KR20100135541A - Evaporator for the looped heat pipe system and method for manufacturing thereof - Google Patents

Abstract

PURPOSE: An evaporator for a looped heat pipe system and a manufacturing method thereof are provided to enhance cooling performance and to enable mass production since fins and wicks are separately manufactured and connected. CONSTITUTION: An evaporator(1) for a looped heat pipe system comprises a metal plate(10), a plurality of fins(20), porous wicks(30) and a cover member(40). The metal plate comprises a top side, which comprises a plurality of connecting recesses, and a flat bottom side. The lower ends of the fins are inserted and fixed into the connecting recesses. The porous wicks are arranged between the fins and connected to them. The cover member is connected to the metal plate. The fin has a thin plate form. The connecting recess has a form to be able to be connected to the lower end of the fin. The connecting recesses are arranged side by side at intervals.

Description

Evaporator for the looped heat pipe system and method for manufacturing Technical Field

The present invention relates to an evaporator which forms a loop heat pipe system together with a condenser, a gas transfer pipe, and a liquid transfer pipe, and in particular, improves the construction of metal flat plates, fins, and wicks, and enables various shapes of each configuration and is manufactured. Not only is this reduced, it is also possible to mass produce and to increase heat transfer efficiency for an evaporator for a loop heat pipe system.

Electronic components such as CPUs and semiconductor chips used in various electronic devices such as computers generate a lot of heat during operation. Since such electronic components are usually designed to function properly at room temperature, failure to effectively cool the heat generated during operation leads to a significant decrease in their performance and, in some cases, even damage to the product.

In addition, since heat generation loads are continuously increasing due to high integration and high performance of electronic components, various new attempts have been made to effectively cool electronic components. One such attempt is a phase change heat transport system. A recent example of such a phase change heat transfer system is a looped heat pipe (LHP) system.

The loop heat pipe system is a type of CLP (Capillary Pumped Loop Heat Pipe) technology developed by NASA to cool large amounts of heat generated from satellite communication equipment and electronic equipment.

1 illustrates a conceptual diagram of the operation of a conventional looped heat pipe system 100. In the loop heat pipe system 100, a condenser 112, a conventional evaporator 114, and a gas transfer pipe 116 and a liquid transfer pipe 118 connecting them are connected to each other to form a loop.

In the case of the loop heat pipe system 100, unlike the previous cylindrical heat pipe, a sintered wick is provided only inside the evaporator 114. Meanwhile, in the present specification, the loop type heat pipe is also referred to as a loop type heat pipe system, and both names are used interchangeably in the same meaning, and the evaporator and the condenser have the same meaning as the evaporator and the condenser, respectively.

The basic principle of operating the loop type heat pipe system 100 is as follows.

First, when the base located in the lower part of the evaporator provided inside is in contact with an electronic component (not shown) that is a heat source and is heated by a heat source, the working fluid that has permeated the sinter wick by the transferred heat is saturated. It is heated up to the temperature and is changed into gas. At this time, the generated gas is moved to the condenser 112 along the gas transfer pipe 116 connected to one side of the evaporator 114. Subsequently, when the gas liquefies by releasing heat to the outside while passing through the condenser 112, the liquefied working fluid is moved back to the evaporator 114 along the liquid transfer pipe 118 on one side of the condenser 112. This process is repeated to cool the electronic components that are the heat source.

The present invention relates to an evaporator in such a loop heat pipe system. The evaporator needs a part that can come into contact with the heat generating part, a part for heat transfer or heat diffusion, and a space and structure necessary for phase change. The evaporator is required to have a structure capable of mass-producing as well as vaporizing the working fluid by receiving the heat of the heat generating unit.

However, evaporators for loop heat pipe systems developed to date, due to problems of their internal construction, not only do not effectively vaporize the working fluid by the heat transferred from the heat source, but also have various shapes and desired specifications for sufficient performance. It is difficult to manufacture, and there is a problem that mass production is difficult.

