201016416 六、發明說明： 【發明所屬之技術領域】 本發明係關於—種從工件（例如秒晶棒、化合物半導體 的晶棒等）切出多數片晶圓之工件的切斷方法及線蘇。 【先前技術】 以往，作為從石夕晶棒、化合物半導體的晶棒等切出晶 ⑩®的手段，已知有線雜。此線鑛，其切斷用鋼線多數次地 捲繞在複數個滾筒周圍而形成鋼線列，該切斷用鋼線往轴 方向被高速驅動，且一邊適當地供給聚液一邊對前述鋼線 歹J切入進給工件，藉此，各卫件可在各鋼線位置同時地被 切斷（參照日本特開平9_262826號公報）。 更詳細來說，在前述工件的側面的一部分，抵板黏著 在件的軸方向的大約整個區域上，用以保持此抵板的工 件板，藉由工件進給機構的工件保持部而被保持，在此狀 態下，工件全體被切入進給，於是切斷用鋼線由前述抵板 的相反側切入。此時，向鋼線列推壓工件的方向，已知有 將該工件從上方往鋼線列推壓的方法、以及從下方推壓的 '仁疋，半導體梦晶棒的切斷，主流是將該工件從上 方往鋼線列推壓的方法。 此處’在第4圖中，表示習用的一般線鑛的一例的概 要。 第4圖所示，此線錯ι〇1，主要是由用以切斷工件 W的鋼線102、捲繞有鋼線102之附凹溝滚筒1〇3、用以 201016416 賦予鋼線102張力的張力賦予機構1〇4、向下方饋送要被 切斷的工件W之馈送（進給）機構1〇5、以及於切斷時供給 漿液的漿液供給機構106所構成》 鋼線102 ’從一側的線揚轴（wjre reei) 1 〇7送出，經由 移車台（traverser) 108，再經過由粉粒離合器（（p〇wder clutch)定轉矩馬達1〇9 )或上下跳動滾筒（靜重（dead weight))(未圖示）等所組成的張力賦予機構丨〇4,進入 附凹溝滾筒103。鋼線1 〇2捲繞於此附凹溝滾筒1 〇3約3〇〇 〜400次之後’經過另一側的張力賦予機構丨〇4，而被捲繞 在線捲軸107’上。 又’附凹溝滾筒103,係在鋼鐵製圓筒的周邊壓入聚 胺酯樹脂，並於其表面以一定的節距切出凹溝的滾筒，捲 繞的鋼線102’可藉由驅動用馬達110，以預定的週期被 駆動，而在往復方向作移動。 另外’切斷工件w時，藉由第5圖所示的工件進給機 構105,工件W —邊被保持一邊被壓下，而向已捲繞於附 凹溝滾筒103上的鋼線102進給（推送）。此工件進給機構 105 ’具備.用以保持工件的工件保持部丨丨i、以及用以將 工件往下方進給的線性導軌112與工件進給本體部113， 利用電腦控制來使工件進給本體部丨丨3沿著線性導軌丄i 2 驅動，藉此，能以預先程式化的進給速度，將已被工件保 持部111保持的工件W推送。 另外，工件W被黏著於抵板114，又，此抵板114藉 由工件板115而被保持著。而且，通過這些抵板114、工 4 201016416 件板15，工件W被工件保持部i丨丨保持β 在第5圖的工件進給機構1〇5的例子中，抵板u4的 寬度，是形成比工件板115的寬度狹窄，但是，已知有一 種線鑛，其目的在於藉由增加抵板114的寬度，使工件板 115的侧緣部不會從抵板丨14的側面往外方突出來解決 因衝撞工件板115的側邊部的底面而彈回的漿液，碰撞切 斷中的晶圓而發生晶圓破裂這樣的問題（參照日本特開平 11-235653 號公報）。 m 但是’若大幅地增加抵板114的寬度，則工件ψ與抵 板114之間的黏著區域變大，而會有工件切斷後的晶圓與 抵板114的剝離變困難這樣的問題。 又’如第4圖所示，在附凹溝滾筒1〇3、捲繞的鋼線 102的附近，設有喷嘴117，於切斷時，可從漿液槽ι18 供給漿液至鋼線102上。又，漿液槽118可與漿液冷卻器 116連接，以調整所供給的漿液的溫度。 利用如此的線鋸101，且利用鋼線張力賦予機構1〇4， ® 賦予鋼線102適當的張力，並藉由驅動用馬達110，使鋼 線102 —邊往復方向地行進’一邊利用工件進給機構1〇5 來將工件切入進給，以此方式進行切片。 然而’若利用上述一般的線鋸，將工件切斷成晶圓狀， 然後調査被切斷的晶圓的形狀之後，則發現產生大的翹 曲。翹曲係半導體晶圓的切斷中的重要品質考量因素之 一，隨著製品的品質要求提高，而有更加地降低的要求。 5 201016416 【發明内容】 ^ 本發月人，詳細地調查切斷後的晶圓的形狀之 後得*特别是在切斷後半部，翹曲顯著地惡化。 為了調查此魅曲惡化的原因，觀察了切斷中的工件的 狀態漿液向工件切斷部的供給是一邊從鋼線列的上方 洗上聚液，—邊在軸方向以高逮㈣鋼線，藉此而往工件 側方位置進行供給。此時，已知··附著在鋼線上而被運至 工件的切斷部附近的漿液，幾乎都會在鋼線進入工件的進 入部，衝撞工件的側面’而往工件的外側飛散。 此處，例如工件是半導體梦晶棒這樣的圓柱形狀的情 況’當切斷工件中央以後的部位時，漿液會往卫件的上方 飛散。特別是在切斷後半部，已知·切斷部與工件保持部 之間的距離變小’從工件飛散出來的漿液，會在工件保持 部的下端面彈回’而激烈地往卫件和鋼線落下。 亦即，明碟地得知：在切斷後半部，勉曲顯著地惡化 的原因’是由於衝撞工件的側面而飛散的漿液，在工件保 持部的下端面彈回’而激烈地往卫件和鋼料下於是工 件被切斷而成為晶圓狀的部分和鋼線等發生搖動的緣故。 本發明係有鑑於上述問題而開發出來，其目的係提供 一種工件㈣斷方法及祕，在_後半部，對於從工件 飛散出來的聚液，在卫件保持部的下端面彈回而激烈地 往工件和鋼線落下的情況’能加以抑制，其結果能改善 切斷的晶圓的翹曲情況。 為了達成上述目的，若根據本發明，提供一種工件的 201016416 切斷方法，是使捲繞在複數個附凹溝滾筒上的鋼線，於軸 方向作往復行進，並將抵板黏著在要切斷的工件上，經由 用以保持該抵板之工件板，而藉由工件保持部來保持前述 工件，且一邊從喷嘴供給漿液至前述鋼線上，一邊相對地 壓下藉由前述工件保持部保持的前述工件，使其壓抵作往 復行進的前述鋼線來進行切入進給，而將前述工件切斷成 晶圓狀的方法，其特徵在於： 將則述工件保持部的下端面與前述工件的上端之間的 距離設為40min以上，來切斷前述工件。 如此，若使前述工件保持部的下端面與前述工件的上 端之間的距離為40mm以上，來切斷前述工件，則特別是 在切斷後半中，對於從工件飛散出來的漿液，在工件保持 部的下端面彈回，而激烈地往工件和鋼線落下的情況能 加以抑制》其結果’能改善切斷的晶圓的翹曲情況。 此時，前述抵板的寬度（橫寬），較佳是前述工件的直 徑的1 / 2以下。 如此，若將前述抵板的寬度設為前述工件的直徑的ι/2 以下，則能縮小工件與抵板的黏著區域，而使工件切斷後 的晶圓與抵板的剝離，能容易地進行而不會使晶圓破損。 又，若根據本發明，提供一種線鋸，是至少具備·•鋼 線，其捲繞在複數個附凹溝滾筒上，並於轴方向作往復行 進，·喷嘴，其對該鋼線供給漿液；以及工件進給機構，其 經由被黏著在要被切斷的工件上之抵板與用以保持該抵 板之工件板，一邊保持前述工件一邊將該工件相對地麼下 201016416 而往前述鋼線進給；而且，—噙〜# 邊從前述喷嘴供給漿液至前 :鋼線上’-邊使藉由前述工件進給機構而保持的前述工 壓抵作往復行進的前述鋼線來進行切人進給，而將前 述工件切斷成晶圓狀的線鋸，其特徵在於： 前述工件進給機構，具“件保㈣，並藉由該工件 保持部’經由前㈣板與前^件板，來㈣前述工件； 參 並且’前述工件保持部的下端面與前述工件的上端之 間的距離，是40mm以上。 如此，前述工件進給機構，若是具有工件保持部，並 藉由該工件保持部’經由前述抵板與前述卫件板，來保持 前述工件’並且，前述卫件保持部的下端面與前述工件的 上端之間的距離，I 4〇mm以上，則對於從工件飛散出來 的漿液’在工件保持部的下端面彈回，而激烈地往工件和 鋼線落下的情況，能加以抑制。其結果，能改 圓的翹曲情況。 此時，前述抵板的寬度，較佳是前述工件的直徑 以下。 如此，前述抵板的寬度，若是前述工件的直徑的1/2 以下，則能縮小工件與抵板的黏著區域，而使工件切斷後 的晶圓與抵板的剝離’能容易地進行而不會使晶固破損。 本發明的線鋸，由於將工件保持部的下端面與工件的 上端之間的距離設為40fflm以上，來切斷工件，所以對於 從工件飛散出來的漿液’在工件保持部的下端面彈回而 激烈地往工件和鋼線落下的情況，能加以抑制。其結果， 8 201016416 能改善切斷的晶圓的龜曲情況。 【實施方式】 以下，說明關於本發明的實施形態，但本發明不限 於此實施形態。 定: 若使用習知的一般線鋸來將工件切斷成晶圓狀，並調 查該被切斷後的晶圓的形狀，則會產生大的翹曲。翹曲係 半導體晶圓的切斷中的重要品質考量因素之一，隨著製品 的品質要求提高，而希望能更進一步地降低。 因此，本發明人為了解決此種問題，詳細地調查切斷 後的晶圓的形狀時，發現特別是在工件的切斷後半部，翹 曲會顯著地惡化。進而進行調查、檢討後的結果，明確地 得知：在工件的切斷後半部’輕曲顯著地惡化的原因，是 由於衝撞工件的側面而飛散的衆液，在工件保持部的下端 面彈回，而激烈地往工件和鋼線落下，於是工件被切斷而 _成為晶圓狀的部分和鋼線等發生搖動的緣故。 而且，想到了若增加工件保持部的下端面與工件的上 端之間的距離，來進行工件的切斷，則能抑制上述般的切 斷後半部中的起曲情況的惡化，並且關於卫㈣㈣的下 端面與工件&上端之間的最佳距離，進行實驗且仔細調 查’而完成本發明。 第1圖係表示本發明的線鋸的一例的概略圖。 如第1圖所示，本發明的線鋸1，主要係由用以切斷 件W的鋼線2、捲繞有鋼線2之附凹溝滾筒3、用以施 201016416 予鋼線2張力的鋼線張力賦予機構4、將要切斷的工件w 向下方進給的工件進給機構5、以及於切斷時供給聚液的 漿液供給機構6所構成》 鋼線2 ’係從一侧的線捲軸7送出，經由移車台8，再 經過由粉粒離合器（定轉矩馬達9)或上下跳動滾筒（靜重 (dead weight))(未圖示）等所組成的鋼線張力賦予機構 4’進入附凹溝滾筒3。鋼線2,藉由捲繞於此附凹溝滚筒 3約300〜400次，而形成鋼線列。鋼線2經過另一側的鋼 線張力賦予機構4’而被捲繞在線捲轴7,上。 在第2圓中’表示可用於本發明的線鋸中的工件進給 機構的一例。如第2圖所示，工件W係黏著於抵板14上； 又，此抵板14係藉由黏著於工件板15或是夾具而被保 持。而且’工件W係隔著這些的抵板14、工件板15，藉 由工件保持部11而被保持。 又’工件板15的寬度（橫寬），大致與抵板14的寬度 相同。 如此’若工件板15的寬度，大致與抵板14的寬度相 同，則能一邊保持工件板15與抵板14的保持力，一邊防 止從工件W飛散出來的漿液在工件板15的下端面彈回而 往工件W和鋼線2落下。 此工件進給機構5,係具備用以一邊保持工件w —邊 ，下壓的工件保持部丨丨、線性導轨12以及工件進給本體 13 ’ U電腦控制’沿著線性導軌12，經由工件進給本 體邻13,驅動工件保持部u，藉此可依預先程式化的進 10 201016416 給速度’將保持著的工件w推送。