TW201020498A - Method for manufacturing evaporator for looped heat pipe system - Google Patents

Abstract

Provided is a method of manufacturing an evaporator for a looped heat pipe (LHP) system, the method including the operations of forming a plurality of wicks having pores; forming a plurality of heat transferring fins respectively having a wick coupler to be coupled to one of the plurality of wicks; inserting each of the wicks into the wick coupler of each of the heat transferring fin, thereby forming a plurality of unit assemblies; applying at least one of heat and pressure to the unit assemblies, and cross-coupling a contact surface of the wick and a contact surface of the heat transferring fin; horizontally disposing the unit assemblies to enable a bottom surface of each of the unit assemblies to be located on a planar surface, and forming an assembly structure; applying at least one of heat and pressure to the assembly structure, and cross-coupling the unit assemblies; and disposing the assembly structure on a top surface of a heat transferring plate having a planar plate shape.

Description

201020498 VI. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing an evaporator of a loop type heat pipe system, comprising a condenser, a gas transmission line, a liquid transmission line, and particularly related to A method for manufacturing an evaporator of a one-loop heat pipe system in which a core structure and a heat transfer fin are cross-coupled to form a component unit and a plurality of component units are arranged and connected to a heat transfer plate An evaporator is formed whereby the core structure and the heat transfer fins are fabricated into various shapes and sizes while minimizing the thermal contact resistance between the core structure and the heat transfer fins. [Prior Art] Electronic components such as a central processing unit or a semiconductor chip used as an electronic device such as a computer generate a large amount of power during operation. Since these electronic devices are usually designed to be used at room temperature, these devices need to reduce the amount of heat generated during operation. One of the thousands of devices used to send the 禋 术 为 is to use the phase change heat transfer system. Here, the Saki technology is a loop heat pipe (LHp) system. FIG. 1 is a schematic diagram of a conventional loop heat pipe system 110. Circuit: heat pipe system, system 110 includes - condenser 112 Z ns 118 5 ^ The two ends of the body line 118 are respectively connected to the condenser u. The fluid is injected into the loop type manifold wire. The hair 114 is different in operation, and the plurality of members have a cylindrical shape. The heat pipe system 110 is in the evaporator m. Configuring the loop heat pipe system 201020498 The loop heat pipe system 110 operates in the following manner: First, the evaporator 114 is in contact with a heating electronic component (not shown), that is, a heat source. When the evaporator is heated by the heat source, the working fluid in the liquid phase penetrates and is phase-shifted into a gaseous state by the core structure. This generated gas flows to the condenser 112 via a gas line 116 connected to one end of the evaporator 114. When this gas passes through the condenser 112, the entrained thermal energy is dissipated outward and liquefied. The liquefied working fluid is connected again

