TW201009911A - Method to locate the perimeter of a wafer - Google Patents

Abstract

This invention relates to a method to locate the perimeter of a wafer applicable in a cutting device. The cutting device comprises: a work platform unit for positioning a work piece, a cutting unit, an image capturing unit, and a central processing unit with at least one built-in image of comparison sample. The work platform unit and the image-capturing unit can mutually move along a first axis and second axis relatively. The method comprises: (A) divide the work platform and the work piece into four test regions along a first and second separation line regions; (B) capture a displayed image unit of one of the test regions by the image capturing unit; (C) compare the displayed image unit with the image of comparison sample; (D) move the work platform unit and the image-capturing unit along the first axis relatively; (E) repeat steps (B), (C), and (D) until one of the two consecutively captured image unit matches the image of comparison sample, and until the other one is completely different from the image of comparison sample, record the location of the displayed image unit which is completely different as the perimeter coordinate; (F) move the work platform unit and the image-capturing unit along the second axis relatively; (G) repeat steps (B), (C), (D), (E), and (F) until the image-capturing unit completes the cross-region capturing of image.

Description

201009911 IX. Description of the invention: [Technical field to which the invention pertains] In particular, it refers to a search for 曰曰 The present invention relates to a method for searching for a circular boundary of a method. [Prior Art] As shown in Figure 1, in this case, all the applicants' number No. 91124245 ==, proposed a cutting die according to the result of wafer edge finding. One is to match a wafer cutting machine. In use, the cutting machine has a first axial direction X and a left and right movement and can rotate around the third axial direction Z: a table 7L 1 early, a rearward movement along a second axis, and a third axis ^Cuting unit 2 for moving up and down, and - central processing unit (not shown) I method, using the automatic edge finding procedure proposed in the invention patent case T (10) No. 9 owned by the applicant of the present application, so that the middle processor Find the coordinates of the absolute upper, lower, left, and right boundary points of the fragment wafer 3 that are located on the table unit 1 (χ〇ί, (8)〇, (_=absolute^,, (10)^ and The central processor, a distance D1 between the lower boundary points, and a distance D2' between the absolute left and right boundaries finally cause the central processor to determine the distance D1 and the comparison parameter (eg, the diameter d of a complete wafer 4). Whether the 1 is equal 'to decide to cut through the circular cutting mode or the rectangular cutting mode The fragment wafer 3 is surrounded by 'there is no way to know all the dots of the fragment wafer 3 by this method. Therefore, regardless of the mode in which the fragment wafer 3 is cut, an empty cut occurs, which affects the cutting. 201009911 SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for finding a wafer boundary that automatically searches for a peripheral boundary coordinate required for a workpiece to be cut while performing a cutting operation. Suitable for all cutting devices with - for workpiece positioning, a cutting table: a cutting unit: an image capturing unit, and a φ stop. „ Central processing of the table unit and the image-first-axis - a second axis perpendicular to the first axis, the central processor can control the table unit, the cutting 'acts like the reclaiming 70, the central processor has at least - taken early Where the stored sample image is pre-photographed, the method comprises the following steps: (A) the workbench sheet is placed along a parallel to the first: '------- parallel to the two-axis And the first partition: the second dividing line of the heading IT is divided into four detecting areas. (B) the unit screen image of the image capturing unit is detected. (C) the unit and the comparison sample image are performed. (9) Make the work. The early U takes the image phantom along the first-axis relative movement line. The Φ_ιθ of the step is successively captured by the unit picture image 疋 and the comparison sample image, and another If the t is completely inconsistent with the sample image, the complete location is recorded as a boundary seatpost. (7) (4): 匕面 (4) The image capturing unit moves relative to the second axis in the same direction.

