fig. 8 is a plan view showing the viscous body 匣4. The viscous crucible 4 is formed in a rectangular shape in plan view as shown in FIGS. 7 and 8 . This viscous crucible 4 is provided with a pair of thin plates (thin sheets) 41, an elastic frame member 42, and a viscous body 43. The thin plate 41 is formed of SUS (stainless steel) having a thickness of 3 mm. As described above, in the present embodiment, since the thin plate 41 is made of metal, the heat from the temperature regulating plate 33 can be favorably conducted to the stamper 35. Further, the thin plate 41 is preferably made of a metal such as brass or SPCC (cold-rolled steel plate) in addition to SUS. 21 201022004 The thickness of the thin plate 41 is preferably between 〇丨~〇 5mni. The elastic frame member 42 includes the first elastic frame member 421 and the second elastic frame member 422. The first elastic frame member 421 is provided between the thin plates 41, and forms a accommodation space V2 with the thin plate 41. The viscous body 43 described later is housed (filled) in the accommodating space V2. The first elastic frame member 421 is formed to have a width of 4 mm and a thickness of 3 mm, and is designed to be equal to the thickness of the viscous body 43 when crushed by about 30%. The first elastic frame member 421 is formed of a PMF (fluororubber) having a hardness of Shore A80 which is hard to be permanently deformed even if it is subjected to a load at a high temperature. Further, the air between the upper thin plate 41 and the viscous body 43 is sucked together with the air in the gap S1 when the air is sucked from the vacuum suction hole 3 11 for adsorbing the stamper 35.

第2彈性框材422係在薄板41間設於第1彈性框材42! 外側。此第2彈性框材422，其寬度3mm '厚度2mm，較第1彈性框材421薄，形成為與黏性體43相同之厚度。又，第2彈性框材422係由若在高溫下反覆承受負荷有時會產生永久變形之硬度高之PTFE(聚四氟乙烯）形成。黏性體43，係由熱傳導率2W/ mk以上之高熱傳導凝膠狀聚矽氧（聚矽氧橡膠）形成。所謂黏性體，係指具有黏著性質’當藉由外力而使内部一部分產生流動時，具有可產生使其速度一致之力之性質的物體。此黏性體43形成為厚度2mm。此外，黏性體43亦可由脂狀之聚矽氧形成。上述黏性體43 ’如前所述收容於黏性體匣4内。因此，當直接將黏性體43設於形成在框體34内之收容空間vi的 22The second elastic frame member 422 is provided outside the first elastic frame member 42! between the thin plates 41. The second elastic frame member 422 has a width of 3 mm 'thickness of 2 mm and is thinner than the first elastic frame member 421, and is formed to have the same thickness as the adhesive body 43. Further, the second elastic frame member 422 is formed of PTFE (polytetrafluoroethylene) having a high hardness which is permanently deformed by being subjected to a load at a high temperature. The viscous body 43 is formed of a highly heat-conductive gel-like poly-oxygen (polyoxymethane rubber) having a thermal conductivity of 2 W/mk or more. The term "viscous body" refers to an object having an adhesive property. When an internal portion is caused to flow by an external force, it has an object capable of producing a force having a uniform velocity. This viscous body 43 was formed to have a thickness of 2 mm. Further, the viscous body 43 may also be formed of a fatty polysiloxane. The viscous body 43' is accommodated in the viscous body 4 as described above. Therefore, when the viscous body 43 is directly disposed in the accommodating space vi formed in the frame 34, 22

I 201022004 情形下，在更換黏性體43時，須有擦除附著於調溫板33 或框體34、以及壓模35之黏性體43的作業’本實施形態中，由於黏性體43收容於黏性體匣4内，因此藉由更換黏性體匣4即能更換黏性體43。因此，可不須如前述之作業，而能容易地更換黏性體43 » 又’黏性體43由於由熱傳導率2 W/ mk以上之高熱傳導聚矽氧橡膠形成，因此能將調溫板33之熱良好地傳導至壓模35。 ❹ 圖9係顯示壓縮後之黏性體匣4的截面圖。上述黏性體匣4,當在模壓基材m而被加壓時，如圖9 所示，薄板41係彼此接近且壓潰具有厚度之第丨彈性框材 421，藉由使此等薄板41及第1彈性框材42丨密閉黏性體 43，並將之壓縮。藉此，本實施形態中由於黏性體内部均等地產生壓力，因此黏性體匣4能將設於該黏性體匣4 上之壓模35各部以均等之力按壓於基材m，使基材m從壓 Q 模35承受之接觸面壓的分布均一。如上述，本實施形態中，不須增長對基材m之模壓時間等使一般模壓步驟變化，藉由將黏性體厘4設於壓模乃背面，即能使基材m從壓模35承受之接觸面壓的分布均一，因此能良好地維持設備成本、運轉成本、生產時間等。又，亦可在不使基材m產生翹曲或起伏等之狀況下良好地模壓基材m。又，本實施形態中，由於開口部34〇之内緣較基材扣之外緣大，設於開口部340内之黏性體g 4的黏性體“之 23 201022004 外緣較基材之外緣大，因此基材m係設於黏性體43之俯視下之内側。因此，可藉由黏性體43將壓模35以均等之力緊壓於基材m之全面，而能將壓模35之形狀圖案良好地轉印於基材m之全面。此處，第2彈性框材422由於與黏性體43形成為相同厚度，因此在黏性體E 4被加壓時不會被壓潰。因此，當第1彈性框材421沿黏性體匣4之緣部設置的情況下，黏性體£ 4被加壓時，第！彈性框材421被壓冑3〇%左右即會往水平方向擴張而從薄板41外緣彈出，此彈出之部分會❹ 咬入調溫板33與框體34之間隙su而有破損之虞。然而，本實施形態中，由於幾乎不會被壓潰之第2彈性框材422 係沿黏性體匣4之緣部設置，因此在黏性體匣4被加壓實，可藉由第2彈性框材422限制第i彈性框材42ι往外側擴張。因此，第！彈性框材421被挾入於該間隙su，而能防止其破損，進而使黏性體匣4之耐久性良好。 [4·熱壓成形裝置之成形運動] 以下說明熱壓成形裝置1之成形運動。 ® 圖10係用以說明熱壓成形裝置丨之成形運動的圖。具體而言，圓10(A)係顯示（成形運動之！循環中之）滑件2'2 上下位置之變化的圖，圖10(B)係顯示模壓加壓力之變化的圖，圖10(C)係顯示壓模35之溫度變化的圖，圖i〇(D)係顯示真空框架345内之密閉空間之壓力變化的圖。在時刻u中，基材m係設置於下側金屬模具部之壓模35上，而滑件22位於上限位置b 1。 24 201022004 自時刻ti至時刻t2，控制手段24係使滑件22下降至真空框架345之下面抵接於下側金屬模具部3A之框體34 的位置B2 ’於真空框架345内側形成收納基材瓜等的密閉空間。自時刻t2起’控制手段24即開始此密閉空間内之抽真二’且開始對調溫板3 3供應高溫蒸氣。到了時刻t3後，當密閉空間内之壓力達到適於熱轉印 ❹之真空度P2時，控制手段24即將滑件22之控制從位置控制切換至加壓力控制。接著，控制手段24使滑件22下降至對基材m之加壓力成為L1的位置B3，至時刻Η為止，將上下之壓模35以預備加壓力L1按壓於基材m兩面。此外，真空度P2設定於一 9〇Kpa以下，預備加壓力L1設定成施加於基材m之面壓會成為lMPa。如上述，當密閉空間内之壓力到達真空度p2之時刻B 為止，並不會將壓模35按壓於基材m，藉此能防止空氣殘〇留於基材m與壓模35之間。又，藉此能防止因殘留空氣使形狀圖案之一部分產生未轉印等的轉印不良產生。又，自時刻t3至時刻t4為止，藉由以預備加壓力L i 將壓模35按壓於基材m兩面，即能使調溫板33、黏性體匣 4、以及壓模35緊貼，而將熱有效地從調溫板33傳達至壓模35’而良好地加熱壓模35。當成為時刻t4且壓模35之溫度到達轉印可能溫度H2 時，控制手段24使滑件22下降至對基材m之加壓力成為轉印可能加壓力L2的位置B4。接著，從對基材m之加麼 25 201022004 力成為轉印可能加壓力L2之時刻t5至時刻t6，控制手段 24係一邊藉由調溫板33加熱基材m、一邊以轉印可能加壓力L2將壓模35持續對基材m加壓。在模壓此基材m時，本實施形態中，上下之框體34係分別克服彈簧344之彈壓力而滑動至底板3 1側。接著，隨著此框體34之移動，黏性體匣4透過基材m及間隔件36 被壓模35壓縮，使黏性體匣4内之黏性體43產生均等壓力’因此能將設於黏性體匣4上之壓模35各部以均等之力按壓於基材m’而能使基材m從壓模35所承受之接觸面壓的分布均一。因此’能將壓模35之形狀圖案良好地轉印至基材m。此外’轉印可能溫度H2,在基材m為丙烯酸板之本實施形態中’係設定於12〜150。