201021157 九、發明說明·· 【發明所屬之技術領域】 本發明係有關於-種1件夾頭，特別是—種用於㈣待加工 工件以進行濺鍍製程之工件夾頭結構。 【先前技術】 隨著半導體製程技觸演進，以及電子產業職速發展，各 式各樣的電子產品已被大量的應用於一般生活當中。隨著休閒風 氣的盛行’制費大眾對於與視聽影音相關的電子產品需求與曰 俱增。其中，液晶顯示器因為具有薄型化體積、相對不佔空間等 優點’而受到消費者的喜愛，並具有逐漸取代傳統彩色映像管顯 示器的發展趨勢。 -般在液晶顯示n的製造流程巾，包含有於—玻璃基板上形 成導電層的處理步驟，此步驟大多藉由物理氣相沉積卿如 Vapor Deposition，PVD)的技術所製作而成，例如使用濺鍍 © (sputtering)技術於玻璃基板上形成一具銦錫氧化物201021157 IX. INSTRUCTION DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a 1-piece chuck, and more particularly to a workpiece chuck structure for (4) a workpiece to be processed for a sputtering process. [Prior Art] With the evolution of semiconductor process technology and the development of the electronics industry, various electronic products have been widely used in general life. With the prevalence of leisure and entertainment, the demand for electronic products related to audio-visual audio and video has increased. Among them, liquid crystal displays are favored by consumers because of their advantages of thin volume and relatively no space occupation, and have a tendency to gradually replace the conventional color image tube display. Generally, the manufacturing process towel of the liquid crystal display n includes a processing step of forming a conductive layer on the glass substrate, and most of the steps are formed by a technique of physical vapor deposition such as Vapor Deposition (PVD), for example, using Sputtering technology to form an indium tin oxide on a glass substrate
Oxide，ΙΤΟ)的導電層。 此濺鍍技術係於一濺鍍機台中進行，濺鍍機台包括一反應室 (chamber)、一?賤鍍機台、一遮罩以及一錢鍍乾你租过）。漉鐘機台 位於反應室内，以承載玻璃基板。遮罩之作用係在定義濺鍍區域， 並可避免在濺鍍載台内，玻璃基板以外的其他區域形成金屬沉積 物。滅鍍靶設置於反應室的開口處，且濺鍍靶配置有靶材，以供 藏鍍使用。其原理係於反應室中產生電漿，再利用磁場或電場等 加速方式’使電漿中的離子對濺鍍靶(target)進行離子轟擊(i〇n 201021157 而飛向玻璃基 —t) ’以造成濺鍍靶表面之靶材原子濺出 板，並在玻璃基板表面形成一層金屬薄膜。 射’濺賴台具有—承放座和—底座。底座的外圍且有多 個槽孔’承放座上具有多個與槽孔姆麟财座 並分麻置有可活動地工件夹頭，如「第】圖」所示為工 10之結構不意圖，其具有一裝設段110、-延伸段120及-承托 段130，裝設段具有二結合孔lu，用於鎖合於底座之槽孔内，且 ❿承托段130上具有—承_ 131，射透補孔露出於承放座上。 底座下方並具有-支撐銷(supp〇rting㈣，支樓銷係於玻璃基板進 入底座上方咖以域㈣基板，錢補基板平獅落於承放 座上’接著工件夾頭10便以承托段13〇之承載面ΐ3ι扣合於玻璃 基板的邊緣，以將玻絲板_於承放座上以進行後續濺鐘的程 序0 值得注意的是’於進行雜程料，讀魏亦直接暴露於 眷反應室内，因此雜完成後，工件夾頭之承載面上未被玻璃基板 邊緣遮敝的區域’同時將沉積部分的賤鍍物質。如此一來，在執 行多次的濺鍍動作之後，附著於承載面上的濺鍍物質將因厚度增 加，而使濺鍍物質與承載面之間的附著力下降，因此容易於離子 轟擊的過私中，或是於支撐銷與工件失頭支撐及夹持玻璃基板的 過程中’因附著力的降低而使累積於承載面的濺鍍物質等剝離 ‘ · -- - ： . (peeling)並掉落於玻璃基板表面上，進而影響玻璃基板之濺鍍製程 的良率’也嚴重影響液晶顯示面板的產能及造成生產成本的上升。 【發明内容】 201021157 鑒於以上的問題’本發明提供一種工件夾頭結構，藉以改良 液晶顯示器之玻璃基板在藏鍍程序中，因工件夹頭之承载面與累 積於承載面上的濺鍍物質之間的附著力不佳，而容易剝離並掉落 於玻璃基板，所導致玻璃基板之濺鍍製程良率不佳的問題。 本發明所揭露之一種工件夾頭結構，此工件夾頭結構包括有 一裝設段、一延伸段及一承托段。裝設段與延伸段相銜接，且延 伸段自裝設段延伸並呈一彎曲形態，承托段銜接於延伸段呈彎曲 罄形悲之一端’承托段具有一承載面，此承載面並具有複數個溝槽。 本發明所揭露之一種工件夾頭結構，係裝設於濺鍍機台上， 用於夹持一待加工工件以進行鍍膜製程，以令待加工工件表面形 成鍍膜，本發明之工件夾頭結構包括有一裝設段、一延伸段及一 承托段。裝設段固定於濺鍍機台上。延伸段銜接於裝設段並相對 濺鍍機台之另一側彎曲延伸。承托段銜接於延伸段呈彎曲延伸之 一端，承托段具有一承載面，用以承載待加工工件，且承载面具 ❹有複數個溝槽，以於鍍膜製程中一併供鍍膜固著於溝槽上。 本發明所揭露之工件央頭結構於承載面上設置有複數個溝 槽，用以使增加承戴面與濺鍍物質之間的附著力，使沉積於承載 面上的濺鍍物質，在進行待加工工件的濺鍍製程中，不易於承载 面上獅並掉落於待加件上，*使待加工工件的製程良率押 得有效的提昇。又 進一步之解釋 以上之關於本發明内容之說明及以下之實施方式之說明係用 ^示範與轉树明m且·本㈣之專咐魏圍更 201021157 【實施方式】 本發明賴露之工倾稱獅於濺難程巾，用以夹持一 待加工工件麵定於承放座上，此待加工工件為手機、筆記型電 蹈和液晶顯示器(Liquid Crystal Display，LCD)等電子產品於生產 時’所欲形成圖案化導電層的電子基底，如半成品的顯示面板。 以下本發賴揭露之實施例係以待加工工件為液晶顯示器中之玻 璃基板做為說明。 ❹ 如「第2圖」卿為本發騎揭露之工做職構之結構示 意®。本發明所揭露之工件夾頭1〇包括有一裝設段n〇、一延伸 •k 120及承托|又130。