201016416 VI. Description of the Invention: [Technical Field] The present invention relates to a cutting method and a wire for cutting a workpiece of a plurality of wafers from a workpiece (for example, a second ingot, a crystal ingot of a compound semiconductor, or the like). [Prior Art] Conventionally, as a means for cutting out the crystal 10® from a quartz crystal rod or a crystal ingot of a compound semiconductor, a wire miscellaneous material is known. In this line, the steel wire for cutting is wound around a plurality of rolls many times to form a steel wire row, and the steel wire for cutting is driven at a high speed in the axial direction, and the steel is supplied to the steel while appropriately supplying the liquid. The wire 歹 J cuts into the feed workpiece, whereby each of the guard members can be simultaneously cut at the position of each steel wire (refer to Japanese Laid-Open Patent Publication No. Hei 9-262826). More specifically, in a portion of the side surface of the workpiece, the resisting plate is adhered to approximately the entire area of the axial direction of the member, and the workpiece plate for holding the resisting plate is held by the workpiece holding portion of the workpiece feeding mechanism. In this state, the entire workpiece is cut into the feed, and the steel wire for cutting is cut in from the opposite side of the abutting plate. In this case, the direction in which the workpiece is pressed against the steel wire row is known, and a method of pressing the workpiece from the upper side to the steel wire column and a process of pressing the semiconductor core bar from the lower side are known. A method of pushing the workpiece from the top to the steel line. Here, in Fig. 4, an outline of an example of a conventional general line mine is shown. As shown in Fig. 4, this line is ι〇1, mainly by the steel wire 102 for cutting the workpiece W, the grooved roller 1〇3 wound with the steel wire 102, and the tension of the steel wire 102 for 201016416. The tension applying mechanism 1〇4, the feeding (feeding) mechanism 1〇5 for feeding the workpiece W to be cut downward, and the slurry supply mechanism 106 for supplying the slurry at the time of cutting constitute the "steel line 102' from one The side of the wire shaft (wjre reei) 1 〇7 is sent out, via the traverser 108, and then through the powder clutch ((p〇wder clutch) torque motor 1〇9) or the drum up and down (static weight) The tension applying mechanism 组成4 composed of (dead weight) (not shown) enters the grooved roller 103. The steel wire 1 〇 2 is wound around the grooved roller 1 〇 3 about 3 〇〇 to 400 times, and then passes through the tension applying mechanism 丨〇 4 on the other side, and is wound on the wire reel 107'. Further, the grooved roller 103 is a roller which presses a polyurethane resin around a steel cylinder and cuts a groove at a certain pitch on the surface thereof, and the wound steel wire 102' can be driven by a motor. 110, being pulsating at a predetermined cycle and moving in a reciprocating direction. Further, when the workpiece w is cut, the workpiece W is pressed while being held while being held by the workpiece feeding mechanism 105 shown in Fig. 5, and is fed to the steel wire 102 that has been wound around the grooved roller 103. Give (push). The workpiece feeding mechanism 105' is provided with a workpiece holding portion 丨丨i for holding the workpiece, and a linear guide 112 for feeding the workpiece downward and a workpiece feeding body portion 113, and the workpiece is fed by computer control. The main body portion 3 is driven along the linear guide 丄i 2 , whereby the workpiece W held by the workpiece holding portion 111 can be pushed at a pre-programmed feed speed. Further, the workpiece W is adhered to the resisting plate 114, and this resisting plate 114 is held by the workpiece plate 115. Further, the workpiece W is held by the workpiece holding portion i by the resisting plate 114 and the workpiece 4 201016416, and in the example of the workpiece feeding mechanism 1A5 of Fig. 5, the width of the plate u4 is formed. The width of the workpiece plate 115 is narrower than that of the workpiece plate 115. However, a wire mine is known, and the purpose is to prevent the side edge portion of the workpiece plate 115 from protruding outward from the side surface of the platen 14 by increasing the width of the plate 114. The slurry which is bounced back by the bottom surface of the side portion of the workpiece plate 115 collides with the wafer being cut and the wafer is broken. (refer to Japanese Laid-Open Patent Publication No. Hei 11-235653). However, if the width of the resisting plate 114 is greatly increased, the adhesion area between the workpiece ψ and the resisting plate 114 becomes large, and the peeling of the wafer and the resisting plate 114 after the workpiece is cut becomes difficult. Further, as shown in Fig. 4, a nozzle 117 is provided in the vicinity of the grooved roller 1〇3 and the wound steel wire 102, and the slurry can be supplied from the slurry tank ι18 to the steel