w ^ 勒 (repeated this step (B [real:) side: ΓΕ), (7) to take one 201009911 related to the above and other technical contents, features and effects of the present invention, preferably in the following reference pattern The detailed description of the embodiments will be clearly understood. ' ❹ 参阅 Referring to Figures 2, 3, and 4', a preferred embodiment of the method for finding wafer boundaries of the present invention is used in conjunction with a cutting device! (10) In the present embodiment, the cutting device 1GG is a wafer cutting machine, and has a table unit ι which can move left and right along the first axial direction 并可 and can rotate around the third axial axis. a cutting unit 20 that is movable back and forth along the second axial axis and movable up and down along the third axial axis, and an image capturing unit 3 that is movable back and forth along the second axial axis in synchronization with the cutting unit 2〇 And an analog-to-digital converter 40 connected to the image capturing unit 3A, a video memory device 50 connected to the analog/digital converter 4, and a central processing unit 6 connected to the image memory device 5Q. A display 7G coupled to the central processing unit 6G, and an alarm 80 controlled by the central processing unit 6〇. The cutting unit 20 has a knife (four), and: a cutter 22 fixed on the cutter carriage 21, the image capturing unit 30 is a camera, and has a lens 3, the central processing unit 6 is operable to control the work. The display of the image capturing unit 3 () is performed by the display 70. As shown in FIG. 5, the table unit 10 is a workpiece 200 that can be placed to be cut. In the embodiment, the workpiece 200 is a fragment wafer, and the surface is adhered to the bottom surface of the fixture frame 9G. The adhered-adhesive tape 11 is placed on the table unit 10. It is worth mentioning that the 'existing-type waxes (June) adhere the workpiece 200 to the table...〇 The tapeless fixing technique can also be applied to the present invention in 201009911. As shown by circle 6, the central processing unit (9) (see Fig. through the image capturing unit 3 (four) has at least 12 inches, in this embodiment. θ 4) The ratio of the shots taken by the county shots is 'in the 疋, there are three kinds of comparison sample images. These comparison samples are silly β 』 like 120 ' 2 〇疋 shot from the same specification as the workpiece 200 - complete wafer ( Figure 7 shows the phase-by-standard specification. The method for finding the boundary of the crystal m includes the step of ordering. ) ================================================================= As early as 70 10 together with the workpiece 200, along-parallel to the first - (four) again - the first dividing line 130 and - parallel to the two axial turns and with the first dividing line 1 The first knife partition 140 of the 30th intersecting octave radii 1/ΙΛ , is divided into four detection areas such as the upper left detection area 7, the upper right detection area 16 〇, the lower left detection area 17 (), and the lower right detection area (10). In this embodiment, the central processing unit 60 (see FIG. 4) initially drives the table unit 1() and the image capturing unit 3() to move relative to the first, second, and second axes to The image capturing unit 30 is located above the workpiece 2〇〇, and then drives the satellite station unit 1G to move left and right along the first axis X, and allows the image capturing unit 30 to continuously capture images. The processor (6) (see FIG. 4) determines the boundary between the workpiece 2〇〇 and the tape no by the gray-scale judging technique of image processing, and defines a left mark Ui, yl) on the workpiece 200. The edge point 'and the coordinate is the right edge point of (x2, y2); for the same reason, the central processing unit 60 (see Fig. 4) drives the image capturing unit 3 to move up and down along the second axis. The image capturing unit 30 continuously captures an image, and the upper edge of the 201009911 edge with the coordinate - (x3, y3) and the one marked (X4) can be defined on the workpiece. a lower edge point of y4). The first dividing line 130 is an intermediate point 2 passing through the upper and lower edge points (χ3, a coordinate value (y3, y4) in the second axial direction Y, the second The dividing line 140 is an intermediate point of the left and right edge points (xl, 71 in the first axis X (xl, x2) - '2" '1. Step 310: Figure 7, 8 As shown in FIG. 9, the central processing unit 6 (see FIG. 4) drives the table unit 1 and the image capturing unit 3 to move relative to each other along the first and second sides to make the image capturing unit 30 at the coordinates. The unit pupil image 151 of the upper left detection area 15〇 is taken for the first starting point of (X1, 2). In this embodiment, the unit pupil image 151 has a length distance L on the first axial axis and a width distance 隹w in the second axial direction γ. The length distance L is 64 pixels ( ), the width distance % is 480 pixels (pixd). Step 320: As shown in FIGS. 7, 8, and 9, the central processing unit 6 (see FIG. 4) performs image comparison of the unit picture image 151 with the comparison sample images 120 (see FIG. 6). In the present embodiment, as can be seen from the comparison of Figs. 9 and 6, the unit picture image 151 β , τ , / 疋 coincides with at least one of the comparison sample images 120 (see Fig. 6). 〃 Step 330: As shown in FIG. 7 and FIG. 1 , the central processing unit 60 (see FIG. 4, the table unit 10 moves relative to the image capturing unit 3 沿 along the first-axis X. 9 201009911 in this step 320 If the unit picture image 151 (see FIGS. 8 and 9) matches the comparison sample image 12〇 (see FIG. 6), in this step, the table is 兀1〇 along the first axis. χ moving the length distance L to the right away from the image capturing unit 30; conversely, in the step 32, if the unit screen image 151 (see FIGS. 8, 9) and the sample images 120 are aligned (see FIG. 6) Incompletely, in the step 33, the table unit 1 is moved to the left along the first axis X to the left by the length distance L: the image capturing unit 30〇_ in the embodiment, Since at the first starting point (x1, the unit picture image 151 of the beat is compared with the sample image 120 2 (see FIG. 6 ^, therefore, the central processing H 6G (see 胄 4) will cause the The table is early? 10 moves the length distance L along the first-axis X to the right away from the image capturing unit 30, so that the image capturing unit 3 is located at a transition position 152. Above the belt 110. ❿ Step 340. As shown in Figures 7, 10, and 11, the central processing unit 60 (see Figure 4) repeats the steps 31, 320, 330 to two consecutive shots. One of the images 151 (see Figures 8, 9) is consistent with the analog images 120 (see Figure 6), while the other (see Figures 10, 11) is: an equal ratio sample image 12G (See Fig. 6) The position of the unit face image 151 which is completely inconsistent is recorded as a - boundary coordinate. In the present embodiment, 'when the first step is repeated for the steps 310 to 330, the silk image is early.疋3Q is to shoot another unit in the transition position 151' and only the tape 110 is photographed. Therefore, the unit 昼 会 完全 完全 完全 样本 样本 样本 〇 〇 〇 〇 〇 〇 〇 〇 〇 完全 完全 完全 完全 完全 完全 完全 完全 完全 完全 完全 完全 完全 完全 完全 完全 完全201009911 Thus, the central processing unit 60 (see FIG. 4) records the transition position 152 where the unit picture image i 5 j is located as a boundary coordinate (χ5, 0). Step 350: As shown in FIGS. The central processing unit 6〇 (see FIG. 4) drives the image capturing unit 30 to move the width distance W upward along the second axial direction γ away from the worktable 1. 步骤 鲁 Step 360: As shown in Figures 7, 13, and 14, the central processing unit 6〇 (see Fig. 4) repeats the steps 31〇, 32〇, 33〇, 34〇, 35〇 to the In the embodiment, when the coordinate value of the unit picture image ΐ5ΐ in the step-axis X is less than ^^, the (4) line (4) 310~350 As shown in FIG. 13, when the step 3 is repeated for the first time, in this step 340, the step 31〇~33〇 is repeated three times.

