201021108 九、發明說明： 【發明所屬之技術領域】 本發明係有關於切割晶圓的加 關於-種提升晶·切割良率的 豸^尤其是有 【先前技術】 處理方法。 請參閱「圖1」與「圖2 ❹ 晶圓1劈裂為—粒粒的晶粒，，晶圓劈裂機用於將 圓1在進行劈狀前，會先用行後續的賊作業，晶 切線2，接著將晶圓丨貼附〜射切割出橫向與縱向的預 1上方覆蓋一保護膜（圖未示-片3(或白膜），在於晶圓 具4送入-晶圓劈裂機進行如以保護後’藉-固定夾 晶圓劈裂機包含一工作^ 作業。 與一影像擷取系統8，該工:2、一劈刀6、一劈裂台7 可作平面方向的移動與轉 5失置該固定夾具4，並 設於該晶圓1的上下兩匈，、該劈刀6與該劈裂台7係對 並藉該劈刀6的沖壓進行以讓該晶圓1抵壓該劈裂台7 用於截取該晶圓1的影像裂作業，該影像擷取系統8則 的位置。 ’並藉該預切線2得知該晶圓1 據而該晶圓1可藉讀 統8的偵測而進行定位 作台5的位移與該影像擷取系 刀6的上下位移與該上作^在定位完成之後’即可藉該劈 2連續進行縣，5料量㈣，❹麵切線 中監控該晶圓1的定/ _取系統8則在連續劈裂過程 行定位，而當橫向與縱^偏移，以視偏移的程度重新= 〇的預切線2皆被劈裂之後即完成 201021108 劈裂作業。 此習知的晶圓劈裂機’其在劈裂的過程中，所採取的 劈裂方法為依序連續對多個預切線2進行劈裂，由於每一 次的劈裂都會對晶圓1擠壓而造成些許無法預測的偏移， 其在累加之後’晶圓1的預切線2會變成曲狀，如「圖 3」所示’其一般稱之為微笑現象，當微笑現象產生後， 由於晶圓1的預切線2與劈刀6不再匹配，因此當劈刀6201021108 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method for processing a wafer to be etched, and in particular to have a [prior art] treatment method. Please refer to Figure 1 and Figure 2 晶圆 Wafer 1 is split into grains. The wafer splitting machine is used to carry out the subsequent thief operation before the round 1 is used. The crystal tangential line 2, and then the wafer 丨 is attached to the ray to cut out the horizontal and vertical pre-1 covers a protective film (not shown - the sheet 3 (or white film), in the wafer 4 is fed-wafer 劈The cracking machine is carried out as a protection. The borrowing-fixing wafer wafer splitting machine comprises a working ^ operation. With an image capturing system 8, the work: 2, a trowel 6, a splitting table 7 can be used as a plane direction The movement and the rotation 5 are lost to the fixing fixture 4, and are disposed on the upper and lower sides of the wafer 1. The trowel 6 is paired with the cleavage table 7 and is pressed by the boring tool 6 to allow the crystal to be The circle 1 is pressed against the splitting table 7 for intercepting the image splitting operation of the wafer 1. The image captures the position of the system 8. 'And the pre-cut line 2 knows the wafer 1 and the wafer 1 The displacement of the positioning table 5 and the up and down displacement of the image capturing knives 6 and the positioning of the upper squeezing knives 6 can be performed by the reading of the system 8 (d), face The sizing system 8 that monitors the wafer 1 in the tangential line is positioned in the continuous cleaving process, and when the lateral and vertical offsets are reversed, the degree of the visual offset is re- 〇 the pre-cut line 2 is cleaved. That is, the splitting operation of 201021108 is completed. The conventional wafer splitting machine 'in the process of splitting, the splitting method adopted is to sequentially split a plurality of pre-cut lines 2 in sequence, due to each time The crack will cause a slight unpredictable shift in the extrusion of the wafer 1. After the accumulation, the pre-cut line 2 of the wafer 1 will become curved, as shown in Fig. 3, which is generally called a smile phenomenon. When the smile phenomenon occurs, since the pre-cut line 2 of the wafer 1 and the file 6 no longer match, the file 6 is used.
劈裂不匹配的預切線2時，會容易造成斜切與崩角，其可 能會損害到晶圓1内部的線路，而降低生產良率。 【發明内容】 爰此，本發明之主要目的在於提供一種晶圓劈裂方 法’降低晶圓在劈裂時所產生的微笑現象，以提升良率， 滿足使用者者需求。 割的劈裂方法’其步驟包含預備一待切 線，且置放=縣裝置’其中該晶圓上設有複數預切 位移元件、二一工作台上，而該劈裂裝置具有一劈刀、一 接著為^劈裂台與一對位元件。 台上 並藉該位移元订劈裂作業，讓該晶圓置放於該劈裂 一個-個的=與該對位元件讓該劈刀以跳躍選擇的方式 據此，本路該複數預切線後執行劈裂作業。 裂，因此可以月由於沒有依序連續對多個預切線進行劈 斜切現象較少，緩降低產生的微笑現象所造成的破壞，其 【實施方式】同時可減少朋角，而可提升良率。 