The present invention has been proposed to solve the above problems, and in the evaporator for the loop bottom pipe system, by improving the structure of the metal plate, the wick, the wick provided inside the evaporator, not only has a sufficiently high heat transfer capacity It is an object of the present invention to provide an evaporator capable of realizing various shapes and specifications, and mass production and manufacturing cost reduction.

Another object of the present invention is to provide a method of manufacturing an evaporator for a loop heat pipe system.

An evaporator for a looped heat pipe (LHP) system according to the present invention includes a metal plate having an upper side and a flat lower side having a plurality of coupling grooves; A plurality of fins having lower ends inserted into respective coupling grooves; A porous wick disposed between and coupled to the pins; And a cover member coupled to the metal flat plate.

On the other hand, the fin is a thin plate shape, each of the coupling groove, the lower end of the fin is a shape that can be coupled, the plurality of coupling grooves are preferably spaced apart from each other side by side.

On the other hand, the lower end of the fin is preferably coupled to the coupling groove by a method of at least one of a forced pressing method, a bonding method using an adhesive, a soldering method, a brazing method and a welding method.

The wick is preferably any one of a sintered wick formed by sintering the metal powder, a porous metal wick, and a porous fiber wick.

In addition, the wick and the wick, it is preferable that at least one of heat and pressure is applied in a bonded state is made of a mutual metal bond.

On the other hand, the metal plate, the upper plate and the lower plate, the upper plate is formed with a through hole penetrating in the vertical direction, the coupling groove, the upper plate and the lower plate is preferably formed by the through hole.

In addition, the upper plate, the lower plate, the fin and the wick, it is preferable that the mutual metallic bonding is made by the heat applied in the mutually bonded state.

On the other hand, the method of manufacturing an evaporator for a looped heat pipe (LHP) system according to another aspect of the present invention, the coupling groove forming step of forming a plurality of coupling grooves on the upper side of the metal plate: in the coupling groove A fin preparation step of preparing a plurality of metal fins into which the lower end may be inserted; A coupling step of coupling the respective couplings to each coupling groove; And a wick bonding step of placing and coupling the porous wick between the pins.

On the other hand, the metal plate is made of a top plate and a bottom plate, the coupling groove forming step, the through-hole forming step of forming a plurality of through-holes penetrating in the up and down direction on the top plate, and the top plate and the bottom plate provided with a through hole It is preferable to include a bottom plate coupling step of coupling to form a coupling groove.

And, the wick coupling step, after placing the wick between the pins, by applying heat in the state that the upper plate, the lower plate, the pin and the wick are mutually coupled, it is to be carried out to make the metal bond to the mutually contacting surface desirable.

In addition, the coupling step, the forced pressing method for forcing the lower end portion of the shock by coupling to the coupling groove, the bonding method for bonding the lower end of the shock and the coupling groove with each other by the adhesive, soldering method, brazing It is preferably carried out by any one of the brazing method and the welding method.

On the other hand, the wick is a wick formed by sintering the metal powder, the wick bonding step, the wick is formed into a preform by applying at least one of heat and pressure to at least one of the molding material of the metal powder and the metal fiber, A preform forming step to form a shape that can be sandwiched between the pins coupled to the metal plate: a preform inserting step of inserting the preform between the pins: and heating the preform and the pins to a sintering temperature Thus, the preform is preferably formed of a porous sintered wick (sintered wick) and at the same time the sintering wick formation and bonding step to be bonded to the interfacial surface of the wick and the pin: is preferably configured to include.

On the other hand, the wick coupling step, after placing the wick between the pins, it is preferable that the metal plate, the pin and the wick is applied to each other by applying heat in the state of mutual coupling.

In the coupling step and the wick coupling step, each of the pins are inserted into the coupling grooves and the wicks are disposed between the pins, and then the metal flat plate, the pins and the wicks are heated at the same time, and they are in contact with each other. It is preferable that the metal bond is performed in the above.