裝設段11〇具有二結合孔⑴裝設段⑽ 與延伸段120相銜接。延伸段12〇係延伸自裝設段ιι〇並呈一彎 曲形態。承托段130銜接於延伸段12〇相對於裝設段11〇之另一 端，承托段130具有-承載面131及一擔片133，擔片133設置於 承載面m上方，且承载面131上具有複數個溝槽132，用以使承 ❹，面131之表面積增加。如「第3圖」所示，各溝槽132之寬度 範圍W1為1.0公厘(mm)至2 〇公厘之間深度範圍為〇 7公 厘至1.7公厘之間，並且各溝槽132彼此之間的距離Μ範圍為 0.3公厘至1.3公厘之間。 請再次參閱「第2圖」，承載面131上的各溝槽132係設置為 _狀結構、矩形狀結構、或是v字型結構等。以下將以各溝槽 132為橢圓狀結構’並於承托段具有一傾斜角度的設置方式， 用以做為本發明實關之說明。其巾，此傾斜角度係自擋片133 朝向裝設段110的方向傾斜。 201021157 如「第4圖」和「第5圖」所示，本發明所揭露之工件炎頭 應用於聽製程時，其工件夾頭10係裝設於賤嫂機台 鍍機台20具有-承放座21〇及一底座22〇，承放座21〇設置於底 座22〇上方’承放S 210之二相對侧邊上開設有複數個開孔如， 且底座220具有複數個對應於開孔21丨之容置槽221，並於容置槽 切内設置有二固定孔222 ’二固定孔222係對應於工件夹頭^ 之結合孔m，用以固定工件夾頭1G。在组裝上，係利用二固定 ⑩件40 (如螺栓)穿設過結合孔⑴並固設於固定孔222内，同時固 定件4〇抵靠於裝設段110，令工件夾頭10被固定於底座22〇上， 工件央頭10之承托段130係穿設過開孔211且露出於承放座21〇 上方，並令二側邊之工件夹頭10之承載面131相互對應。 請參閱「第6圖」和「第7圖」，將一待加工工件1置放於 濺鍍機台時’齡卿設置於二側邊上的I件妞1G之承载 面131夾持此待加工工件3〇的二侧邊緣(即待加工工件奶之二短 參邊），令待加工工件30被固持於承放座21〇上。且待加工工件^ 鄰近於擋片133之一表面與擋片133之間具有一間隙，使溝槽改 部份露出於承載面131。 如「第8圖」所示，當進行雜程序時，將此一承放有待加 工工件30之滅鍍機台20直立放置於反應室内（圖未示），並將濺鍍 物質沉積,於待加工工件30上，以形成一鑛膜5〇。由於用以失持二 加工工件3〇之工件夾頭1Q絲露於反應室内，因此鑛膜亦形成 於工件夾頭1〇之承載面131上及溝槽132内(如「第9圖」所示)。 同時，鍍臈50受到溝槽呈橢圓狀結構的影響，而形成一 u字形的 201021157 鍵膜5〇結構(圖未示）’此u字型結構之鑛膜5〇目結構間的應力 互相抵制，使鍍膜50不會從承载面131上剝離，而掉落於待加工 工件30上。 同fcj·’如「第9圖」所示，溝槽132内並具有一傾斜角度之 斜面134，此斜面134具有增加鍍膜5〇結構應力的功能，使形成 於溝槽m内的鍵膜％不會從承载面131上剝離，並具有導引賤 鑛過知中所產生之雜質微粒的功能，令雜質微粒經由此斜面134 之導引而不會掉落於待加工工件3〇的表面，或當沉積於溝槽132 内的鏡膜50累積量過多，而使开)成於溝槽内之嫂膜5〇的重力大 於與承載面m的附著力而剝離時，斜面134導引此剝離的錢膜 由待力π工工件3〇之一侧邊緣排出（圖未示），令待加工工件3〇 受到污染的風險降低。 本發明之功失職構胁承托段之承載面上設置-溝槽， 當此工件夾頭應用於賤鍍製程時，係用以夾持一待加工工件於氣 參鍍機σ上’以進行待加工工件之減鍍程序，在此錢鍍程序中，待 加工工件之表面形成—鍍膜，並於轉夾頭之承载面上與溝槽内 开/成鍍膜結構’此鏡膜結構受到溝槽所具有的結構形狀影響，而 得以&加與承載面之間的附著力，使得鍍膜不會從承載面上剝離 並掉胁待加件上’令待加王工件在崎轉巾受污染的風 險降低’朗減難程愤加U件的時。 雖然本發明之實施例揭露如上所述，然並非用以限定本發 月任何熟習相關技蟄者’在不脫離本發明之精神和範圍内，舉 凡依本發明HHJ所述之形狀、構造、特徵及精神當可做些許 201021157 之變更，因此本發明之專利保護範圍須視 利範圍所界定者辱準。 本說明書所附之申 請專 【圖式簡單說明】 第1圖為習知技術之結構示意圖； 第2圖為本發騎揭露之叫夾號構之結構示意圖 第3圖為本發贿揭露之溝槽之剖面示意圖；一 第4圖為本發明實施例之結構示意圖； Φ 第5圖為本發明實施例之裝置示意圖； 第6圖為本發明實施例之操作示意圖； 第7圖為本發明實施例之剖面示意圖； 第8圖為本發明實施例於鍍膜後之剖面示意圖；以及 第9圖為本發明實施例之溝槽於鍍膜後之剖面示意圖 【主要元件符號說明】 10 工件夹頭 110 裝設段 111 結合孔 120 延伸段. 130 承托段 131 承載面 132 溝槽 133 擋片 134 斜面 20 濺鍍機台 11 201021157Oxide, ΙΤΟ) conductive layer. The sputtering technique is carried out in a sputtering machine. The sputtering machine includes a chamber, a enamel plating machine, a mask, and a money plate that you rent. The cymbal clock machine is located in the reaction chamber to carry the glass substrate. The role of the mask is to define the sputter area and to avoid the formation of metal deposits in areas other than the glass substrate in the sputter station. The target is placed at the opening of the reaction chamber, and the sputtering target is provided with a target for use in plating. The principle is to generate plasma in the reaction chamber, and then use the acceleration method such as magnetic field or electric field to make the ions in the plasma ion bombard the target (i〇n 201021157 and fly to the glass base-t). The target atoms are caused to splash on the surface of the target, and a metal film is formed on the surface of the glass substrate. The 'splashing table' has a bearing seat and a base. There are a plurality of slots in the periphery of the base. There are a plurality of