(：，轉印可能加壓力L2係設疋於施加在基材m之面壓會成為4〜6MPa。又’在一邊加熱基材m —邊持續加壓之時刻t5至時刻t6之時間T，係視基材m之材質或壓模35之形狀圖案而設定為不致產生轉印不良之最適當值。 *成為時刻t6時，控制手段24即停止對調溫板33之 …、、應而對調溫板3 3供應冷卻水，冷卻黏性體g 4、 35、 ' 以及基材m。接著，藉由冷卻基材m而使形狀圖案固定於基材m。田成為時刻t7而壓模35之溫度成為脫模可能溫度H1 時，控制丰# 1 β γ _ 丁权24係將真空框架245内側之密閉空間往大氣開放。藉，t!_ _ ’密閉空間内之壓力在時刻t8則返回大氣壓力 201022004 pi。此外，在基材m為丙烯酸板之本實施形態中，脫模可能溫度H1係設定於50〜80。(：。當成為時刻t8時，控制手段24係將滑件22之控制再次從加壓力控制切換為位置控制，使滑件22上升至上限位置B1。藉此能取出基材m。 [5-1_實施例1 :接觸面壓分布之比較] 在直接於調溫板上配置有壓模之習知熱壓成形裝置與 φ 本實施形態之熱壓成形裝置1中，分別對基材施加6MPa之面壓’並測定基材從作為代替壓模使用之鏡面板所承受之接觸面壓的分布。基材係使用尺寸34〇x217x〇 7rnrn之壓克力板（PMMA板）。本實施形態之成形裝置1中，係使用板厚 0.7mm之剛體間隔件作為其間隔件。又，各成形裝置中，係代替壓模而使用板壓2mm之鏡面板，且於此鏡面板與基材之間介裝感壓紙’測定在各成形裝置中以室溫25t模壓基材5秒間時之接觸面壓的分布。〇圖11係顯示習知成形裝置之接觸面壓分布的圖，圖12 係顯示本實施形態之成形裝置1之接觸面壓分布的圖。各圖11’ 12中，顯示顏色較濃之部分壓力較高，顏色較薄之部分壓力較低。如圖11所示’可知習知成形裝置中，基材部分35〇之接觸面壓會產生較大之不均。如圖12所示，本實施形態之成形裝置丨之接觸面壓分布中，於基材部分350周圍出現因間隔件部分36〇而產生之面壓分布。自圖12可知，本實施形態之成形裝置i中， 27 201022004 基材部分350之外緣部雖會若干增加約5mm寬度之面壓，但基材部分350中可得到均一之接觸面壓。 [5-2.實施例2 :板厚分布之比較] 於習知熱壓成形裝置與本實施形態之熱壓成形裝置i 分別對基材模壓成形並測定模壓成形前後之基材的板厚分布。基材與實施例1同樣地使用尺寸34〇x217x〇 7mm之壓克力板。圖13係顯示習知成形裝置之模壓成形前之基材板厚分布的圖，圖14係顯示習知成形裝置之模壓成形後之基材板厚分布的圖。各圖13, 14中，橫轴係顯示基材之長邊（34〇mm) 方向的位置，圖表之系列係顯示短邊（217mm)方向之位置。例如_之標示，係顯示沿長邊方向於各點測定從基材之長邊往短邊方向進入1 〇mm内側之位置的板厚的結果。如圖13及圖14所示可知，習知成形裝置中，模壓成形前之板厚不均最大為〇.〇2mm，相對於此，模壓成形後之板厚不均最大增加為〇.〇93mm。又’可知模壓成形前之板厚不均之狀態與模壓成形後之板厚不均之狀態大幅不同。其原因在於，如在實施例1 之前述’習知之成形裝置由於基板從壓模承受之接觸面壓會產生不均’因此於基材各部之厚度方向之變形量亦會產生不均。圖15係顯示本實施形態之成形裝置1之模壓成形前之基材板厚分布的圖，圖16係顯示本實施形態之成形裝置1 之模壓成形後之基材板厚分布的圖。 28 201022004 如圖15及圖16所示可知，本實施形態之成形裝置i 中，模壓成形前之板厚不均最大為〇〇15mm，相對於此，模壓成形後之板厚不均最大僅為〇〇52mm。又，圖16之模壓成形後之板厚分布中，如♦之標示所示~7知基材之從長邊在短邊方向進入5 mm的部分其板厚局部地減少。其原因在於，如在實施例丨之前述，本實施形態之成形裝置1中會若干增加基材部分35〇外緣部之約 5mm寬度的面壓。接著，圖16之模壓成形後之板厚分布中，可知在除了外周5mm寬度之部分以外部分的板厚不均，最大為 0.016mm這點與模壓成形前之板厚不均相同，而板厚不均之傾向亦與模壓成形前之板厚不均相同。因此，本實施形態之成形裝置1中，可知即使於基材之板厚產生不均，亦能對基材賦予均一之接觸面壓。 [第2實施形態] Q 圖係顯示本實施形態之熱壓成形裝置1A之截面圖’圖18係下側金屬模具部3 A的俯視圖。此外，圖17及圖18中’為了易於理解，係將熱壓成形裝置1A簡化描繪。以下，對與前述第1實施形態相同之功能部位賦予同一符號’省略或簡化該等之說明。前述第1實施形態中，框體34之開口部340之内緣雖較基材m外緣大，但本實施形態之特徵點在於，如圖17及圖18所示，框體34之開口部340之内緣較基材m外緣小。藉此’由於本實施形態中之黏性體43外緣較基材外緣小， 29 201022004 因此黏性體43不會自基材m外緣彈出。因此，由於不須藉由間隔件36按壓自基材m外緣彈出之部分之被黏性體43 緊壓之壓模35的既定部分，因此能不須間隔件36，減低零件件數。其他構成則與前述第1實施形態相同。 [第3實施形態] 圖係顯示本實施形態之熱壓成形裝置iB的截面圖。前述第1實施形態中，收容於黏性體匣4之黏性體43 雖係由凝膠狀之聚矽氧形成，但本實施形態之第1特徵在於，收容於黏性體匣4A之黏性體43 A係由軟化溫度較丙烯酸樹脂等之熱可塑性樹脂低溫的低熔點金屬形成。此處，一般已知可藉由將Pb(鉛）、Bi(鉍）、Sn(錫）、Cd(鎘）、In(銦）等種類不同之金屬組合將之合金化，藉此形成熔點低之合金。本實施形態之黏性體43A，藉由由利用了此種性質之熔點低的公知低熔點金屬形成，而使軟化溫度成為較丙烯酸樹脂等之熱可塑性樹脂低溫。I 201022004 In the case where the adhesive body 43 is replaced, the operation of erasing the viscous body 43 attached to the temperature regulating plate 33 or the frame 34 and the stamper 35 is required. In the present embodiment, the viscous body 43 is present. Since it is accommodated in the viscous crucible 4, the viscous body 43 can be replaced by replacing the viscous body 匣4. Therefore, the adhesive body 43 can be easily replaced without the above-described work, and the 'viscous body 43 is formed of a high heat conductive polyoxymethylene rubber having a thermal conductivity of 2 W/mk or more, so that the temperature regulating plate 33 can be used. The heat is well conducted to the stamper 35. ❹ Figure 9 is a cross-sectional view showing the viscous body 压缩 4 after compression. When the adhesive body 4 is pressurized while molding the substrate m, as shown in Fig. 9, the thin plates 41 are close to each other and crush the third elastic frame member 421 having a thickness, by making the thin plates 41 And the first elastic frame member 42 丨 seals the viscous body 43 and compresses it. Therefore, in the present embodiment, since the pressure inside the adhesive body is uniformly generated, the adhesive body 4 can press the respective portions of the stamper 35 provided on the adhesive body 4 against the base material m with equal force. The distribution of the contact surface pressure of the substrate m from the pressure Q die 35 is uniform. As described above, in the present embodiment, it is not necessary to increase the molding time of the substrate m or the like to change the general molding step, and by providing the adhesive body 4 on the back surface of the stamper, the substrate m can be made from the stamper 35. Since the distribution of the contact surface pressure is uniform, the equipment cost, the running cost, the production time, and the like can be well maintained. Further, the substrate m can be favorably molded without causing warpage or undulation of the substrate m. Further, in the present embodiment, since the inner edge of the opening portion 34 is larger than the outer edge of the substrate, the viscous body of the viscous body g 4 provided in the opening portion 340 "the outer edge of the 23 201022004 is larger than the substrate. Since the outer edge is large, the base material m is provided on the inner side of the adhesive body 43 in a plan view. Therefore, the pressure mold 35 can be pressed against the entire surface of the substrate m by the force of the adhesive body 43 and can be The shape pattern of the stamper 35 is well transferred to the entire surface of the substrate m. Here, since the second elastic frame member 422 is formed to have the same thickness as the adhesive body 43, the adhesive body E 4 is not pressurized. Therefore, when the first elastic frame member 421 