According to the evaporator for the loop type heat pipe system of the present invention, by separately manufacturing and combining the fin and the wick, it is possible not only to have sufficient cooling performance but also to realize various shapes and desired specifications, and to mass-produce at low manufacturing cost. The effect can be obtained.

The present invention relates to an evaporator which together with a condenser, a gas conveying tube and a liquid conveying tube forms a loop heat pipe system. Description of the operation of the loop heat pipe system is applied to the above-described in the background section.

An evaporator for a loop type heat pipe system according to an embodiment of the present invention will be described with reference to FIGS. 2 to 4.

2 is a schematic exploded perspective view of an evaporator for a loop type heat pipe system according to an embodiment of the present invention, FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2, and FIG. 4 is a portion except for the cover member of FIG. 2. Is a schematic exploded perspective view of a.

The evaporator 1 for the loop heat pipe system includes a metal flat plate 10, a fin 20, a wick 30, and a lid member 40.

The metal flat plate 10 is made of a metal material, and the flat lower side 16 is in contact with the heat source and receives heat from the heat source. A heat source is an electronic component that generates heat during operation, for example, a computer central processing unit (CPU), a graphics card chipset, and the like.

The upper side 12 of the metal flat plate 10 is provided with a plurality of coupling grooves (14).

Each coupling groove 14 is processed into a shape that can be coupled to the lower end 22 of the fin (20). In the case of this embodiment, the fin 20 is in the form of a thin rectangular plate, so that the shape of the engaging groove 14 also corresponds to this, its cross section is rectangular and extends long.

In addition, a plurality of coupling grooves 14 are provided on the upper surface 12 of the metal flat plate 10, and are arranged side by side to be spaced apart from each other. Coupling groove 14 can be processed in a variety of ways to the metal plate (10).

The jaw 20 is a part of the lower end 22 is inserted into the coupling groove 14 is fixed. A plurality of fins 20 are provided, and one fin 20 is coupled to one coupling groove 14.

Above the lower end 22 of the fin 20, a plurality of comb members 24 are spaced apart from each other in order to secure the passage of the working fluid vaporized in the wick (30). Including the comb member 24 The shape of the fin 20 is similar to the shape of a comb. Through the comb member 24, the working fluid vaporized in the wick 30 is moved to the upper portion, and then moved to the gas transfer pipe 44 again.

The lower end 22 of the fin 20 is coupled to the coupling groove 14 by various methods.

An example of the various methods is a forced press method. The mutual coupling is achieved by forcibly pressing the lower end 22 of the fin 20 into the coupling groove 14. The size of the lower end 22 of the fin 20 and the size of the coupling groove 14 is appropriately processed so that the forced press is made.

On the other hand, after forcibly pressurizing the fin 10 into the coupling groove 14, by applying heat to the portion of the fin 10 and the coupling groove 14 may be a metallic coupling in the contact with each other. When the metallic bond is made, the contact heat resistance at the mutually contacting surface is significantly lowered.

In addition, there is another method of bonding the fin 20 to the coupling groove 14, there is a bonding method using an adhesive. That is, an adhesive having a property of transferring heat, for example, an adhesive such as a heat transfer epoxy adhesive or a silicone adhesive, is applied to a portion where the lower end 22 and the coupling groove 14 of the fin 20 are in contact with each other, and both are bonded to each other. After curing, curing is performed.

In addition, another method of coupling the fin 20 to the coupling groove 14 is a soldering method, a blazing method or a welding method.

The soldering method, also called soldering, is a method in which the material of the fin 20 and the coupling groove 14 is bonded without melting using a brazing filler metal. The brazing method is also a type of soldering, and is a joining method in which only a solder is melted and bonded by using a non-ferrous metal or an alloy (lead material) having a lower melting point than the base material to be joined as the filler metal, with little melting of the base material. However, the blazing method uses an alloy having a somewhat higher melting point as the filler metal compared to the soldering method, and there are some differences in that it uses a solvent.

The welding method is a method of joining the fin 10 and the metal plate 20 so that the two are directly bonded by applying heat or pressure without any other material. There are two welding methods, a welding method and a welding method. Both of them may be used.