The liquid line 118 at the end of the condenser 112 flows back to the evaporator 114. Repeated operation through the above process causes the electronic component, that is, the heat source to cool down. At the same time, for the tightness and high performance of the loop heat pipe system 11 (), the total thermal resistance should be reduced. When the total electric resistance is lowered, the heat source, that is, the electron element can operate at a low temperature. Various factors must be considered to reduce the loop heat pipe system! i 〇 total thermal resistance. The most important factor of the towel is the thermal contact resistance between the contact surface of the core structure and the base surface of the evaporator U4. This heat contact is not only affected by the surface heat transfer on the contact surface of the two objects. In other words, even if the contact surface of the table t is flat, the size of the actual contact interface of the two objects will be known. Therefore, we must cry the state of the contact surface by the state of the contact surface. The contact surface of the remaining structure and evaporation 51 The heat conduction between the contact surfaces of 114^ occurs from the thermal conduction of the actual contact interface between the core structure and the evaporation system, and the heat conduction between the green structure and the vacuum region between the contact surface and the bottom contact surface. , a several 疋 by the vacuum V 〇 1 & _ between the 焱 structure and the base of the evaporator 114, so by increasing the contact area between the core structure and the evaporator 114 5 201020498 substrate, can reduce thermal contact Impedance. In other words, the thermal contact resistance is related to the thermal impedance generated when the two metal surfaces are in contact, and there is a considerable difference depending on the area of the contact surface. Generally, the two contact surfaces are polished to each other, or A lubricating oil having a high thermal conductivity is added to the contact surface to expand the contact area between the two objects. The thermal contact resistance of the loop heat pipe system 110 and the evaporator 114 are twisted, and the interface is Both the sintered core structure and the contact 'surface state of the evaporator 114 are highly correlated. Similarly, the thermal contact resistance is an extremely important factor for the reaction of the working fluid from the liquid phase to the vapor state. The core structure and the substrate similar in function to the hot plate form a large mutual contact surface, but when the sintered core structure is not suitable for the actual contact interface state of the substrate, the sintered core structure is transferred to the sintered core structure. The heat transfer is not smooth. If so, the temperature of the substrate of the hot plate of the evaporator U4 is increased, and the temperature of the gas is increased to the level of the loop heat pipe system 110. The function of the gas is to transfer thermal energy to the condenser 112'. When the loop heat pipe system, the total heat resistance of the loop heat pipe system 110 increases. Therefore, the key to the evaporator 114 is to increase the area of the sintered core structure and the internal structure of the evaporator disposed in the evaporator 114 to reduce the heat leak value. Regarding the evaporation ^ 114, the Korean patent application: 1 () fine 2 side reveals - the contact area between the seed-green structure and the structure in the evaporator is increased. Reference is made to this application, such that the prior art discloses that the protrusions of the internal structure of 201020498 are 12 槿 2 3 构 4 ° However, this method limits the internal: structure = the required shape, and in this case, The state of the contact faces is not uniform and the efficiency of the heat conduction is poor. In the prior art, reference is made to the figure of the present application, and the file corresponds to the figure 2, 3 4 of the present invention. = r; r protrusion - compared to the previous ^ is actually a 'structure 410 It is not desirable to simply embed and join, and between the respective canines 120, the actual contact surface between the core structure 4H) and the protrusion 120 =. In other words, a point-effect turn is made to cause heat transfer from the protrusion 12G to the core lion 410. FIG. 5 illustrates a contact between the core structure and the protrusion 12〇== junction leakage 41G and protrusion 12 (four) temperature gradient (4) (4) ^ Italian,. This figure is obtained by magnifying the contact surface with an electron microscope. Referring to the reference, the 5'-like structure 41G and the protrusion m are mainly connected to each other via point contact. Therefore, it can be seen that the temperature is lowered at the contact interface. ==In this case, although Luofa II operates under a constant heat load, the temperature of the t surface changes with the evaporation_heat_impedance value. When the contact impedance is large, the temperature of the heating interface is ^ contact. The impedance is small, the temperature of the heating interface is lowered, and the shape of the protrusion 120 or the adjustment of the surface rough wheel is limited. Similarly, the core 7 201020498 structure 410 is embedded in the protrusion according to the shape of the protrusion 12〇. In this case, the choice of the material and shape of the core structure is limited. These limitations are the main factors that cause improvement in the state of the contact surface. In other words, according to the prior art, the protrusion 丨2〇 and the heat source contact unit n The crucibles are all formed integrally in the evaporating dragon 4 towel, and the shape of the core structure 410 reduced to the wafer 12G towel corresponds to the shape of the protrusion 120. Thus, the various shapes of the core structure are limited. The unfavorable state of the contact surface between the protrusion 120 and the core structure 410 causes a high thermal contact resistance to prevent the electronic component from being effectively cooled. [Summary of the Invention] The present invention provides a method for manufacturing an evaporator for a loop type heat pipe system. The heat transfer fin of the evaporator can be formed in various shapes and the core structure of the evaporator can be formed in various shapes and materials to improve heat transfer. Contact state between fins and core structures. "Means to achieve technical goals"

The present invention provides a method for fabricating an evaporator for a loop-type heat pipe system, which comprises forming a plurality of core structures having pores; forming a plurality: two having - bonded to a plurality of core structures - a heat transfer fin of a core structure; each of the core structures is embedded in each of the core structure connectors of the hot Korean sheet to form a plurality of component units; applying at least heat and pressure a component unit, and one of the core structures is contacted with one of the contact faces of the heat transfer film to be interconnected; the component units are horizontally arranged such that the bottom surface of each of the component units can be disposed on a plane, I ❹

G 201020498 Forming-component structure; at least the missing parts are connected to each other; the top surface of the heat transfer plate slanting right and flat shape has a component structure on one side, And == force to the top contact surface to make a connection. < One of the contact surface and the heat transfer plate powder may comprise a material selected from the group of metals, to a material composed of: a plurality of cores having a desired shape: selected heat and waste force One of them is mixed with the mixture 4, and then the core structure is applied. Thus, after forming a plurality of core structures having a desired shape and forming a plurality of core structures having a desired shape, the formation of the plurality of structures further includes using one of a solvent extraction method and a pyrolysis method to remove the mixed conjugate polymerization. Or aged organic solvent. 2. In the case of a core structure connector in which the core structure is embedded in the heat transfer fin, the formation of the component 7 更 includes the bonding catalyst selected from the metal powder and the binder (c〇upUngpr〇m〇ter) And so that the bonding catalyst can be placed on at least a portion of the contact surface between the core structure and the heat transfer fins. The forming of the above component structure further comprises: arranging at least one intermediate core structure and one spacer between adjacent component units. The formation of the above-mentioned component structure further comprises: applying a pressure on the component structure horizontally, 201020498, so that the pore size of the pores in the core structure is reduced.