movable workpiece chucks on the socket, and the movable workpiece chuck is arranged in the same manner as shown in the figure. The intent is that it has a mounting section 110, an extension section 120 and a supporting section 130. The mounting section has two coupling holes lu for locking in the slot of the base, and the supporting bracket section 130 has承131, the through hole is exposed on the socket. Below the base, there is a support pin (supp〇rting (4), the branch pin is attached to the glass substrate and enters the base above the base (four) substrate, and the money-filled substrate flat lion falls on the receiving seat.] Then the workpiece chuck 10 is supported by the support section. 13〇The bearing surface ΐ3ι is fastened to the edge of the glass substrate to place the glass plate on the socket for subsequent splashing. 0 It is worth noting that 'for the miscellaneous materials, the reading Wei is also directly exposed to In the reaction chamber, after the completion of the miscellaneous, the area on the bearing surface of the workpiece chuck that is not concealed by the edge of the glass substrate 'will deposit a part of the ruthenium plating material. Thus, after performing multiple sputtering operations, the adhesion is performed. The sputtering material on the bearing surface will increase the adhesion between the sputtering material and the bearing surface due to the increase in thickness, so it is easy for the ion bombardment, or the support pin and the workpiece lose support and clamp. During the holding of the glass substrate, 'the sputtering material accumulated on the bearing surface is peeled off due to the decrease in adhesion. ' -- -- -- (peeling) and falling on the surface of the glass substrate, thereby affecting the sputtering of the glass substrate. Process yield It also seriously affects the productivity of the liquid crystal display panel and causes an increase in production cost. [Summary of the Invention] 201021157 In view of the above problems, the present invention provides a workpiece chuck structure, thereby improving the glass substrate of the liquid crystal display in the plating process, due to the workpiece clamp The adhesion between the bearing surface of the head and the sputtering material accumulated on the bearing surface is not good, and it is easy to peel off and fall on the glass substrate, which causes a problem that the sputtering process of the glass substrate is not good. A workpiece chuck structure is disclosed, the workpiece chuck structure includes a mounting section, an extension section and a supporting section. The mounting section is coupled with the extension section, and the extension section extends from the mounting section and has a curved shape. The support section is connected to the extension section at one end of the curved 罄 shape. The support section has a bearing surface, and the bearing surface has a plurality of grooves. The workpiece chuck structure disclosed in the present invention is installed in a splashing manner. a plating machine for clamping a workpiece to be processed for a coating process to form a coating on a surface of