201021108 為俾使貴委員對本發明之特徵、目的及功效，有著 更加深入之瞭解與認同，兹列舉較佳實施例並配合圖式說 明如后： 辟劲古&目冑4」與「圖5」所示，本發明為—種晶圓 '，其步驟包含預備一待切割的晶圓10、預備一劈 =置=執行劈裂作業’其中該晶圓10上設有複數預切 放於一工作台15上，該劈裂裝置20具有一劈刀 21、一位移元杜9q _ ^ ^ 曰圓ίο罟访##、一劈裂台22與一對位元件24，其讓該 :件24讓該劈二^台22上’並藉該位移元件23與該對位 數預切線;;後執:擇的方式-個-個的對準該複 如「圖5」所+达丄'、 其中預切線11僅以二發明的實施例―，為簡化表示， 線11如「圖2」所一線作為表示’而較貼近實際的預切 圓1〇的一侧端開本實施例中，該劈刀21為由該晶 11對準下-個，並/ Sx預切線1卜並跳過相鄰該預切線 動，直至該預切線==:=端時反向移 S1〜S7表示對準的 订質輯業為止，其中圖示以 執行-次劈裂作業 本發明每次間隔一條預切線11才 劈裂作業為止。 向執行直至完成全部預切線_ 請參閱「圖6 ，装发 例中’其與實施例i類二實施例二’在本實施 另-侧端時，該劈 w i劈刀21與該晶圓1〇 口到初始位置並對準最靠近且尚未 201021108 執行=作業_預城u，亦即如圖 不’其劈刀21每次間隔一條預切㈣才執行If切所 業’ ^劈裂次序都維持同-方向移動。'大劈裂作 明參閱圖7」，其為本發明的實： ，中該劈刀21為由該晶隨的_侧端開在本實施 11 ’並跳過二個相鄰該預切線11對準下—個，讀預切線 晶圓1〇的另-側端時反向移動，直至該預切線二在到達讀 劈裂作業為止，如圖示中的S1~S7所示，其“全被執行 預切線11才執行一次劈裂作業， 且來回往復：:欠間隔兩條 全部完成劈裂作業為止。 伃劈裂直至 請參閱「圖8」，其為本發明的實施例四 例中，其與實施例三_，該劈刀21到達該 實施 業:Γ21回到初始位置並對準最靠近且尚::： 货裂作業的該預切線1卜亦即如圖示中的S1S7所示丁 ❿ 刀21母认間隔兩條預切線Η才執行一次劈裂作業， 裂次序都維持同一方向移動。 、，且劈 如上所述，本發明透過跳躍選擇的方式一個一個的對 準該複數預切線11後執行劈裂作業，因此其晶圓1〇因為劈 裂動作所造成的偏移，不會一直累加下去，換句話說，其 微笑現象會比較不明顯，可減少微笑現象所造成的斜切與 崩角，因而良率可獲得提升，滿足使用者的需求。 、 綜上所述僅為本發明的較佳實施例而已，並非用來 · 丨 * Ρν 又本發明之實施範圍，即凡依本發明申請專利範圍之内容 201021108 所為的等效變化與修 【圖式簡單說明】哪线為本發明之技術範4 m 1 . ^ _ 圖 圖2 圖3 圖4 圖5 圖6 圖7 圖8 【主要元件符號說明】 :=劈裂裝置之局部結構示意圖 知待劈裂晶圓之結構示惫 ，習知晶圓產生微笑現象之㈣圖。 係本發明晶圓劈裂裝置之結構示意圖。 2發明實❹卜的劈裂晶圓之次序示意圖。 係本發明實闕二” m 係本發明實施例三的劈裂晶圓之次序示ί: 例四的劈裂晶圓之次序示意圖。 1 ·晶圓 2 :預切線 3 :藍片 4 :固定夾具 5 :工作台 6 :劈刀 7 :劈裂台 8:影像擷取系統 本發明 10 .晶圓 11 :預切線 9 201021108 15 :工作台 20 :劈裂裝置 21 :劈刀 22 :劈裂台 23 :位移元件 24 :對位元件When the unmatched pre-cut line 2 is split, it is easy to cause chamfering and chipping, which may damage the wiring inside the wafer 1 and reduce the production yield. SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a wafer splitting method that reduces the smile generated by the wafer during splitting to improve yield and meet user needs. The splitting splitting method includes the steps of preparing a strand to be cut and placing the county device, wherein the wafer is provided with a plurality of pre-cutting displacement elements and a two-stage table, and the splitting device has a file, One is followed by a splitting table and a pair of bit elements. On the stage, the displacement element is used to set the splitting operation, and the wafer is placed in the splitting one and the alignment element allows the file to be jumped and selected according to the method. Perform a splitting operation afterwards. Cracking, so it is possible to reduce the damage caused by the smiling phenomenon caused by the lack of successively cutting the plurality of pre-cut lines in sequence, and the method can reduce the angle of the face and increase the yield. . 201021108 In order to give your members a deeper understanding and recognition of the features, purposes and effects of the present invention, the preferred embodiments are illustrated with the following description: Pioneer & Target 4" and Figure 5 As shown, the present invention is a wafer, the steps of which include preparing a wafer 10 to be cut, preparing a wafer = performing a splitting operation, wherein the wafer 10 is provided with a plurality of pre-cuts. On the table 15, the splitting device 20 has a file 21, a displacement element Du9q _ ^ ^ 曰 circle ίο罟 visit##, a splitting table 22 and a pair of position elements 24, which let the piece 24 Let the 劈2^2222' and use the displacement element 23 to pre-cut the line with the pair of digits;; the latter: the selected mode - the one-to-one alignment is the same as "Figure 5" + 丄 、, The pre-cut line 11 is only in the embodiment of the second invention--for the sake of simplicity, the line 11 is as shown in the figure of FIG. 2 as the side of the pre-cut circle 1 表示 which is close to the actual one. The boring tool 21 is aligned by the crystal 11 and /Sx pre-cuts the