wire 102 at the time of cutting. Further, a slurry tank 118 can be coupled to the slurry cooler 116 to adjust the temperature of the supplied slurry. With such a wire saw 101, the steel wire tension applying mechanism 1〇4, ® is given an appropriate tension to the steel wire 102, and the steel wire 102 is moved in the reciprocating direction by the driving motor 110. The mechanism is sliced by feeding the workpiece 1〇5 into the feed. However, when the workpiece was cut into a wafer shape by the above-described general wire saw, and then the shape of the cut wafer was examined, it was found that large warpage occurred. One of the important quality considerations in the warpage of warpage semiconductor wafers is that as the quality requirements of the products are increased, there is a lower demand. 5 201016416 [Description of the Invention] ^ The person in charge of this month has inspected the shape of the wafer after cutting in detail. * Especially in the latter half of the cutting, the warpage is remarkably deteriorated. In order to investigate the cause of the deterioration of the charm, the state of the workpiece being cut is observed. The supply of the slurry to the workpiece cutting portion is to wash the liquid from the upper side of the steel line, and the steel wire is caught in the axial direction. Thereby, the supply is performed to the side position of the workpiece. At this time, it is known that the slurry adhering to the steel wire and transported to the vicinity of the cut portion of the workpiece almost collides with the side of the workpiece and enters the side of the workpiece and scatters toward the outside of the workpiece. Here, for example, when the workpiece is a cylindrical shape such as a semiconductor dream crystal rod, when the portion after the center of the workpiece is cut, the slurry is scattered above the guard. In particular, in the second half of the cutting, it is known that the distance between the cutting portion and the workpiece holding portion becomes small, and the slurry that has been scattered from the workpiece will bounce back on the lower end surface of the workpiece holding portion, and the guard member and the member will be violently The steel wire fell. In other words, it is known from the open disc that the reason why the distortion is remarkably deteriorated in the latter part is that the slurry which is scattered by the side surface of the workpiece is bounced back on the lower end surface of the workpiece holding portion, and the member is violently defended. Under the steel material, the workpiece is cut into a wafer-like portion, and the steel wire or the like is shaken. The present invention has been developed in view of the above problems, and an object thereof is to provide a workpiece (four) breaking method and secret. In the latter half, the liquid collected from the workpiece rebounds at the lower end surface of the guard holding portion and is intensely The case where the workpiece and the steel wire are dropped can be suppressed, and as a result, the warpage of the cut wafer can be improved. In order to achieve the above object, according to the present invention, a 201016416 cutting method for a workpiece is provided in which a steel wire wound on a plurality of grooved grooves is reciprocated in the axial direction and the plate is adhered to be cut. The workpiece is held by the workpiece holding portion via the workpiece holding portion, and the workpiece is held by the workpiece holding portion, and the slurry is supplied from the nozzle to the steel wire while being relatively pressed by the workpiece holding portion. The method of cutting the workpiece into a wafer shape by pressing the workpiece into a wafer shape by reciprocating the steel wire, wherein the lower end surface of the workpiece holding portion and the workpiece are The distance between the upper ends is set to 40 min or more to cut off the aforementioned workpiece. When the distance between the lower end surface of the workpiece holding portion and the upper end of the workpiece is 40 mm or more to cut the workpiece, the slurry which is scattered from the workpiece is held in the workpiece, particularly in the second half of the cutting. The lower end of the part bounces back, and the situation of drastically dropping the workpiece and the steel wire can be suppressed. "The result" can improve the warpage of the cut wafer. In this case, the width (width) of the abutting plate is preferably 1/2 or less of the diameter of the workpiece. When the width of the abutting plate is ι/2 or less of the diameter of the workpiece, the adhesion between the workpiece and the resisting plate can be reduced, and the peeling of the wafer and the resisting plate after the workpiece is cut can be easily performed. Without breaking the