the workpiece to be processed, and the workpiece chuck structure of the present invention comprises a mounting And an extension section and a support section. The installation section is fixed on the sputtering machine platform. The extension section is connected to the installation section and is bent and extended with respect to the other side of the sputtering machine. The support section is connected to the extension section and is bent. One end of the extension, the supporting section has a bearing surface for carrying the workpiece to be processed, and the bearing mask has a plurality of grooves for fixing the coating on the groove in the coating process. The workpiece head structure is provided with a plurality of grooves on the bearing surface for increasing the adhesion between the wearing surface and the sputtering material, so that the sputtering material deposited on the bearing surface is splashed on the workpiece to be processed. During the plating process, it is not easy to carry the lion on the surface and drop on the item to be added, and the process yield of the workpiece to be processed is effectively increased. Further explanation of the above description of the present invention and the following implementation are explained. The description of the method is based on ^ demonstration and transfer tree Ming m and · (4) special Wei Wei more 201021157 [Embodiment] The invention is based on the work of the lion to splash the difficult towel, used to hold a workpiece to be processed The surface is set on the socket, which is to be processed Electronic base member as mobile phones, notebook type electric dance and a liquid crystal display (Liquid Crystal Display, LCD) in the production of electronic products' desired patterned conductive layer is formed, the semi-finished display panel. The embodiments disclosed in the following are illustrative of the glass substrate to be processed in the liquid crystal display. ❹ For example, “Picture 2” is a structural description of the work of the company. The workpiece chuck 1〇 disclosed in the present invention includes a mounting section n〇, an extension • k 120 and a support | The mounting section 11 has two coupling holes (1) and the mounting section (10) is engaged with the extension section 120. The extension 12 is extended from the mounting section and is in a curved configuration. The supporting section 130 is connected to the other end of the extending section 12 〇 relative to the mounting section 11 , the receiving section 130 has a bearing surface 131 and a supporting piece 133 , and the supporting piece 133 is disposed above the bearing surface m and the bearing surface 131 There are a plurality of grooves 132 thereon for increasing the surface area of the bearing surface 131. As shown in FIG. 3, each of the grooves 132 has a width W1 ranging from 1.0 mm (mm) to 2 mm, and a depth ranging from 〇7 mm to 1.7 mm, and each of the grooves 132. The distance between each other ranges from 0.3 mm to 1.3 mm. Referring again to "Fig. 2", each of the grooves 132 on the bearing surface 131 is provided in a _-like structure, a rectangular structure, or a v-shaped structure. Hereinafter, the arrangement in which each of the grooves 132 has an elliptical structure and has an inclined angle in the receiving portion will be described as an embodiment of the present invention. The angle of inclination of the towel is inclined from the direction in which the blocking piece 133 faces the mounting section 110. 