line 1 and skips the adjacent pre-cut line until the pre-cut line ==:= end reverse shift S1~S7 Up to quasi-quality series industry custom, illustrated therein to perform - the present invention each sub-interval fracturing job a job pre tangent 11 before splitting up. Execution until completion of all pre-cutting lines _ Refer to FIG. 6 , in the loading example, and in the second embodiment of the embodiment i, in the other side of the present embodiment, the 劈wi 21 21 and the wafer 1 The mouth is moved to the initial position and aligned to the nearest and has not been 201021108. Execution = Job_Pre-City u, that is, as shown in the figure, 'The sickle 21 is separated by a pre-cut (four) each time. Maintaining the same-direction movement. 'Big splitting is shown in Fig. 7', which is the actual of the present invention: the boring tool 21 is opened by the _ side end of the crystal in the present embodiment 11' and skips two Adjacent to the pre-cut line 11 is aligned, and the other side end of the pre-tangential wafer 1 读 is reversely moved until the pre-cut line 2 reaches the read splitting operation, such as S1~S7 in the figure. As shown in the figure, "all the pre-cutting lines 11 are executed to perform a splitting operation, and the back and forth are repeated: the two are not separated by the entire splitting operation. The splitting is up to see "Fig. 8", which is the present invention. In the fourth embodiment, which is the same as the third embodiment, the file 21 reaches the implementation: Γ21 returns to the initial position and is aligned to the nearest position: :: The pre-cut line 1 of the cargo cracking operation, that is, as shown in S1S7 in the figure, the two pre-cutting lines are separated by two pre-cutting lines, and the splitting order is maintained in the same direction. As described above, the present invention performs the splitting operation by aligning the plurality of pre-cut lines 11 one by one by the jump selection method, so that the wafer 1〇 is not always shifted due to the splitting action. Accumulating, in other words, the smile phenomenon will be less obvious, which can reduce the chamfer and chamfer caused by the smile phenomenon, so the yield can be improved to meet the needs of users. The above is only a preferred embodiment of the present invention, and is not intended to be used in the scope of the present invention, that is, the equivalent change and repair according to the content of the patent application scope 201021108 of the present invention. Brief description of the formula] Which line is the technical model of the invention 4 m 1 . ^ _ Fig. 2 Fig. 3 Fig. 4 Fig. 5 Fig. 6 Fig. 7 Fig. 8 [Description of main component symbols] : = Schematic diagram of the partial structure of the splitting device The structure of the split wafer is shown in the figure. The conventional wafer produces a (4) diagram of the smile phenomenon. The structural schematic diagram of the wafer splitting device of the present invention. 2 Schematic diagram of the sequence of the split wafer of the invention. The order of the splitting wafers of the third embodiment of the present invention is shown in the following: FIG. 4 is a schematic diagram of the order of the split wafers in the fourth example. 1 · Wafer 2: Precut 3: Blue Sheet 4: Fixed Fixture 5: Workbench 6: File 7: Splitting table 8: Image capture system The present invention 10. Wafer 11: Pre-cut line 9 201021108 15 : Workbench 20: Splitting device 21: File 22: Split table 23: displacement element 24: alignment element