wafer. Further, according to the present invention, there is provided a wire saw comprising at least a steel wire wound around a plurality of grooved drums and reciprocating in an axial direction, and a nozzle for supplying a slurry to the steel wire And a workpiece feeding mechanism that passes the workpiece adhered to the workpiece to be cut and the workpiece plate for holding the sheet, while holding the workpiece while the workpiece is relatively facing the next steel 201016416 Line feed; and - 噙~# while feeding the slurry from the nozzle to the front: the steel line '- while the aforementioned work pressure held by the workpiece feed mechanism is pressed against the aforementioned steel wire for reciprocating travel Feeding the wire saw with the workpiece cut into a wafer shape, characterized in that: the workpiece feeding mechanism has a "part guarantee (4), and the front holding member is passed through the front (four) plate and the front plate (4) the aforementioned workpiece; the distance between the lower end surface of the workpiece holding portion and the upper end of the workpiece is 40 mm or more. Thus, the workpiece feeding mechanism has the workpiece holding portion and is held by the workpiece unit The distance between the lower end surface of the guard holding portion and the upper end of the workpiece, and the distance between the lower end of the workpiece holding portion and the upper end of the workpiece via the abutting plate and the guard plate, is the slurry that is scattered from the workpiece. When the lower end surface of the workpiece holding portion is springed back and the workpiece and the steel wire are drastically dropped, it can be suppressed. As a result, the warpage of the round can be corrected. In this case, the width of the abutting plate is preferably the aforementioned. In this case, if the width of the abutting plate is less than 1/2 of the diameter of the workpiece, the adhesion between the workpiece and the plate can be reduced, and the wafer and the plate can be peeled off after the workpiece is cut. The wire saw of the present invention cuts off the workpiece by setting the distance between the lower end surface of the workpiece holding portion and the upper end of the workpiece to 40 fflm or more, so that the wire saw is scattered from the workpiece. When the slurry 'bounces back on the lower end surface of the workpiece holding portion and is drastically dropped toward the workpiece and the steel wire, it can be suppressed. As a result, 8 201016416 can improve the tortuosity of the cut wafer. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described. However, the present invention is not limited to the embodiment. Note: When a workpiece is cut into a wafer using a conventional wire saw, the cut crystal is investigated. In the shape of a circle, large warpage is generated. One of the important quality considerations in the cutting of the warpage semiconductor wafer is expected to be further lowered as the quality requirements of the product are improved. In order to solve such a problem, when the shape of the wafer after the cutting was examined in detail, it was found that the warpage was remarkably deteriorated particularly in the second half of the cutting of the workpiece. The results of the investigation and review were clearly known. : The reason why the lightness of the second half of the workpiece is significantly deteriorated is that the liquid that has smashed against the side surface of the workpiece bounces back at the lower end surface of the workpiece holding portion, and is drastically dropped toward the workpiece and the steel wire. The workpiece is cut and the wafer-shaped portion and the steel wire are shaken. Further, it is conceivable that if the distance between the lower end surface of the workpiece holding portion and the upper end of the workpiece is increased to cut the workpiece, the deterioration of the curve in the second half of the cutting can be suppressed, and the guard (4) (4) The present invention was completed by experimenting with an optimum distance between the lower end surface and the upper end of the workpiece & Fig. 1 is a schematic view showing an example of a wire saw of the present invention. As shown in Fig. 1, the wire saw 1 of the present invention is mainly composed of a steel wire 2 for cutting the member W, a grooved roller 3 for winding the steel wire 2, and a tension for applying the 201016416 steel wire 2 The steel wire tension applying mechanism 4, the workpiece feeding mechanism 5 that feeds the workpiece w to be cut downward, and the slurry supply mechanism 6 that supplies the liquid at the time of cutting are composed of the steel wire 2' from one side. The wire reel 7 is fed out, passes through the transfer table 8, and passes through the wire tension applying mechanism 4 composed of a powder clutch (fixed torque motor 9) or a vertical bounce roller (dead weight) (not shown). 