201021157 As shown in Fig. 4 and Fig. 5, when the workpiece head disclosed in the present invention is applied to the listening process, the workpiece chuck 10 is mounted on the platen table 20 of the machine. The seat 21 〇 and a base 22 〇, the receiving seat 21 〇 is disposed above the base 22 ' 'the opposite side of the receiving S 210 bis is provided with a plurality of openings, for example, and the base 220 has a plurality of openings corresponding to the opening The receiving slot 221 of the 21 , and the two fixing holes 222 are disposed in the accommodating slot. The two fixing holes 222 correspond to the engaging holes m of the workpiece chuck ^ for fixing the workpiece chuck 1G. In the assembly, the fixing hole (1) is fixed by the fixing member 10 (such as a bolt) and is fixed in the fixing hole 222, and the fixing member 4 is abutted against the mounting portion 110, so that the workpiece chuck 10 is The support portion 130 of the workpiece head 10 is inserted through the opening 211 and exposed above the receiving seat 21〇, and the bearing surfaces 131 of the workpiece holders 10 on the two sides correspond to each other. Please refer to "Fig. 6" and "Fig. 7". When the workpiece 1 to be processed is placed on the sputtering machine, the bearing surface 131 of the I-girl 1G set on the two sides is held. The two side edges of the workpiece 3〇 (ie, the short side of the workpiece milk to be processed) are processed, so that the workpiece 30 to be processed is held on the receiving seat 21〇. The workpiece to be processed has a gap between the surface of one of the shutters 133 and the shutter 133, so that the groove is partially exposed to the bearing surface 131. As shown in Fig. 8, when the miscellaneous procedure is performed, the deplating machine 20 on which the workpiece 30 to be processed is placed is placed upright in the reaction chamber (not shown), and the sputtering material is deposited. The workpiece 30 is machined to form a film 5 〇. Since the workpiece chuck 1Q for the loss of the two workpieces is exposed in the reaction chamber, the mineral film is also formed on the bearing surface 131 of the workpiece chuck 1 and in the groove 132 (as shown in Fig. 9). Show). At the same time, the rhodium plated 50 is affected by the elliptical structure of the groove, and forms a U-shaped 201021157 bond film 5〇 structure (not shown). The stress between the 5 mesh structures of the U-shaped structure resists each other. Therefore, the coating film 50 is not peeled off from the bearing surface 131 and falls on the workpiece 30 to be processed. As shown in Fig. 9, the groove 132 has an inclined surface 134 in the groove 132. The inclined surface 134 has a function of increasing the structural stress of the coating 5, so that the key film formed