is disposed along the edge of the adhesive body 4, when the adhesive body 4 is pressurized, the second elastic frame member 421 is compressed by about 3%. That is, it expands in the horizontal direction and is ejected from the outer edge of the thin plate 41, and this ejected portion will bite into the gap su between the temperature regulating plate 33 and the frame 34, and there is damage. However, in this embodiment, since it is hardly Since the second elastic frame member 422 that is crushed is provided along the edge of the adhesive body 4, the adhesive body 4 is pressurized, and can be restricted by the second elastic frame member 422. The elastic frame member 42 is expanded outward. Therefore, the first elastic frame member 421 is inserted into the gap su to prevent breakage thereof, and the durability of the adhesive body 4 is improved. [4] Hot press forming device Molding Movement] The molding movement of the hot press forming apparatus 1 will be described below. Fig. 10 is a view for explaining the forming motion of the hot press forming apparatus. Specifically, the circle 10 (A) shows (formation movement! FIG. 10(B) is a view showing a change in the pressurization pressure, and FIG. 10(C) is a view showing a temperature change of the stamper 35, and FIG. D) is a graph showing the pressure change in the sealed space in the vacuum frame 345. At the time u, the substrate m is placed on the stamper 35 of the lower metal mold portion, and the slider 22 is located at the upper limit position b1. 201022004 From time ti to time t2, the control means 24 lowers the slider 22 to a position B2' where the lower surface of the vacuum frame 345 abuts against the frame 34 of the lower metal mold portion 3A, and forms a storage substrate melon inside the vacuum frame 345. The confined space of the space. From the time t2, the control means 24 starts the confined space. After the time t3, when the pressure in the closed space reaches the vacuum degree P2 suitable for the thermal transfer, the control means 24 controls the slider 22 from The position control is switched to the pressure control. Then, the control means 24 lowers the slider 22 to the position B3 at which the pressing force to the base material m becomes L1, and presses the upper and lower stamper 35 to the preliminary pressing force L1 until time Η. The substrate m has both sides. Further, the degree of vacuum P2 is set to be less than or equal to 9 kPa, and the preliminary pressure L1 is set so that the surface pressure applied to the substrate m becomes 1 MPa. As described above, when the pressure in the sealed space reaches the time B of the degree of vacuum p2, the stamper 35 is not pressed against the substrate m, whereby air residual can be prevented from remaining between the substrate m and the stamper 35. Further, it is possible to prevent the occurrence of a transfer failure such as a non-transfer or the like in a part of the shape pattern due to the residual air. Further, the pressing mold 35 is pressed against both surfaces of the base material m by the preliminary pressing force L i from the time t3 to the time t4, whereby the temperature regulating plate 33, the viscous body 4, and the stamper 35 can be brought into close contact with each other. On the other hand, heat is efficiently transmitted from the temperature regulating plate 33 to the stamper 35' to heat the stamper 35 well. When the time t4 is reached and the temperature of the stamper 35 reaches the transfer possible temperature H2, the control means 24 lowers the slider 22 to a position B4 at which the pressure applied to the substrate m becomes the transfer possible pressure L2. Then, from the time t5 to the time t6 when the force is applied to the substrate m, the pressure is increased by the temperature adjustment plate 33 while the substrate 24 is heated by the temperature adjustment plate 33. L2 continues to pressurize the substrate m with the stamper 35. When the base material m is molded, in the present embodiment, the upper and lower frames 34 are slid to the side of the bottom plate 31 by against the elastic pressure of the spring 344. Then, as the frame 34 moves, the viscous body 4 is compressed by the stamper 35 through the substrate m and the spacer 36, so that the viscous body 43 in the viscous body 4 is uniformly pressurized. The portions of the stamper 35 on the viscous crucible 4 are pressed against the substrate m' with equal force, so that the distribution of the contact surface pressure of the substrate m from the stamper 35 can be made uniform. Therefore, the shape of the stamper 35 can be favorably transferred to the substrate m. Further, the 'transfer possible temperature H2' is set to 12 to 150 in the embodiment in which the substrate m is an acrylic plate. (:, the transfer possible pressing force L2 is set so that the surface pressure applied to the substrate m becomes 4 to 6 MPa, and the time T from the time t5 to the time t6 at which the substrate m is heated while being heated while being heated, The material of the substrate m or the shape pattern of the stamper 35 is set to an optimum value that does not cause a transfer failure. * When the time t6 is reached, the control means 24 stops the temperature adjustment of the temperature control plate 33. The plate 3 3 supplies cooling water to cool the viscous bodies g 4, 35, ' and the substrate m. Then, the shape pattern is fixed to the substrate m by cooling the substrate m. The field becomes the temperature of the stamper 35 at time t7. When the mold release temperature H1 is reached, the control Feng #1 β γ _ ding 24 system opens the closed space inside the vacuum frame 245 to the atmosphere. By, t!