'Enter the grooved roller 3. The steel wire 2 is formed by winding the grooved roller 3 about 300 to 400 times to form a steel wire train. The steel wire 2 is wound around the wire reel 7 through the wire tension applying mechanism 4' on the other side. In the second circle, 'an example of a workpiece feeding mechanism that can be used in the wire saw of the present invention. As shown in Fig. 2, the workpiece W is adhered to the resisting plate 14, and the resisting plate 14 is held by being adhered to the workpiece plate 15 or the jig. Further, the workpiece W is held by the workpiece holding portion 11 via the resist plate 14 and the workpiece plate 15. Further, the width (width) of the workpiece plate 15 is substantially the same as the width of the abutting plate 14. When the width of the workpiece plate 15 is substantially the same as the width of the abutting plate 14, the slurry which is scattered from the workpiece W can be prevented from being bounced on the lower end surface of the workpiece plate 15 while maintaining the holding force of the workpiece plate 15 and the resisting plate 14. The workpiece W and the steel wire 2 are dropped back. The workpiece feeding mechanism 5 is provided with a workpiece holding portion 下, a linear guide 12, and a workpiece feeding body 13 'U computer control' along the linear guide 12 through the workpiece while holding the workpiece w side. The feed body adjacent 13 drives the workpiece holding portion u, whereby the workpiece w that is held at the speed can be pushed according to the pre-programmed advance 10 201016416.
而且，如此地藉由工件進給機構5的工件保持部U 而被保持的X件W ’當進行切斷時，藉由工件進給機構$， 往位於下方的鋼線2進給。又，此工件進給機構5，藉由 將工件w往下方推壓’直到鋼線到達抵板14為止，而使 工件W壓抵鋼線2來進行切入進給。而且，完成工件的 切斷之後’藉由逆轉件的推送方向將切斷結束的工件 W從鋼線列拔出。 此處，在第2圖所示的工件進給機構5的例子中，是 將工件W往下方壓下來進行切入進給，但是在本發明中， 工件的饋送（進給），只要是藉由相對地壓下來進行即可。 亦即’也可以是成為不將工件w往下方進給*是藉由 將鋼線列往上方推壓來進行工件w的饋送這樣的構成。 又，附凹溝滾筒3,係在鋼鐵製圓筒的周邊壓入聚胺 酯樹脂，並於其表面以一定的節距切出凹溝而成的滾筒， 如第1圖所示，捲繞的鋼線2,可藉由驅動用馬達1〇來驅 動，而在往復方向作移動（運動卜而且，在切斷工件時， 藉由鋼線張力賦予機構4，可對鋼線2賦予適當的張力。 又，喷嘴17係被配置在鋼線2的上方，該鋼線2係被 捲繞於附凹溝滾筒3上，在切斷時，於轴方向作往復行進； 當進行工件W的切斷時’可供給漿液至鋼線2上。 此處’敘述有關聚液供給機構6，亦即供給漿液至附 凹溝滾筒3(鋼線2)上的手段。此漿液供給手段6中， 從漿液槽18，經由漿液冷卻器16，連接至喷嘴17 ;要被 201016416 供給的漿液，係藉由漿液冷卻器16而被控制供給溫度， 然後從喷嘴17供給至附凹溝滾筒3 (鋼線2)上。但是’， 其構成並未限定於此種，例如也可以藉由構成另外的熱交 換器’來進行調整衆液的供給溫度。 ' 又，此處，所使用的漿液的種類並無特別限定可使 與習知相同的漿液’例如可為將GC (碳切）磨粒 於液趙而成者。 ❿ 巾且’本發明的線鑛1，如第2圖所示，工件保持部 11的下端面與工件W的上端之間的距離H，是調整成 40mm以上。 此處，工件保持部u的下端面與工件w的上端之間 的距離Η的調整，例如能藉由調整工件板15的厚度來進 行。 如此，在線鋸1中，若工件保持部丨丨的下端面與工件 w的上端之間的距離Η成為40mm以上，則特別是在切斷後 φ 半中，對於從工件飛散出來的漿液，在工件保持部11的 下端面彈回，而激烈地往工件w和鋼線2落下的情況，能 加以抑制，其結果，能改善切斷的晶圓的翹曲情況。 此時，抵板14的寬度（橫寬），較佳是工件w的直徑 的1/2以下。 作為用以抑制在工件w的側面飛散出來的漿液所造 成的影響，已知有將抵板14的寬度設為工件的直徑的 以上的方法。如習知的方法所示，若將抵板14的寬度設 為工件的直徑的1 /2以上，則雖然能抑制從工件板1 $和工 12 201016416 件保持部11等處彈回來的漿液往工件w落下的情況，但 是工件W與抵板14的黏著區域變大，工件切斷後的晶圓 與抵板14的剝離變困難，而有使晶圓破損的可能性。 但是，若是根據本發明，將抵板14的寬度設為工件w 的直徑的1/2以下’理想是設為在切斷工件w時可安全地 懸吊該工件W的最小寬度，來縮小工件W與抵板14的黏 著區域’而使工件切斷後的晶圓與抵板14的剥離，能容 易地進行而不會使晶圓破損，並將工件保持部u的下端 面與工件的上端之間的距離設為40mm，藉此，能抑制從 工件板15和工件保持部η等處彈回的聚液往工件贾激 烈地落下的情況。 接著’說明有關本發明的工件的切斷方法。此處，敘 述關於使用第1圖、第2圖所示的線鋸1、工件進給機構 5的情況的切斷方法。 首先’如第2圖所示’將抵板14黏著於工件w上， 並藉由工件板15來保持該抵板14 〇而且，經由這些抵板 、工件板15 ’並藉由工件保持部11來保持工件w。 此時’工件保持部11的下端面與工件w的上端之間 的距離Η，是調整成40mm以上。 此種工件保持部丨1的下端面與工件w的上端之間的 距離Η的調整，例如能藉由調整工件板15的厚度來進行。 或是’也可以調整抵板14的厚度來進行。 而且’對鋼線2賦予張力並使其往轴方向作往復行 13 201016416 進，且藉由漿液供給機構6來向鋼線2供給漿液，在此狀 態下，沿著工件進給機構5的線性導軌12，並經由工件進 給本體部13來驅動工件保持部u，而使工件w下降，藉 此，相對於鋼線列，將工件W切入進給來切斷工件 如此，若以使工件保持部U的下端面與工件w的上 端之間的距離Η成為40mm以上的方式，來切斷工件w , 則在切斷後半中，對於從工件W飛散出來的漿液，在工件 保持部11的下端面彈回，而激烈地往工件w和鋼線2落 下的情況，能加以抑制。其結果，能改善切斷的晶圓的翹 曲情況。 此處，使用第2圖所示的線鋸的工件進給機構，以將 工件往下方進給的方式來進行切入進給，但是有關本發明 的工件的切斷方法’並不被限定於此種情況，工件的饋送 (進給）只要是藉由相對地壓下來進行即可。亦即，也可以 不將工件W往下方進給，而是藉由將鋼線列往上方推壓 來進行工件W的饋送。 此處’賦予鋼線2的張力的大小、鋼線2的行進速度 等，能適當地設定。例如，能將鋼線的行進速度設為4〇〇 〜800m/min。又，相對於鋼線列，能將切入進給時的 切入進給速度，設為0.2〜0.4mm/min。這些條件並未被限 定。 又’此處’雖然沒有特別地限定，在工件切斷時，使 鋼線2作往復行進時的鋼線反轉週期，例如能設為6〇s。 又’作為在切斷時供給至鋼線2上的漿液，例如能採用一 201016416 種將GC#1000與冷卻液、、宅人=上、t 及屈•合而成的漿液’其重量比例如能 設為50: 50。又，漿潘沾卞立从 艰履的溫度能設為15〇c〜3(rc。 如此’工件W的切斷括接 』得續進饤’當鋼線列到達工件w 的上面的抵板14為止的拄B _ L , 的時點，亦即完成工件W的切斷 時，藉由使工件w的館谈古Α β Μ 一，办 ^ J傾达方向逆轉’可將切斷後的工件w 從鋼線列拔出。 此時，較佳是將抵板14的寬度設為工件|的直徑的 1/2以下。 如此，若將抵板14的寬度設為工件贾的直徑的1/2 以下，則能縮小工件W與抵板14的黏著區域，而使工件 W切斷後的晶圓與抵板14的剝離，能容易地進行且不會 使晶圓破損。 如以上所述，本發明的線鋸，由於是將工件保持部的 下端面與工件的上端之間的距離設為40mm以上，以此方 式來切斷工件’所以對於從工件飛散出來的漿液，在工件 保持部的下端面彈回’而激烈地往工件和鋼線落下的情 況’能加以抑制。其結果，能改善切斷的晶圓的翹曲情況。 以下’表示本發明的實施例及比較例，更具體地說明 本發明，但本發明不限定於這些例子。 (實施例） 使用第1圖所示的本發明的線鑛，以表1所示的條件， 藉由本發明的切斷方法，將直徑300mm、軸方向長度 300mm的矽晶棒切斷成晶圓狀。使用第2圖所示的工件進 15 201016416 給機構，並將工件保持部的下端面與工件的上端之間的距 離H’藉由改變工件板的厚度，而在4〇〜1〇〇mm之間作 變化，然後比較各個情形的切斷後的晶圓的翹曲情況。並 將工件板的寬度設為1〇〇mm、將抵板的寬度設為9〇瓜爪。 將其結果表示於第3圖中。 [表1]Further, when the X piece W' held by the workpiece holding portion U of the workpiece feeding mechanism 5 is cut, the workpiece feeding mechanism $ is fed to the steel wire 2 located below. Further, the workpiece feeding mechanism 5 presses the workpiece w downward until the steel wire reaches the resisting plate 14, and the workpiece W is pressed against the steel wire 2 to perform the cutting feed. Further, after the cutting of the workpiece is completed, the workpiece W whose cutting is completed is pulled out from the steel wire row by the pushing direction of the reverse member. Here, in the example of the workpiece feeding mechanism 5 shown in Fig. 2, the workpiece W is pressed downward to perform the plunging feed, but in the present invention, the feeding (feeding) of the workpiece is performed by Press it down relatively. In other words, it is possible to prevent the workpiece w from being fed downward by pushing the steel wire to the upper side to feed the workpiece w. Further, the grooved roller 3 is a roller obtained by pressing a polyurethane resin around a steel cylinder and cutting a groove at a constant pitch on the surface thereof, as shown in Fig. 1, the wound steel The wire 2 can be driven in the reciprocating direction by being driven by the driving motor 1 (moving), and when the workpiece is cut, the steel wire 2 can be appropriately tensioned by the wire tension applying mechanism 4. Further, the nozzle 17 is disposed above the steel wire 2, and the steel wire 2 is wound around the grooved roller 3, and reciprocates in the axial direction at the time of cutting; when the workpiece W is cut 'The slurry can be supplied to the steel wire 2. Here, the means for supplying the slurry to the grooved drum 3 (steel wire 2) is described. The slurry supply means 6 is from the slurry tank. 18, via a slurry cooler 16, connected to the nozzle 17; the slurry to be supplied by 201016416 is controlled to supply temperature by the slurry cooler 16, and then supplied from the nozzle 17 to the grooved drum 3 (steel wire 2) However, the composition is not limited to this, for example, it can also constitute another heat In addition, the type of the slurry to be used is not particularly limited, and the slurry which is the same as the conventional one can be formed by, for example, grinding GC (carbon cut) into liquid Zhao. As shown in Fig. 2, the distance H between the lower end surface of the workpiece holding portion 11 and the upper end of the workpiece W is adjusted to 40 mm or more. Here, the workpiece holding portion The adjustment of the distance Η between the lower end surface of the u and the upper end of the workpiece w can be performed, for example, by adjusting the thickness of the workpiece plate 15. Thus, in the wire saw 1, if the lower end surface of the workpiece holding portion 与 and the workpiece w When the distance Η between the upper ends is 40 mm or more, the slurry which has been scattered from the workpiece rebounds on the lower end surface of the workpiece holding portion 11 in the φ half after the cutting, and the workpiece w and the steel wire 2 are drastically dropped. In this case, it is possible to suppress the warpage of the cut wafer. As a result, the width (width) of the resisting plate 14 is preferably 1/2 or less of the diameter of the workpiece w. In order to suppress the slurry which is scattered on the side of the workpiece w The influence of the width of the abutting plate 14 is set to be equal to or greater than the diameter of the workpiece. As shown in the conventional method, if the width of the abutting plate 14 is 1 /2 or more of the diameter of the workpiece, It is possible to suppress the slurry which is bounced from the workpiece holding plate 11 and the workpiece 12 and the 161641616 holding portion 11 to the workpiece w, but the adhesion area between the workpiece W and the abutting plate 14 becomes large, and the wafer and the plate after the workpiece is cut off The peeling of 14 becomes difficult, and there is a possibility of damaging the wafer. However, according to the present invention, the width of the resisting plate 14 is 1/2 or less of the diameter of the workpiece w. The minimum width of the workpiece W can be safely suspended to reduce the adhesion area of the workpiece W and the resisting plate 14 and the peeling of the wafer and the resisting plate 14 after the workpiece is cut can be easily performed without the wafer The damage is made, and the distance between the lower end surface of the workpiece holding portion u and the upper end of the workpiece is set to 40 mm, whereby the liquid which bounces off from the workpiece plate 15 and the workpiece holding portion η and the like can be suppressed from falling to the workpiece Jia. Case. Next, the cutting method of the workpiece according to the present invention will be described. Here, a cutting method for using the wire saw 1 and the workpiece feeding mechanism 5 shown in Figs. 1 and 2 will be described. First, as