At least the formation of the above-described component structure further includes arranging a pressure element which applies pressure to the assembly, the Ό structure in the direction of the side of the assembly structure, and which reduces the aperture of the pores in the condensed structure. After the formation of the plurality of core structures, the formation of the plurality of heat transfer fins, and the formation of the component structure, the interconnection of the contact surfaces of the core structure and the heat transfer film, the component unit The interconnection, the enthalpy, and the connection between the component structure and the contact surface of the heat transfer plate are simultaneously performed by the same procedure; the interconnection of the contact surfaces of the ridge structure and the heat transfer fin, and the interconnection of the component units are completed simultaneously. Then, the connection between the component structure and the contact surface of the heat transfer plate is performed, or the contact faces of the core structure and the heat transfer fin are connected to each other, and then the mutual connection of the component units, and the component structure and heat transfer are performed. The connection of the contact faces of the plates. 『Effect of the Invention>> According to one or more embodiments of the present invention, a method for manufacturing an evaporator for a loop type heat pipe system first manufactures a core structure and a heat transfer sheet, and arranges a plurality of core structures And the heat transfer fins are then joined to a heat transfer plate, that is, a metal plate, to thereby manufacture an evaporator. With this side =, a heat transfer fin of a complicated shape or a desired shape can be easily formed, and the contact state of the core structure and the heat transfer fin can be improved, thereby expanding the 2 thermal area and the gas generation area. And minimize the thermal contact resistance between the core structure and the heat transfer fins. The above-described features and advantages of the present invention will become more apparent from the following description. 201020498 [Embodiment] A transmission line for an evaporator for a loop type heat pipe system is manufactured. A description of the circuit breaker, a gas transmission line, and a liquid. The operation of the (,,, s system is in accordance with the above-mentioned prior art 1, and the structure of the system is described in detail. The evaporator of the evaporator-made heat pipe system is the evaporator 1 of the evaporator 1 An exploded perspective view. The stack 1 includes a plurality of core structures, a plurality of heat transfer fins 20, a heat plate 50, and a cover member 60. - a thin plurality of core structures 1G having fine pores, and Each of the H 22 heat transfer pieces 2G each has a core structure connecting the shape of the structure #H, and the connector can be connected to the reduced structure 1〇. The pieces 2〇 are connected to each other to form the component unit 3. Φ Figure 2 is a flat configuration of a plurality of component units 3 () forming - assembly structure 4 〇 (refer to the heat transfer plate 5G is connected to the bottom of the assembly structure 4 〇. Self-teaching 金属 顾 且 and the material is connected to the source and received parts such as - The central processing unit of the computer: - display t ίίο:: is attached to the top surface of the heat transfer plate 50. The cover member 60 forms an internal space with the plate 5' to place the component structure 40 therein. Cover 11 201020498 Cover member 60 A gas line connection hole 62 for connecting to the gas transmission line is formed on the side surface, and the cover member 6〇 A liquid line connection hole 64 for connecting to the liquid transmission line is formed on the top surface. Meanwhile, in the module structure 40, the core structure 10 and the heat transfer fins 20 are connected to each other to form a core structure 1 and The heat transfer fins and the gas passage between the canines 26 and 28, therefore, the gas generated by the core structure can be discharged through the gas line connection hole 62 of the cover member 60. The evaporator 1 having the above structure The operation will be described below. ❹ A liquid working fluid is injected into the evaporator through the liquid wire connection hole 64, and penetrates into a plurality of holes formed in the interior of the core structure. The plate 50 is transferred to the heat of the cymbal sheet 2 to be transferred to the core structure 1 〇 to change the working fluid from the liquid phase: the counter bore 62 is discharged to the outside by the hair splicer 1 The loop type manufacturing method having the above structure will be described below with reference to FIGS. 7 to 12. The operation of the circuit type ageing system includes the operation of the k-party heat transfer rotor ( Operation S2), forming multiple illusions, linking multiple The operation of the unit ('operation (operating the age of the assembly structure (operation S5)), forming -S6), and the operation of the remote structure and the structure of the structure (option and connection-heat transfer plate operation (operation (7). Naked work 12 201020498 A porous structure with a large number of internal pores. The working fluid penetrates into the heat energy of the heat fins to make a description of the fluid phase, and the core structure of the present embodiment is a seven-piece, eight-plate, However, the shape may be changed as needed. For the four-corner flat structure, the core structure 10 may use at least one selected from the group consisting of gold metal powder, metal fiber, and non-gold knife fine material, and heart (^) genus fibers. The material in the wire is miscellaneous, and the wire is added to the selected material. In other words, heat or pressure is applied: 2 = material to obtain the desired shape. One step to the selection of the = = fine structure 1G (10) for S1) can be referred to as the pre-formed structure 10 by using metal powder and in the operation of forming the core structure 10 and containing copper, dragon : The component 'is made like a metal wire or a metal fiber, and is made at the end. Metal powders such as Xing, Bronze, Record, Chin, Ming, and Stainless Steel, which are selected from metal powders and metal fibers, but must contain two or more types of metal powders, or A mixture of powder and metal fibers. One of the heat and pressure to the selected material to obtain the desired or mold and r, the metal or metal fiber is filled into a jig and then 'heat and pressure is applied either or both.