_ _ 'The pressure in the closed space returns to atmospheric pressure at time t8. 201022004 pi. Further, in the embodiment in which the substrate m is an acrylic plate, the mold release possible temperature H1 is set at 50 to 80. (: When the time t8 is reached, the control means 24 controls the slider 22 again. Switching from the pressure control to the position control, the slider 22 is raised to the upper limit position B1 Thereby, the substrate m can be taken out. [5-1_Example 1: Comparison of contact surface pressure distribution] A conventional hot press forming apparatus in which a stamper is placed directly on a temperature regulating plate, and φ is hot pressed in this embodiment. In the molding apparatus 1, a surface pressure of 6 MPa was applied to the substrate, and the distribution of the contact surface pressure of the substrate from the mirror panel used as the replacement stamper was measured. The substrate was used in a size of 34 〇 x 217 x 〇 7 rnrn. In the molding apparatus 1 of the present embodiment, a rigid body spacer having a thickness of 0.7 mm is used as the spacer. Further, in each molding apparatus, a mirror panel having a plate pressure of 2 mm is used instead of the stamper. And the pressure-sensitive paper was interposed between the mirror panel and the substrate. The distribution of the contact surface pressure when the substrate was molded at room temperature for 25 seconds in each molding apparatus was measured. FIG. 11 shows a conventional molding apparatus. Fig. 12 is a view showing the contact surface pressure distribution of the molding apparatus 1 of the present embodiment. In each of Fig. 11'12, the portion where the color is richer is higher, and the portion where the color is thinner is higher. Low. As shown in Fig. 11, it can be known that the conventional forming device The contact surface pressure of the portion 35〇 causes a large unevenness. As shown in Fig. 12, in the contact surface pressure distribution of the forming apparatus of the present embodiment, the spacer portion 36 is generated around the substrate portion 350. The surface pressure distribution can be seen from Fig. 12, in the molding apparatus i of the present embodiment, 27 201022004, although the outer edge portion of the base material portion 350 is increased in surface pressure by about 5 mm, the base portion 350 can be uniformly obtained. Contact surface pressure. [5-2. Example 2: Comparison of thickness distribution] The substrate was molded by a conventional hot press forming apparatus and the hot press forming apparatus i of the present embodiment, and the substrate before and after the press forming was measured. The thickness of the plate is distributed. A base material having a size of 34 〇 x 217 x 〇 7 mm was used in the same manner as in the first embodiment. Fig. 13 is a view showing the distribution of the thickness of the substrate before the press molding of the conventional molding apparatus, and Fig. 14 is a view showing the thickness distribution of the substrate after the press molding of the conventional molding apparatus. In each of Figs. 13 and 14, the horizontal axis indicates the position in the long side (34 mm) direction of the substrate, and the series of the graph shows the position in the short side (217 mm) direction. For example, the _ mark indicates the result of measuring the thickness of the sheet from the long side of the substrate to the short side in the longitudinal direction at a position of 1 mm inside. As shown in Fig. 13 and Fig. 14, in the conventional molding apparatus, the thickness unevenness before press molding is at most 〇 2 mm, whereas the thickness unevenness after press molding is increased to a maximum of 〇.〇93 mm. . Further, it can be seen that the state in which the thickness of the sheet before the press molding is uneven is largely different from the state in which the sheet thickness after the press molding is uneven. The reason for this is that the conventional molding apparatus according to the first embodiment described above has unevenness due to the contact surface pressure of the substrate from the stamper, so that the amount of deformation in the thickness direction of each portion of the substrate is also uneven. Fig. 15 is a view showing a thickness distribution of a base material before press molding of the molding apparatus 1 of the present embodiment, and Fig. 16 is a view showing a thickness distribution of a base material after press molding of the molding apparatus 1 of the present embodiment. 