Moving the table unit 10 to the left along the first axial direction to the left: two times from L, to one of the two successively captured unit pupil images 151 being compared with the sample images 120 (see Figure 6) is consistent, while the other is completely inconsistent with the comparison sample image 12G (see Figure 6), so that another boundary coordinate (x6, y6) can be found. Similarly, as shown in FIG. 14, when 1 = five times repeating the step 310~, the other four boundary coordinates (X7, y7), (x8, y8), (x9, y9) can be found in order. , Ui〇, yi〇). As shown in FIG. 15, when the coordinate value of the unit pupil image 51 on the first axial plane is not less than ^^(Γ/6) 151 (see FIG. 6), the unit is not in accordance with the unit. The "value y and the front-boundary coordinates" on the first 个 Υ 在 在 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 . In this embodiment, when the steps 31〇35〇 are repeated for the sixth time, in step 340, the steps 310~33〇 are repeated, so that the workbench unit 1G is along the first- When the X is shifted to the left by the length distance L - times, the unit picture image 151 in the step 31 即 will cross the second fifxf "0" to cause its coordinate value X1 on the first-axis X. More than this, as shown in FIG. 16, in this step 32, since the single: position shadow 51 and the comparison sample image 12〇 (see FIG. 6) are finished: the symbol ^ the central processing $ 60 ( As shown in Fig. 4), the coordinate value yU of the unit pupil image (5) 该 on the second axis γ and the coordinate value xlG of the previous boundary coordinate (1) 〇, yH)) on the first Μ x are defined as - Boundary coordinates (xl〇, yll). See Figure 17 18, 19 'The method of finding the boundaries of the Crystal® is followed by

G includes step 410, object, 430, _, s, and y, to find the boundary coordinates of the upper right detection area 160, and the step 〜_ is similar to the steps 3H) to 360, the difference is that the (four) 41 〇 (4) The starting point is different from the step 31 〇 'The movement of the table unit (7) in the step 43 is opposite to the step 330'. In this step 46G, it is judged whether or not the step 410 is repeated. The range of coordinates of ~450 is different from the step 36〇. Step 410: As shown in Fig. π thousand, y3 + y4 ', let the image taken earlier than 30 at a second starting point marked as x ' 2 ) to start shooting the upper right detection area (10) bit screen image 161. Step 420: Align the sample image 120 (see FIG. 6) with the sample image 120 (see FIG. 6) as shown in FIG. 12 201009911 Step 430: As shown in FIG. 17 from -^, the table unit 10 is moved relative to the image capturing unit 3 in the first axis X. In the step, if the unit picture image i6i matches the ratios ^ & 120 (see FIG. 6), then in step 430, the table unit 10 is moved to the left along the first axis by the length. The distance L is far away from the u like a single 兀* 3〇. In this step 420, the office branch is located in the middle of the river, and the image of the sample ii 〇 3 3 等 等 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本 样本If tl does not pay, then in step 430, 'make the workbench single eight