The method of coupling the fin 10 to the engaging groove 14 of the metal flat plate 20 is appropriately selected in consideration of the shape or material of the fin 10 and the engaging groove 14.

The wick 30 is disposed between the fins 20 and engaged with the fins 20 on both sides. 2 and 3, the wick 30 is disposed between the pins 20 inserted into the coupling grooves 14 and fixed to the pins 20 on both sides.

The wick 30 has a porous property so that the working fluid may be included therein. The shape of the wick 30 is in the form of a thin plate in accordance with the shape of the fin 10 in the case of the present embodiment. In FIG. 4, the shape of the fin 10 and the wick 20 is shown well.

In the case of the present embodiment, the wick 30 is a sintered wick formed by sintering a metal powder. A sintered wick is produced by compression molding a powder of metal such as copper into a desired shape and then heating it to a sintering temperature lower than the melting point. Meanwhile, in another embodiment, the wick may be made of a material having a porosity such as metal fiber, carbon fiber, ceramic fiber, ceramic fiber, or the like.

In the case of the present embodiment, the fin 20 and the wick 30 are formed in a metallic bond at the parts in contact with each other by the heat and the pressure being reduced in the mutually coupled state. Therefore, there is an effect that the thermal resistance is significantly lowered at the interface between the fin 20 and the wick 30.

On the other hand, in the other embodiment, the pin and the wick is closely bonded to each other, the metallic bond may not be made. In addition, even when forming a metallic bond, only one of heat or pressure may be applied to make the metallic bond.

The cover member 40 is coupled to the metal flat plate 10 to form an inner space of the evaporator 1. The upper surface of the cover member 40 is provided with two liquid transfer pipe coupling holes 42 to which the liquid transfer pipe is coupled. In addition, the side of the cover member 40 is provided with two gas transfer pipe coupling holes 44 that can be coupled to the gas transfer pipe.

On the other hand, the thickness, size, shape, etc. of the metal flat plate 10, the fin 20 and the wick 30 of the present embodiment can be variously modified in consideration of various required cooling capabilities, materials, and the like.

The operation and effects of the evaporator 1 for the loop heat pipe system of the above-described embodiment will be described below.

The operation of the evaporator 1 for the loop type heat pipe system of one embodiment of the present invention will be briefly described. The working fluid of the liquid flows into the upper portion of the wick 30 through the liquid transfer pipe connecting hole 42 and is absorbed, and diffuses widely to the surface.

At this time, when the heat generated from the heat source is transferred to the metal plate 10 forming the lower part of the evaporator 1, this heat is formed by the projections of the protrusion shape is coupled to the coupling groove 14 of the metal plate 10 by heat conduction. 20).

The wick 30 is again supplied with heat transferred to the fin 20 through a contact surface with the fin 20. This heat causes the working fluid to vaporize on the surface of the wick 30, and the working fluid is continuously transported inside the wick 30. The vaporized working fluid is moved to the gas transfer pipe coupling hole 44 between the comb members 24 of the fin 20.

At this time, the working fluid on the surface or the inside of the wick 30 forms a gas-liquid interface, and the curvature of the meniscus is generated so that the capillary pressure due to the pressure difference is between the vapor and the liquid. Occurs. This capillary pressure continuously draws the working fluid in the liquid state from the condenser back to the evaporator 1, resulting in a partial acting as a driving force to enable circulation, allowing circulation throughout the loop heat pipe system. Do it.

Since the evaporator 1 for the loop type heat pipe system according to the embodiment of the present invention has a structure in which the metal flat plate 10, the fin 20, and the wick 30 are prefabricated separately and then coupled to each other, There are advantages in that the shape can be changed, the desired specification can be implemented, the manufacturing method can be diversified and the mass production can be spherical.

In particular, since the coupling plate 14 is provided in the metal flat plate 10 and the fins 20 are coupled to each of the coupling grooves 14, the shapes of the metal flat plate 10 and the fins 20 are mass-produced. There is an advantage that it can be variously modified to suit.