烧结 to sintering,: InΪld to form the desired shape. When heated, the farmer can then use a sintered metal or heat to a pre-sintering temperature below the sintering temperature of 13 201020498 to sinter the metal. The metal is sintered at the sintering temperature, and the pre-sintering temperature is from about 8% to about 90% of the sintering temperature at which the metal has been entangled. Similarly, when pressurizing to the metal to obtain the desired shape, a method of fiUing a jig or a mold can be used and pressure is applied to the mold or jig. At this time, the core structure formed of the metal powder or the metal fiber is a sintered body of the sintered body. (4) The New Structure 1〇=, ? program can be performed in operation S1, or in the subsequent operation of the operation of the component unit (operation (4), operation of the joint assembly structure (operation S6), and the connection heat transfer plate In the step (S7), the core structure 1G is heated to the sintering temperature during the sintering process. In other words, in the operation (S1) for forming the core structure, ", in the case of the program" The subsequent application of the towel is lower than the sintering temperature, and the temperature is reached to a high quality state. However, in the sintering process, the operation is not performed in the operation of forming the core structure (S1), and then in the subsequent operation procedure. Test (four) age program, recording temperature _ heat applied to: the subsequent operating procedure 'this can be achieved at this time - the excellent joint state of the contact surface. At the same time, by selecting at least one of non-metallic powder and non-metal fiber to form The core structure of the desired shape is 1G, and then at least one of the pressures is applied to the selected material. The above non-metallic powder example may comprise a ceramic-based bismuth aluminum oxide (Al2〇3) powder, a carbon Quality life Carbon powder and a carbonaceous 201020498 = graphite powder. This is filled with non-metallic powders and non-metallic fibers - the shape == after applying heat or pressure or both to the fixture or mold to m The non-metallic material to form the core structure of the core structure 1G formed of a non-metallic material and the heat transfer fins formed by the metal material may not be able to pass through the subsequent core structure (1). The operation of the inter-domain wire-connecting unit of the sheet is the connection of the unit, so that the core structure and the heat transfer sheet are subjected to pressure to expand the contact area of the two. In the operation (S1) of forming the core structure 10 of the present embodiment, the = plastic polymer and the organic material are mixed with the material of the crucible to form a grade 1 lion with the desired boot, and the money is re-applied. Heating and manpower - to this mixture. This thermal hybrid polymer is similar to the adhesive polyimide material, which contains polyethylene, polypropylene, propylene, and styrene. This pyropolymer increases the viscosity of the haze before the conversion. And minimize the occurrence and volume change during the sintering operation. The conformation structure 10 is formed by mixing a thermoplastic polymer and a sublimation material with a solvent and a material selected from the group consisting of a non-metal powder and a non-metal material, followed by injection or pressurization. 6 The organic solvent is a sublimation substance, which is solid at room temperature and is heated at a pre-twist temperature _ from _ to a vapor state. The dopant material can be used as an organic solvent such as naphthalene, ether or alcohol, or both. Organic solvents are commonly used to make complex shapes that are generally difficult to form. Since 201020498, the organic solvent is added before the forming operation, and the shape of the formed body after the organic solvent is added is regenerated during the sintering process to produce the desired shape. Similarly, in the operation (S1) of forming a core structure in which the metal is a mixture of a thermoplastic polymer and an organic solvent, the mixed thermoplastic polymer is completed when the formation of the desired core structure is completed. Or the mixed organic solvent can be removed by the method of dissolution and the secret method. After the operation of the loop heat pipe system, the remaining thermoplastic polymer solvent may react with the working fluid, causing ship, pollution, or non-condensation. Therefore, this residue must be removed. In the operation (S2) of "Gu" #, a plurality of heat transfer sheets 2'' each having a heater 22 are formed, and the core structure 1020 is connected by a 工7 connector 22 (refer to Fig. 9). The heat transfer 'the ruling piece of the heat coefficient of the metal and ^18 machine), etc. to process the relatively high-conductivity metal processing branch is used. Matter 10. The heat energy received by the plate 50 is transmitted to the core structure. The ice and the plurality of protrusions % and one end of the bottom member 24 protrude upward. The protrusion 26 and the 16 201020498 -----I-- form a space. This space is used as a passage for the oxygen body generated in the core structure 10. The formation of heat transfer 2G material and the transfer plate 50 2 of the 'protrusions 26 and 28 and the core structure connector β Valley easy to make ia a more complex shape, and can adjust the thickness of the chain to - The degree of need. The order in which the surface of the &<>> forms a core-like operation (S1) and the formation of heat transfer (S2) can be reversed.