The first axial direction X of the early 10/0 s is moved to the right by the length distance L and is close to the image capturing unit 3〇. Step 440. As shown in FIG. 17, repeating the steps of the step, the object, and (4) to the two successively taken unit side images 161 are consistent with the comparison sample (4) 12G (see FIG. 6), and In addition, the __ is recorded as a boundary coordinate (mm) of the unit screen image 161 which is completely inconsistent until the sample image is completely 12G (see FIG. 6). Step 450: As shown in FIG. The image pickup ridge is moved upward along the second axial direction γ by the width distance w away from the table unit 1〇. Step 460·· as shown in FIGS. 18, 19, and 2, repeating the steps 410, 420, 430, 440, and 450 until the image capturing unit 3 is captured across the area as shown in FIGS. 18 and 19, when The unit facial image (6) in step 41 is repeatedly performed in steps 410 to 450 when the coordinate value of the first axial direction is greater than ^. As shown in Fig. 18, when the steps 41 〇 450 450 are repeated for the first time, another boundary coordinate (χ 13, yl3) can be found. As shown in Figure 19, 13 201009911 'When the second to the ninth times repeat this step 410 to 450 days, you can find the boundary coordinates (Xl4 ' yl4), (xl5, yl5), (xl6, yl6), (xl7 Yi7), (xl8'yl8), (xl9, yl9), (x2〇, y2〇), (x2i ') 〇 as shown in FIG. 20, when the step 460 repeats the step 4l 〇 450 for the tenth time, In this step 440, the step 41Q~43 is repeated for five times to "move the table unit 1{" to the right along the first-axis 该 to the right by the length distance L five times, then the step 41 〇 The unit screen image (6) will cross the second dividing line 140, so that the coordinate value χ22 of the unit picture image in the step 41Q on the first secret direction X is not greater than the heng 2, as shown in FIG. 21, In this step 42", since the unit picture image 完全6 is completely inconsistent with the sample image 12G (see Fig. 6), the coordinate value y22 of the unit written image 161 on the second axis γ and the previous boundary coordinate (x21, y21) The coordinate value (2) on the first-axis χ is defined as - the boundary coordinate (X21, y22), and the repetition is repeated for the step 41 〇 ~ 450 β. See Fig. 22 23, to find the boundary of the wafer 5 ° square method step 51. , a, -, -, thereby looking for = the detection zone 150 or the upper right detection zone 160 is not found boundary coordinates, in this embodiment, is to find the upper right detection zone (10) for description, the step _ ~ (10) is similar to the Steps 310 to 360 and 410 to offset, Α differ from: the (four) 5 Η) starting shooting point is different from the step, 41 〇, : the movement of the table unit 10 in step 530 is the same as the step '430 Among them, the 'coordinates in the step (10) are judged whether or not the step 5 is repeated.) The range of coordinate values of the value 550 is different from the step. 14 201009911 Step 500: Determine whether the total number of boundary coordinates of the upper left and upper right detection areas 15 〇 and 丨 6 相等 are equal. If they are not equal, proceed to step 5 〇 560 ′ ′ in this embodiment, The total number of boundary coordinates (seven) of the upper left detection zone 15〇 is less than the total number of boundary coordinates (11) of the upper right detection zone 16〇. Step 510: As shown in FIG. 22, the image capturing unit 3 is caused to start shooting a unit of painting on the last boundary coordinate (χ1 〇, y丨丨) of the upper left detection area 150.

The shirt is like 191. It should be noted that, conversely, if the total number of boundary coordinates of the upper right detection area 160 in this step 5 is less than the total number of boundary coordinates of the upper left detection area 15〇, the image capturing unit 3G is allowed to be in the upper right (four) 16 The last boundary coordinate (x2b y22) of 〇 starts shooting the unit picture image 191. Step 520: As shown in FIG. 22, the unit image, the image is compared with the sample image 12〇 (see FIG. 6), and the image comparison step 530 is performed as shown by g 22 to make the table unit. (7) Along the first, X is moved relative to the image capturing unit 3G. To illustrate, the movement of the workbench is the same as that of the steps 330, 430. If the total number of boundary coordinates of the upper left detection zone 15G is less than the total number of boundary coordinates of the °° 160 For example, if the movement mode of the step 330 is used, the boundary coordinates of the upper right detection area 16〇; = area 2: the standard area, and the step - in this embodiment, the total number of coordinates of the upper left detection area 15 is In the step 520, if the 右(4) mode, ie, the right early face image 191 matches the comparison sample 15 201009911 ^ image 120 (see FIG. 6 ), then In step 530, the workbench sheet is moved ίο along the first-axis χ to the right by the length distance l away from the image capturing unit 30. In the step 52(), if the unit image is ι9ι If the ratio is completely different from the sample image 120 (see Figure 6), then it is made at step 530. The single stage 1 移动 moves the length distance L to the left along the first axial direction away from the image capturing unit 3〇. Step 540: As shown in FIG. 22 and FIG. 23, repeating this step; 520, 530 to one of the two consecutive unit image images ΐ9ι is 12相 corresponding to the comparison sample image (see FIG. 6). ), while the other is the same as the sample image completely 120 (see Figure 6), the position of the unit face image 191 that is completely inconsistent is recorded as a trap boundary coordinate (x23, y23), A trap boundary coordinate (χ23, y23) will overwrite the last boundary coordinate (χ1〇, yn) of the upper left detection zone 150. It should be noted that, conversely, in this step 530, if the movement mode of the step 43 is adopted, the first trap boundary coordinates (X23, y23) will cover the last boundary coordinate of the upper right detection area 160 (χ21). , y22). Step 550: As shown in Fig. 23, the image capturing unit 3 is moved upward along the second axis Y Y by the width distance W away from the table unit 1〇. Step 560: As shown in FIG. 23, when the coordinate value 昼 of the unit pupil image 191 in the first axial direction X in the step 51 is smaller than the upper right coordinate value y on the second axial axis When the boundary coordinates of the detection zone 160 are at the coordinate value X of the first axial direction X, the steps 51〇 to 55〇 are repeated; conversely, when the unit pupil image 19 in the step 510 is at the first The coordinate value X on the axial χ is not less than the same as the coordinate value y of γ in the second axial direction. 201009911 When the boundary value of the upper right detection zone 160 is at the coordinate value 该 on the first axial χ, the repetition is stopped. Perform this step 51〇~55〇. under