In addition, when the coupling of the fin 20 and the coupling groove 14 by the forced press method, there is an advantage that the assembly is simple and the manufacturing cost is reduced. In addition, in the case of forming a metallic coupling between the fin 20 and the coupling groove 14 by applying heat or pressure after the forced pressurization, there is an advantage that the thermal resistance at the surface in contact with each other is lowered.

In addition, when the fin (20) and the wick (30) to form a mutual metal bond with each other by heat or pressure, there is an advantage that the heat transfer is effective in the heat resistance is low in contact with each other.

5 shows a metal plate 10a in which the metal plate 10 of the evaporator 1 of the above-described embodiment is deformed.

The metal flat plate 10a includes an upper plate 12a and a lower plate 16a. In the upper plate 12a, a plurality of through holes 15a penetrating in the vertical direction are formed. Therefore, as shown in FIG. 6, when the upper plate 12a having the through hole 15a and the lower plate 16a are coupled to each other, the through hole 15a forms a coupling groove.

By forming the through hole 15a in the upper plate 12a constituting the metal flat plate 10a, the method of forming the engaging groove is advantageous in terms of precision and productivity.

In addition, after the upper plate 12a and the lower plate 16a are mutually coupled to form a coupling groove, although not shown, after coupling the lower end of the shock to the coupling groove and placing the wick between the shock, such a mutually coupled state By applying heat at the top plate 12a, the bottom plate 16a, the fin and the wick is made to be a metal bond on the surface in contact with each other. This has the advantage that the heat transfer efficiency in terms of mutual contact is increased, and mass production is possible with high productivity.

On the other hand, in another aspect of the present invention, a method of manufacturing an evaporator for a loop type heat pipe system is disclosed. See FIG. 7.

Method for manufacturing an evaporator for a loop type heat pipe system according to an embodiment of the present invention includes a coupling groove forming step (S1), 휜 preparation step (S2), 휜 coupling step (S3) and wick coupling step (S4). It is done by The method of manufacturing the evaporator for the loop heat pipe system of the present embodiment is suitable for manufacturing the evaporator for the loop heat pipe system described above.

Referring to FIG. 4, the coupling groove forming step S1 is a step of forming a plurality of coupling grooves 14 on the upper surface 12 of the metal flat plate 10.

An engaging groove 14 having a width, a depth, and a length is formed on the upper surface 12 of the metal plate 10 so as to correspond to the shape of the lower end portion 22 of the fin 20. The method of processing the surface of a metal uses a well-known cutting process. In some embodiments, the metal flat plate 10 having the coupling grooves 14 may be formed by a die casting method.

On the other hand, in the case of another embodiment, when the metal plate 10a, as illustrated in Figure 5, consisting of the upper plate 12a and the lower plate 16a, the coupling groove forming step (S1), and the through hole forming step It includes a bottom plate bonding step.

The through hole forming step is a step of forming a plurality of through holes 15a penetrating the upper plate 12a in the vertical direction. The through hole 15a is formed in the upper plate 15a by cutting or die casting.

The lower plate coupling step is a step of forming a coupling groove by coupling the upper plate 12a and the lower plate 16a provided with the through hole 15a with each other. The bonding method may be a bonding method, a soldering method, a brazing method, a welding method, or a method of forming a metallic coupling with each other by applying pressure or heat. Of these, the material of the upper plate 12a and the lower plate 16a is selected in consideration.

On the other hand, when the metal plate 10a is composed of the upper plate (12a) and the lower plate (16a), the wick coupling step (S4), after placing the wick 30 between the fins 20, the upper plate (12a), Heat is applied while the lower plate 16a, the fin 20, and the wick 30 are bonded to each other, so that the surfaces that are in contact with each other are made to have a metallic bond.

The preparation step (S2) is a step of preparing a plurality of metal (20), the lower end portion 22 can be inserted into the coupling groove (14).

The coupling step (S3) is a step of engaging each coupling 30 to the coupling groove 14 provided to be spaced side by side.