Next, an operation of forming the component unit is performed (S3). In the operation (S3) of the component unit, the core structure 1 is inserted into the core structure connector 22 of the argument sheet 2G to form the unit 30' as shown in Fig. 10. Meanwhile, in the present embodiment, the operation (S3) of forming the component unit further includes: embedding a bonding catalyst to be placed before the core structure 1 is embedded in the heat transfer film connector 22; And at least a portion of the contact interface between the heat transfer tabs 20. In the operation of embedding the linked catalyst, the bonded catalyst is placed on a contact interface where 20 and the core structure 1 are in contact with each other. Due to this bonding catalyst, the contact interface between the core structure 10 and the heat transfer fins 2 is metal-bonded. One of the metal powder and the joining material is selected as the linking catalyst. In the case of using a bonding catalyst, heat is applied to the module unit in the operation of joining the module unit (operation S4) when one of heat and pressure is applied to the module unit. The metal powder was used as a linking catalyst in the following manner. 17 201020498 f embedded in the _ ^ ^ after the structure of the structure: the device 22, the metal powder mouth between the protrusions 26 and 28, on the disk. After that, the rhythm structure is re-introduced; ^ when the cat is between the private and 28. Since the metal powder is a micron-sized genus powder sprayed on the corresponding heat transfer sheet 2〇's surface structure i〇m core structure 10' metal powder can be placed in the core-like knot corresponding to 1 heat transfer The surface of 2G, and then the structure 10 can be inserted into the heat transfer fins 20. An enlarged cross-sectional view of the mutual powder placed on the contact fines of the core structure 10 and the sheet 20 in contact with each other. The metal of the metal powder may be the same or different from the material forming the operation = the joining material may be linked (4). It contains a solder-based embedded material or other material that is embedded in the space formed by the core structure. In other words, the material is selected and heat transfer based on the melting point of the substrate into the upper 2G. ^^,#'余结构10 Heat transfer ϋ 20 A face: formed or when the core structure 10 is formed of nickel and ψ, ΖΙ u forms 'the solder which can be contained in this joint material and is transmitted to Han Pieces ^ two or oblique. When the core structure 1G is formed of a stainless steel forming material, a gold tantalum material, and a magenta thick, the joining material may include silver solder, a recording solder vibrating platinum material, aluminum solder, iron solder, and the like. 201020498 Meanwhile, a polymeric adhesive or an adhesive polymeric material, that is, a thermoplastic polymer comprising polyethylene, polypropylene, propylene resin, and styrene resin can be used as a linking catalyst. The contact faces of the structure 10 hetero-contact surface and the heat transfer fins 20 are connected to each other. At this time, the operation (S3) of the module unit includes a known technique of incorporating the catalyst, and the connection of the contact faces can be made into a state of high hardness. In the operation (S4) of joining the unit units, at least heat and pressure are applied to the unit unit to connect the contact faces of the core structure 1 and the contact faces of the heat transfer fins 20 to each other. In other words, heat can be applied to the module unit 3 - 0' or pressure can be applied to the assembly unit 1 30 in the up, down, left and right directions of the unit unit 3, or both heat and pressure can be applied to the unit unit 30 to make the core structure The temperature of the object 10 is the same as that of the material forming the core structure.