28 201022004 As shown in Fig. 15 and Fig. 16, in the molding apparatus i of the present embodiment, the sheet thickness unevenness before press molding is at most 〇〇15 mm, whereas the sheet thickness unevenness after press molding is maximum only 〇〇52mm. Further, in the plate thickness distribution after the press molding of Fig. 16, as indicated by the mark of ♦, the thickness of the substrate which is 5 mm from the long side in the short side direction is locally reduced. The reason for this is that, as described above in the embodiment, in the molding apparatus 1 of the present embodiment, the surface pressure of about 5 mm width of the outer edge portion of the base material portion 35 is increased. Next, in the sheet thickness distribution after the press molding of Fig. 16, it is understood that the thickness of the portion other than the portion having a width of 5 mm in the outer circumference is not uniform, and the maximum thickness is 0.016 mm, which is the same as the thickness unevenness before the press molding, and the sheet thickness is the same. The tendency of unevenness is also the same as the thickness unevenness before press molding. Therefore, in the molding apparatus 1 of the present embodiment, it is understood that even if the thickness of the substrate is uneven, a uniform contact surface pressure can be imparted to the substrate. [Second Embodiment] Fig. 9 is a cross-sectional view showing a hot press forming apparatus 1A of the present embodiment. Fig. 18 is a plan view of a lower metal mold portion 3A. Further, in Fig. 17 and Fig. 18, the hot press forming apparatus 1A is simplified in drawing for easy understanding. Hereinafter, the same reference numerals will be given to the same functional portions as those of the first embodiment, and the description thereof will be omitted or simplified. In the first embodiment, the inner edge of the opening 340 of the casing 34 is larger than the outer edge of the base material m. However, the present embodiment is characterized in that the opening of the casing 34 is as shown in Figs. 17 and 18 . The inner edge of 340 is smaller than the outer edge of the substrate m. Therefore, since the outer edge of the viscous body 43 in the present embodiment is smaller than the outer edge of the substrate, 29 201022004, the viscous body 43 does not eject from the outer edge of the substrate m. Therefore, since it is not necessary to press the predetermined portion of the stamper 35 pressed by the adherend 43 from the portion ejected from the outer edge of the substrate m by the spacer 36, the spacer 36 can be eliminated, and the number of parts can be reduced. The other configuration is the same as that of the first embodiment described above. [Third Embodiment] A cross-sectional view of a hot press forming apparatus iB of the present embodiment is shown. In the first embodiment, the viscous body 43 accommodated in the viscous body 4 is formed of a gel-like polyoxygenated oxygen. However, the first feature of the present embodiment resides in the viscous body 4A. The body 43 A is formed of a low melting point metal having a softening temperature lower than that of a thermoplastic resin such as an acrylic resin. Here, it is generally known that alloys of different kinds of metals such as Pb (lead), Bi (bismuth), Sn (tin), Cd (cadmium), and In (indium) can be alloyed, thereby forming a low melting point. Alloy. The viscous body 43A of the present embodiment is formed of a known low-melting-point metal having a low melting point using such a property, and the softening temperature is made lower than that of a thermoplastic resin such as an acrylic resin.

上述本實施形態亦同樣地，由於黏性體43 A係由軟化溫度較熱可塑性樹脂低溫之低熔點金屬形成，因此在模壓基材m時’可藉由來自調溫板33之熱使黏性體43A被加熱而變得柔軟。因此，在模壓基材m時對黏性體匣4A加壓時，黏性體43 A能確實地使内部產生均等壓力，而能將壓模3 5 各部確實地以均等之力按壓於基材m。因此，能確實地使基材m從壓模35承受之接觸面壓的分布均一。又，前述第1實施形態中，雖於壓模35之背面側直接設有黏性體匣4,但本實施形態之第2特徵點在於，於壓模 30 201022004 3 5與黏性體匣4之間設有頂板3 8。藉此，本實施形態中，由於能減低施加於壓模3 5與間隔件3 6之間隙s 2部分之來自黏性體匣4的面壓，因此即使壓模35不具有充分之強度’亦能防止其與間隔件3 6之間隙S 2部分因來自黏性體 IE 4的面壓而塑性變形。本實施形態中，係由此頂板38及壓模35構成轉印手段。 [第4實施形態] ⑩ 圖20係顯示本實施形態之熱壓成形裝置1C的截面圖，圖21係下侧金屬模具部3A之俯視圖。前述第1實施形態中’雖於壓模3 5之背面側設有黏性體匣4，但本實施形態之特徵點在於，如圖2〇及圖2丨所示，於壓模35之背面側設有橡膠構件5。橡膠構件5,具體而言收容於藉由調溫板33、框體34、以及壓模35所包圍之收容空間VI。橡膠構件5之板厚設定為2〜5 mm左右，係由聚妙氧形成。由於一般而言聚碎氧之 ⑩熱傳導較低，因此本實施形態中，係藉由於基質聚矽氧混入氧化鋁或陶瓷等添加劑，使熱傳導率提高。此外，一般而言雖只要添加劑之混入量增多，聚矽氧之熱傳導率即提升，但硬度會降低而使聚矽氧橡膠之狀態成為凝膠狀或黏土狀。如上述，於壓模35之背面側設有橡膠構件5之本實施形態，由於亦同樣地可在模壓基材m時於橡膠構件5内部產生均等壓力’因此能藉由此均等壓力將壓模35之各部以均等之力按壓於基材m。因此，本實施形態亦同樣地，能使 31 201022004 基材m從壓模35所承受之接觸面壓的分布均一。本實施形態中，此橡膠構件5為彈性體。此外，所謂彈性體，係指具有在受外力而使形狀或體積變化時去除外力後可再恢復原本狀態的性質之物體。 [第5實施形態] 圖22係顯示本實施形態之熱壓成形裝置iD的截面圖。前述第4實施形態中，雖橡膠構件5與調温板33係分別設置，但本實施形態之第i特徵點在於，如圖22所示，於橡膠構件5A内部形成有供蒸氣或冷卻水等之熱媒流通的© 水孔33 1，橡膠構件5與調溫板33係形成為一體。本實施形態中，藉此能減低零件件數。又，前述第4實施形態中，雖於橡膠構件5之背面側設有内部供冷卻水等之熱媒流通的冷卻板32,但本實施形態之第2特徵點在於，於橡膠構件5A之背面側設有由耐熱環氧樹脂等之斷熱性高之材料形成的絕熱板32A。本實施形態中，如上述，由於係取代構成複雜之冷卻板32而使用構成簡單之斷熱板32Α，作為用以斷絕對設於底板3丨背面側之承板21及滑件22之熱傳導的構件，因此能減低製造成本。此外，本實施形態中，此斷熱板32Α係設於橡膠構件5 之背面側的底板。 [實施形態之變形] 此外，本發明並不限定於前述實施形態，在能達成本發明目的之範圍的變形、改良等亦包含於本發明。前述實施形態中，橡膠構件5係由單一材料形成。此 32 201022004 時’在將橡膠構件5由硬度低之橡膠材料形成時，加麗時會變得柔軟，而有橡膠構件進入調溫板33與框體34之内壁間之些許間隙S1之虞。為了防止此點’亦可將橡膠構件組合硬度不同之橡膠構件來形成。圖23係顯示變形例之橡膠構件5A的俯視圖。