휜 coupling step (S3) is a forced press method for forcing the lower end 22 of the fin (20) by pressing the coupling groove 14, the lower end 22 of the fin 20 and the coupling groove 14 mutually It is carried out by any one or two or more of a bonding method, a soldering method, a brazing method by brazing, and a welding method of bonding the liver by an adhesive.

The wick coupling step (S4) is a step of placing and bonding the porous wick 30 between the fins (20). The wick 30 has a porous property so that the working fluid may be included therein. The wick 30 is in the shape of a thin plate, so as to have the thickness of the wick, etc. in consideration of the shape of the fin 20 and the distance between the mutually adjacent fins.

In the case of the present embodiment, the wick 30 is a sintered wick formed by sintering a metal powder. A sintered wick is produced by compression molding a powder of metal such as copper into a desired shape and then heating it to a sintering temperature lower than the melting point. Meanwhile, in another embodiment, the wick may be made of a material having a porosity such as metal fiber, carbon fiber, ceramic fiber, ceramic fiber, or the like.

In the case of the present embodiment, the fin 20 and the wick 30 are formed in a metallic bond at the parts in contact with each other by the heat and the pressure being reduced in the mutually coupled state. Therefore, there is an effect that the thermal resistance is significantly lowered at the interface between the fin 20 and the wick 30.

As described above, according to the method of manufacturing an evaporator for a loop type heat pipe system according to an embodiment of the present invention, the coupling groove 14 is formed in advance on the metal flat plate 10, and the fin 20 is manufactured separately. Since it is a way to insert the coupling into the coupling groove 14, there is an advantage that there is little restriction on the shape and specifications of the fin.

In addition, the wick and the wick can be mass-produced separately in their respective forms, and the combination method of these wicks and the wick is simply made, so that their mass production is possible.

Meanwhile, in another embodiment, the wick is a metal sintered wick formed by sintering metal powder or metal fiber, but the wick bonding step S4 includes a preform forming step, a preform inserting step, and a sintering wick forming and joining step. It can also be configured to.

The wick bonding step (S4), a pre-forming agent is first made, and the pre-form is inserted between the pins, and then heated to a sintering temperature therein to include a step of making a sintered wick and bonding.

That is, the forming of the preform is a step of forming a preform by applying at least one of heat and pressure to at least one of the metal powder and the metal fiber. The preform is formed to have a shape that can be sandwiched between the fins 20 coupled to the metal flat plate 10.

The preform is then heated to the sintering temperature of the metal concerned to form a sintering core. Therefore, when heating so as to become a preform, the heating temperature becomes a temperature lower than the sintering temperature of each material metal.

On the other hand, the molding material means a material for making a preform. The molded material is formed into a preform by being heated with an appropriate temperature, or with or without heating, in consideration of physical properties such as melting point and strength of the metal powder or metal fiber selected as the molding material. do.

The preform forming step may be performed by fixing molding materials such as metal powder and metal fibers to a desired shape using a fixture such as a jig or a frame, and then applying heat or pressure. In addition, although it is possible to form only a molding material purely, if necessary, at least one of thermoplastic (polyethylene (PE), polypropylene (PP), acrylic resin, styrene resin as the adhesive polymer material, It is also possible to use to act as a binder between.

The preform insertion step is to insert the preform into the space between the fins (20).

In the preform inserting step, the prepared preform is inserted between the fins 20 coupled to the coupling groove 14 of the metal plate 10. It is preferable that the preforms be inserted between the fins 20 with a single fixation in a temporarily fixed state while being spaced apart from each other by a jig or the like.

Each preform has a size that fits the size of the space between the corresponding fins 20 so that it fits properly between the fins 20. Each preform sandwiched between the fins 20 is fitted such that its lower side is in contact with the upper surface 12 of the metal plate 10 and both sides are in contact with the corresponding fins 20. The preform extends slightly above the fin 20 so that an empty space is formed at the top. These voids allow the vapors from the surface of the wick to escape smoothly.