Perform the operation and set it appropriately. The material of 10 is metal, which is carried out under the pre-heating operation or later (in the operation of the assembly structure (s5))

It is said that the 'structure 12 is disposed adjacent to the ❹ to form the structure of the assembly (S5) = 30 between the "rock" structure: 40, wherein the middle ' between the unit units. Adding 201020498 w)pu into the middle core structure 12, the heat transfer area and the gas generating area can be enlarged. Similarly, spacers can be used instead of the middle core structure 12. Fig. 13 to Fig. 16 A schematic view of two component structures 40a and 40b, wherein a plurality of spacers are disposed between the component units. The space formed by the spacers between the component units serves as a gas passage 'which thereby allows gas generated in the core structure 10 Smoothly discharged to the outside.

In the assembly structure 40a of Figures 13 and 14, the comb spacers 14 are disposed between the plurality of component units 3a. Here, the plurality of heat transfer fins 20a respectively joined to the plurality of core structures 10 are formed to have a relatively extremely thin thickness as compared with the prior embodiment. Since the heat transfer fins 2a are independently manufactured, the plurality of bottom members 24a and the plurality of protrusions 26a and 28a can be manufactured to have an extremely thin thickness. A plurality of gases between the module units 30a are formed by the concealment 14. The solid structure and FIG. 16 are assembly structural diagrams including a plurality of spacers 16, which are different from the embodiments of FIGS. 13 and 14. In this component structure °14/zhong ‘!

= Scale 2% includes - bottom member 24b * multiple with very thin thickness / 26b and 28b. The gas passage 1 between the plurality of component units 4Gb is formed by the separator 16. At the age of 'in order to form the gas passages 15 and 17, a jig (not shown) having a similar shape of the fish RZ i16 can be used as the spacer 1 structure to be bonded to the heat transfer plate, and the material can be assembled from the assembly H, (4) Similarly, the operation of forming the component structure (S5) further includes applying the pressure in the direction of 々20 201020498 to the operation of the component structure 40, that is, the component units can be arranged in a row in this direction, thus making the aperture in the core structure 10 Zoom out. Fig. 17 is a schematic view showing the direction of pressurization by arrows. Fig. 18 is a view showing a case where a non-pressurized fine hole is pressed in a direction indicated by an arrow to reduce the length of the diameter of the fine hole 18 in the core structure 10 from D 至 to D1. This reduced pore 18 is maintained in a compressed state even after the pressure is removed. The reason is that the plastic deformation occurs according to the material of the core structure. The condensed structure 10 functions as a working fluid to be delivered to the evaporator interface by capillary pressure. At this time, when the diameter of the pores 18 is contracted, in other words, as the diameter is decreased, the capillary pressure can be increased, thereby accelerating the transfer of the working fluid to the evaporation interface where evaporation occurs. Therefore, the cooling efficiency can be increased. Furthermore, according to other embodiments, the operation of forming the assembly structure (S5) further comprises configuring a pressure element for applying pressure in any of the side directions of the assembly structure 4" "This pressure element can be in the assembly structure 4" The pressure is applied in any of the measured horizontal directions, and the pore diameter of the pores in the core structure 10 can be reduced. As illustrated in Figure 19, the pressure element can be a square frame, or y is a clamping member (not shown) that engages in either side of the assembly structure 4〇 and can be tensioned via screws or the like. Structure 40. Similarly, a through hole penetrating through the structure of the module can be formed, and the member is placed in the through hole to be pressed in the horizontal direction to the group. At least the heat is applied to the operation of joining the member structure (S6). One of the house forces to the Kakisaki structure 4 (4) connects the component units 3G to each other. 21 201020498 4. Two:: By pressing === in the component structure, the component unit 30 is shown in the structure of the force unit, ^ ^, in the operation of joining the heat transfer plates (S7), group Du 2 = miscellaneous heating, - heat : Face. first,. The contact surface of the 4G contact surface and the heat transfer plate 50 is at this time 'according to the nature of the material of the heat transfer plate 50, ❹ 40 ^ to pass = ^:=), after the cover of the unified = 3? 5 ^ 7 ==, the order of operation of the loop heat pipe to S7 is not mandatory. For the ancient operation; first J and 'S1 =; Ϊ? the operation of the object (S1), the formation of the transmission _ film operation (J), ❹ 2: and the operation of the connection heat transfer plate (===:: or heat And ==4,,, and 87 use heat and diligence -, (S1) ^ to form the operation of the component structure (S5), then two: =) two and 22