It should be noted that, in the step 530, if the moving mode of the step 43 is adopted, the determining manner of the step 560 is changed to: when the unit screen image 191 in the step 51 is on the first axial line The coordinate value χ is greater than the coordinate value 大于 of the upper left detection area (9) having the same coordinate value y on the second axial direction γ, and the steps 510 to 550 are repeated; Conversely, when the coordinate value of the unit pupil image in the first axis X in the step 51〇 is not greater than the boundary coordinate of the upper left detection region 150 in which the coordinate value y on the second axis γ is the same When the coordinate value x in the first axial direction X is stopped, the steps 51 〇 55 55 〇 are repeated. In this embodiment, the coordinate value x23 of the trap boundary coordinates (χ23, y23) is smaller than the coordinate value xl8 of the boundary coordinate (χΐ8, yi8) of the upper right detection area 16〇, so the first step 51〇~55 is repeated. When you are 〇, you can find another boundary coordinate (x24, y24). Similarly, when you repeat this step 510 550 for the second and third times, you can find the other two boundary coordinates (us, y25), (x26, y26). . When the steps 510 550 550 are repeated for the fourth time, in the step 540, the steps 510 530 530 are repeated to make the table unit 1 移动 move the length to the left along the first axis X. The distance L is once, at this time, the coordinate value χ27 of the unit picture image i91 in the step 510 in the first axial direction is equal to the coordinate value x21 of the boundary coordinates (X2i, y22) of the upper right detection area 16〇, 'That stops repeating this step 51〇~55〇. Referring to FIG. 24', the method for finding a wafer boundary further includes step elements 17 201009911 610, 620 '630, 640, 650, 660' to find the boundary coordinates of the lower left detection area 170, and the steps 610 to 66 are similar. The steps 31〇 to 360 are different in that the moving direction of the image capturing unit 3〇 in the step 65〇 is opposite to the step 350, that is, in the step 65, the image capturing unit 30 is caused. The width distance w is moved downward along the second axial direction γ away from the table unit 1〇. Thus, in this step 660, the steps 61〇~65〇 are repeated, that is, seven boundary coordinates (x28, y28), (x29, y29), (χ30, : y30), (x31, y31) can be found. ), (x32, y32), (x33, y33), (x33, y34 _ ) ° Referring to FIG. 25, the method for finding a wafer boundary further includes steps 710, 720, 730, 740, 750, 760 to find The boundary coordinates of the lower right detection area 180, the steps 71 〇 76 76 are similar to the steps 41 〇 460 460, the difference is that the moving direction of the image capturing unit 3 该 in the step 75 是 is opposite to The step 450, that is, in the step 75, is to move the image capturing unit 30 downward along the second axial direction γ by the width distance w away from the table unit 10. 〇 So ' repeat this step 71〇~75〇 in this step 760, ie - to find seven boundary coordinates (x35, y35), (χ36, y36), (x37, W7), (x38, y38 ), (χ39, y39), (X40, y40), (x40, y41) 0 Through the above description, the advantages of the present invention can be further summarized as follows: As shown in FIG. 26, the present invention can find out that the workpiece 200 is The peripheral boundary coordinates of the upper left detection zone 15〇, the upper right detection zone 160, the lower left detection zone 17〇 and the lower right detection zone 18〇18 201009911, such that the cutting unit 2 can be viewed when the subsequent cutting operation of the workpiece 200 is performed. The coordinate value of the cutter 22 in the second axial direction Y determines the range in which the table unit 1 带 moves the workpiece 200 along the first axial direction X, for example, when the workpiece 2 is to be cut When the cutting path 210 is cut, the table unit 1 moves the workpiece 200 from the coordinate value χ26 to the coordinate value x21 along the first axial direction, and when the other cutting channel 220 of the workpiece 200 is to be cut, the work is performed. The stage unit 10 drives the workpiece 2 along the first axis to move from the coordinate value x25 to the seat. Value χ20, so that effectively prevent occurrence of the case of the air-cut, to improve cutting efficiency. In summary, the method for finding the wafer boundary of the present invention can not only find the surrounding boundary coordinates of the workpiece, but also can effectively reduce the time of the empty cutting when the workpiece is subjected to subsequent cutting operations by using the boundary coordinates. To achieve the purpose of the invention. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes made by the present application and the description of the invention are Modifications are still within the scope of the invention. 19 201009911 f simple description of the diagram] Figure is a schematic diagram of the method of determining the cutting mode;