In the sintering wick forming and bonding step, the preforms and the fins 20 bonded to the metal plate 10 are heated to a sintering temperature to simultaneously form the preforms into a porous sintered wick 30. The wick 30 and the fins 20 are in contact with the contact surface.

That is, by heating the bonded body in which the preform is inserted between the fins 20 to the sintering temperature, the preform is formed into a porous sintering wick 30, and at the same time the preform and the fin 20 are Metallic bonds are formed at the parts that are in contact with each other and are closely coupled to each other. The binder is heated to a sintering temperature at a predetermined slope and then maintained at that temperature for a period of time.

On the other hand, in another embodiment, the wick coupling step (S4), after placing the wick 30 between the fins 20, the metal plate 10, the fin 20 and the wick 30 mutually Heat may be applied in a bonded state so that metallic bonding may be performed at the surface in which they are in contact with each other.

In the lower side, in another embodiment, the coupling step and the wick coupling step, each pin 20 is inserted into each coupling groove 14 and the wick is disposed between the pins 20, the metal plate ( 10) and the combination of the fins 20 and the wicks 30 are formed, and then the combination is heated at the same time so that the metal plate 10, the fins 20 and the wicks 30 are in contact with each other. It may also be performed so that the metallic bond in the.

After all of the steps S1, S2, S3, and S4 described above are performed, the lid member 40 is coupled to the metal plate 10 to which the fin 20 and the wick 30 are coupled. The gas transfer pipe coupling hole 44 and the liquid transfer pipe coupling hole 42 of the cover member 40 are respectively coupled to the vapor transfer pipe and the liquid transfer pipe. The evaporator for a loop type heat pipe system is completed by the process mentioned above.

Hereinafter, the effect of the manufacturing method of the evaporator for loop type heat pipe systems of the above-mentioned structure is demonstrated.

Characteristic configuration of the manufacturing method of the present invention, first forming the coupling groove 14 in the metal plate 10, and then coupled to the fins (20), coupled to the wick (30) between the fins (20) It is. In other words, the metal plate and the wick and the wick separately manufactured to combine them to complete the manufacture of the evaporator. Due to this configuration, it is possible to freely modify the shape and size of each configuration to meet the various specifications required by the evaporator, which has the advantage that the productivity is maximized to enable mass production at low cost.

In addition, in the manufacturing method of the present invention, in forming the wick, the preform is formed in advance, inserted between the pins coupled to the coupling groove of the metal plate, and then heated to the sintering temperature again, the complete sintered wick It may be provided with a configuration to form a metallic bond between the sintering wick and the pin at the same time. In the case of employing such a configuration, there is an advantage that the coupling between the wick and the pins is made of metallic coupling to lower the thermal resistance at the contact surface.

In addition, the manufacturing method of the present invention, after forming the coupling groove on the metal plate first, then the method of bonding the core and the wick, it can be carried out variously selected to suit the nature, shape and opinion of each configuration.

That is, after coupling the pins to the coupling grooves of the metal plate, the wicks may be coupled between the pins, or only the pins are inserted into the coupling grooves, the wicks are disposed between the pins, and the cores are simultaneously heated to each other. It is also possible to make the metal bond to the contact surface.

1 is a conceptual diagram of a prior art loop heat pipe system;

2 is a schematic exploded perspective view of an evaporator for a loop heat pipe system according to an embodiment of the present invention;

3 is a cross-sectional view taken along line III-III of FIG. 2;

Figure 4 is a schematic exploded perspective view of a portion except for the cover member of Figure 2,

5 is an exploded perspective view of the metal plate of the modified embodiment,

6 is a schematic cross-sectional view taken along line IV-IV of the metal plate of FIG. 5 coupled thereto;

7 is a flow chart of a method of manufacturing an evaporator for a loop type heat pipe system according to an embodiment of the present invention.