Similarly, in the above-described embodiment, since the viscous body 43A is formed of a low-melting-point metal having a softening temperature lower than that of the thermoplastic resin, the viscous property can be made by heat from the temperature regulating plate 33 when the substrate m is molded. The body 43A is heated to become soft. Therefore, when the adhesive body 4A is pressurized when the base material m is molded, the adhesive body 43 A can surely generate an equal pressure inside, and the portions of the stamper 35 can be surely pressed against the substrate with equal force. m. Therefore, the distribution of the contact surface pressure which the base material m receives from the stamper 35 can be surely made uniform. Further, in the first embodiment, the adhesive body 4 is directly provided on the back side of the stamper 35. However, the second feature of the present embodiment is that the stamper 30 201022004 3 5 and the adhesive body 4 There is a top plate 38 between them. Therefore, in the present embodiment, since the surface pressure from the adhesive body 4 applied to the gap s 2 portion of the stamper 35 and the spacer 36 can be reduced, even if the stamper 35 does not have sufficient strength, It is possible to prevent the gap S 2 between the portion and the spacer 36 from being plastically deformed by the surface pressure from the viscous body IE 4 . In the present embodiment, the top plate 38 and the stamper 35 constitute a transfer means. [Fourth Embodiment] Fig. 20 is a cross-sectional view showing a hot press forming apparatus 1C of the present embodiment, and Fig. 21 is a plan view showing a lower side mold portion 3A. In the first embodiment, the adhesive body 4 is provided on the back side of the stamper 35. However, the present embodiment is characterized in that it is on the back side of the stamper 35 as shown in Fig. 2A and Fig. 2B. A rubber member 5 is provided on the side. Specifically, the rubber member 5 is housed in a housing space VI surrounded by the temperature regulating plate 33, the frame body 34, and the stamper 35. The rubber member 5 is set to have a thickness of about 2 to 5 mm and is formed of polyoxygen. In general, in the present embodiment, the thermal conductivity is improved by the addition of an additive such as alumina or ceramics to the matrix polyfluorene. Further, in general, as long as the amount of the additive is increased, the thermal conductivity of the polyfluorene oxide is increased, but the hardness is lowered to make the state of the polyoxyxene rubber gel-like or clay-like. As described above, in the embodiment in which the rubber member 5 is provided on the back side of the stamper 35, similarly, even when the base material m is molded, an equal pressure is generated inside the rubber member 5, so that the stamper can be pressed by the equal pressure. Each part of 35 is pressed against the substrate m with equal force. Therefore, in the present embodiment as well, the distribution of the contact surface pressure of the substrate m from the stamper 35 can be made uniform in 31 201022004. In the present embodiment, the rubber member 5 is an elastic body. Further, the term "elastomer" refers to an object which has the property of being able to restore the original state after the external force is removed when the shape or volume is changed by an external force. [Fifth Embodiment] Fig. 22 is a cross-sectional view showing a hot press forming apparatus iD of the present embodiment. In the fourth embodiment, the rubber member 5 and the temperature control plate 33 are provided separately. However, the i-th feature of the present embodiment is that steam, cooling water, etc. are formed inside the rubber member 5A as shown in Fig. 22 . The heat medium flows through the water hole 33 1, and the rubber member 5 and the temperature regulating plate 33 are integrally formed. In this embodiment, the number of parts can be reduced. Further, in the fourth embodiment, the cooling plate 32 through which the heat medium such as cooling water flows is provided on the back side of the rubber member 5. However, the second feature of the present embodiment is that the back surface of the rubber member 5A is provided. A heat insulating plate 32A made of a material having high heat-insulating property such as a heat-resistant epoxy resin is provided on the side. In the present embodiment, as described above, the heat-dissipating plate 32 is simply used instead of the complicated cooling plate 32, and is used as the heat conduction for the carrier 21 and the slider 22 which are provided on the back side of the bottom plate 3A. Components, thus reducing manufacturing costs. Further, in the present embodiment, the heat insulating plate 32 is attached to the bottom plate on the back side of the rubber member 5. [Modifications of the Invention] The present invention is not limited to the above-described embodiments, and modifications, improvements, etc. within a scope that can achieve the object of the present invention are also included in the present invention. In the above embodiment, the rubber member 5 is formed of a single material. When the rubber member 5 is formed of a rubber material having a low hardness, the rubber member 5 becomes soft when it is glazed, and the rubber member enters a slight gap S1 between the temperature regulating plate 33 and the inner wall of the frame body 34. In order to prevent this, the rubber member may be formed by combining rubber members having different hardnesses. Fig. 23 is a plan view showing the rubber member 5A of the modification.