A three-dimensional appearance of a cutting device with a cutting wA used;

4 is a schematic view showing the system configuration of the cutting device; FIG. 5 is a plan view showing a workpiece positioned on a table unit of the cutting device; FIG. 6 is a pre-photographed by an image capturing unit of the cutting device. Figure 7 is a flow chart of the preferred embodiment; Figure 8 is a plan view showing the preferred embodiment of the workbench

The upper loose test zone, the lower left detection zone and the lower right detection zone are driven to capture a unit picture image in the upper left detection zone; FIG. 9 is a plan view of the unit face image; FIG. 10 is similar to FIG. The view shows that the preferred embodiment drives the capture image unit to capture another unit picture image in the upper left detection area; FIG. 11 is a plan view of the other unit picture image; FIG. 12 is a view similar to FIG. The preferred embodiment finds the first boundary coordinate of the upper left detection area and drives the image capturing unit to move up_width distance. FIG. 13 is a view similar to FIG. 12, illustrating the preferred embodiment looking for 201009911 The second boundary coordinate of the upper left detection zone is shown; FIG. 14A is similar to the view of FIG. 13, illustrating that the preferred embodiment finds the third to sixth boundary coordinates of the upper left detection zone; FIG. 15 is a similar diagram. a view of the first embodiment, wherein the preferred embodiment drives the table unit to move to the left, and the image capturing unit captures the unit face image across the second dividing line;

Figure 16 is a view similar to Figure 15 illustrating the preferred embodiment to find the seventh boundary coordinate of the upper left detection zone; Figure Π is a view similar to Figure 16, illustrating the preferred embodiment The first boundary coordinate of the upper right detection zone; Figure 18 is a view similar to Figure π; jfiu, 呤昍#± 阖 view illustrating the preferred embodiment to find the second boundary coordinate of the upper right detection zone; Figure 19 is a view similar to Figure a, showing the view of the third to ten boundary coordinates 19 of the upper right detection zone, "Let the preferred embodiment drive" let the image capture unit cross the The second separation diagram 20 is a picture similar to the drawing of the table unit moving to the right to capture the unit pupil image; the eleventh boundary coordinate of the upper right detection area; Λ交佳 implementation 4 Fig. 22 is similar to Figure 21 is a view showing the first trap boundary of the upper right detection zone; Fig. 23 is a view similar to Fig. 22, showing the second to fourth trap boundary seats of the upper right detection zone Figure 24 is a view similar to Figure 23, said; preferred embodiment 21 201009911 out the first to seventh boundary coordinates of the lower left detection zone; FIG. 25 is a view similar to FIG. 24, illustrating the preferred embodiment to find the first to seventh boundary coordinates of the lower right detection zone; Figure 26 is a plan view showing the cutting unit of the cutting device cutting the workpiece.

22 201009911

[Description of main component symbols] 100···...Cutting device 161...Unit image 10 • Workbench unit 170···...Lower left detection £20 ····...Cutting unit 180..· · · The lower right k test £ 21 ···· ...Cutter axis 191 ···Unit screen image 22 ··· ...Tool 200·.· ...Workpiece 30 ····...Image capture unit 210···...Cut road 31 .... ...Lens 220··· ...cutting path 40...·...analog/digital converter 300·.·...Step 50 ···· Image memory device 310··· ...Step 60 ···· ... Central processor 320··. ...Step 70 ···· ...display 330··· ...Step 80 ·..·...Alarm 340···Step 9〇·... Fixture frame 350··· ...Step 110··. ... Tape 360··· ...Step 120····Comparing the sample image X...the first axis 130···the first dividing line Z...the first axis 140·· · ...Second separation line Y......Second axis 150··· ••Top left £££......Length distance 151... ...unit picture image W••... From 152··· ... transition position 160··· ...upper right detection area 23