The heat transfer plate 50 is connected to an electronic component (not shown in the figure to receive thermal energy originating from the electronic component. This heat transfer is then transmitted to the heat transfer fin 20 and then to the core structure #1〇. Since the heat energy is transmitted to the core-like lion with pores, the working fluid existing in the fine hole is vaporized, and then the gas passage disposed on the core structure 1 is passed through the gas line to the condenser. The vinegar (4) is liquefied after the condenser towel is radiated outward, and then supplied to the core structure via the liquid line. The above process is repeated to cool the electronic component. 201020498 (S4) and operation of the joint assembly structure (S6) The operation may be performed in the same manner, and then the operation of joining the heat transfer plates (S7) may be performed separately. Alternatively, the operation of forming the heat transfer fins (S2) of forming the core structure (the operation of forming the component unit) (forming the assembly) Operation of the structure (S5), subsequently, the operation of joining the component units (S4) 'the operation of connecting the wheel structure (s6) and the operation of the connecting plate (S7) can be simultaneously performed in the same process. Method mentioned in the examples The operation of the evaporator for the loop type thermal system manufactured will be briefly described below. The efficiency of the manufacturing method of the evaporator previously used for the loop heat pipe system will be described below. According to the practice of the present invention For example, the heat transfer fins are coupled to the core structure to form: a separate member 'the core structure and the heat transfer plate are interconnected to form a component unit, and the plurality of component units are horizontally arranged to form a component structure and then the group = structure Then, it is connected to the heat transfer plate. Therefore, the core structure and the heat transfer fins of various shapes and sizes can be manufactured to minimize the thermal contact resistance between the core structure and the heat transfer fin 23 201020498 Wjpu sheet. Compared with the prior art, all the protrusions of the prior art are directly formed on the heat transfer plate, but in the embodiment, since the heat transfer fins are made of independent members, the shape can be formed more complicated. Heats the fins and forms heat transfer fins having a very thin thickness. According to the prior art, the adhesion between the core structures and the heat dissipation fins can only be adjusted between the core structure and the heat transfer fins. Capacity Tolerance or the like increases, limiting the increase in adhesion between the core structure and the heat transfer fins. However, in an embodiment of the invention, the core structure and heat transfer fins The adhesion between the two can be increased to promote the generation of gas and the evaporator has excellent efficiency. Similarly, in the embodiment of the present invention, the thickness of the heat transfer fin can be easily adjusted, and can be found to be suitable for The size of the gas passage is used. Further, the heat transfer fin can be manufactured according to the thickness of the core structure, so that a thin core structure can be used to appropriately adjust the gas generation region and the heat transfer region to obtain the most Optimum structure. In the embodiment of the present invention, the above-mentioned optimum structure which is easy to perform can maximize the addition domain and the gas generation region, and the core structure includes heat transfer fins of the protrusions. The thermal contact resistance between the two is minimized. As such, the total thermal impedance of the loop heat pipe system can be reduced. If the core structure is composed of metal, the connection between the core structure and the heat transfer fin f and the heat transfer fin and the heat transfer plate cannot be simply combined with the actual contact surface. Achieved, but should be achieved by metal coupling achieved by one or both of heat and pressure. As such, the thermal contact resistance of the contact interface 24 201020498 can be reduced. According to a conventional technique, after the sintered core structure is formed, the sintered core structure is physically embedded and joined between the protrusions as the base of the heat transfer fin. Thereby, even if the size of the contact surface between the sintered core structure and the substrate can be increased, the connection in the contact surface between the sintered core structure and the protrusion of the substrate is by point contact instead of The surface contact is achieved, and the state of the contact surface is deteriorated, so that the actual thermal impedance in the contact surface is relatively high, and it is difficult to smoothly transfer heat from the heat source to the sintered core structure. However, in the present embodiment, the contact surface between the core structure and the heat transfer fins is not achieved by a simple physical connection, but is achieved by metal face bonding in which the metal is slightly thermally melted. Thus, by comparing the conventional techniques, the thermal contact resistance in the present embodiment can be greatly reduced, so that the electronic component, i.e., the heat source, can be operated at a low temperature. ^ '' At the same time, in this embodiment, the core structure and the heat transfer fins are not in direct contact with the heat source. Therefore, the structure of the heat transfer film can be freely adjusted, and the thickness and width of the core structure are . In other words, in forming the heat transfer fin and the core structure, the thickness and the entire width of each of the core structure and the heat transfer sheet can be easily adjusted so that the heat transfer region and the gas generation region are as large as possible. . When heating and pressure are simultaneously applied to connect the core structure and the heat transfer fins to each other, the interconnection becomes very hard and the thermal impedance of the contact interface is lowered. Similarly, since the assembly structure is horizontally pressurized, the pore diameter of the fine 25 201020498 hole in the core structure is reduced, thereby increasing the capillary suction force, and as a result, the working fluid can smoothly flow. According to an embodiment of the invention, the shape of the heat transfer fins can be varied and the spacers can be disposed between the component units. Due to this configuration, the shape of each component can be freely changed so that the gas can be smoothly discharged to the outside. 21 to 23 are other embodiments of the present invention, which respectively correspond to a modified heat transfer fin 2〇c, a component unit 3〇c, and a component structure 4. Compared with the heat transfer fin of FIG. 9, the heat transfer fins 2〇c of this embodiment do not include the protrusions placed on the side of the heat transfer fins 2〇c, only the protrusions 28c on the other side, and one Bottom member 24c. 22 to 23 are respectively a component unit 30c corresponding to 10% of a heat transfer fin 2〇c-like structure, and a schematic view of the assembly unit 4〇c formed by the assembly unit 3〇. In the embodiment of the present invention, the above method can also be used to manufacture the component structure 40c. The present invention has been disclosed in the above embodiments, but it is not intended to limit the application of the present invention. The figure defines the schematic of the general loop heat pipe system. Fig. 2 to Fig. 4 are schematic diagrams of the prior art. The contact between the interface and the core structure in Fig. 2 to Fig. 4 26 201020498 Fig. 6 is a perspective exploded view of the evaporator manufactured by the method for manufacturing the circuit of the actual circuit and the steaming of the pipeline. Fig. 7 is a flow chart showing the manufacturing method of the loop type heat pipe green shouting device of the present invention. 8. Figures 9 and 10 are schematic diagrams of the corresponding core structure, heat transfer and component unit. Figure 11 is a cross section of the powder interface between the core structure and the heat transfer front. Figure 12 is a schematic diagram of the structure of the component. Inhibition - implementation of the financial group hiding material meaning and the implementation of the invention - the implementation of the financial component structure and = 17 and Figure 18 is the application of horizontal pressure to the structure of the assembly 19 is the hair (four) - real scarf & ^ The structure of the frame of the frame · the meaning of the four-sided = 20 - component structure connection _ heat transfer plate schematic. The film: two 23 respectively correspond to the invention - the embodiment _ piece assembly early, and the component structure Fig. 4 [Description of main component symbols] 1 '114 ·_Evaporator 1〇· 'Swim structure 12: Intermediate core structure 14, 16: Spacer 27 201020498 15,17: Gas channel 18: Fine Holes 20, 20a, 20b, 20c: heat transfer fins 22: core structure connectors 24, 24a, 24b, 24c: bottom members 26, 28, 26a, 26b, 28a, 28b, 28c, 120: protrusions 29 The bottom surface 30, 30a, 30b, 30c of the module unit: the unit unit 40, 40a, 40b, 40c: the assembly structure 42: the quadrilateral frame 50: the heat transfer plate 60: the cover member 62: the gas line connection hole 64: the liquid line connection hole 110: loop heat pipe system 112: condenser 116: gas line 118: liquid line 410: core structure D0: The compressed diameter of the pores D1: diameter of the pores compressed