亦即’如圖23所示，亦可以例如蕭氏硬度A70以上之高硬度聚矽氧橡膠構成橡膠構件5A之矩形框狀的外周區域 51’並以硬度低之高熱傳導聚矽氧橡膠構成被此硬度高之聚矽氧橡膠包圍之内側的矩形内侧區域52。如上述，藉由以硬度高之聚矽氧橡膠構成橡膠構件5A之外周區域51，在加壓時橡膠構件5A之外緣部即變得柔軟，而能防止該外緣部進入調溫板33與框體34之内壁間之間隙s 1。此外該變形例中，構成橡膠構件5 A之外周區域51 的橡膠構件’係、使用熱傳導率低之聚錢。藉此，該變形例中，能抑制從該調溫板33往框體34之熱傳導，而能抑制框體34之熱膨漲及熱收縮。又，亦可取代以硬度高之聚矽氧橡膠構成橡膠構件5A 之外周區域51的方式’而於橡膠構件外側設置〇形環，藉 ^防止橡膠構件進人調溫板33與框體34之内㈣之間隙則述第〜第3實施形態中，黏性體43係收容於黏性體E 4’但黏性體43 #可在收容空間νι中例如直接設置於沿框體34之内壁設置的襯墊内。前述各實施形態中，上下之金屬模具部3a，3B分別具 33 201022004 備斷熱板32A或調溫板33、框體34、壓模35、以及黏性體 E 4或橡膠構件5, 5A，但亦可僅由任一方之金屬模具部3A， 3B 具備各構件 33, 33A，34, 35, 4, 5, 5A。前述各實施形態中，雖例示了液晶顯示器之導光板的基材作為基材m’但亦可使用液晶顯示器之擴散板之基材或透鏡及光碟基板等的光學零件之基材作為基材。【圖式簡單說明】圖1係顯示本發明第1實施形態之熱壓成形裝置之截⑩ 面圖。圖2係放大顯示下側金屬模具部一部分的截面圖。圖3係用以說明水孔之構成之下側金屬模具部的截面圖。圖4係顯示熱壓成形裝置之與圖1及圖3不同之戴面的載面圖。圖5係顯示固定滑件的截面圖。圖6係下側金屬模具部之俯視圖。 ® 圖7係顯示黏性體匣的截面圖。圖8係顯示黏性體匣的俯視圖。圖9係顯示壓縮後之黏性體匣的截面圖。圖10係用以說明熱壓成形裝置之成形運動的圖。圖11係顯示習知成形裝置之接觸面壓分布的圖。圖12係顯示前述實施形態之成形裝置之接觸面壓分布的圖。 34 201022004 圖13係顯示習知成形裝置之模壓成形前之基材板厚分布的圖。圖14係顯示習知成形裝置之模壓成形後之基材板厚分布的圖。圖15係顯示前述實施形態之成形裝置之模壓成形前之基材板厚分布的圖。圖16係顯示前述實施形態之成形裝置之模壓成形後之基材板厚分布的圖。圖17係顯示本發明第2實施形態之熱壓成形裝置之截面圖。圖1 8係下側金屬模具部的俯視圖。圖19係顯示本發明第3實施形態之熱壓成形裝置之截面圖。圖20係顯示本發明第4實施形態之熱壓成形裝置之截面圖。 Q 圖21係下侧金屬模具部的俯視圖。圖22係顯示本發明第5實施形態之熱壓成形裝置之截面圖。 ® 23係顯示本發明之變形例之橡膠構件的俯視圖。【主要元件符號說明】 ’ lA’ 1B，1C，1D熱壓成形裝置 2 模壓裝置金屬模具裝置 35 3 201022004 3A 下侧金屬模具部 3B 上側金屬模具部 4, 4A 黏性體匣 5, 5A 橡膠構件 21 承板 22 滑件 23 驅動手段 24 控制手段 31 底板 32 冷卻板 33 調溫板 34 框體 35 壓模 36 間隔件 38 頂板 41 薄板 42 彈性框材 43, 43A 黏性體 51 外周區域 52 内側區域 311 真空吸附用孔 312 熱電偶插入孔 313 掘入部 314 貫通孔In other words, as shown in Fig. 23, for example, a rectangular rubber-like outer peripheral region 51' of the rubber member 5A may be formed of a high-hardness polyoxymethylene rubber having a hardness of A70 or more and a high-heat-conducting polyoxymethylene rubber having a low hardness. The rectangular inner region 52 of the inner side surrounded by the high-density polyoxyethylene rubber. As described above, by forming the outer peripheral region 51 of the rubber member 5A with a high-density polyoxyxene rubber, the outer edge portion of the rubber member 5A becomes soft at the time of pressurization, and the outer edge portion can be prevented from entering the temperature regulating plate 33. The gap s 1 with the inner wall of the frame 34. Further, in this modification, the rubber member ′ constituting the outer peripheral region 51 of the rubber member 5 A is used, and the money having a low thermal conductivity is used. Thereby, in this modification, heat conduction from the temperature regulating plate 33 to the frame body 34 can be suppressed, and thermal expansion and heat shrinkage of the frame body 34 can be suppressed. Further, instead of forming the outer peripheral region 51 of the rubber member 5A with a high-hardness polyoxyxene rubber, a ring-shaped ring may be provided outside the rubber member to prevent the rubber member from entering the temperature regulating plate 33 and the frame 34. In the third to third embodiments, the adhesive body 43 is housed in the adhesive body E 4 ′ but the adhesive body 43 # can be disposed directly in the housing space νι, for example, directly on the inner wall of the frame body 34. Inside the liner. In each of the above embodiments, the upper and lower metal mold portions 3a, 3B respectively have 33 201022004 preparation hot plate 32A or temperature control plate 33, frame 34, stamper 35, and viscous body E 4 or rubber members 5, 5A, However, each of the members 33, 33A, 34, 35, 4, 5, 5A may be provided only by the metal mold portions 3A, 3B of either one. In the above-described embodiments, the base material of the light guide plate of the liquid crystal display is used as the base material m'. However, a base material of the diffusion plate of the liquid crystal display, or a substrate of an optical component such as a lens or a disk substrate may be used as the base material. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a hot press forming apparatus according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view showing a part of the lower metal mold portion in an enlarged manner. Fig. 3 is a cross-sectional view for explaining a lower metal mold portion constituting a water hole. Fig. 4 is a plan view showing a wearing surface of the hot press forming apparatus different from those of Figs. 1 and 3. Figure 5 is a cross-sectional view showing the fixed slider. Fig. 6 is a plan view of the lower metal mold portion. ® Figure 7 shows a cross-sectional view of the viscous body. Fig. 8 is a plan view showing a viscous body 。. Figure 9 is a cross-sectional view showing the viscous body 压缩 after compression. Figure 10 is a view for explaining the forming motion of the hot press forming apparatus. Figure 11 is a graph showing the contact surface pressure distribution of a conventional forming apparatus. Fig. 12 is a view showing the contact surface pressure distribution of the molding apparatus of the above embodiment. 34 201022004 Fig. 13 is a view showing the distribution of the thickness of the substrate before the press forming of the conventional forming apparatus. Fig. 14 is a view showing the distribution of the thickness of the substrate after the press molding of the conventional molding apparatus. Fig. 15 is a view showing the thickness distribution of the base material before press molding of the molding apparatus of the above embodiment. Fig. 16 is a view showing the thickness distribution of the base material after press molding of the molding apparatus of the above embodiment. Fig. 17 is a cross-sectional view showing a hot press forming apparatus according to a second embodiment of the present invention. Fig. 1 is a plan view of the lower metal mold portion. Fig. 19 is a cross-sectional view showing a hot press forming apparatus according to a third embodiment of the present invention. Fig. 20 is a cross-sectional view showing the hot press forming apparatus according to the fourth embodiment of the present invention. Q Fig. 21 is a plan view of the lower metal mold portion. Figure 22 is a cross-sectional view showing a hot press forming apparatus according to a fifth embodiment of the present invention. ® 23 is a plan view showing a rubber member according to a modification of the present invention. [Description of main component symbols] ' lA' 1B, 1C, 1D hot press forming device 2 Molding device metal mold device 35 3 201022004 3A Lower metal mold part 3B Upper side metal mold part 4, 4A Viscous body 匣 5, 5A Rubber member 21 Carrier 22 Slide 23 Drive means 24 Control means 31 Base plate 32 Cooling plate 33 Temperature control plate 34 Frame 35 Die 36 Spacer 38 Top plate 41 Thin plate 42 Elastic frame material 43, 43A Adhesive body 51 Peripheral area 52 Inner area 311 Vacuum suction hole 312 Thermocouple insertion hole 313 Tunneling part 314 Through hole