shown in Fig. 2, the resisting plate 14 is adhered to the workpiece w, and the resisting plate 14 is held by the workpiece plate 15, and through the resisting plate, the workpiece plate 15' and by the workpiece holding portion 11 To keep the workpiece w. At this time, the distance Η between the lower end surface of the workpiece holding portion 11 and the upper end of the workpiece w is adjusted to 40 mm or more. The adjustment of the distance Η between the lower end surface of the workpiece holding portion 丨1 and the upper end of the workpiece w can be performed, for example, by adjusting the thickness of the workpiece plate 15. Alternatively, the thickness of the plate 14 can be adjusted. Further, 'the steel wire 2 is tensioned and made to reciprocate in the axial direction 13 201016416, and the slurry is supplied to the steel wire 2 by the slurry supply mechanism 6, in this state, the linear guide along the workpiece feeding mechanism 5 12, and the workpiece holding portion u is driven by the workpiece feeding body portion 13, and the workpiece w is lowered, whereby the workpiece W is cut into the feed line to cut the workpiece with respect to the steel line row, so that the workpiece holding portion is made When the distance Η between the lower end surface of the U and the upper end of the workpiece w is 40 mm or more, the workpiece w is cut, and the slurry which is scattered from the workpiece W in the second half of the cutting is at the lower end surface of the workpiece holding portion 11. When it bounces back and violently falls to the workpiece w and the steel wire 2, it can be suppressed. As a result, the warpage of the cut wafer can be improved. Here, the workpiece feeding mechanism of the jigsaw shown in FIG. 2 performs the cutting feed in such a manner that the workpiece is fed downward, but the cutting method of the workpiece according to the present invention is not limited thereto. In this case, the feeding (feeding) of the workpiece may be performed by relatively pressing down. That is, the workpiece W may be fed without pushing the workpiece W downward, but by pushing the steel wire upward. Here, the magnitude of the tension applied to the steel wire 2, the traveling speed of the steel wire 2, and the like can be appropriately set. For example, the traveling speed of the steel wire can be set to 4 〜 to 800 m/min. Further, with respect to the steel wire row, the cutting feed speed at the time of the cutting feed can be set to 0.2 to 0.4 mm/min. These conditions are not limited. Further, the term "herein" is not particularly limited, and the steel wire inversion cycle when the steel wire 2 is reciprocated during the cutting of the workpiece can be set, for example, to 6 〇s. Further, as the slurry supplied to the steel wire 2 at the time of cutting, for example, a 201016416 type of slurry obtained by mixing GC#1000 with a coolant, a houseman, a top, and a t Can be set to 50: 50. In addition, the temperature of the slabs can be set to 15 〇 c 〜 3 (rc. So the 'cutting and splicing of the workpiece W' can be continued 饤' when the steel line reaches the upper plate of the workpiece w When the 拄B _ L of 14 is completed, that is, when the workpiece W is cut, the workpiece W can be reversal by reversing the workpiece. In this case, it is preferable to set the width of the abutting plate 14 to 1/2 or less of the diameter of the workpiece|. Thus, if the width of the abutting plate 14 is 1/2 of the diameter of the workpiece Jia. Hereinafter, the adhesion area between the workpiece W and the resisting plate 14 can be reduced, and the peeling of the wafer and the resisting plate 14 after the workpiece W is cut can be easily performed without causing damage to the wafer. As described above, the present invention The wire saw is used to cut the workpiece in such a manner that the distance between the lower end surface of the workpiece holding portion and the upper end of the workpiece is 40 mm or more. Therefore, the slurry which is scattered from the workpiece is at the lower end surface of the workpiece holding portion. The case of bounce back 'and drastically drop to the workpiece and the steel wire' can be suppressed. As a result, the cut wafer can be improved. The present invention will be described more specifically by the following examples and comparative examples of the present invention, but the present invention is not limited to these examples. (Example) Using the wire ore of the present invention shown in Fig. 1 According to the cutting method of the present invention, a twin rod having a diameter of 300 mm and an axial length of 300 mm is cut into a wafer shape by using the cutting method of the present invention. The workpiece shown in Fig. 2 is used to feed the mechanism into the 15 201016416, and The distance H' between the lower end surface of the workpiece holding portion and the upper end of the workpiece is changed between 4 〇 1 〇〇 1 mm by changing the thickness of the workpiece plate, and then the warpage of the cut wafer after each case is compared. In the case of the curve, the width of the workpiece plate is set to 1 mm, and the width of the plate is set to 9 mm. The result is shown in Fig. 3. [Table 1]