Claims (14)

In the evaporator for Looped Heat Pipe (LHP) system, A metal plate having an upper side with a plurality of coupling grooves and a flat lower side; A plurality of fins having lower ends inserted into respective coupling grooves; A porous wick disposed between and coupled to the pins; And Evaporator for a looped heat pipe (LHP) system comprising a; cover member coupled to the metal plate. The method of claim 1, The fin is a thin plate shape, Each coupling groove has a shape that can be coupled to the lower end of the fin, The plurality of coupling grooves are spaced apart from each other arranged side by side evaporator for the loop type heat pipe system. The method of claim 1, Evaporator for a loop heat pipe system, characterized in that the lower end of the fin is coupled to the coupling groove by at least one of a forced pressing method, a bonding method using an adhesive, a soldering method, a brazing method and a welding method. The method of claim 1, The wick is any one of a sintered wick formed by sintering the metal powder, a porous metal wick and a porous fiber wick, characterized in that the evaporator for a loop type heat pipe system. The method of claim 1, The wick and the wick is evaporator for a loop type heat pipe system, characterized in that the mutual metallic bonding by applying at least one of heat and pressure in a combined state. The method of claim 1, The metal flat plate is composed of an upper plate and a lower plate, The upper plate has a through hole penetrating in the vertical direction, The coupling groove, the upper plate and the lower plate is evaporator for the loop type heat pipe system, characterized in that formed by the through hole. The method of claim 6, The top plate, the bottom plate, the fin and the wick, the evaporator for a loop type heat pipe system, characterized in that the mutual metallic bonding is made by the heat applied in the mutually coupled state. Coupling groove forming step of forming a plurality of coupling grooves on the upper side of the metal plate: A fin preparation step of preparing a plurality of metal fins into which the lower end thereof can be inserted into the coupling groove; A coupling step of coupling the respective couplings to each coupling groove; And Method for manufacturing an evaporator for a loop type heat pipe (LHP) system comprising a; wick bonding step of placing and bonding the porous wick between the fins. The method of claim 8, The metal plate is made of a top plate and a bottom plate, The coupling groove forming step, A loop type including a through hole forming step of forming a plurality of through holes penetrating in the up and down direction in the upper plate, and an upper plate lower plate joining step of coupling the upper plate and the lower plate with through holes to form a coupling groove; Method of manufacturing an evaporator for a heat pipe system. 10. The method of claim 9, The wick coupling step, after placing the wick between the pins, by applying heat in a state in which the upper plate, the lower plate, the pin and the wick are mutually coupled, characterized in that the metallic coupling is made to the mutually contacting surface Method of manufacturing an evaporator for a loop heat pipe system. The method of claim 8, Wherein the coupling step, the forced pressing method for forcing the lower end of the shock by coupling to the coupling groove, the bonding method for bonding the lower end of the shock and the coupling groove with each other by an adhesive, by a soldering method, brazing Method for producing an evaporator for a loop type heat pipe system, characterized in that carried out by any one of the brazing method and the welding method. The method of claim 8, The wick is a wick formed by sintering metal powder, The wick coupling step, The wick is formed into a preform by applying at least one of heat and pressure to at least one of the molding material of the metal powder and the metal fiber, and the preform is formed to have a shape that can be sandwiched between the pins coupled to the metal plate. Formation Steps: Inserting the preform between the pins; Forming and bonding the preform and the fins to a sintering temperature, thereby forming the preform into a porous sintered wick and at the same time, allowing the interfacing surfaces of the wick and the fins to be bonded to each other; Method of manufacturing an evaporator for a loop type heat pipe system, characterized in that comprises a. The method of claim 8, In the wick coupling step, the wick is disposed between the fins, and then the metal plate, the fin and the wick are applied to each other by applying heat in a state where the wicks are connected to each other to form a loop type heat pipe system. Method for producing an evaporator for use. The method of claim 8, The 휜 coupling step and the wick coupling step, After inserting each pin into each coupling groove and placing the wick between the pins, the metal plate, the pins and the wicks are heated simultaneously, so that the metal bonds are made at the surface where they are in contact with each other. Method of manufacturing an evaporator for a loop heat pipe system.

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