Claims (1)

201009911 X. Patent application scope: 1 _ A device for finding the boundary of a wafer has a supply-workpiece widely used for a cutting device, the cutting unit, a table unit for cutting, a cutting single opening and one image capturing unit, and One of the ▲ full early 疋, 〇〇 central processing unit, the workbench unit and the &#; your soap element can be along a first fortunate to draw a second direction perpendicular to the first axis For the movement, the central processing unit can control the operation of the cutting unit ▲ cutting unit and the image capturing unit, and the central processing unit captures the stored comparison sample image in advance by the image capturing unit. The following steps: μ side (Α) dividing the table unit together with the workpiece along a parallel-axial first-dividing line and a second dividing line parallel to the two-axis and intersecting the first-order to four detection zones; Let the image capturing unit capture one of the detection area images; compare; (C) shadow the unit picture image and the comparison sample image D) moving the table unit and the image capturing unit along the first axis pair; D @ (E) repeating the steps (B), (C), and (D) to two successively shot unit image images One of them is consistent with the comparison sample image, and the other is recorded as a boundary coordinate of the unit image image that is completely inconsistent with the comparison sample image; (F) The table unit and the image capturing unit are relatively moved along the second axis; and 24 201009911 (8) repeats the steps (b), (c), (d), and (e) until the image capturing unit is photographed across the area. 2 The method for finding a wafer boundary according to item 1 of the patent application scope, wherein, in the step (C), if the single image matches, then in the step (D) t: = = = 7L is away from each other along the first axial direction, 乂: __ i, ^ , the length-distance distance of the image of the early face image in the first axial direction is in the step (C), the β s image is compared with the comparison If the sample image is completely inconsistent, then in the step (D); period, the length of the length of the workbench unit is taken. Axial close to each other: Shen: Patent consumption around the second item of the search for the wafer edge, in the step (1) towel, so that the workbench single ... take two ~ the first axis away from the unit draw: one Width distance. The method of finding the wafer boundary as described in item 1 of the patent scope of the Taishi side, in the 'in this step (A), the method, 'four' can define 4 on the y = the left edge point of the first, the coordinate $ '··' yi) . is the right edge point of the (x3, Y3) upper edge & y2), a marked edge point, the first point; and - coordinates Is the lower axial position of ($y4)... The upper and lower 3 edge points are in the first axial direction of the second magic centroid value (y3, y4), and the second dividing line is The f+y2 point passing through 2 and parallel to the coordinate value (χ1, χ2) of the one axis is in the second axial direction of the second, and the point is parallel and parallel to the workpiece along the first, second, and second The 201009911 77 line is divided into four detection areas, such as the upper left detection area, the upper right detection area, the lower left detection area, and the lower right detection area. 5_ The method for finding a wafer boundary according to item 4 of the patent application scope, wherein in the step (B), the image capturing unit starts shooting the upper left detection at a first starting point marked (χ1 ' 2 ) The unit screen image of the area. 6. The method for finding a wafer boundary according to item 5 of the patent application scope, wherein: in the step (c), if the unit pupil image matches the comparison sample image, then in the step (D) And moving the table unit along the first axis to the right of the first axis to the right by a length distance in the first axial direction away from the image capturing unit, in the step (C), if the unit If the face image does not completely match the comparison sample image, then in the step (D), the table unit is moved to the left along the first vehicle to move to the left to approach the image capturing unit. 7. The method for finding a wafer boundary according to claim 6, wherein in the step (F), the image capturing unit is moved upward along the second axis to the unit picture image at the second A width distance in the axial direction and ® away from the table unit. 8. The method for finding a wafer boundary according to item 7 of the patent application scope, wherein in the step (G), when the unit picture image in the step (B) is at a coordinate value of the first axis When it is less than, the steps (b), (C), (d), (e), and (f) are repeated. 9_ The method for finding a wafer boundary according to item 8 of the patent application scope, wherein, in the step (G), when the unit surface 26 of the step (B) is in the first axial direction When the coordinate value is not less than, in the step (C), if the unit pupil image is completely different from the comparison sample image, the coordinate value of the unit pupil image in the second axis and the previous boundary coordinate The coordinate value in the first axial direction is defined as a boundary coordinate, and the repetition of the steps (B), (c), (D), (E), (F) e' e 10. is stopped according to the patent application scope. The method for finding a wafer boundary according to Item 9 further includes - a step (H) after the step (G), and a step (1) after the step (H) 'one at the step (1) Subsequent step (j)' is a step (K) after the step (1), - a step (1) after the step (1), and a step (M) after the step (1), in the group (Η) The image capturing unit starts shooting the unit picture image of the upper right detection area at a second starting point marked (χ2, 2) in the step (I) The image of the unit screen is compared with the image of