36 20102200436 201022004

315 斷熱片 316 配管塊 317, 318 孔 319 配管 321 水孔 330 段差部 331 水孔 332 刮屑板螺栓 333 擋栓 334 歧管部 340 開口 340A 表面側開口部 340B 深側開口部 341 段差部 342 水孔 343 刮屑板螺栓 344 彈簧 345 真空框架 346 定位銷 347 真空吸引孔 348 大氣開放孔 349 定位孔 350 基材部分 360 間隔件部分 37 201022004 370 壓力感測器安裝孔 371 收納槽 372, 372A, 372B 固定滑件 373 釋放槽 374 固定塊 375 滑件本體 376 螺栓 377 軌孔 378 刮屑板螺栓 379 彈簧 380 鍵槽 381 鍵 382 歧管塊 383 歧管連結部 384 貫通孔 385 管 421 第1彈性框材 422 第2彈性框材 3450 刮屑板螺栓 345 1 彈簧 A1 〜A3 襯塾 A4〜A7 0形環 m 基材 Sll, S12 間隙 38 201022004 VI, V2 收容空間315 Heater 316 Pipe 317, 318 Hole 319 Pipe 321 Water hole 330 Segment 331 Water hole 332 Scraping plate bolt 333 Stopper 334 Manifold 340 Opening 340A Surface side opening 340B Deep side opening 341 Segment 342 Water hole 343 scraper plate bolt 344 spring 345 vacuum frame 346 positioning pin 347 vacuum suction hole 348 atmosphere opening hole 349 positioning hole 350 base material portion 360 spacer portion 37 201022004 370 pressure sensor mounting hole 371 storage groove 372, 372A, 372B Fixing slide 373 Release groove 374 Fixing block 375 Slider body 376 Bolt 377 Rail hole 378 Scraping plate bolt 379 Spring 380 Keyway 381 Key 382 Manifold block 383 Manifold connection 384 Through hole 385 Tube 421 1st elastic frame material 422 2nd elastic frame material 3450 scraping plate bolt 345 1 spring A1 ~ A3 lining A4 ~ A7 0 ring m substrate Sll, S12 clearance 38 201022004 VI, V2 accommodating space

3939

Claims

201022004 VII. Patent application scope: 1. A hot press forming device, comprising: a molding device having a carrier plate and a sliding member disposed above the carrier plate for approaching or leaving the carrier plate; and a metal mold device having a lower metal mold portion on which the substrate is placed and a metal mold portion provided on the upper side of the slider; and at least one of the lower metal mold portion and the upper metal mold portion includes a bottom plate and is fixed The cover plate or the sliding member; the frame is formed in a frame shape, the bottom plate is disposed in the opening portion, and is disposed to be slidable in the vertical direction; the transfer means is fixed to the frame body and closes the opening portion, The surface has a predetermined shape pattern for thermally transferring the shape pattern to the substrate; and the adhesive body is disposed in the receiving space surrounded by the bottom plate, the frame body, and the transfer means. 2. The hot press forming apparatus according to item 1 of the patent application, comprising a viscous body Θ contained in the accommodating space; the viscous body having: two sheets; the elasticity disposed between the sheets The frame material; and the viscous body are disposed in a space surrounded by the thin plate and the elastic frame material. 3. The hot press forming apparatus of claim 1, wherein the outer edge of the viscous body in the accommodating space is smaller than the outer edge of the substrate. 4. The hot press forming apparatus according to claim 2, wherein an outer edge of the viscous body disposed in the accommodating space is larger than an outer edge of the substrate, and is disposed outside the substrate a spacer having a thickness equal to the thickness of the substrate; an inner edge of the spacer is disposed through the micro-gap between the outer edge of the substrate and the outer edge of the spacer is disposed on the outer side of the outer edge of the adhesive body. 5. The hot press forming apparatus according to any one of claims 1 to 4, wherein the 'transfer means' is composed of a stamper fixed to the frame and closing the opening, and having a pattern on the surface . 6. The hot press forming apparatus according to any one of claims 1 to 4, wherein the transfer means is a top plate fixed to the frame and closing the opening, and is disposed on the top plate and The surface has a stamper structure of the shape pattern. 7. A hot press forming apparatus, comprising: a molding device having a carrier plate and a slider disposed above the carrier plate to approach or leave the carrier plate; and a metal mold device having the carrier plate mounted thereon a lower metal mold portion of the substrate and a metal mold portion provided on the upper side of the slider; and at least one of the lower metal mold portion and the upper metal mold portion includes: a bottom plate fixed to the carrier or the slide The sink system is formed in a frame shape, the bottom plate is disposed in the opening portion, and is disposed to be slidable in the up and down direction; 201022004 The stamper is fixed to the frame body and closes the opening portion, and has a shape of the shape on the surface for The shape pattern is thermally transferred to the substrate and the elastic body ' is disposed in the receiving space surrounded by the bottom plate, the frame, and the stamper. 8. A viscous body E disposed on a back side of a transfer means for thermally transferring a predetermined shape pattern to a substrate, comprising: two sheets; 'provided between the sheets The elastic frame material; and the adhesive body are disposed in a space surrounded by the thin plate and the elastic frame material. 9. The viscous body 第 according to claim 8 wherein the elastic frame material has: a first elastic frame material having a thickness greater than the viscous body, the thickness of the viscous body is sealed; and the second The elastic frame material is disposed outside the first elastic frame material and has a hardness greater than that of the first elastic frame material and the same thickness as the adhesive body.

1A. The viscous body E of claim 8 or 9, wherein the viscous body is formed of a gelatinous or fatty polycrystalline oxygen. 1 Bu The viscous body is formed. For example, the viscous dragon of the 8th or 9th patent application scope, wherein the 'slow point is lower than the softening temperature of the substrate, and the low melting point is eight. Fig.: (e.g., the next page) 42