工件 晶棒直徑 3 00mm 晶棒長度 300mm 鋼線直徑 160 // m 鋼線張力 2.5kgf 鋼線 鋼線新線供給量 1 OOm/min 鋼線反轉週期 60s 鋼線行進速唐 平均 500m/min 磨粒 GC#1000 磨粒濃度（冷卻液：磨粒） 50 : 50(重量比） 漿液 冷卻液 水溶液 漿液供給量 60L/min 漿液供給溫度 23〇C 而且，若將距離Η設為40mm以上，確認可得到充分 的翹曲的改善效果。 如此，本發明的工件的切斷方法及線#，對於從工件 飛散出來的漿液，在工件保持部的下端面彈回，而激烈地 往工件和鋼線落下的情況，能加以抑制，其結果，能改善 16 201016416 切斷的晶圓的翹曲情況。 (比較例） 除了使用第4圖所示的習知的線錯，並將工件保持部 的下端面與工件的上端之間的距離⑺㈣、2〇mm、 30mm m卜’利用與實施例同樣的條件將石夕晶棒切成晶 圓狀’然後比較切斷後的晶圓的翹曲情況。Workpiece ingot diameter 3 00mm Ingot length 300mm Steel wire diameter 160 // m Steel wire tension 2.5kgf Steel wire line new line supply 1 OOm/min Steel line reversal cycle 60s Steel line travel speed Tang average 500m/min Grinding Granule GC#1000 Abrasive concentration (coolant: abrasive grains) 50 : 50 (weight ratio) Serving coolant aqueous solution slurry supply amount 60 L/min Slurry supply temperature 23 〇 C Further, if the distance Η is set to 40 mm or more, it is confirmed that A sufficient warpage improvement effect is obtained. As described above, the cutting method and the line # of the workpiece according to the present invention can suppress the slurry which has been scattered from the workpiece and bounce back on the lower end surface of the workpiece holding portion, and the workpiece and the steel wire are drastically dropped. Can improve the warpage of the 16 201016416 cut wafer. (Comparative Example) The distance (7) (4), 2 mm, and 30 mm m between the lower end surface of the workpiece holding portion and the upper end of the workpiece was used in the same manner as in the embodiment except that the conventional wire misalignment shown in Fig. 4 was used. The condition is that the stone slab is cut into a wafer shape' and then the warpage of the cut wafer is compared.
將其結果表示於第3圖中。 如第3圓所示，若工件保持部的下端面與工件的上端 之間的距離Η越大’則趣曲的改善情況越顯著其效果， 特別^當二離Η在30mm〜5〇贿之間最為顯著。 旦距離Η成為50mm以上，則翹曲的改善量會 逐漸變j $是因為從卫件側面飛散出來的漿液幾乎不 會J達工件保持部的下端面而往卫件和鋼線落下的緣故。 另方面，如第3圖所示，相較於實施例的結果，比 較例中的翹曲情況惡化。 另外本發明不限定於上述實施形態。上述實施形態 :為Ήτ凡疋與本發明的巾請專利範圍中所記載的技術 :想實質上具有相同的構成’能產生相同的效果者，不 論為如何的形態’皆應包含於本發明的技術範圍内。The result is shown in Fig. 3. As shown in the third circle, if the distance between the lower end surface of the workpiece holding portion and the upper end of the workpiece is larger, the effect of the improvement of the interesting music is more remarkable, especially when the two are separated by 30 mm to 5 The most significant difference. When the distance Η becomes 50 mm or more, the amount of warpage improvement is gradually changed to j $ because the slurry scattered from the side of the guard member hardly falls to the lower end surface of the workpiece holding portion and falls to the guard member and the steel wire. On the other hand, as shown in Fig. 3, the warpage in the comparative example deteriorated as compared with the results of the examples. Further, the present invention is not limited to the above embodiment. The above-described embodiment is a technique described in the patent scope of the present invention, and a technique having substantially the same configuration "can produce the same effect, regardless of the form" should be included in the present invention. Within the technical scope.
17 201016416 【圖式簡單說明】 第1圖係表示有關本發明的線鋸的一例的概略圖。 第2圖係表示有關本發明的線鋸中的工件進給機構的 一例的概略圖。 第3圖係表示實施例、比較例的結果的圖。 第4圖係表示習知的線鋸的一例的概略圖。 第5圖係表示習知的線鋸中的工件進給機構的一例的 概略圖。 【主要元件符號說明】 1 ： 線鋸 11 ： 工件保持部 2 ： 鋼線 12 ： 線性導軌 3 ： 附凹溝滾筒 13 ： 工件進給本體部 4、 4’ ：鋼線張力賦予機構 14 ： 抵板 5 ： 工件進給機構 15 ： 工件板 6 ： 漿液供給機構 16 ： 漿液冷卻器 7、 7’ ：線捲轴 17 ： 噴嘴 8 ： 移車台 18 ： 漿液槽 9 ： 定轉矩馬達 W ： 工件 10 :驅動用馬達 1817 201016416 [Simplified description of the drawings] Fig. 1 is a schematic view showing an example of a wire saw according to the present invention. Fig. 2 is a schematic view showing an example of a workpiece feeding mechanism in the wire saw of the present invention. Fig. 3 is a view showing the results of the examples and comparative examples. Fig. 4 is a schematic view showing an example of a conventional wire saw. Fig. 5 is a schematic view showing an example of a workpiece feeding mechanism in a conventional wire saw. [Description of main component symbols] 1 : Wire saw 11 : Workpiece holding portion 2 : Steel wire 12 : Linear guide 3 : With grooved roller 13 : Work piece feeding body portion 4, 4' : Steel wire tension imparting mechanism 14 : Plate 5 : Workpiece feed mechanism 15 : Work plate 6 : Slurry supply mechanism 16 : Slurry cooler 7 , 7 ' : Wire reel 17 : Nozzle 8 : Transfer table 18 : Slurry tank 9 : Constant torque motor W : Workpiece 10 : Drive motor 18