the comparison sample, and in the step (1)+, if the image of the page is matched with the sample image, then in the step (7), the work is performed. The unit moves the length distance to the left along the first axial direction away from the fetching:: In the step (1), if the unit facial image is completely out of line with the comparison sample image, then in the step (7), The workbench moves the length distance axially to the right and approaches the image capturing unit in the step (Κ), repeating the steps (8), (1), (" even among the unit picture images of the shooting) Is the match with the match of 2, and the other is to record the position of the unit picture image that is completely inconsistent with the comparison sample image as the boundary coordinates. In this step (1)t' The image unit moves the width distance along the second 27 201009911 axially away from the table unit. In the step (M), when the unit screen image in the step (H) has a coordinate value greater than one in the axial direction For a while, repeat this step Η), G), (J), (K), (L). The method for finding a wafer boundary according to the first aspect of the patent application, wherein in the step (Μ), when If the coordinate value of the unit picture image in the step (Η) is not greater than the coordinate value in the first axis, in the step (I), if the unit picture image does not completely match the comparison sample image, the unit picture image is in the The coordinate value in the second axial direction and the coordinate value of the previous boundary coordinate in the first axial direction are defined as a boundary coordinate, and the steps (h), (i), (j), (k), (l) 12. The method for finding the wafer boundary according to the scope of claim 5, further comprising - a step after the step (M) (Μι), a step after the step (Ml) ( M2), one at the step (the subsequent steps (called, - the step (M4) after the step (M3), the step (M5) after the step (M4), and one after the step () Step (M6), and a step (M7) after the step (M6), in the step (Ml), to the age _ 士 μ 1, A judgment Whether the total number of boundary coordinates of the upper and upper right detection zones are equal. If they are not equal, perform this step (inter, (3) (Μ4), (μ5), (Μ6), (Μ7), in this step (M2) The image capturing unit is caused to capture a unit of the image of the face of the last boundary of one of the detection zones with a smaller total number of boundary coordinates, and in this step (M3), s Comparing the early screen image with the comparison sample image, in the step (M3), if the unit screen image 28 201009911 matches the comparison sample image, then in the step (Μ4), The work unit: the stage unit and the image taking unit are apart from each other in the first axial direction by the length in the step (M3), if the unit face image is completely out of line with the comparison sample image, then the step (M4) And causing the worktable unit and the image capturing unit to approach the length distance along the first axial direction. Step (M5), repeating the steps (M2), (M3), (M4 φ ❹ ^: one of the successively shot unit picture images is consistent with the sample material' and the other is closed Recording the position of the unit picture image that is completely inconsistent is recorded as a trap boundary coordinate with the comparison sample image completely, and the first trap boundary coordinates cover the total number of boundary coordinates less - the last of the detection area - a boundary coordinate, in the step (M6), the horse p/ytAgg _ & A causes the table Zhuo Zhuo and the image capturing unit to move away from the width distance in the second axial direction, at the step (M7) When the coordinate value of the unit pupil image in the step (M2) in the first axial direction does not exceed the coordinate of the boundary value of the other detection region in the second axial direction on the first axial direction When the value is repeated, repeat the step (m^, (M3), (M4), (M5), (M6)'. When this step (the coordinate value of the unit picture image in the first axis is equal to or exceeds) The boundary of the other detection zone having the same coordinate value in the second axial direction When the coordinates are at the coordinate value in the first axial direction, the steps (10) (M3), (M4), (M5), and (M6) are stopped. The cutting device, the cutting unit, the cutting unit, and the unit are The method for finding a wafer boundary is suitable for a device having a single image capturing unit for positioning a workpiece, and a central processing unit, the work 29 201009911 Moving relative to one another perpendicular to the first axis, the central processor can manipulate the table unit axis: the cutting unit 7C and the image capturing unit, the central processor having at least the image capturing unit The pre-shooting storage comparison method comprises the following steps: 琢 玄 玄 将该 (将该) the table unit along with the workpiece along a first-separating line parallel to the first axis The second dividing line of the first-phase parent is divided into four detecting areas; and - (8) letting the image capturing unit take a picture of one of the detection areas; Ping Zheng Dong • (C) the unit image of the unit and the ratio Image comparison of sample images, (D) for moving The stage unit and the image capturing unit in the second - axially with (Ε) Repeat the steps (B), (C), and (D) to the two shots of the unit screen image, where __ is the match-to-sample image, and the other is compared The sample image is completely inconsistent, and the position of the unit image image of the 2nd inconsistency is recorded as a boundary coordinate; (F) the movement; 70 the workpiece unit and the image acquisition sheet (G) along the second axial direction Repeating steps (b), (c), (d), (e), (f until the imaging unit is photographed across regions; and (H) repeating steps (b), (c), (d), (e), (, (G) until the boundary coordinates of the last inspection area are found. 30