Claims (1)

201020498 VII. Application for Patent Park: Included: 'A manufacturing method for an evaporator for a loop heat pipe system, comprising forming a plurality of core structures having fine pores to form a plurality of core structures each having a joint to a plurality of core structures a heat transfer fin of the core structure connector; each of the core structures is respectively embedded in the braid structure connector of each heat transfer fin to form a plurality of component units; applying at least heat and One of the pressures to the component unit, and one of the contact faces of the core structure and the contact surface of the heat transfer fin are interconnected... The component units are horizontally arranged such that the bottom surface of each component unit can be disposed on one Forming a component structure in a plane; applying at least one of heat and pressure to the component structure, and interconnecting the component units; and arranging the component structure to a top surface of the heat transfer plate having a flat plate shape Heating or applying heat and pressure to the assembly structure on the top surface, and one of the contact surfaces of the assembly structure and one of the contact faces of the heat transfer plate is made: 2. Applying for a patent The method for manufacturing an evaporator for a circuit according to Item 1, wherein the plurality of core structures comprise a metal powder, a non-metal powder, a metal core, and a metal fiber. The medium-like material is collected, and then one of the pressures is applied to the selected material to form a plurality of core structures. a desired shape 3_, as in the manufacturing method of the loop-type heat pipe system 29 201020498, as described in claim 2, wherein the plurality of cores contain a thermoplastic polymer and a The organic solvent is used to form a core structure having a desired shape of the package. "The formation of a plurality of core structures as described in claim 3, wherein the shape of the plurality of core structures after forming a plurality of heat-generating structures The shape agent extraction method and the pyrolysis method are used to remove the organic solvent which has been mixed and mixed. The 11 polymer or the conventional method of the first method is used for the loop type fistula system. Embedding ΐ heat transfer == the core structure 舆 between the shafts ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ The middle core-like knot is a manufacturing method of the rib-loop hair-cutting device described in the scope of the patent application, wherein the formation of the 愧-component structure further comprises a soil structure, thereby making the core structure 8. such as U Lilangdi The method of manufacturing the face loop heat pipe system 30 201020498, wherein the formation of the component structure further comprises a reduction in the aperture of the square hole on either side of the component structure. The fineness of the core structure is as described in the instrument In the formation of the loop heat pipe system φ i component 'the formation of the component unit, and the mutual connection of the components, the links of the * are the same as: "contact with the heat transfer plate, contact with the material and heat transfer 41 pieces" The mutual interconnection of the surfaces is such that the heat transfer is followed by the junction of the components, the interconnection of the contact faces is connected with the connection of the contact faces of the heat transfer plates, and the structure of the assembly