in the groove m is %. It does not peel off from the bearing surface 131, and has the function of guiding the impurity particles generated in the antimony ore, so that the impurity particles are guided by the inclined surface 134 without falling on the surface of the workpiece 3 to be processed. Or when the cumulative amount of the mirror film 50 deposited in the groove 132 is excessive, and the gravity of the film 5〇 formed in the groove is greater than the adhesion with the bearing surface m, the slope 134 guides the peeling. The money film is discharged from one side edge of the workpiece 3 (not shown), so that the risk of contamination of the workpiece 3 to be processed is reduced. The work surface of the present invention is provided with a groove on the bearing surface of the support section, and when the workpiece chuck is applied to the enamel plating process, it is used to hold a workpiece to be processed on the gas ginning machine σ. The plating reduction process of the workpiece to be processed, in the surface of the workpiece, the surface of the workpiece to be processed is formed into a coating film, and is opened/formed on the bearing surface of the transfer chuck and the groove is formed. The structural shape has an influence, and the adhesion between the bearing surface and the bearing surface is increased, so that the coating film does not peel off from the bearing surface and the handle is added to the workpiece to be contaminated. The risk reduction is reduced when the difficulty is increased. Although the embodiments of the present invention are disclosed above, it is not intended to limit the skilled person in the present invention. The shapes, structures, and features described in the HHJ of the present invention are not departing from the spirit and scope of the present invention. And the spirit can make some changes to 201021157, so the scope of patent protection of the invention must be insulted as defined by the scope of interest. The application attached to this manual is a brief description of the drawings. Figure 1 is a schematic diagram of the structure of the prior art; Figure 2 is a schematic diagram of the structure of the clip-on structure disclosed in the first paragraph of the present invention. FIG. 4 is a schematic structural view of an embodiment of the present invention; FIG. 5 is a schematic diagram of an apparatus according to an embodiment of the present invention; FIG. 6 is a schematic diagram of operation of the embodiment of the present invention; FIG. 8 is a schematic cross-sectional view of the embodiment of the present invention after coating; and FIG. 9 is a schematic cross-sectional view of the trench after coating according to an embodiment of the present invention. [Main component symbol description] 10 Work chuck 110 Section 111 joint hole 120 extension section. 130 Support section 131 Bearing surface 132 Groove 133 Block 134 Bevel 20 Sputtering machine 11 201021157
210 承放座 211 開孔 220 底座 221 容置槽 222 固定孔 30 待加工工件 40 固定件 50 鍍膜210 Bearing seat 211 Opening 220 Base 221 Retaining groove 222 Fixing hole 30 Workpiece to be processed 40 Fixing piece 50 Coating